A photovoltaic encapsulant assembly and method of making the same

Abstract

This invention discloses a photovoltaic encapsulation module and its preparation method, comprising a photovoltaic laminate and a frame encapsulation component; the photovoltaic laminate includes a front encapsulation part, a cell string layer, and a back encapsulation part laminated together; the frame encapsulation component includes at least a frame core layer and a surface layer laminated together; the photovoltaic laminate and the frame encapsulation component are encapsulated together by a cold bonding process to obtain a photovoltaic encapsulation module; this invention avoids problems such as photovoltaic module bubbling, delamination, deformation, and creep, and the construction process is efficient and convenient, and is not limited by the thickness of the lightweight photovoltaic backsheet; it also meets the requirements of photovoltaic encapsulation, and is therefore suitable for large-scale promotion and application.

Description

Technical Field

[0001] This invention belongs to the field of photovoltaic module packaging, and specifically relates to a photovoltaic packaging module and its preparation method. Background Technology

[0002] In order to realize the good application of honeycomb core or porous foam layer in the field of photovoltaic module encapsulation, the applicant has previously proposed technical solutions with publication numbers CN110400853A, CN210110803U and CN110491961B, which have effectively solved the problems of bubbling, delamination and deformation creep that occur in photovoltaic modules with honeycomb core or porous foam core during lamination.

[0003] Through in-depth application and new exploration in this product field, the applicant has achieved new innovative results. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a photovoltaic encapsulation module and its preparation method, which will not cause problems such as photovoltaic module bubbling, delamination, deformation and creep, and the construction process is efficient and convenient, and will not be limited by the thickness of the lightweight photovoltaic backsheet; at the same time, it meets the requirements of photovoltaic encapsulation, and is therefore suitable for large-scale promotion and application.

[0005] The technical solution adopted in this invention is as follows:

[0006] A photovoltaic encapsulation component includes a photovoltaic laminate and a frame encapsulation component; wherein,

[0007] Photovoltaic laminates include a front encapsulation section, a cell string layer, and a back encapsulation section that are laminated and combined into one unit;

[0008] The skeleton encapsulation component includes at least a skeleton core layer and a surface layer that are integrally composited;

[0009] The photovoltaic laminate and the skeleton encapsulation component are encapsulated and composited into one unit through a cold bonding process to obtain the photovoltaic encapsulation component.

[0010] Preferably, the cold bonding process includes adhesive bonding, wherein the adhesive is a curing adhesive and / or a non-curing adhesive.

[0011] Preferably, the composite area between the back packaging portion and the skeleton packaging portion is provided with an adhesive in a closed shape at least on its outer periphery, and / or the coating thickness of the adhesive is 0.05-20mm.

[0012] Preferably, the peel strength at the bonding point between the back packaging portion and the skeleton packaging portion is not less than 15 N / cm.

[0013] Preferably, the photovoltaic laminate is formed by a hot lamination process, and / or the skeleton encapsulation is formed by a hot melt composite process.

[0014] Preferably, the skeleton core layer and the back packaging part are packaged together by a cold bonding process; or the skeleton package includes at least an inner layer, a skeleton core layer and a surface layer that are packaged together, and the inner layer and the back packaging part are packaged together by a cold bonding process.

[0015] Preferably, the material of the skeleton core layer includes not less than 40 wt% thermoplastic material, and the skeleton core layer is in the shape of a honeycomb, a porous foam, or a hollow frame.

[0016] Preferably, the skeleton encapsulation component replaces the metal frame as the substrate structure of the photovoltaic module.

[0017] Preferably, a method for preparing a photovoltaic encapsulation module as described above includes the following steps:

[0018] S1) Prepare photovoltaic laminates and frame encapsulation components respectively;

[0019] S2) The photovoltaic laminate and the skeleton encapsulation component are bonded together using a cold bonding process; in the cold bonding process, the photovoltaic laminate and the skeleton encapsulation component are bonded at room temperature or not exceeding 80°C, and / or a pressure force is applied to the bonding joint between the photovoltaic laminate and the skeleton encapsulation component, the pressure force not exceeding 0.2 kPa.

[0020] Preferably, the photovoltaic laminate is formed by a hot lamination process, wherein the lamination temperature is not lower than 100°C and / or the lamination pressure is not lower than 0.5 kPa; the skeleton encapsulation is formed by a hot melt composite process, wherein the hot melt temperature is not lower than 100°C and / or the composite pressure is not lower than 0.5 kPa.

[0021] Preferably, in the cold bonding process, an adhesive is applied to the surface of the skeleton package and / or the surface of the back package, and the adhesive is a curing adhesive and / or a non-curing adhesive.

[0022] The peel strength described in this application is obtained by testing with a peel strength testing device according to the GB / T34444-2017 standard; the dyne value described in this application specifically refers to the magnitude of the surface tension coefficient, which is obtained by testing with a dyne pen.

[0023] It should be noted that, prior to the technical solution proposed in this application, numerous prior public disclosures have proposed using honeycomb panels, which possess both rigidity and lightweight properties, as the outer layer material of the backsheet for photovoltaic modules. To achieve effective encapsulation in photovoltaic modules, conventional hot lamination processes are typically used to perform a single lamination encapsulation of the honeycomb panels, the various encapsulation layer materials of the photovoltaic module, and the cell strings (which is prone to problems such as bubbling, delamination, and deformation / creep). Alternatively, a secondary lamination encapsulation process is performed between the honeycomb panels and the laminated photovoltaic modules. This method is slow, involves high lamination pressure, and can easily lead to microcracks in the photovoltaic modules.

[0024] Through dedicated development and practice by the applicant's inventor team, the applicant was surprised to discover that by pre-laminating and encapsulating the battery strings and then directly encapsulating them with the composite-molded frame encapsulation through a cold bonding process, problems such as photovoltaic module bubbling, delamination, deformation, and creep do not occur. Moreover, the construction process is efficient, convenient, and low-cost, and is not limited by the thickness of the lightweight photovoltaic backsheet. Importantly, after extensive performance testing, the photovoltaic encapsulation module provided by this application meets the photovoltaic encapsulation requirements and is therefore suitable for large-scale promotion and application. Attached Figure Description

[0025] Figure 1a This is a schematic diagram of the photovoltaic laminate in Embodiment 1 of the present invention;

[0026] Figure 1b This is a schematic diagram of the skeleton packaging component in Embodiment 1 of the present invention;

[0027] Figure 2 This is a schematic diagram of the process of cold bonding between the photovoltaic laminate and the skeleton encapsulation component in Embodiment 1 of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of the photovoltaic encapsulation component in Embodiment 1 of the present invention;

[0029] Figure 4a This is a schematic diagram of the photovoltaic laminate in Embodiment 3 of the present invention;

[0030] Figure 4b This is a schematic diagram of the skeleton packaging component in Embodiment 3 of the present invention;

[0031] Figure 5 This is a schematic diagram of the process of cold bonding between the photovoltaic laminate and the skeleton encapsulation component in Embodiment 3 of the present invention;

[0032] Figure 6 This is a schematic diagram of the photovoltaic encapsulation component in Embodiment 3 of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of the photovoltaic encapsulation component in Embodiment 8 of the present invention. Detailed Implementation

[0034] This invention discloses a photovoltaic (PV) encapsulation module, including a photovoltaic laminate and a frame encapsulation component. The photovoltaic laminate includes a front encapsulation portion, a cell string layer, and a back encapsulation portion laminated together. The frame encapsulation component includes at least a frame core layer and a surface layer laminated together. The photovoltaic laminate and the frame encapsulation component are encapsulated together using a cold bonding process to obtain the PV encapsulation module. Preferably, in this embodiment, the frame encapsulation component replaces the metal frame as the substrate structure of the PV module, further reducing the overall installation weight of the PV module and further facilitating the promotion of BIPV (Building Integrated Photovoltaics).

[0035] Preferably, in this embodiment, the battery string layer can be any known battery string layer, such as a polycrystalline silicon battery string layer, a monocrystalline silicon battery string layer, an amorphous silicon battery string layer, or a battery string layer made of other crystalline or amorphous materials; in terms of the shape of the battery cell, it can be a whole cell, a 1 / 2 slice, a 1 / 4 slice, a 1 / 5 slice, or other specifications of slices, or a stacked battery string layer; preferably, in this embodiment, the front-side encapsulation portion can be composed of one or more known front-side encapsulation material layers, preferably a front-side encapsulation material layer with excellent light transmittance and weather resistance, specifically... The encapsulation layer material proposed in CN106299000B is preferred; the back encapsulation part can also use one or more known back encapsulation material layers (including photovoltaic backsheets), preferably using a back encapsulation material layer with good insulation and water vapor permeability, specifically the encapsulation layer material proposed in CN211555907U; preferably, in this embodiment, in order to facilitate the composite effect of the skeleton encapsulation component, the material of the skeleton core layer includes not less than 40wt% thermoplastic material, and the skeleton core layer is in the shape of a honeycomb, a porous foam, or a hollow frame.

[0036] More preferably, in order to facilitate the lightweight installation of the photovoltaic module as a whole, in this embodiment, the photovoltaic laminate is a lightweight photovoltaic laminate with a weight not exceeding 5 kg / m². 2 More preferably, it should not exceed 4 kg / m 2 Specifically, preferably, the applicant's method can be adopted. Component products; of course, in other embodiments, any known photovoltaic laminate (e.g., whose weight does not exceed 5 kg / m²) can also be used. 2 The photovoltaic laminate and skeleton encapsulation components are included, and the skeleton encapsulation components are not particularly limited in this embodiment.

[0037] More preferably, in order to facilitate the lightweight installation of the photovoltaic module as a whole, in this embodiment, the weight of the frame encapsulation component does not exceed 5 kg / m². 2Specifically, preferably, the skeleton package can preferably adopt the material scheme of the second thermoplastic substrate layer (as inner layer), thermoplastic core layer (as skeleton core layer) and first thermoplastic substrate layer (as surface layer) proposed in CN110400853A. Of course, other suitable materials can also be used, and this embodiment does not impose any particular restrictions on them.

[0038] Preferably, in order to improve the encapsulation effect of the battery string layer, the photovoltaic laminate is formed by a hot lamination process in this embodiment; preferably, in order to improve the encapsulation effect of the core layer of the skeleton, the skeleton encapsulation is formed by a hot melt composite process.

[0039] Preferably, in this embodiment, the cold bonding process includes adhesive bonding, wherein the adhesive is a curing adhesive and / or a non-curing adhesive; more preferably, the curing adhesive can be a one-component adhesive (specifically, it can be a silicone adhesive or other known one-component adhesive) or a multi-component adhesive (specifically, it can be a known AB two-component adhesive); the non-curing adhesive can be butyl rubber or pressure-sensitive adhesive or other known non-curing adhesive;

[0040] It should be noted that the adhesive involved in this embodiment can be any material with cold bonding properties, as long as it can achieve a good cold bonding effect without heating. There are no specific restrictions on its form (it can be a gel, solid tape, or liquid, etc.) and material name (it can be called adhesive or adhesive coating, etc.).

[0041] Preferably, after extensive experimental testing by the applicant, in order to further ensure the encapsulation effect of the photovoltaic module, in this embodiment, the peel strength at the bonding point between the back encapsulation part and the frame encapsulation part should not be less than 15 N / cm, otherwise the photovoltaic encapsulation requirements cannot be met; more preferably, it is 18-60 N / cm.

[0042] Preferably, in this embodiment, the composite area between the back packaging part and the skeleton packaging part is provided with a closed adhesive at least on its outer periphery. More preferably, the composite area between the back packaging part and the skeleton packaging part is provided with a plurality of parallel closed adhesives, and these parallel closed adhesives can also preferably be arranged to be staggered. Even more preferably, the composite area between the back packaging part and the skeleton packaging part is provided with a full-surface adhesive coating.

[0043] Preferably, in this embodiment, the coating thickness of the adhesive is 0.05-20 mm, more preferably 0.08-10 mm, and even more preferably 0.1-10 mm. The specific coating thickness is selected according to the type of adhesive chosen, and this embodiment does not impose a unique limitation on it.

[0044] Preferably, in one embodiment, the skeleton core layer and the back encapsulation portion are encapsulated and composited together by a cold bonding process; preferably, in another embodiment, the skeleton encapsulation component includes at least an inner layer, a skeleton core layer, and a surface layer that are composited together, and the inner layer and the back encapsulation portion are encapsulated and composited together by a cold bonding process; as mentioned above, in terms of the preferred material selection for the back encapsulation portion, specific references can be made to the relevant second thermoplastic substrate layer (as the inner layer), thermoplastic core layer (as the skeleton core layer), and first thermoplastic substrate layer (as the surface layer) proposed in CN110400853A; in other variations, a further intermediate layer structure may be provided between the inner layer and the skeleton core layer and / or the surface layer and the skeleton core layer, which are all variations that can be made from the content described in this application.

[0045] Preferably, this embodiment proposes a method for preparing a photovoltaic encapsulation module as described above, comprising the following steps:

[0046] S1) Prepare photovoltaic laminates and frame encapsulation components respectively; preferably, the photovoltaic laminate is formed by a hot lamination process, in which the lamination temperature is not lower than 100℃ and / or the lamination pressure is not lower than 0.5Kpa, preferably, the lamination temperature range is 130-200℃ and the lamination pressure is 0.5Kpa-250Kpa; in other embodiments, the hot lamination process can adopt other known component lamination processes, and this embodiment is not limited to only one; preferably, the frame encapsulation component is formed by a hot melt composite process, in which the hot melt ... The temperature is below 100℃, and / or the composite pressure is not less than 0.5Kpa. Preferably, the hot melt temperature range is 130-200℃, and the composite pressure is 0.5Kpa-250Kpa. In other embodiments, the hot melt composite process can adopt other known hot melt composite processes, and this embodiment does not limit it to only one. It should also be noted that in other embodiments, the skeleton package can also be formed by cold bonding process (specifically, please refer directly to the cold bonding process proposed in this embodiment), that is, the skeleton package is formed by bonding the material layers of the skeleton package with adhesive.

[0047] S2) The photovoltaic laminate and the skeleton encapsulation component from step S1) are bonded together using a cold bonding process; preferably, in the cold bonding process of step S2), the adhesive described above is applied to the surface of the skeleton encapsulation component and / or the surface of the back encapsulation portion; to avoid microcracks in the photovoltaic laminate, preferably, in this embodiment, the skeleton encapsulation component includes an inner layer, and the adhesive is applied to the surface of the inner layer.

[0048] Preferably, in the cold bonding process, the photovoltaic laminate and the frame encapsulation are bonded at room temperature or not higher than 80°C, preferably not higher than 50°C, and more preferably at room temperature. Specifically, the required bonding temperature can be selected according to the type of adhesive chosen. When a curing adhesive is selected, it can be appropriately heated (not higher than 80°C) to accelerate its bonding and curing speed. It is preferred to use an adhesive that does not require heating and can be bonded at room temperature, such as a curing adhesive or a non-curing adhesive that can be cured quickly at room temperature. Preferably, in order to improve the bonding effect, when a curing adhesive is used, the bonding surface can be pre-treated (specifically, corona treatment or flame treatment) to increase the dyne value of the bonding surface. It is recommended that the dyne value of the bonding surface be not less than 48 dyn / cm.

[0049] Preferably, in order to improve the adhesion, in the cold bonding process, a pressing force is applied to the bonding joint between the photovoltaic laminate and the skeleton encapsulation component. The pressing force is not greater than 0.2 kPa, more preferably not greater than 0.15 kPa, and specifically preferably 0.005 kPa-0.1 kPa.

[0050] Preferably, in specific implementation, after applying adhesive to the surface of the skeleton package or the surface of the back package, when bonding the corresponding back package or skeleton package, the bonding should be performed slowly along the outer periphery of the bonding surface to expel as much internal air as possible (to avoid bulging). After the bonding operation is completed, a pressure force is applied to the bonding surfaces (a fixed weight of press material can be placed) to avoid bonding failure caused by material warping.

[0051] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0052] Example 1: Based on the above implementation, this application specifically proposes Example 1, please refer to [link / reference]. Figure 1a , Figure 1b , Figure 2 and Figure 3 As shown, this embodiment 1 proposes a photovoltaic encapsulation component 1, including a photovoltaic laminate 10 and a frame encapsulation component 20; wherein, the photovoltaic laminate 10 includes a front encapsulation part 11, a cell string layer 12, and a back encapsulation part 13 laminated together, specifically selected from... The component product; the skeleton encapsulation component 20 includes a skeleton core layer 21 and a surface layer 22 that are thermally melt-bonded together, specifically adopting the thermoplastic core layer and the first thermoplastic substrate layer disclosed in CN110400853A; the back encapsulation part 13 of the photovoltaic laminate 10 and the skeleton core layer 21 of the skeleton encapsulation component 20 are encapsulated and bonded together by a cold bonding process to obtain the photovoltaic encapsulation component 1.

[0053] When implementing the cold bonding process, butyl adhesive is selected as the adhesive and applied to the outer perimeter of the back encapsulation part 13 in a closed shape (the width of the adhesive is 25-60mm). The skeleton core layer 21 of the skeleton encapsulation part 20 is bonded to the back encapsulation part 13 as a whole by butyl adhesive 14. A certain pressure (5-100N) is applied to the surface corresponding to the position of the butyl adhesive 14 to compact the butyl adhesive 14, so that the photovoltaic laminate 10 and the skeleton encapsulation part 20 are firmly bonded together, thus obtaining the photovoltaic encapsulation module 1 of this embodiment 1.

[0054] By conducting a peel force test on the adhesive joint between the photovoltaic laminate 10 and the skeleton encapsulation component 20 of the photovoltaic encapsulation component 1 in this embodiment 1, the peel force is approximately 30 N / cm.

[0055] Example 2: The remaining technical solutions of Example 2 are the same as those of Example 1. The difference is that in Example 2, double-sided butyl tape is used as an adhesive to replace the butyl glue in Example 1. It is applied (equivalent to coating) to the outer periphery of the back packaging part to form a closed shape. After the release layer of the double-sided butyl tape is removed, the skeleton core layer of the skeleton packaging part is bonded to the back packaging part as a whole by the double-sided butyl tape.

[0056] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 2. The peel force was approximately 25 N / cm.

[0057] Example 3: The remaining technical solutions of Example 3 are the same as those of Example 1, except that, please refer to [link / reference needed]. Figure 4a , Figure 4b , Figure 5 and Figure 6 As shown, in this embodiment 3, the skeleton encapsulation component 30 includes an inner layer 31, a skeleton core layer 32, and a surface layer 33 that are thermally melt-bonded into one piece. Specifically, the second thermoplastic substrate layer, the thermoplastic core layer, and the first thermoplastic substrate layer disclosed in CN110400853A can be used respectively.

[0058] A single-component silicone adhesive 34 is used as the adhesive, and the inner layer 31 is fully coated with the single-component silicone adhesive at a coating amount of 50-100 g / m². 2Then, the back encapsulation part 13 of the photovoltaic laminate 10 is bonded to the inner layer 31 with adhesive 34. After standing at room temperature for 24 hours, the adhesive 34 is cured to obtain the photovoltaic encapsulation component 1'.

[0059] A peel force test was performed on the adhesive joint between the photovoltaic laminate 10 and the skeleton encapsulation component 30 of the photovoltaic encapsulation component 1' in this embodiment 3, and the peel force was approximately 35 N / cm.

[0060] Example 4: The remaining technical solutions of Example 4 are the same as those of Example 3, except that in Example 4, before coating the single-component silicone, the inner layer 31 is pretreated with corona to make its dyn value reach 48 dyn / cm; and then it is implemented according to Example 3.

[0061] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 4. The peel force was approximately 45 N / cm.

[0062] Example 5: The remaining technical solutions of Example 5 are the same as those of Example 3, except that in Example 5, a two-component silicone is used as the adhesive, wherein the weight ratio of the main agent (HN-1728C) to the curing agent (N3390) of the two-component silicone is 22 / 1; after standing at room temperature for at least 144 hours, the adhesive is cured to obtain a photovoltaic encapsulation module.

[0063] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 5. The peel force was approximately 42 N / cm.

[0064] Example 6: The remaining technical solutions of Example 6 are the same as those of Example 5, except that in Example 6, the adhesive is cured after standing for 48 hours at a temperature of 60°C to obtain a photovoltaic encapsulation module.

[0065] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 6. The peel force was approximately 48 N / cm.

[0066] Example 7: The remaining technical solutions of Example 7 are the same as those of Example 5. The difference is that in Example 7, U632 two-component silicone is used to replace the adhesive in Example 5. After standing at room temperature for 30 hours, the adhesive is cured to obtain a photovoltaic encapsulation module.

[0067] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 7. The peel force was approximately 43 N / cm.

[0068] Example 8: The remaining technical solutions of Example 8 are the same as those of Example 3, except that, please refer to [link / reference needed]. Figure 7 As shown, in this embodiment 8, the adhesive 34' is coated on both sides of the inner layer 31 surface along the length direction, specifically in a left-right parallel shape, and the adhesive 34' is not wrapped into a closed shape.

[0069] A peel force test was performed on the adhesive joint between the photovoltaic laminate 10 and the skeleton encapsulation component 30 of the photovoltaic encapsulation component 1” in this embodiment 8, and the peel force was approximately 19 N / cm.

[0070] Example 9: The remaining technical solutions of Example 9 are the same as those of Example 3, except that in Example 9, the front encapsulation part in Example 3 is encapsulated with glass.

[0071] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in Example 9. The peel force was approximately 35 N / cm.

[0072] Example 10: The remaining technical solutions of Example 10 are the same as those of Example 3, except that in Example 10, the back packaging part in Example 3 is encapsulated with glass.

[0073] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in this embodiment 10, and the peel force was approximately 26 N / cm.

[0074] Example 11: The remaining technical solutions of Example 11 are the same as those of Example 3. The difference is that in Example 11, the skeleton encapsulation component includes an inner layer, a first adhesive layer, a skeleton core layer, a second adhesive layer, and a surface layer, which are bonded together by a cold bonding process.

[0075] A peel force test was conducted on the adhesive joint between the photovoltaic laminate and the skeleton encapsulation component of the photovoltaic encapsulation module in this embodiment 11, and the peel force was approximately 30 N / cm.

[0076] Comparative Example 1: The remaining technical solutions of Comparative Example 1 are the same as any one of the embodiments 1-11, except that in Comparative Example 1, the photovoltaic laminate and the skeleton encapsulation component are combined into one piece by a hot lamination process, wherein the lamination temperature range of the hot lamination process is 130-200℃ and the lamination pressure is 0.5Kpa-250Kpa.

[0077] Comparative Example 2: The remaining technical solutions of Comparative Example 2 are the same as any one of the embodiments in Examples 1-11, except that in Comparative Example 2, the front packaging part, battery string layer, back packaging part, inner layer (if any), skeleton core layer and surface layer are composited into one unit by a hot lamination process, wherein the lamination temperature range of the hot lamination process is 130-200℃ and the lamination pressure is 0.5Kpa-250Kpa.

[0078] To verify the encapsulation performance of each embodiment of this application, the applicant selected 100 cell strings for each embodiment and each comparative example in the factory, and encapsulated photovoltaic modules according to Embodiments 1-11 and Comparative Examples 1-2 respectively. The specific comparison results are shown in Table 1 below:

[0079] Table 1

[0080]

[0081]

[0082] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0083] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A photovoltaic encapsulant assembly, characterized by, This includes photovoltaic laminates and frame encapsulation components; among which, Photovoltaic laminates include a front encapsulation section, a cell string layer, and a back encapsulation section that are laminated and combined into one unit; The skeleton encapsulation component includes at least a skeleton core layer and a surface layer that are integrally composited; The photovoltaic laminate and the skeleton encapsulation component are encapsulated and composited into one unit by a cold bonding process to obtain the photovoltaic encapsulation component; The material of the skeleton core layer includes not less than 40 wt% thermoplastic material, and the skeleton core layer is in the shape of a honeycomb, a porous foam, or a hollow frame. The photovoltaic laminate is formed by a hot lamination process; the skeleton encapsulation component is formed by a hot melt composite process. In the cold bonding process, an adhesive is applied to the surface of the skeleton package and / or the surface of the back package, wherein the adhesive is a curing adhesive and / or a non-curing adhesive.

2. The photovoltaic encapsulant assembly of claim 1, wherein, The composite area between the back packaging portion and the skeleton packaging component is provided with an adhesive in a closed shape at least on its outer periphery; and / or the coating thickness of the adhesive is 0.05-20 mm.

3. The photovoltaic encapsulant assembly of claim 1, wherein, The peel strength at the bonding point between the back packaging part and the skeleton packaging part is not less than 15 N / cm.

4. The photovoltaic encapsulant assembly of claim 1, wherein, The skeleton core layer and the back packaging part are packaged together by a cold bonding process; or the skeleton package includes at least an inner layer, a skeleton core layer and a surface layer that are packaged together, and the inner layer and the back packaging part are packaged together by a cold bonding process.

5. The photovoltaic encapsulant assembly of claim 1, wherein, The skeleton encapsulation component replaces the metal frame as the substrate structure of the photovoltaic module.

6. A method for preparing a photovoltaic encapsulation module according to any one of claims 1-5, characterized in that... The operation includes the following steps: S1) Prepare photovoltaic laminates and frame encapsulation components respectively; S2) The photovoltaic laminate and the skeleton encapsulation are bonded together by a cold bonding process; in the cold bonding process, the photovoltaic laminate and the skeleton encapsulation are bonded at room temperature or not higher than 80°C, and / or a pressure force is applied to the bonding joint between the photovoltaic laminate and the skeleton encapsulation, the pressure force being not greater than 0.2 kPa.

7. The method for preparing a photovoltaic encapsulation module according to claim 6, characterized in that, The photovoltaic laminate is formed by a hot lamination process, wherein the lamination temperature is not lower than 100°C and / or the lamination pressure is not lower than 0.5 kPa; the skeleton encapsulation is formed by a hot melt composite process, wherein the hot melt temperature is not lower than 100°C and / or the composite pressure is not lower than 0.5 kPa.

8. The method for preparing a photovoltaic encapsulation module according to claim 6, characterized in that, In the cold bonding process, an adhesive is applied to the surface of the skeleton package and / or the surface of the back package, wherein the adhesive is a curing adhesive and / or a non-curing adhesive.

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