Semiconductor element pickup device and its operation control method

Abstract

Disclosed is a semiconductor element pickup device and a method for controlling the operation thereof, which is capable of correcting the accurate lowering height of a vacuum pickup according to various conditions by grasping the motor operation state of the vacuum pickup and judging the lowering height of the vacuum pickup based on the operation state.

Description

Technical Field

[0001] This invention relates to a semiconductor element pickup device and its operation control method, and more specifically, to a scheme for correcting the accurate descent height of the vacuum pickup according to various conditions by knowing the motor operating state of the vacuum pickup and determining the descent height of the vacuum pickup based on the operating state. Background Technology

[0002] Typically, semiconductor devices can be formed on a silicon wafer, which serves as a semiconductor substrate, by repeatedly performing a series of manufacturing processes. The semiconductor devices formed as described above can be manufactured into semiconductor strips made of multiple semiconductor packages through dicing, chip bonding and molding processes.

[0003] Semiconductor strips manufactured in this way can be individualized into multiple semiconductor packages through a cutting and sorting process, and then classified as good or defective. For example, after the semiconductor strips are loaded onto a chuck, they can be individualized into multiple semiconductor packages using a cutting blade. These individualized semiconductor packages can be inspected by a vision module after cleaning and drying. Furthermore, based on the inspection results obtained through the vision module, they can be classified as good or defective.

[0004] Specifically, the semiconductor package can be transferred to good and defective product trays via a buffer stage for performing drying and inspection processes, a flipping stage for flipping the semiconductor package, and a sorting tray. The transfer of the semiconductor package can be performed using a package picker and a vacuum picker. The package picker can be used to simultaneously pick up the individualized semiconductor package and sequentially transfer it to the buffer stage and the tray, while the vacuum picker can be used to individually pick up the semiconductor package and transfer it to the tray.

[0005] During the process of transferring semiconductor packages from a tray stage to a pocket on a pallet using a vacuum pickup, excessive pressure applied by the vacuum pickup to the package may damage it. Conversely, if the pickup is released from its floating position, the package may become suspended and unable to fit properly inside the pocket. Therefore, it is necessary to accurately measure the height of the vacuum pickup.

[0006] As a method for measuring the height of a vacuum pickup, the bottom height is determined when the pickup is lowered while a certain difference in vacuum pressure is generated. The offset is then adjusted and applied as the pickup height during actual mass production startup.

[0007] However, the problem is that since such vacuum pressure contact positions are not the actual contact surfaces of semiconductor packages, the offset is set based on the manager's experience, making it impossible to accurately set the height of the vacuum pickup.

[0008] (Patent Document 0001) Korean Patent Registration Publication No. 10-2096567

[0009] (Patent Document 0002) Korean Patent Publication No. 10-2020-0065621 Summary of the Invention

[0010] The present invention is proposed to solve the problems of the prior art as described above, and its object is to solve the problem of damage during the picking up of semiconductor packages by correcting the accurate height of the vacuum pickup in the semiconductor component pickup device for transferring semiconductor packages, and to solve the problem of not being able to properly place the semiconductor package in the tray pocket.

[0011] In particular, its purpose is to solve the following problem: In the past, the method of determining the height by measuring the internal vacuum pressure of the vacuum pickup was not the actual contact surface of the semiconductor package. Therefore, the offset was set according to the manager's experience value, which made it impossible to accurately set the descent height of the vacuum pickup.

[0012] The purpose of this invention is not limited to what has been stated above, and other purposes and advantages of the invention not mentioned here may be understood from the following description.

[0013] One embodiment of the operation control method for the semiconductor element pickup device according to the present invention includes: a vacuum pickup descent step, in which the motor of the vertical drive unit is driven toward the semiconductor element, thereby causing the vacuum pickup to descend; a contact height determination step, in which the working state related to the motor of the vertical drive unit is monitored by an encoder, and the working setting value of the motor and the measured value of the encoder are compared to determine whether the vacuum pickup has made contact with the semiconductor element; and a height setting step, in which the height at the time point at which the vacuum pickup is determined to have made contact with the semiconductor element is set as the descent height of the vacuum pickup for the semiconductor element.

[0014] Preferably, in the height setting step, an offset distance is added to the height at the point where the vacuum pickup contacts the semiconductor element, thereby setting the descent height of the vacuum pickup to the semiconductor element.

[0015] More preferably, during the vacuum pickup descent step, the motor of the vertical drive unit can be moved in a stepping motion without applying vacuum pressure to the vacuum pickup.

[0016] Furthermore, in the contact height determination step, the descent measurement value of the vacuum pickup obtained by the position sensing sensor that measures the descent degree of the vacuum pickup can also be considered to determine whether the vacuum pickup is in contact with the semiconductor element.

[0017] As an example, in the contact height determination step, a reader can be used to identify the linear scale display section located on the outside of the vacuum pickup, thereby determining the degree of descent of the vacuum pickup.

[0018] Preferably, in the height setting step, the descent height of the vacuum pickup relative to the semiconductor element is set by taking into account the change in the elastic component disposed on the vacuum pickup based on the change in the degree of descent of the vacuum pickup.

[0019] As an example, in the contact height determination step, a comparison between the torque measurement and the torque setting related to the motor of the vertical drive unit may also be considered to determine whether the vacuum pickup is in contact with the semiconductor element.

[0020] As an example, in the contact height determination step, a comparison between the load measurement and the load setting related to the motor of the vertical drive unit may also be considered to determine whether the vacuum pickup is in contact with the semiconductor element.

[0021] Furthermore, in the vacuum pickup descent step, the vacuum pickup is lowered toward the semiconductor element placed on the tray, and in the height setting step, the descent height of the vacuum pickup toward the semiconductor element on the tray is set.

[0022] Alternatively, in the vacuum pickup descent step, the vacuum pickup is lowered toward the semiconductor element placed in the pocket of the tray, and in the height setting step, the descent height of the vacuum pickup toward the semiconductor element in the pocket of the tray is set.

[0023] Alternatively, one embodiment of the semiconductor element pickup device according to the present invention may include: a vacuum pickup for adsorbing and transferring semiconductor elements using vacuum pressure; a vertical drive unit for raising and lowering the vacuum pickup; and a control unit for monitoring the operating status related to the motor of the vertical drive unit via an encoder, determining whether the vacuum pickup is in contact with the semiconductor element, thereby setting the descent height of the vacuum pickup relative to the semiconductor element.

[0024] Preferably, the control unit may include: a vacuum control unit for controlling the vacuum pressure of the vacuum pickup; a pickup height control unit for controlling the vertical drive unit to adjust the height of the vacuum pickup; and a pickup height determination unit for determining whether the vacuum pickup is in contact with the semiconductor element while monitoring the operating status of the motor of the vertical drive unit through an encoder, thereby setting the descent height of the vacuum pickup relative to the semiconductor element.

[0025] Furthermore, the pickup height determination unit may add an offset distance to the height at which the vacuum pickup contacts the semiconductor element, thereby setting the descent height of the vacuum pickup to the semiconductor element.

[0026] As an example, the semiconductor element pickup device may further include: a position sensing sensor to measure the degree of descent of the vacuum pickup, and the pickup height determination unit may also consider the descent measurement value of the vacuum pickup obtained by the position sensing sensor to determine whether the vacuum pickup is in contact with the semiconductor element.

[0027] Here, the position sensing sensor may include: a linear scale display unit disposed on the outside of the vacuum pickup; and a reader for identifying the linear scale display unit.

[0028] As an example, the semiconductor element pickup device may further include: a torque meter that measures the torque related to the motor of the vertical drive unit, and the pickup height determination unit further considers the comparison between the measured torque and the torque setting related to the motor of the vertical drive unit, thereby determining whether the vacuum pickup is in contact with the semiconductor element.

[0029] As an example, the semiconductor element pickup device may further include: a load measuring instrument that measures the load related to the motor of the vertical drive unit, and the pickup height determination unit further considers the comparison between the measured load related to the motor of the vertical drive unit and the load setting, thereby determining whether the vacuum pickup is in contact with the semiconductor element.

[0030] As an example, the vacuum pickup may include: a chuck for adsorbing a semiconductor element using vacuum pressure; and an elastic member for absorbing impacts applied to the chuck, wherein the pickup height determination unit considers the amount of change of the elastic member disposed in the vacuum pickup, thereby setting the descent height of the vacuum pickup for the semiconductor element.

[0031] Furthermore, the vacuum pickup can transfer semiconductor components from a tray containing semiconductor components that have undergone cleaning and drying processes to a tray with pockets for storing semiconductor components that have undergone video inspection, and the control unit sets the descent height of the vacuum pickup on the tray or the semiconductor components on the tray.

[0032] Furthermore, the operation control method of the semiconductor component pickup device according to the present invention may include: a vacuum pickup descent step, wherein, in a state where no vacuum pressure is applied to the vacuum pickup, the motor of the vertical drive unit is moved stepwise toward the semiconductor component placed on the tray or the semiconductor component placed in the pocket of the tray, thereby causing the vacuum pickup to descend; a contact height determination step, wherein, by monitoring the operating state related to the motor of the vertical drive unit through an encoder, based on the encoder measurement result comparing the operating setting value of the motor and the measurement value of the encoder and the sensor measurement result measuring the degree of descent of the vacuum pickup by identifying the linear scale display unit located on the outside of the vacuum pickup with a reader, taking into account the amount of change of the elastic member disposed on the vacuum pickup, thereby determining whether the vacuum pickup has contacted the semiconductor component; and a height setting step, wherein an offset distance is added to the height at the time point at which the vacuum pickup is determined to be in contact with the semiconductor component, thereby setting the descent height of the vacuum pickup for the semiconductor component on the tray or the semiconductor component on the tray.

[0033] According to the present invention as described above, by calibrating the accurate height of the vacuum pickup in the semiconductor element pickup device for transferring semiconductor elements, it is possible to accurately place the semiconductor element into the pocket of the tray without damaging the semiconductor element during pickup.

[0034] The effects of the present invention are not limited to those mentioned above. Other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0035] Figure 1 A schematic structural diagram is shown for a semiconductor package cutting and sorting apparatus to which the present invention can be applied.

[0036] Figure 2An embodiment of a semiconductor element pickup device according to the present invention is shown.

[0037] Figure 3 A structural diagram is shown for one embodiment of a control unit for a semiconductor element pickup device according to the present invention.

[0038] Figure 4 An example of encoder measurements based on the motor's operating state is shown in this invention.

[0039] Figure 5 A diagram showing the operation of a semiconductor element pickup device according to the present invention, which includes a flexible component.

[0040] Figure 6 Another embodiment of the semiconductor element pickup device according to the present invention is shown.

[0041] Figure 7 Another embodiment of the semiconductor element pickup device according to the present invention is shown.

[0042] Figure 8 A flowchart is shown for one embodiment of an operational control method for a semiconductor element pickup device according to the present invention.

[0043] Figure 9 An example is shown of determining the contact of the vacuum pickup and setting the descent height in the operation control method of the semiconductor element pickup device according to the present invention.

[0044] Figure 10 Another example is shown in the operation control method of the semiconductor element pickup device according to the present invention, which determines the contact of the vacuum pickup and sets the descent height.

[0045] Figure 11 This illustrates yet another example of determining the contact of the vacuum pickup and setting the descent height in the operation control method of the semiconductor element pickup device according to the present invention.

[0046] (Explanation of reference numerals in the attached diagram)

[0047] 100: Semiconductor Component Pickup Device

[0048] 110: Vacuum pickup

[0049] 114: Clamp

[0050] 116: Elastic component

[0051] 120: Vertical drive unit

[0052] 130: Horizontal drive unit

[0053] 140: Reader

[0054] 141: Linear scale display section

[0055] 150: Control Unit

[0056] 151: Vacuum Control Department

[0057] 153: Pickup unit height control

[0058] 155: Pickup unit height determination section

[0059] 160: Torque measuring instrument

[0060] 170: Load measuring instrument Detailed Implementation

[0061] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or restricted by the embodiments.

[0062] To illustrate the advantages of the present invention and the objectives achieved through its implementation, preferred embodiments of the present invention will be described below with reference to these embodiments.

[0063] First, the terminology used in this application is only for describing specific embodiments and is not intended to limit the scope of the invention. Singular expressions may include plural expressions as long as there is no obvious difference in meaning within the context. Furthermore, it should be understood in this application that terms such as "comprising" or "having" are used to specify the presence of features, numbers, steps, operations, constituent elements, components, or combinations thereof described in the specification, without precluding the possibility of the presence or addition of one or more other features or numbers, steps, operations, constituent elements, components, or combinations thereof.

[0064] When describing this invention, detailed descriptions of related announcement structures or functions are omitted if they are deemed to obscure the key points of the invention.

[0065] This invention proposes a technique for determining the descent height of the vacuum pickup in a semiconductor component pickup device by monitoring the motor's operating status and using that status to calibrate the accurate descent height of the vacuum pickup under various conditions.

[0066] Figure 1 A schematic structural diagram is shown for a semiconductor package cutting and sorting apparatus to which the present invention can be applied.

[0067] The semiconductor package cutting and sorting equipment 10 can be used to cut semiconductor strips 1 composed of multiple semiconductor packages 2 to individualize the semiconductor packages 2, and after inspecting the individualized semiconductor packages 2, sort them according to the results.

[0068] The semiconductor package cutting and sorting equipment 10 may include: a cutting module 20 for cutting semiconductor strips 1 into individual semiconductor packages 2; and a sorting module 30 for inspecting the semiconductor packages 2 and sorting them according to the inspection results.

[0069] A warehouse 15 containing multiple semiconductor strips can be configured on one side of the semiconductor package cutting and sorting equipment 10.

[0070] In addition, although not shown in detail, it may include a clamp (not shown) for extracting semiconductor strip 1 from warehouse 15, and the semiconductor strip 1 extracted from warehouse 15 may be guided by a guide rail.

[0071] The semiconductor strip 1 can be picked up by the strip picker 25 and transferred to the vacuum chuck 40. The strip picker 25 can be configured to rotate in order to adjust the orientation of the semiconductor strip 1. For example, after picking up the semiconductor strip 1 retrieved from the warehouse 15, the strip picker 25 can rotate the semiconductor strip 1 and then transfer the rotating semiconductor strip 1 to the vacuum chuck 40.

[0072] The vacuum chuck 40 can be supported by the chuck stage 41, which can move the semiconductor strip 1 to the cutting module 20. The cutting module 20 can include a cutting spindle 22 for cutting the semiconductor strip 1, and the chuck stage 41 can move the semiconductor strip 1 below the cutting spindle 22 by an additional drive unit (not shown).

[0073] The individualized semiconductor packages 2 of the cutting module 20 can be picked up and transferred by the package picker 55. The semiconductor package cutting and sorting equipment 10 may include a package transfer unit 50 for moving the package picker 55, and the package transfer unit 50 may include a package picker holder 52 for gripping the package picker 55. For example, the package transfer unit 50 may include an orthogonal coordinate robot for moving the package picker holder 52 in the horizontal and vertical directions.

[0074] The semiconductor package cutting and sorting equipment 10 may include a cleaning unit 60 for cleaning individualized semiconductor packages 2. After the semiconductor package 2 is picked up by the package picker 55, the package transfer unit 50 can move the package picker 55 above the cleaning unit 60, whereby the cleaning unit 60 can remove foreign matter from the semiconductor package 2 using brushes and cleaning fluid. Furthermore, the cleaning unit 60 can dry the semiconductor package 2 by spraying air onto it.

[0075] After the cleaning and drying of the semiconductor package 2 are completed, the package transfer unit 50 can transfer the semiconductor package 2 to the sorting module 30. For example, the sorting module 30 may include a tray 31 for supporting the semiconductor package 2, and the package transfer unit 50 can transfer the semiconductor package 2 onto the tray 31.

[0076] The sorting module 30 may include: a table transfer unit 32 for moving the pallet table 31 in the horizontal direction; and a vision unit 35 disposed above the transfer path of the pallet table 31 and for inspecting the semiconductor package 2 on the pallet table 31.

[0077] The sorting module 30 may include: a tray 71 for storing semiconductor packages 2 that are determined to be good by the vision unit 35; and a container 75 for storing semiconductor packages 2 that are determined to be defective. Additionally, the sorting module 30 may include a tray transfer unit 72 for moving the tray 71.

[0078] The table transfer unit 32 and the tray transfer unit 72 can move the tray table 31 and the tray 71 to the sorting area. The sorting module 30 may include: a chip picker 85 for receiving semiconductor packages 2 into the tray 71 and the container 75; and a chip picker transfer unit 80 for moving the chip picker 85. Additionally, the sorting module 30 may include a tray supply unit 70 for supplying the tray 71.

[0079] The semiconductor component picking device and its operation control method proposed in this invention can be applied to semiconductor package cutting and sorting equipment as described above.

[0080] Hereinafter, the semiconductor component picking device according to the present invention will be applied to the chip picker 85 in the semiconductor package cutting and sorting equipment 10 described above for receiving semiconductor package 2 from the tray 31 of the sorting module 30 into the tray 71 and container 75. However, the invention is not limited thereto and can be appropriately modified to be applied to various process situations for transferring semiconductor packages.

[0081] The semiconductor element pickup device according to the present invention will be described in more detail by way of examples.

[0082] Figure 2 An embodiment of a semiconductor element pickup device according to the present invention is shown.

[0083] The semiconductor elements mentioned below, as materials picked up and transferred by the semiconductor element pickup device, may include semiconductor packages.

[0084] The semiconductor component pickup device 100 may include: a vacuum pickup 110 for picking up semiconductor components using vacuum pressure; a vertical drive unit 120 for moving the vacuum pickup 110 in the vertical direction; and a control unit 150 for controlling the operation of the vacuum pickup 110 and the vertical drive unit 120.

[0085] The vertical drive unit 120 includes a linear motor (not shown) that moves the vacuum pickup 110 up and down in the vertical direction. The operation of the linear motor is controlled by the control unit 150, thereby controlling the lifting and lowering operation of the vacuum pickup 110.

[0086] In addition, the semiconductor component pickup device 100 may include a horizontal drive unit 130 for moving the vacuum pickup unit 110 above the semiconductor component to be picked up, and the operation of the horizontal drive unit 130 may be controlled by the control unit 150.

[0087] The vacuum pickup 110 may include: a pickup body 112, mounted on the vertical drive unit 120; and a chuck 114, connected to the lower part of the pickup body 112, and used for vacuum adsorption of semiconductor components.

[0088] The vacuum pressure applied to the chuck 114 can be controlled by the control unit 150. For example, the control unit 150 may include a vacuum control unit (not shown) that provides vacuum pressure to the vacuum pickup 110 and controls the vacuum pickup 110 by measuring and controlling its internal vacuum pressure.

[0089] Meanwhile, the control unit 150 may include a configuration that measures the operating state of the linear motor of the vertical drive unit 120 and determines the height of the vacuum pickup 110 based on the operating state, thereby enabling control of the lifting and lowering of the vacuum pickup 110.

[0090] Figure 3 A structural diagram is shown for one embodiment of a control unit for a semiconductor element pickup device according to the present invention.

[0091] The control unit 150 of the semiconductor component pickup device 100 may include a vacuum control unit 151, a pickup height control unit 153, a pickup height determination unit 155, etc.

[0092] In addition, the control unit 150 can also control other components provided in the semiconductor element pickup device 100, such as the horizontal drive unit 130.

[0093] The vacuum control unit 151 can supply vacuum pressure to the vacuum pickup 110 while controlling the degree of vacuum pressure. To this end, the vacuum control unit 151 may include: a vacuum pressure supply device for supplying vacuum pressure to the vacuum pickup 110; and a vacuum pressure measuring device for measuring the internal vacuum pressure of the vacuum pickup 110.

[0094] Furthermore, the vacuum control unit 151 can be linked with the pickup height control unit 153 to control the vacuum pressure used by the vacuum pickup 110 to adsorb and pick up semiconductor components or to place semiconductor components at the transfer position.

[0095] The pickup height control unit 153 can control the lifting height of the vacuum pickup 110. For example, by controlling the linear motor of the vertical drive unit 120, the vacuum pickup 110 can be lowered to a specific height or raised to a specific height.

[0096] The pickup height determination unit 155 can set the descent height of the vacuum pickup 110. For example, the pickup height determination unit 155 can set the descent height of the vacuum pickup 110 for placing semiconductor components on the tray table after cleaning and drying processes. In addition, the pickup height determination unit 155 can set the descent height of the vacuum pickup 110 for placing semiconductor components in the pocket of the tray 71 after video inspection.

[0097] In order to set the descent height of the vacuum pickup 110, the pickup height determination unit 155 can monitor the operating status of the linear motor of the vertical drive unit 120 that raises and lowers the vacuum pickup 110 by an encoder, and at the same time determine whether the vacuum pickup 110 is in contact with the semiconductor element, thereby setting the descent height of the vacuum pickup 110.

[0098] In this regard, by reference Figure 4 An example of encoder measurements based on the motor's operating state is shown in the illustration.

[0099] The pickup height control unit 153 can operate the linear motor of the vertical drive unit 120 based on a preset working setting value corresponding to the corresponding position, thereby causing the vacuum pickup 110 to descend. Preferably, the pickup height control unit 153 can make the linear motor of the vertical drive unit 120 move in small steps, thereby achieving precise control.

[0100] The pickup height determination unit 155 can monitor the operating status of the linear motor of the vertical drive unit 120 via an encoder. The pickup height determination unit 155 can determine the contact time point between the vacuum pickup 110 and the semiconductor element by comparing the height change A of the vacuum pickup 110 according to the operating set value and the height change B of the vacuum pickup 110 according to the encoder measurement value, and set the height at the determined contact time point as the descent height of the vacuum pickup 110. For example, while lowering the vacuum pickup 110 according to the operating set value, and comparing the encoder measurement value, the point P where the difference occurs between the operating set value and the encoder measurement value can be set as the descent height of the vacuum pickup 110 at the corresponding position.

[0101] Preferably, the pickup height determination unit 155 can set the descent height of the vacuum pickup 110 by adding an offset distance according to the corresponding position.

[0102] In addition, in this invention, the pickup height determination unit 155 can set the descent height of the vacuum pickup 110 by adding various methods, which will be described through various embodiments.

[0103] If the pickup height determination unit 155 sets the descent height of the vacuum pickup for the semiconductor device at the corresponding position, then the pickup height control unit 153 will apply the descent height of the vacuum pickup set at the corresponding position to the working setting value related to the linear motor of the vertical drive unit 120 during the actual process, thereby enabling the pickup and transfer of the semiconductor device.

[0104] Furthermore, in the vacuum pickup unit of the semiconductor component pickup device, an elastic component for shock absorption can be provided above the chuck. Figure 5 A diagram showing the operation of a semiconductor element pickup device according to the present invention, which includes a flexible component.

[0105] The vacuum pickup 110 may include: a pickup body 112 mounted on a vertical drive unit 120; and a chuck 114 connected to the lower part of the pickup body 112 and used for vacuum adsorption of semiconductor components, and an elastic member 116 may be disposed between the chuck 114 and the pickup body 112.

[0106] As the vacuum pickup 110 descends and the chuck 114 contacts the semiconductor element, the chuck 114 must be in close contact with the semiconductor element 2 to utilize the vacuum pressure of the chuck 114. Therefore, as the chuck 114 contacts the semiconductor element 2, the pickup body 112 descends further, allowing the semiconductor element 2 to adhere tightly to the chuck 114. At this point, an impact may occur when the chuck 114 and semiconductor element 2 are in close contact. The elastic member 116 absorbs the impact applied to the chuck 114 and semiconductor element 2 during this contact, thus preventing complete damage to both the chuck 114 and semiconductor element 2.

[0107] The elastic component 116 can be a coil spring or similar material, or it can be any other component capable of absorbing impact.

[0108] By incorporating an elastic member 116 in the vacuum pickup 110, it is necessary to further precisely measure the degree of compression deformation of the elastic member 116 when the encoder measures the operating state related to the motor of the vertical drive unit 120. That is, as the vacuum pickup 110 descends, after the chuck 114 contacts the semiconductor element 2, the vacuum pickup 110 can descend further due to the deformation of the elastic member 116. When the deformation of the elastic member 116 exceeds a certain level, the load caused by the descent will be applied to the chuck 114 and the semiconductor element 2 without alteration, potentially causing damage. Therefore, it is necessary to further precisely control the descent of the vacuum pickup 110 based on the degree of deformation of the elastic member 116.

[0109] Therefore, the semiconductor element pickup device according to the present invention may further include additional structures for controlling the descent degree of the vacuum pickup, as illustrated by various embodiments of the semiconductor element pickup device according to the present invention.

[0110] Figure 6 as well as Figure 7 Another embodiment of the semiconductor element pickup device according to the present invention is shown.

[0111] The Figure 6 as well as Figure 7 In the embodiments described, the descent of the vacuum pickup can be more accurately determined by considering the degree of deformation of the elastic component when it is applied to a vacuum pickup with an elastic component. However, it can also be applied to a vacuum pickup without an elastic component to further accurately determine the descent of the vacuum pickup.

[0112] The Figure 6 It uses a position sensing sensor to additionally monitor the descent of the vacuum pickup.

[0113] As a position sensing sensor, it can be applied to the linear scale display 145 located on the outside of the vacuum pickup 110 and the reader 140 that identifies the linear scale display 145.

[0114] A linear scale display 145, showing the degree of descent in minute units, can be provided on the outer side of the pickup body 112 of the vacuum pickup 110. Alternatively, the reader 140 can emit light and use reflected light to identify the unit scale of the linear scale display 145 as the vacuum pickup 110 descends. Alternatively, the reader 140 can also identify the unit scale as the vacuum pickup 110 descends by magnifying and photographing the linear scale display 145 with a camera.

[0115] The control unit 150 can determine the degree of descent of the vacuum pickup 110 based on the unit scale of the linear scale display 145 recognized by the reader 140 itself or the amount of change in the unit scale as the descent occurs.

[0116] The Figure 7 It is applicable to use one or both of a torque meter or a load meter to additionally monitor the descent of the vacuum pickup.

[0117] Alternatively, the torque meter 160 measures the amount of torque related to the motor of the vertical drive unit 120, and the control unit 150 compares the torque setting and the measured torque to determine whether the vacuum pickup 110 is in contact with the semiconductor element as it descends.

[0118] Alternatively, the load measuring instrument 170 measures the load applied to the motor of the vertical drive unit 120, and the control unit 150 compares the load setting and the measured load to determine whether the vacuum pickup 110 has made contact with the semiconductor element as it descends. Here, the load can be measured based on the amount of current applied to the motor of the vertical drive unit 120.

[0119] As described above, the semiconductor element pickup device according to the present invention can measure encoder measurement values ​​related to the motor of the vertical drive unit. In addition, the descent height can be measured by a position sensing sensor, or the contact of the vacuum pickup can be determined based on torque measurement and load measurement by a torque meter and a load meter.

[0120] Preferably, various measurement results are additionally reflected based on encoder measurements, thereby allowing the descent height of the vacuum pickup to be set with higher reliability.

[0121] Furthermore, the present invention proposes an operation control method for the semiconductor element pickup device described above. The operation control method for the semiconductor element pickup device according to the present invention will be explained below with reference to the embodiments of the semiconductor element pickup device according to the present invention described above.

[0122] Figure 8 A flowchart is shown for one embodiment of an operational control method for a semiconductor element pickup device according to the present invention.

[0123] Alternatively, when executing a process, the control unit 150 moves the vacuum pickup 110 to a specific position for picking up or placing semiconductor components via the semiconductor component pickup device, and controls the motor of the vertical drive unit 120 to lower the vacuum pickup 110 (S100), while monitoring the degree of descent of the vacuum pickup 110 (S200).

[0124] Here, the degree of descent of the vacuum pickup 110 can be monitored by measuring the operation of the motor of the vertical drive unit 120 using an encoder, by using a position sensing sensor, or by measuring the torque or load of the motor of the vertical drive unit 120.

[0125] Alternatively, the control unit 150 may determine whether the vacuum pickup 110 is in contact with a semiconductor element while lowering the vacuum pickup 110 (S300), and set the height of the point at which the vacuum pickup 110 is determined to be in contact with the semiconductor element as the descent height of the vacuum pickup 110 to the semiconductor element at the corresponding position (S400).

[0126] Alternatively, the control unit 150 can store the descent height of the vacuum pickup 110 according to the corresponding position, and control the vacuum pickup 110 with the set descent height according to the corresponding position when executing the actual process.

[0127] Through various embodiments, the specific process of the operation control method of the semiconductor element pickup device according to the present invention is further illustrated.

[0128] Figure 9 An example is shown of determining the contact of the vacuum pickup and setting the descent height in the operation control method of the semiconductor element pickup device according to the present invention.

[0129] The control unit 150 can move the vacuum pickup 110 to the appropriate position and lower the vacuum pickup 110 in a state where no vacuum pressure is applied to the vacuum pickup 110.

[0130] Preferably, the linear motor of the vertical drive unit 120 can be moved by a small stepping amount, thereby causing the vacuum pickup 110 to descend in stages (S110).

[0131] The control unit 150 can lower the vacuum pickup 110 while measuring the operating status of the linear motor of the vertical drive unit 120 via an encoder (S210).

[0132] In addition, the control unit 150 can compare the working set value related to the linear motor of the vertical drive unit 120 with the encoder measurement value to determine whether there is a difference between the working measurement value and the encoder measurement value, and thus determine the time point when the difference between the working measurement value and the encoder measurement value is at a certain level or above as the contact time point of the vacuum pickup 110 with the semiconductor element at the corresponding position (S310).

[0133] The control unit 150 can set the height at which the contact time of the vacuum pickup 110 is determined to be the descent height of the vacuum pickup 110 to the semiconductor element at the corresponding position. At this time, considering various conditions and processes at the corresponding position, an additional offset can also be added (S410).

[0134] That is, the control unit 150 can add an offset at the height of the vacuum pickup 110 at the corresponding position, thereby setting it as the descent height of the vacuum pickup 110 (S420).

[0135] For example, when setting the descent height for the vacuum pickup 110 to pick up the semiconductor element at the corresponding position, the vacuum pickup 110 needs to be in close contact with the semiconductor element in order to adsorb it. Therefore, an offset with a positive value is added to the height at which the contact time of the vacuum pickup 110 is determined, thereby setting it as the descent height of the vacuum pickup 110.

[0136] Alternatively, when setting the descent height for the vacuum pickup 110 to place the semiconductor element at the corresponding position, a negative offset is added to the height at the contact time point of the vacuum pickup 110, thereby setting it as the descent height of the vacuum pickup 110, so that the vacuum pickup 110 will not descend to the bottom surface and be squeezed while adsorbing the semiconductor element.

[0137] Here, the offset can be set by taking into account various conditions and processes at the corresponding location.

[0138] Figure 10 Another example is shown in the operation control method of the semiconductor element pickup device according to the present invention, which determines the contact of the vacuum pickup and sets the descent height.

[0139] Yes, the semiconductor component pickup device has a position sensing sensor, which monitors the degree of descent of the vacuum pickup to determine whether the vacuum pickup is making contact.

[0140] When the foregoing description applies... Figure 6 When such a semiconductor component pickup device is used, the control unit 150 can use the reader 140 to identify the linear scale display 145 (S220) to monitor the descent of the vacuum pickup 110.

[0141] In particular, for those possessing the characteristics described above Figure 5 The vacuum pickup 110 with such an elastic member 116 can take into account the amount of change in the elastic member 116 due to the contact between the vacuum pickup 110 and the semiconductor element, thereby determining the degree of descent of the vacuum pickup 110 (S330).

[0142] For example, before the vacuum pickup 110 contacts the semiconductor element, the elastic member 116 is not compressed and deformed, so the vacuum pickup 110 descends at a certain speed. In this state, if the linear scale display 145 is identified by the reader 140, no change in the descent speed occurs. Conversely, when the vacuum pickup 110 contacts the semiconductor element and the elastic member 116 is compressed and deformed, the descent speed of the vacuum pickup 110 changes. In this state, if the linear scale display 145 is identified by the reader 140, the change can be identified even when the descent speed decreases.

[0143] Therefore, the control unit 150 considers the amount of change in the elastic component based on the descent measurement value obtained by the position sensing sensor, thereby determining the amount of descent change of the vacuum pickup 110 (S330), and based on this, determining whether the vacuum pickup 110 is in contact with the semiconductor element (S340).

[0144] Furthermore, the control unit 150 can be in the... Figure 9 This embodiment is additionally applied to the previous embodiment, thereby setting the descent height of the vacuum pickup 110 more accurately.

[0145] Figure 11 This illustrates yet another example of determining the contact of the vacuum pickup and setting the descent height in the operation control method of the semiconductor element pickup device according to the present invention.

[0146] The semiconductor component pickup device may include one or more torque meters or load meters, and monitor the torque or load measurement to determine whether the vacuum pickup is in contact.

[0147] When the foregoing description applies... Figure 7 When such a semiconductor element pickup device is used, the control unit 150 can measure the amount of torque or load related to the motor of the vertical drive unit 120 by the torque meter 160 or the load meter 170 (S230), and monitor the degree of descent of the vacuum pickup 110 based on this.

[0148] For as described Figure 5 The vacuum pickup 110 with the elastic member 116 can take into account the change in the elastic member 116 due to the contact between the vacuum pickup 110 and the semiconductor element, and judge the degree of descent of the vacuum pickup 110 based on the torque or load.

[0149] For example, the elastic member 116 is not compressed and deformed before the vacuum pickup 110 contacts the semiconductor element, so the amount of torque or load associated with the motor of the vertical drive unit 120 that lowers the vacuum pickup 110 can be maintained at a certain level.

[0150] Conversely, when the vacuum pickup 110 contacts the semiconductor element and the elastic member 116 is deformed under pressure, the amount of torque or load associated with the motor of the vertical drive unit 120 that lowers the vacuum pickup 110 can change, and its value will gradually increase.

[0151] Therefore, the control unit 150 can compare the measured torque with the set torque, or compare the measured load with the set load (S350), and determine whether the vacuum pickup 110 is in contact with the semiconductor element based on this (S360).

[0152] Here, the torque setting and load setting can be set by taking into account various conditions at the corresponding location, the physical characteristics of the components in the vacuum pickup, the corresponding process, and other factors.

[0153] Furthermore, the control unit 150 can be in the... Figure 9 This embodiment is additionally applied to the previous embodiment, thereby setting the descent height of the vacuum pickup 110 more accurately.

[0154] The above-described operation control method for the semiconductor component pickup device according to the present invention can be applied to setting the descent height of the vacuum pickup during the process of lowering the vacuum pickup to pick up semiconductor components placed on a tray. Alternatively, it can also be applied to setting the descent height of the vacuum pickup to place semiconductor components into a pocket of a tray.

[0155] Furthermore, it can also be said in the above Figure 9 The embodiments also apply the above. Figure 10 The embodiments and the described Figure 11 An example is used to set the descent height of the vacuum pickup.

[0156] With this invention, by calibrating the accurate height of the vacuum pickup in the semiconductor element pickup device for transferring semiconductor elements, the semiconductor elements can be accurately placed into the tray pocket without damaging them during pickup.

[0157] The above description is merely illustrative of the technical concept of the present invention. Anyone skilled in the art can make various modifications and variations without departing from the essential characteristics of the invention. Therefore, the embodiments described in this invention are not intended to limit the technical concept of the invention but rather to illustrate it; the technical concept of the invention is not limited to these embodiments. The scope of protection of this invention should be interpreted by the appended claims, and all technical concepts within the same scope should be interpreted as included within the scope of the claims of this invention.

Claims

1. A method for controlling the operation of a semiconductor element pickup device, characterized in that, include: In the vacuum pickup descent step, the motor of the vertical drive unit is directed toward the semiconductor element, thereby causing the vacuum pickup to descend. The contact height determination step involves monitoring the operating status of the motor related to the vertical drive unit via an encoder, and comparing the height change of the vacuum pickup based on the motor's operating setting value with the height change of the vacuum pickup based on the encoder's measurement value to determine whether the vacuum pickup is in contact with the semiconductor element; and In the height setting step, the height at which the vacuum pickup contacts the semiconductor element is determined is set as the descent height of the vacuum pickup to the semiconductor element.

2. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, In the height setting step, an offset distance is added to the reference height at which the vacuum pickup contacts the semiconductor element, and when the descent height is used to pick up the semiconductor element, an offset with a positive value is added to the reference height, and when the descent height is used to lower the semiconductor element, an offset with a negative value is added to the reference height, thereby setting the descent height of the vacuum pickup for the semiconductor element.

3. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, During the vacuum pickup descent step, the motor of the vertical drive unit is moved in a stepping motion without applying vacuum pressure to the vacuum pickup.

4. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, In the contact height determination step, the descent measurement value of the vacuum pickup obtained by the position sensing sensor that measures the descent degree of the vacuum pickup is also considered to determine whether the vacuum pickup is in contact with the semiconductor element.

5. The operation control method of the semiconductor element pickup device according to claim 4, characterized in that, In the contact height determination step, a reader is used to identify the linear scale display section located on the outside of the vacuum pickup, thereby determining the degree of descent of the vacuum pickup.

6. The operation control method of the semiconductor element pickup device according to claim 5, characterized in that, In the height setting step, the descent height of the vacuum pickup relative to the semiconductor element is set based on the amount of change related to the degree of descent of the vacuum pickup, taking into account the amount of change of the elastic component disposed on the vacuum pickup.

7. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, In the contact height determination step, a comparison is also taken between the torque measurement and the torque setting related to the motor of the vertical drive unit to determine whether the vacuum pickup is in contact with the semiconductor element.

8. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, In the contact height determination step, a comparison is also taken between the load measurement and the load setting related to the motor of the vertical drive unit to determine whether the vacuum pickup is in contact with the semiconductor element.

9. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, During the vacuum pickup descent step, the vacuum pickup is lowered toward the semiconductor device placed on the tray stage. In the height setting step, the descent height of the vacuum pickup relative to the semiconductor element on the tray is set.

10. The operation control method of the semiconductor element pickup device according to claim 1, characterized in that, During the vacuum pickup descent step, the vacuum pickup is lowered toward the semiconductor device placed in the pocket on the tray. In the height setting step, the descent height of the vacuum pickup on the semiconductor element in the pocket of the tray is set.

11. A semiconductor element pickup device, characterized in that, include: Vacuum pickups use vacuum pressure to pick up and transfer semiconductor components; A vertical drive unit causes the vacuum pickup to move up and down; as well as The control unit monitors the operating status of the motor related to the vertical drive unit via an encoder, and compares the height change of the vacuum pickup according to the motor's operating setting value with the height change of the vacuum pickup according to the encoder's measurement value to determine whether the vacuum pickup is in contact with the semiconductor element, thereby setting the descent height of the vacuum pickup to the semiconductor element.

12. The semiconductor device pickup device according to claim 11, characterized in that, The control unit includes: The vacuum control unit controls the vacuum pressure of the vacuum pickup. The pickup height control unit controls the vertical drive unit to adjust the height of the vacuum pickup; and The pickup height determination unit monitors the operating status of the motor related to the vertical drive unit by means of an encoder, and compares the height change of the vacuum pickup according to the operating setting value of the motor with the height change of the vacuum pickup according to the measurement value of the encoder to determine whether the vacuum pickup is in contact with the semiconductor element, thereby setting the descent height of the vacuum pickup to the semiconductor element.

13. The semiconductor element pickup device according to claim 12, characterized in that, The pickup height determination unit adds an offset distance to the reference height at which the vacuum pickup contacts the semiconductor element, and adds a positive offset to the reference height when picking up the semiconductor element at a lowering height, and adds a negative offset to the reference height when placing the semiconductor element at a lowering height, thereby setting the lowering height of the vacuum pickup for the semiconductor element.

14. The semiconductor element pickup device according to claim 12, characterized in that, The semiconductor element pickup device further includes: A position sensing sensor measures the degree of descent of the vacuum pickup. The pickup height determination unit also considers the descent measurement value of the vacuum pickup obtained by the position sensing sensor, thereby determining whether the vacuum pickup is in contact with the semiconductor element.

15. The semiconductor element pickup device according to claim 14, characterized in that, The position sensing sensor includes: A linear scale display is disposed on the outside of the vacuum pickup; and The reader identifies the linear scale display section.

16. The semiconductor element pickup device according to claim 12, characterized in that, The semiconductor element pickup device further includes: A torque measuring instrument is used to measure the torque related to the motor of the vertical drive unit. The pickup height determination unit also considers the comparison between the torque measurement and the torque setting related to the motor of the vertical drive unit, thereby determining whether the vacuum pickup is in contact with the semiconductor element.

17. The semiconductor element pickup device according to claim 12, characterized in that, The semiconductor element pickup device further includes: A load measuring instrument is used to measure the load related to the motor of the vertical drive unit. The pickup height determination unit also considers the comparison between the load measurement and the load setting related to the motor of the vertical drive unit, thereby determining whether the vacuum pickup is in contact with the semiconductor element.

18. The semiconductor element pickup device according to claim 12, characterized in that, The vacuum pickup includes: A chuck that uses vacuum pressure to hold semiconductor components; and The elastic component absorbs the impact applied to the clamp. The pickup height determination unit takes into account the change in the elastic component disposed on the vacuum pickup, thereby setting the descent height of the vacuum pickup for the semiconductor element.

19. The semiconductor element pickup device according to claim 11, characterized in that, The vacuum pickup transfers semiconductor components from a tray containing semiconductor components that have undergone cleaning and drying processes to a tray equipped with pockets for storing semiconductor components that have undergone video inspection. The control unit sets the descent height of the vacuum pickup for the semiconductor components on the pallet or tray.

20. A method for controlling the operation of a semiconductor element pickup device, characterized in that, include: In the vacuum pickup descent step, without applying vacuum pressure to the vacuum pickup, the motor of the vertical drive unit is moved stepwise toward the semiconductor element placed on the tray or the semiconductor element placed in the pocket of the tray, thereby lowering the vacuum pickup. The contact height determination step involves monitoring the operating status of the motor related to the vertical drive unit using an encoder. Based on the encoder measurement results, which compare the height change of the vacuum pickup according to the operating setting value of the motor and the height change of the vacuum pickup according to the encoder measurement value, and the sensor measurement results, which measure the degree of descent of the vacuum pickup by identifying the linear scale display unit located on the outside of the vacuum pickup using a reader, the step takes into account the amount of change of the elastic component disposed on the vacuum pickup, thereby determining whether the vacuum pickup is in contact with the semiconductor element. as well as The height setting step involves adding an offset distance to a reference height at which the vacuum pickup contacts the semiconductor element, and adding a positive offset to the reference height when the semiconductor element is being picked up, and adding a negative offset to the reference height when the semiconductor element is being lowered, thereby setting the lowering height of the vacuum pickup for the semiconductor element on the tray or the semiconductor element on the pallet.

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