Film for manufacturing electronic components and method for manufacturing electronic components

Abstract

The present disclosure provides a film for manufacturing an electronic component and a method for manufacturing an electronic component. The film for manufacturing an electronic component includes a polymer layer and metal nanowires dispersed in the polymer layer. The polymer layer can include a polyester compound such as polyethylene terephthalate. The metal nanowires can include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2021-0157011, filed on November 15, 2021, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a film for manufacturing electronic components and a method for manufacturing electronic components, and more specifically, to a film for manufacturing electronic components used in the manufacture of multilayer electronic components. Background Technology

[0003] When the thickness variation of the polyester film used in the manufacture of high-end thin / highly stacked multilayer ceramic capacitors (MLCCs) increases, the dielectric layer thickness distribution of the MLCC becomes uneven, resulting in decreased withstand voltage and increased short-circuit rate. Furthermore, as the dielectric layer becomes thinner, foreign matter introduced during molding and stacking processes (roll-to-roll) due to electrostatic discharge significantly impacts the characteristics of the MLCC product.

[0004] In existing technologies, to ensure tight adhesion and cooling of extruded high-temperature films (used in the manufacture of electronic components) on casting rollers, antistatic agents are added to the film during the polymer polymerization step, or the film is physically adhered and cooled via air nozzles. In this case, to impart antistatic properties to the film, a low molecular weight antistatic agent is injected into the film and moved to the surface, or a solution is coated onto the surface of the finished film and dried.

[0005] However, when an excessive amount of antistatic agent is added, its compatibility with the molten polymer decreases, which may lead to a reduction in the surface roughness of the film. Furthermore, in the case of air nozzles, the optimal cooling conditions are determined based on the distance between the air nozzle, the casting roller used for cooling, and the extruded film, and maximum cooling effect is not necessarily achieved at maximum air volume. Increasing the air volume to significantly increase the tightness of the extruded film's adhesion and cooling efficiency may result in air marks on the surface of the extruded film. Summary of the Invention

[0006] One aspect of this disclosure provides a membrane for manufacturing electronic components, the membrane being used to prevent the generation of static electricity during the manufacturing process.

[0007] One aspect of this disclosure also provides a membrane for manufacturing electronic components, the membrane being used to increase cooling efficiency during the manufacturing process.

[0008] One aspect of this disclosure also provides a film for manufacturing electronic components with uniform thickness.

[0009] Another aspect of this disclosure also provides a film for manufacturing electronic components, the film being used to facilitate the peeling of sheets during the manufacturing of electronic components and enabling the manufacturing of electronic components without damage.

[0010] According to one aspect of this disclosure, a film for manufacturing electronic components may include: a polymer layer and metal nanowires dispersed in the polymer layer.

[0011] According to one aspect of this disclosure, a method for manufacturing an electronic component may include peeling the electronic component from a film disposed on a membrane, wherein the membrane may include: a polymer layer; and metal nanowires dispersed in the polymer layer, the metal nanowires including a ferromagnetic metal including at least one of nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof. Attached Figure Description

[0012] The above and other aspects, features and advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0013] Figure 1 This is a schematic cross-sectional view showing a film for manufacturing electronic components according to exemplary embodiments of the present disclosure;

[0014] Figure 2 It is shown Figure 1 A schematic three-dimensional view of a film used in the manufacture of electronic components;

[0015] Figure 3 This is a schematic cross-sectional view illustrating the internal structure of a membrane for manufacturing electronic components according to exemplary embodiments of the present disclosure;

[0016] Figure 4 This is a plan view illustrating a film for manufacturing electronic components according to a variant example of this disclosure;

[0017] Figure 5 This is a diagram illustrating some processes for manufacturing films for electronic components according to exemplary embodiments of the present disclosure;

[0018] Figure 6 This is a schematic comparative diagram illustrating the improvement in peel strength when using a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure;

[0019] Figure 7 This is a schematic comparison diagram illustrating the improvement effect of the sheet wrinkle defect rate when using a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure; and

[0020] Figure 8This is a schematic comparative diagram illustrating the improvement in the number of burn-off occurrences when using a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0021] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0022] The films 10 and 11 for manufacturing electronic components according to the exemplary embodiments and variations of this disclosure can be used to manufacture electronic components such as capacitors (including multilayer ceramic capacitors (MLCCs)), inductors, and resistors. As an example, the films 10 and 11 for manufacturing electronic components can be used as substrate materials for molded and printed layers supporting the multilayer capacitor below the bottom layer in a process of stacking multilayer capacitors, to easily secure the electronic components during the stacking process, and can be used to reduce static electricity generation to prevent foreign matter ingress. After the process of stacking multilayer capacitors, the films 10 and 11 for manufacturing the electronic components can be peeled off from the electronic components.

[0023] The structure of the film for manufacturing electronic components according to the present disclosure will be described in detail below with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic cross-sectional view showing a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure. Figure 2 It is shown Figure 1 A schematic three-dimensional view of a film used in the manufacture of electronic components. Figure 3 This is a schematic cross-sectional view illustrating the internal structure of a membrane for manufacturing electronic components according to exemplary embodiments of the present disclosure.

[0025] A film 10 for manufacturing electronic components according to an exemplary embodiment may include a polymer layer 100 and metal nanowires 112 dispersed in the polymer layer 100. (See also...) Figure 1 The polymer layer 100 may include a front surface layer 110 and a rear surface layer 120 disposed on one surface of the front surface layer 110.

[0026] Reference Figure 2 According to an exemplary embodiment, the metal nanowires 112 may be dispersed in the front surface layer 110 of the film 10 used for manufacturing electronic components.

[0027] Specifically, refer to Figure 3 The front surface layer 110 may include a first resin layer 111 and metal nanowires 112 dispersed in the first resin layer 111.

[0028] The first resin layer 111 may comprise a polyester compound or a polyester polymer, and the main repeating unit of the first resin layer 111 may be at least one of, for example, polyethylene terephthalate and polyethylene naphthalate. As an example, the first resin layer 111 may comprise polyethylene terephthalate (PET) formed by the polycondensation of ethylene glycol and terephthalic acid. In this case, the polyethylene terephthalate can be prepared using a direct method with terephthalic acid, but it can also be prepared using dimethyl terephthalate via the DMT method.

[0029] The metal nanowires 112 can be wire structures with nanoscale dimensions. Here, the average diameter of the metal nanowires 112 can be from 10 nm to 1.0 μm, and the aspect ratio of the metal nanowires 112 can be from 10 to 500. Specifically, in the film 10 for manufacturing electronic components according to exemplary embodiments of the present disclosure, the metal nanowires 112 can include a metallic material, which can be a ferromagnetic metal. The metal nanowires can be synthesized by a vapor-liquid-solid (VLS) method, but are not limited thereto.

[0030] Examples of ferromagnetic metals may include, but are not limited to, at least one of nickel (Ni), cobalt (Co), iron (Fe), and alloys thereof. Since the film 10 for manufacturing electronic components according to an exemplary embodiment comprises metal nanowires 112 having both magnetic and conductive properties, the cooling efficiency of the extruded molten film can be improved by tightly adhering the extruded molten film to the casting roll or cooling roll in the casting process described later, and the film 10 for manufacturing electronic components may have antistatic properties to prevent damage to the ceramic layer due to static electricity. Therefore, a film 10 for manufacturing electronic components with a uniform thickness can be manufactured, improving wrinkling defects that may occur in the stacking process due to static electricity and preventing foreign matter ingress due to static electricity, thereby ultimately improving the characteristics of electronic components such as MLCCs.

[0031] like Figure 3 As shown, the metal nanowires 112 can be dispersed in the front surface layer 110, but are not limited thereto. As an example, the metal nanowires 112 can be dispersed in the second resin layer 121 of the rear surface layer 120 and the front surface layer 110. Furthermore, when the metal nanowires 112 are dispersed in the front surface layer 110, the front surface layer 110 can adhere tightly to the cooling roller (casting roller) 320, which will be described later. Therefore, due to the magnetic and conductive properties of the metal nanowires 112, the antistatic properties and tight adhesion of the film 10 can be improved.

[0032] In the film 10 for manufacturing electronic components according to an exemplary embodiment, the metal nanowires 112 may have a needle-like shape. That is, the metal nanowires 112 may have a columnar shape extending in one direction, but are not limited thereto.

[0033] When the metal nanowires 112 have a needle-like shape, the aspect ratio of the metal nanowires 112 can be from 10 to 500. In addition, the sheet resistance of the film 10 used for manufacturing electronic components can be adjusted by mixing multiple metal nanowires 112 with large differences in aspect ratio with each other and dispersing the mixed metal nanowires 112 in the first resin layer 111.

[0034] In the film 10 for manufacturing electronic components according to an exemplary embodiment, metal nanowires 112 may be included in a content of less than 0.2 wt% relative to the total weight of the front surface layer 110.

[0035] [Table 1]

[0036]

[0037]

[0038] Referring to Experimental Examples 1 to 3 in Table 1, the content of metal nanowires 112 relative to the total weight of the front surface layer 110 can be less than 0.2 wt%. However, as in Comparative Examples 2 and 3, when the content of metal nanowires 112 is 0.2 wt% or greater relative to the total weight of the front surface layer 110, the content of metal nanowires 112 may become higher, potentially leading to agglomeration of metal nanowires 112 in the front surface layer 110, which can reduce the antistatic properties of the film. Agglomeration of the metal nanowires can be observed using electron microscopy (such as transmission electron microscopy).

[0039] Furthermore, referring to Experimental Examples 1 to 3 in Table 1, when the metal nanowires 112 are included in the front surface layer 110, the thickness deviation of the film 10 used for manufacturing electronic components can be reduced compared to Comparative Example 1, which does not include the metal nanowires 112. Here, thickness deviation can refer to the value obtained by measuring the thickness of the front surface layer 110 including the metal nanowires 112 in multiple arbitrary regions (e.g., in 10 different arbitrary regions) and by subtracting the minimum measured thickness from the maximum measured thickness (max).

[0040] In other words, as shown in Experimental Examples 1 to 3, by including metal nanowires 112, the front surface layer 110 can become more uniform, and therefore the overall thickness of the film 10 used to manufacture electronic components can also become more uniform.

[0041] Furthermore, referring to Experimental Examples 1 to 3 in Table 1, it can be seen that when the surface layer 110 includes metal nanowires 112, the generated electrostatic voltage is reduced compared to Comparative Example 1, which does not include metal nanowires 112. Due to the reduced generated electrostatic voltage (as described above), foreign matter can be prevented from being introduced during the roll-to-roll process of manufacturing the film 10 for electronic components, and the phenomenon of foreign matter being introduced into the electronic components can be prevented when electronic components such as MLCCs are subsequently stacked on the film 10 for manufacturing electronic components. The electrostatic voltage can be measured using an electrostatic sensor, a contact electrostatic voltmeter, an electrostatic field meter, a coulomb meter, and / or a non-contact electrostatic voltmeter.

[0042] Additionally, referring to Table 1, when the surface layer 110 includes metal nanowires 112, the peel force (mN) can be reduced compared to Comparative Example 1, which does not include metal nanowires 112. In this disclosure, the reduction in peel force means that after the process of stacking electronic components, the films 10 and 11 used to manufacture the electronic components can be easily peeled from the electronic components or the molded and printed layers of the electronic components. The peel force can be measured by a T-peel test.

[0043] Reference Figure 3 According to an exemplary embodiment, the film 10 for manufacturing electronic components may further include a rear surface layer 120 disposed on one surface of the front surface layer 110.

[0044] The rear surface layer 120 may include a second resin layer 121 and a filler 122 dispersed in the second resin layer 121.

[0045] The main repeating unit of the second resin layer 121 may be at least one of polyethylene terephthalate and polyethylene naphthalate, and the second resin layer 121 may include, but is not limited to, the same material as the first resin layer 111. As an example, the second resin layer 121 may also contain polyethylene terephthalate (PET), but is not limited thereto, and may include other polyester compounds or polyester polymers. The polyethylene terephthalate of the second resin layer 121 may also be prepared using a direct method with terephthalic acid, but may also be prepared using dimethyl terephthalate via the DMT method.

[0046] The filler 122 can be a general inorganic filler. As an example, the filler 122 can be silicon dioxide (SiO2), but is not limited to it, and can be one or more inorganic fillers such as BaSO4, CaCO3 and TiO2, and the average particle size of the filler 122 can be from 2 μm to 5 μm, but is not limited to it.

[0047] Because the back surface layer 120 includes filler 122, the shape of the film 10 can be maintained in the roll-to-roll process for manufacturing the film 10 for electronic components, and the film 10 for manufacturing the electronic components can be smoothly transferred in the stretching process within the roll-to-roll process. Furthermore, in the process of manufacturing the film 10 for electronic components, the rigidity of the film 10 for manufacturing the electronic components can be sufficiently maintained by the filler 122.

[0048] In addition, Figure 3 As shown in the diagram, filler 122 is dispersed only in the rear surface layer 120, but this disclosure is not limited thereto. As an example, filler 122 may also be dispersed in the front surface layer 110.

[0049] In addition, refer to Figure 3 In the film 10 for manufacturing electronic components according to an exemplary embodiment, the average thickness of the rear surface layer 120 may be greater than the average thickness of the front surface layer 110.

[0050] In this disclosure, "average thickness" does not refer to the thickness in any single region, but may refer to the average of the thicknesses in multiple regions of the corresponding component. For example, the average thickness of the front surface layer 110 may refer to the average of values ​​obtained by measuring the shortest distance between one opposite surface of the front surface layer 110 and another surface in the stacking direction of the film 10 used to manufacture the electronic component in five arbitrary regions spaced apart from each other in the front surface layer 110.

[0051] Furthermore, the thickness ratio between the front surface layer 110 and the rear surface layer 120 can be from 1:9 to 3:7. That is, when the average thickness of the film 10 for manufacturing electronic components, including the front surface layer 110 and the rear surface layer 120, is 100%, the average thickness of the front surface layer 110 can be from 10% to 30%, and the average thickness of the rear surface layer 120 can be from 90% to 70%.

[0052] Since the front surface layer 110 and the rear surface layer 120 have the above-mentioned average thickness ratio, the film 10 for manufacturing electronic components according to the exemplary embodiment can have sufficient magnetism and sufficient conductivity, and sufficient rigidity can be obtained by the filler 122 in the process of manufacturing the film 10 for manufacturing electronic components.

[0053] Figure 4 This is a plan view illustrating a film for manufacturing electronic components according to a variant example of this disclosure.

[0054] Reference Figure 4 The image shows a membrane 11 for manufacturing electronic components according to a variant example.

[0055] According to a variant example, the film 11 for manufacturing electronic components may include a front surface layer 110, a rear surface layer 120 disposed on one surface of the front surface layer 110, and a release layer 200 disposed on another surface of the front surface layer 100 opposite to the one surface of the front surface layer 110.

[0056] Compared to the membrane 10 for manufacturing electronic components according to the exemplary embodiment, the membrane 11 for manufacturing electronic components according to the variant example only adds a release layer 200. Therefore, the description of the components other than the release layer 200 is the same as the description in the membrane 10 for manufacturing electronic components according to the exemplary embodiment above.

[0057] The release layer 200 may be disposed on another surface of the front surface layer 110 to allow the film 11 used for manufacturing electronic components to be easily peeled off from the electronic components or the molded / printed layers of the electronic components that will later be disposed on the film 11.

[0058] The release layer 200 may be a silicone release layer. For example, the release layer 200 may include a colored paint component comprising a mixture of alkenyl polysiloxane and hydrogen polysiloxane, a platinum-containing catalyst compound, an epoxy compound, a dye, and a residual amount of solvent, and may have a structure in which the colored paint component is coated once or more. Furthermore, the material of the release layer 200 according to this disclosure is not limited thereto. As another example, the release layer 200 according to this disclosure may include a silicone release component comprising dimethyl polysiloxane as a main material. Furthermore, the release layer 200 may have an average thickness of 10 nm to 200 nm.

[0059] Following the extrusion and cooling process of the film 10 for manufacturing electronic components, as described later, a release layer 200 may be applied and disposed on another surface of the front surface layer 110.

[0060] Since the film 11 for manufacturing electronic components according to the variant example includes a release layer 200, a front surface layer 110, and a back surface layer 120, and also includes metal nanowires 112 and filler 122, the sheet resistance (ohms / sq(Ω / □)) of the surface of the release layer 200 of the film 11 for manufacturing electronic components according to the variant example can be kept low. The sheet resistance can be measured by the four-probe method, also known as the Kelvin technique.

[0061] As an example, according to a variant of this disclosure, the release layer 200 of the film 11 for manufacturing electronic components may have one surface facing the front surface layer 110 and another surface opposite said one surface, and the sheet resistance on the other surface of the release layer 200 may be 10 Ω. 10Ω / □ or less. Therefore, the electrostatic voltage generated in the film 11 for manufacturing electronic components according to the variant example can be reduced, and foreign matter ingress and damage to electronic components caused by the generated static electricity can be prevented.

[0062] The descriptions of other components are repeated in the descriptions above of the film for manufacturing electronic components according to exemplary embodiments, therefore repeated descriptions are omitted.

[0063] Figure 5 This is a diagram illustrating some processes for manufacturing films for electronic components according to exemplary embodiments of the present disclosure.

[0064] Reference Figure 5 A molten film 10 for manufacturing electronic components can be extruded from an extruder 310. The molten film 10 includes a front surface layer 110 and a rear surface layer 120. In this case, in order to make the extruded molten film 10 for manufacturing electronic components extend uniformly in the transverse direction and to make the thickness of the extruded molten film for manufacturing electronic components uniform, it is necessary to significantly reduce the crystallinity in the extruded molten film 10.

[0065] to this end, Figure 5 The extruded molten film 10 for manufacturing electronic components can be tightly adhered to a casting roll or cooling roll 320 for a cooling process. The extruded molten film 10 for manufacturing electronic components can have a temperature of 260°C to 270°C and can be cooled by a cooling roll 320 having a temperature of 20°C to 25°C. In this case, the front surface layer 110 of the molten film 10 for manufacturing electronic components can be tightly adhered to the surface of the cooling roll 320 to contact the cooling roll 320, and metal nanowires 112 can be included in the front surface layer 110 to ensure high adhesion.

[0066] In order to perform the cooling process more effectively in the cooling roller 320, the molten film 10 for manufacturing electronic components needs to adhere more tightly to the cooling roller 320. As described above, the film 10 for manufacturing electronic components according to this disclosure may include metal nanowires 112 to be magnetic.

[0067] Taking advantage of the magnetic property of the film 10 used to manufacture electronic components, a magnetic strip 330 can be used. The magnetic force of the magnetic strip 330 can be from about 0.05N to about 10N. As an example, the magnetic strip can have an N pole, such that the surface of the molten film 10 used to manufacture electronic components near the magnetic strip 330 can have an S pole, and the surface of the molten film 10 used to manufacture electronic components near the cooling roller 320 can have an N pole. In this case, when the cooling roller 320 is controlled to have an S pole, the molten film 10 used to manufacture electronic components can adhere tightly to the cooling roller 320 by utilizing magnetic force without physical damage. Furthermore, control can be performed to make the magnetic force form in the opposite way to the example described above.

[0068] In the prior art, as a method for tightly adhering the molten film 10 used to manufacture electronic components to the cooling roller 320, there may be a physical tight adhesion method using an air nozzle or an electro-tight adhesion method using an antistatic agent and an electro-application method.

[0069] However, in the case of a physical adhesion method, air jets from the air nozzle can cause air marks to form on the surface of the molten film 10, which may physically damage the surface of the molten film 10 and make the thickness of the molten film 10 uneven.

[0070] Furthermore, in the case of the electro-adhesive method, the compatibility of the molten polymer may be reduced due to the excessive addition of antistatic agent, which may lead to a decrease in the surface roughness of the final film 10.

[0071] In this disclosure, by using magnetic metal nanowires 112, magnetic strips 330, and cooling rollers 320, the molten film 10 used for manufacturing electronic components can be effectively attached to the cooling rollers 320 without physical damage.

[0072] Subsequently, the molten film 10 used for cooling in the manufacture of electronic components can be extended 1.5 to 3 times in the longitudinal direction and 2 to 4 times in the transverse direction to manufacture a film with a thickness of 15 μm to 50 μm.

[0073] Figure 6 This is a schematic comparative diagram illustrating the improvement in peel strength when using a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure.

[0074] Reference Figure 6 The diagram shows a graph comparing the peel strength of films 10 and 11 for manufacturing electronic components according to exemplary embodiments and variations of the present disclosure, including metal nanowires 112, with the peel strength of films according to the prior art that do not include metal nanowires 112.

[0075] like Figure 6As shown in the diagram, compared to films according to the prior art, the peel force of films 10 and 11 for manufacturing electronic components according to the exemplary embodiments and variations can be reduced by approximately 25%. Therefore, films 10 and 11 for manufacturing electronic components according to the exemplary embodiments and variations can be easily peeled from electronic components or the molding and printed layers of electronic components that will later be mounted on films 10 and 11 for manufacturing electronic components according to the exemplary embodiments and variations, and damage to electronic components or the molding and printed layers of electronic components can be prevented.

[0076] Figure 7 This is a schematic comparison diagram illustrating the improvement in wrinkle defect rate of molded layers and printed layers (sheets, or ceramic sheets) when using films for manufacturing electronic components according to exemplary embodiments of the present disclosure.

[0077] Reference Figure 7 The diagram shows a graph comparing the wrinkle defect rate (ppm) caused by films 10 and 11 for manufacturing electronic components including metal nanowires 112 according to exemplary embodiments and variant examples of this disclosure with the wrinkle defect rate caused by films excluding metal nanowires 112 according to the prior art.

[0078] like Figure 7 As shown in the graph, the wrinkle defect rate caused by films 10 and 11 for manufacturing electronic components according to exemplary embodiments and variant examples can be reduced by approximately 81% compared to films according to the prior art. Since films 10 and 11 have a uniform thickness, damage to the shape of electronic components or the molded and printed layers of electronic components to be later disposed on films 10 and 11 can be prevented, thereby reducing the wrinkle defect rate and preventing foreign matter ingress due to static electricity.

[0079] Figure 8 This is a schematic comparative diagram illustrating the improvement in the number of times burn-off occurs on the surface of the stacked components due to static electricity when using a film for manufacturing electronic components according to an exemplary embodiment of the present disclosure.

[0080] Reference Figure 8 The diagram shows a graph comparing the number of times a product is burned off by films 10 and 11, which include metal nanowires 112 and are used for manufacturing electronic components, according to exemplary and variant examples of the present disclosure, with the number of times a product is burned off by films excluding metal nanowires 112 according to the prior art.

[0081] When anti-static protection cannot be adequately achieved, excessive voltage and current may be generated due to static electricity, which may cause burn-out when the static current exceeds the acceptable current.

[0082] like Figure 8 As shown in the chart, when 20,000 products were tested respectively, the burn-off phenomenon in films 10 and 11 for manufacturing electronic components according to the exemplary embodiments and variations of this disclosure was reduced by about 96% compared with films according to the prior art, thus preventing damage to the stacked components according to the exemplary embodiments and variations.

[0083] As described above, according to exemplary embodiments of the present disclosure, a film for manufacturing electronic components may be provided, the film being used to prevent the generation of static electricity during the manufacturing process.

[0084] Alternatively, a membrane for manufacturing electronic components can be provided, which improves cooling efficiency during the manufacturing process.

[0085] In addition, films with uniform thickness for manufacturing electronic components can be provided.

[0086] In addition, a film for manufacturing electronic components can be provided, which facilitates the peeling of sheets during the manufacturing of electronic components and enables the manufacturing of electronic components without damage.

[0087] Furthermore, this disclosure provides a film for manufacturing electronic components that reduces damage occurring in both the film manufacturing process and the electronic component manufacturing process by using metal nanowires to simultaneously ensure both conductivity and magnetism.

[0088] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A film for manufacturing electronic components, comprising: The polymer layer includes a front surface layer and a rear surface layer disposed on one surface of the front surface layer; as well as Metal nanowires are dispersed in the front surface layer of the polymer layer. Wherein, based on the total weight of the front surface layer, the content of the metal nanowires in the front surface layer is greater than or equal to 0.03 wt% and less than 0.2 wt%.

2. The film for manufacturing electronic components as claimed in claim 1, wherein, The polymer layer comprises polyester compounds.

3. The film for manufacturing electronic components as described in claim 2, wherein, The polyester compounds include polyethylene terephthalate.

4. The film for manufacturing electronic components as described in any one of claims 1 to 3, wherein, The metal nanowires include ferromagnetic metals.

5. The film for manufacturing electronic components as described in claim 4, wherein, The ferromagnetic metal includes at least one of nickel, cobalt, iron, and their alloys.

6. The film for manufacturing electronic components as claimed in claim 1, wherein, The average diameter of the metal nanowires is 10 nm to 1.0 μm.

7. The film for manufacturing electronic components as claimed in claim 1, wherein, The metal nanowires are also dispersed in the back surface layer of the polymer layer.

8. The membrane for manufacturing electronic components as claimed in claim 1, wherein the membrane for manufacturing electronic components further comprises filler dispersed in the polymer layer.

9. The film for manufacturing electronic components as claimed in claim 8, wherein, The filler is dispersed in the rear surface layer.

10. The film for manufacturing electronic components as claimed in claim 1 or 6, wherein, The aspect ratio of the metal nanowires is 10 to 500.

11. The film for manufacturing electronic components as claimed in claim 1, wherein, The content of the metal nanowires in the front surface layer is less than or equal to 0.1 wt%.

12. The film for manufacturing electronic components as claimed in claim 11, wherein, The polymer layer also includes a release layer disposed on another surface of the front surface layer.

13. The film for manufacturing electronic components as described in claim 12, wherein, The average thickness of the rear surface layer is greater than the average thickness of the front surface layer, and The thickness ratio between the front surface layer and the rear surface layer is 1:9 to 3:

7.

14. The film for manufacturing electronic components as described in claim 13, wherein, The release layer has one surface facing the front surface layer and another surface opposite the one surface of the release layer, wherein the sheet resistance of the other surface of the release layer is less than or equal to 10 Ω. 10 Ω / □.

15. The film for manufacturing electronic components as described in claim 5, wherein, The ferromagnetic metal includes nickel or its alloys.

16. The film for manufacturing electronic components as claimed in claim 5, wherein, The ferromagnetic metal includes cobalt or its alloys.

17. The film for manufacturing electronic components as claimed in claim 5, wherein, The ferromagnetic metal includes iron or its alloys.

18. A method for manufacturing an electronic component, the method comprising: The membrane is peeled off from the electronic components disposed on the membrane, wherein... The membrane comprises: The polymer layer includes a front surface layer and a rear surface layer disposed on one surface of the front surface layer; and Metal nanowires, dispersed in the front surface layer of the polymer layer, the metal nanowires comprising a ferromagnetic metal, the ferromagnetic metal comprising at least one of nickel, cobalt, iron, and alloys thereof. Wherein, based on the total weight of the front surface layer, the content of the metal nanowires in the front surface layer is greater than or equal to 0.03 wt% and less than 0.2 wt%.

19. The method for manufacturing an electronic component as described in claim 18, wherein, The electronic component is a capacitor.

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