Diagnostic disc with high vacuum and temperature resistant power supply

Abstract

A diagnostic disc includes a disc-shaped body having a raised wall encircling an interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised wall of the disc-shaped body bounds a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within a cavity formed on the disc-shaped body. A vacuum and high temperature resistant power source and a wireless charger and circuitry are disposed on the PCB, the circuitry coupled to each non-contact sensor and including at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

Description

Technical Field

[0001] Some embodiments of this disclosure generally relate to diagnostic disks having at least one embedded non-contact sensor, which allow in-situ measurements within a vacuum process chamber and wireless communication with a remote host. Some embodiments of this disclosure generally relate to power sources that are vacuum- and high-temperature resistant and can be used in the diagnostic disks described herein. Existing technology

[0002] Semiconductor substrates are typically processed in vacuum processing systems. These systems include one or more processing chambers, each performing substrate processing operations such as etching, chemical vapor deposition, or physical vapor deposition, and may include heating or cooling the substrate and plasma to aid the process. Such processing conditions (such as thermal cycling and corrosive plasma) can etch or erode exposed portions of chamber components within the processing chamber. Etched or corroded chamber components are periodically maintained (e.g., cleaned or replaced) before these components cause inconsistent or undesirable process results, after several process cycles (e.g., several hours of process time, referred to as radio frequency (RF) hours), and before particulate contamination from component corrosion within the chamber leads to particulate defects on the substrate. Conventionally, to determine whether to begin maintenance of certain chamber components, the processing chamber is vented and opened to provide access to various chamber components. This venting and disassembly is not only labor-intensive but also results in several hours of lost productivity for the substrate processing equipment during the procedure. Furthermore, exposure of the interior of the processing chamber can cause internal contamination and thus necessitate a lengthy requalification process for the processing chamber after it has been opened. Summary of the Invention

[0003] Some embodiments described herein relate to a diagnostic disc, comprising: a disc-shaped body; at least one protrusion extending outwardly from the disc-shaped body; a non-contact sensor attached to each of the at least one protrusion; and a cover. In some embodiments, the disc-shaped body includes a raised wall surrounding the interior of the disc-shaped body, wherein the raised wall of the disc-shaped body defines a cavity in the disc-shaped body. In some embodiments, the diagnostic disc further includes a printed circuit board (PCB) positioned within the cavity on the disc-shaped body; a circuit system disposed on the PCB and coupled to each non-contact sensor; a power source disposed on the PCB; and a wireless charger disposed on the PCB. In some embodiments, the circuit system disposed on the PCB includes at least wireless communication circuitry and memory. In some embodiments, the cover of the diagnostic disc is positioned over the cavity of the disc-shaped body, wherein the cover shields at least a portion of the PCB, the circuit system, the power source, and the wireless charger within the cavity from the external environment.

[0004] Some embodiments described herein relate to a method of operating a diagnostic disc. In some embodiments, the method includes establishing a secure wireless connection with a computing system via the diagnostic disc using a wireless communication circuit of the diagnostic disc before or after placing the diagnostic disc into a processing chamber. In some embodiments, the method further includes generating sensor data of a component disposed within the processing chamber via at least one non-contact sensor of the diagnostic disc. In some embodiments, the method further includes storing the sensor data in a memory of the diagnostic disc. In some embodiments, the method further includes wirelessly transmitting the sensor data to the computing system using the wireless communication circuit. In some embodiments, the method further includes terminating the secure wireless connection with the computing system. In some embodiments, the method further includes clearing the sensor data from the memory of the diagnostic disc.

[0005] Some embodiments described herein relate to a method of operating a computing system that wirelessly communicates with a diagnostic disk. In some embodiments, the method includes establishing a wireless connection with the diagnostic disk via the computing system. In some embodiments, the method further includes placing the diagnostic disk into a processing chamber using a robotic arm within a transfer chamber. In some embodiments, the method further includes causing the diagnostic disk to generate sensor data of components in the processing chamber using one or more non-contact sensors of the diagnostic disk. In some embodiments, the method further includes receiving the sensor data from the diagnostic disk via the wireless connection via the computing system. In some embodiments, the method further includes analyzing the sensor data via the computing system to determine at least one of alignment, concentricity, cleanliness, or corrosion of the components. In some embodiments, the method further includes initiating automatic alignment or concentricity correction of the components in response to determining that the alignment or concentricity is off; initiating automatic cleaning of the components in response to determining that the cleanliness has reached a contamination threshold; or initiating automatic replacement of the components in response to determining that the corrosion has reached a lifespan end threshold.

[0006] Some embodiments described herein relate to a power unit comprising: a printed circuit board (PCB); a power source coupled to the PCB; and a housing that at least encapsulates the power source. In some embodiments, the PCB includes a power management circuitry disposed on the PCB. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power unit is configured to operate in a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C without cracking or exploding.

[0007] Some embodiments described herein relate to a diagnostic disk comprising: a disk-shaped body; a printed circuit board (PCB); a power source coupled to the PCB; a housing that at least encapsulates the power source; and a cover positioned above the PCB and the power source. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power source can operate in a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C without cracking or exploding. In some embodiments, the cover shields the PCB and the power source within the interior formed by the disk-shaped body and the cover from the environment outside the disk-shaped body.

[0008] Some embodiments described herein relate to a method of operating a diagnostic disk. In some embodiments, the method includes establishing a secure wireless connection with a computing system via the diagnostic disk using a wireless communication circuit of the diagnostic disk before or after placing the diagnostic disk into a processing chamber. In some embodiments, the method further includes generating sensor data of a component disposed within the processing chamber via at least one non-contact sensor of the diagnostic disk under a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C. In some embodiments, the method further includes wirelessly transmitting the sensor data to the computing system using the wireless communication circuit. In some embodiments, the diagnostic disk includes: a disk-shaped body; a printed circuit board (PCB); a power source coupled to the PCB; a housing encapsulating at least the power source; and a cover positioned above the PCB and the power source. In some embodiments, the power source has a height of up to about 6 mm. In some embodiments, the power source can operate under a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about -20°C to about 120°C without cracking or exploding. In some embodiments, the cover shields the PCB and the power source inside the interior formed by the disc-shaped body and the cover from the environment outside the disc-shaped body. Attached Figure Description

[0009] The invention is illustrated in the accompanying drawings by way of example and not limitation, wherein like reference numerals indicate like elements. It should be noted that different references to a “one” or “a” embodiment in this disclosure are not necessarily the same embodiment, and such references refer to at least one.

[0010] Figure 1A A simplified top view of an example processing system according to an embodiment of this disclosure is shown.

[0011] Figure 1B An embodiment according to this disclosure is shown. Figure 1A A schematic cross-sectional side view of the processing chamber.

[0012] Figure 2A A perspective view of an open diagnostic disk according to an embodiment of this disclosure is shown.

[0013] Figure 2A1 An enlarged view of a protrusion and a non-contact sensor attached thereto, according to an embodiment of the present disclosure, is shown.

[0014] Figure 2B A bottom view of a diagnostic panel according to an embodiment of this disclosure is shown.

[0015] Figure 2CA side cross-sectional view of a diagnostic disc according to some embodiments of the present disclosure is shown.

[0016] Figure 2D A perspective top view of a shielded diagnostic disc according to an embodiment of the present disclosure is shown.

[0017] Figure 2E A side cross-sectional view of motion coupling in a diagnostic disk for engaging an electrostatic chuck (ESC) wafer lifting rod according to an embodiment of the present disclosure is shown.

[0018] Figure 2F The diagram illustrates a diagnostic disc positioned downwards on the ESC, a chip lift lever, and a low-contact area between the motion coupling and the ESC, according to one embodiment of the present disclosure.

[0019] Figure 2G A schematic diagram depicting the positions of four non-contact sensors on a diagnostic panel according to an embodiment of the present disclosure is shown.

[0020] Figure 3A A top view of a power source according to an embodiment of this disclosure is shown.

[0021] Figure 3B A perspective top view of a power source according to an embodiment of the present disclosure is shown.

[0022] Figure 4 This is a flowchart illustrating the operation method of a diagnostic disk according to an embodiment of the present disclosure.

[0023] Figure 5 This is a flowchart of an operation method of a computing system according to an embodiment of the present disclosure.

[0024] Figure 6A A side cross-sectional view of a diagnostic disk positioned on a wafer lifting rod of an electrostatic chuck (ESC) in a processing chamber, according to an exemplary embodiment of the present disclosure, is shown.

[0025] Figure 6B This is an exemplary embodiment based on the present disclosure. Figure 6A An exploded view of a portion of the diagnostic disc, where a high-resolution camera captures sensor data from the edges and support rings.

[0026] Figure 6C This is an example based on the content of this disclosure. Figure 6A An exploded view of a portion of the diagnostic disc, where non-contact sensors capture sensor data from the edges and support rings.

[0027] Figure 7AA top plan view of one of the non-contact sensors disclosed herein is shown, surrounding the edge ring and support ring of an electrostatic chuck, according to an embodiment of the present disclosure.

[0028] Figure 7B A perspective view is shown of a diagnostic disc having a plurality of non-contact sensors positioned thereon, and a line of sight from the non-contact sensors to a chamber component below, according to an embodiment of the present disclosure.

[0029] Figure 8 This is an example computing device that can serve as a controller for operating an electronic device processing system, according to embodiments of the present disclosure. Detailed Implementation

[0030] Embodiments of this disclosure provide diagnostic disks and methods for performing in-situ diagnostic scanning of components within a processing chamber without venting the processing chamber or opening its cover. Such embodiments benefit from in-situ diagnostic methods to determine what maintenance (if any) should be performed on the components scanned within the processing chamber. This in-situ diagnostics provides improved process results without interrupting the substrate processing system or the processing chamber's handling and / or disassembly. This process saves valuable time and avoids downtime for the substrate processing system. Furthermore, the embodiments prevent the interior of the processing chamber from being exposed to the atmosphere or the external environment, thus mitigating contamination of the processing chamber.

[0031] In-situ diagnostic scanning generates sensor data about various components within the processing chamber using non-contact sensors (e.g., cameras, position sensors, etc.) on a diagnostic panel. The sensor data can be wirelessly transmitted to a computing system using the diagnostic panel, which analyzes the data and determines subsequent actions. For example, the generated sensor data can provide information about the components, such as: placement (alignment and / or concentricity and / or gap measurement), cleanliness, corrosion, metrological data, component damage, and component jamming. Based on this sensor data, the computing system can initiate automatic component placement correction, automatic component cleaning, and automatic component replacement.

[0032] The term "in situ" here means "in place," meaning that the processing chamber remains intact and does not need to be disassembled or exposed to the atmosphere in order to perform the disclosed diagnostic scans. In situ diagnostic scans can be performed between substrate processing steps.

[0033] The ability to perform in-situ diagnostic scans and, in some cases, in-situ follow-up maintenance improves the yield of processed wafers and tool time utilization in customer manufacturing facilities (fabs). Furthermore, in-situ diagnostics can track the condition of various components within the processing chamber and initiate appropriate maintenance for components at the right time based on empirical data rather than guesswork.

[0034] In some embodiments, the diagnostic disk described herein may be able to communicate with a designated computing system. In embodiments, the diagnostic disk establishes a secure wireless connection with the designated computing system using wireless communication circuitry within the diagnostic disk, uses non-contact sensors on the diagnostic disk to generate sensor data for components located within the processing chamber, optionally stores the sensor data in the diagnostic disk's memory, wirelessly transmits the sensor data to the designated computing system using the wireless communication circuitry, terminates the secure wireless connection with the designated computing system, and clears the sensor data from the diagnostic disk's memory. In some embodiments, the diagnostic disk includes a security feature according to which, after a secure wireless connection with the designated computing system has been established and after the secure wireless connection has been terminated, the diagnostic disk can be operated by receiving software from the designated computing system. The diagnostic disk can erase itself (i.e., the sensor data and the software received from the designated computing system, if applicable) so that the sensor data generated by the diagnostic disk cannot be retrieved. If the diagnostic disk receives software from the designated computing system, this software is responsive to commands from its designated computing system.

[0035] The diagnostic disc described herein may include a disc-shaped body comprising a raised wall surrounding the interior of the disc-shaped body, wherein the raised wall defines a cavity in the disc-shaped body. At least one protrusion may extend generally horizontally from the disc-shaped body. At least one non-contact sensor may be attached to each of the at least one protrusion. The diagnostic disc may further include built-in illumination. The cavity of the disc-shaped body may include a printed circuit board (PCB) having at least a power source, a wireless charger, and a circuit system disposed thereon.

[0036] The power source within the disk-shaped body is designed to withstand vacuum and / or high temperatures, ensuring it will not deform, crack, or explode upon exposure. The power source itself, or together with the PCB, can be further encapsulated in a hermetically sealed housing to minimize outgassing and / or prevent contamination of the process chamber. In the event of a power source failure and cracking under vacuum and / or high temperatures, the structural materials of the power source may remain contained within the housing rather than contaminating the process chamber or diagnostic disk. The power source may also be free of heavy metals (such as lithium), allowing for easy cleaning of the power source's structural materials from the process chamber or diagnostic disk even if the power source fails and cracks under vacuum and / or high temperatures, thereby contaminating the diagnostic disk and / or process chamber.

[0037] The power source can be placed within the cavity formed by the disc-shaped body and the cover of the diagnostic disc described herein, thereby separating the power source from the high-vacuum, high-temperature, and corrosive environment in which the diagnostic disc can operate. Containing the power source within the internal cavity of the diagnostic disc and further encapsulating it within a housing (e.g., a semi-rigid insulator) advantageously controls the outflow or leakage of electrolytes or other materials from the power source structure into the surrounding environment (minimizing potential stress by contaminating devices approaching the power source).

[0038] In some embodiments, the power source may include multiple capacitors arranged in parallel, series, or combinations thereof. Therefore, the power source can be scalable and designed to achieve target properties such as output voltage, energy density, runtime, charge-to-run time ratio, internal series resistivity, dimensions (e.g., width, length, and height), weight, operating parameters (e.g., temperature and pressure), capacitance, charging current, discharging current, discharging voltage, leakage current, minimum stored energy, etc. In some embodiments, the power source may be wirelessly charged or wired. In some embodiments, the power source may have a charge-to-run time ratio of approximately 1:2 to approximately 3:2 to charge sufficiently quickly while also providing sufficient power to any diagnostic panel described herein for a duration of approximately 15 minutes to approximately 60 minutes during its operation. The charge-to-run time ratio should not be construed as limiting. In some embodiments, the charging time to running time ratio may range from any of about 1:100, about 1:75, about 1:50, about 1:25, about 1:10, about 1:10, about 1:5, or about 1:1 to any of about 5:1, about 10:1, about 15:1, about 25:1, about 50:1, about 75:1, or about 100:1, or any subrange or a single value thereof.

[0039] In this embodiment, the power source is non-toxic, travel-on-air, durable to provide a long life cycle, and / or removable for easy maintenance and / or replacement.

[0040] The size and mass of the diagnostic tray described herein are similar to those of the wafers processed in the wafer processing system, allowing the diagnostic tray to be transported through the wafer processing system in the same manner as the wafers are transported through it. The materials of the diagnostic tray's structure and the coatings disposed thereon are designed to withstand the vacuum and / or high temperature and / or corrosive environment of the processing chamber.

[0041] At least one protrusion and at least one non-contact sensor on the diagnostic tray described herein can be positioned in a location that allows the diagnostic tray to be picked up and transported via a wafer processing system using existing robots (e.g., existing factory interface robots and existing transfer chamber robots). Another consideration for the positioning of the protrusion and at least one non-contact sensor is to provide a clear line of sight from at least one non-contact sensor to at least a portion of the scanned component.

[0042] Figure 1A A simplified top view of an example processing system 100 according to an embodiment of this disclosure is shown. The processing system 100 includes a fab interface 91 to which multiple substrate cassettes 102 (e.g., front-opening standard bays (FOUPs) and side-storage bays (SSPs)) are coupled for transferring substrates (e.g., wafers, such as silicon wafers) into the processing system 100. In an embodiment, in addition to wafers, the substrate cassettes 102 include a diagnostic disk 110. The diagnostic disk 110 can be used to generate data (such as, but not limited to, alignment, concentricity, etching, cleanliness, metering data, whether a component is damaged or stuck, etc.) regarding various components within one or more processing chambers 107. In one embodiment, the diagnostic disk 110 can be used to generate data related to the placement or maintenance of a process kit ring (not shown). The fab interface 91 can also use the same functions explained for transferring wafers to transfer the diagnostic disk 110 into and out of the processing system 100. Similarly, the fab interface 91 can use the same functions for transferring wafers to transfer certain replacement components (e.g., process kit rings) into and out of the processing system 100.

[0043] The processing system 100 may also include first vacuum ports 103a, 103b that couple the factory interface 91 to individual stations 104a, 104b, which may be, for example, degassing chambers and / or loading locks. Second vacuum ports 105a, 105b may be coupled to individual stations 104a, 104b and are disposed between stations 104a, 104b and transfer chamber 106 to facilitate substrate transfer into transfer chamber 106. Transfer chamber 106 includes a plurality of processing chambers 107 (also referred to as process chambers) disposed around and coupled to transfer chamber 106. Processing chambers 107 are coupled to transfer chamber 106 via individual ports 108 (such as slit valves).

[0044] Processing chamber 107 may include one or more of the following: etching chamber, deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), annealing chamber, etc. Processing chamber 107 may include components that occasionally undergo replacement, alignment and / or concentricity correction, maintenance, etc. Currently, certain actions within the processing chamber (e.g., replacing certain components, correcting the alignment and / or concentricity of certain components, assessing corrosion, or assessing cleanliness and initiating cleaning of the processing chamber) may involve an operator disassembling the processing chamber to facilitate said actions. Processing system 100 is configured to facilitate some of these actions without requiring the operator to disassemble processing chamber 107.

[0045] In various embodiments, factory interface 91 includes factory interface robot 111. Factory interface robot 111 may include a robotic arm and may be or include a selectively compliant component robotic arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, etc. Factory interface robot 111 may include an end effector at the end of the robotic arm. The end effector may be configured to pick up and handle specific objects, such as wafers. Alternatively, the end effector may be configured to handle objects, such as diagnostic discs. In some embodiments, the end effector may be configured to handle chamber components requiring maintenance or placement for calibration, such as process kit rings. Factory interface robot 111 may be configured to transfer objects between substrate cassette 102 (e.g., FOUP and / or SSP) and stations 104a, 104b.

[0046] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 may include a robotic arm with an end effector at its end. The end effector may be configured to handle specific objects, such as wafers and diagnostic discs. The transfer chamber robot 112 may be a SCARA robot, but in some embodiments may have fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0047] Controller 109 (also referred to herein as a “computing system” or “designated computing system”) controls various aspects of processing system 100 and may include or be coupled to wireless access point (WAP) device 129. WAP device 129 may include wireless technology and one or more antennas for communicating with diagnostic disk 110. Controller 109 may be and / or include a computing system such as a personal computer, server computer, programmable logic controller (PLC), microcontroller, etc. Controller 109 may include one or more processing devices, such as microprocessors, central processing units, etc. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of instruction sets. The processing device may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc.

[0048] Although not shown, controller 109 may include data storage devices (e.g., one or more disk drives and / or solid-state drives), primary memory, static memory, network interface, and / or other components. Controller 109 may execute instructions to perform any one or more methods and / or embodiments described herein, including image or sensor data processing and analysis, image processing algorithms, machine learning (ML) algorithms that generate one or more trained machine learning models, deep ML algorithms, and other imaging algorithms for analyzing sensor data to detect, for example, alignment, concentricity, corrosion, cleanliness, whether components within processing chamber 107 are stuck or damaged, etc. Instructions may be stored on a computer-readable storage medium, which may include primary memory, static memory, secondary storage, and / or processing means (during instruction execution). In some embodiments, training data for training ML models may be obtained by imaging components that have undergone some type of maintenance (position correction, replacement, cleaning, etc.) using a scanning device or other type of sensor or camera.

[0049] Figure 1B An embodiment according to this disclosure is shown. Figure 1A A schematic cross-sectional side view of the processing chamber 107. The processing chamber 107 includes a chamber body 101 that together defines an internal volume 130 and a cover 133 disposed thereon. The chamber body 101 is typically coupled to an electrical ground 137. A substrate support assembly 180 is disposed within the internal volume to support a substrate thereon during processing. The process chamber 107 also includes an inductively coupled plasma device 142 for generating plasma 132 within the process chamber 107, and an example controller 155 suitable for controlling the process chamber 107.

[0050] The substrate support assembly 180 includes one or more electrodes 153 coupled to a bias source 119 via a matching network 127 to facilitate biasing of the substrate during processing. The bias source 119 may be illustratively a source of RF energy up to about 1000W (but not limited to about 1000W) at a frequency of, for example, about 13.56MHz, but may provide other frequencies and power as required by a particular application. The bias source 119 may be able to generate either continuous or pulsed power, or both. In some examples, the bias source 119 may be a DC or pulsed DC source. In some examples, the bias source 119 may be able to provide multiple frequencies. One or more electrodes 153 may be coupled to an adsorption power source 160 to facilitate adsorption of the substrate during processing.

[0051] An inductively coupled plasma (ICP) device 142 is disposed above a cover 133 and configured to inductively couple RF power into a process chamber 107 to generate plasma within the process chamber 107. The ICP device 142 includes a first coil 116 and a second coil 118 disposed above the cover 133. The relative position, diameter ratio, and / or number of turns in each coil 116, 118 can be adjusted as needed to control the profile or density of the formed plasma. Each of the first coil 116 and the second coil 118 is coupled to an RF power supply 138 via an RF feed structure 136 and a matching network 114. The RF power supply 138 is illustratively capable of generating up to approximately 4000 W (but not limited to approximately 4000 W) at tunable frequencies ranging from 50 kHz to 13.56 MHz, but other frequencies and powers may be used as required by a specific application.

[0052] In some examples, a power divider 135 (such as a split capacitor) may be provided between the RF feed structure 136 and the RF power supply 138 to control the relative amount of RF power supplied to the individual first and second coils. In some examples, the power divider 135 may be incorporated into the matching network 114.

[0053] Heater element 113 may be disposed on top of cover 133 to facilitate heating of the interior of process chamber 107. Heater element 113 may be disposed between cover 133 and first and second coils 116, 118. In some examples, heater element 113 may include a resistance heating element and may be coupled to power source 115, such as AC power, which is configured to provide sufficient energy to control the temperature of heater element 113 within a desired range.

[0054] During operation, a substrate (such as a semiconductor wafer or other substrate suitable for plasma processing) is placed on a substrate support assembly 180, and process gas is supplied from a gas panel 120 via an inlet port 121 into the internal volume of the chamber body 101. The process gas is ignited into plasma 132 in the process chamber 107 by applying power from an RF power source 138 to first and second coils 116, 118. In some examples, power from a bias source 119 (such as an RF or DC source) may also be supplied to electrodes 153 within the substrate support assembly 180 via a matching network 127. The pressure inside the process chamber 107 can be controlled using a valve 129 and a vacuum pump 122. The temperature of the chamber body 101 can be controlled using a liquid-containing conduit (not shown) running through the chamber body 101.

[0055] Process chamber 107 includes a controller 155 to control the operation of process chamber 107 during processing. Controller 155 includes a central processing unit (CPU) 123, memory 124, and support circuitry 125 for CPU 123 and components facilitating the control of process chamber 107. Controller 155 may be one of any type of general-purpose computer processor suitable for industrial environments for controlling various chambers and subprocessors. Memory 124 stores software (source code or object code) that can be executed or invoked to control the operation of process chamber 107 in the manner described herein.

[0056] The diagnostic panel, described in more detail below, can generate sensor data for various components within the processing chamber 107, such as, but not limited to, the substrate support assembly 180, electrostatic chuck 150, rings (e.g., process kit rings or single rings), chamber walls, substrate, gas distribution plate, nozzles, gas lines, gas inlet port 121, nozzles, chamber cover 133, gaskets, gasket kits, shielding, plasma screen, plasma generation unit 142, RF feed structure 136, electrodes 153, diffusers, flow equalizers, cooling substrate, chamber observation port, etc. Some exemplary sensor data for these components may include, but are not limited to, alignment, concentricity, corrosion, cleanliness, measurement data, whether a component is damaged or stuck, and whether component maintenance is due.

[0057] Figure 2A A perspective view of an open diagnostic disc 110 according to an embodiment of the present disclosure is shown. The diagnostic disc 110 may include a disc-shaped body 210 having a raised wall 202 surrounding the interior of the disc-shaped body 210 and at least one protrusion extending outward from the disc-shaped body 210. In an embodiment, the raised wall 202 may extend to at least one protrusion. Each of the protrusions extends horizontally or substantially horizontally from the disc-shaped body 210 and is positioned perpendicular or substantially perpendicular to the circumference of the disc-shaped body 210.

[0058] In some embodiments, there are four protrusions, such as a first protrusion 204A, a second protrusion 204B, a third protrusion 204C, and a fourth protrusion 204D. In the depicted embodiment, the four protrusions are spaced apart at a position that allows the end effector of the robotic arm of transfer robot 112 to pick up the diagnostic tray and place it in the processing chamber 107. Alternatively, the four protrusions can be positioned in a manner that maintains a clear line of sight between the non-contact sensor attached to each protrusion and the component being diagnosed when the diagnostic tray is held by the end effector or when the diagnostic tray is placed on top of the wafer lifting rod. Figures 2E to 2F neutralization Figure 7B (As depicted in the text).

[0059] In various embodiments, the diagnostic disk 110 includes more or fewer protrusions. In alternative embodiments, the diagnostic disk 110 has no protrusions and is shaped as a solid disk similar to a wafer. In some embodiments, one or more protrusions project outward from the periphery of the disk-shaped body 210 (e.g., as shown in the image). Figure 2B (As shown in the bottom view depicting the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D). In some embodiments, one or more of the protrusions do not project outward from the periphery of the disc-shaped body 210 and are flush with the periphery of the disc-shaped body 210 (e.g., as shown in the bottom view depicting the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D). Figure 2B As shown in the bottom view depicting the first protrusion 204A.

[0060] In some embodiments, the raised wall 202 of the disc-shaped body 210 defines a cavity 208 of the disc-shaped body. In embodiments, the diagnostic disc 110 further includes a printed circuit board (PCB) 203 disposed within the cavity 208 formed by the raised wall 202. Multiple components, such as a circuit system 205, a power source 207, and a wireless charger 209 (e.g., a Qi charger), may be disposed on the PCB 203 and / or within the cavity 208. The circuit system 205 may include multiple components, such as, for example, wireless communication circuitry and memory. The circuit system 205 may be coupled to at least one non-contact sensor 230 (e.g., a wireless communication circuit) attached to each of at least one protrusion of the disc-shaped body 210. Figure 2B (As shown in the diagram). In some embodiments, one or more of these components may not be located inside cavity 208, but may be outside the diagnostic panel and may be coupled to the diagnostic panel(s) via wires.

[0061] Power source 207 may include a battery (such as a lithium-ion polymer battery) or an alternative power source (such as a supercapacitor-type power source, as described below). Figures 3A to 3B (Further detailed description).

[0062] In some embodiments, the diagnostic disc 110 may further include a cover positioned over the cavity 208 of the disc-shaped body 210. The cover 220 may shield at least a portion of the PCB 203 and certain components within the cavity 208 from the external environment. In some embodiments, the cover 220 may shield at least a portion of the PCB 203, circuitry 205, power source 207, and wireless charger 209 within the cavity 208 from the external environment. The cover may be designed with various pockets to create gaps between components on the PCB 203. For example, the cover may include cutouts for placement of the wireless charger 209, for placement of the circuitry 205, for placement of the power source 207, and optionally for additional cavities for future circuitry modifications. In some embodiments, the cover 220 may be used to vacuum-seal the PCB 203, circuitry 205, power source 207, and wireless charger 209 within the cavity 208 to isolate them from the external environment.

[0063] Figure 2B A bottom view of a diagnostic disc according to an embodiment of the present disclosure is shown. In various embodiments, a non-contact sensor is attached to each of at least one of the protrusions. For example, the diagnostic disc 110 may further include a plurality of non-contact sensors, such as a first non-contact sensor 230A, a second non-contact sensor 230B, a third non-contact sensor 230C, and a fourth non-contact sensor 230D, respectively attached to four protrusions 204A, 204B, 204C, and 204D. In some embodiments, each non-contact sensor may be attached to the underside of its respective protrusion, such as... Figure 2B As depicted in the text.

[0064] The non-contact sensor can be attached to each of the at least one protrusion via any suitable attachment mechanism, such as, but not limited to, via epoxy resin, via a spiral coil, etc. In some embodiments, the non-contact sensor is attached to each of the at least one protrusion via an attachment mechanism that allows for easy maintenance (e.g., easy removal and replacement after the non-contact sensor fails). In some embodiments, the non-contact sensor and / or the attachment mechanism coupled thereto may have a width that allows it to be supported by a portion of the raised wall 202. For example, Figure 2A1 An enlarged view of the protrusion 204D is shown. Figure 2A1 In the cavity 208, a portion of the raised wall 202 extending from the circumference of the cavity 208 toward the protrusion 204D supports the non-contact sensor 230D and / or the attachment mechanism coupled to the non-contact sensor 230D via support tabs 206A and 206B.

[0065] In embodiments without protrusions, each non-contact sensor may be attached to the underside of the periphery of the diagnostic disc 110. In some embodiments, each non-contact sensor may be attached to other sides of the diagnostic disc, such as, but not limited to, the upper side of each protrusion (e.g., on the cover 220), the edge of the diagnostic disc 110 (e.g., on the cover 220 or on the periphery of the disc-shaped body 210), etc.

[0066] Each non-contact sensor can be oriented in a direction that allows it to generate sensor data for a component. For example, each non-contact sensor can be oriented over an edge ring, process ring, electrostatic chuck, etc., to generate sensor data for the alignment or concentricity of the edge ring or process ring (e.g., based on gap measurements between them or the gap between the electrostatic chuck and the process ring) or for the corrosion or cleanliness of the edge ring or process kit ring. In another example, each non-contact sensor can be oriented in a direction that allows it to generate sensor data for a processing chamber cover or nozzle. In some embodiments, the non-contact sensor can be oriented to form a clear line of sight toward certain chamber components. In alternative embodiments, the entire diagnostic disk can be oriented to form a clear line of sight toward certain chamber components. For example, the diagnostic disk can be inverted on a wafer lift rod so that a non-contact sensor attached to the underside of each protrusion has a clear line of sight toward the top side of the processing chamber (e.g., for diagnostic scanning of the nozzle or process chamber cover).

[0067] Each non-contact sensor may be coupled to circuitry 205, for example, via a connection on PCB 203. Each non-contact sensor may be configured to acquire sensor data (e.g., positioning, texture, and / or roughness information indicating alignment, concentricity, cleanliness, corrosion, etc.) of components used in any given processing chamber 107. Wireless communication circuitry may include or be coupled to an antenna to wirelessly transmit sensor data to controller 109. In some embodiments, sensor data is temporarily stored in the memory of a diagnostic disk, wirelessly transmitted to controller 109 using wireless communication circuitry, and the sensor data is cleared from the memory of the diagnostic disk once the secure wireless connection between the diagnostic disk and the controller is terminated.

[0068] In varying embodiments, the non-contact sensor is an image sensor, such as a camera zoom with at least four times magnification (e.g., 4X, 6X, 8X, or more). For example, the non-contact sensor may be or include a charge-coupled device (CCD) camera and / or a complementary metal-oxide (CMOS) camera or a high-resolution camera. Alternatively, the camera may have other zoom capabilities. In some embodiments, the non-contact sensor may be a position sensor. Alternatively, the non-contact sensor may be a miniature radar sensor capable of scanning the surface of a component. Furthermore, the non-contact sensor may include an x-ray emitter (e.g., an x-ray laser) and an x-ray detector. The non-contact sensor may alternatively be or include one or more pairs of laser emitters that generate laser beams and laser receivers that receive laser beams. Sensor measurements can be generated by a pair of laser emitters and laser receivers when the laser beams are reflected off the surface of the component. In some embodiments, the non-contact sensor may further include illumination capabilities integrated thereon or coupled to an illumination tool. In various embodiments, these sensor measurements may be converted into sensor data by circuitry 205 and / or controller 109.

[0069] In one embodiment, the non-contact sensor is a camera having a focusing range of about 25mm to about 45mm, about 30mm to about 40mm, about 33mm to about 37mm, or about 35mm. The camera may have a resolution of at least 3 megapixels, at least 4 megapixels, or at least 5 megapixels to enable the camera to focus on a component and obtain its sharp edges. The camera may have a field of view (FOV) of about 25mm to about 45mm, ranging from about 33000μm × about 24000μm to about 60000μm × about 45000μm. In some embodiments, a suitable camera may have autofocus operable via an autofocus algorithm. In some embodiments, a suitable camera does not have autofocus features to extend the lifespan of the power source (e.g., the operating time obtained from the power source). In some embodiments, the camera may have any combination of the features described in Table 1 below. Table 1 - Specifications of an exemplary camera for a diagnostic disc according to one embodiment brightness 0(50％) -64-64 Contrast 32(50％) 0-64 Saturation 64(50％) 0-128 tone 0(50％) -40-40 White balance temperature, automatic Yes (true) Yes | No (false) Gamma (grayscale coefficient) 100(6％) 72-500 Gain 0(0％) 0-100 Power line frequency 50Hz Off | 50Hz | 60Hz White balance temperature 4600(48％) 2800-6500 Sharpness 3 0-6 Backlight compensation 1 0-2 Exposure, automatic Aperture Priority Mode Manual mode | Aperture priority mode Exposure (absolute) 157(3％) 1-5000 Exposure, automatic priority yes Yes | No Focus (Absolute) 224(21％) 1-1023 Focus, Auto yes Yes | No

[0070] In a variation of the embodiment, the diagnostic disc 110 may further include at least one illumination component attached to each of at least one of the protrusions. For example, in Figure 2B In the embodiment depicted, lighting component 232B is attached to protrusion 204B, lighting component 232C is attached to protrusion 204C, and lighting component 232D is attached to protrusion 204D. Although Figure 2BIn the embodiments depicted, the non-contact sensor 230A does not have an illumination component; however, in some embodiments, the non-contact sensor 230A does have an illumination component. A circuit system 205 disposed on PCB 203 may couple to each of at least one illumination component (e.g., 232A, 232B, 232C). Each illumination component may be configured to illuminate at least a portion of the components used in any given processing chamber 107, such that each non-contact sensor can acquire sensor data of the illuminated portion of the component. Exemplary illumination components may include, but are not limited to, light-emitting diodes (LEDs).

[0071] Figure 2C Some aspects of this disclosure are shown along line "2A". Figure 2A A side cross-sectional view of the diagnostic disc 110. Figure 2D A perspective top view of a shielded diagnostic disc according to an embodiment of the present disclosure is shown.

[0072] For further reference Figure 2A The diameter (DIA) of the diagnostic disc 110 can be defined by two points on the outer periphery of the disc-shaped body 210, said two points being 180 degrees apart from each other. One of the points defining the diameter DIA can be the edge of at least one protrusion. For example, the diameter DIA of the disc-shaped body 210 (and the diagnostic disc 110) can extend from the edge of the first protrusion 204A to point 212 (which may be a notch) on the outer periphery of the disc-shaped body 210. Similarly, the diameter of the diagnostic disc can be from the edge of one of the second protrusion 204B, the third protrusion 204C, or the fourth protrusion 204D to a corresponding point on the periphery of the disc-shaped body 210 located 180 degrees from the corresponding edge of one of the protrusions. In some embodiments, the diameter range can be from about 310 mm to about 320 mm, or within 10 to 15% of about 310 mm to about 320 mm. The diameter should not be construed as limiting. In some embodiments, the diameter range may be from any one of about 310 mm, about 315 mm, about 320 mm, about 325 mm, about 330 mm, about 335 mm, about 340 mm, about 345 mm or about 350 mm to any one of about 355 mm, about 360 mm, about 365 mm, about 370 mm, about 375 mm, about 380 mm, about 385 mm, about 390 mm, about 395 mm or about 400 mm, or any subrange or single value thereof.

[0073] Furthermore, in some embodiments, each non-contact sensor may be positioned such that a gap is formed between the non-contact sensor and the bottom of the disc-shaped body 210. For example, each non-contact sensor may be positioned on the underside of a corresponding protrusion such that the vertical distance between the non-contact sensor and the bottom of the disc-shaped body 210 causes the non-contact sensor to be displaced from the surface on which the diagnostic disc is placed. The height (H) of the raised wall 202 may be defined as up to about 15 mm, up to about 14 mm, up to about 13 mm, up to about 12 mm, up to about 11 mm, up to about 10 mm, up to about 9 mm, up to about 8 mm, up to about 7 mm, or up to about 6 mm.

[0074] In varying embodiments, the disc-shaped body 210 and cover 220, including the raised wall 202, may be made of at least one of polyetheretherketone (PEEK), aluminum alloy, carbon fiber, or aluminum. In some embodiments, the disc-shaped body and / or cover is coated. In embodiments, the coating is configured to give the diagnostic disc 110 at least one of the following: vacuum resistance, high temperature resistance, scratch resistance, or a combination thereof. In one embodiment, the coating is reflective and / or transparent to counteract any infrared radiation that the diagnostic disc 110 may be exposed to. For example, in one embodiment, the coating is infrared transparent to allow the surface finish of the coating to reflect the infrared radiation that may be exposed. Reflecting infrared radiation without absorbing it (or minimizing its absorption) minimizes the heat transferred to the diagnostic disc. In some embodiments, the coating is highly polished. In some embodiments, the coating has a surface roughness finish ranging from about 2 μin to about 20 μin, from about 4 μin to about 16 μin, from about 6 μin to about 12 μin, or any subrange or single value thereof.

[0075] In some embodiments, the coating comprises a material operable at a temperature of at least 50°C while maintaining its integrity without peeling, in order to prevent the introduction of particulate contaminants into the processing chamber. The coating may be erosion-resistant and / or corrosion-resistant. Exemplary coating materials that can be used to coat the disc-shaped body 210 and the cover 220 include, but are not limited to, at least one of the following: anodized aluminum, aluminum alloy, or yttrium oxide.

[0076] In some embodiments, the diagnostic disk 110 further includes a plurality of motion coupling interfaces 235 disposed on the bottom surface of the disk-shaped body 210. The plurality of motion coupling interfaces 235 may be configured to interact with a substrate support assembly (such as...) in the processing chamber. Figure 1B The registration feature of the substrate support assembly 180 in the processing chamber 107 is engaged. The engagement of multiple motion coupling interfaces 235 with the registration feature enables the diagnostic disc 110 to achieve target position and target orientation in the processing chamber 107.

[0077] For example, multiple motion coupling interfaces 235 may be configured as angled holes or slots to receive (or engage) the wafer lifting rod of the electrostatic chuck (ESC) 150 located within the processing chamber 107. Figure 2F (253 in the middle). Figure 2E It shows Figure 2A A side cross-sectional view of an example of multiple motion couplings 235 in the diagnostic disk 110. Motion couplings are fixtures designed to accurately constrain parts (e.g., wafer lift rods) by providing positional precision and determinism. The multiple motion couplings 235 thus allow the diagnostic disk 110 to be centered above or below the part, such that the non-contact sensor is generally oriented in the direction of the part being imaged or scanned.

[0078] Figure 2F A diagnostic disk 110 is shown positioned downwards on an ESC 150 with a wafer lift lever 253 and multiple motion couplers 235 between the diagnostic disk 110 and the ESC 150, according to one embodiment of this disclosure. As shown, in one embodiment, the multiple motion couplers 235 provide a draft angle for easy lifting and lowering engagement via the lift lever 253. In various embodiments, the motion couplers are made of one of the following: copper, stainless steel, ring, vaspel, carbon fiber, rexolite, or polyetheretherketone (PEEK). Because the motion couplers 235 are not metallic and contact the surface of the ESC 150, the diagnostic disk 110 avoids scratching or damaging the ESC 150. The materials of the LCA 250 and the motion couplers 235 also help reduce particle generation and contamination.

[0079] In various embodiments, controller 109 (e.g., a computing system) may receive signals from factory interface robot 111, wafer transfer chamber robot 112, and / or each non-contact sensor and send control to factory interface robot 111, wafer transfer chamber robot 112, and / or each non-contact sensor. In this way, controller 109 may initiate diagnostics, where a component in, for example, one of the processing chambers 107 has been operating for a certain number of hours. Controller 109 may send a signal to factory interface robot 111 to pick up one of the diagnostic trays 110 from one of the substrate cassettes 102 and transfer the diagnostic tray 110 to, for example, station 104b, which may be a loading lock or degassing chamber. Thereafter, transfer chamber robot 112 may, for example, use the end effector of a robotic arm to pick up the diagnostic tray 110 and place it in processing chamber 107, where the diagnostic tray 110 can acquire sensor data of the component. For example, the sensor data can be wirelessly transmitted to the controller 109 via a wireless communication circuit through a WAP device 129.

[0080] Figure 2G A schematic diagram depicting the positions of four non-contact sensors on a diagnostic disc according to an embodiment of the present disclosure is shown. In the depicted embodiment, the disc body 210 includes a notch at a first position 221 on the circumference of the disc body. The first position 221 may be referred to as a 0° starting angle. The notch may be used in conjunction with a pre-aligner, allowing the diagnostic disc 110 to be placed at a selected location within the processing chamber 107 and / or to be picked up by the terminal effector.

[0081] In the depicted embodiment, a first non-contact sensor 230A may be attached to a first protrusion 204A, positioning the first protrusion 204A at an angle of approximately 170° to 180° with respect to a first position of the notch. In the depicted embodiment, a second non-contact sensor 230B may be attached to a second protrusion 204B, positioning the second protrusion 204B at an angle of approximately 225° to 235° with respect to the first position of the notch. In the depicted embodiment, a third non-contact sensor 230C may be attached to a third protrusion 204C, positioning the third protrusion 204C at an angle of approximately 295° to 305° with respect to the first position of the notch. In the depicted embodiment, a fourth non-contact sensor 230D may be attached to a fourth protrusion 204D, positioning the fourth protrusion 204D at an angle of approximately 55° to 65° with respect to the first position of the notch.

[0082] The first non-contact sensor 230A can be attached to the first protrusion 204A at a distance of approximately 295 mm to approximately 305 mm from the outer periphery of the disc-shaped body 210. The second non-contact sensors 230B, the third non-contact sensor 230C, and the fourth non-contact sensor 230D, which are respectively attached to the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D, can be positioned at a distance of approximately 310 mm to approximately 320 mm from the outer periphery of the disc-shaped body 210.

[0083] The positions of the second protrusion 204B, the third protrusion 204C, and the fourth protrusion 204D, and the corresponding positions of the second non-contact sensor 230B, the third non-contact sensor 230C, and the fourth non-contact sensor 230D (as per relevant information) Figure 2G The above should not be construed as limiting, as their positions can vary depending on the processing chamber used, the main frame robot used, the transfer chamber robot used, the robot's end effector, etc. At least one protrusion and a non-contact sensor attached thereto may be arranged at other angles or in other locations, provided that the non-contact sensor has a gap (e.g., through the end effector) to view the component or area within the processing chamber being diagnosed.

[0084] exist Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2G and Figure 7B In the embodiment depicted, the first non-contact sensor 230A (e.g., the first camera) is positioned such that the first non-contact sensor 230A is in the flat area 222 (also in... Figure 7A The edge of the center (800) and the starting point of the circular edge of ESC 150 are centered. The second non-contact sensor 230B (e.g., a second camera), the third non-contact sensor 230C (e.g., a third camera), and the fourth non-contact sensor 230D (e.g., a fourth camera) in the depicted embodiment are positioned to observe the ring segments of the process kit (e.g., edge ring 90 and support ring 390). According to the following related... Figures 7A to 7B In a further detailed description of the embodiments, the positioning of the non-contact sensors 230A, 230B, 230C, and 230D in the depicted embodiments allows for the measurement of the gap between the ESC 150 and the process kit ring to determine the alignment and concentricity of the process kit ring.

[0085] In an embodiment, the same robot can be used to move the diagnostic disk 110 within the wafer processing system in the same manner as the wafer. Therefore, the diagnostic disk may have certain properties that enable it to move through wafer processing, such as certain target dimensions (e.g., height and width), target weight, target center of mass, etc. Height and width may have the properties described above relating to... Figure 2C The dimensions of DIA and H. In some embodiments, the mass of the diagnostic disk 110 may range from about 500g to about 700g, from about 530g to about 650g, or from about 550g to about 600g. In some embodiments, the center of mass of the diagnostic disk 110 may be about 0.05 to about 0.15, about -0.15 to about 0.0, or about 0.0 to about 0.15 (X, Y, Z) from the center of diameter. In some embodiments, the center of mass of the diagnostic disk 110 may be about 0.10 to about 0.13, about -0.10 to about -0.05, or about 0.05 to about 0.10 (X, Y, Z) from the center of diameter.

[0086] Various components within the internal cavity 208 of the diagnostic panel 110 (such as at least the PCB 203, circuitry 205, and wireless charger 209) may be made of a glass-reinforced epoxy laminate (e.g., FR-4) and copper. In some embodiments, the weight of the PCB 203 may range from about 40g to about 70g, from about 45g to about 65g, or from about 50g to about 60g. In some embodiments, the weight of the wireless charger 209 may range from about 5g to about 20g, from about 8g to about 17g, or from about 10g to about 15g. In some embodiments, the weight of the circuitry 205 may range from about 10g to about 20g, from about 12g to about 18g, or from about 14g to about 16g.

[0087] Any of the diagnostic disks described herein can be transferred into a processing chamber (such as processing chamber 107) to generate sensor data in situ without venting the processing chamber. Therefore, diagnostic disk 110 can be exposed to high vacuum and / or high temperature and / or corrosive environments. Existing power sources (such as lithium batteries) may leak, expand, or even explode in vacuum and / or high temperature environments.

[0088] In embodiments, this disclosure is coupled to a power source in a PCB having a power management circuitry system disposed thereon to form a power unit. In embodiments, the power unit is configured to operate under high vacuum and high temperature without deformation (e.g., without bulging), cracking, or explosion. High vacuum may include pressures up to about 50 mTorr (e.g., from about 0.1 mTorr to about 50 mTorr, from about 15 mTorr to about 50 mTorr, or from about 30 mTorr to about 50 mTorr). High temperature may include temperatures from about 50°C to about 120°C, from about 65°C to about 120°C, from about 80°C to about 120°C, from about 50°C to about 80°C, or from about 65°C to about 80°C. In some embodiments, the power source may operate at temperatures ranging from about -20°C to about 120°C, from about 0°C to about 120°C, from about 20°C to about 120°C, from about 50°C to about 85°C, or any single value or subrange thereof.

[0089] Figure 3A A top view of a power unit that can be used in a diagnostic panel 110 according to an embodiment of this disclosure is shown. The power unit 300 includes a PCB 203 and a supercapacitor 310 (e.g., in...). Figure 3A (Combinations of 310A, 310B, and 310C in the embodiments depicted), the supercapacitor 310 includes a plurality of capacitors connected in parallel and series. Figure 3A In the embodiment depicted, three groups 310A, 310B and 310C of the six capacitors are connected in series and the three groups (310A, 310B and 310C) are connected in parallel. Figure 3A The arrangements depicted herein should not be construed as limiting. Those skilled in the art will understand that different numbers of capacitors can be arranged in various parallel, series, and combined configurations to achieve the target power properties.

[0090] In some embodiments, the supercapacitor 310 may be coupled to the PCB 203. Alternatively, the supercapacitor 310 may be an integral part of the PCB 203. For example, Figure 3B A perspective top view of a power unit according to another embodiment of this disclosure is shown, which can be used in the diagnostic panel 110 of a supercapacitor 320 as an integral part of a PCB 203. Figure 3B In the embodiments depicted, PCB 203 may be a two-layer PCB. Figure 3B The supercapacitor 320 formed on the two-layer PCB 203 of the embodiment depicted includes eight groups connected in parallel (four on each side of the PCB). Figure 3B The image shows only four groups (320A, 320B, 320C, 320D) on one side, and each group includes six capacitors connected in series.

[0091] In some embodiments, regardless of the arrangement of the supercapacitor (e.g., 310 or 320 or other arrangements not shown) and PCB 203, the power unit 300 may further include a hermetically sealed housing such that, in the event of a power source failure under high vacuum and / or high temperature conditions, the material of the power source remains sealed and does not contaminate the diagnostic panel 110 or the processing chamber 107. The housing for the power unit also provides vacuum protection and / or electrical isolation for the power unit.

[0092] exist Figure 3A In the embodiments depicted, the supercapacitor 310 is encapsulated in a hermetically sealed housing made of silicon. In some embodiments, the housing may be made of metal. The hermetically sealed housing may conformally encapsulate the power source or the entire power unit (e.g., at least the power source together with the PCB). A hermetically sealed structure can be formed over the power source or the entire power unit by placing the power source or power unit in a form (e.g., a mold) and flooding the form with a housing material (e.g., silicon). Other methods for hermetically sealing the power source or the entire power unit may also be suitably used.

[0093] exist Figure 3A In the embodiments depicted, multiple capacitors include sodium chloride. In some embodiments, sodium chloride is advantageously more stable than some materials currently used in power sources, such as lithium, under high vacuum and high temperature conditions. Lithium is a self-oxidizing agent and can ignite, generate its own oxygen, and explode under high temperature and high vacuum conditions. Lithium is also a heavy metal, and if lithium contaminates either the diagnostic panel or the processing chamber, it cannot be cleaned from either the diagnostic panel or the processing chamber. In contrast, if a supercapacitor containing sodium chloride fails and breaks under the high temperature and high vacuum conditions of the processing chamber, the sodium can be easily cleaned. In some embodiments, the power source does not contain heavy metals. In one embodiment, the power source does not contain lithium. In one embodiment, the power source does not contain copper.

[0094] In some embodiments, the power source may include lithium, provided that the power unit is configured to operate under high vacuum and high temperature without bursting or exploding and optionally without deformation.

[0095] In various embodiments, the power source may have a low profile, such as a height of up to about 6 mm, about 5.5 mm, or about 5 mm, so that the power source can be mounted within the interior formed by the disc-shaped body and the cover, shielded within the interior, and isolated from the environment outside the disc-shaped body. In one embodiment, the power source may have a width ranging from about 45 mm to about 50 mm, from about 46 mm to about 49 mm, or from about 47 mm to about 48 mm, and a length ranging from about 50 mm to about 200 mm, from about 65 mm to about 185 mm, or from about 80 mm to about 170 mm. In one embodiment, the weight of the power source may range from about 40 g to about 60 g, from about 45 g to about 55 g, or from about 48 g to about 52 g. In some embodiments, these dimensions refer to the supercapacitor itself without a PCB. In other embodiments, these dimensions refer to the supercapacitor with a PCB.

[0096] In some embodiments, a single series connection of a supercapacitor (e.g., each of six capacitors connected in series, such as...) Figure 3A and Figure 3B Individual 310A or 320A supercapacitors may have certain target attributes. For example, a single string of supercapacitors may have one or more of the following: output voltage of approximately 8.4V, capacitance of approximately 15F, height of approximately 2mm to approximately 3mm, width of approximately 12mm to approximately 16mm, length of approximately 70mm to approximately 75mm, mass of approximately 8g to approximately 10g, minimum stored energy of approximately 105W, operating temperature range of approximately -20°C to approximately 120°C, equivalent series resistance (ESR) of approximately 15 ohms, 24-hour leakage current of approximately 0.10 to approximately 0.15mA, maximum charging current of approximately 50mA, maximum discharging current of approximately 70mA, and minimum discharging voltage of approximately 4.8V.

[0097] In one embodiment, the power source may include keying features (such as mechanical features on a PCB or etched connectors with keys) to ensure that the power source is properly positioned.

[0098] In various embodiments, the power source can be charged using charging circuitry on the PCB, which limits the voltage at the top and bottom and protects the power source from overcharging or undercharging. The power source can be charged at atmospheric pressure and room temperature (e.g., about 20°C to about 30°C) or in a vacuum. In some embodiments, the power source can be wirelessly charged by placing a diagnostic pad next to a charging block or charging plate. In some embodiments, the diagnostic pad 110 may include a charging location identifier for wireless charging thereon. Alternatively, a USB cable can be used to charge the power source.

[0099] During a diagnostic scan, multiple diagnostic disks 110 are rotatable, such that while the power source of the first diagnostic disk is being charged, the second diagnostic disk performs a diagnostic scan. Subsequently, the two diagnostic disks can be interchanged, allowing the power source of the second diagnostic disk to be charged while the first diagnostic disk is performing a diagnostic scan.

[0100] In some embodiments, the power source has a charging time to runtime ratio of approximately 1:2 to approximately 3:2 or approximately 1:1. As used herein, a 1:1 charging time to runtime ratio means that charging the power source for approximately 30 minutes will be sufficient to power the diagnostic disk 110 for approximately 30 minutes. As used herein, a 1:2 charging time to runtime ratio means that charging the power source for approximately 30 minutes will be sufficient to power the diagnostic disk 110 for approximately 60 minutes. As used herein, a 3:2 charging time to runtime ratio means that charging the power source for approximately 30 minutes will be sufficient to power the diagnostic disk 110 for approximately 20 minutes. In some embodiments, the power source is sufficient to power the diagnostic disk and its operation (e.g., image capture) for runtimes of approximately 15 minutes to approximately 60 minutes, approximately 20 minutes to approximately 50 minutes, or approximately 25 minutes to approximately 45 minutes.

[0101] The charging time to runtime ratios listed herein should not be construed as limiting. In some embodiments, the charging time to runtime ratio may range from any of about 1:100, about 1:75, about 1:50, about 1:25, about 1:10, about 1:10, about 1:5, or about 1:1 to any of about 5:1, about 10:1, about 15:1, about 25:1, about 50:1, about 75:1, or about 100:1, or any subrange or single value thereof.

[0102] In some embodiments, the power source has a voltage output of about 3.7V and a current usage ranging from about 300mA to about 1200mA, from about 350mA to about 800mA, or from about 400mA to about 600mA. In some embodiments, the power source has a current capacity ranging from about 400mAh to about 600mAh, from about 450mAh to about 650mAh, or from about 480mAh to about 620mAh.

[0103] In some embodiments, the power source is durable and has a lifespan of at least about 350 cycles, at least about 400 cycles, at least about 450 cycles, or at least about 500 cycles at 1°C. The term "lifespan" refers to the number of cycles a power source can use until it has approximately 80% of its remaining capacity. A single cycle refers to a power source that is charging, using any of the diagnostic disks described herein to power a diagnostic scan, and a power source that is discharging. In one embodiment, a diagnostic scan within a single cycle may include multiple multi-minute measurements (e.g., 12 three-minute measurements or four measurements with eight images captured in each measurement) that generate sensor data during that period.

[0104] The power source described herein is non-toxic and safe for unregulated travel in aircraft without the special classification found in conventional lithium batteries. Therefore, the power source described herein complies with safety regulations UL 2054, IEC 62133ed.2, and UN 38.3.

[0105] A suitable power source may have certain target properties (such as, but not limited to, voltage output, current usage, energy density, equivalent series resistance, mass, etc.) to form a power unit capable of achieving the target duration of use with the diagnostic panel 110 and without deforming, exploding, cracking, or contaminating the processing chamber under high temperature and high vacuum conditions. Exemplary properties for a power source according to one embodiment are outlined in Table 2 below. Table 2 - Exemplary properties of a power source according to an embodiment width 47.5mm length 84.5mm high 6.0mm quality 40-60 grams (e.g., 50 grams) Current capacity 500mAh Voltage range 3.7V rated Peak load 1200mA Rated load 350mA–850mA temperature 120C Vacuum specifications 0.1 millitor Runtime 30min Energy density 9 Ws / g to 13 Ws / g Equivalent series resistance (ESR) Up to approximately 1.5 ohms

[0106] Although the content discussed in this article is related to Figure 3A and Figure 3B The power sources are depicted using a diagnostic panel, and those skilled in the art will understand that similar power sources can be used to power other devices in the wafer processing system 100 or processing chamber 107. These power sources are particularly advantageous because they are located away from the use of wires to power wafer processing system components. The advantages of the power sources described herein also include their low cost, improved performance, low toxicity, durability under high / low temperature / vacuum conditions and corrosive environments, high cycle life, scalability, favorable charge-to-run time ratio, and ease of transport by air.

[0107] Figure 4 Various embodiments of this disclosure utilize a diagnostic disc for obtaining information about treatment chambers (such as...). Figure 1BThe flowchart describes a method 400 for processing sensor data from components within a processing chamber 107. Some operations of method 400 can be performed by processing logic, which may include hardware (circuit systems, dedicated logic, etc.), software (e.g., running on a general-purpose computer system or a dedicated machine), firmware, or a combination thereof. Some operations of method 400 can be performed by a computing device, such as... Figure 1A The controller 109 controls the robotic arm and / or non-contact sensors. For example, the processing logic for performing one or more operations of method 400 may be executed on the controller 109.

[0108] For the sake of simplicity, the method is depicted and described as a series of actions. However, the actions according to this disclosure may occur in various orders and / or simultaneously, and may occur alongside other actions not presented or described herein. Furthermore, not all actions shown are operable to implement the method according to the disclosed subject matter. Moreover, those skilled in the art will understand and appreciate that the method may alternatively be represented by a state diagram or events as a series of interrelated states.

[0109] refer to Figure 4 Method 400 may begin with processing logic loading one or more diagnostic pads 110 into one of the substrate cassettes 102 (such as a FOUP or SSP) (405). In one embodiment, one or more diagnostic pads are stored in a FOUP, which also includes an edge ring, or more generally, a process kit ring. In one embodiment, multiple diagnostic pads are stored in a FOUP designed to house diagnostic pads. Method 400 may continue by determining, based on the number of RF operating hours of the processing chamber within the substrate processing system (410) and / or based on other criteria (e.g., the amount of time elapsed since the last analysis was performed on the component in the processing chamber), that a component in the component processing chamber 107 should be subjected to a diagnostic scan. The processing logic may also determine the type of diagnostic scan for said component (i.e., the type of sensor data to be generated, such as metrological data, gap measurements, etc.) (410).

[0110] Method 400 may continue with the following operation: the processing logic causes one of the diagnostic disks 110 to be moved from the FOUP (or SSP) to the processing chamber (415) with a movement similar to that used for moving a wafer. In an embodiment, this includes moving the fab interface area (e.g., Figure 1A The robotic arm within (91) moves the diagnostic tray 110 from the wafer storage area and loads the diagnostic tray into the loading lock of the substrate processing system (e.g., via a factory interface robot 111). In embodiments, this may further include moving the transfer chamber area (such as...) Figure 1AThe robotic arm within the transfer chamber 106 retracts the diagnostic tray 110 from the loading lock into the processing chamber (e.g., via the transfer chamber robot 112). This may include causing the end effector of the robotic arm within the transfer chamber 106 to pick up and place the diagnostic tray 110 into the processing chamber 107 with movements similar to those used for moving a wafer.

[0111] Optionally, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot 112 to transfer the diagnostic tray 110 from the end effector of the robotic arm to the wafer lifting rod 253 of the ESC 150. Figure 2F In one embodiment, method 400 may further include raising a plurality of wafer lifting rods of a substrate support assembly in a processing chamber, such that a plurality of motion coupling interfaces of the diagnostic disk 110 (e.g., Figure 2E 235) engages with multiple wafer lift rods to give the diagnostic disk 110 a target position and target orientation. In one embodiment, method 400 may further include lowering multiple wafer lift rods of the substrate support assembly in the processing chamber, for example, setting the diagnostic disk 110 on the ESC (420).

[0112] Method 400 may proceed to the following operation: the processing logic establishes a wireless connection (420) with at least one of the diagnostic disks 110. The wireless connection may be a secure wireless connection. The wireless connection may be established before or after the diagnostic disk 110 is placed in the processing chamber. After the wireless connection is established, method 400 may proceed to the following operation: the processing logic loads a script onto the diagnostic disk 110, the script causing the diagnostic disk 110 to monitor temperature, control illumination, and generate sensor data according to a diagnostic scanning algorithm.

[0113] Method 400 may further include the following operation: processing logic causes the diagnostic disc 110 to generate sensor data (425) of a component of the processing chamber using one or more non-contact sensors of the diagnostic disc. For example, causing the diagnostic disc 110 to generate sensor data may include causing the non-contact sensors of the diagnostic disc to generate sensor data depicting multiple multi-minute measurements. In one embodiment, causing a camera on the diagnostic disc 110 to generate sensor data may include causing the camera to autofocus, illuminate, and capture a first image of a portion of the component, subsequently causing the camera to autofocus, illuminate, and capture a second image of said portion of the component, and subsequently causing the camera to autofocus, illuminate, and capture a third image of said portion of the component.

[0114] Method 400 may further include receiving sensor data from the diagnostic disk via a wireless connection (430). Sensor data can be received when the diagnostic disk 110 is positioned on the blade of the robotic arm and within the processing chamber, when the diagnostic disk is on the chip lifting rod 253, or after the diagnostic disk 110 has been lowered to ESC 150.

[0115] For further reference Figure 4 In various embodiments, method 400 further includes processing logic to analyze sensor data to determine at least one of the following: component alignment, concentricity, cleanliness, corrosion, whether the component is damaged, and whether the component is stuck (435).

[0116] If method 400 determines that the alignment or concentricity is correct (440) and the processing logic determines that there is no misalignment in the alignment or concentricity, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic tray 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic tray 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours before restarting the diagnostic scan of the component (455).

[0117] However, if the alignment or concentricity of the components is off, method 400 may continue with the following operation: the processing logic initiates automatic correction of the alignment or concentricity of the components (445).

[0118] If method 400 determines cleanliness (460) and the processing logic determines that the cleanliness has not reached the contamination threshold, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic tray 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic tray 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours before restarting the diagnostic scan of the component to determine cleanliness (455).

[0119] However, if the cleanliness of the component reaches the contamination threshold, method 400 may continue with the following operation: the processing logic initiates automatic cleaning of the component (465).

[0120] If method 400 determines the corrosion level (470) and the processing logic determines that the corrosion level has not reached the end-of-life threshold, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic tray 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic tray 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the substrate processing to continue for an additional number of RF hours before restarting the diagnostic scan of the component to determine the corrosion level (455).

[0121] However, if the corrosion level of a component reaches its end-of-life threshold, method 400 may proceed to: initiating automatic component replacement (475) via processing logic. Component replacement may include removing the worn component (e.g., a process kit ring) from the processing chamber and returning it to a storage area (e.g., a FOUP or SSP). Component replacement may further optionally include flushing away residues and particles around the worn component using a pressurized gas source (e.g., nitrogen) from the processing chamber. Component replacement may further include moving a new component from the storage area into the processing chamber for replacement of the worn component. Component replacement may further include placing the new component into the processing chamber using robotic blades.

[0122] If method 400 identifies a damaged or stuck component (480) and the processing logic determines that the component is not damaged or stuck, method 400 may continue with the following operation: the processing logic causes the transfer chamber robot to move the diagnostic tray 110 from the processing chamber back to the loading lock. Method 400 may further continue with the following operation: the processing logic determines that no additional maintenance is required and causes the factory interface robot to move the diagnostic tray 110 from the loading lock back to the storage area (e.g., FOUP or SSP) (450). Method 400 may further continue with the following operation: the processing logic causes the board processing to continue for an additional number of RF hours to identify the damaged or stuck component before restarting the diagnostic scan of the component (455).

[0123] However, if a component is damaged, method 400 may continue with the following operation: automatically replacing the logic start component, similar to replacing a worn component as described above (485). If a component is stuck, method 400 may continue with the following operation: automatically moving the logic start component (485).

[0124] The function of method 400 can be repeated for additional components in additional processing chambers (490). The function of method 400 can also be repeated to diagnose other problems associated with components in the processing chambers, which can be diagnosed by any diagnostic disk described herein and / or the problems can be automatically resolved using a robot within the processing chamber, such as the transfer chamber robot 112.

[0125] In an embodiment, the sensor data generated by the diagnostic disc may include image data. In an embodiment, the processing logic for analyzing the sensor data includes applying one of an image processing algorithm or a trained machine learning model to determine at least one of the following sensor data related to the diagnosed component: alignment, concentricity, cleanliness, corrosion, whether the component is damaged, whether the component is stuck, etc.

[0126] Figure 5This is a flowchart of a method 500 that uses an in-situ non-contact sensor (e.g., non-contact sensor 230) of a diagnostic disk to generate sensor data and wirelessly transmit the sensor data to a controller 109 (e.g., a computing system). Some operations of method 500 can be performed by processing logic, which may include hardware (circuit systems, dedicated logic, etc.), software (e.g., running on a general-purpose computer system or a dedicated machine), firmware, or some combinations thereof. Some operations of method 500 can be performed via the diagnostic disk 110 before or after the diagnostic disk 110 is placed into the processing chamber.

[0127] For the sake of simplicity, the method is depicted and described as a series of actions. However, the actions according to this disclosure may occur in various orders and / or simultaneously, and may occur alongside other actions not presented or described herein. Furthermore, not all actions shown are operable to implement the method according to the disclosed subject matter. Moreover, those skilled in the art will understand and appreciate that the method may alternatively be represented by a state diagram or events as a series of interrelated states.

[0128] refer to Figure 5 Method 500 may begin with the diagnostic panel 110 using the diagnostic panel's wireless circuitry to establish a secure wireless connection with the computing system (510). This can be achieved by the diagnostic panel entering the processing chamber (e.g., Figure 1A A secure wireless connection between the diagnostic disk and the computing system can be established before or after the processing chamber 107. This secure wireless connection can be established when the diagnostic disk is held by the robotic arm of the transfer robot 112, when the diagnostic disk is placed on the chip pin 253, or when the diagnostic disk is placed on the ESC 250.

[0129] Method 500 may continue with the following operations: the diagnostic panel receives a script from the computing system, via which the diagnostic panel 110 may be instructed to, for example, monitor temperature, control lighting, and generate sensor data.

[0130] Method 500 may continue with the following operation: at least one non-contact sensor (e.g., 230A, 230B, 230C, or 230D) of the diagnostic disk 110 generates sensor data (520) of at least a portion of a component disposed within a processing chamber (e.g., processing chamber 107). The generation of sensor data of at least a portion of the component may be performed at pressures and temperatures similar to those present in the processing chamber during wafer processing. For example, sensor data may be generated in the processing chamber under vacuum (e.g., about 0.1 mTort to about 50 mTort, about 15 mTort to about 50 mTort, or about 30 mTort to about 50 mTort) and / or at temperatures ranging from about -20°C to about 120°C, about 0°C to about 120°C, about 50°C to about 85°C, about 50°C to about 120°C, about 65°C to about 120°C, about 80°C to about 120°C, about 50°C to about 80°C, or about 65°C to about 80°C.

[0131] Generating sensor data may include multiple multi-minute measurements performed by a non-contact sensor on the diagnostic disc. In one embodiment, a camera on the diagnostic disc 110 generates sensor data by autofocusing on a portion of a component (e.g., an edge ring, process kit ring, or ESC), illuminating, and capturing a first image of the portion of the component; subsequently autofocusing, illuminating, and capturing a second image of the portion of the component; and subsequently autofocusing, illuminating, and capturing a third image of the portion of the component. In some embodiments, the diagnostic disc 110 may generate sensor data without autofocusing and / or without illuminating the portion of the component before capturing images.

[0132] At least one non-contact sensor of the diagnostic panel 110 can generate sensor data for various components within the processing chamber. Some exemplary components include, but are not limited to: process kit ring, single ring, substrate support assembly, electrostatic chuck (ESC), chamber wall, substrate, gas line, gas distribution plate, panel, nozzle, spray head, cover, liner, liner kit, shield, plasma screen, remote plasma source, flow equalizer, cooling substrate, chamber observation port, or chamber cover.

[0133] Continue to refer to Figure 5 Method 500 may continue with the following operation: storing sensor data in the memory of the diagnostic disk (530). Method 500 may further continue with the following operation: wireless communication circuitry of the diagnostic disk wirelessly transmits the sensor data to a computing system (540). In some embodiments, the diagnostic disk may only transmit sensor data to the computing system without storing the sensor data in the memory of the diagnostic disk. The sensor data may include image data to be analyzed by the computing system to determine at least one of the following related to the component: alignment, concentricity, cleanliness, corrosion, whether the component is damaged, whether the component is stuck, etc.

[0134] Method 500 may proceed to: terminating the secure wireless connection with the computing system (550). Method 500 may further proceed to: clearing sensor data from the diagnostic disk's memory (560). In some embodiments, the diagnostic disk will also clear any scripts received from the computing system after terminating the secure wireless connection with the computing system. In some embodiments, the diagnostic disk will turn off its contactless sensors and / or its illumination components after terminating the secure wireless connection with the computing system.

[0135] The function of method 500 can be repeated for additional components in additional processing chambers (570). The function of method 500 can also be repeated to diagnose other problems associated with components in the processing chambers, which can be diagnosed by any of the diagnostic disks described herein and / or the problems can be automatically resolved using robots within the processing chambers, such as the transfer chamber robot 112. Example

[0136] The following examples are provided to aid in understanding this disclosure and should not be construed as limiting the scope of the disclosure described and claimed herein. Such variations to this disclosure, including any or all replacements of now-known or hereafter developed equivalents, will fall within the view of those skilled in the art, and minor changes in architecture, operation, design, or properties should be considered to fall within the scope of the disclosure incorporated herein. Example 1 – Diagnostic scan to determine corrosion levels at the edges and support rings.

[0137] Figure 6A A side cross-sectional view of a diagnostic disk (e.g., 110) placed on a wafer lifting rod (e.g., 253) of an ESC (e.g., 150) within a processing chamber (e.g., 107) according to an embodiment of this disclosure is shown. The diagnostic disk is shown positioned on top of an end effector (e.g., a robot blade) of a robotic arm of a transfer chamber robot (e.g., 112) located within a transfer chamber (e.g., 106). Region 311, surrounding a portion of the edge ring of the left side of the ESC (e.g., 150), is circled. Region 311 is located in... Figures 6B to 6C The image is magnified.

[0138] Figure 6B This is an exploded view of a portion of a diagnostic disc (e.g., 110) in FIG3, according to an exemplary embodiment of the present disclosure, wherein the non-contact sensor 230 is a high-resolution camera that captures sensor data of the edges and support rings. Elevable Figure 6AThe wafer lifting rod (e.g., 253) shown, and the end effector of the robotic arm of the transfer chamber robot (e.g., 112), can downwardly position a diagnostic disk (e.g., 110) onto the wafer lifting rod (e.g., 253). Motion coupling (e.g., 235) on the diagnostic disk ensures that the wafer lifting rod is forced to center the diagnostic disk above the ESC (e.g., 150), such that each non-contact sensor 230 is vertically positioned on top of the edge ring 90. In one embodiment, the wafer lifting rod (e.g., 253) is only slightly raised, leaving a small gap between the non-contact sensor 230 and the edge ring 90. With the diagnostic disk (e.g., 110) positioned on the wafer lifting rod (e.g., 253), the non-contact sensor 230 can generate sensor data to indicate the corrosion level of the edge ring 90 and wirelessly transmit the sensor data to a controller (e.g., 109).

[0139] Figure 6C This is an exemplary embodiment based on the present disclosure. Figure 6A An exploded view of a portion of a diagnostic disk (e.g., 110), wherein each non-contact sensor 230 captures sensor data from the edge ring 90 and the support ring 390. In this embodiment, the wafer lift bar (e.g., 253) may be lowered so that the diagnostic disk 110 is positioned on top of the ESC (e.g., 150). In another embodiment, other mechanisms are used to guide the diagnostic disk (e.g., 110) onto the ESC (e.g., 150), such as using sensor data from the non-contact sensors. Each non-contact sensor 230 is brought very close to the edge ring 90, but a gap is still maintained between the non-contact sensor 230 and the edge ring 90. While the diagnostic disk (e.g., 110) is positioned on the ESC (e.g., 150), the non-contact sensor 230 may generate sensor data to indicate the corrosion level of the edge ring and / or support ring and wirelessly transmit the sensor data to a controller (e.g., 109).

[0140] like Figures 6B to 6C As observed, when the corrosion of the edge ring 90 is deep enough, the support ring 390 located below the edge ring 90 and between the edge ring 90 and ESC 150 may also be corroded (or worn). Accordingly, when the edge ring 90 is replaced, the support ring 390 can also be replaced simultaneously, for example, as a process kit ring. Example 2 – Diagnostic scan for determining the alignment of process kit rings

[0141] Figure 7AA top plan view of an edge ring 90 and a support ring 390 surrounding an electrostatic chuck (ESC) 150 according to one embodiment of the present disclosure is shown. The ESC 150 may include a flat region 800 (or other notch or registration feature) along the circumference of the edge of the ESC 150 for aligning a wafer placed thereon. Similarly, the support ring 390 may include a corresponding flat region (or notch or registration feature) such that when the support ring 390 and the edge ring 90 are replaced with a ring kit, the entire ring kit can be oriented along the flat region 800, thus properly secured to a position centered on the ESC 150 of the processing chamber 107.

[0142] In embodiments of this disclosure, controller 109 may receive sensor data from any non-contact sensor described herein, wherein controller 109 may determine from the sensor data whether the flat areas are aligned with each other during ring kit replacement. If the flat areas are not properly aligned, controller 109 may signal to transfer chamber robot 112 to remove the ring kit from processing chamber 107, and then realign it at the end effector of the robotic arm before reinserting it into processing chamber 107.

[0143] For example, controller 109 can determine a rotational error, which may be the rotational angle between the target orientation and the current orientation of the ring assembly. Controller 109 can send instructions to transfer chamber robot 112 to rotate the end effector (and the ring assembly supported on the end effector) by a specified amount to correct and eliminate the rotational error. Transfer chamber robot 112 can then place the edge ring 90 into processing chamber 107 via a corresponding port 108 with corrected orientation. Accordingly, the degrees of freedom of transfer chamber robot 112 can be used to eliminate the rotational error of edge ring 90 without using an alignment station.

[0144] In some embodiments, the transfer chamber robot 112 can correct for a threshold amount of rotational error up to the edge ring 90. For example, one transfer chamber robot 112 may be able to correct for a rotational error of up to 5 degrees, while other plant transfer chamber robots 112 may be able to correct for a rotational error of up to 3 degrees, 7 degrees, or some other amount. If the detected rotational error is greater than the threshold amount of rotational error that can be corrected by the transfer chamber robot 112, the transfer chamber robot 112 may place the ring assembly at an intermediate station (not shown), reposition the end effector, and then retrieve the ring assembly in a manner that eliminates or reduces the rotational error, such that it is less than or equal to the threshold amount of rotational error that can be corrected based on the rotation of the end effector.

[0145] In other embodiments of this disclosure, controller 109 may receive sensor data from any of the non-contact sensors described herein, wherein controller 109 may determine from the sensor data whether the process kit ring has shifted (i.e., decentered) during ring kit replacement. The alignment and concentricity of the process kit ring may be determined by analyzing the gap between edge ring 90 and support ring 390 or between edge ring 90 and ESC 150. To generate sensor data indicating the gap between edge ring 90 and support ring 390 or between edge ring 90 and ESC 150, one non-contact sensor (e.g., a camera) may be positioned to provide a clear line of sight to the edge of plane 800 and the beginning of the circular edge of ESC 150, and the remaining non-contact sensors (e.g., cameras) may be positioned to provide a clear line of sight to the ring segments of edge ring 90 and support ring 390.

[0146] Processing the sensor data generated by these cameras can provide at least some of the following information: ring positioning, the ring including the correct material, the rotation angle between the ESC plane and the ring plane, four points of the gap between the inner edge of the process ring and the outer edge of the ESC 150, concentricity, etc.

[0147] For example, if the flat area of ​​the ESC and the ring kit is not properly centered, the controller 109 can signal the transfer chamber robot 112 to remove the ring kit from the processing chamber 107, and then realign it at the end effector of the robotic arm before reinserting it into the processing chamber 107.

[0148] For example, controller 109 can determine a placement error, which may be a gap between the edge ring and the support ring outside the target gap range. Controller 109 can send a command to transfer chamber robot 112 to move the end effector (and the ring assembly supported on the end effector) by a specified amount in a specified direction to correct and eliminate the placement error. Transfer chamber robot 112 can then place the edge ring 90 into processing chamber 107 via a corresponding port 108 with corrected orientation. Accordingly, the degrees of freedom of transfer chamber robot 112 can be used to eliminate the placement error of edge ring 90 without using an alignment station.

[0149] In some embodiments, the transfer chamber robot 112 can correct for a placement error up to a threshold amount of the edge ring 90. If the detected placement error is greater than the threshold amount of placement error that can be corrected by the transfer chamber robot 112, the transfer chamber robot 112 can position the ring assembly at an intermediate station (not shown), reposition the end effector, and then retrieve the ring assembly in a manner that eliminates or reduces the placement error, such that it is less than or equal to the threshold amount of placement error that can be corrected based on the movement of the end effector.

[0150] Figure 7B The observation position of a diagnostic disk (e.g., 110) configured to observe the positioning (such as alignment and concentricity) of a process kit ring according to an embodiment of this disclosure is shown. The diagnostic disk is shown at a vertical distance above the ESC (e.g., 150). The diagnostic disk (e.g., 110) can reach the depicted observation position when it is mounted in the arm of a transfer robot (e.g., the end effector of transfer robot 112) or when it is mounted on a wafer lifting rod (e.g., 253).

[0151] In the depicted embodiment, according to an exemplary embodiment of this disclosure, the diagnostic disk has four high-resolution cameras (i.e., non-contact sensors) that capture sensor data of the edges and curvature of the process kit ring. In the depicted viewing position, the first camera 730A is positioned above a flat area 800 of ESC 150, with its line of sight over the flat area 800 at the beginning of the curvature of the kit ring. In the depicted viewing position, the second camera 730B, the third camera 730C, and the fourth camera 730D are all positioned above the edge of the kit ring diameter. This sensor data helps the controller 109 determine the alignment and concentricity of the ring kit, for example, as related to the above... Figure 7A As stated above.

[0152] Figure 8 Embodiments based on this disclosure can be used as processing systems (e.g., Figure 1A The computing device 1400 is an example of a system controller operating a processing system 100. The computing device 1400 is a machine capable of executing a set of instructions therein for causing the machine to perform one or more of the methods discussed herein. In alternative embodiments, the machine may be connected (e.g., network-connected) to other machines in a local area network (LAN) 1464, intranet, extranet, or the Internet. The machine may operate as a server or client machine in a client-server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), tablet computer, network application device, server, network router, switch or bridge, or any machine capable of executing a set of instructions (sequentially or otherwise) to specify the actions the machine should take. Furthermore, although only a single machine is shown, the term "machine" should also be considered as a collection (e.g., a computer) of any machines that individually or jointly execute a set of instructions (or multiple sets of instructions) to perform any one or more methods discussed herein. In one embodiment, the computing device 1400 corresponds to... Figure 1A The system controller 109. In one embodiment, the system controller 109 is a component of the computing device 1400.

[0153] The example computing device 1400 includes a processing device 1402 that communicates with each other via a bus 1408, a primary memory 1404 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 1406 (e.g., flash memory, static random access memory (SRAM), etc.), and a secondary memory (e.g., a data storage device 1412).

[0154] Processing device 1402 represents one or more general-purpose processors, such as microprocessors, central processing units, etc. More specifically, processing device 1402 may be a Complex Instruction Set Computing (CISC) microprocessor, a Reduced Instruction Set Computing (RISC) microprocessor, a Very Long Instruction Word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Processing device 1402 may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. Processing device 1402 is configured to execute processing logic (instructions 1426) for performing the operations discussed herein. In one embodiment, system controller 109 corresponds to processing device 1402. In an embodiment, processing device 1402 executes instructions 1426 to implement method 400 of the embodiments.

[0155] The computing device 1400 may further include a network interface device 1408. The computing device 1400 may also include a video display unit 1410 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alphanumeric input device 1412 (e.g., a keyboard), a cursor control device 1414 (e.g., a mouse), and a signal generation device 1420 (e.g., a speaker).

[0156] Data storage device 1428 may include machine-readable storage medium (or more specifically, computer-readable storage medium) 1424 thereon storing one or more instruction sets 1426 to perform any one or more of the methods or functions described herein. Instructions 1426 may also reside wholly or at least partially within main memory 1404 and / or processing device 1402 during execution by computer system 1400, which also constitute machine-readable storage media.

[0157] The computer-readable storage medium 1424 can also be used to store instructions 1426 for analyzing sensor data and / or characteristic error values ​​1450 to detect, for example, alignment, concentricity, corrosion, cleanliness of components within the processing chamber 107, whether components within the processing chamber are stuck or damaged, etc. While the computer-readable storage medium 1424 is shown as a single medium in the example embodiment, the term "computer-readable storage medium" should be considered to include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) that store one or more sets of instructions. The term "computer-readable storage medium" should also be considered to include any medium, other than a carrier wave, capable of storing or encoding sets of instructions for machine execution and causing the machine to perform any one or more of the methods described herein. Accordingly, the term "computer-readable storage medium" should be considered to include, but is not limited to, non-transient media such as solid-state memory and optical and magnetic media.

[0158] To provide a good understanding of several embodiments of the invention, numerous specific details, such as examples of particular systems, components, methods, etc., have been set forth above. However, it will be apparent to those skilled in the art that at least some embodiments of the invention may be practiced without these specific details. In other instances, well-known components or methods have not been described in detail or presented in a simple block diagram format to avoid unnecessarily obscuring the invention. Therefore, the specific details set forth are merely exemplary. Specific implementations may vary from these exemplary details and are still considered to be within the scope of the invention.

[0159] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment. Furthermore, the term "or" is intended to indicate an inclusive rather than an exclusive "or." When the terms "about" or "approximately" are used herein, this is intended to indicate that the presented nominal value is exactly within ±10%.

[0160] Although the operations of the methods described herein are shown and described in a specific order, the order of operations of each method may be changed so that some operations can be performed in reverse order, or that some operations can be performed at least partially concurrently with other operations. In another embodiment, the instructions or sub-operations of different operations may be intermittent and / or alternating. In one embodiment, multiple metal bonding operations are performed as a single step.

[0161] It should be understood that the above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of the invention should be determined by referring to the appended claims and the full scope of their equivalents.

Claims

1. A diagnostic panel, comprising: A disc-shaped body, the disc-shaped body including a raised wall surrounding the interior of the disc-shaped body, wherein the raised wall of the disc-shaped body defines a cavity of the disc-shaped body; At least one protrusion extending outward from the disc-shaped body, wherein the raised wall of the disc-shaped body extends to the at least one protrusion; A non-contact sensor, said non-contact sensor being attached to each of the at least one of the protrusions; A printed circuit board (PCB) is positioned within the cavity on the disc-shaped body; A circuit system disposed on the PCB and coupled to each non-contact sensor, the circuit system including at least a wireless communication circuit and a memory; A power source, wherein the power source is disposed on the PCB; A wireless charger, wherein the wireless charger is disposed on the PCB; as well as A cover is positioned over the cavity on the disc-shaped body, wherein the cover shields at least a portion of the PCB, the circuit system, the power source, and the wireless charger within the cavity from the external environment.

2. The diagnostic panel of claim 1, further comprising an illumination component attached to each of the at least one protrusion, wherein the circuitry disposed on the PCB is further coupled to each illumination component.

3. The diagnostic disc of claim 1, wherein the at least one protrusion comprises four protrusions extending generally horizontally from the disc-shaped body, the four protrusions being positioned around the circumference of the disc-shaped body and generally perpendicular to the circumference of the disc-shaped body.

4. The diagnostic disc of claim 3, wherein the disc-shaped body includes a notch at a first position on the circumference, wherein a first protrusion of the four protrusions is positioned at an angle from 170° to 180° from the first position of the notch, wherein a second protrusion of the four protrusions is positioned at an angle from 225° to 235° from the first position of the notch, wherein a third protrusion of the four protrusions is positioned at an angle from 295° to 305° from the first position of the notch, and wherein a fourth protrusion of the four protrusions is positioned at an angle from 55° to 65° from the first position of the notch.

5. The diagnostic disc as described in claim 4, The diameter of the disc-shaped body is 310 mm to 320 mm; The first non-contact sensor positioned on the first protrusion is 295 mm to 305 mm away from the outer periphery of the disc-shaped body; and The second, third, and fourth non-contact sensors located on each of the second, third, and fourth protrusions are respectively positioned at a distance of 310 mm to 320 mm from the outer periphery of the disc-shaped body.

6. The diagnostic disc of claim 1, wherein the disc body and the cover are made of at least one of polyetheretherketone (PEEK) or aluminum alloy.

7. The diagnostic disc of claim 1, further comprising: A coating is applied to the disc-shaped body and the cover, wherein the coating has a surface roughness finish ranging from 4 µin to 16 µin.

8. The diagnostic disc of claim 7, wherein the coating comprises at least one of anodized aluminum oxide, an aluminum alloy, or yttrium oxide.

9. The diagnostic disc as claimed in claim 1, having a height of up to 9 mm.

10. The diagnostic disc of claim 1, wherein the non-contact sensor comprises a depth camera having a focal depth of 25 mm to 45 mm.

11. The diagnostic disc of claim 1, further comprising: Multiple motion coupling interfaces are located at the bottom of the disc-shaped body, wherein the multiple motion coupling interfaces are configured to engage with registration features of a substrate support assembly in a processing chamber, and wherein the engagement of the multiple motion coupling interfaces with the registration features enables the diagnostic disc to achieve a target position and target orientation in the processing chamber.

12. A method for performing diagnostic scanning on components within a processing chamber, comprising: Before or after the diagnostic disc as described in any one of claims 1 to 11 is positioned into the processing chamber, a secure wireless connection with the computing system is established using the wireless communication circuitry of the diagnostic disc. Sensor data of components disposed within the processing chamber is generated by at least one non-contact sensor of the diagnostic panel. The sensor data is stored in the memory of the diagnostic disk; The sensor data is wirelessly transmitted to the computing system using the wireless communication circuit. Terminate the secure wireless connection with the computing system; as well as Clear the sensor data from the memory of the diagnostic panel.

13. The method of claim 12, wherein the sensor data includes image data analyzed by the computing system to determine at least one of the alignment, concentricity, cleanliness, or corrosion of the component.

14. The method of claim 12, wherein the generation step of the sensor data is performed in a vacuum or at least a temperature from -20°C to 120°C when the diagnostic disk is in the processing chamber.

15. The method of claim 12, wherein the component is at least one of the following: process kit ring, single ring, substrate support assembly, electrostatic chuck (ESC), chamber wall, substrate, gas line, gas distribution plate, panel, nozzle, spray head, cover, gasket, gasket kit, shield, plasma screen, remote plasma source, flow equalizer, cooling substrate, chamber viewport, or chamber cover.

16. A method for performing diagnostic scanning on components within a processing chamber, comprising: A wireless connection is established with the diagnostic disk as described in any one of claims 1 to 11 via a computing system; The robotic arm inside the transfer chamber places the diagnostic disk into the processing chamber; One or more non-contact sensors of the diagnostic disc are used to generate sensor data of the components of the processing chamber. The computing system receives sensor data from the diagnostic panel via the wireless connection. The computing system is used to analyze the sensor data to determine at least one of the following: alignment, concentricity, cleanliness, or corrosion of the component. as well as In response to determining at least one of the following: If the alignment or concentricity is skewed, the automatic correction of the alignment or concentricity of the component is initiated. When the cleanliness level reaches the contamination threshold, the automatic cleaning of the component is initiated; or When the corrosion level reaches the end-of-life threshold, the automatic replacement of the component is initiated.

17. The method of claim 16, further comprising: Based on the number of hours the processing chamber has been in operation, diagnostic scans are performed on the components within the processing chamber. The diagnostic disk is transferred from the storage area into the loading lock of the substrate processing system, which includes the transfer chamber. as well as The robotic arm within the transfer chamber retracts the diagnostic disc from the loading lock.

18. The method of claim 16, wherein the diagnostic disk includes a plurality of motion coupling interfaces at the bottom of the diagnostic disk, the method further comprising: The plurality of lifting rods of the substrate support assembly in the processing chamber are raised, wherein the plurality of motion coupling interfaces of the diagnostic disk engage with the plurality of lifting rods, so that the diagnostic disk has a target position and target orientation; as well as The plurality of lifting rods are lowered to position the diagnostic panel on the substrate support assembly.

19. The method of claim 16, wherein the diagnostic disk generates the sensor data when disposed on the blade of the robotic arm and within the processing chamber, the method further comprising: Determine that at least one of the alignment or concentricity is not misaligned, the cleanliness does not reach the contamination threshold, or the corrosion does not reach the end-of-life threshold; It is determined that no additional maintenance is required; and The diagnostic disk is moved back to the storage area.

20. The method of claim 16, The sensor data includes image data, and analyzing the sensor data includes: An image processing algorithm or a trained machine learning model is applied to the sensor data to determine at least one of the alignment, concentricity, cleanliness, or corrosion of the component.

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