Side seaming apparatus

Abstract

The application provides a side bonding device, which comprises a base, a support frame arranged on one side of the base, a carrying movement mechanism arranged on the base, a CCD correction mechanism arranged on the support frame and above the side of a workpiece to be bonded, used for correcting the position of the workpiece to be bonded, a COF positioning mechanism arranged on the support frame, a COF alignment mechanism arranged on the base, and a parallel pressure bonding mechanism arranged on the support frame and used for bonding the COF to a bonding position of the workpiece to be bonded. The COF is aligned by the COF positioning mechanism and bonded to the bonding position of the workpiece to be bonded by the parallel pressure bonding mechanism, so that the COF is accurately bonded to the side of the workpiece to be bonded.

Description

Technical Field

[0001] This invention relates to the field of automation equipment technology, and more specifically to a side bonding device. Background Technology

[0002] COF, also known as chip flip-chip, is a chip-on-film packaging technology that fixes driver ICs onto flexible circuit boards. It is a technology that uses a flexible additional circuit board as a chip packaging carrier to bond the chip to the flexible substrate circuit.

[0003] Traditionally, COF (Copper Oxide Foil) is bonded to the glass substrate on the outer side of the front display area (a horizontal bonding connection between the COF and the glass). This traditional front bonding inevitably limits the size of the glass display area. Furthermore, large seams between multiple glass panels negatively impact aesthetics. With advancements in technology, the demand for maximized display areas has increased, leading to the development of borderless and ultra-narrow bezel displays. In large-area displays using multiple glass substrates, the requirement for ultra-fine seams has arisen. The planar bonding between COF and the glass substrate can no longer meet the technical requirements and achieve the desired product features.

[0004] Therefore, it is necessary to develop a side-bonding device to solve the above problems. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a side bonding device for COF and glass substrate. The purpose of this device is to enable the horizontal placement, fixing, and adjustment of the glass substrate, as well as the positioning, fixing, adjustment, and alignment of the COF with the glass substrate for side bonding.

[0006] To achieve the above objectives, the present invention provides a side bonding device, the side bonding device comprising: A base and a support frame located on one side of the base, wherein a bonding station is provided on the base; A support motion mechanism is mounted on the base and is used to support the workpiece to be bonded; The CCD correction mechanism is mounted on the support frame and located above the side of the workpiece to be bonded. It is used to correct the position of the workpiece to be bonded, and after the correction is completed, the bearing motion mechanism drives the corrected workpiece to be bonded to the bonding station. COF positioning mechanism, which is mounted on the support frame, is used to transport the COF adsorbed on the COF positioning mechanism to the bonding position of the workpiece to be bonded. COF alignment mechanism, which is mounted on the base, is used to take pictures and align the workpiece to be bonded and the COF located in the area of ​​the bonding station. A parallel crimping bonding mechanism is mounted on the support frame and is used to bond the COF to the bonding position of the workpiece to be bonded.

[0007] In an optional embodiment, the load-bearing motion mechanism includes: A support base is mounted on the base, and the support base is provided with two parallel first slide rails; The X-axis motion component comprises an X-axis moving component, a first sliding connector, and a first connecting plate. The X-axis moving component is mounted on the bearing base. The first sliding connector is slidably connected to two first slide rails. The first connecting plate is connected to the first sliding connector, and the output end of the X-axis moving component is connected to the first connecting plate. The first connecting plate is provided with two parallel second slide rails. The device comprises a Y-axis moving component, a second sliding connector, and a second connecting plate. The Y-axis moving component is mounted on the first connecting plate. The second sliding connector is slidably connected to two second slide rails. The second connecting plate is connected to the second sliding connector, and the output end of the Y-axis moving component is connected to the second sliding connecting plate. The rotating motion component, the adapter, and the carrying platform are provided. The rotating motion component is mounted on the second connecting plate. The carrying platform is movably connected to the second connecting plate through the adapter. The output end of the rotating motion component is connected to the carrying platform to drive the carrying platform to rotate. The carrying platform is used to carry the workpiece to be bonded.

[0008] In an optional embodiment, the CCD calibration mechanism includes: A first fixing plate is mounted on the support frame; A first mounting plate is mounted on the first fixing plate; CCD correction motor, wherein the CCD correction motor is mounted on the first mounting plate; CCD correction motor mounting plate, wherein the CCD correction motor mounting plate is mounted on the output end of the CCD correction motor; A first adjusting member and a second adjusting member, wherein the first adjusting member is connected to the CCD correction motor mounting plate, and the second adjusting member is movably connected to the side of the first adjusting member facing away from the CCD correction motor mounting plate; CCD calibration component, wherein the CCD calibration component is connected to the second adjustment component; The output end of the CCD correction motor drives the CCD correction motor mounting plate and the first adjustment component to move in a first direction. The first adjustment component drives the second adjustment component and the CCD correction component to move in a second direction. The second adjustment component drives the CCD correction component to move in a third direction. The first direction, the second direction, and the third direction are perpendicular to each other.

[0009] In an optional embodiment, the COF alignment mechanism includes: The second fixing plate is mounted on the base; COF positioning motor, wherein the COF positioning motor is mounted on the second fixing plate; COF alignment motor mounting plate, wherein the COF alignment motor mounting plate is mounted on the output end of the COF alignment motor; The third adjusting member and the fourth adjusting member are connected to the COF alignment motor mounting plate, and the fourth adjusting member is movably connected to the side of the third adjusting member facing away from the COF alignment motor mounting plate. COF alignment member, wherein the COF alignment member is connected to the fourth adjustment member; The output end of the COF alignment motor drives the COF alignment motor mounting plate and the third adjusting member to move in the fourth direction. The third adjusting member drives the fourth adjusting member and the COF alignment member to move in the fifth direction. The fourth adjusting member drives the COF alignment member to move in the sixth direction. The fourth direction, the fifth direction and the sixth direction are perpendicular to each other.

[0010] In an optional embodiment, both the CCD calibration element and the COF alignment element are CCD calibration cameras.

[0011] In an optional embodiment, the COF positioning mechanism includes: Two third slide rails are mounted parallel to each other on the support frame; Two sliding blocks are respectively mounted on the two third slide rails; A third fixing plate and an alignment mounting plate, wherein the third fixing plate is mounted on the two sliding blocks and the alignment mounting plate is mounted on the third fixing plate; A fifth adjusting member and a sixth adjusting member, wherein the fifth adjusting member is connected to the alignment mounting plate, and the sixth adjusting member is movably connected to the side of the fifth adjusting member facing away from the alignment mounting plate; An adsorption element, which is connected to the sixth adjusting element; Among them, the two sliding blocks, the third fixing plate, the alignment mounting plate and the fifth adjusting member move toward the seventh direction, the fifth adjusting member drives the sixth adjusting member and the adsorption member to move toward the eighth direction, the sixth adjusting member drives the adsorption member to move toward the ninth direction, and the seventh direction, the eighth direction and the ninth direction are perpendicular to each other.

[0012] In an optional embodiment, the parallel crimp bonding mechanism includes: A fixed base plate is mounted on the support frame; The device comprises a moving component, two fourth slide rails, and a pressure head mounting base. The moving component is mounted on the fixed base plate, the two fourth slide rails are mounted parallel to each other on the fixed base plate, the pressure head mounting base is slidably connected to the two fourth slide rails, and the output end of the moving component is connected to the pressure head mounting base. A pressure head assembly, which is mounted on the pressure head mounting base, is used to bond the COF to the bonding position of the workpiece to be bonded.

[0013] In an optional embodiment, the parallel crimp bonding mechanism further includes: The first adapter plate and the second adapter plate are respectively installed on opposite sides of the pressure head mounting base; The system comprises a first reel, a second reel, and a buffer belt. The first reel is movably connected to the first adapter plate, the second reel is movably connected to the second adapter plate, and one end of the buffer belt is wound onto the first reel, while the other end of the buffer belt is wound onto the second reel. During the parallel pressing process of the pressing head, the buffer band is positioned between the pressing head and the COF to buffer the parallel pressing action of the pressing head.

[0014] In an optional embodiment, the side bonding device further includes a clamping and positioning mechanism mounted on the support frame; The clamping and positioning mechanism includes: A clamping mounting block is movably connected to the support frame; Two pneumatic components and two clamping blocks are provided. The two pneumatic components are respectively installed at both ends of the clamping block, and the two clamping blocks are respectively installed on the output end of the pneumatic components. A pressure block, wherein the pressure block is installed in the middle region of the clamping mounting block; After the workpiece to be bonded is supported by the bearing motion mechanism, the clamping and positioning mechanism moves to the bearing motion mechanism and clamps the workpiece to be bonded by the two clamping blocks and presses against the workpiece by the clamping blocks.

[0015] In an optional embodiment, the side-bonding device further includes: A control mechanism mounted on the support frame is used to control the operation of the load-bearing motion mechanism, the CCD correction mechanism, the COF alignment mechanism, the COF positioning mechanism, the parallel pressing and bonding mechanism, and the pressing and positioning mechanism. An alarm mechanism is mounted on the support frame and is communicatively connected to the control mechanism.

[0016] This invention provides a side bonding device, comprising a base and a support frame disposed on one side of the base, wherein a bonding station is provided on the base; a carrying motion mechanism mounted on the base for carrying the workpiece to be bonded; a CCD correction mechanism mounted on the support frame and located above and to the side of the workpiece to be bonded for correcting the position of the workpiece to be bonded, and after correction, moving the corrected workpiece to the bonding station via the carrying motion mechanism; a COF positioning mechanism mounted on the support frame for transporting the COF adsorbed on the COF positioning mechanism to the bonding position of the workpiece to be bonded; a COF alignment mechanism mounted on the base for photographing and aligning the workpiece to be bonded and the COF located in the area of ​​the bonding station; and a parallel pressing bonding mechanism mounted on the support frame for bonding the COF to the bonding position of the workpiece to be bonded. The beneficial effects are as follows: by placing the workpiece to be bonded horizontally on the ground on the bearing motion mechanism, and after the position is corrected by the CCD correction mechanism, the bearing motion mechanism drives the corrected workpiece to be bonded to the bonding station. Then, the COF alignment mechanism performs a second correction. At this time, the CCD takes a picture of the side of the glass substrate and leaves a residual image. The COF positioning mechanism performs alignment and the parallel pressing bonding mechanism bonds the COF to the bonding position of the workpiece to be bonded, thereby achieving precise bonding between the COF and the side of the workpiece to be bonded. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or examples of the present invention, the drawings used in the embodiments or examples will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a schematic diagram of the side bonding device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the motion-bearing mechanism according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the CCD calibration mechanism according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the COF positioning mechanism according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the COF alignment mechanism according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the parallel crimp bonding mechanism according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the pressing and positioning mechanism according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the combination of the parallel pressing and bonding mechanism and the load-bearing motion mechanism in an embodiment of the present invention.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0022] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] The present invention provides a side bonding device for performing COF bonding on the side of a horizontally placed workpiece to be bonded, wherein the workpiece to be bonded is a glass substrate.

[0024] In one embodiment, such as Figure 1As shown, the side bonding device includes a base 1000 and a support frame 2000 disposed on one side of the base 1000. A bonding station is provided on the base 1000. A carrying motion mechanism 3000 is mounted on the base 1000 and is used to carry the workpiece to be bonded. A CCD correction mechanism 4000 is mounted on the support frame 2000 and located above and to the side of the workpiece to be bonded. This mechanism corrects the position of the workpiece and, after correction, moves the corrected workpiece to the bonding station via the carrying motion mechanism 3000. Fixed workstation; COF positioning mechanism 5000, which is mounted on the support frame 2000, for transporting the COF adsorbed on the COF positioning mechanism 5000 to the bonding position of the workpiece to be bonded; COF alignment mechanism 6000, which is mounted on the base 1000, for taking pictures and aligning the workpiece to be bonded and the COF located in the area of ​​the bonding workstation; Parallel pressing bonding mechanism 7000, which is mounted on the support frame 2000, for bonding the COF to the bonding position of the workpiece to be bonded.

[0025] In this embodiment, the workpiece to be bonded is placed horizontally on the ground on the bearing motion mechanism 3000, and its position is corrected by the CCD correction mechanism 4000 (the correction can be adjusted manually or automatically). The bearing motion mechanism 3000 then moves the corrected workpiece to the bonding station. A second correction is performed by the COF alignment mechanism 5000. At this time, the CCD takes a picture of the side of the glass substrate, leaving a residual image. The COF positioning mechanism 6000 performs alignment, and the parallel pressing bonding mechanism 7000 bonds the COF to the bonding position of the workpiece to be bonded, thereby achieving precise bonding between the COF and the side of the workpiece.

[0026] It is understood that the COF is horizontally bonded to the side of the workpiece to be bonded, and the side of the workpiece to be bonded has multiple bonding positions. That is, the COF is sequentially bonded to each bonding position of the workpiece to be bonded by the COF positioning mechanism 6000 and the parallel pressing bonding mechanism 7000.

[0027] Optionally, the side of the workpiece to be bonded has 36 bonding positions (the bonding positions are optional), meaning that 36 parallel pressing bonding actions need to be performed by the parallel pressing bonding mechanism 7000. Of course, in other embodiments, the side of the workpiece to be bonded may have other numbers of bonding positions, which is not limited here.

[0028] The bonding station is where the parallel crimping bonding mechanism 7000 bonds the COF to the workpiece to be bonded. For example, during the bonding process of the first bonding position of the workpiece to be bonded, the workpiece to be bonded is transported to the bonding station by the carrying motion mechanism 3000, and the first bonding position of the workpiece to be bonded corresponds to the area of ​​the bonding station. After the first bonding position is completed, the second bonding position of the workpiece to be bonded is transported to the area corresponding to the bonding station by the carrying motion mechanism 3000, and so on, until the bonding work of all bonding positions is completed. That is, this bonding station is not within the protection scope of this application.

[0029] In this embodiment, the workpiece to be bonded is a glass substrate, meaning that the workpiece has three sides that can be used to bond COF. After the COF bonding operation on one side is completed, the COF bonding operation can be performed on another side until the COF bonding operation on all three sides is completed. Here, the number of bonding positions on each side can be the same or different, and there is no limitation on this.

[0030] Furthermore, such as Figure 2As shown, the bearing motion mechanism 3000 includes a bearing base 3100, which is mounted on the base 1000, and has two parallel first slide rails 3200; an X-axis motion component 3300, a first sliding connector 3400, and a first connecting plate 3500. The X-axis motion component 3300 is mounted on the bearing base 3100, the first sliding connector 3400 is slidably connected to the two first slide rails 3200, the first connecting plate 3500 is connected to the first sliding connector 3400, and the output end of the X-axis motion component 3300 is connected to the first sliding connecting plate 3400. The first connecting plate 3500 has two parallel second slide rails 3600; a Y-axis motion component 3700, a second sliding connector 3800, and a first connecting plate 3500. Two connecting plates 3900; the Y-axis moving component 3700 is mounted on the first connecting plate 3500; the second sliding connecting component 3800 is slidably connected to two second slide rails 3600; the second connecting plate 3900 is connected to the second sliding connecting component 3800; and the output end of the Y-axis moving component 3700 is connected to the second connecting plate 3900; a rotating moving component 3010, a connecting component 3020, and a supporting platform 3030 are also included. The rotating moving component 3010 is mounted on the second connecting plate 3900; the supporting platform 3030 is movably connected to the second connecting plate 3900 via the connecting component 3020; and the output end of the rotating moving component 3010 is connected to the supporting platform 3030 to drive the supporting platform 3030 to rotate. The supporting platform 3030 is used to support the workpiece to be bonded.

[0031] Specifically, the support base 3100 is a marble base used to support the support motion mechanism 3000. The support base 3100 is cuboid in shape, and two parallel first slide rails 3200 are provided along its length, allowing the first sliding connector 3400 to slide along the first slide rails 3200 under the drive of the output end of the X-axis moving component 3300. That is, the sliding direction of the first sliding connector 3400 is the same as the length direction of the support base 3100.

[0032] Of course, in other embodiments, the two first slide rails 3200 may also be arranged in parallel in the width direction of the support base 3100, which is not limited here.

[0033] It is understood that the support base 3100 can also be configured in other shapes, and this is not limited here.

[0034] Furthermore, the first sliding connector 3400 includes a plurality of first sliders 3410 and two first connecting blocks 3420. The plurality of first sliders 3410 are slidably connected to the two first slide rails 3200 respectively, and the two first connecting blocks 3420 are connected to the first sliders 3410 disposed on each of the first slide rails 3200, so that the two first connecting blocks 3420 can slide on the two first slide rails 3200 via the first sliders 3410.

[0035] The first connecting plate 3500 is provided with two parallel second slide rails 3600, so that the second sliding connector 3800 can slide on the second slide rails 3600 under the drive of the output end of the Y-axis moving member 3700.

[0036] Furthermore, the second sliding connector 3800 includes a plurality of second sliders 3810 and two second connecting blocks 3820. The plurality of second sliders 3810 are slidably connected to the two second slide rails 3600 respectively, and the two second connecting blocks 3820 are connected to the second sliders 3810 disposed on each of the second slide rails 3600, so that the two second connecting blocks 3820 can slide on the two second slide rails 3600 via the second sliders 3810.

[0037] In this embodiment, the bearing motion mechanism 3000 further includes an abutment block (not shown) mounted on the bearing platform 3030. The output end of the rotating motion component 3010 abuts against the abutment block so that when the rotating motion component 3010 is started, the output end of the rotating motion component 3010 pushes the abutment block to move. At this time, the bearing platform 3030 will rotate, thereby driving the workpiece to be bonded placed on the bearing platform 3030 to rotate.

[0038] Furthermore, such as Figure 3As shown, the CCD calibration mechanism 4000 includes a first fixing plate 4100 mounted on the support frame 2000; a first mounting plate 4200 mounted on the first fixing plate 4100; a CCD calibration motor 4300 mounted on the first mounting plate 4200; a CCD calibration motor mounting plate 4400 mounted on the output end of the CCD calibration motor 4300; a first adjusting member 4500 connected to the CCD calibration motor mounting plate 4400; and a second adjusting member 4600. A CCD calibration component 4700 is movably connected to the side of the first adjusting member 4500 facing away from the CCD calibration motor mounting plate 4400; the CCD calibration component 4700 is connected to the second adjusting member 4600; wherein, the output end of the CCD calibration motor 4300 drives the CCD calibration motor mounting plate 4400 and the first adjusting member 4500 to move in a first direction, the first adjusting member 4500 drives the second adjusting member 4600 and the CCD calibration component 4700 to move in a second direction, and the second adjusting member 4600 drives the CCD calibration component 4700 to move in a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0039] In this embodiment, the first direction, the second direction, and the third direction are the X direction, the Y direction, and the Z direction, respectively. That is, the CCD calibration component 4700 can move in the X direction, the Y direction, and the Z direction under the action of the CCD calibration motor 4300, the first adjustment component 4500, and the second adjustment component 4600. In this way, during the calibration process, the calibration error caused by the calibration blind zone can be avoided, thereby ensuring the bonding accuracy.

[0040] Optionally, the CCD correction component 4700 is a CCD correction camera. That is, the correction principle of the CCD correction mechanism 4000 is as follows: the CCD correction camera captures an image of the workpiece to be bonded, and the rotating motion component 3010 drives the supporting platform 3030 to rotate, thereby adjusting and correcting the position of the workpiece to be bonded. After correction, the X-axis motion component 3300 and the Y-axis motion component 3700 drive the supporting platform 3030 to the bonding station. At this time, the first bonding position of the workpiece to be bonded is located in the area corresponding to the bonding station.

[0041] Furthermore, when the first bonding position of the workpiece to be bonded is in the area corresponding to the bonding station, the COF placed thereon is transported to the bonding position of the workpiece to be bonded by the COF positioning mechanism 5000.

[0042] Specifically, such as Figure 4 As shown, the COF positioning mechanism 5000 includes two third slide rails 5100, which are mounted parallel to each other on the support frame 2000; two sliding blocks 5200, which are respectively mounted on the two third slide rails 5100; a third fixing plate 5300 and an alignment mounting plate 5400, wherein the third fixing plate 5300 is mounted on the two sliding blocks 5200 and the alignment mounting plate 5400 is mounted on the third fixing plate 5300; a fifth adjusting member 5500 and a sixth adjusting member 5600, wherein the fifth adjusting member 5500 is connected to the alignment mounting plate 5400 and the sixth adjusting member 5600 is connected to the third fixing plate 5300. The fifth adjusting member 5500 is movably connected to the side facing away from the alignment mounting plate 5400; the suction member 5700 is connected to the sixth adjusting member 5600; wherein, the two sliding blocks 5200, the third fixing plate 5300, the alignment mounting plate 5400 and the fifth adjusting member 5500 move toward the seventh direction, the fifth adjusting member 5500 drives the sixth adjusting member 5600 and the suction member 5700 to move toward the eighth direction, the sixth adjusting member 5600 drives the suction member 5700 to move toward the ninth direction, and the seventh direction, the eighth direction and the ninth direction are perpendicular to each other.

[0043] That is, COF is adsorbed by the adsorption element 5700 and transported to the bonding position of the workpiece to be bonded. In this embodiment, the seventh direction, the eighth direction, and the ninth direction are the X direction, the Y direction, and the Z direction, respectively. That is, COF can move in the X, Y, and Z directions, thereby avoiding blind spots during the transport of COF and ensuring that COF can be accurately placed at the bonding position of the workpiece to be bonded.

[0044] Optionally, the adsorption element 5700 uses vacuum adsorption to adsorb COF, thereby ensuring that the adsorbed COF is not easily dropped during the transfer process.

[0045] Furthermore, after the COF is transported to the bonding position of the workpiece to be bonded by a motor (the motor drives the COF and the glass to be close enough to be suitable for CCD imaging and side bonding), the COF alignment mechanism 6000 is used to align and correct the positions of the workpiece to be bonded and the COF, thereby improving the bonding accuracy of the COF.

[0046] Specifically, such as Figure 5As shown, the COF alignment mechanism 6000 includes a second fixing plate 6100 mounted on the base 1000; a COF alignment motor 6300 mounted on the second fixing plate 6100; a COF alignment motor mounting plate 6400 mounted on the output end of the COF alignment motor 6300; a third adjusting member 6500 and a fourth adjusting member 6600, the third adjusting member 6500 being connected to the COF alignment motor mounting plate 6400, and the fourth adjusting member 6600 being movably connected to the back of the third adjusting member 6500. To one side of the COF alignment motor mounting plate 6400; COF alignment member 6700, which is connected to the fourth adjustment member 6600; wherein, the output end of the COF alignment motor 6300 drives the COF alignment motor mounting plate 6400 and the third adjustment member 6500 to move in the fourth direction, the third adjustment member 6500 drives the fourth adjustment member 6600 and the COF alignment member 6700 to move in the fifth direction, and the fourth adjustment member 6600 drives the COF alignment member 6700 to move in the sixth direction, wherein the fourth direction, the fifth direction and the sixth direction are perpendicular to each other.

[0047] In this embodiment, the fourth direction, the fifth direction, and the sixth direction are the X direction, the Y direction, and the Z direction, respectively. That is, the COF alignment member 6700 can move in the X, Y, and Z directions under the action of the COF alignment motor 6300, the third adjustment member 6500, and the fourth adjustment member 6600. This avoids the correction error caused by the correction blind zone during the correction process, thereby ensuring the bonding accuracy.

[0048] Optionally, the COF alignment component 6700 is a CCD correction camera. That is, the correction principle of the COF alignment mechanism 6000 is as follows: the CCD correction camera captures images of the positions of the workpiece to be bonded and the COF, and in conjunction with the rotating motion component 3010 driving the support platform 3030 to rotate, thereby adjusting and correcting the position of the workpiece to be bonded, so that the bonding position of the workpiece corresponds perfectly with the position of the COF. The COF alignment component 6700 is equipped with a heat insulation plate 6710 to protect the COF alignment mechanism.

[0049] Furthermore, after the bonding position of the workpiece to be bonded is aligned with the position of the COF, the COF alignment member 6700 moves away from the CCD correction mechanism 6000 through the COF alignment motor 6300. At this time, the COF is bonded to the bonding position of the workpiece to be bonded by the parallel pressing bonding mechanism 7000.

[0050] Specifically, such as Figure 6 As shown, the parallel press-bonding mechanism 7000 includes a fixed base plate 7100, which is horizontally mounted on the support frame 2000; a moving component 7200, two fourth slide rails 7300, and a press head mounting seat 7400. The moving component 7200 is mounted on the fixed base plate 7100, the two fourth slide rails 7300 are mounted parallel to each other on the fixed base plate 7100, the press head mounting seat 7400 is slidably connected to the two fourth slide rails 7300, and the output end of the moving component 7200 is connected to the press head mounting seat 7400; and a press head component 7500, which is mounted on the press head mounting seat 7400 and is used to bond the COF to the bonding position of the workpiece to be bonded.

[0051] Optionally, the moving component 7200 is a motor. That is, the output shaft of the motor drives the pressure head mounting base 7400 and the pressure head component 7500 thereon to move toward the bonding position of the COF or the workpiece to be bonded, so that the COF is bonded to the bonding position of the workpiece to be bonded.

[0052] Furthermore, since the pressure head 7500 in this embodiment is a high-temperature pressure head, that is, it presses the workpiece to be bonded and the COF together by heat conduction and pressure application, in order to reduce the high temperature and pressure generated by the contact between the pressure head 7500 and the COF during the bonding process, in this embodiment, the parallel pressing and bonding mechanism 7000 also includes a first adapter plate 7600 and a second adapter plate 7700, which are respectively mounted on opposite sides of the pressure head mounting base 7400; a first reel 7800, a second reel 7900, and... A buffer belt (not shown) is provided. The first reel 7800 is movably connected to the first adapter plate 7600, and the second reel 7900 is movably connected to the second adapter plate 7700. One end of the buffer belt is wound on the first reel 7800, and the other end is wound on the second reel 7900. During the parallel pressing process of the pressure head 7500, the buffer belt is positioned between the pressure head 7500 and the COF to buffer the parallel pressing action of the pressure head 7500, thereby reducing the high temperature and pressure generated during the parallel pressing process.

[0053] Furthermore, the workpiece to be bonded is placed horizontally on the bearing motion mechanism 3000, parallel to the ground, that is, the workpiece to be bonded is arranged parallel to the base 1000. At this time, the pressure head 7500 is also arranged parallel to the base 1000, i.e. Figure 8As shown, during the parallel pressing (parallel movement with respect to the ground) process of the pressure head 7500, the pressure head 7500 moves toward the side A of the workpiece to be bonded, that is, the pressure head 7500 moves along direction B to bond the COF to the side A of the workpiece to be bonded. Herein, direction B is the horizontal direction.

[0054] Furthermore, after placing the workpiece to be bonded on the support platform 3030, in order to secure the workpiece, as follows: Figure 1 As shown, the side bonding device also includes a glass pressing and positioning mechanism 8000 mounted on the support frame 2000.

[0055] Specifically, in combination Figure 1 and Figure 7 As shown, the clamping and positioning mechanism 8000 includes a clamping mounting block 8100, which is movably connected to the support frame 2000; two pneumatic components 8200 and two clamping blocks 8300, with the two pneumatic components 8200 respectively mounted at both ends of the clamping mounting block 8100 and the two clamping blocks 8300 respectively mounted on the output ends of the pneumatic components 8200; and a pressure block 8400, which has fixed foam (to increase friction, softly contact the glass, and prevent damage to the LCD) mounted in the middle area of ​​the clamping mounting block 8100, and segmented pressure blocks (for multi-sided and multi-sized glass, avoiding the already bonded COF). After the workpiece to be bonded is supported by the carrying motion mechanism 3000, the clamping and positioning mechanism 8000 moves to the carrying motion mechanism 3000 and clamps the workpiece to be bonded by the two clamping blocks 8300 and presses against the workpiece by the pressing block 8400, thereby clamping and positioning the workpiece to be bonded.

[0056] Further, please continue to refer to Figure 1 As shown, the side bonding device also includes a control mechanism 9000 mounted on the support frame 2000. The control mechanism 9000 is used to control the operation of the bearing motion mechanism 3000, the CCD correction mechanism 4000, the COF alignment mechanism 6000, the COF positioning mechanism 5000, the parallel pressing and bonding mechanism 7000, and the pressing and positioning mechanism 8000; and an alarm mechanism 10000, which is mounted on the support frame 2000 and communicatively connected to the control mechanism 9000.

[0057] Optionally, the control mechanism 9000 is an industrial control computer, which serves as the control center of the side bonding machine. The alarm mechanism 10000 is a three-color alarm indicator light. When any of the following mechanisms malfunctions or completes its operation: the bearing motion mechanism 3000, the CCD correction mechanism 4000, the COF alignment mechanism 6000, the COF positioning mechanism 5000, the parallel pressing and bonding mechanism 7000, and the pressing and positioning mechanism 8000, the industrial control computer can issue a warning and trigger an alarm via the three-color alarm indicator light.

[0058] It is understandable that the three-color alarm indicator light can be used to trigger an alarm based on a pre-set mapping table between operation details and alarm combinations; this is not a limitation.

[0059] Furthermore, the working principle of the side bonding device described in this embodiment is as follows: The workpiece to be bonded is placed on the carrying motion mechanism 3000 by an external material handling device. At this time, the clamping and positioning mechanism 8000 moves to the workpiece to be bonded and clamps and positions it. After clamping and positioning, the position of the workpiece to be bonded is corrected by the CCD correction mechanism 4000 in conjunction with the rotating motion component 3010. After correction, the workpiece to be bonded is transported by the X-axis motion component 3300 and the Y-axis motion component 3700, so that the first... The bonding position is located in the area where the bonding station is located; after the workpiece to be bonded is in place, the COF is transported to the bonding position of the workpiece to be bonded by the COF positioning mechanism 5000, and the workpiece to be bonded and the COF in the area where the bonding station is located are photographed and aligned by the COF alignment mechanism 6000; after the alignment is completed, the CCD correction mechanism 6000 is removed, and at this time, the COF is bonded to the first bonding position of the workpiece to be bonded by the parallel pressing bonding mechanism 7000.

[0060] After the first bonding position of the workpiece to be bonded is completed, the parallel pressing bonding mechanism 7000 retracts; at this time, the workpiece to be bonded is transported by the X-axis moving part 3300 and the Y-axis moving part 3700, so that the second bonding position of the workpiece to be bonded is in the area where the bonding station is located, so as to perform the bonding of the second bonding position, and so on, until all bonding positions on this side are bonded.

[0061] After all the bonding positions on this side are bonded, remove the workpiece to be bonded and bond the other unbonded sides of the workpiece to be bonded in the same manner as described above, until all the bonding positions on all three sides of the workpiece to be bonded are bonded.

[0062] In the embodiments provided in this application, the side bonding device includes a base 1000 and a support frame 2000 disposed on one side of the base 1000, wherein a bonding station is provided on the base 1000; a carrying motion mechanism 3000, which is mounted on the base 1000 and is used to carry the workpiece to be bonded; and a CCD correction mechanism 4000, which is mounted on the support frame 2000 and located above and to the side of the workpiece to be bonded, for correcting the position of the workpiece to be bonded, and, after correction, driving the corrected workpiece to be bonded to move through the carrying motion mechanism 3000. The bonding station includes: a COF positioning mechanism 5000, mounted on the support frame 2000, for transporting the COF adsorbed on the COF positioning mechanism 5000 to the bonding position of the workpiece to be bonded; a COF alignment mechanism 6000, mounted on the base 1000, for aligning the workpiece to be bonded and the COF located in the area of ​​the bonding station by taking photographs; and a parallel pressing bonding mechanism 7000, mounted on the support frame 2000, for bonding the COF to the bonding position of the workpiece to be bonded. Specifically, the workpiece to be bonded is placed horizontally on the ground on the bearing motion mechanism 3000, and its position is corrected by the CCD correction mechanism 4000. Then, the bearing motion mechanism 3000 moves the corrected workpiece to the bonding station, and the COF alignment mechanism 5000 performs a second correction. At this time, the CCD takes a picture of the side of the glass substrate and leaves a residual image. The COF positioning mechanism 6000 performs alignment, and the parallel pressing bonding mechanism 7000 bonds the COF to the bonding position of the workpiece to be bonded, thereby achieving precise bonding between the COF and the side of the workpiece.

[0063] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent transformations made under the concept of the present invention using the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A side-bonding device, characterized in that, The side bonding device includes: A base and a support frame located on one side of the base, wherein a bonding station is provided on the base; A motion support mechanism includes a support base, the support base being mounted on a base, and the support base being provided with two parallel first slide rails; The X-axis motion component comprises an X-axis moving component, a first sliding connector, and a first connecting plate. The X-axis moving component is mounted on the bearing base. The first sliding connector is slidably connected to two first slide rails. The first connecting plate is connected to the first sliding connector, and the output end of the X-axis moving component is connected to the first connecting plate. The first connecting plate is provided with two parallel second slide rails. The device comprises a Y-axis moving component, a second sliding connector, and a second connecting plate. The Y-axis moving component is mounted on the first connecting plate. The second sliding connector is slidably connected to two second slide rails. The second connecting plate is connected to the second sliding connector, and the output end of the Y-axis moving component is connected to the second connecting plate. The rotating motion component, the adapter, and the carrying platform are provided. The rotating motion component is mounted on the second connecting plate. The carrying platform is movably connected to the second connecting plate through the adapter. The output end of the rotating motion component is connected to the carrying platform to drive the carrying platform to rotate. The carrying platform is used to carry the workpiece to be bonded. The first correction mechanism is mounted on the support frame and located above the side of the workpiece to be bonded. It is used to correct the position of the workpiece to be bonded, and after the correction is completed, the workpiece to be bonded is moved to the bonding station by the bearing motion mechanism. COF positioning mechanism, which is mounted on the support frame, is used to transport the COF adsorbed on the COF positioning mechanism to the bonding position of the workpiece to be bonded. The second calibration mechanism is mounted on the base and is used to take pictures and align the workpiece to be bonded and the COF located in the area of ​​the bonding station. A pressing bonding mechanism is mounted on the support frame and is used to bond the COF to the bonding position of the workpiece to be bonded. A clamping and positioning mechanism is mounted on the support frame. The clamping and positioning mechanism includes: a clamping mounting block movably connected to the support frame; two pneumatic components and two clamping blocks, the two pneumatic components being respectively mounted at both ends of the clamping mounting block and the two clamping blocks being respectively mounted on the output ends of the pneumatic components; and a pressure block mounted in the middle area of ​​the clamping mounting block. After the workpiece to be bonded is supported by the carrying motion mechanism, the clamping and positioning mechanism moves to the carrying motion mechanism and clamps the workpiece to be bonded by the two clamping blocks and presses against the workpiece by the pressure block.

2. The side bonding device according to claim 1, characterized in that, The first calibration mechanism includes: A first fixing plate is mounted on the support frame; A first mounting plate is mounted on the first fixing plate; A first calibration motor is mounted on the first mounting plate; A first calibration mounting plate is mounted on the output end of the first calibration motor. A first adjusting member and a second adjusting member, wherein the first adjusting member is connected to the first calibration mounting plate, and the second adjusting member is movably connected to the side of the first adjusting member facing away from the first calibration mounting plate; A first calibration component is connected to the second adjustment component; The output of the first correction motor drives the first correction mounting plate and the first adjustment component to move in a first direction. The first adjustment component drives the second adjustment component and the first correction component to move in a second direction. The second adjustment component drives the first correction component to move in a third direction. The first direction, the second direction, and the third direction are perpendicular to each other.

3. The side bonding device according to claim 2, characterized in that, The second calibration mechanism includes: The second fixing plate is mounted on the base; The second correction motor is mounted on the second fixed plate; The second calibration mounting plate is mounted on the output end of the second calibration motor. A third adjusting member and a fourth adjusting member, wherein the third adjusting member is connected to the second correction mounting plate, and the fourth adjusting member is movably connected to the side of the third adjusting member facing away from the second correction mounting plate; The second calibration component is connected to the fourth adjustment component; The output of the second correction motor drives the second correction mounting plate and the third adjustment component to move in the fourth direction. The third adjustment component drives the fourth adjustment component and the second correction component to move in the fifth direction. The fourth adjustment component drives the second correction component to move in the sixth direction. The fourth, fifth, and sixth directions are perpendicular to each other.

4. The side bonding device according to claim 3, characterized in that, Both the first calibration component and the second calibration component are CCD calibration cameras.

5. The side bonding device according to claim 1, characterized in that, The COF positioning mechanism includes: Two third slide rails are mounted parallel to each other on the support frame; Two sliding blocks are respectively mounted on the two third slide rails; A third fixing plate and an alignment mounting plate, wherein the third fixing plate is mounted on the two sliding blocks and the alignment mounting plate is mounted on the third fixing plate; A fifth adjusting member and a sixth adjusting member, wherein the fifth adjusting member is connected to the alignment mounting plate, and the sixth adjusting member is movably connected to the side of the fifth adjusting member facing away from the alignment mounting plate; An adsorption element, which is connected to the sixth adjusting element; Among them, the two sliding blocks, the third fixing plate, the alignment mounting plate and the fifth adjusting member move toward the seventh direction, the fifth adjusting member drives the sixth adjusting member and the adsorption member to move toward the eighth direction, the sixth adjusting member drives the adsorption member to move toward the ninth direction, and the seventh direction, the eighth direction and the ninth direction are perpendicular to each other.

6. The side bonding device according to claim 1, characterized in that, The pressure bonding mechanism includes: A fixed base plate is mounted on the support frame; The device comprises a moving component, two fourth slide rails, and a pressure head mounting base. The moving component is mounted on the fixed base plate, the two fourth slide rails are mounted parallel to each other on the fixed base plate, the pressure head mounting base is slidably connected to the two fourth slide rails, and the output end of the moving component is connected to the pressure head mounting base. A pressure head assembly, which is mounted on the pressure head mounting base, is used to bond the COF to the bonding position of the workpiece to be bonded.

7. The side bonding device according to claim 6, characterized in that, The pressure bonding mechanism also includes: The first adapter plate and the second adapter plate are respectively installed on opposite sides of the pressure head mounting base; The system comprises a first reel, a second reel, and a buffer belt. The first reel is movably connected to the first adapter plate, the second reel is movably connected to the second adapter plate, and one end of the buffer belt is wound onto the first reel, while the other end of the buffer belt is wound onto the second reel. During the pressing process of the pressure head, the buffer band is located between the pressure head and the COF to buffer the pressing action of the pressure head.

8. The side bonding device according to claim 7, characterized in that, The side bonding device also includes: A control mechanism mounted on the support frame is used to control the operation of the load-bearing motion mechanism, the first correction mechanism, the second correction mechanism, the COF positioning mechanism, the pressing and bonding mechanism, and the clamping and positioning mechanism. An alarm mechanism is mounted on the support frame and is communicatively connected to the control mechanism.

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