Circuit structure
Patent Information
- Application Number
- CN202211241997.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-10-29
- Filing Date
- 2022-10-11
- Publication Date
- 2026-09-29
- Estimated Expiration
- 2042-10-11
AI Technical Summary
[0012]根据本公开，能够抑制电路结构体的大型化。
Smart Images
Figure CN116072642B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a circuit structure. Background Technology
[0002] Conventional circuit structures include a control board, multiple power terminals for supplying power to the control board, and multiple busbars electrically connected to the power terminals to form a power circuit (for example, see Patent Document 1). Figure 4 As shown, in the conventional circuit structure 90, each terminal 91 is electrically connected to each busbar 92 by soldering.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-96769 Summary of the Invention
[0006] The problem that the invention aims to solve
[0007] In the conventional circuit structure 90, a pressing surface 91a for soldering the terminal 91 to the busbar 92 needs to be formed at the terminal 91. Therefore, the arrangement space for the terminal 91 becomes larger, which is the reason for the larger size of the circuit structure 90.
[0008] Therefore, the purpose of this disclosure is to suppress the enlargement of circuit structures.
[0009] Technical solutions for solving the problem
[0010] One aspect of the circuit structure disclosed herein includes a first conductive component, a second conductive component, and a retaining component that maintains insulation between the first conductive component and the second conductive component. The first conductive component has a first exposed surface protruding from the retaining component, and the second conductive component has a second exposed surface protruding from the retaining component. The retaining component has an insulating portion located between the first exposed surface and the second exposed surface. The circuit structure includes a conductive film that covers at least a portion of the first exposed surface and at least a portion of the second exposed surface across the insulating portion.
[0011] Invention Effects
[0012] According to this disclosure, it is possible to suppress the enlargement of circuit structures. Attached Figure Description
[0013] Figure 1 This is a three-dimensional view of the circuit structure involved in this embodiment.
[0014] Figure 2 This is a top view of the circuit structure.
[0015] Figure 3 This is an enlarged top view showing the periphery of the power terminals.
[0016] Figure 4 It is a 3D diagram of a traditional circuit structure. Detailed Implementation
[0017] <Summary of Embodiments of this Disclosure>
[0018] First, a summary of the embodiments of this disclosure will be provided for explanation.
[0019] (1) The circuit structure disclosed herein includes a first conductive component, a second conductive component, and a retaining component for maintaining the insulation of the first conductive component and the second conductive component. The first conductive component has a first exposed surface exposed from the retaining component, the second conductive component has a second exposed surface exposed from the retaining component, and the retaining component has an insulating portion located between the first exposed surface and the second exposed surface. The circuit structure includes a conductive film that covers at least a portion of the first exposed surface and at least a portion of the second exposed surface across the insulating portion.
[0020] According to the circuit structure, the first conductive member and the second conductive member held by the holding member each have a first exposed surface and a second exposed surface exposed from the holding member. At least a portion of the first exposed surface and at least a portion of the second exposed surface are covered by a conductive film across the insulating portion, so the two exposed surfaces can be electrically connected by the conductive film. Therefore, it is not necessary to form a welding pressing surface at one of the first conductive member and the second conductive member, thus reducing the exposed surface at that location. As a result, the enlargement of the circuit structure can be suppressed.
[0021] (2) Preferably, a portion of the first conductive component other than the first exposed surface is embedded in the retaining component, and a portion of the second conductive component other than the second exposed surface is embedded in the retaining component.
[0022] In this case, by means of, embedding molding, a portion of the first conductive component and a portion of the second conductive component are embedded in the retaining component, thereby making it easy to form the first exposed surface and the second exposed surface.
[0023] (3) The conductive film is preferably a metal coating.
[0024] In this case, a conductive film can be easily formed.
[0025] (4) The first conductive component preferably has a cut-out portion formed by being cut away in a manner that surrounds the second exposed surface.
[0026] In this case, compared to the case where a hole is formed around the second exposed surface at the first conductive component, it is possible to suppress the first conductive component from heating up due to a large current.
[0027] (5) The first exposed surface and the second exposed surface are preferably configured to be on the same plane as the opposing surface of the insulating portion that faces the conductive film.
[0028] In this case, it is easier to form a conductive film.
[0029] <Details of the embodiments disclosed>
[0030] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, at least some of the embodiments described below may be combined arbitrarily.
[0031] [Circuit Structure]
[0032] Figure 1 This is a perspective view of the circuit structure 10 involved in this embodiment. Figure 2 This is a top view of the circuit structure 10. In the following description of this embodiment, directions such as "up," "down," "right," "left," "front," and "back" mean... Figure 1 direction shown.
[0033] exist Figure 1 and Figure 2 In this embodiment, the circuit structure 10 can be mounted on various devices, but the circuit structure 10 of this embodiment is mounted on an automobile. Specifically, the circuit structure 10 is installed in an electrical junction box located midway through the wiring path connecting a first vehicle-mounted device (not shown) and a second vehicle-mounted device. The circuit structure 10 includes multiple conductive plates (first conductive components) 11, multiple power terminals (second conductive components) 12, multiple control terminals 13, multiple electronic components 14, and a holding component 15. The multiple conductive plates 11, multiple power terminals 12, and multiple control terminals 13 constitute the power circuit of the circuit structure 10.
[0034] The circuit structure 10 of this embodiment includes three conductive plates 11. The number of conductive plates 11 is the same as the number of power terminals 12, and each conductive plate 11 is electrically connected to each power terminal 12 in a one-to-one relationship. Additionally, the circuit structure 10 of this embodiment includes ten control terminals 13. The number of control terminals 13 is the same as the number of electronic components 14, and each control terminal 13 is electrically connected to each electronic component 14 in a one-to-one relationship. Furthermore, the number of each of the conductive plates 11, power terminals 12, control terminals 13, and electronic components 14 is arbitrary and can be freely changed.
[0035] The conductive plate 11 is manufactured by stamping a metal plate into a predetermined shape and is also called a busbar. The conductive plate 11 is preferably a copper component, such as pure copper or a copper alloy. The conductive plate 11 is entirely conductive, and no wiring pattern as is typically found on a printed circuit board is formed there. As a plurality of conductive plates 11, the circuit structure 10 of this embodiment includes a first conductive plate 111, a second conductive plate 112, and a third conductive plate 113.
[0036] A first conductive plate 111 is disposed at the foremost side and extends in the left-right direction. A second conductive plate 112 is disposed at a distance from the rear side of the first conductive plate 111 and extends in the left-right direction. Multiple recesses 112a are formed at intervals in the left-right direction on both the front and rear sides of the second conductive plate 112, respectively. (See also...) Figure 3 In this embodiment, five recesses 112a are formed on the front and rear sides of the second conductive plate 112, respectively.
[0037] The third conductive plate 113 has a conductive main body portion 113a extending in the left-right direction and a conductive extension portion 113b extending forward from the left end of the conductive main body portion 113a. The conductive main body portion 113a is disposed with a gap at the rear side of the second conductive plate 112. The front portion of the conductive extension portion 113b is formed to the left side of the first conductive plate 111. The conductive extension portion 113b is disposed with a gap at the left side of the first conductive plate 111 and the second conductive plate 112. Furthermore, the shapes of the first conductive plate 111, the second conductive plate 112, and the third conductive plate 113 are not limited to the shapes of this embodiment. For example, the third conductive plate 113 may be composed only of the conductive main body portion 113a.
[0038] The power terminal 12 is manufactured by stamping metal wire into a predetermined shape. The power terminal 12 is a metal terminal. The power terminal 12 is preferably a copper component, such as pure copper or a copper alloy. The power terminal 12 is electrically connected to the conductive plate 11 via the conductive film 20 described later, and supplies power from the conductive plate 11 to a control substrate (not shown).
[0039] The circuit structure 10 of this embodiment includes a first power terminal 121, a second power terminal 122, and a third power terminal 123, which serve as multiple power terminals 12. The first power terminal 121 is disposed on the left side of the first conductive plate 111. The second power terminal 122 is disposed on the left side of the second conductive plate 112. The third power terminal 123 is disposed on the right side of the conductive extension 113b of the third conductive plate 113.
[0040] The control terminal 13 is manufactured by stamping a metal wire into a predetermined shape. The control terminal 13 is a metal terminal. Preferably, the control terminal 13 is a copper component, such as pure copper or a copper alloy. In this embodiment, a plurality of control terminals 13 are respectively disposed in recesses 112a on the front and rear sides of the second conductive plate 112. The plurality of control terminals 13 extend downward and are electrically connected to the control substrate.
[0041] Electronic component 14 is a semiconductor relay, such as a field-effect transistor (FET). In the following description, the case where electronic component 14 is a field-effect transistor will be described, and the field-effect transistor will be referred to as "FET". A plurality of FETs 14 are placed on the first conductive plate 111 and the third conductive plate 113 with spacing in the left-right direction.
[0042] Each FET14 has multiple terminals. For example... Figure 2 As shown in the enlarged view, each FET14 has multiple (four in the example) source terminals 14a, one gate terminal 14b, and one drain terminal 14c (see also [reference]). Figure 3 The source terminal 14a is electrically connected to the second conductive plate 112 via solder or the like. The gate terminal 14b is electrically connected to the control terminal 13 via solder or the like. The drain terminal 14c is electrically connected to the first conductive plate 111 or the third conductive plate 113 via solder or the like. Furthermore, the electronic component 14 can also be a component other than a field-effect transistor, for example, it can be a mechanical relay, etc.
[0043] The retaining member 15 is made of a thermoplastic resin. The retaining member 15 may be made of, for example, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), nylon, PP (polypropylene), PE (polyethylene), etc., and has insulating properties. In this embodiment, the retaining member 15 is made of PPS. The retaining member 15 is formed by injection molding. In this embodiment, the retaining member 15 is manufactured by insert molding, in which the conductive plate 11, power terminal 12, and control terminal 13 are disposed in an injection molding mold (not shown). Thus, the retaining member 15 retains the conductive plate 11, power terminal 12, and control terminal 13. The conductive plate 11, power terminal 12, control terminal 13, and retaining member 15 are integrally formed inserts.
[0044] [Showing face]
[0045] The conductive plate 11 has an exposed surface (first exposed surface) that protrudes from the holding member 15. Specifically, the first conductive plate 111 has an exposed surface 111b that protrudes upward from the holding member 15. A portion of the first conductive plate 111, excluding the exposed surface 111b (the portion lower than the exposed surface 111b), is embedded in the holding member 15. A predetermined number (five in the example) of FETs 14 are placed at the exposed surface 111b. The second conductive plate 112 has an exposed surface 112c that protrudes upward from the holding member 15. A portion of the second conductive plate 112, excluding the exposed surface 112c (the portion lower than the exposed surface 112c), is embedded in the holding member 15.
[0046] The third conductive plate 113 has an exposed surface 113d that protrudes upward from the holding member 15. The exposed surface 113d has a main body exposed surface 113e that protrudes from the holding member 15 at the conductive main body portion 113a and an extended exposed surface 113f that protrudes from the holding member 15 at the conductive extension portion 113b. A portion of the third conductive plate 113 other than the exposed surface 113d (the portion lower than the exposed surface 113d) is embedded in the holding member 15. A remaining predetermined number (five in the example) of FETs 14 are placed at the exposed surface 113d.
[0047] Figure 3 This is an enlarged top view showing the periphery of power terminal 12. Figure 3 In this configuration, the power terminal 12 has an exposed surface (second exposed surface) that protrudes from the holding member 15. Specifically, the first power terminal 121 has an exposed surface 121a that protrudes upward from the holding member 15. The second power terminal 122 has an exposed surface 122a that protrudes upward from the holding member 15. The third power terminal 123 has an exposed surface 123a that protrudes upward from the holding member 15. A portion of each power terminal 121, 122, 123, excluding the exposed surfaces 121a, 122a, 123a (the portion lower than the exposed surfaces 121a, 122a, 123a), is embedded in the holding member 15.
[0048] [Incision site]
[0049] At the left end of the first conductive plate 111, a cutout 111a is formed to surround the exposed surface 121a of the first power terminal 121. In this embodiment, the cutout 111a is concave with an opening on the left side. At the left rear corner of the second conductive plate 112, a cutout 112b is formed to surround the exposed surface 122a of the second power terminal 122. In this embodiment, the cutout 112b is L-shaped with openings on the rear and left sides. At the right end of the conductive extension 113b of the third conductive plate 113, a cutout 113c is formed to surround the exposed surface 123a of the third power terminal 123. In this embodiment, the cutout 113c is concave with an opening on the right side.
[0050] [Insulation section]
[0051] exist Figure 2 and Figure 3 In this structure, the retaining member 15, serving as an insulating portion to insulate the exposed surfaces of adjacent conductive plates 11 from each other, has a first insulating portion 15a, a second insulating portion 15b, and a third insulating portion 15c. The first insulating portion 15a is located between the exposed surface 111b of the first conductive plate 111 and the exposed surface 112c of the second conductive plate 112, insulating the two exposed surfaces 111b and 112c from each other. The second insulating portion 15b is located between the exposed surface 112c of the second conductive plate 112 and the main body exposed surface 113e of the third conductive plate 113, insulating the two exposed surfaces 112c and 113e from each other.
[0052] The third insulating portion 15c is located between the extended exposed surface 113f of the third conductive plate 113 and the exposed surfaces 111b and 112c of the first conductive plate 111 and the second conductive plate 112, thereby insulating the extended exposed surface 113f from the exposed surfaces 111b and 112c. The third insulating portion 15c is connected to the left ends of the first insulating portion 15a and the second insulating portion 15b.
[0053] exist Figure 3 In this part, as an insulating part that insulates the exposed surfaces of the conductive plate 11 and the power terminal 12 from each other, the retaining member 15 has a fourth insulating part 15d, a fifth insulating part 15e and a sixth insulating part 15f.
[0054] The fourth insulating portion 15d is located between the exposed surface 111b of the first conductive plate 111 and the exposed surface 121a of the first power terminal 121, thus insulating the two exposed surfaces 111b and 121a. In this embodiment, the fourth insulating portion 15d is continuously formed within the cutout 111a of the first conductive plate 111, on the front, right, and rear sides of the exposed surface 121a of the first power terminal 121. The fourth insulating portion 15d is connected to the third insulating portion 15c.
[0055] The fifth insulating portion 15e is located between the exposed surface 112c of the second conductive plate 112 and the exposed surface 122a of the second power terminal 122, thus insulating the two exposed surfaces 112c and 122a from each other. In this embodiment, the fifth insulating portion 15e is continuously formed within the cutout 112b of the second conductive plate 112, on the front and right sides of the exposed surface 122a of the second power terminal 122. The fifth insulating portion 15e is connected to the second insulating portion 15b and the third insulating portion 15c.
[0056] The sixth insulating portion 15f is located between the extended exposed surface 113f of the third conductive plate 113 and the exposed surface 123a of the third power terminal 123, thus insulating the two exposed surfaces 113f and 123a from each other. In this embodiment, the sixth insulating portion 15f is continuously formed in the cutout portion 113c of the third conductive plate 113, on the front, left, and rear sides of the exposed surface 123a of the third power terminal 123. The sixth insulating portion 15f is connected to the third insulating portion 15c.
[0057] The upper surfaces of the first insulating portions 15a to 15c and the upper surfaces of the fourth insulating portions 15d to 15f (facing surfaces opposite to the conductive film 20 described later) are arranged on the same plane. Furthermore, the exposed surfaces 111b, 112c, 113d of the conductive plate 11 and the exposed surfaces 121a, 122a, 123a of the power terminals 12 are arranged on the same plane as the upper surfaces of the insulating portions 15a to 15f of the retaining member 15 (see also...). Figure 1 ).
[0058] [Conductive film]
[0059] The circuit structure 10 includes a plurality of conductive films 20 that electrically connect the conductive plate 11 to the power supply terminal 12. The conductive films 20 are formed, for example, by vacuum evaporation. In this embodiment, the conductive film 20 is a metal film formed by stacking a nickel plating layer on a copper plating layer. As a plurality of conductive films 20, the circuit structure 10 of this embodiment includes a first conductive film 21, a second conductive film 22, and a third conductive film 23.
[0060] The first conductive film 21 electrically connects the first conductive plate 111 to the first power terminal 121. Specifically, the first conductive film 21 is formed in such a way that it covers a portion (left end) of the exposed surface 111b of the first conductive plate 111 and a portion (front end) of the exposed surface 121a of the first power terminal 121 across the fourth insulating portion 15d.
[0061] The second conductive film 22 electrically connects the second conductive plate 112 to the second power terminal 122. Specifically, the second conductive film 22 is formed in such a way that it covers a portion (left end) of the exposed surface 112c of the second conductive plate 112 and a portion (front end) of the exposed surface 122a of the second power terminal 122 across the fifth insulating portion 15e.
[0062] The third conductive film 23 electrically connects the third conductive plate 113 to the third power terminal 123. Specifically, the third conductive film 23 is formed in such a way that it covers a portion (right end) of the extended exposed surface 113f of the third conductive plate 113 and a portion (left end) of the exposed surface 123a of the third power terminal 123 across the sixth insulating portion 15f.
[0063] [Regarding the effect]
[0064] According to the circuit structure 10 of this embodiment, the exposed surfaces 111b, 112c, and 113d of the conductive plate 11 exposed from the holding member 15 and the exposed surfaces 121a, 122a, and 123a of the power terminal 12 exposed from the holding member 15 are covered by a conductive film 20 spanning the insulating portions 15d, 15e, and 15f, thereby electrically connecting the conductive plate 11 and the power terminal 12 by the conductive film 20. Therefore, it is unnecessary to form a pressing surface for soldering at the power terminal 12, thus reducing the size of the exposed surfaces 121a, 122a, and 123a of the power terminal 12. As a result, the enlargement of the circuit structure 10 can be suppressed.
[0065] By embedding molding, a portion of the conductive plate 11, excluding the exposed surfaces 111b, 112c, and 113d, is embedded in the retaining member 15, and a portion of the power terminal 12, excluding the exposed surfaces 121a, 122a, and 123a, is also embedded in the retaining member 15. This allows for the easy formation of the exposed surfaces 111b, 112c, and 113d of the conductive plate 11 and the exposed surfaces 121a, 122a, and 123a of the power terminal 12.
[0066] At the conductive plate 11, cutouts 111a, 112b, and 113c are formed to surround the exposed surfaces 121a, 122a, and 123a of the power terminal 12. Therefore, compared to forming holes around the power terminal 12 at the conductive plate 11, it is possible to suppress the conductive plate 11 from heating up due to high current.
[0067] The conductive film 20 is a metal-plated film, so it can be easily formed. Furthermore, by making the conductive film 20 a metal-plated film, other electronic components can be mounted onto the conductive film 20.
[0068] The exposed surfaces 111b, 112c, and 113d of the conductive plate 11, the exposed surfaces 121a, 122a, and 123a of the power terminal 12, and the upper surfaces of the insulating portions 15d, 15e, and 15f are arranged on the same plane, so the conductive film 20 can be easily formed.
[0069] [other]
[0070] In this embodiment, the conductive film 20 covers a portion of the exposed surfaces (first exposed surfaces) 111b, 112c, and 113d of the conductive plate 11, but it may also cover the entire exposed surfaces 111b, 112c, and 113d. Similarly, the conductive film 20 covers a portion of the exposed surfaces (second exposed surfaces) 121a, 122a, and 123a of the power terminal 12, but it may also cover the entire exposed surfaces 121a, 122a, and 123a. The conductive film 20 in this embodiment is formed by vacuum evaporation, but it is not limited to this method; it may also be formed by, for example, sputtering or printing.
[0071] It should be considered that the embodiments disclosed herein are exemplary in all respects and not restrictive. The scope of the invention is defined not by the foregoing meaning but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.
[0072] Explanation of reference numerals in the attached figures
[0073] 10 Circuit Structure
[0074] 11. Conductive plate (first conductive component)
[0075] 12 Power terminal (second conductive component)
[0076] 13 Control Terminals
[0077] 14 FET (Electronic Component)
[0078] 14a source terminal
[0079] 14b gate terminal
[0080] 14c leaky end polarity
[0081] 15 Retaining components
[0082] 15a First Insulation Section
[0083] 15b Second Insulation Section
[0084] 15c Third Insulation Section
[0085] 15d Fourth Insulation Section (Insulation Section)
[0086] 15e Fifth Insulation Section (Insulation Section)
[0087] 15f Sixth Insulation Section (Insulation Section)
[0088] 20 Conductive film
[0089] 21 First conductive film
[0090] 22 Second conductive film
[0091] 23 Third conductive film
[0092] 111 First conductive plate
[0093] 111a Incision site
[0094] 111b First Exposure
[0095] 112 Second conductive plate
[0096] 112a recess
[0097] 112b Incision area
[0098] 112c Exposed Surface (First Exposed Surface)
[0099] 113 Third conductive plate
[0100] 113a Conductive main body
[0101] 113b Conductive extension
[0102] 113c Incision area
[0103] 113d Exposed Surface (First Exposed Surface)
[0104] 113e Main body exposed surface
[0105] 113f Extended exposure surface
[0106] 121 First power terminal
[0107] 121a Exposed surface (second exposed surface)
[0108] 122 Second power terminal
[0109] 122a Exposed surface (second exposed surface)
[0110] 123 Third power terminal
[0111] 123a Exposed surface (second exposed surface).
Claims
1. A circuit structure comprising: First conductive component; Second conductive component; and An insulating retaining component holds the first conductive component and the second conductive component together. The first conductive component has a first exposed surface that protrudes from the retaining component. The second conductive component has a second exposed surface that protrudes from the retaining component. The retaining member has an insulating portion located between the first exposed surface and the second exposed surface. The circuit structure includes a conductive film that covers at least a portion of the first exposed surface and at least a portion of the second exposed surface across the insulating portion. The first conductive component has a cutout formed by being cut away in a manner that surrounds the second exposed surface.
2. The circuit structure according to claim 1, wherein, A portion of the first conductive component, excluding the first exposed surface, is embedded in the retaining component. A portion of the second conductive component, excluding the second exposed surface, is embedded in the retaining component.
3. The circuit structure according to claim 1, wherein, The conductive film is a metal coating.
4. The circuit structure according to claim 2, wherein, The conductive film is a metal coating.
5. The circuit structure according to any one of claims 1 to 4, wherein, The first exposed surface and the second exposed surface are configured to be on the same plane as the opposing surface of the insulating portion that faces the conductive film.
Citation Information
Patent Citations
Circuit structure
JP2019096769A
Wireless communications device, production method therefor, and resin molded body
WO2017141771A1