Cooling system, cooling methods and computer room
Patent Information
- Application Number
- CN202310176228.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-28
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2043-02-28
Smart Images

Figure CN116056429B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of server heat dissipation technology, and in particular to a heat dissipation system, heat dissipation method, and computer room. Background Technology
[0002] Currently, with the development of internet technology, people have connected network communication and big data through network data. To better store network data, the use of servers is essential. As we all know, servers are generally installed and deployed in data centers. During server operation, servers generate a large amount of heat. Since a data center is a closed space, this heat cannot dissipate naturally and requires auxiliary technologies for heat dissipation.
[0003] Current technology typically employs air conditioning in the server room to blow cool air, which circulates and removes heat generated by the servers, thus cooling the room. However, due to the unprecedented development of big data, the amount of data to be stored and the capacity of servers are increasing, leading to a greater number of servers required. This makes the aforementioned cooling method insufficient to meet the server's cooling requirements, resulting in heat not being dissipated in time, high temperatures within the server room, and impaired server operation, ultimately preventing the servers from operating in a suitable environment. Summary of the Invention
[0004] This application provides a heat dissipation system, a heat dissipation method, and a computer room to solve the problem that due to outdated heat dissipation methods in related technologies, heat in the computer room cannot be dissipated in a timely manner, resulting in high temperatures in the computer room, which affects the normal and effective operation of the server and prevents the server from operating in a good environment.
[0005] According to some embodiments, this application provides a heat dissipation system, which includes an underground heat dissipation unit; the underground heat dissipation unit includes a basement located below the computer room, and a mesh panel is provided between the basement and the computer room to connect the basement and the computer room; the basement is provided with a condensing component to cool the air in the basement; a first fan box is provided on the side of the computer room at the horizontal ground, and the first fan box is used to discharge the air cooled by the condensing component into the computer room through the mesh panel to cool the computer room.
[0006] By adopting the above-mentioned technical solution: the installation of underground heat dissipation units can remove heat from the computer room in a timely manner, thereby preventing the temperature inside the computer room from becoming too high and affecting the normal and effective operation of the servers.
[0007] Preferably, the condensing assembly includes condenser pipes located inside the basement and near its four sides, with refrigerant inside the condenser pipes; a condenser is located on the horizontal ground at a position on the side of the machine room, and the condenser is connected to the condenser pipes to cool the refrigerant inside the condenser pipes; so that after the first fan box draws outside air into the condenser pipes, it cools the air in the basement through the condenser pipes.
[0008] By employing the above-mentioned technical solution—the combination of condenser pipes, refrigerant, and condenser—the air in the basement can be cooled.
[0009] Preferably, the heat dissipation system also includes an above-ground heat dissipation unit, which is used to exhaust hot air in the computer room to the outside of the computer room to cool the computer room; the computer room is equipped with server chassis, and the server chassis is equipped with several racks, on which server components are stored; the outer periphery of the server chassis is equipped with an outer shell, and the above-ground heat dissipation unit includes a second fan box installed in the outer shell, which is used to draw in the heat generated by the server components and exhaust it to the outside of the computer room to cool the computer room.
[0010] By adopting the above-mentioned technical solution: the installation of ground-level heat dissipation units can exhaust hot air from the computer room to the outside to cool the computer room, thereby providing further protection against excessively high temperatures in the computer room that could affect the normal and effective operation of the servers.
[0011] Preferably, the above-ground heat dissipation unit can also be connected to the underground heat dissipation unit to draw cold air from the underground heat dissipation unit into the computer room to cool the computer room; a lifting groove connected to the basement is provided on the horizontal ground at the position of the outer perimeter of the server chassis; a hydraulic cylinder is provided on the bottom surface of the outer casing to allow the outer casing to be raised and lowered along the height direction of the rack; the second fan box can draw cold air from the basement into the computer room to cool the computer room by reversing the lifting and lowering.
[0012] By adopting the above-mentioned technical solution, combining above-ground and underground heat dissipation units to cool the computer room, the servers can always be in a good operating environment.
[0013] Preferably, the ground cooling unit also includes a third fan box, which is installed on the top surface of the computer room to draw in hot air from the computer room and exhaust it outside the computer room to cool the computer room.
[0014] By adopting the above-mentioned technical solution: the installation of a third fan box, hot air in the computer room is drawn in and discharged outside the computer room to cool it down, thus further ensuring the cooling effect of the computer room.
[0015] According to some embodiments, this application also provides a heat dissipation method, which is applied to a heat dissipation system as described above; the heat dissipation system further includes a temperature sensor disposed on the rack and a controller disposed in the computer room, the method comprising:
[0016] Real-time monitoring of temperature sensor readings;
[0017] The current temperature level of the computer room is determined based on the monitored temperature values, and heat dissipation operations are carried out based on the temperature level.
[0018] By adopting the above technical solution, multi-level heat dissipation treatment is carried out in the computer room based on the temperature value of the temperature sensor, so as to better achieve the purpose of heat dissipation.
[0019] According to one feasible embodiment of this application, the temperature level includes a first temperature level, and the method includes:
[0020] When the temperature in the computer room is detected to be at the first temperature level, the first fan box is controlled to operate, drawing cold air from the basement into the computer room through the mesh panel.
[0021] Control the second fan unit to exhaust hot air from the server chassis into the computer room; control the third fan unit to exhaust hot air from inside the computer room to the outside to cool the computer room.
[0022] By adopting the above technical solution, when the current temperature value of the computer room is detected to be at the first temperature level, the computer room is cooled only through the first fan box and the second fan box, so as to minimize the heat dissipation cost.
[0023] According to one achievable method in an embodiment of this application, the temperature level further includes a second temperature level, the temperature of the second temperature level being higher than the temperature of the first temperature level; the method further includes:
[0024] When the current temperature value of the computer room is detected to be at the second temperature level, the condenser is controlled to operate simultaneously with the operation of the first fan box, the second fan box and the third fan box.
[0025] The condenser controls the refrigerant in the condenser pipes located in the basement to cool the air in the basement, so that the first fan box can draw the cold air in the basement through the mesh plate into the machine room to cool the machine room.
[0026] By adopting the above technical solution: when the current temperature value of the computer room is detected to be at the second temperature level, the condenser is controlled to work while the first fan box and the second fan box are working, so as to achieve a better cooling effect for the computer room.
[0027] According to one achievable method in an embodiment of this application, the temperature level further includes a third temperature level, the temperature of the third temperature level being higher than the temperature of the second temperature level; the method further includes:
[0028] When the current temperature value of the computer room is detected to be at the third temperature level, the hydraulic cylinder is controlled to work simultaneously with the operation of the first fan box, the second fan box, the third fan box and the condenser.
[0029] The hydraulic cylinder drives the outer casing to move up and down between the machine room and the basement, and the second fan box draws in cold air from the basement into the machine room to cool it down.
[0030] By adopting the above technical solution, when the current temperature value of the computer room is detected to be at the third temperature level, the third fan box is controlled to work while the first fan box, the second fan box, and the condenser are working, providing further assurance for cooling the computer room.
[0031] According to some embodiments, this application also provides a computer room, including a heat dissipation system as described above and an insulation wall. The insulation wall is installed on a horizontal ground and is used for heat preservation. An inner cover is provided inside the insulation wall, and a cavity for placing refrigerant is provided between the inner cover and the insulation wall. A condenser is located outside the insulation wall and is connected to the cavity through a connecting pipe. The condenser is used to cool the refrigerant in the cavity so as to cool the computer room using the inner cover.
[0032] By adopting the above technical solution, the data center itself also has heat dissipation function, which can further accelerate the heat dissipation effect of the data center and keep the server in good operating condition at all times.
[0033] Therefore, the embodiments of this disclosure have at least the following advantages:
[0034] 1) Using the above-mentioned heat dissipation system to cool the computer room can remove the heat in the computer room in a timely manner, so as to prevent the temperature in the computer room from being too high and affecting the normal and effective operation of the server, so that the server can always be in a good operating environment.
[0035] 2) Using the above-mentioned heat dissipation methods to cool the computer room can minimize heat dissipation costs, and the multi-stage heat dissipation approach can better achieve the purpose of heat dissipation.
[0036] 3) By using the above-mentioned computer room, since the computer room itself also has heat dissipation function, the heat dissipation of the computer room can be further accelerated, so that the server is always in a good operating condition. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this application or in the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0038] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation system according to an embodiment of this application;
[0039] Figure 2 This is a cross-sectional structural diagram of a heat dissipation system according to an embodiment of this application;
[0040] Figure 3 This is a schematic diagram of the internal structure of a heat dissipation system in a computer room according to an embodiment of this application;
[0041] Figure 4 This is a schematic flowchart of a heat dissipation method according to an embodiment of this application;
[0042] Figure 5 This is a cross-sectional structural diagram of a computer room according to an embodiment of this application.
[0043] Attached Figure Descriptions: 1. Computer Room; 11. Insulated Wall; 12. Inner Cover; 121. Steel Plate; 122. Square Tube; 13. Cavity; 14. Connecting Pipe; 2. Heat Dissipation System; 21. Underground Heat Dissipation Unit; 211. Basement; 212. Mesh Panel; 213. Condenser Pipe; 22. Above-Ground Heat Dissipation Unit; 221. Second Fan Box; 222. Third Fan Box; 3. Condenser; 4. First Fan Box; 5. Server Chassis; 51. Chassis Base Plate; 52. Chassis Top Plate; 521. Cable Drill Hole; 522. Wiring Tray; 53. Support Rod; 6. Rack; 61. Server Components; 62. Temperature Sensor; 7. Outer Cover; 71. Hydraulic Cylinder; 8. Controller. Detailed Implementation
[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the various embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the various embodiments below is for ease of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.
[0045] Reference Figure 1 , Figure 3As shown in the figure, this application embodiment provides a heat dissipation system 2, which includes an underground heat dissipation unit 21; the underground heat dissipation unit 21 includes a basement 211 located below the computer room 1, and a mesh panel 212 is provided between the basement 211 and the computer room 1, the mesh panel 212 being used to connect the basement 211 and the computer room 1; the basement 211 is provided with a condensing component for cooling the air in the basement 211; a first fan box 4 is provided on the side of the horizontal ground at the computer room 1, the first fan box 4 being used to discharge the air cooled by the condensing component into the computer room 1 through the mesh panel 212 to cool the computer room 1.
[0046] like Figure 1 , Figure 3 As shown, in one example, the computer room 1 is rectangular and built on a horizontal surface made of cement. The basement 211 is built at the bottom of the horizontal surface, constructed of reinforced concrete, and is located directly below the computer room 1. A stainless steel mesh panel 212 is bolted to the horizontal surface and is located between the basement 211 and the computer room 1, serving to connect the two spaces.
[0047] A condenser assembly is installed in basement 211 to cool the air in basement 211. Four first fan boxes 4 are installed, each bolted to the four sides of the server room 1 on a horizontal surface. The exhaust vents of the first fan boxes 4 are connected to the air inlets of basement 211, allowing the air cooled by the condenser assembly to be discharged into server room 1 through mesh panels 212 to cool the server room 1. Server room 1 includes, but is not limited to, a server room 1. Besides a rectangular shape, server room 1 can be flexibly configured as needed.
[0048] The above setup, by combining the basement 211 below the computer room 1, the mesh panel 212 between the basement 211 and the computer room 1, the condensation components in the basement 211, and the first fan box 4, cools down the computer room 1. This allows the heat in the computer room 1 to be removed in a timely manner, thereby preventing the temperature inside the computer room 1 from becoming too high and affecting the normal and effective operation of the server.
[0049] Reference Figure 1 As shown, in some embodiments, the condensation assembly includes condenser pipes 213 disposed inside the basement 211 and near its four sides, the condenser pipes 213 containing refrigerant; a condenser 3 is disposed on the horizontal ground at a position on the side of the machine room 1, the condenser 3 being connected to the condenser pipes 213 for cooling the refrigerant in the condenser pipes 213; so that after the first fan box 4 draws outside air into the condenser pipes 213, the air in the basement 211 is cooled through the condenser pipes 213.
[0050] like Figure 1 As shown, in one example, the condensing assembly includes multiple condenser pipes 213, which are evenly laid inside the basement 211 near its four sides, and each condenser pipe 213 is filled with refrigerant. Four condensers 3 are provided, each bolted to the four corners of the machine room 1 on the horizontal ground. A circulation pump is installed on each condenser 3, connected to the condenser pipes 213, to cool the refrigerant inside the condenser pipes 213, so that after the first fan box 4 draws outside air into the condenser pipes 213, the air inside the basement 211 can be cooled through the condenser pipes 213. Besides this, within the aforementioned spirit and principles, other possible methods can be used for the number, installation location, and installation method of the condensers 3.
[0051] The above setup, through the combination of multiple condenser pipes 213, the refrigerant inside the condenser pipes 213, and the condenser 3 located on the side of the machine room 1 on the horizontal ground, achieves the effect of cooling the air in the basement 211, thereby achieving the effect of cooling the air in the machine room 1.
[0052] Reference Figure 2 , Figure 3 As shown, in some embodiments, the heat dissipation system 2 further includes a ground heat dissipation unit 22, which is used to exhaust hot air in the computer room 1 to the outside of the computer room 1 to cool the computer room 1; a server chassis 5 is provided in the computer room 1, and several racks 6 are provided in the server chassis 5, which are all used to store server components 61; an outer shell 7 is provided on the outer periphery of the server chassis 5, and the ground heat dissipation unit 22 includes a second fan box 221 provided in the outer shell 7, which is used to absorb the heat generated by the server components and exhaust it to the outside of the computer room 1 to cool the computer room 1.
[0053] like Figure 2 , Figure 3 As shown, in one example, the heat dissipation system 2 also includes a ground-level heat dissipation unit 22 for exhausting hot air from the computer room 1 to the outside of the computer room 1 to cool the computer room 1. Several server chassis 5 are provided, all of which are installed inside the computer room 1. The server chassis 5 includes a chassis base plate 51 located on the bottom surface of the computer room 1 and a chassis top plate 52 located directly above the chassis base plate 51. Both the chassis base plate 51 and the chassis top plate 52 are rectangular. The upper end surface of the chassis top plate 52 has a cable hole 521 along its length and near the edge. The upper end surface of the chassis top plate 52 has a wiring groove 522 welded along its length. The wiring groove 522 and the cable hole 521 are spaced apart for placing the connection wires of the server components 61.
[0054] Continue to refer to Figure 3, a support rod 53 is arranged between the chassis bottom plate 51 and the chassis top plate 52. There are four support rods 53, and the four support rods 53 are located at the four corners of the chassis bottom plate 51. The lower end of each support rod 53 is welded to the upper surface of the chassis bottom plate 51, and the upper end is welded to the lower surface of the chassis top plate 52. A number of racks 6 are arranged in the server chassis 5 and are fixedly connected to the chassis bottom plate 51 at intervals along the length direction of the server chassis 5 by bolts. A plurality of server components 61 are fixedly connected in the rack 6 by bolts.
[0055] The outer shell sleeve 7 is arranged in a "return" shape and is sleeved on the outer peripheral side of the server chassis 5. The above-ground heat dissipation unit 22 includes a second blower box 221. There are four second blower boxes 221, and the four second blower boxes 221 are respectively fixedly installed on the four side surfaces of the outer shell sleeve 7 by bolts, and are used to suck the heat generated by the server components 61 and discharge it outside the computer room 1 to cool the computer room 1.
[0056] With the above settings, through the arrangement of the second blower boxes 221 installed on the four side surfaces of the outer shell sleeve 7, the effect of sucking the heat generated by the server components 61 and discharging it outside the computer room 1 to cool the computer room 1 is achieved, further ensuring the normal and effective operation of the server.
[0057] Refer to Figure 2 、 Figure 3 As shown in
[0058] In some embodiments, the above-ground heat dissipation unit 22 can also be connected to the underground heat dissipation unit 21 and is used to suck the cold air of the underground heat dissipation unit 21 into the computer room 1 to cool the computer room 1; a lifting groove communicating with the basement 211 is provided at the position of the horizontal ground on the outer peripheral side of the server chassis 5; a hydraulic cylinder 71 that can make the outer shell sleeve 7 lift along the height direction of the rack 6 is provided on the bottom surface of the outer shell sleeve 7; the second blower box 221 can suck the cold air of the basement 211 into the computer room 1 to cool the computer room 1 by lifting and reversing. Figure 2 、 Figure 3As shown, in one example, the above-ground heat dissipation unit 22 can also be connected to the underground heat dissipation unit 21 to draw cold air from the underground heat dissipation unit 21 into the machine room 1 to cool it down. The lifting trough is located between the machine room 1 and the basement 211 at the horizontal ground level, and both the lifting trough and the outer casing 7 are arranged in a "U" shape. Four hydraulic cylinders 71 are provided, each located at one of the four corners of the outer casing 7. The bottom of each hydraulic cylinder 71 is bolted to the bottom of the basement 211, and the top is bolted to the bottom of the outer casing 7. A hydraulic oil pump and a hydraulic oil tank, which work in conjunction with the hydraulic cylinders 71, are installed in the basement 211. The hydraulic oil pump is connected to the hydraulic oil tank and the hydraulic cylinders 71 via hydraulic oil pipes. Because the hydraulic cylinders 71 can raise and lower the outer casing 7 along the height of the frame 6 through the lifting trough, the second fan box 221 can draw cold air from the basement 211 into the machine room 1 to cool it down by reversing its lifting motion.
[0059] The above-mentioned setup combines the above-ground heat dissipation unit 22 and the underground heat dissipation unit 21. Through the cooperation of the hydraulic cylinder 71 and the second fan box 221, the cold air from the basement 211 is drawn into the machine room 1 to cool the machine room 1, thereby further ensuring the cooling effect of the machine room 1.
[0060] Reference Figure 1 , Figure 3 As shown, in some embodiments, the ground heat dissipation unit 22 further includes a third fan box 222, which is disposed on the top surface of the computer room 1 and is used to draw in hot air from the computer room 1 and exhaust it outside the computer room 1 to cool the computer room 1.
[0061] like Figure 1 , Figure 3 As shown, in one example, the ground-level heat dissipation unit 22 also includes a third fan box 222. The third fan box 222 is bolted to the upper surface of the machine room 1 and is used to draw in hot air from the machine room 1 and exhaust it outside the machine room 1 to cool it down. It should be noted that the first fan box 4, the second fan box 221, and the third fan box 222 are all equipped with dust filters to prevent dust from entering and affecting the working efficiency of the first fan box 4, the second fan box 221, and the third fan box 222.
[0062] The above-mentioned configuration, specifically the third fan box 222, can draw in hot air from the computer room 1 and exhaust it outside the computer room 1 to cool it down, ensuring that the server can always operate in a good environment.
[0063] It should also be noted that the above-mentioned underground heat dissipation unit 21 and above-ground heat dissipation unit 22 are the preferred embodiments provided in this application. In addition to this preferred embodiment, only one of the underground heat dissipation unit 21 and above-ground heat dissipation unit 22 may be used, or heat dissipation units may be used in other locations. This application will not list them all. As long as they are within the spirit and principles of the embodiments of this application, they are all within the protection scope of this application.
[0064] In combination with the above Figure 1-3 as well as Figure 4 As shown in the embodiment of this application, a heat dissipation method is also provided, which can be applied to the heat dissipation system 2 described above; the method includes:
[0065] Step S501: Monitor the temperature value of temperature sensor 62 in real time.
[0066] Here, the aforementioned heat dissipation system 2 also includes a temperature sensor 62 bolted to the rack 6 and a controller 8 located in the server room 1; the temperature sensor 62 is located on the upper surface of the server component 61 and can monitor the temperature value of the server component 61 in real time. The controller 8 is located between two adjacent server chassis 5 and is connected to the temperature sensor 62, the hydraulic oil pump, the condenser 3, the first fan box 4, the second fan box 221, and the third fan box 222, respectively.
[0067] Specifically, temperature sensor 62 senses the temperature value of server component 61 in real time, and controller 8 monitors the temperature value of temperature sensor 62 in real time.
[0068] Step S503: Determine the current temperature level of computer room 1 based on the monitored temperature value, and perform heat dissipation operation on computer room 1 based on the temperature level.
[0069] Specifically, the controller 8 determines the current temperature level of the computer room 1 based on the monitored temperature values, and performs heat dissipation operations on the server components 61 in the computer room 1 based on the temperature level.
[0070] The above method involves real-time monitoring of the temperature value of the temperature sensor 62 to determine the current temperature level of the computer room 1, and then performing heat dissipation operations on the computer room 1 based on the temperature level to ensure the normal and effective operation of the server.
[0071] In one embodiment, the method includes: when the current temperature value of the computer room 1 is detected to be at a first temperature level, controlling the first fan box 4 to operate, drawing cold air from the basement 211 into the computer room 1 through the mesh plate 212; controlling the second fan box 221 to operate, exhausting hot air from the server chassis 5 into the computer room 1; and controlling the third fan box 222 to operate, exhausting hot air from the computer room 1 to the outside of the computer room 1 to cool the computer room 1.
[0072] The temperature levels include the first temperature level.
[0073] Specifically, when the controller 8 detects that the current temperature value of the computer room 1 is at the first temperature level, it controls the first fan box 4 to be powered on, drawing the cold air in the basement 211 onto the mesh plate 212, and discharging it into the computer room 1 through the mesh holes on the mesh plate 212; the controller 8 controls the second fan box 221 to be powered on, drawing the hot air from the server chassis 5 into the computer room 1; the controller 8 controls the third fan box 222 to be powered on, discharging the hot air in the computer room 1 to the outside of the computer room 1 to achieve the effect of cooling the computer room 1.
[0074] The above method, when the current temperature value of the computer room 1 is detected to be at the first temperature level, controls the first fan box 4 and the second fan box 221 to work in order to cool down the computer room 1, thereby achieving the effect of heat dissipation while reducing heat dissipation costs.
[0075] In one embodiment, the method further includes: when the current temperature value of the computer room 1 is detected to be at the second temperature level, controlling the first fan box 4, the second fan box 221 and the third fan box 222 to work while controlling the condenser 3 to work; controlling the condenser 3 to cool the refrigerant in the condenser pipe 213 installed in the basement 211 to cool the air in the basement 211, so as to use the first fan box 4 to draw the cold air in the basement 211 into the computer room 1 through the mesh plate 212 to cool the computer room 1.
[0076] The temperature levels also include a second temperature level, where the temperature is higher than that of the first temperature level.
[0077] Specifically, when the controller 8 detects that the current temperature of the computer room 1 is at the second temperature level, since the temperature at the second temperature level is higher than that at the first temperature level, the controller 8 can simultaneously control the operation of the first fan box 4, the second fan box 221, and the third fan box 222, and also control the condenser 3 to be powered on. The controller 8 controls the condenser 3 to cool the refrigerant in the condenser pipe 213 located in the basement 211. The fan in the first fan box 4 draws outside air onto the condenser pipe 213, where it is cooled, and then discharged through the through-holes on the mesh plate 212 to cool the computer room 1.
[0078] The above method: When the current temperature value of the computer room 1 is detected to be at the second temperature level, since the temperature of the second temperature level is higher than that of the first temperature level, controlling the first fan box 4 and the second fan box 221 to work alone is not enough to meet the heat dissipation effect. It is also necessary to control the condenser 3 to work at the same time in order to cool down the computer room 1 more quickly.
[0079] In one embodiment, the method further includes: when the current temperature value of the computer room 1 is detected to be at the third temperature level, controlling the first fan box 4, the second fan box 221, the third fan box 222 and the condenser 3 to work, while also controlling the hydraulic cylinder 71 to work; controlling the hydraulic cylinder 71 to drive the outer casing 7 to move up and down between the computer room 1 and the basement 211, and drawing cold air from the basement 211 into the computer room 1 through the second fan box 221 to cool the computer room 1.
[0080] The temperature levels also include a third temperature level, where the temperature is higher than that of the second temperature level.
[0081] Specifically, when the controller 8 detects that the current temperature of the computer room 1 is at the third temperature level, since the temperature of the third temperature level is higher than that of the second temperature level, the controller 8 can simultaneously control the operation of the first fan box 4, the second fan box 221, the third fan box 222, and the condenser 3, and also control the hydraulic cylinder 71 to be energized. The controller 8 controls the hydraulic cylinder 71 to descend slowly, and the outer casing 7 descends slowly accordingly, and the second fan box 221 also descends slowly, so that the second fan box 221 is located in the basement 211. By controlling the second fan box 221 to rise and reverse, the cold air in the basement 211 can be drawn into the computer room 1 through the mesh plate 212 to cool the computer room 1, improve the air circulation in the computer room 1, and achieve a rapid cooling effect.
[0082] The above method: When the current temperature value of the computer room 1 is detected to be at the third temperature level, since the temperature of the third temperature level is higher than that of the second temperature level, controlling only the first fan box 4, the second fan box 221 and the condenser 3 cannot achieve a good cooling effect. Therefore, the third fan box 222 can also be controlled to ensure that the server is always in a good operating environment.
[0083] The heat dissipation system 2 provided in this application embodiment can be applied to various heat dissipation scenarios to prevent excessively high temperatures in enclosed spaces. For example, the heat dissipation system 2 can be installed in: computer rooms containing communication equipment, factories containing medical equipment, and laboratories containing power supply equipment, etc. This application does not list them all. As long as they are within the spirit and principles described above in the embodiments of this application, they all fall within the protection scope of this application.
[0084] Taking a computer room 1 containing communication equipment as an example, this application embodiment also provides a computer room, referring to... Figure 1 , Figure 5The system includes the aforementioned heat dissipation system 2 and an insulation wall 11. The insulation wall 11 is rectangularly arranged on a horizontal surface and is used for heat preservation. An inner cover 12 is provided inside the insulation wall 11. The inner cover 12 is made of stainless steel plate 121 and square tube 122 welded together. A cavity 13 for placing refrigerant is provided between the inner cover 12 and the insulation wall 11. A condenser 3 is installed on the outside of the insulation wall 11 at its four corners. The condenser 3 is connected to the cavity 13 through a connecting pipe 14. After the condenser 3 cools, the refrigerant flows back into the cavity 13 for cooling, so as to facilitate the cooling of the computer room 1 by using the inner cover 12.
[0085] Since the computer room 1 itself can also achieve heat dissipation, when the controller 8 detects that the current temperature value of the computer room 1 is at a certain level, such as the third temperature level, the controller 8 controls the condenser 3 to work. The condenser 3 cools the refrigerant in the cavity 13 between the inner cover 12 and the insulation wall 11, so that the stainless steel plate 121 on the inner wall of the inner cover 12 cools the air in the computer room 1, thereby accelerating the heat dissipation effect.
[0086] The above-mentioned setup, along with the fact that the computer room 1 itself has a heat dissipation function, provides greater assurance for accelerating the heat dissipation of the air inside the computer room 1, thereby preventing the temperature inside the computer room 1 from becoming too high and affecting the normal and effective operation of the server.
[0087] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this application and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this application should be included within the protection scope of this application. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.
Claims
1. A heat dissipation system, characterized in that, The heat dissipation system (2) includes an underground heat dissipation unit (21) and an above-ground heat dissipation unit (22); The underground heat dissipation unit (21) is used to discharge cold air from underground into the machine room (1) to cool the machine room (1); the underground heat dissipation unit (21) includes a basement (211), which is located below the machine room (1), and a mesh plate (212) is provided between the basement (211) and the machine room (1), which is used to connect the basement (211) and the machine room (1); the basement (211) is provided with a condensing component to cool the air in the basement (211); a first fan box (4) is provided on the side of the machine room (1) on the horizontal ground, which is used to discharge the air cooled by the condensing component into the machine room (1) through the mesh plate (212) to cool the machine room (1); The ground-level heat dissipation unit (22) is used to exhaust the hot air in the computer room (1) to the outside of the computer room (1) to cool the computer room (1); the ground-level heat dissipation unit (22) includes a second fan box (221) and a third fan box (222); a server chassis (5) is provided in the computer room (1), and several racks (6) are provided in the server chassis (5), and server components (61) are stored on the several racks (6); an outer shell (7) is provided on the outer periphery of the server chassis (5); the second fan box (221) is provided on the outer shell (7) to absorb the heat generated by the server components (61) and exhaust it to the outside of the computer room (1) to cool the computer room (1); the third fan box (222) is provided on the top surface of the computer room (1) to absorb the hot air in the computer room (1) and exhaust it to the outside of the computer room (1) to cool the computer room (1); The above-ground heat dissipation unit (22) and the underground heat dissipation unit (21) are connected to each other and are used to draw the cold air from the underground heat dissipation unit (21) into the computer room (1) to cool the computer room (1); the horizontal ground is provided with a lifting groove connected to the basement (211) at the position of the outer periphery of the server chassis (5); the bottom surface of the outer casing (7) is provided with a hydraulic cylinder (71) that makes the outer casing (7) rise and fall along the height direction of the rack (6); the second fan box (221) draws the cold air from the basement (211) into the computer room (1) to cool the computer room (1) by lifting and reversing.
2. The heat dissipation system according to claim 1, characterized in that, The condensation assembly includes condenser pipes (213) located inside the basement (211) and near its four sides, with a refrigerant inside the condenser pipes (213); a condenser (3) is installed on the horizontal ground at a position on the side of the machine room (1), and the condenser (3) is connected to the condenser pipes (213) to cool the refrigerant inside the condenser pipes (213); so that after the first fan box (4) draws outside air into the condenser pipes (213), it cools the air in the basement (211) through the condenser pipes (213).
3. A heat dissipation method, characterized in that, The heat dissipation method is applied to the heat dissipation system (2) as described in any one of claims 1-2; the heat dissipation system (2) further includes a temperature sensor (62) disposed on the rack (6) and a controller (8) disposed in the computer room (1), the method comprising: Real-time monitoring of the temperature value of the temperature sensor (62); The temperature level of the computer room (1) is determined based on the monitored temperature value, and heat dissipation operation is performed on the computer room (1) based on the temperature level.
4. The method according to claim 3, characterized in that, The temperature level includes a first temperature level, and the method includes: When the temperature value of the computer room (1) is detected to be at the first temperature level, the first fan box (4) is controlled to work to draw the cold air in the basement (211) into the computer room (1) through the mesh plate (212); Control the second fan box (221) to work and exhaust the hot air from the server box (5) to the computer room (1); control the third fan box (222) to work and exhaust the hot air from the computer room (1) to the outside of the computer room (1) to cool the computer room (1).
5. The method according to claim 4, characterized in that, The temperature level further includes a second temperature level, wherein the temperature of the second temperature level is higher than the temperature of the first temperature level; the method further includes: When the current temperature value of the computer room (1) is detected to be at the second temperature level, the condenser (3) is controlled to work at the same time as the first fan box (4), the second fan box (221) and the third fan box (222). The condenser (3) cools the refrigerant in the condenser pipe (213) in the basement (211) to cool the air in the basement (211), so that the cold air in the basement (211) can be drawn into the machine room (1) through the mesh plate (212) by the first fan box (4) to cool the machine room (1).
6. The method according to claim 5, characterized in that, The temperature level further includes a third temperature level, the temperature of which is higher than the temperature of the second temperature level; the method further includes: When the current temperature value of the computer room (1) is detected to be at the third temperature level, the hydraulic cylinder (71) is controlled to work at the same time as the first fan box (4), the second fan box (221), the third fan box (222) and the condenser (3); The hydraulic cylinder (71) drives the outer casing (7) to move up and down between the machine room (1) and the basement (211), and draws cold air from the basement (211) into the machine room (1) through the second fan box (221) to cool the machine room (1).
7. A computer room, characterized in that, The system includes a heat dissipation system (2) as described in any one of claims 1-2 and an insulation wall (11), wherein the insulation wall (11) is disposed on a horizontal ground and is used for heat preservation; an inner cover (12) is disposed inside the insulation wall (11), and a cavity (13) for placing a refrigerant is disposed between the inner cover (12) and the insulation wall (11); a condenser (3) is located outside the insulation wall (11), and the condenser (3) is connected to the cavity (13) through a connecting pipe (14), and the condenser (3) is used to cool the refrigerant in the cavity (13) so as to cool the computer room (1) using the inner cover (12).
Citation Information
Patent Citations
Automatic microcomputer intelligent control machine room heat dissipation equipment
CN211607183U
Data center machine room refrigerating system and data center machine room
CN218072200U