A bonding machine apparatus and method of bonding alignment

Abstract

The application relates to the technical field of bonding, in particular to a bonding machine device which comprises a support plate, a moving table, a moving table slidingly connected to the upside center position of the support plate, a placing table fixedly connected to the upside center position of the moving table, a motor embedded in the upside center position of the moving table, a threaded rod fixedly connected to the shaft end of the motor, a lifting plate sleeved on the outside of the threaded rod through threaded transmission, two electric push rods one, two electric push rods one arranged on the upside of the lifting plate respectively, a connecting rod fixedly connected to the shaft end of the electric push rod one, a positioning plate fixedly connected to the top end of the connecting rod, a wafer one arranged on the upside of the placing table, a wafer two arranged on the upside of the wafer one, a protective shell fixedly connected to the upside of the support plate, a hydraulic cylinder arranged at the upside center position of the protective shell, and a self-heating bonding head arranged at the shaft end of the hydraulic cylinder. The bonding machine device can realize automatic centering and aligning bonding, semi-automatic and semi-manual operation bonding, and has high bonding quality.

Description

Technical Field

[0001] This invention relates to the field of bonding technology, and more particularly to a bonding machine apparatus and a bonding alignment method. Background Technology

[0002] A bonding machine is an instrument used in the field of physics. Bonding is a technology that combines two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces after surface cleaning and activation treatment, and then directly combines them under certain conditions. The bonding is achieved by van der Waals forces, molecular forces, or even atomic forces.

[0003] Existing wafers are placed in various ways during bonding. If the two wafers are not aligned in the center, it will affect the bonding quality, reduce bonding efficiency, and make them prone to loosening, thus affecting the bonding. To address this, we propose a bonding machine device and a bonding alignment method. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies where wafers are placed in various ways during bonding. If the two wafers are not aligned properly during placement, it will affect the bonding quality, reduce bonding efficiency, and cause loosening, thus affecting the bonding process. Therefore, this invention proposes a bonding machine device and a bonding alignment method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: Design a bonding machine apparatus, including: a support plate, A movable platform, which is slidably connected to the upper center of the support plate; A placement platform is fixedly connected to the upper center of the movable platform, and the inner side of the placement platform is set with a cavity structure. A through groove is provided on the upper side of the placement platform. The motor is embedded in the upper center of the moving platform; A threaded rod is fixedly connected to the shaft end of the motor and is located inside the placement platform. A lifting plate, wherein the lifting plate is sleeved on the outside of a threaded rod via a threaded drive; Two electric push rods are provided, and the two electric push rods are respectively installed on the upper side of the lifting plate. A connecting rod, which is fixedly connected to the shaft end of the electric push rod one; A positioning plate, which is fixedly connected to the top end of the connecting rod; Wafer 1, wherein wafer 1 is disposed on the upper side of the placement stage; Wafer 2, which is disposed on the upper side of wafer 1; A protective shell, which is fixedly connected to the upper side of the support plate; A hydraulic cylinder is located at the center of the upper side of the protective shell; A self-heating bonding head is disposed at the shaft end of a hydraulic cylinder.

[0006] Preferably, an electric push rod 2 is fixedly provided on both the front and rear sides of the placement platform. A bidirectional cylinder is fixedly provided on the shaft end of the electric push rod 2. A connecting block is fixedly provided on the shaft end of the bidirectional cylinder. A clamping strip 1 is fixedly provided on one side of the connecting block.

[0007] Preferably, a plurality of guide rods are fixedly provided on both sides of the placement platform, a slide rod is slidably connected to the upper side of the guide rod, a plurality of tension springs are provided on one side of the slide rod, one end of the tension spring is connected to one side of the placement platform, a clamping strip is fixedly provided at the top of the slide rod, and a locking strip is flipped and connected to the upper side of the clamping strip.

[0008] Preferably, the upper side of the moving platform is provided with two guide seats in parallel and symmetrical arrangement. A guide sleeve is slidably sleeved on the upper side of the guide seat. A plurality of springs are provided on the top side of the guide seat. One side of the springs abuts against the top inner side of the guide sleeve. A pressure plate is fixedly provided on the upper side of the guide sleeve. A guide hole is provided at the center position of the upper side of the pressure plate.

[0009] Preferably, a plurality of electric push rods are fixedly provided on the lower side of the support plate.

[0010] Preferably, the central axes of the guide hole, wafer one, wafer two, and self-heating bonding head are arranged in an overlapping structure.

[0011] A method for bonding alignment of a bonding machine apparatus, comprising the following specific steps: S1. First, place wafer one on the upper side of the placement stage; S2. Then, the lifting plate is raised by using the motor to drive the threaded rod and thread transmission. S3. Next, the two electric push rods start working to drive the positioning plate to center and align the wafer one. S4. Use the electric push rod two to drive the bidirectional cylinder to control the connecting block to fix the clamping strip one to wafer one, and then place wafer two. S5. Similarly, use S to center wafer two. S6. Finally, the self-heating bonding head is pressed down by the hydraulic cylinder to perform hot-press bonding of wafer one and wafer two.

[0012] The bonding machine device proposed in this invention has the following advantages: By setting up a support plate, a moving stage, a placement stage, a motor, a threaded rod, a lifting plate, an electric push rod (first type), a connecting rod, a positioning plate, wafer (first type), wafer (second type), a protective shell, and a hydraulic cylinder, it can provide an automatic alignment and centering function, which improves the bonding quality. By setting up an electric push rod (second type), a two-way cylinder, a connecting block, a clamping bar (first type), a guide rod, a sliding rod, a tension spring, a clamping bar (second type), and a locking bar, it can provide a clamping function for wafer (first type) and wafer (second type), preventing displacement during bonding. By setting up a guide seat, a guide sleeve, a pressure plate, and a spring, it can provide a bonding pressure buffer function and a secondary stabilization function. This bonding machine device can automatically center and align the bonding, and can operate the bonding semi-automatically and semi-manually, resulting in high bonding quality. Attached Figure Description

[0013] Figure 1 This is a front isometric structural diagram of a bonding machine device proposed in this invention; Figure 2 This is a side-section isometric view of a bonding machine device proposed in this invention; Figure 3 This invention provides a bonding machine apparatus. Figure 2 A schematic diagram of the structure of A in the middle; Figure 4 This is a partial structural schematic diagram of a bonding machine device proposed in this invention; Figure 5 This is a front-section isometric view of a bonding machine device proposed in this invention. Figure 6 This invention provides a bonding machine apparatus. Figure 5 A schematic diagram of the structure of B in the middle.

[0014] In the diagram: 1 Support plate, 2 Moving stage, 3 Placement stage, 4 Motor, 5 Threaded rod, 6 Lifting plate, 7 Electric push rod I, 8 Connecting rod, 9 Positioning plate, 10 Wafer I, 11 Wafer II, 12 Protective shell, 13 Hydraulic cylinder, 14 Electric push rod II, 15 Bidirectional cylinder, 16 Connecting block, 17 Clamping bar I, 18 Guide rod, 19 Slide rod, 20 Tension spring, 21 Clamping bar II, 22 Locking bar, 23 Guide seat, 24 Guide sleeve, 25 Pressure plate, 26 Spring, 27 Electric push rod III, 28 Self-heating key head, 29 Through slot. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0016] Reference Figure 1-6 A bonding machine apparatus, comprising: a support plate 1, The movable stage 2 is slidably connected to the upper center of the support plate 1; The placement platform 3 is fixedly connected to the upper center of the moving platform 2, and the inner side of the placement platform 3 is set with a cavity structure. The upper side of the placement platform 3 is provided with a through groove 29. Motor 4 is embedded in the upper center of the moving platform 2; Threaded rod 5 is fixedly connected to the shaft end of motor 4, and threaded rod 5 is located inside the placement platform 3; The lifting plate 6 is sleeved on the outside of the threaded rod 5 via a threaded drive. Electric push rod 7, there are two electric push rods 7, and the two electric push rods 7 are respectively set on the upper side of the lifting plate 6; Connecting rod 8 is fixedly connected to the shaft end of electric push rod 7; Positioning plate 9 is fixedly connected to the top of connecting rod 8; Wafer 10 is positioned on the upper side of the placement stage 3; Wafer 2 11 is located on the upper side of wafer 1 10; The protective shell 12 is fixedly connected to the upper side of the support plate 1; Hydraulic cylinder 13 is located at the upper center of the protective shell 12; The self-heating bonding head 28 is located at the shaft end of the hydraulic cylinder 13.

[0017] To provide a clamping function after centering and aligning wafer 10, thereby restricting the position of wafer 10, electric push rods 2 14 are fixedly installed on the front and rear sides of the placement stage 3. A bidirectional cylinder 15 is fixedly installed on the shaft end of the electric push rod 2 14, and a connecting block 16 is fixedly installed on the shaft end of the bidirectional cylinder 15. A clamping strip 17 is fixedly installed on one side of the connecting block 16. After wafer 10 is centered and aligned, the electric push rod 2 14 pushes the bidirectional cylinder 15 to rise. The bidirectional cylinder 15 drives the connecting block 16 to drive the clamping strip 17 to perform a clamping operation on wafer 10.

[0018] To provide a clamping function to restrict the position of wafer 11 after centering and aligning it, several guide rods 18 are fixedly provided on both sides of the placement stage 3. A slide rod 19 is slidably connected to the upper side of the guide rod 18. Several tension springs 20 are provided on one side of the slide rod 19. One end of the tension spring 20 is connected to one side of the placement stage 3. A clamping strip 21 is fixedly provided at the top of the slide rod 19. A locking strip 22 is flipped and connected to the upper side of the clamping strip 21. After wafer 11 is centered and aligned, the locking strip 22 is manually adjusted to release the locking strip 22 from its limiting position. The locking strip 22 is pulled by the rebound force of the tension spring 20, causing the slide rod 19 to move on the guide rod 18, thereby limiting the position of wafer 11.

[0019] Preferably, two guide seats 23 are provided parallel and symmetrically on the upper side of the moving platform 2. A guide sleeve 24 is slidably sleeved on the upper side of the guide seat 23. Several springs 26 are provided on the top side of the guide seat 23. One side of the spring 26 abuts against the top of the inner side of the guide sleeve 24. A pressure plate 25 is fixedly provided on the upper side of the guide sleeve 24. A guide hole is provided at the center of the upper side of the pressure plate 25.

[0020] To provide a height adjustment function for the whole, several electric push rods 27 are fixedly installed on the lower side of the support plate 1.

[0021] To improve the efficiency of center alignment, the central axes of the guide hole, wafer 10, wafer 21, and self-heating bonding head 28 are arranged in an overlapping structure.

[0022] A method for bonding alignment of a bonding machine apparatus, comprising the following specific steps: S1. First, place wafer 10 on the upper side of the placement stage 3; S2. Then, the threaded rod 5 is driven by the motor 4 to raise the lifting plate 6 via the thread transmission. S3. Next, the two electric push rods 7 start working to drive the positioning plate 9 to center and align the wafer 10. S4. Use electric push rod 14 to drive bidirectional cylinder 15 to control connecting block 16 so that clamping bar 17 fixes wafer 10, and then place wafer 11. S5. Similarly, use S3 to center wafer 11. S6. Finally, the hydraulic cylinder 13 is used to press down the self-heating bonding head 28 to perform hot-press bonding of wafer 10 and wafer 21.

[0023] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A bonding machine apparatus, characterized in that, include: Support plate (1) The movable stage (2) is slidably connected to the upper center of the support plate (1); Placement platform (3), which is fixedly connected to the upper center of the moving platform (2), and the inner side of the placement platform (3) is provided with a cavity structure. The upper side of the placement platform (3) is provided with a through groove (29), which vertically penetrates the surface of the placement platform (3) and communicates with the inner cavity, for the vertical passage of internal components. Motor (4), which is embedded in the upper center of the moving platform (2); Threaded rod (5), the threaded rod (5) is fixedly connected to the shaft end of the motor (4), and the threaded rod (5) is located on the inner side of the placement platform (3); The lifting plate (6) is sleeved on the outside of the threaded rod (5) via a threaded drive. Electric push rod 1 (7), there are two electric push rods 1 (7), and the two electric push rods 1 (7) are respectively set on the upper side of the lifting plate (6); Connecting rod (8), which is fixedly connected to the shaft end of electric push rod (7); Positioning plate (9), which is fixedly connected to the top of connecting rod (8); Wafer 1 (10), which is disposed on the upper side of the placement stage (3); Wafer 2 (11), which is disposed on the upper side of wafer 1 (10); A protective shell (12) is fixedly connected to the upper side of the support plate (1); Hydraulic cylinder (13), the hydraulic cylinder (13) is located at the upper center of the protective shell (12); The self-heating bonding head (28) is disposed at the shaft end of the hydraulic cylinder (13).

2. The bonding machine apparatus according to claim 1, characterized in that, The placement platform (3) is symmetrically fixed with a set of electric push rods (14) on the front and rear sides. Each set of electric push rods (14) has a bidirectional cylinder (15) fixed at the shaft end. The two ends of the bidirectional cylinder (15) are respectively fixed with connecting blocks (16). A clamping bar (17) is fixed on one side of the connecting block (16). The clamping bar (17) moves with the electric push rods (14) and the bidirectional cylinder (15) to clamp and fix the wafer (10) from the front and rear sides.

3. The bonding machine apparatus according to claim 1, characterized in that, Several guide rods (18) are fixedly provided on both the left and right sides of the placement platform (3). A slide rod (19) is slidably connected to the upper side of the guide rod (18). Several tension springs (20) are provided on one side of the slide rod (19). One end of the tension spring (20) is connected to one side of the placement platform (3). A clamping strip (21) is fixedly provided at the top of the slide rod (19). A locking strip (22) is flipped and connected to the upper side of the clamping strip (21). The clamping strip (21) is used to clamp the wafer (11) from the side. After the locking strip (22) is flipped, it is locked onto one side of the positioning plate (9) to achieve a limit.

4. The bonding machine apparatus according to claim 1, characterized in that, The upper side of the moving platform (2) is provided with two guide seats (23) symmetrically arranged in parallel. The upper side of the guide seat (23) is provided with a guide sleeve (24) slidably sleeved. The top side of the guide seat (23) is provided with several springs (26). One side of the spring (26) abuts against the top of the inner side of the guide sleeve (24). The upper side of the guide sleeve (24) is fixedly provided with a pressure plate (25). The upper center of the pressure plate (25) is provided with a guide hole.

5. The bonding machine apparatus according to claim 1, characterized in that, Several electric push rods (27) are fixedly provided on the lower side of the support plate (1).

6. The bonding machine apparatus according to claim 4, characterized in that, The central axes of the guide hole, wafer one (10), wafer two (11), and self-heating bonding head (28) are arranged in an overlapping structure.

7. A method for bonding alignment using a bonding machine apparatus according to any one of claims 1-6, characterized in that, The specific steps are as follows: S1. First, place wafer 1 (10) on the upper side of the placement stage (3); S2. Then, the motor (4) drives the threaded rod (5) to drive the lifting plate (6) to rise. S3. Next, the two electric push rods (7) are used to drive the positioning plate (9) to center and align the wafer (10). S4. Use electric push rod two (14) to drive bidirectional cylinder (15) to control connecting block (16) so that clamping bar one (17) fixes wafer one (10), and then place wafer two (11). S5. Reuse the action flow of step S3 to drive the electric push rod (7) and positioning plate (9) to push the wafer (11) from both sides to complete the centering operation of wafer (11); S6. Finally, the self-heating bonding head (28) is pressed down by the hydraulic cylinder (13) to heat-bond wafer one (10) and wafer two (11).

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