A semiconductor packaging device
By designing the dispensing and replication mechanisms in semiconductor packaging equipment, the problem of dispensing adaptability for different wafer models was solved, and synchronous dispensing at multiple dispensing positions was achieved, improving packaging efficiency and accuracy.
CN116110830BActive Publication Date: 2026-05-26SUZHOU HESWAY ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU HESWAY ELECTRONICS CO LTD
- Filing Date
- 2023-03-03
- Publication Date
- 2026-05-26
Smart Images
Figure CN116110830B_ABST
Abstract
This invention belongs to the field of semiconductor packaging, specifically a semiconductor packaging device, including a worktable, a gantry, a wafer body, a prototype wafer, a dispensing mechanism, and a replication mechanism. The gantry is fixedly installed on the upper surface of the worktable. The dispensing mechanism includes a dispensing cylinder and dispensing heads for dispensing adhesive onto the wafer body. The dispensing heads are slidably installed in the inner cavity of the dispensing cylinder, and multiple dispensing heads are evenly distributed within the inner cavity of the dispensing cylinder. The replication mechanism includes a replication cylinder and a pressing head for pressing the prototype wafer. The pressing head is slidably installed in the inner cavity of the replication cylinder, and multiple pressing heads are evenly distributed within the inner cavity of the replication cylinder. The prototype wafer has the same size as the wafer body. Through the cooperation of the above structures, precise and synchronous dispensing can be performed on each dispensing point on the wafer body, and it can adapt to dispensing wafer bodies of different sizes, thus improving its applicability.
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