An atomizing chip and an electronic cigarette

Abstract

The application discloses an atomizing chip and an electronic cigarette. The atomizing chip comprises a substrate, the substrate comprises a porous region and an edge region, and the porous region comprises a plurality of uniformly distributed through holes; a heating layer is located on one side of the substrate, and the heating layer covers the region of the substrate except the through holes; a contact electrode is located on the side of the heating layer away from the substrate, and is arranged on the region of the heating layer located in the edge region; and an insulating layer is located on the side of the heating layer away from the substrate, the insulating layer is arranged on the region of the heating layer where the contact electrode is not arranged, and the insulating layer covers the surface of the heating layer away from the substrate and the surface parallel to the side wall of the through hole. The application can improve the liquid storage capacity of the atomizing chip and prolong the service life of the atomizing chip.

Description

Technical Field

[0001] This invention relates to the field of atomization technology, and more particularly to an atomization chip and an electronic cigarette. Background Technology

[0002] Existing atomizers for electronic cigarettes mainly employ the following structure: a heater and a reservoir. Figure 1 This is a schematic diagram of the structure of a cotton wick atomizer in the prior art, for reference. Figure 1 The cotton wick atomizer includes a cotton wick 01, a heating wire 02, and a liquid storage area 03. The design using a liquid storage cotton wick requires the liquid storage cotton to have high temperature resistance. It is generally made of mineral wool, etc., but its liquid storage capacity is insufficient, and liquid often leaks out from the cotton wick. This atomizer design is a relatively early atomization chip design structure, but subsequent designs have all focused on optimizing the liquid storage and heating aspects. Figure 2 This is a schematic diagram of the structure of a ceramic atomizing core in the prior art, for reference. Figure 2 The ceramic atomizing core consists of porous ceramic (04), a nickel wire heating layer (05), and atomizing liquid (06). Based on the original design, the ceramic atomizing core addresses the liquid leakage problem caused by insufficient liquid adsorption by using a porous ceramic substrate instead of a cotton wick. This improvement significantly reduces leakage. However, with prolonged use, some solidified liquid will remain in the pores of the porous ceramic, leading to a decrease in its liquid storage capacity and an inability to replenish the liquid promptly. Furthermore, prolonged use results in severe internal oxidation of the atomizing chip, affecting its lifespan. Summary of the Invention

[0003] This invention provides an atomizing chip and an electronic cigarette to improve the liquid storage capacity of the atomizing chip and extend its service life.

[0004] According to one aspect of the present invention, an atomizing chip is provided, comprising:

[0005] The substrate includes a porous region and an edge region, and the porous region includes multiple uniformly distributed through holes;

[0006] A heating layer is located on one side of the substrate and covers the area of ​​the substrate except for the through holes;

[0007] The contact electrode is located on the side of the heating layer away from the substrate and is disposed in the area of ​​the heating layer located at the edge region;

[0008] An insulating layer is located on the side of the heating layer away from the substrate. The insulating layer is set in the area of ​​the heating layer where no contact electrode is provided, and the insulating layer covers the surface of the heating layer away from the substrate and the surface parallel to the sidewall of the through hole.

[0009] Optionally, the heating layer may be made of at least one of aluminum tantalum nitride, nickel-chromium alloy, tungsten, and cobalt.

[0010] Optionally, in aluminum tantalum nitride, the proportion of tantalum is 20%-80%, the proportion of aluminum is 0%-70%, and the proportion of nitrogen is 15%-40%.

[0011] In nickel-chromium alloys, the proportion of nickel is 10%-90%, and the proportion of chromium is 10%-90%.

[0012] Optionally, the thickness of the heating layer is 0.1-5 μm.

[0013] Optionally, the diameter of the through hole is 1-5 μm.

[0014] Optionally, the ratio of the pore spacing to the pore diameter in the porous region is between 1 and 2.

[0015] Optionally, the substrate material includes at least one of silicon, glass, silicon oxide, and ceramic.

[0016] Optionally, the insulating layer extends into the via and covers a portion of the sidewall of the via.

[0017] Optionally, the contact electrode material is gold or a multilayer alloy of aluminum, copper, nickel, palladium, and gold;

[0018] The insulating layer is made of at least one of polycrystalline silicon, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, ceramics, and composite materials.

[0019] According to another aspect of the present invention, an electronic cigarette is provided, including the atomizing chip described in any of the embodiments of the present invention.

[0020] The atomizing chip provided by this invention comprises a substrate including a porous region and an edge region. Multiple uniformly distributed through-holes are formed in the porous region of the substrate. A heating layer covers the area of ​​the substrate excluding the through-holes. Contact electrodes are disposed in the edge region of the heating layer. An insulating layer is disposed in the area of ​​the heating layer where no contact electrodes are located, and the insulating layer covers the surface of the heating layer away from the substrate and the surface parallel to the sidewalls of the through-holes. By forming multiple uniformly distributed through-holes on the substrate, the through-holes can utilize the capillary force of their inner walls to adsorb liquid, allowing for timely replenishment of new liquid and improving the liquid storage capacity of the atomizing chip. Furthermore, the insulating layer effectively isolates the heating layer from the atmospheric environment, extending the lifespan of the heating layer and thus improving the service life of the atomizing chip.

[0021] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 yes Figure 1 This is a schematic diagram of the structure of a cotton wick atomizer in the prior art;

[0024] Figure 2 This is a schematic diagram of the structure of a ceramic atomizing core in the prior art;

[0025] Figure 3 This is a schematic diagram of the structure of an atomizing chip provided in an embodiment of the present invention;

[0026] Figure 4 yes Figure 3 A schematic diagram of the cross-section of the atomizing chip along section line AA;

[0027] Figure 5 This is a schematic diagram of the structure of another atomizing chip provided in an embodiment of the present invention. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0030] This invention provides an atomizing chip. Figure 3 This is a schematic diagram of the structure of an atomizing chip provided in an embodiment of the present invention. Figure 4 yes Figure 3 A cross-sectional view of the atomizing chip along section line AA is shown in the diagram. (Refer to...) Figure 3 and Figure 4 The atomizing chip includes: a substrate 10, which includes a porous region 11 and an edge region 12, the porous region 11 including a plurality of uniformly distributed through holes 13; a heating layer 20, located on one side of the substrate 10, and covering the area of ​​the substrate 10 except for the through holes 13; a contact electrode 30, located on the side of the heating layer 20 away from the substrate 10, and disposed in the area of ​​the heating layer 20 located in the edge region 12; and an insulating layer 40, located on the side of the heating layer 20 away from the substrate 10, disposed in the area of ​​the heating layer 20 where the contact electrode 30 is not disposed, and covering the surface of the heating layer 20 away from the substrate 10 and the surface parallel to the sidewall of the through holes 13.

[0031] In the atomizing chip, the substrate 10 has a porous region 11 that has good liquid adsorption capacity. However, the morphology of porous ceramics in the prior art is irregular pores with uneven distribution of pore size and position. As the usage time increases, some solidified liquid will remain in the pores, causing pore blockage, which leads to a decrease in liquid storage capacity and service life. In the embodiment of the present invention, the thickness of the substrate 10 can be 150-450μm, and the material of the substrate 10 can be various heat-resistant materials such as silicon, glass, silicon oxide, and ceramics. By performing micro-nano processing on the substrate 10, multiple uniformly distributed through holes 13 are formed on the substrate 10. The through holes 13 can adsorb liquid using the capillary force of their inner walls, replenishing new liquid in time. At the same time, the capillary force can also prevent liquid seepage, achieving the function of effectively storing and releasing liquid. In addition, since the uniformity of the through holes 13 in the embodiment of the present invention is higher than that of the pores in porous ceramics, the service life of the substrate 10 in the embodiment of the present invention is also longer than that of porous ceramics.

[0032] The contact electrode 30 can be made of a metal with good passivation and conductivity, and the heating layer 20 can be made of a corrosion-resistant, high-resistivity metal material. For example, the heating layer 20 can be made of materials such as tantalum aluminum nitride, nickel-chromium alloy, tungsten, and cobalt. The corrosion-resistant, high-resistivity metal material itself has anti-oxidation capabilities, which can improve the lifespan of the heating layer. At the same time, by covering the surface of the heating layer 20 away from the substrate 10 and the surface parallel to the sidewall of the through hole 13 with the insulating layer 40, the heating layer 20 can be effectively isolated from the atmospheric environment, preventing atmospheric corrosion of the heating layer 20 and further improving the lifespan of the heating layer.

[0033] The atomizing chip provided by this invention has a substrate 10 comprising a porous region 11 and an edge region 12. A plurality of uniformly distributed through-holes 13 are formed in the porous region 11 of the substrate 10. A heating layer 20 covers the area of ​​the substrate 10 except for the through-holes 13. A contact electrode 30 is disposed in the region of the heating layer 20 located in the edge region 12. An insulating layer 40 is disposed in the region of the heating layer 20 where the contact electrode 30 is not located, and the insulating layer 40 covers the surface of the heating layer 20 away from the substrate 10 and the surface parallel to the sidewalls of the through-holes 13. By forming a plurality of uniformly distributed through-holes 13 on the substrate 10, the through-holes 13 can utilize the capillary force of their inner walls to adsorb liquid, replenishing it promptly and improving the liquid storage capacity of the atomizing chip. Furthermore, the insulating layer 40 effectively isolates the heating layer 20 from the atmospheric environment, extending its lifespan and thus improving the service life of the atomizing chip.

[0034] Optionally, the heating layer may be made of at least one of aluminum tantalum nitride, nickel-chromium alloy, tungsten, and cobalt.

[0035] Among them, tantalum aluminum nitride, nickel-chromium alloy, tungsten and cobalt have their own antioxidant capacity and strong corrosion resistance, which can improve the antioxidant capacity of the heating layer, thereby improving the service life of the atomizing chip.

[0036] Optionally, in aluminum tantalum nitride, the proportion of tantalum is 20%-80%, the proportion of aluminum is 0%-70%, and the proportion of nitrogen is 15%-40%; in nickel-chromium alloy, the proportion of nickel is 10%-90%, and the proportion of chromium is 10%-90%.

[0037] During the heating process, the heating layer material is prone to instability, which reduces the service life of the heating layer. By incorporating tantalum aluminum nitride with tantalum content of 20%-80%, aluminum content of 0%-70%, and nitrogen content of 15%-40%, and nickel-chromium alloy with nickel content of 10%-90% and chromium content of 10%-90%, the material properties of tantalum aluminum nitride and nickel-chromium alloy can be made more stable during the heating process of the heating layer, thereby improving the service life of the heating layer.

[0038] Optionally, the thickness of the heating layer is 0.1-5 μm.

[0039] If the thickness of the heating layer is less than 0.1 μm, the resistance of the heating layer is relatively high, and the reliability is poor due to the excessively thin heating layer; if the thickness of the heating layer is greater than 5 μm, the manufacturing process is more difficult. Therefore, setting the thickness of the heating layer to 0.1-5 μm is simple to manufacture, has good reliability, and the thickness can be adapted within the range of 0.1-5 μm according to the requirements of the driving voltage and current.

[0040] Optionally, the diameter of the through hole is 1-5 μm.

[0041] If the pore diameter of the through hole is less than 1μm, it is easy to cause blockage after long-term use, which will reduce the service life and make the preparation process more difficult. If the pore diameter of the through hole is greater than 5μm, the liquid is easy to seep out, resulting in leakage. Therefore, setting the pore diameter of the through hole to 1-5μm can not only prevent the through hole from being blocked, but also improve the liquid storage capacity.

[0042] Optionally, the ratio of the pore spacing to the pore diameter in the porous region is between 1 and 2.

[0043] If the ratio of the pore spacing to the pore diameter in the porous region is less than 1, the pore spacing is relatively dense, which can easily cause blockage of the through holes during long-term use; if the ratio of the pore spacing to the pore diameter in the porous region is greater than 2, the pore spacing is relatively sparse, which reduces the liquid storage capacity of the substrate; setting the ratio of the pore spacing to the pore diameter in the porous region to be between 1 and 2 can improve the liquid storage capacity and service life of the substrate.

[0044] Optionally, the substrate material includes at least one of silicon, glass, silicon oxide, and ceramic.

[0045] Among them, silicon, glass, silicon oxide, and ceramics have good heat resistance and insulation, which can improve the lifespan of the atomizing chip during long-term use.

[0046] Optional, Figure 5 This is a schematic diagram of another atomizing chip provided in an embodiment of the present invention, for reference. Figure 5 The insulating layer 40 extends into the through hole 13 and covers a portion of the sidewall of the through hole 13.

[0047] The insulating layer 40 extends into the through hole 13 and covers part of the sidewall of the through hole 13, which can more effectively protect the heating layer 20, isolate it from the atmospheric environment, and improve the life of the heating layer 20.

[0048] Optionally, the contact electrode is made of gold or a multilayer alloy of aluminum, copper, nickel, palladium, and gold; the insulating layer is made of at least one of polycrystalline silicon, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, ceramics, and composite materials.

[0049] Among them, the materials of the contact electrodes, such as gold or aluminum-copper-nickel-palladium-gold multilayer alloys, are easy to passivate and have good conductivity, which can reduce the resistance of the contact electrodes and improve their service life. The contact electrodes are generally made of gold balls prepared by the ball-planting method, or aluminum-copper-nickel-palladium-gold multilayer alloy contacts prepared by chemical plating.

[0050] The insulating layer is made of the same material as the substrate, which ensures good adhesion to the substrate. The material used is related to the cost of the atomizing chip. The more complex the chip, the higher the cost. The specific material can be selected according to specific needs.

[0051] Based on the above embodiments, the present invention also provides an electronic cigarette, including the atomizing chip described in any embodiment of the present invention.

[0052] The electronic cigarette provided in this embodiment has the same beneficial effects as the atomizing chip provided in any embodiment of the present invention.

[0053] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0054] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An atomizing chip, characterized in that, include: A substrate, the substrate comprising a porous region and an edge region, the porous region comprising a plurality of through holes that penetrate the substrate and are evenly distributed; A heating layer is located on one side of the substrate, and the heating layer covers the area of ​​the substrate except for the through hole; The contact electrode is located on the side of the heating layer away from the substrate and is disposed in the region of the heating layer located in the edge region; An insulating layer is located on the side of the heating layer away from the substrate. The insulating layer is disposed in the area of ​​the heating layer where the contact electrode is not disposed, and the insulating layer covers the surface of the heating layer away from the substrate and the surface parallel to the sidewall of the through hole. The diameter of the through hole is 1-5 μm; the ratio of the hole spacing to the hole diameter in the porous region is between 1 and 2.

2. The atomizing chip according to claim 1, characterized in that, The heating layer is made of at least one of tantalum aluminum nitride, nickel-chromium alloy, tungsten, and cobalt.

3. The atomizing chip according to claim 2, characterized in that, In the aforementioned tantalum aluminum nitride, the proportion of tantalum is 20%-80%, the proportion of aluminum is 0%-70%, and the proportion of nitrogen is 15%-40%. In the nickel-chromium alloy, the proportion of nickel is 10%-90% and the proportion of chromium is 10%-90%.

4. The atomizing chip according to claim 2, characterized in that, The thickness of the heating layer is 0.1-5 μm.

5. The atomizing chip according to claim 1, characterized in that, The substrate material includes at least one of silicon, glass, silicon oxide, and ceramics.

6. The atomizing chip according to claim 1, characterized in that, The insulating layer extends into the through hole and covers a portion of the sidewall of the through hole.

7. The atomizing chip according to claim 1, characterized in that, The material of the contact electrode is gold or a multilayer alloy of aluminum, copper, nickel, palladium, and gold; The insulating layer is made of at least one of polycrystalline silicon, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, ceramics, and composite materials.

8. An electronic cigarette, characterized in that, Includes the atomizing chip as described in any one of claims 1-7.

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