Control method and device for improving perforation efficiency in laser processing, processor and computer readable storage medium thereof

CN116060794BActive Publication Date: 2026-10-23SHANGHAI WEIHONG ELECTRONICS TECH +1
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Patent Information

Application Number
CN202310246376.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-14
Publication Date
2026-10-23
Estimated Expiration
2043-03-14

AI Technical Summary

Technical Problem

[0008]参考文献(1)和(2)公开的激光穿孔方法与本方法的目的和解决方式都不相同,侧重点也不相同,与现有技术的内容相结合并不能实现极大提升薄板穿孔效率的目的

Benefits of technology

[0035]采用了本发明的激光加工中实现穿孔效率提高的控制方法、装置、处理器及其计算机可读存储介质,从穿孔方式优化、参数下发方式优化、穿孔流程优化等多个维度出发,旨在提升薄板穿孔的效率,进行薄板穿孔可以显著提升薄板穿孔及薄板加工的效率。

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Abstract

The present application relates to a kind of control methods for improving the efficiency of perforation in laser processing, comprising the following steps: obtaining cutting height, setting servo height as cutting height;Start blowing, set laser parameters and cutting parameters are same;For the operation needing to be synchronized, use addressing, buffer addressing to local;Wait for frog to jump into position and then start perforation;Wait for perforation, open servo and use servo to drop to cutting height when perforation;Enter to cutting process.The present application also relates to corresponding device, processor and its computer readable storage medium.The control method for improving the efficiency of perforation in laser processing, device, processor and its computer readable storage medium of the present application are used, starting from multiple dimensions such as perforation mode optimization, parameter optimization, perforation process optimization, etc., aiming to improve the efficiency of sheet perforation, and perforating sheet can significantly improve the efficiency of sheet perforation and sheet processing.
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Description

Technical Field

[0001] This invention relates to the field of laser cutting and processing, and more particularly to the field of perforation methods. Specifically, it relates to a control method, device, processor, and computer-readable storage medium for improving perforation efficiency in laser processing. Background Technology

[0002] In existing laser processing piercing methods, the conventional approach is to set parameters such as piercing height, power, duty cycle, frequency, and focus before piercing. During piercing, the focus is adjusted and the device is moved to the piercing height. After piercing, the cutting parameters (power, duty cycle, frequency, etc.) are set, and the focus is readjusted and the device is moved to the cutting height before cutting begins.

[0003] This relatively precise perforation method works well for thick plates; however, it is somewhat inefficient for thin plates because they are easier to penetrate. The actual perforation process for thin plates can be further optimized.

[0004] Reference (1) invented a laser perforation method, a multi-stage perforation method, and a continuous perforation method. The next step is executed based on the measurement range of the obtained capacitance sensor, the current height of the laser head, and the target height. By increasing the tolerance value, the perforation action can be performed directly without adjusting the position of the laser head, provided that the difference between the current height and the target height is less than the tolerance, thus effectively improving the perforation efficiency.

[0005] Compared to this method, the other method focuses on improving the perforation efficiency of thick and extremely thick plates. Its solution also relies on comparing data from the capacitive sensor and set parameters to make different actions to optimize the perforation efficiency. In contrast, this method focuses on optimizing the perforation of plates that can be perforated in one step, thereby improving the perforation efficiency of thin plates.

[0006] Reference (2) invented a laser perforation method, which uses the frequency, duty cycle and focus to change during the perforation process, that is, the frequency is changed from high frequency to low frequency, the duty cycle is changed from high duty cycle to low duty cycle or from low duty cycle to high duty cycle, and the focus is changed from high defocus to low defocus, in order to solve the problems of hole bursting and overburning during the perforation process and achieve fast and stable perforation.

[0007] Compared to this method, the latter focuses on improving the quality of perforation by adding a parameter-changing process during perforation. In contrast, this method aims to improve the efficiency of perforating thin plates by optimizing and simplifying the perforation process and reducing the number and methods of issuing parameter-changing instructions, thereby achieving the goal of quickly and stably perforating thin plates.

[0008] The laser perforation methods disclosed in references (1) and (2) have different purposes and solutions than this method, and their focuses are also different. Combining them with the existing technology cannot achieve the goal of greatly improving the efficiency of perforation of thin plates. This method aims to improve the efficiency of perforation of thin plates from multiple dimensions, such as perforation method optimization, parameter distribution method optimization, and perforation process optimization.

[0009] (1) Invention title: A laser perforation method, a multi-stage perforation method and a continuous perforation method Authorization announcement number: CN111745311A Patentee: Han's Laser Technology Industry Group Co., Ltd.;

[0010] (2) Invention title: A laser perforation method Authorization announcement number: CN 110773885 A Patentee: Jinan Bond Laser Co., Ltd. Summary of the Invention

[0011] The purpose of this invention is to overcome the shortcomings of the prior art and provide a control method, device, processor and computer-readable storage medium for improving the perforation efficiency in laser processing, which is efficient, easy to operate and widely applicable.

[0012] To achieve the above objectives, the present invention provides a control method, apparatus, processor, and computer-readable storage medium for improving perforation efficiency in laser processing, as follows:

[0013] The control method, apparatus, processor, and computer-readable storage medium for improving perforation efficiency in laser processing are characterized in that the method includes the following steps:

[0014] (1) Obtain the cutting height and set the follow-up height to the cutting height;

[0015] (2) Start blowing air, and set the laser parameters and cutting parameters to be the same;

[0016] (3) For operations that need to be performed synchronously, use addressing and cache the addressing locally;

[0017] (4) Wait for the frog to jump into place before starting to drill;

[0018] (5) Wait for the perforation to be completed, then open the follower;

[0019] (6) Utilize the homing mechanism to pierce the hole when it descends to the cutting height;

[0020] (7) Proceed to the cutting process.

[0021] Preferably, step (1) further includes the following steps:

[0022] (1.1) Determine whether frog jump is enabled. If yes, set the follow height to the cutting height; otherwise, set the follow height to the perforation height.

[0023] Preferably, step (2) specifically includes the following steps:

[0024] (2.1) Set the blowing parameters to the parameters for cutting the blowing;

[0025] (2.2) Set the duty cycle of the piercing method to the preset duty cycle, and set the piercing power and piercing frequency to be the same as the cutting parameters;

[0026] (2.3) Set the perforation focus and the cutting focus to be the same.

[0027] Preferably, step (3) specifically includes the following steps:

[0028] (3.1) For operations that need to be performed synchronously, use addressing.

[0029] (3.2) Cache the addressing that needs to be checked repeatedly to local variables.

[0030] The device for controlling and improving the perforation efficiency in laser processing is characterized in that the device comprises:

[0031] A processor is configured to execute computer-executable instructions;

[0032] The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the steps of the control method, apparatus, processor, and computer-readable storage medium described above for improving perforation efficiency in laser processing.

[0033] The processor for controlling the piercing efficiency improvement in laser processing is characterized in that the processor is configured to execute computer-executable instructions, which, when executed by the processor, implement the various steps of the aforementioned control method, apparatus, processor, and computer-readable storage medium for improving piercing efficiency in laser processing.

[0034] The main feature of this computer-readable storage medium is that it stores a computer program thereon, which can be executed by a processor to implement the various steps of the control method, apparatus, processor and computer-readable storage medium for improving piercing efficiency in the above-described laser processing.

[0035] The present invention employs a control method, apparatus, processor, and computer-readable storage medium for improving piercing efficiency in laser processing. It aims to improve the efficiency of thin plate piercing from multiple dimensions, including piercing method optimization, parameter distribution method optimization, and piercing process optimization. Thin plate piercing can significantly improve the efficiency of thin plate piercing and thin plate processing. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the overall processing flow of the control method for improving perforation efficiency in laser processing according to the present invention. Detailed Implementation

[0037] To more clearly describe the technical content of the present invention, the following description is provided in conjunction with specific embodiments.

[0038] The present invention discloses a control method, apparatus, processor, and computer-readable storage medium for improving perforation efficiency in laser processing, comprising the following steps:

[0039] (1) Obtain the cutting height and set the follow-up height to the cutting height;

[0040] (2) Start blowing air, and set the laser parameters and cutting parameters to be the same;

[0041] (3) For operations that need to be performed synchronously, use addressing and cache the addressing locally;

[0042] (4) Wait for the frog to jump into place before starting to drill;

[0043] (5) Wait for the perforation to be completed, then open the follower;

[0044] (6) Utilize the homing mechanism to pierce the hole when it descends to the cutting height;

[0045] (7) Proceed to the cutting process.

[0046] In a preferred embodiment of the present invention, step (1) further includes the following steps:

[0047] (1.1) Determine whether frog jump is enabled. If yes, set the follow height to the cutting height; otherwise, set the follow height to the perforation height.

[0048] In a preferred embodiment of the present invention, step (2) specifically includes the following steps:

[0049] (2.1) Set the blowing parameters to the parameters for cutting the blowing;

[0050] (2.2) Set the duty cycle of the piercing method to the preset duty cycle, and set the piercing power and piercing frequency to be the same as the cutting parameters;

[0051] (2.3) Set the perforation focus and the cutting focus to be the same.

[0052] In a preferred embodiment of the present invention, step (3) specifically includes the following steps:

[0053] (3.1) For operations that need to be performed synchronously, use addressing.

[0054] (3.2) Cache the addressing that needs to be checked repeatedly to local variables.

[0055] The apparatus of the present invention for controlling and improving the perforation efficiency in laser processing, wherein the apparatus comprises:

[0056] A processor is configured to execute computer-executable instructions;

[0057] The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the steps of the control method, apparatus, processor, and computer-readable storage medium described above for improving perforation efficiency in laser processing.

[0058] The present invention discloses a processor for controlling improved perforation efficiency in laser processing, wherein the processor is configured to execute computer-executable instructions, which, when executed by the processor, implement the various steps of the aforementioned control method, apparatus, processor, and computer-readable storage medium for improving perforation efficiency in laser processing.

[0059] The computer-readable storage medium of the present invention stores a computer program thereon, which can be executed by a processor to implement the various steps of the control method, apparatus, processor and computer-readable storage medium thereof for improving perforation efficiency in laser processing described above.

[0060] In a specific embodiment of the present invention, a method for improving piercing efficiency is provided, which greatly reduces piercing time and improves piercing efficiency while ensuring piercing quality and consistency.

[0061] The present invention comprises the following steps:

[0062] S1: This perforation method is suitable for materials that can be perforated in one step, and for scenarios where perforation does not require changes to air pressure and focus.

[0063] S2.1: This perforation method will obtain the cutting height before perforation. If the frog jump is enabled, the follow height will be set to the cutting height. If the frog jump is not enabled, the follow height will be set to the perforation height.

[0064] S2.2: Set the blowing parameters to the parameters of the cutting blowing (including gas type and gas pressure);

[0065] S2.3: Set the duty cycle of this perforation method to the preset duty cycle, and set the perforation power and perforation frequency to be the same as the cutting parameters;

[0066] S2.4: Set the perforation focus and cutting focus to be the same.

[0067] S2.5: For operations that need to be performed synchronously (such as turning on the light or blowing air), use addressing to perform the operation, and use asynchronous addressing as much as possible;

[0068] S2.6: Cache addressing that needs to be checked repeatedly to local variables to save time;

[0069] S2.7: Use the greatest possible speed and acceleration to reduce frog jump planning time;

[0070] S2.8: Since the final stage of the frog jump is actually a follow-up action, the switch follow-up process is canceled when piercing after the frog jump to save time;

[0071] S2.9: Drill holes simultaneously during the time it takes for the device to descend to the cutting height.

[0072] S3.1: Avoid high-level following to prevent affecting speed;

[0073] S3.2: Due to the low time accuracy of the system, the light is turned on first and then the follower is turned on during the perforation process, sacrificing some efficiency to improve the perforation consistency.

[0074] S4: Utilize WaitPort time to perform multiple operations simultaneously.

[0075] In practical applications, the perforation process is as follows: Figure 1 As shown:

[0076] 1. After the frog jumps to the piercing point, the follow-up height will be set to be equal to the cutting height;

[0077] 2. Start blowing air and set the laser parameters (power, frequency, focus) to be the same as the cutting parameters;

[0078] 3. After the frog jumps into position, the consecration ceremony will begin and the perforation will commence;

[0079] 4. Continue drilling as the device descends to the cutting height;

[0080] 5. After waiting for the perforation to complete, turn on the follow-up mechanism and then proceed with the cutting process.

[0081] For the specific implementation scheme of this embodiment, please refer to the relevant descriptions in the above embodiments, which will not be repeated here.

[0082] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0083] It should be noted that in the description of this invention, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means at least two.

[0084] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of the invention includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as will be understood by those skilled in the art to which embodiments of the invention pertain.

[0085] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution device. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0086] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The corresponding program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0087] Furthermore, the functional units in the various embodiments of the present invention can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0088] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0089] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0090] The present invention employs a control method, apparatus, processor, and computer-readable storage medium for improving piercing efficiency in laser processing. It aims to improve the efficiency of thin plate piercing from multiple dimensions, including piercing method optimization, parameter distribution method optimization, and piercing process optimization. Thin plate piercing can significantly improve the efficiency of thin plate piercing and thin plate processing.

[0091] In this specification, the invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and variations can be made without departing from the spirit and scope of the invention. Therefore, the specification and drawings should be considered illustrative rather than restrictive.

Claims

1. A control method for improving perforation efficiency in laser processing, characterized in that, The method includes the following steps: (1) Obtain the cutting height and set the follow height to the cutting height; (2) Start blowing air, and set the laser parameters and cutting parameters to be the same; (3) For operations that need to be performed synchronously, use addressing and cache the addressing locally; (4) Start drilling after the frog jumps into place; (5) Wait for the perforation to be completed, then open the follower; (6) Drill holes when the device descends to the cutting height; (7) Proceed to the cutting process.

2. The control method for improving perforation efficiency in laser processing according to claim 1, characterized in that, Step (1) further includes the following steps: (1.1) Determine whether frog jump is enabled. If yes, set the follow height to the cutting height; otherwise, set the follow height to the perforation height.

3. The control method for improving perforation efficiency in laser processing according to claim 1, characterized in that, Step (2) specifically includes the following steps: (2.1) Set the blowing parameters to the parameters for cutting the blowing; (2.2) Set the duty cycle of the perforation method to the preset duty cycle, and set the perforation power and perforation frequency to be the same as the cutting parameters; (2.3) Set the perforation focus and the cutting focus to be the same.

4. The control method for improving perforation efficiency in laser processing according to claim 1, characterized in that, Step (3) specifically includes the following steps: (3.1) For operations that need to be performed synchronously, use addressing. (3.2) Cache the addressing that needs to be checked repeatedly to local variables.

5. A device for controlling and improving the perforation efficiency in laser processing, characterized in that, The device includes: A processor is configured to execute computer-executable instructions; The memory stores one or more computer-executable instructions, which, when executed by the processor, implement the steps of the control method for improving piercing efficiency in laser processing according to any one of claims 1 to 4.

6. A processor for controlling and improving the perforation efficiency in laser processing, characterized in that, The processor is configured to execute computer-executable instructions, which, when executed by the processor, implement the steps of the control method for improving piercing efficiency in laser processing according to any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, It stores a computer program that can be executed by a processor to implement the various steps of the control method for improving perforation efficiency in laser processing according to any one of claims 1 to 4.

Citation Information

Patent Citations

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    CN110773885A

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