Electronic device

Abstract

The application provides an electronic device, comprising a mainboard for arranging devices, wherein the electronic device further comprises an antenna, the antenna comprising a radiation patch, a feed and a ground, one end of the ground being connected with the radiation patch, the other end of the ground being connected with the mainboard in a coupled or abutting manner, one end of the feed being connected with the mainboard, the other end of the feed being connected with the radiation patch in a coupled or abutting manner. The electronic device provided by the application does not need to cover the medium block, and is connected with the mainboard through the ground and the feed, so that the medium loss is eliminated, and the antenna efficiency and gain can be obviously improved. Since the antenna is arranged on the mainboard as a whole, the Z-direction space on the mainboard can provide sufficient arrangement space for the antenna, and the thickness space for arranging the antenna between the battery cover and the graphite sheet is not needed, so that the overall thickness is not needed to be increased, and the thin design of the mobile phone is realized.

Description

Technical Field

[0001] This application relates to the field of communication antenna technology, and more particularly to an electronic device. Background Technology

[0002] Ultra-wideband (UWB) technology is a short-range wireless communication technology that has been applied to various terminal devices in recent years. A UWB antenna is an antenna operating in the UWB frequency band. For mobile phones, existing UWB antennas are microstrip antennas, consisting of a radiating patch, a dielectric block, and a ground plane from top to bottom. The antenna is connected to the UWB chip via a liquid-crystal polymer (LCP) transmission line. However, existing UWB antennas are relatively large in area and thickness, posing significant challenges to the physical space occupied within the phone and the design of thin phone architectures. Furthermore, the radiation emitted by the antenna between the ground plane and the radiating patch is affected by dielectric loss, leading to a reduction in antenna gain and efficiency. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device to solve the problems of existing UWB antennas occupying a large space in terminal devices and having dielectric loss.

[0004] This application provides an electronic device, including a motherboard for arranging devices, wherein the electronic device further includes an antenna, the antenna including a radiating patch, a feeding element and a grounding element, one end of the grounding element being connected to the radiating patch, and the other end of the grounding element being coupled to or abutting the motherboard, one end of the feeding element being connected to the motherboard, and the other end of the feeding element being coupled to or abutting the radiating patch.

[0005] The electronic device provided in this application does not require the radiating patch to overlap with the dielectric block. Instead, it is connected to the motherboard via a grounding component and a power supply component, thus eliminating dielectric loss and significantly improving antenna efficiency and gain. Since the antenna is entirely mounted on the motherboard, the Z-axis space on the motherboard provides sufficient space for antenna placement. This eliminates the need for additional thickness space between the battery cover and the graphite sheet for antenna placement, thereby reducing the overall thickness of the device and enabling a thinner mobile phone design.

[0006] In one possible implementation, the grounding element is welded to the radiating patch. This ensures the reliability of the connection between the grounding element and the radiating patch.

[0007] In one possible implementation, the antenna further includes a dielectric layer, on which the radiating patch is disposed. The ends of the feed element and the ground element facing away from the motherboard are both connected to the dielectric layer. This dielectric layer can, on the one hand, support the radiating patch, ensuring the overall stability of the antenna; on the other hand, it can further reduce the overall size of the antenna, achieving miniaturization and reducing the space occupied by the antenna on the motherboard.

[0008] In one possible implementation, the radiating patch is etched onto the surface of the dielectric layer, and both the feed element and the ground element are connected to the side of the dielectric layer opposite to the radiating patch. Using an etching process to form the radiating patch on the front side of the dielectric layer improves the forming accuracy of the radiating patch and also enhances the overall antenna placement accuracy on the motherboard.

[0009] In one possible implementation, both the grounding element and the power supply element are welded to the dielectric layer. This ensures that both the grounding element and the power supply element can be reliably connected to the dielectric layer.

[0010] In one possible implementation, the dielectric layer is a printed circuit board. Etching the radial patch 21 on the front side of the PCB board can improve the consistency of the traces on the PCB board and facilitate the etching operation.

[0011] In one possible implementation, the radiating patch is disposed inside the dielectric layer. This dielectric layer can encapsulate the radiating patch internally, thereby further reducing the overall size of the antenna.

[0012] In one possible implementation, both the grounding element and the feeding element are disposed inside the dielectric layer. Therefore, by encapsulating the grounding element, the feeding element, and the radiating patch within the dielectric layer, the overall size of the antenna can be reduced, thereby minimizing the space occupied above the motherboard.

[0013] In one possible implementation, the dielectric layer is ceramic or alumina. Ceramic or alumina dielectric layers have a high dielectric constant, which can further reduce the space occupied by the antenna on the motherboard.

[0014] In one possible implementation, the dielectric layer and the radiating patch are integrally formed. The radiating patch is disposed inside the dielectric layer during the dielectric layer forming process, thereby achieving encapsulation of the radiating patch through the dielectric layer and further reducing the overall size of the antenna.

[0015] In one possible implementation, the dielectric layer has a first port for connecting to the grounding element and a second port for connecting to the feed element. The first and second ports allow the dielectric layer to be connected to the grounding element and the feed element after molding, and then connected to the motherboard via the grounding element and the feed element. Alternatively, the first and second ports can also facilitate the connection of devices, such as capacitors or inductors, to adjust the antenna resonant point within a specified frequency band.

[0016] In one possible implementation, the radiating patch is seamless or has at least one slot, one end of which extends through the edge of the radiating patch. The slotted structure of the radiating patch allows for the design of a good multi-band antenna. Designing slots on the radiating patch and utilizing the slot radiation of the antenna can achieve good impedance matching and improve antenna gain.

[0017] In one possible implementation, the length of the slot is 0.25λ, where λ is the operating wavelength of the center point of the radiating patch's radiation frequency. This can improve the antenna's radiation capability.

[0018] In one possible implementation, the radiating patch, the feed element, and the grounding element are made of conductive metal. This reduces the cost of the antenna, making it suitable for low- to mid-range devices and enabling these devices to utilize low-cost UWB technology. The antenna can be fabricated using metal structural component processing techniques, which are simple, low-cost, and conducive to mass production.

[0019] In one possible implementation, the number of radiating patches is at least one, and when the number of radiating patches is two or more, a gap is maintained between adjacent radiating patches. This enables multi-frequency radiation of the antenna.

[0020] In one possible implementation, the sizes of two adjacent radiating patches may be equal or unequal. This can increase bandwidth or enable dual-band or multi-band operation of the antenna.

[0021] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0022] Figure 1 This is a state diagram of UWB antenna applications in existing technologies;

[0023] Figure 2 This is a top view of a UWB antenna application in the existing technology;

[0024] Figure 3 This is a schematic diagram of a side cross-section of an existing mobile phone;

[0025] Figure 4The graphs show the radiation efficiency, system efficiency, and reflection coefficient of UWB antennas in the prior art.

[0026] Figure 5 The far-field radiation pattern of a UWB antenna in the prior art;

[0027] Figure 6 This is a view of the back of the phone.

[0028] Figure 7 A side cross-sectional view of a mobile phone provided in an embodiment of this application;

[0029] Figure 8 A schematic diagram of the antenna structure in an electronic device according to one embodiment of this application (I);

[0030] Figure 9 A schematic diagram (II) of the structure of an antenna in an electronic device provided in one embodiment of this application;

[0031] Figure 10 A schematic diagram (III) of the antenna structure in an electronic device provided in one embodiment of this application;

[0032] Figure 11 The graphs showing the radiation efficiency, system efficiency, and reflection coefficient of the antenna in the electronic device provided in the embodiments of this application;

[0033] Figure 12 The far-field radiation pattern of the antenna in the electronic device provided in the embodiments of this application;

[0034] Figure 13 This is a schematic diagram of the antenna structure in an electronic device provided in another embodiment of this application;

[0035] Figure 14 This is a schematic diagram of the antenna structure in an electronic device provided in another embodiment of this application;

[0036] Figure 15 for Figure 14 The diagram shows the bottom of the antenna near the motherboard.

[0037] Figure 16 This is a schematic diagram of the structure of a radiation patch;

[0038] Figure 17 A state diagram (I) showing the application of two radiating patches in an antenna;

[0039] Figure 18 State diagram (II) showing the application of two radiating patches in an antenna;

[0040] Figure 19 State diagram (III) showing the application of two radiating patches in an antenna.

[0041] Figure label:

[0042] 100-UWB antenna;

[0043] 110-Radiation Patch;

[0044] 120-floor;

[0045] 200-Transmission line;

[0046] 300-UWB chip;

[0047] a - length;

[0048] b - width;

[0049] 1-Mobile phone;

[0050] 11-Battery cover;

[0051] 12-Graphite sheet;

[0052] 13-Battery;

[0053] 14-Motherboard;

[0054] 15-Front shell;

[0055] 16-screen;

[0056] 17- Devices;

[0057] 18-Thickness space;

[0058] 2-antenna;

[0059] 21-Radiation patch;

[0060] 211-Gap;

[0061] 212a, 212b, 212c - First radiating plates;

[0062] 213a, 213b, 213c - Second radiation plates;

[0063] 22a, 22b, 22c - Power supply components;

[0064] 23a, 23b, 23c - Grounding components;

[0065] 24-Dielectric layer;

[0066] 241 - First Port;

[0067] 242 - Second port.

[0068] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0069] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0070] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0071] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0072] Electronic devices can achieve wireless communication via antennas. Ultra-wideband (UWB) is a short-range wireless communication method. Instead of using sinusoidal carriers, UWB utilizes non-sinusoidal narrow pulses in the nanosecond to microsecond range to transmit data. Therefore, it has a wide transmission bandwidth, making it suitable for high-speed, short-range wireless personal communication. The U.S. Federal Communications Commission (FCC) stipulates that UWB operates in the frequency range of 3.1 GHz to 10.6 GHz, occupying a bandwidth of over 500 MHz. Due to its high data transmission rate (up to 1 Gbit / s), strong resistance to multipath interference, low power consumption, low cost, strong penetration capability, low interception rate, and ability to share spectrum with other existing wireless communication systems, UWB technology has become the preferred technology for Wireless Personal Area Network (WPAN) communication and is currently used in various terminal electronic devices.

[0073] The UWB antenna 100 is an antenna operating in the UWB frequency band. Electronic devices can achieve wireless communication through the UWB antenna 100. Figure 1 This is a state diagram of UWB antenna applications in existing technologies. Figure 2 This is a top view of a UWB antenna application in the prior art, such as... Figure 1 and Figure 2 As shown, the application of existing UWB technology in terminals is relatively simple. The UWB antenna 100 used is mainly a microstrip antenna, which is connected to the UWB chip 1 through a liquid-crystal polymer (LCP) transmission line 2. The microstrip antenna includes a radiating patch 110, a dielectric block (not shown), and a ground plane 120. The radiating patch 110 and the ground plane 120 are respectively disposed on both sides of the dielectric block. When the microstrip antenna radiates between the ground plane 120 and the top radiating patch 110, it is affected by dielectric loss, resulting in a reduction in both antenna gain and efficiency.

[0074] Figure 2 This is a top view of a UWB antenna application in the prior art, such as... Figure 2 As shown, currently, when UWB technology is applied to terminal electronic products such as mobile phones, the space inside the phone is limited, and the radiation characteristics of the antenna must also be considered. The antenna thickness is generally 0.3mm, the length 'a' is 13.8mm, the width 'b' is 11mm, the dielectric constant of the dielectric block is 2.9, and the loss tangent is 0.002. The cross-sectional area of ​​the antenna (the cross-sectional area perpendicular to the thickness direction of the phone) is very large, far exceeding the cross-sectional area of ​​the components on the phone's motherboard. Therefore, there is no space on the phone's motherboard available for arranging this antenna.

[0075] Figure 3 This is a schematic diagram of a side cross-section of an existing mobile phone, such as... Figure 3 As shown, a conventional mobile phone includes a battery cover 11, a graphite sheet 12, a battery 13, a motherboard 14, a front cover 15, and a screen 16. The graphite sheet 12 is typically positioned between the battery and the battery cover 11, and is attached to the battery cover 11 to facilitate heat dissipation. The motherboard 14 and the battery are both positioned between the graphite sheet 12 and the front cover 15. The motherboard 14 has various functional components 17 mounted on it. The screen 16 is fixed to the front cover 15 and is used for display. Because there is no space on the motherboard 14 of a conventional mobile phone to accommodate the existing UWB antenna 100, the existing UWB antenna 100 can only be positioned between the battery cover 11 and the graphite sheet 12, as shown below. Figure 3 As shown, this requires a certain thickness space 18 to be reserved between the battery cover 11 and the graphite sheet 12. However, under normal circumstances, the gap between the battery cover 11 and the graphite sheet 12 is very small, and the battery cover 11 even needs to be attached to the graphite sheet 12 for heat dissipation. If the antenna is arranged between the battery cover 11 and the graphite sheet 12, then at least a thickness space 18 of 0.3mm must be reserved between the battery cover 11 and the graphite sheet 12. This will increase the thickness of the entire mobile phone and bring a great challenge to the overall architecture.

[0076] Figure 4 This is a graph showing the radiation efficiency and system efficiency of existing UWB antennas. The horizontal axis represents frequency in GHz, and the vertical axis represents efficiency in dB. Figure 4 As shown, the solid line represents radiation efficiency, the dashed line represents system efficiency, and the dotted-dashed line represents antenna return loss. From... Figure 4 As can be seen, the antenna in the existing scheme covers two frequency bands, namely 6.5GHz and 8GHz. The radiation efficiency and system efficiency at 6.5GHz are -2.2dB and -3.7dB, respectively. Figure 5 The far-field radiation pattern of a UWB antenna in the prior art is shown below. Figure 5 As shown, the far-field radiation pattern of the existing antenna is oriented towards the back of the phone, and the simulated gain is 5.39 dBi. Therefore, it can be seen that the radiation efficiency, system efficiency, and gain of the existing antenna are all relatively low.

[0077] Therefore, this application provides an electronic device, which may be a mobile phone, tablet computer, PDA, or other similar device. All of these electronic devices are capable of wireless communication using an antenna. This embodiment does not limit the specific type of electronic device. Figure 6 A view of the back of the phone, such as... Figure 6 As shown, in this embodiment, a mobile phone is preferably used as an example for detailed explanation.

[0078] Figure 7 This is a side cross-sectional view of a mobile phone provided in an embodiment of this application, as shown below. Figure 7 As shown, this type of mobile phone electronic device generally includes a battery cover 11, a graphite sheet 12, a battery 13, a motherboard 14, a front cover 15, and a screen 16. In the mobile phone provided in this application embodiment, the graphite sheet 12 is disposed between the battery and the battery cover 11 and is attached to the battery cover 11 to achieve heat dissipation, that is, there is no gap between the battery cover 11 and the graphite sheet 12. The motherboard 14 and the battery are both disposed between the graphite sheet 12 and the front cover 15, and the motherboard 14 is provided with devices 17 that can realize various functions. The screen 16 is fixed to the front cover 15 and is used for display. The electronic device also includes an antenna 2, which is disposed on the motherboard 14. The Z-direction space at the motherboard 14 can provide sufficient space for the antenna 2 to be arranged, without the need to add a 0.3mm thickness space 18 between the battery cover 11 and the graphite sheet 12 for arranging the antenna 2, so that the graphite sheet 12 can be attached to the battery cover 11. Figure 7 As shown, this allows the antenna 2 to be arranged on the basis of the existing mobile phone architecture without increasing the overall thickness, enabling the antenna 2 to work in the UWB band and realize the application of UWB technology, which is conducive to the thinner design of mobile phones.

[0079] Specifically, Figure 8 This is a schematic diagram (a) of the antenna structure in an electronic device according to one embodiment of this application, as shown below. Figure 8 As shown, the electronic device also includes an antenna 2, which includes a radiating patch 21, a feed element 22a, and a grounding element 23a. One end of the grounding element 23a is connected to the radiating patch 21, and the other end of the grounding element 23a is abutted and connected to the motherboard 14, that is, the grounding element 23a is in direct contact with the motherboard 14, such as by screwing it to the motherboard 14 or by directly soldering it to the motherboard 14. One end of the feed element 22a is connected to the motherboard 14, and the other end of the feed element 22a is coupled and connected to the radiating patch 21. A gap is maintained between the feed element 22a and the radiating patch 21, and the energy of the feed element 22a is coupled to the radiating patch 21 through this gap, thereby forming a coupled feed structure in which the feed element 22a feeds the radiating patch 21.

[0080] Figure 9 This is a schematic diagram (II) of the antenna structure in an electronic device according to one embodiment of this application, as shown below. Figure 9 As shown, the electronic device also includes an antenna 2, which includes a radiating patch 21, a power supply component 22b, and a grounding component 23a. One end of the grounding component 23a is connected to the radiating patch 21, and the other end of the grounding component 23a is in direct contact with the motherboard 14, such as by screwing it onto the motherboard 14 or by directly soldering it to the motherboard 14. One end of the power supply component 22b is connected to the motherboard 14, and the other end of the power supply component 22b is in direct contact with the radiating patch 21, thus allowing direct power supply through contact with the radiating patch 21.

[0081] Depend on Figure 8 and Figure 9 It can be seen that, Figure 8 The antenna structure shown has a feed element 22a that does not directly contact the radiating patch 21, forming a coupled feed form. The end of the feed element 22a near the radiating patch 21 has a certain length in a direction parallel to the radiating patch 21, thereby forming a certain coupling space between the feed element 22a and the radiating patch 21. Compared with direct feeding, this increases the bandwidth, improves efficiency, and allows for more flexible adjustment of the shape of the radiating patch 21, effectively utilizing space. Figure 9 The feed element 22b in the antenna shown is in direct contact with the radiating patch 21, forming a direct feed form. Compared with coupled feed, this can improve the antenna gain and facilitate impedance matching.

[0082] Figure 10 This is a schematic diagram (iii) of the antenna structure in an electronic device according to one embodiment of this application, as shown. Figure 10As shown, the electronic device also includes an antenna 2, which includes a radiating patch 21, a feed element 22a, and a grounding element 23b. One end of the grounding element 23b is connected to the radiating patch 21, and the other end of the grounding element 23b is coupled to the motherboard 14. A gap is maintained between the grounding element 23b and the motherboard 14, forming a coupled grounding structure. One end of the feed element 22a is connected to the motherboard 14, and the other end of the feed element 22a is coupled to the radiating patch 21. A gap is maintained between the feed element 22a and the radiating patch 21, and the energy of the feed element 22a is coupled to the radiating patch 21 through this gap, thereby forming a coupled feeding structure in which the feed element 22a feeds the radiating patch 21.

[0083] Depend on Figure 8 and Figure 10 It can be seen that, Figure 8 The grounding component 23a in the antenna shown is in direct contact with the motherboard 14, forming a direct grounding structure, which can ensure the stability of the antenna. Specifically, the grounding component 23a can be soldered to the motherboard 14. Figure 10 The grounding component 23b in the antenna shown does not contact the main board 14, forming a coupled grounding structure. This eliminates the need for soldering between the grounding component 23b and the main board 14, making the arrangement of the grounding component 23b easier to operate and maintain.

[0084] Then by Figure 9 and Figure 10 It can be seen that, Figure 9 The grounding component 23a in the antenna shown is in direct contact with the main board 14, forming a direct grounding structure. Figure 10 The grounding component 23a in the antenna shown does not contact the main board 14, thus forming a coupled grounding structure. Figure 9 direct grounding structure and Figure 8 The direct grounding structure is the same in both cases, which can ensure the stability of the antenna. Figure 10 The coupled grounding structure eliminates the need for soldering between the grounding component 23b and the main board 14, making the arrangement of the grounding component 23b easier to operate and maintain. Furthermore, Figure 9 The feed element 22b in the antenna shown is in direct contact with the radiating patch 21, forming a direct feed form. Compared with coupled feed, this can improve the antenna gain and facilitate impedance matching. Figure 10 The feed element 22a in the antenna shown does not contact the radiating patch 21, forming a coupled feed structure. Figure 10 The coupled feed structure in Figure 8 The coupling feed structure is the same as that in the previous one, which can more flexibly adjust the shape of the radiating patch 21, effectively utilize space, and also increase bandwidth and improve efficiency.

[0085] Figure 11The graph shows the radiation efficiency and system efficiency of the antenna in the electronic device provided in this application embodiment. The horizontal axis represents frequency in GHz, and the vertical axis represents efficiency in dB. Curve A represents the radiation efficiency (…). Figure 11 As shown in the Rad. Efficiency diagram, curve B represents the system efficiency. Figure 11 The curve C represents the antenna's return loss (Tot. Efficiency). Figure 11 As shown in S1,1). Figure 11 Specifically Figure 8 The diagram shows the radiation efficiency and system efficiency curves of the antenna. Figure 11 As shown, Figure 8 The antenna shown has a radiation efficiency of -0.8 dB and a system efficiency of -1.8 dB at 6.5 GHz. Figure 12 The far-field radiation pattern of the antenna in the electronic device provided in the embodiments of this application is as follows: Figure 12 As shown, in this embodiment, the far-field radiation pattern of the antenna is oriented towards the back of the mobile phone 1, and the simulated gain is 5.89 dBi. Compared with the simulated gain of existing UWB antennas, the simulated gain of the antenna in this embodiment is significantly improved, and for example... Figure 5 The radiation pattern of the existing antenna shown and as follows Figure 12 As shown in the antenna radiation pattern of this embodiment, the antenna in this embodiment has stronger radiation intensity in all directions. Therefore, the antenna 2 in this embodiment, which includes a radiating patch 21, a grounding component, and a feeding component, has significantly improved radiation efficiency, system efficiency, and antenna gain in the UWB band compared to existing antennas. Specifically, the radiation efficiency is improved by 1.4 dB, the system efficiency by 1.9 dB, and the antenna gain by 0.5 dBi at 6.5 GHz.

[0086] Understandably, existing microstrip antennas require mounting on a dielectric block, and the antenna electric field is radiated out through dielectric loss, resulting in a certain loss in both antenna radiation efficiency and system efficiency, as well as antenna gain. However, in this embodiment, as... Figure 6 and Figure 7 As shown, the radiating patch 21 does not need to overlap the dielectric block; it is connected to the motherboard 14 via grounding and feeding components, thus eliminating dielectric loss and significantly improving antenna efficiency and gain. The dimensions of the radiating patch 21 in the direction perpendicular to the thickness of the phone 1 (Z direction), i.e., the dimensions in the X and Y directions, can be designed to be similar in size to the components 17 on the motherboard 14, thereby greatly reducing the space occupied in the X and Y directions within the phone 1. Since the antenna 2 is entirely mounted on the motherboard 14, the Z-direction space on the motherboard 14 provides sufficient space for the antenna 2, eliminating the need for a 0.3mm spacer between the battery cover 11 and the graphite sheet 12 for antenna 2 placement. Figure 6The thickness space 18 shown allows the graphite sheet 12 to fit snugly against the battery cover 11, as... Figure 7 As shown, this allows the antenna 2 to be arranged on the basis of the existing mobile phone architecture without increasing the overall thickness, enabling the antenna 2 to work in the UWB band and realize the application of UWB technology, which is conducive to the thinner design of mobile phones.

[0087] The radiating patch 21, the feed component, and the grounding component are all made of conductive metals, such as silver, copper, and aluminum. In this embodiment, copper is preferred because copper has low cost and low resistivity, which can reduce the cost of electronic devices such as mobile phones, reduce the impedance of the radiating patch 21, the grounding component, and the conductive component, and improve the antenna radiation performance.

[0088] It should be noted that the radiating patch 21, the feed component, and the grounding component all use metal structural components, eliminating dielectric loss and significantly improving antenna efficiency and gain. Furthermore, Figure 1 This is a state diagram of UWB antenna applications in existing technologies, such as... Figure 1 As shown, existing antennas use an LCP transmission line 200 to connect the antenna and the UWB chip. The cost of the LCP transmission line 200 is very high, making it difficult to apply in low- to mid-range terminal devices. In this embodiment, the antenna 2, including the radiating patch 21, the feed element, and the grounding element, can be manufactured as a custom component and integrated into the motherboard 14 of mobile phones and other terminal electronic devices, eliminating the need for the LCP transmission line 200. This significantly reduces costs and makes it suitable for low- to mid-range devices, enabling them to utilize low-cost UWB technology. Furthermore, since the radiating patch 21, the feed element, and the grounding element are all made of metal, the antenna 2 can be manufactured using metal structural component processing technology, which is simple, low-cost, and conducive to mass production.

[0089] As a specific implementation, the grounding component is welded to the radiating patch 21, thereby ensuring the reliability of the connection between the grounding component and the radiating patch 21. The grounding component can be a metal strip, a copper pillar, a screw, etc. Of course, the grounding component can be a component with other different shapes, such as triangular, circular, arc-shaped, spiral-shaped, etc., and this embodiment does not limit this.

[0090] As a specific implementation method, Figure 13 This is a schematic diagram of the antenna structure in an electronic device according to another embodiment of this application, as shown below. Figure 13As shown, the antenna 2 also includes a dielectric layer 24, on which the radiating patch 21 is disposed. The ends of the feed component 22c and the ground component 23c facing away from the motherboard 14 are both connected to the dielectric layer 24. The dielectric layer 24 is the electromagnetic medium supporting the radiating patch 21. Its material grade can be FR-4, which is a designation for a flame-retardant material grade, meaning that the resin material must be able to self-extinguish after combustion, ensuring the safety of the antenna 2. Of course, the dielectric layer 24 can also be an electromagnetic medium such as F2B. The dielectric layer 24 can expand the bandwidth and frequency band of the antenna 2, and these parameters can be adjusted as needed. The thickness of the dielectric layer 24 can be changed as needed, and its shape can be circular, square, etc. In addition, due to the loading of the electromagnetic medium, according to the principle of shortening the propagation wavelength in the medium, the physical size of the antenna 2 is further reduced. The size of the antenna 2 after reduction is one-square-root of the dielectric constant of the original size. This can further reduce the space occupied by the antenna 2 on the motherboard 14.

[0091] Specifically, the radiating patch 21 can be etched onto the surface of the dielectric layer 24, and the feed component 22c and the ground component 23c are both connected to the side of the dielectric layer 24 away from the radiating patch 21. Forming the radiating patch 21 on the front side of the dielectric layer 24 using an etching process is beneficial to improving the forming accuracy of the radiating patch 21, and also beneficial to improving the overall arrangement accuracy of the antenna 2 on the motherboard 14.

[0092] The dielectric layer 24 can be a printed circuit board (PCB). Using PCB manufacturing process, the radiation patch 21 is etched on the front side of the PCB, which can improve the consistency of the traces on the PCB and facilitate the etching operation.

[0093] Specifically, in order to ensure that both the grounding component 23c and the power supply component 22c can be reliably connected to the dielectric layer 24, both the grounding component 23c and the power supply component 22c are welded to the dielectric layer 24.

[0094] As a specific implementation method, Figure 14 This is a schematic diagram of the antenna structure in an electronic device provided in another embodiment of this application, as shown below. Figure 14 As shown, the radiating patch 21 can be disposed inside the dielectric layer 24. The radiating patch 21 can be integrally formed with the dielectric layer 24, and is disposed inside the dielectric layer 24 during the forming process of the dielectric layer 24, so that the radiating patch 21 is encapsulated by the dielectric layer 24, thereby further reducing the overall size of the antenna.

[0095] The grounding component and the feed component can both be housed within the dielectric layer 24 for encapsulation. The end of the grounding component facing away from the radiating patch 21 can protrude from the dielectric layer 24 for direct connection to the motherboard 14, or it can remain within the dielectric layer 24 and be connected to the motherboard 14 via a coupling connection. The end of the feed component facing away from the radiating patch 21 can also protrude from the dielectric layer 24, and the feed component can be connected to the motherboard 14 via a transmission line. Therefore, by encapsulating the grounding component, feed component, and radiating patch 21 within the dielectric layer 24, the overall size of the antenna can be reduced, thereby minimizing the space occupied above the motherboard 14.

[0096] It should be noted that in this embodiment, the dielectric layer 24 can be a material with a high dielectric constant, such as ceramic or alumina, but it is not limited to ceramic or alumina. Using a ceramic or alumina dielectric layer 24 allows the radiating patch 21 to be entirely encapsulated within the dielectric layer 24. Based on the principle of shortened propagation wavelength in the dielectric, the physical size of the antenna 2 is further reduced. The reduced size of the antenna 2 is one-times the square root of the dielectric constant of its original size, thereby further reducing the space occupied by the antenna 2 on the motherboard 14. In this embodiment, the dielectric layer 24 and the radiating patch 21 are integrally formed. For example, when using a ceramic dielectric layer 24, low-temperature co-fired ceramic (LTCC) technology can be used to integrally form the dielectric layer 24 and the radiating patch 21, achieving encapsulation of the radiating patch 21, thereby simplifying the manufacturing process of the antenna 2.

[0097] in, Figure 15 for Figure 14 The diagram shown is a bottom view of the antenna near the motherboard 14. Figure 15 As shown, the dielectric layer 24 has a first port 241 for connecting to the grounding component and a second port 242 for connecting to the power supply component. During the molding process of the dielectric layer 24, the first port 241 and the second port 242 can be reserved so that the dielectric layer 24 can be connected to the grounding component and the power supply component after molding, and then connected to the main board 14 through the grounding component and the power supply component. Of course, both the first port 241 and the second port 242 can be further connected in series with devices 17, such as capacitors or inductors, to adjust the antenna resonant point within a specified frequency band.

[0098] As a specific implementation method, Figure 16 This is a schematic diagram of the structure of the radiating patch 21, as shown below. Figure 16As shown, the radiating patch 21 has no gap 211 or at least one slot 211, with one end of the slot 211 extending through the edge of the radiating patch 21. When the radiating patch 21 has no gap 211, it is a complete metal sheet that radiates electromagnetic waves outwards as a whole. When the radiating patch 21 has at least one slot 211, the slot 211 can change the current path, causing the radiating patch 21 to radiate electromagnetic waves outwards at the slot 211. The slot 211 structure of the radiating patch 21 enables the design of a good multi-band antenna. By designing the slot 211 on the radiating patch 21 and utilizing the antenna's slot 211 for radiation, good impedance matching can be achieved, improving antenna gain.

[0099] In this embodiment, there are two slots 211. The two slots 211 can be designed for two frequency bands, or they can be designed for the same frequency band, thereby increasing the bandwidth. Of course, three or more slots 211 can also be designed to enable the antenna to operate in multiple frequency bands.

[0100] The length of the slit 211 can be 0.25λ, where λ is the operating wavelength of the center point of the radiation frequency of the radiating patch 21, thereby improving the radiation capability of the antenna.

[0101] As a specific implementation, the number of radiating patches 21 is at least one. When the number of radiating patches 21 is two or more, there is a gap between two adjacent radiating patches 21, so that multi-frequency radiation of the antenna can be realized.

[0102] Specifically, in this embodiment, as Figure 17 As shown, there are two radiating patches 21, namely a first radiating patch 212a and a second radiating patch 213a. The first radiating patch 212a is connected to the grounding component 23a and the feeding component 22a. The second radiating patch 213a is located above the first radiating patch 212a and maintains a certain distance from the first radiating patch 212a. The feeding component 22a feeds power to the first radiating patch 212a, and the first radiating patch 212a can feed power to the second radiating patch 213a through electromagnetic coupling. The radiation capability of the antenna can be improved through the first radiating patch 212a and the second radiating patch 213a.

[0103] The dimensions of two adjacent radiating patches 21 may be equal or unequal. The dimensions of the radiating patch 21 refer to the overall external dimensions of the radiating patch 21.

[0104] Figure 17 The diagram shows the state of two radiating patches used in an antenna (I), as follows: Figure 17 As shown, when two adjacent radiating patches 21 have the same size, for example, when the first radiating patch 212a and the second radiating patch 213a have the same size, the antenna bandwidth can be increased.

[0105] Figure 18 The second diagram shows the state of two radiating patches used in an antenna. Figure 18 As shown, when the size of the first radiating plate 212b is larger than the size of the second radiating plate 213b, the resonant frequency of the second radiating plate 213b is higher than the resonant frequency of the first radiating plate 212b. That is, the second radiating plate 213b corresponds to the high-frequency resonant bandwidth, and the first radiating plate 212b corresponds to the low-frequency resonant bandwidth.

[0106] Figure 19 The diagram shows the state of two radiating patches used in an antenna (Part 3), as follows: Figure 19 As shown, when the size of the first radiating patch 212c is smaller than the size of the second radiating patch 213c, the resonant frequency of the first radiating patch 212c is higher than that of the second radiating patch 213c. That is, the first radiating patch 212c corresponds to the high-frequency resonant bandwidth, and the second radiating patch 213c corresponds to the low-frequency resonant bandwidth, thereby realizing dual-frequency operation of the antenna. Of course, when the number of radiating patches 21 is greater, multi-frequency operation of the antenna can also be realized, which is not limited in this embodiment.

[0107] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device comprising a motherboard for arranging components, characterized in that, The electronic device further includes a battery cover, a graphite sheet, a battery, a front shell, a screen, and an antenna. The graphite sheet is disposed between the battery and the battery cover and is attached to the battery cover. The screen is fixed to the front shell. The motherboard and the battery are both disposed between the graphite sheet and the front shell. The antenna is disposed between the motherboard and the graphite sheet. The antenna includes a radiating patch, a feeding element, and a grounding element. One end of the grounding element is connected to the radiating patch, and the other end of the grounding element is coupled to or abutted against the motherboard. One end of the feeding element is connected to the motherboard, and the other end of the feeding element is coupled to or abutted against the radiating patch. There is no dielectric layer between the radiator and the motherboard.

2. The electronic device according to claim 1, characterized in that, The grounding component is welded to the radiating patch.

3. The electronic device according to any one of claims 1-2, characterized in that, The radiating patch is either seamless or has at least one slit, with one end of the slit extending through the edge of the radiating patch.

4. The electronic device according to claim 3, characterized in that, The length of the slit is 0.25λ, where λ is the operating wavelength of the center point of the radiation frequency of the radiating patch.

5. The electronic device according to any one of claims 1-4, characterized in that, The radiating patch, the power supply component, and the grounding component are made of conductive metal.

6. The electronic device according to any one of claims 1-5, characterized in that, The number of radiation patches is at least one, and when the number of radiation patches is two or more, there is a gap between two adjacent radiation patches.

7. The electronic device according to claim 6, characterized in that, The sizes of two adjacent radiation patches may be equal or unequal.

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