A high-temperature safe operating area test method and system for a power device

Abstract

This invention provides a method and system for testing the high-temperature safe operating area of ​​power devices, relating to the field of power electronics technology. The method includes: first, obtaining a heating power based on the test thermal resistance, real-time ambient temperature, and desired junction temperature; then, obtaining a heating current based on the heating power and a preset operating voltage; next, matching a test drive voltage in a heating current correspondence table; then, sequentially heating each power device to its corresponding desired junction temperature according to the test drive voltage, operating voltage, and heating time; finally, obtaining the test drive time corresponding to the test drive voltage based on the operating voltage, test inductance, and test current, and performing a high-temperature safe operating area test on each power device heated to the desired junction temperature according to the test drive voltage and test drive time. The advantages are a reasonable arrangement of the test sequence, rapid heating of the power devices before the high-temperature safe operating area test, elimination of the need for heat preservation functions, reduced test steps, and improved test efficiency.

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