server

Abstract

The application provides a kind of server, it is related to electronic equipment technical field, for solving the technical problem that the cooling effect of heat dissipation system and the energy consumption of occupied whole machine are difficult to adjust under different working conditions.The server includes cabinet body and load arranged in the cabinet body, and the heat dissipation system for heat dissipation to load;Cabinet body includes panel, movable plate and electromagnetic device;The heat dissipation system includes the heat dissipation through-hole arranged in the panel, and the movable plate is provided with auxiliary through-hole;Movable plate and electromagnetic device are both installed on panel, movable plate has first working condition and second working condition, when movable plate is in first working condition, auxiliary through-hole is not connected into heat dissipation system;When movable plate is in second working condition, auxiliary through-hole is connected into heat dissipation system;Electromagnetic device is configured to, when movable plate is in second working condition and the power consumption of load changes, electromagnetic device drives movable plate to move relative to panel, to change the coincidence degree of auxiliary through-hole and heat dissipation through-hole.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to a server. Background Technology

[0002] A server consists of a cabinet and loads (such as hard drives) housed within it. During operation, the loads generate heat, causing the temperature inside the cabinet to rise. To reduce this temperature, the cabinet also includes a panel and a cooling system. The cooling system includes ventilation holes in the panel and is used to lower the load's temperature. However, the cooling effect and overall power consumption of the cooling system are difficult to adjust under different operating conditions. Summary of the Invention

[0003] This invention provides an electronic device server to solve the technical problem that the cooling effect of the heat dissipation system and the overall energy consumption of the machine are difficult to adjust under different operating conditions.

[0004] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0005] This invention provides a server, including a cabinet, a load disposed within the cabinet, and a heat dissipation system for dissipating heat from the load; the cabinet includes a panel, a movable plate, and an electromagnetic device;

[0006] The heat dissipation system includes heat dissipation through holes provided in the panel, and the movable plate is provided with auxiliary through holes;

[0007] Both the movable plate and the electromagnetic device are mounted on the panel. The movable plate has a first working condition and a second working condition. When the movable plate is in the first working condition, the auxiliary through hole is not connected to the heat dissipation system. When the movable plate is in the second working condition, the auxiliary through hole is connected to the heat dissipation system.

[0008] The electromagnetic device is configured such that when the movable plate is in the second operating condition and the power consumption of the load changes, the electromagnetic device drives the movable plate to move relative to the panel, thereby changing the overlap between the auxiliary through hole and the heat dissipation through hole.

[0009] The server provided in this embodiment of the invention has the following beneficial effects:

[0010] The server provided in this embodiment of the invention includes a cabinet and a load disposed within the cabinet, and a heat dissipation system for dissipating heat from the load. The load generates heat during operation, causing the temperature inside the server to rise, and the heat dissipation system is used to reduce the temperature inside the server.

[0011] The aforementioned cabinet includes a panel, a movable plate, and an electromagnetic device, both of which are mounted on the panel. The movable plate has a first operating condition and a second operating condition. In the first operating condition, the auxiliary through-hole is not connected to the cooling system, and the cooling system includes the cooling through-holes located in the panel. At this time, the cooling effect of the cooling system is related to the overall energy consumption and the cooling through-holes. Since the cooling through-holes are not covered, the cooling effect of the cooling system is excellent, but the overall energy consumption is the highest. In the second operating condition, the auxiliary through-hole is connected to the cooling system, and the cooling system includes the cooling through-holes located in the panel. The cooling effect and overall power consumption of the heat dissipation system are related to the heat dissipation holes and auxiliary holes. Furthermore, the electromagnetic device is configured such that when the movable plate is in the second operating condition and the power consumption of the load changes, the electromagnetic device drives the movable plate to move relative to the panel, thereby changing the overlap between the auxiliary holes and the heat dissipation holes. This changes the effective opening area of ​​the heat dissipation holes. Therefore, compared with related technologies, the server provided in this embodiment of the invention adjusts the cooling effect and overall power consumption of the heat dissipation system under different operating conditions by changing the overlap between the auxiliary holes and the heat dissipation holes.

[0012] Based on the above technical solutions, the embodiments of the present invention can be further improved as follows.

[0013] Furthermore, the panel is provided with a first cylindrical protrusion and a second cylindrical protrusion at the position of the first end face near the cabinet body. The first cylindrical protrusion is provided with a first blind hole, and the second cylindrical protrusion is provided with a second blind hole. The center lines of the first blind hole and the second blind hole both extend along the first direction.

[0014] The movable plate is provided with a rotating shaft, one end of which is located in the first blind hole and the other end is located in the second blind hole. The movable plate can rotate along the center line of the rotating shaft and move along the direction of the center line of the rotating shaft. The bottom of the first blind hole is a first limiting part, and the bottom of the second blind hole is a second limiting part.

[0015] The panel is provided with a support plate along the second direction, the support plate is snapped onto the lower surface of the movable plate, and the support plate is a third limiting part.

[0016] Furthermore, when the movable plate is in the first working condition, the movable plate is fixed at the third limiting part, the movable plate is perpendicular to the panel, and the effective opening area of ​​the heat dissipation through hole is maximized;

[0017] When the movable plate is in the second working condition and the power consumption of the load is within the first preset range, the movable plate rotates to fit against the panel and moves to the first limiting part along the first direction under the attraction of the electromagnetic device. The auxiliary through hole coincides with the first part of the heat dissipation through hole, and the ratio of the area of ​​the first part of the heat dissipation through hole to the total area of ​​the heat dissipation through hole is 2 / 3. The heat dissipation through hole forms an effective opening area of ​​medium size.

[0018] When the movable plate is in the second working condition and the power consumption of the load is within the second preset range, the movable plate rotates to fit against the panel under the attraction of the electromagnetic device and moves to the second limiting part along the first direction. The auxiliary through hole coincides with the second part of the heat dissipation through hole, and the ratio of the area of ​​the second part of the heat dissipation through hole to the total area of ​​the heat dissipation through hole is 1 / 3. The effective opening area of ​​the heat dissipation through hole is the smallest.

[0019] Furthermore, the electromagnetic device is installed on the panel near the second end face of the cabinet, the first end face is opposite to the second end face, and includes a first electromagnetic device, a second electromagnetic device and a third electromagnetic device arranged at intervals along the first direction.

[0020] The first electromagnetic device is used to attract the movable plate, causing the movable plate to move along the first direction to the first limiting part; the second electromagnetic device is used to attract the movable plate, causing the movable plate to rotate along the rotating shaft; and the third electromagnetic device is used to attract the movable plate, causing the movable plate to move along the first direction to the second limiting part.

[0021] Furthermore, the heat dissipation through holes include a first group of heat dissipation through holes and a second group of heat dissipation through holes spaced apart along the first direction. The first group of heat dissipation through holes and the second group of heat dissipation through holes are both rectangular in shape. The first group of heat dissipation through holes is located between the first electromagnetic device and the second electromagnetic device, and the second group of heat dissipation through holes is located between the second electromagnetic device and the third electromagnetic device.

[0022] Furthermore, the electromagnetic device is fixedly connected to the panel via a threaded connector.

[0023] Furthermore, the cabinet body is provided with an open receiving slot, the load is fixedly installed on the load bracket, and the load bracket is snapped into the receiving slot and closes the opening.

[0024] Furthermore, the cabinet also includes a baseboard management controller, which is electrically connected to the load and the electromagnetic device respectively. The baseboard management controller is used to monitor the power consumption of the load and control the on / off state of the first electromagnetic device, the second electromagnetic device and the third electromagnetic device.

[0025] Furthermore, the substrate management controller is configured such that when the movable plate is in the second operating condition and the power consumption of the load is within a first preset range, the substrate management controller controls the first electromagnetic device to conduct to form a first current and a first attraction force on the movable plate, controls the second electromagnetic device to conduct to form a second current and a second attraction force on the movable plate, and the first attraction force is greater than the second attraction force, thereby attracting the movable plate to adhere to the panel and move to the first limiting part;

[0026] When the movable plate is in the second operating condition and the power consumption of the load is within the second preset range, the substrate management controller controls the second electromagnetic device to conduct to form a third current and a third attraction force on the movable plate, controls the third electromagnetic device to conduct to form a fourth current and a fourth attraction force on the movable plate, and the fourth attraction force is greater than the third attraction force, thereby attracting the movable plate to adhere to the panel and move to the second limiting part.

[0027] Furthermore, the heat dissipation system also includes an air duct, a fan, and an air outlet. The air duct connects the air outlet and the heat dissipation through hole, and the fan is fixedly installed inside the air duct.

[0028] In addition to the technical problems solved by the embodiments of the present invention, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions as described above, other technical problems that the server provided by the embodiments of the present invention can solve, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 This is a front view of the server provided in an embodiment of the present invention in a vertical state between the active panel and the panel;

[0031] Figure 2 This is a top view of the server provided in an embodiment of the present invention in a vertical state between the active panel and the panel;

[0032] Figure 3 This is a front view of the server provided in an embodiment of the present invention with the active board and the panel in a bonded state;

[0033] Figure 4 A front view of the server provided in an embodiment of the present invention when the movable plate and the panel are in a state of being attached and the movable plate is moved to the first limiting part;

[0034] Figure 5 This is a front view of the server provided in an embodiment of the present invention when the movable plate and the panel are in contact and the movable plate has moved to the second limiting part.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1 - Cabinet, 100 - Load;

[0037] 200 - Panel, 300 - Movable panel;

[0038] 400 - Electromagnetic device; 500 - Board management controller;

[0039] 210 - Heat dissipation through hole, 211 - First group of heat dissipation through holes;

[0040] 212 - Second set of heat dissipation holes; 220 - First cylindrical protrusion;

[0041] 230 - Second cylindrical protrusion; 310 - Auxiliary through hole;

[0042] 410 - First electromagnetic device; 420 - Second electromagnetic device;

[0043] 430 - Third electromagnetic device. Detailed Implementation

[0044] As described in the background section, servers in related technologies suffer from the technical problem that the cooling effect of the heat dissipation system and the overall power consumption are difficult to adjust under different operating conditions. The inventors of this invention have discovered that in related technologies, servers include a cabinet and a load housed within the cabinet. The cabinet includes a panel. When the load generates heat, a heat dissipation system within the cabinet lowers the load's temperature. The heat dissipation system includes heat dissipation holes in the panel. Because the effective opening area of ​​these heat dissipation holes is fixed, the cooling effect and overall power consumption of the heat dissipation system remain unchanged even when the load's power consumption varies. Consequently, the cooling effect and overall power consumption of the heat dissipation system cannot be adjusted under different operating conditions.

[0045] To solve the above-mentioned technical problems, in the server provided by the embodiments of the present invention, when the power consumption of the load changes, an electromagnetic device is used to drive the movable plate to move relative to the panel, so as to change the overlap between the auxiliary through holes in the movable plate and the heat dissipation through holes in the panel, thereby adjusting the cooling effect of the heat dissipation system and the overall energy consumption of the machine under different operating conditions.

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0047] The first and second directions in this article are perpendicular to each other. The first direction can be... Figures 1-5 The left and right directions in the middle, the second direction can be Figure 2 The front and back directions in the middle.

[0048] like Figure 1 and Figure 2 As shown, the server provided in this embodiment of the invention includes a cabinet 1, a load 100 disposed within the cabinet 1, and a heat dissipation system. The cabinet 1 is the main structure of the server, and its shape is typically approximately rectangular. The load 100 is an electronic device within the cabinet 1 that performs specific functions, such as a hard drive for storage, a central processing unit for computation, or a graphics processor for processing image and graphics information. The load 100 generates heat during operation, causing its temperature to rise, which reduces its processing speed and may even damage it. The heat dissipation system is used to remove the heat generated by the load 100 during operation, reducing its temperature and thus protecting it.

[0049] The cabinet 1 includes a panel 200, a movable plate 300, and an electromagnetic device 400. The panel 200 is usually one end face of the cabinet 1 or a baffle surrounding the load 100. The panel 200 can be a rectangular flat plate. The panel 200 is provided with heat dissipation holes 210. The following description takes the panel 200 as the front face of the cabinet 1 as an example.

[0050] Both the movable plate 300 and the electromagnetic device 400 are mounted on the panel 200. The movable plate 300 has a first working condition and a second working condition. The movable plate 300 can be a rectangular flat plate and has auxiliary through holes 310. The movable plate 300 is made of a magnetic material (such as a magnet). The electromagnetic device 400 is used to drive the movable plate 300 to move or rotate. The first working condition of the movable plate 300 refers to a situation where the power consumption of the load is relatively higher than that of the second working condition. For example, the power consumption of the load 100 is 70% to 100% of the maximum power consumption of the load 100. The heat generated by the load is high, and the effective opening area of ​​the heat dissipation through holes corresponding to the load is the largest. The second working condition of the movable plate 300 refers to a situation where the power consumption of the load is relatively lower than that of the first working condition. For example, the power consumption of the load 100 is 0% to 70% of the maximum power consumption of the load 100. The heat generated by the load is low, and the effective opening area of ​​the heat dissipation through holes corresponding to the load changes.

[0051] The heat dissipation system includes heat dissipation through holes 210. When the movable plate 300 is in the first operating condition, the auxiliary through holes 310 are not connected to the heat dissipation system, and the total area of ​​the heat dissipation through holes 210 is the effective opening area of ​​the heat dissipation through holes 210. When the movable plate 300 is in the second operating condition, the auxiliary through holes 310 are connected to the heat dissipation system. In other words, when the movable plate 300 is in the first operating condition, the heat dissipation system only includes the heat dissipation through holes 210, but does not include the auxiliary through holes 310; when the movable plate 300 is in the second operating condition, the heat dissipation system includes both the heat dissipation through holes 210 and the auxiliary through holes 310.

[0052] When the movable plate 300 is in the second operating condition and the power consumption of the load 100 changes, the electromagnetic device 400 drives the movable plate 300 to move relative to the panel 200, such as by moving or rotating, to change the overlap between the auxiliary through hole 310 and the heat dissipation through hole 210. At this time, the area of ​​the overlapping part of the auxiliary through hole 310 and the heat dissipation through hole 210 is the effective opening area of ​​the heat dissipation through hole 210. Compared with the related technology where the effective opening area of ​​the heat dissipation through hole 210 is fixed, in this embodiment of the invention, the effective opening area of ​​the heat dissipation through hole 210 can be adjusted according to different operating conditions by adjusting the overlap between the auxiliary through hole 310 and the heat dissipation through hole 210, thereby adjusting the cooling effect of the heat dissipation system and the overall energy consumption of the machine.

[0053] In some embodiments, such as Figures 1-5 As shown, a first cylindrical protrusion 220 and a second cylindrical protrusion 230 are provided on the first end face of the panel 200 near the cabinet 1, so as to... Figure 1 Taking the indicated orientation as an example, the first end face of cabinet 1 is the bottom face of cabinet 1. A first cylindrical protrusion 220 has a first blind hole, and a second cylindrical protrusion has a second blind hole. The center lines of both the first and second blind holes extend along a first direction, which is the left-right direction. The first cylindrical protrusion 220, the second cylindrical protrusion 230, the first blind hole, and the second blind hole are used to install the movable plate 300. Along the second direction, the panel 200 has a support plate, or in other words, the panel 200 has a support plate extending along the second direction, which is... Figure 2 The up and down directions in the middle.

[0054] The movable plate 300 is equipped with a rotating shaft, one end of which is located in a first blind hole and the other end in a second blind hole. This allows the movable plate 300 to rotate relative to the panel 200 along the rotating shaft and move along the centerline of the rotating shaft. Since one end of the rotating shaft is located in the first blind hole and the other end in the second blind hole, the bottom of the first blind hole serves as the first limiting part of the movable plate 300, and the bottom of the second blind hole serves as the second limiting part of the movable plate 300. In other words, the range of movement of the movable plate 300 along the first direction is between the bottoms of the first and second blind holes. A support plate is engaged with the lower surface of the movable plate 300, and the rotation of the movable plate 300 along the rotating shaft 200 is restricted by the support plate. The support plate serves as the third limiting part of the movable plate 300. In other words, the rotation range of the movable plate 300 is 0° to 90°. The connection method between the movable plate 300 and the panel 200 provided in this embodiment enables the electromagnetic device 400 to drive the movable plate 300 to move relative to the panel 200 between the first limiting part and the second limiting part, and to rotate along the axis within the range of 0° to 90°.

[0055] In some embodiments, when the movable plate 300 is in the first working condition, the movable plate 300 is fixed to the third limiting portion, such as... Figure 1 and Figure 2 As shown, at this time, the movable plate 300 is perpendicular to the panel 200, and the effective opening area of ​​the heat dissipation through hole 210 is at its maximum. At this time, the power consumption of the load 100 can be 70% to 100% of the maximum power consumption of the load 100. For example, the movable plate 300 is fixed at the third limiting part under the repulsive force of the electromagnetic device 400, preventing the movable plate 300 from rotating along the axis.

[0056] When the movable plate 300 is in the second operating condition, and the power consumption of the load 100 is within a first preset range, for example, the power consumption of the load 100 is 40% to 70% of the maximum power consumption of the load 100, the movable plate 300, under the attraction of the electromagnetic device 400, rotates to fit against the panel 200 and moves along the first direction to the first limiting part, that is, the bottom of the first blind hole, as shown. Figure 4 As shown in the figure, the area enclosed by the dashed line is the part of the heat dissipation through hole 210 covered by the movable plate 300, and the shaded area is the part of the auxiliary through hole 310 covered by the panel 200. At this time, the auxiliary through hole 310 coincides with the first part of the heat dissipation through hole 210, and the ratio of the area of ​​the first part of the heat dissipation through hole 210 to the total area of ​​the heat dissipation through hole 210 is 2 / 3. The heat dissipation through hole 210 forms an effective opening area of ​​medium size.

[0057] When the movable plate 300 is in the second operating condition, and the power consumption of the load 100 is within a second preset range (e.g., the power consumption of the load 100 is 0% to 40% of its maximum power consumption), the movable plate 300, under the attraction of the electromagnetic device 400, rotates to fit against the panel 200 and moves along the first direction to the second limiting part, i.e., the bottom of the second blind hole. Figure 5 As shown in the figure, the area enclosed by the dashed line is the part of the heat dissipation through-hole 210 covered by the movable plate 300, and the shaded area is the part of the auxiliary through-hole 310 covered by the panel 200. At this time, the auxiliary through-hole 310 coincides with the second part of the heat dissipation through-hole 210, and the ratio of the area of ​​the second part of the heat dissipation through-hole 210 to the total area of ​​the heat dissipation through-hole 210 is 1 / 3, and the effective opening area of ​​the heat dissipation through-hole 210 is the smallest. This embodiment takes the load 100 under three power consumption conditions as an example. The electromagnetic device 400 drives the movable plate 300 to move relative to the panel 200, adjusting the overlap between the auxiliary through-hole 310 and the heat dissipation through-hole 210, thereby adjusting the effective opening area of ​​the heat dissipation through-hole 210, adjusting the cooling effect of the heat dissipation system and the overall power consumption of the machine. It should be noted that the three power consumption operating states of the load 100 and the movement form of the movable plate 300 are only illustrative examples.

[0058] In some embodiments, such as Figure 1 As shown, the electromagnetic device 400 is mounted on the panel 200 near the second end face of the cabinet 1, with the first and second end faces facing each other. Figure 1 Taking the shown orientation as an example, the first end face is the bottom surface of cabinet 1, and the second end face is the top surface of cabinet 1. The electromagnetic device 400 includes a first electromagnetic device 410, a second electromagnetic device 420, and a third electromagnetic device 430 spaced apart along a first direction. The first electromagnetic device 410 can attract the movable plate 300 to move along the first direction to the first limiting part; the second electromagnetic device 420 can attract the movable plate 300 to rotate along the pivot; and the third electromagnetic device 430 can attract the movable plate 300 to move along the first direction to the second limiting part. In this embodiment, the electromagnetic device 400 includes the first electromagnetic device 410, the second electromagnetic device 420, and the third electromagnetic device 430. The first electromagnetic device 410, the second electromagnetic device 420, and the third electromagnetic device 430 respectively control different movement forms of the movable plate 300, facilitating the movement of the movable plate 300 relative to the panel 200.

[0059] It should be noted that the electromagnetic device 400, including the first electromagnetic device 410, the second electromagnetic device 420, and the third electromagnetic device 430, is only for illustrative purposes. The number of electromagnetic devices 400 is not specifically required. For example, the electromagnetic device 400 may include the first electromagnetic device 410, the second electromagnetic device 420, the third electromagnetic device 430, and a fourth electromagnetic device, wherein the fourth electromagnetic device is close to the second electromagnetic device 420. The second electromagnetic device 420 and the fourth electromagnetic device together attract the movable plate 300 to rotate along the pivot, ensuring that the attraction force on the movable plate 300 is strong enough so that the movable plate 300 can fit against the panel 200.

[0060] In some embodiments, the heat dissipation through-holes 210 include a first group of heat dissipation through-holes 211 and a second group of heat dissipation through-holes 212 spaced apart along a first direction. Both the first group of heat dissipation through-holes 211 and the second group of heat dissipation through-holes 212 are rectangular in shape. The first group of heat dissipation through-holes 211 is located between the first electromagnetic device 410 and the second electromagnetic device 420, and the second group of heat dissipation through-holes 212 is located between the second electromagnetic device 420 and the third electromagnetic device 430. This arrangement of heat dissipation through-holes achieves heat dissipation while ensuring the structural strength of the panel 200.

[0061] In some embodiments, the electromagnetic device 400 is fixedly connected to the panel 200 by a threaded connector, which can be a screw. The above installation method is convenient to operate.

[0062] In some embodiments, such as Figure 1 As shown, the cabinet 1 has an open receiving slot. The load 100 is fixedly mounted on the load bracket, which snaps into the receiving slot and closes the opening. Alternatively, the load bracket is used to mount the load 100 inside the cabinet 1. This mounting method facilitates the removal and replacement of the load 100, allowing operators to easily replace or add / remove loads under different usage conditions. For example, if the load 100 is a hard drive, the operator can easily increase or decrease the number of loads 100 as the server's storage requirements increase or decrease. In this case, an electromagnetic device drives the movable plate 300 to move relative to the panel 200, changing the overlap between the auxiliary through-hole 310 and the heat dissipation through-hole 210 to accommodate different load requirements.

[0063] In some embodiments, such as Figure 1 and Figure 2 As shown, the cabinet 1 also includes a baseboard management controller 500. The baseboard management controller 500 is electrically connected to the load 100 and the electromagnetic device 400 respectively. The baseboard management controller 500 is used to monitor the power consumption of the load 100 and control the on / off state of the first electromagnetic device 410, the second electromagnetic device 420 and the third electromagnetic device 430, thereby controlling the attraction force of the first electromagnetic device 410, the second electromagnetic device 420 and the third electromagnetic device 430 on the movable plate 300.

[0064] When the movable plate 300 is in the second operating condition and the power consumption of the load 100 is within the first preset range, for example, the power consumption of the load 100 is 40% to 70% of the maximum power consumption of the load 100, the substrate management controller 500 controls the first electromagnetic device 410 to conduct to form a first current and a first attraction force on the movable plate 300, and controls the second electromagnetic device 420 to conduct to form a second current and a second attraction force on the movable plate 300, and the first attraction force is greater than the second attraction force, thereby attracting the movable plate 300 to adhere to the panel 200 and move to the first limiting part, so that the heat dissipation through hole 210 forms an effective opening area of ​​medium size.

[0065] When the movable plate 300 is in the second operating condition and the power consumption of the load 100 is within the second preset range, for example, the power consumption of the load 100 is 0% to 40% of the maximum power consumption of the load 100, the substrate management controller 500 controls the second electromagnetic device 420 to conduct to form a third current and a third attraction force on the movable plate 300, and controls the third electromagnetic device 430 to conduct to form a fourth current and a fourth attraction force on the movable plate 300, and the fourth attraction force is greater than the third attraction force, thereby attracting the movable plate 300 to adhere to the panel and move to the second limiting part, so as to minimize the effective opening area of ​​the heat dissipation through hole 210.

[0066] In addition, the substrate management controller 500 can also control the current direction in the electromagnetic device 400. For example, when the movable plate 300 is in the first working condition, the power consumption of the load 100 can be 70% to 100% of the maximum power consumption of the load 100. The substrate management controller 500 controls the second electromagnetic device 420 to conduct to form a fifth current. The direction of the fifth current is opposite to the direction of the first current, so that the second electromagnetic device 420 generates a first repulsive force on the movable plate 300, so that the movable plate 300 is fixed in the third limiting part under the action of the repulsive force of the electromagnetic device 400, and the effective opening area of ​​the heat dissipation through hole 210 is maximized.

[0067] In this embodiment, the baseboard management controller 500 monitors the power consumption of the load 100 and controls the on / off state and current direction of the first electromagnetic device 410, the second electromagnetic device 420, and the third electromagnetic device 430. This causes the first electromagnetic device 410, the second electromagnetic device 420, and the third electromagnetic device 430 to generate attractive or repulsive forces on the movable plate 300, thereby driving the movable plate 300 to move relative to the panel 200. This changes the overlap between the auxiliary through hole 310 and the heat dissipation through hole 210, thereby adjusting the cooling effect of the heat dissipation system and the overall power consumption under different operating conditions. Since the baseboard management controller 500 is a commonly used controller in servers, no additional control unit is required, making the above control method easy to implement.

[0068] In some embodiments, the heat dissipation system further includes an air duct, a fan, and an air outlet. The air duct connects the air outlet and the heat dissipation hole 210. The fan is fixedly installed at one end of the air duct near the air outlet. Driven by the fan, cold air can enter the air duct through the heat dissipation hole 210, thereby cooling the load. The cold air becomes hot air, and finally the hot air is discharged from the air outlet. The above arrangement can enable the heat dissipation system to achieve a better cooling effect through the drive of the fan.

[0069] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0070] In the description of this invention, the various embodiments or implementation methods are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0071] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0073] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0074] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0076] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A server, characterized in that, It includes a cabinet and a load disposed within the cabinet, and a heat dissipation system for dissipating heat from the load; the cabinet includes a panel, a movable plate, and an electromagnetic device; The heat dissipation system includes heat dissipation through holes provided in the panel, and the movable plate is provided with auxiliary through holes; Both the movable plate and the electromagnetic device are mounted on the panel. The movable plate has a first working condition and a second working condition. When the movable plate is in the first working condition, the auxiliary through hole is not connected to the heat dissipation system. When the movable plate is in the second working condition, the auxiliary through hole is connected to the heat dissipation system. The electromagnetic device is configured such that when the movable plate is in the second working condition and the power consumption of the load changes, the electromagnetic device drives the movable plate to move relative to the panel to change the overlap between the auxiliary through hole and the heat dissipation through hole. The panel is provided with a first cylindrical protrusion and a second cylindrical protrusion at the first end face near the cabinet. The first cylindrical protrusion is provided with a first blind hole, and the second cylindrical protrusion is provided with a second blind hole. The center lines of the first blind hole and the second blind hole both extend along the first direction. The movable plate is provided with a rotating shaft, one end of which is located in the first blind hole and the other end is located in the second blind hole. The movable plate can rotate along the center line of the rotating shaft and move along the direction of the center line of the rotating shaft. The bottom of the first blind hole is a first limiting part, and the bottom of the second blind hole is a second limiting part. The panel is provided with a support plate along the second direction, the support plate is snapped onto the lower surface of the movable plate, and the support plate is a third limiting part.

2. The server according to claim 1, characterized in that, When the movable plate is in the first working condition, the movable plate is fixed at the third limiting part, the movable plate is perpendicular to the panel, and the effective opening area of ​​the heat dissipation through hole is maximized. When the movable plate is in the second working condition and the power consumption of the load is within the first preset range, the movable plate rotates to fit against the panel and moves to the first limiting part along the first direction under the attraction of the electromagnetic device. The auxiliary through hole coincides with the first part of the heat dissipation through hole, and the ratio of the area of ​​the first part of the heat dissipation through hole to the total area of ​​the heat dissipation through hole is 2 / 3. The heat dissipation through hole forms an effective opening area of ​​medium size. When the movable plate is in the second working condition and the power consumption of the load is within the second preset range, the movable plate rotates to fit against the panel under the attraction of the electromagnetic device and moves to the second limiting part along the first direction. The auxiliary through hole coincides with the second part of the heat dissipation through hole, and the ratio of the area of ​​the second part of the heat dissipation through hole to the total area of ​​the heat dissipation through hole is 1 / 3. The effective opening area of ​​the heat dissipation through hole is the smallest.

3. The server according to claim 2, characterized in that, The electromagnetic device is installed on the panel near the second end face of the cabinet, the first end face is opposite to the second end face, and includes a first electromagnetic device, a second electromagnetic device and a third electromagnetic device arranged at intervals along the first direction. The first electromagnetic device is used to attract the movable plate, causing the movable plate to move along the first direction to the first limiting part; the second electromagnetic device is used to attract the movable plate, causing the movable plate to rotate along the rotating shaft; and the third electromagnetic device is used to attract the movable plate, causing the movable plate to move along the first direction to the second limiting part.

4. The server according to claim 3, characterized in that, The heat dissipation through holes include a first group of heat dissipation through holes and a second group of heat dissipation through holes spaced apart along the first direction. Both the first group of heat dissipation through holes and the second group of heat dissipation through holes are rectangular in shape. The first group of heat dissipation through holes is located between the first electromagnetic device and the second electromagnetic device, and the second group of heat dissipation through holes is located between the second electromagnetic device and the third electromagnetic device.

5. The server according to claim 1, characterized in that, The electromagnetic device is fixedly connected to the panel via a threaded connector.

6. The server according to claim 1, characterized in that, The cabinet is provided with an open receiving slot, and the load is fixedly installed on the load bracket. The load bracket is snapped into the receiving slot and closes the opening.

7. The server according to claim 3, characterized in that, The cabinet also includes a baseboard management controller, which is electrically connected to the load and the electromagnetic device respectively. The baseboard management controller is used to monitor the power consumption of the load and control the on / off state of the first electromagnetic device, the second electromagnetic device and the third electromagnetic device.

8. The server according to claim 7, characterized in that, The substrate management controller is configured such that when the movable plate is in the second working condition and the power consumption of the load is within a first preset range, the substrate management controller controls the first electromagnetic device to conduct to form a first current and a first attraction force on the movable plate, controls the second electromagnetic device to conduct to form a second current and a second attraction force on the movable plate, and the first attraction force is greater than the second attraction force, thereby attracting the movable plate to adhere to the panel and move to the first limiting part; When the movable plate is in the second operating condition and the power consumption of the load is within the second preset range, the substrate management controller controls the second electromagnetic device to conduct to form a third current and a third attraction force on the movable plate, controls the third electromagnetic device to conduct to form a fourth current and a fourth attraction force on the movable plate, and the fourth attraction force is greater than the third attraction force, thereby attracting the movable plate to adhere to the panel and move to the second limiting part.

9. The server according to claim 1, characterized in that, The heat dissipation system also includes an air duct, a fan, and an air outlet. The air duct connects the air outlet and the heat dissipation through hole, and the fan is fixedly installed inside the air duct.

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