Predetermined line position determination method and apparatus, processing method, electronic device, and medium

Abstract

This invention provides a method and apparatus for determining the position of a predetermined line, a processing method, an electronic device, and a medium. The method includes: determining the initial physical position of at least one predetermined line based on the image position of a first product feature in a first image and the relative positional relationship between at least one predetermined line and the first product feature; determining a second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, based at least on a first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, wherein the second product feature is a feature on the second image, and the first and second product features correspond to the same feature on the workpiece to be processed; and determining the target physical position of at least one predetermined line based on the initial physical position and the second physical position difference. This method enables high-precision positioning of products of different sizes.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a method for determining the position of a predetermined line for a processing apparatus, a device for determining the position of a predetermined line for a processing apparatus, a processing method for a workpiece, an electronic device, and a storage medium. Background Technology

[0002] In many industries, such as the semiconductor industry, vision is required for positioning certain processing equipment. For example, laser processing equipment used to dicing wafers needs to use vision to position the dicing track on the wafer so that the dicing track is parallel to the horizontal direction (X-axis movement direction, the X-axis motion mechanism drives the wafer to move along the X-axis, during which the laser processing equipment processes the wafer).

[0003] Traditional laser processing equipment relies solely on mechanical or high-precision vision methods to position products. Mechanical positioning has relatively low accuracy, making it difficult to level the product and meet modern manufacturing requirements. Vision systems, on the other hand, have limited field of view. For example, a single, large-field-of-view vision system struggles to meet accuracy requirements, while a single, small-field-of-view system finds it difficult to precisely position large products. Summary of the Invention

[0004] The present invention was proposed in view of the above-mentioned problems. The present invention provides a method and apparatus for determining the predetermined line position of a processing device, a processing method for a workpiece, an electronic device, and a storage medium.

[0005] According to a first aspect of the present invention, a method for determining the position of a predetermined line for a processing apparatus is provided. The predetermined line is a feature line on a workpiece to be processed. The processing apparatus includes a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device. The method includes: determining the initial physical position of at least one predetermined line based on the image position of a first product feature in a first image and the relative positional relationship between at least one predetermined line and the first product feature, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed; determining a second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, at least based on a first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, wherein the second product feature is a feature on a second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed; and determining the target physical position of at least one predetermined line according to the initial physical position and the second physical position difference.

[0006] For example, the first product feature is a feature point. Determining the initial physical position of at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between the first product feature and at least one predetermined line includes: identifying the first product feature and the contour of the workpiece from the first image; determining at least one first straight line along a first direction, and / or, determining at least one second straight line along a second direction, wherein the first direction is perpendicular to the second direction, one of the at least one first straight line passes through the first product feature, one of the at least two second straight lines passes through the first product feature, the distance between any two first straight lines is equal to the spacing between the predetermined lines in the second direction, and the distance between any two second straight lines is equal to the spacing between the predetermined lines in the first direction; determining the initial physical position of at least one predetermined line based on the at least one first straight line and / or at least one second straight line, and based on the contour.

[0007] For example, determining the initial physical position of at least one predetermined line based on at least one first straight line and / or at least one second straight line, and based on a contour, includes: determining the intersection point between the line and the contour for each of the at least one first straight line or for each of the at least one second straight line; determining whether the number of intersection points is greater than or equal to a preset number; if the number of intersection points is greater than or equal to the preset number, selecting the two outermost intersection points on the line as the start and end points of the predetermined line corresponding to the line; and determining the initial physical position of the predetermined line corresponding to the line based on the image positions of the start and end points in the first image.

[0008] For example, the first direction or the second direction is a direction parallel to the feature edge on the workpiece.

[0009] For example, after identifying the first product feature and the outline of the workpiece from the first image, the method further includes: dilating the outline such that the outline expands outward by a first width along a first direction and / or expands outward by a second width along a second direction; wherein the first width is greater than or equal to the spacing of predetermined lines in the second direction, and the second width is greater than or equal to the spacing of predetermined lines in the first direction.

[0010] For example, expanding a contour includes: expanding the contour in response to an expansion command input by a user on a user interface.

[0011] For example, before determining the initial physical position of at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature, the method further includes: acquiring a third image of the workpiece acquired by the first image acquisition device; determining the angle between the feature edge on the workpiece and the preset direction in the third image; controlling the rotation of the workpiece based on the angle so that the feature edge is parallel to the preset direction; wherein the first image is acquired when the feature edge is parallel to the preset direction.

[0012] For example, at least based on a first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, a second physical position difference is determined between the physical positions corresponding to the first product feature and the second product feature at the same calibration time. This includes: determining a third physical position difference between the physical position corresponding to the first product feature in the first image and the physical position corresponding to the first field of view center of the first image acquisition device when acquiring the first image, based on the image position difference between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device; and determining a third physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the first field of view center when acquiring the first image, based on the third physical position difference and the first physical position difference. The fourth physical position difference is calculated between the physical position corresponding to the first product feature and the physical position corresponding to the second field of view center of the second image acquisition device; the workpiece is moved by a distance equal to the fourth physical position difference, wherein the second image is acquired by the second image acquisition device after the workpiece stops moving; based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center, the physical position difference between the physical position corresponding to the second product feature and the physical position corresponding to the second field of view center when acquiring the second image is determined, and the calculated physical position difference is determined as the second physical position difference, and the calibration time is the time when the second image is acquired.

[0013] For example, before determining the second physical position difference between the physical position of the first product feature and the physical position of the second product feature at the same calibration time, based at least on the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, the method further includes: determining the first physical position of the workpiece to be processed when the rotation axis coincides with the first field of view center of the first image acquisition device, wherein the rotation axis is the axis around which the workpiece to be processed rotates; determining the second physical position of the workpiece to be processed when the rotation axis coincides with the second field of view center of the second image acquisition device; calculating the physical position difference between the first physical position and the second physical position, and determining the calculated physical position difference as the first physical position difference.

[0014] For example, determining the first physical position of the workpiece when the rotation axis coincides with the field of view center of the first image acquisition device includes: acquiring a first template image and multiple first test images, wherein the first template image contains a first identification feature on the workpiece, the multiple first test images are images acquired by the first image acquisition device for the workpiece when it is in multiple different third physical positions, the number of multiple first test images is greater than or equal to 3, and the multiple different third physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; for each of the multiple first test images, determining the image position of the first identification feature in the first test image based on the first template image; determining the first image position corresponding to the rotation axis based on the image position of the first identification feature in the multiple first test images; and determining the first physical position of the workpiece when the rotation axis coincides with the first field of view center based on the first image position corresponding to the rotation axis and the image position corresponding to the first field of view center. ; and / or, determining the second physical position of the workpiece when the rotation axis coincides with the field of view center of the second image acquisition device includes: acquiring a second template image and multiple second test images, wherein the second template image contains a second identification feature on the workpiece, the multiple second test images are images acquired by the second image acquisition device for the workpiece when the workpiece is in multiple different fourth physical positions, the number of multiple second test images is greater than or equal to 3, and the multiple different fourth physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; for each of the multiple second test images, determining the image position of the second identification feature in the second test image according to the second template image; determining the second image position corresponding to the rotation axis through the image position of the second identification feature in the multiple second test images; determining the second physical position of the workpiece when the rotation axis coincides with the second field of view center according to the second image position corresponding to the rotation axis and the image position corresponding to the second field of view center.

[0015] For example, the workpiece to be processed is a wafer, the first template image includes the wafer, the first identification feature is the center point of the wafer, and the second template image includes the intersection area of ​​two mutually perpendicular predetermined lines on the wafer and a predetermined range around the intersection area.

[0016] According to a second aspect of the present invention, a method for processing a workpiece is also provided, comprising: determining a target physical position of at least one predetermined line according to the predetermined line position determination method for a processing apparatus described above; and processing the workpiece based at least on the target physical position of at least one predetermined line.

[0017] According to a third invention of the present invention, a predetermined line position determination device for a processing apparatus is also provided. The predetermined line is a feature line on a workpiece to be processed. The processing apparatus includes a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than that of the second image acquisition device. The predetermined line position determination device includes: a first determination module, configured to determine the initial physical position of at least one predetermined line based on the image position of a first product feature in a first image and the relative positional relationship between at least one predetermined line and the first product feature, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed; a second determination module, configured to determine the second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, based at least on the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, wherein the second product feature is a feature on a second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed; and a third determination module, configured to determine the target physical position of at least one predetermined line according to the initial physical position and the second physical position difference.

[0018] According to a fourth aspect of the present invention, an electronic device is also provided, comprising a processor and a memory, characterized in that the memory stores a computer program, the processor executing the computer program to implement the above-described method for determining the predetermined line position for a processing apparatus.

[0019] According to a fifth aspect of the present invention, a storage medium storing a computer program / instructions is also provided, characterized in that the computer program / instructions, when executed by a processor, implement the above-described method for determining the predetermined line position for a processing apparatus.

[0020] According to embodiments of the present invention, a method and apparatus for determining the position of a predetermined line in a processing device, a processing method for a workpiece, an electronic device, and a storage medium employ two image acquisition devices with different field-of-view sizes to acquire images of the workpiece. Based on the image acquired by the first image acquisition device with the large field of view, a coarse predetermined line positioning can be performed to obtain the initial physical position of the predetermined line. The positioning deviation of the predetermined line is determined based on the deviation between product features in the images acquired by the two image acquisition devices. Based on the positioning deviation and the coarse predetermined line positioning result, a precise predetermined line positioning result (i.e., the final physical position) is obtained. This scheme can achieve high-precision positioning of products of different sizes (especially large-sized products) through the cooperation of two image acquisition devices with different field of view.

[0021] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0022] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0023] Figure 1 A schematic flowchart of a method for determining the position of a predetermined line according to an embodiment of the present invention is shown;

[0024] Figure 2 A schematic diagram of an image coordinate system established for a first image according to an embodiment of the present invention is shown;

[0025] Figure 3 A schematic diagram showing the angle between a feature edge on a third image and a preset direction according to an embodiment of the present invention is shown;

[0026] Figure 4 A schematic diagram of a template image according to an embodiment of the present invention is shown;

[0027] Figure 5 A schematic diagram of an image coordinate system established for a first image to be tested according to an embodiment of the present invention is shown;

[0028] Figure 6 A schematic flowchart of a processing method for a workpiece according to an embodiment of the present invention is shown;

[0029] Figure 7 A schematic block diagram of a predetermined line position determination device for a processing apparatus according to an embodiment of the present invention is shown;

[0030] Figure 8 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0032] To at least partially solve the above-mentioned problems, embodiments of the present invention provide a method for determining the position of a predetermined line in a processing apparatus. The predetermined line is any feature line on a workpiece to be processed. The workpiece to be processed can be any item, such as a wafer. The processing apparatus may include a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than that of the second image acquisition device; this can also be understood as the resolution of the first image acquisition device being lower than that of the second image acquisition device. For example, the first image acquisition device can be considered a wide-field-of-view camera, and the second image acquisition device a narrow-field-of-view camera; in other words, the first image acquisition device has a larger acquisition range but lower resolution, while the second image acquisition device has a smaller acquisition range but higher resolution. Figure 1 A schematic flowchart of a predetermined line position determination method 100 according to an embodiment of the present invention is shown, as follows: Figure 1 As shown, the method 100 may include the following steps S110, S120 and S130.

[0033] Step S110: Based on the image position of the first product feature in the first image and the relative positional relationship between the first product feature and the first product feature, determine the initial physical position of the at least one predetermined line, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed.

[0034] Exemplarily, a first image of the workpiece is acquired using a first image acquisition device with a large field of view. In one embodiment, the first image may include a first product feature of the workpiece. The product feature described herein can be any identifiable feature on the workpiece. Exemplarily, the product feature can be a feature inherent to the workpiece itself, such as a feature of a certain shape or structure. Exemplarily, the product feature can also be a feature additionally marked on the workpiece by manual means or a processing device, such as an easily identifiable symbol, pattern, etc. The product feature can be of any shape, such as a circle, cross, or star. Preferably, the product feature is the center of a kerf at a specific location on the workpiece, such as the center of a kerf at the very center of a wafer, which is also the wafer center. The aforementioned kerf center refers to the center point of the intersection area of ​​two mutually perpendicular kerfs. The predetermined line is any feature line on the workpiece. In one example, the predetermined line can be a kerf on the wafer, and at least one predetermined line is at least one kerf on the wafer.

[0035] To facilitate understanding later, the methods for measuring physical location and image location mentioned in this article are described below.

[0036] The image position of any object (e.g., the first product feature) described herein can be represented by pixel coordinates in the image coordinate system in which the object is located. Figure 2 A schematic diagram of an image coordinate system established for a first image according to an embodiment of the present invention is shown. For example, the origin o can be established with the upper left corner vertex of the first image as the origin o, the x-axis being the side passing through the origin o and parallel to the upper side of the first image, and the y-axis being the side passing through the origin o, perpendicular to the x-axis, and parallel to the left side of the first image. Figure 2 The image coordinate system shown is as follows. For example, the first image contains a total of 1000×1000 pixels. The first product feature is located at the 450th pixel in the x-direction and the 480th pixel in the y-direction. Therefore, the image position of the first product feature can be represented as (450, 480).

[0037] The various physical positions described herein can be represented by coordinates in the same world coordinate system. An example of establishing such a world coordinate system is described below. A workpiece can be placed on a movable device (e.g., a movable stage). The movable stage can translate within a plane (which may be called the "movement plane") or rotate within that plane about a fixed axis of rotation. The workpiece moves synchronously with the movable stage; therefore, the physical position of the movable stage described herein can be considered the same as the physical position of the workpiece, and they can be interchanged. Within the movement range of the movable stage, two mutually perpendicular grating rulers can be provided. For example, when the movable stage stops at a predetermined initial physical position, the reading of the grating rulers can be set to 0, and this physical position can be defined as the origin O of the world coordinate system. A first grating ruler can be provided along a first direction through the origin O, and the axis containing the first grating ruler can be used as the X-axis of the world coordinate system. A second grating ruler is provided perpendicular to the X-axis and through the origin O. The axis containing the second grating ruler can be used as the Y-axis of the world coordinate system. The first direction can be defined as needed. For ease of description, this paper defines the first direction as the horizontal direction, which is also the X-axis direction. The Y-axis direction, perpendicular to the X-axis direction, is defined as the vertical direction. After establishing the above world coordinate system, each time the movable stage moves, i.e., when the workpiece moves, the corresponding X-axis and Y-axis coordinates can be read from the first and second grating rulers. This (X,Y) coordinate can be used to represent the physical position of the workpiece. It can be understood that (X,Y) can be coordinate data used to represent the displacement of the workpiece.

[0038] The relative positional relationship between the first product feature and any predetermined line can be known. For example, if the first product feature is the wafer center, and the predetermined line (hereinafter referred to as the first predetermined line) is a predetermined line that does not pass through the wafer center but is closest to the wafer center and is located on either side of the predetermined line passing through the wafer center along the first direction, the relative positional relationship between the wafer center and the predetermined line is: the vertical distance from the wafer center to the predetermined line is equal to the spacing of the predetermined lines in the first direction. Based on the image position of the first product feature and the relative positional relationship between the first product feature and any predetermined line, the initial physical position of the predetermined line can be determined. The relative positional relationship between the first product feature and each predetermined line can be known. The following combines... Figure 2 This describes an exemplary implementation for determining the initial physical location of a predetermined line. (See also...) Figure 2 In the center of the first image, a cross-shaped icon marks the location of the wafer center. The center of the cross-shaped icon is the wafer center, which can be considered the first product feature. Furthermore, Figure 2A predetermined line (e.g., a dicing ridge) is also shown, with two intersection points M1 and M2 with the wafer outline. These two intersection points can be considered as the start and end points of the predetermined line. Using the relative positional relationship between the image position of the wafer center and the image positions of intersection points M1 and M2, the initial image positions of M1 and M2 and / or the initial image positions of all points along the entire predetermined line M1M2 can be determined. The initial image positions of the start and end points and / or the initial image positions of all points along the entire predetermined line are then defined as the initial image positions of the predetermined line. Based on the transformation relationship between the image position in the image acquired by the first image acquisition device and the physical position in the world coordinate system, the initial image position of the predetermined line can be converted into an initial physical position. This transformation relationship can be pre-stored in a storage device. The storage device can be a storage device included in the device (e.g., a host computer) used to execute the predetermined line position determination method 100, or it can be a separate storage device. The device used to execute the predetermined line position determination method 100 can be communicatively connected to this separate storage device. The initial physical position is a coarsely located physical position, also referred to as a rough physical position.

[0039] Step S120: Based at least on the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, determine the second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time. The second product feature is a feature on the second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed.

[0040] The second physical position difference (ΔX2, ΔY2) between the physical positions corresponding to the first product feature and the second product feature at the same calibration time can be determined at least based on the first physical position difference (ΔX1, ΔY1) between the first and second image acquisition devices. The first physical position difference between the physical positions corresponding to the first and second image acquisition devices can be obtained in any manner. For example, the first physical position difference between the two image acquisition devices can be measured using a measuring device. Another example is that the physical position of the workpiece can be determined when the field of view centers of the two image acquisition devices coincide with the rotation axis of the workpiece, and the difference between the two determined physical positions can be calculated to obtain the first physical position difference; this method will be described below.

[0041] For example, the second image may represent an image captured by a second image acquisition device with a smaller field of view. The second image contains a second product feature. The first product feature and the second product feature correspond to the same feature on the workpiece to be processed. For example, both may be the center of the dicing track at the very center of the wafer, which is also the wafer center. In one example, the first image acquisition device is a wide-field-of-view camera, which can capture a first image containing the entire wafer. Based on the first image captured by the wide-field-of-view camera, the location of the wafer center can only be roughly determined. That is, due to resolution and other issues, the wafer center cannot be accurately identified, and therefore the location of the dicing track center that coincides with the wafer center cannot be accurately identified. The second image acquisition device may be a small-field-of-view camera, which can capture a clearer dicing track center within its field of view. A preferable approach is to set the field of view (i.e., image acquisition range) of the small-field-of-view camera to capture only a single kerf center at a time, placing the kerf center coinciding with the wafer center within the small-field-of-view camera's field of view. Alternatively, the influence of other kerf centers can be eliminated by occluding those coinciding with the wafer center, ensuring that the second image captured by the small-field-of-view camera only contains the kerf center coinciding with the wafer center. Based on the second image captured by the small-field-of-view camera, the location of the kerf center coinciding with the wafer center can be identified. Therefore, the first product feature captured by the large-field-of-view camera, or identified from the first image, is a relatively coarse wafer center, while the second product feature captured by the small-field-of-view camera, or identified from the second image, is a more precise kerf center coinciding with the wafer center, i.e., a more precise wafer center. It is evident that the first product feature and the second product feature essentially correspond to the same feature. The difference lies in the resolution of the images acquired by the two image acquisition devices, leading to a difference in their corresponding image positions. Furthermore, there is a difference in their physical positions at the same moment (referred to as the calibration moment in this paper) (i.e., the second physical position difference). Detecting this difference allows us to determine the "error" in the initial physical position of any predetermined line determined based on the first image. Correcting the initial physical position based on this "error" allows us to consider the corrected physical position as the precise physical position of the current predetermined line, i.e., the target physical position.

[0042] Step S130: Determine the target physical position of at least one predetermined line based on the difference between the initial physical position and the second physical position.

[0043] As described above, the initial physical position of the predetermined line is corrected based on the second physical position difference to obtain the target physical position. The correction can be achieved by shifting the initial physical position by the distance corresponding to the second physical position difference. The shifted physical position can then be used as the target physical position. For example, based on the obtained initial physical position and the second physical position difference (ΔX2, ΔY2) of the predetermined line, the target physical position of the workpiece can be determined to be at a physical position ΔX2 to the right along the X-axis and ΔY2 upwards along the Y-axis from the initial physical position.

[0044] According to the method for determining the position of a predetermined line for a processing apparatus according to embodiments of the present invention, two image acquisition devices with different field-of-view sizes are used to acquire images of the workpiece to be processed. The image acquired by the first image acquisition device with the large field of view allows for coarse positioning of the predetermined line, obtaining the initial physical position of the predetermined line. The positioning deviation of the predetermined line is determined based on the deviation between product features in the images acquired by the two image acquisition devices. Based on the positioning deviation and the coarse positioning result, a precise positioning result (i.e., the target physical position) of the predetermined line is obtained. This scheme can achieve high-precision positioning of products of different sizes (especially large-sized products) through the cooperation of two image acquisition devices with different field of view.

[0045] For example, the first product feature is a feature point. Based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature, the initial physical position of at least one predetermined line is determined. (Step S110) may include: identifying the first product feature and the contour of the workpiece from the first image; determining at least one first straight line along a first direction, and / or determining at least one second straight line along a second direction, wherein the first direction is perpendicular to the second direction, one of the at least one first straight line passes through the first product feature, one of the at least two second straight lines passes through the first product feature, the distance between any two first straight lines is equal to the spacing between the predetermined lines in the second direction, and the distance between any two second straight lines is equal to the spacing between the predetermined lines in the first direction; determining the initial physical position of at least one predetermined line based on at least one first straight line and / or at least one second straight line, and based on the contour.

[0046] In one embodiment, the first product feature can be represented by feature points, such as... Figure 2 The wafer center is shown. First product features and the outline of the workpiece to be processed are identified from the first image. (Refer to...) Figure 2 The black circular area represents the wafer. The outline of this black circular area is the outline of the wafer. For each pixel in the first image, a grayscale threshold can be set to obtain the wafer outline. The grayscale threshold can be any value, for example, a grayscale threshold of 50. (See reference...) Figure 2The darker areas represent the regions corresponding to pixels with grayscale values ​​less than 50. This allows us to obtain the area occupied by the wafer and its outline.

[0047] One or more straight lines can be defined along a first direction. The first direction can be any direction, such as the horizontal direction. In the case of defining multiple first straight lines along the first direction, the distance between any two first straight lines is equal to the spacing between predetermined lines in a second direction. For example, a first straight line can be drawn first along the first direction through a first product feature, and then a second first straight line can be drawn horizontally at a position separated from the first first straight line by a first spacing. Then, a third first straight line can be drawn horizontally at a position separated from the second first straight line by a first spacing, and so on. The first spacing is the spacing between two predetermined lines extending along the first direction in the second direction.

[0048] Furthermore, at least one second straight line can be defined along the second direction. The first direction is perpendicular to the second direction, and the second direction can be, for example, a vertical direction. In the case of multiple second straight lines defined along the second direction, the distance between any two second straight lines is equal to the spacing between predetermined lines in the first direction. For example, a first second straight line can be drawn along the second direction through a first product feature, and then a second second straight line can be drawn horizontally at a position separated from the first second straight line by a second spacing. Then, a third second straight line can be drawn horizontally at a position separated from the second second straight line by a second spacing. And so on. The second spacing is the spacing between two predetermined lines extending along the second direction in the first direction.

[0049] The number of multiple first straight lines and the number of multiple second straight lines can be the same or different. As mentioned above, among the multiple first straight lines and multiple second straight lines, there exists one first straight line and one second straight line that pass through the first product feature (e.g., Figure 2 (Wafer center shown). The initial physical locations of multiple dicing lines can be determined based on at least one first straight line and / or at least one second straight line and the wafer profile.

[0050] According to the above technical solution, the initial physical position of at least one predetermined line can be determined by using at least one first straight line determined along a first direction and / or at least one second straight line determined along a second direction, combined with the contour of the workpiece to be processed. This method can automatically, simply, and quickly determine the initial physical position of each of the at least one predetermined line.

[0051] For example, determining the initial physical position of at least one predetermined line based on at least one first straight line and / or at least one second straight line, and based on a contour, may include: determining the intersection points between the line and the contour; determining whether the number of intersection points is greater than or equal to a preset number; if the number of intersection points is greater than or equal to the preset number, selecting the two outermost intersection points on the line as the start and end points of the predetermined line corresponding to the line; and determining the initial physical position of the predetermined line corresponding to the line based on the image positions of the start and end points in the first image.

[0052] In one embodiment, taking a first direction as an example, the initial physical positions of multiple predetermined lines in the first direction are determined based on multiple first straight lines and the outline of the wafer. For each first straight line, the following operations may be performed.

[0053] The intersection points between the first straight line and the wafer outline are determined. For example, the intersection points between the straight line and the wafer outline are a, b, and c in sequence. Then, it can be determined whether the number of intersection points is greater than or equal to a preset number. The preset number can be any value set by the user. For example, the preset number can be 2. If the number of intersection points is greater than or equal to the preset number, the two outermost intersection points on the straight line are selected as the start and end points of the predetermined line corresponding to the straight line. That is, intersection point a and intersection point c can be selected as the start and end points of the corresponding predetermined line, respectively. If the number of intersection points is less than the preset number, the straight line can be discarded. In the first image, the image positions of the start point (intersection point a) and the end point (intersection point c) can be determined. Based on the image positions of the start and end points in the first image, the physical positions corresponding to the start and end points can be determined using the conversion relationship between image positions and physical positions described above, and thus the initial physical position of the predetermined line corresponding to the straight line can be determined. For example, the initial physical position of the predetermined line can be represented by the physical position of the start point and the physical position of the end point of the predetermined line.

[0054] The above embodiments are described below in conjunction with the scheme for determining the position of dicing tracks on the wafer. The spacing between dicing tracks in the horizontal and vertical directions of the wafer is known, depending on the product attributes. A horizontal straight line can be drawn through the center of the wafer, and the intersection points of this line and the wafer outline can be determined. Normally, there are two intersection points, which can be recorded. If there is dirt on the wafer, the number of intersection points may be less than two. Therefore, if the number of intersection points is less than two, the line can be omitted. If there are pits or debris on the wafer, there may be more than two intersection points. If there are more than two intersection points, the leftmost and rightmost intersection points can be selected and recorded. The physical positions corresponding to the two points recorded are the approximate physical positions of the start and end points of a horizontal dicing track. The distance between these two points is the approximate length of the dicing track. Then, the wafer center can be moved upward by a distance equal to the horizontal dicing track spacing to obtain a new center point. The horizontal dicing track spacing can be obtained by converting the spacing between two horizontal dicing tracks in the world coordinate system to the spacing in the image coordinate system. Draw a horizontal straight line through the new center point and determine its intersection with the wafer profile. This gives you the start and end points of the dicing treads. Repeat this process until the drawn line no longer intersects the wafer profile. Then, return to the wafer center and move it downwards by a horizontal dicing tread spacing to obtain a new center point. Draw another horizontal straight line through this new center point and determine its intersection with the wafer profile. This gives you the start and end points of the dicing treads. Repeat this process until the drawn line no longer intersects the wafer profile. This allows you to determine the approximate coordinates of the start and end points of the horizontal dicing treads and their approximate lengths.

[0055] Next, return to the wafer center and draw a vertical line through it, finding the intersection point with the wafer outline. If there are two intersection points, record them. If there are fewer than two, don't record them. If there are more than two, record the top and bottom points. The physical positions corresponding to these two recorded points are the approximate physical positions of the start and end points of a vertical kerf. The distance between these two points is the approximate length of the kerf. Then, move the wafer center to the left by the distance of one vertical kerf spacing to obtain a new center point. The vertical kerf spacing can be obtained by converting the spacing between two vertical kerfs in the world coordinate system to the spacing in the image coordinate system. Draw a vertical line through the new center point and determine the intersection point of this line with the wafer outline, obtaining the start and end points of the kerf. Continue this process until the drawn line has no intersection points with the wafer outline. Then, return to the wafer center and move it horizontally to the right by a distance equal to the vertical kerf spacing to obtain a new center point. Draw a vertical line through this new center point and determine the intersection of this line with the wafer profile to obtain the start and end points of the kerfs. Repeat this process until the drawn line no longer intersects the wafer profile. Record the approximate lengths of all vertical kerfs and the approximate physical locations (i.e., world coordinates) of the start and end points of the kerfs.

[0056] According to the above technical solution, by determining whether the number of intersections between the straight line and the contour meets the preset requirement, the starting point and ending point of the straight line are determined, thereby determining the initial physical position of the corresponding predetermined line. This method can eliminate the possibility that the straight line passes through areas of dirt or other defects on the wafer, which helps to improve the accuracy of the determined predetermined line.

[0057] For example, the first direction or the second direction is a direction parallel to the feature edge on the workpiece.

[0058] In one embodiment, such as Figure 2 The flat edge at the top of the wafer, indicated by the black arrow, can represent a feature edge. This feature edge can be parallel to a first direction, and thus also parallel to a predetermined line in the first direction. By setting the feature edge, the first or second straight line can be determined along a direction parallel to the feature edge, using the feature edge as a reference, which helps to more accurately locate the predetermined line.

[0059] For example, after identifying the first product feature and the outline of the workpiece from the first image, the method may further include: dilating the outline such that the outline expands outward by a first width along a first direction and / or expands outward by a second width along a second direction; wherein the first width is greater than or equal to the spacing of predetermined lines in the second direction, and the second width is greater than or equal to the spacing of predetermined lines in the first direction.

[0060] In one embodiment, after identifying the contour of the workpiece, the contour can be dilated. Exemplarily, and not limitingly, the contour can be dilated using a kernel convolutional layer from the OpenCV library. Optionally, pixels within a predetermined region surrounding the contour of the workpiece on the first image can also be assigned to the workpiece to obtain a new contour. The outer contour of this predetermined region differs from the undilated contour of the workpiece by a first width in a first direction, and / or by a second width in a second direction. That is, in the first direction, the difference between the radius of the dilated contour and the radius of the undilated contour is equal to the first width. In the second direction, the difference between the radius of the dilated contour and the radius of the undilated contour is equal to the second width. The first width can be any value greater than or equal to the spacing of the predetermined lines in the second direction, such as 10 micrometers, 20 micrometers, 50 micrometers, etc. Similarly, the second width can be any value greater than or equal to the spacing of the predetermined lines in the first direction, such as 10 micrometers, 20 micrometers, 50 micrometers, etc.

[0061] According to the above technical solution, by expanding the contour, the omission of predetermined lines located near the contour can be avoided.

[0062] For example, expanding a contour may include expanding the contour in response to an expansion command input by a user on a user interface.

[0063] Users can input expansion commands to the device (e.g., a host computer system) used to execute the predetermined line position determination method 100 via an input device. The input device may include, but is not limited to, one or more of the following: mouse, keyboard, touchscreen, and microphone. In one embodiment, a user interface can be displayed on a display device. Users can interact with operable controls in the user interface via a mouse, keyboard, etc., to input expansion commands. For example, the user interface may include an information input control and a first operable control. Users can input the desired expansion width in the information input control (e.g., an information input box) via the keyboard, and then click the first operable control, such as the "confirm" control. The device used to execute the predetermined line position determination method 100 can then automatically expand the contour. In another embodiment, the user interface may include a selection control and a second operable control. The selection control may contain multiple pre-set width values, and users can select the desired value according to their needs. After selection, clicking the second operable control, such as the "confirm" control, allows the device used to execute the predetermined line position determination method 100 to automatically expand the contour. Therefore, diverse application scenarios can be met, and the device can respond to user input expansion commands, exhibiting good interactivity. The apparatus for performing the predetermined line position determination method 100 may include the above-mentioned input device and / or display device, or may be communicatively connected to the above-mentioned input device and / or display device to realize information transmission.

[0064] For example, before determining the initial physical position of at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature (step S110), the method may further include: acquiring a third image acquired by the first image acquisition device for the workpiece to be processed; determining the angle between the feature edge on the workpiece to be processed and a preset direction in the third image; controlling the rotation of the workpiece to be processed based on the angle so that the feature edge is parallel to the preset direction; wherein, the first image is acquired when the feature edge is parallel to the preset direction.

[0065] In one embodiment, a third image of the wafer is acquired using a first image acquisition device. The third image is an image acquired prior to the first image acquisition. The third image also includes feature edges. The angle α between the feature edges on the third image and a preset direction can be determined. The preset direction can be any direction, such as the aforementioned horizontal direction (i.e., the X-axis direction). Figure 3 A schematic diagram showing the angle between a feature edge on a third image and a preset direction according to an embodiment of the present invention is illustrated. Figure 3As shown, dashed lines can represent the horizontal direction, and straight lines can represent feature edges on the third image. Based on the included angle α, the workpiece can be rotated counterclockwise so that the rotated feature edges are parallel to a preset direction. The first image mentioned above can be acquired when the feature edges are parallel to the preset direction. As mentioned above, the extension direction of the feature edges and the predetermined line can be parallel.

[0066] According to the above technical solution, the rotation of the workpiece is controlled by the angle between the feature edge on the workpiece in the third image and the preset direction, so that the feature edge is parallel to the preset direction. This allows for the correction and adjustment of the direction of the predetermined lines by the feature edges, helping to accurately determine the initial physical position of each predetermined line from the first image.

[0067] For example, determining a second physical position difference between the physical position of the first product feature and the physical position of the second product feature at the same calibration time, based at least on a first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, may include: determining a third physical position difference between the physical position of the first product feature in the first image and the physical position corresponding to the first field of view center of the first image acquisition device when acquiring the first image, based on the image position difference between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device; and determining a third physical position difference between the physical position of the first product feature and the physical position corresponding to the first field of view center when acquiring the first image, based on the third physical position difference and the first physical position difference. The image is defined as follows: the fourth physical position difference between the physical position corresponding to the first product feature in the image and the physical position corresponding to the second field of view center of the second image acquisition device; the movement of the workpiece to be processed is controlled by a distance equal to the fourth physical position difference, wherein the second image is acquired by the second image acquisition device after the workpiece to be processed stops moving; based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center, the physical position difference between the physical position corresponding to the second product feature and the physical position corresponding to the second field of view center when acquiring the second image is determined, and the calculated physical position difference is determined as the second physical position difference, and the calibration time is the time when the second image is acquired.

[0068] In one embodiment, in the image coordinate system corresponding to the first image, the image position difference (Δx1, Δy1) between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device can be obtained. Based on this image position difference (Δx1, Δy1) and the transformation relationship described above, a third physical position difference (ΔX3, ΔY3) between the physical position corresponding to the first product feature and the physical position corresponding to the first field of view center when acquiring the first image can be determined. Based on the third physical position difference (ΔX3, ΔY3) and the first physical position difference (ΔX1, ΔY1) determined in the previous embodiment, a fourth physical position difference (ΔX4, ΔY4) between the physical position corresponding to the first product feature and the physical position corresponding to the second field of view center of the second image acquisition device when acquiring the first image can be determined. For the fourth physical position difference, ΔX4 = ΔX1 + ΔX3, ΔY4 = ΔY1 + ΔY3. The wafer movement is controlled by a distance equal to the fourth physical position difference.

[0069] Similarly, the image coordinate system for the second image is established in a similar way to that for the first image, and will not be elaborated further for simplicity. Based on the image position difference (Δx2, Δy2) between the image position of the second product feature in the second image and the image position corresponding to the second field of view center, and the transformation relationship described above, the physical position difference between the physical position corresponding to the second product feature and the physical position corresponding to the second field of view center at the time of acquiring the second image can be determined, and the calculated physical position difference is defined as the second physical position difference (ΔX2, ΔY2). The calibration time is the time when the second image is acquired.

[0070] According to the above technical solution, based on the third physical position difference and the first physical position difference obtained above, the fourth physical position difference can be determined, and the movement of the workpiece to be processed can be controlled to be equal to the fourth physical position difference. This ensures that the physical position corresponding to the first product feature in the first image coincides with the physical position corresponding to the second field of view center of the second image acquisition device. Thus, the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center can be determined as the second physical position difference between the physical positions corresponding to the first and second product features at the same calibration time. This solution primarily calculates the final second physical position difference based on image information from a small-field-of-view camera, therefore achieving high accuracy in calculating the second physical position difference.

[0071] For example, before determining the second physical position difference between the physical position of the first product feature and the physical position of the second product feature at the same calibration time, based at least on the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, the method may further include: determining the first physical position of the workpiece when the rotation axis coincides with the first field of view center of the first image acquisition device, wherein the rotation axis is the axis around which the workpiece rotates; determining the second physical position of the workpiece when the rotation axis coincides with the second field of view center of the second image acquisition device; calculating the physical position difference between the first physical position and the second physical position, and determining the calculated physical position difference as the first physical position difference.

[0072] Determining the physical position of the workpiece when its rotation axis coincides with the field of view center of any image acquisition device can be achieved in any suitable manner. For example, the position of the workpiece can be manually adjusted until its rotation axis coincides with the field of view center of the image acquisition device, and the current physical position of the workpiece can be measured. Alternatively, the physical position of the workpiece when its rotation axis coincides with the field of view center of any image acquisition device can be determined by an automatic position calibration method, as can be understood from the following embodiments. The difference between the first physical position of the workpiece when its rotation axis coincides with the first field of view center of the first image acquisition device, and the second physical position of the workpiece when its rotation axis coincides with the second field of view center of the second image acquisition device, can be regarded as the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device.

[0073] For example, determining the first physical position of the workpiece when the rotation axis coincides with the field of view center of the first image acquisition device may include: acquiring a first template image and multiple first test images, wherein the first template image contains a first identification feature on the workpiece, the multiple first test images are images acquired by the first image acquisition device for the workpiece when it is in multiple different third physical positions, the number of multiple first test images is greater than or equal to 3, and the multiple different third physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; for each of the multiple first test images, determining the image position of the first identification feature in the first test image based on the first template image; determining the first image position corresponding to the rotation axis based on the image position of the first identification feature in the multiple first test images; and determining the first physical position of the workpiece when the rotation axis coincides with the first field of view center based on the first image position corresponding to the rotation axis and the image position corresponding to the first field of view center. ; and / or, determining the second physical position of the workpiece when the rotation axis coincides with the field of view center of the second image acquisition device may include: acquiring a second template image and multiple second test images, wherein the second template image contains a second identification feature on the workpiece, the multiple second test images are images acquired by the second image acquisition device for the workpiece when the workpiece is in multiple different fourth physical positions, the number of multiple second test images is greater than or equal to 3, and the multiple different fourth physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; for each of the multiple second test images, determining the image position of the second identification feature in the second test image according to the second template image; determining the second image position corresponding to the rotation axis through the image position of the second identification feature in the multiple second test images; determining the second physical position of the workpiece when the rotation axis coincides with the second field of view center according to the second image position corresponding to the rotation axis and the image position corresponding to the second field of view center.

[0074] For example, the template image (including a first template image and a second template image) can be an image containing any identifying features on the workpiece to be processed. The identifying features (including a first product feature and a second product feature) can be any identifiable feature on the workpiece to be processed. For example, the identifying features can be features inherent to the workpiece itself, such as features of certain shapes or structures. For example, the identifying features can also be features additionally marked on the workpiece by hand or by a processing device, such as a readily identifiable symbol, pattern, etc. The identifying features can be of any shape, such as a circle, a cross, or a star. Preferably, the identifying feature is the center of the wafer or the center of the dicing track. Figure 4 A schematic diagram of a template image according to an embodiment of the present invention is shown. Figure 4As shown, the template image includes the cut track center (represented by a black dot), which can be used as an identification feature. The product feature and the aforementioned identification feature can be of the same type or different types. For example, they can both be cut track centers, or one can be a cut track center and the other a star-shaped symbol additionally marked on the workpiece. If the product feature and the identification feature are of the same type, they can be the same feature or different features. For example, they can both be cut track centers coinciding with the wafer center, or they can be cut track centers at different locations on the wafer.

[0075] The workpiece can translate within the plane containing the X and Y axes or a plane parallel to these planes (i.e., the moving plane), and can rotate around the rotation axis within this moving plane. When the workpiece rotates around the rotation axis within the moving plane, this moving plane can also be called the rotation plane. When the workpiece is located at different physical positions (i.e., third physical positions) within its moving plane, multiple first test images of the workpiece can be acquired using the first image acquisition device. Each of the multiple first test images corresponds one-to-one with a multiple different third physical positions. As described above, each third physical position can be obtained based on the corresponding grating ruler reading. The different third physical positions are distributed circumferentially along the rotation axis. The number of multiple first test images can be any integer greater than or equal to 3. In one embodiment, starting from an initial physical position (i.e., based on the initial physical position), the workpiece can be rotated multiple times around the rotation axis, with each rotation angle relative to the initial physical position being different, and the position where it stops at the end of each rotation is taken as a new physical position. Multiple physical positions can be determined from at least one physical position obtained through the above rotation and the initial physical position, and these determined physical positions can be used as multiple different third physical positions corresponding one-to-one with the multiple first images to be tested. In another embodiment, rotation can be performed without using the initial physical position as a reference, and multiple different third physical positions can be obtained in other ways, such as by the user directly inputting the coordinate values ​​of multiple different physical positions.

[0076] Subsequently, a third identifier feature matching the first identifier feature in the first template image can be identified from the first image to be tested, and the image position of the third identifier feature in the first image to be tested is determined as the image position of the first identifier feature in the first image to be tested.

[0077] For example, there may be three first test images. For any one of the three first test images, the image position of the first identification feature in the first test image can be determined based on the first template image. In one embodiment, the image feature corresponding to the first identification feature can be identified from the first template image, and the image position of the matching image feature (i.e., the image position of the third identification feature) in any first test image can be detected using this image feature to obtain the image position of the first identification feature in the first test image. In another embodiment, in addition to the first identification feature, the first template image may also contain a feature to be matched. In one example, the workpiece to be processed is a wafer, and the first template image contains the intersection area of ​​two mutually perpendicular dicing tracks on the wafer and a region within a preset range around the intersection area. The first identification feature is the center point of the intersection area. In the above first template image, the intersection area of ​​the two mutually perpendicular dicing tracks and the region within a preset range around the intersection area can be identified as the feature to be matched. Based on the first template image, a matching feature that matches the feature to be matched can be identified from any first test image. Furthermore, the relative positional relationship between the feature to be matched and the first identification feature in the first template image is determined. Based on this relative positional relationship, the image position in the first image to be tested that has the same relative positional relationship as the image position of the matching feature is determined, and this image position is used as the third identifier feature in the first image to be tested. When the image features corresponding to the first identifier feature itself are not obvious and are difficult to directly identify from the first image to be tested, the scheme of indirectly determining the image position of the first identifier feature through the feature to be matched can reduce the difficulty of identifying the identifier feature and help to more accurately determine the image position of the first identifier feature.

[0078] Subsequently, the position of the first image corresponding to the rotation axis can be determined by the image position of the first identification feature in multiple first images to be tested.

[0079] Assume that the image positions of the first identifier feature in the three first test images are obtained according to the above. For example, the image position of the first identifier feature in the first test image I1 can be represented as (x1, y1), the image position of the first identifier feature in the first test image I2 can be represented as (x2, y2), and the image position of the first identifier feature in the first test image I3 can be represented as (x3, y3). Figure 5 A schematic diagram of an image coordinate system established for a first image to be tested according to an embodiment of the present invention is shown. (Refer to...) Figure 5For ease of understanding, solid dot A can represent the image position of the first identifier feature in the current first image to be tested I1. Hollow dots B and C can represent the image positions of the first identifier feature in the first images to be tested I2 and I3, respectively. It is understood that although image positions A, B, and C do not originate from the same first image to be tested, they can be represented using the same image coordinate system, and comparisons and calculations can be performed between them within this coordinate system. For example, the image position of the rotation axis in the image coordinate system can be obtained by calculating the intersection of the perpendicular bisectors of the lines connecting any two of the three image positions. For instance, the intersection point R( ) of the perpendicular bisectors of line segment AB and line segment BC can be calculated. Figure 5 Image position (x, not shown in the image) R ,y R The image position where the intersection point R is located is the first image position corresponding to the rotation axis. It can be understood that the first image position corresponding to the rotation axis is also the image position of the intersection point of the rotation axis and the moving plane of the workpiece in the image acquired by the first image acquisition device.

[0080] Subsequently, the first physical position of the workpiece when the rotation axis coincides with the field of view center can be determined based on the first image position corresponding to the rotation axis and the image position corresponding to the field of view center of the first image acquisition device.

[0081] The rotation axis coinciding with the center of the field of view of the first image acquisition device can mean that the center of the field of view of the first image acquisition device falls on the rotation axis, that is, the center of the field of view of the first image acquisition device coincides with any point on the rotation axis. For example, the center of the field of view of the first image acquisition device can coincide with the rotation center, which can be the intersection of the rotation axis and the aforementioned moving plane (i.e., the rotation plane), such as the aforementioned intersection point R.

[0082] For example, the image position corresponding to the first field of view center of the first image acquisition device can be the image position (x) corresponding to the center P of any image (e.g., any first image to be tested) acquired by the first image acquisition device. P ,y P This is represented by ) based on the first image position (x) corresponding to the rotation axis. R ,y R The image position (x) corresponding to the first field of view center of the first image acquisition device. P ,y P The physical position (X,Y) of the workpiece can be determined when the rotation axis coincides with the first field of view center. This physical position can be called the first physical position.

[0083] The method for determining the second physical location is similar to that for determining the first physical location, and can be understood by referring to the above text, so it will not be repeated here.

[0084] According to the above technical solution, multiple first / second test images of the workpiece are acquired. For different first / second test images, the workpiece has different distribution positions in the circumferential direction of the rotation axis. The image position of the rotation axis is determined by using the position of the same identification feature on multiple first / second test images, and then the physical position of the workpiece when the rotation axis coincides with the center of the field of view is determined. This solution can automatically determine the physical position of the workpiece when the rotation axis coincides with the center of the field of view by using visual positioning technology in conjunction with changes in the physical position of the workpiece. This solution does not require manual intervention, can effectively save manpower, and has high positioning accuracy.

[0085] For example, the conversion relationship described above can be determined in the following way: acquiring multiple third test images, which are images acquired by an image acquisition device for the workpiece when it is in multiple different fifth physical positions, and the number of multiple third test images is greater than or equal to 3; for each of the multiple third test images, determining the image position of the third identification feature in the third test image based on the third template image; and determining the conversion relationship based on the image position of the third identification feature in the multiple third test images and the multiple fifth physical positions.

[0086] The third template image may be the same as one or both of the first and second template images, or it may be different from both. The third identification feature may be the same as one or both of the first and second identification features, or it may be different from both. The third template image and the third identification feature can be referred to the descriptions of the first / second template images and the first / second identification features mentioned above, which will not be repeated here.

[0087] In one embodiment, the number of third images to be tested is greater than or equal to three. Exemplarily, but not limitingly, the number of third images to be tested is greater than or equal to three and less than or equal to nine. For example, there are a total of nine third images to be tested. These nine third images to be tested can be images acquired by the image acquisition device for the workpiece when it is in nine different fifth physical positions. The nine different fifth physical positions K1, K2, ..., K9 can be arbitrary.

[0088] For each of the nine third test images, the image position of the third identifier feature in that third test image can be determined based on the acquired third template image. Determining the image position of the third identifier feature in the third test image based on the third template image can be achieved as follows: identify a fourth identifier feature in the third test image that matches the third identifier feature in the third template image, and determine the image position of the fourth identifier feature in the third test image as the image position of the third identifier feature in that third test image.

[0089] Based on the image positions F1, F2, ..., F9 in the nine third test images and their corresponding nine fifth physical positions K1, K2, ..., K9, a mapping relationship (X) between the coordinates corresponding to the image positions and the coordinates corresponding to the physical positions can be established. K ,Y K )=f(w)(x F ,y F ). (X) K ,Y K (x) represents each fifth physical position. F ,y F The coordinates () represent the positions of each image. Using the nine determined coordinate points, the f(w) matrix can be calculated, thus establishing the transformation relationship between each image position and its corresponding fifth physical position. Based on this transformation relationship, the transformation relationship between any image position and its corresponding physical position can be determined.

[0090] According to the above technical solution, the transformation relationship can be determined based on the image positions of the third identification features in multiple third images to be tested, and the multiple fifth physical positions of the third identification features. This method determines the transformation relationship through multiple image positions and multiple fifth physical positions; the algorithm is simple and easy to implement.

[0091] For example, the workpiece to be processed is a wafer, the first template image includes the wafer, the first identification feature is the center point of the wafer, and the second template image includes the intersection area of ​​two mutually perpendicular predetermined lines on the wafer and a predetermined range around the intersection area.

[0092] In one embodiment, the workpiece to be processed can be a wafer. The first image acquisition device has a large image acquisition range, such as a wide-field-of-view camera that captures images of the entire wafer. In this case, the wafer center (i.e., the center point of the wafer) can be used as a marker feature to help determine the first physical location. The second image acquisition device has a small image acquisition range, such as a small-field-of-view camera that captures images of a portion of the dicing track. In this case, the center of the dicing track can be used as a marker feature to help determine the second physical location.

[0093] The second template image may include the intersection region of two mutually perpendicular dicing lines on the wafer. (See also: [link to relevant documentation]) Figure 4 The image shows a cross-shaped white area, which is part of two mutually perpendicular cutting lines. The intersection area is the region within the rectangle indicated by the dashed line in the middle. Additionally, the template image can also include a region within a preset range surrounding the intersection area (which can be called a preset region), such as... Figure 4 The four gray sub-regions and two cutting paths shown are located outside the intersection region. The preset range is set such that the image features contained within the intersection region and the preset region are sufficient for the image processing algorithm to identify the location of the intersection region and the preset region from the image acquired by the image acquisition device. For example... Figure 4 As shown, the image features contained in the intersection region are not obvious and are difficult to distinguish. Therefore, they can be combined with the surrounding preset regions to form sufficiently distinguishable image features, which can help identify the positions of the intersection region and the preset regions. The main purpose is to identify the position of the intersection region and then determine the position of the second identification feature. The second identification feature can be the center point of the intersection region.

[0094] According to a second aspect of the present invention, a method for processing a workpiece is also provided. Figure 6 A schematic flowchart of a processing method 600 for a workpiece according to an embodiment of the present invention is shown, such as... Figure 6 As shown, the method 600 may include the following steps S610 and S620.

[0095] Step S610: Determine the target physical position of at least one predetermined line according to the predetermined line position determination method 100 for the processing device described above.

[0096] Step S620: Process the workpiece based on the target physical location of at least one predetermined line.

[0097] In one embodiment, the workpiece can be processed directly based on the target physical position of a predetermined line. For example, the workpiece can be moved to the target physical position corresponding to the start point of a cutting spur and processing can begin. During processing, the workpiece moves in real time until it reaches the target physical position corresponding to the end point of the cutting spur, thus completing the processing of that cutting spur. In another embodiment, the workpiece can be processed further by incorporating other information. For example, the processing area can be determined based on the target physical position of any cutting spur according to user requirements, and processing can begin when the workpiece moves into the processing area. For example, the processing start point and processing end point of the processing area corresponding to any cutting spur can be set to appear at positions earlier than the start and end points of that cutting spur, respectively.

[0098] According to the processing method of the present invention, the workpiece is processed based on the target physical position of the high-precision positioning described above, which helps to improve the processing accuracy.

[0099] According to a third aspect of the present invention, a device for determining the position of a predetermined line for a processing apparatus is also provided. The predetermined line is a feature line on a workpiece to be processed. The processing apparatus includes a first image acquisition device and a second image acquisition device, wherein the image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device. Figure 7 A schematic block diagram of a predetermined line position determination device 700 for a processing apparatus according to an embodiment of the present invention is shown. Figure 7 As shown, the device 700 may include a first determining module 710, a second determining module 720 and a third determining module 730.

[0100] The first determining module 710 can be used to determine the initial physical position of at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed.

[0101] The second determining module 720 can be used to determine, at least based on the first physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, the second physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device. The second product feature is a feature on the second image, the second image is an image acquired by the second image acquisition device for the workpiece to be processed, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed.

[0102] The third determining module 730 can be used to determine the target physical position of at least one predetermined line based on the difference between the initial physical position and the second physical position.

[0103] According to a fourth aspect of the present invention, an electronic device is also provided. Figure 8 A schematic block diagram of an electronic device 800 according to an embodiment of the present invention is shown, such as... Figure 8 As shown, the electronic device 800 may include a processor 810 and a memory 820. The memory 820 stores a computer program, and the processor 810 executes the computer program to implement the aforementioned method for determining the predetermined line position of a processing apparatus.

[0104] According to a fifth aspect of the invention, a storage medium is also provided. Program instructions are stored on the storage medium, which, when executed, perform the predetermined line position determination method for a processing apparatus as described above. The storage medium may, for example, include a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0105] Those skilled in the art can understand the specific implementation schemes and beneficial effects of the above-described method for determining the predetermined line position of a processing apparatus by reading the relevant descriptions above. For the sake of brevity, these will not be elaborated further here.

[0106] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0107] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0108] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0109] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0110] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, this approach should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0111] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0112] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0113] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some modules in the predetermined line position determination device for a processing apparatus according to embodiments of the present invention. The present invention can also be implemented as an apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0114] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0115] The above description is merely a specific embodiment of the present invention or an explanation of that embodiment. The scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for determining the position of a predetermined line in a processing apparatus, characterized in that, The predetermined line is a feature line on the workpiece to be processed. The processing device includes a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device. The method includes: Based on the image position of the first product feature in the first image and the relative positional relationship between at least one predetermined line and the first product feature, the initial physical position of the at least one predetermined line is determined, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed; Based on the first physical position difference and the image position difference between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device, the workpiece to be processed is controlled to move so as to obtain a second image acquired by the second image acquisition device for the moved workpiece. The first physical position difference is the physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device. Based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center of the second image acquisition device, the second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time is determined, wherein the second product feature is a feature on the second image, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed; The target physical position of the at least one predetermined line is determined based on the initial physical position and the difference between the second physical position.

2. The method according to claim 1, wherein, The first product feature is a feature point. Determining the initial physical position of the at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between the at least one predetermined line and the first product feature includes: Identify the first product features and the outline of the workpiece to be processed from the first image; At least one first straight line is determined along a first direction, and / or at least one second straight line is determined along a second direction, wherein the first direction is perpendicular to the second direction, one of the at least one first straight line passes through the first product feature, one of the at least one second straight line passes through the first product feature, the distance between any two first straight lines is equal to the spacing between predetermined lines in the second direction, and the distance between any two second straight lines is equal to the spacing between predetermined lines in the first direction. The initial physical position of the at least one predetermined line is determined based on the at least one first straight line and / or the at least one second straight line, and based on the contour.

3. The method according to claim 2, wherein, Determining the initial physical position of the at least one predetermined line based on the at least one first straight line and / or the at least one second straight line, and based on the contour, includes: For each of the at least one first straight line or for each of the at least one second straight line, Determine the intersection point of the straight line and the contour; Determine whether the number of intersection points is greater than or equal to a preset number. If the number of intersection points is greater than or equal to the preset number, then select the two outermost intersection points on the straight line as the start and end points of the predetermined line corresponding to the straight line. The initial physical position of the predetermined line corresponding to the straight line is determined based on the image positions of the starting point and the ending point in the first image.

4. The method according to claim 2, wherein, The first direction or the second direction is a direction parallel to the feature edge on the workpiece.

5. The method according to claim 2, wherein, After identifying the first product features and the outline of the workpiece to be processed from the first image, the method further includes: The contour is expanded such that the contour expands outward by a first width along the first direction and / or expands outward by a second width along the second direction; Wherein, the first width is greater than or equal to the spacing of the predetermined lines in the second direction, and the second width is greater than or equal to the spacing of the predetermined lines in the first direction.

6. The method according to claim 5, wherein, The process of expanding the contour includes: The contour is expanded in response to an expansion command input by the user on the user interface.

7. The method according to any one of claims 1-6, wherein, Before determining the initial physical position of the at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between the at least one predetermined line and the first product feature, the method further includes: Acquire a third image of the workpiece captured by the first image acquisition device; Determine the angle between the feature edge on the workpiece to be processed in the third image and the preset direction; The workpiece is rotated based on the included angle so that the feature edge is parallel to the preset direction; The first image is acquired when the feature edge is parallel to the preset direction.

8. The method according to any one of claims 1-6, wherein, The image position difference, based on the first physical position difference and the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device, includes: Based on the image position difference between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device, a third physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the first field of view center when acquiring the first image is determined. Based on the third physical position difference and the first physical position difference, a fourth physical position difference is determined between the physical position corresponding to the first product feature when acquiring the first image and the physical position corresponding to the second field of view center of the second image acquisition device. The workpiece is controlled to move a distance equal to the difference between the fourth physical position and the workpiece. The second image is acquired by the second image acquisition device after the workpiece stops moving. The step of determining the second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time, based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center of the second image acquisition device, includes: Based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center, the physical position difference between the physical position corresponding to the second product feature and the physical position corresponding to the second field of view center when the second image is acquired is determined, and the calculated physical position difference is determined as the second physical position difference. The calibration time is the time when the second image is acquired.

9. The method according to any one of claims 1-6, wherein, Before determining the second physical position difference between the physical position of the first product feature and the physical position of the second product feature at the same calibration time, based at least on the first physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device, the method further includes: The first physical position of the workpiece to be processed is determined when the rotation axis coincides with the first field of view center of the first image acquisition device, wherein the rotation axis is the axis around which the workpiece to be processed rotates; Determine the second physical position of the workpiece when the rotation axis coincides with the second field of view center of the second image acquisition device; Calculate the physical position difference between the first physical position and the second physical position, and determine the calculated physical position difference as the first physical position difference.

10. The method according to claim 9, wherein, The determination of the first physical position of the workpiece when the rotation axis coincides with the field of view center of the first image acquisition device includes: Acquire a first template image and multiple first test images, wherein the first template image contains a first identification feature on the workpiece to be processed, and the multiple first test images are images acquired by the first image acquisition device for the workpiece when the workpiece to be processed is in multiple different third physical positions, the number of the multiple first test images is greater than or equal to 3, and the multiple different third physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; For each of the plurality of first images to be tested, the image position of the first identification feature in the first image to be tested is determined according to the first template image; The position of the first image corresponding to the rotation axis is determined by the image position of the first identification feature in the plurality of first images to be tested. Based on the first image position corresponding to the rotation axis and the image position corresponding to the first field of view center, determine the first physical position of the workpiece when the rotation axis coincides with the first field of view center; And / or, Determining the second physical position of the workpiece when the rotation axis coincides with the field of view center of the second image acquisition device includes: Acquire a second template image and multiple second test images, wherein the second template image contains a second identification feature on the workpiece to be processed, and the multiple second test images are images acquired by the second image acquisition device for the workpiece when the workpiece to be processed is in multiple different fourth physical positions, the number of the multiple second test images is greater than or equal to 3, and the multiple different fourth physical positions are different physical positions distributed along the circumferential direction corresponding to the rotation axis; For each of the plurality of second images to be tested, the image position of the second identification feature in the second image to be tested is determined according to the second template image; The position of the second image corresponding to the rotation axis is determined by using the image position of the second identification feature in the plurality of second images to be tested. Based on the second image position corresponding to the rotation axis and the image position corresponding to the second field of view center, the second physical position of the workpiece to be processed when the rotation axis coincides with the second field of view center is determined.

11. The method according to claim 10, wherein, The workpiece to be processed is a wafer, the first template image includes the wafer, the first identification feature is the center point of the wafer, and the second template image includes the intersection area of ​​two mutually perpendicular predetermined lines on the wafer and a predetermined range around the intersection area.

12. A method for processing a workpiece, characterized in that, include: The target physical position of the at least one predetermined line is determined according to the method for determining the position of a predetermined line for a processing apparatus as described in any one of claims 1-11; The workpiece is processed based on the target physical location at least based on the at least one predetermined line.

13. A device for determining the position of a predetermined line in a processing apparatus, characterized in that, The predetermined line is a feature line on the workpiece to be processed. The processing device includes a first image acquisition device and a second image acquisition device. The image acquisition range of the first image acquisition device is larger than the image acquisition range of the second image acquisition device. The predetermined line position determination device includes: The first determining module is used to determine the initial physical position of the at least one predetermined line based on the image position of the first product feature in the first image and the relative positional relationship between the at least one predetermined line and the first product feature, wherein the first image is an image acquired by the first image acquisition device for the workpiece to be processed. The second determining module is used to control the movement of the workpiece to be processed based on a first physical position difference and the image position difference between the image position of the first product feature in the first image and the image position corresponding to the first field of view center of the first image acquisition device, so as to obtain a second image of the workpiece to be processed by the second image acquisition device after the movement. The first physical position difference is the physical position difference between the physical position corresponding to the first image acquisition device and the physical position corresponding to the second image acquisition device. The second determining module is also used to determine a second physical position difference between the physical position corresponding to the first product feature and the physical position corresponding to the second product feature at the same calibration time based on the image position difference between the image position of the second product feature in the second image and the image position corresponding to the second field of view center of the second image acquisition device. The second product feature is a feature on the second image, and the first product feature and the second product feature correspond to the same feature on the workpiece to be processed. The third determining module is used to determine the target physical position of the at least one predetermined line based on the initial physical position and the difference between the second physical position.

14. An electronic device comprising a processor and a memory, characterized in that, The memory stores a computer program, and the processor executes the computer program to implement the method for determining the predetermined line position for a processing apparatus as described in any one of claims 1-11.

15. A storage medium storing a computer program / instructions, characterized in that, When the computer program / instructions are executed by the processor, they implement the method for determining the predetermined line position of a processing apparatus as described in any one of claims 1-11.

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