Method for manufacturing display panel and display panel

Abstract

The application relates to a display panel preparation method and a display panel. The display panel preparation method comprises the following steps: removing an opening part to obtain a first through hole, the first through hole penetrating a cathode layer, and in the process of removing the opening part, dust generated is controlled to fall on the surface of the side of the display part away from the substrate; the display panel comprises an opening area and a display area, the opening area is adjacent to the display area, the display panel comprises a cathode layer and a substrate, the cathode layer is located on the substrate, the cathode layer comprises an opening part and a display part, the opening part is located in the opening area, and the display part is located in the display area. According to the embodiment of the application, the reliability of the display panel packaging can be improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a method for manufacturing a display panel and the display panel itself. Background Technology

[0002] In related technologies, with the continuous development of display technology, users have increasingly higher demands for the screen-to-body ratio of mobile devices. Since components such as cameras and sensors need to be installed at the top of the screen, openings are usually reserved at the top for these components to achieve a high screen-to-body ratio.

[0003] However, encapsulation failure is a common problem when manufacturing display panels with openings. Summary of the Invention

[0004] This invention provides a method for manufacturing a display panel and a display panel in order to overcome the shortcomings of related technologies.

[0005] According to a first aspect of the present invention, a method for manufacturing a display panel is provided. The display panel includes an aperture region and a display region, the aperture region being adjacent to the display region. The display panel includes a cathode layer and a substrate, the cathode layer being located on the substrate. The cathode layer includes an aperture portion and a display portion, the aperture portion being located in the aperture region, and the display portion being located in the display region. The method includes:

[0006] The opening is removed to obtain a first through hole that penetrates the cathode layer. During the removal of the opening, the generated dust is controlled to fall onto the surface of the display unit on the side opposite to the substrate.

[0007] In one embodiment, before removing the opening to obtain the first through hole, the process includes:

[0008] The display panel is placed on the support frame, with the cathode layer facing the support frame, the edge of the display panel in contact with the support frame, and the opening portion suspended in the air;

[0009] The process of removing the opening portion to obtain the first through hole includes:

[0010] The first through hole is obtained by removing the opening portion from the substrate in the direction of the cathode layer using a drilling process; during the removal of the opening portion, the generated dust falls along the cathode layer in the direction of the support frame.

[0011] In one embodiment, the display panel further includes a driving circuit layer located between the substrate and the cathode layer;

[0012] The driving circuit layer includes a light-shielding part and a light-transmitting part, the light-shielding part and the light-transmitting part are adjacent to each other, and the light-transmitting part is located in the opening area;

[0013] The step of removing the opening portion from the substrate in the direction pointing towards the cathode layer using a drilling process to obtain the first through hole includes:

[0014] A laser is used to irradiate the opening portion through the light-transmitting portion along the direction from the substrate to the cathode layer, causing the opening portion to be ashed to obtain the first through hole; the light-shielding portion is used to block the laser.

[0015] In one embodiment, the driving circuit layer includes at least one metal layer; the light-shielding portion is located on at least one of the metal layers of the driving circuit layer.

[0016] In one embodiment, the absorption rate of the cathode layer to the laser is greater than the absorption rate of the light-shielding portion to the laser; or, the thickness of the light-shielding portion is greater than the thickness of the cathode layer.

[0017] In one embodiment, the light-transmitting portion is a first light-transmitting hole; or...

[0018] The light-transmitting portion includes a first sub-light-transmitting portion and a second sub-light-transmitting portion. The first sub-light-transmitting portion is a second light-transmitting hole, and the second light-transmitting hole is located on at least one of the metal layers of the driving circuit layer. The driving circuit layer also includes an inorganic layer, and the second sub-light-transmitting portion is located in the inorganic layer. The second sub-light-transmitting portion is located in the opening area, and the absorption rate of the laser by the second sub-light-transmitting portion is less than the absorption rate of the laser by the cathode layer.

[0019] In one embodiment, before removing the opening to obtain the first through hole, the process includes:

[0020] A photomask is placed on the side of the cathode layer facing away from the substrate, the photomask including an opening, the projection of the opening onto the substrate being located in the aperture area;

[0021] The process of removing the opening portion to obtain the first through hole includes:

[0022] The opening is removed through the opening to form the first through hole; during the removal of the opening, dust generated falls onto the surface of the mask facing away from the substrate.

[0023] In one embodiment, there is a gap between the mask and the cathode layer.

[0024] In one embodiment, removing the opening portion through the opening to form the first through hole includes:

[0025] The first through-hole is formed by bombarding the opening with plasma through the opening.

[0026] In one embodiment, the photomask includes a metal layer and an insulating layer, wherein the insulating layer covers the metal layer.

[0027] According to a second aspect of the present invention, a display panel is provided, which is prepared using the above-described display panel preparation method; the display panel includes an opening region and a display region, the opening region being adjacent to the display region; the display panel includes a substrate, a driving circuit layer, and a cathode layer, the driving circuit layer being located between the substrate and the cathode layer, the driving circuit layer including a light-shielding portion and a light-transmitting portion, the light-shielding portion being adjacent to the light-transmitting portion, the light-transmitting portion being located in the opening region, and the light-shielding portion being located outside the opening region for blocking laser light; the cathode layer includes a first through-hole and a display region, the display region being adjacent to the first through-hole, the first through-hole being located in the opening region, and the display region being located in the display region or...

[0028] The display panel includes an opening area and a display area, the opening area being adjacent to the display area; the display panel includes a substrate, a driving circuit layer and a cathode layer, the driving circuit layer being located between the substrate and the cathode layer; the cathode layer includes a first through-hole and a display portion, the display portion being adjacent to the first through-hole, the first through-hole being located in the opening area, and the display portion being located in the display area.

[0029] As can be seen from the above embodiments, since the display panel includes an opening area and a display area, the opening area and the display area are adjacent to each other. The display panel includes a cathode layer and a substrate. The cathode layer is located on the substrate. The cathode layer includes an opening portion and a display portion. The opening portion is located in the opening area, and the display portion is located in the display area. By removing the opening portion, a first through hole is obtained. The first through hole penetrates the cathode layer. During the removal of the opening portion, the generated dust is controlled to fall on the surface of the display portion facing away from the substrate, thereby avoiding the dust generated during the removal of the opening portion from falling on the surface of the cathode layer facing away from the substrate. This prevents the encapsulation from failing due to the dust falling on the surface of the cathode layer facing away from the substrate piercing the encapsulation film during encapsulation.

[0030] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0032] Figure 1This is a schematic diagram of a display panel according to an embodiment of the present invention;

[0033] Figure 2 This is a cross-sectional view of a display panel according to an embodiment of the present invention;

[0034] Figure 3A This is a cross-sectional view of a driving circuit layer mechanism of a display panel according to an embodiment of the present invention;

[0035] Figure 3B This is a cross-sectional view of a driving circuit layer mechanism of a display panel according to an embodiment of the present invention;

[0036] Figure 4A This is a schematic diagram of the structure of a driving circuit layer of a display panel according to an embodiment of the present invention;

[0037] Figure 4B This is a schematic diagram of the structure of the driving circuit layer of another display panel according to an embodiment of the present invention;

[0038] Figure 5 This is a cross-sectional view of another display panel according to an embodiment of the present invention;

[0039] Figure 6 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0040] Figure 7 This is a schematic diagram illustrating a method for drilling holes in the cathode layer of a display panel according to an embodiment of the present invention;

[0041] Figure 8 This is a flowchart illustrating another method for manufacturing a display panel according to an embodiment of the present invention;

[0042] Figure 9 This is a schematic diagram illustrating another method for drilling holes in the cathode layer of a display panel according to an embodiment of the present invention. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims.

[0044] This invention provides a display panel, the display panel 1, as shown in the example. Figure 1As shown, it includes: an opening area 11 and a display area 12, with the opening area 11 and the display area 12 adjacent to each other. This display panel 1, as... Figure 2 As shown, it includes: a cathode layer 21, a driving circuit layer 22, a substrate 23, an encapsulation layer 24, a light-emitting layer 25, and an anode 26.

[0045] like Figure 1 and Figure 2 As shown, the driving circuit layer 22 is located on the substrate 23, the light-emitting layer 25 is located on the side of the driving circuit layer 22 facing away from the substrate 23, the anode 26 is located between the light-emitting layer 25 and the driving circuit layer 22, the light-emitting layer 25 and the anode 26 are located in the display area 12, the cathode layer 21 is located on the side of the light-emitting layer 25 facing away from the driving circuit layer 22, and the encapsulation layer 24 is located on the side of the cathode layer 21 facing away from the light-emitting layer 25. The driving circuit layer 22 includes a light-shielding portion 221 and a light-transmitting portion 222, which are adjacent to each other. The light-transmitting portion 222 is located in the opening area 11, and the light-shielding portion 221 is located outside the opening area 11 to block laser light. The cathode layer 21 includes a first through-hole 211 and a display portion 212, which are adjacent to the first through-hole 211. The first through-hole 211 is located in the opening area 11 and penetrates the cathode layer 21. The display portion 212 is located in the display area 12.

[0046] In this embodiment, the display panel includes an opening area and a display area, which are adjacent to each other. The display panel includes a cathode layer, a driving circuit layer, and a substrate. The driving circuit layer includes a light-shielding part and a light-transmitting part, which are adjacent to each other. The light-transmitting part is located in the opening area, and the light-shielding part is located outside the opening area to block the laser. The cathode layer includes a first through hole and a display area, which are adjacent to each other. The first through hole is located in the opening area, and the display area is located in the display area. When the laser irradiates the cathode layer along the direction from the substrate to the cathode layer to form the first through hole, the light-shielding part can block the laser and prevent the incident laser from damaging the display area and other circuits in the driving circuit layer.

[0047] In some embodiments, such as Figure 2 As shown, the cathode layer 21 includes an opening portion and a display portion 212. The opening portion is adjacent to the display portion 212. The opening portion is located in the opening area 11, and the display portion 212 is located in the display area 12. The opening portion is a first through hole 211.

[0048] In some embodiments, the encapsulation layer 24 may be a thin-film encapsulation. This reduces the thickness of the encapsulation layer 24, thereby reducing the thickness of the display panel after encapsulation.

[0049] In some embodiments, such as Figure 2 As shown, the light-emitting layer 25 is located on the corresponding anode 26, and the cathode layer 21 is located on the side of the light-emitting layer 25 facing away from the anode 26. It is possible that the anodes 26 are not connected to each other.

[0050] In some embodiments, the light-emitting layer 25 includes a red light-emitting layer 251, a green light-emitting layer 252, and a blue light-emitting layer 253, which are arranged in an array. The red light-emitting layer 251 emits red light, the green light-emitting layer 252 emits green light, and the blue light-emitting layer 253 emits blue light.

[0051] In some embodiments, such as Figure 3A As shown, the driving circuit layer 22 may include a source / drain layer 223, a second insulating layer 224, a gate layer 225, a first insulating layer 226, and a polysilicon layer 227. The first insulating layer 226 is located on the polysilicon layer 227. The gate layer 225 is located on the side of the first insulating layer 226 facing away from the polysilicon layer 227. The second insulating layer 224 is located on the side of the gate layer 225 facing away from the first insulating layer 226. The source / drain layer 223 is located on the side of the second insulating layer 224 facing away from the gate layer 225. The gate layer 223 and the source / drain layer 225 in the driving circuit layer 22 are metal layers, but are not limited to this. The light-shielding portion 221 is located on at least one of the metal layers in the driving circuit layer 22. For example, the light-shielding portion 221 may be located on the source / drain layer 223 and the gate layer 225, or on any one of the source / drain layer 223 and the gate layer 225. In this way, since metal has a better effect on blocking lasers than organic and inorganic layers, when the laser is incident along the direction from the substrate 23 to the cathode layer 21, the light-shielding part 221 on the metal layer of the driving circuit layer 22 can block the laser with a better effect than blocking the laser through organic and inorganic layers. This ensures that the laser does not damage the display unit 212 and other circuits in the driving circuit layer 22. At the same time, when the light-shielding part 221 is located in two or more metal layers, the thickness of the light-shielding part 221 can be increased, thereby enhancing the laser blocking effect of the light-shielding part 221 and improving the protection effect of the light-shielding part 221 on the display unit 212 and other circuits in the driving circuit layer 22.

[0052] In some embodiments, the absorption rate of the cathode layer 21 to the laser is greater than that of the light-shielding portion 221 to the laser, or the thickness of the light-shielding portion 221 is greater than the thickness of the cathode layer 21. In this way, when the laser is incident along the direction of the substrate 23 pointing towards the cathode layer 21, the light-shielding portion 221 can block the laser and ensure that the laser does not damage other circuits in the drive circuit layer 22.

[0053] In some embodiments, the light-transmitting portion 222 can be a first light-transmitting hole. In this way, when ambient light is incident from the opening region 11 along the direction of the driving circuit layer 22 toward the substrate 23, it will not be blocked by the driving circuit layer 22, thereby improving the brightness of the ambient light incident from the opening region.

[0054] In some embodiments, such as Figure 3B As shown, the driving circuit layer 22 may include a source-drain layer 223, a second insulating layer 224, a gate layer 225, a first insulating layer 226, and a polysilicon layer 227. The first insulating layer 226 is located on the polysilicon layer 227. The gate layer 225 is located on the side of the first insulating layer 226 facing away from the polysilicon layer 227. The second insulating layer 224 is located on the side of the gate layer 225 facing away from the first insulating layer 226. The source-drain layer 223 is located on the side of the second insulating layer 224 facing away from the gate layer 225. The transmittance of the insulating layer 224 and the polysilicon layer 227 is higher than that of the gate layer 223 and the source-drain layer 225. The light-transmitting portion 222 includes a first sub-light-transmitting portion 2221 and a second sub-light-transmitting portion 2222. The first sub-light-transmitting portion 2221 is a second light-transmitting aperture, which is located on at least one of the metal layers of the driving circuit layer 22. For example, the second light-transmitting aperture may be located on the gate layer 223 and the source / drain layer 225, but is not limited thereto. The second sub-light-transmitting portion 2222 is located in the aperture region 11 and is located on an inorganic layer in the driving circuit layer 22. For example, the second sub-light-transmitting portion 2222 is located on the insulating layer 224 and the polysilicon layer 227, but is not limited thereto. In this way, when ambient light is incident from the aperture region 11 along the direction of the driving circuit layer 22 toward the substrate 23, it will not be blocked by the metal layers in the driving circuit layer 22, thereby improving the brightness of the ambient light incident from the aperture region. At the same time, the absorption rate of the second sub-light-transmitting portion 2222 for laser light is less than the absorption rate of the cathode layer 21 for laser light. In this way, even if the second sub-transmitting part 2222 is retained in the opening area, the impact on the opening of the cathode layer can be reduced.

[0055] In some embodiments, such as Figure 4A As shown, the display panel 1 includes an opening area 11 and a display area 12, with the opening area 11 surrounding the display area 12. In the driving circuit layer 22, a light-shielding portion 221 surrounds a light-transmitting portion 222. In this way, the light-shielding portion 221 can better block laser light incident along the direction from the substrate 23 toward the cathode layer 21, preventing damage to the display area 212 and other circuits in the driving circuit layer 22.

[0056] In other embodiments, such as Figure 4B As shown, the display panel 1 includes an opening area 11 and a display area 12, with the opening area 11 partially surrounding the display area 12. In the driving circuit layer 22, a light-shielding portion 221 partially surrounds a light-transmitting portion 222. The two ends of the semicircular ring formed by the light-shielding portion 221 and the light-transmitting portion 222 are located at the edge of the driving circuit layer 22. The side of the light-transmitting portion 222 that does not contact the light-shielding portion 221 in a direction parallel to the driving circuit layer 22 is located at the edge of the driving circuit layer 22. Thus, since parts of the edges of the light-shielding portion 221 and the light-transmitting portion 222 are located at the edge of the driving circuit layer 22, the precision requirements of the manufacturing process are reduced, thereby reducing the difficulty and cost of the process.

[0057] In some embodiments, the substrate 23 is made of polyimide (PI), but is not limited thereto. The polyimide material can be transparent or opaque. When using opaque polyimide as the substrate 23, a drilling process can be performed on the portion of the substrate 23 located in the opening region 11 to form a through-hole penetrating the substrate 23. This avoids the substrate 23 located in the opening region 11 from blocking incident light, thereby increasing the brightness of light incident from the opening region. When using transparent polyimide as the substrate 23, compared to using opaque polyimide, the light transmittance of the substrate 23 can be increased without performing a drilling process.

[0058] This invention also provides another display panel, such as... Figure 5 As shown, the display panel 1 includes an opening area 11 and a display area 12, with the opening area 11 and the display area 12 adjacent to each other. The display panel 1, as... Figure 5 As shown, it includes: a cathode layer 21, a driving circuit layer 22, a substrate 23, an encapsulation layer 24, a light-emitting layer 25, and an anode 26.

[0059] like Figure 1 and Figure 5 As shown, the driving circuit layer 22 is located on the substrate 23, the light-emitting layer 25 is located on the side of the driving circuit layer 22 facing away from the substrate 23, the anode 26 is located between the light-emitting layer 25 and the driving circuit layer 22, the light-emitting layer 25 and the anode 26 are located in the display area 12, the cathode layer 21 is located on the side of the light-emitting layer 25 facing away from the driving circuit layer 22, and the encapsulation layer 24 is located on the side of the cathode layer 21 facing away from the light-emitting layer 25. The cathode layer 21 includes a first through-hole 211 and a display portion 212. The display portion 212 is adjacent to the first through-hole 211. The first through-hole 211 is located in the opening area 11 and penetrates the cathode layer 21. The display portion 212 is located in the display area 12.

[0060] The above describes two display panels provided by embodiments of the present invention. The following describes the preparation methods of these two display panels.

[0061] This invention also provides a method for manufacturing a display panel. This method for manufacturing a display panel is used to prepare... Figure 2 The display panel shown is as follows: Figure 6 As shown, the steps 601 to 604 are included:

[0062] In step 601, the display panel 1 is placed on the support frame 71, the cathode layer 21 faces the support frame 71, the edge of the display panel 1 contacts the support frame 71, and the opening is suspended.

[0063] In some embodiments, such as Figure 7As shown, the display panel 1 is placed on the support frame 71, the cathode layer 21 faces the support frame 71, the edge of the display panel 1 contacts the support frame 71, and the opening is suspended.

[0064] In step 602, a laser 72 is used to irradiate the opening portion through the light-transmitting portion 222 along the direction from the substrate 23 to the cathode layer 21, causing the opening portion to be ashed, thereby obtaining the first through hole 211.

[0065] In some embodiments, such as Figure 7 As shown, a laser 72 is used to irradiate the opening portion through the light-transmitting part 222 along the direction from the substrate 23 to the cathode layer 21, causing the opening portion to be ashed, thus obtaining the first through hole 211.

[0066] In some embodiments, other drilling processes may be used to remove the opening portion to obtain the first through hole 211.

[0067] In some embodiments, the driving circuit layer 22 includes at least one metal layer, and the light-shielding portion 221 is located on at least one of the metal layers of the driving circuit layer 22. The absorption rate of the cathode layer 21 to the laser 72 is greater than the absorption rate of the light-shielding portion 221 to the laser 72, or the thickness of the light-shielding portion 221 is greater than the thickness of the cathode layer 21. The light-shielding portion 221 is used to block the laser 72. In this way, when the laser 72 irradiates the opening portion along the direction from the substrate 23 to the cathode layer 21, damage to the display portion 212 and other film layers in the driving circuit layer 22 due to laser irradiation can be avoided.

[0068] In some embodiments, when the laser 72 irradiates the opening portion along the direction from the substrate 23 to the cathode layer 21, the method further includes focusing the laser 72 onto the cathode layer 21 using a lens or lens group 73. This concentrates the energy of the laser 72 onto the opening portion as much as possible, thereby increasing the efficiency of the opening, while also minimizing the possibility of the laser 72 irradiating other parts of the display panel 1, thus preventing damage to other parts of the display panel 1 caused by the laser 72 irradiation.

[0069] In some embodiments, before removing the opening portion to obtain the first through hole 211, the light-transmitting portion 222 is removed to form a through hole penetrating the driving circuit layer 22.

[0070] In some other embodiments, the light-transmitting portion 222 includes a first sub-light-transmitting portion 2221 and a second sub-light-transmitting portion 2222. The first sub-light-transmitting portion 2221 is a second light-transmitting hole. The second light-transmitting hole is located on at least one of the metal layers of the driving circuit layer 22. The driving circuit layer 22 also includes an inorganic layer. The second sub-light-transmitting portion 2222 is located in the inorganic layer. The second sub-light-transmitting portion 2222 is located in the opening area 11. The first sub-light-transmitting portion 2221 is removed to form the second light-transmitting hole before the opening portion is removed, while the second sub-light-transmitting portion 2222 is retained.

[0071] In some embodiments, before removing the opening portion to obtain the first through hole 211, the portion of the substrate 23 located in the opening region 11 is removed to form a through hole penetrating the substrate 23.

[0072] In some embodiments, a transparent polyimide material is used as the substrate, so that the portion of the substrate 23 located in the opening region 11 does not need to be removed before the opening portion is removed to obtain the first through hole 211.

[0073] In some embodiments, before removing the opening to obtain the first through-hole 211, the method further includes: identifying alignment marks located on the substrate 23 by a charge-coupled device (CCD) on the drilling device, and automatically calibrating the drilling device to adjust its own position based on the alignment marks identified by the CCD. Thus, since the drilling device can automatically calibrate its own position based on the alignment marks, the drilling accuracy of the drilling device can be improved.

[0074] In step 603, a light extraction layer is formed on the side surface of the cathode layer 21 facing away from the substrate 23.

[0075] In step 604, an encapsulation layer 24 is formed on the side of the light extraction layer facing away from the cathode layer 21 to complete the encapsulation of the display panel.

[0076] In this embodiment, when the first through hole 211 is obtained by removing the opening portion, the dust generated is controlled to fall outside the surface of the display portion 212 on the side facing away from the substrate 23, so that the dust will not pierce the encapsulation layer during encapsulation.

[0077] In this embodiment, since the dust generated by removing the opening can fall along the direction of the cathode layer 21 toward the support frame 71, the dust generated can be prevented from falling on the side of the cathode layer 21 away from the substrate. This can prevent the dust falling on the side of the cathode layer 21 away from the substrate from piercing the encapsulation layer 24 during encapsulation, thereby improving the reliability of the display panel encapsulation.

[0078] This invention also provides another method for manufacturing a display panel. This method for manufacturing a display panel is used to prepare... Figure 5 The display panel shown is as follows: Figure 8 As shown, the steps 801-802 are included:

[0079] In step 801, a mask 91 is placed on the side of the cathode layer 21 facing away from the substrate 23. The mask 91 includes an opening 911, and the projection of the opening 911 on the substrate 23 is located in the opening area 11.

[0080] In some embodiments, such as Figure 9As shown, a mask 91 is placed on the side of the cathode layer 21 facing away from the substrate 23. The mask 91 includes an opening 911, and the projection of the opening 911 on the substrate 23 is located in the opening area 11.

[0081] In step 802, plasma 92 is used to remove the opening portion through the opening 911 to form the first through hole 211. During the removal of the opening portion, the dust 93 generated falls onto the surface of the mask 91 facing away from the substrate.

[0082] In this embodiment, due to the shielding of the mask 91, the dust 93 will fall on the surface of the mask 91 facing away from the substrate and will not fall on the surface of the cathode layer 21 facing away from the substrate 23. Therefore, the dust 93 falling on the side of the cathode layer 21 facing away from the substrate can be prevented from piercing the encapsulation layer during encapsulation.

[0083] In some embodiments, plasma 92 may be oxygen, hydrogen, or nitrous oxide gas, but is not limited thereto.

[0084] In some embodiments, when plasma 92 is used to remove the opening portion through opening 911, there is a gap between the mask 91 and the cathode layer 21. In this way, since the mask 91 does not directly contact the cathode layer 21, it can avoid scratching the cathode layer 21, thereby better protecting the cathode layer 21.

[0085] In some embodiments, when plasma 92 is used to remove the opening portion through opening 911, the mask 91 includes a metal layer and an insulating layer, with the insulating layer covering the metal layer. The insulating layer can be aluminum oxide, but is not limited to this. Thus, since the insulating layer of the mask 91 covers the metal layer, abnormal discharge phenomena caused by contact between the plasma 92 and the metal layer during plasma 92 removal of the opening portion can be avoided, improving the reliability and safety of the processing.

[0086] In some embodiments, the material of mask 91 is the same as the material of the mask used when preparing the encapsulation layer.

[0087] This invention also provides an electronic device. The electronic device includes a display module and the display panel described in any of the above embodiments.

[0088] In some embodiments, an imaging device may be disposed on the side of the substrate 23 opposite to the driving circuit layer 22, and the projection of the imaging device on the substrate 23 is located in the opening area 11.

[0089] It should be noted that the display panel in this embodiment can be the display panel of any product or component with display function, such as a mobile phone, tablet computer, or laptop computer.

[0090] The formation processes used in the above process may include, for example, film formation processes such as deposition and sputtering, and patterning processes such as etching.

[0091] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0092] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0093] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. The invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0094] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel includes an opening area and a display area, the opening area being adjacent to the display area. The display panel includes a cathode layer and a substrate, the cathode layer being located on the substrate. The cathode layer includes an opening portion and a display portion, the opening portion being located in the opening area, and the display portion being located in the display area. The method includes: The opening is removed to obtain a first through-hole, which penetrates the cathode layer. During the removal of the opening, the generated dust is controlled to fall onto the outer surface of the display unit on the side facing away from the substrate. Before removing the opening portion to obtain the first through hole, the process includes: The display panel is placed on the support frame, with the cathode layer facing the support frame, the edge of the display panel in contact with the support frame, and the opening portion suspended in the air; The process of removing the opening portion to obtain the first through hole includes: The first through-hole is obtained by removing the opening portion from the substrate in the direction pointing towards the cathode layer using a drilling process; during the removal of the opening portion, the generated dust falls off along the cathode layer in the direction pointing towards the support frame; or... A photomask is placed on the side of the cathode layer facing away from the substrate, the photomask including an opening, the projection of the opening onto the substrate being located in the aperture area; The process of removing the opening portion to obtain the first through hole includes: The opening is removed through the opening to form the first through hole; during the removal of the opening, dust generated falls onto the surface of the mask facing away from the substrate.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The display panel further includes a driving circuit layer, which is located between the substrate and the cathode layer; The driving circuit layer includes a light-shielding part and a light-transmitting part, the light-shielding part and the light-transmitting part are adjacent to each other, and the light-transmitting part is located in the opening area; The step of removing the opening portion from the substrate in the direction pointing towards the cathode layer using a drilling process to obtain the first through hole includes: A laser is used to irradiate the opening portion through the light-transmitting portion along the direction from the substrate to the cathode layer, causing the opening portion to be ashed, thereby obtaining the first through hole; The light-shielding part is used to block the laser.

3. The method for manufacturing a display panel according to claim 2, characterized in that, The driving circuit layer includes at least one metal layer; the light-shielding portion is located on at least one of the metal layers of the driving circuit layer.

4. The method for manufacturing a display panel according to claim 2, characterized in that, The absorption rate of the cathode layer to the laser is greater than the absorption rate of the light-shielding portion to the laser; or, the thickness of the light-shielding portion is greater than the thickness of the cathode layer.

5. The method for manufacturing a display panel according to claim 3, characterized in that, The light-transmitting part is a first light-transmitting hole; or... The light-transmitting portion includes a first sub-light-transmitting portion and a second sub-light-transmitting portion. The first sub-light-transmitting portion is a second light-transmitting hole, and the second light-transmitting hole is located on at least one of the metal layers of the driving circuit layer. The driving circuit layer also includes an inorganic layer, and the second sub-light-transmitting portion is located in the inorganic layer. The second sub-light-transmitting portion is located in the opening area, and the absorption rate of the laser by the second sub-light-transmitting portion is less than the absorption rate of the laser by the cathode layer.

6. The method for manufacturing a display panel according to claim 1, characterized in that, There is a gap between the mask and the cathode layer.

7. The method for manufacturing a display panel according to claim 6, characterized in that, The step of removing the opening portion through the opening to form the first through hole includes: The first through-hole is formed by bombarding the opening with plasma through the opening.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The photomask includes a metal layer and an insulating layer, wherein the insulating layer covers the metal layer.

9. A display panel, characterized in that, The display panel is prepared using the method described in any one of claims 1 to 5; the display panel includes an opening area and a display area, the opening area being adjacent to the display area; the display panel includes a substrate, a driving circuit layer, and a cathode layer, the driving circuit layer being located between the substrate and the cathode layer, the driving circuit layer including a light-shielding portion and a light-transmitting portion, the light-shielding portion being adjacent to the light-transmitting portion, the light-transmitting portion being located in the opening area, and the light-shielding portion being located outside the opening area for blocking laser light; the cathode layer includes a first through-hole and a display area, the display area being adjacent to the first through-hole, the first through-hole being located in the opening area, and the display area being located in the display area; or... The display panel is manufactured using the method for manufacturing a display panel according to any one of claims 1, 6 to 8; the display panel includes an opening area and a display area, the opening area being adjacent to the display area; the display panel includes a substrate, a driving circuit layer and a cathode layer, the driving circuit layer being located between the substrate and the cathode layer; the cathode layer includes a first through-hole and a display portion, the display portion being adjacent to the first through-hole, the first through-hole being located in the opening area, and the display portion being located in the display area.

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