Detection device, detection method, processing apparatus, and processing method

Abstract

The present disclosure provides a detection device, a detection method, a processing device and a processing method. The detection device comprises: a laser interferometer, configured to emit a laser beam to form an interference fringe with a surface of a to-be-processed element, drive the interference fringe to shift phase, collect phase information of the interference fringe, and obtain continuous surface profile data according to the phase information of the interference fringe; and a white light interference detection head, configured to perform vertical scanning on the surface of the to-be-processed element to obtain topographic data of discrete microstructures. The processing device comprises: the detection device as described above, configured to measure the continuous surface profile data of the surface of the to-be-processed element and the topographic data of the discrete microstructures, match the continuous surface profile data and the topographic data of the discrete microstructures to generate full-view data of the surface of the to-be-processed element; and a processing device, configured to generate processing parameters according to the full-view data, and perform single-point uncoupled processing on the surface of the to-be-processed element according to the processing parameters. The device, the device and the method can realize high-precision detection and processing of the surface of the discrete microstructures.

Description

Technical Field

[0001] This disclosure relates to the field of testing and processing technology, and in particular to a testing device, testing method, processing equipment and processing method. Background Technology

[0002] The flatness of the substrate is determined by the substrate holder that supports the substrate. The main feature of the holder is that there are a large number of periodically arranged discrete microstructures on its surface. During use, the back of the substrate is supported by these raised surface microstructures. In order to reduce the impact of contaminants such as particles on the flatness of the substrate, the duty cycle of the microstructure pattern on the surface of the holder is usually very small (less than 5%).

[0003] Traditional optical inspection and processing methods are mainly designed for continuous surfaces. Due to the large number of discrete microstructures on the surface of the retainer, traditional optical inspection methods cannot perform high-precision surface flatness inspection on such retainers, which limits the further improvement of the retainer's accuracy. Furthermore, existing optical processing methods cannot process discontinuous discrete surfaces or have coupling effects during processing, making it impossible to achieve high-precision single-point uncoupled processing, thus failing to meet the substrate flatness requirements of advanced processes. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a detection device, a detection method, a processing equipment, and a processing method, which at least partially solve the above-mentioned technical problems.

[0005] Based on this, the first aspect of this disclosure provides a detection device, comprising: a laser interferometer, used to emit a laser beam to form interference fringes with the surface of the component to be processed, drive the interference fringes to shift phase, acquire phase information of the interference fringes, and obtain continuous surface shape data based on the phase information of the interference fringes; and a white light interferometer detection head, used to perform vertical scanning on the surface of the component to be processed to acquire morphological data of discrete microstructures.

[0006] According to embodiments of this disclosure, the detection device further includes: a first mounting bracket for mounting a laser interferometer; a second mounting bracket for mounting a white light interferometer detection head; a worktable mounted on one side of the laser interferometer and the white light interferometer detection head emitting light; a detection sample stage mounted on the worktable for placing the component to be processed, wherein the worktable is used to switch the detection sample stage between the measurement position of the laser interferometer and the measurement position of the white light interferometer detection head, and to move the component to be processed to different positions for measuring continuous surface data or discrete microstructure morphology data; and a detection encapsulation shell for sealing the laser interferometer, the white light interferometer detection head, the first mounting bracket, the second mounting bracket, the worktable, and the detection sample stage.

[0007] The second aspect of this disclosure provides a detection method based on the above-mentioned detection device, comprising: emitting a laser beam through a laser interferometer to form interference fringes with the surface of the component to be processed, causing the interference fringes to shift phase, acquiring phase information of the interference fringes, and obtaining continuous surface shape data based on the phase information of the interference fringes; performing a vertical scan on the surface of the component to be processed using a white light interferometer to acquire morphological data of discrete microstructures; and matching the continuous surface shape data and the morphological data of discrete microstructures to generate overall surface data of the component to be processed.

[0008] According to embodiments of this disclosure, matching continuous surface shape data and discrete microstructure topography data to generate overall surface data of the component to be processed specifically includes: interpolating the continuous surface shape data; calculating the height of a single microstructure based on the topography data of the discrete microstructure using a method for determining step height; and superimposing the interpolated continuous surface shape data with the height of the single microstructure to obtain overall surface data.

[0009] A third aspect of this disclosure provides a processing apparatus, comprising: a detection device as described above, used to measure continuous surface shape data and discrete microstructure morphology data of the surface of a component to be processed, and to match the continuous surface shape data and discrete microstructure morphology data to generate overall surface data of the surface of the component to be processed; and a processing device used to generate processing parameters based on the overall surface data, and to perform single-point uncoupled processing on the surface of the component to be processed based on the processing parameters.

[0010] According to embodiments of this disclosure, the processing apparatus includes: a vertical polishing machine, which is a single-spindle combined with a three-dimensional displacement stage structure, used for single-point non-coupled processing of the surface of the component to be processed; a processing sample stage, used to support the component to be processed; and a processing encapsulation shell, used to seal the vertical polishing machine and the processing sample stage.

[0011] According to an embodiment of this disclosure, a vertical polishing machine includes a machining spindle, an X-axis displacement stage, a Y-axis displacement stage, a Z-axis displacement stage, a transmission box, and a polishing disc. The torque output by the machining spindle drives the polishing disc to rotate through the transmission box, thereby grinding and polishing the component to be processed. The X-axis displacement stage, the Y-axis displacement stage, and the Z-axis displacement stage work together to move the polishing disc to different positions on the surface of the component to be processed for grinding and polishing.

[0012] According to embodiments of this disclosure, the diameter of the polishing pad is smaller than the arrangement period of the discrete microstructures on the surface of the element to be processed.

[0013] The fourth aspect of this disclosure provides a processing method based on the aforementioned processing equipment, comprising: emitting a laser beam through a laser interferometer to form interference fringes with the surface of the component to be processed, causing the interference fringes to shift phase, acquiring phase information of the interference fringes, and obtaining continuous surface shape data based on the phase information of the interference fringes; performing a vertical scan on the surface of the component to be processed using a white light interferometer to acquire morphological data of discrete microstructures; matching the continuous surface shape data and the morphological data of discrete microstructures to generate overall surface data of the component to be processed; generating processing parameters based on the overall surface data; and performing single-point uncoupled processing on the surface of the component to be processed based on the processing parameters.

[0014] According to embodiments of this disclosure, generating processing parameters based on overall data specifically includes: generating the position and removal amount of each microstructure on the surface of the component to be processed based on the overall data; converting the position and removal amount into processing parameters, wherein the processing parameters include spindle speed, feed rate and processing time.

[0015] According to an embodiment of this disclosure, the processing method further includes: after processing is completed, determining whether the flatness of the surface of the component to be processed is greater than or equal to a preset accuracy threshold; if the flatness of the surface of the component to be processed is less than the preset accuracy threshold, repeating the processing method until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold.

[0016] The detection apparatus, detection method, processing equipment, and processing method provided according to the embodiments of this disclosure have at least the following beneficial effects:

[0017] The detection device and detection method disclosed herein use a laser interferometer to measure continuous surface shape data of the surface of the component to be processed based on the principle of laser interferometry, and a white light interferometer detection head to measure the morphological data of discrete microstructures on the surface of the component to be processed based on the principle of white light interferometry. The two complement each other, and simultaneously realize the measurement of continuous surface shape data and discrete microstructure morphological data, thereby achieving high-precision detection of the surface flatness of the component to be processed.

[0018] The processing equipment and processing method disclosed herein achieve high-precision detection of the surface flatness of the component to be processed based on the detection device, and can obtain accurate processing parameters. On this basis, considering the differences in the amount of material removed during processing of various microstructures, a single spindle combined with a three-dimensional displacement stage structure is set up, thereby achieving a non-coupled single-point processing effect covering the entire surface of the component to be processed. This solves the technical problem that existing optical processing methods cannot process discontinuous discrete surfaces or have coupling effects during processing. Attached Figure Description

[0019] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0020] Figure 1 A schematic diagram of the detection device provided in an embodiment of this disclosure is shown.

[0021] Figure 2 A schematic diagram of the structure of the laser interferometer provided in an embodiment of this disclosure is shown.

[0022] Figure 3 A schematic diagram of the structure of the white light interferometric detection head provided in an embodiment of this disclosure is shown.

[0023] Figure 4 A schematic cross-sectional view of the detection device provided in an embodiment of this disclosure is shown.

[0024] Figure 5 A flowchart illustrating the detection method provided in an embodiment of this disclosure is shown schematically.

[0025] Figure 6 A schematic diagram of the retainer surface structure provided in an embodiment of this disclosure is shown.

[0026] Figure 7 The schematic diagram illustrates the principle of solving the bottom surface shape data of the holder microstructure location provided in the embodiments of this disclosure.

[0027] Figure 8 The schematic diagram illustrates the principle of solving the holder microstructure height data provided in the embodiments of this disclosure.

[0028] Figure 9 The schematic diagram illustrates the principle of superimposing surface data and three-dimensional topography data provided in the embodiments of this disclosure.

[0029] Figure 10 The schematic diagram illustrates the overall structure of the processing equipment provided in the embodiments of this disclosure.

[0030] Figure 11 A schematic diagram of the processing apparatus provided in an embodiment of this disclosure is shown.

[0031] Figure 12 A schematic diagram illustrating the dimensions of a polishing pad provided in an embodiment of this disclosure is shown.

[0032] Figure 13 A flowchart illustrating a processing method provided in one embodiment of the present disclosure is shown schematically.

[0033] Figure 14 A flowchart illustrating a processing method provided in another embodiment of this disclosure is shown schematically.

[0034] Figure 15 The schematic diagram illustrates the structure of the test and processing retainer provided in an embodiment of this disclosure.

[0035] Figure 16An interference fringe pattern obtained from the detection provided in an embodiment of this disclosure is illustrated schematically.

[0036] Figure 17 The illustration schematically shows a three-dimensional topographic image of a single microstructure on the retainer surface obtained from the detection provided in an embodiment of this disclosure. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0039] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0040] In the description of this disclosure, it should be understood that the terms "longitudinal", "length", "circumferential", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the subsystem or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.

[0041] Throughout the accompanying drawings, identical elements are represented by the same or similar reference numerals. Conventional structures or constructions have been omitted where they may cause confusion in understanding this disclosure. Furthermore, the shapes, dimensions, and positional relationships of the components in the drawings do not reflect actual size, scale, or actual positional relationships. Additionally, any reference numerals placed between parentheses in the claims should not be construed as limiting the claims.

[0042] Similarly, to simplify this disclosure and aid in understanding one or more of the various aspects of the disclosure, in the above description of exemplary embodiments of the present disclosure, various features of the present disclosure are sometimes grouped together in a single embodiment, figure, or description thereof. The use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] Figure 1 A schematic diagram of the detection device provided in an embodiment of this disclosure is shown.

[0045] like Figure 1 As shown, the detection device may include, for example, a laser interferometer 12 and a white light interferometer detection head 14.

[0046] The laser interferometer 12 is used to emit a laser beam to form interference fringes with the surface of the component to be processed, drive the interference fringes to shift phase, collect the phase information of the interference fringes, and obtain continuous surface shape data based on the phase information of the interference fringes.

[0047] The white light interferometer detector 14 is used to perform vertical scanning on the surface of the component to be processed to obtain morphological data of discrete microstructures.

[0048] Figure 2 A schematic diagram of the structure of the laser interferometer provided in an embodiment of this disclosure is shown.

[0049] like Figure 2 As shown, the laser interferometer 12 can be, for example, a Fizeau-type interferometer, including a laser source, collimating mirror, beam splitter, phase shifter, standard mirror, and CCD (Charge Coupled Device) camera.

[0050] A laser beam emitted from a laser source is collimated by a collimating lens, then passes sequentially through a beam splitter and a standard mirror before illuminating the surface of the component to be processed. The laser beam transmitted through the standard mirror forms interference fringes with the surface under test. An actuator controls a phase shifter on the standard mirror to produce a minute displacement, causing the interference fringes to shift phase. A CCD camera is used to capture the interference fringes, and the surface shape data of the surface under test can be calculated by analyzing the phase information of the interference fringes. The component under test can be, for example, a substrate holder; the specific type of component disclosed herein is not limited.

[0051] The measurement principle of the Fizeau interferometer determines that the laser interferometer 12 is suitable for measuring the surface shape data of continuous surfaces, but not for measuring the discrete microstructure of the surface of the component to be processed.

[0052] Figure 3 A schematic diagram of the structure of the white light interferometric detection head provided in an embodiment of this disclosure is shown.

[0053] like Figure 3 As shown, a white light interferometric detection head may include, for example, an illumination system, an imaging system, a vertical scanning mechanism, an interferometer lens, and a CCD camera.

[0054] The illumination system emits a light beam, and the imaging system, vertical scanning mechanism, and interferometer objective use the light beam to perform vertical scanning and imaging of the surface of the component to be processed, thereby acquiring the morphological data of the discrete microstructure on the surface of the component to be processed, and using a CCD camera to record the morphological data of the discrete microstructure.

[0055] The vertical scanning mechanism typically employs a high-precision piezoelectric ceramic actuator, enabling nanometer-level precise measurement of the three-dimensional morphology of the surface of the component to be processed. The white light interferometer detection head 14 is used in the detection device to detect the discrete microstructure on the surface of the device, forming a functional complement to the laser interferometer 12.

[0056] Figure 4 A schematic cross-sectional view of the detection device provided in an embodiment of this disclosure is shown.

[0057] See Figure 1 and Figure 4 The detection device also includes, for example, a detection encapsulation housing 11 ( Figure 1 and Figure 4 (Not shown in the image), first mounting bracket 13, second mounting bracket 15, worktable 16, and sample testing stage 17. Wherein:

[0058] The first mounting bracket 13 is used to mount the laser interferometer 12.

[0059] The second mounting bracket 15 is used to mount the white light interferometric detection head 14. Furthermore, the main optical path structure of the white light interferometric detection head 14 can be encapsulated within a metal housing 141, with only the motorized tower 142 exposed externally. This motorized tower 142 is equipped with interferometric lenses of different magnifications, allowing for the detection of different field sizes by switching the interferometric lenses. The detection field size of the white light interferometric detection head 14 is typically between 0.1mm × 0.1mm and 10mm × 10mm.

[0060] The worktable 16 is installed on one side of the emitted light beam from the laser interferometer 12 and the white light interferometer detection head 14. Figure 1 and Figure 4 (As shown below).

[0061] The test sample stage 17 is mounted on the worktable 16 and is used to place the component to be processed. The worktable 16 is used to drive the test sample stage 17 to switch between the measurement position of the laser interferometer 12 and the measurement position of the white light interferometer detection head 14, and to move the component to be processed to different positions to measure the morphological data of continuous surface shape data or discrete microstructure.

[0062] The detection enclosure 11 is used to seal the laser interferometer 12, white light interferometer detection head 14, first mounting bracket 13, second mounting bracket 15, worktable 16, and sample stage 17. The detection enclosure 11 primarily serves to isolate external contaminants and protect the internal precision optical instruments. This enclosure is assembled using riveting, threaded connections, welding, etc., and is made of metal. It can be a single sheet or composed of multiple sheets joined together. Holes can be drilled at necessary locations to facilitate disassembly, assembly, and wiring.

[0063] Based on the above-described detection device, this disclosure also provides a detection method.

[0064] Figure 5 A flowchart illustrating the detection method provided in an embodiment of this disclosure is shown schematically.

[0065] like Figure 5 As shown, the detection method may include, for example, operations S501 to S503.

[0066] In operation S501, a laser beam is emitted by a laser interferometer to form interference fringes with the surface of the component to be processed, causing the interference fringes to shift phase, and the phase information of the interference fringes is collected. Continuous surface shape data is obtained based on the phase information of the interference fringes.

[0067] When operating the S502, the surface of the component to be processed is vertically scanned by a white light interferometer to obtain the morphological data of the discrete microstructure.

[0068] In operation S503, the continuous surface shape data and the topography data of discrete microstructures are matched to generate the overall topography data of the surface of the component to be processed.

[0069] In this embodiment of the disclosure, the process of generating overall data can be as follows: interpolating continuous surface data; calculating the height of a single microstructure based on the morphology data of discrete microstructures using a method for determining step height; and superimposing the interpolated continuous surface data with the height of the single microstructure to obtain overall data.

[0070] The following detailed explanation uses a retainer as an example of the component to be processed.

[0071] Figure 6 A schematic diagram of the retainer surface structure provided in an embodiment of this disclosure is shown.

[0072] For example, first, open the sliding door of the test enclosure 11, install the retainer on the test sample stage 17 of the test device, close the sliding door, and start the test.

[0073] Secondly, the surface shape data of the retainer is measured: the workpiece stage 16 moves the retainer to directly below the laser interferometer 12, and the following steps are performed: Figure 6 The surface shape detection of the bottom surface of the holder shown is missing because the area of ​​the microstructure on the surface of the holder is very small and cannot form effective interference fringes.

[0074] Figure 7 The schematic diagram illustrates the principle of solving the bottom surface shape data of the holder microstructure location provided in the embodiments of this disclosure.

[0075] like Figure 7 As shown in the figure, the black circles represent the pixel surface shape data of the retainer surface obtained by measurement, and the white circles represent the pixel surface shape data of the retainer surface obtained by interpolation. Since the occupancy of the surface microstructure is small, the number of missing data points is usually very small. Therefore, the surface shape data h1 of the bottom surface of the retainer microstructure obtained by interpolation has high accuracy.

[0076] Next, the three-dimensional morphological data of the discrete microstructure is detected: the workpiece stage 16 moves the retainer to directly below the white light detection head 14, and the following steps are performed: Figure 6 The three-dimensional morphology detection of the microstructure on the surface of the holder shown is performed by switching the electric tower 142 to an interference objective lens with an appropriate magnification according to the area size of the microstructure before detection, so as to ensure that the detection field of view is larger than the area size of the microstructure.

[0077] Figure 8 The schematic diagram illustrates the principle of solving the holder microstructure height data provided in the embodiments of this disclosure.

[0078] like Figure 8 As shown, after measuring the morphological data of the scattered microstructures, the height h2 of a single microstructure is calculated using the method of calculating the step height; the workpiece stage 16 drives the holder to move to different positions to detect the height of the microstructures until the three-dimensional morphology of all microstructures on the surface of the holder is completely detected.

[0079] Finally, by superimposing the detected surface shape data and three-dimensional topography data, the overall topography data of the retainer surface can be obtained, which contains all the topography data information of the entire retainer surface.

[0080] Figure 9 The schematic diagram illustrates the principle of superimposing surface data and three-dimensional topography data provided in the embodiments of this disclosure.

[0081] like Figure 9 As shown, the overall data h of the microstructure on the surface of the retainer is the sum of the surface shape data h1 at that location and the height h2 of a single microstructure. The flatness of the retainer surface can be calculated using the overall data h.

[0082] It should be noted that the three-dimensional topography data of the discrete microstructure can be detected first, followed by the surface shape data of the retainer. The specific order can be determined according to the actual application requirements, and this disclosure does not impose any restrictions.

[0083] According to the detection device and detection method provided in the embodiments of this disclosure, a laser interferometer measures the continuous surface shape data of the surface of the component to be processed, and a white light interferometer detection head measures the morphological data of the discrete microstructure on the surface of the component to be processed. The two complement each other, and simultaneously realize the measurement of continuous surface shape data and discrete microstructure morphological data, thereby achieving high-precision detection of the surface flatness of the component to be processed.

[0084] Based on the above-described detection device, this disclosure also provides a processing device.

[0085] Figure 10 The schematic diagram illustrates the overall structure of the processing equipment provided in the embodiments of this disclosure.

[0086] like Figure 10 As shown, the processing equipment may include:

[0087] The detection device 1 is used to measure the continuous surface shape data and discrete microstructure morphology data of the surface of the component to be processed, and to match the continuous surface shape data and discrete microstructure morphology data to generate the overall surface data of the surface of the component to be processed.

[0088] The processing device 2 is used to generate processing parameters based on the overall data, and to perform single-point non-coupled processing on the surface of the component to be processed according to the processing parameters.

[0089] The structure of detection device 1 and Figures 1-4The structure shown is the same; for details, please refer to the aforementioned introduction of the detection device, which will not be repeated here. The processing device 2 will be described in detail below.

[0090] Figure 11 A schematic diagram of the processing apparatus provided in an embodiment of this disclosure is shown.

[0091] like Figure 11 As shown, the processing apparatus 2 may include, for example, a processing encapsulation housing 21, a vertical polishing machine 22, and a processing sample stage 23, wherein:

[0092] The processing and sealing housing 21 is used to seal the vertical polishing machine and the processing sample stage. The purpose of the seal is to prevent the leakage of contaminants such as slurry, polishing powder, and polishing fluid used during the processing, which could cause contamination.

[0093] The vertical polishing machine 22 is a single spindle combined with a three-dimensional displacement stage structure. It is used to take the overall data transmitted by the detection device 1 as input data, generate processing parameters, and perform single-point uncoupled processing on the surface of the component to be processed to achieve the desired surface accuracy.

[0094] The sample stage 23 is used to hold the components to be processed.

[0095] Traditional small-head polishing equipment often employs a planetary gear train structure with a revolution motor and a rotation motor. However, because the surface of the processing element in the equipment of this disclosure is not a continuous structure but a series of discrete microstructures, the amount of material removed varies among these microstructures, resulting in a complex material removal function that is unsuitable for traditional planetary gear train structures. Furthermore, to cover a large processing area, the diameter of the polishing disc in a planetary gear train structure with a revolution motor and a rotation motor is typically large (tens to hundreds of millimeters). The amount of material removed within the diameter of the polishing disc does not show differences, resulting in a coupling effect and failing to achieve single-point processing of local microstructures on the retainer surface.

[0096] Based on this, the vertical polishing machine 22 provided in this embodiment adopts a structure of single spindle + XYZ displacement stage.

[0097] Specifically, the vertical polishing machine 22 may include, for example, a machining spindle 221, an X-axis displacement stage 222, a Y-axis displacement stage 223, a Z-axis displacement stage 224, a transmission box 225, and a polishing disc 226. The torque output from the machining spindle 221 drives the polishing disc 226 to rotate at high speed via the transmission box 225, grinding and polishing the surface of the retainer to be processed. The X-axis displacement stage 222, Y-axis displacement stage 223, and Z-axis displacement stage 224 move the polishing disc 226 to different positions for processing, thereby ensuring that the processing area covers the entire surface of the sample to be processed.

[0098] Furthermore, in order to better reflect the differences in the amount of material removed during processing and to avoid coupling effects, the dimensions of the polishing disc 226 are also designed in accordance with the present disclosure embodiments.

[0099] Figure 12 A schematic diagram illustrating the dimensions of a polishing pad provided in an embodiment of this disclosure is shown.

[0100] like Figure 12 As shown, the diameter of the polishing disk is smaller than the arrangement period of the discrete microstructures on the surface of the component to be processed, so as to achieve a non-coupled single-point processing effect covering the entire surface of the retainer.

[0101] Furthermore, the processing equipment may also include, for example, a platform 3 and a base 4.

[0102] Platform 3 is used to install the testing device 1 and the processing device 2. Platform 3 can be made of thicker marble or granite to improve the stability of the equipment.

[0103] The base 4 is used to contact the ground and bear the load. The base 4 has a hollow frame structure, which facilitates the placement of components such as the control cabinet, chassis, and waste liquid tank of the detection device 1 and the processing device 2, ensuring the compactness of the structure.

[0104] Based on the above-described processing equipment, this disclosure also provides a processing method.

[0105] Figure 13 A flowchart illustrating a processing method provided in one embodiment of the present disclosure is shown schematically.

[0106] like Figure 13 As shown, the processing method may include, for example, operations S1301 to S1304.

[0107] In operation S1301, a laser beam is emitted by a laser interferometer to form interference fringes with the surface of the component to be processed, causing the interference fringes to shift phase, and the phase information of the interference fringes is collected. Continuous surface shape data is obtained based on the phase information of the interference fringes.

[0108] In operation S1302, the surface of the component to be processed is vertically scanned by a white light interferometer to obtain the morphological data of discrete microstructures.

[0109] In operation S1303, the continuous surface shape data and the topography data of discrete microstructures are matched to generate the overall topography data of the surface of the component to be processed.

[0110] In operation S1304, processing parameters are generated based on the overall data, and single-point uncoupled processing is performed on the surface of the component to be processed based on the processing parameters.

[0111] Operations S1301 to S1303 correspond one-to-one with operations S501 to S503, and will not be repeated here. Operation S1304 will be described in detail below.

[0112] First, the machining device generates machining parameters based on the overall data, which may include: generating the position and removal amount of each microstructure on the surface of the component to be processed based on the overall data. The position and removal amount are then converted into machining parameters, including spindle speed, feed rate, and machining time.

[0113] Secondly, processing is performed according to the processing parameters: During processing, the X-axis displacement stage 222 and Y-axis displacement stage 223 move the polishing disk 226 to different positions according to the position information, the Z-axis displacement stage 224 executes the corresponding feed rate according to the amount of material to be removed, and the machining spindle 221 drives the polishing disk 226 to polish the microstructures on the surface of the component to be processed. Since the diameter of the polishing disk 226 is smaller than the microstructure arrangement period, the processing can achieve decoupled single-point processing. The above processing continues until all microstructures on the surface of the component to be processed are processed.

[0114] Figure 14 A flowchart illustrating a processing method provided in another embodiment of this disclosure is shown schematically.

[0115] like Figure 14 As shown, this processing method may also include, for example, operation S1305, based on operations S1301 to S1304.

[0116] In operation S1305, it is determined whether the flatness of the surface of the component to be processed after processing is greater than or equal to the preset accuracy threshold.

[0117] If the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold after processing, the processing of the component is complete. If the flatness of the surface of the component to be processed is less than the preset accuracy threshold, operations S1301 to S1304 are repeated until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold. The criterion for whether the accuracy meets the requirements can be the actual performance of the retainer or the overall data of the retainer measured by the detection device 1.

[0118] According to the processing equipment and processing method provided in this disclosure, the surface flatness of the component to be processed can be detected with high precision based on the detection device, and accurate processing parameters can be obtained. On this basis, considering the difference in the amount of material removed by each microstructure, a single spindle combined with a three-dimensional displacement stage structure is set up, which can achieve a non-coupled single-point processing effect covering the entire surface of the component to be processed, thus solving the problem that existing optical processing methods cannot process discontinuous discrete surfaces or have coupling effects during processing.

[0119] To more clearly illustrate the detection device, detection method, processing equipment, and processing method provided in the embodiments of this disclosure, specific examples of detecting and processing a retainer are listed below.

[0120] Figure 15 The schematic diagram illustrates the structure of the test and processing retainer provided in an embodiment of this disclosure.

[0121] like Figure 15 As shown, this holder is a typical substrate holder structure, made of silicon carbide, with a surface consisting of a large number of regularly arranged cylindrical dot structures. The cylinders have a diameter of 0.5 mm, a height of 0.1 mm, a period of 5 mm, and are arranged within a φ298 mm area, used to hold a 12-inch substrate. A key feature of this holder is the requirement for a very high surface flatness, making it highly suitable for inspection and processing using the inspection device, inspection method, processing equipment, and processing method provided in this disclosure. The specific inspection and processing procedure is as follows:

[0122] First, install the sample: install the retainer sample to be processed onto the test sample stage 17 of test turner 1, close the sliding door, and prepare to start the test.

[0123] Then, the workpiece stage 16 moves the retainer to directly below the laser interferometer 12, and the laser interferometer 12 is used to measure the aperture of φ300mm and the standard mirror shape accuracy of 1 / 20λ.

[0124] Figure 16 An interference fringe pattern obtained from the detection provided in an embodiment of this disclosure is illustrated schematically.

[0125] like Figure 16 As shown, due to the small diameter of the cylinder and the discontinuous structure, effective interference fringes cannot be formed. The surface shape data of the bottom surface is measured, and the data of each cylinder is temporarily missing.

[0126] Next, the three-dimensional morphology of the cylinder is inspected: the workpiece stage 16 moves the holder directly below the white light inspection head 14 to inspect the three-dimensional morphology of the cylindrical dot matrix. Before inspection, the electric tower 142 is switched to a 10x interferometer lens with a field of view of 1mm×1mm, which can cover a cylinder with a diameter of 0.5mm. During the inspection, the workpiece stage 16 moves the holder to different positions for inspection until the three-dimensional morphology of all cylindrical structures on the holder surface is inspected.

[0127] Figure 17 The illustration schematically shows a three-dimensional topographic image of a single microstructure on the retainer surface obtained from the detection provided in an embodiment of this disclosure.

[0128] like Figure 17 As shown, the three-dimensional morphology of a single microstructure on the surface of the retainer obtained by detection is a cylinder.

[0129] Next, data overlay: The obtained bottom surface data is overlaid with the obtained cylindrical lattice 3D topography data to obtain the overall topography data of the retainer surface. The overlay uses the least squares method to match the data of the bottom edge of the cylinder with the surface shape data of the corresponding position to generate the overall topography data of the retainer. This data contains the XYZ point cloud data information of all structures on the retainer surface.

[0130] Next, processing preparation: Take out the tested retainer and install it on the processing sample stage 23 of the processing device 2, ready for processing.

[0131] Next, data transmission: The generated overall data of the retainer is transmitted to the processing device 2. The processing device 2 generates processing data such as the position of each cylinder on the surface of the retainer and the amount of material removed based on this data. The calculation of the amount of material removed is based on the minimum value of the height of all cylinders.

[0132] Next, single-point processing: The vertical polishing machine 22 receives the generated processing data and converts the amount of material removed into specific processing parameters such as spindle speed, feed rate, and processing time. In this embodiment, the spindle speed is 200 r / min, the feed rate is 0.01 μm, and the processing time is linearly related to the amount of material removed, ranging from 60 s to 280 s. The polishing disc 26 has a diameter of 4 mm, slightly smaller than the period of the cylindrical arrangement, and uses W20 diamond micro powder as the abrasive. Processing is carried out according to the above processing parameters until all the cylinders on the surface are processed.

[0133] Finally, accuracy judgment: Determine whether the surface accuracy of the processed retainer meets the requirements. If it does, the sample processing is complete; if it does not, repeat the above process to re-inspect and process iteratively until the accuracy meets the requirements.

[0134] The specific embodiments described above further illustrate the purpose, technical solutions, and beneficial effects of this disclosure. It should be understood that the above descriptions are merely specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A detection device, characterized in that, include: A laser interferometer is used to emit a laser beam to form interference fringes with the surface of the component to be processed, drive the interference fringes to shift phase, collect the phase information of the interference fringes, and obtain continuous surface shape data based on the phase information of the interference fringes; A white light interferometer detection head is used to perform vertical scanning on the surface of the component to be processed to obtain morphological data of discrete microstructures. The first mounting bracket is used to mount the laser interferometer; The second mounting bracket is used to mount the white light interferometry detection head; The worktable is installed on one side of the emitted light beam from the laser interferometer and the white light interferometer detection head; A test sample stage is installed on the workbench for placing the component to be processed. The workbench is used to switch the test sample stage between the measurement position of the laser interferometer and the measurement position of the white light interferometer detection head, and to move the component to be processed to different positions for measuring continuous surface data or discrete microstructure morphology data. The process involves interpolating the continuous surface shape data; calculating the height of a single microstructure based on the morphology data of the discrete microstructure using a method for determining step height; and superimposing the interpolated continuous surface shape data with the height of the single microstructure to obtain the overall surface data of the component to be processed.

2. The detection device according to claim 1, characterized in that, The detection device further includes: The detection enclosure is used to seal the laser interferometer, the white light interferometer detection head, the first mounting bracket, the second mounting bracket, the worktable, and the detection sample stage.

3. A detection method based on the detection device according to claim 1 or 2, characterized in that, include: A laser beam is emitted by a laser interferometer to form interference fringes on the surface of the component to be processed, causing the interference fringes to shift phase. The phase information of the interference fringes is collected, and the continuous surface shape data is obtained based on the phase information of the interference fringes. The surface of the component to be processed is vertically scanned by a white light interferometer to obtain the morphological data of the discrete microstructure; Interpolate the continuous surface data; The height of a single microstructure is calculated based on the morphological data of the discrete microstructure using a method for determining step height. The interpolated continuous surface data is superimposed with the height of a single microstructure to obtain the overall data.

4. A processing device, characterized in that, include: The detection device as described in claim 1 or 2 is used to measure continuous surface shape data and discrete microstructure morphology data of the surface of the component to be processed, and to match the continuous surface shape data and the discrete microstructure morphology data to generate overall surface data of the surface of the component to be processed. The processing apparatus includes: a vertical polishing machine, which is a single-spindle combined with a three-dimensional displacement stage structure, used to perform single-point non-coupled processing on the surface of the component to be processed based on the processing parameters generated by the overall data; the vertical polishing machine includes a polishing disc, the diameter of which is smaller than the arrangement period of the discrete microstructures on the surface of the component to be processed.

5. The processing equipment according to claim 4, characterized in that, The processing apparatus includes: A sample stage is used to support the component to be processed; A processing and packaging shell is used to seal the vertical polishing machine and the processing sample stage.

6. The processing equipment according to claim 5, characterized in that, The vertical polishing machine includes a machining spindle, an X-axis displacement stage, a Y-axis displacement stage, a Z-axis displacement stage, and a transmission box, wherein: The torque output by the machining spindle drives the polishing disc to rotate through the transmission box, grinding and polishing the component to be processed. The X-axis displacement stage, the Y-axis displacement stage and the Z-axis displacement stage work together to move the polishing disc to different positions on the surface of the component to be processed for grinding and polishing.

7. A processing method based on the processing equipment according to any one of claims 4-6, characterized in that, include: A laser beam is emitted by a laser interferometer to form interference fringes on the surface of the component to be processed, causing the interference fringes to shift phase. The phase information of the interference fringes is collected, and the continuous surface shape data is obtained based on the phase information of the interference fringes. The surface of the component to be processed is vertically scanned by a white light interferometer to obtain the morphological data of the discrete microstructure; The continuous surface shape data and the topography data of the discrete microstructure are matched to generate the overall topography data of the surface of the component to be processed; Processing parameters are generated based on the overall data, and single-point uncoupled processing is performed on the surface of the component to be processed based on the processing parameters.

8. The processing method according to claim 7, characterized in that, The step of generating processing parameters based on the overall data specifically includes: Based on the overall data, the location and amount of material removed from each microstructure on the surface of the component to be processed are generated. The location and the amount of material removed are converted into processing parameters, wherein the processing parameters include spindle speed, feed rate and processing time.

9. The processing method according to claim 7 or 8, characterized in that, The processing method further includes: After processing, determine whether the flatness of the surface of the component to be processed is greater than or equal to a preset accuracy threshold. If the flatness of the surface of the component to be processed is less than a preset accuracy threshold, the processing method is repeated until the flatness of the surface of the component to be processed is greater than or equal to the preset accuracy threshold.

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