Substrate assembly, substrate, and electronic device

Abstract

Provided are a substrate assembly capable of checking the connection state of substrates to each other with a simpler wiring configuration, a substrate, and an electronic device. A first substrate (30) and a second substrate (50) that constitute a substrate assembly (18) are fixed in a manner such that signal lines (42, 60) that constitute a first signal line group (44) and a second signal line group (62) are connected to each other in a linear shape. An additional signal line (64, 66) is provided on the second substrate (50), the additional signal line (64, 66) is separated from the second signal line group (62) in the thickness direction of the second substrate (50), and extends in a manner that crosses the second signal line group (62) or a second connection terminal group constituted by a plurality of connection terminals connected to the first signal line group (44).

Description

Technical Field

[0001] This invention relates to substrate assemblies, substrates, and electronic devices. Background Technology

[0002] Previously, techniques for checking whether signal lines mounted on an electronic circuit board are in a broken state were known. For example, Patent Document 1 discloses a method for checking a capacitive touch sensor that arranges multiple line electrodes in a two-dimensional lattice.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-145066 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] For example, when connecting substrates to each other, a crimping process using anisotropic conductive film (ACF) is sometimes employed. This crimping process has the advantage of making it easier to achieve low-profile and narrow-pitch connections compared to solder-based or connector-based connections. However, the possibility of poor connection and wire breakage increases with the crimping process.

[0008] The present invention was made in view of such problems, and its object is to provide a substrate assembly, substrate, and electronic device that has a simpler wiring structure while being able to check the connection status between substrates.

[0009] Methods for solving problems

[0010] The substrate assembly of the first invention comprises: a first substrate including a first signal line group consisting of a plurality of signal lines extending in a first direction and arranged in a direction orthogonal to the first direction; and a second substrate including a second signal line group consisting of a plurality of signal lines extending in a second direction and arranged in a direction orthogonal to the second direction. The first substrate and the second substrate are fixed in such a way that the signal lines constituting the first signal line group and the second signal line group are respectively connected to each other to form a line. An additional signal line is provided on the second substrate. The additional signal line is separated from the second signal line group in the thickness direction of the second substrate and extends in such a way that it traverses the second signal line group or is connected to a plurality of connection terminals, i.e., a second connection terminal group, of the first signal line group.

[0011] The second substrate of the present invention comprises: a substrate; a signal line group consisting of a plurality of signal lines arranged in a row or a connection terminal group consisting of a plurality of connection terminals arranged in a row, disposed on one main surface of the substrate; and one or more additional signal lines disposed on another main surface of the substrate, extending in a manner that traverses the signal line group or the connection terminal group.

[0012] The electronic device of the third invention includes a substrate assembly of the first invention or a substrate of the second invention.

[0013] Invention Effects

[0014] According to the present invention, the connection status between the substrates is inspected while having a simpler wiring structure. Attached Figure Description

[0015] Figure 1 This is an exploded perspective view of an electronic device incorporating a group of sensor substrates that are substrate components in the first embodiment of the present invention.

[0016] Figure 2 yes Figure 1 A partial top view of the sensor substrate group shown.

[0017] Figure 3 It is along Figure 2 The cross-sectional view shown along line AA.

[0018] Figure 4 It is shown Figure 2 and Figure 3 A diagram illustrating an example of a method for determining the connection status in a group of sensor substrates.

[0019] Figure 5 This is a cross-sectional view of the sensor substrate group in a first variation of the first embodiment.

[0020] Figure 6 This is a partial top view of the sensor substrate group in the second variation of the first embodiment.

[0021] Figure 7 This is a top view of the display substrate according to the second embodiment of the present invention.

[0022] Figure 8 This is a partial top view of the sensor substrate group, which is a substrate assembly in the third embodiment of the present invention.

[0023] Figure 9 It is shown Figure 8 A diagram illustrating an example of a method for determining the connection status in a group of sensor substrates. Detailed Implementation

[0024] The following is a reference to the appendix. Figure 1 The embodiments of the present invention will be described below. To facilitate understanding, the same reference numerals will be used as much as possible to refer to the same constituent elements in the accompanying drawings, and repeated descriptions will be omitted. It should be noted that the present invention is not limited to the first to third embodiments and modifications described below, and can certainly be freely modified within the scope of the spirit of the present invention. Alternatively, the various structures can be arbitrarily combined within the scope that does not cause technical inconsistencies.

[0025] [First Implementation Method]

[0026] Regarding the substrate assembly and electronic device in the first embodiment of the present invention, while referring to... Figures 1-4 While explaining.

[0027] <Overall Structure>

[0028] Figure 1 This is an exploded perspective view of an electronic device 10 incorporating a sensor substrate group 18, which is a substrate assembly in the first embodiment of the present invention. The electronic device 10 can be a variety of devices that carry electronic circuit boards, such as a tablet computer used with an electronic pen. The electronic device 10 is constructed by sequentially stacking a back cover 12, a main substrate 14, a display panel 16, a sensor substrate group 18, and a front cover 20 from the back side.

[0029] The back cover 12 and the front cover 20 are components that constitute the housing of electronic components inside the electronic device 10. A highly light-transmitting protective panel 22 is provided on the front cover 20 in such a way that it covers the entire surface of the opening formed on its main surface.

[0030] The main substrate 14 is a substrate that forms the circuitry for operating the electronic device 10. Various electronic components, such as a host processor, memory, driver IC (Integrated Circuit) for the display panel 16, connectors for connecting to the sensor substrate group 18, wireless communication modules, and power supply circuits, are disposed on the main substrate 14.

[0031] The display panel 16 is composed of, for example, a liquid crystal panel, an organic EL (Electro Luminescence) panel, or electronic paper. The display panel 16 drives multiple pixels by applying a driving voltage to a matrix of signal lines arranged in the row and column directions, thereby displaying images or videos within the display area.

[0032] The sensor substrate group 18 functions as an "external" touch panel mounted from the outside relative to the display panel 16. The sensor substrate group 18 includes a detection substrate 30 (first substrate) with a position indication detection function and a flexible substrate 50 (second substrate). Here, the detection substrate 30 and the flexible substrate 50 are electrically connected without connectors.

[0033] The detection substrate 30 has a touch sensor 32 capable of detecting the position indicated by a user's finger or electronic pen. The touch sensor 32 is formed in a planar configuration using linear or block-shaped sensor electrodes (not shown).

[0034] An integrated circuit (hereinafter referred to as "touch control IC52") for driving control of touch sensor 32 is mounted on flexible substrate 50. The mounting method can be FOC (Chip on Film) or TAB (Tape Automated Bonding).

[0035] It should be noted that the configuration relationship between the display panel 16 and the sensor substrate group 18 is not limited to... Figure 1 The example can also be changed depending on the detection method of the touch sensor 32. For example, for a touch sensor 32 using active electrostatic coupling (AES), it is more preferable that the sensor substrate group 18 is disposed above the display panel 16. On the other hand, for a touch sensor 32 using electromagnetic induction (EMR), it is more preferable that the sensor substrate group 18 is disposed below the display panel 16.

[0036] <Structure of Sensor Substrate Group 18>

[0037] Figure 2 yes Figure 1 A partial top view of the sensor substrate group 18 shown. Figure 3 It is along Figure 2 The cross-sectional view along line AA is shown. Hereinafter, the orientation is defined based on the position and orientation of the flexible substrate 50. More specifically, the long side direction, short side direction, and height direction of the flexible substrate 50 are referred to as the "length direction", "width direction", and "thickness direction", respectively.

[0038] like Figure 3 As shown, the detection substrate 30 and the flexible substrate 50 are arranged such that their ends overlap each other. The detection substrate 30 is constructed by sequentially stacking touch sensors 32. Figure 1The conductive layer 36 is composed of a substrate 34, a conductive layer 36, and an insulating layer 38. The substrate 34 is made of a material with insulating and heat-resistant properties (e.g., a resin such as polyethylene terephthalate). The conductive layer 36 is made of a highly conductive material (e.g., a metal such as copper, silver, or gold). The insulating layer 38 is provided such that it completely covers the surface of the conductive layer 36 except for the end in the longitudinal direction (hereinafter referred to as the exposed front end 40).

[0039] On the other hand, the flexible substrate 50 is equipped with a touch control IC 52. Figure 1 and Figure 2 The substrate 54 comprises a conductive layer 56 disposed on the lower surface of the substrate 54 and a conductive layer 58 disposed on the upper surface of the substrate. The substrate 54 is made of a material with insulating, heat-resistant, and flexible properties (e.g., a resin such as polyimide). The conductive layers 56 and 58 are made of a highly conductive material (e.g., metals such as copper, silver, and gold). It should be noted that the protective film 68 is provided to protect the conductive layer 58 (more specifically, the additional signal lines 64 and 66 described later).

[0040] An anisotropic conductive film (hereinafter referred to as "ACF70") is inserted between the detection substrate 30 and the flexible substrate 50. ACF70 is formed by molding a mixture of a thermosetting resin and fine metal particles into a film. The detection substrate 30 and the flexible substrate 50 are pressed together at a pressing portion 72, including the exposed front end 40. That is, by applying heat and pressure at the pressing portion 72, a conductive region 74 is formed in a part of the ACF70, which electrically connects the conductive layers 36 and 56 to each other.

[0041] like Figure 2 As shown, on the detection substrate 30, a conductive layer 36 ( Figure 3 A signal line group 44 (first signal line group) consisting of multiple signal lines 42 is formed on the flexible substrate 50. A conductive layer 56 is formed on the flexible substrate 50. Figure 3 A signal line group 62 (second signal line group) is formed, consisting of multiple signal lines 60. The multiple signal lines 60 extend in the length direction and are arranged in the width direction. Multiple signal lines 42 extend in the length direction and are arranged in the width direction. The signal lines 42 and 60 constituting the two signal line groups 44 and 62 are aligned with each other in a manner that they are each connected to form a single line.

[0042] Furthermore, on the flexible substrate 50, a conductive layer 58 ( Figure 3Two additional signal lines 64 and 66 are formed. A portion of the additional signal line 64 extends in the width direction across the signal line group 44 at a position closer to the front end of the crimped portion 72 in the length direction. A portion of the additional signal line 66 extends in the width direction across the signal line group 62 at a position closer to the rear end of the crimped portion 72 in the length direction.

[0043] Each signal line 42 is connected to the component forming the touch sensor 32. Figure 1 The sensor electrode is part of the touch control IC 52. Additionally, each signal line 60 is connected to a detection pin of the touch control IC 52. Additional signal lines 64 and 66 are connected to test pins of the touch control IC 52.

[0044] <Explanation of the judgment action>

[0045] The electronic device 10 and the sensor substrate group 18 in the first embodiment are configured as described above. Next, the operation of determining the connection state of the sensor substrate group 18 is performed while referring to... Figures 2-4 To explain further: First, the touch control IC52 periodically or irregularly initiates a control mode (i.e., a test mode) to check the connection status of the sensor substrate group 18.

[0046] In the first action of the test mode, the touch control IC52 sends a test signal via the first test pin. This creates capacitive coupling CC between the additional signal line 64 and the signal line 60. Figure 3 This generates a response signal relative to the test signal. The touch control IC52 receives the response signals sequentially via signal line 60. If the strength of the response signal exceeds a threshold, it is determined as "first reception result = OK"; on the other hand, if the strength of the response signal is below the threshold, it is determined as "first reception result = N / A".

[0047] In the second operation of the test mode, the touch control IC 52 sends a test signal via the second test pin. This creates capacitive coupling CC between the additional signal line 66 and the signal line 42. Figure 3 This generates a response signal relative to the test signal. The touch control IC 52 receives the response signal sequentially via signal line 42, conductive area 74, and signal line 60. If the strength of the response signal exceeds a threshold, it is determined as "Second reception result = OK"; on the other hand, if the strength of the response signal is below the threshold, it is determined as "Second reception result = N / A".

[0048] Figure 4 It is shown Figure 2 and Figure 3The figure shows an example of a method for determining the connection status in the sensor substrate group 18. If both the first reception result and the second reception result are "OK", it is determined that there is no breakage on either the signal line 42 of the detection substrate 30 or the signal line 60 of the flexible substrate 50, and therefore it is "normal" (result 1). On the other hand, if it is a combination of other results (results 2 to 4), it is determined to be "abnormal", and the following reasons are distinguished.

[0049] If only the first reception result is "OK", it is determined that there is no broken signal line 42 or 60, but there is a malfunction of the touch control IC 52 (Result 2). If only the second reception result is "OK", it is determined that there is any one of [1] a broken signal line 42, [2] a faulty substrate crimping, and [3] a malfunction of the touch control IC 52 (Result 3). If both the first and second reception results are "N / A", it is determined that there is any one of [1] a broken signal line 60 and [2] a malfunction of the touch control IC 52 (Result 4).

[0050] <Effects>

[0051] As described above, the sensor substrate group 18 (substrate assembly) in the first embodiment includes: a detection substrate 30 (first substrate) comprising a signal line group 44 (first signal line group) consisting of a plurality of signal lines 42 extending in a first direction and arranged in a direction orthogonal to the first direction; and a flexible substrate 50 (second substrate) comprising a signal line group 62 (second signal line group) consisting of a plurality of signal lines 60 extending in a second direction and arranged in a direction orthogonal to the second direction. The detection substrate 30 and the flexible substrate 50 are fixed in such a way that the signal lines 42 and 60 constituting the signal line groups 44 and 62 are respectively connected to each other in a linear form. Additional signal lines 64 and 66 are provided on the flexible substrate 50, which are separated from the signal line group 62 in the thickness direction of the flexible substrate 50 and extend transversely to the signal line group 62.

[0052] By providing additional signal lines 64 and 66 extending across the signal line group 62, capacitive coupling CC is formed between each signal line 60 constituting the signal line group 62 and the additional signal lines 64 and 66. For example, by sending a test signal from the additional signal lines 64 and 66 and receiving a response signal relative to the test signal from each signal line 60, the connection state of the signal lines 60 can be determined. Thus, the connection state between the substrates can be checked while maintaining a simpler wiring structure.

[0053] Alternatively, an ACF70 (anisotropic conductive film) containing thermosetting resin may be present between the detection substrate 30 and the flexible substrate 50, and the detection substrate 30 and the flexible substrate 50 may be fixed in a heated and pressurized state at the pressing portion 72 where the ACF70 is present.

[0054] Furthermore, on the flexible substrate 50, at least one additional signal line 64 may be provided at a position closer to the front end of the crimping portion 72 in the longitudinal direction (second direction). Additionally, on the flexible substrate 50, at least one additional signal line 66 may be provided at a position closer to the rear end of the crimping portion 72 in the longitudinal direction. Furthermore, at least two additional signal lines 66 may be provided on the flexible substrate 50 such that they clamp the crimping portion 72 along the longitudinal direction.

[0055] Alternatively, signal line group 62 can be disposed on one main surface of flexible substrate 50, and additional signal lines 64 and 66 can be disposed on the other main surface of flexible substrate 50. Thus, additional signal lines 64 and 66 can also be configured at positions overlapping with signal line group 62 when viewed from above, thereby increasing the degree of design freedom.

[0056] Alternatively, the first substrate can be a detection substrate 30 with a touch sensor 32, and the second substrate can be a flexible substrate 50. The touch sensor 32 is connected to a touch control IC 52 (integrated circuit) for controlling the touch sensor 32 via signal lines 44 and 62. In particular, by placing the touch control IC 52 on the flexible substrate 50, the freedom of substrate layout design is further increased.

[0057] <First Variation>

[0058] Figure 5 This is a cross-sectional view of the sensor substrate group 80 in a first variation of the first embodiment. The sensor substrate group 80 includes a detection substrate 30 (first substrate) having the same structure as in the first embodiment and a flexible substrate 82 (second substrate) having a different structure than in the first embodiment.

[0059] The flexible substrate 82 is equipped with a touch control IC 52. Figure 1 and Figure 2 The substrate 84 comprises a substrate 84 and a conductive layer 86 disposed on the lower surface of the substrate 84. The substrate 84 is made of a material having insulating, heat-resistant, and flexible properties (e.g., a resin such as polyimide). The conductive layer 86 is made of a material with high conductivity (e.g., a metal such as copper, silver, or gold).

[0060] On the detection substrate 30, with the first embodiment ( Figure 2Similarly, a plurality of signal lines 42 (i.e., signal line groups 44) are formed by the conductive layer 36. A plurality of signal lines 60 (i.e., signal line groups 62) are formed by the conductive layer 86 on the flexible substrate 82. The signal lines 42 and 60 constituting the signal line groups 44 and 62 are aligned with each other in a manner that they are each connected to form a single line. Furthermore, an additional signal line 64 is formed by the conductive layer 86 on the flexible substrate 82. A portion of the additional signal line 64 extends in the width direction across the signal line group 44 at a position closer to the front end of the crimping portion 72 in the length direction.

[0061] In this way, signal line group 62 and additional signal line 64 can also be disposed on one main surface of flexible substrate 50. With this structure, similar to the first embodiment, a simpler wiring structure is achieved while the connection status between the substrates can be checked.

[0062] <Second Variation>

[0063] Figure 6 This is a cross-sectional view of the sensor substrate group 100 in the second variation of the first embodiment. The sensor substrate group 100 includes a detection substrate 30, a flexible substrate 102 (first substrate), and a main substrate 14 (second substrate) having the same structure as in the first embodiment.

[0064] On the flexible substrate 102, a signal line group 62 (first signal line group) consisting of multiple signal lines 60 and two additional signal lines 104 and 106 are formed respectively. In addition, the flexible substrate 102 and the main substrate 14 are pressed together at the pressing portion 108 on the opposite side of the pressing portion 72.

[0065] Signal line 60 extends in the length direction and is arranged in the width direction. A portion of additional signal line 104 extends in the width direction across signal line group 62 at a position closer to the rear end of crimped portion 108 in the length direction. A portion of additional signal line 106 extends in the width direction across signal line group 62 at a position closer to the front end of crimped portion 108 in the length direction.

[0066] On the other hand, a touch control IC 52, a signal line group 112 (second signal line group) composed of multiple signal lines 110, and two signal lines 114 and 116 are disposed on the main substrate 14. The multiple signal lines 110 extend in the length direction and are arranged in the width direction. The signal lines 42, 60, and 110 constituting the three signal line groups 44, 62, and 112 are aligned with each other in a way that they are each connected to form a line. Two additional signal lines 104 and 106 are aligned in a way that they are each connected to the signal lines 114 and 116 in a way that they are each connected to form a line.

[0067] Each signal line 42 is connected to the component forming the touch sensor 32. Figure 1 The sensor electrode is part of the touch control IC 52. Additionally, each signal line 110 is connected to a detection pin of the touch control IC 52. Furthermore, two signal lines 114 and 116 are connected to test pins of the touch control IC 52.

[0068] In this way, the touch control IC 52 can also be disposed on a substrate (e.g., main substrate 14) that is independent of the flexible substrate 102. With this structure, similar to the first embodiment, it is possible to check the connection status between the substrates while having a simpler wiring structure.

[0069] <Other variations>

[0070] First implementation method ( Figure 2 and Figure 3 In the previous description, the additional signal lines 64 and 66 were extended orthogonally across the signal line group 62, but the configuration of the additional signal lines is not limited to this. For example, on the flexible substrate 50, additional signal lines may also be provided that are separated from the signal line group 62 in the thickness direction and extend across multiple connection terminals (that is, connection terminal groups) of the signal line group 44 connected to the detection substrate 30. In addition, the additional signal lines 64 and 66 may also extend at an angle of less than 90 degrees.

[0071] First implementation method ( Figure 2 and Figure 3 In the previous section, the case where additional signal lines 64 and 66 were only provided on the flexible substrate 50 was described, but the configuration of the additional signal lines is not limited to this. For example, additional signal lines may also be provided on the detection substrate 30, which are separated from the signal line group 44 in the thickness direction of the detection substrate 30 and extend across the signal line group 44 (or the connection terminal group of the signal line group 62 connected to the flexible substrate 50). As a result, the connection status of the signal lines 42 can also be checked at the same time, and the cause of the connection becomes easier to distinguish.

[0072] First implementation method ( Figure 2 and Figure 3 In the previous section, the case where additional signal lines 64 and 66 are provided at the position of the clamping crimping portion 72 was described, but the configuration of the additional signal lines is not limited to this. For example, at least one additional signal line may be provided on the flexible substrate 50 at the position including the crimping portion 73. This allows for direct inspection of the connection status at the connection portion of the signal lines 42 and 60.

[0073] First implementation method ( Figure 2The example described the connection of additional signal lines 64 and 66 to the touch control IC 52, but the connection method of the additional signal lines is not limited to this. For example, an input terminal may be provided at one end of the additional signal line. For example, by connecting an external inspection device to the input terminal, checking the connection status becomes easier.

[0074] First implementation method ( Figure 4 In the previous section, the case where the touch control IC 52 sends test signals from the additional signal lines 64 and 66 was described. However, the operation of the touch control IC 52 can also be reversed. Specifically, the touch control IC 52 can also send test signals sequentially via signal line 60 and receive response signals via additional signal lines 64 and 66.

[0075] [Second Implementation]

[0076] <Structure of display substrate 130>

[0077] Figure 7 This is a top view of the display substrate 130 according to the second embodiment of the present invention. The display substrate 130 functions as a "built-in" (or, further classified as an On-Cell or In-Cell type) touch panel display in which the display panel and touch sensor are integrally formed. The display substrate 130 is configured to include a substrate 132, an integral panel 136 composed of multiple segmented panels 134, a control integrated circuit (hereinafter referred to as control IC 138), and multiple signal line groups 140.

[0078] The substrate 132 is made of a material with insulating and heat-resistant properties (e.g., glass). The integral panel 136, the control IC 138, and the signal line group 140 are all disposed on a main surface (i.e., the surface) of the substrate 132. The number of control ICs 138 is equal to the number of segments of the integral panel 136. That is, each segmented panel 134 is connected to its corresponding control IC 138 via the signal line group 140.

[0079] As shown in the enlarged view of part B, the signal line group 140 is formed by a periodic arrangement of signal lines 142 connected to the display panel side and signal lines 144 connected to the touch sensor side at approximately equal intervals. Additionally, on the substrate 132, an additional signal line 146 is disposed for one control IC 138. The additional signal line 146 extends laterally on the surface of the substrate 132, originating from a test pin of the control IC 138, and extends across the signal line group 140 on the back side of the substrate 132 via a through-hole (not shown).

[0080] <Explanation of the judgment action>

[0081] The display substrate 130 in the second embodiment is configured as described above. Next, the operation for determining the connection status of the display substrate 130 will be explained. First, the control IC 138 periodically or irregularly starts a control mode (that is, a test mode) for checking the connection status of the display substrate 130.

[0082] When the control IC 138 is executed in test mode, it sends a test signal via a test pin. This creates capacitive coupling (CC) between the additional signal line 146 and the signal line 144, generating a response signal relative to the test signal. The control IC 138 receives the response signals sequentially via the signal line 144. If the strength of the response signal exceeds a threshold, it is considered "received = OK" and it is determined that there is no break in the signal line 144. Conversely, if the strength of the response signal is below the threshold, it is considered "received = N / A" and it is determined that there is a break in the signal line 144.

[0083] <Effects>

[0084] Thus, the display substrate 130 includes: a substrate 132; a signal line group 140 disposed on one main surface of the substrate 132, consisting of a plurality of signal lines 142 and 144 arranged in a row; and one or more additional signal lines 146, at least a portion of which are disposed on another main surface of the substrate 132 and extend across the signal line group 140.

[0085] With this structure, similar to the first embodiment, the connection status of the display substrate 130 can be checked while having a simpler wiring structure.

[0086] [Third Implementation Method]

[0087] Next, regarding the method for inspecting the substrate assembly and its connection status in the third embodiment, while referring to... Figure 8 and Figure 9 While explaining.

[0088] <Structure of Sensor Substrate Group 200>

[0089] Figure 8 This is a partial top view of the sensor substrate group 200 in the third embodiment. The sensor substrate group 200 includes a detection substrate 30 and a flexible substrate 202 having the same structure as in the first embodiment. The flexible substrate 202 is structurally similar to that in the first embodiment except that additional signal lines 64 and 66 are not provided. Figure 2 The functions of the touch control IC 204, which differ from those in the first embodiment, are provided on the flexible substrate 202.

[0090] <Explanation of the judgment action>

[0091] The sensor substrate group 200 in the third embodiment is configured as described above. Next, the operation for determining the connection status of the sensor substrate group 200 will be explained. First, the touch control IC 204 periodically or irregularly starts a control mode (that is, a test mode) for checking the connection status of the sensor substrate group 200.

[0092] When the touch control IC 204 is in test mode, it sends a test signal via the first detection pin. This creates capacitive coupling CC between the first signal line 60 and nearby signal lines 60, generating a response signal relative to the test signal. The touch control IC 204 receives these response signals sequentially via the signal lines 60. Consequently, the closer the signal is to the first signal line 60, the higher its signal level.

[0093] Next, the touch control IC204 sends a test signal via the second detection pin and receives response signals sequentially via the adjacent signal line 60. Then, the signal line 60 for sending the test signal is changed sequentially while the response signals are received sequentially.

[0094] Figure 9 It is shown Figure 8 This diagram illustrates an example of a method for determining the connection state in a sensor substrate group 200. Here, we envision a connection state where only the nth signal line 60 out of N signal lines 60 is disconnected. When a test signal is transmitted from the (n-2)th signal line 60, response signals with signal levels exceeding a threshold are received from the adjacent (n-3)th and (n-1)th signal lines 60. When a test signal is transmitted from the (n-1)th signal line 60, response signals with signal levels exceeding the threshold are received from the adjacent (n-2)th signal line 60, but response signals with signal levels below the threshold are received from the adjacent nth signal line 60. When a test signal is transmitted from the nth signal line, response signals with signal levels below the threshold are received from the adjacent (n-1)th and (n+1)th signal lines 60.

[0095] In this way, the touch control IC204 can use the capacitive coupling CC formed between adjacent signal lines 60 to determine the connection status of the signal lines 60.

[0096] <Effects>

[0097] As described above, the touch control IC 204, which serves as the touch controller, is connected to a signal line group 62 consisting of multiple signal lines 60 arranged in an array. Furthermore, the touch control IC 204 can send a test signal from one signal line 60 and receive response signals from other signal lines 60 adjacent to that signal line 60, which are associated with capacitive coupling CC formed between the signal lines 60. The connection state of the signal lines 60 is determined based on the strength of the response signals.

[0098] With this configuration, it is possible to avoid the need for additional signal lines 64 and 66. Figure 2 and Figure 3 Check the connection status of the sensor substrate group 200.

[0099] [Explanation of reference numerals in the attached figures]

[0100] 10…electronic devices; 18, 80, 100, 200…sensor substrate groups (substrate assemblies); 30…detection substrates; 50, 82, 202…flexible substrates; 44, 62, 112, 140…signal line groups; 64, 66, 104, 106, 146…additional signal lines; 130…display substrates (substrates).

Claims

1. A substrate assembly comprising: The first substrate includes a first signal line group consisting of a plurality of signal lines extending in a first direction and arranged in a direction orthogonal to the first direction; and The second substrate includes a second signal line group consisting of a plurality of signal lines extending in a second direction and arranged in a direction orthogonal to the second direction. The first substrate and the second substrate are fixed in such a way that the signal lines constituting the first signal line group and the second signal line group are respectively connected to each other to form a line. An additional signal line is provided on the second substrate. The additional signal line is separated from the second signal line group in the thickness direction of the second substrate and extends in a manner that crosses the second signal line group or a second connection terminal group composed of a plurality of connection terminals connected to the first signal line group, thereby checking the connection status between the first substrate and the second substrate based on capacitive coupling.

2. The substrate assembly according to claim 1, An additional signal line is provided on the first substrate. The additional signal line is separated from the first signal line group in the thickness direction of the first substrate and extends in a manner that traverses the first signal line group or a first connection terminal group composed of a plurality of connection terminals connected to the second signal line group.

3. The substrate assembly according to claim 1, An anisotropic conductive film containing thermosetting resin exists between the first substrate and the second substrate. The first substrate and the second substrate are fixed in a thermally pressurized state at the pressing portion where the anisotropic conductive film is present.

4. The substrate assembly according to claim 3, On the second substrate, at least one additional signal line is provided at a position on the front end side of the crimping portion in the second direction.

5. The substrate assembly according to claim 3, On the second substrate, at least one additional signal line is provided at a position on the rear end side of the crimping portion in the second direction.

6. The substrate assembly according to claim 3, On the second substrate, at least one additional signal line is provided at the location including the crimping portion.

7. The substrate assembly according to claim 3, On the second substrate, at least two additional signal lines are provided in such a way that they clamp the crimping portion along the second direction.

8. The substrate assembly according to claim 1, The second signal line group is disposed on one main surface of the second substrate. The additional signal line is disposed on another main surface of the second substrate.

9. The substrate assembly according to claim 1, The second signal line group and the additional signal line are disposed on one main surface of the second substrate.

10. The substrate assembly according to claim 1, The first substrate is a detection substrate with a touch sensor. The second substrate is a flexible substrate with flexibility. The touch sensor is connected to an integrated circuit for controlling the touch sensor via the first signal line group and the second signal line group.

11. The substrate assembly according to claim 10, The integrated circuit is disposed on the flexible substrate.

12. A substrate comprising: Substrate; A signal line group consisting of multiple signal lines arranged in an array, or a connection terminal group consisting of multiple connection terminals arranged in an array, is disposed on a main surface of the substrate; and One or more additional signal lines are disposed on another main surface of the substrate and extend across the signal line group or the connection terminal group to check the connection status of the substrate with other substrates based on capacitive coupling.

13. An electronic device comprising a substrate assembly according to any one of claims 1 to 11.

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