Electronic devices and electronic equipment

Abstract

The application provides an electronic device and an electronic equipment. The electronic device comprises a vibrating electrode and a plurality of release structures. The vibrating electrode comprises a ring-shaped supporting part and an elastic part. The elastic part is connected to a hollow area of the ring-shaped supporting part. The release structures are arranged on the elastic part and communicate with both side surfaces of the vibrating electrode. The gas in the cavities on both sides of the vibrating electrode can flow, and the influence of air damping on the electronic device is reduced. The release structures are distributed on the elastic part, and the stress generated by the elastic part during vibration can be balanced, and the structure of the vibrating electrode is ensured to be complete.

Description

Technical Field

[0001] This application belongs to the field of sensing technology, specifically, it relates to an electronic device and an electronic device. Background Technology

[0002] Vibration sensors and other electronic devices are used to convert vibration signals into electrical signals. Taking bone conduction sensors as an example, a bone conduction sensor is a sensor that uses the vibration of a diaphragm to drive airflow and detect the flow signal. Traditional bone conduction sensors typically include a vibration system and a microphone assembly. The vibration system senses external vibration information, and the microphone assembly converts the airflow changes generated during vibration into electrical signals, thereby expressing the vibration information.

[0003] A vibration system typically includes a diaphragm and a mass block mounted on the diaphragm. However, the mass block has a relatively large mass, which means that the impact generated by the mass block on the diaphragm during vibration is also relatively large. This can easily generate large stress on the diaphragm, causing damage to the diaphragm, seriously affecting the sensitivity and frequency response of the vibration sensor, and reducing the reliability and lifespan of the vibration sensor product. Summary of the Invention

[0004] One objective of this application is to provide a new technical solution for electronic devices and electronic equipment.

[0005] According to a first aspect of the embodiments of this application, an electronic device is provided, comprising:

[0006] A vibrating electrode, comprising an annular support portion and an elastic portion, wherein the elastic portion is connected to the hollow region of the annular support portion;

[0007] Multiple release structures are disposed on the elastic part and communicate with both sides of the vibrating electrode. The multiple release structures are distributed on the elastic part to release the stress on the elastic part.

[0008] Optionally, the release structure is a through hole penetrating the elastic portion.

[0009] Optionally, the release structure is a linear slit that extends through the elastic portion.

[0010] Optionally, the release structure is a notch in the elastic portion near the edge of the annular support portion.

[0011] Optionally, it also includes a mass block connected to the middle region on one side of the elastic part, and the release structure is disposed adjacent to the mass block.

[0012] Optionally, the plurality of release structures form a ring structure, and the ring structure is concentrically arranged with the elastic part.

[0013] Optionally, the vibration electrode is a capacitive electrode, a piezoelectric electrode, a piezoresistive electrode, or a magnetic induction electrode.

[0014] Optionally, it also includes a fixed electrode, wherein the annular support portion is disposed at a distance from the fixed electrode by means of an insulating washer.

[0015] Optionally, the electronic device is a vibration sensor, and the vibration sensor further includes:

[0016] A housing having an opening;

[0017] A circuit board, the circuit board being disposed on the opening;

[0018] The annular support portion is fixed inside the housing and electrically connected to the circuit board;

[0019] The fixed electrode is disposed in the housing and located between the vibration electrode and the circuit board, and the fixed electrode is provided with a first connection channel;

[0020] There is a first cavity between the fixed electrode and the circuit board, a second cavity between the vibrating electrode and the fixed electrode, and a third cavity between the vibrating electrode and the housing;

[0021] The first connection channel connects the first cavity and the second cavity, and the release structure connects the second cavity and the third cavity.

[0022] Optionally, the fixed electrode is provided with a first connection channel, and the release structure is opposite to the first connection channel.

[0023] Optionally, the fixed electrode is provided with a first connection channel, and the release structure is offset from the first connection channel.

[0024] Optionally, it further includes an insulating support ring disposed between the fixed electrode and the circuit board, and the insulating support ring surrounds the first cavity.

[0025] Optionally, the vibrating electrode is provided with a second connection channel, and the mass block is provided with a first through hole, the first through hole being opposite to the second connection channel.

[0026] Optionally, the electronic device is a MEMS chip.

[0027] According to a second aspect of the embodiments of this application, an electronic device is provided, including the electronic device described in the first aspect.

[0028] One technical advantage of this application is:

[0029] This application provides an electronic device comprising a vibrating electrode and multiple release structures. The vibrating electrode includes an annular support portion and an elastic portion, with the elastic portion connected to the hollow region of the annular support portion. The release structures, disposed on the elastic portion and communicating with both sides of the vibrating electrode, ensure gas flow through the cavities on both sides of the vibrating electrode in the electronic device, reducing the impact of air damping on the electronic device. Furthermore, the multiple release structures distributed on the elastic portion can balance the stress generated by the elastic portion during vibration, ensuring the structural integrity of the vibrating electrode and improving the sensitivity and frequency response of the electronic device.

[0030] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0032] Figure 1 A schematic diagram of a vibration sensor provided in an embodiment of this application;

[0033] Figure 2 A schematic diagram of a MEMS chip provided in an embodiment of this application;

[0034] Figure 3 A schematic diagram of the interaction between a vibration electrode and a release structure in an electronic device provided in this application embodiment. Figure 1 ;

[0035] Figure 4 A schematic diagram of the interaction between a vibration electrode and a release structure in an electronic device provided in this application embodiment. Figure 2 .

[0036] in:

[0037] 1. Housing; 11. Opening; 12. Second through hole; 2. Circuit board; 21. Signal processing unit; 3. Fixed electrode; 31. First connection channel; 4. Vibrating electrode; 401. Annular support part; 402. Elastic part; 41. Second connection channel; 5. Insulating support ring; 6. Metal ring; 7. Insulating washer; 8. Support structure; 9. Mass block; 91. First through hole; 10. Solder pad; 104. Solder joint;

[0038] 100. Release structure;

[0039] 101. First cavity; 102. Second cavity; 103. Third cavity. Detailed Implementation

[0040] Various exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application.

[0041] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0043] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0045] Reference Figure 1 This application provides an electronic device, which includes:

[0046] Vibrating electrode 4 and multiple release structures 100.

[0047] See Figure 3 and Figure 4 The vibration electrode 4 includes an annular support portion 401 and an elastic portion 402. The elastic portion 402 is connected to the hollow area of ​​the annular support portion 401, meaning that the elastic portion 402 can be suspended to ensure its flexibility during vibration. Furthermore, the vibration signal generated by the elastic portion 402 during vibration can be converted into an electrical signal and transmitted externally through the annular support portion 401.

[0048] See Figure 1 The release structure 100 is disposed on the elastic part 402 and communicates with both sides of the vibration electrode 4. A plurality of the release structures 100 are distributed on the elastic part 402 to release the stress on the elastic part 402.

[0049] Specifically, the vibration electrode 4 will cause changes in air pressure on both sides of the vibration electrode 4 during the vibration process. That is, when the air pressure on one side of the vibration electrode 4 increases, the air pressure on the other side will change less. After the release structure 100 is disposed on the elastic part 402 and connects the two sides of the vibration electrode 4, it can ensure the gas flow in the cavity on both sides of the vibration electrode 4 in the electronic device and reduce the impact of air damping on the electronic device.

[0050] Furthermore, the multiple release structures 100 can be evenly distributed on the elastic part 402, which can balance the stress generated by the elastic part 402 during vibration, ensure the structural integrity of the vibration electrode 4, improve the sensitivity and frequency response of the electronic device, and ensure the reliability and service life of the electronic device.

[0051] The electronic device provided in this application embodiment includes a vibrating electrode 4 and multiple release structures 100. The vibrating electrode 4 includes an annular support portion 401 and an elastic portion 402, with the elastic portion 402 connected to the hollow region of the annular support portion 401. The release structures 100 are disposed on the elastic portion 402 and communicate with both sides of the vibrating electrode 4, ensuring gas flow through the cavities on both sides of the vibrating electrode 4 in the electronic device, reducing the impact of air damping on the electronic device. Furthermore, the multiple release structures 100 distributed on the elastic portion 402 can balance the stress generated by the elastic portion 402 during vibration, ensuring the structural integrity of the vibrating electrode 4 and improving the sensitivity and frequency response of the electronic device.

[0052] Optionally, see Figure 3 The release structure 100 is a through hole penetrating the elastic part 402.

[0053] Specifically, the release structure 100 can be a circular hole, an elliptical hole, or a polygonal hole that penetrates the elastic part 402. When multiple release structures 100 are distributed at equal intervals on the elastic part 402, the shapes of the multiple release structures 100 can be different. For example, some release structures 100 are circular holes, some release structures 100 are elliptical holes, and the remaining release structures 100 are triangular holes.

[0054] When the release structure 100 is a through hole penetrating the elastic part 402, it can release the stress on the elastic part 402 while avoiding the impact on the integrity of the edge structure of the elastic part 402, thus ensuring the mechanical strength of the elastic part 402.

[0055] Optionally, the release structure 100 is a linear slit that passes through the elastic portion 402.

[0056] Specifically, the release structure 100 can be a curved or zigzag slit that runs through the elastic part 402, so as to release the stress on the elastic part 402 while avoiding excessive occupation of the space on the elastic part 402 and ensuring the structural integrity of the elastic part 402.

[0057] Optionally, see Figure 4 The release structure 100 is a notch in the elastic part 402 near the edge of the annular support part 401.

[0058] Specifically, the release structure 100 is an arc-shaped notch, square notch, or triangular notch near the edge of the annular support portion 401 in the elastic portion 402. When the release structure 100 is a notch near the edge of the annular support portion 401 in the elastic portion 402, it can release the stress on the elastic portion 402 while increasing the vibration amplitude of the elastic portion 402, so that the electronic device can obtain a larger amount of sensing signal change and improve the sensitivity of the electronic device.

[0059] Optionally, see Figure 2 The electronic device also includes a mass block 9, which is connected to the middle region on one side of the elastic part 402, and the release structure 100 is disposed adjacent to the mass block 9.

[0060] Specifically, when the mass block 9 is connected to the middle region on one side of the elastic part 402, the large mass of the mass block 9 allows it to drive the elastic part 402 to vibrate during vibration, thereby increasing the vibration amplitude of the vibration electrode 4. The release structure 100 is arranged adjacent to the mass block 9, which can not only release the stress on the elastic part 402, but also better adjust the gas damping around the vibration electrode 4 to improve the sensitivity and frequency response of the electronic device.

[0061] Optionally, see Figure 3 and Figure 4 The multiple release structures 100 are arranged in a ring structure, and the ring structure is concentrically arranged with the elastic part 402.

[0062] Specifically, when multiple release structures 100 are arranged in an array-shaped ring structure, the multiple release structures 100 can be designed to be centrally symmetrical. For example, the multiple release structures 100 are equidistant from the central axis of the elastic part 402, so that the ring structure and the elastic part 402 are concentrically arranged, that is, the ring structure and the central axis of the elastic part 402 coincide, so as to balance the stress generated by the elastic part 402 during vibration and ensure the structural integrity of the vibration electrode 4.

[0063] Optionally, the vibration electrode 4 is a capacitive electrode, a piezoelectric electrode, a piezoresistive electrode, or a magnetic induction electrode.

[0064] Specifically, when the vibrating electrode 4 is a capacitive electrode, a capacitive gap can be formed between the vibrating electrode 4 and the fixed electrode, so that when the vibrating electrode 4 vibrates, a capacitive signal is generated through the changing capacitive gap, thereby realizing the signal sensing of the electronic device.

[0065] When the vibration electrode 4 is a piezoelectric electrode, piezoresistive electrode, or magnetic induction electrode, the vibration electrode 4 can vibrate upon receiving a voltage or magnetic field signal to achieve signal sensing of the electronic device.

[0066] Optionally, the electronic device further includes a fixed electrode 3, and the annular support portion 401 is disposed at a distance from the fixed electrode 3 by means of an insulating washer 7.

[0067] Specifically, when the insulating washer 7 is disposed between the vibrating electrode 4 and the fixed electrode 3, the insulating washer 7 can form a cavity between the vibrating electrode 4 and the fixed electrode 3 while ensuring mutual insulation between them, so as to provide vibration space for the vibrating electrode 4 and ensure the signal stability of the electronic device.

[0068] Optionally, see Figure 1 The electronic device is a vibration sensor, and the vibration sensor further includes:

[0069] The housing 1 and the circuit board 2 are provided. The housing 1 has an opening 11 and the circuit board 2 is disposed on the opening 11 so that the electronic device can be connected to the outside through the circuit board 2.

[0070] The annular support 401 is fixed inside the housing 1 and electrically connected to the circuit board 2. The elastic part 402 is connected to the hollow area of ​​the annular support 401, which means that the elastic part 402 can be suspended inside the housing 1 to ensure the flexibility of the elastic part 402 during vibration.

[0071] The fixed electrode 3 is disposed in the housing 1 and located between the vibration electrode 4 and the circuit board 2, and the fixed electrode 3 is provided with a first connection channel 31;

[0072] The fixed electrode 3 and the circuit board 2 have a first cavity 101, the vibrating electrode 4 and the fixed electrode 3 have a second cavity 102, and the vibrating electrode 4 and the housing 1 have a third cavity 103.

[0073] The first connection channel 31 connects the first cavity 101 and the second cavity 102, and the release structure 100 connects the second cavity 102 and the third cavity 103.

[0074] In one embodiment, see Figure 2 The electronic device is a MEMS chip, specifically, the fixed electrode 3 and the vibration electrode 4 form a MEMS chip with variable capacitance. The size of the MEMS chip is much smaller than the size of the vibration sensor. When the vibration electrode 4 vibrates, a capacitance signal can be generated through the changing capacitance gap to realize the signal sensing of the MEMS chip.

[0075] After the first connection channel 31 and the release structure 100 connect the first cavity 101, the second cavity 102 and the third cavity 103, the gas flow in each cavity of the electronic device can be guaranteed, the influence of air damping on the electronic device can be reduced, the sensitivity and frequency response of the electronic device can be improved, and the reliability and service life of the electronic device can be guaranteed.

[0076] Optionally, the fixed electrode 3 is provided with a first connection channel 31, and the release structure 100 is opposite to the first connection channel 31.

[0077] Specifically, when the first connection channel 31 is opposite to the release structure 100, it can accelerate the ventilation rate between the first cavity 101, the second cavity 102 and the third cavity 103, reduce the influence of air damping in each cavity on ventilation, and improve the sensitivity of the electronic device.

[0078] In addition, the number of the first connecting channels 31 can be equal to the number of the release structures 100. For example, when there is only one first connecting channel 31 and one release structure 100, the flow cross-sectional area of ​​the first connecting channel 31 and the release structure 100 can be equal, so that the first connecting channel 31 and the release structure 100 are completely opposite to each other; or the flow cross-sectional area of ​​the first connecting channel 31 and the release structure 100 can be unequal, but the first connecting channel 31 and the release structure 100 are concentrically arranged.

[0079] When there are multiple first connection channels 31 and multiple release structures 100, the multiple first connection channels 31 and multiple release structures 100 can be paired one-to-one.

[0080] Optionally, see Figure 1 The fixed electrode 3 is provided with a first connection channel 31, and the release structure 100 is offset from the first connection channel 31.

[0081] Specifically, when the first connection channel 31 is misaligned with the release structure 100, the air damping between the first cavity 101, the second cavity 102 and the third cavity 103 can be used to adjust the frequency response of the electronic device, thereby optimizing the FR performance of the electronic device.

[0082] In addition, the number of the first connecting channels 31 can be equal to the number of the release structures 100. For example, when there is only one first connecting channel 31 and one release structure 100, the flow cross-sectional area of ​​the first connecting channel 31 and the release structure 100 can be equal or unequal. However, some areas of the first connecting channel 31 and the release structure 100 are not opposite each other and thus form a misalignment.

[0083] In addition, the number of the first connection channels 31 and the number of the release structures 100 may be different. For example, the number of the first connection channels 31 may be greater than the number of the release structures 100, some of the first connection channels 31 may be completely misaligned with the release structures 100, and the remaining part of the first connection channels 31 may be partially misaligned with the release structures 100; or all of the first connection channels 31 may be completely misaligned with the release structures 100.

[0084] Optionally, the electronic device further includes an insulating support ring 5, which is disposed between the fixed electrode 3 and the circuit board 2, and the insulating support ring 5 forms the first cavity 101.

[0085] Specifically, the electronic device further includes a metal ring 6, which is disposed inside the insulating support ring 5 and is used to conduct electricity between the fixed electrode 3 and the circuit board 2; in addition, the electronic device further includes a signal processing unit 21, which is disposed on the circuit board 2 and is used to process the signal transmitted from the fixed electrode 3 to the circuit board 2.

[0086] Optionally, the insulating washer 7 is disposed between the vibrating electrode 4 and the fixed electrode 3, and the insulating washer 7 forms the second cavity 102. The insulating washer 7 can ensure mutual insulation between the vibrating electrode 4 and the fixed electrode 3, so as to form a reliable capacitance gap between the vibrating electrode 4 and the fixed electrode 3, and ensure the signal stability of the electronic device.

[0087] Optionally, the electronic device further includes a support structure 8 disposed between the vibrating electrode 4 and the housing 1, and the support structure 8 forming a third cavity 103. The release structure 100 connects the second cavity 102 and the third cavity 103, which can reduce the influence of air damping on sensitivity in the electronic device by increasing the volume of the connected cavity.

[0088] Optionally, see Figure 1 The vibrating electrode 4 is provided with a second connection channel 41, and the mass block 9 is provided with a first through hole 91, which is opposite to the second connection channel 41.

[0089] The first through hole 91 is opposite to the second connecting channel 41. The flow cross-sectional areas of the first through hole 91 and the second connecting channel 41 can be equal, so that the first through hole 91 and the second connecting channel 41 are completely opposite; or the flow cross-sectional areas of the first through hole 91 and the second connecting channel 41 can be equal or unequal, but the first through hole 91 and the second connecting channel 41 are concentrically arranged.

[0090] After the first through hole 91 is aligned with the second connecting channel 41, the stable connection between the second cavity 102 and the third cavity 103 can be ensured.

[0091] Optionally, when the electronic device is a vibration sensor, the vibration sensor may specifically be a bone conduction sensor; when the electronic device is a MEMS chip, a MEMS microphone or a MEMS speaker may be formed by assembling the MEMS chip.

[0092] The housing 1 is provided with a second through hole 12 leading to the outside of the electronic device to ensure that the electronic device is exposed to air during SMT placement; when the electronic device is put into use, the second through hole 12 can be sealed to prevent external signals from interfering with the electronic device.

[0093] Additionally, see Figure 1 The electronic device also includes a pad 10, which is disposed on the side of the circuit board 2 away from the first cavity 101 and is used to close the opening 11 to ensure the airtightness of the electronic device.

[0094] Furthermore, the pad 10 is provided with at least one solder point 104 to facilitate the soldering of external components to the circuit board 2; when the pad 10 is provided with multiple solder points 104, the multiple solder points 104 can be separated by insulating material to achieve mutual insulation.

[0095] This application also provides an electronic device, which includes the aforementioned electronic components.

[0096] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. An electronic device, characterized in that, include: Vibrating electrode (4), the vibrating electrode (4) includes an annular support portion (401) and an elastic portion (402), the elastic portion (402) being connected to the hollow region of the annular support portion (401); Multiple release structures (100) are disposed on the elastic part (402) and connected to both sides of the vibration electrode (4). The multiple release structures (100) are distributed on the elastic part (402) and separated from the annular support part (401) for releasing stress on the elastic part (402). Multiple release structures (100) are equally spaced on the elastic part (402) and form a ring structure, the ring structure being concentrically arranged with the elastic part (402).

2. The electronic device according to claim 1, characterized in that, The release structure (100) is a through hole that penetrates the elastic part (402).

3. The electronic device according to claim 1, characterized in that, The release structure (100) is a linear slit that penetrates the elastic part (402).

4. The electronic device according to claim 1, characterized in that, The release structure (100) is a notch in the elastic part (402) near the edge of the annular support part (401).

5. The electronic device according to claim 1, characterized in that, It also includes a mass block (9), which is connected to the middle region on one side of the elastic part (402), and the release structure (100) is disposed adjacent to the mass block (9).

6. The electronic device according to claim 1, characterized in that, The vibrating electrode (4) is a capacitive electrode, a piezoelectric electrode, a piezoresistive electrode, or a magnetic induction electrode.

7. The electronic device according to claim 1, characterized in that, It also includes a fixed electrode (3), and the annular support (401) is arranged at a distance from the fixed electrode (3) by means of an insulating washer (7).

8. The electronic device according to claim 7, characterized in that, The electronic device is a vibration sensor, and the vibration sensor further includes: The housing (1) has an opening (11). Circuit board (2), said circuit board (2) is disposed on said opening (11); The annular support (401) is fixed inside the housing (1) and electrically connected to the circuit board (2); The fixed electrode (3) is disposed in the housing (1) and located between the vibration electrode (4) and the circuit board (2). The fixed electrode (3) is provided with a first connection channel (31). There is a first cavity (101) between the fixed electrode (3) and the circuit board (2), a second cavity (102) between the vibrating electrode (4) and the fixed electrode (3), and a third cavity (103) between the vibrating electrode (4) and the housing (1). The first connection channel (31) connects the first cavity (101) and the second cavity (102), and the release structure (100) connects the second cavity (102) and the third cavity (103).

9. The electronic device according to claim 7, characterized in that, The fixed electrode (3) is provided with a first connection channel (31), and the release structure (100) is opposite to the first connection channel (31).

10. The electronic device according to claim 7, characterized in that, The fixed electrode (3) is provided with a first connection channel (31), and the release structure (100) is misaligned with the first connection channel (31).

11. The electronic device according to claim 8, characterized in that, It also includes an insulating support ring (5), which is disposed between the fixed electrode (3) and the circuit board (2), and the insulating support ring (5) forms the first cavity (101).

12. The electronic device according to claim 5, characterized in that, The vibration electrode (4) is provided with a second connection channel (41), and the mass block (9) is provided with a first through hole (91), the first through hole (91) being opposite to the second connection channel (41).

13. The electronic device according to claim 1, characterized in that, The electronic device is a MEMS chip.

14. An electronic device, characterized in that, Includes the electronic device as described in any one of claims 1-13.

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