Wafer scrubbing apparatus
The pressure feedback system, composed of a lifting drive mechanism and a force sensor, solves the problems of insufficient wafer surface cleanliness and inaccurate brushing force control, achieving precise pressure control of the brush body on the wafer surface and consistent cleaning effect.
CN116116851BActive Publication Date: 2026-07-03HWATSING TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HWATSING TECHNOLOGY CO LTD
- Filing Date
- 2023-02-28
- Publication Date
- 2026-07-03
Smart Images
Figure CN116116851B_ABST
Abstract
This invention discloses a wafer cleaning device, comprising a swing arm, a lifting drive mechanism, an elastic support mechanism, a rotating shaft, a rotary drive mechanism, and a brush body. The lifting drive mechanism, the elastic support mechanism, and the rotary drive mechanism are all located above the swing arm. The lifting drive mechanism, the elastic support mechanism, and the rotating shaft are distributed vertically from top to bottom, and the lifting drive mechanism and the rotary drive mechanism are arranged adjacent to each other in the horizontal direction. The lifting drive mechanism is connected to the rotating shaft through the elastic support mechanism. The upper end of the rotating shaft is rotatably connected to the elastic support mechanism, and the lower end of the rotating shaft passes through the swing arm and connects to the brush body located below the swing arm. The rotary drive mechanism is connected to the rotating shaft and drives the brush body to rotate through the rotating shaft. A force sensor is provided between the lifting drive mechanism and the elastic support mechanism to detect and provide feedback to adjust the pressure applied by the lifting drive mechanism.
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