超声波清洗方法
By using an acoustic cleaning device that combines ultrasonic waves and low-pressure zones, foreign matter on the surface of semiconductor components can be cleaned without damage. This solves the problems of complex devices and damage in existing technologies and improves cleaning efficiency.
CN116034452BActive Publication Date: 2026-07-17YAMAHA ROBOTICS HLDG CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YAMAHA ROBOTICS HLDG CO LTD
- Filing Date
- 2021-08-26
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In the prior art, the use of dry ice blasting may damage semiconductor components, while ultrasonic cleaning machines using cleaning tanks are difficult to integrate into semiconductor manufacturing equipment and the equipment is complex.
Method used
The device employs an acoustic cleaning system. After applying cleaning fluid to the surface of the object to be cleaned, it utilizes ultrasonic waves and low-pressure zones generated by multiple ultrasonic generators to peel off and attract foreign objects, thus avoiding direct contact with the object being cleaned.
Benefits of technology
It achieves non-destructive cleaning, simplifies the cleaning structure, and improves cleaning efficiency and speed.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116034452B_ABST
Abstract
本发明的超声波清洗方法包括：清洗液涂布步骤(S101)，在保持于清洗载台的电子零件的表面涂布清洗液；剥离步骤(S103)，自安装于音响头的超声波扬声器将超声波照射至涂布了清洗液的电子零件的表面，使附着于表面的异物自表面剥离；以及吸引步骤(S104)，使自超声波扬声器产生的超声波在壳体与清洗载台的保持面之间的空隙集中，在壳体的中央下部形成压力比大气压低的低压区域，将自电子零件的表面剥离的异物与涂布于表面的清洗液吸引至低压区域。根据本发明，可抑制清洗对象物的损伤且利用简单的结构进行清洗对象物的清洗。
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