Mass transfer method of LED chips, display panel and display device

Abstract

The application relates to a mass transfer method of an LED chip, which comprises the following steps: providing a display backboard; providing a plurality of negative pressure devices; providing a first temporary substrate, wherein the first temporary substrate is provided with a hole penetrating through the first temporary substrate and a first LED chip adhered to one end of the hole through a first fixing glue; forming a negative pressure in the hole through the plurality of negative pressure devices to make the first LED chip fall off from the first fixing glue to a first reserved mounting position of the display backboard, and electrically connecting the first LED chip with the display backboard. The application further provides a display panel and a display device with the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for mass transfer of LED chips, a display panel, and a display device having the display panel. Background Technology

[0002] Micro LEDs, as a next-generation display technology, offer higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared to traditional LEDs. Furthermore, they can be combined with flexible panels to achieve flexible displays. With the maturation of manufacturing processes and the decrease in price, products based on Micro LED chips have become increasingly common in recent years. Currently, Micro LED display panels incorporate multiple subpixel rendering (SPR) areas, with each SPR consisting of a first LED chip, a second LED chip, and a third LED chip.

[0003] In mass transfer technology, it is typically necessary to transfer the first, second, and third LED chips from their respective growth substrates to a display backplane, which requires selective mass transfer. Currently, lasers are commonly used for selective mass transfer of LED chips. Specifically, part of the laser energy is used to de-adhede the photoresist, while the remaining energy is applied to the LED chips, causing damage due to laser irradiation. Moreover, laser-based de-adhesion is costly. Furthermore, most current mass transfer methods are contact-based, which can easily cause problems such as deformation and wire pulling at the backplane solder joints during contact transfer. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a method for mass transfer of LED chips, a display panel, and a display device having the display panel, which aims to solve the problem of LED chips being damaged during the process of being laser-stripped and transferred from the growth substrate to the display backplane in the prior art.

[0005] A method for mass transfer of LED chips includes: providing a display backplate; providing a plurality of negative pressure devices; providing a first transient substrate, the first transient substrate having a hole penetrating the first transient substrate and a first LED chip adhered to one end of the hole by a first adhesive, wherein the plurality of negative pressure devices form a negative pressure in the hole to cause the first LED chip to fall from the first adhesive to a first reserved mounting position on the display backplate, and the first LED chip is electrically connected to the display backplate.

[0006] In summary, the mass transfer method for LED chips of this application achieves selective transfer of the first LED chip through a transient substrate and the negative pressure device, solving the problem of LED chip damage during laser stripping and transfer to the display backplane. Simultaneously, the negative pressure generated within the holes by multiple negative pressure devices enables non-contact transfer of the LED chip, avoiding problems such as solder deformation and wire drawing during LED chip bonding, and also preventing residue issues caused by poor adhesive adhesion during LED chip transfer.

[0007] Optionally, providing a first transient substrate, the first transient substrate having a hole penetrating the first transient substrate and a first LED chip adhered to one end of the hole by a first adhesive, wherein a plurality of negative pressure devices are used to create negative pressure within the hole to cause the first LED chip to fall from the first adhesive to a first reserved mounting position on the display backplate, and the first LED chip is electrically connected to the display backplate, includes: providing a first transient substrate; providing a first adhesive film on one side of the first transient substrate; transferring the first LED chip to the side of the first adhesive film opposite to the first transient substrate; etching a first adhesive layer located between adjacent first LED chips to obtain a plurality of first adhesive segments; and creating negative pressure within the hole by the plurality of negative pressure devices to cause the first LED chip to fall from the first adhesive segments to the first reserved mounting position on the display backplate, and the first LED chip is electrically connected to the display backplate.

[0008] Optionally, the step of providing a first adhesive film on one side of the first transient substrate includes: providing a first fixing adhesive layer, the first fixing adhesive layer including a first lower release film, a first adhesive film and a first upper release film stacked sequentially; removing the first lower release film; placing the side of the first adhesive film opposite to the first upper release film on one side of the first transient substrate; and removing the first upper release film from the first adhesive film.

[0009] Optionally, the step of creating negative pressure within the hole using multiple negative pressure devices to cause the first LED chip to fall from the first fixing adhesive segment to the first reserved mounting position on the display backplate, and electrically connecting the first LED chip to the display backplate, includes: moving the first transient substrate above the display backplate; aligning the multiple first LED chips with the first reserved mounting position on the display backplate; aligning the multiple negative pressure devices with the ends of the hole opposite to the first LED chips; creating negative pressure within the hole using the negative pressure devices to draw at least a portion of the first fixing adhesive segment into the hole, causing the first LED chip to fall from the first fixing adhesive segment to the first reserved mounting position on the display backplate; electrically connecting the multiple first LED chips to the display backplate; and removing the negative pressure devices and the first transient substrate.

[0010] Optionally, the mass transfer method further includes: providing a second transient substrate having a hole penetrating the second transient substrate and a second LED chip adhered to one end of the hole by a second adhesive; forming a negative pressure in the hole by a plurality of negative pressure devices to cause the second LED chip to fall from the second adhesive to a second reserved mounting position on the display backplate; and electrically connecting the second LED chip to the display backplate.

[0011] Optionally, providing a second transient substrate, the second transient substrate having a hole penetrating the second transient substrate and a second LED chip adhered to one end of the hole by a second adhesive, wherein a negative pressure is formed in the hole by a plurality of the negative pressure devices to cause the second LED chip to fall from the second adhesive to a second reserved mounting position on the display backplate, and the second LED chip is electrically connected to the display backplate, includes: providing a second transient substrate; providing a second adhesive film on one side of the second transient substrate; transferring the second LED chip to the side of the second adhesive film opposite to the second transient substrate; etching a second adhesive layer located between adjacent second LED chips to obtain a plurality of second adhesive segments; and forming a negative pressure in the hole by the plurality of negative pressure devices to cause the second LED chip to fall from the second adhesive segments to the second reserved mounting position on the display backplate, and the second LED chip is electrically connected to the display backplate.

[0012] Optionally, the step of providing a second adhesive film on one side of the second transient substrate includes: providing a second fixing adhesive layer, the second fixing adhesive layer including a second lower release film, a second adhesive film and a second upper release film stacked sequentially; removing the second lower release film; disposing of the side of the second adhesive film opposite to the second upper release film on one side of the second transient substrate; and removing the second upper release film from the second adhesive film.

[0013] Optionally, the step of creating negative pressure within the hole using multiple negative pressure devices to cause the second LED chip to fall from the second fixing adhesive segment to the second reserved mounting position on the display back panel, and electrically connecting the second LED chip to the display back panel, includes: moving the second transient substrate above the display back panel, aligning the multiple second LED chips with the second reserved mounting position on the display back panel; creating negative pressure within the hole using the negative pressure devices to draw at least a portion of the second fixing adhesive segment into the hole, causing the second LED chip to fall from the second fixing adhesive segment to the second reserved mounting position on the display back panel; electrically connecting the multiple second LED chips to the display back panel, and removing the negative pressure devices and the second transient substrate.

[0014] Optionally, the side of the first adhesive layer that contacts the first LED chip has a raised or recessed pattern, and the side of the second adhesive layer that contacts the second LED chip has a raised or recessed pattern.

[0015] Optionally, the negative pressure device is a suction nozzle.

[0016] In summary, the mass transfer method for LED chips in this application solves the problem of LED chip damage during laser stripping and transfer to the display backplane by transferring LED chips on a transient substrate. Therefore, it not only improves the yield of LED chips, but also improves the transfer efficiency of LED chips.

[0017] Based on the same inventive concept, this application also provides a display panel, which includes the above-described display backplate and a plurality of LED chips transferred to the display backplate by the mass transfer method.

[0018] In summary, the display panel of this application achieves selective transfer of multiple LED chips through a transient substrate and the negative pressure device. This not only allows for non-contact transfer of LED chips but also enables single-chip transfer, facilitating subsequent repair processes and resolving the issue of LED chip damage during laser stripping and transfer to the display backplane. Furthermore, the non-contact transfer of LED chips via the transient substrate and negative pressure device avoids solder deformation and stringing during LED chip bonding, and also prevents residue buildup due to poor adhesive properties during the transfer process.

[0019] Based on the same inventive concept, this application also provides a display device, which includes a support frame and the above-described display panel, wherein the support frame is used to support the display panel.

[0020] In summary, the display device of this application solves the problem of LED chip damage during the laser stripping and transfer to the display backplane by transferring the LED chip on a transient substrate. Therefore, it not only improves the yield of LED chips, but also improves the transfer efficiency of LED chips. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a flowchart illustrating a mass transfer method for LED chips disclosed in an embodiment of this application.

[0023] Figure 2 for Figure 1 A schematic diagram of the corresponding structure formed in step S20 of the mass transfer method shown;

[0024] Figure 3 for Figure 1 A flowchart illustrating step S30 in the mass transfer method shown.

[0025] Figure 4 for Figure 3 A schematic diagram of the corresponding structure formed in step S31 of the mass transfer method shown;

[0026] Figure 5 for Figure 3 A schematic diagram of another corresponding structure formed in step S31 of the mass transfer method shown;

[0027] Figure 6 for Figure 3 The flowchart of step S32 in the mass transfer method shown is as follows;

[0028] Figure 7 for Figure 6 A schematic diagram of the corresponding structure formed in step S321 of the mass transfer method shown;

[0029] Figure 8 for Figure 6 A schematic diagram of the corresponding structure formed in step S322 of the mass transfer method shown;

[0030] Figure 9 for Figure 6 A schematic diagram of the corresponding structure formed in step S323 of the mass transfer method shown;

[0031] Figure 10 for Figure 6 A schematic diagram of the corresponding structure formed in step S324 of the mass transfer method shown;

[0032] Figure 11 for Figure 3 A schematic diagram of the corresponding structure formed in step S33 of the mass transfer method shown;

[0033] Figure 12 for Figure 3 A schematic diagram of the corresponding structure formed in step S34 of the mass transfer method shown;

[0034] Figure 13 for Figure 3 The flowchart of step S35 in the mass transfer method shown is as follows;

[0035] Figure 14 for Figure 13 A schematic diagram of the corresponding structure formed in step S351 of the mass transfer method shown.

[0036] Figure 15 for Figure 13 A schematic diagram of the corresponding structure formed in step S352 of the mass transfer method shown;

[0037] Figure 16 for Figure 13 A schematic diagram of another corresponding structure formed in step S352 of the mass transfer method shown;

[0038] Figure 17 for Figure 13 The flowchart of step S353 in the mass transfer method shown is as follows;

[0039] Figure 18 for Figure 1 The flowchart of step S40 in the mass transfer method shown is as follows;

[0040] Figure 19 for Figure 18 A schematic diagram of the corresponding structure formed in step S41 of the mass transfer method shown;

[0041] Figure 20 for Figure 18 A schematic diagram of another corresponding structure formed in step S41 of the mass transfer method shown;

[0042] Figure 21 for Figure 18 The flowchart of step S42 in the mass transfer method shown is as follows;

[0043] Figure 22 for Figure 21 A schematic diagram of the corresponding structure formed in step S421 of the mass transfer method shown;

[0044] Figure 23 for Figure 21 A schematic diagram of the corresponding structure formed in step S422 of the mass transfer method shown;

[0045] Figure 24 for Figure 21 A schematic diagram of the corresponding structure formed in step S423 of the mass transfer method shown;

[0046] Figure 25 for Figure 21 A schematic diagram of the corresponding structure formed in step S424 of the mass transfer method shown;

[0047] Figure 26 for Figure 18 A schematic diagram of the corresponding structure formed in step S43 of the mass transfer method shown;

[0048] Figure 27 for Figure 18 A schematic diagram of the corresponding structure formed in step S44 of the mass transfer method shown;

[0049] Figure 28 for Figure 18 The flowchart of step S45 in the mass transfer method shown is as follows;

[0050] Figure 29 for Figure 28 A schematic diagram of the corresponding structure formed in step S451 of the mass transfer method shown.

[0051] Figure 30 for Figure 28 A schematic diagram of the corresponding structure formed in step S452 of the mass transfer method shown;

[0052] Figure 31 for Figure 28 A schematic diagram of another corresponding structure formed in step S452 of the mass transfer method shown;

[0053] Figure 32 for Figure 28 The flowchart of step S453 in the mass transfer method shown is as follows;

[0054] Figure 33 for Figure 1 A flowchart illustrating step S50 in the mass transfer method shown.

[0055] Figure 34 for Figure 33 A schematic diagram of the corresponding structure formed in step S51 of the mass transfer method shown;

[0056] Figure 35 for Figure 33 A schematic diagram of another corresponding structure formed in step S51 of the mass transfer method shown;

[0057] Figure 36 for Figure 33 A flowchart illustrating step S52 in the mass transfer method shown.

[0058] Figure 37 for Figure 36 A schematic diagram of the corresponding structure formed in step S521 of the mass transfer method shown;

[0059] Figure 38 for Figure 36 A schematic diagram of the corresponding structure formed in step S522 of the mass transfer method shown;

[0060] Figure 39 for Figure 36 A schematic diagram of the corresponding structure formed in step S523 of the mass transfer method shown;

[0061] Figure 40 for Figure 36 A schematic diagram of the corresponding structure formed in step S524 of the mass transfer method shown;

[0062] Figure 41 for Figure 33 A schematic diagram of the corresponding structure formed in step S53 of the mass transfer method shown;

[0063] Figure 42 for Figure 33 A schematic diagram of the corresponding structure formed in step S54 of the mass transfer method shown.

[0064] Figure 43 for Figure 33 The flowchart of step S55 in the mass transfer method shown is as follows;

[0065] Figure 44 for Figure 43A schematic diagram of the corresponding structure formed in step S551 of the mass transfer method shown.

[0066] Figure 45 for Figure 43 A schematic diagram of the corresponding structure formed in step S552 of the mass transfer method shown;

[0067] Figure 46 for Figure 43 A schematic diagram of another corresponding structure formed in step S552 of the mass transfer method shown;

[0068] Figure 47 for Figure 43 The flowchart of step S553 in the mass transfer method shown is illustrated.

[0069] Explanation of reference numerals in the attached figures:

[0070] 10 - First transient substrate;

[0071] 11-holes;

[0072] 13-Second transient substrate;

[0073] 15 - Third transient substrate;

[0074] 20 - First fixing adhesive layer;

[0075] 201 - First lower side release film;

[0076] 202 - First adhesive membrane material;

[0077] 203 - First upper release film;

[0078] 21-Second fixing adhesive layer;

[0079] 211 - Second lower side release film;

[0080] 212 - Second adhesive membrane material;

[0081] 213 - Second upper release film;

[0082] 22 - Third fixing adhesive layer;

[0083] 221 - Third lower side release film;

[0084] 222-Third adhesive membrane material

[0085] 223 - Third upper release film;

[0086] 30 - First LED chip;

[0087] 31-First chip body;

[0088] 33 - First solder joint;

[0089] 34 - Second LED chip;

[0090] 35 - Second chip body;

[0091] 36 - Second weld leg;

[0092] 37 - Third LED chip;

[0093] 38 - The third chip body;

[0094] 39 - Third solder leg;

[0095] 40 - First fixing adhesive segment;

[0096] 41 - Second fixing adhesive segment;

[0097] 42 - Third fixing adhesive segment;

[0098] 50-Negative pressure device;

[0099] 60 - Display back panel;

[0100] 61 - Adhesive layer;

[0101] Steps of the mass transfer method for S10-S50 LED chips;

[0102] Step S30 in the mass transfer method of S31-S35 LED chips;

[0103] Step S32 in the mass transfer method of S321-S324 LED chips;

[0104] Step S35 in the mass transfer method of S351-S353 LED chips;

[0105] Step S40 in the mass transfer method of S41-S45 LED chips;

[0106] Step S24 in the mass transfer method of S421-S424 LED chips;

[0107] Step S45 in the mass transfer method of S451-S453 LED chips;

[0108] Step S50 in the mass transfer method of S51-S55 LED chips;

[0109] Step S52 in the mass transfer method of S521-S524 LED chips;

[0110] Step S55 in the mass transfer method of S551-S553 LED chips. Detailed Implementation

[0111] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0112] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0113] Micro LEDs, as a next-generation display technology, offer higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared to traditional LEDs. They can also be combined with flexible panels to achieve flexible displays. With the maturation of manufacturing processes and the decrease in price, products based on Micro LED chips have become increasingly common in recent years. Currently, Micro LED display panels include multiple subpixel rendering (SPR) areas, each containing a first LED chip, a second LED chip, and a third LED chip. In mass transfer technology, it is typically necessary to transfer the first, second, and third LED chips from their respective growth substrates to a display backplane, requiring selective mass transfer. Currently, lasers are commonly used for selective mass transfer of LED chips. Specifically, some of the laser energy is used to de-adhede the photoresist, while the remaining energy is applied to the LED chips, causing damage due to laser irradiation. Furthermore, laser-based de-adhesion is costly. In addition, most current mass transfer methods are contact-based, which can easily cause problems such as deformation and wire pulling at the backplane solder joints. Therefore, how to solve the problem of damage to LED chips on the growth substrate during the laser stripping and transfer to the display backplane is an urgent issue to be addressed.

[0114] Based on this, this application aims to provide a mass transfer solution that can solve the above-mentioned technical problems. It can solve the problem of LED chips being damaged during the process of being laser-stripped and transferred from the growth substrate to the display backplane. The details will be described in subsequent embodiments.

[0115] This application provides a detailed description of a mass transfer method for LED chips, a display panel formed by the mass transfer method, and a display device having the display panel.

[0116] Please see Figure 1 This is a flowchart illustrating a mass transfer method for LED chips disclosed in an embodiment of this application. The mass transfer method is used to transfer LED chips in large quantities to avoid damage to the LED chips on the growth substrate during laser stripping and transfer to the display backplane. Figure 1 As shown in the embodiments of this application, the mass transfer method for the LED chip may include at least the following steps.

[0117] S10, Provides a display back panel;

[0118] S20, provides multiple negative pressure devices;

[0119] S30. A first transient substrate is provided, the first transient substrate having a hole penetrating the first transient substrate and a first LED chip adhered to one end of the hole by a first fixing adhesive. A negative pressure is formed in the hole by a plurality of the negative pressure devices to cause the first LED chip to fall from the first fixing adhesive to a first reserved mounting position of the display back plate, and the first LED chip is electrically connected to the display back plate.

[0120] In summary, the mass transfer method for LED chips of this application achieves selective transfer of the first LED chip through a transient substrate and the negative pressure device. At the same time, by forming negative pressure in the holes through multiple negative pressure devices, non-contact transfer of LED chips can be achieved, avoiding problems such as solder deformation and stringing during LED chip pressing, and also avoiding the problem of residue caused by poor adhesive adhesion during LED chip transfer.

[0121] The mass transfer method for the LED chip may further include at least the following steps:

[0122] S40. A second transient substrate is provided, the second transient substrate having a hole penetrating the second transient substrate and a second LED chip adhered to one end of the hole by a second adhesive. A negative pressure is formed in the hole by a plurality of negative pressure devices to cause the second LED chip to fall from the second adhesive to a second reserved mounting position on the display back plate, and the second LED chip is electrically connected to the display back plate.

[0123] S50. A third transient substrate is provided, the third transient substrate having a hole penetrating the third transient substrate and a third LED chip adhered to one end of the hole by a third fixing adhesive. A negative pressure is formed in the hole by a plurality of the negative pressure devices to cause the third LED chip to fall from the third fixing adhesive to a third reserved mounting position on the display back plate, and the third LED chip is electrically connected to the display back plate.

[0124] In summary, the mass transfer method for LED chips of this application achieves selective transfer of the first, second, and third LED chips through a transient substrate and the negative pressure device, respectively. This method not only allows for non-contact transfer of LED chips but also enables single-chip transfer, facilitating subsequent repair processes and solving the problem of LED chip damage during laser stripping and transfer to the display backplane. Furthermore, the non-contact transfer via the transient substrate and negative pressure device avoids solder deformation and stringing during LED chip bonding, and also prevents residue buildup due to poor adhesive properties during the transfer process.

[0125] In the embodiments of this application, please refer to Figure 2 As shown, multiple negative pressure devices 50 can be installed on a transfer adsorption device (e.g., a robotic arm), and the multiple negative pressure devices 50 are detachably installed on the transfer adsorption device at a preset interval. For example, any two adjacent negative pressure devices 50 are arranged with a spacing of two LED chips between them. In this embodiment, the negative pressure device 50 can be a suction nozzle, which is used for inhaling or exhaling air.

[0126] Please see Figure 3 In this embodiment, step S30 includes at least the following steps.

[0127] S31, Provide a first transient substrate 10.

[0128] Specifically, in the embodiments of this application, such as Figure 4 and Figure 5 As shown, multiple holes 11 are formed inside the first transient substrate 10 through a non-metallic etching process. The multiple holes 11 are arranged in a matrix and penetrate the first transient substrate 10, that is, the holes 11 form connecting holes on the first transient substrate 10. The first transient substrate 10 is made of a flat and easily processed substrate material such as glass or sapphire.

[0129] It is understood that, in the exemplary embodiment, the shape of the hole 11 may be square, rectangular, circular, or other shapes. The position of the hole 11 matches the position of the first LED chip, and the size of the hole 11 is slightly smaller than the size of the first LED chip. The diameter of the negative pressure device 50 is slightly larger than the diameter of the hole 11.

[0130] S32. A first adhesive film 202 is provided on one side of the first transient substrate 10.

[0131] Please see Figure 6 In this embodiment, step S32 may include at least the following steps.

[0132] S321. A first fixing adhesive layer 20 is provided, the first fixing adhesive layer 20 including a first lower release film 201, a first adhesive film material 202 and a first upper release film 203 stacked in sequence.

[0133] Specifically, in the embodiments of this application, such as Figure 7 As shown, the first adhesive layer 20 includes a first lower release film 201, a first adhesive film 202, and a first upper release film 203, wherein the first adhesive film 202 is located between the first lower release film 201 and the first upper release film 203. Specifically, the first adhesive film 202 is disposed on one side of the first lower release film 201, and the first upper release film 203 is disposed on the side of the first adhesive film 202 opposite to the first lower release film 201, that is, the first lower release film 201 and the first upper release film 203 are respectively located on opposite sides of the first adhesive film 202.

[0134] In an exemplary embodiment, the side of the first lower release film 201 facing the first adhesive film 202 has a smooth surface, and the side of the first upper release film 203 facing the first adhesive film 202 has a textured, frosted surface. Correspondingly, the side of the first adhesive film 202 facing the first lower release film 201 also has a smooth surface, and the side of the first adhesive film 202 facing the first upper release film 203 also has a textured, frosted surface. The first adhesive film 202 is made of an adhesive material such as polydimethylsiloxane (PDMS), pyrolytic adhesive, cold-dissolving adhesive, or photolytic adhesive.

[0135] S322, Remove the first lower release film 201.

[0136] Specifically, in the embodiments of this application, such as Figure 8As shown, the first lower release film 201, which is disposed on one side of the first adhesive film 202, is removed from the first adhesive film 202. At this time, the first upper release film 203 and the first adhesive film 202 are still attached together.

[0137] S323. The side of the first adhesive film 202 facing away from the first upper release film 203 is disposed on one side of the first transient substrate 10.

[0138] Specifically, in the embodiments of this application, such as Figure 9 As shown, the side of the first adhesive film 202 facing away from the first upper release film 203 is disposed on one side of the first transient substrate 10. That is, the first adhesive film 202 is attached to the first lower release film 201 and is attached to one side of the first transient substrate 10. In other words, the side of the first adhesive film 202 with a smooth surface is attached to one side of the first transient substrate 10.

[0139] S324. Remove the first upper release film 203 from the first adhesive film 202.

[0140] Specifically, in the embodiments of this application, such as Figure 10 As shown, the first upper release film 203 is removed from the first adhesive film 202. At this time, only the first adhesive film 202 remains on the first transient substrate 10, and the rough, uneven surface of the first adhesive film 202 facing the first upper release film 203 is exposed.

[0141] S33. Transfer the first LED chip 30 to the side of the first adhesive film 202 that is opposite to the first transient substrate 10.

[0142] Specifically, in the embodiments of this application, such as Figure 11As shown, after removing the first upper release film 203 from the first adhesive film 202, only the first adhesive film 202 remains on the first transient substrate 10. The smooth surface of the first adhesive film 202 facing the first lower release film 201 is attached to the first transient substrate 10, while the rough, textured surface of the first adhesive film 202 faces away from the first transient substrate 10. Multiple first LED chips 30 are transferred to the rough, textured surface of the first adhesive film 202 facing away from the first transient substrate 10, and each of the multiple first LED chips 30 is aligned with one of the holes 11. Each first LED chip 30 includes a first chip body 31 and a first solder joint 33. The first chip body 31 of the first LED chip 30 is adhered and fixed to the first adhesive film 202, and the first solder joint 33 of the first LED chip 30 is disposed on the first chip body 31 of the first LED chip 30, with the first solder joint 33 facing away from the first adhesive film 202.

[0143] In this embodiment of the application, the size of the plurality of holes 11 inside the first transient substrate 10 is smaller than the size of the first chip body 31 in the first LED chip 30.

[0144] S34. The first adhesive layer 20 located between adjacent first LED chips 30 is etched to obtain a plurality of first adhesive segments 40.

[0145] Specifically, in the embodiments of this application, such as Figure 12 As shown, after the first LED chip 30 is transferred to the side of the first adhesive film 202 facing away from the first transient substrate 10, the first LED chip 30 is aligned with each of the holes 11. Then, the first fixing adhesive layer 20 located between any adjacent first LED chips 30 is etched away to obtain a plurality of first fixing adhesive segments 40. Since the first LED chip 30 is aligned with each of the holes 11, the first fixing adhesive segments 40 are also aligned with each of the holes 11. That is, each first fixing adhesive segment 40 is located between each hole 11 and the corresponding first LED chip 30.

[0146] In an exemplary embodiment, the first fixing adhesive layer 20 located between any adjacent first LED chips 30 can be etched using an adhesive etching method such as inductively coupled plasma (ICP) or plasma. The width of the plurality of first fixing adhesive segments 40 is smaller than the width of the first chip body 31 in the first LED chip 30.

[0147] S35. A negative pressure is formed in the hole 11 by the multiple negative pressure devices 50 so that the first LED chip 30 falls from the first fixing adhesive section 40 to the first reserved installation position of the display back plate 60, and the first LED chip 30 is electrically connected to the display back plate 60.

[0148] Please see Figure 13 In this embodiment, step S35 may include at least the following steps.

[0149] S351. Move the first transient substrate 10 above the display backplate 60, align the plurality of first LED chips 30 with the first reserved mounting positions of the display backplate 60, and align the plurality of negative pressure devices 50 with the ends of the holes 11 opposite to the first LED chips 30.

[0150] Specifically, in the embodiments of this application, such as Figure 14 As shown, an adhesive layer 61 is coated on one side of the display backplate 60. The first transient substrate 10, to which the first LED chip 30 is adhered, is moved above the adhesive layer 61 of the display backplate 60, and the first solder feet 33 of the plurality of first LED chips 30 are aligned with the first reserved mounting positions of the display backplate 60. At this time, a preset distance is maintained between the first transient substrate 10 and the display backplate 60. The first reserved mounting position refers to the position on the display backplate 60 used to mount the first LED chip 30.

[0151] In an exemplary embodiment, the display backplane 60 may be a thin film transistor (TFT) backplane, and the adhesive layer 61 may be made of adhesive materials such as non-conductive film (NCF) or anisotropic conductive film (ACF).

[0152] The preset distance between the first transient substrate 10 and the display backplate 60 can be 5um to 100um. For example: 6um, 10um, 15um, 20um, 30um, 50um, 80um, or other values.

[0153] S352. The negative pressure device 50 creates a negative pressure in the hole 11, drawing at least a portion of the first fixing adhesive segment 40 into the hole 11, so that the first LED chip 30 falls from the first fixing adhesive segment 40 to the first reserved mounting position on the display back plate 60.

[0154] Specifically, in the embodiments of this application, such as Figure 15As shown, multiple negative pressure devices 50 are arranged at a preset interval (for example, any two adjacent negative pressure devices 50 are spaced apart by the spacing of two first LED chips 30) and aligned with the holes 11 on the first transient substrate 10. The multiple negative pressure devices 50 apply negative pressure to the aligned holes 11, creating a negative pressure within the holes 11. This causes at least a portion of the first fixing adhesive segment 40 to be drawn into the holes 11, reducing the contact area between the chip and the fixing adhesive segment. Consequently, multiple first LED chips 30 fall under gravity to the first reserved mounting position on the display backplate 60 and are adhered to by the adhesive layer 61. Therefore, by precisely controlling the negative pressure devices 50, not only can LED chips be transferred non-contactly, but single LED chips can also be transferred, facilitating subsequent repair processes.

[0155] Specifically, in the embodiments of this application, such as Figure 16 As shown, the multiple holes 11 inside the first transient substrate 10 are filled with air. The multiple negative pressure devices 50 draw air out of the holes 11 to create negative pressure, causing the first fixing adhesive segment 40 disposed between the holes 11 and the first LED chip 30 to deform and shrink. The contact area between the first fixing adhesive segment 40 and the first LED chip 30 is reduced, thereby reducing the adhesion of the first fixing adhesive segment 40 to the first LED chip 30. The first LED chip 30 falls to the first reserved mounting position on the display back plate 60 and is adhered by the adhesive layer 61.

[0156] S353. Electrically connect the plurality of first LED chips 30 to the display backplate 60, and remove the negative pressure device 50 and the first transient substrate 10.

[0157] Specifically, in the embodiments of this application, such as Figure 17 As shown, metal bonding is completed on the pads (not shown) corresponding to the first reserved mounting positions on the first LED chip 30 and the display backplate 60, thereby realizing the electrical connection between the first LED chip 30 and the display backplate 60 (for example, soldering the first LED chip 30 to the pads on the display backplate 60). The negative pressure device 50 and the first transient substrate 10 are then removed, thereby completing the transfer of the first LED chip 30. At this time, multiple first LED chips 30 are respectively located at the first reserved mounting positions on the display backplate 60 and are electrically connected to the display backplate 60.

[0158] Please see Figure 18 In this embodiment, step S40 includes at least the following steps.

[0159] S41, Provide a second transient substrate 13.

[0160] Specifically, in the embodiments of this application, such as Figure 19 and Figure 20 As shown, multiple holes 11 are formed inside the second transient substrate 13 through a non-metallic etching process. The multiple holes 11 are arranged in a matrix and penetrate the second transient substrate 13, that is, the holes 11 form connecting holes on the second transient substrate 13. The second transient substrate 13 is made of a flat and easily processed substrate material such as glass or sapphire.

[0161] It is understood that, in the exemplary embodiment, the shape of the hole 11 may be square, rectangular, circular, or other shapes. The position of the hole 11 matches the position of the second LED chip, and the size of the hole 11 is slightly smaller than the size of the second LED chip. The diameter of the negative pressure device 50 is slightly larger than the diameter of the hole 11.

[0162] S42. A second adhesive film 212 is provided on one side of the second transient substrate 13.

[0163] Please see Figure 21 In this embodiment, step S32 includes at least the following steps.

[0164] S421. Provide a second fixing adhesive layer 21, the second fixing adhesive layer 21 including a second lower release film 211, a second adhesive film 212 and a second upper release film 213 stacked in sequence.

[0165] Specifically, in the embodiments of this application, such as Figure 22 As shown, the second adhesive layer 21 includes a second lower release film 211, a second adhesive film 212, and a second upper release film 213, wherein the second adhesive film 212 is located between the second lower release film 211 and the second upper release film 213. Specifically, the first adhesive film 212 is disposed on one side of the second lower release film 211, and the second upper release film 213 is disposed on the side of the second adhesive film 212 opposite to the second lower release film 211, that is, the second lower release film 211 and the second upper release film 213 are respectively located on opposite sides of the second adhesive film 212.

[0166] In an exemplary embodiment, the side of the second lower release film 211 facing the second adhesive film 212 has a smooth surface, and the side of the second upper release film 213 facing the second adhesive film 212 has a textured, frosted surface. Correspondingly, the side of the second adhesive film 212 facing the second lower release film 211 also has a smooth surface, and the side of the second adhesive film 212 facing the second upper release film 213 also has a textured, frosted surface. The second adhesive film 212 is made of an adhesive material such as polydimethylsiloxane (PDMS), thermally degradable adhesive, cold-degradable adhesive, or photolyzable adhesive.

[0167] S422, Remove the second lower release film 211.

[0168] Specifically, in the embodiments of this application, such as Figure 23 As shown, the second lower release film 211, which is disposed on one side of the second adhesive film 212, is removed from the second adhesive film 212. At this time, the second upper release film 213 and the second adhesive film 212 are still attached together.

[0169] S423. The side of the second adhesive film 212 facing away from the second upper release film 213 is disposed on one side of the second transient substrate 13.

[0170] Specifically, in the embodiments of this application, such as Figure 24 As shown, the side of the second adhesive film 212 facing away from the second upper release film 213 is disposed on one side of the second transient substrate 13. That is, the second adhesive film 212 is attached to the side of the second transient substrate 13 with the second lower release film 211 attached thereon. In other words, the side of the second adhesive film 212 with a smooth surface is attached to one side of the second transient substrate 13.

[0171] S424. Remove the second upper release film 213 from the second adhesive film 212.

[0172] Specifically, in the embodiments of this application, such as Figure 25 As shown, the second upper release film 213 is removed from the second adhesive film 212. At this time, only the second adhesive film 212 remains on the second transient substrate 13, and the rough and uneven surface of the second adhesive film 212 facing the second upper release film 213 is exposed.

[0173] S43. Transfer the second LED chip 34 to the side of the second adhesive film 212 that is opposite to the second transient substrate 13.

[0174] Specifically, in the embodiments of this application, such as Figure 26As shown, after removing the second upper release film 213 from the second adhesive film 212, only the second adhesive film 212 remains on the second transient substrate 13. The smooth surface of the second adhesive film 212 facing the second lower release film 211 adheres to the second transient substrate 13, while the rough, uneven surface of the second adhesive film 212 faces away from the second transient substrate 13. Multiple second LED chips 34 are transferred to the rough, uneven surface of the second adhesive film 212 facing away from the second transient substrate 13, and each of the multiple second LED chips 34 is aligned with one of the holes 11. Each second LED chip 34 includes a second chip body 35 and a second solder joint 36. The second chip body 35 of the second LED chip 34 is adhered and fixed to the second adhesive film 212, and the second solder joint 36 of the second LED chip 34 is disposed on the second chip body 35 of the second LED chip 34, with the second solder joint 36 facing away from the second adhesive film 212.

[0175] In this embodiment of the application, the size of the plurality of holes 11 inside the second transient substrate 13 is smaller than the size of the second chip body 35 in the second LED chip 34.

[0176] S44. The second adhesive layer 21 located between adjacent second LED chips 34 is etched to obtain a plurality of second adhesive segments 41.

[0177] Specifically, in the embodiments of this application, such as Figure 27 As shown, after the second LED chip 34 is transferred to the side of the second adhesive film 212 facing away from the second transient substrate 13, the second LED chip 34 is aligned with each of the holes 11. Then, the second adhesive layer 21 located between any adjacent second LED chips 34 is etched away to obtain a plurality of second adhesive segments 41. Since the second LED chip 34 is aligned with each of the holes 11, the second adhesive segments 41 are also aligned with each of the holes 11. That is, each second adhesive segment 41 is located between each hole 11 and the corresponding second LED chip 34.

[0178] In an exemplary embodiment, the second fixing adhesive layer 21 located between any adjacent second LED chips 34 can be etched using an adhesive etching method such as inductively coupled plasma (ICP) or plasma. The width of the plurality of second fixing adhesive segments 41 is smaller than the width of the second chip body 35 in the second LED chip 34.

[0179] S45. A negative pressure is formed in the hole 11 by the multiple negative pressure devices 50 to make the second LED chip 34 fall from the second fixing adhesive section 41 to the second reserved installation position of the display back plate 60, and to electrically connect the second LED chip 34 to the display back plate 60.

[0180] Please see Figure 28 In this embodiment, step S45 may include at least the following steps.

[0181] S451. Move the second transient substrate 13 above the display backplate 60, and align the plurality of second LED chips 34 with the second reserved mounting positions of the display backplate 60.

[0182] Specifically, in the embodiments of this application, such as Figure 29 As shown, an adhesive layer 61 is coated on one side of the display backplate 60. The second transient substrate 13, to which the second LED chip 34 is adhered, is moved above the adhesive layer 61 of the display backplate 60, and the second solder feet 35 of the plurality of second LED chips 34 are aligned with the second reserved mounting positions of the display backplate 60. At this time, a preset distance is maintained between the second transient substrate 13 and the display backplate 60. The second reserved mounting position refers to the position on the display backplate 60 used to mount the second LED chip 34.

[0183] In an exemplary embodiment, the display backplane 60 may be a TFT backplane, and the adhesive layer 61 may be made of adhesive materials such as non-conductive film (NCF) or anisotropic conductive film (ACF).

[0184] The preset distance between the second transient substrate 13 and the display backplate 60 can be 5um to 100um. For example: 6um, 10um, 15um, 20um, 30um, 50um, 80um, or other values.

[0185] S452. The negative pressure device 50 creates a negative pressure in the hole 11, drawing at least a portion of the second fixing adhesive segment 41 into the hole 11, so that the second LED chip 34 falls from the second fixing adhesive segment 41 to the second reserved mounting position on the display back plate 60.

[0186] Specifically, in the embodiments of this application, such as Figure 30As shown, multiple negative pressure devices 50 are arranged at a preset interval (for example, any two adjacent negative pressure devices 50 are spaced apart by the spacing of two second LED chips 34) and aligned with the holes 11 on the second transient substrate 13. The multiple negative pressure devices 50 apply negative pressure to the aligned holes 11, creating a negative pressure within the holes 11. This causes the multiple second LED chips 34 corresponding to the holes 11 to transfer to the second reserved mounting position on the display backplate 60 and be adhered to by the adhesive layer 61. Therefore, by precisely controlling the negative pressure devices 50, not only can LED chips be transferred non-contactly, but single LED chips can also be transferred, facilitating subsequent repair processes.

[0187] Specifically, in the embodiments of this application, such as Figure 31 As shown, the multiple holes 11 inside the second transient substrate 13 are filled with air. The multiple negative pressure devices 50 draw air out of the holes 11 to create negative pressure, causing the second fixing adhesive segment 41 disposed between the holes 11 and the second LED chip 34 to deform and shrink. The contact area between the second fixing adhesive segment 41 and the second LED chip 34 is reduced, thereby reducing the adhesion of the second fixing adhesive segment 41 to the second LED chip 34. The second LED chip 34 falls to the second reserved mounting position on the display back plate 60 and is adhered by the adhesive layer 61.

[0188] S453. Connect the plurality of second LED chips 34 to the display backplate 60, and remove the negative pressure device 50 and the second transient substrate 13.

[0189] Specifically, in the embodiments of this application, such as Figure 32 As shown, metal bonding is completed between the second LED chip 34 and the pad (not shown) corresponding to the second reserved mounting position on the display backplate 60, thereby realizing the electrical connection between the second LED chip 34 and the display backplate 60 (for example, soldering the second LED chip 34 to the pad on the display backplate 60). The negative pressure device 50 and the second transient substrate 13 are then removed, thereby completing the transfer of the second LED chip 34. At this time, multiple second LED chips 34 are respectively located at the second reserved mounting position on the display backplate 60 and are electrically connected to the display backplate 60.

[0190] Please see Figure 33 In this embodiment, step S50 includes at least the following steps.

[0191] S51, Provide a third transient substrate 15.

[0192] Specifically, in the embodiments of this application, such as Figure 34 and Figure 35 As shown, multiple holes 11 are formed inside the third transient substrate 15 through a non-metallic etching process. The multiple holes 11 are arranged in a matrix and penetrate the third transient substrate 15, that is, the holes 11 form connecting holes on the third transient substrate 15. The third transient substrate 15 is made of a flat and easily processed substrate material such as glass or sapphire.

[0193] It is understood that, in the exemplary embodiment, the shape of the hole 11 may be square, rectangular, circular, or other shapes. The position of the hole 11 matches the position of the third LED chip, and the size of the hole 11 is slightly smaller than the size of the third LED chip. The diameter of the negative pressure device 50 is slightly larger than the diameter of the hole 11.

[0194] S52, A third adhesive film 222 is provided on one side of the third transient substrate 15.

[0195] Please see Figure 36 In this embodiment, step S52 includes at least the following steps.

[0196] S521. Provide a third fixing adhesive layer 22, the third fixing adhesive layer 22 comprising a third lower release film 221, a third adhesive film material 222 and a third upper release film 223 stacked in sequence.

[0197] Specifically, in the embodiments of this application, such as Figure 37 As shown, the third adhesive layer 22 includes a third lower release film 221, a third adhesive film 222, and a third upper release film 223, wherein the third adhesive film 222 is located between the third lower release film 221 and the third upper release film 223. Specifically, the third adhesive film 222 is disposed on one side of the third lower release film 221, and the third upper release film 223 is disposed on the side of the third adhesive film 222 opposite to the third lower release film 221, that is, the third lower release film 221 and the third upper release film 223 are respectively located on opposite sides of the third adhesive film 222.

[0198] In an exemplary embodiment, the side of the third lower release film 221 facing the third adhesive film 222 has a smooth surface, and the side of the third upper release film 223 facing the third adhesive film 222 has a textured, frosted surface. Correspondingly, the side of the third adhesive film 222 facing the third lower release film 221 also has a smooth surface, and the side of the third adhesive film 222 facing the third upper release film 223 also has a textured, frosted surface. The third adhesive film 222 is made of an adhesive material such as polydimethylsiloxane (PDMS), thermally degradable adhesive, cold-degradable adhesive, or photolyzable adhesive.

[0199] S522, Remove the third lower release film 221.

[0200] Specifically, in the embodiments of this application, such as Figure 38 As shown, the third lower release film 221, which is disposed on one side of the third adhesive film 222, is removed from the third adhesive film 222. At this time, the third upper release film 223 and the third adhesive film 222 are still attached together.

[0201] S523, The side of the third adhesive film 222 facing away from the third upper release film 223 is disposed on one side of the third transient substrate 13.

[0202] Specifically, in the embodiments of this application, such as Figure 39 As shown, the side of the third adhesive film 222 opposite to the third upper release film 223 is disposed on one side of the third transient substrate 13, that is, the third adhesive film 222 is attached to one side of the third transient substrate 13 with the third lower release film 221 attached thereon, that is, the side of the third adhesive film 222 with a smooth surface is attached to one side of the third transient substrate 13.

[0203] S524. Remove the third upper release film 223 from the third adhesive film 222.

[0204] Specifically, in the embodiments of this application, such as Figure 40 As shown, the third upper release film 223 is removed from the third adhesive film 222. At this time, only the third adhesive film 222 remains on the third transient substrate 15, and the rough, uneven surface of the third adhesive film 222 facing the third upper release film 223 is exposed.

[0205] S53, the third LED chip 37 is transferred to the side of the third adhesive film 222 that is opposite to the third transient substrate 15.

[0206] Specifically, in the embodiments of this application, such as Figure 41As shown, after removing the third upper release film 223 from the third adhesive film 222, only the third adhesive film 222 remains on the third transient substrate 15. The smooth surface of the third adhesive film 222 facing the third lower release film 221 is attached to the third transient substrate 15, while the textured surface of the third adhesive film 222 faces away from the third transient substrate 15. Multiple third LED chips 37 are transferred to the textured surface of the third adhesive film 222 facing away from the third transient substrate 15, and each of the multiple third LED chips 37 is aligned with one of the holes 11. The third LED chip 37 includes a third chip body 38 and a third solder foot 39. The third chip body 38 of the third LED chip 37 is adhered and fixed to the third adhesive film 222. The third solder foot 39 of the third LED chip 37 is disposed on the third chip body 38 of the third LED chip 37, and the third solder foot 39 faces away from the third adhesive film 222.

[0207] In this embodiment of the application, the size of the plurality of holes 11 inside the third transient substrate 15 is smaller than the size of the third chip body 38 in the third LED chip 37.

[0208] S54. The third adhesive layer 22 located between adjacent third LED chips 37 is etched to obtain a plurality of third adhesive segments 42.

[0209] Specifically, in the embodiments of this application, such as Figure 42 As shown, after the third LED chip 37 is transferred to the side of the third adhesive film 222 facing away from the third transient substrate 15, the third LED chip 37 is aligned with each of the holes 11. Then, the third fixing adhesive layer 22 located between any adjacent third LED chips 37 is etched away to obtain a plurality of third fixing adhesive segments 42. Since the third LED chip 37 is aligned with each of the holes 11, the third fixing adhesive segments 42 are also aligned with each of the holes 11. That is, each third fixing adhesive segment 42 is located between each hole 11 and the corresponding third LED chip 37.

[0210] In an exemplary embodiment, the third fixing adhesive layer 22 located between any adjacent third LED chips 37 can be etched using an adhesive etching method such as inductively coupled plasma (ICP) or plasma. The width of the plurality of third fixing adhesive segments 42 is smaller than the width of the third chip body 38 in the third LED chip 37.

[0211] S55. A negative pressure is formed in the hole 11 by the multiple negative pressure devices 50 to make the third LED chip 37 fall from the third fixing adhesive section 42 to the third reserved installation position of the display back plate 60, and the third LED chip 37 is electrically connected to the display back plate 60.

[0212] Please see Figure 43 In this embodiment, step S55 may include at least the following steps.

[0213] S551. Move the third transient substrate 15 above the display backplate 60, align the plurality of third LED chips 37 with the third reserved mounting positions of the display backplate 60, and align the plurality of negative pressure devices 50 with the ends of the holes 11 opposite to the third LED chips 37.

[0214] Specifically, in the embodiments of this application, such as Figure 44 As shown, an adhesive layer 61 is applied to one side of the display backplate 60. The third transient substrate 15, to which the third LED chip 37 is adhered, is moved to a position above the adhesive layer 61 of the display backplate 60, and the third solder feet 38 of the plurality of third LED chips 37 are aligned with the third reserved mounting positions of the display backplate 60. At this time, a preset distance is maintained between the third transient substrate 15 and the display backplate 60. The third reserved mounting position refers to the position on the display backplate 60 used for mounting the third LED chip 37.

[0215] In an exemplary embodiment, the display backplane 60 may be a TFT backplane, and the adhesive layer 61 may be made of a non-conductive adhesive, anisotropic conductive adhesive, or other adhesive materials.

[0216] The preset distance between the third transient substrate 15 and the display backplate 60 can be 5um to 100um. For example: 6um, 10um, 15um, 20um, 30um, 50um, 80um, or other values.

[0217] S552, The negative pressure device 50 creates a negative pressure in the hole 11, drawing at least a portion of the third fixing adhesive segment 42 into the hole 11, so that the third LED chip 37 falls from the third fixing adhesive segment 42 to the third reserved mounting position on the display back plate 60.

[0218] Specifically, in the embodiments of this application, such as Figure 45As shown, multiple negative pressure devices 50 are arranged at a preset interval (for example, any two adjacent negative pressure devices 50 are spaced apart by the spacing of two third LED chips 37) and aligned with the holes 11 on the third transient substrate 15. The multiple negative pressure devices 50 apply negative pressure to the aligned holes 11, creating a negative pressure within the holes 11. This causes the multiple third LED chips 37 corresponding to the holes 11 to transfer to the third reserved mounting position on the display backplate 60 and be adhered to by the adhesive layer 61. Therefore, by precisely controlling the negative pressure devices 50, not only can LED chips be transferred non-contactly, but single LED chips can also be transferred, facilitating subsequent repair processes.

[0219] Specifically, in the embodiments of this application, such as Figure 46 As shown, the multiple holes 11 inside the third transient substrate 15 are filled with air. The multiple negative pressure devices 50 draw air out of the holes 11 to create negative pressure, causing the third fixing adhesive segment 42 disposed between the holes 11 and the third LED chip 37 to deform and shrink. The contact area between the third fixing adhesive segment 42 and the third LED chip 37 is reduced, thereby reducing the adhesion of the third fixing adhesive segment 42 to the third LED chip 37. The third LED chip 37 falls to the third reserved mounting position on the display back plate 60 and is adhered by the adhesive layer 61.

[0220] S553. Connect the plurality of third LED chips 37 to the display backplate 60, and remove the negative pressure device 50 and the third transient substrate 15.

[0221] Specifically, in the embodiments of this application, such as Figure 47 As shown, metal bonding is completed between the third LED chip 37 and the pad (not shown) corresponding to the third reserved mounting position on the display backplate 60, thereby realizing the electrical connection between the third LED chip 37 and the display backplate 60 (for example, soldering the third LED chip 37 to the pad on the display backplate 60). The negative pressure device 50 and the third transient substrate 15 are then removed, thereby completing the transfer of the third LED chip 37. At this time, multiple third LED chips 37 are respectively located at the third reserved mounting position on the display backplate 60 and are electrically connected to the display backplate 60.

[0222] In summary, the mass transfer method for LED chips in this application solves the problem of LED chip damage during laser stripping and transfer to the display backplane by transferring LED chips on a transient substrate. Therefore, it not only improves the yield of LED chips, but also improves the transfer efficiency of LED chips.

[0223] This application also provides a display panel, which includes a display backplate 40 as shown in the above embodiments and a first LED chip 30, a second LED chip 31, and a third LED chip 32 transferred onto the display backplate 40 by the mass transfer method described in the above embodiments. The first LED chip 30, the second LED chip 31, and the third LED chip 32 form multiple pixel regions. It is understood that the first LED chip 30, the second LED chip 31, and the third LED chip 32 can be different red, green, or blue LED chips, respectively. In other embodiments, the display panel may further include a display area and a non-display area, wherein the display area is used for image display, and the non-display area is disposed around the display area and is not used for image display. The display panel may use liquid crystal material as the display medium, but this application is not limited thereto.

[0224] Understandably, the display panel can be used in electronic devices that include functions such as a Personal Digital Assistant (PDA) and / or a music player, such as mobile phones, tablets, and wearable electronic devices with wireless communication capabilities (such as smartwatches). The aforementioned electronic devices can also be other electronic devices, such as laptops with touch-sensitive surfaces (e.g., touch panels). In some embodiments, the electronic device may have communication capabilities, i.e., it can establish communication with a network via 2G (second-generation mobile communication technology), 3G (third-generation mobile communication technology), 4G (fourth-generation mobile communication technology), 5G (fifth-generation mobile communication technology), or W-LAN (wireless local area network) or other communication methods that may emerge in the future. For the sake of simplicity, this application embodiment does not further limit this aspect.

[0225] This application also provides a display device, which includes a support frame and a display panel as described in the above embodiments, wherein the support frame supports the display panel. The display device includes, but is not limited to, any electronic device or component with display function, such as a Mini LED panel, a Micro LED panel, a mobile phone, a tablet computer, a navigator, or a monitor; this application does not impose specific limitations on this. It is understood that the display device may further include: a pixel circuit disposed in the display area within the display panel for displaying images; and a circuit board assembly for providing operating voltage, driving current, and corresponding functional signals.

[0226] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for mass transfer of LED chips, characterized in that, include: Provide display back panel; Multiple negative pressure devices are provided; A first transient substrate is provided, the first transient substrate having a hole penetrating the first transient substrate and a first LED chip adhered to one end of the hole by a first fixing adhesive. A plurality of negative pressure devices are used to create negative pressure in the hole to cause the first LED chip to fall from the first fixing adhesive to a first reserved mounting position on the display back panel, and to electrically connect the first LED chip to the display back panel. The first fixing adhesive includes a plurality of first fixing adhesive segments, and the first LED chip and the first fixing adhesive segments are aligned with the hole one by one. Each first fixing adhesive segment is located between each hole and the corresponding first LED chip. The width of the first fixing adhesive segment is smaller than the width of the first chip body of the first LED chip, so that when the negative pressure device creates negative pressure in the hole, it draws the first fixing adhesive segment into the hole.

2. The mass transfer method for LED chips as described in claim 1, characterized in that, The provision of a first transient substrate, the first transient substrate having a hole penetrating the first transient substrate and a first LED chip adhered to one end of the hole by a first adhesive, wherein a negative pressure is formed in the hole by a plurality of negative pressure devices to cause the first LED chip to fall from the first adhesive to a first reserved mounting position on the display back panel, and the first LED chip is electrically connected to the display back panel, including: Provide a first transient substrate; A first adhesive film is disposed on one side of the first transient substrate; The first LED chip is transferred to the side of the first adhesive film that is opposite to the first transient substrate; The first adhesive layer located between adjacent first LED chips is etched to obtain a plurality of first adhesive segments; The negative pressure is created in the hole by multiple negative pressure devices to make the first LED chip fall from the first fixing adhesive section to the first reserved installation position of the display back plate, and to electrically connect the first LED chip to the display back plate.

3. The mass transfer method for LED chips as described in claim 2, characterized in that, The provision of a first adhesive film on one side of the first transient substrate includes: A first fixing adhesive layer is provided, the first fixing adhesive layer comprising a first lower release film, a first adhesive film material and a first upper release film stacked sequentially; Remove the first lower release film; The side of the first adhesive film material that is opposite to the first upper release film is disposed on one side of the first transient substrate. Remove the first upper release film from the first adhesive film material.

4. The mass transfer method for LED chips as described in claim 2, characterized in that, The step of creating negative pressure within the hole using multiple negative pressure devices to cause the first LED chip to fall from the first fixing adhesive section to the first reserved mounting position on the display backplate, and electrically connecting the first LED chip to the display backplate, includes: The first transient substrate is moved above the display back panel, and the plurality of first LED chips are aligned with the first reserved mounting positions on the display back panel. The plurality of negative pressure devices are respectively aligned with the end of the hole opposite to the first LED chip. The negative pressure device creates negative pressure in the hole, drawing at least a portion of the first fixing adhesive segment into the hole, so that the first LED chip falls from the first fixing adhesive segment to the first reserved mounting position on the display back panel. The first LED chips are electrically connected to the display backplate, and the negative pressure device and the first transient substrate are removed.

5. The mass transfer method for LED chips as described in claim 2, characterized in that, The mass transfer method also includes: A second transient substrate is provided, the second transient substrate having a hole penetrating the second transient substrate and a second LED chip adhered to one end of the hole by a second fixing adhesive. A negative pressure is formed in the hole by a plurality of the negative pressure devices to cause the second LED chip to fall from the second fixing adhesive to a second reserved mounting position on the display back plate, and the second LED chip is electrically connected to the display back plate.

6. The mass transfer method for LED chips as described in claim 5, characterized in that, The provision of a second transient substrate, the second transient substrate having a hole penetrating the second transient substrate and a second LED chip adhered to one end of the hole by a second adhesive, wherein a negative pressure is created within the hole by a plurality of the negative pressure devices to cause the second LED chip to fall from the second adhesive to a second reserved mounting position on the display back panel, and the second LED chip is electrically connected to the display back panel, including: Provide a second transient substrate; A second adhesive film is disposed on one side of the second transient substrate; The second LED chip is transferred to the side of the second adhesive film that is opposite to the second transient substrate; The second adhesive layer located between adjacent second LED chips is etched to obtain multiple second adhesive segments; The negative pressure is created in the hole by multiple negative pressure devices to make the second LED chip fall from the second fixing adhesive section to the second reserved mounting position of the display back plate, and to electrically connect the second LED chip to the display back plate.

7. The mass transfer method for LED chips as described in claim 6, characterized in that, The provision of a second adhesive film on one side of the second transient substrate includes: A second fixing adhesive layer is provided, the second fixing adhesive layer comprising a second lower release film, a second adhesive film material and a second upper release film stacked sequentially; Remove the second lower release film; The side of the second adhesive film material that is opposite to the second upper release film is disposed on one side of the second transient substrate; Remove the second upper release film from the second adhesive film material.

8. The mass transfer method for LED chips as described in claim 6, characterized in that, The step of creating negative pressure within the hole using multiple negative pressure devices to cause the second LED chip to fall from the second fixing adhesive section to the second reserved mounting position on the display backplate, and electrically connecting the second LED chip to the display backplate, includes: The second transient substrate is moved above the display back panel, and the plurality of second LED chips are aligned with the second reserved mounting positions on the display back panel; The negative pressure device creates negative pressure in the hole, drawing at least a portion of the second fixing adhesive segment into the hole, so that the second LED chip falls from the second fixing adhesive segment to the second reserved mounting position on the display back panel; The second LED chips are electrically connected to the display backplate, and the negative pressure device and the second transient substrate are removed.

9. The mass transfer method for LED chips as described in claim 6, characterized in that, The side of the first adhesive layer that contacts the first LED chip has a raised or recessed pattern, and the side of the second adhesive layer that contacts the second LED chip has a raised or recessed pattern.

10. The mass transfer method for LED chips as described in any one of claims 1-9, characterized in that, The negative pressure device is a suction nozzle.

11. A display panel, characterized in that, It includes a display backplate and a plurality of LED chips transferred to the display backplate by the mass transfer method as described in any one of claims 1-10.

12. A display device, characterized in that, It includes a support frame and a display panel as described in claim 11, wherein the support frame is used to support the display panel.

Images