Spacecraft carries the uniform heat storage integration sar antenna active mounting plate

Abstract

The application provides a spacecraft load-uniform temperature-heat storage integrated SAR antenna active mounting plate, which is integrally manufactured by using a laser selective melting additive manufacturing process; the spacecraft load-uniform temperature-heat storage integrated SAR antenna active mounting plate comprises a cavity, a mounting hole embedded part, a space three-dimensional lattice network sandwich structure, a plurality of working medium filling holes and a plurality of heat pipes; an array unit of the space three-dimensional lattice network sandwich structure is a regular dodecahedron configuration; the space three-dimensional lattice network sandwich structure is filled and arranged in the remaining space in the cavity except the heat pipes and the mounting hole embedded part; the spacecraft load-uniform temperature-heat storage integrated SAR antenna active mounting plate is integrally manufactured by using the laser selective melting additive manufacturing process, has no welding points and adhesive points, and avoids the disadvantages of low connection strength, easy leakage of working medium and the like caused by possible quality defects of the welding points and the adhesive points.

Description

Technical Field

[0001] This invention relates to the field of mechanical design and manufacturing technology, specifically to an active mounting plate for a spacecraft-integrated SAR antenna that combines load-bearing, temperature equalization, and heat storage, particularly to an active mounting plate for a spacecraft-integrated SAR antenna that is highly efficient for laser additive manufacturing. Background Technology

[0002] Satellite SAR antennas and other payloads are characterized by short-duration, high-power operation and periodic operation. They often employ phase change energy storage devices with metallic shells, utilizing the near-isothermal properties of paraffin phase change materials (PCMs) during melting and solidification to achieve relative temperature control of the payload. However, traditional PCMs suffer from inherently low thermal conductivity and poor temperature uniformity when used over large areas. Furthermore, traditional manufacturing processes limit the design of heat transfer fins in conventional PCMs, resulting in insufficient heat transfer enhancement efficiency. This leads to slow melting rates and uneven heat storage of low-thermal-conductivity PCMs, potentially causing overheating of the payload's thermal control surface. Increasing the number of heat transfer fins, on the other hand, results in excessive weight for the PCM, failing to meet the satellite's lightweight design requirements.

[0003] The new generation of SAR satellites has seen a multiple-fold improvement in payload ratio, power, and detection accuracy, which places high demands on the temperature control and temperature consistency of distributed high-power distributed devices in SAR antenna arrays, and also requires lightweight and efficient thermal control for SAR antenna active mounting boards. To address these two significant challenges, a composite adhesive-bonded SAR antenna active mounting plate has been developed. This design employs a sandwich structure, consisting of an upper and lower cover plate molded from carbon fiber composite materials, and multiple components bonded together, including a high thermal conductivity carbon-based composite phase change material, aluminum alloy mounting hole embeddings, and reinforcing ribs. The high thermal conductivity carbon-based composite phase change material is formed by filling and encapsulating porous foamed carbon thermal conductive carriers and paraffin phase change material under vacuum conditions. This design achieves relative temperature control of the high heat dissipation unit and TR components during intermittent operation through the enhanced thermal conductivity of the porous foamed carbon material and the heat storage / release of the paraffin phase change material, while also meeting lightweight requirements. However, this design has two drawbacks: first, the heat transfer components are mainly assembled by adhesive bonding, resulting in multiple thermal interfaces and high thermal resistance; second, multiple mounting hole embeddings are assembled to the shell by adhesive bonding, leading to multiple points of working fluid leakage after high and low temperature cycling. Another option is to assemble the sandwich structure, and then use aluminum alloy materials to machine the upper and lower cover plates, mounting hole columns, reinforcing ribs and other shell components, and assemble them with high thermal conductivity carbon-based composite phase change material. Then, they are connected into one piece by low temperature welding. However, this option has drawbacks such as low low temperature welding connection strength, many weld points, and easy leakage of working fluid. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide an active mounting plate for a spacecraft-integrated SAR antenna that combines temperature equalization and thermal storage.

[0005] According to the present invention, an active mounting plate for a spacecraft-borne, temperature-equalizing, and heat-storage integrated SAR antenna is manufactured in an integrated manner using a laser selective melting additive manufacturing process.

[0006] The spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate includes a cavity, mounting hole embedded parts, a three-dimensional spatial lattice network sandwich structure, multiple working fluid filling holes, and multiple heat pipes.

[0007] The heat pipe, mounting hole embedded parts, and spatial three-dimensional lattice network sandwich structure are all arranged inside the cavity;

[0008] The working fluid filling hole is the inlet of the heat pipe; the working fluid filling hole is located on the side wall of the cavity;

[0009] The three-dimensional lattice network sandwich structure is an array structure, and the array unit of the three-dimensional lattice network sandwich structure is a regular dodecahedral configuration;

[0010] The spatial three-dimensional lattice network sandwich structure is filled and arranged in the remaining space inside the cavity, except for the heat pipes and mounting hole embedded parts; the height of the dodecahedral configuration is equal to the height of the cavity.

[0011] Preferably, the dodecahedral configuration is a dodecahedral configuration composed of multiple rod structures, and each of the four faces (top, bottom, left, and right) of the dodecahedral configuration is provided with two extension rod structures; the rod diameter of the structure is 0.5mm to 0.7mm.

[0012] Preferably, the heat pipe is filled with liquid ammonia as the working fluid; the space inside the cavity other than the heat pipe is filled with paraffin as the heat storage working fluid.

[0013] Preferably, the active mounting plate of the spacecraft-borne-uniform-thermal storage integrated SAR antenna is made of aluminum alloy or magnesium alloy.

[0014] Preferably, the wall thickness of the cavity is 0.5mm to 0.7mm; the inner cavity height is 5mm to 6mm.

[0015] Preferably, the wall thickness of the column in the mounting hole embedded part is 1.8mm to 2.5mm.

[0016] Preferably, the heat pipe layout meets the following requirements:

[0017] The spacing between heat pipes in the non-localized heat flow heat source area within the active mounting plate is designed to be 100mm to 180mm.

[0018] The specific spacing value can be determined based on the positional constraints of the embedded parts in the mounting holes within the plate. Based on this, combined with the width of the active mounting plate, the number of heat pipes that need to be arranged within the plate can be calculated.

[0019] Considering the constraints of the overhang angle in additive manufacturing, a meandering heat pipe route design and a shared sidewall design between heat pipes are adopted to ensure that each heat pipe in the plate is thermally coupled with a local high heat flux heat source area. Through the gas-liquid phase change heat transfer of the liquid working fluid in the pipe, the heat of the local high power heat source is transported relatively throughout the plate to achieve a uniform temperature effect.

[0020] Preferably, the angle between the heat pipe axis and the length direction of the SAR antenna active mounting plate is less than 45°.

[0021] Preferably, the capillary wick channel cross-section of the heat pipe is dovetail-shaped; the radius of the central hole of the heat pipe cross-section is 1.2mm to 1.5mm; the capillary length of the dovetail-shaped capillary wick channel of the heat pipe is 0.5mm to 0.6mm, the capillary width is 0.2mm to 0.3mm, the dovetail width is 0.8mm to 1.1mm, and the dovetail angle is 55° to 65°; the minimum wall thickness of the heat pipe is 0.5mm to 0.8mm.

[0022] Preferably, the working fluid filling hole includes a solid-liquid phase change working fluid filling hole and a gas-liquid phase change working fluid filling hole. The diameter of the solid-liquid phase change working fluid filling hole is 5 mm, and the shape of the gas-liquid phase change working fluid filling hole is consistent with the central hole of the heat pipe cross-section.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. This invention is manufactured in one piece using laser selective melting additive manufacturing process, without welding points or adhesive joints. This overcomes the disadvantages of high interface thermal resistance in adhesive joints and avoids the drawbacks of low connection strength and easy leakage of working fluid caused by potential quality defects in welding points and adhesive joints.

[0025] 2. This invention designs a dovetail-shaped capillary heat pipe, which greatly improves the capillary suction force and working fluid transport characteristics, and realizes the maximum heat transfer capacity under the constraint of a narrow space. At the same time, through the layout design of the heat pipe and gas-liquid phase change heat transfer, the heat of the local high-power heat source is transported throughout the plate, achieving the effect of uniform temperature of the whole plate.

[0026] 3. The cavity of the present invention is filled with paraffin heat storage medium in the space other than the heat pipe. The three-dimensional lattice network sandwich structure realizes the load-bearing function and the thermal conductivity enhancement function of the paraffin solid-liquid phase change process, so as to achieve the load-bearing and uniform heat storage effect. Attached Figure Description

[0027] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0028] Figure 1 This is a schematic diagram of the front-side array distributed device arrangement in the working state of the present invention;

[0029] Figure 2 This is a schematic diagram of the arrangement of high-power electronic devices on the back side during the operation of this invention.

[0030] Figure 3 This is a three-dimensional schematic diagram of the present invention;

[0031] Figure 4 for Figure 4 3D schematic diagram of the cross-section along the AA direction;

[0032] Figure 5 This is a three-dimensional schematic diagram of the three-dimensional configuration of the load-bearing and thermally conductive enhanced skeleton array unit in this invention;

[0033] Figure 6 This is a three-dimensional schematic diagram of the heat pipe layout in this invention.

[0034] The diagram shows:

[0035] Detailed Implementation

[0036] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0037] This invention provides an active mounting plate for a spacecraft-integrated SAR antenna that combines load-bearing, temperature equalization, and heat storage, such as... Figure 1-6 As shown, the symbols represent the following meanings: t1 - cavity wall thickness; t2 - minimum wall thickness of the heat pipe; t3 - length of the heat pipe capillary segment; S - spacing of the micro heat pipe layout in the non-local high heat flux region; L - cavity height; d1 - width of the heat pipe capillary segment; d2 - width of the heat pipe dovetail segment; α - included angle of the heat pipe dovetail segment; t4 - diameter of the dodecahedron rod; t4 - wall thickness of the mounting hole embedded column.

[0038] The active mounting plate of the spacecraft-borne-uniform-thermal storage integrated SAR antenna is made of aluminum alloy or magnesium alloy, and the active mounting plate of the spacecraft-borne-uniform-thermal storage integrated SAR antenna is manufactured in one piece using laser selective melting additive manufacturing process.

[0039] The spacecraft-integrated SAR antenna active mounting plate includes a cavity, mounting hole embedded parts 6, a spatial three-dimensional lattice network sandwich structure, multiple working fluid filling holes, and multiple heat pipes 4. The heat pipes 4, mounting hole embedded parts 6, and spatial three-dimensional lattice network sandwich structure are all arranged within the cavity, specifically between the upper and lower walls of the cavity. The working fluid filling holes are the inlets of the heat pipes 4; the working fluid filling holes are located on the side walls of the cavity; the spatial three-dimensional lattice network sandwich structure is an array structure, and the array unit of the spatial three-dimensional lattice network sandwich structure is a three-dimensional configuration 7 of a load-bearing and thermally conductive enhanced skeleton array unit. The three-dimensional configuration 7 of the load-bearing and thermally conductive enhanced skeleton array unit is a regular dodecahedral configuration, that is, in this preferred embodiment, the spatial three-dimensional lattice network sandwich structure is a regular dodecahedral configuration load-bearing and thermally conductive enhanced skeleton 5. In a preferred embodiment, the regular dodecahedral configuration is a hollow structure. The spatial three-dimensional lattice network sandwich structure fills the remaining space within the cavity, excluding the heat pipe 4 and the mounting hole embedded part 6; that is, the dodecahedral array fills the remaining space within the cavity, excluding the heat pipe and the mounting hole embedded part. The height of the dodecahedral array is equal to the height of the cavity. In a preferred embodiment, the mounting hole embedded part 6 is a cylindrical structure with internal threaded holes.

[0040] In a preferred embodiment, the active mounting plate of the spacecraft-borne-equalizing-thermal storage integrated SAR antenna also has cable bundle vias.

[0041] In a preferred embodiment, the cavity is a thin-walled cavity with a wall thickness of 0.5 mm to 0.7 mm; the inner height of the cavity is 5 mm to 6 mm. The mounting hole embedding 6 is used to mount electronic equipment, and the wall thickness of the column in the mounting hole embedding 6 is 1.8 mm to 2.5 mm.

[0042] The working fluid filling holes include a solid-liquid phase change working fluid filling hole 1 and a gas-liquid phase change working fluid filling hole 2. The solid-liquid phase change working fluid filling hole has a diameter of 5 mm and also serves as an additive manufacturing powder cleaning hole. The gas-liquid phase change working fluid filling hole 2 has the same shape as the center hole of the heat pipe cross-section.

[0043] The dodecahedral configuration is a dodecahedral configuration composed of multiple rod structures, and each of the four faces (top, bottom, left, and right) of any dodecahedral configuration has two extension rod structures; the rod diameter of the structure is 0.5mm to 0.7mm.

[0044] The heat pipe layout meets the following requirements: the spacing between heat pipes within the non-localized heat flow source area of ​​the active mounting plate is designed to be 100mm to 180mm. Specifically, the non-localized heat flow source area refers to a non-localized high heat flow source area. The specific spacing value of the heat pipes can be determined based on constraints such as the position of the embedded parts in the mounting holes within the plate. Based on this, combined with the width of the active mounting plate, the number of micro-heat pipes that need to be arranged within the plate is calculated. On this basis, methods such as a meandering route design for the micro-heat pipes and a shared sidewall design between heat pipes are adopted to ensure that each heat pipe within the plate forms a thermal coupling with a localized heat flow source area. Specifically, the localized heat flow source area refers to a localized high heat flow source area. Heat transfer through the gas-liquid phase change of the liquid working fluid within the pipe achieves relative transport of heat from the localized high-power heat source throughout the plate, achieving a uniform temperature effect. Each heat pipe forms a thermal coupling with a localized high heat flow source area.

[0045] The angle between the axis of the heat pipe 4 and the length direction of the SAR antenna active mounting plate is less than 45°.

[0046] The capillary wick channel of the heat pipe 4 has a dovetail-shaped cross-section; in a preferred embodiment, the heat pipe 4 is a micro heat pipe, and the radius of the central hole of the heat pipe 4 cross-section is 1.2mm to 1.5mm; the capillary length of the dovetail-shaped capillary wick channel of the heat pipe 4 is 0.5mm to 0.6mm, the capillary width is 0.2mm to 0.3mm, the dovetail width is 0.8mm to 1.1mm, and the dovetail angle is 55° to 65°; the minimum wall thickness of the heat pipe is 0.5mm to 0.8mm.

[0047] The heat pipe 4 is filled with liquid ammonia working fluid. Through the layout design of the heat pipe and the gas-liquid phase change heat transfer, it achieves the uniform temperature effect by transporting heat from the local high-power heat source throughout the plate. The space inside the cavity, excluding the heat pipe 4, is filled with paraffin wax heat storage working fluid. The three-dimensional lattice network sandwich structure achieves the load-bearing function and the thermal conductivity enhancement effect of the solid-liquid phase change of paraffin wax, achieving the load-bearing and uniform heat storage effect. The amount of liquid ammonia working fluid filled in the heat pipe 4 is calculated based on the volume of the liquid absorber. After filling, the working fluid filling tube is cut and sealed with cold welding pliers. The amount of paraffin wax heat storage working fluid filled in the cavity is 85% of the cavity volume. After filling, the working fluid filling tube is cut and sealed with cold welding pliers.

[0048] The design and manufacturing process of this invention is as follows:

[0049] Step 1: Complete the design of an active mounting plate for a spacecraft-integrated SAR antenna that combines load-bearing, temperature equalization, and thermal storage.

[0050] Step 2: Perform laser selective melting forming process constraint analysis on the active mounting plate of a spacecraft-integrated SAR antenna carrying-uniform temperature-storage heat storage. Adjust the structural parameters of each feature unit according to the forming direction to meet the free forming conditions.

[0051] Step 3: Using appropriate laser selective melting forming process parameters, an active mounting plate for an integrated SAR antenna that carries, homogenizes, and stores heat in a spacecraft is manufactured.

[0052] Step 4: The heat pipe is filled with liquid ammonia working fluid. The filling amount is calculated based on the volume of the wick. After filling, the working fluid filling tube is cut and sealed with cold welding pliers. The remaining space of the cavity is filled with paraffin working fluid, with a filling amount of 85% of the cavity volume. After filling, the working fluid filling tube is cut and sealed with cold welding pliers.

[0053] like Figure 1-2 As shown, when the spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate is working, it is also necessary to install a distributed high-power T / R module on the front and a high-power power supply module on the back.

[0054] The spacecraft-borne, temperature-equalizing, and heat-storage integrated SAR antenna active mounting plate provided by this invention replaces the original "carbon fiber composite shell + foam carbon reinforced thermal conductive skeleton + aluminum alloy embedded part" glued composite SAR antenna active mounting plate on the satellite. It solves the problems of large interface thermal resistance, multiple leakage points, poor temperature control and temperature equalization effect in local high heat flux areas caused by the glued bonding mode of more than 100 components of the original SAR antenna active mounting plate, and meets the high efficiency temperature equalization and temperature control requirements of the area array uniformly distributed TR component of the SAR antenna for intermittent operation.

[0055] This invention leverages laser additive manufacturing technology to create virtually any complex shape, offering significant design freedom. Furthermore, it boasts advantages such as lightweight design, uniform heat storage across the entire plate, high temperature control precision, excellent temperature uniformity, strong load-bearing capacity, no leakage risks associated with multi-point bonding / welding, and high reliability. It is well-suited for meeting the high-precision temperature uniformity requirements of next-generation spacecraft's SAR antennas, particularly for high-power electronic equipment and distributed array devices. In addition, this invention addresses the shortcomings of conventional satellite thermal control methods in terms of heat uniformity, heat storage, and temperature control; the susceptibility to working fluid leakage and low reliability associated with traditional bonding / welding manufacturing methods; and the inability to meet the efficient temperature uniformity and control requirements of next-generation space-based distributed high heat flux density devices.

[0056] This invention proposes an integrated active mounting plate for spacecraft SAR antennas, combining load-bearing, temperature equalization, and heat storage. This replaces the original adhesive / welded composite SAR antenna active mounting plate solution, solving problems such as high interface thermal resistance, multiple leakage points, poor temperature control and equalization in localized high-heat-flux areas, and issues arising from the adhesive / welded method with over a hundred components in the original solution. It offers advantages such as lightweight design, uniform heat storage across the entire plate, high temperature control accuracy, excellent temperature equalization, good load-bearing capacity, no leakage risk associated with multi-point adhesive / welding, and high reliability. It is suitable for next-generation spacecraft, meeting the high-precision temperature equalization and control requirements between high-power electronic devices and distributed array components in the SAR antenna. This invention has broad application prospects in the aerospace field and can also be extended to other industries with similar needs, offering considerable economic benefits.

[0057] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0058] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An active mounting plate for a spacecraft-integrated SAR antenna that combines temperature equalization and thermal storage, characterized in that, The active mounting plate of the spacecraft-borne-uniform-thermal storage integrated SAR antenna is manufactured in one piece using laser selective melting additive manufacturing process. The spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate includes a cavity, mounting hole embedded parts (6), a spatial three-dimensional lattice network sandwich structure, multiple working fluid filling holes, and multiple heat pipes (4). The heat pipe (4), the mounting hole embedded part (6), and the spatial three-dimensional lattice network sandwich structure are all arranged in the cavity; The working fluid filling hole is the inlet of the heat pipe (4); the working fluid filling hole is located on the side wall of the cavity; The three-dimensional lattice network sandwich structure is an array structure, and the array unit of the three-dimensional lattice network sandwich structure is a regular dodecahedral configuration; The spatial three-dimensional lattice network sandwich structure is filled and arranged in the remaining space of the cavity except for the heat pipe (4) and the mounting hole embedded part (6); the height of the dodecahedral configuration is equal to the height of the cavity. The heat pipe (4) is filled with liquid ammonia working fluid; the space inside the cavity other than the heat pipe (4) is filled with paraffin heat storage working fluid. The heat pipe layout must meet the following requirements: The spacing between heat pipes in the non-localized heat flow heat source area within the active mounting plate is designed to be 100mm~180mm. The specific spacing value can be determined according to the position constraints of the mounting hole embedded part (6) in the plate. Based on this, combined with the width of the active mounting plate, the number of heat pipes (4) that need to be arranged in the plate can be calculated. By adopting a meandering heat pipe route design and a shared sidewall design between heat pipes, it is ensured that each heat pipe in the plate is thermally coupled with a local high heat flux heat source area. Through the gas-liquid phase change heat transfer of the liquid working fluid in the pipe, the heat of the local high power heat source is transported relatively throughout the plate, achieving a uniform temperature effect.

2. The spacecraft-borne-temperature-equalization-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The dodecahedral configuration is a dodecahedral structure composed of multiple rods, and each of the four faces (top, bottom, left, and right) of the dodecahedral configuration has two extension rods; the diameter of the rods is 0.5mm to 0.7mm.

3. The spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The active mounting plate of the spacecraft-borne-uniform-thermal storage integrated SAR antenna is made of aluminum alloy or magnesium alloy.

4. The spacecraft-borne-temperature-equalization-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The wall thickness of the cavity is 0.5mm to 0.7mm; the inner cavity height is 5mm to 6mm.

5. The spacecraft-borne-temperature-equalization-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The wall thickness of the column in the mounting hole embedded part (6) is 1.8mm~2.5mm.

6. The spacecraft-borne-temperature-equalization-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The angle between the axis of the heat pipe (4) and the length direction of the active mounting plate of the SAR antenna is less than 45°.

7. The spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate according to claim 2, characterized in that, The capillary wick channel of the heat pipe (4) has a dovetail-shaped cross-section; the radius of the central hole of the heat pipe (4) is 1.2mm~1.5mm; the capillary length of the dovetail-shaped capillary wick channel of the heat pipe (4) is 0.5mm~0.6mm, the capillary width is 0.2mm~0.3mm, the dovetail width is 0.8mm~1.1mm, and the dovetail angle is 55°~65°; the minimum wall thickness of the heat pipe is 0.5mm~0.8mm.

8. The spacecraft-borne-uniform-thermal storage integrated SAR antenna active mounting plate according to claim 1, characterized in that, The working fluid filling hole includes a solid-liquid phase change working fluid filling hole (1) and a gas-liquid phase change working fluid filling hole (2). The diameter of the solid-liquid phase change working fluid filling hole is 5 mm, and the shape of the gas-liquid phase change working fluid filling hole (2) is consistent with the center hole of the heat pipe cross section.

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