Grinding slurry spraying device, chemical mechanical polishing equipment and grinding method

Abstract

This disclosure provides a polishing slurry spraying device, a chemical mechanical polishing (CMP) apparatus, and a polishing method. The device includes a polishing slurry arm; the polishing slurry arm includes multiple first nozzles; the multiple first nozzles are used to spray polishing slurry in a first time period and to spray rinsing liquid in a second time period. By setting multiple first nozzles, the device allows the polishing slurry to flow out from multiple points. Sharing multiple first nozzles with both polishing slurry and rinsing liquid allows for more polishing slurry spraying points to be set within a limited area. Compared with polishing slurry spraying devices with single-point polishing slurry flow in related technologies, the polishing slurry disperses faster, which is beneficial for improving polishing efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of chemical mechanical polishing, and more particularly to an abrasive spraying device, chemical mechanical polishing equipment, and a polishing method. Background Technology

[0002] With the development of semiconductor manufacturing processes, chemical mechanical polishing (CMP) technology has been widely used.

[0003] During the polishing process, wafers are primarily polished through chemical reactions with the polishing slurry. The distribution of the polishing slurry on the polishing pad affects the wafer's morphology. In the CMP process, the polishing slurry typically flows onto the polishing pad at a single point, and is then dispersed by adjusting the pad's cleaning and rotation. This dispersion rate is usually slow, resulting in low polishing efficiency. Summary of the Invention

[0004] This disclosure provides an abrasive spraying device, a chemical mechanical polishing equipment, and a grinding method, which can improve the dispersion speed of the abrasive.

[0005] Therefore, the present disclosure provides the following technical solutions: In a first aspect, embodiments of this disclosure provide a grinding fluid spraying device, including a grinding fluid arm; The grinding fluid arm includes multiple first nozzles; Multiple of the first nozzles are used to spray grinding fluid in a first time period and to spray rinsing fluid in a second time period.

[0006] Optionally, it also includes a liquid supply line; The liquid supply pipeline includes a first pipeline and a second pipeline; The first pipeline includes a first inlet and a first outlet. The first inlet is used to input the grinding fluid, and the first outlet is connected to a plurality of first nozzles so that the plurality of first nozzles spray the grinding fluid. The second pipeline includes a second inlet and a second outlet. The second inlet is used to input flushing fluid, and the second outlet is connected to a plurality of first nozzles so that the plurality of first nozzles spray flushing fluid.

[0007] Optionally, the abrasive arm further includes a second nozzle; The first pipeline also includes a third liquid outlet, which is connected to the second nozzle.

[0008] Optionally, the liquid supply line further includes a three-way valve; The three-way valve includes a third inlet, a fourth inlet, and a fourth outlet. The third liquid inlet is connected to the first liquid outlet, the fourth liquid inlet is connected to the second liquid outlet, and the fourth liquid outlet is connected to multiple first nozzles; During the first time period, the third liquid inlet is connected to the fourth liquid outlet, and the fourth liquid inlet is closed to the fourth liquid outlet; During the second time period, the fourth liquid inlet and the fourth liquid outlet are connected, while the third liquid inlet and the fourth liquid outlet are disconnected.

[0009] Optionally, the grinding fluid arm has a first channel, and a plurality of first nozzles are connected to the first channel. The grinding fluid arm is provided with a first channel interface, which is connected to the first outlet and the second outlet respectively.

[0010] Optionally, the grinding fluid arm has a second channel, the second nozzle is connected to the second channel, the grinding fluid arm is provided with a second channel interface, and the second channel interface is connected to the third outlet.

[0011] Optionally, the grinding fluid spraying device further includes a base; The grinding fluid arm is positioned above the base, and one end of the grinding fluid arm is rotatably connected to the base.

[0012] Optionally, the number of the second nozzles is one, and one of the second nozzles is located at the end of the abrasive arm away from the base.

[0013] Optionally, a plurality of the first nozzles are arranged along the length of the abrasive arm.

[0014] Optionally, the spacing between two adjacent first nozzles is the same.

[0015] Optionally, the spacing between two adjacent first nozzles gradually increases along the direction away from the base.

[0016] Optionally, the spray directions of the plurality of first nozzles are parallel to each other.

[0017] Secondly, this disclosure provides a chemical mechanical polishing apparatus, including a polishing disc and a polishing slurry spraying device as described in any of the above embodiments; The polishing fluid arm is positioned above the polishing disc and is used to spray polishing fluid or rinsing fluid onto the polishing disc.

[0018] Optionally, the grinding disc includes a grinding pad and a grinding table; The grinding pad is disposed on the grinding table; The grinding table is used to rotate the grinding pad.

[0019] Optionally, the grinding disc further includes an adjuster; The regulator is used to clean the abrasive pad.

[0020] Optionally, the grinding disc further includes a grinding head; The grinding head is mounted on the grinding pad and is used to fix the product to be ground.

[0021] Optionally, the grinding table rotates at a speed of 30-70 revolutions per minute.

[0022] Thirdly, this disclosure provides a grinding method in which grinding fluid is sprayed using the grinding fluid spraying device described in any of the above embodiments.

[0023] One or more technical solutions provided in this disclosure have the following advantages: The grinding slurry spraying device provided in this embodiment can make the grinding slurry flow out from multiple points by setting multiple first nozzles. The grinding slurry and rinsing slurry share multiple first nozzles, which can set more grinding slurry spraying points in a limited area. Compared with the grinding slurry spraying device with single-point flow of grinding slurry in related technologies, the dispersion speed of the grinding slurry is faster, which is beneficial to improving grinding efficiency. Attached Figure Description

[0024] Figure 1 A schematic diagram of a grinding fluid spraying device of the related technology is shown; Figure 2 It shows Figure 1 The diagram shows the distribution of grinding fluid when the grinding fluid spraying device is in use. Figure 3 A schematic diagram of a grinding fluid spraying device according to an embodiment of the present disclosure is shown; Figure 4 A schematic diagram of an abrasive slurry arm according to an embodiment of the present disclosure is shown; Figure 5 A schematic diagram of an abrasive slurry arm according to another embodiment of the present disclosure is shown; Figure 6 It shows Figure 3 The diagram shows the distribution of grinding fluid when the grinding fluid spraying device is in use. Figure 7 A schematic diagram of a liquid supply pipeline according to an embodiment of the present disclosure is shown; Figure 8 A schematic diagram of a chemical mechanical polishing apparatus according to an embodiment of the present disclosure is shown.

[0025] Figure label: 1: First grinding fluid arm; 12: Grinding fluid nozzle; 13: First grinding pad; 14: First spray surface; 2: Liquid supply line; 21: First line; 211: First inlet; 212: First outlet; 213: Third outlet; 22: Second line; 221: Second inlet; 222: Second outlet; 3: Grinding fluid arm; 31: First nozzle; 32: Second nozzle; 33: Second spray surface; 34: First channel; 341: First channel interface; 35: Second channel; 351: Second channel interface; 4: Three-way valve; 41: Third inlet; 42: Fourth inlet; 43: Fourth outlet; 44: Diverter valve; 5: Base; 6: Grinding pad; 7: Regulator; 71: Adjusting arm; 72: Adjusting pad; 73: Regulator base; 8: Grinding head. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this disclosure clearer, the disclosure will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are exemplary only and are not intended to limit the scope of this disclosure. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this disclosure.

[0027] The embodiments described in this disclosure are only a part of the embodiments, not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0028] In the description of this disclosure, it should be noted that the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] Furthermore, the technical features involved in the different embodiments of this disclosure described below can be combined with each other as long as they do not conflict with each other.

[0030] Figure 1 A schematic diagram of a grinding fluid spraying device of related technology is shown. Figure 1 As shown, the polishing slurry spraying device includes a first slurry supply line and a first polishing slurry arm 1. The first polishing slurry arm 1 is equipped with a polishing slurry nozzle 12. When polishing slurry is sprayed onto the first polishing pad 13 through this device, as... Figure 2As shown, the polishing slurry is sprayed in a linear pattern on the first polishing pad 13. The area of ​​the first spray surface 14 is relatively small. Usually, the polishing slurry needs to be evenly distributed on the surface of the first polishing pad 13 by rotating the first polishing pad 13 and adjusting and cleaning the polishing pad before subsequent polishing. The polishing slurry dispersion process usually takes a lot of time. At the same time, the polishing pad adjustment and cleaning will cause wear to the polishing pad, thus shortening the service life of the polishing pad.

[0031] Figure 3 A schematic diagram of a grinding fluid spraying device according to an embodiment of this disclosure is shown. Figure 3 As shown, this disclosure provides a polishing slurry spraying device. The polishing slurry spraying device includes a polishing slurry arm 3. The polishing slurry arm 3 includes a plurality of first nozzles 31. The plurality of first nozzles 31 are used to spray polishing slurry in a first time period and to spray rinsing fluid in a second time period.

[0032] In the polishing slurry spraying device provided in this embodiment, a first nozzle 31 on the polishing slurry arm 3 is used to spray polishing slurry, changing the polishing slurry from a single-point flow in related technologies to a linear flow. This causes the polishing slurry to form an annular surface on the polishing pad 6, increasing the area of ​​the second spraying surface of the polishing slurry on the polishing pad 6. This facilitates rapid dispersion of the polishing slurry and helps reduce the need for adjusting and cleaning the polishing pad 6, thereby extending the service life of the polishing pad 6. The first nozzle 31 is also used to spray rinsing fluid to perform a rinsing process.

[0033] The polishing slurry spraying device also includes a base 5. A polishing slurry arm 3 is disposed above the base 5, with one end rotatably connected to the base 5. There is one second nozzle 32, located at the end of the polishing slurry arm 3 furthest from the base 5. The polishing slurry spraying device provided in this embodiment also includes a supply line 2. The supply line 2 is used to supply working fluid to the polishing slurry arm 3. In some embodiments, the supply line 2 is fixed by the base 5. In some embodiments, the supply line 2 includes a first line 21 and a second line 22. The first line 21 is used to deliver polishing slurry to the polishing slurry arm 3. The first line 21 includes a first inlet 211 and a first outlet 212. The first inlet 211 is used to input polishing slurry, and the first outlet 212 is connected to a plurality of first nozzles 31 to spray polishing slurry. In use, the polishing slurry spraying device introduces polishing slurry through the first line 21 and sprays it out through the first nozzles 31. In some embodiments, the flow rate of the polishing slurry is 200 ml / min to 400 ml / min, which is conducive to the uniform distribution of the polishing slurry on the surface of the polishing pad 6. In some embodiments, the polishing slurry flow rate of the multiple first nozzles 31 is the same. In other embodiments, the flow rate of the polishing slurry in the first nozzles 31 gradually decreases along the direction away from the base 5. During the first time period, the position of the polishing slurry arm 3 remains fixed, while the polishing pad 6 rotates. The moving distance of the first nozzle 31 at the end of the polishing slurry arm 3 away from the base 5 relative to the polishing pad 6 is greater than the moving distance of the first nozzle 31 at the end of the polishing slurry arm 3 closer to the base 5 relative to the polishing pad 6. By reducing the flow rate of the polishing slurry in the first nozzles 31 away from the base 5, it is beneficial to uniformly spray the polishing slurry on the surface of the polishing pad 6, thereby helping to accelerate the dispersion speed of the polishing slurry.

[0034] The second conduit 22 is used to deliver rinsing fluid to the polishing slurry arm 3. The second conduit 22 includes a second inlet 221 and a second outlet 222. The second inlet 221 is used to input the rinsing fluid, and the second outlet 222 is connected to a plurality of first nozzles 31 so that the first nozzles 31 spray the rinsing fluid. In use, the polishing slurry spraying device introduces the rinsing fluid through the second conduit 22 and sprays it out through the first nozzles 31. The polishing slurry spraying device provided in this embodiment of the present disclosure, by setting multiple first nozzles 31 shared by both polishing slurry and rinsing fluid, can provide more polishing slurry or rinsing fluid spray points on a limited area of ​​the surface of the polishing slurry arm 3, which is beneficial for reducing the distribution area of ​​the first nozzles 31.

[0035] Multiple first nozzles 31 are arranged along the length of the polishing slurry arm 3. The multiple first nozzles 31 can be arranged in a single row or at least in two rows along the length of the polishing slurry arm 3. When the multiple first nozzles 31 are arranged in at least two rows along the length of the polishing slurry arm 3, the first nozzles 31 in adjacent rows can be staggered. In an exemplary embodiment, the spacing between two adjacent first nozzles 31 in the same row is the same. In another exemplary embodiment, the spacing between two adjacent first nozzles 31 gradually increases along the direction away from the base 5. During a first time period, the position of the polishing slurry arm 3 remains fixed, and the polishing pad 6 rotates. The moving distance of the first nozzle 31 at the end of the polishing slurry arm 3 away from the base 5 relative to the polishing pad 6 is less than the moving distance of the first nozzle 31 at the end of the polishing slurry arm 3 near the base 5 relative to the polishing pad 6. Increasing the spacing between two adjacent first nozzles 31 away from the base 5 facilitates uniform spraying of the polishing slurry on the surface of the polishing pad 6, thereby helping to accelerate the dispersion speed of the polishing slurry. The spray directions of any two first nozzles 31 differ by no more than 30 degrees. In some embodiments, the spray directions of the multiple first nozzles 31 are parallel to each other. The first nozzle 31 is used to spray abrasive fluid or rinsing fluid onto the abrasive pad 6. In some embodiments, the rinsing fluid is deionized water. Figure 4 A schematic diagram of an abrasive slurry arm according to an embodiment of this disclosure is shown. Figure 4 As shown, in some embodiments, the polishing slurry arm 3 has a first channel 34, and multiple first nozzles 31 are connected to the first channel 34. The polishing slurry arm 3 is provided with a first channel interface 341, which is located at one end of the first channel 34 and is connected to a first outlet 212 and a second outlet 222, respectively. The polishing slurry arm 3 also has a second channel 35, and a second nozzle 32 is connected to the second channel 35. The polishing slurry arm 3 is provided with a second channel interface 351, which is connected to a third outlet 213. When spraying polishing slurry, the first pipeline 21 inputs polishing slurry into the first channel 34 through the first channel interface 341. The polishing slurry in the first channel 34 is sprayed through the first nozzles 31 to distribute the slurry on the polishing pad. When rinsing, the second pipeline 22 inputs rinsing slurry into the first channel 34 through the first channel interface 341. The rinsing slurry in the first channel 34 is sprayed through the first nozzles 31 to achieve rinsing.

[0036] Figure 5 A schematic diagram of an embodiment of the grinding fluid arm disclosed herein is shown, as follows: Figure 5 As shown, in some embodiments, the grinding fluid arm 3 has a first channel 34, a plurality of first nozzles 31 are connected to the first channel 34, and a first channel interface 341 is provided in the middle of the first channel 34. The first channel interface 341 is connected to the first liquid outlet 212 and the second liquid outlet 222 respectively.

[0037] When spraying polishing fluid, the first conduit 21 introduces polishing fluid into the first channel 34 through the first channel interface 341. The polishing fluid in the first channel 34 is then sprayed onto the polishing pad through the first nozzle 31. During rinsing, the second conduit 22 introduces rinsing fluid into the first channel 34 through the first channel interface 341. The rinsing fluid in the first channel 34 is then sprayed onto the first nozzle 31 to achieve rinsing.

[0038] like Figure 4 As shown, in the present invention, the polishing slurry spraying device has a larger area of ​​the second spraying surface of the polishing slurry on the polishing pad 6 than the area of ​​the first spraying surface of the polishing slurry on the first polishing pad 6 in related technologies. As the polishing pad 6 rotates, the polishing slurry can be quickly distributed across the entire surface of the polishing pad 6, helping to save polishing time and improve production efficiency. The product to be polished can contact the polishing slurry more evenly from the center to the edge, which helps to better control the polishing process and also helps to reduce the need for cleaning and adjusting the polishing pad 6, increasing its service life. When the product to be polished is a wafer, the polishing slurry can contact the wafer surface more quickly and evenly, resulting in a more stable wafer morphology. After polishing, rinsing fluid is sprayed through the first nozzle 31 to clean the residual polishing slurry from the wafer surface.

[0039] In some embodiments, the polishing slurry arm 3 further includes a second nozzle 32. In some embodiments, the spray direction of the second nozzle 32 is the same as that of the first nozzle 31. The first pipeline 21 further includes a third outlet 213, which is connected to the second nozzle 32 to allow the second nozzle 32 to spray polishing slurry. In the chemical mechanical polishing process, when spraying polishing slurry, the first pipeline 21 simultaneously supplies polishing slurry to both the first nozzle 31 and the second nozzle 32, allowing as many nozzles as possible to participate in the spraying of polishing slurry, increasing the spraying area, and improving the slurry distribution speed. During the rinsing process, the supply of slurry from the first pipeline 21 is stopped, and rinsing slurry is supplied from the second pipeline 22. The rinsing slurry is sprayed out from the first nozzle 31 for cleaning. In related technologies, the polishing slurry arm 3 typically includes one polishing slurry nozzle and multiple rinsing slurry nozzles. The polishing slurry spraying device provided in this disclosure can be implemented by changing the design of the supply pipeline of the polishing slurry spraying device in related technologies, without the need to redesign the polishing slurry arm, thus exhibiting good versatility.

[0040] The liquid supply line 2 also includes a three-way valve 4. The three-way valve 4 includes a third inlet 41, a fourth inlet 42, and a fourth outlet 43. The third inlet 41 is connected to the first outlet 212, the fourth inlet 42 is connected to the second outlet 222, and the fourth outlet 43 is connected to a plurality of first nozzles 31. In some embodiments, the three-way valve 4 is a three-way solenoid valve, which is used to control the connection between the fourth outlet 43 and the third inlet 41 or the fourth inlet 42. In some embodiments, the first outlet 212 is located in the middle of the first line 21. When spraying the polishing fluid, the third inlet 41 and the fourth outlet 43 of the three-way valve 4 are connected, and the first line 21 inputs the polishing fluid into the first channel 34 through the three-way valve 4. The polishing fluid in the first channel 34 is sprayed through the first nozzles 31 to achieve liquid distribution on the polishing pad. During rinsing, the fourth inlet 42 and the fourth outlet 43 are connected. The second pipeline 22 introduces rinsing fluid into the first channel 34 through the three-way valve 4. The rinsing fluid in the first channel 34 is sprayed through the first nozzle 31 to achieve rinsing. In use, during the first period, the third inlet and the fourth outlet are connected, and the fourth inlet and the fourth outlet are closed. During the second period, the fourth inlet and the fourth outlet are connected, and the third inlet and the fourth outlet are closed.

[0041] Figure 6 A schematic diagram of a liquid supply line 2 according to an embodiment of this disclosure is shown. For example... Figure 6 As shown, in some embodiments, the three-way valve 4 is equipped with a switching valve 44, and the fourth liquid outlet 43 is connected to the third liquid inlet 41 or the fourth liquid inlet 42 through the switching valve 44. In use, the fourth liquid outlet 43 is first connected to the third liquid inlet 41 by rotating the switching valve 44, while simultaneously disconnecting the fourth liquid outlet 43 from the fourth liquid inlet 42. The grinding fluid is then pumped into the first pipeline 21. The grinding fluid flows through the three-way valve 4 and exits from the first nozzle 31. The spray direction of the first nozzle 31 is towards the grinding pad 61. As the grinding pad 61 rotates, the second spray surface 33 of the grinding fluid on the surface of the grinding pad 61 forms a ring shape. With the rotation of the grinding pad 61, the grinding fluid sprayed onto the surface of the grinding pad 61 is evenly distributed on the surface of the grinding pad 61, ensuring uniform contact between the product to be ground and the grinding fluid. After grinding is completed, the switching valve 44 is turned to connect the fourth liquid outlet 43 with the fourth liquid inlet 42, while the fourth liquid outlet 43 is disconnected from the third liquid inlet 41. The rinsing liquid is input into the second pipeline 22 through the liquid pump. The rinsing liquid flows through the three-way valve 4 and flows out from the first nozzle 31 to rinse the ground product. The device has a simple structure and is highly practical.

[0042] Figure 7 A schematic diagram of a chemical mechanical polishing apparatus according to an embodiment of the present disclosure is shown. Figure 7As shown, this disclosure provides a chemical mechanical polishing (CMP) apparatus, including a polishing disc 6 and a polishing slurry spraying device as described in any of the above embodiments. The CMP apparatus is used for polishing wafers. A polishing slurry arm 3 is disposed above the polishing disc 6 and is used to spray polishing slurry or rinsing fluid onto the polishing disc 6. In some embodiments, the polishing disc 6 has a circular top view, and its diameter is larger than the diameter of the wafer. The polishing disc 6 includes a polishing pad 61 and a polishing table. The polishing pad 61 is supported on the polishing table. In some embodiments, the polishing pad 61 and the polishing table have the same diameter. The polishing pad 61 is detachably connected to the polishing table. In some instances, the polishing pad 61 is a hard pad or a soft pad. In other embodiments, the polishing pad 61 is made of a stack of hard and soft pads.

[0043] In some embodiments, the grinding table is driven to rotate by a motor. The rotation of the grinding table causes the grinding pad 61 to rotate. In use, the rotation speed of the grinding table is 30-70 revolutions per minute, which helps the grinding slurry to be evenly distributed on the grinding pad 61.

[0044] The grinding disc also includes an adjuster 7. The adjuster 7 is used to clean the grinding pad 61. In some embodiments, the adjuster 7 includes an adjusting arm 71, an adjusting pad 72, and an adjuster base 73. One end of the adjusting arm 71 is rotatably connected to the adjuster base 73, and the other end is connected to the adjusting pad 72. In use, the adjusting arm 71 rotates to drive the adjusting pad 72 to clean the grinding pad 61.

[0045] The grinding disc also includes a grinding head 8. The grinding head 8 is disposed on the grinding pad 61 and is used to hold the wafer.

[0046] In the chemical mechanical polishing equipment provided in this embodiment, the area of ​​the second spray surface 33 of the polishing slurry on the polishing pad 61 is larger than the area of ​​the first spray surface 14 of the polishing slurry on the first polishing pad 61 in related technologies. As the polishing pad 61 rotates, the polishing slurry can be quickly distributed across the entire surface of the polishing pad 61, helping to save polishing time and improve production efficiency. The product to be polished can contact the polishing slurry more evenly from the center to the edge, which helps to better control the polishing process and also helps to reduce the need for cleaning and adjusting the polishing pad 61, increasing its service life. When the product to be polished is a wafer, the polishing slurry can contact the wafer surface more quickly and evenly, resulting in a more stable wafer morphology. After polishing, rinsing fluid is sprayed through the first nozzle 31 to clean the residual polishing slurry from the wafer surface.

[0047] This disclosure provides a grinding method that can employ the grinding slurry spraying device described in any of the above embodiments to spray grinding slurry. The above device embodiments can be used to understand the method of this disclosure, and the following embodiments regarding the method can also be used to understand the grinding slurry spraying device of this disclosure.

[0048] The grinding method of this disclosure includes: during grinding, conveying grinding fluid to a grinding fluid arm 3, and spraying the grinding fluid through a plurality of first nozzles 31 on the grinding fluid arm 3; during rinsing, conveying rinsing fluid to the grinding fluid arm 3, and spraying the rinsing fluid through the plurality of first nozzles 31 on the grinding fluid arm 3 for rinsing. The grinding fluid arm 3 includes a plurality of first nozzles 31. The plurality of first nozzles 31 can be used to spray both grinding fluid and rinsing fluid.

[0049] When spraying the polishing slurry, the third inlet 41 and the fourth outlet 43 of the three-way valve 4 are connected. The first pipeline 21 inputs the polishing slurry into the first channel 34 through the three-way valve 4. The polishing slurry in the first channel 34 is sprayed through the first nozzle 31 to achieve liquid distribution on the polishing pad. During rinsing, the fourth inlet 42 and the fourth outlet 43 are connected. The second pipeline 22 inputs the rinsing slurry into the first channel 34 through the three-way valve 4. The rinsing slurry in the first channel 34 is sprayed through the first nozzle 31 to achieve rinsing. During polishing, the motor drives the polishing table to rotate at a speed of 30-70 rpm, which in turn drives the polishing pad 61 to rotate. As the polishing pad 61 rotates, the polishing slurry sprayed onto the surface of the polishing pad 61 is dispersed on the surface of the polishing pad 61. The adjusting arm 71 rotates around the adjusting base 73. The adjusting arm 71 drives the adjusting pad 72 to clean the polishing pad 61, and the polishing slurry is evenly dispersed on the surface of the polishing pad 61, so that the polishing wafer to be polished is in uniform contact with the polishing slurry. The grinding head 8 restricts the position of the wafer and controls the grinding of the wafer.

[0050] After grinding is completed, turn the switching valve 44 to connect the fourth liquid outlet 43 with the fourth liquid inlet 42, and at the same time disconnect the fourth liquid outlet 43 from the third liquid inlet 41. The rinsing liquid is then pumped into the second pipeline 22. The rinsing liquid flows through the three-way valve 4 and flows out from the first nozzle 31 to rinse the ground wafer.

[0051] The polishing slurry spraying method provided in this embodiment transforms the polishing slurry from a single-point flow to a linear flow through the first nozzle 31 on the polishing slurry arm 3, causing the polishing slurry to form an annular surface on the polishing pad 6. This increases the area of ​​the second spraying surface of the polishing slurry on the polishing pad 6, which is beneficial for the rapid dispersion of the polishing slurry. It also helps to reduce the need for adjusting and cleaning the polishing pad 6, thereby extending the service life of the polishing pad 6. The uniform dispersion of the polishing slurry ensures that the wafer and the polishing slurry are in uniform contact, which helps to control the morphology of the wafer during subsequent polishing.

[0052] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this disclosure and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this disclosure should be included within the protection scope of this disclosure. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A grinding fluid spraying device, characterized in that, include: Base; An abrasive arm is disposed above the base, with one end of the abrasive arm rotatably connected to the base; the abrasive arm includes a plurality of first nozzles; the plurality of first nozzles are used to spray abrasive fluid in a first time period and to spray rinsing fluid in a second time period. The liquid supply pipeline includes a first pipeline and a second pipeline; the first pipeline includes a first inlet and a first outlet, the first inlet is used to input the grinding fluid, and the first outlet is connected to a plurality of first nozzles so that the plurality of first nozzles spray the grinding fluid. The second pipeline includes a second inlet and a second outlet. The second inlet is used to input flushing fluid, and the second outlet is connected to a plurality of first nozzles so that the plurality of first nozzles spray flushing fluid. The grinding fluid arm has a first channel, and multiple first nozzles are connected to the first channel. The grinding fluid arm is provided with a first channel interface, which is connected to the first outlet and the second outlet respectively. The multiple first nozzles are arranged along the length of the grinding fluid arm, and the spacing between two adjacent first nozzles gradually increases along the direction away from the base. The grinding fluid arm also includes a second nozzle. The first pipeline also includes a third outlet, which is connected to the second nozzle.

2. The grinding fluid spraying device according to claim 1, wherein, The liquid supply pipeline also includes a three-way valve; The three-way valve includes a third inlet, a fourth inlet, and a fourth outlet. The third liquid inlet is connected to the first liquid outlet, the fourth liquid inlet is connected to the second liquid outlet, and the fourth liquid outlet is connected to multiple first nozzles; During the first time period, the third liquid inlet is connected to the fourth liquid outlet, and the fourth liquid inlet is closed to the fourth liquid outlet; During the second time period, the fourth liquid inlet and the fourth liquid outlet are connected, while the third liquid inlet and the fourth liquid outlet are disconnected.

3. The grinding fluid spraying device according to claim 1, wherein, The grinding fluid arm has a second channel, the second nozzle is connected to the second channel, and the grinding fluid arm is provided with a second channel interface, which is connected to the third outlet.

4. The grinding fluid spraying device according to claim 1, wherein, The number of the second nozzles is one, and one second nozzle is located at the end of the grinding fluid arm away from the base.

5. The grinding fluid spraying device according to any one of claims 1-4, wherein, The spray directions of the multiple first nozzles are parallel to each other.

6. A chemical mechanical polishing apparatus, characterized in that, Includes a grinding disc and a grinding fluid spraying device as described in any one of claims 1-5; The polishing fluid arm is positioned above the polishing disc and is used to spray polishing fluid or rinsing fluid onto the polishing disc.

7. The chemical mechanical polishing apparatus according to claim 6, wherein, The grinding disc includes a grinding pad and a grinding table; The grinding pad is disposed on the grinding table; The grinding table is used to rotate the grinding pad.

8. The chemical mechanical polishing apparatus according to claim 7, wherein, The grinding disc also includes an adjuster; The regulator is used to clean the abrasive pad.

9. The chemical mechanical polishing apparatus according to claim 7, wherein, The grinding disc also includes a grinding head; The grinding head is mounted on the grinding pad and is used to fix the product to be ground.

10. The chemical mechanical polishing apparatus according to any one of claims 7-9, wherein, The grinding table rotates at a speed of 30-70 revolutions per minute.

11. A grinding method, wherein the grinding fluid is sprayed using the grinding fluid spraying device according to any one of claims 1-5.

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