Heating control circuit and battery pack

CN116053659BActive Publication Date: 2026-09-01EVE ENERGY CO LTD
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Patent Information

Application Number
CN202310120527.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-02-15
Publication Date
2026-09-01
Estimated Expiration
2043-02-15

AI Technical Summary

Technical Problem

[0003]而相关技术中,利用纯硬件电路实现对低温电池的加热控制,仍存在一些不能实现稳定加热的因素

Benefits of technology

[0044]在本发明的实施例中,通过在加热控制电路中设置震荡抑制模块,避免第一实时电压与参考电压出现大小接近的情况而导致加热控制模块反复启动,从而避免影响加热模块正常工作。

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Abstract

This invention provides a heating control circuit and a battery pack. The heating control circuit mainly includes a first temperature acquisition module, a temperature judgment module, an oscillation suppression module, a heating control module, and a heating module. The first temperature acquisition module outputs a first real-time voltage. The temperature judgment module is electrically connected to both the first temperature acquisition module and a reference voltage terminal. The oscillation suppression module is electrically connected to both the first temperature acquisition module and the temperature judgment module. The heating control module is electrically connected to both the temperature judgment module and a first heating drive voltage terminal. The heating module is also electrically connected to the heating control module. By incorporating the oscillation suppression module, the repeated activation of the heating control module due to the first real-time voltage being close to the reference voltage is avoided, ensuring the normal operation of the heating module.
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Description

Technical Field

[0001] This invention relates to the field of battery heating control technology, specifically to a heating control circuit and a battery pack. Background Technology

[0002] Whether in the automotive or aerospace industries, there is still significant room for improvement in battery thermal management technology, especially in low-temperature environments, which has garnered considerable industry attention. This is because at low temperatures, the activity of internal materials in a battery decreases considerably, making it difficult for the battery to provide sufficient voltage to the power consumer, thus affecting the normal operation of the consumer. Therefore, to ensure the normal operation of the power consumer, appropriate heating is necessary for batteries in low-temperature environments.

[0003] However, in related technologies, the use of pure hardware circuits to control the heating of low-temperature batteries still presents some challenges in achieving stable heating. The main reason for this is that pure hardware circuits cannot accurately determine the temperature threshold for initiating heating. This causes the heating control circuit to oscillate repeatedly during the heating initiation and shutdown processes, preventing core components, including the battery, from operating based on their designated operating temperature, thus affecting the normal operation of the power-consuming component.

[0004] Therefore, the above-mentioned problems urgently need to be addressed. Summary of the Invention

[0005] Embodiments of the present invention provide a heating control circuit and a battery pack that can avoid heating vibration problems and ensure that heating components can work normally in low-temperature environments.

[0006] In a first aspect, embodiments of the present invention provide a heating control circuit, comprising:

[0007] The first temperature acquisition module is used to output a first real-time voltage, which varies based on the real-time temperature change;

[0008] A temperature judgment module is electrically connected to the first temperature acquisition module and the reference voltage terminal, and the temperature judgment module is used to output a second real-time voltage based on the first real-time voltage and the reference voltage output by the reference voltage terminal.

[0009] An oscillation suppression module is electrically connected to both the first temperature acquisition module and the temperature judgment module. The oscillation suppression module is used to adjust the first real-time voltage based on the second real-time voltage.

[0010] A heating control module is electrically connected to the temperature judgment module and the first heating drive voltage terminal, respectively. The heating control module is used to output the first heating drive voltage provided by the first heating drive voltage terminal based on the second real-time voltage.

[0011] A heating module, which is electrically connected to the heating control module, is used to perform heating based on the first heating drive voltage.

[0012] In one embodiment, the first temperature acquisition module includes a first temperature-sensitive unit and a first sampling unit;

[0013] The first end of the first temperature-sensitive unit is electrically connected to the first power supply end, and the second end of the first temperature-sensitive unit is electrically connected to the temperature judgment module, the first end of the first sampling unit, and the oscillation suppression module, respectively; the first temperature-sensitive unit is used to detect the real-time temperature change.

[0014] The second end of the first sampling unit is electrically connected to the ground end, and the first sampling unit is used to output a first real-time voltage based on the change of the real-time temperature.

[0015] In one embodiment, the temperature determination module includes a comparator;

[0016] The first input terminal of the comparator is electrically connected to the reference voltage terminal, the second input terminal of the comparator is electrically connected to the first temperature acquisition module, and the output terminal of the comparator is electrically connected to the heating control module.

[0017] In one embodiment, the oscillation suppression module includes a second sampling unit, a switching unit, and a voltage divider unit;

[0018] The second sampling unit is electrically connected to the temperature judgment module, the switching unit and the grounding terminal respectively. The second sampling unit is used to collect the second real-time voltage and output a third real-time voltage to the switching unit based on the second real-time voltage.

[0019] The switching unit is electrically connected to the voltage divider unit and the first temperature acquisition module respectively. The switching unit is used to control the on / off state of the voltage divider unit based on the third real-time voltage.

[0020] The voltage divider unit is electrically connected to the first temperature sampling module, and the voltage divider unit is used to adjust the first real-time voltage.

[0021] In one embodiment, the second sampling unit includes a first sampling resistor, a second sampling resistor, and a first capacitor;

[0022] The first end of the first sampling resistor is electrically connected to the temperature judgment module, and the second end of the first sampling resistor is electrically connected to the first end of the second sampling resistor and the switching unit, respectively.

[0023] The second terminal of the second sampling resistor is electrically connected to the ground terminal;

[0024] The first terminal of the first capacitor is electrically connected to the first terminal of the second sampling resistor, and the second terminal of the first capacitor is electrically connected to the second terminal of the second sampling resistor.

[0025] In one embodiment, the switching unit includes a first switching transistor;

[0026] The gate of the first switching transistor is electrically connected to the second sampling unit, one of the source and drain of the first switching transistor is electrically connected to the voltage divider unit, and the other of the source and drain of the first switching transistor is electrically connected to the first temperature acquisition module.

[0027] In one embodiment, the voltage divider unit includes at least one voltage divider resistor;

[0028] The first end of the voltage divider resistor is electrically connected to the first temperature acquisition module, and the second end of the voltage divider resistor is electrically connected to the switching unit.

[0029] In one embodiment, the heating control module includes a second switching transistor and a third switching transistor;

[0030] The gate of the second switch is electrically connected to the temperature judgment module, one of the source and drain of the second switch is electrically connected to the ground terminal, and the other of the source and drain of the second switch is electrically connected to the gate of the third switch.

[0031] One of the source and drain of the third switching transistor is electrically connected to the first heating drive voltage terminal, and the other of the source and drain of the third switching transistor is electrically connected to the heating module.

[0032] In one embodiment, the heating control circuit further includes a microprocessor module;

[0033] The microprocessor module is electrically connected to the heating control module and the heating module respectively. The microprocessor module is used to provide a second heating drive voltage to the heating module based on the second real-time voltage.

[0034] The heating module heats the object based on the second heating drive voltage.

[0035] In one embodiment, the heating control circuit further includes a second temperature sampling module;

[0036] The second temperature acquisition module is connected to the microprocessor module, and the second temperature acquisition module is used to output a fourth real-time voltage, which varies based on the real-time temperature change;

[0037] The microprocessor module provides the second heating drive voltage to the heating module based on the fourth real-time voltage.

[0038] In one embodiment, the battery pack heating control circuit further includes a communication module;

[0039] The communication module is electrically connected to the microprocessor module, and the communication module is used to interact with the outside world based on the second real-time voltage and the fourth real-time voltage.

[0040] In one embodiment, the heating control circuit further includes a power supply module;

[0041] The power supply module is electrically connected to the first temperature acquisition module, the temperature judgment module, the reference voltage terminal, and the first heating drive voltage terminal, respectively. The power supply module is used to provide corresponding voltages to the first temperature acquisition module, the temperature judgment module, the reference voltage terminal, and the first heating drive voltage terminal, respectively.

[0042] Secondly, embodiments of the present invention provide a battery pack, including a battery body and any of the heating control circuits described in the foregoing embodiments.

[0043] The beneficial effects of the embodiments of the present invention are as follows:

[0044] In an embodiment of the present invention, by setting an oscillation suppression module in the heating control circuit, the heating control module is repeatedly started due to the situation where the first real-time voltage and the reference voltage are close in magnitude, thereby avoiding affecting the normal operation of the heating module. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a schematic diagram of the first structure of the heating control circuit provided in the embodiment of the present invention;

[0047] Figure 2 This is a schematic diagram of a second structure of the heating control circuit provided in an embodiment of the present invention;

[0048] Figure 3This is a schematic diagram of a third structure of the heating control circuit provided in an embodiment of the present invention;

[0049] Figure 4 This is a schematic diagram of the fourth structure of the heating control circuit provided in the embodiments of the present invention;

[0050] Figure 5 This is a schematic diagram of the fifth structure of the heating control circuit provided in the embodiments of the present invention;

[0051] Figure 6 This is a schematic diagram of the sixth structure of the heating control circuit provided in the embodiments of the present invention;

[0052] Figure 7 This is a schematic diagram of the seventh structure of the heating control circuit provided in the embodiments of the present invention;

[0053] Figure 8 This is an eighth structural schematic diagram of the heating control circuit provided in the embodiments of the present invention;

[0054] Figure 9 This is a circuit diagram of a heating control circuit provided in an embodiment of the present invention;

[0055] Figure 10 This is a ninth structural schematic diagram of the heating control circuit provided in an embodiment of the present invention;

[0056] Figure 11 This is a schematic diagram of the tenth structure of the heating control circuit provided in the embodiment of the present invention;

[0057] Figure 12 This is an eleventh structural schematic diagram of the heating control circuit provided in an embodiment of the present invention;

[0058] Figure 13 This is a schematic diagram of the twelfth structure of the heating control circuit provided in the embodiments of the present invention. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present invention and are not intended to limit the present invention.

[0060] Please see Figure 1 , Figure 1 This is a schematic diagram of a first structural embodiment of the heating control circuit provided by the present invention. Figure 1As shown, the heating control circuit 100 includes a first temperature acquisition module 10, a temperature judgment module 20, a heating control module 30, a heating module 40, and an oscillation suppression module 50. Specifically, the temperature judgment module 20 is electrically connected to the first temperature acquisition module 10 and the reference voltage terminal Vref, the oscillation suppression module 50 is electrically connected to the first temperature acquisition module 10 and the temperature judgment module 20, the heating control module 30 is electrically connected to the temperature judgment module 20 and the first heating drive voltage terminal Ven1, and the heating module 40 is electrically connected to the heating control module 30.

[0061] The first temperature acquisition module 10 is used to output a first real-time voltage, which varies based on changes in real-time temperature. It should be understood that the first temperature acquisition module 10 can detect the real-time temperature of a specific object and convert the detected real-time temperature into a first real-time voltage. The specific object can be a battery or a printed circuit board (PCB) of a battery management system.

[0062] The temperature judgment module 20 is used to output a second real-time voltage based on the first real-time voltage and the reference voltage output from the reference voltage terminal Ven1. It should be understood that the voltage value of the second real-time voltage output by the temperature judgment module 20 is jointly determined by the voltage value of the reference voltage and the voltage value of the first real-time voltage.

[0063] The oscillation suppression module 50 is used to adjust the first real-time voltage based on the second real-time voltage, so as to adjust the voltage difference between the first real-time voltage and the reference voltage, and avoid the temperature judgment module 20 from oscillating when the voltage values ​​of the first real-time voltage and the reference voltage are close, which would cause the heating control module 30 to start repeatedly and thus affect the normal operation of the heating module.

[0064] The heating control module 30 is used to output the first heating drive voltage provided by the first heating drive voltage terminal Ven1 to the heating module 40 based on the second real-time voltage output by the temperature judgment module 20. It should be understood that whether the first heating drive voltage terminal Ven1 outputs the first heating drive voltage to the heating module 40 depends on the voltage value of the second real-time voltage.

[0065] The heating module 40 is used to perform heating based on a first heating drive voltage. It should be understood that the heating module 40 heats a specific object of the first temperature sampling module 10 based on the first heating drive voltage, ensuring that the specific object can operate normally in a low-temperature environment. Specifically, the heating module 40 may include a heating plate that converts electrical energy into heat energy, or an integrated circuit.

[0066] In the heating control circuit provided in this embodiment, by setting an oscillation suppression module, the first real-time voltage and the reference voltage are prevented from being close in magnitude, thereby preventing the heating control module from oscillating due to repeated starts, and thus ensuring the normal operation of the heating module.

[0067] In one specific embodiment provided in this application, please refer to Figure 2 , Figure 2 This is a schematic diagram of a second structure of the heating control circuit provided in an embodiment of the present invention. (See diagram below.) Figure 2 As shown, the difference between this embodiment and the previous embodiment is that in the heating control circuit 100 provided in this embodiment, the first temperature sampling module 10 includes a first temperature-sensitive unit 101 and a first sampling unit 102.

[0068] Specifically, the first end of the first temperature-sensitive unit 101 is electrically connected to the first power supply terminal, and the second end of the first temperature-sensitive unit 101 is electrically connected to both the temperature judgment module 20 and the first end of the first sampling unit 102. The second end of the first sampling unit 102 is electrically connected to the ground terminal. That is, the first temperature-sensitive unit 101 and the first sampling unit 102 are connected in series between the first power supply terminal V1 and the ground terminal.

[0069] The first temperature-sensitive unit 101 is used to detect real-time temperature changes. That is, the first temperature-sensitive unit 101 can be used to detect real-time temperature changes of the battery, circuit board or other circuit components, and can convert real-time temperature changes into electrical signal changes.

[0070] Specifically, the first temperature-sensitive unit 101 can be a thermistor. A thermistor can have different resistance values ​​at different temperatures. When the voltage supplied by the first power supply terminal V1 is constant, the thermistor can change the voltage drop between the first and second terminals of the first temperature-sensitive unit 101 based on the change in its own resistance value. Therefore, the thermistor can convert temperature changes into changes in its voltage divider parameters in the circuit, thereby causing a corresponding change in the voltage divider parameters of the first sampling unit 102 in the circuit. Consequently, the first real-time voltage output by the first sampling unit 102 will change based on the real-time temperature change. Correspondingly, the first temperature-sensitive unit 101 can also be a resistance temperature detector, an integrated circuit temperature sensor, or other temperature-sensing element. Therefore, the specific temperature-sensing element of the first temperature-sensitive unit 101 can be selected according to actual needs.

[0071] The voltage at the first terminal of the first sampling unit 102 is the first real-time voltage.

[0072] Specifically, the first sampling unit 102 may include at least one sampling resistor to output a first real-time voltage to the temperature judgment module 20. When the first sampling unit 102 includes multiple sampling resistors, these multiple sampling resistors may be connected in series or in parallel. The equivalent resistance value of the first sampling unit 102, the number of sampling resistors, the resistance value of the corresponding sampling resistors, and the connection relationship between each sampling resistor can be set according to actual needs based on the sampling resistors.

[0073] To ensure that the first sampling unit 102 outputs a stable first real-time voltage, a temperature sampling and voltage stabilizing capacitor can be set in the first temperature sampling module 10, so that the first end of the temperature sampling and voltage stabilizing capacitor is electrically connected to the first end of the first temperature-sensitive unit 101, and the second end of the temperature sampling and voltage stabilizing capacitor is electrically connected to the second end of the first temperature-sensitive unit 101.

[0074] In one specific embodiment provided in this application, please refer to Figure 3 , Figure 3 This is a schematic diagram of a third structure of the heating control circuit provided in an embodiment of the present invention. (See diagram below.) Figure 3 As shown, the difference between this embodiment and the previous embodiment is that, in the heating control circuit 100 provided in this embodiment, the temperature judgment module 20 includes a comparator U1. The first input terminal of the comparator U1 is electrically connected to the reference voltage terminal Vref, the second input terminal of the comparator U1 is electrically connected to the first temperature acquisition module 10, and the output terminal of the comparator U1 is electrically connected to the heating control module 30.

[0075] Specifically, comparator U1 compares the voltage at the first input terminal with the voltage at the second input terminal, and based on the comparison result, outputs a second real-time voltage to the output terminal. Specifically, as... Figure 3 As shown, the first input terminal of comparator U1 is the positive input terminal, and the second input terminal of comparator U1 is the negative input terminal. If the voltage at the positive input terminal is greater than the voltage at the negative input terminal, the second real-time voltage output by comparator U1 is a high-level voltage; if the voltage at the positive input terminal is less than the voltage at the negative input terminal, the second real-time voltage output by comparator U1 is a low-level voltage. Therefore, the value of the second real-time voltage is variable, and the heating control module 30 and the oscillation suppression module 50 can adjust their operating states based on the changing second real-time voltage.

[0076] The comparator U1 is also electrically connected to the comparator power supply terminal Vop and the ground terminal, respectively. The comparator power supply terminal Vop is used to provide the operating voltage required by the comparator U1.

[0077] It is worth mentioning that, Figure 3This is merely an illustrative example showing that the first input terminal of comparator U1 is a positive input terminal and the second input terminal of comparator U1 is a negative input terminal. Those skilled in the art can select either the first or second input terminal as a positive input terminal based on the technical concept of this embodiment and according to actual needs.

[0078] It is worth mentioning that, in the temperature judgment module 20 of this embodiment, at least one resistor can be provided between the first input terminal of the comparator U1 and the reference voltage terminal Vref to divide the reference voltage provided by the reference voltage terminal Vref and avoid the reference voltage from being too large. Furthermore, to ensure that the reference voltage terminal Vref provides a stable reference voltage, a voltage stabilizing capacitor can be provided at the reference voltage terminal Vref, with one end of the voltage stabilizing capacitor electrically connected to the reference voltage terminal Vref and the other end electrically connected to the ground terminal.

[0079] Correspondingly, at least one resistor can be provided between the second input terminal of comparator U1 and the first temperature acquisition module 10 to divide the first real-time voltage provided by the first temperature acquisition module 10, so as to avoid the first real-time voltage being too large.

[0080] Correspondingly, a voltage regulator capacitor can also be set at the comparator power supply terminal Vop of comparator U1, so that one end of the voltage regulator capacitor is electrically connected to the comparator power supply terminal Vop, and the other end of the voltage regulator capacitor is electrically connected to the ground terminal, so as to ensure that the comparator power supply terminal Vop provides a stable operating voltage.

[0081] In one specific embodiment provided in this application, please refer to Figure 4 , Figure 4 This is a schematic diagram of the fourth structure of the heating control circuit provided in an embodiment of the present invention. Figure 4 As shown, the difference between this embodiment and the previous embodiment is that, in the heating control circuit 100 provided in this embodiment, the oscillation suppression module 50 includes a second sampling unit 501, a switching unit 502, and a voltage divider unit 503.

[0082] The second sampling unit 501 is electrically connected to the temperature judgment module 20, the switching unit 502, and the grounding terminal. The second sampling unit 501 is used to collect the second real-time voltage and output a third real-time voltage to the switching unit 502 based on the second real-time voltage.

[0083] The switching unit 502 is electrically connected to both the voltage divider unit 503 and the first temperature sampling module 10. The switching unit 502 controls the on / off state of the voltage divider unit 503 based on the third real-time voltage provided by the second sampling unit 501. It should be understood that whether the voltage divider unit 503 is in a closed-circuit state or an open-circuit state depends on the response of the switching unit 502 based on the third real-time voltage.

[0084] The voltage divider unit 503 is electrically connected to the first temperature acquisition module 10. The voltage divider unit 503 is used to adjust the first real-time voltage.

[0085] For details, please refer to Figure 5 , Figure 5 This is a schematic diagram of the fifth structure of the heating control circuit provided in an embodiment of the present invention. For example... Figure 5 As shown, the second sampling unit 501 includes a first sampling resistor R1, a second sampling resistor R2, and a first capacitor C51.

[0086] The first end of the first sampling resistor R1 is electrically connected to the temperature judgment module 20, and the second end of the first sampling resistor R1 is electrically connected to the first end of the second sampling resistor R2 and the switching unit 502.

[0087] The second terminal of the second sampling resistor R2 is electrically connected to the ground terminal. Therefore, the first sampling resistor R1 and the second sampling resistor R2 are connected in series between the temperature judgment module 20 and the ground terminal, and the voltage at the first terminal of the second sampling resistor R2 is the third real-time voltage. Since both the first sampling resistor R1 and the second sampling resistor R2 are fixed resistors, the voltage at the second sampling resistor R2 changes based on the change of the second real-time voltage, that is, the third real-time voltage changes based on the change of the second real-time voltage.

[0088] The first terminal of the first capacitor C51 is electrically connected to the first terminal of the second sampling resistor R2, and the second terminal of the first capacitor C51 is electrically connected to the second terminal of the second sampling resistor R2. The purpose of setting the first capacitor C51 is to ensure a stable third real-time output voltage.

[0089] For details, please refer to Figure 6 , Figure 6 This is a schematic diagram of the sixth structure of the heating control circuit provided in an embodiment of the present invention. For example... Figure 6 As shown, the switching unit 502 includes a first switching transistor T1. Specifically, the gate of the first switching transistor T1 is electrically connected to the second sampling unit 501, one of the source and drain of the first switching transistor T1 is electrically connected to the voltage divider unit 503, and the other of the source and drain of the first switching transistor T1 is electrically connected to the first temperature sampling module 10.

[0090] The first switching transistor T1 can be a metal-oxide-semiconductor field-effect transistor (MOSFET). As a voltage-controlled component, the MOSFET is in the on state when there is a certain voltage between its gate and source, and in the off state when there is no voltage. Accordingly, the first switching transistor T1 can also be selected from NPN and PNP transistors according to actual needs.

[0091] Therefore, in this embodiment, based on the third real-time voltage provided by the second sampling unit 501 connected to the gate of the first switch T1, the first switch T1 can switch between an on state and an off state. Since the third real-time voltage is variable, the on or off state of the first switch T1 is also variable.

[0092] For details, please refer to Figure 7 , Figure 7 This is a schematic diagram of the seventh structure of the heating control circuit provided in this embodiment of the invention. For example... Figure 7 As shown, the voltage divider unit 503 includes at least one voltage divider resistor.

[0093] Taking the voltage divider unit 503, which includes a third voltage divider resistor R51, as an example, specifically, the first end of the third voltage divider resistor R51 is electrically connected to the first temperature acquisition module 10, and the second end of the third voltage divider resistor R51 is electrically connected to the switching unit 502. If the switching unit 502 is in the on state, the third voltage divider resistor R51 and the first temperature acquisition module form a parallel path, thereby adjusting the first real-time voltage of the first temperature acquisition module 10; if the switching unit 502 is in the off state, no loop is formed between the first end and the second end of the third voltage divider resistor R51, and the first real-time voltage of the first temperature acquisition module 10 will not be adjusted.

[0094] It should be understood that in some embodiments, the voltage divider unit 503 may also include a third voltage divider resistor R51 and a fourth voltage divider resistor R52 connected in parallel. Thus, under normal circumstances, the resistance of the voltage divider unit 503 is the equivalent resistance of the third voltage divider resistor R51 and the fourth voltage divider resistor R52 connected in parallel. If one of the third voltage divider resistor R51 and the fourth voltage divider resistor R52 is damaged or open-circuited, the other of the three voltage divider resistors can still be connected in parallel with the first temperature acquisition module 10 to adjust the first real-time voltage, thereby improving the stability of the heating control circuit.

[0095] In one embodiment provided in this application, please refer to Figure 8 , Figure 8 This is a schematic diagram of the eighth structure of the heating control circuit provided in an embodiment of the present invention. For example... Figure 8 As shown, the difference between this embodiment and the previous embodiment is that, in the heating control circuit 100 provided in this embodiment, the heating control module 30 includes a second switching transistor T2 and a third switching transistor T3.

[0096] The gate of the second switch T2 is electrically connected to the temperature judgment module, one of the source and drain of the second switch T2 is electrically connected to the ground terminal, and the other of the source and drain of the second switch T2 is electrically connected to the gate of the third switch.

[0097] One of the source and drain of the third switching transistor is electrically connected to the first heating drive voltage terminal Ven1, and the other of the source and drain of the third switching transistor is electrically connected to the heating module 40.

[0098] Specifically, when the gate of the second switch T2 is connected to the second real-time voltage and is in the ON state, it provides the ground voltage of the ground terminal to the gate of the third switch T3. The third switch T3 is in the ON state based on the ground voltage of the ground terminal, thereby providing the first driving heating voltage (Ven1) to the heating module 40, so that the heating module 40 converts the first driving heating voltage into heat energy. Conversely, when the gate of the second switch T2 is connected to the second real-time voltage and is in the OFF state, the third switch T3 is also in the OFF state, and the heating module 40 is not in operation.

[0099] It is worth mentioning that, to prevent the voltage connected to the gate of the second switching transistor T2 from being too high, a voltage divider resistor can be connected in series with the gate of the second switching transistor T2 in the temperature judgment module 20 to protect the second switching transistor T2. In addition, to ensure the stability of the voltage connected to the gate of the second switching transistor T2, a voltage-regulating resistor and a voltage-regulating capacitor can be provided between the gate of the second switching transistor T2 and one of the source and drain of the second switching transistor.

[0100] Similarly, a voltage divider resistor can be connected in series between the gate of the third switch T3 and the other of the source and drain of the second switch T2. A voltage regulator resistor and a voltage regulator capacitor can also be connected between the gate of the third switch T3 and the first driving heating voltage terminal Ven1.

[0101] Please see Figure 9 , Figure 9 This is a circuit diagram of a heating control circuit provided in an embodiment of the present invention. Figure 9 As shown, the heating control circuit 100 includes a first temperature acquisition module 10, a temperature judgment module 20, a heating control module 30, a heating module 40, and an oscillation suppression module 50.

[0102] Specifically, the first temperature acquisition module 10 includes a first temperature-sensitive unit 101 and a first sampling unit 102. Specifically, the first temperature-sensitive unit 101 includes a first temperature-sensitive resistor R01 and a temperature-sensing and voltage-stabilizing capacitor C01. For ease of subsequent illustration, the first temperature-sensitive resistor R01 is a negative temperature coefficient thermistor, meaning that the resistance of the first temperature-sensitive resistor R01 decreases as the temperature increases. Specifically, the first sampling unit 102 includes a third sampling resistor R02.

[0103] In this configuration, the first terminal of the first thermistor R01 is electrically connected to the first power supply terminal V1, and the second terminal of the first thermistor R01 is electrically connected to the first node A. The first terminal of the temperature-sensing and voltage-stabilizing capacitor C01 is electrically connected to the first terminal of the first thermistor R01, and the second terminal of the temperature-sensing and voltage-stabilizing capacitor C01 is electrically connected to the first node A. The first terminal of the third sampling resistor R02 is electrically connected to the first node A, and the second terminal of the third sampling resistor R02 is electrically connected to the fourth node D. The fourth node D is electrically connected to the ground terminal. Therefore, the first thermistor R01 and the third sampling resistor R02 are connected in series between the first power supply terminal V1 and the ground terminal.

[0104] The first thermistor R01 can be placed on the surface of the battery or circuit board under test to sense the real-time temperature of the battery or circuit board. The resistance of the first thermistor R01 changes based on the real-time temperature change. When the resistance of the third sampling resistor R02 is constant and the voltage supplied by the first power supply terminal V1 is constant, the voltage at the first node A will change with the resistance of the first thermistor R01. It should be understood that the voltage at the first node A is the first real-time voltage output by the first temperature sampling module 10. Specifically, the voltage supplied by the first power supply terminal V1 is 5V.

[0105] Specifically, the temperature judgment module 20 includes a comparator U1, a first voltage divider resistor R21, a second voltage divider resistor R22, a first voltage regulator capacitor C21, and a second voltage regulator capacitor C22.

[0106] In this circuit, the first terminal of the first voltage divider resistor R21 is electrically connected to the reference voltage terminal Vref, and the second terminal of R21 is electrically connected to the non-inverting input terminal of comparator U1. The first terminal of the first voltage stabilizing capacitor C21 is electrically connected to the reference voltage terminal Vref, and the second terminal of C21 is electrically connected to the ground terminal. The first terminal of the second voltage divider resistor R22 is electrically connected to the first node A, and the second terminal of R22 is electrically connected to the non-inverting input terminal of comparator U1. The output terminal of comparator U1 is electrically connected to the second node B, and comparator U1 is also electrically connected to the comparator power supply terminal Vop and the ground terminal. Specifically, the reference voltage provided by the reference voltage terminal Vref is 2.5V, and the voltage provided by the comparator power supply terminal Vop is 5V.

[0107] It should be understood that the voltage at the second node B is the second real-time voltage. Comparator U1 is used to compare the voltage at the negative input terminal with the voltage at the positive input terminal. When the voltage at the positive input terminal is greater than the voltage at the negative input terminal, comparator U1 provides a high-level voltage to the second node B; when the voltage at the positive input terminal is less than the voltage at the negative input terminal, comparator U1 provides a low-level voltage to the second node B.

[0108] The oscillation suppression module 50 includes a second sampling unit 501, a switching unit 502, and a voltage divider unit 503. Specifically, the second sampling unit 501 includes a first sampling resistor R1, a second sampling resistor R2, and a first capacitor C51. The switching unit 502 includes a first switching transistor T1. The voltage divider unit 503 includes a third voltage divider resistor R51 and a fourth voltage divider resistor R52.

[0109] Specifically, the first terminal of the first sampling resistor R1 is electrically connected to the second node B, and the second terminal of the first sampling resistor R1 is electrically connected to the third node C. The first terminal of the second sampling resistor R2 is electrically connected to the third node, and the second terminal of the second sampling resistor R2 is electrically connected to the fourth node D. The first terminal of the first capacitor C51 is electrically connected to the third node C, and the second terminal of the first capacitor C51 is electrically connected to the fourth node D. It should be understood that the voltage at the third node C is the third real-time voltage.

[0110] Specifically, the gate of the first switching transistor T1 is electrically connected to the third node C, one of the source and drain of the first switching transistor T1 is electrically connected to the ground terminal, and the other of the source and drain of the first switching transistor T1 is electrically connected to the first terminal of the third voltage divider resistor R51 and the first terminal of the fourth voltage divider resistor R52, respectively. It should be understood that when the voltage at the third node C is a high-level voltage, the first switching transistor T1 is in the conducting state; when the voltage at the third node C is a low-level voltage, the first switching transistor T1 is in the cutoff state.

[0111] That is, when the voltage at the positive input terminal of comparator U1 is greater than the voltage at its negative input terminal, and comparator U1 outputs a high-level voltage to the second node B, the first switch T1 is turned on, thereby controlling the voltage divider unit 503 to adjust the voltage at the first node A.

[0112] It is worth mentioning that the purpose of this setting is to avoid the heating control module repeatedly switching between heating on and off states when the voltages at the positive and negative input terminals of comparator U1 are equal, thereby suppressing the oscillation of the heating control circuit 100.

[0113] Specifically, the second terminal of the third voltage divider resistor R51 is electrically connected to the first node A. The second terminal of the fourth voltage divider resistor R52 is also electrically connected to the first node A.

[0114] That is, when the first switch T1 is in the on state, the third voltage divider resistor R51, the fourth voltage divider resistor R52, and the third sampling resistor R02 are connected in parallel. Therefore, the equivalent resistance formed by the third voltage divider resistor R51, the fourth voltage divider resistor R52, and the third sampling resistor R02 is less than the resistance of the third sampling resistor R02. As a result, the voltage division between the first temperature-sensitive resistor R01 and the third sampling resistor R02 changes, causing the voltage at the first node A to decrease, i.e., the first real-time voltage to decrease. Based on this, the voltage difference between the positive and negative input terminals of comparator U1 increases, and the oscillation in the heating control circuit 100 is suppressed.

[0115] The heating control module 30 includes a fifth and third voltage divider resistor R51, a sixth voltage divider resistor R33, a first voltage regulator resistor R32, a second voltage regulator resistor R34, a third voltage regulator capacitor C31, a fourth voltage regulator capacitor C32, a second switching transistor T2, and a third switching transistor T3.

[0116] Specifically, the first terminal of the fifth and third voltage divider resistor R51 is electrically connected to the second node B, and the second terminal of the fifth and third voltage divider resistor R51 is electrically connected to the gate of the second switching transistor T2. One of the source and drain of the second switching transistor T2 is electrically connected to the ground terminal, and the other of the source and drain of the second switching transistor T2 is electrically connected to the first terminal of the sixth voltage divider resistor R33.

[0117] The first terminal of the first voltage-regulating resistor R32 is electrically connected to the gate of the second switching transistor T2, and the second terminal of the first voltage-regulating resistor R32 is electrically connected to one of the source and drain terminals of the second switching transistor T2. The first terminal of the third voltage-regulating capacitor C31 is electrically connected to the gate of the second switching transistor T2, and the second terminal of the third voltage-regulating capacitor C31 is electrically connected to one of the source and drain terminals of the second switching transistor T2.

[0118] The second terminal of the sixth voltage divider resistor R33 is electrically connected to the gate of the third switching transistor T3. One of the source and drain of the third switching transistor T3 is electrically connected to the first heating drive voltage terminal Ven1, and the other of the source and drain of the third switching transistor T3 is electrically connected to the heating module 40. Specifically, the first heating drive voltage provided by the first heating drive voltage terminal Ven1 is 28V.

[0119] The first terminal of the second voltage-regulating resistor R34 is electrically connected to the first heating drive voltage terminal Ven1, and the second terminal of the second voltage-regulating resistor R34 is electrically connected to the gate of the third switching transistor T3. The first terminal of the fourth voltage-regulating capacitor C32 is electrically connected to the first heating drive voltage terminal Ven1, and the second terminal of the fourth voltage-regulating capacitor C32 is electrically connected to the gate of the third switching transistor T3.

[0120] The heating control module 30 may further include a Zener diode D1. The positive terminal of the Zener diode D1 is electrically connected to the gate of the third switching transistor T3, and the negative terminal of the Zener diode D1 is electrically connected to the first heating drive voltage terminal Ven1.

[0121] The heating module 40 includes a circuit heating plate. The positive terminal of the circuit heating plate is electrically connected to the other of the source and drain terminals of the third switching transistor T3, and the negative terminal of the circuit heating plate is electrically connected to the ground terminal.

[0122] In one embodiment provided in this application, please refer to Figure 10 , Figure 10 This is a schematic diagram of the ninth structure of the heating control circuit provided in an embodiment of the present invention. (See attached diagram.) Figure 10 As shown, the difference between this embodiment and the previous embodiment is that the heating control circuit 100 provided in this embodiment also includes a microprocessor module 60.

[0123] The microprocessor module 60 is electrically connected to both the temperature judgment module 20 and the heating module 40. The microprocessor module 60 can provide a second heating drive voltage to the heating module 40 based on the second real-time voltage provided by the temperature judgment module 20, thereby enabling the heating module 40 to perform heating based on the second heating drive voltage.

[0124] Specifically, the microprocessor module 60 includes at least one microprocessor chip (MCU), which carries a matching algorithm to control the operating state of the heating module 40 based on the acquired second real-time voltage. Therefore, the heating control circuit 100 provided in this embodiment contains both hardware logic judgment circuits and software logic judgment circuits.

[0125] It is worth mentioning that the microprocessor module 60 can also convert the received second real-time voltage into a first real-time temperature according to the corresponding algorithm, and store the second real-time voltage and the corresponding first real-time temperature.

[0126] It is important to emphasize that the microprocessor chip itself has certain requirements for ambient temperature. Specifically, when the ambient temperature of the microprocessor chip is lower than its operating temperature, the microprocessor chip cannot control the heating module 40 to heat. Therefore, the heating control circuit 100 provided in this embodiment can still control the heating module 40 to heat even when the microprocessor chip is unable to operate. Thus, it combines hardware logic judgment circuitry with software logic judgment circuitry, achieving a complementary effect. It can replace the development or use of microprocessor chips that meet low-temperature operating requirements, reducing the production cost of the heating control circuit.

[0127] In one embodiment provided in this application, please refer to Figure 11 , Figure 11This is a schematic diagram of the tenth structure of the heating control circuit provided in an embodiment of the present invention. For example... Figure 11 As shown, the difference between this embodiment and the previous embodiment is that the heating control circuit 100 provided in this embodiment also includes a second temperature sampling module 70.

[0128] The second temperature acquisition module 70 is electrically connected to the microprocessor module 60. The second temperature acquisition module 70 can detect the temperature of a specific object and output a fourth real-time voltage to the microprocessor module 60 based on the detected temperature. That is, the fourth real-time voltage changes based on the real-time temperature. The specific object can be a battery or a circuit board of a battery management system.

[0129] Specifically, the second temperature acquisition module 70 may include one of the following temperature acquisition elements: a thermistor, a resistance temperature detector, or an integrated circuit temperature sensor. The specific temperature acquisition element of the second temperature acquisition module 70 can be selected according to actual needs.

[0130] Therefore, the microprocessor module 60 can also convert the received fourth real-time voltage into a second real-time temperature according to the corresponding algorithm, and store the fourth real-time voltage and the corresponding second real-time temperature.

[0131] In the heating control circuit 100 provided in this embodiment, one of the first temperature sampling module 10 and the second temperature sampling module 70 can be placed on the battery to detect the battery's temperature environment and ensure that the battery can work normally even in low-temperature environments. Simultaneously, the other of the first temperature sampling module 10 and the second temperature sampling module 70 can be placed on the circuit board to detect the circuit board's temperature environment and ensure that the circuit board can work normally in low-temperature environments. Therefore, heating of both the battery and the circuit board can be controlled in low-temperature environments.

[0132] In one embodiment provided in this application, please refer to Figure 12 , Figure 12 This is an eleventh structural schematic diagram of the heating control circuit provided in an embodiment of the present invention. Figure 12 As shown, the difference between this embodiment and the previous embodiment is that the heating control circuit 100 provided in this embodiment also includes a communication module 80.

[0133] The communication module 80 is electrically connected to the microprocessor module 60. The communication module 80 is used to exchange information with the outside world based on the second real-time voltage and the fourth real-time voltage acquired by the microprocessor module 60. It should be understood that the communication module 80 acts as an interaction medium connecting the microprocessor module 60 and the outside world. Specifically, the communication module 80 can exchange information with the outside world using the second real-time voltage, the fourth real-time voltage, the first real-time temperature of the first temperature sampling module 10, and the second real-time temperature of the second temperature sampling module 70 acquired by the microprocessor module 60. Specifically, the communication module 80 may include a SIT3490 chip.

[0134] In one embodiment provided in this application, please refer to Figure 13 , Figure 13 This is a schematic diagram of the twelfth structural embodiment of the heating control circuit provided by the present invention. Figure 13 As shown, the difference between this embodiment and the previous embodiment is that the heating control circuit 100 provided in this embodiment also includes a power supply module 90.

[0135] The power supply module 90 is electrically connected to the first temperature acquisition module 10, the temperature judgment module 20, the reference voltage terminal Vref, the first heating drive voltage terminal Ven1, the microprocessor module 60, the second temperature acquisition module 70, and the communication module 80. The power supply module 90 provides corresponding voltages to the first temperature acquisition module 10, the temperature judgment module 20, the reference voltage terminal Vref, the first heating drive voltage terminal Ven1, the microprocessor module 60, the second temperature acquisition module 70, and the communication module 80. The microprocessor module 60 can also obtain the voltage parameters of the power supply module 90 and exchange information with the outside world through the communication module 80.

[0136] This application also provides a battery pack, which includes the heating control circuit 100 described in any of the foregoing embodiments and a battery body. In this embodiment, the heating control circuit 100 controls the heating of the battery body to ensure that the battery body operates normally in a low-temperature environment.

[0137] The embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A heating control circuit, characterized in that, include: The first temperature acquisition module is used to output a first real-time voltage, which varies based on the real-time temperature change; A temperature judgment module is electrically connected to the first temperature acquisition module and the reference voltage terminal, and the temperature judgment module is used to output a second real-time voltage based on the first real-time voltage and the reference voltage output by the reference voltage terminal. An oscillation suppression module is electrically connected to both the first temperature acquisition module and the temperature judgment module. The oscillation suppression module is used to adjust the first real-time voltage based on the second real-time voltage. The oscillation suppression module includes a switching unit and a voltage divider unit. The switching unit is connected to the temperature judgment module, the voltage divider unit and ground. The voltage divider unit is connected to the first temperature acquisition module. When the second real-time voltage is high, the switching unit is turned on and the voltage divider unit is connected to ground to reduce the first real-time voltage. A heating control module is electrically connected to the temperature judgment module and the first heating drive voltage terminal, respectively. The heating control module is used to output the first heating drive voltage provided by the first heating drive voltage terminal based on the second real-time voltage. A heating module is electrically connected to the heating control module, and the heating module is used to perform heating based on the first heating drive voltage.

2. The heating control circuit according to claim 1, characterized in that, The first temperature acquisition module includes a first temperature-sensitive unit and a first sampling unit; The first end of the first temperature-sensitive unit is electrically connected to the first power supply end, and the second end of the first temperature-sensitive unit is electrically connected to the temperature judgment module, the first end of the first sampling unit, and the oscillation suppression module, respectively; the first temperature-sensitive unit is used to detect the real-time temperature change. The second end of the first sampling unit is electrically connected to the ground end, and the first sampling unit is used to output a first real-time voltage based on the change of the real-time temperature.

3. The heating control circuit according to claim 1, characterized in that, The temperature determination module includes a comparator; The first input terminal of the comparator is electrically connected to the reference voltage terminal, the second input terminal of the comparator is electrically connected to the first temperature acquisition module, and the output terminal of the comparator is electrically connected to the heating control module.

4. The heating control circuit according to claim 1, characterized in that, The oscillation suppression module also includes a second sampling unit; The second sampling unit is electrically connected to the temperature judgment module, the switching unit and the grounding terminal respectively. The second sampling unit is used to collect the second real-time voltage and output a third real-time voltage to the switching unit based on the second real-time voltage. The switching unit is electrically connected to the voltage divider unit and the first temperature acquisition module respectively. The switching unit is used to control the on / off state of the voltage divider unit based on the third real-time voltage. The voltage divider unit is electrically connected to the first temperature acquisition module, and the voltage divider unit is used to adjust the first real-time voltage.

5. The heating control circuit according to claim 4, characterized in that, The second sampling unit includes a first sampling resistor, a second sampling resistor, and a first capacitor; The first end of the first sampling resistor is electrically connected to the temperature judgment module, and the second end of the first sampling resistor is electrically connected to the first end of the second sampling resistor and the switching unit, respectively. The second terminal of the second sampling resistor is electrically connected to the ground terminal; The first terminal of the first capacitor is electrically connected to the first terminal of the second sampling resistor, and the second terminal of the first capacitor is electrically connected to the second terminal of the second sampling resistor.

6. The heating control circuit according to claim 4, characterized in that, The switching unit includes a first switching transistor; The gate of the first switching transistor is electrically connected to the second sampling unit, one of the source and drain of the first switching transistor is electrically connected to the voltage divider unit, and the other of the source and drain of the first switching transistor is electrically connected to the first temperature acquisition module.

7. The heating control circuit according to claim 4, characterized in that, The voltage divider unit includes at least one voltage divider resistor; The first end of the voltage divider resistor is electrically connected to the first temperature acquisition module, and the second end of the voltage divider resistor is electrically connected to the switching unit.

8. The heating control circuit according to claim 1, characterized in that, The heating control module includes a second switching transistor and a third switching transistor; The gate of the second switch is electrically connected to the temperature judgment module, one of the source and drain of the second switch is electrically connected to the ground terminal, and the other of the source and drain of the second switch is electrically connected to the gate of the third switch. One of the source and drain of the third switching transistor is electrically connected to the first heating drive voltage terminal, and the other of the source and drain of the third switching transistor is electrically connected to the heating module.

9. The heating control circuit according to any one of claims 1-8, characterized in that, The heating control circuit also includes a microprocessor module; The microprocessor module is electrically connected to the heating control module and the heating module respectively. The microprocessor module is used to provide a second heating drive voltage to the heating module based on the second real-time voltage. The heating module heats the object based on the second heating drive voltage.

10. The heating control circuit according to claim 9, characterized in that, The heating control circuit also includes a second temperature acquisition module; The second temperature acquisition module is electrically connected to the microprocessor module. The second temperature acquisition module is used to output a fourth real-time voltage, which varies based on the real-time temperature. The microprocessor module provides the second heating drive voltage to the heating module based on the fourth real-time voltage.

11. The heating control circuit according to claim 10, characterized in that, The heating control circuit also includes a communication module; The communication module is electrically connected to the microprocessor module, and the communication module is used to interact with the outside world based on the second real-time voltage and the fourth real-time voltage.

12. The heating control circuit according to any one of claims 1-8, characterized in that, The heating control circuit also includes a power supply module; The power supply module is electrically connected to the first temperature acquisition module, the temperature judgment module, the reference voltage terminal, and the first heating drive voltage terminal, respectively. The power supply module is used to provide corresponding voltages to the first temperature acquisition module, the temperature judgment module, the reference voltage terminal, and the first heating drive voltage terminal, respectively.

13. A battery pack, characterized in that, It includes the battery body and the heating control circuit as described in any one of claims 1-12.

Citation Information

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