Ultrasonic electric box

Abstract

The application relates to an ultrasonic electric box, which comprises a shell and a handle, a heat dissipation frame in the shape of 'E' composed of three plates and a vertical plate is arranged in the shell, circuit modules are divided into a core plate, a power plate and a driving plate, the core plate is installed above the uppermost plate of the heat dissipation frame, the power plate is installed below the middle plate of the heat dissipation frame, the driving plate is installed outside the vertical plate of the heat dissipation frame, a screen is further arranged above the uppermost plate of the heat dissipation frame, a generator is installed inside the vertical plate of the heat dissipation frame, a transformer and a transducer are installed on the lowermost plate of the heat dissipation frame, the side of the shell is a heat dissipation net, and a heat dissipation fan is further arranged in the shell, the heat dissipation frame in the shape of 'E' is designed, the circuit modules are divided into the core plate, the driving plate and the power plate, and are arranged at different positions of the heat dissipation frame, so that the heat sources can be separated, the heat dissipation fan is matched, good heat dissipation effect can be achieved, and the situation that the circuit modules are not timely cooled and affect the normal operation of the circuit can be avoided.

Description

Technical Field

[0001] This invention relates to the field of ultrasonic technology, and more particularly to an ultrasonic power supply box. Background Technology

[0002] Existing ultrasonic welding machines consist of an ultrasonic generator, transducer, amplitude transformer, and welding head. The combination of the transducer, amplitude transformer, and welding head is called the "oscillator." During the welding process, due to factors such as welding load, oscillator temperature, energy loss, welding area, and welding head wear, the impedance characteristics of the entire oscillator will change with the operation, thereby altering the oscillator's natural operating frequency and operating frequency range.

[0003] If the frequency of the inverter trigger pulse (full-bridge inverter circuit) in the generator does not follow the change, it will cause the oscillator to become detuned, reduce working efficiency, and aggravate transducer losses. Therefore, the generator must have a frequency tracking function, that is, a full-bridge inverter trigger pulse in the ultrasonic generator must be within the operating frequency range of the oscillator. This inevitably requires a frequency tracking circuit, which contains multiple chips. The generator, transducer, transformer and related circuits of the ultrasonic welding machine are all installed in the ultrasonic enclosure. When the ultrasonic welding machine is operating, the components in the ultrasonic enclosure, especially the chips used for calculation, will generate a lot of heat. Existing ultrasonic enclosures are cooled by cooling fans, which can easily lead to poor heat dissipation and affect the normal operation of the circuit. Summary of the Invention

[0004] The purpose of this invention is to provide an ultrasonic heat sink box that uses an "E"-shaped heat sink design to divide the circuit module into three circuit boards, which are respectively placed in different positions on the heat sink. This separates the heat source, and with the help of a cooling fan, it can achieve a good heat dissipation effect, avoiding the situation where the circuit module cannot dissipate heat in time and affect the normal operation of the circuit.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: an ultrasonic power box, comprising a shell and a handle, wherein an "E"-shaped heat sink frame composed of three flat plates and a vertical plate is provided inside the shell, the circuit module is divided into a core board, a power board and a drive board, the core board is installed above the uppermost flat plate of the heat sink frame, the power board is installed below the middle flat plate of the heat sink frame, and the drive board is installed on the outside of the vertical plate of the heat sink frame, a screen is also provided above the uppermost flat plate of the heat sink frame, a generator is installed inside the vertical plate of the heat sink frame, and a transformer and a transducer are installed on the lowermost flat plate of the heat sink frame, the core board, power board, drive board, screen, generator, transformer and transducer are electrically connected through terminals, the side of the shell is a heat dissipation mesh, and a cooling fan is also provided inside the shell.

[0006] The heat sink is designed in an "E" shape, and the circuit modules are divided into a core board, a driver board, and a power board, which are placed in different positions on the heat sink. This separates the heat sources, and with the help of the cooling fan, a good heat dissipation effect can be achieved, avoiding the situation where the circuit modules cannot dissipate heat in time and affect the normal operation of the circuit.

[0007] Preferably, the heat sink is made of aluminum, the heat dissipation mesh only covers the area formed by the upper and lower plates and the inner side of the vertical plate of the heat sink, and there are two heat dissipation fans, which are arranged between adjacent plates of the heat sink.

[0008] The heat sink is made of aluminum, which has good thermal conductivity. The unit is placed between adjacent plates, which creates two heat dissipation airflow channels. The heat dissipation only covers the area formed by the upper and lower plates and the inner side of the vertical plate of the heat sink. This prevents the airflow from passing through the drive board and the core board, which can achieve a good dust prevention effect without affecting heat dissipation.

[0009] Preferably, the generator, transformer and transducer are all housed in a detachable housing, and the housing is bolted to the heat sink.

[0010] The generator, transformer, and transducer are housed in a removable housing, which is easier to disassemble and provides better stability compared to existing adhesive methods.

[0011] Preferably, the circuit module includes a full-bridge inverter circuit on the driver board and four driver chips for adjusting the pulse frequency of the full-bridge inverter circuit. The full-bridge inverter circuit is connected to a transformer after passing through a DC blocking capacitor, an inductor, and a capacitor on the power board. The transformer drives the transducer after passing through a matching inductor on the power board. The transformer is connected to the transformer primary current sampling circuit, the transformer secondary circuit sampling circuit, and the transformer voltage sampling circuit on the power board. The current and voltage information sampled by the transformer primary current sampling circuit, the transformer secondary circuit sampling circuit, and the transformer voltage sampling circuit is fed back to the main chip MUC on the core board. The main chip calculates the frequency tracking information based on the feedback current and voltage information and sends out four PWM signals through the PWM drive signal circuit on the core board to control the four driver chips.

[0012] The transformer primary and secondary current and voltage information is collected in real time through the transformer primary current sampling circuit, transformer secondary circuit sampling circuit, and transformer voltage sampling circuit. The information is fed back to the MUC in real time. After calculation by the MUC, a PWM drive signal is issued in real time to control the operation of the four drive chips and adjust the frequency of the inverter trigger pulse in the full-bridge inverter circuit. This ensures that the frequency of the inverter trigger pulse always operates within the working range, which reduces the risk of oscillator damage and lowers costs and risks.

[0013] Preferably, the circuit module also includes a power supply circuit on the driver board. The power supply circuit includes input AC380V and AC220V voltages. The AC380V voltage is filtered by the EMI circuit and rectified by the rectifier bridge to output DC580V voltage to power the full-bridge inverter circuit. The AC220V voltage is converted by the alternating circuit to output DC voltage 24V and ±DC6.5V. The DC voltage 24V is used to power the four driver chips, and the ±DC6.5V is used to power the MUC. The DC voltage 24V is converted into ±isolated power to power the four driver chips, and the ±DC6.5V is converted by the frequency converter circuit to output 3V voltage to power the MUC.

[0014] The power supply circuit accepts two types of AC power: DC580V to power the full-bridge inverter circuit, 24V DC to power the driver chip, and ±DC6.5V to power the MUC, thus simultaneously meeting the power supply requirements of various electrical appliances.

[0015] Preferably, the transformer primary current sampling circuit includes a current transformer CT connected to the circuit and resistors R1, R3 and R5 connected in parallel at the two output terminals of the CT for current shunting. The resistance of resistor R1 is 33 ohms, the resistance of resistor R3 is 390 ohms, the resistance of resistor R5 is 1 kΩ, and the error of resistors R1, R3 and R5 is 1%.

[0016] The primary current sampling circuit of the transformer uses three parallel resistors to shunt the current, so that the feedback current is not too large and is matched with the sampling circuit feedback circuit and MUC. The secondary current sampling circuit of the transformer is basically the same as the primary current sampling circuit of the transformer.

[0017] Preferably, the transformer voltage sampling circuit includes sampling wires connected to the two output terminals of the transformer. A voltage divider resistor is connected in series with the sampling wires, and a current divider resistor is connected in parallel. The voltage divider resistors include R7, R8, R9, R10, R11, R12, R13, R14, R15, and R16 connected in series, each with a resistance of 18 kΩ and an error of 1%. The current divider resistors include R17, R18, and R19 connected in parallel, with R17 having a resistance of 1500 Ω, R18 having a resistance of 390 Ω, and R19 having a resistance of 33 Ω. The error of R17, R18, and R19 is also 1%.

[0018] The transformer voltage sampling circuit uses 10 series resistors to divide the voltage, which makes the sampled output voltage less than 3V. At the same time, it also uses series resistors to shunt the current, so that the feedback current is not too large and it matches the sampling circuit feedback circuit and MUC.

[0019] Preferably, the current and voltage information sampled by the transformer primary current sampling circuit, the transformer secondary circuit sampling circuit, and the transformer voltage sampling circuit is fed back to the main chip MUC after passing through the sampling circuit feedback circuit on the core board. The sampling circuit feedback circuit is composed of two OPA2197IDR operational amplifiers, and a capacitor is set between the two OPA2197IDR operational amplifiers.

[0020] The design of the sampling circuit feedback circuit uses two OPA2197IDR operational amplifiers to amplify the voltage and current waveforms, making the MUC calculations more convenient. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of an ultrasonic electrical box.

[0022] Figure 2 A three-dimensional schematic diagram of an ultrasonic electrical box with a small portion of its casing removed.

[0023] Figure 3 A three-dimensional schematic diagram of an ultrasonic electrical box with most of its casing removed.

[0024] Figure 4 A three-dimensional schematic diagram of an ultrasonic electrical box with its casing removed.

[0025] Figure 5 This is a schematic diagram of the circuit module.

[0026] Figure 6 This is a schematic diagram of the transducer drive circuit after being connected to the sampling circuit.

[0027] Figure 7 This is a schematic diagram of the transformer primary current sampling circuit.

[0028] Figure 8 This is a schematic diagram of a transformer voltage sampling circuit.

[0029] Figure 9 This is a schematic diagram of the sampling circuit feedback circuit.

[0030] Figure 10 The schematic diagram is for a single OPA2197IDR operational amplifier.

[0031] The text labels in the diagram represent: 21. Housing; 22. Handle; 23. Mounting block; 24. Screen; 25. Heat dissipation mesh; 26. Heat dissipation fan; 27. Heat sink frame; 28. Core board; 29. ​​Power board; 30. Driver board; 31. Generator; 32. Transformer; 33. Transducer. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0033] Example 1

[0034] like Figures 1-4 As shown, this application discloses an ultrasonic power supply box, including a housing 21 and a handle 22. The housing 21 contains an "E"-shaped heat sink 27 composed of three flat plates and a vertical plate. The circuit module consists of a core board 28, a power board 29, and a driver board 30. The core board 28 is mounted above the uppermost flat plate of the heat sink 27, the power board 29 is mounted below the middle flat plate of the heat sink 27, and the driver board 30 is mounted on the outside of the vertical plate of the heat sink 27. A screen 24 is also mounted above the uppermost flat plate of the heat sink 27. A generator 21 is mounted inside the vertical plate of the heat sink 27, and a transformer 30 is mounted on the lowermost flat plate of the heat sink 27. The core board 28, power board 29, drive board 30, screen 24, generator 21, transformer 32 and transducer 33 are electrically connected through terminals. The side of the housing 21 is a heat dissipation mesh 25, and a heat dissipation fan 26 is also provided inside the housing 21. The heat dissipation frame 27 is made of aluminum. The heat dissipation mesh 25 only covers the area formed by the upper and lower plates and the inner side of the vertical plate of the heat dissipation frame 27. There are two heat dissipation fans 26, which are arranged between adjacent plates of the heat dissipation frame 27. The generator 31, transformer 32 and transducer 33 are all housed in a detachable box, and the box is installed in the heat dissipation frame 27 by bolts.

[0035] The specific installation of the ultrasonic enclosure of this application is as follows: First, install the heat sink 27 onto the base plate of the housing 21. Then, install the power board 29, drive board 30, and core board 28 onto the heat sink 27. Next, install the screen 24, generator 21, transformer 32, and transducer 33 onto the heat sink 27, and connect the various circuit boards or electronic components through terminals. Then, install the other housings 21, and position the two cooling fans 26 between adjacent horizontal plates of the heat sink 27. Finally, install the remaining housings 21, and then... (The sentence is incomplete and requires more context to translate accurately.) The entire box is lifted by the handle 22 and installed in the corresponding position using the mounting block 23 on the outside of the shell 21. The mounting block 23 has bolt holes for installation. This completes the installation of the ultrasonic power box. In actual use, the power box is powered on, which in turn enables the circuit module inside the power box to operate, driving the generator 31 and transducer 33 to work. At the same time, it can also be connected to the industrial communication module through the screen. While the circuit module is operating, the cooling fan 26 will start accordingly, which can form two cooling air channels to dissipate the heat emitted by the three circuit boards.

[0036] Example 2

[0037] like Figure 1-10 An ultrasonic transducer box is shown. The circuit module includes a full-bridge inverter circuit on a driver board 30 and four driver chips for adjusting the pulse frequency of the full-bridge inverter circuit. The full-bridge inverter circuit is connected to a transformer via a DC blocking capacitor, an inductor, and a capacitor on a power board 29. The transformer drives a transducer via a matching inductor on the power board 29. The transformer is connected to a transformer primary current sampling circuit, a transformer secondary circuit sampling circuit, and a transformer voltage sampling circuit on the power board 29. The current and voltage information sampled by these circuits is fed back to the main chip MUC on the core board 28. The main chip calculates the tracking value based on the feedback current and voltage information. The circuit module receives frequency information and outputs four PWM signals via the PWM drive signal circuit on the core board 28 to control four driver chips. The circuit module also includes a power supply circuit on the driver board 30. The power supply circuit includes input AC380V and AC220V voltages. The AC380V voltage is filtered by the EMI circuit and rectified by the rectifier bridge to output DC580V to power the full-bridge inverter circuit. The AC220V voltage is converted by the alternating circuit to output DC 24V and ±DC 6.5V. The DC 24V is used to power the four driver chips, and the ±DC 6.5V is used to power the MUC. The DC 24V is converted into ±isolated power supplies to power the four driver chips, and the ±DC 6.5V is used to power the MUC. The 0.5V voltage is converted to 3V by the frequency converter circuit to power the MUC. The transformer primary current sampling circuit includes a current transformer (CT) connected to the circuit and resistors R1, R3, and R5 connected in parallel to the two output terminals of the CT for current shunting. The resistance of resistor R1 is 33 ohms, the resistance of resistor R3 is 390 ohms, and the resistance of resistor R5 is 1 kΩ. The tolerance of resistors R1, R3, and R5 is 1%. The transformer voltage sampling circuit includes sampling wires connected to the two output terminals of the transformer. Resistors for voltage division are connected in series and in parallel for current shunting on the sampling wires. The voltage division resistors include resistors R7, R8, R9, R10, R11, R12, R13, and R4 connected in series. 14. R15 and R16 are both 18 kΩ with a tolerance of 1%. The shunt resistors include parallel resistors R17, R18 and R19. R17 has a resistance of 1500 Ω, R18 has a resistance of 390 Ω, and R19 has a resistance of 33 Ω. The tolerance of R17, R18 and R19 is 1%. The current and voltage information sampled by the transformer primary current sampling circuit, the transformer secondary circuit sampling circuit and the transformer voltage sampling circuit are fed back to the main chip MUC after passing through the sampling circuit feedback circuit on the core board 28. The sampling circuit feedback circuit is composed of two OPA2197IDR operational amplifiers, and a capacitor is placed between the two OPA2197IDR operational amplifiers.

[0038] The frequency tracking method combined with the circuit module is as follows: The AC380V input voltage of the power supply circuit is filtered by the EMI circuit and rectified by the rectifier bridge to output DC580V voltage to power the full-bridge inverter circuit. The full-bridge inverter circuit generates pulses that drive the transducer after passing through the DC blocking capacitor, inductor, capacitor, transformer, and matching inductor. This is the normal operation of the generator and transducer. During operation, the AC220V input voltage of the power supply circuit is converted into 24V DC voltage to form four isolated power supplies to power the four driver chips respectively. The AC220V input voltage of the power supply circuit is also converted into ±DC6.5V, and after passing through the frequency conversion circuit, it forms a 3V power supply to power the main chip MUC. The current and voltage information sampled by the transformer primary current sampling circuit, transformer secondary circuit sampling circuit, and transformer voltage sampling circuit are first amplified by two OPA2197IDR operational amplifiers before being transmitted to the main chip MUC. For each sampling cycle, the data is placed in the main chip's built-in peripheral - integrated control law accelerator coprocessor (Control Law). The Accelerator (CLA) performs a Fourier transform, flipping the real and imaginary parts of the complex number, then performing a bit inversion, decompressing it, and performing a Fast Fourier Transform (FFT) to obtain the true Fourier series. The acquired waveform is then reconstructed in the software to complete the phase construction. The principle is based on the property of Fourier series, that is, any periodic function can be represented by an infinite series composed of sine and cosine functions. The main chip encapsulates the FFT processing function for users to call directly. Then, the following key parameter is calculated: ① Amplitude: Amplitude = 2*sqrt((maximum value in the period^2) + (minimum value in the period^2)). By inputting the FFT calculation results of the primary current, secondary current, and secondary voltage signals, the amplitude of the corresponding signals can be obtained.

[0039] ② Phase: atan2(maximum value in the period, minimum value in the period)*180 / π.

[0040] ③ Primary and secondary current phase difference: primary current phase - secondary current phase.

[0041] ④ Secondary voltage and current phase difference: Secondary voltage phase - Secondary current phase.

[0042] ⑤ Phase difference between primary and secondary current and voltage: secondary voltage phase - primary current phase.

[0043] ⑥ Voltage = Secondary voltage amplitude * Voltage correction factor (1.493).

[0044] ⑦ Current = Secondary current amplitude * Current correction factor (0.019).

[0045] ⑧ Power = Voltage * Current * Power Correction Factor (1) * cos(Secondary Current-Voltage Phase Difference * π / 180)

[0046] ⑨ Impedance = Voltage / Current * Impedance Correction Factor (1)

[0047] ⑩ Frequency = 1 / Time for the current to complete one cycle

[0048] Note: The parameters above are calculated immediately after each data acquisition cycle, i.e., sampling, phase construction, and calculation are performed synchronously in real time.

[0049] After obtaining the above key parameters, frequency tracking can be performed, starting from the anti-resonance frequency and proceeding downwards. The entire process is divided into two parts:

[0050] ① When the impedance is greater than or equal to the target impedance * 3, track the frequency at which the phase difference between the secondary current and voltage is 0: obtain the current phase difference and current frequency in real time. If the phase difference is not equal to 0, subtract the frequency. This is determined by the oscillator characteristics, so first track the 0 phase to ensure that the frequency is tracked downwards, operating within the frequency range (i.e., the working bandwidth) between the resonant point and the anti-resonant point. Obtain the minimum and maximum impedance under load using an impedance analyzer. The target impedance is set between the minimum and maximum impedances. The specific value required for good soldering can be adjusted. The higher the setting, the closer to the anti-resonant point, and the lower the setting, the closer to the resonant point.

[0051] ② When the phase difference between the secondary current and voltage is 0 or the impedance is less than 3 times the target impedance, the frequency is tracked to the target impedance. When the current impedance is less than the target impedance, the frequency is increased; when the current impedance is greater than the target impedance, the frequency is decreased; until the welding is completed, the current impedance is always kept near the target impedance.

[0052] Frequency change value for each step: Set the PID coefficient and derive the change value based on the PID algorithm; the algorithm is a packaged function provided by the main chip for direct user call.

[0053] The phase that needs to be tracked is calculated, and then four PWM signals are emitted through the PWM drive signal circuit. The PWM signals are transmitted to four drive chips to control the four drive chips to adjust the pulse emission phase of the full-bridge inverter circuit, so as to achieve the effect of real-time frequency tracking and ensure that the input frequency of the transducer is always within the normal range.

[0054] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0055] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. An ultrasonic charging box, comprising a housing (21) and a handle (22), characterized in that, The housing (21) contains an "E"-shaped heat sink (27) consisting of three flat plates and one vertical plate. The circuit module is divided into a core board (28), a power board (29), and a driver board (30). The core board (28) is installed above the top flat plate of the heat sink (27), the power board (29) is installed below the middle flat plate of the heat sink (27), and the driver board (30) is installed on the outside of the vertical plate of the heat sink (27). A screen (24) is also provided above the top flat plate of the heat sink (27), and a generator is installed on the inside of the vertical plate of the heat sink (27). The generator (31) has a transformer (32) and a transducer (33) mounted on the bottom plate of the heat sink (27). The core board (28), power board (29), drive board (30), screen (24), generator (31), transformer (32) and transducer (33) are electrically connected through terminals. The side of the housing (21) is a heat sink (25), and a heat sink fan (26) is also provided inside the housing (21). The circuit module includes a full-bridge inverter circuit on the drive board (30) and four drive chips for adjusting the pulse frequency of the full-bridge inverter circuit. The full-bridge inverter circuit connects to the transformer via the DC blocking capacitor, inductor, and capacitor on the power board (29). The transformer drives the transducer via the matching inductor on the power board (29). The transformer is connected to the transformer primary current sampling circuit, transformer secondary circuit sampling circuit, and transformer voltage sampling circuit on the power board (29). The current and voltage information sampled by the transformer primary current sampling circuit, transformer secondary circuit sampling circuit, and transformer voltage sampling circuit is fed back to the main chip MUC on the core board (28). The main chip calculates the frequency tracking signal based on the feedback current and voltage information. The information is transmitted through the PWM drive signal circuit on the core board (28) to generate four PWM signals to control four drive chips. Specifically, the main chip transmits the acquired data to the peripheral integrated control law accelerator coprocessor of the main chip for Fourier transform in each acquisition cycle, flips the real and imaginary parts of the complex number, performs bit inversion, decompresses and performs fast Fourier transform calculation to obtain the true Fourier series, restores the acquired waveform in the software, and completes phase establishment; obtain parameters, ① amplitude: amplitude = 2*sqrt((maximum value in the cycle^2) +(minimum value in the period^2)), by inputting the FFT calculation results of the primary current, secondary current, and secondary voltage signals, the amplitude of the corresponding signals can be obtained respectively; ② Phase: atan2(maximum value in the period, minimum value in the period)*180 / π; ③ Primary and secondary current phase difference: primary current phase - secondary current phase; ④ Secondary voltage and current phase difference: secondary voltage phase - secondary current phase; ⑤ Primary and secondary current and voltage phase difference: secondary voltage phase - primary current phase; ⑥ Voltage = secondary voltage amplitude * voltage correction coefficient; ⑦ Current = secondary current amplitude * current correction coefficient; ⑧ Power = voltage * current * power correction coefficient * cos(secondary current and voltage phase difference * π / 180);⑨ Impedance = Voltage / Current * Impedance Correction Factor; ⑩ Frequency = 1 / Time for Current to complete one cycle; Frequency tracking is performed by tracking the target impedance, which has the following two cases: ① When impedance ≥ target impedance * 3, track the frequency where the secondary current-voltage phase difference = 0: obtain the current phase difference and current frequency in real time; if the phase difference ≠ 0, subtract the frequency; ② When the secondary current-voltage phase difference = 0 or impedance < target impedance * 3, track the target impedance frequency; if the current impedance < target impedance, add the frequency; if the current impedance > target impedance, subtract the frequency.

2. An ultrasonic enclosure according to claim 1, characterized in that, The heat sink (27) is made of aluminum. The heat sink mesh (25) only covers the area formed by the upper and lower plates and the inner side of the vertical plate of the heat sink (27). There are two heat sink fans (26), which are set between adjacent plates of the heat sink (27).

3. An ultrasonic enclosure according to claim 1, characterized in that, The generator (31), transformer (32) and transducer (33) are all housed in a detachable housing, and the housing is bolted to the heat sink (27).

4. An ultrasonic enclosure according to claim 1, characterized in that, The circuit module also includes a power supply circuit on the driver board (30). The power supply circuit includes an input AC380V voltage and an AC220V voltage. The AC380V voltage is filtered by the EMI circuit and rectified by the rectifier bridge to output a DC580V voltage to power the full-bridge inverter circuit. The AC220V voltage is output as a DC voltage of 24V and ±DC6.5V after passing through the alternating circuit. The DC voltage of 24V is used to power the four driver chips, and ±DC6.5V is used to power the MUC.

5. An ultrasonic enclosure according to claim 4, characterized in that, The 24V DC voltage is converted into ± isolated power to power the four driver chips, and the ±DC 6.5V is output as 3V after passing through the frequency conversion circuit to power the MUC.

6. An ultrasonic enclosure according to claim 1, characterized in that, The transformer primary current sampling circuit includes a current transformer CT connected to the circuit and resistors R1, R3, and R5 connected in parallel at the two output terminals of the CT for current shunting. The resistance of resistor R1 is 33 ohms, the resistance of resistor R3 is 390 ohms, and the resistance of resistor R5 is 1 kΩ. The error of resistors R1, R3, and R5 is 1%.

7. An ultrasonic enclosure according to claim 1, characterized in that, The transformer voltage sampling circuit includes sampling wires connected to the two output terminals of the transformer. A resistor for voltage division is connected in series on the sampling wires, and a resistor for current division is connected in parallel.

8. An ultrasonic box according to claim 7, characterized in that, The voltage divider resistors include R7, R8, R9, R10, R11, R12, R13, R14, R15, and R16 connected in series, each with a resistance of 18 kΩ and a tolerance of 1%. The current divider resistors include R17, R18, and R19 connected in parallel, with R17 having a resistance of 1500 Ω, R18 having a resistance of 390 Ω, and R19 having a resistance of 33 Ω. The tolerance of R17, R18, and R19 is also 1%.

9. An ultrasonic enclosure according to claim 1, characterized in that, The current and voltage information sampled by the transformer primary current sampling circuit, the transformer secondary circuit sampling circuit and the transformer voltage sampling circuit are fed back to the main chip MUC after passing through the sampling circuit feedback circuit on the core board (28). The sampling circuit feedback circuit is composed of two OPA2197IDR operational amplifiers, and a capacitor is set between the two OPA2197IDR operational amplifiers.

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