Electronic device including flexible board

Abstract

An electronic device is disclosed. The electronic device includes a housing including a board and a back plate facing a second surface of the board, the back plate including a planar area facing a first direction; a display module disposed on a first surface of the board; a circuit board and a battery disposed on a second surface of the board; a first flexible plate extending from the display module; a second flexible plate extending from the circuit board to the first flexible plate across the battery, wherein the first flexible plate includes a first connector, the second flexible plate includes a second connector, and the first flexible plate and the second flexible plate are configured such that the first connector and the second connector are coupled in a second direction different from the first direction. Furthermore, various other embodiments can be understood with reference to the specification.

Description

[0001] This application is based on and claims priority to Korean Patent Application No. 10-2020-0097668, filed with the Korean Patent Office on August 4, 2020, and the entire contents of which are incorporated herein by reference.

[0002] The embodiments disclosed in this document relate to an electronic device including a flexible substrate. Technical Field

[0003] This disclosure relates to an electronic device including a flexible substrate. Background Technology

[0004] Electronic devices may include flexible substrates for electrically connecting two or more physically separate components. At least a portion of the flexible substrate may be formed to be flexible, thus allowing efficient use of the limited internal space of the electronic device. The flexible substrate may also be electrically connected to other flexible substrates.

[0005] The above information is presented as background information only to aid in understanding this disclosure. It has not been determined or asserted whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0006] Technical issues

[0007] Flexible substrates can extend from circuit boards, batteries, or display modules located in the XY plane. Two flexible substrates can be positioned in the XY plane, and their connectors can be aligned and coupled to each other in the Z-axis direction. In this case, tension can act on the flexible substrates in a direction substantially perpendicular to the direction in which the connectors are coupled. The connectors may be damaged by the tension. Furthermore, in electronic devices with relatively limited internal space, there may be limitations depending on the XY dimensions of the connectors. Additionally, when the flexible substrate is bent at a large curvature within the limited internal space, either the flexible substrate or the connector may be damaged.

[0008] The embodiments of this disclosure at least address the aforementioned problems and / or disadvantages, and provide at least the advantages described below. Therefore, embodiments of this disclosure provide an electronic device including a flexible substrate coupling structure for efficient use of a limited internal space.

[0009] Embodiments of this disclosure provide an electronic device including a flexible substrate coupling structure for providing sufficient space therein for a flexible substrate to be bent.

[0010] Embodiments of this disclosure provide an electronic device including a support structure for mechanically constraining a flexible substrate.

[0011] Technical solution

[0012] According to an exemplary embodiment of this disclosure, an electronic device includes: a housing including a plate, a frame surrounding the plate, and a back plate facing a second surface of the plate and coupled to the frame, the back plate including a planar region facing a first direction; a display module including a display disposed on a first surface of the plate structure; a battery and a circuit board disposed on a second surface of the plate; a first flexible substrate extending from the display module through an opening region of the plate to the second surface of the plate structure; and a second flexible substrate extending across the battery from the circuit board to the first flexible substrate. The first flexible substrate includes a first region, a second region, and a first connector, at least a portion of the first flexible substrate being disposed in the opening region, the second region extending from the first region toward the back plate, and the first connector being disposed in the second region. The second flexible substrate includes a third region, a fourth region, and a second connector, at least a portion of the second flexible substrate being disposed between the battery and the back plate, the fourth region extending from the third region toward the second surface of the plate structure, and the second connector being disposed in the fourth region. The first and second flexible substrates are configured such that the first and second connectors are coupled in a second direction different from the first direction.

[0013] According to an example embodiment of this disclosure, an electronic device includes: a board including a first surface, a second surface facing a direction opposite to that of the first surface, and an opening region formed through the first surface and the second surface; a display module including a display disposed on the first surface and including a planar region facing a first direction; a circuit board disposed on the second surface; a first flexible substrate extending from the display module through the opening region to the second surface and including a first connector; and a second flexible substrate extending from the circuit board and including a second connector, wherein the first connector and the second connector are coupled in a direction substantially perpendicular to the first direction.

[0014] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the disclosure taken in conjunction with the accompanying drawings.

[0015] Beneficial effects

[0016] According to various embodiments of this disclosure, an electronic device may include a flexible substrate that is partially bent in the Z-axis direction, thus allowing efficient use of relatively limited internal space. For example, space within the internal space of the electronic device facing the Z-axis can be utilized. Furthermore, the electronic device may include a support structure that mechanically constrains the flexible substrate. Therefore, the shape of the flexible substrate can be specified and can be used for design and control. Additionally, the electronic device may include a flexible substrate and connectors with relatively reduced dimensions. Therefore, the assembly process can be improved and manufacturing costs can be reduced.

[0017] In addition, this disclosure can provide various effects that can be recognized directly or indirectly. Attached Figure Description

[0018] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1a This is a front perspective view of an electronic device according to various embodiments;

[0020] Figure 1b This is a rear perspective view of an electronic device according to various embodiments;

[0021] Figure 2a This is an exploded perspective view of an electronic device according to various embodiments;

[0022] Figure 2b This is a view showing the rear side of an electronic device according to various embodiments;

[0023] Figure 3 This is a perspective view showing a first flexible substrate and a second flexible substrate of an electronic device according to various embodiments;

[0024] Figure 4 These are cross-sectional views of electronic devices according to various embodiments;

[0025] Figure 5a and Figure 5b This is a cross-sectional view showing a first flexible substrate, a second flexible substrate, and a support structure of an electronic device according to various embodiments;

[0026] Figure 6 This is an exploded perspective view showing a first flexible substrate, a second flexible substrate, and a support structure of an electronic device according to various embodiments;

[0027] Figure 7 This is a cross-sectional view showing the support structure of an electronic device according to various embodiments;

[0028] Figure 8a , Figure 8b and Figure 8c This is a perspective view showing the support structure of an electronic device according to various embodiments;

[0029] Figure 9a and Figure 9b These are cross-sectional views of electronic devices according to various embodiments;

[0030] Figure 10a and Figure 10b This is a view illustrating an electronic device according to various embodiments;

[0031] Figure 11These are cross-sectional views of electronic devices according to various embodiments;

[0032] Figure 12 These are cross-sectional views of electronic devices according to various embodiments;

[0033] Figure 13a and Figure 13b This is a cross-sectional view showing a first bracket and a second bracket of an electronic device according to various embodiments;

[0034] Figure 14a , Figure 14b , Figure 14c , Figure 14d , Figure 14e and Figure 14f This is a view illustrating example methods of assembling an electronic device, including a first flexible substrate, a second flexible substrate, a support structure, and a board structure, according to various embodiments.

[0035] Figure 15 This is a perspective view showing examples of a support for an electronic device according to various embodiments;

[0036] Figure 16a and Figure 16b According to various embodiments, including Figure 15 A cross-sectional view of the electronic device with the bracket shown;

[0037] Figure 17 This illustrates various embodiments including Figure 15 A cross-sectional view of an example of an electronic device with a bracket shown in the illustration;

[0038] Figure 18 This is a perspective view showing examples of a support for an electronic device according to various embodiments;

[0039] Figure 19a and Figure 19b It includes various embodiments. Figure 18 A cross-sectional view of the electronic device with the bracket shown;

[0040] Figure 20 These are cross-sectional views of electronic devices according to various embodiments; and

[0041] Figure 21 It is a cross-sectional view of an electronic device according to various embodiments.

[0042] In the following description of the accompanying drawings, similar components will be assigned similar reference numerals. Detailed Implementation

[0043] In the following description, various exemplary embodiments of the present disclosure may be referenced to the accompanying drawings. Therefore, those skilled in the art will recognize that various modifications, equivalents, and / or substitutions may be made to the various exemplary embodiments described herein without departing from the scope and spirit of the present disclosure.

[0044] Figure 1a This is a front perspective view of an electronic device according to various embodiments. Figure 1b This is a rear perspective view of an electronic device according to various embodiments.

[0045] refer to Figure 1a and Figure 1b The electronic device 100 may include a housing 110, which includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface (e.g., a frame) 110C surrounding the space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surface 110C.

[0046] According to an embodiment, a first surface 110A may be formed of a front panel 102, at least a portion of which is substantially transparent (e.g., a glass or polymer panel comprising various coatings). A second surface 110B may be formed of a substantially opaque back panel 111. The back panel 111 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. A side surface 110C may be formed of a side frame structure (e.g., a “frame structure”) 118 coupled to the front panel 102 and the back panel 111 and comprising metal and / or polymer. In an embodiment, the back panel 111 and the side frame structure 118 may be integrally formed with each other and may comprise the same material (e.g., a metallic material such as aluminum).

[0047] In the illustrated embodiment, the front panel 102 may include two first regions 110D that curve and extend seamlessly from a portion of the first surface 110A toward the back panel 111. The first regions 110D may be located at opposite long edges of the front panel 102.

[0048] In the illustrated embodiment, the back panel 111 may include two second regions 110E that curve and extend seamlessly from a portion of the second surface 110B toward the front panel 102. The second regions 110E may be located at opposite long edges of the back panel 111.

[0049] In one embodiment, the front panel 102 (or back panel 111) may include only one first region 110D (or second region 110E). Alternatively, in another embodiment, the front panel 102 (or back panel 111) may not include a portion of the first region 110D (or second region 110E).

[0050] In an embodiment, when viewed from the side of the electronic device 100, the side bezel structure 118 may have a first thickness (or width) on the side (e.g., the short side) excluding the first region 110D or the second region 110E, and may have a second thickness on the side (e.g., the long side) including the first region 110D or the second region 110E, wherein the second thickness is less than the first thickness.

[0051] In an embodiment, the electronic device 100 may include at least one of a display 101, audio modules 103, 104 and 107, a sensor module (not shown), camera modules 105, 112 and 113, a key input device 117, a light-emitting element (not shown), and / or a connector hole 108. In an embodiment, the electronic device 100 may not include at least one of the above components (e.g., the key input device 117 or the light-emitting element (not shown)), or may additionally include one or more other components.

[0052] In one embodiment, the display 101 may be exposed through a large portion of the front panel 102. For example, at least a portion of the display 101 may be exposed through the front panel 102, which includes a first region 110D comprising a first surface 110A and a side surface 110C.

[0053] In one embodiment, the periphery of the display 101 may be formed to have a shape substantially the same as the adjacent outer edge of the front panel 102. In another embodiment (not shown), the gap between the periphery of the display 101 and the periphery of the front panel 102 may be substantially constant to extend the area of ​​the display 101 that is exposed.

[0054] In an embodiment, the surface of the housing 110 (or front panel 102) may include a display area formed when the display 101 is visible. For example, the display area may include a first region 110D of a first surface 110A and a side surface 110C.

[0055] In an embodiment (not shown), display areas 110A and 110D may include sensing areas (not shown) configured to acquire a user's biometric information. Here, when display areas 110A and 110D include sensing areas, this may mean that at least a portion of the sensing areas overlaps with display areas 110A and 110D. For example, a sensing area (not shown) may refer to an area capable of displaying visual information of display 101 like other areas of display areas 110A and 110D and additionally acquiring the user's biometric information (e.g., fingerprint).

[0056] In an embodiment (not shown), the display 101 may be coupled to or adjacent to a touch detection circuit, a pressure sensor for measuring the intensity (pressure) of the touch, and / or a digital converter for detecting a stylus of a magnetic type.

[0057] In an embodiment, audio modules 103, 104, and 107 may include microphone holes 103 and 104 and speaker holes 107.

[0058] In an embodiment, microphone holes 103 and 104 may include a first microphone hole 103 formed in a portion of the side surface 110C and a second microphone hole 104 formed in a portion of the second surface 110B. Microphones for acquiring external sound may be disposed in microphone holes 103 and 104. The microphones may include multiple microphones for detecting the direction of the sound. In an embodiment, the second microphone hole 104 formed in a portion of the second surface 110B may be disposed adjacent to camera modules 105, 112, and 113. For example, the second microphone hole 104 may acquire sound when camera modules 105, 112, and 113 are performing, or it may acquire sound when performing other functions.

[0059] In an embodiment, the speaker hole 107 may include an external speaker hole 107 and a receiver hole (not shown) for telephone calls. The external speaker hole 107 may be formed in a portion of the side surface 110C of the electronic device 100. In an embodiment, the external speaker hole 107 and the microphone hole 103 may be implemented as a single hole. Although not shown, the receiver hole (not shown) for telephone calls may be formed in another portion of the side surface 110C. For example, the receiver hole (not shown) for telephone calls may be formed in a portion of the side surface 110C (e.g., the portion facing the +Y axis direction), which faces the portion of the side surface 110C where the external speaker hole 107 is formed (e.g., the portion facing the -Y axis direction).

[0060] In one embodiment, the electronic device 100 may include a speaker communicating with the speaker hole 107. In another embodiment, the speaker may include a piezoelectric speaker that does not include the speaker hole 107.

[0061] In an embodiment, the sensor module (not shown) may generate electrical signals or data values ​​corresponding to the operating state inside the electronic device 100 or the environmental state outside the electronic device 100. For example, the sensor module may include at least one of a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor.

[0062] In one embodiment, the key input device 117 may be disposed on the side surface 110C of the housing 110 (e.g., the first region 110D and / or the second region 110E). In another embodiment, the electronic device 100 may not include all or some of the key input devices 117, and the excluded key input devices 117 may be implemented on the display 101 in different forms, such as soft keys. In another embodiment, the key input device 117 may include a sensor module (not shown) forming a sensing region (not shown) included in the display regions 110A and 110D.

[0063] In an embodiment, connector hole 108 may accommodate a connector. Connector hole 108 may be disposed in a side surface 110C of housing 110. For example, connector hole 108 may be disposed in side surface 110C so as to be adjacent to at least a portion of an audio module (e.g., microphone hole 103 and speaker hole 107). In an embodiment, electronic device 100 may include a first connector hole 108 accommodating a connector (e.g., a USB connector) for transmitting / receiving power and / or data with an external electronic device, and / or a second connector hole (not shown) accommodating a connector (e.g., a headphone jack) for transmitting / receiving audio signals with an external electronic device.

[0064] In an embodiment, the electronic device 100 may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface 110A of the housing 110. The light-emitting element (not shown) may provide status information of the electronic device 100 in the form of light. In an embodiment, the light-emitting element (not shown) may provide a light source that operates in conjunction with the operation of the camera module 105. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0065] In an embodiment, camera modules 105, 112, and 113 may include a first camera module 105 (e.g., an under-display camera) configured to receive light through a camera region on a first surface 110A of the electronic device 100, a second camera module 112 exposed on a second surface 110B, and a flash 113.

[0066] Figure 2a This is an exploded perspective view of an electronic device according to various embodiments. Figure 2b This is a view showing the rear side of an electronic device according to various embodiments. Figure 2b From Figure 2a The view of the back panel 180 is omitted in the electronic device shown.

[0067] Reference Figure 2a and Figure 2b The electronic device 100 may include a back panel 180, support members 161 and 162 (e.g., a rear shell), a battery 145, a first circuit board 151, a second circuit board 152, a first flexible substrate 210, a second flexible substrate 220, a third flexible substrate 291, a fourth flexible substrate 292, a housing 140 (e.g., a front shell), and a display module 130 (e.g., Figure 1a (Display 101). In embodiments, electronic device 100 may not include at least one of the aforementioned components, or may additionally include one or more other components. At least one of the components of electronic device 100 may be associated with... Figure 1a and Figure 1b At least one of the components of the electronic device 100 is the same or similar, and the same description may be omitted here.

[0068] In embodiments, housing 140 may include a plate structure (e.g., a plate) 142 and a frame structure (e.g., a frame) 141. Plate structure 142 may have a first circuit board 151, a second circuit board 152, a camera module 112, and a battery 145 disposed on one surface thereon. Plate structure 142 may have a display module 130 disposed on its opposite surface. Frame structure 141 may surround plate structure 142. In various embodiments, plate structure 142 and frame structure 141 may be integrally formed with each other, or may be detachably connected to each other as separate structures. Frame structure 141 may form part of the surface of electronic device 100 (e.g., a side surface). In various embodiments, frame structure 141, display module 130, and backplate 180 may form housing (e.g., a plate) 142. Figure 1a and Figure 1b (shell 110).

[0069] In this embodiment, a first circuit board 151 and a second circuit board 152 may be disposed on a plate structure 142 of the housing 140. The first circuit board 151 may be located near the camera module 112. The first circuit board 151 and the second circuit board 152 may be configured to have a battery 145 therebetween. The second circuit board 152 may have an external interface module disposed thereon.

[0070] In one embodiment, the first circuit board 151 may have a processor disposed thereon. The processor may be electrically connected to a display driver IC 219 disposed on the first flexible substrate 210 via a first flexible substrate 210 and a second flexible substrate 220. In various embodiments, the processor and / or the display driver IC 219 may drive the display module 130.

[0071] In an embodiment, the third flexible substrate 291 and the fourth flexible substrate 292 may be electrically connected to the first circuit board 151 and the second circuit board 152. At least a portion of the third flexible substrate 291 and at least a portion of the fourth flexible substrate 292 may extend into the space between the battery 145 and the backplate 180.

[0072] In embodiments, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect the electronic device 100 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. In embodiments, the interface may be located on a second circuit board 152.

[0073] In an embodiment, battery 145 can supply power to at least one component of electronic device 100. For example, battery 145 may include a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. In an embodiment, at least a portion of battery 145 may be disposed on a plane substantially the same as the first circuit board 151 and the second circuit board 152. In an embodiment, battery 145 may be integrally disposed within electronic device 100, or may be configured to be removable from electronic device 100.

[0074] In an embodiment, the display module 130 may form at least a portion of the surface (e.g., the front surface) of the electronic device 100. The display module 130 may include multiple layers. A portion of the multiple layers may include a front panel forming the surface of the electronic device 100. The display module 130 may be electrically connected to the first circuit board 151 via a first flexible substrate 210 and a second flexible substrate 220. For example, the first flexible substrate 210 may extend to a second surface 142b of the board structure 142 via an opening region 143 formed in the board structure 142, and may be connected to the second flexible substrate 220.

[0075] In one embodiment, the first flexible substrate 210 may extend from the edge of the display module 130. For example, the first flexible substrate 210 may include a layer extending from at least one of a plurality of layers included in the display module 130. In one embodiment, at least a portion of the first flexible substrate 210 may be formed to be flexible. In one embodiment, electrical components associated with driving the display module 130 may be disposed on the first flexible substrate 210. For example, a display driver IC 219 may be disposed on the first flexible substrate 210. In one embodiment, the first flexible substrate 210 may extend to the second surface 142b of the plate structure 142 through an opening region 143 formed in the plate structure 142. For example, at least a portion of the first flexible substrate 210 may be located in the opening region 143. The first flexible substrate 210 may be connected to the second flexible substrate 220 on the second surface 142b of the plate structure 142.

[0076] In one embodiment, the second flexible substrate 220 may extend from the first circuit board 151 across the battery 145. For example, the second flexible substrate 220 may connect the first circuit board 151 located on one side of the battery 145 and the first flexible substrate 210 located on the opposite side of the battery 145. The first flexible substrate 210 and the second flexible substrate 220 may be fastened to each other on the opposite side of the battery 145.

[0077] Figure 3 This is a perspective view showing a first flexible substrate and a second flexible substrate of an electronic device according to various embodiments.

[0078] Reference Figure 3 The electronic device 100 may include a battery frame 148 surrounding the battery 145 and a first connector for securing the first flexible substrate 210 (e.g., Figure 4 The first connector 214) and the second connector of the second flexible substrate 220 (e.g., Figure 4 The second connector 224) has a support structure 230. The battery frame 148 can be formed on the second surface 142b of the plate structure 142 and can protrude from the second surface 142b in the -Z axis direction. The opening region 143 can be formed through the region of the plate structure 142 adjacent to the battery frame 148.

[0079] In an embodiment, the first flexible substrate 210 may be exposed on the second surface 142b of the board structure 142 through an opening region 143. For example, at least a portion of the first flexible substrate 210 may be located in the opening region 143. A display driver IC 219 may be disposed on the first flexible substrate 210. The first flexible substrate 210 may include a first connector 214 coupled to a second flexible substrate 220 (e.g., Figure 4 First connector 214).

[0080] In one embodiment, the second flexible substrate 220 may extend from the first circuit board 151 across the battery 145 and the battery frame 148 to the first flexible substrate 210. The second flexible substrate 220 may include a second connector 224 coupled to the first flexible substrate 210 (e.g., ...). Figure 4 The second connector 224).

[0081] In this embodiment, the first flexible substrate 210 and the second flexible substrate 220 can be electrically connected to the display module 130 and the first circuit board 151.

[0082] In one embodiment, the support structure 230 may be fixedly disposed on the plate structure 142. For example, the support structure 230 may include a fixing portion extending from the support structure 230 in opposite directions, and the fixing portion may be received in a recess formed in the plate structure 142. Alternatively, in various embodiments, the support structure 230 may be screwed to the plate structure 142.

[0083] Figure 4 It is a cross-sectional view of an electronic device according to various embodiments.

[0084] In an embodiment, the backplate 180 may include a planar region facing the -Z-axis direction. The display module 130 may include a planar region facing the Z-axis direction. In an embodiment, the battery 145, at least a portion of the first flexible substrate 210, the second flexible substrate 220, and the internal structure 160 may be disposed in the space between the plate structure 142 and the backplate 180. In an embodiment, when viewed in a direction perpendicular to the Z-axis, the first connector 214 of the first flexible substrate 210, the second connector 224 of the second flexible substrate 220, and the support structure 230 may be disposed in the first space S1 between the internal structure 160 and the battery frame 148. In an embodiment, the internal structure 160 may include a support member (e.g., Figure 2a Supporting members 161 and 162). Opening area (e.g., Figure 2a An opening region 143 can be formed in the plate structure 142. The first flexible substrate 210 can extend from the display module 130 through the opening region 143, such that at least a portion of the first flexible substrate 210 is located in the first space S1.

[0085] In an embodiment, the first flexible substrate 210 may include a first region 211 and a second region 212 extending from the first region 211. In an embodiment, the first region 211 and the second region 212 may extend in different directions. For example, the first region 211 and the second region 212 may face directions substantially perpendicular to each other. In an embodiment, the second region 212 may be bent from the first region 211. For example, portions of the first region 211 and / or portions of the second region 212 may be bent. In an embodiment, the first region 211 may extend from the display module 130 and may include a second surface of the plate structure 142 located through an opening region 143 (e.g., Figure 3 The region is located on the second surface 142b of the plate structure 142 or exposed on the second surface 142b of the plate structure 142 through the opening region 143. In an embodiment, the first region 211 may include a region substantially oriented towards the Z-axis direction. In an embodiment, the second region 212 may include a region facing the fourth region 222 of the second flexible substrate 220. For example, the second region 212 may include a direction perpendicular to the Z-axis (e.g., Figure 2a and Figure 2b The second region 212 may include a first rigid element 213 and a first connector 214 in the direction perpendicular to the Z-axis. The first rigid element 213 may be formed of a material with a specified stiffness to increase the strength of the first flexible substrate 210. In various embodiments, the first rigid element 213 may be disposed on the second region 212 of the first flexible substrate 210 facing the first connector 214, with the second region 212 located therebetween. In embodiments, the first connector 214 may be physically coupled to the second connector 224. For example, the first connector 214 may be in a direction perpendicular to the Z-axis (e.g., in the direction perpendicular to the Z-axis). Figure 2a and Figure 2b It is coupled to the second connector 224 in the Y-axis direction.

[0086] refer to Figure 4 A second region 212 of the first flexible substrate 210 can be attached to the battery frame 148. For example, a first rigid element 213 can be attached to the battery frame 148. For example, the first rigid element 213 can be attached to the battery frame 148 via an adhesive member (e.g., double-sided tape). In an embodiment, a first connector 214 of the first flexible substrate 210 and a second connector 224 of the second flexible substrate 220 can be located between the support structure 230 and the battery frame 148. In the illustrated embodiment, the second region 212 of the first flexible substrate 210 can be positioned closer to the battery frame 148 than a fourth region 222 of the second flexible substrate 220.

[0087] In an embodiment, the second flexible substrate 220 may include a third region 221 and a fourth region 222 extending from the third region 221. In an embodiment, the third region 221 and the fourth region 222 may extend in different directions. For example, the third region 221 and the fourth region 222 may face directions substantially perpendicular to each other. In an embodiment, the third region 221 may be bent from the fourth region 222. For example, a portion of the fourth region 222 may be bent. In an embodiment, the third region 221 may be bent from the first circuit board (e.g., Figure 2a and Figure 2b The first circuit board 151 extends from it. In an embodiment, the third region 221 may include a region substantially oriented towards the Z-axis direction. In an embodiment, the fourth region 222 may include a region facing the second region 212 of the first flexible substrate 210. For example, the fourth region 222 may include a direction perpendicular to the Z-axis (e.g., Figure 2a and Figure 2b The fourth region 222 may include a second rigid element 223 and a second connector 224 in the direction perpendicular to the Z-axis. The second rigid element 223 may be formed of a material with a specified stiffness to increase the strength of the second flexible substrate 220. In various embodiments, the second rigid element 223 may be disposed on the fourth region 222 of the second flexible substrate 220 facing the second connector 224, with the fourth region 222 located therebetween. In embodiments, the second connector 224 may be physically coupled to the first connector 214. For example, the second connector 224 may be in a direction perpendicular to the Z-axis (e.g., in the direction perpendicular to the Z-axis). Figure 2a and Figure 2b It is coupled to the first connector 224 in the Y-axis direction.

[0088] Reference Figure 4 The fourth region 222 of the second flexible substrate 220 can be attached to the support structure 230. For example, the second rigid element 223 of the second flexible substrate 220 can be attached to the support structure 230. For example, the second rigid element 223 can be attached to the support structure 230 by means of an adhesive member (e.g., double-sided tape) 261. In an embodiment, the fourth region 222 of the second flexible substrate 220 can be spaced apart from the battery frame 148 by a predetermined gap and can face the battery frame 148. In an embodiment, the support structure 230 may include bent portions 243 and 244 for constraining the position of the second flexible substrate 220. The bent portions 243 and 244 may extend toward the battery frame 148 to surround at least a portion of the second rigid element 223.

[0089] Reference Figure 4 When viewed in the Z-axis direction, the first flexible substrate 210 and the second flexible substrate 220 can at least partially overlap each other. For example, when... Figure 2bAs shown when viewed from the rear (e.g., the -Z-axis direction), the overlapping region A of the first flexible substrate 210 and the second flexible substrate 220 can overlap each other in the Y-axis direction. The overlapping region A can be used to ensure that the first flexible substrate 210 and the second flexible substrate 220 can be bent within the limited internal space of the electronic device 100. For example, when the first flexible substrate 210 and the second flexible substrate 220 are bent with a relatively large curvature, the first flexible substrate 210 and the second flexible substrate 220 may crack. In order to enable the first flexible substrate 210 and the second flexible substrate 220 to bend with a relatively small curvature, the first flexible substrate 210 can be further extended in a first direction (e.g., the Y-axis direction), and the second flexible substrate 220 can be further extended in a second direction opposite to the first direction (e.g., the -Y-axis direction). Therefore, cracks in the first flexible substrate 210 and the second flexible substrate 220 can be reduced.

[0090] Furthermore, the electronic device 100 according to various embodiments can be configured such that the first connector 214 and the second connector 224 will not disengage from each other when an external force (e.g., repulsive force or drop impact of the flexible substrates 210 and 220) is applied. For example, tension (e.g., pulling force in the Y-axis direction) can be applied from the display module 130 to the first flexible substrate 210, and tension (e.g., pulling force in the Y-axis direction) can be applied from the first circuit board 151 to the second flexible substrate 220. Figure 4 In the illustrated embodiment, the first connector 214 and the second connector 224 can be substantially coupled to each other in the tension direction. Therefore, the first connector 214 and the second connector 224 can be securely coupled by tension without disengaging from each other.

[0091] According to various embodiments, the first flexible substrate 210 and the second flexible substrate 220 of the electronic device 100 can be configured such that connectors 214 and 224 are coupled to each other in a direction perpendicular to the Z-axis. That is, the coupling direction of connectors 214 and 224 (e.g., the Y-axis direction) can be aligned with the principal direction of the tension acting on the first flexible substrate 210 and the second flexible substrate 220, thus reducing the risk of damage to connectors 214 and 224 through tension. Furthermore, the first flexible substrate 210 and the second flexible substrate 220 can utilize the space of the electronic device 100 facing the Z-axis direction, thus making more efficient use of limited internal space.

[0092] Figure 5a and Figure 5b This is a view showing a first flexible substrate, a second flexible substrate, and a support structure of an electronic device according to various embodiments. Figure 6 This is an exploded perspective view showing a first flexible substrate, a second flexible substrate, and a support structure of an electronic device according to various embodiments.

[0093] In an embodiment, the support structure 230 may include a first support 240 and a second support 250.

[0094] In one embodiment, the first support 240 may be coupled to the second flexible substrate 220. The first support 240 may also be coupled to the second support 250. For example, the first support 240 may be fixed to the plate structure 142 via the second support 250.

[0095] In an embodiment, the first support 240 may include a first plate 241 facing the second rigid element 223, a hook portion 242 formed at a first edge P1 of the first plate 241, and one or more curved portions 243 formed at the first edge P1 and / or the second edge P2 of the first plate 241.

[0096] In an embodiment, the first plate 241 may be substantially oriented in the Y-axis direction (e.g., towards the direction of the Y-axis). Figure 5a and Figure 5b A flat plate (in the direction of the battery frame 148) is formed. A second rigid element 223 can be attached to the first plate 241 by an adhesive member. In an embodiment, the first plate 241 may be located between the second rigid element 223 of the second flexible substrate 220 and the second plate 251 of the second support 250. In an embodiment, the first edge P1 of the first plate 241 may be closer to the plate structure 142 than the second edge P2 of the first plate 241. For example, the second edge P2 may be located in the -Z axis direction relative to the first edge P1. For example, the first edge P1 and the second edge P2 of the first plate 241 may be edges that are substantially parallel to the X axis direction. In an embodiment, a hook portion 242 may be bent from the first edge P1 of the first plate 241 to surround a portion of the second plate 251 of the second support 250. The hook portion 242 may support the second plate 251 of the second support 250 in the -Z axis direction. In an embodiment, the bent portion 243 may extend from the first edge P1 and the second edge P2 of the first plate 241 in the +Y axis direction and may cover a portion of the second rigid element 223 of the second flexible substrate 220. For example, the first support 240 can be formed in the shape of a "c". For example, the curved portion 243 can be located in the +Z / -Z axis direction relative to the second rigid element 223 of the second flexible substrate 220.

[0097] In an embodiment, the second support 250 may include a second plate 251 facing the first plate 241 of the first support 240 and a fixing portion 252 (e.g., including 2521, 2522) extending from the second plate 251 in the opposite direction and fixing the second support 250 to the plate structure 142. The fixing portion 252 may include extending from the second plate 251 to one side (e.g., Figure 6 The first fixed portion 2521 (on the left side) and the portion extending from the second plate 251 to the opposite side (e.g., Figure 6 The second fixing portion 2522 (on the right side of the first support 240) is shown in the figure. In an embodiment, the second plate 251 may be formed to be substantially flat. For example, the second plate 251 may face a direction substantially perpendicular to the first plate 241 of the first support 240 (e.g., the Y-axis direction). A screw coupling portion 254 may be located between the second plate 251 and the fixing portion 252. In various embodiments, the screw coupling portion 254 is not limited to the position shown in the figures. For example, the screw coupling portion 254 may be located in the -X-axis direction from the first fixing portion 2521 and in the +X-axis direction from the second fixing portion 2522. In an embodiment, the first fixing portion 2521 and the second fixing portion 2522 may be received in a recess 144 formed on the plate structure 142. Each of the first fixing portion 2521 and the second fixing portion 2522 may be formed such that one portion area faces the other portion area in the Y-axis direction. In an embodiment, the first fixing portion 2521 and the second fixing portion 2522 may be fixed in the X-axis and Y-axis directions by being received in the recess 144. In various embodiments, the first fixing portion 2521 and the second fixing portion 2522 may be configured to provide elasticity to the sidewall of the recess 144 and may be fixed in the Z-axis direction. Additionally, in various embodiments, the second bracket 250 may be screwed to the plate structure 142. The second bracket 250 may be fixed to the plate structure 142 via the screw coupling portion 254.

[0098] Figure 7 This is a cross-sectional view showing the support structure of an electronic device according to various embodiments. Figure 8a , Figure 8b and Figure 8c This is a view illustrating the support structure of an electronic device according to various embodiments.

[0099] Reference Figure 7 as well as Figure 8a , Figure 8b and Figure 8c The second support 250 may include a second plate 251 coupled to the first support 240 and a fixing portion 252 coupled to the plate structure 142.

[0100] In an embodiment, each of the fixing portions 252 may include a first portion 252a extending from the second plate 251, a second portion 252b extending from the first portion 252a, and a third portion 252c extending from the second portion 252b and facing the first portion 252a.

[0101] In one embodiment, the first portion 252a and the third portion 252c may be formed to face each other. The second portion 252b may be bent to connect the first portion 252a and the third portion 252c. The first portion 252a, the second portion 252b, and the third portion 252c may be accommodated in a recess 144 of the plate structure 142. The first portion 252a and the third portion 252c may be disposed on the facing sidewalls of the recess 144.

[0102] In one embodiment, the fixing portion 252 can fix the second bracket 250 in the Y-axis direction. For example, the first portion 252a and the third portion 252c can face each other in the Y-axis direction and can contact the sidewall of the recess 144. In another embodiment, the fixing portion 252 can fix the second bracket 250 in the X-axis direction. For example, the second portion 252b can contact the sidewall of the recess 144 in the X-axis direction. Therefore, the fixing portion 252 can be accommodated in the recess 144 and can fix the second bracket 250 in both the X-axis and Y-axis directions.

[0103] Reference Figure 8a , Figure 8b and Figure 8c The fixing portion 252 of the second bracket 250 can be configured to provide additional constraint in the Z-axis direction. For example, the fixing portion 252 can be configured such that the first portion 252 and the third portion 252c provide elastic force against the sidewall of the recess 144. For example, the force can act on the first portion 252a and the third portion 252c in a direction away from each other. For example, the recess 144 can have a first width W1 in the Y-axis direction, and the first portion 252a and the third portion 252c of the fixing portion 252, which are not coupled to the plate structure 142, can be spaced apart from each other by a first gap G1. The first gap G1 can be greater than the first width W1. In an embodiment, the first portion 252a and the third portion 252c of the fixing portion 252 can be located in the recess 144 in a compressed state to move toward each other. Therefore, the third portion 252c can press against the sidewall of the recess 144 in a direction away from the first portion 252a. The second bracket 250 can be more securely fixed by pressing the side wall of the recess 144 by the third part 252c.

[0104] In an embodiment, the fixing portion 252 may further include a fourth portion 252d extending from the third portion 252c. In an embodiment, the fourth portion 252d may be formed obliquely to insert into the recess 144 along the sidewall of the recess 144 when the fixing portion 252 is inserted into the recess 144. For example, the fourth portion 252d may be formed obliquely such that the fixing portion 252 is compressed during insertion into the recess 144. For example, the fourth portion 252d may extend obliquely in the Z-axis direction and in the direction toward the first portion 252a. For example, the fourth portion 252d may extend in the direction in which the fixing portion 252 is inserted into the recess 144 and in the direction toward the first portion 252a.

[0105] In various embodiments, the second bracket 250 can be more securely fixed with screws. The screw coupling portion 254 of the second bracket 250 can be located between the second plate 251 and the fixing portion 252. However, the shape, structure, and coupling relationship of the second bracket 250 of the electronic device 100 according to various embodiments are not limited to those shown in the figures.

[0106] Figure 9a and Figure 9b It is a cross-sectional view of an electronic device according to various embodiments. Figure 9a It is along Figure 5a A cross-sectional view taken from line A-A' of line 5B. Figure 9b It is along Figure 5a A cross-sectional view taken from line B-B' of line 5B.

[0107] In one embodiment, a first region 211 of the first flexible substrate 210 may be disposed on the plate structure 142, and a second region 212 of the first flexible substrate 210 may extend in a direction toward the backplate 180 (e.g., the -Z-axis direction). The second region 212 may extend into the space between the internal structure 160 and the battery frame 148. A first rigid element 213 on the second region 212 may be attached to the battery frame 148. A first connector 214 on the second region 212 may be coupled to a second connector 224 in a direction substantially perpendicular to the Z-axis (e.g., the -Y-axis direction).

[0108] In one embodiment, a third region 221 of the second flexible substrate 220 may be located in the space between the backplate 180 and the battery frame 148, and a fourth region 222 of the second flexible substrate 220 may extend in a direction toward the display module 130 (e.g., the +Z axis direction). The fourth region 222 may extend into the space between the internal structure 160 and the battery frame 148. A second connector 224 on the fourth region 222 may be coupled to a first connector 214 in a direction substantially perpendicular to the Z axis (e.g., the Y axis direction). A second rigid element 223 on the fourth region 222 may be coupled to a first support 240. For example, the second rigid element 223 may be attached to a first plate 241 of the first support 240 via an adhesive member 261.

[0109] Reference Figure 9a The hook portion 242 of the first support 240 may be located on the second plate 251 of the second support 250. For example, the hook portion 242 may be formed around the edge of the second plate 251 of the second support 250. For example, the hook portion 242 may be configured to support the second support 250 in the -Z axis direction.

[0110] Reference Figure 9a and Figure 9b The first curved portion 243 and the second curved portion 244 of the first support 240 may surround at least a portion of the second rigid element 223, such that the second rigid element 223 of the second flexible substrate 220 does not separate from the first support 240. Therefore, separation of the second flexible substrate 220 from the first flexible substrate 210 can be prevented and / or reduced. For example, the first curved portion 243 and the second curved portion 244 may be formed to face each other in the Z-axis direction, and the second rigid element 223 may be disposed between the first curved portion 243 and the second curved portion 244. In various embodiments, one of the first curved portion 243 or the second curved portion 244 may be omitted.

[0111] In the embodiment, reference Figure 9bThe first support 240 can be configured to prevent and / or reduce separation of the second flexible substrate 220. For example, the first plate 241 of the first support 240 and the second flexible substrate 220 can be coupled by an adhesive member 261. The adhesive force of the adhesive member 261 can weaken over a predetermined period of time. Furthermore, for example, a repulsive force can act on the partially bent second flexible substrate 220 to restore the second flexible substrate 220 to a flat state. Due to the weakened adhesive and repulsive forces of the adhesive member 261, the coupling between the second flexible substrate 220 and the first support 240 can be released. For example, the second flexible substrate 220 can be separated from the first support 240 when the adhesive member 261 is peeled off. An electronic device 100 according to various embodiments may include a first support 240 including a first bent portion 243 and a second bent portion 244 surrounding at least a portion of a second rigid element 223 of the second flexible substrate 220, and may prevent and / or reduce the likelihood of separation of the second flexible substrate 220 from the first support 240.

[0112] In the embodiment, reference Figure 9a The first support 240 can be configured not to separate from the second support 250. For example, the first support 240 and the second flexible substrate 220 can be coupled by an adhesive member 261, and the repulsive force of the bent second flexible substrate 220 can act on the first support 240. The repulsive force can separate the first support 240 from the second support 250 fixed to the plate structure 142. To prevent and / or reduce the separation of the first support 240, the first support 240 may include a hook portion 242 surrounding at least a portion of the edge of the second support 250. For example, the hook portion 242 may be formed in the direction resisting the separation of the first support 240. For example, the first support 240 may move in the -Z-axis direction by the repulsive force of the second flexible substrate 220, and to prevent and / or reduce the movement of the first support 240, the hook portion 242 may be formed around at least a portion of the edge of the second support 250 facing the +Z-axis direction. Therefore, when the repulsive force acts on the first support 240, the hook portion 242 can prevent and / or reduce the separation of the first support 240 from the second support 250.

[0113] The shape and coupling structure of the first bracket 240 and the second bracket 250 of the electronic device 100 according to various embodiments are not limited to... Figure 9a and Figure 9b Those shown in the image.

[0114] Figure 10a This is a perspective view showing an electronic device according to various embodiments. Figure 10b It is a cross-sectional view of an electronic device according to various embodiments. Figure 10b It is along Figure 10aA cross-sectional view taken by line A-A'. In the description Figure 10a and Figure 10b At that time, it is not necessary to repeat the information about... Figure 9a and Figure 9b The embodiments shown are repeated descriptions that are the same or similar.

[0115] The repulsive forces of flexible substrates 210 and 220 can be related to the thickness of the substrates and the curvature of the bent portion. For example, when the thickness of flexible substrates 210 and 220 is small, the repulsive forces of flexible substrates 210 and 220 can be relatively small. For example, as the length of the bent portion increases, the curvature of the bent portion can decrease, and the repulsive forces of flexible substrates 210 and 220 can decrease. (Refer to the above text) Figure 4 As described above, when the first flexible substrate 210 and the second flexible substrate 220 have a large repulsive force, a portion of the first flexible substrate 210 and the second flexible substrate 220 (e.g., Figure 4 The overlapping regions A) can overlap each other to provide a length sufficient to bend the first flexible substrate 210 and the second flexible substrate 220.

[0116] according to Figure 10a and Figure 10b In the illustrated embodiment, the electronic device 100 may include a second flexible substrate 220 having relatively small repulsive forces. For example, Figure 10a and Figure 10b The second flexible substrate 220 shown can have a higher density than... Figure 9a and Figure 9b The second flexible substrate 220 shown has a small repulsive force. For example, the adhesive member 261 can provide sufficient adhesive force to attach the first support 240 and the second flexible substrate 220. In this case, the first bent portion 243 and the second bent portion 244 of the first support 240 can be omitted.

[0117] In various embodiments, depending on the properties of the second flexible substrate 220 (e.g., thickness and curvature), the hook portion 242 and / or the bent portions 243 and 244 of the first support 240 may be omitted.

[0118] Figure 11 It is a cross-sectional view of an electronic device according to various embodiments. Figure 12 This is a cross-sectional view of an electronic device according to various embodiments. (and) Figure 4 The examples shown are different, in Figure 11 and Figure 12 In the embodiment shown, the first flexible substrate and the second flexible substrate may not overlap each other.

[0119] Refer again Figure 4In the illustrated embodiment, the first flexible substrate 210 and the second flexible substrate 220 can be configured such that when viewed in the Z-axis direction (e.g., when viewed from above the back panel 180), certain areas (e.g., Figure 4 The overlapping regions A) overlap each other in the limited space between the battery frame 148 and the internal structure 160 to ensure sufficient length for bending of the first flexible substrate 210 and the second flexible substrate 220. However, it is not limited to... Figure 4 As shown, depending on the properties of the flexible substrates 210 and 220 and / or the size of the space in which the flexible substrates 210 and 220 can be bent, the electronic device 100 according to various embodiments may include various structures.

[0120] For example, refer to Figure 11 and Figure 12 The first flexible substrate 210 and the second flexible substrate 220 can be configured to not overlap each other in the Z-axis direction. For example, when the first flexible substrate 210 and the second flexible substrate 220 have relatively small thicknesses or the space between the battery frame 148 and the internal structure 160 is relatively wide, the first flexible substrate 210 and the second flexible substrate 220 can be configured to have no overlapping areas.

[0121] Reference Figure 11 and Figure 12 A first region 211 of the first flexible substrate 210 may be disposed on the plate structure 142, and a second region 212 of the first flexible substrate 210 may extend in a direction toward the back plate 180 (e.g., the -Z-axis direction). The second region 212 may extend into the space between the internal structure 160 and the battery frame 148. A first connector 214 on the second region 212 may be coupled to a second connector 224 in a direction substantially perpendicular to the Z-axis. The second region 212 may be spaced apart from the battery frame 148 by a predetermined gap and may face the battery frame 148. In an embodiment, a first rigid element 213 of the first flexible substrate 210 may be attached to a first support 240. The first rigid element 213 may be attached to the first support 240 by an adhesive member 261 (e.g., double-sided tape).

[0122] Reference Figure 11 and Figure 12A third region 221 of the second flexible substrate 220 may be located in the space between the backplate 180 and the battery frame 148, and a fourth region 222 of the second flexible substrate 220 may extend in a direction toward the display module 130 (e.g., the +Z axis direction). The fourth region 222 may extend into the space between the internal structure 160 and the battery frame 148. A second connector 224 on the fourth region 222 may be coupled to the first connector 214 in a direction substantially perpendicular to the Z axis. In an embodiment, a second rigid element 223 on the fourth region 222 may be attached to the battery frame 148.

[0123] In various embodiments, separation of the first flexible substrate 210 from the first support 240 can be prevented and / or reduced by the first bent portion 243 and / or the second bent portion 244 of the first support 240. For example, at least a portion of the first rigid element 213 of the first flexible substrate 210 may be located between the first bent portion 243 and the second bent portion 244.

[0124] In various embodiments (not shown), the first support 240 may include a hook portion surrounding the edge of the second plate 251 of the second support 250 (e.g., Figure 6 Hook portion 242).

[0125] In various embodiments (not shown), the first support 240 may not include the first bent portion 243 and may include only the second bent portion 244. For example, the first rigid element 213 of the first flexible substrate 210 and the first support 240 may be coupled by an adhesive member 261. For example, the repulsive force of the first flexible substrate 210 may act primarily in the +Z axis direction (e.g., the downward direction in the figure). To prevent and / or reduce separation of the first flexible substrate 210 from the first support 240, the first support 240 may include the second bent portion 244. The second bent portion 244 may be formed at the first edge of the first plate 241 of the first support 240 (e.g., Figure 6 The first rigid element 213 of the first flexible substrate 210 can be supported at the first edge P1) and in the -Z axis direction (e.g., the upper direction in the figure).

[0126] The shape and coupling structure of the first bracket 240 and the second bracket 250 of the electronic device 100 according to various embodiments are not limited to those shown in the figures.

[0127] For example, refer to Figure 11The first bent portion 243 and the second bent portion 244 of the first support 240 can be omitted. For example, it can be considered that the first flexible substrate 210 has a relatively small thickness or that sufficient space is ensured for bending the first flexible substrate 210. In this case, the repulsive force of the first flexible substrate 210 can be relatively small. That is, the adhesive member 261 can provide an adhesive force sufficient to firmly couple the first flexible substrate 210 and the first support 240. The adhesive force can correspond to the repulsive force of the first flexible substrate 210. (See reference...) Figure 11 At least one of the first curved portion 243 and / or the second curved portion 244 can be omitted from the first bracket 240. In various embodiments (not shown), the hook portion (e.g., Figure 6 The hook portion 242 can be formed on the first support 240.

[0128] Figure 13a and Figure 13b This is a cross-sectional view showing a first bracket and a second bracket of an electronic device according to various embodiments.

[0129] Reference Figure 13b When viewed in the Z-axis direction, the first support 240 can be located in the opening region 143 formed in the plate structure 142. For example, in order to pass through the opening region 143, the first support 240 can be formed to be smaller than the opening region 143. The first support 240 can be coupled to the second support 250 via the hook portion 242.

[0130] Reference Figure 13a When viewed in the Z-axis direction, the second bracket 250 can extend across the opening region 143 formed in the plate structure 142. For example, the first fixing portion 2521 and the second fixing portion 2522 can be located on one side and opposite sides of the opening region 143. When viewed in the Z-axis direction, at least a portion of the second plate 251 of the second bracket 250 can be located in the opening region 143. For example, when viewed in the X-axis direction, the second bracket 250 can be formed to be larger than the opening region 143.

[0131] An electronic device 100 according to various embodiments may include a support structure 230 for supporting one of two flexible substrates 210 and 220, and the support structure 230 may include two supports 240 and 250. Referring together to the assembly process of FIG14, firstly, a first connector 214 of the first flexible substrate 210 and a second connector 224 of the second flexible substrate 220 may be fastened to each other. The first support 240 may be coupled to a first rigid element 213 of the first flexible substrate 210 or a second rigid element 223 of the second flexible substrate 220. Then, the first flexible substrate 210 and the second flexible substrate 220, together with the first support 240, may pass through an opening region 143 and may be coupled to a board structure 142. Subsequently, the second support 250 may be coupled to the first support 240.

[0132] The first support 240, which is directly coupled to the first rigid element 213 or the second rigid element 223, can be formed to be small enough that the first support 240 can pass through the opening region 143, and the second support 250 can be formed to be larger than the opening region 143, such that the second support 250 includes fixing portions 2521 and 2522 fixed to the plate structure 142.

[0133] However, the support structure 230 of the electronic device 100 according to various embodiments is not limited to the support structure shown in the figures. For example, the first support 240 and the second support 250 may be integrally formed with each other (e.g., Figure 15 and Figure 17 For example, the opening region 143 can be formed large enough to allow the integral bracket coupled to the first connector 214 and the second connector 224 to pass through the opening region 143 during assembly. For example, as in Figures 15 to 19b In the various embodiments shown, the electronic device 100 may include an integral bracket (e.g., Figures 15 to 19b The integral support has a first support 240 and a second support 250 integrally formed with each other.

[0134] Figure 14a , Figure 14b , Figure 14c , Figure 14d , Figure 14e and Figure 14f This is a view illustrating an example process of assembling an electronic device, including a first flexible substrate, a second flexible substrate, a support structure, and a board structure, according to various embodiments.

[0135] Reference Figure 14a The first support 240 can be coupled to the second flexible substrate 220. For example, the first support 240 can be attached to the second rigid element 223 of the second flexible substrate 220. The second flexible substrate 220 can be in a state where it is not connected to the first circuit board 151.

[0136] Reference Figure 14b Display module (e.g., Figure 4 The display module 130 can be mounted on the board structure 142. A first flexible substrate 210 extending from the display module 130 can pass through the opening region 143 of the board structure 142 and can be coupled to a second flexible substrate 220. A first connector 214 of the first flexible substrate 210 and a second connector 224 of the second flexible substrate 220 can be coupled. As described above, in order to pass through the opening region 143, the first support 240 can be formed to be smaller than the opening region 143.

[0137] Reference Figure 14c The second bracket 250 can be coupled such that the fixing portion 252 is received in the recess 144 of the plate structure 142. The second bracket 250 can be formed to be larger than the opening region 143 to span the opening region 143. Considering the assembly process of the electronic device 100 with limited space, the electronic device 100 according to various embodiments may include a first bracket 240 that can pass through the opening region 143 and a second bracket 250 fixed to the housing 140.

[0138] Reference Figure 14d The second bracket 250 can be coupled to the first bracket 240 via the hook portion 242, and can be fixed to the plate structure 142 via the fixing portion 252. At this time, the second flexible substrate 220 can be connected to the first circuit board 151.

[0139] Reference Figure 14e The screw can be fastened to the screw coupling portion 254 of the second bracket 250, and the second bracket 250 can be additionally fixed to the plate structure 142.

[0140] Reference Figure 14f Internal structure 160 (e.g., Figure 2b The support members 161 and 162 can be configured to cover the first flexible substrate 210.

[0141] However, Figure 14a , Figure 14b , Figure 14c , Figure 14d , Figure 14e and Figure 14f (as referred to below) Figures 14a to 14f An example is shown, and the order in which the first flexible substrate 210, the second flexible substrate 220, and the supports 240 and 250 of the electronic device 100 according to various embodiments are not limited to... Figures 14a to 14f The sequence shown is different. For example, when the opening area 143 is large enough, an integral bracket can be used to perform assembly in a different sequence.

[0142] Figure 15This is a perspective view showing examples of a support for an electronic device according to various embodiments. Figure 16a and Figure 16b It includes various embodiments. Figure 15 The cross-sectional view of the electronic device with the bracket shown. Figure 17 This illustrates various embodiments including Figure 15 A cross-sectional view of an example of an electronic device with a bracket shown.

[0143] Reference Figure 15 The electronic device 100 may include a support 330 coupled to the second flexible substrate 220. Figure 15 , Figure 16a and Figure 16b The bracket 330 shown can be Figure 4 The first bracket 240 and the second bracket 250 shown in Figure 14 are integrally formed together as a single-piece bracket. The bracket 330 may include a plate 331, a fixing portion 332 extending from the plate 331 in opposite directions, and a screw coupling portion 334 screwed to the plate structure 142. The fixing portion 332 and the screw coupling portion 334 are the same as those referenced above. Figure 4 The descriptions in Figure 14 are the same or similar, so redundant descriptions can be avoided.

[0144] In various embodiments, the fixing portions 3321 and 3322 of the bracket 330 can be, for example... Figure 6 Bending in the same direction as shown, or as... Figure 15 It bends in the opposite direction as shown.

[0145] In various embodiments, the first fixing portion 3321 of the bracket 330 may be bent in a different direction than the second fixing portion 3322 of the bracket 330. For example, the first fixing portion 3321 may be bent such that the third region 332c is located in the -Y-axis direction relative to the first region 332a. For example, the second fixing portion 3322 may be bent such that the third region 332c is located in the +Y-axis direction relative to the first region 332a.

[0146] In an embodiment, the first flexible substrate 210 can be bent such that the first region 211 is located in the opening region of the plate structure 142 (e.g., Figure 2aThe second region 212 is coupled to the battery frame 148 within the opening region 143 of the first flexible substrate 210. The second region 212 may include a first rigid element 213 for increasing the strength of the first flexible substrate 210 and a first connector 214 formed on the facing surface of the first rigid element 213. The first connector 214 may be physically coupled to a second connector 224. The first connector 214 and the second connector 224 may be coupled in a direction perpendicular to the Z-axis. The first rigid element 213 may be attached to the battery frame 148 via an adhesive member.

[0147] In one embodiment, the second flexible substrate 220 may extend such that a third region 221 is located in the space between the battery frame 148 and the backplate 180, and a fourth region 222 is spaced apart from the battery frame 148 by a predetermined gap. The fourth region 222 of the second flexible substrate 220 may include a second rigid element 223 for increasing the strength of the second flexible substrate 220 and a second connector 224 formed on the facing surface of the second rigid element 223. The second connector 224 may be physically coupled to a first connector 214. The second connector 224 and the first connector 214 may be coupled in a direction perpendicular to the Z-axis. The second rigid element 223 may be coupled to a bracket 330. For example, the second rigid element 223 may be attached to a plate 331 of the bracket 330 via an adhesive member.

[0148] exist Figure 16a In the illustrated embodiment, the support 330 may include a curved portion 336 extending from the edge of the plate 331. The curved portion 336 may be bent toward the battery frame 148 to surround a portion of the second flexible substrate 220. In an embodiment, the curved portion 336 may surround a portion of the second flexible substrate 220 to prevent and / or reduce the separation of the second flexible substrate 220 from the support 330 due to the repulsive force of the second flexible substrate 220. For example, the curved portion 336 may be referred to as... Figure 9a and Figure 9b The bent portion 243 or 244 of the first bracket 240 shown.

[0149] The support 330 of the electronic device 100 according to various embodiments is not necessarily limited to including the bent portion 336. For example, in the case of a second flexible substrate 220 having relatively small repulsive force, the bent portion 336 may be omitted. For example, as Figure 16b In the illustrated embodiment, the curved portion 336 can be omitted. For example... Figure 9b As shown, the curved portion 336 can extend so that the second rigid element 223 relative to the second flexible substrate 220 is located in the Z-axis direction and the -Z-axis direction.

[0150] Reference Figure 17The bent portion 336 of the bracket 330 can extend from the plate 331 to contact the second rigid element 223. For example, the bent portion 336 can contact the side of the second rigid element 223 facing the -Z axis direction.

[0151] Reference Figure 17 The curved portion 336 can be formed so as not to cover the curved portion of the second flexible substrate 220. For example, when viewed in the +Z axis direction, the curved portion of the second flexible substrate 220 may not be hidden by the curved portion 336. For example, when viewed in the +Z axis direction, the curved portion of the second flexible substrate 220 may be formed so as to only hide at least a portion of the second rigid element 223.

[0152] Reference Figure 17 Unlike the fourth region 222 coupled to the support 330, the curved portion of the second flexible substrate 220 can be formed to be flexible and movable. The movable curved portion may be damaged due to collision with the curved portion 336. To prevent and / or reduce damage to the curved portion, the curved portion 336 may only surround the rigid region fixed to the support 330 (e.g., the second rigid element 223).

[0153] Figure 18 This is a perspective view showing examples of a support for an electronic device according to various embodiments. Figure 19a and Figure 19b According to various embodiments, including Figure 18 The cross-sectional view of the electronic device with the bracket shown. Figure 20 It is a cross-sectional view of an electronic device according to various embodiments.

[0154] Reference Figure 18 , Figure 19a and Figure 19b The electronic device 100 may include a support 340 coupled to the second flexible substrate 220. Figure 18 , Figure 19a and Figure 19b The bracket 340 shown may be excluding Figure 15 The bracket 330 shown is a bracket with a screw coupling portion 334. In an embodiment, the bracket 340 may include a plate 341, a fixing portion 342 extending from the plate 341 in opposite directions, and a curved portion 346 extending from the plate 341. The fixing portion 342 is the same as the one referenced above. Figures 4 to 13b The fixed parts described are the same, therefore their descriptions will be omitted. See the reference above. Figure 15 The bending portion 346 can prevent and / or reduce the separation of the first flexible substrate 210 and the second flexible substrate 220 from the support 340 due to the repulsive forces of the flexible substrates 210 and 220.

[0155] Figure 18, Figure 19a and Figure 19b The bracket 340 shown can be secured in the Z-axis direction via the internal structure 160 of the electronic device 100. For example, the internal structure 160 of the electronic device 100 may include an extension 164 extending into the space between the curved portion 346 of the bracket 340 and the back panel 180. At least a portion of the extension 164 may contact the curved portion 346. The extension 164 may be configured to press the bracket 340 toward the display module 130. Therefore, the bracket 340 can be secured to the plate structure 142 of the electronic device 100 in the Z-axis direction without the need for separate screws.

[0156] In one embodiment, the fourth region 222 of the second flexible substrate 220 may be coupled to the plate 341 of the support 340. For example, the second rigid element 223 included in the fourth region 222 may be attached to the plate 341 by an adhesive member.

[0157] Although not shown, according to various embodiments, the bracket 340 can be fixed in the Z-axis direction by a fixing portion 342 that is pressed into the recess 144. For example, as Figure 13a and Figure 13b As shown, the fixing portion 342 of the bracket 340 can be configured to press the sidewall of the recess 144, and can also be fixed in the Z-axis direction.

[0158] Reference Figure 19a and Figure 19b When viewed along the Z-axis, the first flexible substrate 210 and the second flexible substrate 220 can be configured such that portions of their areas overlap. For example, the support 340 can be coupled to a fourth region 222 of the second flexible substrate 220. However, the electronic device 100 is not necessarily limited to the structure shown. For example, as Figure 20 As shown, the electronic device 100 may include a structure in which a first flexible substrate 210 and a second flexible substrate 220 do not overlap.

[0159] Reference Figure 19b The bent portion 346 of the bracket 340 can extend from the plate 341 to contact the second rigid element 223. For example, the bent portion 346 can contact the side of the second rigid element 223 facing the -Z axis direction.

[0160] Reference Figure 19b The curved portion 346 can be formed so as not to cover the curved portion of the second flexible substrate 220. For example, when viewed in the +Z axis direction, the curved portion of the second flexible substrate 220 may not be hidden by the curved portion 346. For example, when viewed in the +Z axis direction, the curved portion of the second flexible substrate 220 may be formed so as to only hide at least a portion of the second rigid element 223.

[0161] Reference Figure 19b Unlike the fourth region 222 coupled to the support 340, the curved portion of the second flexible substrate 220 can be formed to be flexible and movable. The movable curved portion may be damaged due to collision with the curved portion 346. To prevent and / or reduce damage to the curved portion, the curved portion 346 may only surround the rigid region fixed to the support 340 (e.g., the second rigid element 223).

[0162] Reference Figure 20 The support 340 can be coupled to a second region 212 of the first flexible substrate 210. For example, the plate 341 of the support 340 can be attached to a first rigid element 213 included in the second region 212. Figure 20 The structure shown can be applied to flexible substrates with relatively low repulsive forces. In various embodiments, when sufficient space is formed in which the first flexible substrate 210 and the second flexible substrate 220 can be bent, such as Figure 20 As shown, the fourth region 222 of the second flexible substrate 220 can be attached to the battery frame 148, and the second region 212 of the first flexible substrate 210 can be attached to the support 340.

[0163] Figure 21 It is a cross-sectional view of an electronic device according to various embodiments.

[0164] Figure 21 The bracket 230 shown may include Figures 4 to 13b The support structure shown (e.g., first support 240 and second support 250) or Figures 14 to 15 Figure 19b At least one of the supports 330 or 340 shown (e.g., integrated supports).

[0165] In one embodiment, the first flexible substrate 210 may be configured such that a first region 211 is disposed on the plate structure 142, and a second region 212 extends in a direction toward the backplate 180 (e.g., the -Z-axis direction). The second region 212 may extend into the space between the internal structure 160 and the battery frame 148. A first rigid element 213 on the second region 212 may be attached to the battery frame 148. A first connector 214 on the second region 212 may be coupled to a second connector 224 in a direction substantially perpendicular to the Z-axis.

[0166] In an embodiment, the second flexible substrate 220 may be configured such that a third region 221 is located in the space between the backplate 180 and the battery frame 148, and a fourth region 222 extends in a direction toward the display module 130 (e.g., the +Z axis direction). The fourth region 222 may extend into the space between the internal structure 160 and the battery frame 148. A second connector 224 on the fourth region 222 may be coupled to a first connector 214 in a direction substantially perpendicular to the Z-axis. A second rigid element 223 on the fourth region 222 may be coupled to a bracket 230. For example, the second rigid element 223 may be attached to the bracket 230 by an adhesive member.

[0167] Reference Figure 21 The battery frame 148 may include a protruding portion 149 projecting toward the support 230. For example, the protruding portion 149 may protrude from an edge of the battery frame 148 facing the -Z axis direction. For example, at least a portion of the protruding portion 149 may face the display module 130. For example, a second region 212 of the first flexible substrate 210 may be located between the protruding portion 149 and the display module 130. For example, a first connector 214 and / or a first rigid element 213 of the first flexible substrate 210 may be disposed between the protruding portion 149 and the display module 130.

[0168] Reference Figure 21 The second region 212 of the first flexible substrate 210 can be guided by the protrusion 149 of the battery frame 148. For example, the protrusion 149 can prevent and / or reduce movement of the first flexible substrate 210 due to external impacts or external forces (such as the repulsive force of the second flexible substrate 220). For example, when an external force (e.g., a repulsive force or a drop impact) acts on the first flexible substrate 210 or the adhesive force of the adhesive member is insufficient, the first rigid element 213 of the first flexible substrate 210 can separate from the battery frame 148. At this time, the protrusion 149 of the battery frame 148 can prevent and / or reduce the detachment of the first connector 214 of the first flexible substrate 210 from the second connector 224.

[0169] refer to Figure 21 The protrusion 149 is shown as being integrally formed with the battery frame 148, but is not necessarily limited thereto. For example, the protrusion 149 may include a separate structure coupled to the battery frame 148 by various coupling methods. In this case, the protrusion 149 may comprise a material different from that of the battery frame 148 (e.g., a polymer). For example, various coupling methods may include hook coupling, screw coupling, riveting coupling, bonding, and / or press fitting. For example, the protrusion 149 may be formed by molding metal or plastic onto the battery frame 148. For example, molding may include injection molding, insert molding, compression molding, and / or extrusion molding.

[0170] In various embodiments, in addition to the methods described above, the protruding portion 149 may be formed on or coupled to the battery frame 148 by various assembly and molding methods used in the art.

[0171] In various embodiments, the electronic device 100 may include guiding structures (e.g., guides) for guiding the positioning of the first flexible substrate 210 and / or the second flexible substrate 220. For example, the guiding structure may be configured to support the first rigid element 213 and / or the second rigid element 223 in the +Z / -Z axis direction. For example, the guiding structure may be an insert molded into or coupled to another structure located within the electronic device 100 (e.g., battery frame 148 or internal structure 160).

[0172] An electronic device according to various example embodiments of the present disclosure may include: a housing including a plate, a frame surrounding the plate, and a back plate facing a second surface of the plate and coupled to the frame, the back plate including a planar region facing a first direction; a display module including a display disposed on a first surface of the plate; a battery and a circuit board disposed on a second surface of the plate; a first flexible substrate extending from the display module, the first flexible substrate extending to the second surface of the plate through an opening region of the plate, and a second flexible substrate extending across the battery from the circuit board to the first flexible substrate. The first flexible substrate may include a first region, a second region, and a first connector, at least a portion of the first flexible substrate being located in the opening region, the second region extending from the first region toward the back plate, and the first connector being disposed on the second region. The second flexible substrate may include a third region, a fourth region, and a second connector, at least a portion of the second flexible substrate being located between the battery and the back plate, the fourth region extending from the third region toward the second surface of the plate, and the second connector being disposed on the fourth region. The first flexible substrate and the second flexible substrate may be configured such that the first connector and the second connector are coupled in a second direction different from the first direction.

[0173] In various example embodiments, the first connector can be hidden by the second flexible substrate when the second surface of the board structure is viewed in the first direction.

[0174] In various example embodiments, the second direction may be substantially perpendicular to the first direction.

[0175] In various example embodiments, the electronic device 100 may further include a bracket spaced apart from the battery frame and fixed to a plate, and the battery frame may at least partially surround the battery. One of the second or fourth regions may be disposed on the battery frame, and the other of the second or fourth regions may be coupled to the bracket.

[0176] In various example embodiments, the first region may include a layer extending from at least a portion of the layers included in the display module.

[0177] In various example embodiments, the electronic device may further include a display driver integrated circuit (IC) disposed on a first region of a first flexible substrate, and the display driver IC may be configured to drive a display module.

[0178] In various example embodiments, the bracket can be fixed to one side and the opposite side of the opening area.

[0179] In various example embodiments, the first flexible substrate may include a first rigid element comprising a material having a specified stiffness located on a second region, the second flexible substrate may include a second rigid element comprising a material having a specified stiffness located on a fourth region, and the support may be coupled to the first rigid element or the second rigid element.

[0180] In various example embodiments, the plate may include a recess located around the opening area, and the support may include a fixing portion, at least a portion of which is received in the recess.

[0181] In various example embodiments, the fixing portion may provide elasticity to the sidewall of the recess.

[0182] In various example embodiments, the first flexible substrate may include a first rigid element comprising a material having a specified stiffness located on a second region, the second flexible substrate may include a second rigid element comprising a material having a specified stiffness located on a fourth region, and the support may include a bent portion that is bent to surround a portion of the first rigid element or a portion of the second rigid element.

[0183] In various example embodiments, the support may include a first support and a second support, the first support having a size smaller than the opening region and coupled to a second region or a fourth region, and the second support being fixed across the opening region to a portion surrounding the opening region.

[0184] In various example embodiments, the first support may include a hook that is fastened to the second support.

[0185] An electronic device according to various example embodiments of the present disclosure may include: a board, a display module, a circuit board, a first flexible substrate, and a second flexible substrate. The board includes a first surface, a second surface opposite to the first surface, and an opening region formed through the first and second surfaces. The display module includes a display disposed on the first surface and includes a planar region facing a first direction. The circuit board is disposed on the second surface. The first flexible substrate extends from the display module through the opening region to the second surface and includes a first connector. The second flexible substrate extends from the circuit board and includes a second connector. The first connector and the second connector may be coupled in a direction substantially perpendicular to the first direction.

[0186] In various example embodiments, when the second surface of the plate structure is viewed in a first direction, the first flexible substrate and the second flexible substrate may at least partially overlap each other.

[0187] In various example embodiments, the circuit board may be spaced apart from the opening region in a second direction perpendicular to the first direction, and the second connector may be substantially coupled to the first connector in the second direction.

[0188] In various exemplary embodiments, a battery frame, at least partially surrounding the battery, may be formed on a second surface of the plate. The electronic device may also include a support facing the battery frame and fixed to the plate. At least a portion of a first flexible substrate may be attached to the battery frame, and at least a portion of a second flexible substrate may be attached to the support.

[0189] In various example embodiments, the first flexible substrate may include a first rigid element attached to the battery frame and comprising a material having a specified stiffness, and the second flexible substrate may include a second rigid element attached to the support and comprising a material having a specified stiffness.

[0190] In various example embodiments, the support may include a first support and a second support, with a second rigid element coupled to the first support and the second support hook coupled to the first support and secured to the plate. The second support may include a fixing portion received in a recess disposed on opposite sides of the opening region. The fixing portion may be disposed in the recess in a compressed state to press against the sidewall of the recess 144.

[0191] In various example embodiments, the electronic device may also include a processor disposed on a circuit board and a display driver integrated circuit (IC) disposed on a first flexible substrate. The first flexible substrate and the second flexible substrate may also be electrically connected to the processor and the display driver IC.

[0192] According to various embodiments of this disclosure, an electronic device may include a flexible substrate that is partially bent in the Z-axis direction, thus allowing efficient use of relatively limited internal space. For example, space within the internal space of the electronic device facing the Z-axis can be utilized. Furthermore, the electronic device may include a support structure that mechanically constrains the flexible substrate. Therefore, the shape of the flexible substrate can be specified and can be used for design and control. Additionally, the electronic device may include a flexible substrate and connectors with relatively reduced dimensions. Therefore, the assembly process can be improved and manufacturing costs can be reduced.

[0193] In addition, this disclosure can provide various effects that can be recognized directly or indirectly.

[0194] The various embodiments of this disclosure and the terminology used herein are not intended to limit the technology described herein to specific embodiments, and it should be understood that the various embodiments and terminology include modifications, equivalents, and / or substitutions to the corresponding embodiments described herein. Regarding the description of the drawings, similar components may be labeled by similar reference numerals. Unless otherwise stated, singular terms may include plural forms. In the disclosure herein, expressions such as “A or B,” “at least one of A and / or B,” “A, B, or C,” or “at least one of A, B, and / or C,” etc., may include any and all combinations of one or more of the associated listed items. Expressions such as “first” or “second,” etc., may express their components regardless of their priority or importance and may be used to distinguish one component from another, but do not limit these components. When a component (e.g., a first) is referred to as being “(operably or communicatively) coupled to” or “connected to” another component (e.g., a second), it may be directly coupled to or connected to the other component, or there may be an intermediate component (e.g., a third component).

[0195] Depending on the context, the expression “suitable for or constructed as” as used herein may be used interchangeably with expressions such as “suitable for,” “capable of,” “modified as,” “manufactured as,” “capable of,” or “designed as” in hardware or software. The expression “device constructed as” may refer to a device “capable of” operating with another device or other component. For example, “processor constructed (or configured) to perform A, B, and C” may refer to a dedicated processor (e.g., an embedded processor) for performing the respective operations or a general-purpose processor (e.g., a central processing unit (CPU) or application processor (AP)) that performs the respective operations by executing one or more software programs stored in a memory device.

[0196] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, or any combination thereof, and is used interchangeably with the terms "logic," "logic block," "component," "circuit," etc. A "module" can be the smallest unit of integrated components or a portion thereof, or the smallest unit or a portion thereof for performing one or more functions. A "module" can be implemented mechanically or electronically and can include, for example, known or to be developed application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), and programmable logic devices for performing some operations.

[0197] At least a portion of an apparatus (e.g., its modules or functions) or method (e.g., operation) according to various embodiments can be implemented, for example, by instructions stored in a computer-readable storage medium (e.g., memory) as program modules. When executed by a processor (e.g., a processor), the instructions cause the processor to perform a function corresponding to the instructions. Computer-readable recording media may include hard disks, floppy disks, magnetic media (e.g., magnetic tape), optical media (e.g., optical disc read-only memory (CD-ROM and digital versatile optical disc (DVD), magneto-optical media (e.g., optical floppy disk)), embedded memory, etc. One or more instructions may contain code produced by a compiler or code executable by an interpreter.

[0198] Each component (e.g., a module or program module) according to various embodiments may include a single entity or multiple entities, and a portion of the aforementioned sub-components may be omitted, or additional sub-components may be included. Optionally or additionally, after integration into a single entity, some components (e.g., modules or program modules) may perform the same or similar functions performed by each respective component prior to integration. According to various embodiments, operations performed by modules, program modules, or other components may be performed using sequential, parallel, repetitive, or heuristic methods, or at least a portion of the operations may be performed in a different order or omitted. Optionally, additional operations may be added.

[0199] While this disclosure has been shown and described with reference to various exemplary embodiments, it should be understood that these exemplary embodiments are intended to be illustrative and not restrictive. Those skilled in the art will further understand that various changes in form and detail may be made without departing from the true spirit and full scope of this disclosure, including the appended claims and their equivalents.

Claims

1. An electronic device, comprising: The housing includes a plate, a frame at least partially surrounding the plate, and a back plate facing a second surface of the plate and coupled to the frame, the back plate including a planar region facing a first direction; The display module includes a display disposed on a first surface of the plate; A battery and a circuit board are disposed on the second surface of the board; A first flexible substrate extends from the display module and extends through an opening area of ​​the plate to the second surface of the plate; as well as A second flexible substrate extends across the battery from the circuit board to the first flexible substrate. The first flexible substrate includes a first region facing a direction opposite to the first direction, a second region facing a second direction perpendicular to the first direction, and a first connector. At least a portion of the first region is located in the opening region, the second region extends from the first region toward the backplate, and the first connector is disposed on the second region. The second flexible substrate includes a third region facing a direction opposite to the first direction, a fourth region facing the second direction, and a second connector. At least a portion of the third region is located between the battery and the backplate. The fourth region extends from the third region toward the second surface of the substrate. The second connector is disposed on the fourth region. The first flexible substrate and the second flexible substrate are arranged such that the first connector and the second connector are coupled in the second direction.

2. The electronic device according to claim 1, wherein, When viewed from the second surface of the plate in the first direction, the first connector is hidden by the second flexible substrate.

3. The electronic device according to claim 1, further comprising: A bracket, spaced apart from the battery frame and secured to the plate, the battery frame at least partially surrounding the battery. One of the second region or the fourth region is disposed on the battery frame, and the other of the second region or the fourth region is coupled to the bracket.

4. The electronic device as claimed in claim 1, wherein, The first region includes a layer extending from at least a portion of the layer included in the display module.

5. The electronic device according to claim 1, further comprising: The display driver integrated circuit IC is disposed on the first region of the first flexible substrate. The display driver IC is configured to drive the display module.

6. The electronic device according to claim 3, wherein, The bracket is fixed to one side and the opposite side of the opening area.

7. The electronic device according to claim 3, wherein, The first flexible substrate includes a first rigid element located on the second region, the first rigid element comprising a material having a specified stiffness. The second flexible substrate includes a second rigid element located on the fourth region, the second rigid element comprising a material having a specified stiffness, and The bracket is coupled to either the first rigid element or the second rigid element.

8. The electronic device according to claim 6, wherein, The plate includes a recess located around the opening area, and The bracket includes a fixing part, at least a portion of which is accommodated in the recess.

9. The electronic device according to claim 8, wherein, The fixing portion is configured to provide elasticity to the sidewall of the recess.

10. The electronic device according to claim 6, wherein, The first flexible substrate includes a first rigid element located on the second region, the first rigid element comprising a material having a specified stiffness. The second flexible substrate includes a second rigid element located on the fourth region, the second rigid element comprising a material having a specified stiffness, and The bracket includes a curved portion that is bent to surround a portion of the first rigid element or a portion of the second rigid element.

11. The electronic device according to claim 6, wherein, The bracket includes a first bracket and a second bracket, the first bracket being smaller than the size of the opening area and coupled to the second area or the fourth area, and the second bracket being fixed across the opening area to a portion surrounding the opening area.

12. The electronic device according to claim 11, wherein, The first bracket includes a hook portion that is fastened to the second bracket.

13. An electronic device, comprising: The plate includes a first surface, a second surface opposite to the first surface, and an opening region formed through the first surface and the second surface; The display module includes a display disposed on the first surface, and the display module includes a planar area facing a first direction; A circuit board is disposed on the second surface; A first flexible substrate extends from the display module to the second surface through the opening region and includes a first region facing a direction opposite to the first direction, a second region facing a second direction perpendicular to the first direction, and a first connector disposed on the second region; as well as A second flexible substrate extends from the circuit board and includes a third region facing a direction opposite to the first direction, a fourth region facing the second direction, and a second connector disposed on the fourth region. The first connector and the second connector are coupled in the second direction.

14. The electronic device according to claim 13, wherein, When viewed from the first direction, the second surface of the plate overlaps at least partially with respect to each other.

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