Display device and method for manufacturing display device

Abstract

A display device and a method for manufacturing the display device are provided. The display device includes: a substrate; a first electrode disposed on the substrate; a second electrode disposed on the substrate and separated from the first electrode; a light-emitting element disposed on the first electrode and the second electrode, such that two ends of the light-emitting element are respectively disposed on the first electrode and the second electrode; a first insulating pattern disposed on the light-emitting element and exposing the two ends of the light-emitting element; and a second insulating pattern disposed on the first electrode and arranged separately from the first insulating pattern, wherein the first insulating pattern and the second insulating pattern comprise the same material.

Description

Technical Field

[0001] This disclosure relates to a display device and a method for manufacturing the display device. Background Technology

[0002] With the development of multimedia technology, the importance of display devices has steadily increased. In response, various types of display devices, such as organic light-emitting displays and liquid crystal displays (LCDs), have been adopted.

[0003] A display device is a means for displaying images and includes a display panel such as an organic light-emitting display panel or a liquid crystal display panel. A light-emitting display panel may include light-emitting elements (e.g., light-emitting diodes (LEDs)), and examples of light-emitting diodes include organic light-emitting diodes (OLEDs) that use organic materials as fluorescent materials and inorganic light-emitting diodes that use inorganic materials as fluorescent materials. Summary of the Invention

[0004] Technical issues

[0005] This disclosure provides a display device with improved reliability by removing separate light-emitting elements.

[0006] It should be noted that the disclosed aspects are not limited thereto, and other aspects not mentioned herein will be obvious to those skilled in the art based on the following description.

[0007] Technical solution

[0008] According to a disclosed embodiment, the display device includes: a substrate; a first electrode disposed on the substrate; a second electrode disposed on the substrate and spaced apart from the first electrode; a light-emitting element disposed on the first electrode and the second electrode, such that two ends of the light-emitting element are respectively disposed on the first electrode and the second electrode; a first insulating pattern disposed on the light-emitting element and exposing the two ends of the light-emitting element; and a second insulating pattern disposed on the first electrode and spaced apart from the first insulating pattern, wherein the first insulating pattern and the second insulating pattern comprise the same material.

[0009] The display device may further include: a first contact electrode in contact with one end of the light-emitting element and a first electrode, wherein the first contact electrode may be disposed on the first electrode to cover a second insulating pattern.

[0010] The display device may further include: a first insulating layer disposed on a first electrode and a second electrode, wherein a light-emitting element and a second insulating pattern may be disposed on the first insulating layer, and a first contact electrode may contact the first electrode through a first opening through the first insulating layer.

[0011] The first opening may not overlap with the first and second insulating patterns in the thickness direction of the substrate.

[0012] The display device may further include a third insulating pattern disposed on the second electrode and spaced apart from the first insulating pattern and the second insulating pattern, wherein the third insulating pattern may include the same material as the first insulating pattern and the second insulating pattern.

[0013] The display device may further include: a first contact electrode disposed on a first electrode and in contact with one end of the light-emitting element and the first electrode; and a second contact electrode disposed on a second electrode and in contact with the other end of the light-emitting element and the second electrode, wherein the first contact electrode and the second contact electrode may be configured to be spaced apart from each other on a first insulating pattern.

[0014] The first contact electrode can be configured to cover the second insulating pattern, and the second contact electrode can be configured to cover the third insulating pattern.

[0015] The thickness of the first insulating pattern can be greater than the thickness of the second insulating pattern.

[0016] The second insulating pattern may not overlap with the two ends of the first electrode in the thickness direction of the substrate.

[0017] Each of the first and second insulating patterns may have an island shape in the plan view.

[0018] The cross-sectional shape of the second insulating pattern can be a shape in which one side surface of the second insulating pattern facing the first insulating pattern is parallel to the first insulating pattern and the other side surface of the second insulating pattern protrudes.

[0019] According to another disclosed embodiment, the display device includes: a substrate; a first electrode disposed on one surface of the substrate and extending in a first direction; a second electrode disposed on one surface of the substrate, spaced apart from the first electrode, and extending in the first direction; a light-emitting element disposed on the first electrode and the second electrode, such that two ends of the light-emitting element are respectively disposed on the first electrode and the second electrode; a first insulating pattern disposed on the substrate in a region between the first electrode and the second electrode and extending in the first direction; and a second insulating pattern spaced apart from the first insulating pattern, disposed on the first electrode, and extending in the first direction, wherein at least a portion of the first insulating pattern is disposed on the light-emitting element and does not overlap with the two ends of the light-emitting element in the thickness direction of the substrate, and the second insulating pattern does not overlap with the two ends of the first electrode in the thickness direction of the substrate.

[0020] The display device may further include: a first contact electrode, which contacts one end of the light-emitting element and the first electrode, extends in a first direction, and covers a second insulating pattern.

[0021] The first insulating pattern and the second insulating pattern may contain the same material.

[0022] According to another disclosed embodiment, a method for manufacturing a display device includes: preparing a substrate, the substrate including a first electrode and a second electrode spaced apart from each other and facing each other, and a plurality of light-emitting elements disposed on the first electrode or the second electrode; and forming a shadow mask on the substrate, and then using the shadow mask to form an insulating pattern material layer on the first electrode and the second electrode and in the spaced region between the first electrode and the second electrode; wherein the insulating pattern material layer is superimposed on one end of the first electrode facing the second electrode and one end of the second electrode facing the first electrode in the thickness direction of the substrate, and is not superimposed on the other end of the first electrode and the other end of the second electrode in the thickness direction of the substrate.

[0023] The light-emitting element may include a first light-emitting element and a second light-emitting element. The two ends of the first light-emitting element are respectively disposed on a first electrode and a second electrode. At least one of the two ends of the second light-emitting element is not disposed on the first electrode or the second electrode. The insulating pattern material layer may be configured to cover the first light-emitting element.

[0024] The insulating pattern material layer may not overlap with the second light-emitting element in the thickness direction of the substrate. The manufacturing method for the display device may further include removing the second light-emitting element after the step of forming the insulating pattern material layer.

[0025] In the step of removing the second light-emitting element, the first light-emitting element can be covered by an insulating pattern material layer and is not removed.

[0026] The manufacturing method for a display device may further include: forming a first insulating pattern, a second insulating pattern, and a third insulating pattern by etching an insulating pattern material layer, wherein the first insulating pattern may be disposed on a light-emitting element and expose both ends of the light-emitting element, the second insulating pattern may be disposed on a first electrode, the third insulating pattern may be disposed on a second electrode, and the first insulating pattern, the second insulating pattern, and the third insulating pattern may be spaced apart from each other.

[0027] The manufacturing method for a display device may further include: forming a first contact electrode that contacts one end of a light-emitting element and a first electrode, and a second contact electrode that contacts the other end of the light-emitting element and a second electrode, wherein the first contact electrode and the second contact electrode may be spaced apart from each other, the first contact electrode may be disposed on the first electrode to cover a second insulating pattern, and the second contact electrode may be disposed on the second electrode to cover a third insulating pattern.

[0028] Details of other embodiments are included in the detailed description and accompanying drawings.

[0029] Beneficial effects

[0030] Using the display device and manufacturing method for the display device according to the embodiment, by partially forming an insulating pattern material layer using a shadow mask, a light-emitting element (hereinafter referred to as a first light-emitting element) whose two ends are disposed on a first electrode and a second electrode can be fixed, and a light-emitting element whose two ends are not disposed on the first electrode or the second electrode (hereinafter referred to as a second light-emitting element or a separated light-emitting element) can be removed. Therefore, defects in the display device caused by the separated light-emitting element can be reduced, and the separated light-emitting element can be recycled and reused, thereby reducing the material cost of the display device.

[0031] The effects of the embodiments are not limited to those illustrated above, and many more effects are included in this disclosure. Attached Figure Description

[0032] Figure 1 This is a schematic plan view of a display device according to an embodiment;

[0033] Figure 2 This is a plan view showing one pixel of a display device according to an embodiment;

[0034] Figure 3 This is a schematic cross-sectional view of the display area and pad area of ​​the display device according to an embodiment;

[0035] Figure 4 It shows along Figure 2 A cross-sectional view of an example taken by line V-V';

[0036] Figure 5 This is a schematic diagram of a light-emitting element according to an embodiment;

[0037] Figures 6 to 28 These are cross-sectional and plan views of the manufacturing process steps of the display device according to an embodiment;

[0038] Figure 29 This is a schematic cross-sectional view of the display area and pad area of ​​a display device according to another embodiment; and

[0039] Figures 30 to 32 It is shown Figure 29 A cross-sectional view of some process steps in the manufacturing method of the display device. Detailed Implementation

[0040] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0041] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer may be directly on the other layer or substrate, or there may be an intermediate layer. Throughout the specification, the same reference numerals denote the same components.

[0042] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the teachings of the invention, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0043] In the following description, embodiments will be illustrated with reference to the accompanying drawings.

[0044] Figure 1 This is a schematic plan view of a display device according to an embodiment.

[0045] Reference Figure 1 The display device 10 displays moving or still images. The display device 10 can refer to any electronic device that provides a display screen. For example, televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, mobile phones, smartphones, tablet PCs, electronic watches, smartwatches, watch phones, head-mounted displays, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, game consoles, digital cameras, camcorders, etc., that provide a display screen can be included in the display device 10.

[0046] Display device 10 includes a display panel that provides a display screen. Examples of display panels may include inorganic light-emitting diode (LED) display panels, organic light-emitting diode (OLED) display panels, quantum dot (QD) light-emitting diode (OLED) display panels, plasma display panels, field emission display panels, etc. In the following description, an example of an inorganic LED display panel being used as a display panel will be given by way of example; however, this disclosure is not limited thereto, and the same technical spirit can be applied to other display panels where applicable.

[0047] In the following drawings, which describe an embodiment of the display device 10, a first direction DR1, a second direction DR2, and a third direction DR3 are defined. The first direction DR1 and the second direction DR2 may be directions perpendicular to each other in a plane. The third direction DR3 may be a direction perpendicular to the plane in which the first direction DR1 and the second direction DR2 are positioned. The third direction DR3 is perpendicular to each of the first direction DR1 and the second direction DR2. In the embodiment describing the display device 10, the third direction DR3 refers to the thickness direction (or display direction) of the display device 10.

[0048] In a plan view, the display device 10 may have a rectangular shape including a long side in the first direction DR1 and a short side in the second direction DR2. In a plan view, the corner where the long and short sides of the display device 10 meet may be a right angle, but is not limited to this; it may also have a rounded curved shape. The shape of the display device 10 is not limited to the above shapes and can be modified in various ways. For example, in a plan view, the shape of the display device 10 may also be a square shape, a quadrilateral shape with rounded corners (vertices), other polygonal shapes, a circular shape, or other shapes.

[0049] The display surface of the display device 10 may be disposed on one side of the display device 10 in the third direction DR3, which is the thickness direction. In the embodiment used to describe the display device 10, unless otherwise stated, "upper part" refers to one side in the third direction DR3 and refers to the display direction, and "upper surface" refers to the surface facing the side in the third direction DR3. In addition, "lower part" refers to the other side in the third direction DR3 and refers to the direction opposite to the display direction, and "lower surface" refers to the surface facing the other side in the third direction DR3. In addition, in the plan view, "left", "right", "upper", and "lower" refer to the direction when viewing the display device 10. For example, "right side" refers to one side in the first direction DR1, "left side" refers to the other side in the first direction DR1, "upper side" refers to one side in the second direction DR2, and "lower side" refers to the other side in the second direction DR2.

[0050] The display device 10 may include a display area DPA and a non-display area NDA. The display area DPA is the area in which an image can be displayed, and the non-display area NDA is the area in which an image is not displayed.

[0051] The shape of the display area DPA can follow the shape of the display device 10. For example, in a plan view, the display area DPA can have a rectangular shape similar to the overall shape of the display device 10. The display area DPA can substantially occupy the center of the display device 10.

[0052] The display area (DPA) may include multiple pixels (PX). These pixels (PX) may be arranged in a matrix. In a planar view, each pixel (PX) may be rectangular or square. Each pixel (PX) may include a light-emitting element made of inorganic particles.

[0053] The non-display area NDA can be positioned around the display area DPA. The non-display area NDA can completely or partially surround the display area DPA. The non-display area NDA can form the bezel of the display device 10.

[0054] The driving circuit or driving element for driving the display area DPA can be disposed in the non-display area NDA. For example, the pad (also called "solder pad" or "solder pad") portion can be disposed on the first long side of the display device 10 (where the pad is located). Figure 1 The non-display area NDA is disposed adjacent to the lower side of the display device 10 and / or adjacent to the second long side of the display device 10. Figure 1 The external device EXD is disposed on the substrate of the non-display area NDA adjacent to the upper side of the display device 10, and the external device EXD can be mounted on the pad electrode of the pad portion. Examples of the external device EXD may include a connection film, a printed circuit board, a driver chip DIC, a connector, a wiring connection film, etc. The scan driver SDR, etc. formed on the substrate of the display device 10 can be disposed adjacent to the first short side of the display device 10. Figure 1 The non-display area NDA is set adjacent to the left side of the image.

[0055] Figure 2 This is a plan view showing a pixel of a display device according to an embodiment.

[0056] Reference Figure 2 Each pixel PX of the display device 10 may include an emitting region EMA and a non-emitting region (not shown). The emitting region EMA may be defined as the area in which light emitted from the light-emitting element ED is emitted, and the non-emitting region may be defined as the area in which light emitted from the light-emitting element ED does not reach and therefore does not emit light.

[0057] The emitting region EMA may include the area in which the light-emitting element ED is disposed and the area adjacent to the area in which the light-emitting element ED is disposed. In addition, the emitting region EMA may also include the area in which light emitted from the light-emitting element ED is reflected or refracted by other components and subsequently emitted.

[0058] Each pixel PX may also include a cutout region CBA disposed in a non-emitting region. The cutout region CBA may be disposed above the emitting region EMA (or on one side of the emitting region EMA in the second direction DR2) within a pixel PX. The cutout regions CBA may be disposed between the emitting regions EMA of pixels PX disposed adjacent to each other along the second direction DR2.

[0059] The notch region CBA can be a region in which electrodes 210 and 220 in each pixel PX adjacent to each other along the second direction DR2 are separated from each other. Electrodes 210 and 220 in each pixel PX can be separated from each other in the notch region CBA, and portions of electrodes 210 and 220 in each pixel PX can be located within the notch region CBA. The light-emitting element ED may not be located within the notch region CBA.

[0060] Figure 3 This is a schematic cross-sectional view of the display area and pad area of ​​the display device according to an embodiment. Figure 4 It shows along Figure 2 A cross-sectional view of an example cut by line V-V'.

[0061] exist Figure 3 The image shows cross-sections of a portion of the display area DPA and a portion of the non-display area NDA. A cross-section of the emission area EMA and its adjacent areas, included within a pixel PX, is shown as a cross-section of the display area DPA, while a cross-section of the pad area PDA is shown as a cross-section of the non-display area NDA. Figure 4 The image shows a cross-section of the area in which the first contact electrode 710 and the second contact electrode 720 are in contact with each other in the emission region EMA of a pixel PX in the display region DPA, and the area in which the first electrode 210 and the second electrode 220 are in contact with each other.

[0062] Reference Figures 2 to 4 The display device 10 may include a substrate SUB, a circuit element layer PAL disposed on the substrate SUB, a light-emitting element layer disposed on the circuit element layer PAL in the display area DPA and including a plurality of light-emitting elements ED, and a pad portion disposed on the circuit element layer PAL in the pad area PDA and including a pad electrode 730.

[0063] The substrate SUB can be an insulating substrate. The substrate SUB can be made of insulating materials such as glass, quartz, or polymer resin. The substrate SUB can be a rigid substrate, but it can also be a flexible substrate that can be bent, folded, or rolled up.

[0064] The circuit element layer PAL can be disposed on the substrate SUB. Although not shown in the figures, the circuit element layer PAL may include at least one transistor, etc., disposed in the display area DPA to drive the light-emitting element layer. Additionally, the circuit element layer PAL may include wiring pads disposed in the pad area PDA for connection to an external device EXD mounted on the circuit element layer PAL (see Figure 1) via the connection electrode 230 and pad electrode 730 described later. Figure 1 ).

[0065] The first dam 400 can be disposed on the circuit element layer PAL. The first dam 400 can be disposed in the display area DPA. In a plan view, the first dam 400 can have a shape in which the first dam 400 extends in a second direction DR2 within the emission area EMA of each pixel PX.

[0066] The first dike 400 may include a first sub-dike 410 and a second sub-dike 420 configured to be spaced apart from each other. In an embodiment, the first sub-dike 410 and the second sub-dike 420 may be configured to be spaced apart from each other and face each other in a first direction DR1.

[0067] The first sub-dam 410 and the second sub-dam 420 may have a structure in which at least a portion of the first sub-dam 410 and the second sub-dam 420 protrudes from the upper surface of the substrate SUB. The protruding portions of the first sub-dam 410 and the second sub-dam 420 may have inclined side surfaces. The first sub-dam 410 and the second sub-dam 420 may have inclined surfaces to change the direction of travel of light emitted from the light-emitting element ED and traveling toward the side surfaces of the first sub-dam 410 and the second sub-dam 420 to an upward direction (e.g., a display direction).

[0068] The first electrode 210 and the second electrode 220 can be disposed on the first dam 400. The first electrode 210 can be disposed on the first sub-dam 410, and the second electrode 220 can be disposed on the second sub-dam 420.

[0069] In the plan view, each of the first electrode 210 and the second electrode 220 may have a shape that extends in the second direction DR2. The first electrode 210 and the second electrode 220 may be arranged to be spaced apart from each other and facing each other in the first direction DR1.

[0070] In the plan view, the first electrode 210 may extend in the second direction DR2 to overlap with a portion of the second dam 600 extending in the first direction DR1. The first electrode 210 may be electrically connected to the circuit element layer PAL through the first contact hole CT1.

[0071] In the plan view, the second electrode 220 may extend in the second direction DR2 to overlap with a portion of the second dam 600 extending in the first direction DR1. The second electrode 220 may be electrically connected to the circuit element layer PAL through the second contact hole CT2.

[0072] The first electrode 210 and the second electrode 220 can be electrically connected to the light-emitting element ED, respectively, and a predetermined voltage can be applied to the first electrode 210 and the second electrode 220 to cause the light-emitting element ED to emit light. For example, multiple electrodes 210 and 220 can be electrically connected to the light-emitting element ED disposed on the first electrode 210 and the second electrode 220 through contact electrodes 710 and 720, which will be described later, in the gap region between the first electrode 210 and the second electrode 220, and electrical signals applied to the electrodes 210 and 220 can be transmitted to the light-emitting element ED through the contact electrodes 710 and 720.

[0073] Furthermore, an alignment signal for forming an electric field for aligning the light-emitting elements (EDs) in the manufacturing process of the display device 10 can be applied to the first electrode 210 and the second electrode 220. Specifically, when ink comprising a plurality of light-emitting elements (EDs) is jetted onto the first electrode 210 and the second electrode 220 by an inkjet printing process in the manufacturing process of the display device 10, an alignment signal can be applied to the first electrode 210 and the second electrode 220 to generate an electric field. The plurality of light-emitting elements (EDs) included in the ink can be aligned by receiving the dielectric force generated by the electric field generated on the first electrode 210 and the second electrode 220, such that the two ends of the plurality of light-emitting elements (EDs) are positioned between the first electrode 210 and the second electrode 220.

[0074] The first electrode 210 and the second electrode 220 can be separated from the first electrode 210 and the second electrode 220 of the adjacent pixel PX in the second direction DR2, respectively, in the notch region CBA in the pixel PX. In the manufacturing process of the display device 10, the planar shape of the first electrode 210 and the second electrode 220 separated in the notch region CBA can be formed by disconnecting the first electrode 210 and the second electrode 220 in the notch region CBA after the process of setting the light-emitting element ED. However, this disclosure is not limited thereto; some of the first electrode 210 and the second electrode 220 can extend to the adjacent pixel PX in the second direction DR2 to be integrated with the first electrode 210 and the second electrode 220 of the adjacent pixel PX in the second direction DR2, or only either the first electrode 210 or the second electrode 220 can be separated.

[0075] The connection electrode 230 may be disposed on the circuit element layer PAL. The connection electrode 230 may be disposed in the pad region PDA. Although not shown in the figures, as described above, the circuit element layer PAL may include wiring pads disposed in the pad region PDA, and the connection electrode 230 may be electrically connected to the wiring pads.

[0076] In this embodiment, the first electrode 210, the second electrode 220, and the connecting electrode 230 may comprise the same material. The first electrode 210, the second electrode 220, and the connecting electrode 230 may be patterned and formed using the same masking process, but are not limited thereto.

[0077] The first insulating layer 510 can be disposed in the display area DPA and the pad area PDA. The first insulating layer 510 can be disposed on the plurality of electrodes 210 and 220 and the connecting electrode 230.

[0078] A first insulating layer 510 may be disposed in the display area DPA on the first electrode 210 and the second electrode 220. The first insulating layer 510 may be configured to cover the first electrode 210 and the second electrode 220, and may include a first opening OP1 exposing a portion of the first electrode 210 and a second opening OP2 exposing a portion of the second electrode 220. The first electrode 210 may contact the first contact electrode 710 (described later) through the first opening OP1 of the first insulating layer 510, and the second electrode 220 may contact the second contact electrode 720 (described later) through the second opening OP2 of the first insulating layer 510.

[0079] The first insulating layer 510 can be used to insulate the first electrode 210 and the second electrode 220 from each other while protecting the first electrode 210 and the second electrode 220. In addition, the first insulating layer 510 can prevent the light-emitting element ED disposed on the first insulating layer 510 from direct contact with other components and from being damaged by other components.

[0080] A first insulating layer 510 may be disposed in the outer peripheral region of the connecting electrode 230 to expose a portion of the upper surface of the connecting electrode 230 in the pad region PDA. The first insulating layer 510 may form a pad opening OPP that exposes the connecting electrode 230. The inner sidewall of the pad opening OPP may be configured to overlap with the connecting electrode 230.

[0081] The first insulating layer 510 may comprise an inorganic insulating material or an organic insulating material. For example, the first insulating layer 510 may comprise silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N yInorganic insulating materials such as aluminum oxide (Al2O3) or aluminum nitride (AlN) can be used. Optionally, the first insulating layer 510 may include organic insulating materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene resin, polyphenylene sulfide resin, benzocyclobutene, cardo resin, siloxane resin, silsesquioxane resin, polymethyl methacrylate, polycarbonate, or polymethyl methacrylate-polycarbonate synthetic resin. In an embodiment, the first insulating layer 510 may include silicon oxide (SiO2). x (but not limited to this).

[0082] The second dam 600 can be disposed on the first insulating layer 510. The second dam 600 can be disposed within the display area DPA. In a plan view, the second dam 600 can be configured as a grid pattern throughout the display area DPA by including portions extending in the first direction DR1 and the second direction DR2. The second dam 600 can be disposed across the boundaries between individual pixels PX to divide adjacent pixels PX. The second dam 600 can be disposed around the outside of the display area DPA, but may not be disposed within the pad area PDA.

[0083] The second dike 600 can be formed to have a greater height than the first dike 400. The second dike 600 can be used in the inkjet printing process for aligning the light-emitting element ED during the manufacturing process of the display device 10 to prevent ink overflow into adjacent pixels PX. Furthermore, the second dike 600 can be configured to divide the emission area EMA and the notch area CBA around each pixel PX. Since the second dike 600 can be configured to divide the emission area EMA and the notch area CBA, the light-emitting element ED may not be located within the notch area CBA.

[0084] In an embodiment, the second dike 600 may include, but is not limited to, an organic insulating material such as polyimide (PI).

[0085] The light-emitting element ED can be disposed on the first insulating layer 510. The light-emitting element ED can be disposed in the display area DPA.

[0086] The light-emitting element (ED) may have a shape in which the light-emitting element (ED) extends in one direction. The extending directions of the first electrode 210 and the second electrode 220 and the extending directions of the light-emitting element (ED) may be substantially perpendicular to each other. However, this disclosure is not limited thereto. Some of the plurality of light-emitting elements (EDs) may be configured such that their extending directions are substantially perpendicular to the extending directions of the first electrode 210 and the second electrode 220, and other of the plurality of light-emitting elements (EDs) may be configured such that their extending directions are inclined to the extending directions of the first electrode 210 and the second electrode 220.

[0087] The light-emitting element ED may have two ends respectively disposed on the first electrode 210 and the second electrode 220 between the first sub-dike 410 and the second sub-dike 420. Specifically, the light-emitting element ED may be disposed on a corresponding end of the first electrode 210 and the second electrode 220 that are spaced apart from each other and face each other. In the following, for ease of explanation in this disclosure, the corresponding ends of the first electrode 210 and the second electrode 220 that face each other (that is, the ends of the corresponding electrodes that face inward in the emission region EMA) will be referred to as one end of the first electrode 210 and the second electrode 220, and the ends of the first electrode 210 and the second electrode 220 that are opposite to this one end (that is, the ends of the corresponding electrodes that face outward in the emission region EMA) will be referred to as the other end of the first electrode 210 and the second electrode 220.

[0088] The extension length of the light-emitting element ED can be greater than the interval between the first electrode 210 and the second electrode 220. Therefore, the light-emitting element ED can be disposed on the first electrode 210 and the second electrode 220, such that one end of the light-emitting element ED is placed on the first electrode 210 (specifically, one end of the first electrode 210), and the other end of the light-emitting element ED is placed on the second electrode 220 (specifically, one end of the second electrode 220).

[0089] A first insulating pattern 521 may be disposed in the emission region EMA between the first electrode 210 and the second electrode 220. In a plan view, the first insulating pattern 521 may have a shape in which the first insulating pattern 521 extends in the second direction DR2. The first insulating pattern 521 may be formed as a linear pattern or an island pattern in the emission region EMA of each pixel PX.

[0090] At least a portion of the first insulating pattern 521 may be disposed on the light-emitting element ED. The first insulating pattern 521 may be partially disposed on the light-emitting element ED between the first electrode 210 and the second electrode 220. The first insulating pattern 521 may be configured to partially surround the outer surface of the light-emitting element ED. The first insulating pattern 521 may be disposed on the light-emitting element ED, but both ends of the light-emitting element ED may be exposed.

[0091] The first insulating pattern 521 can be used to fix the light-emitting element ED while protecting it during the manufacturing process of the display device 10. Meanwhile, to stably fix the light-emitting element ED, the thickness of the first insulating pattern 521 can be greater than the diameter of the light-emitting element ED.

[0092] The second insulating pattern 522 can be configured to be spaced apart from the first insulating pattern 521 in the first direction DR1. In a plan view, the second insulating pattern 522 can have a shape in which the second insulating pattern 522 extends in the second direction DR2. The second insulating pattern 522 can be formed as a linear pattern or an island pattern in the emission region EMA of each pixel PX.

[0093] The second insulating pattern 522 may be disposed on the first insulating layer 510 in the emission region EMA. The second insulating pattern 522 may be configured to overlap with the first electrode 210 in the third direction DR3. The width of the second insulating pattern 522 in the first direction DR1 may be smaller than the width of the first electrode 210 in the first direction DR1. Therefore, the second insulating pattern 522 may not overlap with both ends of the first electrode 210 in the third direction DR3. The second insulating pattern 522 may not overlap with the inclined side surface of the first sub-dike 410 in the third direction DR3. However, this disclosure is not limited thereto, and the second insulating pattern 522 may at least partially overlap with the inclined side surface of the first sub-dike 410 in the third direction DR3.

[0094] The cross-sectional shapes of one side surface of the second insulating pattern 522 facing the first insulating pattern 521 and the other side surface of the second insulating pattern 522 can differ from each other. For example, one side surface of the second insulating pattern 522 can be formed substantially parallel to the first insulating pattern 521, forming a single flat or curved surface, but the other side surface of the second insulating pattern 522 can have a shape that protrudes outward from the emission region EMA. This cross-sectional shape of the second insulating pattern 522 can be a shape formed using a deposition process with a shadow mask.

[0095] The third insulating pattern 523 can be configured to be spaced apart from the first insulating pattern 521 and the second insulating pattern 522 in the first direction DR1. In a plan view, the first insulating pattern 521 can be disposed between the second insulating pattern 522 and the third insulating pattern 523. In a plan view, the third insulating pattern 523 can have a shape in which the third insulating pattern 523 extends in the second direction DR2. The third insulating pattern 523 can be formed as a linear pattern or an island pattern in the emission region EMA of each pixel PX.

[0096] The third insulating pattern 523 may be disposed on the first insulating layer 510 in the emitting region EMA. The third insulating pattern 523 may be disposed on the third direction DR3 and superimposed on the second electrode 220. The width of the third insulating pattern 523 on the first direction DR1 may be smaller than the width of the second electrode 220 on the first direction DR1. Therefore, the third insulating pattern 523 may not superimpose on both ends of the second electrode 220 on the third direction DR3. The third insulating pattern 523 may not superimpose on the inclined side surface of the second sub-dike 420 on the third direction DR3. However, this disclosure is not limited thereto, and the third insulating pattern 523 may at least partially superimpose on the inclined side surface of the second sub-dike 420 on the third direction DR3.

[0097] Similar to the second insulating pattern 522, the cross-sectional shapes of one side surface of the third insulating pattern 523 facing the first insulating pattern 521 and the other side surface of the third insulating pattern 523 can differ from each other. For example, one side surface of the third insulating pattern 523 can be formed substantially parallel to the first insulating pattern 521, forming a single flat or curved surface, but the other side surface of the third insulating pattern 523 can have a shape that protrudes outward from the emission region EMA. This cross-sectional shape of the third insulating pattern 523 can be a shape formed using a deposition process with a shadow mask.

[0098] The first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 may not overlap with the first opening OP1 and the second opening OP2 on the third-direction DR3.

[0099] The first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 may comprise the same material. In an embodiment, the first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 may be patterned using the same process and deposited as an insulating pattern material layer 530' (see...). Figure 11 The second insulating pattern 522 and the third insulating pattern 523 may be unetched residual patterns left in the etching process for forming the insulating pattern material layer 530' for the areas where the contact electrodes 710 and 720, described later, are in contact with each other, due to the mask pattern disposed thereon. A detailed description of these will be provided later.

[0100] The thickness of the first insulating pattern 521 may be greater than the thickness of the second insulating pattern 522 and the third insulating pattern 523. The width of the first insulating pattern 521 in the first direction DR1 may be greater than the width of the second insulating pattern 522 and the third insulating pattern 523 in the first direction DR1. However, this disclosure is not limited thereto, and the thickness of the first insulating pattern 521 may also be the same as the thickness of the second insulating pattern 522 and the third insulating pattern 523.

[0101] The first contact electrode 710 can be disposed on the first insulating layer 510. The first contact electrode 710 can be disposed in the display area DPA. The first contact electrode 710 can be disposed on the first sub-dike 410 and the first electrode 210.

[0102] In the plan view, the first contact electrode 710 may have a shape in which the first contact electrode 710 extends in the second direction DR2. The first contact electrode 710 may form a linear pattern or an island pattern in the emission region EMA of each pixel PX.

[0103] The first contact electrode 710 can contact one end of the light-emitting element ED and the first electrode 210. Specifically, a portion of the first contact electrode 710 can contact one end of the light-emitting element ED exposed by the first insulating pattern 521. Additionally, another portion of the first contact electrode 710 can contact the upper surface of the first electrode 210 exposed through the first opening OP1 formed in the first insulating layer 510. In other words, the first contact electrode 710 can contact one end of the light-emitting element ED and the first electrode 210, allowing the light-emitting element ED and the first electrode 210 to be electrically connected to each other.

[0104] The first contact electrode 710 may be configured to at least partially cover the second insulating pattern 522 disposed on the first electrode 210. While the accompanying drawings show the first contact electrode 710 completely covering the second insulating pattern 522 disposed on the first electrode 210, this disclosure is not limited thereto. The first contact electrode 710 may be superimposed on the second insulating pattern 522 on a third-direction DR3. The first contact electrode 710 may be configured to extend from one end of the light-emitting element ED toward the first insulating pattern 521 to cover a portion of the first insulating pattern 521.

[0105] The second insulating layer 530 can be disposed in the display area DPA and the pad area PDA. The second insulating layer 530 can be disposed entirely in the area except for the space between the first insulating pattern 521 and the third insulating pattern 523 facing each other in the display area DPA. The second insulating layer 530 can be disposed in the outer peripheral area of ​​the connecting electrode 230 to expose the connecting electrode 230.

[0106] The second insulating layer 530 may not be disposed in the space between the first insulating pattern 521 and the third insulating pattern 523 facing each other.

[0107] The second insulating layer 530 can be disposed on the first contact electrode 710 and the third insulating pattern 523 in the display area DPA. The second insulating layer 530 can extend outward from the first contact electrode 710 and the third insulating pattern 523 to also be disposed on the first sub-dam 410 and the second dam 600. The side surfaces of the second insulating layer 530 can be aligned with the facing side surfaces of the first insulating pattern 521 and the third insulating pattern 523, respectively.

[0108] The second insulating layer 530 can electrically insulate the first contact electrode 710 and the second contact electrode 720 from each other. The second insulating layer 530 can be configured to cover the first contact electrode 710, but it can be omitted from the other end of the light-emitting element ED, so that the light-emitting element ED can contact the second contact electrode 720.

[0109] The second insulating layer 530 can be disposed in the outer peripheral region of the connecting electrode 230 to expose a portion of the upper surface of the connecting electrode 230 in the pad region PDA. The second insulating layer 530 can form a pad opening OPP that exposes the connecting electrode 230. The inner sidewall of the pad opening OPP can be configured to overlap with the connecting electrode 230. In the pad region PDA, the second insulating layer 530 and the first insulating layer 510 can form the pad opening OPP. The inner sidewalls of the second insulating layer 530 and the first insulating layer 510 that form the pad opening OPP can be aligned with each other.

[0110] The second contact electrode 720 can be disposed on the second insulating layer 530. The second contact electrode 720 can be disposed in the display area DPA. The second contact electrode 720 can be disposed on the second sub-dike 420 and the second electrode 220.

[0111] In a plan view, the second contact electrode 720 may have a shape in which the second contact electrode 720 extends in the second direction DR2. The second contact electrode 720 may form a linear pattern or an island pattern in the emission region EMA of each pixel PX. In a plan view, the second contact electrode 720 may be configured to be spaced apart from the first contact electrode 710 in the first direction DR1.

[0112] The second contact electrode 720 can contact the other end of the light-emitting element ED and the second electrode 220. Specifically, a portion of the second contact electrode 720 can contact the other end of the light-emitting element ED exposed by the first insulating pattern 521. Additionally, another portion of the second contact electrode 720 can contact the upper surface of the second electrode 220 exposed through the second opening OP2 formed in the first insulating layer 510. In other words, the second contact electrode 720 can contact the other end of the light-emitting element ED and the second electrode 220 to electrically connect the other end of the light-emitting element ED to the second electrode 220.

[0113] The second contact electrode 720 may be configured to at least partially cover the third insulating pattern 523 disposed on the second electrode 220. While the accompanying drawings show the second contact electrode 720 completely covering the third insulating pattern 523 disposed on the second electrode 220, this disclosure is not limited thereto. The second contact electrode 720 may be superimposed on the third insulating pattern 523 on a third-direction DR3. The second contact electrode 720 may be configured to extend from the other end of the light-emitting element ED toward the first insulating pattern 521 to cover portions of the first insulating pattern 521 and the second insulating layer 530. The first contact electrode 710 and the second contact electrode 720 may be insulated from each other through the second insulating layer 530.

[0114] A pad electrode 730 may be disposed in the pad region of the PDA. The pad electrode 730 may be disposed on the second insulating layer 530. The pad electrode 730 may directly contact the upper surface of the connecting electrode 230 through the pad opening OPP. The pad electrode 730 may comprise the same material as the second contact electrode 720. In an embodiment, the pad electrode 730 may be formed using the same process as the second contact electrode 720.

[0115] The third insulating layer 540 can be completely disposed on the substrate SUB. The third insulating layer 540 can be used to protect the components disposed on the substrate SUB from the influence of the external environment.

[0116] Figure 5 This is a schematic diagram of a light-emitting element according to an embodiment.

[0117] Reference Figure 5 The light-emitting element (ED) is a granular element and may have a rod shape or a cylindrical shape with a predetermined aspect ratio. The length of the light-emitting element (ED) may be greater than the diameter of the light-emitting element (ED), and the aspect ratio of the light-emitting element (ED) may be from 1.2:1 to 100:1, but this disclosure is not limited thereto.

[0118] The light-emitting element (ED) can have dimensions ranging from nanometer-scale (1 nm or larger and less than 1 μm) to micrometer-scale (1 μm or larger and less than 1 mm). In embodiments, both the length and diameter of the ED can be nanometer-scale or micrometer-scale. In some other embodiments, the diameter of the ED can be nanometer-scale, while the length of the ED can be micrometer-scale. In some embodiments, the diameter and / or length of some of the EDs can be nanometer-scale, while the diameter and / or length of others can be micrometer-scale.

[0119] A light-emitting element (ED) may include an inorganic light-emitting diode (LED). An inorganic LED may include multiple semiconductor layers. For example, an inorganic LED may include a first conductivity type (e.g., n-type) semiconductor layer, a second conductivity type (e.g., p-type) semiconductor layer, and an active semiconductor layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. The active semiconductor layer may receive holes and electrons provided from the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively, and the holes and electrons arriving at the active semiconductor layer may combine with each other to emit light.

[0120] In this embodiment, the semiconductor layers described above can be stacked sequentially along the length of the light-emitting element (ED). For example... Figure 5 As shown, the light-emitting element (ED) may include a first semiconductor layer 31, an active layer 33, and a second semiconductor layer 32 stacked sequentially in the length direction. The first semiconductor layer 31, the active layer 33, and the second semiconductor layer 32 may be the first conductivity type semiconductor layer, the active semiconductor layer, and the second conductivity type semiconductor layer, respectively.

[0121] The first semiconductor layer 31 may be doped with a dopant of a first conductivity type. The dopant of the first conductivity type may be Si, Ge, Se, Sn, etc. In an embodiment, the first semiconductor layer 31 may be made of n-GaN doped with n-type Si.

[0122] The second semiconductor layer 32 may be spaced apart from the first semiconductor layer 31, and the active layer 33 may be disposed between the second semiconductor layer 32 and the first semiconductor layer 31. The second semiconductor layer 32 may be doped with a dopant of a second conductivity type, such as Mg, Zn, Ca, or Ba. In an embodiment, the second semiconductor layer 32 may be made of p-GaN doped with p-type Mg.

[0123] The active layer 33 may comprise a material having a single quantum well structure or a multiple quantum well structure. As described above, the active layer 33 can emit light through the recombination of electron-hole pairs in response to an electrical signal applied through the first semiconductor layer 31 and the second semiconductor layer 32.

[0124] In some embodiments, the active layer 33 may have a structure in which semiconductor materials with large band gaps and semiconductor materials with small band gaps are stacked alternately, and may include other group III to group V semiconductor materials depending on the wavelength of the emitted light.

[0125] Light emitted from the active layer 33 can be emitted not only to the outer surface of the light-emitting element ED along its length, but also to both sides of the light-emitting element ED. In other words, the emission direction of light from the active layer 33 is not limited to one direction.

[0126] The light-emitting element ED may further include an electrode layer 37 disposed on the second semiconductor layer 32. The electrode layer 37 may be in contact with the second semiconductor layer 32. The electrode layer 37 may be an ohmic contact electrode, but is not limited thereto, and may also be a Schottky contact electrode.

[0127] When the two ends of the light-emitting element ED and the electrodes (contact electrodes of the display device or the first and second probes of the optical inspection device) are electrically connected to each other, an electrode layer 37 may be disposed between the second semiconductor layer 32 and the electrodes to reduce resistance in order to apply an electrical signal to the first semiconductor layer 31 and the second semiconductor layer 32. The electrode layer 37 may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). The electrode layer 37 may also include n-type or p-type doped semiconductor materials.

[0128] The light-emitting element (ED) may further include an insulating film 38 surrounding the outer peripheral surfaces of the first semiconductor layer 31, the second semiconductor layer 32, the active layer 33, and / or the electrode layer 37. The insulating film 38 may be configured to at least surround the outer surface of the active layer 33 and may extend in one direction in which the light-emitting element ED extends. The insulating film 38 serves to protect these components. The insulating film 38 may be made of a material with insulating properties to prevent electrical short circuits that may occur when the active layer 33 comes into direct contact with the electrodes through which electrical signals are transmitted to the light-emitting element ED. Furthermore, the insulating film 38 protects the outer peripheral surfaces of the first semiconductor layer 31, the second semiconductor layer 32, and the active layer 33, and thus prevents a decrease in luminous efficiency.

[0129] The manufacturing process of the display device 10 will be described below with reference to the other accompanying drawings.

[0130] Figures 6 to 28 These are cross-sectional views and plan layout diagrams of the manufacturing process steps of the display device according to an embodiment.

[0131] Reference Figure 6 and Figure 7First, a circuit element layer PAL is formed on the substrate SUB, and a first dam 400 including a first sub-dam 410 and a second sub-dam 420 is formed on the circuit element layer PAL. Next, a first electrode 210 and a second electrode 220 are formed on the first sub-dam 410 and the second sub-dam 420 in the display area DPA, respectively, and a connection electrode 230 is formed on the circuit element layer PAL in the pad area PDA. The first electrode 210, the second electrode 220, and the connection electrode 230 may include the same material and can therefore be formed simultaneously in the same process.

[0132] Next, a first insulating layer 510 is formed on the substrate SUB. The first insulating layer 510 includes a first opening OP1 and a second opening OP2 that expose the first electrode 210 and the second electrode 220 in the emitter region EMA, respectively, and a third opening OP3 that exposes a portion of the connection electrode 230 in the pad region PDA.

[0133] Next, a second dam 600 is formed on the first insulating layer 510, and then a plurality of light-emitting elements ED are disposed in the emitting region EMA separated by the second dam 600. The plurality of light-emitting elements ED may include a first light-emitting element ED1 with its two ends disposed on the first electrode 210 and the second electrode 220 respectively, and a second light-emitting element ED2 with at least one end not disposed on the first electrode 210 or the second electrode 220.

[0134] Simultaneously, multiple light-emitting elements (EDs) can be jetted onto the target substrate SUB while they are dispersed in ink. In an embodiment, the light-emitting elements (EDs) can be fabricated while dispersed in ink and jetted onto the target substrate SUB using a printing process employing an inkjet printing apparatus. The ink jetted by the inkjet printing apparatus can be located in an area surrounded by a second dike 600. The second dike 600 prevents ink from spilling into other adjacent pixels (PXs).

[0135] When ink including light-emitting elements (EDs) is ejected, an electrical signal can be applied to each of the first electrode 210 and the second electrode 220 to align the plurality of EDs on the first insulating layer 510. Specifically, the plurality of EDs can be aligned such that their two ends are respectively disposed on the first electrode 210 and the second electrode 220. Simultaneously, some of the EDs included in the ejected ink can be disposed between the first electrode 210 and the second electrode 220, but other EDs included in the ejected ink may not be disposed between the first electrode 210 and the second electrode 220.

[0136] Based on the relative arrangement between the two ends of the light-emitting element ED and the first electrode 210 and the second electrode 220, the plurality of light-emitting elements ED sprayed onto the substrate SUB may include the first light-emitting element ED1 and the second light-emitting element ED2.

[0137] The first light-emitting element ED1, which is dispersed in ink and sprayed into the area separated by the second dam 600, can be a light-emitting element with its two ends respectively disposed on the first electrode 210 and the second electrode 220, while its orientation and position are changed by receiving the dielectric force according to the electric field generated between the first electrode 210 and the second electrode 220.

[0138] On the other hand, the second light-emitting element ED2, dispersed in the ink and sprayed onto the light-emitting element ED in the area separated by the second dike 600, can be a light-emitting element whose two ends are not respectively disposed on the first electrode 210 and the second electrode 220, or a light-emitting element whose two ends are not disposed on the first electrode 210 or the second electrode 220. In this case, such a second light-emitting element ED2 can be referred to as a separate light-emitting element ED. At the same time, since at least one of the two ends of the second light-emitting element ED2 is not disposed on the first electrode 210 or the second electrode 220, electrical signals are not transmitted to the two ends of the second light-emitting element ED2. That is, the second light-emitting element ED2 can be a light-emitting element ED disposed in the emission region EMA but not emitting light. In addition, by creating a step with a thickness corresponding to the diameter of the light-emitting element ED in the process of forming multiple layers disposed on the second light-emitting element ED2, such a second light-emitting element ED2 will cause a defect in the display device 10. Therefore, the reliability of the display device 10 can be improved by removing such a second light-emitting element ED2 (that is, a separate light-emitting element ED2).

[0139] Next, refer to Figure 8 and Figure 9 A shadow mask SM can be disposed on the substrate SUB, and a first insulating pattern material layer 520 can be formed using the shadow mask SM. The first insulating pattern material layer 520 can be formed by a deposition process. For example, the opening OSM of the shadow mask SM can be configured to include an end region of the first electrode 210 and the second electrode 220 in the emission region EMA and a gap region between the first electrode 210 and the second electrode 220. That is, the opening OSM of the shadow mask SM can be superimposed on the region in which a first light-emitting element ED1 is disposed in each emission region EMA.

[0140] A first insulating pattern material layer 520 formed using a shadow mask SM can be formed on the first insulating layer 510 to completely cover the first light-emitting element ED1. By using a deposition process with the shadow mask SM, the first insulating pattern material layer 520 can even be partially deposited outside the opening OSM of the shadow mask SM. In this case, the outer shape of the first insulating pattern material layer 520 may include a tail shape protruding towards the second embankment 600. The first insulating pattern material layer 520 may not cover the second light-emitting element ED2. That is, the first insulating pattern material layer 520 may not be superimposed on the second light-emitting element ED2 on the third-direction DR3.

[0141] Next, refer to Figure 10 With the first insulating pattern material layer 520 formed on the first light-emitting element ED1, a process for removing the second light-emitting element ED2 can be performed. The removal of the second light-emitting element ED2 can be performed using a liquid processing process. After performing the deposition process using a shadow mask SM, the liquid processing process can be replaced with a liquid processing process for cleaning the substrate SUB, without adding a separate process. Since the first light-emitting element ED1 can be fixed by the first insulating pattern material layer 520 provided on it, it can be removed without a liquid processing process. On the other hand, since there is no layer fixing the second light-emitting element ED2 on it, the second light-emitting element ED2 can be removed from the substrate SUB by liquid processing. Simultaneously, the second light-emitting element ED2 removed from the substrate SUB can be recycled and reused. Therefore, the second light-emitting element ED2 is reused, thus reducing material costs.

[0142] like Figures 11 to 13 As shown, when the above-described liquid processing process is performed, the second light-emitting element ED2 can be removed from the substrate SUB. Meanwhile, in this embodiment, the first insulating patterned material layer 520 can be integrated onto one end of the first electrode 210 and one end of the second electrode 220, and integrated into the space between the first electrode 210 and the second electrode 220 to form a single patterned layer. In a plan view, the first insulating patterned material layer 520 can have a shape in which the first insulating patterned material layer 520 extends in a second direction DR2 within the emission region EMA. The first insulating patterned material layer 520 can form an island-shaped pattern. The first insulating patterned material layer 520 can be configured to cover the first opening OP1 and the second opening OP2.

[0143] Next, refer to Figure 14 and Figure 15 A first photoresist pattern PR1 is formed on the first insulating pattern material layer 520. The first photoresist pattern PR1 can be formed by forming a photoresist layer throughout the entire substrate SUB and then performing exposure and development.

[0144] Specifically, the first photoresist pattern PR1 can cover the entire display area DPA and pad area PDA. The first photoresist pattern PR1 can be formed to expose the space in which the light-emitting element ED and the first sub-dam 410 are spaced apart from each other and face each other. The first photoresist pattern PR1 can be formed to expose one end of the light-emitting element ED and a side surface of the first sub-dam 410 adjacent to one end of the light-emitting element ED. The first photoresist pattern PR1 can be formed to cover at least a portion of one end of the first insulating pattern material layer 520 disposed on the first sub-dam 410.

[0145] Next, refer to Figures 16 to 18 The first insulating pattern material layer 520 is etched using a first photoresist pattern PR1 as an etching mask. Through this process, the first insulating pattern material layer 520 exposed by the first photoresist pattern PR1 is etched, allowing the formation of a second insulating pattern material layer 520_1 and a second insulating pattern 522 spaced apart from each other in the first direction DR1. The second insulating pattern material layer 520_1 and the second insulating pattern 522 are not superimposed on the first opening OP1 in the third direction DR3. In other words, a portion of the first insulating pattern material layer 520 is etched by the etching process, exposing the first opening OP1 in the third direction DR3.

[0146] As described above, the first photoresist pattern PR1 can be formed to cover at least a portion of one end of the first insulating pattern material layer 520 disposed on the first sub-dam 410. Since the first photoresist pattern PR1 is formed to cover at least a portion of one end of the first insulating pattern material layer 520, the first insulating layer 510 disposed in the region overlapping with the second insulating pattern 522 and in the region adjacent to that region can be protected by the first photoresist pattern PR1. Therefore, damage to the first insulating layer 510 disposed in the corresponding region by the etchant can be prevented.

[0147] Next, refer to Figures 19 to 21 A patterned first contact electrode 710 can be formed on the first electrode 210. The patterned first contact electrode 710 can be formed using a mask process. For example, the first contact electrode 710 can be formed by completely depositing a material layer for the first contact electrode 710 in the display area DPA and then patterning the material layer for the first contact electrode 710. The material layer for the first contact electrode 710 can be formed to overlap with the first opening OP1, and the first electrode 210 and the first contact electrode 710 exposed through the first opening OP1 can be in contact with each other. The first contact electrode 710 can extend from one end of the light-emitting element ED to be partially disposed on the second insulating patterned material layer 520_1.

[0148] Next, refer to Figure 22 and Figure 23 The material layer 530' for the second insulating layer 530 is completely deposited on the substrate SUB. Next, a second photoresist pattern PR2 is formed by forming a photoresist layer on the material layer 530' for the second insulating layer 530, followed by exposure and development.

[0149] Specifically, a second photoresist pattern PR2 can be formed to expose a portion of the second insulating pattern material layer 520_1. The second photoresist pattern PR2 can be formed to expose the space in which the light-emitting element ED and the second sub-bank 420 are spaced apart from each other and face each other. The second photoresist pattern PR2 can be formed to expose the other end of the light-emitting element ED and a side surface of the second sub-bank 420 adjacent to the other end of the light-emitting element ED. The second photoresist pattern PR2 can be formed to cover at least a portion of one end of the second insulating pattern material layer 520_1 disposed on the second sub-bank 420.

[0150] Next, refer to Figures 24 to 26 The second photoresist pattern PR2 is used as an etching mask to etch the second insulating pattern material layer 520_1 and the material layer 530' for the second insulating layer 530. Through this process, the second insulating pattern material layer 520_1 and the material layer 530' exposed by the second photoresist pattern PR2 are etched, allowing the formation of a first insulating pattern 521 and a third insulating pattern 523 spaced apart from each other on the first direction DR1. As described above, the second photoresist pattern PR2 is formed to cover at least a portion of the other end of the second insulating pattern material layer 520_1 disposed on the second sub-dike 420, so that the first insulating layer 510 disposed in the area covered by the second insulating pattern material layer 520_1 can be protected and not etched by the etching process. Through this etching process, the second insulating pattern material layer 520_1 disposed on the second opening OP2 can be etched and exposed on the third direction DR3.

[0151] Meanwhile, in this etching process, the second insulating pattern material layer 520_1 and the material layer 530' for the second insulating layer 530 are etched together, such that each of the facing side surfaces of the first insulating pattern 521 and the third insulating pattern 523 can be aligned with the second insulating layer 530.

[0152] Next, refer to Figure 27 and Figure 28A patterned second contact electrode 720 disposed on the second electrode 220 in the display area DPA and a pad electrode 730 superimposed on the connection electrode 230 in the pad area PDA can be formed. The patterned second contact electrode 720 and the pad electrode 730 can be formed using the same mask process. For example, the second contact electrode 720 and the pad electrode 730 can be formed by completely depositing a material layer for the second contact electrode 720 in the display area DPA and then patterning the material layer for the second contact electrode 720. The material layer for the second contact electrode 720 can be formed to be superimposed on the second opening OP2 and the third opening OP3, through which the second electrode 220 and the second contact electrode 720 exposed can contact each other, and through the third opening OP3 the connection electrode 230 and the pad electrode 730 exposed can contact each other. The second contact electrode 720 can extend from one end of the light-emitting element ED to be partially disposed on the first insulating pattern 521.

[0153] Next, as Figure 3 and Figure 4 As shown, a third insulating layer 540 can be formed on the substrate SUB. The third insulating layer 540 can be completely disposed in the display area DPA and can be configured to expose a portion of the pad electrode 730 in the pad area PDA.

[0154] Other embodiments will be described below. In the following embodiments, repeated descriptions of components that are the same as those described above will be omitted or simplified, and components that are different from those described above will be described primarily.

[0155] Figure 29 This is a schematic cross-sectional view of the display area and pad area of ​​a display device according to another embodiment.

[0156] The display device according to this embodiment and the display device according to this embodiment Figure 3 The difference in the display device of the embodiment is that the first contact electrode 710_1, the second contact electrode 720_1 and the pad electrode 730_1 are formed in the same layer, and the second insulating layer 530 is omitted.

[0157] Specifically, the first contact electrode 710_1 and the second contact electrode 720_1 can be respectively disposed at one end and the other end of the light-emitting element ED, and can extend toward the first insulating pattern 521. The first contact electrode 710_1 and the second contact electrode 720_1 can be configured to cover the side surface of the first insulating pattern 521, and can be partially disposed on the upper surface of the first insulating pattern 521. The first contact electrode 710_1 and the second contact electrode 720_1 can be spaced apart from each other on the upper surface of the first insulating pattern 521.

[0158] The first contact electrode 710_1 may be configured to cover the second insulating pattern 522. The second contact electrode 720_1 may be configured to cover the third insulating pattern 523. The first contact electrode 710_1 may be directly disposed on the outer surface of the second insulating pattern 522, and the second contact electrode 720_1 may be directly disposed on the outer surface of the third insulating pattern 523, but this disclosure is not limited thereto.

[0159] Since the first contact electrode 710_1 and the second contact electrode 720_1 are formed in the same layer, the second insulating layer 530, which insulates the first contact electrode 710_1 and the second contact electrode 720_1 from each other, can be omitted. Therefore, the third opening OP3 formed in the first insulating layer 510 in the pad region PDA can be the pad opening between the pad electrode 730_1 and the connecting electrode 230. Because the insulating layer provided between the pad electrode 730_1 and the connecting electrode 230 is the first insulating layer 510, the step can be reduced. Therefore, the contact reliability between the pad electrode 730_1 and the connecting electrode 230 can be improved.

[0160] Figures 30 to 32 It is shown that it is used for Figure 29 A cross-sectional view of some process steps in the manufacturing method of the display device.

[0161] The process of forming a circuit element layer PAL, a first barrier 400, a first electrode 210 and a second electrode 220, a first insulating layer 510, a light-emitting element ED, a second barrier 600, and a first insulating pattern material layer 520 on a substrate SUB is as follows: Figures 6 to 13 The process is the same as that of the embodiments.

[0162] Next, refer to Figure 30 A third photoresist pattern PR3 is formed on the first insulating pattern material layer 520.

[0163] Specifically, a third photoresist pattern PR3 is formed by applying a photoresist layer to the first insulating pattern material layer 520 and the first insulating layer 510 and performing exposure and development, thereby forming a pattern shape having the first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 to be retained. In this case, the third photoresist pattern PR3 can be configured to overlap at least a portion of both ends of the first insulating pattern material layer 520. The third photoresist pattern PR3 being configured to overlap at least a portion of both ends of the first insulating pattern material layer 520 allows the first insulating layer 510 to be protected by the third photoresist pattern PR3. Therefore, damage to the first insulating layer 510 by the etchant used to etch the first insulating pattern material layer 520 can be prevented.

[0164] Next, refer to Figure 30 and Figure 31The first insulating pattern material layer 520 is etched using a third photoresist pattern PR3 as an etching mask. A first insulating pattern 521, a second insulating pattern 522, and a third insulating pattern 523 spaced apart from each other in the first direction DR1 can be formed by etching the first insulating pattern material layer 520 using the third photoresist pattern PR3.

[0165] Next, refer to Figure 32 The first contact electrode 710_1 and the second contact electrode 720_1 can be formed on the first insulating layer 510, the first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 in the display area DPA, and the pad electrode 730_1 can be formed on the first insulating layer 510 in the pad area PDA. The first contact electrode 710_1, the second contact electrode 720_1, and the pad electrode 730_1 can be formed by completely depositing a material layer for the contact electrodes on the substrate SUB and then patterning the material layer for the contact electrodes.

[0166] In the manufacturing method for a display device according to this embodiment, the first insulating pattern 521, the second insulating pattern 522, and the third insulating pattern 523 are patterned and formed using the same mask process, and the first contact electrode 710_1, the second contact electrode 720_1, and the pad electrode 730_1 are also patterned and formed using the same mask process. Therefore, the mask process can be omitted. Thus, separate additional mask processes for forming the first and second contact electrodes are not required, thereby improving process efficiency.

[0167] In concluding this detailed description, those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments disclosed in this invention are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. A display device, the display device comprising: Base; The first electrode is disposed on the substrate; The second electrode is configured to be spaced apart from the first electrode on the substrate; A light-emitting element is disposed on the first electrode and the second electrode, such that the two ends of the light-emitting element are respectively disposed on the first electrode and the second electrode; A first insulating pattern is disposed on the light-emitting element and exposes both ends of the light-emitting element; as well as A second insulating pattern is disposed on the first electrode and is configured to be spaced apart from the first insulating pattern. The first insulating pattern and the second insulating pattern both consist of the same material. Wherein, the second insulating pattern does not overlap with the two ends of the first electrode in the thickness direction of the substrate.

2. The display device according to claim 1, further comprising: The first contact electrode is in contact with one end of the light-emitting element and the first electrode. The first contact electrode is disposed on the first electrode to cover the second insulating pattern.

3. The display device according to claim 2, further comprising: A first insulating layer is disposed on the first electrode and the second electrode. The light-emitting element and the second insulating pattern are disposed on the first insulating layer, and The first contact electrode contacts the first electrode through a first opening that passes through the first insulating layer.

4. The display device according to claim 3, wherein, The first opening does not overlap with the first insulating pattern and the second insulating pattern in the thickness direction of the substrate.

5. The display device according to claim 1, further comprising: A third insulating pattern is disposed on the second electrode and is configured to be spaced apart from the first insulating pattern and the second insulating pattern. The third insulating pattern comprises the same material as the first insulating pattern and the second insulating pattern.

6. The display device according to claim 5, further comprising: A first contact electrode is disposed on the first electrode and is in contact with one end of the light-emitting element and the first electrode; as well as A second contact electrode is disposed on the second electrode and is in contact with the other end of the light-emitting element and the second electrode. The first contact electrode and the second contact electrode are configured to be spaced apart from each other on the first insulating pattern.

7. The display device according to claim 6, wherein, The first contact electrode is configured to cover the second insulating pattern, and The second contact electrode is configured to cover the third insulating pattern.

8. The display device according to claim 1, wherein, The thickness of the first insulating pattern is greater than the thickness of the second insulating pattern.

9. The display device according to claim 1, wherein, Each of the first and second insulating patterns has an island shape in the plan view.

10. The display device according to claim 1, wherein, The cross-sectional shape of the second insulating pattern is such that one side surface of the second insulating pattern facing the first insulating pattern is parallel to the first insulating pattern, and the other side surface of the second insulating pattern protrudes.

11. A display device, the display device comprising: Base; A first electrode is disposed on one surface of the substrate and extends in a first direction; The second electrode is disposed on one surface of the substrate, spaced apart from the first electrode, and extends in the first direction; A light-emitting element is disposed on the first electrode and the second electrode, such that the two ends of the light-emitting element are respectively disposed on the first electrode and the second electrode; A first insulating pattern is disposed on the substrate in the region between the first electrode and the second electrode, and extends in the first direction; as well as A second insulating pattern, spaced apart from the first insulating pattern, is disposed on the first electrode and extends in the first direction. Wherein, at least a portion of the first insulating pattern is disposed on the light-emitting element, and does not overlap with the two ends of the light-emitting element in the thickness direction of the substrate, and The second insulating pattern does not overlap with the two ends of the first electrode in the thickness direction of the substrate.

12. The display device according to claim 11, further comprising: The first contact electrode contacts one end of the light-emitting element and the first electrode, extends in the first direction, and covers the second insulating pattern.

13. The display device according to claim 11, wherein, The first insulating pattern and the second insulating pattern comprise the same material.

14. A method for manufacturing a display device, the method comprising: A substrate is prepared, the substrate comprising a first electrode and a second electrode spaced apart from each other and facing each other, and a plurality of light-emitting elements disposed on the first electrode or the second electrode; as well as A shadow mask is disposed on the substrate, and then an insulating pattern material layer is formed on the first electrode and the second electrode, and in the spacer region between the first electrode and the second electrode, using the shadow mask. Wherein, the insulating patterned material layer is stacked in the thickness direction of the substrate with the end of the first electrode facing the second electrode and the end of the second electrode facing the first electrode, and The substrate does not overlap with the other end of the first electrode and the other end of the second electrode in the thickness direction of the substrate.

15. The method of manufacturing a display device according to claim 14, wherein, The light-emitting element includes a first light-emitting element and a second light-emitting element. The two ends of the first light-emitting element are respectively disposed on the first electrode and the second electrode. At least one end of the second light-emitting element is not disposed on either the first electrode or the second electrode. The insulating patterned material layer is configured to cover the first light-emitting element.

16. The method of manufacturing a display device according to claim 15, wherein, The insulating patterned material layer does not overlap with the second light-emitting element in the thickness direction of the substrate. The method for manufacturing a display device further includes removing the second light-emitting element after the step of forming the insulating patterned material layer.

17. The method of manufacturing a display device according to claim 16, wherein, In the step of removing the second light-emitting element, the first light-emitting element is covered by the insulating pattern material layer and is not removed.

18. The method for manufacturing a display device according to claim 14, further comprising: The first insulating pattern, the second insulating pattern, and the third insulating pattern are formed by etching the insulating pattern material layer. The first insulating pattern is disposed on the light-emitting element and exposes both ends of the light-emitting element. The second insulating pattern is disposed on the first electrode. The third insulating pattern is disposed on the second electrode, and The first insulating pattern, the second insulating pattern, and the third insulating pattern are spaced apart from each other.

19. The method for manufacturing a display device according to claim 18, further comprising: A first contact electrode is formed that contacts one end of the light-emitting element and the first electrode, and a second contact electrode is formed that contacts the other end of the light-emitting element and the second electrode. The first contact electrode and the second contact electrode are configured to be spaced apart from each other. The first contact electrode is disposed on the first electrode to cover the second insulating pattern, and The second contact electrode is disposed on the second electrode to cover the third insulating pattern.

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