Electronic device comprising an antenna

Abstract

An electronic device according to embodiments disclosed in the present document includes a printed circuit board including a plurality of layers; a communication circuit disposed on one surface of the printed circuit board; and at least one processor electrically connected to the communication circuit, wherein the printed circuit board can include a first layer in which a plurality of patch antennas are disposed; a first feed path feeding a first point of a first patch antenna, the first point allowing the first patch antenna disposed in the first layer to receive a first polarized signal; a second feed path feeding a second point of the first patch antenna, the second point allowing the first patch antenna to receive a second polarized signal orthogonal to the first polarized signal; a first ground path electrically connecting a third point to a ground; and a second ground path electrically connecting a fourth point to a second layer. Various other embodiments appreciated in the specification can also be possible.

Description

Technical Field

[0001] The embodiments disclosed in this document relate to a technique for antennas included in electronic devices. Background Technology

[0002] The increasing number of functions in electronic devices has led to an increase in the number of internal components. In addition, electronic devices now include antennas capable of transmitting and / or receiving high-frequency or broadband signals to support next-generation wireless communication systems.

[0003] As the size of the antenna ground of the included antenna increases, the feed paths electrically coupled to the antenna ground can be spaced out sufficiently. Summary of the Invention

[0004] Technical issues

[0005] The increasing number of functions supported by electronic devices and the decreasing thickness of electronic devices have led to insufficient space for mounting antenna structures. The dimensions of the antenna structure can be determined by the dimensions of the patch antenna included in the antenna structure and the dimensions of the grounding, which are related to antenna performance.

[0006] However, when the ground width, which determines the antenna structure width, is reduced, the feed-to-feed coupling characteristics of the patch antenna structure may deteriorate. Since the deterioration of feed-to-feed coupling characteristics leads to a degradation in antenna performance, there may be limitations in reducing the size of the antenna structure.

[0007] Various embodiments of this disclosure can provide an electronic device including an antenna grounding path that prevents antenna performance degradation while minimizing antenna size.

[0008] Solution to the problem

[0009] An electronic device according to embodiments disclosed in this document may include: a multilayer printed circuit board (PCB), a communication circuit electrically coupled to the PCB, and at least one processor electrically coupled to the communication circuit. The PCB may include: a first layer having a plurality of patch antennas disposed thereon; a first feed path that directly or indirectly feeds a first point of the first patch antennas such that the first patch antennas disposed on the first layer transmit and / or receive a first polarization signal, wherein the first feed path includes a path penetrating a first number of the plurality of layers and is electrically coupled to the communication circuit; a second feed path that directly or indirectly feeds a second point of the first patch antennas such that the first patch antennas disposed on the first layer transmit and / or receive a second polarization signal orthogonal to the first polarization signal, wherein the second feed path includes a path penetrating a first number of the plurality of layers and is electrically coupled to the communication circuit; a second layer including ground; a first ground path electrically coupling the ground from outside the first patch antennas to a third point adjacent to the first point of the first patch antennas; and a second ground path electrically coupling the ground from outside the first patch antennas to a fourth point adjacent to the second point of the first patch antennas.

[0010] Beneficial effects of the invention

[0011] According to the various embodiments disclosed in this document, the ground plane size of a printed circuit board (PCB) can be reduced while maintaining or improving antenna performance.

[0012] According to the various embodiments disclosed in this document, PCBs with smaller dimensions can be realized to provide users with smaller electronic devices, thereby improving user portability.

[0013] According to the various embodiments disclosed in this document, the grounding path can be set in an appropriate location to improve the feed-to-feed coupling characteristics of the patch antenna. Attached Figure Description

[0014] Figure 1 It is a block diagram of an electronic device in a network environment according to various implementation methods;

[0015] Figure 2 It is a block diagram of an electronic device in a network environment including multiple cellular networks according to various embodiments;

[0016] Figure 3 An electronic device according to an embodiment is shown;

[0017] Figure 4 A printed circuit board (PCB) included in an antenna module of an electronic device according to an embodiment is shown;

[0018] Figure 5This is a perspective view of the PCB of a single-band dual-polarized antenna module viewed from the side according to the embodiment.

[0019] Figure 6a This is a view showing the PCB of a single-band dual-polarized antenna module according to various embodiments;

[0020] Figure 6b It is a graph showing the performance of a single-band dual-polarized antenna module according to various embodiments;

[0021] Figure 6c It is a graph showing the performance of a single-band dual-polarized antenna module according to various embodiments;

[0022] Figure 7 This is a partial view showing the PCB of the antenna module according to an embodiment;

[0023] Figure 8 This is a perspective view of the PCB of a dual-band dual-polarized antenna module viewed from the side according to the embodiment.

[0024] Figure 9a The PCB of a dual-band dual-polarized antenna module according to various embodiments is partially shown;

[0025] Figure 9b The diagram shows performance graphs of a dual-band dual-polarized antenna module according to various embodiments;

[0026] Figure 9c It is a graph showing the performance of a dual-band dual-polarized antenna module according to various embodiments;

[0027] Figure 9d It is a graph showing the performance of a dual-band dual-polarized antenna module according to various embodiments;

[0028] Figure 9e It is a graph showing the performance of a dual-band dual-polarized antenna module according to various embodiments;

[0029] Figure 10a The PCB of the antenna module according to an embodiment is shown;

[0030] Figure 10b The configuration of each layer of the PCB of the antenna module according to an embodiment is shown;

[0031] Figure 10c It is a graph showing the performance of the antenna module according to the embodiment;

[0032] Figure 10d It is a graph showing the performance of the antenna module according to the embodiment;

[0033] Figure 11a This is a cross-sectional view of the electronic device as seen from the side according to the embodiment;

[0034] Figure 11b This is a cross-sectional view of the electronic device as seen from the side according to the embodiment;

[0035] Figure 11c This is a cross-sectional view of the electronic device as seen from the side according to the embodiment;

[0036] Figure 12a The PCB and frame of the electronic device are shown as viewed from the side according to an embodiment.

[0037] Figure 12b The PCB and frame of the electronic device are shown as viewed from the side according to an embodiment.

[0038] Figure 12c It is a graph showing the performance of the antenna module according to various implementations;

[0039] Figure 12d It is a graph showing the performance of the antenna module according to various implementations;

[0040] Figure 13 A PCB including a dipole antenna is shown in an electronic device according to an embodiment;

[0041] Figure 14a The PCB is shown as viewed from above according to an embodiment;

[0042] Figure 14b This is a perspective view of the PCB viewed from the side according to the implementation method;

[0043] Figure 14c Antenna performance, depending on the distance between the patch antenna and the ground path in the PCB, is shown according to various implementations;

[0044] Figure 14d Antenna performance depending on the height of the ground path in the PCB is shown according to various implementations;

[0045] Figure 14e Antenna performance, depending on the distance between the patch antenna and the ground path in the PCB, is shown according to various implementations;

[0046] Figure 15a The PCB of the antenna module according to an embodiment is shown;

[0047] Figure 15b This is a perspective view of the PCB viewed from above, according to the implementation method;

[0048] Figure 15cThis is a perspective view of the PCB viewed from the side according to various implementation methods;

[0049] Figure 16a The PCB is shown as viewed from above according to an embodiment;

[0050] Figure 16b Antenna performance depending on the presence / absence of a ground path in the PCB is shown according to various implementations;

[0051] Figure 16c Antenna performance, depending on the distance between the patch antenna and the ground path in the PCB, is shown according to various implementations;

[0052] Figure 16d Antenna performance, depending on the distance between the patch antenna and the ground path in the PCB, is shown according to various implementations;

[0053] Figure 17a The PCB is shown from above according to various embodiments;

[0054] Figure 17b The PCB is shown from above according to various embodiments;

[0055] Figure 18a The grounding paths and patch antenna shapes according to various embodiments are shown;

[0056] Figure 18b The grounding paths and patch antenna shapes according to various embodiments are shown;

[0057] Figure 18c The grounding paths and patch antenna shapes according to various embodiments are shown;

[0058] Figure 18d The grounding paths and patch antenna shapes according to various embodiments are shown;

[0059] Figure 18e The grounding paths and patch antenna shapes according to various embodiments are shown;

[0060] Figure 19a A patch antenna arranged in a 2×2 configuration on a PCB is shown according to various embodiments;

[0061] Figure 19b A patch antenna arranged in a 2×2 configuration on a PCB is shown according to various embodiments;

[0062] Figure 19c A patch antenna arranged in a 2×2 configuration on a PCB is shown according to various embodiments;

[0063] Figure 19dA patch antenna arranged in a 2×2 configuration on a PCB is shown according to various embodiments;

[0064] Figure 20a A PCB including a 1×4 antenna array is shown according to various embodiments;

[0065] Figure 20b A PCB including a 1×4 antenna array is shown according to various embodiments;

[0066] Figure 20c A PCB including a 1×4 antenna array is shown according to various embodiments;

[0067] Figure 20d A PCB including a 1×4 antenna array is shown according to various embodiments;

[0068] Figure 21a A PCB including a 1×5 antenna array is shown according to various embodiments;

[0069] Figure 21b A PCB including a 1×5 antenna array is shown according to various embodiments;

[0070] Figure 21c A PCB including a 1×5 antenna array is shown according to various embodiments; and

[0071] Figure 21d A PCB including a 1×5 antenna array is shown according to various embodiments. Detailed Implementation

[0072] Various embodiments of the present disclosure are described below with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the technical features set forth herein to specific embodiments, but rather to include various modifications, equivalents, or substitutions to embodiments of the present disclosure.

[0073] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input device 150, sound output device 155, display device 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of these components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

[0074] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) and an auxiliary processor 123 (e.g., graphics processing unit (GPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, auxiliary processor 123 may be adapted to consume less power than main processor 121, or adapted for a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0075] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (other than the main processor 121) (e.g., display device 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display device 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123.

[0076] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0077] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0078] Input device 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus).

[0079] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0080] Display device 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display device 160 may include touch circuitry adapted to detect touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of the force caused by touch.

[0081] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0082] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0083] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0084] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0085] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through its tactile or kinesthetic sense. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0086] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0087] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0088] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0089] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0090] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0091] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0092] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, either with further processing or without further processing. For this purpose, technologies such as cloud computing, distributed computing, or client-server computing may be used.

[0093] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0094] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0095] As used herein, the term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0096] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0097] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0098] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0099] Figure 2 This is a block diagram 200 of an electronic device 101 in a network environment including multiple cellular networks, according to various embodiments. (Refer to...) Figure 2 The electronic device 101 may include a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, a third RFIC 226, a fourth RFIC 228, a first radio frequency front-end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna 248. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may further include... Figure 1 The second network 299 may further include at least one of the components of the third RFIC 226, and may further include at least one different network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted, or may be included as part of the third RFIC 226.

[0100] The first communication processor 212 can establish a communication channel in a frequency band to be used in wireless communication with the first cellular network 292, and can support conventional network communication through the established communication channel. According to various embodiments, the first cellular network can be a conventional network, including second-generation (2G), third-generation (3G), fourth-generation (4G), or Long Term Evolution (LTE) networks. The second communication processor 214 can establish a communication channel corresponding to a designed frequency band (e.g., from about 6 GHz to about 60 GHz) in the frequency band to be used in wireless communication with the second cellular network 294, and can support 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 can be a 5G network as defined in 3GPP. Furthermore, according to embodiments, the first communication processor 212 or the second communication processor 214 can establish a communication channel corresponding to another specified frequency band (e.g., below about 6 GHz) in the frequency band to be used in wireless communication with the second cellular network 294. According to embodiments, the first communication processor 212 and the second communication processor 214 can be implemented within a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be constructed together with the processor 120, the auxiliary processor 123, or the communication module 190 within a single chip or a single package. According to embodiments, the first communication processor 212 and the second communication processor 214 may be directly or indirectly coupled to each other via an interface (not shown) to provide or receive data or control signals in either or both directions.

[0101] In the case of transmission, the first RFIC 222 can convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of approximately 700 MHz to approximately 3 GHz used in the first cellular network 292 (e.g., a conventional network). In the case of reception, the RF signal can be acquired from the first cellular network 292 (e.g., a conventional network) via an antenna (e.g., the first antenna module 242) and can be preprocessed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 can convert the preprocessed RF signal back into a baseband signal for processing by the first communication processor 212.

[0102] In the case of transmission, the second RFIC 224 can convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into a Sub6 band (e.g., below about 6 GHz) RF signal (hereinafter, 5G Sub6 RF signal) used in the second cellular network 294 (e.g., a 5G network). In the case of reception, the 5G Sub6 RF signal can be acquired from the second cellular network 294 (e.g., the 5G network) via an antenna (e.g., the second antenna module 244) and can be preprocessed via an RFFE (e.g., the second RFFE 234). The second RFIC 224 can convert the preprocessed 5G Sub6 RF signal back into a baseband signal for processing by the corresponding communication processor (i.e., the first communication processor 212 or the second communication processor 214).

[0103] The third RFIC 226 can convert the baseband signal generated by the second communication processor 214 into an RF signal in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) (hereinafter, 5G Above6 RF signal) for use in the second cellular network 295 (e.g., a 5G network). Upon reception, the 5G Above6 signal can be acquired from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and can be preprocessed by the third RFFE 236. The third RFIC 226 can convert the preprocessed 5G Above6 signal back into a baseband signal for processing by the second communication processor 214. According to an embodiment, the third RFFE 236 can be configured as part of the third RFIC 226.

[0104] According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately or may include the fourth RFIC 228 as part of the third RFIC 226. In this case, the fourth RFIC 228 can convert the baseband signal generated by the second communication processor 214 into an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) RF signal (hereinafter, IF signal), which can then be transmitted to the third RFIC 226. The third RFIC 226 can convert the IF signal into a 5G above6 RF signal. In the case of reception, the 5G above6 RF signal can be received from the second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and can be converted into an IF signal by the third RFIC 226. The fourth RFIC 228 can convert the IF signal into a baseband signal for processing by the second communication processor 214.

[0105] According to an embodiment, the first RFIC 222 and the second RFIC 224 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 can be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one antenna module, namely the first antenna module 242 or the second antenna module 244, can be omitted or can be coupled to another antenna module to process RF signals of multiple corresponding frequency bands.

[0106] According to an embodiment, the third RFIC 226 and the antenna 248 can be disposed on the same substrate to construct a third antenna module 246. For example, the wireless communication module 192 or the processor 120 can be disposed on a first substrate (e.g., a main PCB). In this case, the third antenna module 246 can be constructed by disposing the third RFIC 226 on a portion (e.g., the lower surface) of a second substrate (e.g., a sub-PCB) separate from the first substrate and by disposing the antenna 248 on another portion (e.g., the upper surface). Since the third RFIC 226 and the antenna 248 are disposed on the same substrate, the length of the transmission line between them can be reduced. Therefore, for example, it is possible to prevent the loss (e.g., degradation) of signals in the high-frequency bands (e.g., from about 6 GHz to about 60 GHz) used in 5G network communications due to the transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

[0107] According to an embodiment, antenna 248 may be configured as an antenna array including multiple antenna elements that can be used for beamforming. In this case, the third RFIC 226 may include multiple phase shifters 238 corresponding to the multiple antenna elements, for example, as part of the third RFFE 236. In the case of transmission, the multiple phase shifters 238 can convert the phase of the 5G Above6 RF signal to transmit it to the outside of the electronic device 101 (e.g., a base station of a 5G network) through the respective antenna elements. In the case of reception, the multiple phase shifters 238 can convert the phase of the 5G Above6 RF signal received from the outside through the respective antenna elements into the same or substantially the same phase. Therefore, transmission or reception is possible through beamforming between the electronic device 101 and the outside.

[0108] The second cellular network 294 (e.g., a 5G network) can operate independently of the first cellular network 292 (e.g., a legacy network) (e.g., standalone (SA)) or in conjunction with it (e.g., non-standalone (NSA)). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or a next-generation RAN (NG RAN)) and may not have a core network (e.g., a next-generation core (NGC)). In this case, the electronic device 101 can access the access network of the 5G network and subsequently access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., an evolved packet core (EPC)). Protocol information for communicating with the legacy network (e.g., LTE protocol information) or protocol information for communicating with the 5G network (e.g., new radio (NR) protocol information) can be stored in memory 230 for access by another component (e.g., processor 120, the first communication processor 212, or the second communication processor 214).

[0109] Figure 3 An electronic device 101 according to an embodiment is shown.

[0110] Reference Figure 3 The electronic device 101 according to the embodiment may include a PCB 310, a communication circuit 320 disposed on one side of the PCB 310, and a processor 330 electrically coupled to the communication circuit 320 (e.g., Figure 1 The device 101 includes a processor 120, a rear cover 360, and side members 350 surrounding the space between the display and the rear cover 360. In one embodiment, the housing 380 may include either the side members 350 or the rear cover 360. The side members 350 may include a first side 350-1, a second side 350-2, a third side 350-3, and / or a fourth side 350-4. According to one embodiment, the display may be disposed on at least a portion of the front of the electronic device 101. In another embodiment, the display may occupy a large portion of the front of the electronic device 101.

[0111] In one embodiment, PCB 310 may be disposed adjacent to the second side 350-2 of electronic device 101. Although in Figure 3 The diagram shows PCB 310 disposed in the interior direction of the second side 350-2, but PCB 310 may also be disposed in the interior direction of at least one of the first side 350-1, the third side 350-3, and the fourth side 350-4. According to an embodiment, the electronic device 101 may further include a PCB comprising a mesh antenna element in the interior direction of the display.

[0112] In an embodiment, in addition to PCB 310, electronic device 101 may additionally include at least one PCB. For example, electronic device 101 may include a PCB adjacent to at least one of the first side 350-1, the third side 350-3, and the fourth side 350-4. In an embodiment, the PCB may also be disposed in an inward direction on a portion of the rear cover 360 of electronic device 101. PCB 310 may be electrically coupled to processor 330.

[0113] In one embodiment, the rear camera 370 may be disposed on the back of the electronic device 101. The rear camera 370 may be exposed through certain areas of the back cover 360. In another embodiment, the electronic device 101 may include at least one rear camera disposed in said certain areas.

[0114] In one embodiment, physical keys may be located on the side member 350 of the electronic device 101. For example, a first function key 340 for powering on / off the display or powering on / off the electronic device 101 may be located on the second side 350-2 of the electronic device 101. In another embodiment, a second function key for controlling the volume of the electronic device 101 or controlling the screen brightness, etc., may be located on the third side 350-3 of the electronic device 101. Additionally, extra buttons or keys may be located on the front or back of the electronic device 101.

[0115] Figure 1 The electronic device 101 corresponds to only one example and does not limit the shape of the device to which the technical concepts disclosed in this document are applied. For example, the technical concepts disclosed in this document can also be applied to foldable electronic devices that can be folded horizontally or vertically by employing a flexible display and hinge structure, or to electronic devices, tablet computers, or laptops that can slide by using a flexible display.

[0116] In the following text, for ease of explanation, based on Figure 3 Various implementation methods are described using the electronic device 101.

[0117] Figure 4 A PCB310 included in an antenna module 240 of an electronic device according to an embodiment is shown.

[0118] For example, Figure 4 It is a reference point viewed from one side. Figure 3 A perspective view of PCB 310 as described.

[0119] Reference Figure 4In one embodiment, the third antenna module 240 may include a PCB 310, communication circuitry 320, and / or a module interface (not shown). The PCB 310 may include at least an antenna array 430 and a ground plane 440. The communication circuitry 320 may include a radio frequency integrated circuit (RFIC). The PCB 310 may further include a power management integrated circuit (PMIC). As another example, the antenna module 240 may further include a shielding member 450. In other embodiments, at least one of the above components may be omitted, or at least two of the components may be integrally constructed.

[0120] In an implementation, PCB 310 may include multiple layers. For example, PCB 310 may include multiple conductive layers and multiple non-conductive layers stacked alternately with the conductive layers. For example, at least one conductive layer and / or at least one non-conductive layer may be configured between a first layer 410 in which a first patch antenna 431 is disposed and a second layer 420 in which ground 440 is disposed. In an example, a layer excluding the antenna element may be included between the first layer 410 and the second layer 420.

[0121] In an implementation, PCB 310 can provide electrical connections between various external electronic components and / or another PCB by using wiring and conductive paths constructed on a conductive layer.

[0122] In an embodiment, antenna array 430 may include a plurality of patch antennas 431, 432, 433, and 434 configured to form a directional beam. For example, the plurality of patch antennas 431, 432, 433, and 434 may constitute an antenna array having an M×N array (such as 1×5, 5×1, 1×4, 4×1, or 2×2). For example, antenna array 430 may be an antenna array for beamforming in a direction including the vertical direction of the first patch antenna 431. In this respect, with Figure 2 The description of antenna 248 can be applied to Figure 4 Antenna array 430. In an embodiment, multiple patch antennas 431, 432, 433 and 434 can operate as patch antennas.

[0123] In one embodiment, as shown, patch antennas 431, 432, 433, and 434 can be constructed on a first layer 410 (e.g., a first surface) of PCB 310. According to another embodiment, antenna array 430 can be constructed inside PCB 310. According to another embodiment, antenna array 430 can include multiple antenna arrays having the same or different shapes or types. For example, the multiple antenna arrays can include dipole antenna arrays and / or patch antenna arrays. The multiple patch antennas 431, 432, 433, and 434 can have at least any one of the shapes, such as circular, elliptical, and rectangular. In one embodiment, a dielectric layer can be constructed in the +z direction of the multiple patch antennas 431, 432, 433, and 434.

[0124] In an implementation, the communication circuit 320 (e.g., Figure 2 The third RFIC (226) can be located in another area of ​​the PCB 310 (e.g., the second side opposite the first side). The communication circuit 320 can be configured to process signals of the selected frequency band transmitted and / or received via the antenna array. According to an embodiment, in the case of transmission, the communication circuit 320 can convert the baseband signal obtained from the communication processor into an RF signal of the specified frequency band. In the case of reception, the communication circuit 320 can convert the RF signal received via the antenna array into a baseband signal and send it to the communication processor.

[0125] In one implementation, during transmission, the communication circuit 320 can up-convert the IF signal obtained from the intermediate frequency integrated circuit (IFIC) into an RF signal of the selected frequency band. In this implementation, the IF signal may correspond to a frequency band of approximately 9 GHz to approximately 15 GHz. As another example, with... Figure 2 The description related to the fourth RFIC 228 can be applied to the IFIC. As another example, in the case of reception, the communication circuit 320 can down-convert the RF signal acquired by the antenna array 430 into an IF signal and send it to the IFIC.

[0126] In this implementation, the PMIC may be located in some other area of ​​the PCB 310. The voltage is supplied by a battery, and the PMIC can provide the power required by the various components (e.g., communication circuitry 320) included in the antenna module 240.

[0127] In one embodiment, the shielding member 450 may be disposed on a portion of the PCB 310 (e.g., a second side) to electrically shield the communication circuit 320. According to another embodiment, the shielding member 450 may include a shielding cover.

[0128] In one implementation, PCB 310 can be electrically coupled to different PCBs (e.g., a circuit board on which processor 330 is disposed) via a module interface (not shown). The module interface may include connecting components such as coaxial cable connectors, board-to-board connectors, inserters, or flexible printed circuit boards (FPCBs). The communication circuitry 320 of antenna module 240 can be electrically coupled to different PCBs via these connecting components.

[0129] In some embodiments, the first ground path 406 and / or the second ground path 408 may be disposed within the PCB 310 to improve coupling characteristics between power supply paths. For example, the first ground path 406 and the second ground path 408 may be grounded to ground 440 and configured to penetrate some areas of the PCB 310. In embodiments of this disclosure, the first ground path 406 and / or the second ground path 408 may include paths or patterns constructed by a via process.

[0130] In one implementation, the first patch antenna 431 may include a first point 402-1 and a second point 404-1. As another example, the PCB 310 may include a third point 406-1 and a fourth point 408-1. In another implementation, the third point 406-1, where the first ground path 406 is located, may be positioned in the -x and -y quadrants relative to the center point of the first patch antenna 431. The first point 402-1, where the first feed path 402 is located, may be positioned in the -x and -y quadrants relative to the center point of the first patch antenna 431. The fourth point 408-1, where the second ground path 408 is located, may be positioned in the +x and -y quadrants relative to the center point of the first patch antenna 431. The second point 404-1, where the second feed path 404 is located, may be positioned in the +x and -y quadrants relative to the center point of the first patch antenna 431. Due to the deployment of the first to fourth points 402-1, 404-1, 406-1, and 408-1, the coupling characteristics between the feed paths can be improved.

[0131] The described structure can be applied not only to the first patch antenna 431, but also to at least one of the patch antennas 432, 433, and 434 arranged side by side. For example, two ground paths corresponding to the patch antennas included in the antenna array 430 can be configured.

[0132] Although the ground path and feed path are constructed on PCB 310 in the described structure, this is merely an example. Therefore, in addition to PCB 310, the ground path and / or feed path can be constructed in another hardware configuration that may be referred to as an antenna structure.

[0133] Figure 5This is a perspective view 500 of the PCB 310 of the single-band dual-polarized antenna module 240, viewed from the side according to the embodiment.

[0134] Reference Figure 5 PCB 310 may include a first patch antenna 431 constructed on a first layer 410, a ground 440 constructed on a second layer 420, a first feed path 402, a second feed path 404, a first ground path 406 and / or a second ground path 408.

[0135] In an implementation, the antenna module 240 may include communication circuitry disposed on one side of the PCB 310 (e.g., Figure 4 The PCB 310 may include a first power supply path 402 or a second power supply path 404 electrically coupled to the communication circuit 320.

[0136] In one embodiment, at least one conductive layer or at least one non-conductive layer or cavity for impedance matching may be included between ground 440 and the first layer 410, and the first patch antenna 431 is disposed on the first layer 410. (See reference...) Figure 5 According to the embodiment, the first patch antenna 431 connected to the first layer 410 can be configured to be spaced apart from the first feed path 402 and can be indirectly fed through the first feed path 402. In another embodiment, the first patch antenna 431 can be directly fed by the first feed path 402. In the embodiment, the first feed path 402 and / or the second feed path 404 may include pathways penetrating a first number of layers and can be electrically coupled to the communication circuit 320. For example, the first number may be 4 to 8. The communication circuit 320 can use feed paths 402 and 404 to feed the first patch antenna 431.

[0137] According to an embodiment, the first ground path 406 and / or the second ground path 408 can be provided to the PCB 310 by being spaced apart from the first patch antenna 431. For example, ground paths 406 and 408 can be provided by being spaced apart from the center point of the first patch antenna 431 by substantially the same distance. In an embodiment, ground paths 406 and 408 can be substantially parallel to the first feed path 402 and / or the second feed path 404.

[0138] Figure 6a This is a view 600 showing the PCB 310 of a single-band dual-polarized antenna module 240 according to various embodiments. Figure 6b and Figure 6c This shows that it depends on the grounding path (e.g., Figure 4 The efficiency curve of the antenna module 240 deployed with grounding paths 406 and 408.

[0139] Reference Figure 6b and Figure 6c Figure 6 shows graphs illustrating the return loss of the antenna module 240 according to embodiments 610 to 640 and graphs illustrating the mutual coupling characteristics of the antenna module 240 according to embodiments 610 to 640. PCB 310 is partially shown in embodiments 610, 620, 630, and 640 of Figure 6.

[0140] According to various embodiments of this disclosure, the PCB 310 of the first embodiment 610 may not have a ground path disposed around the first patch antenna 431.

[0141] According to the second embodiment 620, the PCB 310 may include four ground paths configured to the first quadrant, the second quadrant, the third quadrant, or the fourth quadrant.

[0142] According to the third embodiment 630, the PCB 310 may include a first ground path 406 disposed in the third quadrant or a second ground path 408 disposed in the fourth quadrant.

[0143] According to the fourth embodiment 640, the PCB 310 may include a first ground path 406 disposed in a first quadrant or a second ground path 408 disposed in a second quadrant.

[0144] In the first to fourth embodiments 610, 620, 630 and 640, the first power supply path 402 can be set in the first quadrant and the second power supply path 404 can be set in the second quadrant.

[0145] Reference Figure 6b It shows that the return loss characteristics of the second embodiment 620 and the fourth embodiment 640 are excellent in the first target frequency band (e.g., 26.5 GHz to 29.5 GHz).

[0146] Reference Figure 6c This demonstrates that the coupling characteristics of the fourth embodiment 640 are relatively excellent in the first target frequency band (e.g., 26.5 GHz to 29.5 GHz). Ground paths 406 and 408 can be used, for example, for inductive polarization, making feed-to-feed coupling less likely to occur.

[0147] In an implementation, the angle formed by the first virtual line 602 and the second virtual line 604 can be a specific angle between 60° and 120°, thereby improving the dual-polarization characteristics of the antenna. The first line 602 can be a connection to a first point (e.g., Figure 4 The first point (402-1) and the third point (e.g., Figure 4 The third point 406-1) is the line. The second virtual line 604 can be the line connecting the second point (e.g., Figure 4 Point 2 (404-1) and point 4 (e.g., Figure 4 The fourth point (408-1) is the line.

[0148] In one embodiment, in order to improve the coupling characteristics of the dual-polarized antenna, the PCB 310 of the antenna module 240 can be implemented as in the fourth embodiment 640, in which the coupling characteristics are relatively excellent in the first target frequency band.

[0149] Figure 7 This is a partial view showing the PCB 310 of the antenna module 240 according to an embodiment. Figure 7 The structures of the first patch antenna 431 and the second patch antenna 720 corresponding to an N×M antenna array are shown. For example, Figure 7 The structure shown can be applied to 1×4, 1×5 or 2×2 antenna arrays.

[0150] Reference Figure 7 At least one conductive layer or at least one non-conductive layer may be used to construct the first layer 410 in which the first patch antenna 431 is disposed (e.g., Figure 4 The first layer 410 and the third layer 710 in which the second patch antenna 720 is disposed may be located between the first layer 410, in which the first patch antenna 431 is disposed, and the third layer 710 in which the second patch antenna 720 is disposed. According to an embodiment, the third layer 710 may be positioned further from the ground 440 than the first layer 410. The second patch antenna 720 may be positioned further from the ground 440 than the first patch antenna 431. When viewed from above the third layer 710, the second patch antenna 720 may be configured to at least partially overlap with the first patch antenna 431.

[0151] According to the embodiment, the size of the second patch antenna 720 can be smaller than the size of the first patch antenna 431. For example, the length of the first patch antenna 431, which has a square shape, can be about 2.4 mm to about 2.5 mm, and the length of the second patch antenna 720, which has a square shape, can be about 1.7 mm to about 1.8 mm.

[0152] According to an embodiment, the second patch antenna 720 may be configured to transmit and / or receive signals in a higher frequency band than the first patch antenna 431. For example, the first patch antenna 431 may be operable to transmit and / or receive signals in the 26.5 GHz to 29.5 GHz frequency band, and the second patch antenna 720 may be configured to transmit and / or receive signals in the approximately 36 GHz to approximately 40 GHz frequency band.

[0153] According to an embodiment, the first patch antenna 431, which will be disposed on the first layer 410, can be fed through a first feed path 402 and a second feed path 404. In an embodiment, the first patch antenna 431 can be fed directly or indirectly through the first feed path 402 and the second feed path 404. For example, feed paths 402 and 404 can be coupled to the first patch antenna 431 by extending to the first layer 410, and thus can directly feed the first patch antenna 431. As another example, feed paths 402 and 404 can be extended to a layer lower than the first layer without coupling to the first patch antenna 431, and can indirectly feed the first patch antenna 431.

[0154] According to an embodiment, the second patch antenna 720 disposed on the third layer 710 can be fed via a third feed path 712 and a fourth feed path 714. In an embodiment, the second patch antenna 720 can be fed directly or indirectly via the third feed path 712 and the fourth feed path 714. For example, feed paths 712 and 714 can be coupled to the second patch antenna 720 by extending to the third layer 710, thus directly feeding the second patch antenna 720. As another example, feed paths 712 and 714 can be extended to a layer lower than the third layer 710 (e.g., the first layer) without coupling to the second patch antenna 720, and can indirectly feed the second patch antenna 720. In an embodiment, the third feed path 712 and the fourth feed path 714 can be implemented by penetrating the first patch antenna 431.

[0155] In this embodiment, the location of the first grounding path 406 and the second grounding path 408 may affect the coupling characteristics of the antenna module 240. In this embodiment, the third point 406-1 where the first grounding path 406 is located and the fourth point 408-1 where the second grounding path 408 is located may be adjacent to the first point 402-1 (e.g., Figure 4 Point 1 (402-1) and Point 2 (404-1, for example, Figure 4 The second point 404-1). For example, the first point 402-1 may be located near the first corner 730, and the third point 406-1 may be located on the virtual line connecting the first corner 730 and the first point 402-1. As another example, the second point 404-1 may be located near the second corner 740 of the first patch antenna 431, and the fourth point 408-1 may be located on the virtual line connecting the second corner 740 and the second point 404-1. In the implementation, the angle formed by the virtual line connecting the first point 402-1 and the third point 406-1 and the virtual line connecting the second point 404-1 and the fourth point 408-1 may be a specified angle between approximately 60° and approximately 120°.

[0156] In one implementation, the first ground path 406 and the second ground path 408 may be grounded to ground 440 located in the second layer 420. For example, ground paths 406 and 408 may penetrate a third number of layers. As another example, ground paths 406 and 408 may reach at least half the height of the entire layer of PCB 310.

[0157] In this embodiment, the fifth point 712-1 where the third feed path 712 is located and the sixth point 714-1 where the fourth feed path 714 is located can be situated within a region of the second patch antenna 720. For example, the fifth point 712-1 and the sixth point 714-1 can be located on the same plane as the third point 406-1 and the fourth point 408-1. The fifth point 712-1 and the sixth point 714-1 can be located in the +y direction relative to the center of the second patch antenna 720, and the third point 406-1 and the fourth point 408-1 can be located in the -y direction relative to the center of the second patch antenna 720. In this embodiment, the first patch antenna 431 can resonate in the first frequency band, and the second patch antenna 720 can resonate in the second frequency band. The position of the third feed path 712 or the fourth feed path 714 feeding the second patch antenna 720 can be flexible.

[0158] Figure 8 This is a perspective view 800 of the PCB310 of the dual-band dual-polarized antenna module 240, viewed from the side according to the embodiment. Figure 8 This could be a perspective view of PCB 310 as seen from the side.

[0159] Reference Figure 8 PCB 310 may include a first patch antenna 431 constructed on a first layer 410, a ground 440 constructed on a second layer 420, a second patch antenna 720 constructed on a third layer 710, a first feed path 402, a fourth feed path 714, a first ground path 406 and / or a second ground path 408.

[0160] In an embodiment, the antenna module 240 may include communication circuitry (not shown) constructed on one side of the PCB 310 (e.g., Figure 4 The communication circuit 320). The PCB 310 may include a first power supply path 402, a second power supply path 404, a third power supply path 712 and / or a fourth power supply path 714 electrically coupled to the communication circuit 320.

[0161] In one implementation, the first feed path 402 and the second feed path 404 may include pathways penetrating a first number of layers and may be electrically coupled to the communication circuit 320. For example, the first number may be 4 to 8. The communication circuit 320 may use feed paths 402 and 404 to feed the first patch antenna 431. The third feed path 712 and the fourth feed path 714 may include pathways penetrating a second number of layers and may be electrically coupled to the communication circuit 320. For example, the second number may be 6 to 10. The communication circuit 320 may use feed paths 712 and 714 to feed the second patch antenna 720. For example, feed paths 712 and 714 may be configured to feed the second patch antenna 720 by penetrating the first patch antenna 431 without necessarily being electrically coupled to the first patch antenna 431.

[0162] In one embodiment, the first patch antenna 431 may be spaced apart from the second patch antenna 720 and may be arranged parallel to the second patch antenna 720. The first patch antenna 431 may be closer to ground 440 than the second patch antenna 720. The electronic device 101 may include a dielectric layer or a non-dielectric layer between the first patch antenna 431 and the second patch antenna 720, or a cavity for impedance matching.

[0163] Figure 9a The PCB 310 of a dual-band dual-polarized antenna module 240 according to various embodiments is partially shown. Figures 9b to 9d This is a graph showing the efficiency of the antenna module 240 deployed according to grounding paths 406 and 408.

[0164] Reference Figures 9b to 9e Figure 9 shows graphs illustrating the return loss of antenna modules 240 according to the first embodiment 910, the second embodiment 920, the third embodiment 930, and the fourth embodiment 940, as well as graphs illustrating the mutual coupling characteristics of antenna modules 240 according to the first embodiment 910, the second embodiment 920, the third embodiment 930, and the fourth embodiment 940. A portion of the PCB is shown in embodiments 910, 920, 930, and 940 shown in Figure 9.

[0165] According to various embodiments of this disclosure, the PCB 310 according to the first embodiment 910 may not have a ground path disposed around the first patch antenna 431 and the second patch antenna 720 (e.g., Figure 8 (First grounding path 406 or second grounding path 408).

[0166] According to the second embodiment 920, the PCB 310 may include four ground paths configured to the first quadrant, the second quadrant, the third quadrant, or the fourth quadrant.

[0167] According to the third embodiment 930, the PCB 310 may include a first ground path 406 disposed in the third quadrant or a second ground path 408 disposed in the fourth quadrant.

[0168] According to the fourth embodiment 940, the PCB 310 may include a first ground path 406 disposed in the first quadrant or a second ground path 408 disposed in the second quadrant.

[0169] In the first to fourth embodiments 910, 920, 930 and 940, the first power supply path 402 can be set in the first quadrant and the second power supply path 404 can be set in the second quadrant.

[0170] Reference Figure 9b This demonstrates that the return loss characteristics of the second embodiment 920 and the fourth embodiment 940 are excellent in the first target frequency band of the first patch antenna 431 (e.g., about 26.5 GHz to about 29.5 GHz).

[0171] Reference Figure 9c This demonstrates that the coupling characteristics of the fourth embodiment 940 are relatively superior in the first target frequency band of the first patch antenna 431 (e.g., from about 26.5 GHz to about 29.5 GHz). When transmitting and / or receiving the first polarized signal via the first feed path 402, the PCB 310 can have a relatively small impact on the second feed path 404. This can also be applied substantially equivalently to the opposite situation.

[0172] Reference Figure 9d This demonstrates that the return loss characteristics of the fourth embodiment 940 are excellent in the second target frequency band of the second patch antenna 720 (e.g., from about 36 GHz to about 40 GHz).

[0173] Reference Figure 9e This demonstrates that the coupling characteristics of the fourth embodiment 940 are excellent in the second target frequency band of the second patch antenna 720 (e.g., from about 36 GHz to about 40 GHz). When the third polarized signal is transmitted and / or received through the third feed path 712, the antenna module 240 can have a relatively small impact on the fourth feed path 714. This can also be applied substantially equivalently to the opposite situation.

[0174] In one embodiment, in order to improve the coupling characteristics of the dual-polarized antenna, the antenna module 240 of the electronic device 101 can be implemented as in the fourth embodiment 940, in which the coupling characteristics are relatively good in the second target frequency band.

[0175] Figure 10a The PCB 310 of the antenna module 240 according to an embodiment is shown. Figure 10bThe configuration for each layer of PCB 310 according to an embodiment is shown. Figure 10c The performance of the antenna module 240 according to an embodiment is shown. Figure 10d The performance of the antenna module 240 according to an embodiment is shown.

[0176] Reference Figure 10a PCB 310 may include a first patch antenna 431, a second patch antenna 720, a first feed path 402, a second feed path 404, a ground 440, or a periodic structure 1020. For example, the periodic structure 1020 may widen the effective bandwidth of the antenna module 240 including PCB 310.

[0177] In one embodiment, the overall shape of the periodic structure 1020 can be configured to surround either the first patch antenna 431 or the second patch antenna 720. The periodic structure 1020 may include at least one element. For example, the periodic structure 1020 may include 16 elements and may surround the second patch antenna 720. In one embodiment, the element may be a conductive pattern. As another example, the number of elements included in the periodic structure 1020 can be varied.

[0178] In the implementation method, refer to Figure 10b PCB (e.g., Figure 4 The PCB 310 may include multiple layers (e.g., 14 layers).

[0179] In one implementation, the periodic structure 1020 may be disposed on layer 1. In another example, the periodic structure 1020 may be disposed parallel to the same layer (e.g., layer 2) as the second band patch antenna (e.g., second patch antenna 720). Figure 10b Only one embodiment is shown, and the second patch antenna 720 may be placed at a lower or higher layer than the periodic structure 1020.

[0180] In this implementation, ground 440 can be located on layers 9 and 11. Logic circuitry can be constructed on layers 12 to 14. Feed lines and filters can be located on layer 10.

[0181] In the implementation, the second frequency band patch (e.g., Figure 7 The second patch antenna 720 can be fed through a feed path for the second frequency band (e.g., Figure 7 The third feed path 712 and the fourth feed path 714 are fed directly or indirectly. For example, the feed path (e.g., Figure 7 The third feed path 712 and the fourth feed path 714 can be constructed from layers 12 to 3, and a second frequency band path to layer 2 (e.g., Figure 7The second patch antenna 720 can be fed via a feed path (e.g., Figure 7 The third feed path 712 and the fourth feed path 714 are fed.

[0182] In an implementation, the first frequency band patch (e.g., Figure 7 The first patch antenna 431 can be fed through a feed path for the first frequency band (e.g., Figure 7 The third feed path 712 and the second feed path 404) are fed directly or indirectly. For example, the feed path (e.g., Figure 7 The first feed path 402 and the second feed path 404 can be constructed from layers 12 to 6, and a first frequency band path to layer 5 (e.g., Figure 7 The first patch antenna 431 can be fed through a feeding path (e.g., Figure 7 The first feed path 402 and the second feed path 404 are fed.

[0183] In an implementation, a core layer may be included between layers 7 and 8. Due to the core layer, the power supply path (e.g., Figure 7 The first feed path 402 and the second feed path 404) and the grounding path (e.g., Figure 7 The first grounding path 406 and the second grounding path 408 can be implemented as cascaded paths instead of linear paths.

[0184] In one embodiment, the width 1030 of ground 440 can be approximately 3.5 mm, and the length 1034 of ground 440 can be approximately 23.8 mm. The center-to-center distance 1032 of the patch antenna arranged side-by-side with PCB 310 can be approximately 5.7 mm. The above values ​​represent only one embodiment and may be less than or greater than the above values.

[0185] In this implementation, the first patch antenna 431 and the second patch antenna 720 may have the same center. For example, when viewed from above the second patch antenna 720, the center of the second patch antenna 720 and the center of the first patch antenna 431 may overlap.

[0186] In the implementation, Figure 10c The achieved gains are illustrated. 1042 may represent the gain achieved when receiving a first polarized signal from the first patch antenna 431, and 1044 may represent the gain achieved when receiving a third polarized signal from the second patch antenna 720. For example, the first polarized signal may include -45° polarization, and the third polarized signal may include -45° polarization.

[0187] In the implementation, Figure 10dCross-polarization identification is shown. 1052 can represent cross-polarization identification when receiving the first polarization signal of the first patch antenna 431, and 1054 can represent cross-polarization identification when receiving the third polarization signal of the second patch antenna 720.

[0188] Figure 10a The illustrated embodiments include an antenna array including a first patch antenna 431 and an antenna array including a second patch antenna 720, but there may be embodiments in which the antenna array including the second patch antenna 720 is omitted.

[0189] Figures 11a to 11c This is a cross-sectional view of the electronic device 101 viewed from the side according to various embodiments of the present disclosure. Figure 11b and Figure 11c A cross-section of the electronic device 101 taken along direction A-A' can be shown.

[0190] Reference Figure 11a The electronic device 101 may include side members located on the electronic device 101 (e.g., Figure 3 The PCB 310 is located near the side member 350. For example, the PCB 310 may be adjacent to the side member (e.g., Figure 3 The second side 350-2 or the third side 350-3) is disposed inside the housing. The PCB 310 may be disposed on the side of the electronic device 101 to transmit and / or receive radio signals in the -x direction.

[0191] In some embodiments, PCB 1100 may be positioned adjacent to the side of electronic device 101 on the +y axis and may be positioned close to the opposite side (e.g., the back side) of the side where the display is located. For example, PCB 1100 may be configured to transmit and / or receive radio signals in the direction of the back side of electronic device 101. Various embodiments of PCB 310 described in the various embodiments of the specification may be applied equivalently or similarly to PCB 1100.

[0192] Reference Figure 11b and Figure 11c The rear housing 1140 may be disposed on the back of the electronic device 101 and may form at least a portion of the side surface. For example, the rear housing 1140 may comprise a non-conductive material such as plastic. A support member 1110 including conductive components may be disposed between the front display 1150 and the rear housing 1140. The support member 1110 may form at least a portion of the side surface of the electronic device 101 and may support various components included in the electronic device 101.

[0193] Reference Figure 11bIn an embodiment, when the width 1120 of the PCB 310 is approximately 3.5 mm, it can be placed without interfering with the housing of the electronic device 101 (e.g., Figure 3 The device is positioned in contact with the housing 380. For example, when the width 1120 is about 3.5 mm, the overall size (e.g., thickness) of the electronic device 101 can be reduced based on the width 1120.

[0194] Reference Figure 11c In an embodiment, when the width 1130 of the PCB 310 is approximately 4.2 mm, it can be integrated with the housing of the electronic device 101 (e.g., Figure 3 The housing 380) contacts. For example, when the width 1130 is about 4.2 mm, the overall size (e.g., thickness) of the electronic device 101 can be reduced based on the width 1130.

[0195] In an embodiment, the support member 1110 of the electronic device 101 may include a conductive material, and at least a portion of the conductive material may form at least a portion of the side surface of the electronic device 101.

[0196] In implementations, the positional relationship between the support member 1110 and the grounding path included in the PCB 310 may affect the performance of the antenna module 240 including the PCB 310. The performance of the antenna module 240 based on the position of the grounding path and the support member 1110 is shown below.

[0197] Figure 12a and Figure 12b The PCB 310 and frame 1110 are shown as viewed from the side of the electronic device according to various embodiments.

[0198] Reference Figure 12a The first grounding path 406 may be disposed in the quadrants of the +y and -z directions relative to the first feed path 402. The second grounding path 408 may be disposed in the quadrants of the -y and -z directions relative to the second feed path 404. In embodiment 1210, the first grounding path 406 and the second grounding path 408 may be spaced apart from the support member 1110 and / or the metal support member (e.g., metal bracket) 1230 in the -z direction.

[0199] Reference Figure 12b The first grounding path 406 can be positioned in the quadrants of the +y and +z directions relative to the first feed path 402. The second grounding path 408 can be positioned in the quadrants of the -y and +z directions relative to the second feed path 404. Figure 12bAs shown, when viewed from above the first patch antenna 431, the first ground path 406 and the second ground path 408 can be configured to overlap with the support member 1110 and / or the metal support member 1230.

[0200] Reference Figure 12c The graphs according to Embodiment 1210 can represent the gain 1202 achieved when receiving the first polarization signal of the first patch antenna 431, the gain 1204 achieved when receiving the second polarization signal of the first patch antenna 431, the gain 1206 achieved when receiving the third polarization signal of the second patch antenna 720, and the gain 1208 achieved when receiving the fourth polarization signal of the second patch antenna 720. For example, the first polarization signal may include -45° polarization, the second polarization signal may include +45° polarization, the third polarization signal may include -45° polarization, and the fourth polarization signal may include +45° polarization. This can also be applied substantially equivalently to Embodiment 1220.

[0201] Reference Figure 12d The graph according to embodiment 1220 can represent the gain 1212 when receiving the first polarization signal of the first patch antenna 431, the gain 1214 when receiving the second polarization signal of the first patch antenna 431, the gain 1216 when receiving the third polarization signal of the second patch antenna 720, and the gain 1218 when receiving the fourth polarization signal of the second patch antenna 720.

[0202] Compare Figure 12c and Figure 12d It shows that in a first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz), the gain of the implementation of embodiment 1210 is higher than the gain of the implementation of embodiment 1220. It also shows that in a second target frequency band (e.g., from about 36 GHz to about 40 GHz), the gain of the implementation of embodiment 1210 is higher than the gain of the implementation of embodiment 1220.

[0203] According to the implementation, when the first grounding path 406 and the second grounding path 408 are arranged adjacent to the first feed path 402 and the second feed path 404, and when the first grounding path 406 and the second grounding path 408 are arranged as far away as possible from the third feed path 712, the fourth feed path 714, the support member 1110 and / or the metal support member 1230, the antenna gain for the realization of the first polarization signal to the fourth polarization signal can be high.

[0204] Figure 13 A PCB 310 including a patch antenna and a dipole antenna in an electronic device according to an embodiment is shown.

[0205] According to an embodiment, PCB 310 may include a patch antenna array 430 or a dipole antenna array 1310. For example, the dipole antenna array 1310 may include a plurality of dipole antennas 1311, 1312, 1313, 1314, and 1315, and the plurality of dipole antennas 1311, 1312, 1313, 1314, and 1315 may be arranged in a 1×k array pattern (e.g., a 1×4 array or a 1×5 array) at positions corresponding to the plurality of patch antennas 431, 432, 433, 434, and 435. Although in Figure 13 The example illustrates multiple dipole antennas arranged in a 1×4 or 1×5 array, but multiple dipole antennas can be configured in various other ways. Although in Figure 13 The example illustrates a 1×4 or 1×5 array of multiple patch antennas, but in addition, multiple patch antennas can be arranged in various other ways.

[0206] According to the implementation, the dipole antenna can have both (+) and (-) polarities. For example, antenna elements 1311-1, 1312-1, 1313-1, 1314-1, and 1315-1 can have (+) polarities, while antenna elements 1311-2, 1312-2, 1313-2, 1314-2, and 1315-2 can have (-) polarities. The (+) polarity can be a feed path for electrically coupling the multiple dipole antennas 1311, 1312, 1313, 1314, and 1315. The multiple dipole antennas 1311, 1312, 1313, 1314, and 1315 can be coupled to ground 440 and communication circuitry (e.g., Figure 3 The communication circuit 320. The power supply path may include a connection point that couples multiple dipole antennas 1311, 1312, 1313, 1314 and 1315 to the communication circuit 320.

[0207] According to an embodiment, the dipole antenna array 1310 may be an antenna array oriented perpendicular to the direction in which the patch antenna array 430 performs transmission and / or reception. For example, the electronic device 101 may transmit and / or receive radio signals to the side of the electronic device 101 via the patch antenna array 430, and may transmit and / or receive radio signals in the front or back direction of the electronic device via the dipole antenna array 1310.

[0208] According to the implementation, the filling cut area may exist between the patch antenna array 430 and the dipole antenna array 1310.

[0209] Figure 14a The PCB 310 as viewed from above is shown according to an embodiment. Figure 14b This is a perspective view of PCB 310 viewed from the side according to the embodiment. Figure 14cAntenna performance, depending on the distance between the patch antenna and the ground path in PCB310, is shown according to various embodiments. Figure 14d Antenna performance depending on the ground path height in PCB310 is shown according to various embodiments. Figure 14e Antenna performance, depending on the distance between the patch antenna and the ground path in PCB 310, is shown according to various embodiments.

[0210] Figures 14c to 14d Antenna performance can be shown depending on the distances from the center of the first patch antenna 431 in the +x and -y axis directions of ground paths 406 and 408. Figure 14d Antenna performance can be shown depending on the height of ground paths 406 and 408.

[0211] Reference Figure 14a and Figure 14b This distance can be represented by a first distance 1412 and a second distance 1414. The first distance 1412 can represent the linear distance of the first grounding path 406 or the second grounding path 408 from the center of the first patch antenna 431 in the x-axis direction. The second distance 1414 can represent the linear distance of the first grounding path 406 or the second grounding path 408 from the center of the first patch antenna 431 in the y-axis direction.

[0212] Reference Figure 14c This illustrates how the return loss characteristics of feed paths 402 and 404 vary with a first distance 1412 within a first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz). It shows that case 1422, where the first distance 1412 is about 1.65 mm, exhibits better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1421, where the first distance 1412 is about 1.55 mm. It also shows that case 1423, where the first distance 1412 is about 1.75 mm, exhibits better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1422, where the first distance 1412 is about 1.65 mm. For example, increasing the first distance 1412 to a certain level (e.g., 1.75 mm) may result in improved impedance matching characteristics and increased bandwidth.

[0213] Reference Figure 14dThis illustrates that, in a first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz), the return loss characteristics of feed paths 402 and 404 vary depending on the height 1416 of ground paths 406 and 408. For example, the height can be the length of the ground path starting from ground 440. It shows that case 1432, with a height 1416 of about 0.7 mm, has better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1431, with a height 1416 of about 0.6 mm. It also shows that case 1433, with a height 1416 of about 0.8 mm, has better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1432, with a height 1416 of about 0.7 mm. For example, increasing the height 1416 to a certain level (e.g., 0.8 mm) may result in improved impedance matching characteristics and increased bandwidth in the first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz).

[0214] Reference Figure 14e This illustrates how the return loss characteristics of feed paths 402 and 404 vary with a second distance 1414 within a first target frequency band (e.g., approximately 26.5 GHz to approximately 29.5 GHz). It shows that case 1442, where the second distance 1414 is approximately 1.65 mm, exhibits better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1441, where the second distance 1414 is approximately 1.55 mm. It also shows that case 1443, where the second distance 1414 is approximately 1.75 mm, exhibits better return loss characteristics for the first feed path 402 and the second feed path 404 than case 1442, where the second distance 1414 is approximately 1.65 mm. For example, increasing the second distance 1414 to a certain level (e.g., 1.75 mm) may result in improved impedance matching characteristics and increased bandwidth.

[0215] Figure 15a The PCB 310 of the antenna module 240 according to an embodiment is shown. Figure 15b This is a perspective view of PCB 310 viewed from above, according to the embodiment. Figure 15c This is a perspective view of PCB 310 viewed from the side according to various embodiments.

[0216] Figure 15a This is a simplified perspective view of PCB 310 according to an embodiment. (Refer to...) Figure 15a At least a portion of the first ground path 406 and the second ground path 408 can be implemented using a via process. The first ground path 406 and the second ground path 408 can include various shapes. For example, the first ground path 406 or the second ground path 408 can be configured in a linear shape or in a cascaded shape.

[0217] In one embodiment, when viewed from above the first patch antenna 431, the overall shape of the periodic structure 1020 can be configured to surround either the first patch antenna 431 or the second patch antenna 720. The periodic structure 1020 may include at least one element. For example, the periodic structure 1020 may include 16 elements and may surround the second patch antenna 720. In one embodiment, the elements may be conductive patterns. As another example, the number of elements included in the periodic structure 1020 can be varied.

[0218] In one implementation, the periodic structure 1020 may be disposed parallel to the same layer (e.g., layer 1 of FIG. 10) as the first band patch antenna (e.g., first patch antenna 431) or the second band patch antenna (e.g., second patch antenna 720). As another example, the first patch antenna 431 or the second patch antenna 720 may be disposed on a layer lower or higher than the periodic structure 1020.

[0219] Figure 15b The PCB 310, viewed from above according to an embodiment, is partially shown. (Refer to...) Figure 15b The first feed path 402 can be positioned in the -y direction relative to the center of the first patch antenna 431. The second feed path 404 can be positioned in the +x direction relative to the center of the first patch antenna 431. The third feed path 712 can be positioned in the -x direction relative to the center of the second patch antenna 720. The fourth feed path 714 can be positioned in the +y direction relative to the center of the second patch antenna 720.

[0220] In one implementation, the first grounding path 406 may be positioned in the -x and -y quadrants relative to the center of the first patch antenna 431. The second grounding path 408 may be positioned in the +x and -y quadrants relative to the center of the first patch antenna 431.

[0221] Figure 15c This is a perspective view of PCB 310 viewed from the side according to the embodiment.

[0222] In an implementation, the first feed path 402 and / or the second feed path 404 may be configured to directly or indirectly feed the first patch antenna 431.

[0223] In an implementation, the third feed path 712 and the fourth feed path 714 can be configured to directly or indirectly feed the second patch antenna 720 by penetrating the first patch antenna 431, without being electrically coupled to the first patch antenna 431.

[0224] In this implementation, power supply paths 402, 404, 712, and 714 can be electrically coupled to logic circuitry (or logic layers) or power supply lines without contacting ground 440. For example, power supply lines 402, 404, 712, and 714 can be electrically coupled to a power supply network and logic circuitry (or logic layers) disposed between grounds 440 by penetrating ground 440.

[0225] Figure 16a The PCB 310 as viewed from above is shown according to an embodiment. Figure 16b Antenna performance, depending on the presence / absence of a ground path in PCB 310, is shown according to various implementations. Figure 16c and Figure 16d Antenna performance, depending on the distance between the patch antenna and the ground path in PCB 310, is shown according to various embodiments.

[0226] Figure 16c and Figure 16d Antenna performance is shown according to various embodiments, depending on the location of the ground path in PCB 310. Figure 16c and Figure 16d Antenna performance can be shown depending on the distances from the center of the first patch antenna 431 in the x-axis and -y-axis directions of ground paths 406 and 408.

[0227] Reference Figure 16a This distance can be represented by a first distance 1612 and a second distance 1614. The first distance 1612 can represent the linear distance of the first grounding path 406 or the second grounding path 408 from the center of the first patch antenna 431 in the x-axis direction. The second distance 1614 can represent the linear distance of the first grounding path 406 or the second grounding path 408 from the center of the first patch antenna 431 in the y-axis direction.

[0228] Reference Figure 16b It shows that in the first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz), case 1622 with ground paths 406 and 408 has better return loss characteristics of the second feed path 404 than case 1621 without ground paths 406 and 408. It also shows that in the first target frequency band (e.g., from about 26.5 GHz to about 29.5 GHz), case 1624 with ground paths 406 and 408 has better return loss characteristics of the first feed path 402 than case 1623 without ground paths 406 and 408.

[0229] Reference Figure 16cThis illustrates how the return loss characteristics of feed paths 402 and 404 vary with a first distance 1612. It shows that cases 1632 and 1635 with a first distance 1612 of approximately 1.9 mm have better return loss characteristics for the first feed path 402 and the second feed path 404 than cases 1631 and 1634 with a first distance 1612 of approximately 1.8 mm. It also shows that cases 1633 and 1636 with a first distance 1612 of approximately 2.0 mm have better return loss characteristics for the first feed path 402 and the second feed path 404 than cases 1632 and 1635 with a first distance 1612 of approximately 1.9 mm. For example, increasing the first distance 1612 up to a certain level (e.g., 2.0 mm) may result in improved impedance matching characteristics and increased bandwidth.

[0230] Reference Figure 16d This illustrates how the return loss characteristics of feed paths 402 and 404 vary with a second distance 1614. It shows that cases 1642 and 1645 with a second distance 1614 of approximately 1.2 mm have better return loss characteristics of the first feed path 402 and the second feed path 404 than cases 1641 and 1644 with a second distance 1614 of approximately 0.5 mm. It also shows that cases 1643 and 1646 with a second distance 1614 of approximately 1.4 mm have better return loss characteristics of the first feed path 402 and the second feed path 404 than cases 1642 and 1645 with a second distance 1614 of approximately 1.2 mm. For example, increasing the second distance 1614 up to a certain level (e.g., 1.4 mm) may result in improved impedance matching characteristics and increased bandwidth. The first distance 1612 or the second distance 1614 where the return loss characteristics or impedance matching characteristics are improved can vary depending on the target frequency band.

[0231] Figure 17a and Figure 17b The PCB 310 is shown from above according to various embodiments. Figure 17a and Figure 17b The location of the grounding path of PCB 310 according to various embodiments is shown.

[0232] In an implementation, the locations of grounding paths 406 and 408 described in FIG15 can be applied to include Figure 17a The patch antenna in PCB 310.

[0233] Reference Figure 17bTwo grounding paths (e.g., first grounding path 406 and second grounding path 408) can be arranged one after the other between the patch antennas, instead of corresponding to a single patch antenna 431. For example, the second grounding path 408 can be located at the midpoint between the first patch antenna 431 and the second patch antenna 432. The third grounding path 1702 can be located at the midpoint between the second patch antenna 432 and the third patch antenna 433. The fourth grounding path 1704 can be located at the midpoint between the third patch antenna 433 and the fourth patch antenna 434. The fifth grounding path 1706 can be located at the midpoint between the fourth patch antenna 434 and the fifth patch antenna 435. The sixth grounding path 1708 can be located in the +x and -y directions relative to the center of the fifth patch antenna 435. In an embodiment, the first grounding path 406 can be located at a distance substantially the same as the distance between the first patch antenna 431 and the second grounding path 408. As another example, depending on the structure of PCB 310, the first ground path 406 or the sixth ground path 1708 located at the two edges can have a different distance from the patch antenna than the other ground paths.

[0234] Figures 18a to 18e The grounding path and patch antenna shape are shown according to various implementations.

[0235] Reference Figure 18a The first patch antenna 431 and / or the second patch antenna 720 may have a circular shape. (Refer to...) Figure 18b The first patch antenna 431 and / or the second patch antenna 720 may have a rhomboid shape. For example, the first patch antenna 431 and the second patch antenna 720 may be arranged in such a way that... Figure 18c The patch antennas 431 and 720 are rotated 45 degrees to the left or 45 degrees to the right. (See reference...) Figure 18c References can be shown. Figure 7 , Figure 8 And the structure described in Figure 9. (Refer to...) Figure 18d Grounding paths 406 and 408 can have a rectangular shape instead of a circular shape. (See reference...) Figure 18e The first grounding path 406 can have a '┌' shape, and the second grounding path 408 can have a '┐' shape. The above description is merely an example, and the shape of the patch antenna or the grounding path is not limited to those described above. For example, these shapes can be implemented in various forms, such as triangles or ellipses.

[0236] Figures 19a to 19d A patch antenna arranged in a 2×2 configuration in PCB 310 can be shown according to various embodiments. According to various embodiments, the deployment of the ground path in PCB 310 can be... Figures 19a to 19d As shown in the image.

[0237] According to the implementation method, such as Figure 19a As shown, PCB 310 may include a first patch antenna 431 supporting a first frequency band, a second patch antenna 720 supporting a second frequency band, a first feed path 402, a second feed path 404, a third feed path 712, or a fourth feed path 714. When the first feed path 402 and the fourth feed path 714 support horizontal polarization, and the second feed path 404 and the third feed path 712 support vertical polarization, the first ground path 406 or the second ground path 408 may be configured to be further adjacent to the feed path supporting the lower frequency band between the first and second frequency bands.

[0238] Reference Figure 19a The first feed path 402 can be positioned in the -x direction relative to the center of the first patch antenna 431. The second feed path 404 can be positioned in the -y direction relative to the center of the first patch antenna 431. The third feed path 712 can be positioned in the +y direction relative to the center of the second patch antenna 720. The fourth feed path 714 can be positioned in the +x direction relative to the center of the second patch antenna 720. In an embodiment, patch antennas 431 and 720 and feed paths 402, 404, 712 and 714 can be configured as a single group in a 2×2 configuration. For example, components applied to patch antennas 431 and 720 (e.g., feed paths 402, 404, 712 and 714 or ground paths 406 and 408) can be included in PCB 310 and can also be applied substantially equivalently to other patch antennas configured in a 2×2 configuration. In an embodiment, a single group can have a 2×2 configuration in the same direction or a 2×2 configuration in different directions. For example, refer to Figure 19a When the patch antenna included in PCB310 is configured in a 2×2 configuration, the feed path applied to the patch antenna can be applied by offsetting it by 90 degrees in the clockwise direction. Figures 19b to 19d The same or similar deployments can be applied Figure 19a The patch antennas 431 and 720 and the feed paths 402, 404, 712 and 714 are described in the document.

[0239] In this implementation, the first grounding path 406 may be positioned in the -x and -y quadrants relative to the center of the first patch antenna 431. The second grounding path 408 may be positioned in the +x and -y quadrants relative to the center of the first patch antenna 431. For example, the first grounding path 406 may be positioned in a 10:30 direction relative to the center of the first patch antenna 431, and the second grounding path 408 may be positioned in a 1:30 direction relative to the first patch antenna 431. The deployment of the grounding paths can be applied substantially equivalently to the different patch antennas 432, 433, and 434.

[0240] Reference Figure 19b Regarding the center 1950 of PCB 310, the first ground path 406, the second ground path 408, the ground path 1901, the ground path 1911, the ground path 1903, the ground path 1913, the ground path 1905 and the ground path 1915 can be set at the 10:30 direction, the 12 o'clock direction, the 1:30 direction, the 3 o'clock direction, the 4:30 direction, the 6 o'clock direction, the 7:30 direction and the 9 o'clock direction respectively.

[0241] Reference Figure 19c Ground paths 406, 408, 1901, and 1911 can be further located near ground paths supporting lower frequency bands. For example, ground paths 406, 408, 1901, and 1911 can be positioned close to the first edge of PCB 310. Ground paths 1903, 1913, 1905, and 1915 can be positioned close to the second edge opposite the first edge.

[0242] Reference Figure 19d Regarding the center 1950 of PCB 310, the first ground path 406, ground path 1901, ground path 1903, and ground path 1905 can be respectively set in the 10:30 direction, 1:30 direction, 4:30 direction, and 7:30 direction. In an embodiment, ground paths 406, 1901, 1903, and 1905 can be set near the corners of PCB 310 in the above directions.

[0243] The structure described in this document for a patch antenna can be applied to another patch antenna included in a patch antenna array.

[0244] Figures 20a to 20d A PCB310 including a 1×4 antenna array can be shown according to various embodiments.

[0245] Figure 4 The antenna array 430, ground paths 406 and 408, and feed paths 402 and 404 described herein can also be applied equivalently or similarly. Figure 20a and Figure 20b .

[0246] Reference Figure 20aMultiple ground paths can be provided between the patch antennas. For example, ground path 408 can be positioned in the quadrants of the +x and -y directions relative to the center of the first patch antenna 431, and multiple (e.g., 5) ground paths can be provided in the +x direction of ground path 408. Ground path 406 can be positioned in the quadrants of the -x and -y directions relative to the center of the first patch antenna 431, and multiple (e.g., 2) ground paths 406 can be provided in the -x direction of ground path 406. For example, ground paths 406 and 408 can be constructed using multiple paths. The deployment of ground paths 406 and 408 can be applied substantially equivalently to the other patch antennas 432, 433, and 434. In an embodiment, ground path 406 or ground path 408 can be provided to one edge or the other edge of the PCB.

[0247] In this implementation, multiple grounding paths can be provided between the first patch antenna 431 and the second patch antenna 432. This can be applied substantially equivalently to other patch antennas. For example, the number of multiple grounding paths is not limited and can be 2 to n.

[0248] In one implementation, the multiple ground paths located at one edge of PCB 310 can be additionally located at the other edge of PCB 310, thus creating symmetry with respect to a virtual center line 2010 drawn from the center of PCB 310 along the +x and -x directions. This can also be equivalently applied to... Figures 20b to 20d and Figures 21a to 21d .

[0249] In the implementation method, similar to Figure 7 The structure of PCB 310, when viewed from above, shows a patch antenna (e.g., Figure 7 The second patch antenna 720 can be additionally configured to overlap with the antenna array 430. This can also be applied substantially equivalently to Figures 20b to 20d .

[0250] Reference Figure 20b , Figure 20aThe positions of the feed paths described herein can be changed. For example, feed paths 402 and 404 corresponding to the first patch antenna 431 can be configured such that the feed paths are rotated 90 degrees to the left relative to the center of the first patch antenna 431. The feed path corresponding to the second patch antenna 431 can be configured such that the feed path is rotated 90 degrees to the left relative to the center of the second patch antenna 432. For example, the feed path of the first patch antenna 431 or the second patch antenna 432 can be configured to be adjacent to an edge located in the -x direction. The feed path corresponding to the third patch antenna 433 can be configured such that the feed path is rotated 90 degrees to the right relative to the center of the third patch antenna 433. The feed path corresponding to the fourth patch antenna 434 can be configured such that the feed path is rotated 90 degrees to the right relative to the center of the fourth patch antenna 434. For example, the feed path of the third patch antenna 433 or the fourth patch antenna 434 can be configured to be adjacent to an edge located in the +x direction. Figure 20a The deployment of grounding paths described herein can be applied essentially equivalently to the deployment of grounding paths.

[0251] Reference Figure 20c When viewed from above PCB 310, the first feed path 402 can be configured to be adjacent to the edge located in the -x direction relative to the center of the first patch antenna 431. The second feed path 404 can be configured to be adjacent to the edge located in the -y direction relative to the center of the first patch antenna 431. The feed paths of the first patch antenna 431 can be applied substantially equivalently to the feed paths of patch antennas 432, 433, and 434. Figure 20a The deployment of grounding paths described herein can be applied essentially equivalently to the deployment of grounding paths.

[0252] Reference Figure 20d , Figure 20cThe positions of the feed paths described herein can be changed. For example, the feed path corresponding to the third patch antenna 433 can be configured such that the feed path is rotated 90 degrees to the right relative to the center of the third patch antenna 433. The feed path corresponding to the fourth patch antenna 434 can be configured such that the feed path is rotated 90 degrees to the right relative to the center of the fourth patch antenna 434. For example, when viewed from above the PCB 310, the first feed path of the third patch antenna 433 can be configured to be adjacent to the edge located in the +x direction relative to the center of the third patch antenna 433. The second feed path of the third patch antenna 433 can be configured to be adjacent to the edge located in the -y direction relative to the center of the third patch antenna 433. As another example, when viewed from above the PCB 310, for example, the first feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the +x direction relative to the center of the fourth patch antenna 434. The second feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the -y direction relative to the center of the fourth patch antenna 434. Figure 20a The deployment of grounding paths described herein can be applied essentially equivalently to the deployment of grounding paths.

[0253] Figures 21a to 21d A PCB310 including a 1×5 antenna array can be shown according to various embodiments.

[0254] Reference Figure 21a When viewed from above PCB 310, the first feed path 402 can be configured to be adjacent to the edge located in the -x direction relative to the center of the first patch antenna 431. The second feed path 404 can be configured to be adjacent to the edge located in the -y direction relative to the center of the first patch antenna 431. The feed paths of the first patch antenna 431 can be applied substantially equivalently to the feed paths of patch antennas 432, 433, 434, and 435.

[0255] Reference Figure 21a Multiple grounding paths can be arranged between patch antennas 431, 432, 433, 434, and 435. For example, grounding path 408 can be arranged in the quadrants of the +x and -y directions relative to the center of the first patch antenna 431, and multiple (e.g., 5) grounding paths can be arranged in the +x direction of grounding path 408. Grounding path 406 can be arranged in the quadrants of the -x and -y directions relative to the center of the first patch antenna 431, and multiple (e.g., 2) grounding paths 406 can be arranged in the -x direction of grounding path 406. For example, grounding paths 406 and 408 can be constructed using multiple paths. The deployment of grounding paths 406 and 408 can be applied substantially equivalently to the other patch antennas 432, 433, 434, and 435. For example, as Figure 20aAs shown, multiple grounding paths can be arranged between antenna array 430. The number of grounding paths is unlimited and can be 2 to n.

[0256] In one implementation, the multiple ground paths located at one edge of the PCB 310 may be additionally located at the other edge of the PCB 310, thus being symmetrical with respect to the virtual center line 2010 drawn from the center of the PCB 310 along the +x and -x directions.

[0257] The above-described grounding path deployment can also be applied essentially the same way. Figures 21b to 21d .

[0258] Reference Figure 21b The feed paths for patch antennas 431, 432, and 433 can be located in relation to... Figure 21a The patch antennas 431, 432, and 433 are positioned substantially the same. In this embodiment, the feed paths corresponding to the fourth patch antenna 434 and the fifth patch antenna 435 can be configured such that the feed paths corresponding to the first patch antenna 431 and the patch antenna 432 are symmetrical with respect to a virtual center line 2120 drawn from the center of the PCB 310 along the +y and -y directions. For example, when viewed from above the PCB 310, the first feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the +x direction relative to the center of the fourth patch antenna 434. The second feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the -y direction relative to the center of the fourth patch antenna 434. As another example, for instance, when viewed from above the PCB 310, the first feed path of the fifth patch antenna 435 can be configured to be adjacent to the edge located in the +x direction relative to the center of the fifth patch antenna 435. The second feed path of the fifth patch antenna 435 can be configured to be adjacent to the edge located in the -y direction relative to the center of the fifth patch antenna 435.

[0259] Reference Figure 21c When viewed from above PCB 310, the first feed path 402 can be configured to be adjacent to the edge of the first patch antenna 431 in the -x direction. The second feed path 404 can be configured to be adjacent to the edge of the first patch antenna 431 in the -y direction. The third feed path 712 can be configured to be adjacent to the edge of the patch antenna 720 in the +y direction. The fourth feed path 714 can be configured to be adjacent to the edge of the patch antenna 720 in the +x direction. The feed paths of the first patch antenna 431 can be applied substantially equivalently to the feed paths of patch antennas 432, 433, 434, and 435. The feed path of the patch antenna 721 can be applied substantially equivalently to the feed paths of patch antennas 722, 723, 724, and 725.

[0260] Reference Figure 21c In the implementation method, Figure 20a The multiple ground paths described herein can be configured symmetrically with respect to the first edge (e.g., the edge in the -y direction) and the second edge (the edge in the +y direction) of PCB 310. In another example, multiple ground paths can be configured to the first edge (e.g., the edge in the -y direction) to reduce the width of PCB 310.

[0261] Reference Figure 21d The feed paths for patch antennas 431, 432, and 433 can be located in relation to... Figure 21c The patch antennas 431, 432, and 433 are located in essentially the same positions. The feed paths for patch antennas 720, 721, and 722 can be located in the same... Figure 21c The patch antennas 720, 721, and 722 are positioned substantially at the same location. In the embodiment, the feed paths corresponding to the fourth patch antenna 434 and the fifth patch antenna 435 can be configured such that the feed paths corresponding to the first patch antenna 431 and the second patch antenna 432 are symmetrical with respect to the virtual center line 2120 drawn from the center of the PCB 310 along the +y and -y directions. For example, when viewed from above the PCB 310, the first feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the +x direction relative to the center of the fourth patch antenna 434. The second feed path of the fourth patch antenna 434 can be configured to be adjacent to the edge located in the -y direction relative to the center of the fourth patch antenna 434. As another example, for instance, when viewed from above the PCB 310, the first feed path of the fifth patch antenna 435 can be configured to be adjacent to the edge located in the +x direction relative to the center of the fifth patch antenna 435. The second feed path of the fifth patch antenna 435 can be configured to be adjacent to the edge located in the -y direction relative to the center of the fifth patch antenna 435. For example, when viewed from above PCB 310, the first feed path of patch antenna 724 can be positioned adjacent to the edge in the +x direction relative to the center of patch antenna 724. The second feed path of patch antenna 724 can be positioned adjacent to the edge in the -y direction relative to the center of patch antenna 724. As another example, when viewed from above PCB 310, the first feed path of patch antenna 725 can be positioned adjacent to the edge in the +x direction relative to the center of patch antenna 725. The second feed path of patch antenna 725 can be positioned adjacent to the edge in the -y direction relative to the center of patch antenna 725.

[0262] Reference Figure 21d In the implementation method, Figure 20aThe multiple ground paths described herein can be configured symmetrically with respect to the first edge (e.g., the edge in the -y direction) and the second edge (the edge in the +y direction) of PCB 310. In another example, multiple ground paths can be configured to the first edge (e.g., the edge in the -y direction) to reduce the width of PCB 310.

[0263] In an embodiment, the electronic device 101 may include a PCB 310 comprising multiple layers, a communication circuit 320 disposed on one side of the PCB 310, and the at least one processor 330 electrically coupled to the communication circuit 320. The PCB 310 may include: a first layer 410 on which a plurality of patch antennas (e.g., 431, 432, 433, and 434) are disposed; a first feed path 402, directly or indirectly feeding a first point 402-1 of the first patch antenna 431 such that the first patch antenna 431 disposed on the first layer 410 receives a first polarization signal; a second feed path 404, directly or indirectly feeding a second point 404-1 of the first patch antenna 431 such that the first patch antenna 431 receives a second polarization signal orthogonal to the first polarization signal; and a second layer 420 corresponding to the PCB. 310 ground 440; first ground path 406, electrically coupled from the outside of the first patch antenna 431 to the second layer 420 and the third point 406-1 adjacent to the first point 402-1 of the first patch antenna 431; and second ground path 408, electrically coupled from the outside of the first patch antenna 431 to the second layer 420 and the fourth point 408-1 adjacent to the second point 404-1 of the first patch antenna 431.

[0264] In the electronic device 101 according to the embodiment, the PCB 310 may include a third layer 710 on which a plurality of patch antennas are disposed, a third feed path 712 that directly or indirectly feeds the fifth point 712-1 of the second patch antenna 720 so that the second patch antenna 720 disposed on the third layer 710 receives a third polarization signal, and a fourth feed path 714 that directly or indirectly feeds the sixth point 714-1 of the second patch antenna 720 so as to receive a fourth polarization signal orthogonal to the third polarization signal.

[0265] In the electronic device 101 according to an embodiment, the third power supply path 712 may include a path penetrating a second number of the plurality of layers and may be electrically coupled to the communication circuit 320. The fourth power supply path 714 may include a path penetrating a second number of the plurality of layers and may be electrically coupled to the communication circuit 320.

[0266] In the electronic device 101 according to the embodiment, the first layer 410 can be vertically disposed on the inner side compared to the third layer 710.

[0267] In the electronic device 101 according to the embodiment, the first patch antenna 431 may be vertically overlapped with the second patch antenna 720, and the size of the first patch antenna 431 may be larger than the size of the second patch antenna 720.

[0268] In the electronic device 101 according to the embodiment, the width of ground 440 may be 3.5 mm.

[0269] In the electronic device 101 according to the embodiment, the first virtual line 602 connecting the first point 402-1 and the third point 406-1 can be orthogonal to the second virtual line 604 connecting the second point 404-1 and the fourth point 408-1.

[0270] In the electronic device 101 according to the embodiment, the first grounding path 406 and the second grounding path 408 may be positioned spaced apart from the metal frame 1110 of the electronic device 101.

[0271] In the electronic device 101 according to the embodiment, the number of multiple patch antennas can be k, and the multiple patch antennas can be arranged in a 1×k array pattern.

[0272] In the electronic device 101 according to the embodiment, the plurality of patch antennas 431, 432, 433, 434 and 435 may have at least any one of, for example, circular, elliptical and rectangular shapes.

[0273] In the electronic device 101 according to the embodiment, the first patch antenna 431 and the second patch antenna 720 can be operated to transmit / receive radio frequency (RF) signals in a specified frequency band, and the specified frequency band may include a millimeter wave band.

[0274] In the electronic device 101 according to the embodiment, the first patch antenna 431 is operable to transmit / receive signals in the 24 GHz to 29.5 GHz frequency band, and the second patch antenna 720 is operable to transmit / receive signals in the 37 GHz to 40 GHz frequency band.

[0275] In the electronic device 101 according to the embodiment, the first grounding path 406 and the second grounding path 408 can penetrate a third number of layers.

[0276] In the electronic device 101 according to the embodiment, the PCB 310 may further include a plurality of dipole antennas 1311, 1312, 1313, 1314 and 1315.

[0277] In the electronic device 101 according to the embodiment, a plurality of dipole antennas 1311, 1312, 1313, 1314 and 1315 can be arranged in a 1×k array pattern at positions corresponding to a plurality of patch antennas 431, 432, 433, 434 and 435.

[0278] In an embodiment, PCB 310 may include a PCB 310 comprising multiple layers and a communication circuit 320 electrically coupled to the PCB. PCB 310 may include: a first layer 410 on which a plurality of patch antennas 431, 432, 433, 434 and 435 are disposed; a first feed path 402, which directly or indirectly feeds a first point 402-1 of the first patch antenna 431 to enable the first patch antenna 431 disposed on the first layer 410 to receive a first polarization signal, wherein the first feed path 402 includes a path penetrating a first number of layers among the plurality of layers and is electrically coupled to the communication circuit 320; a second feed path 404, which directly or indirectly feeds a second point 404-1 of the first patch antenna 431 to enable the first patch antenna 431 disposed on the first layer 410 to receive a second polarization signal orthogonal to the first polarization signal, wherein the second feed path 404 includes a path penetrating a first number of layers among the plurality of layers and is electrically coupled to the communication circuit 320; a second layer 420, corresponding to the PCB. 310 ground 440; first ground path 406, electrically coupled from the outside of the first patch antenna 431 to the second layer 420 and the third point 406-1 adjacent to the first point 402-1 of the first patch antenna 431; and second ground path 408, electrically coupled from the outside of the first patch antenna 431 to the second layer 420 and the fourth point 408-1 adjacent to the second point 404-1 of the first patch antenna 431.

[0279] The PCB 310 according to the embodiment may include: a third layer 710 on which a plurality of patch antennas are disposed; a third feed path 712 that directly or indirectly feeds the fifth point 712-1 of the second patch antenna 720 so that the second patch antenna 720 disposed on the third layer 710 receives a third polarization signal; and a fourth feed path 714 that directly or indirectly feeds the sixth point 714-1 of the second patch antenna 720 so as to receive a fourth polarization signal orthogonal to the third polarization signal.

[0280] In the PCB 310 according to the embodiment, the first patch antenna 431 can be vertically disposed on the inner side compared to the second patch antenna 720a. The size of the first patch antenna 431 can be larger than the size of the second patch antenna 720.

[0281] In the PCB 310 according to the embodiment, the first ground path 406 and the second ground path 408 can penetrate a third number of layers, and the width of the ground 440 can be 3.5 mm.

[0282] In an implementation, PCB 310 may further include a plurality of dipole antennas 1311, 1312, 1313, 1314 and 1315.

[0283] In the specific embodiments described above, the components included in this disclosure are expressed in a singular or plural form according to the specific embodiments presented herein. However, for the sake of convenience of explanation, singular or plural expressions are appropriately chosen, and therefore the various embodiments of this disclosure are not limited to a single or multiple components. Thus, components expressed in a plural form may also be expressed in a singular form, and vice versa.

[0284] While this disclosure has been shown and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of this disclosure as defined by the appended claims. Therefore, the scope of this disclosure is not defined by its detailed description but by the appended claims, and all differences within equivalents of that scope shall be construed as included in this disclosure.

Claims

1. An electronic device comprising: Multiple patch antennas; Printed circuit boards including multiple layers; as well as The communication circuit is electrically coupled to the printed circuit board. The printed circuit board includes: The first of the plurality of layers, wherein the plurality of patch antennas are disposed; A first power supply path directly or indirectly supplies power to a first point of a first patch antenna among the plurality of patch antennas, so that the first patch antenna transmits and / or receives a first polarization signal, wherein the first power supply path includes a path that penetrates a first number of layers among the plurality of layers and is electrically coupled to the communication circuit. A second power supply path directly or indirectly supplies power to a second point of the first patch antenna so that the first patch antenna transmits and / or receives a second polarization signal orthogonal to the first polarization signal, wherein the second power supply path includes a path that penetrates the first number of layers of the plurality of layers and is electrically coupled to the communication circuit. Including the second layer of the earth; A first grounding path electrically connects the ground to a third point adjacent to the first point of the first patch antenna, wherein the third point is located outside the first patch antenna; and The second grounding path electrically connects the ground to a fourth point adjacent to the second point of the first patch antenna, wherein the fourth point is located outside the first patch antenna. The third point is located on a virtual line connecting the first corner of the first patch antenna and the first point, and the fourth point is located on a virtual line connecting the second corner of the first patch antenna and the second point, thereby reducing the coupling between the first feed path for the first polarized signal and the second feed path for the second polarized signal.

2. The electronic device of claim 1, wherein the printed circuit board comprises: The third layer contains multiple additional patch antennas. The third feeding path directly or indirectly supplies power to the fifth point of the second patch antenna among the plurality of other patch antennas, so that the second patch antenna receives the third polarization signal. as well as The fourth feeding path directly or indirectly supplies power to the sixth point of the second patch antenna to receive a fourth polarization signal orthogonal to the third polarization signal.

3. The electronic device according to claim 2, The third power supply path includes a path that penetrates a second number of the plurality of layers and is electrically coupled to the communication circuit. The fourth power supply path includes a path that penetrates the second number of layers among the plurality of layers and is electrically coupled to the communication circuit.

4. The electronic device according to claim 2, wherein the first layer is disposed between the third layer and the second layer.

5. The electronic device according to claim 2, in, When viewed from above the printed circuit board, the first patch antenna is configured such that some areas of the first patch antenna overlap with some areas of the second patch antenna, and The size of the first patch antenna is larger than the size of the second patch antenna.

6. The electronic device according to claim 1, wherein the width of the ground is 3 mm to 4 mm.

7. The electronic device of claim 1, wherein the virtual line connecting the first point and the third point is orthogonal to the virtual line connecting the second point and the fourth point.

8. The electronic device according to claim 1, wherein, When viewed from the side of the electronic device, the first grounding path and the second grounding path are configured not to overlap with the metal frame included in the electronic device.

9. The electronic device according to claim 1, wherein the number of the plurality of patch antennas is n×m, and the plurality of patch antennas are configured as an antenna array of an n×m array.

10. The electronic device of claim 1, wherein the plurality of patch antennas are rectangular.

11. The electronic device according to claim 2, The first patch antenna and the second patch antenna transmit and / or receive radio frequency signals in a specified frequency band, and The specified frequency band includes the millimeter wave frequency band.

12. The electronic device according to claim 11, The first patch antenna transmits and / or receives signals in the 24 to 29.5 GHz frequency band, and The second patch antenna transmits and / or receives signals in the 37 to 40 GHz frequency band.

13. The electronic device of claim 1, wherein the first ground path and the second ground path penetrate a third number of layers.

14. The electronic device of claim 1, wherein the printed circuit board further comprises a plurality of dipole antennas.

15. The electronic device of claim 14, wherein the plurality of patch antennas are configured as a 1×m array antenna array, and The plurality of dipole antennas are configured as an antenna array of 1×m at each corresponding position of the plurality of patch antennas.

Images