A silicon wafer cleaning device

Abstract

The application provides a silicon wafer cleaning device, which comprises a silicon wafer cleaning system and a carrier recycling system. The silicon wafer cleaning system comprises a carrier and silicon wafer separation unit, a silicon wafer combination unit, a cleaning unit and a silicon wafer separation unit arranged in sequence. The carrier and silicon wafer separation unit separates silicon wafers from the upper carrier loaded with the silicon wafers. Multiple groups of separated silicon wafers enter the silicon wafer combination unit for combination. The combined multiple groups of silicon wafers enter the cleaning unit for cleaning. The cleaned multiple groups of silicon wafers are separated in the silicon wafer separation unit, and each group of separated silicon wafers is downloaded. The carrier recycling system is provided with a drying unit for drying the separated upper carrier. The application has the beneficial effects that multiple groups of silicon wafers can be cleaned simultaneously, the cleaning capacity of the silicon wafers is improved, each separated upper carrier enters the drying unit for drying, the influence of water dripping on the upper carrier is reduced, and water accumulation in the upper loading port is avoided.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer manufacturing technology, and in particular relates to a silicon wafer cleaning device. Background Technology

[0002] Currently, silicon wafer cleaning can only be carried out by a single carrier, which will result in insufficient capacity. Generally, the cleaning capacity is increased by expanding the tank volume and increasing the length of the robotic arm, which increases the footprint of the equipment. The carrier returns to the outlet through a special water tank, and a large amount of water adheres to the surface of the carrier, causing water to drip and easily resulting in water accumulation at the loading port of the carrier. Summary of the Invention

[0003] In view of the above problems, the present invention provides a silicon wafer cleaning apparatus to solve the above or other problems existing in the prior art.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a silicon wafer cleaning device, comprising,

[0005] The silicon wafer cleaning system includes a carrier and silicon wafer separation unit, a silicon wafer merging unit, a cleaning unit, and a silicon wafer separation unit arranged sequentially. The carrier and silicon wafer separation unit separates the silicon wafers from the loading carrier. Multiple sets of separated silicon wafers enter the silicon wafer merging unit for merging. The merged sets of silicon wafers enter the cleaning unit for cleaning. The cleaned sets of silicon wafers are separated in the silicon wafer separation unit, and the separated sets of silicon wafers are then downloaded.

[0006] The vehicle recovery system is equipped with a drying unit to dry the separated load vehicles.

[0007] Furthermore, the carrier and silicon wafer separation unit includes a separation device body, a carrier positioning device disposed on the separation device body, and a silicon wafer lifting device disposed within the separation device body. The carrier positioning device can move relative to the separation device body, and the silicon wafer lifting device can be raised and lowered. The carrier positioning device transports the loading carrier containing the silicon wafer to the silicon wafer lifting device. The silicon wafer lifting device operates to lift the silicon wafer, thereby separating the loading carrier from the silicon wafer.

[0008] Furthermore, the carrier positioning device includes a positioning drive device and a support component connected to the positioning drive device. The positioning drive device drives the support component to move. The support component is provided with a through hole so that when the loading carrier is placed on the support component, at least part of the loading carrier extends through the through hole into the interior of the separation device body so that the silicon wafer lifting device can contact the silicon wafer.

[0009] Furthermore, the silicon wafer lifting device includes at least one set of silicon wafer support components arranged opposite to each other and a lifting drive device connected to the silicon wafer support components. The lifting drive device drives the silicon wafer support components to move closer to or further away from the loading carrier containing the silicon wafers in order to lift the silicon wafers.

[0010] The silicon wafer support assembly includes a support member and multiple slots provided on the support member for positioning and supporting the silicon wafer.

[0011] Furthermore, the silicon wafer merging unit includes a merging device body, a merging gripping device for transferring the separated groups of silicon wafers into the merging device body, and a transfer gripping device for transferring the groups of silicon wafers placed in the merging device body to the cleaning unit, wherein,

[0012] The main body of the merging device is equipped with a holding assembly, which has multiple holding slots for placing each group of silicon wafers;

[0013] The merging and clamping device includes a set of relatively movable slot clamping arms. The slot clamping arms include a connecting arm and a clamping member disposed at one end of the connecting arm. The clamping member is arranged along the axial direction of the silicon wafer, and multiple slots are arranged along the length direction of the clamping member to clamp and hold the silicon wafer.

[0014] The transfer clamping device includes a set of relatively movable first slot clamping arms. The first slot clamping arm includes a first connecting arm and a first slot arm disposed at one end of the first connecting arm. The first slot arm is arranged along the axial direction of the silicon wafer, and a plurality of first slots are arranged along the length direction of the first slot arm to clamp and hold the silicon wafer.

[0015] Furthermore, the card slot is provided with a clamping slot on its periphery, and the cross-sectional shape of the clamping slot is V-shaped.

[0016] Furthermore, there are multiple clamping components, which are arranged sequentially along the length of the connecting arm. The diameter of the clamping component located at the free end of the connecting arm is larger than the diameter of the other clamping components. When clamping the silicon wafer, the clamping component located at the free end of the connecting arm is located below the diameter of the silicon wafer.

[0017] Furthermore, the first slot arm includes a mounting body, and the first slot is arranged along the circumferential direction of the device body, with a V-shaped cross-section.

[0018] Furthermore, the silicon wafer cleaning system also includes:

[0019] The flipping unit receives the groups of silicon wafers separated by the silicon wafer separation unit and flips each group of silicon wafers.

[0020] The download unit downloads the silicon wafers sequentially after they have been flipped.

[0021] Furthermore, the silicon wafer separation unit includes a separation container assembly for placing silicon wafers and a separation clamping device. Multiple sets of cleaned silicon wafers are placed on the separation container assembly, and the separation clamping device clamps a set of silicon wafers and places them in the flipping unit.

[0022] Furthermore, the flipping unit includes a flipping device and a separation lifting device that can move along the axis of the flipping device. A set of separated silicon wafers is placed on the separation lifting device. When the separation lifting device is activated, the set of silicon wafers falls into the flipping device. When the flipping device is activated, the silicon wafers are flipped.

[0023] Furthermore, the flipping device includes a housing and a rotating device connected to the housing. The rotating device drives the housing to flip. A set of opposite sides of the housing are provided with side locking members. The side locking members are provided with multiple side locking slots to lock the silicon wafer.

[0024] The separation and lifting device includes a separation and lifting drive and a separation and lifting component connected to the separation and lifting drive. The separation and lifting drive drives the separation and lifting component to move up and down.

[0025] Furthermore, the download unit includes a download gripping device, which includes multiple support arms and a download driving device connected to the multiple support arms. The download driving device drives the multiple support arms to move, and the multiple support arms are arranged in a straight line to download a set of silicon wafers.

[0026] Furthermore, the drying unit includes a moving device and an air blowing device mounted on the moving device. The air blowing device is driven by the moving device to perform linear motion. The air blowing device includes multiple air blowing pipes, which correspond to the inner and outer sides of the upper carrier, respectively, to blow air and dry the inner and outer sides of the upper carrier.

[0027] Furthermore, the cleaning unit includes multiple cleaning tanks arranged in sequence and a cleaning clamping device for transferring multiple sets of silicon wafers. Each cleaning tank contains a different cleaning solution, which is used to clean the silicon wafers in sequence.

[0028] By adopting the above technical solution, the silicon wafer cleaning device has a carrier and silicon wafer separation unit, which can separate the silicon wafer from the loading carrier. The separated groups of silicon wafers on multiple loading carriers enter the silicon wafer merging unit, and after merging, they enter the cleaning unit for cleaning. After cleaning, the multiple groups of silicon wafers enter the silicon wafer separation unit for separation, and each group of silicon wafers enters the flipping unit for state conversion, changing from a vertical state to a horizontal state to facilitate downloading by the downloading unit. This allows for simultaneous cleaning of multiple groups of silicon wafers, improving the silicon wafer cleaning capacity. After separation, each loading carrier enters the drying unit for drying, reducing the impact of water dripping from the loading carrier and preventing water accumulation at the loading port. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of a silicon wafer cleaning apparatus according to an embodiment of the present invention;

[0030] Figure 2 This is a top view of a carrier and silicon wafer separation unit according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the main structure of a carrier and silicon wafer separation unit according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the structure of a merging and gripping device according to an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the structure of a card slot clamping arm according to an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the structure of a clamping member according to an embodiment of the present invention;

[0035] Figure 7 This is a schematic diagram of the structure of a transfer gripping device according to an embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of the first slot clamping arm according to an embodiment of the present invention;

[0037] Figure 9 This is a schematic diagram of the structure of the first slot arm according to an embodiment of the present invention;

[0038] Figure 10 This is a schematic diagram of the structure of a container assembly according to an embodiment of the present invention;

[0039] Figure 11 This is a schematic diagram of the structure of a flipping unit according to an embodiment of the present invention;

[0040] Figure 12 This is a top view of the flipping device according to an embodiment of the present invention;

[0041] Figure 13 This is a schematic diagram of the front view structure of a flipping device according to an embodiment of the present invention;

[0042] Figure 14 This is a schematic front view of a separation and lifting device according to an embodiment of the present invention;

[0043] Figure 15 This is a side view of the separation and lifting device according to an embodiment of the present invention;

[0044] Figure 16 This is a schematic diagram of the structure of a download gripper according to an embodiment of the present invention;

[0045] Figure 17 This is a schematic diagram of the download gripping device according to an embodiment of the present invention from another angle;

[0046] Figure 18 This is a schematic diagram of the structure of a drying unit according to an embodiment of the present invention.

[0047] In the picture:

[0048] 1. Carrier and silicon wafer separation unit; 2. Silicon wafer merging unit; 3. Cleaning unit.

[0049] 4. Silicon wafer separation unit; 5. Flipping unit; 6. Download unit

[0050] 7. Drying unit 10, carrier positioning device 100, support assembly

[0051] 101. Positioning drive device; 11. Silicon wafer lifting device; 110. Silicon wafer support assembly

[0052] 111. Lifting drive device; 20. Merging device body; 21. Merging clamping device

[0053] 210, Slot clamping arm; 211, Connecting arm; 212, Clamping component

[0054] 213. Slot component; 214. Clamping body; 215. Clamping slot.

[0055] 216. Connector 22. Transfer clamping device 220. First slot clamping arm

[0056] 221. First connecting arm; 222. First slot arm; 223. First slot.

[0057] 224. Installation body; 25. Container assembly; 250. Support unit

[0058] 251, container slot 50, separation and lifting device 51, flipping device

[0059] 500, Separation and Lifting Component; 501, Separation and Lifting Drive Component; 502, Separation and Locking Slot

[0060] 510. Side locking component; 511. Rotating device; 512. Housing

[0061] 513. Side slot; 514. Straight wall section; 515. Support section

[0062] 60. Support arm 600, locking block 61, download drive device

[0063] 62. Mounting bracket 610, lateral moving part 611, longitudinal moving part

[0064] 612, Rotating component; 70, Air blowing device; 71, Moving device

[0065] 700, Mounting plate 701, Channel 702, Connecting hole

[0066] 703, Air blowing pipe; 710, Air blowing longitudinal moving part; 711, Air blowing lateral moving part Detailed Implementation

[0067] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0068] Figure 1 The diagram shows a structural schematic of an embodiment of the present invention. This embodiment relates to a silicon wafer cleaning device for cleaning silicon wafers, particularly for cleaning polished silicon wafers. During the cleaning process, multiple loading carriers carrying silicon wafers separate the wafers from the loading carriers in a carrier-wafer separation unit. Multiple groups of silicon wafers on the loading carriers are placed in a wafer merging unit for merging. The merged groups of wafers are then cleaned in a cleaning unit. After cleaning, the wafers are grouped and downloaded, increasing the wafer cleaning capacity. The separated loading carriers are dried in a drying unit to reduce the impact of water dripping from the loading carriers and prevent water accumulation at the surface loading ports.

[0069] A silicon wafer cleaning device, such as Figure 1 As shown, it includes:

[0070] A silicon wafer cleaning system is used to clean silicon wafers. The silicon wafer cleaning system includes a carrier and silicon wafer separation unit 1, a silicon wafer merging unit 2, a cleaning unit 3, and a silicon wafer separation unit 4 arranged sequentially. The carrier and silicon wafer separation unit 1 separates the silicon wafers from the loading carriers on which they are loaded. Each loading carrier is designated as a group of silicon wafers. Multiple loading carriers with silicon wafers are separated from the loading carriers in the carrier and silicon wafer separation unit 1 to form multiple groups of silicon wafers. The separated groups of silicon wafers enter the silicon wafer merging unit 2 for merging. The merged groups of silicon wafers enter the cleaning unit 3 for cleaning, which enables the cleaning unit 3 to clean multiple groups of silicon wafers at one time, thereby increasing the production capacity of the cleaning unit 3. The cleaned groups of silicon wafers are separated in the silicon wafer separation unit 4 to form individual groups of silicon wafers, which correspond to the groups of silicon wafers before the separation of the loading carriers and silicon wafers. The separated groups of silicon wafers are then downloaded and loaded into a download carrier for subsequent processes.

[0071] The vehicle recovery system is used to recover and reuse the separated loading vehicles. The vehicle recovery system is equipped with a drying unit 7 to dry the separated loading vehicles. After the loading vehicles are cleaned in a special water tank, they are still carrying water. The drying unit 7 dries them to reduce the impact of water dripping from the loading vehicles and to prevent water accumulation at the loading port of the loading vehicles.

[0072] The aforementioned loading carrier is a flower basket capable of holding multiple silicon wafers. The bottom of the carrier has two support rods with slots on them, and slots are also provided on the side walls of the carrier. The slots on the support rods correspond one-to-one with the slots on the side walls, and each set of corresponding slots carries one silicon wafer. There is no connection between the two support rods or between each support rod and a side wall, and no structure is provided.

[0073] like Figure 2 and 3 As shown, the aforementioned carrier and silicon wafer separation unit 1 includes a separation device body 12, a carrier positioning device 10 disposed on the separation device body 12, and a silicon wafer lifting device 11 disposed within the separation device body 12. The carrier positioning device 10 is movable relative to the separation device body 12, and the silicon wafer lifting device 11 is movable up and down. The carrier positioning device 10 transports the loading carrier containing silicon wafers to the silicon wafer lifting device 11. The silicon wafer lifting device 11 actuates, lifting the silicon wafers to separate the loading carrier from the silicon wafers. The loading carrier containing silicon wafers is loaded onto the carrier positioning device 10. The carrier positioning device 10 moves horizontally, transporting the loading carrier containing silicon wafers to the silicon wafer lifting device 11. The silicon wafer lifting device 11 actuates, contacting all the silicon wafers on the loading carrier and lifting all the silicon wafers upward, causing all the silicon wafers to detach from the loading carrier, thus achieving separation of the loading carrier from the silicon wafers.

[0074] The aforementioned separation device body 12 has a groove structure with internal space. The carrier positioning device 10 is located on the side of the separation device body 12 near the loading carrier containing silicon wafers. The silicon wafer lifting device 11 is installed inside the separation device body 12 and is located on the side of the separation device body 12 near the silicon wafer merging unit 2, so that: the loading carrier containing silicon wafers is loaded onto the carrier positioning device 10, the carrier positioning device 10 is activated, the loading carrier containing silicon wafers is moved above the silicon wafer lifting device 11, the silicon wafer lifting device 11 is activated, moves upward, and lifts all silicon wafers to separate the silicon wafers from the loading carrier, so that the silicon wafers can be transferred to the silicon wafer merging unit 2.

[0075] The aforementioned carrier positioning device 10 includes a positioning drive device 101 and a support component 100 connected to the positioning drive device 101. The positioning drive device 101 drives the support component 100 to move, causing the support component 100 to perform reciprocating linear motion to transport the loading carrier containing the silicon wafer.

[0076] A support assembly 100 supports a loading carrier containing silicon wafers. The support assembly 100 includes a support body with a through hole, allowing the loading carrier to extend through the through hole into the separation device body 12 when placed on the support body. The support body has a plate-like structure, and the through hole is shaped to fit the shape of the carrier, allowing the loading carrier containing silicon wafers to extend through the through hole into the separation device body 12 when placed on the support body. The support body also has a connecting channel, allowing one end of the support body to communicate with the outside. This connecting channel communicates with the through hole, making the support body generally C-shaped plate-like. The width of the support body is adapted to the width of the separation device body 12, allowing the support body to be placed on top of the opening end of the separation device body. Under the action of the locking drive device 101, the support body can reciprocate linearly along the length of the separation device body 12. Therefore, a guide device, which can be a guide rail, is provided on the side of the support body facing the separation device body 12. The guide rail is installed on the top of the separation device body 12, and the slider is connected to the support body. During movement, the support body moves along the guide rail, reducing friction when the support body and the separation device body are in direct contact, thus extending the service life of the support body. A loading carrier carrying silicon wafers is placed on the support body, with its outer wall locked onto the support body. A portion of the bottom of the loading carrier extends into the separation device body 12 so that the silicon wafer lifting device 11 contacts the silicon wafer during its ascent, lifting the wafer and separating it from the loading carrier.

[0077] The support assembly 100 also includes multiple locking components, which are arranged around the periphery of the through hole. The positions of these locking components correspond one-to-one with the support points of the loading vehicle, providing support and positioning for the loading vehicle. The multiple locking components, positioned around the through hole, position the loading vehicle when it is placed on the support body, allowing it to be placed directly onto the locking components for accurate and rapid positioning and locking into the support body. The structure of the locking component matches the structure of the support points of the loading vehicle. The locking component can be a protruding structure, in which case the support point is a groove, and the locking component inserts into the support point; alternatively, the locking component can be a groove structure, in which case the support point is a protrusion, and the locking component inserts into the support point; or other structures can be used, selected according to actual needs. No specific requirements are specified here.

[0078] The aforementioned positioning drive device 101 can be a cylinder, a lead screw drive assembly, a pneumatic slide, or other structures capable of reciprocating linear motion, selected according to actual needs; no specific requirements are specified here. In this embodiment, preferably, the positioning drive device 101 is a cylinder, connected to the support body. The reciprocating linear motion of the support body is achieved through the extension and retraction of the cylinder's piston rod.

[0079] The aforementioned silicon wafer lifting device 11 includes at least one set of silicon wafer support assemblies 110 arranged opposite to each other and a lifting drive device 111 connected to the silicon wafer support assemblies 110. The lifting drive device 111 drives the silicon wafer support assemblies 110 to move closer to or further away from the loading carrier containing the silicon wafers, so as to lift the silicon wafers. The lifting drive device 111 moves the silicon wafer support assemblies 110 upward, contacting all the silicon wafers on the loading carrier, and continues to move upward. The silicon wafer support assemblies 110 lift the silicon wafers upward, so that the silicon wafers are separated from the loading carrier.

[0080] The silicon wafer support assembly includes a support member and multiple locking slots on the support member for positioning and supporting the silicon wafers. The multiple locking slots are located on the side of the support member facing the silicon wafer and are arranged sequentially along the length of the support member. Each locking slot corresponds to the position of a silicon wafer, so that when the silicon wafer support assembly 110 is in direct contact with the silicon wafer, each silicon wafer is directly inserted into one locking slot.

[0081] In this embodiment, the lifting drive device 111 is preferably a cylinder. The cylinder is connected to the support member, and the support member moves linearly in the vertical direction by extending or retracting the piston rod of the cylinder.

[0082] In this embodiment, the silicon wafer support assembly 110 and the lifting drive device 111 are two sets. The silicon wafer support assembly 110 in one set corresponds to the gap between one support rod of the upper carrier and the adjacent side wall. The silicon wafer support assembly 110 in the other set corresponds to the gap between another support rod of the upper carrier and another side wall. This allows the two silicon wafer support assemblies 110 to pass through the corresponding gaps and contact the silicon wafer during the upward movement and continue to move upward. The silicon wafer support assembly 100 will not interfere with the upper carrier during the upward and downward movement.

[0083] like Figure 4-10As shown, the aforementioned silicon wafer merging unit 2 includes a merging device body 20, a merging clamping device 21 for transferring the separated silicon wafers into the merging device body 20, and a transfer clamping device 22 for transferring the silicon wafers placed in the merging device body 20 to the cleaning unit 3. The merging device body 20 is provided with a holding assembly 25, which has multiple holding slots 251 for placing the silicon wafers. The merging device body 20 has a tank structure, and the holding assembly 25 is placed inside the merging device body 20. The holding assembly 25 includes at least two support parts 250, and each support part 250 is provided with multiple holding slots 251. The multiple holding slots 251 on the multiple support parts 250 correspond one-to-one, so that the multiple support parts 250 support the silicon wafers from multiple directions, so that the silicon wafers can be placed on the holding assembly 25. The container assembly 25 is also connected to a container drive device (not shown in the figure) to drive the container assembly 25 to move so that multiple sets of silicon wafers can be placed on the container assembly 25 at the same time and the multiple sets of silicon wafers can be merged.

[0084] like Figure 4-6 As shown, the merging clamping device 21 includes a set of relatively movable slot clamping arms 210. Each set of slot clamping arms 210 consists of two arms, which can move closer or further apart to clamp and release the silicon wafer. Each slot clamping arm 210 includes a connecting arm 211 and a clamping member 212 located at one end of the connecting arm 211. The clamping member 212 is arranged along the axial direction of the silicon wafer, and multiple slots 213 are arranged along the length of the clamping member 212, so that the clamping member 212 can position and clamp multiple silicon wafers. The other end of the connecting arm 211 is connected to a clamping drive device (not shown in the figure), which drives the connecting arm 211 to move and realize the relative movement of the two slot clamping arms 210. The clamping drive device is preferably a cylinder.

[0085] The clamping component 212 includes a clamping body 214 and multiple slotted components 213 arranged sequentially along the length of the clamping body. The clamping body 214 is a rod-shaped structure, and the slotted components 213 are fixedly installed on the clamping body 214. Alternatively, the clamping body 214 may be a cylindrical structure. There are multiple clamping bodies 214, each positioned between the slotted components 213. That is, one clamping body 214, one slotted component 213, one clamping body 214, one slotted component 213… are arranged sequentially to form the overall structure of the clamping component 212. The arrangement of the clamping bodies 214 and the slotted components 213 is selected according to actual needs. Connecting components 216 are provided at both ends of the clamping body 214 so that both ends of the clamping body 214 can be connected to corresponding connecting arms 211. The connection can be made using bolts.

[0086] In this embodiment, multiple clamping slots 213 are equally spaced to clamp multiple silicon wafers simultaneously. Each clamping slot 213 includes a main body and clamping slots 215 located on the peripheral end face of the main body. The clamping slots 215 have a V-shaped cross-section and are used to clamp silicon wafers. Each clamping slot 215 clamps one silicon wafer. The main body is a plate-like structure, and its shape can be an arc-shaped structure larger than a semicircle, including a straight portion and an arc-shaped portion. The clamping slots 215 are located along the peripheral end face of the arc-shaped portion and / or the straight portion, and are formed by indentation from the end face of the main body. Preferably, during installation, the arc-shaped portion of the clamping slot 213 faces the silicon wafer, so that the arc-shaped portion is tangent to the silicon wafer when in contact, facilitating clamping. When two opposing clamping members 212 clamp the silicon wafer, the silicon wafer is subjected to balanced forces and remains relatively stationary during movement. Multiple slots 213 are arranged in a straight line along the clamping body 214 and are coaxially arranged so that the clamping member 212 can clamp multiple silicon wafers at the same time, and the number of silicon wafers clamped by the clamping member 212 is adapted to the number of slots 213.

[0087] The silicon wafers here are silicon wafers.

[0088] In a set of slot clamping arms 210, two clamping members 212 are correspondingly and symmetrically located on both sides of the silicon wafer. When clamping, the silicon wafer is subjected to symmetrical and balanced forces, which facilitates the two slot clamping arms 210 to clamp and move the silicon wafer.

[0089] In a further optimized embodiment, each slot clamping arm 210 includes two clamping members 212. Both clamping members 212 are arranged along the diameter direction of the silicon wafer (along the length direction of the connecting arm 211). When clamping the silicon wafer, the two clamping members 212 are located on both sides of the diameter of the silicon wafer, or one clamping member 212 is located at the diameter of the silicon wafer and the other clamping member 212 is located below the diameter of the silicon wafer. The diameters of the slots 213 of the two clamping members 212 are different. The diameter of the slot 213 of the clamping member 212 located at the end of the connecting arm 211 is larger than the diameter of the slot 213 of the other clamping member 212, so that both clamping members 212 can contact the silicon wafer. When the two slot clamping arms 210 clamp the silicon wafer, there are two clamping members 212 on both sides of the silicon wafer, and the silicon wafer is subjected to balanced forces, maintaining relative stability during clamping and movement.

[0090] The merging and gripping device 21 is mounted on the merging lateral and merging longitudinal moving parts, enabling it to move horizontally and vertically. It can grip and move the silicon wafers from the carrier and wafer separation unit 1, and place them on the holding assembly 25 of the wafer merging unit 2. The merging lateral and longitudinal moving parts can be mounted on the gantry of the production line. These parts can be cylinders, six-axis robots, or other structures that achieve lateral and longitudinal movement, selected according to actual needs.

[0091] like Figure 7-10 As shown, the aforementioned transfer clamping device 22 includes a set of relatively movable first slot clamping arms 220. The first slot clamping arm 220 includes a first connecting arm 221 and a first slot arm 222 disposed at one end of the first connecting arm 221. The first slot arm 222 is arranged along the axial direction of the silicon wafer, and a plurality of first slots 223 are arranged along the length direction of the first slot arm 222 to clamp and hold the silicon wafer. The other end of the first connecting arm 221 is connected to a transfer driving device (not shown in the figure) to drive the two first slot clamping arms 220 to move closer or further apart, thereby realizing the clamping and transfer of multiple sets of silicon wafers after merging.

[0092] The first clamping arm 222 includes a mounting body 224, and a first clamping groove 223 arranged along the circumferential direction of the mounting body 224. The cross-sectional shape of the first clamping groove 223 is V-shaped. Multiple first clamping grooves 223 are arranged sequentially along the length direction of the mounting body 224, coaxially, and preferably equally spaced. Each first clamping groove 223 clamps one silicon wafer, so as to facilitate the simultaneous clamping of multiple sets of silicon wafers. The mounting body 224 is a rod-shaped structure with a circular cross-sectional shape. The first clamping groove 223 is a groove structure formed by inward indentation from the surface of the mounting body 224. The silicon wafer is tangential when it contacts the first clamping groove 223.

[0093] In a further optimized design, each first slot clamping arm 220 includes two first slot arms 222. The two first slot arms 222 are arranged along the length direction of the first connecting arm 221. The diameter of the first slot 223 of the two first slot arms 222 is the same, and the two first slot arms 222 are located on both sides of the silicon wafer diameter. Alternatively, one first slot arm 222 is located on the silicon wafer diameter, and the other first slot arm 222 is located below the silicon wafer diameter, so that each side of the silicon wafer is subjected to forces from two directions. When a set of first slot clamping arms 220 clamps the silicon wafer, the silicon wafer is subjected to balanced forces and remains relatively stable during clamping and movement.

[0094] The length of the first slot arm 222 is the same as the length of the clamping member 212. The number of first slots 223 is greater than the number of clamping slots 215. Preferably, the number of first slots 223 is twice the number of clamping slots 215, so that the number of silicon wafers that the transfer clamping device 22 can clamp is twice the number of silicon wafers that the merging clamping device 21 can clamp, so as to realize the simultaneous clamping and transfer of multiple groups of silicon wafers after merging, increase the number of silicon wafers entering the cleaning unit 3, and increase the cleaning capacity. To facilitate the clamping of multiple groups of silicon wafers by the first slot arm 222, the arrangement of the holding slot 251 of the holding assembly 25 is consistent with the arrangement of the first slot 223 of the first slot arm 222. Simultaneously, to facilitate the clamping member 212 in clamping each group of silicon wafers after separation, the arrangement of the clamping slot 215 on the clamping member 212 is consistent with the arrangement of the slots on the silicon wafer support assembly 110. The interval between two adjacent first slots 223 on the first slot arm 222 is set to 0.5 product intervals (the product interval is the distance between two silicon wafers, which is selected and set according to actual needs), and the interval between two adjacent clamping slots 215 on the clamping member 212 is set to 1 product interval. When merging and transferring multiple groups of silicon wafers, the merging clamping device 21 clamps the first... The first set of silicon wafers on a loading carrier is placed on the holding assembly 25. The first set of silicon wafers is placed with one holding slot 251 in between. Before placing the second set of silicon wafers on the second loading carrier, the holding assembly 25 moves 0.5 product intervals to prepare for the second set of silicon wafers on the second loading carrier. The second set of silicon wafers is placed on the holding assembly 25, staggered with the first set of silicon wafers, and placed in the holding slots 251 in each interval. This makes the interval between the silicon wafers on the holding assembly 25 consistent with the interval between two adjacent first slots 223 on the first slot arm 222, so that the first slot arm 222 can clamp the combined multiple sets of silicon wafers. After the second set of silicon wafers is placed on the holding assembly 25, the holding assembly 25 moves back to its original position to prepare for the placement or transfer clamping device of the next set of silicon wafers.

[0095] The aforementioned cleaning unit 3 includes multiple cleaning tanks arranged sequentially and a cleaning clamping device for transferring multiple sets of silicon wafers. Each cleaning tank contains a different cleaning solution, and the silicon wafers are cleaned sequentially. The cleaning clamping device is a robotic arm. In this embodiment, the cleaning unit 3 includes a first pure water tank, a first acid pickling tank, a second pure water tank, an alkaline pickling tank, a third pure water tank, a second acid pickling tank, a fourth pure water tank, an ozone cleaning tank, a slow-lift cleaning tank, and a hot drying tank arranged sequentially. The silicon wafers are sequentially cleaned with pure water, acid, pure water, alkaline, pure water, acid, pure water, ozone oxidation, slow lifting, and drying. The appropriate cleaning solution is selected according to the cleaning process.

[0096] The combined sets of silicon wafers move between the various cleaning tanks via a robotic arm. The structure of the robotic arm is the same as that of the transfer and gripping device 22. It can simultaneously clean and transfer multiple sets of silicon wafers, thereby increasing the silicon wafer cleaning capacity.

[0097] The aforementioned silicon wafer separation unit 4 includes a separation holding assembly and a separation clamping device. The structure of the separation holding assembly is the same as that of the holding assembly 25 in the aforementioned silicon wafer merging unit 2. Multiple groups of silicon wafers, after being dried from the cleaning unit 3, are placed on the separation holding assembly. The structure of the separation clamping device is the same as that of the merging clamping device 21, and it is used to clamp a group of silicon wafers. When separating each group of silicon wafers, the separation clamping device is used to clamp the silicon wafers placed on the separation holding assembly. First, the first group of silicon wafers is clamped, and then the second group of silicon wafers is clamped to ensure that the cleaning download sequence is consistent with the loading sequence. After the first group of silicon wafers is clamped, the separation holding assembly moves 0.5 product intervals. This moving direction is consistent with the moving direction of the holding assembly 25 in the silicon wafer merging unit 2. Then, the separation clamping device picks up the wafers and clamps the second group of silicon wafers, and so on, separating each group of silicon wafers in sequence.

[0098] The aforementioned silicon wafer cleaning system also includes:

[0099] The flipping unit 5 receives the groups of silicon wafers separated by the silicon wafer separation unit 4 and flips each group of silicon wafers.

[0100] Download unit 6 downloads each group of silicon wafers sequentially after flipping them, placing each group of silicon wafers on the download carrier to complete the silicon wafer cleaning.

[0101] like Figure 11-15 As shown, the flipping unit 5 includes a separation and lifting device 50 for placing silicon wafers and a flipping device 51. The separation and gripping device places a group of silicon wafers on the separation and lifting device 50. The separation and lifting device 50 lifts the silicon wafers to the flipping device 51 and places the group of silicon wafers on the flipping device 51. The flipping device 51 operates to flip the silicon wafers and adjust their position to facilitate cooperation with the downloading unit 6. The downloading unit 6 can download the group of silicon wafers to the downloading carrier.

[0102] In this embodiment, both the separation lifting device 50 and the flipping device 51 are vertically arranged, and the separation lifting device 50 and the flipping device 51 are coaxially arranged. The separation lifting device 50 can move up and down in the vertical direction inside the flipping device 51 to place the silicon wafer on the flipping device 51.

[0103] like Figure 14-15As shown, the aforementioned separation and lifting device 50 includes a separation and lifting member 500 and a separation and lifting drive member 501 connected to the separation and lifting member 500. The separation and lifting drive member 501 drives the separation and lifting member 500 to move in a linear reciprocating motion, so that the separation and lifting member 500 receives a group of silicon wafers and carries the group of silicon wafers to move. In this embodiment, the separation and lifting member 500 moves up and down in the vertical direction. During the descent, the group of silicon wafers is placed on the flipping device 51. The separation and lifting member 500 includes a lifting body and at least two sets of separation locking slots 502 provided on the lifting body. The lifting body has a plate-like structure, and the multiple sets of separation locking slots 502 correspond one-to-one and are arranged in parallel. Each set of separation locking slots 502 has multiple slots, which are arranged along the length direction of the lifting body so that the separation and lifting member 500 can place multiple silicon wafers at the same time. In this embodiment, there are three sets of separation slots 502. The silicon wafer is placed vertically in the corresponding separation slot 502. The separation slots 502 support the silicon wafer from three directions to ensure that the silicon wafer is in a vertically balanced state as the separation support member 500 moves.

[0104] In this embodiment, the aforementioned separation lifting drive 501 is preferably a cylinder.

[0105] like Figure 11-13 As shown, the aforementioned flipping device 51 includes a housing 512 and a rotating device 511 connected to the housing 512. A set of opposing inner side locking members 510 are provided inside the housing 512 to lock the silicon wafer. The opposing surfaces of the two opposing side locking members 510 are provided with multiple side locking slots 513, and the side locking slots 513 on the two side locking members 510 correspond one-to-one so that the silicon wafer can be inserted into the corresponding side locking slot 513.

[0106] The side-mounted member 510 includes a base, which includes a connected straight wall portion 514 and a supporting portion 515. The supporting portion 515 extends from the surface of the straight wall portion 514 toward the side-mounted member 510 on the other side. The straight wall portion 514 and the supporting portion 515 are arranged perpendicularly to form a base structure with an L-shaped cross-section, so that the distance between two corresponding supporting portions 515 is smaller than the distance between two corresponding straight wall portions 514. Both the straight wall portion 514 and the supporting portion 515 are provided with side-mounted grooves 513. The corresponding side-mounted grooves 513 on the straight wall portion 514 and the supporting portion 515 are connected to accommodate the silicon wafer. At the same time, the supporting portion 515 supports the silicon wafer when it is placed vertically to prevent the silicon wafer from falling. To ensure good contact between the side locking grooves 513 of the straight wall portion 514 and the side locking grooves 513 of the support portion 515 and the silicon wafer, the side locking grooves 513 of the straight wall portion 514 are straight grooves tangentially positioned to the silicon wafer. The side locking grooves 513 of the support portion 515 are arc-shaped grooves tangentially positioned to the silicon wafer, supporting it and ensuring the wafer remains vertically positioned between the two side locking members 510, preventing it from falling off. The distance between the two opposing side locking members 510 is greater than the size of the separation support member 500 to avoid interference when the separation support member 500 moves between the two side locking members 510.

[0107] The rotating device 511 is connected to the outer wall of the housing 512. The rotating device 511 drives the housing 512 to rotate, thereby rotating the silicon wafer. The rotating device 511 can be a cylinder, a four-bar linkage, or other structures that can achieve the flipping of the housing 512, depending on the actual needs.

[0108] After separation, a set of silicon wafers is placed on the separation lifting device 50. The initial state of the separation lifting device 50 is: passing through the inside of the flipping device 51 and located above the flipping device 51. The separation lifting device 50 moves downward, lifting the silicon wafer into the housing 512. During the downward movement of the separation lifting device 50, the silicon wafer is blocked by the side locking members 510 on both sides and inserted into the corresponding side locking slots. The side locking slots lock the silicon wafer. As the separation lifting device 50 continues to descend, the silicon wafer is locked by the side locking slots and stays between the two oppositely arranged side locking members 510. The separation lifting device 50 separates from the silicon wafer. When the separation lifting device 50 separates from the flipping device 51 and the separation lifting device 50 moves away from the flipping device 51, the rotating device 511 moves, driving the housing 512 to flip 90°, so that the silicon wafer flips from a vertical state to a horizontal state, so that the downloading unit 6 can download the set of silicon wafers.

[0109] like Figure 16-17As shown, the download unit 6 includes a download clamping device, which clamps the silicon wafers in one go and places them into the download carrier to complete the cleaning process.

[0110] The download gripping device includes a download driving component 61 and multiple support arms 60 connected to the driving component. The download driving component 61 drives the multiple support arms 60 to operate simultaneously, gripping a group of silicon wafers and placing them in the download carrier. The multiple support arms 60 are arranged in a straight line in sequence, with equal spacing and parallel arrangement, simultaneously acquiring multiple silicon wafers. In this embodiment, the multiple support arms 60 are arranged in sequence along the vertical direction. One end of each support arm 60 is connected to the download driving component 61 via a mounting bracket 62. The support arm 60 has a plate-like structure, and its shape can be trapezoidal, square, etc., selected according to actual needs. It has a certain area so that when the support arm 60 supports the silicon wafer, it can make contact with most of the silicon wafer, preventing the silicon wafer from falling. However, the size of the support arm 60 is smaller than the size of the download carrier so that the support arm 60 can place the silicon wafer onto the download carrier.

[0111] Multiple locking blocks 600 are protruding from the side of the support arm 60 that contacts the silicon wafer. These locking blocks 600 are respectively located at both ends of the support arm 60; that is, a locking block 600 is located at the end of the support arm 60 near the mounting bracket 62, and a locking block 600 is located at the free end of the support arm 60. These blocks limit the position of the silicon wafer on the support arm 60, preventing the silicon wafer from falling off during the movement of the support arm 60. The shape of the side of the locking block 600 that contacts the silicon wafer is adapted to the shape of the silicon wafer, allowing for better contact. In this embodiment, there are three locking blocks 600: one at the end of the support arm 60 near the mounting bracket 62, and two on each side of the free end of the support arm 60, limiting the position of the silicon wafer placed on the support arm 60 from three directions.

[0112] The aforementioned download drive assembly 61 includes a lateral moving member 610, a longitudinal moving member 611 connected to the lateral moving member 610, and a rotating member 612. This enables the support arm 60 to move and rotate in both horizontal and vertical directions, allowing the support arm 60 to retrieve silicon wafers from different positions of the flipping device 51 and deliver them to the download carrier for placement. The lateral moving member 610 and the longitudinal moving member 611 can be cylinders, lead screw drives, or other structures that achieve linear movement, selected according to actual requirements. The rotating member 612 can be a cylinder, a gear drive assembly, or other structures that achieve rotation, selected according to actual requirements.

[0113] like Figure 18As shown, the drying unit 7 includes a moving device 71 and an air blowing device 70 mounted on the moving device. The air blowing device 70 is driven by the moving device 71 to perform linear motion. The air blowing device 70 can blow air onto the inner and outer sides of the loading vehicle to perform air drying.

[0114] The air blowing device 70 includes multiple air blowing pipes 703 and a mounting plate 700 connected to the multiple air blowing pipes 70. The mounting plate 700 is connected to the air source through a power component. When the power component is activated, gas enters the air blowing pipes 703 through the mounting plate 700, enabling the air blowing pipes 703 to blow air onto the load carrier and dry the water vapor on the load carrier. The mounting plate 700 has a plate-like structure with an internal gas flow channel 701. Both ends of the channel 701 are connected to the outside, and connectors are attached to both ends of the channel 701. These connectors are connected to a power component via gas pipes, allowing gas to enter the channel 701 through the gas pipes and connectors. The mounting plate 700 also has connecting holes 702. One end of each connecting hole 702 is connected to the channel 701, and the other end is connected to the outside. This connecting hole is used to connect to an air blowing pipe 703, allowing gas entering the channel 701 to enter the air blowing pipe 703 and exit from it, thus blowing and drying the loaded vehicle. There are multiple connecting holes 702, each connected to a channel 701. Similarly, there are multiple channels 701, each connected to multiple connecting holes 702. The number of channels 701 and connecting holes 702 can be selected and set according to actual needs; no specific requirements are specified here.

[0115] When installing the air blowing pipe 703, the installation position is selected according to actual needs. The air blowing pipe 703 is connected to the connection hole 702 by a thread. The connection hole 702 where the air blowing pipe 703 is not connected is equipped with a sealing part to prevent air leakage and to meet the air blowing pressure requirements of the air blowing pipe 703.

[0116] In order to quickly dry the moisture on the loading vehicle, multiple air pipes 70 are set in two groups. The air blowing direction of one group of air pipes 703 corresponds to the inside of the loading vehicle, and the multiple air pipes 703 in this group correspond to the slot positions of the loading vehicle to blow air into the slots of the loading vehicle. The air blowing direction of the other group of air pipes 703 corresponds to the outer side of the loading vehicle to blow air into the outer side of the loading vehicle. The multiple air pipes 703 in this group correspond to the outer side walls on both sides of the loading vehicle to quickly blow air into the outer side walls of the loading vehicle.

[0117] In this embodiment, the power component is preferably an air pump.

[0118] The aforementioned moving device 71 includes a lateral air-blowing moving component 711 and a longitudinal air-blowing moving component 710 mounted on the lateral air-blowing moving component 711. The air-blowing device 70 is mounted on the longitudinal air-blowing moving component 710, enabling the air-blowing device 70 to move linearly in both the horizontal and vertical directions. Adjusting the position of the air-blowing device 70 facilitates air blowing onto the loading vehicle from different positions. The air-blowing device 70 can move along the length of the loading vehicle while blowing air, quickly drying the moisture on the loading vehicle and preventing dripping and water accumulation at the loading port. The lateral air-blowing moving component 711 and the longitudinal air-blowing moving component 710 can be cylinders, screw drives, rack and pinion drives, or other structures capable of linear motion, selected according to actual needs; specific requirements are not specified here.

[0119] In this embodiment, the distance between two adjacent slots on the silicon wafer support assembly 110, the distance between two adjacent slots 213 on the clamping member 212, the distance between two adjacent separating slots 502 on the separating support member 500, and the distance between two adjacent side slots 513 on the side slot member 510 are all equal to 1 product interval. The distance between two adjacent holding slots 251 on the holding assembly 25 and the distance between two adjacent first slots 223 on the first slot arm 222 are equal to 0.5 product interval.

[0120] The silicon wafer cleaning apparatus also includes a control device, which is electrically connected to the carrier and silicon wafer separation unit 1, the silicon wafer merging unit 2, the cleaning unit 3, the silicon wafer separation unit 4, the flipping unit 5, the downloading unit 6, and the drying unit 7, respectively. The control device controls the carrier and silicon wafer separation unit 1, the silicon wafer merging unit 2, the cleaning unit 3, the silicon wafer separation unit 4, the flipping unit 5, the downloading unit 6, and the drying unit 7, so that each cleaning unit cooperates to achieve the cleaning of the silicon wafer.

[0121] During the cleaning process, a loading carrier containing silicon wafers is loaded onto the carrier-wafer separation unit 1. The loading carrier is placed on the carrier positioning device 10 and secured to the support assembly 100, with its bottom extending into the separation unit body 12. The positioning drive device 101 actuates, driving the support assembly 100 towards the wafer lifting device 11 until the loading carrier is directly above the wafer lifting device 11. The positioning drive device 101 then stops. The wafer lifting device 11 actuates, and the lifting drive device 111 drives the wafer support assembly 110 upwards, gradually approaching the loading carrier until the wafer support assembly 110 contacts the silicon wafer. Two silicon wafer support assemblies 110 simultaneously contact the silicon wafer. One silicon wafer support assembly 110 passes through the gap between a support rod and a side wall of the upper carrier and contacts the silicon wafer, and continues to move upward. The other silicon wafer support assembly 110 passes through the gap between another support rod and another side wall of the upper carrier and contacts the silicon wafer, and continues to move upward. The two silicon wafer support assemblies 110 simultaneously lift the silicon wafer upward and do not contact the upper carrier during the upward movement of the silicon wafer support assembly 110. As the two silicon wafer support assemblies 110 move upward, the silicon wafer separates from the upper carrier, and all the silicon wafers on the upper carrier move upward simultaneously and move to the top of the upper carrier.

[0122] The merging clamping device 21 operates, moving above the group of silicon wafers. The two opposing slot clamping arms 210 move away from each other and descend simultaneously. The clamping members 212 on the two slot clamping arms 210 are located on both sides of the silicon wafer. The two slot clamping arms 210 stop descending and move closer together, with the clamping members 212 contacting the silicon wafer and clamping it. The two clamping members 212 on each slot clamping arm 210 are located on the upper and lower sides of the silicon wafer's diameter, respectively. The four clamping members 212 are located from four different... A force is applied to the silicon wafer in a certain direction, so that the silicon wafer and the merging clamping device 21 remain relatively stationary during the movement, and the transfer of the group of silicon wafers is carried out. The corresponding clamping slots 215 on each set of oppositely arranged clamping members 212 clamp one silicon wafer, and at the same time clamp all the silicon wafers on the loading carrier. After the group of silicon wafers is clamped, the loading carrier is transferred to the carrier recycling system for recycling and reuse. Then the second loading carrier containing silicon wafers is loaded, and then the above-mentioned separation action between the loading carrier and the silicon wafer is repeated.

[0123] The merging and clamping device 21 clamps the group of silicon wafers and moves them above the holding assembly 25 inside the merging device body 20, then moves them downwards to place the silicon wafers on the holding assembly 25. The two opposing clamping arms 210 are positioned relatively far apart, placing each silicon wafer on its corresponding holding slot 251. After the group of silicon wafers is placed, the holding assembly 25, driven by the holding drive device, moves forward 0.5 product intervals to prepare for placing silicon wafers on the second loading carrier. The merging and clamping device 21 then repeats the silicon wafer clamping action, clamping all the silicon wafers on the second loading carrier and placing the first... Silicon wafers from two loading carriers are placed on the holding assembly 25, with the second group of silicon wafers placed crosswise. The above actions of separating silicon wafers from the loading carriers, clamping silicon wafers, and placing silicon wafers are repeated in sequence to place silicon wafers from multiple loading carriers onto the holding assembly 25. The number of holding slots 251 on the holding assembly 25 is selected and set according to actual needs. The number of actions of the merging clamping device 21 (the number of times silicon wafers are clamped) is determined based on the number of holding slots 251 on the holding assembly 25 and the number of clamping slots 215 on the clamping member 212 of the merging clamping device 21.

[0124] After multiple sets of silicon wafers are placed on the housing assembly 25, the transfer clamping device 22 is activated, moves to the top of the housing assembly 25, and descends. During the descent, the two opposing first slot clamping arms 220 move away from each other. When the two first slot arms 222 on one first slot clamping arm 220 are respectively located on the upper and lower sides of the diameter of the silicon wafer, the descent stops, and the two opposing first slot clamping arms 220 move closer to each other. Each silicon wafer is located in a first slot 223, and all silicon wafers on the housing assembly 25 are clamped at once and transferred to the cleaning unit 3 for cleaning.

[0125] The silicon wafers enter the cleaning unit 3 and are transferred between the various cleaning tanks by a robotic arm, and are sequentially cleaned with pure water, acid, pure water, alkali, pure water, acid, pure water, ozone oxidation, slow lifting and drying.

[0126] After drying, the silicon wafers are transferred to the silicon wafer separation unit 4 and placed on the separation container assembly. The separation clamping device is activated to clamp the first group of silicon wafers and place the first group of silicon wafers on the separation lifting device 50 of the flipping unit 5. The silicon wafers in this group are located on the respective separation slots 502. After the first group of silicon wafers is clamped, the separation container assembly moves forward by 0.5 product intervals to prepare for the second group of silicon wafers to be clamped. The above actions are performed in sequence to clamp each group of silicon wafers. The loading sequence when separating each group of silicon wafers is consistent with the loading sequence when merging each group of silicon wafers.

[0127] After a group of silicon wafers is placed on the separation and lifting device 50, the separation and lifting drive 501 is activated, and the separation and lifting device 500 descends. As the separation and lifting device 500 descends, the silicon wafers in the group are respectively inserted into the corresponding side locking parts 510 of the flipping device 51. Each silicon wafer is inserted into a corresponding set of side locking slots 513 and is blocked and supported by the supporting part 515. The silicon wafers are separated from the separation and lifting device 500. The separation and lifting device 50 continues to descend until it is far away from the flipping device 51 and does not interfere with the flipping action of the flipping device 51. The rotating device 511 is activated, and the box 512 flips, so that the silicon wafers change from a vertical state to a horizontal state, which facilitates the downloading unit 6 to download them.

[0128] After the flipping action is completed, the download clamping device is activated. The horizontal moving part 610, the vertical moving part 611, and the rotating part 612 are activated to adjust the position of the support arm 60 according to the position of each silicon wafer, so that each support arm 60 is inserted into the gap between the corresponding two silicon wafers. The silicon wafer falls onto each support arm 60 and is located between each clamping block 600. Each clamping block 600 limits the silicon wafer. Each support arm 60 is activated to place each silicon wafer on the upper carrier, completing the download of a set of silicon wafers.

[0129] The loading vehicle is moved into the vehicle recovery system by the gripping action of the loading robotic arm. After being cleaned in a special water tank (pure water cleaning), it enters the drying unit 7. The air blowing horizontal moving part 711 and the air blowing vertical moving part 710 are activated, so that each air blowing pipe 703 moves to the position of the loading vehicle, corresponding to the inside and outside of the loading vehicle respectively. Each air blowing pipe 703 blows air to dry the moisture inside and outside of the loading vehicle. During the blowing process, each air blowing pipe 703 moves along the length of the loading vehicle to blow air on each part of the loading vehicle and quickly dry the loading vehicle.

[0130] After drying, the loading carrier is transferred to the loading port, where silicon wafers are loaded and then loaded again. The above steps are repeated to clean the silicon wafers.

[0131] By adopting the above technical solution, the silicon wafer cleaning device has a carrier and silicon wafer separation unit, which can separate the silicon wafer from the loading carrier. The separated groups of silicon wafers on multiple loading carriers enter the silicon wafer merging unit, and after merging, they enter the cleaning unit for cleaning. After cleaning, the multiple groups of silicon wafers enter the silicon wafer separation unit for separation, and each group of silicon wafers enters the flipping unit for state conversion, changing from a vertical state to a horizontal state to facilitate downloading by the downloading unit. This allows for simultaneous cleaning of multiple groups of silicon wafers, improving the silicon wafer cleaning capacity. After separation, each loading carrier enters the drying unit for drying, reducing the impact of water dripping from the loading carrier and preventing water accumulation at the loading port.

[0132] The embodiments of the present invention have been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A silicon wafer cleaning device, characterized in that: include, A silicon wafer cleaning system includes a carrier and silicon wafer separation unit, a silicon wafer merging unit, a cleaning unit, and a silicon wafer separation unit arranged sequentially. The carrier and silicon wafer separation unit separates the silicon wafers from the loading carrier. Multiple sets of separated silicon wafers enter the silicon wafer merging unit for merging. The merged sets of silicon wafers enter the cleaning unit for cleaning. The cleaned sets of silicon wafers are separated in the silicon wafer separation unit, and the separated sets of silicon wafers are then downloaded. The vehicle recovery system is equipped with a drying unit to dry the separated upper vehicle; The silicon wafer cleaning system also includes a flipping unit, which receives the groups of silicon wafers separated by the silicon wafer separation unit and flips each group of silicon wafers. The flipping unit includes a flipping device and a separation lifting device that moves along the axis of the flipping device. A set of separated silicon wafers is placed on the separation lifting device. When the separation lifting device is activated, the set of silicon wafers falls into the flipping device. When the flipping device is activated, the silicon wafers are flipped. The flipping device includes a housing and a rotating device connected to the housing. The rotating device drives the housing to flip. A set of opposite inner sides of the housing are provided with side locking members. The side locking members are provided with multiple side locking slots to lock the silicon wafer. The separation and lifting device includes a separation and lifting drive and a separation and lifting component connected to the separation and lifting drive. The separation and lifting drive drives the separation and lifting component to move up and down. The silicon wafer cleaning system also includes: The download unit sequentially downloads data to each group of silicon wafers after they have been flipped. The download unit includes a download gripping device, which includes multiple support arms and a download driving device connected to the multiple support arms. The download driving device drives the multiple support arms to move. The multiple support arms are arranged in a straight line to download a group of silicon wafers. Multiple locking blocks are protruding from the side of the support arm that contacts the silicon wafer. The multiple locking blocks are respectively disposed at both ends of the support arm. The shape of the side of the locking blocks that contacts the silicon wafer is adapted to the shape of the silicon wafer. The silicon wafer merging unit includes a merging device body, a merging clamping device for transferring the separated silicon wafers into the merging device body, and a transfer clamping device for transferring the silicon wafers placed in the merging device body to the cleaning unit. The main body of the merging device is provided with a holding assembly, which has multiple holding slots for placing each group of silicon wafers; The merging and clamping device includes a set of relatively movable slot clamping arms. The slot clamping arms include a connecting arm and a clamping member disposed at one end of the connecting arm. The clamping member is arranged along the axial direction of the silicon wafer, and multiple slots are arranged along the length direction of the clamping member to clamp and hold the silicon wafer. The cleaning unit includes multiple cleaning tanks arranged in sequence and a cleaning clamping device for transferring multiple sets of silicon wafers. Each cleaning tank contains a different cleaning solution, which is used to clean the silicon wafers in sequence.

2. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The carrier and silicon wafer separation unit includes a separation device body, a carrier positioning device disposed on the separation device body, and a silicon wafer lifting device disposed within the separation device body. The carrier positioning device moves relative to the separation device body, and the silicon wafer lifting device moves up and down. The carrier positioning device transports the loading carrier containing the silicon wafer to the silicon wafer lifting device. The silicon wafer lifting device operates to lift the silicon wafer, thereby separating the loading carrier from the silicon wafer.

3. The silicon wafer cleaning apparatus according to claim 2, characterized in that: The carrier positioning device includes a positioning drive device and a support component connected to the positioning drive device. The positioning drive device drives the support component to move. The support component has a through hole so that when the loading carrier is placed on the support component, at least part of the loading carrier extends through the through hole into the interior of the separation device body so that the silicon wafer lifting device can contact the silicon wafer.

4. The silicon wafer cleaning apparatus according to claim 3, characterized in that: The silicon wafer lifting device includes at least one set of silicon wafer support components arranged opposite to each other and a lifting drive device connected to the silicon wafer support components. The lifting drive device drives the silicon wafer support components to move relatively closer to or away from the loading carrier containing the silicon wafers, so as to lift the silicon wafers. The silicon wafer support assembly includes a support member and multiple slots provided on the support member for positioning and supporting the silicon wafer.

5. The silicon wafer cleaning apparatus according to any one of claims 1-4, characterized in that: The transfer clamping device includes a set of relatively movable first slot clamping arms. The first slot clamping arm includes a first connecting arm and a first slot arm disposed at one end of the first connecting arm. The first slot arm is arranged along the axial direction of the silicon wafer, and a plurality of first slots are arranged along the length direction of the first slot arm to clamp and hold the silicon wafer.

6. The silicon wafer cleaning apparatus according to claim 5, characterized in that: The peripheral end face of the card slot is provided with a clamping slot, and the cross-sectional shape of the clamping slot is V-shaped.

7. The silicon wafer cleaning apparatus according to claim 6, characterized in that: The number of clamping members is multiple, and the multiple clamping members are arranged sequentially along the length direction of the connecting arm. The diameter of the clamping member located at the free end of the connecting arm is larger than the diameter of the other clamping members. When clamping the silicon wafer, the clamping member located at the free end of the connecting arm is located below the diameter of the silicon wafer.

8. The silicon wafer cleaning apparatus according to claim 5, characterized in that: The first slot arm includes a mounting body, the first slot is arranged along the circumferential direction of the mounting body, and the cross-sectional shape of the first slot is V-shaped.

9. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The silicon wafer separation unit includes a separation container assembly for placing silicon wafers and a separation clamping device. Multiple sets of cleaned silicon wafers are placed on the separation container assembly, and the separation clamping device clamps a set of silicon wafers and places them in the flipping unit.

10. The silicon wafer cleaning apparatus according to any one of claims 1-4 and 6-9, characterized in that: The drying unit includes a moving device and an air blowing device mounted on the moving device. The air blowing device is driven by the moving device to perform linear motion. The air blowing device includes multiple air blowing pipes, which correspond to the inner and outer sides of the upper carrier, respectively, to blow air and dry the inner and outer sides of the upper carrier.

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