Microphone unit and electronic equipment

Abstract

This invention discloses a microphone unit and an electronic device. The microphone unit includes a microphone substrate, a housing, a MEMS chip, conductive pads, and sacrificial pads. The microphone substrate has a sound hole. The housing covers one side of the microphone substrate and together with the microphone substrate forms a receiving cavity. The MEMS chip is connected to one side of the microphone substrate and located within the receiving cavity. The conductive pads are located on the side of the microphone substrate opposite to the MEMS chip. The sacrificial pads are closed in shape, and their projection on the microphone substrate surrounds the sound hole, while the conductive pads are located outside the area enclosed by the sacrificial pads. This invention's technical solution, by providing a closed-shaped sacrificial pad on the microphone substrate, with the sacrificial pad surrounding the sound hole and the conductive pad located outside the area enclosed by the sacrificial pad, ensures that water entering through the sound hole first contacts the sacrificial pad, reducing the risk of corrosion of the conductive pad and guaranteeing a strong weld.

Description

Technical Field

[0001] This invention relates to the field of electronic devices, and in particular to a microphone unit and an electronic device using the microphone unit. Background Technology

[0002] Existing MEMS microphone units are typically waterproofed by placing a waterproof membrane or mesh on the inside or outside of the microphone's acoustic aperture. However, in microphone units with a bottom-mounted acoustic aperture, the acoustic aperture and mounting pads are on the same side. While bottom-mounted waterproof microphone units may pass waterproofing tests, in actual use, the conductive pads around the acoustic aperture (usually signal ground pads) and the microphone substrate at the aperture will come into contact with external liquids. Therefore, over time, this can lead to corrosion of the conductive pads and moisture absorption by the microphone substrate, resulting in poor soldering quality of the ground pads. Summary of the Invention

[0003] The main objective of this invention is to propose a microphone unit that aims to improve the poor soldering quality of conductive pads caused by corrosion of conductive pads or moisture absorption by the microphone substrate.

[0004] To achieve the above objectives, the present invention proposes a microphone unit comprising a microphone substrate, a housing, a MEMS chip, conductive pads, and sacrificial pads; the microphone substrate has a sound hole; the housing covers one side of the microphone substrate and together with the microphone substrate forms a receiving cavity; the MEMS chip is connected to one side of the microphone substrate and is located within the receiving cavity; the conductive pads are located on the side of the microphone substrate opposite to the MEMS chip; the sacrificial pads are closed in shape, and the projection of the sacrificial pads on the microphone substrate surrounds the sound hole, while the conductive pads are located outside the area enclosed by the sacrificial pads.

[0005] Optionally, the conductive pad has a closed shape, the conductive pad surrounds the sacrificial pad, and is spaced apart from the sacrificial pad;

[0006] Alternatively, the conductive pad includes a plurality of spaced-apart arc segments that surround the sacrificial pad and are spaced apart from it.

[0007] Alternatively, the conductive pads may be dot-shaped and spaced apart from the sacrificial pads.

[0008] Optionally, a portion of the sacrificial pad adjacent to the conductive pad is connected to the conductive pad;

[0009] And / or, the sacrificial pads are provided in at least two, the at least two sacrificial pads are arranged concentrically, and adjacent sacrificial pads are spaced apart or partially connected.

[0010] Optionally, the sacrificial pad and the conductive pad are isolated from each other.

[0011] Optionally, a waterproof ring is provided between the sacrificial pad and the conductive pad;

[0012] And / or, a waterproof ring is provided within the area enclosed by the sacrificial pad.

[0013] Optionally, the microphone substrate is further provided with a first waterproof coating on the side where the sacrificial pad is provided, and the projection of the first waterproof coating on the microphone substrate falls into the area enclosed by the projection of the sacrificial pad on the microphone substrate.

[0014] And / or, the microphone substrate is further provided with a second waterproof coating on the side opposite to the sacrificial pad.

[0015] Optionally, a first metal layer is further sandwiched between the first waterproof coating and the microphone substrate;

[0016] And / or, a second metal layer is further sandwiched between the second waterproof coating and the microphone substrate;

[0017] And / or, a third metal layer is provided on the inner side of the acoustic hole, and an anti-corrosion coating is provided on the third metal layer.

[0018] Optionally, the first metal layer, the second metal layer, the third metal layer, and the sacrificial pad are integrated into one structure.

[0019] Optionally, the microphone substrate includes:

[0020] The main body portion has an embedded hole, and the conductive pad is disposed on the main body portion; and

[0021] A waterproof insert is provided, wherein the waterproof insert is embedded in the insert hole, the acoustic hole is formed on the waterproof insert, and the sacrificial pad is provided on the waterproof insert.

[0022] The present invention also proposes an electronic device comprising the aforementioned microphone unit.

[0023] The technical solution of this invention facilitates the connection of the microphone unit to the main substrate or other devices in electronic devices using the microphone unit by placing the conductive pad on the side of the microphone substrate away from the MEMS chip. By also providing a closed-shaped sacrificial pad on the side of the microphone substrate away from the MEMS chip, and surrounding the sound hole, while the conductive pad is located outside the area enclosed by the sacrificial pad, water entering through the sound hole will first contact and corrode the sacrificial pad before directly contacting the conductive pad. Therefore, the sacrificial pad isolates external water from the conductive pad, reducing the risk of water corrosion and ensuring the conductive pad maintains strong soldering strength. This improves the reliability of the microphone unit and extends its service life. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the connection structure of a main substrate in a microphone and electronic device according to an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A cross-sectional view of an embodiment at point AA;

[0027] Figure 3 for Figure 1 A cross-sectional view of another embodiment at point AA;

[0028] Figure 4 for Figure 1 A cross-sectional view of another embodiment at point AA;

[0029] Figure 5 for Figure 1 A cross-sectional view of another embodiment at point AA;

[0030] Figure 6 for Figure 1 A cross-sectional view of another embodiment at point AA;

[0031] Figure 7 for Figure 1 A schematic diagram of a local structure in the image;

[0032] Figure 8 This is a schematic diagram of the connection structure of another embodiment of the microphone and main substrate in the electronic device of the present invention;

[0033] Figure 9 for Figure 8 Sectional view at point BB.

[0034] Explanation of icon numbers:

[0035]

[0036]

[0037] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0039] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0040] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0041] This invention proposes a microphone unit 100.

[0042] In the embodiments of the present invention, please refer to the reference. Figures 1 to 9The microphone unit 100 includes a microphone substrate 110, a housing 180, a MEMS chip 190, conductive pads 120, and sacrificial pads 130. The microphone substrate 110 has a sound hole 110a. The housing 180 covers one side of the microphone substrate 110 and together with the microphone substrate 110 forms a receiving cavity. The MEMS chip 190 is connected to one side of the microphone substrate 110 and is located in the receiving cavity. The conductive pads 120 are located on the side of the microphone substrate 110 away from the MEMS chip 190. The sacrificial pads 130 are closed in shape, and the projection of the sacrificial pads 130 on the microphone substrate 110 surrounds the sound hole 110a. The conductive pads 120 are located outside the area enclosed by the sacrificial pads 130.

[0043] The microphone substrate 110 is a circuit board microphone substrate 110. The microphone substrate 110 has a sound hole 110a, so that external sound can enter the receiving cavity formed by the microphone substrate 110 and the housing 180 through the sound hole 110a. The receiving cavity is equipped with a MEMS chip 190. The MEMS chip 190 divides the receiving cavity into a front cavity facing the sound hole 110a and a rear cavity away from the sound hole 110a. The MEMS chip 190 is equipped with a diaphragm. The sound waves transmitted from the sound hole 110a cause the diaphragm to vibrate, so that the MEMS chip 190 transmits the vibration signal of the diaphragm to the circuit board for recognition, amplification, etc. In order to connect the microphone substrate 110 to other components of the microphone unit 100, the side of the microphone substrate 110 away from the MEMS chip 190 is also provided with a conductive pad 120. The conductive pad 120 may include at least one of the following: a ground pad, a signal pad for transmitting signals, or a pad for connecting to power. Normally, the conductive pad 120 near the sound hole 110a is easily corroded by external water, which reduces the soldering strength of the conductive pad 120. In this invention, a sacrificial pad 130 is provided on the side of the microphone substrate 110 away from the MEMS chip 190. The sacrificial pad 130 is arranged around the sound hole 110a, and the conductive pad 120 is located outside the area enclosed by the sacrificial pad 130. Therefore, when external water enters the sound hole 110a and spreads around the sound hole 110a, the water first contacts and corrodes the sacrificial pad 130, thereby achieving a better waterproof effect on the conductive pad 120 and ensuring that the conductive pad 120 still has a relatively stable soldering effect. Furthermore, since the sacrificial pad 130 is soldered using solder paste, a solder ring and a protective layer formed by residual flux are created on the surface of the solder ring. In actual use, this protective layer is the first to be eroded, and it also has a certain degree of water resistance. Therefore, it can more effectively protect the conductive pad 120 located outside the sacrificial pad 130, thereby improving the reliability of the microphone unit 100 and extending its service life. Of course, the sacrificial pad 130 can also be bonded to other components using thermosetting adhesive, for example, the sacrificial pad 130 can be bonded to the main substrate 200 of the electronic device on which the microphone unit 100 is applied using thermosetting adhesive.

[0044] Specifically, one, two, three, or more sacrificial pads 130 can be provided. It is understood that the more sacrificial pads 130 are provided, the better the protection effect on the conductive pads 120. In practice, the number of sacrificial pads 130 can be determined by considering both the size of the microphone substrate 110 and the desired protection effect. When at least two sacrificial pads 130 are provided, adjacent sacrificial pads 130 can be spaced apart or connected by connecting components. The shape of the sacrificial pad 130 can be a closed ring, a closed polygon, a racetrack shape, or other closed irregular shapes. The sacrificial pad 130 can be partially connected to the surrounding conductive pads 120, or it can be isolated from the conductive pads 120.

[0045] The present invention provides a convenient way to connect the microphone unit 100 to the main substrate 200 or other devices in an electronic device using the microphone unit 100 by placing the conductive pad 120 on the side of the microphone substrate 110 away from the MEMS chip 190. Furthermore, by providing a closed-shaped sacrificial pad 130 on the side of the microphone substrate 110 away from the MEMS chip 190, and by surrounding the sound hole 110a with the conductive pad 120 located outside the area enclosed by the sacrificial pad 130, water entering through the sound hole 110a will first contact and corrode the sacrificial pad 130 before directly contacting the conductive pad 120. Therefore, the sacrificial pad 130 can isolate external water from the conductive pad 120, reducing the risk of water corrosion of the conductive pad 120, ensuring that the conductive pad 120 still has strong soldering strength, improving the reliability of the microphone unit 100, and extending its service life.

[0046] As an example, such as Figure 2 , Figure 3 or Figure 6 As shown, the conductive pad 120 has a closed shape, surrounds the sacrificial pad 130, and is spaced apart from the sacrificial pad 130. By also making the conductive pad 120 a closed shape, at least two layers of sealing effect are provided on the substrate to ensure a better acoustic sealing effect.

[0047] As another example, such as Figure 4 As shown, the conductive pad 120 includes a plurality of spaced-apart arc-shaped segments that surround the sacrificial pad 130. Alternatively, as... Figure 5As shown, the conductive pad 120 has a dotted structure. It is understood that since the sacrificial pad 130 provided in this invention can also achieve an acoustic seal, the conductive pad 120 can be a closed shape, or an open or discontinuous shape. In this embodiment, by including multiple spaced arc segments around the sacrificial pad 130 in the conductive pad 120, or by making the conductive pad 120 a dotted structure, it is beneficial to reduce the cost of the conductive pad 120.

[0048] Furthermore, such as Figure 6 As shown, a portion of the sacrificial pad 130 adjacent to the conductive pad 120 is connected to the conductive pad 120.

[0049] By connecting a portion of the adjacent sacrificial pad 130 to the conductive pad 120, the conductive pad 120 and the sacrificial pad 130 are made into a single unit, thereby improving the strength of the soldering.

[0050] Of course, in other embodiments, such as Figure 2 or Figure 3 As shown, the sacrificial pad 130 can also be isolated from the conductive pad 120. This arrangement prevents the sacrificial pad 130 from being connected to the conductive pad 120 after being corroded by water, thus avoiding the risk of the conductive pad 120 being in a conductive state when it is used as a grounding pad, which would otherwise cause noise in the microphone of this invention.

[0051] In one embodiment, at least two sacrificial pads 130 are provided, the at least two sacrificial pads 130 are concentrically arranged, and adjacent sacrificial pads 130 are spaced apart or partially connected.

[0052] By setting at least two sacrificial pads 130, the sacrificial pads 130 provide stronger protection for the conductive pads 120, greatly reducing the risk of poor soldering results due to water corrosion of the conductive pads 120. For example, Figure 5 As shown, adjacent sacrificial pads 130 can be spaced apart to increase the path for external liquid to enter the conductive pad 120. Alternatively, adjacent sacrificial pads 130 can be partially connected to improve the welding strength of the sacrificial pads 130 and reduce the risk of poor welding after water erosion of the sacrificial pads 130. This indirectly reduces the risk of external liquid entering the conductive pads 120 and corroding them.

[0053] As an example, a waterproof ring (not shown) is provided between the sacrificial pad 130 and the conductive pad 120.

[0054] Specifically, the waterproof ring can be a waterproof adhesive or a sealing ring, etc. A waterproof ring is provided between the sacrificial pad 130 and the conductive pad 120, which further prevents water from entering the conductive pad 120 and corroding it.

[0055] As an example, a waterproof ring can also be provided within the area enclosed by the sacrificial pad 130. By providing a waterproof ring within the area enclosed by the sacrificial pad 130, the waterproof ring serves to prevent external water from entering, thereby reducing the risk of water corrosion to the sacrificial pad 130, and thus indirectly providing better protection for the conductive pad 120 and extending its service life.

[0056] As an example, such as Figure 7 As shown, the microphone substrate 110 is provided with a first waterproof coating 141 on the side where the sacrificial pad 130 is provided. The projection of the first waterproof coating 141 on the microphone substrate 110 falls into the area enclosed by the projection of the sacrificial pad 130 on the microphone substrate 110.

[0057] By providing a first waterproof coating 141 on one side of the microphone substrate 110 where the sacrificial pad 130 is located, and ensuring that the projection of the first waterproof coating 141 on the microphone substrate 110 falls within the area enclosed by the projection of the sacrificial pad 130 on the microphone substrate 110, the first waterproof coating 141 first isolates the water entering the sound hole 110a, preventing further corrosion of the sacrificial pad 130. Furthermore, by providing the first waterproof coating 141 on one side of the microphone substrate 110, the first waterproof coating 141 also provides good waterproofing for the microphone substrate 110, reducing the risk of the microphone substrate 110 absorbing moisture and causing the sacrificial pad 130 and / or conductive pad 120 to become loosely soldered.

[0058] It is understandable that, since water may flow outward along the two opposite surfaces of the substrate after entering the sound hole 110a, a second waterproof coating 142 may also be provided on the side of the microphone substrate 110 away from the sacrificial pad 130, so that the second waterproof coating 142 can also provide a good moisture-proof effect for the microphone substrate 110, thereby reducing the risk of the sacrificial pad 130 and / or conductive pad 120 not being firmly soldered.

[0059] Furthermore, such as Figure 7 As shown, a first metal layer 161 is also sandwiched between the first waterproof coating 141 and the microphone substrate 110.

[0060] By sandwiching a first metal layer 161 between the first waterproof coating 141 and the microphone substrate 110, the first metal layer 161 can further prevent moisture from entering the microphone substrate 110 due to the poor water absorption of metal, thereby further improving the microphone's moisture-proof effect. Since the sacrificial pads 130 and conductive pads 120 are also made of metal, they can be disposed in the same layer as the first metal layer 161 to achieve an overall consistency effect. Furthermore, by placing the first metal layer 161 between the first waterproof coating 141 and the microphone substrate 110, the first waterproof coating 141 also has a good waterproof effect on the first metal layer 161, reducing the risk of water corrosion to the first metal layer 161 and ensuring that it can provide better moisture protection for the microphone substrate 110.

[0061] Based on the above-mentioned scheme where a second waterproof coating 142 is provided on the side of the microphone substrate 110 facing away from the sacrificial pad 130, further, as Figure 7 As shown, a second metal layer 162 is also sandwiched between the second waterproof coating 142 and the microphone substrate 110.

[0062] Similarly, by sandwiching a second metal layer 162 between the second waterproof coating 142 and the microphone substrate 110, the second metal layer 162 can further prevent moisture from entering the microphone substrate 110, thereby further improving the microphone's moisture-proof effect. Furthermore, by placing the second metal layer 162 between the second waterproof coating 142 and the microphone substrate 110, the second waterproof coating 142 also provides good waterproofing to the second metal layer 162, reducing the risk of water corrosion to the second metal layer 162 and ensuring that it provides optimal moisture protection for the microphone substrate 110.

[0063] Furthermore, such as Figure 7 As shown, based on the arrangement of the sacrificial pad 130 and the conductive pad 120, a third waterproof coating 143 can also be provided between the sacrificial pad 130 and the conductive pad 120, thereby further improving the waterproof effect of the conductive pad 120 and reducing the risk of the conductive pad 120 not being firmly soldered.

[0064] like Figure 7 As shown, in order to provide better moisture protection for the microphone substrate 110, a third metal layer 163 is provided on the inner side of the sound hole 110a, and an anti-corrosion coating 170 is provided on the third metal layer 163.

[0065] By providing a third metal layer 163 inside the acoustic hole 110a, the third metal layer 163 can provide better waterproofing for the substrate. Since moisture can easily enter through the acoustic hole 110a, providing an anti-corrosion coating 170 on the third metal layer 163 can further reduce the risk of corrosion from moisture. Specifically, to provide better anti-corrosion for the third metal layer 163, the anti-corrosion coating 170 can also be a metal coating with a lower metallic reactivity than the third metal layer 163. For example, if the third metal layer 163 is made of copper, the anti-corrosion coating 170 can be a gold-plated layer.

[0066] Based on the microphone in the invention having the aforementioned first metal layer 161, second metal layer 162, and third metal layer 163, further, as... Figure 7 As shown, in this embodiment, the first metal layer 161, the second metal layer 162, the third metal layer 163, and the sacrificial pad 130 are integrated into a single structure. This arrangement facilitates installation and reduces the number of components. Furthermore, it improves the sealing performance between any two adjacent components of the first metal layer 161, the second metal layer 162, the third metal layer 163, and the sacrificial pad 130, thereby further enhancing the waterproofing effect on the microphone substrate 110. Specifically, the first metal layer 161, the second metal layer 162, the third metal layer 163, and the sacrificial pad 130 can be made of copper, which has good ductility and facilitates their integral molding. Of course, in other embodiments, the first metal layer 161, the second metal layer 162, the third metal layer 163, and the sacrificial pad 130 can also be made of other metals.

[0067] As yet another example, please refer to [reference needed]. Figure 7 and Figure 8 The microphone substrate 110 includes a main body 111 and a waterproof embedding part 112. The main body 111 has an embedding hole and a conductive pad 120 is disposed on the main body 111. The waterproof embedding part 112 is embedded in the embedding hole, a sound hole 110a is formed on the waterproof embedding part 112, and a sacrificial pad 130 is disposed on the waterproof embedding part 112.

[0068] By embedding the waterproof insert 112 into the insertion hole of the main body 111, and with the acoustic hole 110a formed on the waterproof insert 112, water entering the acoustic hole 110a can be blocked by the waterproof insert 112, thereby reducing the risk of moisture absorption by the main body 111 and consequently reducing the risk of poor soldering of the conductive pad 120 provided on the main body 111. Furthermore, by providing the sacrificial pad 130 in the waterproof insert 112, the risk of poor soldering of the sacrificial pad 130 due to moisture absorption by the waterproof insert 112 connected to it can be reduced, thereby indirectly providing a better waterproofing effect on the conductive pad 120. Specifically, the waterproof insert 112 can be made of ceramic or waterproof plastic, etc.

[0069] Furthermore, the main body 111 and the waterproof insert 112 can be bonded together with adhesive, thereby improving the stability of the connection between the main body 111 and the waterproof insert 112 and the good sealing between them.

[0070] The present invention also proposes an electronic device, which includes a microphone unit 100. The specific structure of the microphone unit 100 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The electronic device may also include a main substrate 200, and the microphone unit 100 can be connected to the main substrate 200 through sacrificial pads 130 and conductive pads 120.

[0071] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made under the inventive concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A microphone monobloc, characterized in that, include: A microphone substrate, wherein the microphone substrate is provided with a sound hole; A housing, which covers one side of the microphone substrate and together with the microphone substrate forms a receiving cavity; The MEMS chip is connected to one side of the microphone substrate and located within the receiving cavity; Conductive pads, the conductive pads being disposed on the side of the microphone substrate opposite to the MEMS chip; and The sacrificial pad is closed in shape. The projection of the sacrificial pad on the microphone substrate surrounds the sound hole, and the conductive pad is located outside the area enclosed by the sacrificial pad. The sacrificial pad is used to form a waterproof protective layer for the conductive pad. The microphone substrate includes a main body and a waterproof embedded part. The main body has an embedded hole and the conductive pad is disposed in the main body. The waterproof embedded part is embedded in the embedded hole, the sound hole is opened on the waterproof embedded part, and the sacrificial pad is disposed in the waterproof embedded part.

2. The microphone package of claim 1, wherein, The conductive pad is in a closed shape, and the conductive pad surrounds the sacrificial pad and is spaced apart from the sacrificial pad; Alternatively, the conductive pad includes a plurality of spaced-apart arc segments that surround the sacrificial pad and are spaced apart from it. Alternatively, the conductive pads may be dot-shaped and spaced apart from the sacrificial pads.

3. The microphone package of claim 2, wherein, A portion of the sacrificial pad adjacent to the conductive pad is connected to the conductive pad; And / or, the sacrificial pads are provided in at least two, the at least two sacrificial pads are arranged concentrically, and adjacent sacrificial pads are spaced apart or partially connected.

4. The microphone package of claim 1, wherein, The sacrificial pad and the conductive pad are isolated from each other.

5. The microphone package of claim 4, wherein the first and second acoustic ports are formed by a single acoustic port formed in the substrate and covered by the first and second acoustic membranes. A waterproof ring is provided between the sacrificial pad and the conductive pad; And / or, a waterproof ring is provided within the area enclosed by the sacrificial pad.

6. The microphone package of claim 1, wherein, The microphone substrate is provided with a first waterproof coating on the side where the sacrificial pad is located, and the projection of the first waterproof coating on the microphone substrate falls into the area enclosed by the projection of the sacrificial pad on the microphone substrate. And / or, the microphone substrate is further provided with a second waterproof coating on the side opposite to the sacrificial pad.

7. The microphone package of claim 6, wherein the first and second acoustic ports are formed by a single acoustic port in the housing. A first metal layer is also sandwiched between the first waterproof coating and the microphone substrate; And / or, a second metal layer is further sandwiched between the second waterproof coating and the microphone substrate; And / or, a third metal layer is provided on the inner side of the acoustic hole, and an anti-corrosion coating is provided on the third metal layer.

8. The microphone package of claim 7, wherein the first and second acoustic ports are formed by a single acoustic port in the housing. The first metal layer, the second metal layer, the third metal layer, and the sacrificial pad are integrated into one structure.

9. An electronic device, comprising: Includes the microphone unit as described in any one of claims 1 to 8.

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