Display and method of manufacturing a display

Abstract

The application discloses a display and a manufacturing method thereof. The display comprises a substrate and a pixel unit arranged on one side of the substrate. The display further comprises an electronic ink layer and a common electrode. The electronic ink layer is arranged on the side of the substrate away from the pixel unit. The electronic ink layer comprises a plurality of electronic capsules which are uniformly arranged at intervals. The common electrode is arranged on the side of the electronic capsule away from the substrate. The projection of the common electrode on the substrate covers the projections of the pixel unit and the electronic capsule on the substrate. The projection of each electronic capsule on the substrate coincides with the projection of at least one pixel unit on the substrate. According to the technical scheme, the pixel unit and the electronic ink layer are arranged on different sides of the substrate. Therefore, the electronic ink layer can be arranged without contacting the pixel unit, and the circuit in the pixel unit can be prevented from being scratched, thereby improving the yield of the display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display and a method for manufacturing the display. Background Technology

[0002] Electronic paper holds a significant share in the display field due to its advantages such as thinness, low power consumption, and simple manufacturing process. Current electronic paper display manufacturing processes generally involve: first fabricating an active circuit array module, then attaching the electronic ink layer with display functionality onto the active circuit array module. Because the electronic ink layer is attached to the same side as the active circuitry, some circuitry is inevitably scratched during attachment, potentially leading to the scrapping of the entire product and a low yield rate. Summary of the Invention

[0003] The main objective of this application is to provide a display designed to improve the problem of active circuits being easily scratched.

[0004] To achieve the above objectives, the present application proposes a display comprising a substrate and pixel units disposed on one side of the substrate. The display further comprises an electronic ink layer and a common electrode. The electronic ink layer is disposed on the side of the substrate opposite to the pixel units, and the electronic ink layer comprises a plurality of electronic capsules, which are evenly spaced apart. The common electrode is disposed on the side of the electronic capsules opposite to the substrate. The projection of the common electrode on the substrate covers the projections of the pixel units and the electronic capsules on the substrate, and the projection of each electronic capsule on the substrate coincides with the projection of at least one pixel unit on the substrate.

[0005] In one embodiment, the projected area of ​​each electronic capsule on the substrate corresponds to the projected area of ​​at least two of the pixel units on the substrate.

[0006] In one embodiment, the display further includes a first protective layer that encapsulates the pixel unit; the display further includes a second protective layer disposed on the side of the substrate opposite to the pixel unit and encapsulating the electronic ink layer, the second protective layer being a transparent protective layer.

[0007] In one embodiment, the second protective layer is a transparent protective layer.

[0008] In one embodiment, the display further includes:

[0009] A conductive adhesive is disposed on the side of the substrate opposite to the pixel unit, and on one side of the conductive adhesive in the non-display area is electrically connected to the common electrode, while the other side is used for grounding; and

[0010] A driver chip is used to drive the pixel unit. The driver chip is bonded to the edge of the substrate on which the pixel unit is located and is located in the non-display area. The pixel unit is connected to the driver chip.

[0011] In one embodiment, the display further includes:

[0012] A conductive adhesive is disposed on the side of the substrate opposite to the pixel unit, and in the non-display area, the conductive adhesive is electrically connected to the common electrode.

[0013] A driver chip, wherein the driver chip is bonded to one edge of the substrate on which the pixel unit is located and is situated in a non-display area, and the pixel unit is connected to the driver chip; and

[0014] A flexible circuit board, one end of which is electrically connected to the conductive adhesive, and the other end is bent around the substrate and electrically connected to the driving chip.

[0015] This application also proposes a method for manufacturing a display, the method being based on the aforementioned display, the method comprising:

[0016] Pixel units are disposed on one side of the substrate;

[0017] A first protective layer is encapsulated outside the pixel unit;

[0018] Detect the yield of pixel units;

[0019] An electronic ink layer is disposed on the side of the substrate away from the pixel unit, and a common electrode is disposed on the side of the electronic ink layer away from the substrate.

[0020] A second protective layer is encapsulated outside the electronic ink layer and the common electrode.

[0021] In one embodiment, the electronic ink layer includes an electronic capsule, and the step of forming the electronic ink layer on the side of the substrate opposite to the pixel unit and forming a common electrode on the side of the electronic ink layer opposite to the substrate includes:

[0022] Multiple electronic capsules are disposed at uniform intervals on the side of the substrate away from the pixel unit, and each electronic capsule is disposed corresponding to at least two pixel units;

[0023] The common electrode is disposed on the side of the electronic capsule facing away from the substrate, and the projection of the common electrode on the substrate covers the projections of the electronic capsule and the pixel unit on the substrate.

[0024] In one embodiment, after the step of setting an electronic capsule on the side of the substrate away from the pixel unit, and each electronic capsule being set in correspondence with at least two pixel units, the method further includes: applying conductive adhesive to a non-display area on the side of the substrate where the electronic capsule is located, so that the side of the conductive adhesive near the electronic capsule can be electrically connected to the common electrode, and the side of the conductive adhesive away from the electronic capsule is used for grounding.

[0025] The step of encapsulating a second protective layer outside the electronic ink layer and the common electrode further includes: binding a driver chip to a non-display area on the side of the substrate where the pixel unit is located, and connecting the pixel unit to the driver chip.

[0026] In one embodiment, after the step of disposing an electronic capsule on the side of the substrate opposite to the pixel unit, and each electronic capsule being disposed corresponding to at least two pixel units, the method further includes:

[0027] One end of the flexible circuit board is pressed to the non-display area on the side of the substrate where the electronic capsule is located, and the other end is bent around the substrate and pressed to the non-display area on the side of the substrate where the pixel unit is located.

[0028] Conductive adhesive is applied to the side of the flexible circuit board near the electronic capsule and electrically connected to the conductive adhesive, so that the conductive adhesive can be electrically connected to the common electrode.

[0029] The step of encapsulating a second protective layer outside the electronic ink layer and the common electrode further includes: binding a driver chip to the non-display area on the side of the substrate where the pixel unit is located, such that one end of the driver chip is connected to the pixel unit and the other end is pressed to the flexible circuit board.

[0030] This application's technical solution places the pixel units on one side of the substrate and the electronic ink layer on the side of the substrate opposite to the pixel units. That is, the pixel units and the electronic ink layer are located on different sides of the substrate. Therefore, when placing the electronic ink layer, contact with the pixel units can be avoided, thus preventing the risk of scratching the circuitry within the pixel units and improving the yield rate of the display. Furthermore, due to the placement of the electronic ink layer in this application, the display is a reflective display. Its working principle is that external light directly shines into the electronic ink layer, and the reflection effect of the ink layer achieves a high-brightness display effect. Since the light does not need to penetrate the substrate and pixel units, placing the pixel units on the side of the substrate opposite to the electronic ink layer has no impact on the display effect. Moreover, because the substrate isolates the pixel units and the electronic ink layer, it also provides good insulation between the pixel units and the electronic ink layer, preventing short circuits between them. In addition, by placing the common electrode on the side of the electronic capsule facing away from the substrate, and having the projection of the common electrode on the substrate cover the projections of the pixel unit and the electronic capsule on the substrate, and having the projection of each electronic capsule on the substrate coincide with the projection of at least one pixel unit on the substrate, an electronic capsule is positioned between at least one pixel unit and the common electrode. Thus, the electrophoretic movement of the electronic capsule can be achieved through the voltage difference between the pixel unit and the common electrode, thereby achieving the effect of changing the grayscale of the display screen. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 This is a front view of an example display according to Embodiment 1 of this application;

[0033] Figure 2 This is a top view of a pixel unit disposed on a substrate in a display according to Embodiment 1 of this application;

[0034] Figure 3 for Figure 2 Sectional view at point AA;

[0035] Figure 4 for Figure 2 Sectional view at point BB;

[0036] Figure 5 This is a bottom view of an example display according to Embodiment 1 of this application;

[0037] Figure 6 This is a top view of an example display according to Embodiment 1 of this application;

[0038] Figure 7 This is a front view of another example of a display according to Embodiment 1 of this application;

[0039] Figure 8 This is a top view of yet another example of a display according to Embodiment 1 of this application;

[0040] Figure 9 This is a front view of yet another example of a display according to Embodiment 1 of this application;

[0041] Figure 10 This is a top view of another example of the display according to Embodiment 1 of this application;

[0042] Figure 11 This is a front view of another example of a display according to Embodiment 1 of this application;

[0043] Figure 12 This is a cross-sectional view of an example of the electronic ink layer and pixel units of a display according to Embodiment 1 of this application;

[0044] Figure 13 This is a cross-sectional view of another example of the electronic ink layer and pixel units of the display according to Embodiment 1 of this application;

[0045] Figure 14 This is a schematic diagram illustrating the structural flow of an example of the manufacturing method of the display according to Embodiment 2 of this application;

[0046] Figure 15 This is a flowchart illustrating an example of a method for manufacturing a display according to Embodiment 2 of this application;

[0047] Figure 16 This is a schematic flowchart illustrating another example of the method for manufacturing a display according to Embodiment 2 of this application;

[0048] Figure 17 This is a flowchart illustrating yet another example of the method for manufacturing a display according to Embodiment 2 of this application;

[0049] Figure 18 This is a flowchart illustrating another example of the manufacturing method of the display in Embodiment 2 of this application.

[0050] Explanation of icon numbers:

[0051] 100 substrate 200 pixel unit 210 scan lines 220 Data cable 230 Active layer 240 Pixel Electrode 250 First insulating layer 260 Second insulating layer 300 First protective layer 400 electronic ink layer 410 Electronic capsule 411 White charged particles 412 Black charged particles 900 Common electrode 500 Second protective layer 600 conductive adhesive 700 driver chip 800 Flexible circuit board

[0052] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0054] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0055] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0056] Example 1:

[0057] This application proposes a display.

[0058] In the embodiments of this application, please refer to the reference. Figures 1 to 13 The display includes a substrate 100 and pixel units 200 disposed on one side of the substrate 100. The display also includes an electronic ink layer 400 and a common electrode 900. The electronic ink layer 400 is disposed on the side of the substrate 100 opposite to the pixel units 200. The electronic ink layer 400 includes a plurality of electronic capsules 410, which are evenly spaced apart. The projection of the common electrode 900 on the substrate 100 covers the projections of the pixel units 200 and the electronic capsules 410 on the substrate 100, and the projection of each electronic capsule 410 on the substrate 100 coincides with the projection of at least one pixel unit 200 on the substrate 100.

[0059] The substrate 100 provides a supporting base for the pixel unit 200 and the electronic ink layer 400. The substrate 100 can be made of a light-transmitting material or an opaque material. One side of the substrate 100 has mutually perpendicular scan lines 210 and data lines 220. The scan lines 210 and the second direction array form a grid, with each grid representing the area where a pixel unit 200 is located. The pixel unit 200 also includes a thin-film transistor (TFT) and a pixel electrode 240. The gate of the TFT is connected to the scan line 210, one of the source and drain of the TFT is connected to the data line 220, and the other of the source and drain of the TFT is connected to the pixel electrode 240. The drain and source are disposed on the same layer, and the gate and drain are stacked vertically. An active layer 230 is disposed between the gate and drain, and the active layer 230 is connected to both the drain and the source. Its working principle is as follows: when the electrical signal of the scan line 210 is transmitted to the gate, the gate receives the signal and causes the active layer 230 to turn on. Then the electrical signal of the data line 220 enters the pixel electrode 240 through the drain or source.

[0060] The electronic capsule 410 needs to be steered under pressure difference so that it can reflect external light to achieve the effect of displaying an image. By placing the common electrode 900 on the side of the electronic capsule 410 away from the substrate 100, and placing the electronic capsule 410 on the side of the substrate 100 away from the pixel unit 200, the common electrode 900 is positioned on the side of the electronic capsule 410 away from the pixel unit 200. Furthermore, the projection of the common electrode 900 on the substrate 100 covers the projections of both the pixel unit 200 and the electronic capsule 410 on the substrate 100. This ensures that the electronic capsule 410 is positioned between the pixel unit 200 and the common electrode 900, thereby ensuring that the electronic capsule 410 can achieve the steerable effect under the pressure difference between the pixel electrode 240 in the pixel unit 200 and the common electrode 900. Specifically, the common electrode 900 can be a block electrode and at least partially overlap with the projection of the pixel electrode 240 in the pixel unit 200; or the common electrode 900 can also be a planar electrode, so that the pixel unit 200 can always be positioned opposite to the common electrode 900.

[0061] The electronic ink layer 400 includes an electronic capsule 410 located between the common electrode 900 and the pixel electrode 240. The electronic capsule 410 is oriented by the pressure difference between the common electrode 900 and the pixel electrode 240, thereby achieving the effect of displaying an image. Specifically, the electronic capsule 410 includes a capsule body and white charged particles 411 and black charged particles 412 disposed within the capsule body. When there is a pressure difference between the common electrode 900 and the pixel electrode 240, the white charged particles 411 and the black charged particles 412 move in different directions, causing the displayed image to show a bright or dark state. For example, when white charged particles 411 carry a negative charge and black charged particles 412 carry a positive charge, if a positive voltage is applied to the common electrode 900 and a negative voltage is applied to the pixel electrode 240, the white charged particles 411 move towards the common electrode 900, while the black charged particles 412 move towards the pixel electrode 240. In this case, the display screen is brighter. If a negative voltage is applied to the common electrode 900 and a positive voltage is applied to the pixel electrode 240, the black charged particles 412 move towards the common electrode 900, while the white charged particles 411 move towards the pixel electrode 240. In this case, the display screen is darker.

[0062] Furthermore, if the projection of each electron capsule 410 onto the substrate 100 coincides with the projection of at least one pixel unit 200 onto the substrate 100, then at least one pixel unit 200 corresponds to one electron capsule 410. This allows the electron capsule 410 to undergo electrophoresis under the pressure difference between at least one pixel unit 200 and the common electrode 900, thereby achieving the effect of changing the grayscale of the displayed image. In one example, one electron capsule 410 can be directly opposite one pixel electrode 240 (e.g., ...). Figure 1 As shown), this ensures that the electronic capsule 410 can achieve a steering effect due to the pressure difference between the pixel electrode 240 and the common electrode 900. Alternatively, one electronic capsule 410 can correspond to at least two pixel units 200 (e.g., Figure 7 As shown in the diagram, this allows different areas of the pixel units 200 within the electronic capsule 410 to have different turning effects. This enables each electronic capsule 410 to display more different gray levels in different areas, resulting in richer and more detailed image content. It should be noted that the substrate 100 is made of insulating material to avoid the risk of electrical connection between the traces in the pixel units 200 and the substrate 100 when the traces are located on the substrate 100.

[0063] By placing the electronic ink layer 400 on the side of the substrate 100 away from the pixel unit 200, the risk of scratching the circuitry in the pixel unit 200 due to contact between the electronic ink layer 400 and the pixel unit 200 can be avoided when the electronic ink layer 400 is placed. Specifically, the pixel unit 200 can be placed on one side of the substrate 100 first, and then the electronic ink layer 400 can be placed on the side of the substrate 100 away from the pixel unit 200; or the electronic ink layer 400 can be placed on one side of the substrate 100 first, and then the pixel unit 200 can be placed on the side of the substrate 100 away from the electronic ink layer 400.

[0064] The technical solution of this application places the pixel unit 200 on one side of the substrate 100 and the electronic ink layer 400 on the side of the substrate 100 away from the pixel unit 200. That is, the pixel unit 200 and the electronic ink layer 400 are respectively located on different sides of the substrate 100. The substrate 100 provides good isolation between the pixel unit 200 and the electronic ink layer 400, preventing the electronic ink layer 400 from contacting the pixel unit 200. This avoids the risk of scratching the circuitry in the pixel unit 200 during the placement of the electronic ink layer 400, thereby improving the yield rate of the display. Furthermore, due to the placement of the electronic ink layer 400 in this application, the display is a reflective display. Its working principle is that external light directly shines into the electronic ink layer 400, and the high-brightness display effect is achieved through the reflection of the ink layer. Since the light does not need to penetrate the substrate 100 and the pixel unit 200, placing the pixel unit 200 on the side of the substrate 100 away from the electronic ink layer 400 has no impact on the display effect. Furthermore, in this application, since the substrate 100 is isolated between the pixel unit 200 and the electronic ink layer 400, the pixel unit 200 and the electronic ink layer 400 have a good insulation effect, preventing short circuits between them. Additionally, by placing the common electrode 900 on the side of the electronic capsule 410 of the electronic ink layer 400 facing away from the substrate 100, and by ensuring that the projection of the common electrode 900 on the substrate 100 covers the projections of both the pixel unit 200 and the electronic capsule 410 on the substrate 100, and that the projection of each electronic capsule 410 on the substrate 100 coincides with the projection of at least one pixel unit 200 on the substrate 100, an electronic capsule 410 is located between at least one pixel unit 200 and the common electrode 900. This allows the electrophoretic movement of the electronic capsule 410 to be achieved through the voltage difference between the pixel unit 200 and the common electrode 900, thereby changing the grayscale of the displayed image.

[0065] Furthermore, such as Figure 7 As shown, the projected area of ​​each electronic capsule 410 on the substrate 100 corresponds to the projected area of ​​at least two pixel units 200 on the substrate 100.

[0066] This configuration allows each electronic capsule 410 to be driven by at least two pixel units 200. That is, different areas of each electronic capsule 410 corresponding to different pixel units 200 can have different driving effects, resulting in different display effects for different areas of each electronic capsule 410. Specifically, the projection of each electronic capsule 410 onto the substrate 100 can correspond to three pixel units 200, allowing each of the three pixel units 200 to have different driving effects on different areas of the electronic capsule 410, further enhancing the effect of different grayscale levels in different areas of the electronic capsule 410. Furthermore, when one pixel unit 200 fails, the other pixel units 200 can still drive the electronic capsule 410 to undergo electrophoresis, thereby improving the display's fault tolerance.

[0067] Furthermore, please refer to the following: Figure 1 , Figure 5 , Figure 6 , Figure 7 , Figure 9 and Figure 11 The display also includes a first protective layer 300, which encapsulates the pixel unit 200. The display also includes a second protective layer 500, which is disposed on the side of the substrate 100 opposite to the pixel unit 200 and encapsulates the electronic ink layer 400.

[0068] By encapsulating the pixel unit 200 with the first protective layer 300, the first protective layer 300 can further protect the pixel unit 200, preventing external forces from scratching it. In addition, the first protective layer 300 also provides good waterproof and dustproof protection for the circuitry within the pixel unit 200, ensuring a more stable operating environment. Specifically, during manufacturing, the electronic ink layer 400 can be applied after encapsulating the pixel unit 200 with the first protective layer 300, thereby further protecting the pixel unit 200 during the manufacturing process. In this example, the first protective layer 300 can be made of a light-transmitting material or an opaque material.

[0069] By providing a second protective layer 500 on the side of the substrate 100 away from the pixel unit 200, and by encapsulating the electronic ink layer 400 in the second protective layer 500, the second protective layer 500 can protect the electronic ink layer 400 and also achieve a good waterproof and dustproof effect.

[0070] Furthermore, the second protective layer 500 is a transparent protective layer.

[0071] By setting the second protective layer 500 as a transparent protective layer, the second protective layer 500 has less impact on the reflective effect of the electronic ink layer 400, thereby enabling the display to have higher display brightness.

[0072] In one example, please refer to the reference. Figure 8 and Figure 9 The display also includes conductive adhesive 600 and driver chip 700. The conductive adhesive 600 is disposed on the side of the substrate 100 away from the pixel unit and in the non-display area. One side of the conductive adhesive 600 is electrically connected to the common electrode 900, and the other side is used for grounding. The driver chip 700 is bonded to the edge of the side of the substrate 100 where the pixel unit 200 is located and is disposed in the non-display area. The pixel unit is connected to the driver chip 700.

[0073] The conductive adhesive 600 can be a structure containing conductive particles, such as conductive gold or silver spheres. One side of the conductive adhesive 600 is electrically connected to the common electrode 900, while the other side is grounded. Specifically, the other side of the conductive adhesive 600 can be made conductive to the metal frame of the display that encloses the substrate 100, pixel unit 200, and common electrode 900. In this case, the driver chip 700 does not provide electrical signals to the common electrode 900, and the voltage of the common electrode 900 remains constant at ground level. This configuration reduces the number of connection lines between the common electrode 900 and the driver chip 700, thereby reducing the risk of wire breakage.

[0074] By placing the driver chip 700 on the side of the substrate 100 where the pixel units 200 are located, and connecting the pixel units 200 to the driver chip 700, the driver chip 700 can provide varying voltage signals to the pixel units 200, facilitating connection between the driver chip 700 and the pixel units 200. Specifically, multiple pixel units 200 can be connected via a single driving circuit trace, and the driver chip 700 can be electrically connected to this driving circuit trace. By changing the voltage of the pixel units 200, a voltage difference is created between the voltage of the pixel units 200 and the voltage of the common electrode 900. This, in turn, controls the electrophoretic migration of the white charged particles 411 and the black charged particles 412 in the electron capsule 410, enabling the display to show different grayscale levels. Furthermore, by placing both the conductive adhesive 600 and the driver chip 700 in the non-display area, it is possible to prevent the conductive adhesive 600 and the driver chip 700 from blocking light and affecting the display effect.

[0075] In another example, please refer to the reference. Figure 10 and Figure 11The display also includes conductive adhesive 600, driver chip 700, and flexible circuit board 800. The conductive adhesive 600 is disposed on the side of the substrate 100 away from the pixel unit and in the non-display area. The conductive adhesive 600 is electrically connected to the common electrode 900. The driver chip 700 is bonded to the edge of the substrate 100 on the side where the pixel unit 200 is located and is disposed in the non-display area. The pixel unit is connected to the driver chip 700. One end of the flexible circuit board 800 is electrically connected to the conductive adhesive 600, and the other end is bent around the substrate 100 and electrically connected to the driver chip 700.

[0076] The conductive adhesive 600 can have a structure containing conductive particles, such as conductive gold or silver spheres. The conductive adhesive 600 is electrically connected to the common electrode 900, and is also connected to the driver chip 700 via the flexible circuit board 800. The driver chip 700 can then provide an electrical signal to the common electrode 900, thereby changing its voltage. This configuration allows for flexible adjustment of the voltage of the common electrode 900, and thus more flexibly changes the voltage difference between the pixel unit 200 and the common electrode 900. Specifically, the driver chip 700 can provide a varying voltage or a constant voltage to the common electrode 900.

[0077] By placing the driver chip 700 on the side of the substrate 100 where the pixel units 200 are located, and connecting the pixel units 200 to the driver chip 700, the driver chip 700 can provide varying voltage signals to the pixel units 200, facilitating connection between the driver chip 700 and the pixel units 200. Specifically, multiple pixel units 200 can be connected via a single driving circuit trace, and the driver chip 700 can be electrically connected to this driving circuit trace. By changing the voltage of the pixel units 200, a voltage difference is created between the voltage of the pixel units 200 and the voltage of the common electrode 900. This, in turn, controls the electrophoretic migration of the white charged particles 411 and the black charged particles 412 in the electron capsule 410, enabling the display to show different grayscale levels. Furthermore, by placing both the conductive adhesive 600 and the driver chip 700 in the non-display area, it is possible to prevent the conductive adhesive 600 and the driver chip 700 from blocking light and affecting the display effect.

[0078] Example 2:

[0079] This application also proposes a method for manufacturing a display. This method is based on the specific structure of the display described above. Since the display manufactured by this method adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0080] Please refer to the reference. Figure 14 and Figure 15 The methods for manufacturing a monitor include:

[0081] Step 10: Pixel unit 200 is disposed on one side of substrate 100;

[0082] Step 101: Encapsulate the pixel unit 200 with a first protective layer 300.

[0083] By placing the pixel unit 200 on one side of the substrate 100 and then encapsulating it with a first protective layer 300, the first protective layer 300 can effectively protect the pixel unit 200, thus avoiding the risk of scratching the circuitry in the pixel unit 200 by external force during the subsequent application of the electronic ink layer 400. Furthermore, encapsulating the pixel unit 200 with the first protective layer 300 prevents the pixel unit 200 from receiving dust or water due to environmental factors during subsequent manufacturing processes, reducing the risk of pixel unit 200 failure. Specifically, when encapsulating the first protective layer 300, pressure-sensitive adhesive can be used, and a certain pressure can be applied to the edges of the first protective layer 300 towards the substrate 100, resulting in a strong bond between the first protective layer 300 and the substrate 100. This setup eliminates the need for any additional additives or heating processes to ensure high stability after the first protective layer 300 encapsulates the pixel unit 200.

[0084] Since the display in this application does not require a backlight module to provide a light source, but instead uses natural or external light sources to allow light to shine onto the electronic ink layer 400, and the light is reflected by the electronic ink layer 400 to display the image, the first protective layer 300 does not need to be transparent. The first protective layer 300 can be a transparent material or an opaque material. Similarly, the substrate 100 can be a transparent material or an opaque material. It should be noted that the substrate 100 uses an insulating material, such as glass, to avoid the risk of electrical connection between it and the circuitry in the pixel unit 200.

[0085] Step 102: Detect the yield of pixel unit 200.

[0086] By testing the yield rate of the pixel unit 200 after encapsulating the first protective layer 300 outside the pixel unit 200, the electronic ink layer 400 is placed on the substrate 100 only after the pixel unit 200 is set up to be qualified, thereby further ensuring the yield rate of the product and avoiding wasting more electronic ink layer 400 resources.

[0087] Pixel unit 200 includes a gate, a first insulating layer 250, an active layer, a source and a drain, and a second insulating layer 260, stacked sequentially from near the substrate 100 to away from the substrate 100. The gate is disposed on the same layer as the scan line 210 and connected to the scan line 210, i.e., the gate is located on the first metal layer; the source and drain are both disposed on the same layer as the data line 220, i.e., the source and drain are both located on the second metal layer. During manufacturing, some manufacturing defects are unavoidable. For example, the trace breakage rate of the first metal layer is typically 1%; the trace breakage rate of the second metal layer is 3%; when the portion of the second insulating layer 260 corresponding to the source and drain is not completely etched, IN particles may remain, with an unavoidable IN particle residue rate of approximately 1% during manufacturing; metal particles may also remain on the first and second metal layers during manufacturing, with an unavoidable metal particle residue rate of approximately 1%. There are also other defects. Considering all the above defects, the overall yield needs to be greater than 92%. Traditionally, when the electronic ink layer 400 is disposed above the pixel unit 200, the scratching of the metal traces in the pixel unit 200 caused by the electronic ink layer 400 can reach up to 10%, resulting in a decrease in the overall yield to approximately 80%. However, in the present application's technical solution, by disposing the electronic ink layer 400 and the pixel unit 200 on opposite sides of the substrate 100, the scratching loss of the metal traces in the pixel unit 200 caused by the electronic ink layer 400 can be avoided, thereby maintaining an overall yield of over 90%. The yield detection of the pixel unit 200 in this application includes detecting the yield corresponding to at least the four aforementioned defects, as well as the yield including other indicators.

[0088] Step 20: An electronic ink layer 400 is disposed on the side of the substrate 100 opposite to the pixel unit 200, and a common electrode 900 is disposed on the side of the electronic ink layer 400 opposite to the substrate 100.

[0089] In manufacturing a display, the electronic ink layer 400 and the pixel unit 200 are respectively disposed on opposite sides of the substrate 100. Therefore, during installation, the pixel unit 200 can be disposed on one side of the substrate 100 first, and then the electronic ink layer 400 can be disposed on the opposite side of the substrate 100. With this arrangement, the electronic ink layer 400 will not come into contact with the pixel unit 200 when the worker applies the electronic ink layer 400 to the substrate 100, thus avoiding scratching the circuitry in the pixel unit 200.

[0090] Alternatively, in another example, the electronic ink layer 400 can be formed on one side of the substrate 100 first, and then the pixel unit 200 can be formed on the opposite side of the substrate 100. With this arrangement, since the pixel unit 200 is formed after the electronic ink layer 400, the risk of scratching the pixel unit 200 during the formation of the electronic ink layer 400 can be avoided. Furthermore, since the pixel unit 200 is formed on the side of the substrate 100 away from the electronic ink layer 400, the electronic ink layer 400 will not come into contact with the pixel unit 200 during its formation on the substrate 100, thus also avoiding the risk of the electronic ink layer 400 scratching the pixel unit 200.

[0091] Specifically, the electronic ink layer 400 includes a plurality of evenly spaced electronic capsules 410. When the electronic ink layer 400 is disposed on the substrate 100, the electronic capsules 410 of the electronic ink layer 400 are positioned close to the substrate 100, while the common electrode 900 is positioned away from the substrate 100. That is, the electronic capsules 410 are located between the common electrode 900 and the pixel unit 200, so that the electronic capsules 410 can rotate when there is a voltage difference between the common electrode 900 and the pixel unit 200. More specifically, the electronic capsule 410 includes a capsule body and black charged particles 412 and white charged particles 411 disposed within the capsule body. When there is a voltage difference between the common electrode 900 and the pixel electrode 240, the white charged particles 411 and the black charged particles 412 move in different directions, so that the display screen shows a bright state or a dark state. The electronic capsule 410 can be positioned directly opposite the pixel unit 200, ensuring that it faces the pixel electrode 240 and achieves a turning effect due to the pressure difference between the pixel electrode 240 and the common electrode 900. Alternatively, the electronic capsule 410 can be partially positioned opposite the pixel unit 200 and the common electrode 900, still ensuring that some particles in the electronic capsule 410 can move under the pressure difference between the pixel unit 200 and the common electrode 900. Alternatively, one electronic capsule 410 can correspond to at least two pixel units 200, allowing different areas of the electronic capsule 410 corresponding to different pixel units 200 to have different turning effects, thus achieving a more refined display effect. Furthermore, due to the electronic ink layer 400 in this application, the display is a reflective display. Its working principle is that external light directly shines into the electronic ink layer 400, and the high-brightness display effect is achieved through the reflection of the ink layer. Since light does not need to penetrate the substrate 100 and the pixel unit 200, placing the pixel unit 200 on the side of the substrate 100 away from the electronic ink layer 400 has no impact on the display effect. Furthermore, because the substrate 100 is isolated between the pixel unit 200 and the electronic ink layer 400, this application also provides good insulation between the pixel unit 200 and the electronic ink layer 400, preventing short circuits between them.

[0092] Step 201: Encapsulate a second protective layer 500 outside the electronic ink layer 400 and the common electrode 900.

[0093] By encapsulating the electronic ink layer 400 with a second protective layer 500, the electronic ink layer 400 receives a higher level of protection after encapsulation, reducing the damage caused by external forces and minimizing the risk of corrosion from dust or water. Since the display principle in this application relies on external light shining into the electronic ink layer 400, the second protective layer 500 can be made of a light-transmitting material to ensure good light transmission. Similarly, the common electrode 900 in the electronic ink layer 400 also uses a transparent electrode.

[0094] Specifically, when encapsulating the second protective layer 500, pressure-sensitive adhesive can be used to apply a certain pressure to the edge of the second protective layer 500 toward the substrate 100, so that the second protective layer 500 and the substrate 100 are bonded more firmly. With this setting, no additional additives or heating processes are needed to ensure that the second protective layer 500 has high stability after encapsulating the electronic ink layer 400.

[0095] In another example, such as Figure 16 As shown, step 20: the electronic ink layer includes an electronic capsule 410. The step of setting an electronic ink layer 400 on the side of the substrate 100 opposite to the pixel unit 200 and setting a common electrode 900 on the side of the electronic ink layer 400 opposite to the substrate 100 includes:

[0096] Step 21: An electronic capsule 410 is disposed on the side of the substrate 100 opposite to the pixel unit 200, and each electronic capsule 410 is disposed corresponding to at least two pixel units 900.

[0097] By assigning each electronic capsule 410 to at least two pixel units 900, each electronic capsule 410 can be driven by at least two pixel units 200. This means that different areas of each electronic capsule 410 corresponding to different pixel units 200 can have different driving effects, resulting in different display effects for different areas of each electronic capsule 410. Specifically, the projection of each electronic capsule 410 onto the substrate 100 can correspond to three pixel units 200, allowing each of the three pixel units 200 to have different driving effects on different areas of the electronic capsule 410, further enhancing the effect of different grayscale levels in different areas of the electronic capsule 410. Furthermore, when one pixel unit 200 is damaged, the other pixel units 200 can still drive the electronic capsule 410 to undergo electrophoresis, thereby improving the display's fault tolerance.

[0098] Step 22: The common electrode 900 is disposed on the side of the electronic capsule 410 away from the substrate 100, and the projection of the common electrode 900 on the substrate 100 covers the projections of the electronic capsule 410 and the pixel unit 200 on the substrate 100.

[0099] By placing the common electrode 900 on the side of the electronic capsule 410 away from the substrate 100, and ensuring that its projection on the substrate 100 covers the projections of the electronic capsule 410 and the pixel unit 200 on the substrate, it can be ensured that each electronic capsule 410 is disposed between the common electrode 900 and the pixel unit 200, so that the electronic capsule 410 can undergo electrophoresis under the pressure difference between the common electrode 900 and the pixel unit 200, thereby achieving the effect of changing the grayscale of the display screen.

[0100] In yet another example, such as Figure 17 As shown, step 21, which involves disposing an electronic capsule 410 on the side of the substrate 100 opposite to the pixel unit 200, and where each electronic capsule 410 is correspondingly disposed to at least two pixel units 200, further includes the following:

[0101] Step 211: Apply conductive adhesive 600 to the non-display area on the side of the substrate 100 where the electronic capsule 410 is located, so that the side of the conductive adhesive 600 near the electronic capsule 410 can be electrically connected to the common electrode 900, and the side of the conductive adhesive 600 away from the electronic capsule 410 is used for grounding.

[0102] The conductive adhesive 600 can be a structure containing conductive particles, such as conductive gold or silver spheres. One side of the conductive adhesive 600 is electrically connected to the common electrode 900, while the other side is grounded. Specifically, the other side of the conductive adhesive 600 can be made conductive to the metal frame of the display that encloses the substrate 100, pixel unit 200, and common electrode 900. In this case, the driver chip 700 does not provide electrical signals to the common electrode 900, and the voltage of the common electrode 900 remains constant at ground level. This configuration reduces the number of connection lines between the common electrode 900 and the driver chip 700, thereby reducing the risk of wire breakage.

[0103] Step 201, following the step of encapsulating the second protective layer 500 outside the electronic ink layer 400 and the common electrode 900, further includes:

[0104] Step 202: Bind the driver chip 700 to the non-display area on the side of the substrate 100 where the pixel unit 200 is located, and connect the pixel unit 200 to the driver chip 700.

[0105] By placing the driver chip 700 on the side of the substrate 100 where the pixel units 200 are located, and connecting the pixel units 200 to the driver chip 700, the driver chip 700 can provide varying voltage signals to the pixel units 200, and facilitates connection between the driver chip 700 and the pixel units 200. Specifically, multiple pixel units 200 can be connected through a single driving circuit trace (i.e., data line 220). The driver chip 700 can be electrically connected to this driving circuit trace, thereby changing the voltage of the pixel units 200 to create a voltage difference between the voltage of the pixel units 200 and the voltage of the common electrode 900. This, in turn, controls the electrophoretic migration of the white charged particles 411 and the black charged particles 412 in the electronic capsule 410, enabling the display to show different grayscale levels.

[0106] In yet another example, such as Figure 18 As shown, step 21, which involves disposing an electronic capsule 410 on the side of the substrate 100 opposite to the pixel unit 200, and where each electronic capsule 410 is correspondingly disposed to at least two pixel units 200, further includes the following:

[0107] Step 212: Press one end of the flexible circuit board 800 to the non-display area on the side of the substrate 100 where the electronic capsule 410 is located, and bend the other end around the substrate 100 and press it to the non-display area on the side of the substrate 100 where the pixel unit 200 is located.

[0108] Step 213: Apply conductive adhesive 600 to the side of the flexible circuit board 800 near the electronic capsule and make it electrically connected to the conductive adhesive 600, so that the conductive adhesive 600 can be electrically connected to the common electrode 900.

[0109] By first pressing one end of the flexible circuit board 800 onto the non-display area of ​​the substrate 100 where the electronic capsule 410 is located, and then applying conductive adhesive 600 to the side of the flexible circuit board 800 near the electronic capsule 410, it is easy to electrically connect the conductive adhesive 600 to the flexible circuit board 800, avoiding the need for connecting wires between the conductive adhesive 600 and the flexible circuit board 800. Furthermore, by bending the flexible circuit board 800 around the substrate 100 and then pressing it onto the side of the substrate 100 where the pixel unit 200 is located, it is possible to connect the flexible circuit board 800 to the driver chip 700.

[0110] Step 201, following the step of encapsulating the second protective layer 500 outside the electronic ink layer 400 and the common electrode 900, further includes:

[0111] Step 202: Bind the driver chip 700 to the non-display area on the side of the substrate where the pixel unit 200 is located, and connect one end of the driver chip 700 to the pixel unit 200 and press the other end to the flexible circuit board 800.

[0112] When the driver chip 700 is connected to one end of the pixel unit 200, one end of the driver chip 700 can be directly pressed onto the driving circuit trace (i.e., data line 220) of the pixel unit 200. This allows the driver chip 700 to control multiple pixel units 200 simultaneously, and avoids connecting the pixel unit 200 to the driver chip 700 through other connecting lines. In addition, the other end of the driver chip 700 is directly pressed onto the flexible circuit board 800, which also reduces the number of connecting lines between the driver chip 700 and the flexible circuit board, thereby reducing the manufacturing process and saving manufacturing costs.

[0113] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the content of this application's specification and drawings under the concept of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A display comprising a substrate and pixel units disposed on one side of the substrate, characterized in that, The display further includes an electronic ink layer and a common electrode. The electronic ink layer is disposed on the side of the substrate away from the pixel unit. The electronic ink layer includes a plurality of electronic capsules, which are evenly spaced apart. The common electrode is disposed on the side of the electronic capsules away from the substrate. The projection of the common electrode on the substrate covers the projections of the pixel unit and the electronic capsules on the substrate, and the projection of each electronic capsule on the substrate coincides with the projection of at least one pixel unit on the substrate. The display further includes a first protective layer that encapsulates the pixel unit; the display further includes a second protective layer that is disposed on the side of the substrate away from the pixel unit and encapsulates the electronic ink layer and the common electrode, wherein the electronic ink layer and the common electrode are both covered between the second protective layer and the substrate. The display also includes conductive adhesive and a driving chip. The conductive adhesive is disposed on the side of the substrate away from the pixel unit and in the non-display area. The driving chip is used to drive the pixel unit. The driving chip is bonded to the edge of the substrate on the side where the pixel unit is disposed and is disposed in the non-display area. The pixel unit is connected to the driving chip. One side of the conductive adhesive is electrically connected to the common electrode, and the other side is used for grounding; or the conductive adhesive is electrically connected to the driver chip through a flexible circuit board, and the flexible circuit board is bent around the substrate and electrically connected to the driver chip.

2. The display as claimed in claim 1, characterized in that, The projected area of ​​each electronic capsule on the substrate corresponds to the projected area of ​​at least two pixel units on the substrate.

3. The display as described in claim 1 or 2, characterized in that, The second protective layer is a transparent protective layer.

4. A method for manufacturing a display, characterized in that, The method for manufacturing the display is based on the display as described in any one of claims 1 to 3, and the method for manufacturing the display includes: Pixel units are disposed on one side of the substrate; A first protective layer is encapsulated outside the pixel unit; Detect the yield of the pixel unit; An electronic ink layer is disposed on the side of the substrate opposite to the pixel unit, and a common electrode is disposed on the side of the electronic ink layer opposite to the substrate. A second protective layer is encapsulated outside the electronic ink layer and the common electrode.

5. The method for manufacturing a display as described in claim 4, characterized in that, The electronic ink layer includes a plurality of electronic capsules. The step of setting the electronic ink layer on the side of the substrate away from the pixel unit and setting a common electrode on the side of the electronic ink layer away from the substrate includes: Multiple electronic capsules are disposed at uniform intervals on the side of the substrate away from the pixel unit, and each electronic capsule is disposed corresponding to at least two pixel units; The common electrode is disposed on the side of the electronic capsule facing away from the substrate, and the projection of the common electrode on the substrate covers the projections of the electronic capsule and the pixel unit on the substrate.

6. The method for manufacturing a display as described in claim 5, characterized in that, After the step of setting an electronic capsule on the side of the substrate away from the pixel unit, and each electronic capsule being set in correspondence with at least two pixel units, the method further includes: applying conductive adhesive to the non-display area on the side of the substrate where the electronic capsule is located, so that the side of the conductive adhesive near the electronic capsule can be electrically connected to the common electrode, and the side of the conductive adhesive away from the electronic capsule is used for grounding. The step of encapsulating a second protective layer outside the electronic ink layer and the common electrode further includes: binding a driver chip to a non-display area on the side of the substrate where the pixel unit is located, and connecting the pixel unit to the driver chip.

7. The method for manufacturing a display as described in claim 5, characterized in that, The step of setting an electronic capsule on the side of the substrate away from the pixel unit, wherein each electronic capsule is correspondingly set with at least two pixel units, further includes: One end of the flexible circuit board is pressed to the non-display area on the side of the substrate where the electronic capsule is located, and the other end is bent around the substrate and pressed to the non-display area on the side of the substrate where the pixel unit is located. Conductive adhesive is applied to the side of the flexible circuit board near the electronic capsule and electrically connected to the conductive adhesive, so that the conductive adhesive can be electrically connected to the common electrode. The step of encapsulating a second protective layer outside the electronic ink layer and the common electrode further includes: binding a driver chip to the non-display area on the side of the substrate where the pixel unit is located, such that one end of the driver chip is connected to the pixel unit and the other end is pressed to the flexible circuit board.

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