A ceramic slice knife blade sharpening device and method

Abstract

This invention relates to a ceramic slicing blade grinding apparatus and method. During processing, laser irradiation locally generates significant thermal stress in the ceramic material, inducing cracks. Simultaneously, a low-temperature coolant is sprayed to guide further crack propagation. During processing, a grinding wheel grinds and compresses the grinding fluid remaining in the cracks, causing further crack propagation and removal via brittle processes. Finally, the cutting edge is finished by the grinding action of the grinding wheel itself and a polishing device. The processing apparatus includes: a workpiece clamping mechanism, a laser and its focusing device, a feed mechanism, and a grinding wheel angle adjustment mechanism. Using the method proposed in this invention, high-efficiency removal of ceramic surface material can be achieved under the combined action of laser and mechanical processes. Processing does not involve cutting edge angles, reducing cutting forces, increasing tool life, and obtaining high-precision, high-quality machined surfaces.

Description

Technical Field

[0001] This invention belongs to the field of machining, and in particular relates to a processing device and method for grinding ceramic slicing blades. Background Technology

[0002] Currently, high-speed steel or cemented carbide cutting tools are commonly used in the aluminum foil and other product shearing industries. Traditional tools have low hardness and wear resistance, leading to high tool consumption costs. This is especially true in electromagnetic aluminum foil shearing, where tool wear is severe and cannot be re-sharpened, resulting in high production costs. Ceramic cutting tools, with their excellent heat resistance, wear resistance, and chemical stability, demonstrate unparalleled advantages over traditional tools in high-speed cutting and machining of difficult-to-machine materials. However, ceramic materials are characterized by poor toughness and high hardness, making them prone to brittle fracture during manufacturing, affecting processing quality and resulting in poor machinability. Currently, most ceramic materials are processed using laser-assisted machining, which utilizes laser irradiation to locally soften the material and control the generation of thermal cracks, removing the ceramic material in a plastic manner. Research on using laser irradiation to induce thermal cracks on the ceramic material surface for excess material removal is limited. Furthermore, laser radiation energy is typically absorbed in very thin areas (usually on the micrometer scale) of the material surface, failing to create a continuous tensile or compressive stress field along the thickness direction. This limitation makes it unsuitable for machining the thinner cutting edges of ceramic cutting tools.

[0003] With the increasing use of laser processing in ceramic materials, some scholars have begun to study how to use laser irradiation to induce cracks on the ceramic surface for processing. For example, patent application number 201410061230.9, published on June 4, 2014, discloses a "laser-induced thermal cracking grinding method for alumina engineering ceramics." This method utilizes laser irradiation supplemented by cooling argon gas to stimulate thermal cracks on the surface of alumina ceramics, resulting in a high-quality processed surface and improved processing performance of alumina engineering ceramics. Patent application number 201210468664.1, published on March 6, 2013, discloses a "laser heating-assisted arc-initiating micro-explosion processing method and device for engineering ceramic materials." This method uses laser preheating to soften the material, followed by arc-initiating micro-explosion processing of the softened material, improving material removal rate. Therefore, in-depth and systematic research on how to achieve low-cost, high-quality processing of engineering ceramics using laser-induced thermal cracking grinding technology is an important technical issue worthy of exploration in current ceramic processing research. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a ceramic slicing blade grinding device and processing method to address the shortcomings of the existing technology. The application of this method can obtain a high-quality processed surface with no melting and solidification layer and low roughness, which will greatly improve the machinability of ceramic materials. Compared with the traditional grinding process of engineering ceramics, it reduces grinding force, increases grinding ratio, and extends tool life.

[0005] A ceramic slicing blade grinding device includes a base, on which a workpiece clamping mechanism is arranged. A laser and its focusing device and a feeding mechanism are distributed on both sides of the workpiece clamping mechanism. A grinding wheel angle adjustment mechanism is arranged between the laser and its focusing device and the feeding mechanism.

[0006] Preferably, the workpiece clamping mechanism of the present invention includes a base, a stepper motor fixed on the lower surface of the base, a bracket mounted on the base, and a coolant wiping / polishing mechanism for changing work positions. The workpiece clamping mechanism uses a spring device to ensure that the mechanism is in close contact with the workpiece surface, a rotating shaft connected to the motor via a coupling, a bearing seat sleeved on the rotating shaft and fixed on the bracket, and a quick-change clamping system mounted on the top of the rotating shaft and rotating with the rotating shaft.

[0007] Preferably, the quick-change clamping system of the present invention has a symmetrical structure, including a workpiece bearing mounted on a central bearing with threads at both ends, two annular pressure plates placed on the upper and lower surfaces of the workpiece, a locking nut mounted on both ends of the central bearing to fix the workpiece, and two positioning rivets mounted on the end faces of the locking nuts to ensure that the system can rotate with the rotating shaft. Two reference zero-point chucks are mounted on the rotating shaft. The zero-point positioning system ensures high positioning accuracy after changing surfaces.

[0008] Preferably, the laser and its focusing device of the present invention include a rotating base fixed on a base, an L-shaped base plate mounted on the rotating base, a handwheel-type lead screw module mounted on the base plate and adjustable along the XZ axis, a laser fixed on the lead screw module worktable, and an angle adjustment mechanism fixed on the worktable.

[0009] Preferably, the feeding mechanism of the present invention includes a support frame fixed on the base, a slide table mounted on the support frame that can move in the Y direction, and a three-axis movable lead screw module, wherein the Z-axis movable module is mounted on an L-shaped plate and fixed on the X-axis movable module worktable.

[0010] Preferably, the grinding wheel angle adjustment mechanism of the present invention includes a rotary table fixed on the Z-axis moving module, an L-shaped bracket fixed on the surface of the rotary table, an electric spindle mounted on the L-shaped bracket, a grinding wheel chuck axially fixed on the electric spindle, and a cup-shaped grinding wheel mounted on the grinding wheel chuck, which is fixed by a locking nut and dynamically balanced.

[0011] Preferably, the base of the present invention includes a liquid storage bottom shell and a baffle. The liquid storage bottom shell is fixed to the lower surface of the base by bolts. The coolant can flow back into the liquid storage bottom shell through the hole on the base. During processing, the coolant is injected into the workpiece processing surface at a lower temperature through a cooling device. The baffle is installed on the base to prevent the coolant from flowing around during processing.

[0012] The processing method based on the ceramic slicing blade grinding device of the present invention includes the following steps:

[0013] Step 1: Clamping and positioning of the workpiece, laser, and cutting tool; specifically:

[0014] Fix the workpiece onto the quick-change clamping system, and install the quick-change clamping system into the two reference zero-point chucks on the rotating shaft to complete the workpiece positioning. Adjust the laser to a suitable position above the workpiece by rotating the base. At this time, turn on the laser and adjust the laser output power to the lowest power state. Adjust the output laser to be perpendicular to the cutting edge angle to be processed by the angle adjustment mechanism. Adjust the focal length using the laser focusing device to complete the focusing. Finally, focus the laser spot on the middle position of the material to be processed in the edge of the workpiece and then turn it off. Turn on the rotary table and adjust the cup-shaped grinding wheel to a position parallel to the required cutting edge angle of the workpiece. Turn on the lead screw module in the XYZ direction feed mechanism to perform tool setting. After tool setting, move the cup-shaped grinding wheel a certain distance along the Z direction to open the workpiece surface.

[0015] Step Two: Laser-Mechanical Composite Processing; Specifically:

[0016] Set the laser and grinding parameters, turn on the motor and set the speed. The workpiece starts to rotate. Turn on the laser and irradiate the material in the area to be processed. After the laser repeatedly irradiates the area to be processed for 2-3 revolutions, turn on the coolant switch and inject low-temperature coolant into the area after laser irradiation. At the same time, use the wiping / polishing mechanism to wipe away the coolant. Turn on the electric spindle and lead screw module, set the grinding wheel speed and feed rate, and the grinding wheel starts grinding the workpiece. After the grinding wheel has processed to a certain depth, turn off the laser.

[0017] Step 3: Grinding and polishing; specifically:

[0018] The coolant wiping mechanism is rotated to a diamond polishing cotton polishing surface. The grinding wheel itself removes all machining allowances. The ball screw module moves the cup-shaped grinding wheel away from the workpiece surface. The electric spindle is then turned off. After polishing, the polishing cotton is removed and the motor is shut off. To change the machining surface, the quick-change clamping system is removed from the rotating shaft. The unmachined surface of the workpiece is mounted face up in the two reference zero-point chucks on the rotating shaft. The above steps are then repeated to complete the machining of the other side of the ceramic slicing blade.

[0019] The laser-mechanical composite processing of the present invention utilizes laser irradiation to first induce cracks on the ceramic surface, then pours in coolant to intensify the cracks, and finally relies on the dynamic pressure effect generated by the grinding wheel itself and the residual grinding fluid in the cracks to further expand the cracks on the material surface and remove them in a brittle manner.

[0020] For ceramic materials with good laser reflection and light transmission, the material needs to be processed and removed multiple times before grinding and polishing. Before each processing, a layer of black light-absorbing material needs to be pre-coated on the surface of the area to be processed.

[0021] This invention, employing the above-mentioned technical solution, has the following advantages compared to existing technologies: This method differs from general laser-assisted processing of ceramic materials. During processing, the thermal cracks generated in the laser irradiation zone will further expand under the intensification of the low-temperature coolant. The dynamic pressure effect generated between the rotating feed wheel and the coolant in the crack will guide the crack to further expand and be removed in a brittle manner, improving processing efficiency. Finally, the grinding action of the grinding wheel and polishing with polishing cotton ensure a good surface quality of the processed ceramic material. Furthermore, the rapid face-changing positioning system can reduce the time for changing processing surfaces and ensure face-changing accuracy. This invention provides a simple, easy-to-use, low-cost, and high-precision experimental device for processing ceramic disc cutter blades, capable of processing blades of different angles and thicknesses. Attached Figure Description

[0022] Figure 1 A schematic diagram of the overall structure of the present invention;

[0023] Figure 2 yes Figure 1 Top view;

[0024] Figure 3 This is a schematic diagram of the quick face-changing clamping system of the present invention;

[0025] Figure 4 This is a flowchart illustrating the processing method of the present invention;

[0026] Figure 5 This is a schematic diagram of the angle during the processing of an embodiment of the present invention.

[0027] The markings in the diagram represent: 1-base, 2-stepper motor, 3-liquid reservoir, 4-baffle, 5-bracket, 6-bearing seat, 7-rotating shaft, 8-cup-shaped grinding wheel, 9-grinding wheel chuck, 10-electric spindle, 11-rotary table, 12-Z-axis lead screw module, 13-first-hand wheel-type lead screw module, 15-second-hand wheel-type lead screw module, 14-laser, 14-angle adjustment mechanism, 16-L-shaped base plate, 17-rotating base, 18-Y-axis lead screw module, 19-L-shaped bracket, 20-X-axis lead screw module, 21-L-shaped plate, 22-slide table, 23-bracket, 24-quick face-changing clamping system, 25-positioning rivet, 26-wiping / polishing mechanism, 27-reference zero-point chuck, 28-locking nut, 29-ring pressure plate, 30-workpiece. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-5 The technical solution of the present invention will be further described below.

[0029] like Figure 4 As shown, a method for grinding ceramic slicing blades includes the following steps:

[0030] Step 1: Clamping and positioning of the workpiece, laser, and cutting tool; specifically:

[0031] Workpiece 30 is fixed onto the quick-change clamping system 24, and the quick-change clamping system is installed into the two reference zero-point chucks 27 on the rotating shaft 7 to complete the workpiece positioning. The laser 14 is adjusted to a suitable position above the workpiece using the rotating base 17. The laser output power is then turned on and set to the lowest power level. The laser output is adjusted to be perpendicular to the cutting edge angle to be processed using the angle adjustment mechanism 14-1. The focus is adjusted using the laser focusing device to complete focusing. Finally, the laser spot is focused on the middle position of the material in the processing area on the edge of the workpiece and then turned off. The laser used is a continuous ND:YAG laser with a wavelength of 1.06μm. The rotary table 11 is turned on, and the cup-shaped grinding wheel 8 is adjusted to be parallel to the required cutting edge angle of the workpiece. The lead screw module in the XYZ direction feed mechanism is turned on for tool setting. After tool setting, the cup-shaped grinding wheel is moved a certain distance along the Z direction to open the workpiece surface. A diamond cup-shaped grinding wheel with an outer diameter of 120mm, a grit size of 400#, and a sand width of 10mm is used.

[0032] Step Two: Laser-Mechanical Composite Processing; Specifically:

[0033] Set the laser and grinding parameters, turn on motor 2 and set the speed. The workpiece begins to rotate. Turn on laser 14 to irradiate the material in the area to be processed. After the laser repeatedly irradiates the area 2-3 times, turn on the coolant switch to inject low-temperature coolant into the laser-irradiated area. Simultaneously, use the wiping / polishing mechanism 26 to wipe away the coolant to improve the subsequent laser effect. Turn on the electric spindle 10 and the lead screw module, set the grinding wheel speed and feed rate, and the grinding wheel begins to grind the workpiece. After the grinding wheel has processed to a certain depth, turn off the laser. Because the cup-shaped grinding wheel and the laser spot are at a certain distance along the radial direction of the workpiece during the processing, and this distance remains constant, as the grinding wheel feeds continuously, the cup-shaped grinding wheel will begin to grind the edge of the workpiece and remove the material in the laser-irradiated area of ​​the workpiece, thereby achieving the removal of hard and brittle materials.

[0034] Step 3: Grinding and polishing; specifically:

[0035] The coolant wiping mechanism is rotated to a diamond polishing cotton polishing surface. The grinding wheel itself removes all machining allowances. The ball screw module moves the cup-shaped grinding wheel away from the workpiece surface. The electric spindle is then turned off. After polishing, the polishing cotton is removed and the motor is shut off. To change the machining surface, the quick-change clamping system is removed from the rotating shaft. The unmachined surface of the workpiece is mounted face up in the two reference zero-point chucks on the rotating shaft. The above steps are then repeated to complete the machining of the other side of the ceramic slicing blade.

[0036] A ceramic slicing blade grinding device includes a workpiece clamping mechanism, a laser and its focusing device, a feeding mechanism, and a grinding wheel angle adjustment mechanism. Wherein:

[0037] like Figure 1 , Figure 2 As shown, the workpiece clamping mechanism of the present invention includes a base 1, a stepper motor 2 fixed on the lower surface of the base, a bracket 5 mounted on the base, and a coolant wiping / polishing mechanism 26 that can change work positions. The mechanism uses a spring device to ensure that the mechanism is in close contact with the workpiece surface, a rotating shaft 7 connected to the motor via a coupling, a bearing seat 6 sleeved on the rotating shaft and fixed on the bracket 23, and a quick-change clamping system 24 mounted on the top of the rotating shaft and capable of operating with the rotating shaft.

[0038] like Figure 1 , Figure 2 As shown, the laser and its focusing device of the present invention include a rotating base 17 fixed on a base, an L-shaped base plate 16 mounted on the rotating base, a first handwheel type lead screw module 13 and a second handwheel type lead screw module 15 mounted on the base plate and adjustable along the XZ axis, a laser 14 fixed on the lead screw module worktable, and an angle adjustment mechanism 14-1 fixed on the worktable.

[0039] like Figure 1 , Figure 2 As shown, the feeding mechanism of the present invention includes a support frame 5 fixed on a base, a slide 22 mounted on the support frame that can move in the Y direction, a Z-axis lead screw module 12, a Y-axis lead screw module 18, and an X-axis lead screw module 20, wherein the Z-axis moving module is mounted on an L-shaped plate 21 and fixed on the X-axis moving module worktable.

[0040] like Figure 1 , Figure 2 As shown, the grinding wheel angle adjustment mechanism of the present invention includes a rotary table 11 fixed on the Z-axis moving module, an L-shaped bracket 19 fixed on the surface of the rotary table 11, an electric spindle 10 mounted on the L-shaped bracket, a grinding wheel chuck 9 axially fixed on the electric spindle, and a cup-shaped grinding wheel 8 mounted on the grinding wheel chuck, which is fixed by a locking nut and dynamically balanced.

[0041] like Figure 1 , Figure 2 As shown, the base of the present invention includes a liquid storage shell 3 and a baffle 4. The liquid storage shell 3 is fixed to the lower surface of the base 1 by bolts. The coolant used when the device is working can flow back to the liquid storage shell through the hole on the base. During processing, the coolant is injected into the workpiece surface at a lower temperature through the cooling device. The baffle 4 is installed on the base to prevent the coolant from flowing around during processing.

[0042] like Figure 3 As shown, the quick-change clamping system of the present invention has a symmetrical structure, including a workpiece 30 mounted on a central bearing with threads at both ends, two annular pressure plates 29 placed on the upper and lower surfaces of the workpiece, a locking nut 28 mounted on both ends of the central bearing to fix the workpiece, and two positioning rivets 25 mounted on the end faces of the locking nuts to ensure that the system can rotate together with the rotating shaft 7. Two reference zero-point chucks 27 are mounted on the rotating shaft.

[0043] The processing method of the ceramic slicing blade grinding device of the present invention will be described below through two specific embodiments.

[0044] Example 1: As Figure 5 Using an alumina ceramic ring disc with an outer diameter of φ100mm, an inner diameter of φ30mm, and a thickness of 1mm as the workpiece material, a ceramic disc cutter with a cutting edge angle of 14° is machined. The machining method and processing device for grinding ceramic slicing blades proposed in this invention will be further explained.

[0045] The specific processing steps are as follows:

[0046] Step 1: Fix the alumina ceramic workpiece 30 onto the quick-change clamping system 24. Install the quick-change clamping system 24 into the two reference zero-point chucks on the rotating shaft 7 to complete the workpiece positioning. Adjust the laser 14 to a suitable position above the workpiece by rotating the base 1. At this time, turn on the laser 14 and adjust the laser output power to the lowest power state. Adjust the output laser to be perpendicular to the cutting edge to be processed by the angle adjustment mechanism 14-1. Adjust the focal length using the laser focusing device to complete the focusing. The spot diameter is 2mm. Finally, focus the laser spot on the middle position of the material to be processed in the edge of the workpiece and then turn it off. Open the rotary table 11 and adjust the cup-shaped grinding wheel 8 to be 7° counterclockwise with the X-axis, that is, parallel to the cutting edge. Open the lead screw module in the XYZ direction feed mechanism to perform tool setting. After tool setting, move the cup-shaped grinding wheel 8 a certain distance along the Z direction to open the workpiece surface.

[0047] Step Two: Set the laser power to 100W and the workpiece linear speed to 60mm / s. Turn on the laser to heat the workpiece material in the area to be processed. After repeated laser irradiation for 10-15 seconds, turn on the coolant switch to inject low-temperature coolant into the laser-irradiated area. At this time, start wiping / polishing the surface coolant of the material before laser irradiation to improve laser absorption. Turn on the electric spindle and lead screw, setting the spindle speed to 4500r / min and the grinding wheel feed speed to 0.05mm / s. The grinding wheel begins grinding the workpiece. During the processing, coolant is injected into the working area. The dynamic pressure effect generated between the grinding wheel and the grinding fluid further expands the surface cracks of the material and removes them in a brittle manner until a certain machining allowance is left to ensure subsequent polishing. Turn off the laser.

[0048] Step 3: Convert the coolant wiping mechanism into a diamond polishing cotton polishing device to grind the cutting edge. Adjust the grinding wheel feed speed to 0.01 mm / s, keeping the spindle speed constant. Use the grinding wheel's own grinding action to remove all machining allowance. Use the lead screw module to move the cup-shaped grinding wheel 8 away from the workpiece machining surface. Turn off the electric spindle. After polishing, remove the polishing cotton and turn off the motor. When changing the machining surface, remove the quick-change clamping system 24 from the rotating shaft 7. Mount the workpiece with the unmachined surface facing up in the two reference zero-point chucks on the rotating shaft. Repeat the above steps to complete the ceramic slicing knife processing.

[0049] Example 2: Unlike Example 1, this example uses zirconia ceramic material. Since zirconia ceramic is a semi-transparent material, it has a low absorption rate for lasers with a wavelength of 1.06μm and the laser beam can penetrate the material, which can easily cause internal damage to the ceramic. Therefore, a layer of graphite gel is applied to the area of ​​the zirconia ceramic to be processed, which makes it difficult for the laser to penetrate and improves the surface's ability to absorb laser.

[0050] The processing procedure is similar to that in Example 1, except that step 2 is different as follows:

[0051] Step Two: Set the laser power to 120W and the workpiece linear speed to 100mm / s. Heat the workpiece material in the area to be processed using the laser. After repeated laser irradiation for 6-10 seconds, turn on the coolant switch and inject low-temperature coolant into the laser-irradiated area. Then turn off the laser. Turn on the electric spindle 10 and the lead screw module 12, setting the grinding wheel speed to 5000r / min and the grinding wheel feed speed to 0.05mm / s. The grinding wheel begins grinding the workpiece. During the processing, inject coolant into the working area. After the cracks are removed by grinding, move the grinding wheel away from the workpiece surface along the Z-axis and turn off the coolant system. Continue applying a graphite gel coating to the processed surface. After the coating dries, turn on the laser again to irradiate the processed surface. Repeat this laser irradiation and grinding process, applying graphite gel before each irradiation, until a certain processing allowance is left for subsequent polishing.

[0052] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements without departing from the principle of the present invention, and these improvements should also be considered within the scope of protection of the present invention.

Claims

1. A processing method based on a ceramic slicing blade grinding device, characterized in that, The device includes a base (1), on which a workpiece clamping mechanism is arranged. Lasers and their focusing devices and feeding mechanisms are distributed on both sides of the workpiece clamping mechanism. A grinding wheel angle adjustment mechanism is arranged between the lasers and their focusing devices and feeding mechanisms. The workpiece clamping mechanism includes a coolant wiping / polishing mechanism (26) for changing workstations. A rotating shaft (7) is connected to a motor through a coupling. A bearing seat (6) is fitted on the rotating shaft and fixed on a bracket (23). A quick face-changing clamping system (24) is installed on the top of the rotating shaft and operates together with the rotating shaft. Includes the following steps: Step 1: Clamping and positioning of the workpiece, laser, and cutting tool; specifically: Fix the workpiece (30) onto the quick face-changing clamping system (24), install the quick face-changing system into the two reference zero-point chucks (27) on the rotating shaft (7) to complete the workpiece positioning, adjust the laser (14) to a suitable position above the workpiece by rotating the base (17), turn on the laser and adjust the laser output power to the lowest power state, adjust the output laser to be perpendicular to the cutting edge angle to be processed by the angle adjustment mechanism (14-1), adjust the focal length by using the laser focusing device to complete the focusing, and finally focus the laser spot on the middle position of the material to be processed in the edge of the workpiece and then turn it off; turn on the rotary table (11) and adjust the cup-shaped grinding wheel (8) to be parallel to the required cutting edge angle of the workpiece, turn on the screw module in the XYZ direction feed mechanism to perform tool setting, after the tool setting is completed, move the cup-shaped grinding wheel a certain distance along the z direction to open the workpiece surface; Step Two: Laser-Mechanical Composite Processing; Specifically: Set the laser parameters and grinding parameters, turn on the motor (2) and set the speed. The workpiece starts to rotate. Turn on the laser (14) and use the laser to irradiate the material in the area to be processed. After the laser irradiates the area to be processed 2-3 times, turn on the coolant switch and inject low-temperature coolant into the area after laser irradiation. At the same time, use the wiping / polishing mechanism (26) to wipe away the coolant. Turn on the electric spindle (10) and the lead screw module, set the grinding wheel speed and feed speed, and the grinding wheel starts to grind the workpiece. After the grinding wheel has processed to a certain depth, turn off the laser. Step 3: Grinding and polishing; specifically: The wiping / polishing mechanism (26) is rotated to the diamond polishing cotton to polish the surface after the workpiece is processed. The grinding wheel itself is used to remove all the processing allowance. The cup-shaped grinding wheel (8) is moved away from the workpiece surface by the lead screw module (12). The electric spindle is turned off. After polishing is completed, the polishing cotton is removed and the motor (2) is turned off. To change the processing surface, the quick-change clamping system (24) is removed from the rotating shaft (7). The unprocessed surface of the workpiece is installed in the two reference zero point chucks (27) on the rotating shaft with the unprocessed surface facing up. At this time, the above operation steps are repeated to complete the processing of the other side of the ceramic slicing blade. The laser-mechanical composite processing method first uses laser irradiation to create cracks on the ceramic surface, then pours in coolant to intensify the cracks, and finally relies on the dynamic pressure effect generated by the grinding wheel itself and the residual grinding fluid in the cracks to further expand the cracks on the material surface and remove them in a brittle manner.

2. The processing method according to claim 1, characterized in that: For ceramic materials with good laser reflection and light transmission, the material needs to be removed multiple times before grinding and polishing. Before each processing, a layer of black light-absorbing material needs to be pre-coated on the surface of the area to be processed.

3. The processing method according to claim 2, characterized in that, The workpiece clamping mechanism also includes a base (1), a stepper motor (2) fixed on the lower surface of the base, and a bracket (5) mounted on the base. The workpiece clamping mechanism uses a spring device to ensure that the mechanism is in close contact with the workpiece surface.

4. The processing method according to claim 2, characterized in that, The quick-change clamping system has a symmetrical structure, including a workpiece (30) mounted on a central bearing with threads at both ends, two annular pressure plates (29) placed on the upper and lower surfaces of the workpiece, a locking nut (28) mounted on both ends of the central bearing to fix the workpiece, two positioning rivets (25) mounted on the end face of the locking nut to ensure that the system can rotate with the rotating shaft (7), and two reference zero-point chucks (27) mounted on the rotating shaft (7).

5. The processing method according to claim 1, characterized in that, The laser and its focusing device include a rotating base (17) fixed on a base, an L-shaped base plate (16) mounted on the rotating base, a handwheel type lead screw module (13, 15) mounted on the base plate that can be adjusted along the XZ axis, a laser (14) fixed on the lead screw module worktable, and an angle adjustment mechanism (14-1) fixed on the worktable.

6. The processing method according to claim 1, characterized in that, The feeding mechanism includes a support frame (5) fixed on the base, a slide (22) mounted on the support frame that can move in the Y direction, and a three-axis movable lead screw module, wherein the Z-axis movable module is mounted on an L-shaped plate (21) and fixed on the X-axis movable module worktable.

7. The processing method according to claim 1, characterized in that, The grinding wheel angle adjustment mechanism includes a rotary table (11) fixed on the Z-axis moving module, an L-shaped bracket (19) fixed on the surface of the rotary table (11), an electric spindle (10) mounted on the L-shaped bracket, a grinding wheel chuck (9) axially fixed on the electric spindle, and a cup-shaped grinding wheel (8) mounted on the grinding wheel chuck, which is fixed by a locking nut and dynamically balanced.

8. The processing method according to claim 1, characterized in that, The base includes a liquid storage shell (3) and a baffle (4). The liquid storage shell (3) is fixed to the lower surface of the base (1) by bolts. The coolant can flow back into the liquid storage shell through the hole on the base. During processing, it is injected into the workpiece surface at a lower temperature through the cooling device. The baffle (4) is installed on the base to prevent the coolant from flowing around during processing.

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