Optical path control member and display device comprising the same

Abstract

An optical path control member includes: a first substrate on which a first direction and a second direction are defined; a first electrode provided on the first substrate; a second substrate provided on the first substrate, defining the first direction and the second direction; a second electrode provided below the second substrate; a light conversion portion provided between the first electrode and the second electrode; an adhesive layer provided between the first electrode and the light conversion portion; and a cutting region formed by removing the second substrate, the second electrode, and the light conversion portion, wherein the cutting region includes a first cutting region and a second cutting region, the first cutting region and the second cutting region extend in a length direction of the first direction and are disposed to face each other in the second direction, the first cutting region and the second cutting region include a first region and a second region, the adhesive layer is formed on the first region, the second region is formed by partially or entirely removing the adhesive layer, and a first sealing portion is provided in the cutting region.

Description

[0001] Cross-references in related fields

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0149836, filed on November 3, 2021, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The embodiments relate to an optical path control component and a display device including the optical path control component. Background Technology

[0004] The light-shielding film blocks the transmission of light from the light source and is attached to the front of the display panel. When the display outputs an image, the light-shielding film adjusts the angle of light according to the incident angle of the light to present a clear image quality at the user's desired viewing angle. The display panel is a display device used in mobile phones, laptops, tablets, car navigation devices, vehicle touch screens, etc.

[0005] In addition, shading film can be used on windows of vehicles or buildings to partially block external light to prevent glare or prevent the interior from being seen from the outside.

[0006] That is, the light-shielding film can be a light path control component, which controls the movement path of light to block light in a specific direction and transmit light in a specific direction. Therefore, by using the light-shielding film to control the light transmission angle, the user's viewing angle can be controlled.

[0007] On the other hand, such sunshades can be divided into sunshades that can always control the viewing angle regardless of the surrounding environment or the user's environment, and switchable sunshades that allow users to turn the viewing angle control on / off according to the surrounding environment or the user's environment.

[0008] This switchable light-blocking film can be achieved by filling the interior of the patterned portion with particles that can move when a voltage is applied and a dispersion liquid for dispersing the particles, and by switching the patterned portion into a light-transmitting portion and a light-blocking portion through dispersion and aggregation of the particles.

[0009] In this case, in order to apply voltage to the light-shielding film, the electrodes of the switchable light-shielding film should be connected to an external power source. Such a connection is an electrode connection, which is not an area for controlling the viewing angle and can be defined as a bezel region in the display device.

[0010] Meanwhile, the light-shielding film may have an adhesive layer with a layered structure disposed in certain areas to bond the light-shielding film. However, since the adhesive layer has very low water permeability, water may penetrate into the light-shielding film through the adhesive layer, thereby degrading the reliability of the light-shielding film. For example, when water penetrates into the light-shielding film, appearance defects may occur, and the dielectric constant of the water-permeable and water-impermeable areas in the areas where the light conversion material is disposed changes, so the driving speed of each area may differ.

[0011] Therefore, a new optical path control component with a novel structure is needed to solve the above problems. Summary of the Invention

[0012] Technical issues

[0013] The embodiments relate to an optical path control component that has improved reliability and drive characteristics by effectively blocking moisture that may be introduced therein via the adhesive layer.

[0014] Technical solution

[0015] The optical path control component according to an embodiment includes: a first substrate defining a first direction and a second direction on the first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate and defining the first direction and the second direction; a second electrode disposed below the second substrate; a light conversion portion disposed between the first electrode and the second electrode; an adhesive layer disposed between the first electrode and the light conversion portion; and a cutting region formed by removing the second substrate, the second electrode, and the light conversion portion, wherein the cutting region includes a first cutting region and a second cutting region, the first cutting region and the second cutting region extend in the length direction of the first direction and are configured to face each other in the second direction, the first cutting region and the second cutting region include a first region and a second region, the adhesive layer is formed on the first region, the second region is formed by partially or entirely removing the adhesive layer, and a first sealing portion is provided in the cutting region.

[0016] Beneficial effects

[0017] According to the embodiment, the optical path control component can be formed into two regions depending on the degree of cutting of the cutting region where the sealing part is provided.

[0018] In detail, the cutting area may form a first region with an exposed adhesive layer and a second region including a stepped portion having a step difference from the first region.

[0019] The second region can be defined as the area where the adhesive layer has been partially or entirely removed.

[0020] Correspondingly, when the sealing part is placed in the cutting area, the sealing part can also be placed in the area where the adhesive layer is removed.

[0021] Therefore, by reinforcing the water-resistant adhesive layer with a sealing element, moisture can be prevented from penetrating into the optical path control component from the outside through the adhesive layer.

[0022] Therefore, appearance defects of the optical path control component can be prevented, and the degradation of driving characteristics due to moisture penetration can be prevented. Thus, the optical path control component according to the embodiment can have improved reliability and driving characteristics. Attached Figure Description

[0023] Figure 1 This is a perspective view of the optical path control component according to an embodiment;

[0024] Figure 2 and Figure 3 It is along Figure 1 A sectional view taken by line A-A';

[0025] Figure 4 It is along Figure 1 Another sectional view taken by line A-A';

[0026] Figure 5 This is a top view of the first substrate of the optical path control component according to an embodiment;

[0027] Figure 6 This is a top view of the second substrate of the optical path control component according to an embodiment;

[0028] Figure 7 This is a top view of the first and second substrates of the optical path control component according to the embodiment being stacked.

[0029] Figure 8 yes Figure 1 A top view of region A, used to describe the first cut region of the optical path control component according to the embodiment;

[0030] Figure 9 It is along Figure 1 and Figure 8 A sectional view taken by line B-B';

[0031] Figure 10 It is along Figure 1 and Figure 8 A sectional view taken by line C-C';

[0032] Figure 11 and Figure 12 It is along Figure 8A sectional view taken by line D-D';

[0033] Figure 13 yes Figure 1 Another top view of region A is used to describe the first cut region of the optical path control component according to the embodiment;

[0034] Figure 14 It is along Figure 1 and Figure 13 A sectional view taken by line B-B';

[0035] Figure 15 yes Figure 1 Another top view of region A, used to describe the first cut region of the optical path control component according to the embodiment;

[0036] Figure 16 It is along Figure 1 and 15 A sectional view taken by line B-B';

[0037] Figure 17 It is along Figure 15 A sectional view taken by line E-E';

[0038] Figure 18 yes Figure 1 A top view of region G, used to describe the second cutting region, the fifth cutting region and the sixth cutting region of the optical path control component according to the embodiment;

[0039] Figure 19 It is along Figure 1 and Figure 18 A sectional view taken by line F-F';

[0040] Figure 20 It is along Figure 1 and 18 A cross-sectional view taken by line G-G';

[0041] Figure 21 It is along Figure 18 A cross-sectional view taken by line H-H';

[0042] Figures 22 to 23 It is along Figure 18 A sectional view taken by line I-I';

[0043] Figure 24 yes Figure 1 Another top view of region G is used to describe the second cutting region, the fifth cutting region, and the sixth cutting region of the optical path control component according to the embodiment;

[0044] Figure 25 It is along Figure 1 and Figure 24 A sectional view taken by line F-F';

[0045] Figure 26 yes Figure 1 Another top view of region G, used to describe the second cutting region, the fifth cutting region and the sixth cutting region of the optical path control component according to the embodiment;

[0046] Figure 27 It is along Figure 1 and 26 A sectional view taken by line F-F';

[0047] Figure 28 This is a top view used to describe the third and fourth cutting regions of the optical path control component according to the embodiment;

[0048] Figure 29 It is along Figure 28 A sectional view taken by line J-J';

[0049] Figure 30 It is a view used to describe various shapes of the cutting area of ​​the optical path control component according to the embodiment;

[0050] Figure 31 It is a view used to describe various pattern shapes of the cutting area of ​​the optical path control component according to the embodiment;

[0051] Figures 32 to 38 This is a view used to describe a method of manufacturing an optical path control component according to an embodiment;

[0052] Figure 39 and 40 This is a cross-sectional view of a display device that applies the optical path control component according to an embodiment;

[0053] Figures 41 to 43 This is a view of one embodiment of a display device that uses an optical path control component according to an embodiment. Detailed Implementation

[0054] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. However, the concept and scope of the invention are not limited to the described embodiments, but can be implemented in different forms, and one or more components in the embodiments can be selectively combined and substituted within the concept and scope of the invention.

[0055] Furthermore, unless otherwise explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries may be interpreted as having the same meaning as their meaning in the context of the relevant art.

[0056] Furthermore, the terminology used in the embodiments of this invention is for describing the embodiments and is not intended to limit the invention. In this specification, unless specifically stated in the wording, the singular form may also include the plural form, and when described as "at least one (or more) of A (and), B and C", it may include at least one of all combinations that can be combined among A, B, and C.

[0057] Furthermore, when describing the elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and they do not limit the nature, order, or sequence of the elements.

[0058] In addition, when an element is described as being “connected” or “linked” to another element, it can include not only cases where the element is directly “connected” or “linked” to other elements, but also cases where the element is “connected” or “linked” to another element through which the element connects or links to other elements.

[0059] Furthermore, when described as being formed or set “above” or “below” each element, “above” or “below” can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or set between two elements.

[0060] Furthermore, when expressed as "up" or "down", it can include not only the upward direction based on a single element, but also the downward direction based on a single element.

[0061] In the following description, an optical path control component according to an embodiment will be described with reference to the accompanying drawings. The optical path control component described below may be a switchable light-shielding film driven in open mode and privacy mode according to the application of voltage.

[0062] For ease of description, the following figures show the inner surface of the cutting area perpendicular to the bottom surface, but this embodiment is not limited to this. That is, the inner surface of the cutting area can be formed to be inclined at an acute or obtuse angle relative to the bottom surface.

[0063] refer to Figures 1 to 7 According to the embodiment, the optical path control component may include a first substrate 110, a second substrate 120, a first electrode 210, a second electrode 220, and a light conversion unit 300.

[0064] The first substrate 110 and the second substrate 120 can be rigid or flexible.

[0065] Furthermore, the first substrate 110 and the second substrate 120 may be transparent. For example, the first substrate 110 and the second substrate 120 may include transparent substrates capable of transmitting light.

[0066] The first substrate 110 and the second substrate 120 may comprise glass, plastic, or a flexible polymer film. For example, the flexible polymer film may be made of any of the following: polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS). This is merely an example, and the embodiments are not limited thereto.

[0067] In addition, the first substrate 110 and the second substrate 120 can be flexible substrates with flexible properties.

[0068] Furthermore, the first substrate 110 and the second substrate 120 can be curved or bent substrates. That is, the optical path control member including the first substrate 110 and the second substrate 120 can also be formed to have flexible, curved, or bent characteristics. Therefore, the optical path control member according to the embodiment can be modified into various designs.

[0069] The first electrode 210 may be disposed on one surface of the first substrate 110. In addition, the second electrode 220 may be disposed on one surface of the second substrate 120.

[0070] The first electrode 210 and the second electrode 220 may comprise a transparent conductive material. For example, the first electrode 210 and the second electrode 220 may comprise a conductive material having a transmittance of about 80% or higher. As an example, the first electrode 210 and the second electrode 220 may comprise metal oxides such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, etc.

[0071] The first electrode 210 and the second electrode 220 may have a thickness of about 10 nm to about 300 nm.

[0072] Alternatively, the first electrode 210 and the second electrode 220 may comprise various metals to achieve low resistance. For example, the first electrode 210 and the second electrode 220 may comprise at least one metal selected from chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof.

[0073] The first electrode 210 and the second electrode 220 may be disposed on the entire surface of one surface of the first substrate 110 and the second substrate 120, respectively. Specifically, the first electrode 210 may be disposed as a surface electrode on one surface of the first substrate 110, and the second electrode 220 may be disposed as a surface electrode on one surface of the second substrate 120. However, the embodiments are not limited thereto, and at least one of the first electrode 210 and the second electrode 220 may be formed from a plurality of patterned electrodes having a uniform pattern, such as a mesh or stripe pattern.

[0074] For example, at least one of the first electrode 210 and the second electrode 220 may include multiple conductive patterns. Specifically, at least one of the first electrode 210 and the second electrode 220 may include multiple intersecting grid lines and multiple grid openings formed by the grid lines.

[0075] Therefore, even if the first electrode 210 and the second electrode 220 are made of metal, they will not be visually identifiable from the outside, thereby improving visibility. Furthermore, the increased light transmittance through the openings enhances the brightness of the light path control component according to the embodiment.

[0076] The light conversion unit 300 may be disposed between the first substrate 110 and the second substrate 120. More specifically, the light conversion unit 300 may be disposed between the first electrode 210 and the second electrode 220.

[0077] An adhesive layer 410 can be provided between the light conversion unit 300 and the first electrode 210. The light conversion unit and the first electrode 210 can be bonded together by the adhesive layer 410.

[0078] A buffer layer 420 can be disposed between the light conversion unit 300 and the second electrode 220. The buffer layer 420 can improve the adhesion between the second electrode 220, which is a heterogeneous material, and the light conversion unit 300. In other words, the buffer layer 420 can be a primer layer disposed between the light conversion unit 300 and the second electrode 220.

[0079] The adhesive layer 410 and the buffer layer 420 may comprise transparent materials capable of transmitting light. As an example, the adhesive layer 420 may comprise an optically clear adhesive (OCA), and the buffer layer 410 may comprise a transparent resin.

[0080] The optical path control component can extend in a first direction 1D, a second direction 2D, and a third direction 3D. That is, the substrate, electrode, and light conversion part constituting the optical path control component can extend in the first direction 1D, the second direction 2D, and the third direction 3D, respectively.

[0081] In detail, the optical path control component may include: a first direction 1D corresponding to the length or width direction of the optical path control component; a second direction 2D extending in a direction different from the first direction 1D and corresponding to the length or width direction of the optical path control component; and a third direction 3D extending in a direction different from the first direction 1D and the second direction 2D and corresponding to the thickness direction of the optical path control component.

[0082] For example, the first direction 1D can be defined as the length direction of the optical path control component, the second direction 2D can be defined as the width direction perpendicular to the first direction 1D, and the third direction 3D can be defined as the thickness direction of the optical path control component. Alternatively, the first direction 1D can be defined as the width direction of the optical path control component, the second direction 2D can be defined as the length direction of the optical path control component perpendicular to the first direction 1D, and the third direction 3D can be defined as the thickness direction of the optical path control component.

[0083] For ease of description, the first direction 1D will be described as the length direction of the optical path control component, the second direction 2D will be described as the width direction of the optical path control component, and the third direction 3D will be described as the thickness direction of the optical path control component.

[0084] Figure 2 and Figure 3 It is along Figure 1 The view intercepted by line A-A'.

[0085] refer to Figure 2 and Figure 3 The light conversion unit 300 may include a plurality of partition wall portions 310, a plurality of housing portions 320 and a base portion 350.

[0086] The light conversion unit 300 may include a plurality of partition walls 310 and receiving portions 320, and the partition walls 310 and receiving portions 320 may be arranged alternately. That is, a receiving portion 320 may be arranged between two adjacent partition walls 310, and a partition wall 310 may be arranged between two adjacent receiving portions 320.

[0087] The receiving section 320 can be configured to extend in one direction. For example, the receiving section 320 can be configured to tilt relative to a second direction at an angle within a set range. That is, the receiving section 320 can be configured to extend in a direction between the first direction 1D and the second direction 2D.

[0088] The base portion 350 can be disposed above the receiving portion 320. More specifically, the base portion 350 can be disposed between the receiving portion 320 and the buffer layer 420. More specifically, the base portion 350 can be disposed between the upper surface of the receiving portion 320 and the lower surface of the buffer layer 420. Accordingly, the light conversion unit 300 can be attached to the second electrode 220 via the base portion 350 and the buffer layer 420.

[0089] Furthermore, the adhesive layer 410 can be disposed between the partition wall portion 310 and the first electrode 210, and the light conversion portion 300 and the first electrode 210 can be bonded together by the adhesive layer 410.

[0090] The base portion 350 is a region formed simultaneously with the release of the resin material constituting the partition wall portion 310 and the receiving portion 320 from the mold member to form the partition wall portion 310 and the receiving portion 320, and the base portion 350 may include the same material as the partition wall portion 310. That is, the base portion 350 and the partition wall portion 310 may be formed integrally.

[0091] The partition wall 310 can transmit light. Furthermore, the light transmittance of the housing 320 can be changed according to the applied voltage.

[0092] In detail, the light conversion material 330 can be disposed in the housing portion 320. The housing portion 320 can have variable light transmittance through the light conversion material 330. The light conversion material 330 can include light conversion particles 330b that move according to the application of voltage and a dispersion liquid 330a that disperses the light conversion particles 330b. In addition, the light conversion material 300 can further include a dispersant for preventing the light conversion particles 330b from agglomerating.

[0093] The light-converting particles 330b within the dispersion 330a can move according to the applied voltage. For example, refer to... Figure 2 The surface of the light-converting particles 330b in the dispersion 330a is negatively charged. When a positive voltage is applied through at least one of the first electrode 210 and the second electrode 220, the light-converting particles 330b move toward the first electrode 210 or the second electrode 220, so that the housing portion 320 can be used as a light-transmitting portion.

[0094] For example, when the first electrode 210 is under a positive voltage or ground voltage, and the second electrode 220 has a positive voltage or a positive voltage greater than that of the first electrode 210, the light conversion particles 330b can be attracted and move toward the second electrode 220 to aggregate.

[0095] Accordingly, the optical path control components can be driven in an open mode.

[0096] In addition, refer to Figure 3When a negative voltage is applied through at least one of the first electrode 210 and the second electrode 220, the light conversion particles 330b can be dispersed back into the dispersion liquid 330a by repulsion, and the receiving part 320 can be used as a light-shielding part.

[0097] Accordingly, the optical path control components can be driven in privacy mode.

[0098] The optical path control component 1000 may include at least one cutting region. More specifically, the optical path control component 1000 may include multiple cutting regions.

[0099] For example, the optical path control component 1000 may include a first cutting region CA1, a second cutting region CA2, a third cutting region CA3, a fourth cutting region CA4, a fifth cutting region CA5, and a sixth cutting region CA6.

[0100] The first cutting region CA1 and the second cutting region CA2 can be configured to face each other. More specifically, the first cutting region CA1 and the second cutting region CA2 can be configured to face each other in a second direction (2D).

[0101] In other words, the first cutting region CA1 and the second cutting region CA2 can be configured to extend in the first direction while facing each other in the second direction.

[0102] Furthermore, the third cutting region CA3 and the fourth cutting region CA4 can be configured to face each other. Specifically, the third cutting region CA3 and the fourth cutting region CA4 can be configured to face each other in the first direction 1D.

[0103] In other words, the third cutting region CA3 and the fourth cutting region CA4 can be configured to extend in the second direction while facing each other in the first direction.

[0104] Furthermore, the fifth cutting region CA5 and the sixth cutting region CA6 can be positioned below the second cutting region CA2. Specifically, the fifth cutting region CA5 and the sixth cutting region CA6 can be positioned facing each other in the second direction 2D.

[0105] In other words, the fifth cutting region CA5 and the sixth cutting region CA6 can be configured to extend in the first direction while facing each other in the second direction.

[0106] Furthermore, the second cutting region CA12 can be located between the first cutting region CA1 and the fifth cutting region CA5. Additionally, the fifth cutting region CA5 can be located between the second cutting region CA2 and the sixth cutting region CA6. That is, the first cutting region CA1, the second cutting region CA2, the fifth cutting region CA5, and the sixth cutting region CA6 can be sequentially arranged based on the second direction 2D.

[0107] The first cutting region CA1, the second cutting region CA2, the third cutting region CA3, the fourth cutting region CA4, the fifth cutting region CA5, and the sixth cutting region CA6 can be formed by cutting the second substrate 120. Specifically, the first cutting region CA1, the second cutting region CA2, the third cutting region CA3, the fourth cutting region CA4, the fifth cutting region CA5, and the sixth cutting region CA6 can be formed by cutting at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, the adhesive layer 410, and the first electrode 210.

[0108] Sealing material can be provided in the first cutting area CA1, the second cutting area CA2, the third cutting area CA3, the fourth cutting area CA4, and the fifth cutting area CA5. Accordingly, the sealing material can be provided in the first cutting area CA1, the second cutting area CA2, the third cutting area CA3, the fourth cutting area CA4, and the fifth cutting area CA5 to form a sealing part 500.

[0109] For example, the first sealing part 510 may be provided in the first cutting region CA1 and the second cutting region CA2, the second sealing part 520 may be provided in the third cutting region CA3 and the fourth cutting region CA4, and the third sealing part 530 may be formed in the fifth cutting region CA5.

[0110] Meanwhile, the first cutting region CA1 can be formed at the edge of the optical path control member 1000. Accordingly, one side surface of the optical path control member 1000 can become a first sealing part 510 disposed in the first cutting region CA1.

[0111] Furthermore, a conductive material can be disposed in the sixth cutting region CA6. Therefore, the conductive material can be disposed in the sixth cutting region CA6 to form a connecting electrode. Specifically, the conductive material can be disposed in the sixth cutting region CA6 to form the second connecting electrode CE2 of the optical path control component 1000.

[0112] In addition, a first connection electrode CE1 formed by removing part or all of the adhesive layer 410 can be formed on the first substrate 110, and the first connection electrode CE1 and the second connection electrode CE2 can be connected to an external printed circuit board.

[0113] The first substrate 110 and the second substrate 120 may have the same size or different sizes.

[0114] In detail, the first length extending in the first direction 1D of the first substrate 110 may be the same as or similar to the second length extending in the first direction 1D of the second substrate 120.

[0115] For example, the first length and the second length can have dimensions of 300mm to 400mm.

[0116] Furthermore, the first width extending in the second direction 2D of the first substrate 110 may be the same as or similar to the second width extending in the second direction of the second substrate 120.

[0117] For example, the first width and the second width can have dimensions ranging from 150mm to 200mm.

[0118] Furthermore, the first thickness extending in the third direction 3A of the first substrate 110 may be the same as or similar to the second thickness extending upward in the third direction of the second substrate 120.

[0119] For example, the first thickness and the second thickness can have dimensions of 1 mm or less.

[0120] Furthermore, the first substrate 110 and the second substrate 120 may have different areas.

[0121] In detail, the first substrate 110 and the second substrate 120 may include protrusions. (See reference...) Figures 5 to 7 The first substrate 110 may include a first protrusion PA1, and the second substrate 120 may include a second protrusion PA2. More specifically, the first substrate 110 and the second substrate 120 may include the first protrusion PA1 and the second protrusion PA2, which are configured to be offset from each other.

[0122] In other words, the first protrusion PA1 and the second protrusion PA2 can be configured to not overlap each other on the third direction 3A.

[0123] Alternatively, this embodiment is not limited to this, and the first protrusion PA1 and the second protrusion PA2 may include overlapping regions that overlap each other and non-overlapping regions that do not overlap each other. That is, the first protrusion PA1 and the second protrusion PA2 may include overlapping regions that overlap each other in a third direction and non-overlapping regions that do not overlap each other in a third direction.

[0124] In this case, the first protrusion PA1 and the second protrusion PA2 can have different areas. That is, the first substrate 110 and the second substrate 120 can have different dimensions due to the size difference of the protrusions.

[0125] The connection electrodes that connect to an external printed circuit board or flexible printed circuit board can be formed on the first protrusion PA1 of the first substrate 110 and the second protrusion PA2 of the second substrate 120, respectively.

[0126] In detail, the first connecting electrode CE1 can be disposed on the first protrusion PA1, and the second connecting electrode CE2 can be disposed on the second protrusion PA2. When the first protrusion PA1 and the second protrusion PA2 are disposed at offset positions, the first connecting electrode CE1 and the second connecting electrode CE2 can be configured not to overlap in the third direction 3A.

[0127] Conductive materials can be exposed on the upper surfaces of the first connecting electrode CE1 and the second connecting electrode CE2, respectively. For example, the first connecting electrode CE1 can be formed by partially removing the adhesive layer 410 on the first electrode 210. Accordingly, a conductive material identical to the conductive material of the first electrode 210 can be exposed on the first connecting electrode CE1.

[0128] Furthermore, as described above, the second connecting electrode CE2 can be formed by providing a conductive material within the sixth cutting region CA6. Accordingly, a conductive material that is the same as or different from the conductive material of the second electrode 220 can be exposed on the second connecting electrode CE2.

[0129] The optical path control component can be electrically connected to an external printed circuit board or flexible printed circuit board via the first connecting electrode CE1 and the second connecting electrode CE2.

[0130] For example, by providing pad portions on the first connecting electrode CE1 and the second connecting electrode CE2, and by providing a conductive adhesive including at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) between the pad portions and the printed circuit board or flexible printed circuit board, the optical path control component can be connected thereto.

[0131] Alternatively, a conductive adhesive comprising at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) may be disposed between the first connecting electrode (CE1), the second connecting electrode (CE2) and the printed circuit board or flexible printed circuit board for direct connection without pads.

[0132] At the same time, refer to Figure 2 and Figure 3 The third cutting region CA3 and the fourth cutting region CA4 can be formed by removing the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410. Therefore, the second sealing part 520 provided in the third cutting region CA3 and the fourth cutting region CA4 can be configured to contact the first electrode 210.

[0133] Or, refer to Figure 4 The third cutting region CA3 and the fourth cutting region CA4 can be formed by removing part or all of the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion part 300. Accordingly, the second sealing part 520 provided in the third cutting region CA3 and the fourth cutting region CA4 can be configured to contact the light conversion part 300 or the adhesive layer 410.

[0134] Meanwhile, in the configuration of the optical path control member 1000 according to an embodiment of the present invention, the adhesive layer 410 is configured to bond the first electrode 210 and the light conversion part 300. However, since the material forming the adhesive layer 410 has a lower external water vapor transmittance than the materials of other layers, moisture may be introduced from the outside towards the light conversion material of the optical path control member through the adhesive layer 410.

[0135] Therefore, appearance defects may occur in the optical path control components, and differences in driving characteristics may occur in areas where moisture has seeped into the light conversion material, thereby degrading the driving characteristics of the optical path control components.

[0136] Therefore, the following will describe in detail the optical path control component that can improve the sealing properties of the adhesive layer of the optical path control component.

[0137] First, refer to Figures 8 to 17 The first cutting area CA1, where the first sealing part 510 is provided, will be described.

[0138] Figures 8 to 17 This is a view used to describe the first cutting area CA1 and the first sealing part 510 disposed in the first cutting area CA1.

[0139] Figure 8 This is a top view used to describe the first cut area of ​​the optical path control component 1000.

[0140] refer to Figure 8 The first cutting region CA1 can extend in the first direction 1D. That is, the length direction of the first cutting region CA1 can be the first direction.

[0141] The first cutting region CA1 can be formed by partially removing the optical path control member 1000. The first cutting region CA1 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410.

[0142] Specifically, the first cutting region CA1 can be defined as two regions depending on the degree of cutting. Specifically, the first cutting region CA1 may include: a first region 1A, from which the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion part 300 are removed; and a second region 2A, from which the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 are removed.

[0143] That is, the adhesive layer 410 may not be removed from the first region 1A, and the adhesive layer 410 may be partially or completely removed from the second region 2A. Therefore, the adhesive layer 410 may be formed in the first region 1A, and the second region 2A may be formed by partially or completely removing the adhesive layer 410.

[0144] The cutting depths of the first region 1A and the second region 2A can be different. Accordingly, the first region 1A and the second region 2A can have different depths. Accordingly, the first cutting region CA1 can include: the first region 1A, to which the adhesive layer 410 is exposed; and the second region 2A, which includes a stepped portion SA having a step difference from that of the first region.

[0145] For example, the adhesive layer 410 may be exposed in the first region 1A, and the first electrode 210 may be exposed in the second region 2A. That is, the bottom surface of the first cutting region CA1 may have a step difference between the first region 1A and the second region 2A.

[0146] The second region 2A can be the region irradiated by a laser to form the first cutting region CA1. That is, a portion of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 can be removed from the optical path control member 1000 by irradiating the second region 2A with a laser. Accordingly, the first cutting region CA1 can be formed in the optical path control member 1000.

[0147] Figure 9 It is along Figure 1 and 8 The sectional view taken by line B-B'. Figure 10 It is along Figure 1 and 8 A cross-sectional view taken by line C-C'. Figure 11 It is along Figure 8 A sectional view taken by line D-D'. Figures 9 to 11 This is a cross-sectional view of the sealing portion filling the first cut area CA1.

[0148] refer to Figure 9The first sealing portion 510 disposed in the first region 1A of the first cutting region CA1 can be configured to contact the adhesive layer 410. Furthermore, refer to... Figure 10 The first sealing part 510, which is provided in the second region 2A of the first cutting region CA1, can be configured to contact the first electrode 210.

[0149] In other words, the first sealing part 510 can be configured to contact different layers depending on its position in the first cutting area CA1.

[0150] Accordingly, refer to Figure 11 When moisture permeates through the adhesive layer 410, the moisture can move from the adhesive layer 410 toward the light conversion part 300, and can then be blocked by the first sealing part 510 adjacent to the light conversion part 300.

[0151] In other words, the first sealing part 510 can prevent or minimize the movement of moisture that has penetrated through the adhesive layer 410 to the light conversion part 300.

[0152] For details, please refer to Figure 11 The first sealing portion 510 disposed in the first cutting area CA1 may include a stepped portion SA. The stepped portion SA can short-circuit the first adhesive layer 410, and by disposing the first sealing portion 510 in the stepped portion SA, moisture can be easily prevented from penetrating through the adhesive layer 410.

[0153] refer to Figure 11 The inner surface of the first cutting region CA1 may include an inclined surface. Furthermore, the inner surface of the first cutting region CA1 may include a curved surface. That is, the inner surface of the first cutting region CA1 may include an inclined surface with a curved surface.

[0154] The width of the first cutting region can increase as it extends from the first substrate 110 toward the second substrate 120. Here, the width of the first cutting region can extend in a second direction. That is, the inner surface of the first cutting region CA1 can be inclined in the direction in which the width of the first cutting region CA1 increases as it extends from the first substrate 110 toward the second substrate 120.

[0155] Furthermore, the side surface of the adhesive layer 410 in the inner surface of the first cutting region CA1 can be formed into a recessed shape. That is, the side surface of the adhesive layer 410 is the area that is in direct contact with the laser to form the first cutting region CA1. Compared with other layers, a large amount of heat is generated according to the laser being applied, thus forming a recessed shape.

[0156] Furthermore, the tilt angle of the inner surface of the first cutting region CA1 can change as it extends from the first substrate 110 toward the second substrate 120. For example, the tilt angle of the inner surface of the first cutting region CA1 can be larger than the tilt angle in the first substrate 110, and the tilt angles of the second electrode 220 and the buffer layer 420 can be larger than the tilt angles in the second substrate 120 or the light conversion section 300.

[0157] In addition, refer to Figure 12 The area of ​​the first electrode 210 exposed in the first cutting region CA1 can be spaced apart from the inner surface of the first cutting region CA1. That is, with Figure 11 Unlike other materials, the adhesive layer 410 can be disposed between the area of ​​the first electrode 210 exposed in the first cutting area CA1 and the inner surface of the first cutting area.

[0158] Figure 13 This is another top view used to describe the first cutting area of ​​the optical path control component 1000.

[0159] refer to Figure 13 The first cutting region CA1 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300 and the adhesive layer 410.

[0160] In detail, the first cutting region CA1 can be defined as two regions depending on the degree of cutting. Specifically, the first cutting region CA1 may include: a first region 1A, from which the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300 are removed; and a second region 2A, from which the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion unit 300, and the adhesive layer 410 are removed.

[0161] That is, the adhesive layer 410 can be formed in the first region 1A, and the second region 2A can be formed by partially or completely removing the adhesive layer 410.

[0162] Accordingly, the adhesive layer 410 can be exposed in the first region 1A, and the first electrode 210 can be exposed in the second region 2A. That is, the lower surface of the first cutting region CA1 can have a step difference in the first region 1A and the second region 2A.

[0163] The second region 2A may also be formed at at least one end of the first direction 1D of the first cutting region CA1. For example, the second region 2A may be formed at only one end of the first direction 1D of the first cutting region CA1, or it may be formed at both ends of the first cutting region CA1.

[0164] Accordingly, when the first cutting area CA1 is formed in the optical path control component 1000, cutting can be easily performed by increasing the area to be irradiated by the laser.

[0165] For example, the second region 2A can be formed to extend from both ends of the first cutting region CA1 in the first direction 1D in the second direction 2D. Accordingly, the second region 2A can be configured to surround the first region 1A.

[0166] Figure 14 It is along Figure 1 and Figure 11 The sectional view taken by line B-B'. Figure 14 This is a cross-sectional view of the first cut area CA1 filled with a sealing portion.

[0167] refer to Figure 13 and 14 The first sealing portion 510 disposed in the first region 1A of the first cutting region CA1 can be configured to contact the adhesive layer 410. Furthermore, the first sealing portion 510 disposed in the second region 2A of the first cutting region CA1 can be configured to contact the first electrode 210.

[0168] In other words, the first sealing part 510 can be configured to contact different layers depending on its position in the first cutting area CA1.

[0169] Accordingly, refer to Figure 13 and 14 The adhesive layer 410 on the outer surface ES of the optical path control component 1000 is removed, and a first sealing portion 510 is provided in the area where the adhesive layer 410 is removed. Therefore, moisture can be prevented or minimized from penetrating into the optical path control component through the adhesive layer on the outer surface of the optical path control component 1000.

[0170] Figure 15 This is another top view used to describe the first cutting area of ​​the optical path control component 1000.

[0171] refer to Figure 15 The first cutting region CA1 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300 and the adhesive layer 410.

[0172] In other words, the laser can irradiate all areas where the first cutting region CA1 is to be formed.

[0173] Therefore, since the first cutting region CA1 is formed by removing all of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410, the first electrode 210 can be exposed in the first cutting region CA1. That is, the first electrode 210 can be exposed on the lower surface of the first cutting region CA1 without any step difference.

[0174] Figure 16 It is along Figure 1 and Figure 15 The sectional view taken by line B-B'. Figure 17 It is along Figure 15 The sectional view taken by line E-E', and Figure 16 and 17 This is a cross-sectional view of the case where the sealing part is filled in the first cutting area CA1.

[0175] refer to Figure 16 and 17 The first sealing portion 510 disposed in the first cutting area CA1 can be configured to contact the first electrode 210. That is, all the first sealing portions 510 disposed in the first cutting area CA1 can be configured to contact the first electrode 210.

[0176] Accordingly, refer to Figure 16 and 17 The outer surface ES of the optical path control component 1000, which is formed by the first cutting region CA1 in the optical path control component 1000, can be formed by the first sealing part 510.

[0177] Therefore, when moisture penetrates into the optical path control component 1000 through the outer surface of the optical path control component, the first sealing part 510 can prevent or minimize the penetration of moisture into the optical path control component.

[0178] Meanwhile, the first sealing part 510 and the second sealing part 520 can be connected in the region where the first cutting region CA1, the third cutting region CA3, and the fourth cutting region CA4 overlap. That is, the first sealing part 510 and the second sealing part 520 can be integrally formed in the region where the first cutting region CA1, the third cutting region CA3, and the fourth cutting region CA4 overlap.

[0179] The first sealing portion 510 may include a photocurable material. Furthermore, the sealing material of the first sealing portion 510 may include a material with low reactivity with the light conversion material 330. For example, the sealing material of the first sealing portion 510 may include polyurethane acrylate.

[0180] The first sealing part 520 can seal the housing part 320 of the light conversion part 300. That is, while preventing the light conversion material 330 contained in the housing part 320 from leaking to the outside, it can also prevent impurities that may penetrate from the outside from penetrating into the light conversion part 300.

[0181] That is, the first sealing part 520 can seal the light conversion material 300 by means of the injection part and the injection part in the suction part of the sealing receiving part 320.

[0182] The first sealing portion 510 can be provided while completely filling the first cutting region CA1, or the first sealing portion 510 can be provided at a height lower than the depth of the first cutting region CA1. Accordingly, the upper surface of the first sealing portion 510 can be provided at a height lower than the upper surface of the second substrate 120. That is, a step difference can be formed between the upper surface of the first sealing portion 510 and the upper surface of the second substrate 120. Furthermore, the upper surface of the first sealing portion 510 can be formed into a recessed shape.

[0183] The second cutting region CA2, the fifth cutting region CA5, and the sixth cutting region CA6 will be described below.

[0184] Figures 18 to 27 This is a view used to describe the second cutting region CA2, the fifth cutting region CA5, the sixth cutting region CA6, the first sealing part 510 disposed in the second cutting region CA2, the third sealing part 530 disposed in the fifth cutting region CA5, and the conductive material 600 disposed in the sixth cutting region CA6.

[0185] refer to Figure 18 The second cutting region CA2 can extend along the length direction of the first direction 1D.

[0186] The second cutting region CA2 can be formed by partially removing the optical path control member 1000. The second cutting region CA2 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410.

[0187] In detail, the second cutting region CA2 can be defined as two regions depending on the degree of cutting. Specifically, the second cutting region CA2 may include: a first region 1A, from which the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion part 300 are removed; and a second region 2A, from which the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 are removed.

[0188] The cutting depths of the first region 1A and the second region 2A can be different. Accordingly, the first region 1A and the second region 2A can have different depths. Accordingly, the first cutting region CA1 can include: the first region 1A, to which the adhesive layer 410 is exposed; and the second region 2A, which includes a stepped portion SA that has a step difference from the first region.

[0189] The second region 2A may include multiple regions. For example, the second region 2A may include multiple second regions 2A spaced apart from each other. In addition, the first region 1A may be located between the second regions 2A.

[0190] Accordingly, the adhesive layer 410 can be exposed in the first region 1A, and the first electrode 210 can be exposed in the second region 2A. That is, the lower surface of the second cutting region CA2 can have a step difference in the first region 1A and the second region 2A.

[0191] The second region 2A can be the region irradiated by a laser to form the first cutting region CA1. That is, a portion of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 can be removed from the optical path control member 1000 by irradiating the second region 2A with a laser. Accordingly, the first cutting region CA1 can be formed in the optical path control member 1000.

[0192] Figure 19 It is along Figure 1 and Figure 18 The sectional view taken by line F-F'. Figure 20 It is along Figure 1 and Figure 18 A cross-sectional view taken by line G-G'. Figure 21 It is along Figure 18 A cross-sectional view taken by line H-H'. Figure 22 and Figure 23 It is along Figure 18 A sectional view taken from line I-I'. Figures 19 to 23 This is a cross-sectional view showing the situation where the sealing portion is filled in the second cutting region CA2 and the fifth cutting region CA5, and the conductive material is filled in the sixth cutting region CA6.

[0193] refer to Figure 19 The first sealing portion 510, located in the first region 1A of the second cutting region CA2, can be configured to contact the adhesive layer 410. Furthermore, refer to... Figure 20 The first sealing part 510, which is provided in the second region 2A of the second cutting region CA2, can be configured to contact the first electrode 210.

[0194] In other words, the first sealing part 510 can be configured to contact different layers depending on its position in the first cutting area CA1.

[0195] Accordingly, refer to Figure 21 When moisture permeates through the adhesive layer 410, the first sealing part 510 provided between the adhesive layers can prevent or minimize the permeation of moisture into the light conversion part 300.

[0196] Furthermore, since the first sealing portion 510 is disposed throughout the second region 2A which is spaced apart from each other, moisture penetration can be doubly prevented. Therefore, when moisture penetrates into the optical path control member through the adhesive layer, the movement of moisture toward the light conversion portion 300 can be prevented or minimized.

[0197] Figure 22 and Figure 23 It is a cross-sectional view obtained by cutting the second, fifth, and sixth cutting regions. Figure 22 and Figure 23 This is a cross-sectional view showing the filling of sealing parts in the second cutting region CA2 and the fifth cutting region CA5, and the filling of conductive material in the sixth cutting region CA6.

[0198] The fifth cutting region CA5 can be set to be spaced apart from the second cutting region CA2 in the opposite direction to the first cutting region CA1.

[0199] The fifth cutting region CA5 may include the first region 1A and the second region 2A in the same manner as the second cutting region CA2. Accordingly, the third sealing portion 530 disposed in the fifth cutting region CA5 may be configured to contact the adhesive layer 410 and the first electrode 210 within the fifth cutting region CA5.

[0200] In other words, the adhesive layer 410 can be formed in the first region 1A, and the second region 2A can be formed by partially or completely removing the adhesive layer 410.

[0201] The length of the fifth cutting region CA5 in the first direction may be smaller than the length of the second cutting region CA2. Furthermore, the third sealing portion 530 may comprise a material that is the same as or similar to that of the first sealing portion 510.

[0202] Furthermore, conductive material 600 can be disposed in the sixth cutting region CA6. The sixth cutting region CA6 can be the region where the aforementioned second connecting electrode CE2 is disposed. Conductive material 600 can include a metal paste. For example, conductive material 600 can include a paste composition having a metal that is the same as or different from the metal of the first electrode 210 and the second electrode 220.

[0203] The height of the sixth cutting region CA6 can be different from the height of at least one of the first cutting region CA1, the second cutting region CA2, and the fifth cutting region CA5. For example, Figure 22 and Figure 23 As shown, the height of the sixth cutting region CA6 can be smaller than the heights of the first cutting region CA1, the second cutting region CA2, and the fifth cutting region CA5.

[0204] refer to Figure 23 The second region of the second cutting region CA2 and the second region of the fifth cutting region CA5 can have different depths. Specifically, the thickness of the adhesive layer 410 disposed in the second region 2A of the second cutting region CA2 and the fifth cutting region CA5 can be different.

[0205] Specifically, the thickness of the adhesive layer 410 disposed in the second region 2A of the second cutting region CA2 and the fifth cutting region CA5 can vary depending on the distance from the first cutting region CA1. More specifically, the thickness of the adhesive layer 410 disposed in the second region 2A of the second cutting region CA2 and the fifth cutting region CA5 can be greater as it gets closer to the first cutting region CA1.

[0206] That is, in the second region 2A of the fifth cutting region CA5, all the adhesive layer 410 can be removed by increasing the intensity or irradiation time of the laser, while in the second region 2A of the second cutting region CA2, a portion of the adhesive layer 410 can be retained by making the intensity or irradiation time of the laser relatively small.

[0207] When using a laser to form the second cutting region CA12 and the fifth cutting region CA5, the first electrode 210 located below the adhesive layer 410 may be removed together during the process due to errors.

[0208] Therefore, in the second cutting region CA2, the removal of the first electrode 210 can be prevented by reducing the intensity or duration of the laser, thus partially preserving the adhesive layer 410. Therefore, by preventing the removal of the housing portion of the light conversion section 300 (i.e., the first electrode 210 configured to be adjacent to the light conversion material 300 in the second cutting region CA2), the deterioration of the driving characteristics of the optical path control component can be prevented.

[0209] Furthermore, in the fifth cutting region CA5, by removing all the adhesive layer using increased laser intensity or duration, and partially removing the first electrode 210 according to the laser intensity, the area of ​​the third sealing portion 530 can be increased. Accordingly, the penetration of moisture that might seep from the outside of the optical path control component can be effectively prevented. Moreover, since the fifth cutting region CA5 is located away from the light conversion material 300, even if a portion of the first electrode 210 is partially removed during the laser process, the driving characteristics will not be significantly affected.

[0210] Figure 24 and Figure 25 This is a view used to describe the second and fifth cutting regions of the optical path control component 1000.

[0211] refer to Figure 24 The second cutting region CA2 and the fifth cutting region CA5 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300 and the adhesive layer 410.

[0212] Specifically, the second cutting region CA2 and the fifth cutting region CA5 can be defined as two regions depending on the degree of cutting. Specifically, the second cutting region CA2 and the fifth cutting region CA5 include: a first region 1A, from which the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300 are removed; and a second region 2A, from which the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion unit 300, and the adhesive layer 410 are removed.

[0213] Accordingly, the adhesive layer 410 can be exposed in the first region 1A, and the first electrode 210 can be exposed in the second region 2A. That is, the lower surface of the second cutting region CA2 can have a step difference in the first region 1A and the second region 2A.

[0214] The second region 2A may also be formed at at least one end of the second cutting region CA2 and the fifth cutting region CA5 in the first direction 1D. For example, the second region 2A may be formed at only one end of the second cutting region CA2 in the first direction 1D, or it may be formed at both ends of the second cutting region CA2.

[0215] Accordingly, when the second cutting region CA2 and the fifth cutting region CA5 are formed in the optical path control component 1000, they can be easily cut by increasing the area to which the irradiated laser is applied.

[0216] For example, the second region 2A can be formed to extend in the second direction 2D from both ends of the second cutting region CA2 and the fifth cutting region CA5 in the first direction 1D. Accordingly, the second region 2A can be configured to surround the first region 1A.

[0217] Figure 25 It is along Figure 1 and Figure 24 The sectional view taken by line F-F'. Figure 25 This is a cross-sectional view showing the situation where the sealing portion is filled in the second cutting region CA2 and the fifth cutting region CA5, and the conductive material is filled in the sixth cutting region CA6.

[0218] refer to Figure 25 The first sealing portion 510 disposed in the first region 1A of the second cutting region CA2 can be configured to contact the adhesive layer 410. Furthermore, the first sealing portion 510 disposed in the second region 2A of the second cutting region CA2 can be configured to contact the first electrode 210.

[0219] In other words, the first sealing part 510 can be configured to contact different layers depending on its position in the second cutting area CA2.

[0220] Accordingly, refer to Figure 25 The first sealing portion 510 can be disposed in the region where the adhesive layer 410 of the optical path control member 1000 is removed. Therefore, moisture can be prevented or minimized from penetrating into the optical path control member 1000 through the adhesive layer.

[0221] Figure 26 and 27 This is another view used to describe the second and fifth cutting regions of the optical path control component 1000.

[0222] refer to Figure 26 The second cutting region CA2 and the fifth cutting region CA5 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410. Specifically, the second cutting region CA2 and the fifth cutting region CA5 can be formed by removing the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410.

[0223] In other words, the laser can irradiate all areas where the second cutting region CA2 and the fifth cutting region CA5 are to be formed.

[0224] Therefore, since the second cutting region CA2 and the fifth cutting region CA5 are formed by removing the entire second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410, the first electrode 210 can be exposed in the second cutting region CA2 and the fifth cutting region CA5. That is, the first electrode 210 can be exposed on the lower surface of the second cutting region CA2 and the fifth cutting region CA5 without any step difference.

[0225] Figure 27 It is along Figure 1 and Figure 26 The sectional view taken by line F-F'. Figure 27 This is a cross-sectional view showing the filling of sealing parts in the second cutting region CA2 and the fifth cutting region CA5, and the filling of conductive material in the sixth cutting region CA6.

[0226] refer to Figure 27 The first sealing portion 510 disposed in the second cutting region CA2 can be configured to contact the first electrode 210. That is, all the first sealing portions 510 disposed in the first cutting region CA1 can be configured to contact the first electrode 210.

[0227] Accordingly, refer to Figure 27 The outer surface ES of the optical path control component 1000, which is formed by the second cutting region CA2 of the optical path control component 1000, can be formed by the first sealing part 510.

[0228] Therefore, when moisture penetrates into the optical path control component 1000 through the outer surface of the optical path control component, the first sealing part 510 can prevent or minimize the penetration of moisture into the optical path control component.

[0229] Below, we will refer to Figure 28 and 29 Describe the third cutting area, the fourth cutting area, and the second sealing part.

[0230] refer to Figure 28 The third cutting region CA3 and the fourth cutting region CA4 can extend in the width direction of the second direction 2D.

[0231] The third cutting region CA3 and the fourth cutting region CA4 can be formed by partially removing the optical path control member 1000. The third cutting region CA3 and the fourth cutting region CA4 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300 and the adhesive layer 410.

[0232] In detail, the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 can be removed in the third cutting region CA3 and the fourth cutting region CA4.

[0233] Accordingly, the first electrode 210 can be exposed in the third cutting region CA3 and the fourth cutting region CA4.

[0234] Alternatively, a portion of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410 may be removed in the third cutting region CA3 and the fourth cutting region CA4.

[0235] Accordingly, a portion of the adhesive layer 410 removed therefrom can be exposed in the third cutting region CA3 and the fourth cutting region CA4.

[0236] Figure 29 It is along Figure 1 and Figure 28 A sectional view taken by line J-J'. Figure 30 This is a cross-sectional view showing the filling of the sealing portion in the third cutting region CA3 and the fourth cutting region CA4.

[0237] refer to Figure 29 The second sealing portion 520 disposed in the third cutting region CA3 and the fourth cutting region CA4 can be configured to contact the first electrode 210. Alternatively, when the adhesive layer is partially removed as described above, the second sealing portion 520 disposed in the third cutting region CA3 and the fourth cutting region CA4 can be configured to contact the adhesive layer 410.

[0238] Accordingly, when moisture permeates through the adhesive layer 410, the moisture can move from the adhesive layer 410 toward the light conversion unit 300, and can then be blocked by the sealing part 520 adjacent to the light conversion unit 300.

[0239] In other words, the movement of moisture that penetrates through the adhesive layer 410 into the light conversion section 300 can be prevented or minimized by the second sealing part 520.

[0240] Meanwhile, the foregoing description mainly describes the complete removal of the adhesive layer 410 from the first cutting area to the fifth cutting area, but this embodiment is not limited to this.

[0241] For example, refer to Figure 30 In (a), the adhesive layer 410 may be partially retained in the second region 2A of the first cut region CA1. In detail, the adhesive layer 410 may be partially retained such that the thickness of the second region 2A of the first cut region CA1 is 50% or less of the thickness of the first region 1A.

[0242] Or, refer to Figure 30 (b) The adhesive layer 410 can be completely removed in the second region 2A of the first cutting region CA1, and the first electrode 210 can also be partially removed. Specifically, the adhesive layer 410 can be partially removed together with the first electrode 210, such that the thickness of the second region 2A of the first cutting region CA1 is 50% to less than 100% of the thickness of the first electrode 210 in the first region 1A.

[0243] Or, refer to Figure 30 (c) The adhesive layer 410 and the first electrode 210 can be completely removed in the second region 2A of the first cutting region CA1, and the first substrate 110 can also be partially removed.

[0244] Similar to the first cutting region, in the second to fifth cutting regions, the adhesive layer may be retained or the first electrode may be completely or partially removed.

[0245] Furthermore, in the foregoing description, in the first to fifth cutting regions, the adhesive layer is removed from the edge of the cutting region, or the adhesive layer is completely removed from the cutting region, but this embodiment is not limited to this.

[0246] For example, refer to Figure 31 (a) can form three or more second regions 2A of the first cutting region CA1. That is, at least three second regions extending in the same direction can be formed.

[0247] Or, refer to Figure 31 (b) The second region 2A of the first cutting region CA1 may include multiple regions extending in different directions. For example, the second region 2A of the first cutting region CA1 may include multiple regions extending in a first direction, a second direction, and a direction between the first and second directions.

[0248] In other words, by adjusting the direction and intensity of the laser used to form the second region, a second region with various pattern shapes can be formed in the first cutting region.

[0249] Similar to the first cutting area, the second to fifth cutting areas can also form a second area with various pattern shapes.

[0250] Below, we will refer to Figures 32 to 38 A method for manufacturing an optical path control component according to an embodiment is described. In the description of the method for manufacturing the optical path control component according to the embodiment, descriptions that are the same as or similar to those of the optical path control component according to the above embodiment will be omitted, and the same reference numerals will be assigned to the same configuration.

[0251] refer to Figure 32The first substrate 110 and the second substrate 120 can be adhered together by the adhesive layer 410. That is, the first substrate 110 and the second substrate 120 can be adhered to each other so that the second substrate 120 is disposed on the first substrate 110.

[0252] Subsequently, a plurality of holes can be formed on the second substrate 120. Specifically, a first hole H1, a second hole H2, and a third hole H3 can be formed on the second substrate 120.

[0253] The first hole H1 may include hole 1-1 H1-1 and hole 1-2 H1-2, which are spaced apart from each other and face each other. Furthermore, the second hole H2 may include hole 2-1 H2-1 and hole 2-2 H2-2, which are spaced apart from each other and face each other.

[0254] Hole 1-1 H1-1, Hole 1-2 H1-2, Hole 2-1 H2-1 and Hole 2-2 H2-2 can extend in the length direction of the first direction.

[0255] Hole 1-1 H1-1 and hole 1-2 H1-2 can be set to be further away from the edge of the second substrate 120 than hole 2-1 H2-1 and hole 2-2 H2-2.

[0256] Hole H1-1 (1-1), Hole H1-2 (1-2), Hole H2-1 (2-1), and Hole H2-2 (2-2) can be formed by removing the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410. In this case, the adhesive layer 410 can be completely or partially removed.

[0257] Hole 1-1 H1-1 can correspond to the first cutting area CA1 mentioned above, and hole 1-2 H1-2 can correspond to the second cutting area CA2 mentioned above. Hole 2-2 H2-2 can correspond to the fifth cutting area CA5 mentioned above.

[0258] Furthermore, a third hole H3 can be formed in the protrusion PA of the second substrate 120. The third hole H3 can be formed by removing at least one of the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410.

[0259] The aforementioned conductive material 600 is disposed in the third hole H3, and correspondingly, the third hole H3 can form a second connecting electrode CE2 connected to the second electrode 220.

[0260] Subsequently, reference Figure 33The sealing material can be filled into the second hole H2. Accordingly, the third sealing part 530 can be disposed in the second hole H2. When the light conversion material 330 is injected into the receiving part 320, the third sealing part 530 can be used as a dam to block the movement of the light conversion material.

[0261] The third sealing portion 530 can partially or completely fill the area between the first hole H1 and the second hole H2 along the receiving portion 320.

[0262] The third sealing portion 530 may include polyurethane acrylate, but this embodiment is not limited thereto.

[0263] refer to Figure 34 The light conversion material 330, comprising light conversion particles 330a and dispersion 330b, can be injected into the receiving portion 320 through the first hole H1. Accordingly, the light conversion material 330 can fill the receiving portion 320, the first hole H1, and the second hole H2.

[0264] The housing 320 can be configured to tilt at a constant angle relative to the second direction 2A, and correspondingly, the light conversion material 330 can also be tilted at a constant angle to be filled.

[0265] For example, after designating hole 1-1 H1-1 of the first holes H1 facing each other as the injection section and hole 1-2 H1-2 as the suction section, light conversion material is dispensed in the injection section, and then the light conversion material can be filled into the receiving section 320 by a capillary method for suctioning the light conversion material from the suction section.

[0266] Subsequently, reference Figure 35 The first sealing part 510 can be formed by filling the 1-1 hole H1-1 and the 1-2 hole H1-2 with sealing material.

[0267] The first sealing portion 510 may include the same material as the third sealing portion 530, but this embodiment is not limited thereto.

[0268] Meanwhile, the interior of the first hole H1 is cleaned before filling with the sealing material so that the sealing material can be easily filled into the first hole H1, and additional steps (such as cleaning steps) for forming the injection channel of the sealing material can be performed.

[0269] Simultaneously, the first sealing portion 510, while being disposed within the first hole H1, can be partially moved into the receiving portion 320. Accordingly, the light conversion material 330 and the sealing material can be disposed together in the receiving portion 320.

[0270] Subsequently, a fourth hole H4 and a fifth hole H5 can be additionally formed. Specifically, the fourth hole H4 and the fifth hole H5, extending in the second direction, can be formed on the second substrate 120. That is, the fourth hole H4 and the fifth hole H5 can be formed by irradiating a laser from the second substrate 120 toward the first substrate 110.

[0271] The fourth hole H4 may include hole 4-1 H4-1 and hole 4-2 H4-2, which are spaced apart from each other and face each other. Furthermore, the fifth hole H5 may include hole 5-1 H5-1 and hole 5-2 H5-2, which are spaced apart from each other and face each other.

[0272] Hole 4-1 H4-1, hole 4-2 H4-2, hole 5-1 H5-1 and hole 5-2 H5-2 can extend in the length direction of the second direction.

[0273] Holes H4-1 (4-1) and H4-2 (4-2) can be positioned further away from the edge of the second substrate 120 than holes H5-1 (5-1) and H5-2 (5-2).

[0274] Holes H4-1 (4-1), H4-2 (4-2), H5-1 (5-1), and H5-2 (5-2) can be formed by removing the second substrate 120, the second electrode 220, the buffer layer 420, the light conversion part 300, and the adhesive layer 410. In this case, the adhesive layer 410 can be completely or partially removed.

[0275] At least one of the fourth hole H4 and the fifth hole H5 can be configured to overlap with the first hole H1 and the second hole H2.

[0276] Hole 4-1 H4-1 can correspond to the third cutting region CA3 mentioned above, and hole 4-2 H4-2 can correspond to the fourth cutting region CA4 mentioned above.

[0277] Meanwhile, holes 4-1 (H4-1), 4-2 (H4-2), 5-1 (H5-1), and 5-2 (H5-2) can be formed simultaneously with the first hole (H1) and the second hole (H2) mentioned above.

[0278] Subsequently, reference Figure 36 The second sealing part 520 can be formed by placing sealing material in the fourth hole H4 and the fifth hole H5.

[0279] The second sealing part 520 may include the same material as the first sealing part 510 and the third sealing part 530 described above, but this embodiment is not limited thereto.

[0280] Subsequently, reference Figure 37 , Figure 38The optical path control component can be used in Figure 36 The final product is obtained by cutting along the dotted line direction.

[0281] Below, for reference Figures 39 to 40 This section describes a display device that applies an optical path control component according to an embodiment.

[0282] refer to Figures 39 to 40 According to the embodiment, the optical path control component 1000 can be disposed above or below the display panel 2000.

[0283] The display panel 2000 and the optical path control component 1000 can be configured to be attached to each other. For example, the display panel 2000 and the optical path control component 1000 can be bonded to each other via an adhesive layer 1500. The adhesive layer 1500 can be transparent. For example, the adhesive layer 1500 can include an adhesive or adhesive layer having an optically transparent adhesive material.

[0284] The adhesive layer 1500 may include a release film. Specifically, when the optical path control component and the display panel are bonded, the optical path control component and the display panel can be bonded after the release film has been removed.

[0285] The display panel 2000 may include a first substrate 2100 and a second substrate 2200. When the display panel 2000 is a liquid crystal display panel, the light path control member may be formed below the liquid crystal panel. That is, when the surface of the liquid crystal panel that is observed by the user is defined as the upper part of the liquid crystal panel, the light path control member may be disposed below the liquid crystal panel. The display panel 2000 may be formed in a structure in which the first substrate 2100, including thin-film transistors (TFTs) and pixel electrodes, and the second substrate 2200, including a color filter layer, are bonded to each other and a liquid crystal layer is interposed between them.

[0286] Alternatively, the display panel 2000 can be a liquid crystal display panel with a color filter on transistor (COT) structure, wherein thin-film transistors, color filters, and black electrolyte are formed on a first substrate 2100, a second substrate 2200 is bonded to the first substrate 2100, and a liquid crystal layer is interposed between them. That is, thin-film transistors can be formed on the first substrate 2100, a protective film can be formed on the thin-film transistors, and a color filter layer can be formed on the protective film. Furthermore, pixel electrodes in contact with the thin-film transistors can be formed on the first substrate 2100. In this case, to improve the aperture ratio and simplify the masking process, the black electrolyte can be omitted, and the common electrode can also be formed to function as the black electrolyte.

[0287] In addition, when the display panel 2000 is a liquid crystal display panel, the display device may also include a backlight unit 3000 that provides light from the rear surface of the display panel 2000.

[0288] That is, such as Figure 39 As shown, the optical path control component can be disposed below the liquid crystal panel and above the backlight unit 3000, and the optical path control component can be disposed between the backlight unit 3000 and the display panel 2000.

[0289] Or, such as Figure 40 As shown, when the display panel 2000 is an organic light-emitting diode (OLED) panel, a light path control component can be formed on the OLED panel. That is, when the surface of the OLED panel that is observed by the user is defined as the upper part of the OLED panel, the light path control component can be disposed on the OLED panel. The display panel 2000 may include a self-emissive element that does not require a separate light source. In the display panel 2000, a thin-film transistor can be formed on the first substrate 2100, and an organic light-emitting element in contact with the thin-film transistor can be formed. The organic light-emitting element may include an anode, a cathode, and an organic light-emitting layer formed between the anode and the cathode. Furthermore, a second substrate 2200 configured to function as a packaging substrate for encapsulation may also be included on the organic light-emitting element.

[0290] Furthermore, although not shown in the figure, a polarizing plate can be further disposed between the optical path control member 1000 and the display panel 2000. The polarizing plate can be a linear polarizing plate or a polarizing plate that prevents external light reflection. For example, when the display panel 2000 is a liquid crystal display panel, the polarizing plate can be a linear polarizing plate. Furthermore, when the display panel 2000 is an organic light-emitting diode panel, the polarizing plate can be a polarizing plate that prevents external light reflection.

[0291] In addition, an additional functional layer 1300, such as an anti-reflection layer or an anti-glare layer, can be further provided on the optical path control component 1000.

[0292] In addition, a touch panel can be installed between the display panel and the optical path control components.

[0293] As shown in the accompanying drawings, the light conversion portion of the light path control member according to the embodiment is in a direction parallel or perpendicular to the outer surface of the second substrate, but the light conversion portion is formed to be inclined at a predetermined angle from the outer surface of the second substrate. Therefore, moiré patterns occurring between the display panel and the light path control member can be reduced.

[0294] refer to Figures 41 to 43 The optical path control component according to the embodiment can be applied to various display devices.

[0295] refer to Figures 41 to 43The optical path control component according to the embodiment can be applied to a display device that displays a display screen.

[0296] For example, such as Figure 41 As shown, when the optical path control component is energized, the housing portion functions as a light-transmitting portion, thereby enabling the display device to be driven in an open mode, and, as Figure 42 As shown, when the optical path control component is not powered, the housing part acts as a light-shielding part, thereby enabling the display device to be driven in privacy mode.

[0297] Therefore, users can easily drive the display device in either privacy or normal mode depending on the amount of power applied.

[0298] Light emitted from the backlight unit or the self-emissive element can move from the first substrate toward the second substrate. Alternatively, light emitted from the backlight unit or the self-emissive element can also move from the second substrate toward the first substrate.

[0299] In addition, refer to Figure 43 The display device that uses the optical path control component according to the embodiment can also be applied to the interior of a vehicle.

[0300] For example, a display device including the optical path control component according to an embodiment can display video confirmation information of the vehicle and the vehicle's movement trajectory. The display device can be disposed between the driver's seat and the passenger seat of the vehicle.

[0301] Furthermore, the optical path control component according to the embodiment can be applied to a dashboard that displays vehicle speed, engine speed, warning signals, etc.

[0302] Furthermore, the optical path control component according to the embodiment can be applied to the windshield (FG) or left and right window glass of a vehicle.

[0303] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. Furthermore, those skilled in the art can combine or modify the features, structures, and effects shown in each embodiment for other embodiments. Therefore, it should be understood that such combinations and modifications are included within the scope of the present invention.

[0304] Furthermore, while the foregoing has primarily described embodiments, these embodiments are merely examples and do not limit the invention. Those skilled in the art will understand that various changes and applications not mentioned above can be made without departing from the basic characteristics of the embodiments. For example, each component specifically represented in the embodiments can be modified. Additionally, it should be understood that differences associated with such changes and applications are included within the scope of the invention as defined by the appended claims.

Claims

1. An optical path control component, comprising: A first substrate, defining a first direction and a second direction on the first substrate; A first electrode is disposed on the first substrate; A second substrate is disposed on the first substrate and defines the first direction and the second direction; The second electrode is located below the second substrate; A light conversion unit is disposed between the first electrode and the second electrode; An adhesive layer is disposed between the first electrode and the light conversion part; as well as The cutting area is formed by removing the second substrate, the second electrode, and the light conversion part. The cutting area includes a first cutting area and a second cutting area, which extend along the length direction of the first direction and are positioned to face each other in the second direction. The first cutting area and the second cutting area include a first area and a second area, the adhesive layer is formed on the first area, and the second area is formed by partially or entirely removing the adhesive layer. A first sealing part is provided in the cutting area. Wherein, the first sealing portion contacts the adhesive layer in the first region, and The first sealing portion contacts the first electrode in the second region.

2. The optical path control component according to claim 1, wherein, The height of the adhesive layer in the first region is greater than the height of the adhesive layer in the second region.

3. The optical path control component according to claim 1, wherein, The second region extends in at least one of the first direction and the second direction.

4. The optical path control component according to claim 1, wherein, The second region surrounds the first region.

5. The optical path control component according to claim 1 further includes a fifth cutting region, the fifth cutting region being spaced apart from the second cutting region in a direction opposite to the first cutting region, and extending in the length direction in the first direction. in, The fifth cutting region includes a first region and a second region, the adhesive layer is formed in the first region, and the second region is formed by partially or entirely removing the adhesive layer. A third sealing part is provided in the fifth cutting area.

6. The optical path control component according to claim 1, wherein, The second cutting area is set to be closer to the first cutting area than the fifth cutting area, and The thickness of the adhesive layer in the second region of the second cutting region is different from the thickness of the adhesive layer in the second region of the fifth cutting region.

7. The optical path control component according to claim 6, wherein, The thickness of the adhesive layer in the second region of the second cutting region is greater than the thickness of the adhesive layer in the second region of the fifth cutting region.

8. The optical path control component according to claim 5, wherein, The third sealing portion contacts the adhesive layer in the first region of the fifth cutting region, and The third sealing portion contacts the first electrode in the second region of the fifth cutting region.

9. The optical path control component according to claim 1, wherein, The light conversion unit includes multiple partition walls and a receiving portion disposed between the multiple partition walls, and The receiving portion extends in a direction inclined relative to the second direction.

10. The optical path control component according to claim 1, further comprising a third cutting region and a fourth cutting region, the third cutting region and the fourth cutting region extending in the second direction and facing each other in the first direction. in, The third and fourth cutting regions are configured to expose at least one of the adhesive layer and the first electrode, and The second sealing part is disposed in the third cutting area and the fourth cutting area.

11. The optical path control component according to claim 10, wherein, The third and fourth cutting regions are configured to expose at least one of the first substrate, the adhesive layer, the first electrode, and the light conversion part.

12. A display device, comprising: The panel includes at least one of a display panel and a touch panel; as well as The optical path control component according to any one of claims 1 to 11 is disposed above or below the panel.

13. The display device according to claim 12, wherein, The panel includes a backlight unit and a liquid crystal display panel. The optical path control component is disposed between the backlight unit and the liquid crystal display panel, and The light emitted from the backlight unit moves from the first substrate to the second substrate.

14. The display device according to claim 12, wherein, The panel includes an organic light-emitting diode panel. The optical path control component is disposed on the organic light-emitting diode panel, and Light emitted from the panel moves from the first substrate to the second substrate.

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