Liquid ejecting head and liquid ejecting apparatus

Abstract

A liquid ejecting head and a liquid ejecting apparatus capable of suppressing deformation of a fixing plate on which a head chip is fixed are provided. In the present invention, on an upper portion of the head chip, a first adhesive surface is provided, a holder is provided between the first adhesive surface and the fixing plate to accommodate the head chip, and the holder has a second adhesive surface formed with an opening of a second supply flow path that communicates with the head chip. The first adhesive surface and the second adhesive surface are adhered together by a first adhesive in a manner that defines a connection flow path that connects between a first supply flow path and the second supply flow path. The upper portion of the head chip has a first contact portion, and the holder has a first contacted portion that opposes the first contact portion. A first dimension between the first contact portion and the first contacted portion is smaller than a second dimension between the first adhesive surface and the second adhesive surface.

Description

Technical Field

[0001] This invention relates to a liquid ejector head and a liquid ejection device that ejects liquid from a nozzle, and more particularly to an inkjet recording head and an inkjet recording device that ejects ink as a liquid. Background Technology

[0002] A representative example of a liquid ejection head that ejects droplets is an inkjet recording head (hereinafter referred to as a recording head only). For example, there is an ejection head that has multiple head chips that eject ink, a holder that holds the multiple head chips, and a fixing plate that fixes the holder and the multiple head chips (for example, see Patent Document 1).

[0003] In the recording head illustrated in Patent Document 1, an adhesive is filled around the connecting portion of the liquid inlet channel of the holder and the housing channel of the head chip in the gap between the holder and the head chip, thereby bonding the upper surface of the head chip and the head mounting surface of the holder together.

[0004] Although the recording head with the above-described structure has an opening formed on the mounting plate for the nozzles exposing the chip, external forces act on the mounting plate when the opening is sealed with a cap. Furthermore, external forces also act on the mounting plate when the sprayed medium comes into contact with it. When such external forces act on the mounting plate, problems arise such as the adhesive filling the space between the chip and the retainer being crushed, and the chip being pressed close to the retainer, potentially causing deformation of the mounting plate.

[0005] Furthermore, problems like those described above can occur in all types of inkjet printheads. Moreover, they can exist not only in inkjet printheads that eject ink, but also in liquid printheads that eject liquids other than ink.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2016-130026 Summary of the Invention

[0007] One aspect of the present invention that solves the above-mentioned problem is a liquid injection head, characterized in that it comprises: a first head chip having a plurality of first nozzles for injecting liquid in a spraying direction; a retainer for holding the first head chip; a fixing plate having a first opening for exposing the plurality of first nozzles to the outside, and fixing the retainer and the first head chip to the fixing plate; a first adhesive surface having an opening with a flow channel formed on the upper part of the first head chip; the retainer housing the first head chip between itself and the fixing plate, and having a second adhesive surface having an opening with a flow channel communicating with the first head chip; the first adhesive surface and the second adhesive surface being bonded together by a first adhesive in such a way as to define a connecting flow channel connecting the retainer to the flow channel communicating with the first head chip and the flow channel of the first head chip; the upper part of the first head chip having a first contact portion; the retainer having a first contacted portion opposite to the first contact portion; a first dimension between the first contact portion and the first contacted portion being smaller than a second dimension between the first adhesive surface and the second adhesive surface.

[0008] In addition, another aspect of the present invention is a liquid injection device, characterized in that it comprises: a liquid injection head of the above-described manner; and a conveying unit for conveying a medium. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of an inkjet recording device.

[0010] Figure 2 A magnified cross-sectional view of the main parts of the inkjet recording device.

[0011] Figure 3 This is an exploded perspective view of the recording head according to Embodiment 1.

[0012] Figure 4 A top view of the head chip involved in Implementation 1 for observation in the +Z direction.

[0013] Figure 5 for Figure 4 A-A' section view.

[0014] Figure 6 This is a cross-sectional view of the recording head according to Embodiment 1.

[0015] Figure 7 A cross-sectional view of the main part of the recording head involved in Embodiment 1 is shown in an enlarged form.

[0016] Figure 8 A top view of the recording head used in Implementation 1 for observation in the -Z direction.

[0017] Figure 9 This is a cross-sectional view of the recording head according to Embodiment 2.

[0018] Figure 10 This is a cross-sectional view of the recording head according to Embodiment 3.

[0019] Figure 11 A top view of the head chip involved in Implementation 4, which is used for observation in the +Z direction. Detailed Implementation

[0020] The present invention will now be described in detail based on embodiments. However, the following description represents one aspect of the invention, and modifications can be made freely within the scope of the invention. Furthermore, in the figures, the same symbols will be used to refer to the same components, and repeated descriptions will be omitted. In addition, in the figures, X, Y, and Z represent three spatial axes that are orthogonal to each other. In this specification, the directions along these axes will be defined as the X direction, Y direction, and Z direction, and the direction in which the arrows in the figures point will be described as the positive (+) direction, and the opposite direction as the negative (-) direction. The Z direction represents the vertical direction, the +Z direction represents vertically downward, and the -Z direction represents vertically upward. Further, the three spatial axes X, Y, and Z, which are not limited to positive and negative directions, will be described as the X-axis, Y-axis, and Z-axis.

[0021] (Implementation Method 1)

[0022] Figure 1 This is a schematic diagram of an inkjet recording device. Figure 2 This is a magnified cross-sectional view of the main parts of the inkjet recording device, and is a cross-sectional view perpendicular to the Y-axis and passing through the inkjet recording head 1, the transport mechanism 4, and the moving mechanism 6, which will be described later. The inkjet recording device I (hereinafter, also referred to simply as "recording device I") according to the present invention is a printing device that sprays ink, a liquid, in the form of ink droplets onto a medium S such as printing paper, and performs the printing of images, etc., by arranging the dots formed on the medium S. Furthermore, the medium S can be any material such as resin film or cloth, in addition to recording paper.

[0023] The recording device I includes: an inkjet recording head 1 (hereinafter, also referred to as "recording head 1"), which is an example of a liquid ejector head; a liquid container 3; a delivery mechanism 4 for dispensing the medium S; a control unit 5; and a moving mechanism 6. The delivery mechanism 4 is an example of a "delivery unit".

[0024] The liquid container 3 stores the ink that will be ejected from the recording head 1. Examples of liquid containers 3 include a cartridge that can be detached from the recording device 1, a bag-shaped ink pack made of a flexible film, and an ink canister for refilling ink. In this embodiment, a cartridge that is detachably mounted on the recording head 1 is used as the liquid container 3. Furthermore, multiple types of ink of different colors or varieties are stored separately in the liquid container 3.

[0025] Although the control unit 5 is not specifically illustrated, it is configured, for example, to include a control device such as a CPU (Central Processing Unit) or FPGA (Field Programmable Gate Array) and a storage device such as semiconductor memory. The control unit 5 executes the program stored in the storage device through the control device, thereby uniformly controlling the various elements of the inkjet recording device I, namely the transport mechanism 4, the moving mechanism 6, the recording head 1, etc.

[0026] The conveying mechanism 4 is controlled by the control unit 5 and conveys the medium S in the +X direction. Specifically, the conveying mechanism 4 includes an impression plate 400, a paper feeding unit 410, and a conveying unit 420, which are mounted on the main body 2 of the device.

[0027] The impression plate 400 is a component that extends in the ±Y direction and supports the surface opposite to the ink-sprayed surface of the medium S, i.e., the +Z direction side. The impression plate 400 has a surface positioned relative to the recording head 1 in the +Z direction, opposite to the recording head 1, and supporting the medium S, at least within the ±Y direction movement range of the recording head 1. The impression plate 400 is positioned relative to the paper feeding unit 410 (described later) in the +X direction and relative to the transport unit 420 (described later) in the -X direction.

[0028] Alternatively, an adsorption unit for adsorbing the medium S can be provided on the surface of the imprint plate 400 opposite to the recording head 1. Examples of adsorption units include those that perform suction adsorption by drawing the medium S, or those that use electrostatic force to electrostatically adsorb the medium S.

[0029] The paper feeding unit 410 conveys the medium S in the +X direction, thereby feeding paper to the recording head 1 mounted on the device body 2. Specifically, the paper feeding unit 410 includes a paper feeding roller 411, a paper feeding driven roller 412, and a drive motor (not shown), and is positioned on the -X direction side relative to the recording head 1. The paper feeding roller 411 is a component extending in the ±Y direction and is mounted on the device body 2 in a manner rotatable about the Y-axis, and is rotated by the drive unit. The paper feeding driven roller 412 is a component extending in the ±Y direction and is mounted on the device body 2 in a manner rotatable about the Y-axis, and is driven by the paper feeding roller 411. The paper feeding roller 411 is positioned on the +Z direction side relative to the medium S, and the paper feeding driven roller 412 is positioned on the -Z direction side relative to the medium S. The drive unit is driven by the control unit 5, thereby rotating the paper feeding roller 411. The medium S is conveyed towards the +X direction side by passing between the rotating feed roller 411 and the feed driven roller 412. Alternatively, the feed roller 411 may be positioned on the -Z direction side relative to the medium S, and the feed driven roller 412 may be positioned on the +Z direction side relative to the medium S.

[0030] The conveying unit 420 conveys the medium S in the +X direction, thereby discharging it to the outside of the device body 2. Specifically, the conveying unit 420 includes a conveying roller 421, a conveying driven roller 422, and a drive motor (not shown), and is positioned on the +X direction side relative to the recording head 1. The conveying roller 421 is a component extending in the ±Y direction and is mounted on the device body 2 in a manner rotatable about the Y-axis, and is rotated by the drive unit. The conveying driven roller 422 is a component extending in the ±Y direction and is mounted on the device body 2 in a manner rotatable about the Y-axis, and is driven by the conveying roller 421. The conveying roller 421 is positioned on the +Z direction side relative to the medium S, and the conveying driven roller 422 is positioned on the -Z direction side relative to the medium S. The drive unit is driven by the control unit 5, thereby rotating the conveying roller 421. The medium S is conveyed in the +X direction side by passing between the rotating conveying roller 421 and the conveying driven roller 422. Alternatively, the conveying roller 421 may be positioned on the -Z direction side relative to the medium S, and the conveying driven roller 422 may be positioned on the +Z direction side relative to the medium S.

[0031] The medium S is conveyed in the +X direction and fed to the recording head 1 via the paper feeding unit 410. The medium S is supported by the impression plate 400 from the +Z direction side and is sprayed with ink droplets ejected from the recording head 1. The medium S with ink droplets sprayed on it is discharged to the outside of the device body 2 via the transport unit 420.

[0032] Furthermore, the conveying mechanism 4 for conveying the medium S is not limited to a structure using rollers such as a paper feed roller 411 and a conveying roller 421, but can also be a structure that conveys the medium S by a belt or a roller.

[0033] The moving mechanism 6 is controlled by the control unit 5, thereby causing the recording head 1 to reciprocate in the ±Y direction. The ±Y direction in which the recording head 1 reciprocates via the moving mechanism 6 is the direction that intersects with the +X direction in which the medium S is transported.

[0034] Specifically, the moving mechanism 6 of this embodiment includes a holding member 7 for holding the recording head 1, a conveyor belt 8, and a guide rail 8b. The holding member 7 is a generally box-shaped structure, a so-called carriage, for housing the recording head 1, and is fixed to the conveyor belt 8. The conveyor belt 8 is a seamless belt that is stretched along the ±Y direction. Under the control of the control unit 5, the driving force of the drive motor 8a is transmitted to the conveyor belt 8, and the conveyor belt 8 rotates, thereby causing the recording head 1 and the holding member 7 to move back and forth along the guide rail 8b that extends along the ±Y direction. Furthermore, the recording device I sprays ink onto the medium S by the recording head 1 in parallel with the transport of the medium S and the repeated back and forth movement of the recording head 1, thereby forming a desired image on the surface of the medium S. In addition, although the liquid container 3 is mounted on the holding member 7 together with the recording head 1, it is not limited to such a structure. The liquid container 3 can also be placed separately from the recording head 1 within the device body 2.

[0035] Furthermore, a cover 9 is provided on the recording device I on the -Y direction side. Although the detailed structure will be described later, the cover 9 is for the nozzle 11 of the recording head 1 (see reference). Figure 5 The recording head 1 is a sealing component and is mounted on the recording device I in a manner that allows it to move in the ±Z direction. The control unit 5 moves the recording head 1 to a position where it overlaps with the cover 9 when viewed in the +Z direction, and the cover 9 moves towards the recording head 1, thereby sealing the nozzle 11 within the enclosed space 9a (see reference 1) formed by the cover 9 and the recording head 1. Figure 7 )Inside.

[0036] Furthermore, although the above-described recording apparatus I exemplifies a recording apparatus in which the recording head 1 moves back and forth in the ±Y direction, it is not limited to this. For example, the present invention can also be applied to a so-called line recording apparatus in which the recording head 1 is elongated compared to the width of the medium S and the printing is performed by moving the medium S only in the ±X direction instead of moving the recording head 1 during the period when liquid is sprayed onto the medium S for printing purposes.

[0037] Figure 3This is an exploded perspective view of the recording head 1. The recording head 1 includes: a head chip 10, a holder 70, and a fixing plate 80. In this embodiment, one recording head 1 includes four head chips 10, with a first head chip 10A, a second head chip 10B, a third head chip 10C, and a fourth head chip 10D arranged from the +Y direction side to the -Y direction side. Furthermore, the number of head chips 10 held on the holder 70 is not limited to four; it can be two or more, or it can be one. Moreover, the configuration of multiple head chips 10 is not limited to the example shown in this figure.

[0038] The following description of "head chips 10A-10D" refers to the first head chip 10A, the second head chip 10B, the third head chip 10C, and the fourth head chip 10D. The common structure among head chips 10A-10D will be referred to as head chip 10. The unique structure of each of head chips 10A-10D will be referred to as first head chip 10A, second head chip 10B, third head chip 10C, or fourth head chip 10D.

[0039] use Figure 4 as well as Figure 5 Let's take an example of the head chip 10 to illustrate. Figure 4 This is a top view of the head chip 10 when viewed in the +Z direction. Figure 5 for Figure 4 A sectional view along line A-A'. Additionally, in Figure 5 The diagram also shows a cross-section of the fixing plate 80. Furthermore, in this embodiment, the various orientations of the head chip 10 will be described based on its orientation when mounted on the recording head 1.

[0040] The head chip 10 includes multiple nozzles 11, a housing 13, and a flexible substrate 23. Furthermore, the head chip 10 of this embodiment also includes a connecting plate 14, a pressure chamber forming substrate 15, a vibrating plate 16, a malleable substrate 17, a piezoelectric actuator 18, etc. These multiple structural components constituting the head chip 10 are stacked together and bonded together by adhesives or the like, thereby being modularized.

[0041] Multiple nozzles 11 are formed on the nozzle plate 12 and eject ink in the +Z direction. The nozzle 11 of the first chip 10A is an example of a "first nozzle", and the nozzle 11 of the second chip 10B is an example of a "second nozzle". The surface of the nozzle plate 12 on which the nozzles 11 are disposed is called the nozzle surface.

[0042] The pressure chamber forming substrate 15 has a plurality of pressure chambers 19 communicating with each of a plurality of nozzles 11 formed on the nozzle plate 12. A plurality of piezoelectric actuators 18 are provided corresponding to each pressure chamber 19. The piezoelectric actuators 18 are energy generating elements that generate energy to cause pressure fluctuations in the ink within the corresponding pressure chamber 19, i.e., the ejection of ink from the nozzles 11 communicating with the pressure chamber 19; they are also pressure generating elements. A vibrating plate 16 is provided between the pressure chambers 19 and the piezoelectric actuators 18, and the opening on the -Z direction side of the pressure chamber 19 is sealed by the vibrating plate 16, thereby dividing a portion of the pressure chamber 19. Alternatively, the pressure chamber forming substrate 15 and the vibrating plate 16 can be integrally formed. Furthermore, piezoelectric actuators 18 are stacked on the vibrating plate 16 in areas corresponding to each pressure chamber 19. In this embodiment, the piezoelectric actuator 18 has a first electrode 20, a piezoelectric layer 21, and a second electrode 22 sequentially stacked on the vibrating plate 16. When an electric field corresponding to the potential difference between the two electrodes is applied between the first electrode 20 and the second electrode 22, the piezoelectric actuator 18 constructed in this manner undergoes flexural deformation.

[0043] Furthermore, a flexible substrate 23 with flexibility is connected to the piezoelectric actuator 18. In this embodiment, the electrodes of the piezoelectric actuator 18 and the flexible substrate 23 are connected together via lead-out wiring 24 led from the piezoelectric actuator 18 to the vibrating plate 16. On the flexible substrate 23, a circuit board having switching elements such as transmission gates for driving the piezoelectric actuator 18 and a drive circuit 25 such as a semiconductor integrated circuit (IC) are mounted. Such a flexible substrate 23 is led out in the -Z direction of the pressure chamber forming substrate 15. In addition, the flexible substrate 23 is not limited to a COF (chip flip-flop) substrate with the drive circuit 25 provided as described above. For example, instead of the flexible substrate 23, flexible wiring such as FFC (flexible flat cable) or FPC (flexible printed circuit board) without the drive circuit 25 can also be used.

[0044] On the +Z direction side of the pressure chamber forming substrate 15, a connecting plate 14 is joined, which has a wider area than the pressure chamber forming substrate 15 when viewed from above in the +Z direction. On the connecting plate 14, a nozzle connecting port 26 connecting the pressure chamber 19 and the nozzle 11, a common liquid chamber 27 shared by each pressure chamber 19, and an independent connecting port 28 connecting the common liquid chamber 27 to the pressure chamber 19 are formed. The common liquid chamber 27 is a space extending along the ±X direction, which is the direction in which the nozzles 11 are arranged side-by-side. In this embodiment, two common liquid chambers 27 are formed corresponding to the rows of two nozzles 11 provided on the nozzle plate 12. Multiple independent connecting ports 28 are formed along the ±X direction, which is the direction of the nozzle rows, corresponding to each pressure chamber 19. The independent connecting ports 28 and the portions of the pressure chambers 19 that communicate with the nozzle connecting ports 26 are connected at opposite ends.

[0045] A nozzle plate 12, on the +Z direction side of the connecting plate 14, is joined at approximately the center. Multiple nozzles 11 are formed thereon. In this embodiment, the nozzle plate 12 is a plate smaller than the outer shape of the connecting plate 14 when viewed from below in the -Z direction. The nozzle plate 12 is joined to the connecting plate 14 on the +Z direction side, at a position away from the opening of the common liquid chamber 27 and in the area where the nozzle connecting ports 26 are open, with the nozzle connecting ports 26 and the multiple nozzles 11 respectively connected, by an adhesive or the like. In this embodiment, the nozzle plate 12 has a total of two nozzle rows (not shown), formed by multiple nozzles 11 arranged side-by-side in the aforementioned nozzle row direction, i.e., the ±X direction. The two nozzle rows are arranged side-by-side in the ±Y direction.

[0046] Furthermore, a malleable substrate 17 is joined to the surface of the connecting plate 14 on the +Z direction side at a position away from the nozzle plate 12. When the malleable substrate 17 is positioned on and joined to the surface of the connecting plate 14 on the +Z direction side, it seals the opening of the common liquid chamber 27 on the surface of the connecting plate 14 on the +Z direction side.

[0047] In this embodiment, the malleable substrate 17 includes a sealing film 17a made of a flexible film such as resin, and a frame member 17b made of a hard material such as stainless steel. Since the area of ​​the frame member 17b opposite the common liquid chamber 27 becomes a malleable opening 17c that is completely removed in the thickness direction, one surface of the common liquid chamber 27 becomes a flexible portion, or malleable portion 17d, sealed only by the flexible sealing film 17a. Flexible deformation is achieved through this malleable portion 17d, thereby mitigating pressure fluctuations within the ink flow channels, particularly within the common liquid chamber 27.

[0048] Furthermore, a protective substrate 29 having approximately the same size as the pressure chamber forming substrate 15 is joined in the -Z direction of the pressure chamber forming substrate 15. The protective substrate 29 has a space, i.e., a holding portion 30, for protecting the piezoelectric actuator 18.

[0049] The pressure chamber forming substrate 15, the protective substrate 29, and the connecting plate 14 are fixed to the housing 13. Inside the housing 13, inlet liquid chambers 31, which communicate with the common liquid chamber 27 of the connecting plate 14, are formed on both sides where the pressure chamber forming substrate 15 is sandwiched. Furthermore, wiring insertion holes 33 for inserting flexible substrate 23 are provided on the protective substrate 29 and the housing 13. The flexible substrate 23, which is led out from the pressure chamber forming substrate 15 in the -Z direction, inserts through the wiring insertion holes 33 of the protective substrate 29 and the housing 13, and is led out to the -Z direction side of the housing 13.

[0050] An adhesive portion 40 is provided on the upper part of the head chip 10, that is, on a portion of the housing 13 in the -Z direction. The adhesive portion 40 has a shape that protrudes from the upper part of the housing 13 toward the -Z direction. Furthermore, the adhesive portion 40 is provided at both ends of the housing 13 in the ±X direction. In the adhesive portion 40 on the +X direction side, a first supply channel 101 communicating with the inlet liquid chamber 31 is formed. In the adhesive portion 40 on the -X direction side, a first discharge channel 111 communicating with the inlet liquid chamber 31 is formed. Furthermore, in this embodiment, two common liquid chambers 27 are formed in one head chip 10, and a first supply channel 101 and a first discharge channel 111 are provided in each common liquid chamber 27.

[0051] The adhesive surface 41 is the surface of the adhesive portion 40 in the -Z direction. A first supply channel 101 is formed on the adhesive surface 41 of the adhesive portion 40 in the +X direction, and an opening for a first discharge channel 111 is formed on the adhesive surface 41 of the adhesive portion 40 in the -X direction. Although details will be described later, a first adhesive 45 is applied to the adhesive surface 41 around the openings of the first supply channel 101 and the first discharge channel 111 (see reference). Figure 6 In addition, although the adhesive surface 41 is respectively provided on the head chips 10A-10D, the adhesive surface 41 of the first head chip 10A is an example of a "first adhesive surface", and the adhesive surface 41 of the second head chip 10B is an example of a "third adhesive surface".

[0052] like Figure 6As shown, a contact portion 51 and a contact portion 52 are provided on the upper part of the head chip 10. The contact portion 51 faces the contacted portion 71 of the holder 70 (described later), and the contact portion 52 faces the contacted portion 72 of the holder 70 (described later). Specifically, the contact portions 51 and 52 have a cylindrical shape protruding from the upper part of the housing 13 in the -Z direction. However, the shapes of the contact portions 51 and 52 are not limited to cylindrical. Furthermore, although the contact portions 51 are respectively provided on the head chips 10A-10D, the contact portion 51 provided on the first head chip 10A is an example of a "first contact portion," and the contact portion 51 provided on the second head chip 10B is an example of a "third contact portion." Additionally, the contact portion 52 provided on the first head chip 10A is an example of a "second contact portion."

[0053] Furthermore, relative to the long side direction of the head chip 10, and the center of the head chip 10 in the ±X direction in this embodiment, the contact portion 51 is disposed on the -X direction side, and the contact portion 52 is disposed on the +X direction side. This arrangement of contact portions 51 and 52 results in two sets of contact portions 51 and 52 being disposed in the ±Y direction, separated by the wiring through-hole 33.

[0054] The upper part of the head chip 10 has a non-contact portion 43 that does not contact the holder 70. In this embodiment, the non-contact portion 43 is the portion of the upper part of the head chip 10 that is not provided with the adhesive portion 40, the contact portion 51, and the contact portion 52. The non-contact portion 43 is a surface opposite to the holder 70 and is formed to be substantially flat.

[0055] The adhesive surface 41 and the contact portion 51 on the -X direction side are arranged such that the non-contact portion 43 is sandwiched when viewed in the +Z direction. Similarly, the adhesive surface 41 and the contact portion 52 on the +X direction side are arranged such that the non-contact portion 43 is sandwiched when viewed in the +Z direction.

[0056] Furthermore, when viewed in the +Z direction, the area of ​​the non-contact portion 43 is larger than the area of ​​the contact portion 51. Similarly, when viewed in the +Z direction, the area of ​​the non-contact portion 43 is larger than the area of ​​the contact portion 52. Moreover, in the long side direction (±X direction) and the short side direction (±Y direction) of the head chip 10, the non-contact portion 43 is larger than the contact portion 51 and larger than the contact portion 52.

[0057] Furthermore, the contact portion 51 is located in the -Z direction, which is opposite to the +Z direction, which is the ink ejection direction, compared to the adhesive surface 41. Similarly, the contact portion 52 is located in the -Z direction, which is opposite to the +Z direction, which is the ink ejection direction, compared to the adhesive surface 41.

[0058] use Figure 3 , Figure 6 , Figure 7 as well as Figure 8 This explains the structure of the holder 70, fixing plate 80, circuit board 95, and flow channel component 90 of the holding head chip 10. Figure 6 This is a cross-sectional view of the recording head 1, with the cross-section appropriately bent to include the adhesive surface 41, the inlet liquid chamber 31, the first supply channel 101, the contact portion 51, and the contact portion 52. Figure 7 This is a magnified cross-sectional view of the main part of the recording head 1, with the plane perpendicular to the ±X direction and passing through the center of the head chip 10 in the ±X direction as the cross-section. Figure 8 This is a top view of recording head 1 when observing in the -Z direction. Additionally, in Figure 8 In the diagram, the dashed lines represent the respective shapes of the head chips 10A-10D, the dotted lines represent the contact position 83 described later, and the cross-sectional area represents the fixed position 82 described later.

[0059] The retainer 70 is a component that holds the four head chips 10 and houses them between itself and the fixing plate 80. Specifically, the retainer 70 has a flat base portion 75 and an outer peripheral wall 76 protruding from the base portion 75 in the +Z direction. Multiple head chips 10 are housed in multiple receiving portions 77 formed by the +Z direction side surface of the base portion 75 and the inner surface of the outer peripheral wall 76. As per... Figures 6 to 8 As understood, when viewed in the -Z direction, the outer peripheral wall 76 is configured to include a frame-shaped outermost wall 76a and a plurality of partition portions 76b. Specifically, when viewed in the -Z direction, the outermost wall 76a is provided to surround the four head chips 10, and the plurality of partition portions 76b are divided into multiple storage portions 77 surrounded by the outermost wall 76a. That is, when viewed in the -Z direction, each head chip 10 is arranged one by one in the space, i.e., the storage portion 77, which is surrounded by a part of the outermost wall 76a and one or more partition portions 76b. In this embodiment, since three partition portions 76b are provided, four storage portions 77 are provided in such a way that they correspond to each of the four head chips. Alternatively, it can be configured such that the outer peripheral wall 76 is composed only of the outermost wall 76a without the partition portions 76b, thereby storing a plurality of head chips 10 in one storage portion 77. Furthermore, the number of partition sections 76b can be any number, including zero.

[0060] The retainer 70 includes, as an example, a second supply channel 102 and a second discharge channel 112 that extend through the base portion 75 in the ±Z direction, communicating with the head chip 10. In this embodiment, two second supply channels 102 are provided in a manner corresponding to the two first supply channels 101 provided in the head chip 10. Similarly, two second discharge channels 112 are provided in a manner corresponding to the two first discharge channels 111 provided in the head chip 10.

[0061] The adhesive surface 42 is the +Z direction side of the holder 70 and is the surface coated with the first adhesive 45, which will be described later. The openings of the second supply channel 102 and the second discharge channel 112, as described above, are formed on the adhesive surface 42. Furthermore, although the adhesive surface 42 is provided on the holder 70 in a manner corresponding to each of the head chips 10A-10D, the adhesive surface 42 provided on the holder 70 in a manner corresponding to the first head chip 10A is an example of a "second adhesive surface," and the adhesive surface 42 provided on the holder 70 in a manner corresponding to the second head chip 10B is an example of a "fourth adhesive surface."

[0062] Furthermore, the retainer 70 has a contacted portion 71 opposite to the contact portion 51 and a contacted portion 72 opposite to the contact portion 52. In this embodiment, the bottom surface 78 of the retainer 70 on the +Z direction side inside the outer peripheral wall 76 is formed flat, and the contacted portion 71 is the portion of the bottom surface 78 opposite to the contact portion 51. Similarly, the contacted portion 72 is the portion of the bottom surface 78 opposite to the contact portion 52. There are two contacted portions 71 corresponding to each of the two contact portions 51, and two contacted portions 72 corresponding to each of the two contact portions 52. Additionally, the contacted portions 71 are provided on the retainer 70 in a manner corresponding to each of the head chips 10A-10D. An example of a "first contacted portion" is a contacted portion 71 disposed on the holder 70 in a manner corresponding to the first head chip 10A, and an example of a "third contacted portion" is a contacted portion 71 disposed on the holder 70 in a manner corresponding to the second head chip 10B. Contacted portions 72 are disposed on the holder 70 in a manner corresponding to each of the head chips 10A-10D. An example of a "second contacted portion" is a contacted portion 72 disposed on the holder 70 in a manner corresponding to the first head chip 10A.

[0063] A flow channel component 90 is provided on the -Z direction side of the retainer 70. The flow channel component 90 has a flow channel, namely a third supply flow channel 103, on the surface of the -Z direction side for supplying ink from the liquid container 3. In addition, the flow channel component 90 has a flow channel, namely a third discharge flow channel 113, on the surface of the -Z direction side for discharging ink from the head chip 10.

[0064] Although not specifically illustrated, the third supply channel 103 branches into one opening connected to the liquid container 3 and two openings connected to the second supply channels 102 of the holder 70. As described above, two first supply channels 101 are provided in one head chip 10, and correspondingly, two second supply channels 102 are provided in the holder 70. The third supply channel 103 branches to supply ink from one liquid container 3 to the two second supply channels 102. Depending on the number of liquid containers 3, four such third supply channels 103 are provided in this embodiment.

[0065] Although not specifically illustrated, the third discharge channel 113 branches into one opening connected to the liquid container 3 and two openings connected to the second discharge channels 112 of the holder 70. As described above, two first discharge channels 111 are provided in one head chip 10, and correspondingly, two second discharge channels 112 are provided in the holder 70. The third discharge channel 113 is for discharging ink from the two second discharge channels 112 into one liquid container 3, thereby merging them. Depending on the number of liquid containers 3, there are four such third discharge channels 113 in this embodiment.

[0066] The retainer 70 holds the circuit board 95 between itself and the flow channel member 90. Specifically, a recess 91 is formed on the surface of the flow channel member 90 in the +Z direction. The +Z direction side of the flow channel member 90 and the -Z side of the retainer 70 are fixed, so that the circuit board 95 is housed in the space formed by the recess 91 and the retainer 70, that is, in a state of being stacked on the retainer 70, positioned above the retainer 70.

[0067] The circuit board 95 is a rigid substrate shared by the multiple flexible substrates 23 of each of the multiple head chips 10. A first substrate insertion hole 98, penetrating in the ±Z direction and through which the flexible substrate 23 can be inserted, is formed on the base portion 75 of the retainer 70. Furthermore, a second substrate insertion hole 97, also penetrating in the ±Z direction and through which the flexible substrate 23 can be inserted, is formed on the circuit board 95. The flexible substrate 23 of each head chip 10 is inserted through the first substrate insertion hole 98 and the second substrate insertion hole 97 and bent, and electrically connected to the -Z direction side of the circuit board 95. Additionally, a first insertion hole 96 is provided on the circuit board 95 through which a third supply channel 103 and a third discharge channel 113 are inserted. The third supply channel 103 is inserted into the first insertion hole 96 and connected to the second supply channel 102. The third discharge channel 113 is inserted into the first insertion hole 96 and connected to the second discharge channel 112.

[0068] Furthermore, a fixing plate 80 is fixed to each head chip 10. The fixing plate 80 is a plate-shaped component made of a metal material such as stainless steel, and has openings 81 for exposing a plurality of nozzles 11 of the head chip 10 to the outside. In this embodiment, the openings 81 are formed to expose the nozzle plate 12 of the head chip 10, and a plurality of openings are provided independently for each head chip 10. Here, the opening 81 exposing the plurality of nozzles 11 of the first head chip 10A to the outside is an example of a "first opening", and the opening 81 exposing the plurality of nozzles 11 of the second head chip 10B to the outside is an example of a "second opening".

[0069] The head chip 10 is fixed to the fixing plate 80. "The head chip 10 is fixed to the fixing plate 80" means that the fixing plate 80 is fixed to the +Z direction side of the head chip 10. The location where the fixing plate 80 is fixed to the head chip 10 is not limited; in this embodiment, the fixing plate 80 is fixed to the malleable substrate 17. Obviously, this structure is not limited; for example, the fixing plate 80 could also be fixed to the nozzle plate 12.

[0070] Furthermore, the retainer 70 is fixed to the fixing plate 80. In this embodiment, the fixing plate 80 is fixed to the outer peripheral wall 76 of the retainer 70. That is, the top end of the outer peripheral wall 76 in the +Z direction is fixed to the fixing plate 80. The portion of the fixing plate 80 that is fixed to the outer peripheral wall 76 is referred to as the fixing position 82. Furthermore, when viewed in the -Z direction, the outer peripheral wall 76, in other words the outermost wall 76a and the partition wall portion 76b surround the head chip 10 in a manner that creates a gap between them and the head chip 10.

[0071] In this manner, the head chip 10, which is fixed to the fixing plate 80 on the +Z direction side, is bonded to the retainer 70 on the -Z direction side by the first adhesive 45. Specifically, the adhesive surface 41 of the head chip 10 and the adhesive surface 42 of the retainer 70 are bonded together by the first adhesive 45.

[0072] The first adhesive 45 bonds the head chip 10 and the holder 70, and defines a connecting channel 44 between the first supply channel 101 and the second supply channel 102. Similarly, the first adhesive 45 defines a connecting channel 44 between the first discharge channel 111 and the second discharge channel 112. Furthermore, the first adhesive 45 does not need to be applied to the entire surface of the bonding surface 41 or the bonding surface 42; it only needs to be applied near the openings of the first supply channel 101, the second supply channel 102, the first discharge channel 111, and the second discharge channel 112. While silicone-based adhesives can be used as the first adhesive 45, it is not a limitation.

[0073] Furthermore, although the above description states that the retainer 70 houses the head chip 10 between itself and the fixing plate 80, this refers to the situation where the head chip 10 is positioned between the retainer 70 and the fixing plate 80 in the ±Z direction, with the +Z direction side of the head chip 10 fixed to the fixing plate 80 and the -Z direction side of the head chip 10 bonded to the retainer 70.

[0074] In the recording head 1 of the head chip 10 having the above-described structure, ink from the liquid container 3 is supplied to the first supply channel 101 of the head chip 10 via the third supply channel 103 and the second supply channel 102 provided in the flow channel component 90 and the holder 70, and the connecting channel 4 formed by the first adhesive 45. Then, when the flow channel from the first supply channel 101 to the nozzle 11 is filled with ink through the inlet liquid chamber 31, the common liquid chamber 27 and the pressure chamber 19, the piezoelectric actuator 18 is driven to generate a pressure change on the ink in the pressure chamber 19, and the ink is ejected from the designated nozzle 11 by the pressure change. Furthermore, in the recording head 1, ink that is not ejected from the nozzle 11 is discharged from the inlet liquid chamber 31 to the first discharge channel 111, the connecting channel 44, the second discharge channel 112 and the third discharge channel 113. The ink discharged from the third discharge channel 113 is then supplied to the head chip 10 again from the third supply channel 103 in a circulating recording head 1.

[0075] like Figure 1 as well as Figure 7 As shown, the recording device I is provided with a cover 9 corresponding to each head chip 10 which is housed between the holder 70 and the fixing plate 80 by the holder 70.

[0076] In other words, cover 9 is set up separately from head chips 10A-10D, and is also referred to as cover 9A, 9B, 9C, and 9D respectively (cover 9D is in...). Figure 7 (Not illustrated in the diagram). Hereinafter, the reference "cover 9A-9D" refers to cover 9A, cover 9B, cover 9C, and cover 9D. The common structure among covers 9A-9D will be referred to as cover 9 for explanation.

[0077] Covers 9A-9D each have a shape capable of blocking each of the openings 81 provided corresponding to each head chip 10A-10D. In addition, "first cover" refers to cover 9A provided for the first head chip 10A, and "second cover" refers to cover 9B provided for the second head chip 10B.

[0078] The cover 9 is provided on the main body 2 of the device as a structural element of the maintenance unit (not shown). The maintenance unit includes the cover 9, a cover moving mechanism (not shown) for moving the cover 9, and a suction pump (not shown).

[0079] The cover 9 has a flat bottom 901 opposite to the nozzle plate 12, and wall portions 902 extending from each side of the bottom 901 toward the -Z direction side, and is a bottomed box-shaped component that opens toward the -Z direction side. The opening shape of the cover 9 is at least larger than the opening 81 of the fixing plate 80.

[0080] The recording head 1 can move along the guide rail 8b in the -Y direction and stop at a predetermined position on the -Y direction side relative to the range where the medium S is transported. This predetermined position is called the cover position. When the recording head 1 stops at the cover position, the cover 9 is configured to face the nozzle plate 12 and cover the opening 81 when viewed in the +Z direction.

[0081] The cover moving mechanism of the maintenance unit moves the cover 9 in the ±Z direction. With the recording head 1 stopped in the cover position, the cover moving mechanism, via the control unit 5, moves the cover 9 towards the -Z direction. Through this operation of the cover moving mechanism, when observing in the +Z direction, the cover 9 moves from the +Z direction side to the -Z direction side at a position closer to the inside of the fixed position 82 and coinciding with the head chip 10, and contacts the fixed plate 80. Figure 7 as well as Figure 8 As shown, a portion of the fixing plate 80 that abuts against the -Z direction side of the wall portion 902 of the cover 9 is designated as an abutment position 83. The abutment position 83 is located on the outer side compared to the opening 81 of the fixing plate 80 and on the inner side compared to the fixing position 82.

[0082] The opening 81 is blocked by the contact between the wall 902 of the cover 9 and the abutment position 83 of the fixing plate 80. A closed space 9a is formed by the portion of the nozzle plate 12 in the recording head 1 exposed in the opening 81, the inner circumferential surface of the opening 81, and the cover 9. In other words, the cover 9 functions as a seal that cuts off the nozzle 11 from external gas. Therefore, by stopping the recording head 1 at the cover position and covering the nozzle plate 12 with the cover 9, the closed space 9a can be formed, thereby cutting off the nozzle 11 of the nozzle plate 12 from external gas. As a result, the nozzle 11 can be kept moist, thus suppressing, for example, ink thickening near the nozzle 11.

[0083] The suction pump of the maintenance unit creates a negative pressure in the enclosed space 9a formed by the cover 9. For example, a connecting channel (not shown) is provided in the cover 9 to connect the enclosed space 9a to the outside, so that the suction pump can create a negative pressure in the enclosed space 9a through the connecting channel.

[0084] By operating the suction pump while the closed space 9a is formed by the cover 9, creating a negative pressure in the closed space 9a, cleaning can be performed to force the ink thickened in the ink channel of the recording head 1 or air bubbles trapped in the channel out of the nozzle 11. Furthermore, the cover 9 can also be used to contain ink ejected from the nozzle 11 during rinsing without operating the suction pump.

[0085] Here, the dimension between the contact portion 51 and the contacted portion 71 is defined as the first dimension H1. The dimension between the adhesive surface 41 and the adhesive surface 42 is defined as the second dimension H2. The dimension between the contact portion 52 and the contacted portion 72 is defined as the third dimension H3. Furthermore, the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2. Regarding the size relationship between the first dimension H1 and the third dimension H3, one can be larger than the other, or the two can be equal. In addition, the contact portion 51 and the contacted portion 71 can also be in contact. That is, the first dimension H1 can also be zero. The contact portion 52 and the contacted portion 72 can also be in contact. That is, the third dimension H3 can also be zero. Furthermore, although for the second chip 10B, the aforementioned "fourth dimension" between the "third contact portion" and the "third contacted portion" is equivalent to the first dimension H1 mentioned in the first chip 10A, even for the "fourth dimension," it is smaller than the second dimension H2.

[0086] For example, the second dimension H2 is set to 0.14 ± 0.11 mm (manufacturing tolerance). That is, the second dimension H2 is set within the range of 0.03-0.25 mm. The first dimension H1 is preferably narrower than the minimum gap of the second dimension H2, which takes into account the tolerance, i.e., 0.03 mm. That is, the first dimension H1 is preferably set to 0.00 mm-0.029 mm. More specifically, the first dimension H1 is preferably set to 0.020 ± 0.009 mm, i.e., about 0.011 mm-0.029 mm. By setting the first dimension H1, the second dimension H2, and the third dimension H3 in this way, deformation of the fixing plate 80 can be suppressed as follows.

[0087] Furthermore, the dimension between the non-contact portion 43 and the portion of the holder 70 opposite to the non-contact portion 43 is defined as dimension H. Dimension H is greater than the second dimension H2. That is, the upper part of the head chip 10 has a structure in which the contact portion 51 and the contact portion 52 are in contact with the holder 70, and the other non-contact portions 43 are not in contact with the holder 70.

[0088] As described above, the fixing plate 80 is fixed to the top of the outer peripheral wall 76 of the retainer 70 and is fixed to the head chip 10, which is arranged with a gap between it and the outer peripheral wall 76. When viewed in the +Z direction, at the contact position 83, which is inside the fixing position 82 and coincides with the head chip 10, when the cover 9 contacts the fixing plate 80, an external force in the -Z direction acts near the head chip 10 of the fixing plate 80.

[0089] When the external force generated by the cover 9 acts on the fixing plate 80, the head chip 10 is pressed in the -Z direction, thereby crushing the first adhesive 45. However, since the first dimension H1 is smaller than the second dimension H2, the contact portion 51 and the contacted portion 71 come into contact. Through this contact, the movement of the head chip 10 in the -Z direction caused by the external force of the cover 9 is restricted. Furthermore, since the movement of the head chip 10 in the -Z direction is restricted, deformation of the fixing plate 80 in the -Z direction can be suppressed.

[0090] Furthermore, external forces generated by the medium S may act on the fixed plate 80. For example, when conveying a medium S with folds or wrinkles, or when folds or wrinkles are formed on the medium S during conveying, the folds or wrinkles may reach the recording head 1 and the imprint plate 400 (see reference 1). Figure 2Between the contact portion 51 and the contacted portion 71, an external force acts, pressing the fixing plate 80 towards the -Z direction. In particular, when the medium S is cloth, the thickness of the folded or wrinkled portion in the ±Z direction tends to increase, thus tending to result in a larger external force acting on the fixing plate 80. However, since the recording head 1 of this embodiment can limit the movement of the head chip 10 in the -Z direction due to the external force of the medium S through the contact of the contact portion 51 and the contacted portion 71 as described above, the deformation of the fixing plate 80 can be suppressed even for the external force generated by the medium S.

[0091] The Young's modulus of contact portions 51 and 52 is higher than that of the first adhesive 45. Specifically, contact portions 51 and 52 are rigid bodies that do not deform under external forces acting from the cover 9 or the medium S via the fixing plate 80. In this embodiment, contact portions 51 and 52 are formed as part of the housing 13. Examples of materials constituting such a housing 13 include resin, metal, and ceramic. Alternatively, contact portions 51 and 52 may be separate from the housing 13.

[0092] The Young's modulus of the contacted portions 71 and 72 is higher than that of the first adhesive 45. Specifically, the contacted portions 71 and 72 are rigid bodies that do not deform under external forces acting from the cover 9 or the medium S via the fixing plate 80. In this embodiment, the contacted portions 71 and 72 are part of the retainer 70. Examples of materials constituting such a retainer 70 include resin, metal, and ceramic. Alternatively, the contacted portions 71 and 72 may be separate from the retainer 70.

[0093] The resin constituting the housing 13 or the retainer 70 can be either a thermoplastic resin or a thermosetting resin. Examples of thermoplastic resins include polyphenylene ether resin (PPE), modified polyphenylene ether resin (m-PPE), polyethylene resin (PE), polystyrene resin (PS), polyamide resin (PA), PPS, PP, LCP, ABS resin, vinyl chloride-vinyl acetate copolymer resin, polyvinyl chloride resin, and other thermoplastic resins, or mixtures thereof. Examples of thermosetting resins include phenolic resins such as bakelite, epoxy resins such as epoxy resin glass, polyurethane resins, melamine resins, ester resins, etc. Furthermore, it is preferable that the housing 13 and the retainer 70 are formed using a thermosetting resin that exhibits excellent temperature stability, liquid resistance, and high rigidity.

[0094] As explained above, the recording head 1 according to this embodiment includes a head chip 10, a holder 70, and a fixing plate 80, and the head chip 10 is housed between the holder 70 and the fixing plate 80. The head chip 10 is provided with an adhesive surface 41, a contact portion 51, and a contact portion 52, and the holder 70 is provided with an adhesive surface 42, a contacted portion 71, and a contacted portion 72. The head chip 10 is bonded to the adhesive surface 42 on the adhesive surface 41 by a first adhesive 45 and is fixed by the fixing plate 80. Furthermore, the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2.

[0095] In this recording head 1, even if an external force in the -Z direction acts on the head chip 10 via the fixing plate 80, since the first dimension H1 is smaller than the second dimension H2, the contact portion 51 and the contacted portion 71 can still make contact, thereby limiting the movement of the head chip 10 in the -Z direction due to the external force of the cover 9. Furthermore, since the movement of the head chip 10 in the -Z direction is restricted, deformation of the fixing plate 80 can be suppressed.

[0096] Furthermore, the head chip 10 and the holder 70 are secured by the first adhesive 45. Therefore, the tilting of the nozzle surface caused by dimensional errors of the individual head chips 10 can be adjusted by varying the thickness of the first adhesive 45 in the ±Z direction when mounting the head chip 10 onto the holder 70. In particular, by using a silicone-based adhesive with a relatively low Young's modulus in the first adhesive 45, it is easier to vary the thickness of the first adhesive 45 in the ±Z direction.

[0097] Although the contact portion 51 and the contacted portion 71 illustrated in the above embodiment do not contact each other when no external force is applied to the fixing plate 80, the structure is not limited to this and they can also contact each other directly. In the recording head 1 where the contact portion 51 and the contacted portion 71 are in direct contact, the deformation of the fixing plate 80 can be suppressed more reliably compared to the case where the contact portion 51 and the contacted portion 71 are not in contact.

[0098] In addition to the contact portion 51 and the contacted portion 71, a contact portion 52 and a contacted portion 72 are also provided. That is, when multiple groups of contact portions and contacted portions are provided, the contact portions and contacted portions can be made to contact in all groups or only in any group.

[0099] Furthermore, when the recording head 1 of this embodiment is viewed in the +Z direction, which is the ink ejection direction, the area of ​​the non-contact portion 43 is larger than the area of ​​the contact portions 51 and 52. In other words, compared with the structure in which the contact portions 51 and 52 are provided on a portion of the upper part of the housing 13, the structure in which the contact portions are provided on the entire surface of the upper part of the housing 13 other than the adhesive surface 41 can improve the surface accuracy of the contact portions 51 and 52 and improve the accuracy of the first dimension H1.

[0100] Furthermore, the head chip 10 has a housing 13 with contact portions 51 and 52, and the contact portions 51 and 52 are formed as part of the upper part of the housing 13. Since the housing 13, as a rigid body, abuts against the retainer 70, deformation of the fixing plate 80 can be suppressed more reliably.

[0101] Furthermore, the head chip 10 includes a flexible substrate 23 connected to the circuit board 95 and erected along the ±Z direction, which is the ink spraying direction. Thus, the drive circuit 25 of the head chip 10 and the circuit board 95 held on the holder 70 can be connected via the flexible substrate 23, which can absorb tolerances in the ±Z direction, so that the tilt of the head chip 10 relative to the holder 70 in the ±Z direction can be adjusted. Additionally, the flexible substrate 23 can also be erected at an angle relative to the ±Z direction.

[0102] Furthermore, in this embodiment, the recording head 1 has a contact portion 52 and a contacted portion 72. When the third dimension H3 of the contact portion 52 and the contacted portion 72 is equal to the first dimension H1, the contact portion 51 and the contact portion 52 respectively come into contact with the contacted portion 71 and the contacted portion 72 respectively by the external force of the fixing plate 80. Since multiple contact portions come into contact with the contacted portions in this way, the external force acting from the fixing plate 80 is blocked, thus the deformation of the fixing plate 80 can be suppressed more reliably. In addition, when the third dimension H3 is not equal to the first dimension H1, either the contact portion 51 or the contact portion 52 comes into contact with the contacted portion 71 or the contacted portion 72. That is, since even if multiple groups of contact portions and contacted portions are provided, the dimensions in the ±Z directions of each group are different, thus any group may come into contact, and the deformation of the fixing plate 80 as described above can also be suppressed.

[0103] Furthermore, in this embodiment, relative to the center of the head chip 10 in the ±X direction (the direction along the long side of the head chip 10), the contact portion 51 is disposed on the -X direction side, and the contact portion 52 is disposed on the +X direction side. By distributing the contact portions 51 and 52 in this manner, the external force acting from the fixing plate 80 is dispersed in the +X and -X directions, thereby further suppressing deformation of the fixing plate 80.

[0104] Furthermore, in this embodiment, each of the plurality of covers 9 is individually provided relative to each of the respective head chips 10. Therefore, compared to a structure where one cover 9 is shared on multiple head chips 10, a larger load is easily applied to the head chip 10 via the fixing plate 80. However, even with individual covers 9 provided for each of the multiple head chips 10, the recording head 1 of this embodiment can withstand such a large load, thereby suppressing deformation of the fixing plate 80. In addition, by individually providing each of the plurality of covers 9 relative to each of the respective head chips 10, the moisture retention of the nozzle 11 can be improved, and clogging can be suppressed. Furthermore, the sealing performance of the enclosed space 9a can also be improved.

[0105] (Implementation Method 2)

[0106] Figure 9 This is a cross-sectional view of the recording head 1A according to Embodiment 2 of the present invention. More specifically, Figure 9 This is a cross-sectional view of the recording head 1, with the cross-section appropriately bent to include the adhesive surface 41, the inlet liquid chamber 31, the first supply channel 101, the contact portion 51A, and the contact portion 52A. Furthermore, components identical to those in Embodiment 1 described above will be labeled with the same symbols, and repeated descriptions will be omitted.

[0107] In the retainer 70A of this embodiment, the second supply channel 102 and the second discharge channel 112 described in Embodiment 1 are not provided. The retainer 70A is provided with a second insertion hole 79 that extends through in the ±Z direction.

[0108] A third supply channel 103, provided on the flow channel component 90A, extends in the +Z direction and is inserted into the second insertion hole 79. The +Z direction side of the third supply channel 103 is bonded with a first adhesive 45, thereby communicating the third supply channel 103 with the connecting channel 44 and the first supply channel 101. The opening edge of the third supply channel 103 in the +Z direction becomes the adhesive surface 42.

[0109] A third discharge channel 113, provided on the flow channel component 90A, extends in the +Z direction and is inserted into the second insertion hole 79. The +Z direction side of the third discharge channel 113 is bonded with a first adhesive 45, thereby communicating the third discharge channel 113 with the connecting channel 44 and the first discharge channel 111. The opening edge of the third discharge channel 113 in the +Z direction becomes the adhesive surface 42.

[0110] Contact portion 51A is located in the +Z direction relative to the adhesive surface 41 in the spraying direction. Similarly, contact portion 52A is located in the +Z direction relative to the adhesive surface 41 in the spraying direction. Furthermore, contact portion 71A protrudes from the surface of the holder 70 opposite to the head chip 10. Similarly, contact portion 72A protrudes from the surface of the holder 70 opposite to the head chip 10.

[0111] The first dimension H1 between the contact portion 51A and the contacted portion 71A is smaller than the second dimension H2. Furthermore, the third dimension H3 between the contact portion 52A and the contacted portion 72A is smaller than the second dimension H2.

[0112] Furthermore, the contact portion 51A and the contacted portion 71A are bonded together by a second adhesive 46, and the contact portion 52A and the contacted portion 72A are bonded together by a second adhesive 46. The second adhesive 46 may have the same composition as the first adhesive 45 or a different composition. When using a second adhesive 46 with a different composition than the first adhesive 45, it is preferable that the second adhesive 46 has a higher Young's modulus compared to the first adhesive 45. If a silicone-based adhesive is used as the first adhesive 45, an epoxy resin-based adhesive can be used as the second adhesive 46, which has a higher Young's modulus.

[0113] The Young's modulus of contact portions 51A and 52A is higher than that of the second adhesive 46. Furthermore, the Young's modulus of the contacted portions 71A and 72A is higher than that of the second adhesive 46.

[0114] The recording head 1A with this structure bonds the adhesive surfaces 41 and 42 together using the first adhesive 45, thus fixing the head chip 10 to the fixing plate 80. Furthermore, the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2. Therefore, the recording head 1A achieves the same functional effect as the recording head 1 of Embodiment 1.

[0115] Furthermore, the contact portion 51A and the contacted portion 71A are bonded together by a second adhesive 46. In such a recording head 1A, deformation of the fixing plate 80 can be suppressed more reliably compared to the case where the contact portion 51A and the contacted portion 71A are not in contact.

[0116] Furthermore, although the first adhesive 45 and the second adhesive 46 can be of the same type, it is preferable that the second adhesive 46 has a higher Young's modulus than the first adhesive 45. Compared to the case where the recording head 1A, bonded to the contact portion 51A and the contacted portion 71A via the second adhesive 46 with a Young's modulus higher than that of the first adhesive 45, does not contact the contact portion 51A and the contacted portion 71A, and further, compared to the case where adhesives with the same Young's modulus are used on both the first adhesive 45 and the second adhesive 46, deformation of the fixing plate 80 can be suppressed more reliably.

[0117] (Implementation Method 3)

[0118] Figure 10 This is a cross-sectional view of the recording head 1B according to Embodiment 3 of the present invention. More specifically, Figure 10 This is a cross-sectional view of the recording head 1, with the cross-section appropriately bent to include the adhesive surface 41, the inlet liquid chamber 31, the first supply channel 101, the contact portion 51, and the contact portion 52. Furthermore, components identical to those in Embodiments 1 and 2 described above will be labeled with the same symbols, and repeated descriptions will be omitted.

[0119] In this embodiment, the recording head 1B has a circuit board 95 disposed above the holder 70B, that is, on the -Z direction side of the holder 70B.

[0120] The second supply channel 102, which is disposed in the retainer 70B, protrudes in the +Z direction from the bottom surface 78. The +Z side of the second supply channel 102 is bonded with the first adhesive 45, thereby communicating the second supply channel 102 with the connecting channel 44 and the first supply channel 101. The opening edge of the second supply channel 102 in the +Z direction becomes the adhesive surface 42.

[0121] A second discharge channel 112, disposed in the retainer 70B, protrudes from the bottom surface 78 in the +Z direction. The +Z side of the second discharge channel 112 is bonded with a first adhesive 45, thereby communicating the second discharge channel 112 with the connecting channel 44 and the first discharge channel 111. The opening edge of the second discharge channel 112 in the +Z direction becomes the adhesive surface 42.

[0122] The recording head 1B with this structure bonds the adhesive surfaces 41 and 42 together using the first adhesive 45, and the head chip 10 is fixed to the fixing plate 80. Furthermore, the first dimension H1 is smaller than the second dimension H2, and the third dimension H3 is smaller than the second dimension H2. Therefore, the recording head 1B achieves the same functional effect as the recording head 1 in Embodiment 1.

[0123] (Implementation Method 4)

[0124] Figure 11This is a top view of the head chip 10 as seen in the +Z direction. Furthermore, components identical to those in Embodiments 1-3 described above will be labeled with the same symbols and repeated descriptions will be omitted.

[0125] The head chip 10 according to embodiments 1-3 has a structure in which connecting channels 44, defined by a first adhesive 45, are arranged on the +X direction side and the -X direction side, respectively. That is, it has a structure in which the connecting channels 44 are on the outer side in the ±X direction, and contact portions 51 and 52 are arranged on their inner sides. This structure is suitable for situations where ink circulates within the head chip 10.

[0126] On the other hand, such as Figure 11 As shown, the head chip 10 in this embodiment has the following structure: it does not have a first discharge channel 111, and it has two common liquid chambers 27 (see reference). Figure 5 Each is connected to the first supply channel 101, and a connecting channel 44 is connected to the first supply channel 101 (see reference). Figure 6 The structure is not an ink recycling structure.

[0127] The head chip 10 according to this embodiment has a structure in which contact portions 51 and 52 are disposed on the outer side in the ±X direction, and a first supply channel 101 is disposed on their inner side. In the case where the ink does not circulate within the head chip 10, it is preferable to place the contact portions 51 and 52 on the outer side in the ±X direction in terms of the strength of the head chip 10.

[0128] (Other implementation methods)

[0129] Although various embodiments of the present invention have been described above, the basic structure of the present invention is not limited to the above description.

[0130] Although contact portions 51 and 52 are provided on the head chip 10 in the above embodiment, the structure is not limited to providing multiple contact portions in this manner. The number of contact portions may also be one.

[0131] When there is one contact portion, it is preferably located at the center in the ±X direction, which is the long side direction of the head chip 10. When there are two contact portions, as illustrated in Embodiment 4, it is desirable to provide contact portions at both ends in the ±X direction of the head chip 10. When there are four contact portions, as illustrated in Embodiment 1, it is preferable to provide them at the four corners of the center in the ±X direction of the head chip 10. Furthermore, the term "both ends in the ±X direction, which is the long side direction of the head chip" refers to the regions located at the outermost ends of the head chip 10, which are imaginarily divided into three to five parts in the ±X direction. The term "center in the ±X direction, which is the long side direction of the head chip" refers to the region located inwards compared to the aforementioned regions located at the outermost ends.

[0132] In the above embodiment, only the portion of the head chip 10 forming the connecting channel 44 is bonded to the holder 70 using the first adhesive 45. By using the first adhesive 45 for bonding in this manner, it is easy to adjust the tilt of the head chip 10 relative to the ±Z direction, and the amount of adhesive used can be reduced. In addition, the first adhesive 45 is applied not only to the portion of the head chip 10 forming the connecting channel 44, but also to other areas. That is, the first adhesive 45 can also be provided between the non-contact portion 43 and the holder 70. As a result, the head chip 10 can be more firmly fixed to the holder 70.

[0133] In embodiments 2 and 3, the contacted portions 71A, 71B, 72A, and 72B are configured to protrude from the bottom surface 78 of the retainer 70 toward the +Z direction, but are not limited to this structure. For example, the contacted portions may also be configured to protrude from the outer peripheral wall 76 of the retainer 70 toward the ±X or ±Y direction.

[0134] Although in the above embodiment, the fixing plate 80 is directly fixed to the head chip 10, it is not limited to such a structure. For example, it may also be a structure in which a reinforcing plate is provided between the fixing plate 80 and the head chip 10, so that the fixing plate 80 is indirectly fixed to the head chip 10 via the reinforcing plate.

[0135] If the first dimension H1, the second dimension H2, and the third dimension H3 satisfy the above relationship, then the adhesive surface 41, the contact portion 51, the contact portion 51A, the contact portion 52, and the contact portion 52A can either protrude towards the -Z direction side compared to the non-contact portion 43, or be on the same surface as the non-contact portion 43, or be recessed towards the +Z direction side compared to the non-contact portion 43.

[0136] If the first dimension H1, the second dimension H2, and the third dimension H3 satisfy the above relationship, then the adhesive surface 42, the contacted portion 71, the contacted portion 71A, the contacted portion 72, and the contacted portion 72A can either protrude from the bottom surface 78 of the holder 70 opposite to the head chip 10 in the +Z direction, or be on the same surface as the bottom surface 78, or be recessed in the -Z direction compared to the bottom surface 78.

[0137] Furthermore, this invention is broadly applicable to all liquid ejection heads. For example, it can also be applied to various inkjet printing heads used in image recording devices such as printers, color material ejection heads used in the manufacture of color filters for liquid crystal displays, electrode material ejection heads used in the electrode formation of organic EL displays, FEDs (field emission displays), and biological organic matter ejection heads used in the manufacture of biochips. Moreover, although an inkjet printing device has been described as an example of a liquid ejection device, it can also be used in liquid ejection devices that utilize other liquid ejection heads described above.

[0138] Symbol Explanation

[0139] H1…First dimension; H2…Second dimension; H3…Third dimension; I…Inkjet recording device (recording device); 1, 1A, 1B…Inkjet recording head (recording head); 4…Transport mechanism (transport section); 9, 9A, 9B, 9C, 9D…Cover; 10…Head chip; 10A…First head chip; 10B…Second head chip; 10C…Third head chip; 10D…Fourth head chip; 11…Nozzle; 12…Nozzle plate; 13… 23… Casing; 41, 42… Adhesive surface; 43… Non-contact part; 44… Connecting channel; 45… First adhesive; 46… Second adhesive; 51, 51A, 52, 52A… Contact part; 70, 70A, 70B… Holder; 71, 71A, 71B, 72, 72A, 72B… Contacted part; 76… Outer peripheral wall; 80… Fixing plate; 81… Opening; 82… Fixing position; 95… Circuit board.

Claims

1. A liquid injection head, characterized in that, have: The first chip has multiple first nozzles that spray liquid in the jetting direction; A cage that holds the first chip head; A fixing plate having a first opening for exposing the plurality of first nozzles to the outside, and the retainer and the first head chip being fixed on the fixing plate. On the upper part of the first chip, there is a first adhesive surface with an opening formed with a flow channel. The retainer houses the first head chip between itself and the fixing plate, and has a second adhesive surface with an opening formed with a flow channel communicating with the first head chip. The first adhesive surface and the second adhesive surface are bonded together by a first adhesive in a manner that defines a connecting channel between the flow channel of the holder communicating with the first head chip and the flow channel of the first head chip. The upper part of the first head chip has a first contact portion. The retainer has a first contacted portion opposite to the first contact portion. The first dimension between the first contact portion and the first contacted portion is smaller than the second dimension between the first adhesive surface and the second adhesive surface.

2. The liquid injection head as described in claim 1, characterized in that, The first contact portion and the first contacted portion are in direct contact.

3. The liquid injection head as described in claim 1, characterized in that, The first contact portion and the first contacted portion are bonded to each other via a second adhesive.

4. The liquid injection head as described in claim 3, characterized in that, The second adhesive has a higher Young's modulus compared to the first adhesive.

5. The liquid injection head according to any one of claims 1 to 4, characterized in that, The first contact portion and the first contacted portion have higher Young's modulus compared to the first adhesive.

6. A liquid injection head, characterized in that, have: The first chip has multiple first nozzles that spray liquid in the jetting direction; A cage that holds the first chip head; A fixing plate having a first opening for exposing the plurality of first nozzles to the outside, and the retainer and the first head chip being fixed on the fixing plate. On the upper part of the first chip, there is a first adhesive surface with an opening formed with a flow channel. The retainer houses the first head chip between itself and the fixing plate, and has a second adhesive surface with an opening formed with a flow channel communicating with the first head chip. The first adhesive surface and the second adhesive surface are bonded together by a first adhesive in a manner that defines a connecting channel between the flow channel of the holder communicating with the first head chip and the flow channel of the first head chip. The upper part of the first chip has a first contact portion and a non-contact portion that does not contact the holder. The retainer has a first contacted portion opposite to the first contact portion. The first dimension between the first contact portion and the first contacted portion is smaller than the second dimension between the first adhesive surface and the second adhesive surface. The dimension between the non-contact portion and the portion of the retainer opposite to the non-contact portion is greater than the second dimension.

7. The liquid injection head as described in claim 6, characterized in that, The first adhesive surface and the first contact portion are configured to sandwich the non-contact portion when viewed in the spraying direction.

8. The liquid injection head as described in claim 6 or 7, characterized in that, When observed in the direction of the spray, the area of ​​the non-contact portion is larger than the area of ​​the first contact portion.

9. The liquid injection head as described in claim 1 or 6, characterized in that, The first chip has a housing, and the housing has the first contact portion. The first contact portion is a part of the upper part of the housing.

10. The liquid injection head as described in claim 1 or 6, characterized in that, It includes a circuit board, which is positioned above the holder and electrically connected to the first head chip.

11. The liquid injection head as claimed in claim 10, characterized in that, The first chip head includes a flexible substrate, which is connected to the circuit board and stands upright along the jetting direction.

12. The liquid injection head as described in claim 1 or 6, characterized in that, The first contact portion is located in the opposite direction to the spraying direction compared to the first adhesive surface.

13. The liquid injection head as described in claim 1 or 6, characterized in that, The first contact portion is located in the spraying direction relative to the first adhesive surface. The first contacted portion protrudes from the surface of the holder opposite to the first head chip.

14. The liquid injection head as described in claim 1 or 6, characterized in that, The upper part of the first chip has a second contact portion. The retainer has a second contacted portion opposite to the second contact portion. The third dimension between the second contact portion and the second contacted portion is smaller than the second dimension.

15. The liquid injection head as claimed in claim 14, characterized in that, The first contact portion is positioned on one side relative to the center of the first head chip along its long side. The second contact portion is positioned on the opposite side relative to the center of the first head chip in the long side direction.

16. The liquid injection head as claimed in claim 1 or 6, characterized in that, It is equipped with a second head chip, which has multiple second nozzles for spraying liquid. The fixing plate has a second opening for exposing the plurality of second nozzles to the outside, and the second head chip is fixed on the fixing plate. The second head chip is housed between the retainer and the fixing plate in a manner that separates it from the first head chip. On the upper part of the second chip, a third adhesive surface with an opening formed with a flow channel is provided. The retainer has a fourth adhesive surface with an opening formed into a flow channel communicating with the second head chip. The third and fourth adhesive surfaces are bonded together by the first adhesive in a manner that defines a connecting channel between the flow channel of the retainer and the flow channel of the second head chip. The upper part of the second chip has a third contact portion. The retainer has a third contacted portion opposite to the third contact portion. The fourth dimension between the third contact portion and the third contacted portion is smaller than the second dimension.

17. The liquid injection head as claimed in claim 1 or 6, characterized in that, The retainer has an outer peripheral wall that surrounds the first head chip in a manner that is spaced apart from the first head chip. The top end of the outer peripheral wall in the spray direction is fixed at the fixed position of the fixed plate.

18. A liquid injection device, characterized in that, have: The liquid injection head according to any one of claims 1 to 17; The conveying unit is responsible for transporting the medium.

19. The liquid injection device as claimed in claim 18, characterized in that, The device includes a cover that moves relative to the fixed plate in a direction opposite to the spray direction, thereby contacting the fixed plate. The cover forms a closed space with the plurality of first nozzles by contacting the fixing plate on the inner side compared to the fixed position. The retainer has an outer peripheral wall that surrounds the first head chip in a manner that is spaced apart from the first head chip. The top end of the outer peripheral wall in the spray direction is fixed at the fixed position of the fixed plate.

20. A liquid injection device, characterized in that, have: The liquid injection head according to claim 16; The first and second covers come into contact with the fixed plate by moving relative to it in a direction opposite to the spray direction. The first cover contacts the fixing plate at a position that is more inward than the fixed position and overlaps with the first head chip when viewed in the spray direction, thereby forming a closed space with the plurality of first nozzles opening. The second cover contacts the fixing plate at a position that is more inward than the fixed position and overlaps with the second head chip when viewed in the spray direction, thereby forming a closed space with openings for the plurality of second nozzles. The retainer has an outer peripheral wall that surrounds the first head chip in a manner that is spaced apart from the first head chip. The top end of the outer peripheral wall in the spray direction is fixed at the fixed position of the fixed plate.

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