一种贴片式跨线元件
The surface-mount cross-wire component with a hollow solenoid structure, manufactured by spiral decoction, solves the problem of automating the placement of fine wires, realizes automated vertical connection of circuit boards, and improves soldering efficiency and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOSHAN ZHONGJIN MICRO ELECTRONICS TECH CO LTD
- Filing Date
- 2022-12-29
- Publication Date
- 2026-07-17
AI Technical Summary
Tiny wires cannot be picked up by the pick-and-place machine, making it difficult to automate the placement and soldering of circuit board pads, especially when vertically connecting on aluminum substrates that cannot be drilled, resulting in high labor intensity, low efficiency and poor reliability.
The surface mount cross-line component, which uses a hollow solenoid structure made by spinning and decoction, is automatically mounted and vertically connected by using a pick-and-place machine nozzle to hold the upper end face and solder it to the circuit board pads, or by pulling the solenoid through the through hole and soldering it to the circuit board.
It enables automated surface mount and vertical soldering of fine wires, improving soldering efficiency and reliability, reducing operating costs, and is applicable to a variety of circuit board materials.
Smart Images
Figure CN116056328B_ABST