Liquid discharge head and liquid discharge apparatus

Abstract

A liquid discharge head and a liquid discharge apparatus that enable appropriate sizing of a flexible substrate are provided. The liquid discharge head has a nozzle, a pressure chamber, a supply flow path that is located on one side in a first direction compared to the pressure chamber and that supplies liquid to the pressure chamber, a discharge flow path that is located on the other side in the first direction compared to the pressure chamber and that discharges liquid from the pressure chamber, a supply-side flexible substrate that absorbs vibration of the liquid in the supply flow path, and a discharge-side flexible substrate that absorbs vibration of the liquid in the discharge flow path. The length of the discharge-side flexible substrate along the first direction is shorter than the length of the supply-side flexible substrate along the first direction.

Description

Technical Field

[0001] This invention relates to a liquid ejector head and a liquid ejection device. Background Technology

[0002] The liquid ejector head described in Patent Document 1 includes: a nozzle for ejecting liquid; a pressure chamber communicating with the nozzle; a supply channel for supplying liquid to the pressure chamber; and a discharge channel for discharging liquid discharged from the pressure chamber. Liquid not ejected from the nozzle is discharged from the pressure chamber and flows within the discharge channel. The liquid ejector head also includes: a supply-side plastic substrate for absorbing vibrations of the liquid within the supply channel; and a discharge-side plastic substrate for absorbing vibrations of the liquid within the discharge channel.

[0003] In existing liquid ejection heads, the supply-side and discharge-side plastic substrates are of the same size. Since the flow rates of the liquid flowing through the supply channel and the discharge channel differ, there is still room for further research regarding the dimensions of the supply-side and discharge-side plastic substrates.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2021-130258 Summary of the Invention

[0005] The liquid ejector head of the present invention comprises: a nozzle for ejecting liquid; a pressure chamber for applying pressure to the liquid; a supply channel located on one side in a first direction relative to the pressure chamber and supplying liquid to the pressure chamber; a discharge channel located on the other side in the first direction relative to the pressure chamber and discharging liquid from the pressure chamber; a supply-side plastic substrate disposed facing the supply channel and for absorbing vibrations of the liquid in the supply channel; and a discharge-side plastic substrate disposed facing the discharge channel and for absorbing vibrations of the liquid in the discharge channel, wherein the length of the discharge-side plastic substrate along the first direction is shorter than the length of the supply-side plastic substrate along the first direction.

[0006] The liquid ejector head of the present invention comprises: a nozzle for ejecting liquid; a pressure chamber for applying pressure to the liquid; a supply channel located on one side in a first direction relative to the pressure chamber and supplying liquid to the pressure chamber; a discharge channel located on the other side in the first direction relative to the pressure chamber and discharging liquid from the pressure chamber; a supply-side plastic substrate disposed facing the supply channel and used to absorb vibrations of the liquid in the supply channel; and a discharge-side plastic substrate disposed facing the discharge channel and used to absorb vibrations of the liquid in the discharge channel, wherein the length of the discharge-side plastic substrate along the first direction is longer than the length of the supply-side plastic substrate along the first direction.

[0007] The liquid ejection device of the present invention includes: the liquid ejection head described above; and a control unit that controls the ejection action that causes liquid to be ejected from the liquid ejection head. Attached Figure Description

[0008] Figure 1 This is an exploded perspective view of the liquid ejector head involved in Example 1.

[0009] Figure 2 A cross-sectional view is shown to represent the liquid ejection head, and a cross-sectional view is shown to represent along... Figure 1 A diagram of the cross section of line II-II in the diagram.

[0010] Figure 3 This is a plan view showing a portion of the connecting plate involved in Embodiment 1.

[0011] Figure 4 This is a plan view showing a portion of the pressure chamber substrate involved in Embodiment 1.

[0012] Figure 5 This is a plan view showing the vibrating plate, piezoelectric element, and a portion of the pressure absorption section.

[0013] Figure 6 To indicate along Figure 5 A cross-sectional view of the cut surface of line VI-VI, showing the vibration absorption section on the supply side.

[0014] Figure 7 This is a cross-sectional view showing a portion of the vibrating plate, piezoelectric element, and vibration absorption part involved in Embodiment 1.

[0015] Figure 8 To indicate along Figure 5 A cross-sectional view of the section cut along line VIII-VIII, showing the vibration absorption section on the discharge side.

[0016] Figure 9 A plan view showing the length and width of the opening of the damper chamber formed below the plastic substrate.

[0017] Figure 10 A cross-sectional view showing the thickness of the plastic substrate.

[0018] Figure 11 This is a cross-sectional view showing the liquid ejector head involved in Example 2.

[0019] Figure 12 This is a plan view showing a portion of the connecting plate involved in Embodiment 2.

[0020] Figure 13 This is a plan view showing a portion of the pressure chamber substrate involved in Embodiment 2.

[0021] Figure 14 This is a cross-sectional view showing the liquid ejector head involved in Example 3.

[0022] Figure 15 This is a cross-sectional view showing a portion of the vibration absorption section on the supply side involved in Embodiment 3.

[0023] Figure 16 This is a cross-sectional view showing a portion of the vibration absorption section on the discharge side as described in Embodiment 3.

[0024] Figure 17 This is a plan view showing a portion of the connecting plate involved in Embodiment 5.

[0025] Figure 18 This is a plan view showing a portion of the pressure chamber substrate involved in Embodiment 5.

[0026] Figure 19 This is a cross-sectional view showing the liquid ejector head involved in Example 8.

[0027] Figure 20 This is a schematic diagram illustrating the liquid ejection device involved in the embodiment.

[0028] Figure 21 This is a block diagram illustrating the liquid ejection device involved in the embodiment. Detailed Implementation

[0029] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. However, the dimensions and scales of the various parts in the drawings differ appropriately from the actual situation. Furthermore, since the embodiments described below are preferred examples of the present invention, various technically preferred limitations have been added; however, unless otherwise stated in the following description, the scope of the present invention is not limited to these embodiments.

[0030] In the following description, the three intersecting directions may be defined as the X-axis, Y-axis, and Z-axis. The X-axis includes the X1 and X2 directions, which are opposite directions. The X-axis is an example of the first direction. The Y-axis includes the Y1 and Y2 directions, which are opposite directions. The Y-axis is an example of the second direction. The Z-axis includes the Z1 and Z2 directions, which are opposite directions. The Z1 direction is an example of the third direction. The X-axis, Y-axis, and Z-axis are orthogonal. The Z-axis is typically along the vertical direction, but it may not be along the vertical direction.

[0031] Example 1

[0032] Reference Figures 1 to 8 The liquid ejector head 10 involved in Example 1 will be described in this way. Figure 1 An exploded perspective view of the liquid ejector head 10 involved in Example 1 is shown. Figure 2 A cross-sectional view showing the liquid ejection head 10, and a view showing along... Figure 1 A diagram of the cross section of line II-II in the diagram. Figure 3 This is a partial plan view showing a portion of the connecting plate 24. Figure 4 This is a partial plan view showing a portion of the pressure chamber substrate 25 involved in Embodiment 1. Figure 5 This is a plan view showing a portion of the vibrating plate, piezoelectric element, and vibration absorption section involved in Embodiment 1. The liquid ejector head 10 employs a circulation method that circulates the liquid that has flowed through the common liquid chambers RA and RB and the pressure chambers CA and CB, which will be described later.

[0033] Furthermore, in this specification, the terms "supply side" and "discharge side" are sometimes used. "Supply side" refers to the upstream side of the liquid flow path compared to the pressure chamber C. Additionally, the portion associated with the upstream side compared to the pressure chamber C is sometimes referred to as the "supply side." For example, as described later, there is a case described as "a plastic substrate on the supply side." "Discharge side" refers to the downstream side of the liquid flow path compared to the pressure chamber C. Furthermore, the nozzle N, described later, is not included in the "discharge side." Additionally, the portion associated with the downstream side compared to the pressure chamber C is sometimes referred to as the "discharge side." For example, as described later, there is a case described as "a plastic substrate on the discharge side."

[0034] The liquid ejector head 10 includes a nozzle substrate 21, a connecting plate 24, a pressure chamber substrate 25, a vibrating plate 26, a sealing plate 27, and a piezoelectric element 50. Furthermore, the liquid ejector head 10 includes a housing 28 and a COF 60. COF is an abbreviation for Chip on Film. The liquid ejector head 10 has malleable substrates 23A and 23B and damper chambers DA and DB. In this embodiment, the liquid ejector head 10 that ejects ink, as an example of a liquid, will be described. The liquid is not limited to ink; the liquid ejector head 10 can eject other liquids.

[0035] The thickness direction of the nozzle substrate 21, the connecting plate 24, the pressure chamber substrate 25, the vibrating plate 26, the sealing plate 27, and the housing 28 is along the Z-axis. The nozzle substrate 21 is disposed at the bottom of the liquid ejection head 10. The connecting plate 24 is disposed in the Z2 direction of the nozzle substrate 21. The pressure chamber substrate 25 is disposed in the Z2 direction of the connecting plate 24. In other words, the connecting plate 24 is disposed between the pressure chamber substrate 25 and the nozzle substrate 21. In the Z2 direction of the pressure chamber substrate 25, the vibrating plate 26 and the plastic substrates 23A and 23B are formed.

[0036] A sealing plate 27 is disposed in the Z2 direction of the vibrating plate 26 and the malleable substrates 23A and 23B. The sealing plate 27 includes a portion in the X-axis direction that is outermost compared to the malleable substrates 23A and 23B. This outer portion of the sealing plate 27 in the X-axis direction is located in the Z2 direction of the pressure chamber substrate 25. The sealing plate 27 covers the vibrating plate 26, the malleable substrates 23A and 23B, the plurality of piezoelectric elements 50, and the pressure chamber substrate 25. A housing 28 is disposed on the sealing plate 27. The piezoelectric elements 50 are correspondingly arranged in the pressure chamber CA.

[0037] Next, the flow channel 40 for ink flow will be described. An ink flow channel 40 is formed in the liquid ejector head 10. The flow channel 40 includes a supply port 42A, an outlet port 42B, common liquid chambers RA and RB, damper chambers DA and DB, a pressure chamber C, connecting flow channels 47A to 47C, and a nozzle N.

[0038] The flow channel 40 has a supply flow channel 41A and a discharge flow channel 41B. The supply flow channel 41A is an upstream flow channel relative to the pressure chamber C, and is located within the connecting plate 24 and the pressure chamber base plate 25. The supply flow channel 41A includes flow channel 45A, connecting flow channel 46A, and damper chamber DA. The discharge flow channel 41B is a downstream flow channel relative to the pressure chamber C, and is located within the connecting plate 24 and the pressure chamber base plate 25. The discharge flow channel 41B includes connecting flow channel 47C, connecting flow channel 47B, damper chamber DB, flow channel 46B, and flow channel 45B. Furthermore, the supply flow channel 41A does not include the flow channel 44A within the sealing plate 27 or the flow channel 43A within the housing 28. The discharge flow channel 41B does not include the flow channel 44B within the sealing plate 27 or the flow channel 43B within the housing 28.

[0039] A common liquid chamber RA is provided for use by multiple pressure chambers C. The common liquid chamber RA is continuous in the Y-axis direction. The common liquid chamber RA includes a flow channel 43A provided on the housing 28, a flow channel 44A provided on the sealing plate 27, a flow channel 45A provided on the pressure chamber base plate 25, and a flow channel 46A provided on the connecting plate 24. These flow channels 43A, 44A, 45A, and 46A are continuous in the Z-axis direction. Flow channels 45A and 46A are an example of a common supply flow channel. Flow channels 43A and 44A in the common liquid chamber RA are not included in the common supply flow channel.

[0040] Multiple connecting channels 47A are separately provided for multiple pressure chambers C. Multiple connecting channels 47A are configured downstream of a common liquid chamber RA. Connecting channels 47A communicate with channel 46A.

[0041] Multiple damper chambers DA are separately provided for multiple pressure chambers C. Each damper chamber DA is positioned between multiple connecting channels 47A and multiple pressure chambers C. The damper chamber DA is located in the Z2 direction of the connecting channel 47A. The damper chamber DA is connected downstream of the connecting channel 47A. The damper chamber DA is located in the X1 direction of the pressure chambers C. The damper chamber DA is connected upstream of the pressure chambers C. The connecting channel 47A and the damper chamber DA are an example of an "independent supply channel". The damper chamber DA is a damper chamber on the supply side.

[0042] Multiple nozzles N are connected to multiple pressure chambers C. The nozzles N are located in the Z1 direction of the pressure chambers C.

[0043] Multiple connecting channels 47C are separately provided for multiple pressure chambers C. The multiple connecting channels 47C are connected to the downstream of the pressure chambers C. The X2 direction end of the pressure chamber C, which is the downstream end, and the X1 direction end of the connecting channels 47C, which is the upstream end, overlap when viewed in the Z-axis direction.

[0044] The connecting channel 47B is provided separately for multiple connecting channels 47C. The connecting channel 47B is configured downstream of the connecting channel 47C.

[0045] Multiple damper chambers DB are separately provided for multiple pressure chambers C. The damper chambers DB are located in the Z2 direction of the connecting flow channel 47B. The multiple damper chambers DB are connected to the multiple connecting flow channels 47B respectively. The damper chambers DB are connected to the pressure chambers C via connecting flow channels 47B and 47C. The connecting flow channels 47B and 47C and the damper chambers DB constitute an example of an "independent discharge flow channel". The damper chambers DB are discharge-side damper chambers.

[0046] The common liquid chamber RB is shared by multiple pressure chambers C. The common liquid chamber RB is commonly connected to multiple connecting channels 47B. The common liquid chamber RB is connected to the pressure chambers C via connecting channels 47B and 47C. The common liquid chamber RB is located downstream of connecting channel 47B.

[0047] The common liquid chamber RB is continuous in the Y-axis direction. The common liquid chamber RB includes a flow channel 43B disposed on the housing 28, a flow channel 44B disposed on the sealing plate 27, a flow channel 45B disposed on the pressure chamber base plate 25, and a flow channel 46B disposed on the connecting plate 24. These flow channels 43B, 44B, 45B, and 46B are continuous in the Z-axis direction. Flow channels 45B and 46B are an example of a common discharge flow channel. Flow channels 43B and 44B in the common liquid chamber RB are not included in the common discharge flow channel.

[0048] As mentioned above, the liquid ejector head 10 employs a circulation method that recirculates the ink that has flowed through the pressure chamber C. Figure 20 As shown, a circulation mechanism 8 for circulating ink is connected to the liquid nozzle 10. A liquid container 2 is connected to the circulation mechanism 8. The circulation mechanism 8 includes a supply channel 81 for supplying ink to the liquid nozzle 10, a recovery channel 82 for recovering ink discharged from the liquid nozzle 10, and a pump 83 for transferring ink. The supply channel 81 and the recovery channel 82 may, for example, be channels within a flexible hose. The supply channel 81 and the recovery channel 82 include channels formed through openings, grooves, recesses, etc.

[0049] The ink in liquid container 2 is transferred by pump 83 and flows through supply channel 81 and through... Figure 2 The ink flows into the common liquid chamber RA through the supply port 42A. The ink in the common liquid chamber RA flows through the connecting channel 47A and the damper chamber DA and is supplied to the pressure chamber C. A portion of the ink in the pressure chamber C is ejected from the nozzle N.

[0050] Ink that is not ejected from nozzle N flows through connecting channels 47C and 47B into the common liquid chamber RB. A portion of the ink flowing through connecting channel 47C flows into the damper chamber DB. The ink in the common liquid chamber RB flows through outlet 42B into the recovery channel 82 and is recovered into the liquid container 2. In this way, the ink is circulated in the liquid ejector head 10.

[0051] Next, the structure of the liquid ejector head 10 will be described. Figure 1 as well as Figure 2A plurality of nozzles N are formed on the nozzle substrate 21 shown. The plurality of nozzles N constitute a nozzle array N1. The nozzle array N1 includes a plurality of nozzles N arranged in the Y-axis direction. The nozzles N are through holes that penetrate the nozzle substrate 21 in the Z-axis direction.

[0052] like Figure 2 as well as Figure 3 As shown, flow channels 46A, 47A, 47C, and 47B, which are part of the common liquid chamber RA, and flow channel 46B, which is part of the common liquid chamber RB, are formed on the connecting plate 24. That is, a supply flow channel and a portion of a discharge flow channel are provided on the connecting plate 24. Through holes, grooves, or recesses are formed on the connecting plate 24. Through these through holes, grooves, or recesses, portions of the common liquid chambers RA and RB, and the connecting flow channels 47A, 47B, and 47C are formed.

[0053] Furthermore, a portion of a plurality of nozzles N is formed on the connecting plate 24. For example... Figure 2 As shown, the nozzle N penetrates the connecting plate 24 and the nozzle base plate 21 in the Z-axis direction. On the connecting plate 24, a portion of the nozzle N is formed on the side closest to the pressure chamber C.

[0054] like Figure 2 as well as Figure 4 As shown, on the pressure chamber substrate 25, there are flow channels 45A as part of the common liquid chamber RA, multiple damper chambers DA, multiple pressure chambers C, multiple damper chambers DB, and flow channels 45B as part of the common liquid chamber RB. Additionally, in Figure 4 In the diagram, multiple nozzles N are shown using dashed lines. The pressure chamber substrate 25 can be manufactured, for example, from a monocrystalline silicon substrate. The pressure chamber substrate 25 can also be manufactured from other materials.

[0055] like Figure 4 As shown, multiple damper chambers DA extend in the X-axis direction. The damper chambers DA and the common liquid chamber RA are separated from each other in the X-axis direction. The damper chambers DA and the pressure chamber C are formed as a continuous common space in the X-axis direction. The damper chambers DA penetrate the pressure chamber substrate 25 in the Z-axis direction. The damper chambers DA have a predetermined volume. The multiple damper chambers DA are arranged at predetermined intervals in the Y-axis direction. Alternatively, a relay flow channel may be formed between the damper chambers DA and the pressure chamber C.

[0056] Pressure chamber C extends in the X-axis direction. Pressure chamber C penetrates pressure chamber substrate 25 in the Z-axis direction. Pressure chamber C has a predetermined volume. Multiple pressure chambers C are arranged at predetermined intervals in the Y-axis direction. Multiple pressure chambers C are arranged in the Y-axis direction at the same positions as multiple damper chambers DA. Multiple pressure chambers C constitute a pressure chamber row CL arranged in the Y-axis direction. Pressure chamber row CL includes multiple pressure chambers C. Additionally, in Figure 4 In the diagram, imaginary lines L1 and L2, representing the boundaries of pressure chamber C, are shown using double-dotted lines. Imaginary line L1 represents the end of pressure chamber C in the X1 direction. Imaginary line L2 represents the end of pressure chamber C in the X2 direction.

[0057] Multiple damper chambers DB extend along the X-axis. The damper chambers DB are separated from the pressure chamber C along the X-axis. For example... Figure 2 As shown, a connecting flow channel 47C is formed between the damper chamber DB and the pressure chamber C. The damper chamber DB and the common liquid chamber RB are separated from each other in the X-axis direction. When viewed in the Z-axis direction, the damper chamber DB is formed in a manner that overlaps with the connecting flow channel 47B. The damper chamber DB penetrates the pressure chamber substrate 25 in the Z-axis direction. The damper chamber DB is connected to the connecting flow channel 47B in the Z-axis direction. The damper chamber DB has a predetermined volume. Multiple damper chambers DB are arranged at predetermined intervals in the Y-axis direction.

[0058] like Figure 4 As shown, the width W1 of the damper chamber DA on the supply side along the X-axis is different from the length W2 of the damper chamber DB on the discharge side along the X-axis. The length W1 of the damper chamber DA on the supply side along the X-axis is larger than the length W2 of the damper chamber DB on the discharge side. The width of the damper chamber DA along the Y-axis is the same as the width of the damper chamber DB along the Y-axis.

[0059] Figure 6 To indicate along Figure 5 A cross-sectional view of the cut surface along line VI-VI. Figure 7 This is an enlarged cross-sectional view showing a portion of the vibrating plate 26, the piezoelectric element 50, and the COM wiring 54. (See attached image.) Figure 6 as well as Figure 7 As shown, a vibrating plate 26 is disposed on the upper surface of the pressure chamber substrate 25. The vibrating plate 26 covers the opening of the pressure chamber substrate 25. The portion of the vibrating plate 26 that covers the opening of the pressure chamber substrate 25 constitutes the upper wall of the pressure chamber C.

[0060] The vibrating plate 26 includes an elastic layer 26a and an insulating layer 26b. The elastic layer 26a is made of, for example, silicon dioxide (SiO2). The insulating layer 26b is made of, for example, zirconium dioxide (ZrO2). The elastic layer 26a is formed on the pressure chamber substrate 25, and the insulating layer 26b is formed on the elastic layer 26a.

[0061] like Figures 5 to 7 As shown, a plurality of piezoelectric elements 50 are formed on the vibrating plate 26. The piezoelectric elements 50 are positioned at locations that overlap with the pressure chamber C when viewed in the Z-axis direction. The piezoelectric elements 50 are respectively provided for the plurality of pressure chambers C.

[0062] The vibrating plate 26 is driven by the piezoelectric element 50, thereby vibrating in the Z-axis direction. The vibrating plate 26, which forms the upper wall of the pressure chamber C, is driven by the piezoelectric element 50 on the pressure chamber C. The total thickness of the vibrating plate 26 is, for example, 2 μm or less. The total thickness of the vibrating plate 26 may also be 15 μm or less, 40 μm or less, or 100 μm or less. For example, when the total thickness of the vibrating plate 26 is 15 μm or less, a resin layer may be included. The vibrating plate 26 may also be formed of metal. Examples of metals include stainless steel and nickel. When the vibrating plate 26 is made of metal, the plate thickness of the vibrating plate 26 may be more than 15 μm and less than 100 μm.

[0063] Figure 6 as well as Figure 7 The piezoelectric element 50 shown has individual electrodes 51, a common electrode 52, and a piezoelectric layer 53. The individual electrodes 51, the piezoelectric layer 53, and the common electrode 52 are stacked in this order on the vibrating plate 26. The piezoelectric layer 53 is held by the individual electrodes 51 and the common electrode 52. The individual electrodes 51 are elongated along the X-axis. Multiple individual electrodes 51 are arranged at intervals along the Y-axis. Each individual electrode 51 is configured for each of a plurality of pressure chambers C. The individual electrodes 51 are respectively positioned at locations overlapping the plurality of pressure chambers C when viewed along the Z-axis. The common electrode 52 is strip-shaped and extends along the Y-axis. The common electrode 52 is continuous in a manner that covers the multiple individual electrodes 51.

[0064] The independent electrode 51 includes a substrate layer and an electrode layer. The substrate layer contains, for example, titanium (Ti). The electrode layer contains, for example, a low-resistivity conductive material such as platinum (Pt) or iridium (Ir). The electrode layer can also be formed using oxides such as strontium ruthenate (SrRuO3) and lanthanum nickelate (LaNiO3). The piezoelectric layers 53A and 53B are formed, for example, using known piezoelectric materials such as lead zirconate titanate (Pb(Zr,Ti)O3) or ceramics.

[0065] The common electrode 52 includes a base layer and an electrode layer. The base layer may contain, for example, titanium. The electrode layer may contain, for example, a low-resistivity conductive material such as platinum or iridium. This electrode layer may also be formed using oxides such as strontium ruthenium ruthenium oxide and lanthanum nickel oxide. The region between the individual electrode 51 and the common electrode 52 in the piezoelectric layer 53 is called the driving region. Driving regions are formed on each of the multiple pressure chambers C.

[0066] A predetermined reference voltage is applied to the common electrode 52. This reference voltage is a constant voltage and is, for example, set to be higher than the ground voltage. A holding signal with a constant voltage is applied to the common electrode 52, for example. A drive signal with a varying voltage is applied to the independent electrode 51. Thus, a voltage equivalent to the difference between the reference voltage applied to the common electrode 52 and the drive signal supplied to the independent electrode 51 is applied to the piezoelectric layer 53. The drive signal corresponds to the amount of liquid ejected from the nozzle N.

[0067] By applying a voltage between the independent electrode 51 and the common electrode 52 to deform the piezoelectric layer 53, the piezoelectric element 50 generates energy that causes the vibrating plate 26 to flex.

[0068] By utilizing the energy generated by the piezoelectric element 50 to vibrate the vibrating plate 26, the pressure of the liquid in the pressure chamber C changes, thereby causing the liquid in the pressure chamber C to be ejected from the nozzle N.

[0069] like Figure 1 as well as Figure 2 As shown, the COF60 includes a flexible wiring substrate 61 and a driving circuit 62. The flexible wiring substrate 61 is a flexible wiring substrate. The flexible wiring substrate 61 is, for example, an FPC. The flexible wiring substrate 61 can also be, for example, an FFC. FPC is an abbreviation for Flexible Printed Circuit. FFC is an abbreviation for Flexible Flat Cable.

[0070] like Figure 2 As shown, the flexible wiring board 61 is electrically connected to the individual electrode 51 of the piezoelectric element 50 via the COM wiring 54, which will be described later. The COM wiring 54... Figure 2 , Figure 5 as well as Figure 7 It is shown in the figure.

[0071] Furthermore, the flexible wiring substrate 61 is electrically connected to the common electrode 52 of the piezoelectric element 50 via VBS wirings 55A and 55B, described later. The flexible wiring substrate 61 is electrically connected to a circuit board (not shown). The circuit board includes... Figure 21 The driving signal generation circuit 32 shown is shown.

[0072] A drive circuit 62 is mounted on a flexible wiring substrate 61. The drive circuit 62 includes a switching element for driving the piezoelectric element 50. The drive circuit 62 is connected to the flexible wiring substrate 61 and the circuit board via the flexible wiring substrate 61. Figure 21 The control unit 30 shown is electrically connected. The drive circuit 62 receives the drive signal Com output from the drive signal generation circuit 32. The switching element of the drive circuit 62 switches whether to supply the drive signal Com generated by the drive signal generation circuit 32 to the piezoelectric element 50. The drive circuit 62 supplies drive voltage or current to the piezoelectric element 50 to make the vibrating plate 26 vibrate.

[0073] like Figure 5 as well as Figure 7 As shown, the liquid ejector head 10 includes COM wiring 54. Multiple COM wirings 54 are connected to multiple individual electrodes 51 respectively. The multiple COM wirings 54 extend in the X-axis direction and are led out into the opening 27a of the sealing plate 27. The opening 27a is located in... Figure 1 as well as Figure 2 It is shown in the diagram. Additionally, in Figure 1 The illustration of COM wiring 54 is omitted. Opening 27a penetrates sealing plate 27 in the Z-axis direction. When viewed in the Z-axis direction, COM wiring 54 is electrically connected to COF60 at a position corresponding to opening 27a. COM wiring 54 is formed of a conductive material with low resistance compared to the independent electrode 51. For example, COM wiring 54 is a conductive pattern formed by stacking a conductive film of gold (Au) on the surface of a conductive film formed of a nickel-chromium alloy (NiCr).

[0074] like Figure 7 As shown, the COM wiring 54 has an electrode layer 54a, a first bonding layer 54b, and a first wiring layer 54c. The electrode layer 54a covers the X2-direction end face of the piezoelectric layer 53. The X2-direction end face forms a surface intersecting the X-axis direction. The first bonding layer 54b covers both the electrode layer 54a and the individual electrode 51. The first bonding layer 54b is in close contact with both the electrode layer 54a and the individual electrode 51. The first wiring layer 54c covers the first bonding layer 54b. The first wiring layer 54c is electrically connected to the individual electrode 51 via the first bonding layer 54b.

[0075] The liquid nozzle 10 includes a VBS wiring 55 electrically connected to the COF 60 and the common electrode 52. The VBS wiring 55 is disposed on the common electrode 52 and extends in the Y-axis direction. The VBS wiring is formed to appear as a strip when viewed in the Z-axis direction and to cover the common electrode 52. The VBS wiring 55 is electrically connected to the COF 60 at its Y-axis end.

[0076] Next, refer to Figure 2 , Figure 5 , Figure 6 as well as Figure 8 The vibration absorption units 70A and 70B will now be described. The liquid ejector head 10 includes a vibration absorption unit 70A on the supply side and a vibration absorption unit 70B on the discharge side. Figure 2 , Figure 5 as well as Figure 6 As shown, the vibration absorption section 70A on the supply side is provided relative to the damper chamber DA on the supply side. Figure 2 , Figure 5 as well as Figure 8 As shown, the vibration absorption section 70B on the discharge side is provided relative to the damper chamber DB on the discharge side.

[0077] like Figure 6 As shown, the vibration absorption section 70A includes a malleable substrate 23A and a piezoelectric element 71A. The malleable substrate 23A is located in the X1 direction of the vibrating plate 26. The malleable substrate 23A is disposed on the upper surface of the pressure chamber substrate 25. The malleable substrate 23A covers the portion of the opening in the pressure chamber substrate 25 corresponding to the damper chamber DA. The malleable substrate 23A forms the upper wall of the damper chamber DA. The malleable substrate 23A is positioned at a position corresponding to the sealing space S2 formed in the sealing plate 27 when viewed in the Z-axis direction.

[0078] The malleable substrate 23A includes a flexible film. The malleable substrate 23A includes an elastic layer 23a and an insulating layer 23b. The elastic layer 23a is made of, for example, silicon dioxide (SiO2). The insulating layer 23b is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23a is formed on the pressure chamber substrate 25, and the insulating layer 23b is formed on the elastic layer 23a. The elastic layer 23a is continuously formed with the elastic layer 26a of the vibrating plate 26 covering the pressure chamber C. The insulating layer 23b is continuously formed with the insulating layer 26b of the vibrating plate 26.

[0079] Multiple malleable substrates 23A are respectively disposed for multiple damper chambers DA arranged in the Y-axis direction. The malleable substrates 23A are deformable under the pressure of ink. The deformation of the malleable substrates 23A by the pressure of the ink allows them to absorb pressure fluctuations of the ink within the damper chambers DA. The multiple malleable substrates 23A change independently corresponding to the multiple damper chambers DA.

[0080] like Figure 5 as well as Figure 6As shown, a plurality of piezoelectric elements 71A are formed on a malleable substrate 23A. The piezoelectric elements 71A are positioned at locations that overlap with the damper chambers DA when viewed in the Z-axis direction. The piezoelectric elements 71A are respectively provided for the plurality of damper chambers DA.

[0081] The piezoelectric element 71A has an individual electrode layer 71a, a common electrode layer 71b, and a piezoelectric body layer 71c. The individual electrode layer 71a, the common electrode layer 71b, and the piezoelectric body layer 71c are stacked in this order on a malleable substrate 23A. The piezoelectric body layer 71c is held between the individual electrode layer 71a and the common electrode layer 71b. The individual electrode layer 71a is elongated along the X-axis. Multiple individual electrode layers 71a are arranged spaced apart from each other in the Y-axis direction. Each individual electrode layer 71a is configured for each of the multiple damper chambers DA. The individual electrode layers 71a are respectively positioned at locations overlapping the multiple damper chambers DA when viewed in the Z-axis direction. The common electrode layer 71b is strip-shaped and extends in the Y-axis direction. The common electrode layer 71b is continuous in a manner that covers the multiple individual electrode layers 71a.

[0082] The structure and material of the independent electrode layer 71a are the same as those of the independent electrode 51 of the piezoelectric element 50. The structure and material of the common electrode layer 71b are the same as those of the common electrode 52 of the piezoelectric element 50. The structure and material of the piezoelectric body layer 71c are the same as those of the piezoelectric body layer 53 of the piezoelectric element 50. The piezoelectric element 71A can be formed into a film in the same way as the piezoelectric element 50.

[0083] like Figure 2 as well as Figure 5 As shown, the malleable substrate 23B is located in the X2 direction of the vibrating plate 26. The malleable substrate 23B is located on the opposite side of the malleable substrate 23A in the X-axis direction relative to the vibrating plate 26. Figure 8 As shown, a malleable substrate 23B is disposed on the upper surface of the pressure chamber substrate 25. The malleable substrate 23B covers the portion of the opening in the pressure chamber substrate 25 corresponding to the damper chamber DB. The malleable substrate 23B forms the upper wall of the damper chamber DB. The malleable substrate 23B is positioned at a location corresponding to the sealing space S3 formed in the sealing plate 27 when viewed in the Z-axis direction.

[0084] The malleable substrate 23B includes a flexible film. The malleable substrate 23B includes an elastic layer 23c and an insulating layer 23d. The elastic layer 23c is made of, for example, silicon dioxide (SiO2). The insulating layer 23d is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23c is formed on the pressure chamber substrate 25, and the insulating layer 23d is formed on the elastic layer 23c. The elastic layer 23c is continuously formed with the elastic layer 26a of the vibrating plate 26. The insulating layer 23d is continuously formed with the insulating layer 26b of the vibrating plate 26.

[0085] Multiple malleable substrates 23B are separately provided for multiple damper chambers DB arranged in the Y-axis direction. The malleable substrates 23B are deformable under the pressure of ink. By deforming under the pressure of ink, the malleable substrates 23B can absorb pressure fluctuations of the ink within the damper chambers DB. The multiple malleable substrates 23B change independently corresponding to the multiple damper chambers DB.

[0086] like Figure 5 as well as Figure 8 As shown, a plurality of piezoelectric elements 71B are formed on a malleable substrate 23B. The piezoelectric elements 71B are positioned at locations that overlap with the damper chambers DB when viewed in the Z-axis direction. The piezoelectric elements 71B are respectively provided for the plurality of damper chambers DB.

[0087] The piezoelectric element 71B has an individual electrode layer 71d, a common electrode layer 71e, and a piezoelectric body layer 71f. The individual electrode layer 71d, the common electrode layer 71e, and the piezoelectric body layer 71f are stacked in this order on a malleable substrate 23B. The piezoelectric body layer 71f is held between the individual electrode layer 71e and the common electrode layer 71e. The individual electrode layer 71d is elongated along the X-axis. Multiple individual electrode layers 71d are arranged at intervals along the Y-axis. The multiple individual electrode layers 71d are individually configured for each of the multiple damper chambers DB. The individual electrode layers 71d are respectively positioned at locations overlapping the multiple damper chambers DB when viewed along the Z-axis. The common electrode layer 71e is strip-shaped and extends along the Y-axis. The common electrode layer 71e is continuous in a manner that covers the multiple individual electrode layers 71d.

[0088] The structure and material of the independent electrode layer 71d are the same as those of the independent electrode 51 of the piezoelectric element 50. The structure and material of the common electrode layer 71e are the same as those of the common electrode 52 of the piezoelectric element 50. The structure and material of the piezoelectric body layer 71f are the same as those of the piezoelectric body layer 53 of the piezoelectric element 50. The piezoelectric element 71B can be formed into a film in the same way as the piezoelectric element 50 and the piezoelectric element 71A.

[0089] The sealing plate 27 is rectangular in shape when viewed along the Z-axis. The sealing plate 27 protects the multiple piezoelectric elements 50, 71A, 71B and strengthens the mechanical properties of the pressure chamber substrate 25, the vibrating plate 26, and the malleable substrates 23A, 23B. The sealing plate 27 is bonded to the vibrating plate 26, for example, using an adhesive. The sealing plate 27 is fixed relative to the pressure chamber substrate 25 via the vibrating plate 26 and the malleable substrates 23A, 23B.

[0090] Sealing spaces S1 to S3 are formed in the sealing plate 27. A recess is formed on the lower surface of the sealing plate 27. The spaces formed by these recesses are the sealing spaces S1 to S3. Sealing spaces S1 to S3 are formed continuously in the Y-axis direction. Sealing space S1 is formed to overlap with multiple pressure chambers C when viewed in the Z-axis direction. Sealing space S1 houses multiple piezoelectric elements 50. Sealing space S2 is formed to overlap with multiple damper chambers DA when viewed in the Z-axis direction. Sealing space S2 houses multiple piezoelectric elements 71A. Sealing space S3 is formed to overlap with multiple damper chambers DB when viewed in the Z-axis direction. Sealing space S3 houses multiple piezoelectric elements 71B.

[0091] In the sealing plate 27, flow channels 44A included in the common liquid chamber RA and 44B included in the common liquid chamber RB are formed. Flow channels 44A and 44B are formed in such a way that they penetrate the sealing plate 27 in the Z-axis direction. Flow channel 44A is located in the X1 direction of the sealing space S2. Flow channel 44B is located in the X2 direction of the sealing space S3.

[0092] The housing 28 is located in the Z2 direction of the sealing plate 27. A supply port 42A, a discharge port 42B, and flow channels 43A and 43B are formed on the housing 28. Flow channel 43A is included in the common liquid chamber RA. Flow channel 43A is formed to overlap with flow channel 44A of the sealing plate 27 when viewed in the Z-axis direction. The supply port 42A communicates with flow channel 43A. Flow channel 43B is included in the common liquid chamber RB. Flow channel 43B is formed to overlap with flow channel 44B of the sealing plate 27 when viewed in the Z-axis direction. The discharge port 42B communicates with flow channel 43B.

[0093] Next, refer to Figure 2 The malleable substrates 77A and 77B, which are disposed in the common liquid chambers RA and RB, will be described. For example... Figure 2 As shown, the liquid ejector head 10 includes malleable substrates 77A and 77B. These malleable substrates 77A and 77B differ from the malleable substrates 23A and 23B that are disposed corresponding to the damper chambers DA and DB. Furthermore, although in Figure 2The malleable substrates 77A and 77B are structures that are not exposed to the outside of the liquid ejection head 10, but the malleable substrates 77A and 77B can also be structures that are exposed to the outside of the liquid ejection head 10.

[0094] A malleable substrate 77A and a flow channel 43A of a common liquid chamber RA are correspondingly provided. The malleable substrate 77A is located in the X1 direction of the flow channel 43A. The malleable substrate 77A is configured to cover the opening forming the flow channel 43A. The thickness direction of the malleable substrate 77A is along the X-axis direction. The malleable substrate 77A extends in the Y-axis direction. The malleable substrate 77A is fixed to the housing 28.

[0095] A malleable substrate 77B and a flow channel 43B sharing a liquid chamber RB are correspondingly disposed. The malleable substrate 77B is located in the X2 direction of the flow channel 43B. The malleable substrate 77B is configured to cover the opening forming the flow channel 43B. The thickness direction of the malleable substrate 77B is along the X-axis direction. The malleable substrate 77B extends in the Y-axis direction. The malleable substrate 77B is fixed to the housing 28.

[0096] The malleable substrates 77A and 77B may, for example, have the same structure as the malleable substrates 23A and 23B. The malleable substrates 77A and 77B include an elastic layer and an insulating layer. The elastic layer is, for example, made of silicon dioxide (SiO2). The insulating layer is, for example, made of zirconium dioxide (ZrO2).

[0097] The malleable substrate 77A is deformable by the pressure of the ink in the flow channel 43A of the common liquid chamber RA. The malleable substrate 77A is deformed by the pressure of the ink, thereby absorbing the pressure fluctuations of the ink in the flow channel 43A of the common liquid chamber RA.

[0098] The malleable substrate 77B is deformable by the pressure of the ink in the flow channel 43B of the common liquid chamber RB. The malleable substrate 77B is deformed by the pressure of the ink, thereby absorbing the pressure fluctuations of the ink in the flow channel 43B of the common liquid chamber RB.

[0099] In the liquid ejector head 10 of Embodiment 1, the length LX1 of the plastic substrate 23A on the supply side in the X-axis direction is longer than the length LX2 of the plastic substrate 23B on the discharge side in the X-axis direction. In the liquid ejector head 10, since ink is ejected from the nozzle N, the flow rate of liquid flowing through the discharge channel 41B is less than the flow rate of liquid flowing through the supply channel 41A. The discharge channel 41B experiences less crosstalk and other effects compared to the supply channel 41A, and therefore requires less plasticity. Crosstalk, as referred to here, means that vibrations generated as liquid flows through an independent channel (a channel composed of an independent supply channel and an independent discharge channel) affect liquid flowing through other independent channels adjacent to that independent channel, thereby reducing the ejection characteristics of the liquid in those other independent channels. As described above, since the discharge channel 41B has a smaller flow rate compared to the supply channel 41A, the length of the plastic substrate 23B on the discharge side is less critical compared to the length of the plastic substrate 23A on the supply side. In the liquid ejector head 10, by making the length LX2 of the plastic substrate 23B on the discharge side shorter than the length LX1 of the plastic substrate 23A on the supply side, the length of the liquid ejector head 10 in the X-axis direction can be shortened. This enables miniaturization of the liquid ejector head 10.

[0100] In the liquid ejector head 10 of Embodiment 1, by increasing the size of the plastic substrate 23A on the supply side, the plasticity of the supply side can be ensured, and by decreasing the size of the plastic substrate 23B on the discharge side, the length of the liquid ejector head 10 in the Y-axis direction can be shortened to save space. Thus, the liquid ejector head 10 achieves a balance between ensuring plasticity and saving space.

[0101] Furthermore, in the liquid ejector head 10, the length LX6 of the discharge channel 41B is longer than the length LX5 of the supply channel 41A. However, the liquid ejector head 10 is not limited to having a longer length LX6 for the discharge channel 41B than for the supply channel 41A. When the length LX6 of the discharge channel 41B is longer than the length LX5 of the supply channel 41A, and the cross-sectional area is the same, the flow resistance of the discharge channel 41B is greater than that of the supply channel 41A. This makes it easier to reduce the crosstalk effect of the discharge channel 41B compared to the supply channel 41A. Even considering the case where the flow rate of the discharge channel 41B is lower than that of the supply channel 41A, considering the greater flow resistance of the discharge channel 41B compared to the supply channel 41A, it can be seen that the length of the plastic substrate 23B on the discharge side can be reduced in the X-axis direction compared to the plastic substrate 23A on the supply side.

[0102] Furthermore, in the liquid ejector head 10, since a piezoelectric element 71A is provided on the malleable substrate 23A, the piezoelectric element 71A can be deformed in response to the deformation of the malleable substrate 23A to absorb the vibration of the ink in the damper chamber DA. Moreover, by providing the piezoelectric element 71A on the malleable substrate 23A, the malleable substrate 23A can be strengthened. The same applies to the piezoelectric element 71B.

[0103] Furthermore, in the liquid ejector head 10, since the vibrating plate 26 and the malleable substrates 23A and 23B are integrated, and the structure of the piezoelectric elements 71A and 71B on the malleable substrates 23A and 23B is the same as the structure of the piezoelectric element 50 on the vibrating plate 26, the piezoelectric elements 71A and 71B can be easily manufactured.

[0104] In the liquid ejector head 10, the amount of plasticity CR generated by the plastic substrate 23B on the discharge side is smaller than the amount of plasticity CS generated by the plastic substrate 23A on the supply side. The amounts of plasticity CS and CR will be described later. When the material, width along the Y-axis, and thickness along the Z-axis of the plastic substrates 23A and 23B are the same, as in Embodiment 1, the amounts of plasticity CS and CR are proportional to the lengths of the plastic substrates 23A and 23B in the X-axis direction. In the liquid ejector head 10, it is possible to make the amount of plasticity CR on the discharge side smaller than the amount of plasticity CS on the supply side.

[0105] plasticity

[0106] Next, the plasticity quantities CS and CR in the liquid ejector head 10 will be explained. Figure 9 This is a plan view showing the length l and width w of the opening of the damper chamber DA formed below the plastic substrate 23A. Figure 10 This is a cross-sectional view showing the thickness t of the plastic substrate 23A.

[0107] The plasticity quantity CS is the plasticity quantity in the supply channel 41A. The plasticity quantity CR is the plasticity quantity in the discharge channel 41B. The plasticity quantities CS and CR satisfy the following equation (1). The plasticity quantity CS on the supply side is larger than the plasticity quantity CR on the discharge side. The plasticity quantity CS on the supply side is an example of the plasticity capacity of the supply side. The plasticity quantity CR on the discharge side is an example of the plasticity capacity of the discharge side.

[0108] CS>CR…(1)

[0109] The flow rates QS and QR of the ink flowing through the liquid nozzle 10 satisfy the following equation (2). The flow rate QS of the ink on the supply side is larger than the flow rate QR of the ink on the discharge side. The flow rate QS on the supply side is the flow rate of the ink flowing through the supply channel 41A. The flow rate QR on the discharge side is the flow rate of the ink flowing through the discharge channel 41B.

[0110] QS>QR…(2)

[0111] Without distinguishing between the plasticity amount CS on the supply side and the plasticity amount CR on the discharge side, they are referred to as plasticity amount C. Similarly, without distinguishing between plastic substrates 23A and 23B, they are referred to as plastic substrate 23. Plasticity amount C can be expressed using the following formula (3).

[0112] Mathematical Formula 1

[0113]

[0114] In equation (3), “ν” is the Poisson’s ratio of the plastic substrate 23. “ν” is the physical property value of the material constituting the plastic substrate. “E” is the Young’s modulus. “E” is the physical property value of the material constituting the plastic substrate.

[0115] “w” represents the width of the opening covered by the plastic substrate. “w” represents the width of the damper chambers DA and DB along the Y-axis. “l” represents the length of the opening covered by the plastic substrate. “t” represents the thickness of the plastic substrate.

[0116] Casing 1

[0117] For example, when the flow resistance MS of the supply channel 41A is smaller than the flow resistance MR of the discharge channel 41B, the pressure fluctuation of the ink in the pressure chamber C is more easily transmitted to the ink in the supply channel 41A compared to the ink in the discharge channel 41B. In this case, the plasticity amounts CS and CR are set to satisfy equation (4). The plasticity amount CS on the supply side is larger than the plasticity amount CR on the discharge side. In Example 1, the flow resistance MS of the supply channel 41A is smaller than the flow resistance MR of the discharge channel 41B.

[0118] CS>CR…(4)

[0119] Shell 2

[0120] For example, when the flow resistance MS of the supply channel 41A is larger than the flow resistance MR of the discharge channel 41B, the pressure fluctuation of the ink in the pressure chamber C is more easily transmitted to the ink in the discharge channel 41B compared to the ink in the supply channel 41A. In this case, the plasticity amounts CS and CR are set to satisfy equation (5). The plasticity amount CS on the supply side is larger than the plasticity amount CR on the discharge side. In Example 8 described later, the flow resistance MS of the supply channel 41A is larger than the flow resistance MR of the discharge channel 41B.

[0121] CS<CR…(5)

[0122] Example 2

[0123] Next, the liquid ejector head 10B involved in Example 2 will be described. Figure 11 This is a cross-sectional view showing the liquid ejector head 10B involved in Example 2. Figure 11 This is a cross-sectional view showing the liquid ejector head 10B involved in Example 2. Figure 12 This is a plan view showing a portion of the connecting plate 24B. Figure 13 This is a plan view showing a portion of the pressure chamber substrate 25B. The liquid ejector head 10B involved in Embodiment 2 and... Figure 2 The liquid ejector head 10 shown in Embodiment 1 differs in that it has a connecting plate 24B instead of a connecting plate 24, a pressure chamber substrate 25B instead of a pressure chamber substrate 25, and vibration absorption sections 70C and 70D instead of vibration absorption sections 70A and 70B. Furthermore, in the description of Embodiment 2, descriptions identical to those in Embodiment 1 may sometimes be omitted.

[0124] like Figure 11 As shown, the liquid ejector head 10B includes a nozzle substrate 21, a connecting plate 24B, a pressure chamber substrate 25B, a vibrating plate 26, malleable substrates 23C and 23D, a sealing plate 27, a housing 28, and a COF 60. The liquid ejector head 10B includes vibration absorbing sections 70C and 70D. The vibration absorbing section 70C on the supply side includes a malleable substrate 23C and a piezoelectric element 71C. The vibration absorbing section 70D on the discharge side includes a malleable substrate 23D and a piezoelectric element 71D.

[0125] The liquid ejector head 10B has an ink flow channel 40B. The ink flow channel 40B has a supply flow channel 41C and a discharge flow channel 41D. The supply flow channel 41C includes flow channels 45A and 46A, a connecting flow channel 47D, and a damper chamber DC. The supply flow channel 41C includes a common supply flow channel shared by multiple pressure chambers C. The common supply flow channel includes flow channels 45A and 46A, a connecting flow channel 47D, and the damper chamber DC.

[0126] The discharge flow channel 41D includes connecting flow channels 47C and 47E, a damper chamber DD, flow channels 46B and 45B. The discharge flow channel 41D includes independent discharge flow channels separately provided for multiple pressure chambers C. Each independent discharge flow channel includes multiple connecting flow channels 47C. The discharge flow channel 41D also includes a common discharge flow channel shared by multiple pressure chambers C. The common discharge flow channel includes flow channels 45B, 46B, connecting flow channels 47C and 47E, and the damper chamber DD.

[0127] like Figure 12 As shown, flow channels 46A, 47D, 47C, and 47E, which are part of the common liquid chamber RA, and flow channel 46B, which is part of the common liquid chamber RB, are formed on the connecting plate 24B. Through holes, grooves, or recesses are formed on the connecting plate 24. Through these through holes, grooves, or recesses, the common liquid chambers RA and RB, and the connecting flow channels 47D, 47C, and 47E are formed.

[0128] like Figure 13 As shown, on the pressure chamber substrate 25B, there are flow channels 45A as part of the common liquid chamber RA, damper chamber DC, multiple pressure chambers C, damper chamber DD, and flow channels 45B as part of the common liquid chamber RB. Additionally, in Figure 13 In the image, multiple nozzles N are shown using dashed lines.

[0129] The damper chamber DC on the supply side is shared by multiple pressure chambers C. The damper chamber DC extends in the Y-axis direction and communicates with the multiple pressure chambers C. The damper chamber DD on the discharge side is shared by multiple pressure chambers C. The damper chamber DD extends in the Y-axis direction and communicates with the multiple pressure chambers C via multiple connecting channels 47C.

[0130] The length LX3 of the damper chamber DC on the supply side along the X-axis is different from the length LX4 of the damper chamber DD on the discharge side along the X-axis. The length LX3 of the damper chamber DC on the supply side is longer than the length LX4 of the damper chamber DD on the discharge side. The width of the damper chamber DC along the Y-axis is the same as the width of the damper chamber DD along the Y-axis.

[0131] In the liquid ejector head 10B according to Embodiment 2, a common supply-side malleable substrate 23C is provided for the plurality of pressure chambers C. In the liquid ejector head 10B, a common discharge-side malleable substrate 23D is provided for the plurality of pressure chambers C. The liquid ejector head 10B may also have a structure having such malleable substrates 23C and 23D.

[0132] Example 3

[0133] Next, the liquid ejector head 10C involved in Example 3 will be described. Figure 14 This is a cross-sectional view showing the liquid ejector head 10C involved in Example 3. Figure 15 This is a cross-sectional view showing a portion of the vibration absorption section 70E on the supply side according to Embodiment 3. Figure 16 This is a cross-sectional view showing a portion of the vibration absorption section 70F on the discharge side according to Embodiment 3. The liquid ejector head 10C according to Embodiment 3 and... Figure 2 The liquid nozzle 10 shown in Embodiment 1 differs in that it has a vibration absorption section 70E instead of vibration absorption section 70A, and a vibration absorption section 70F instead of vibration absorption section 70B. Furthermore, in the description of Embodiment 3, descriptions identical to those in Embodiments 1 and 2 may sometimes be omitted.

[0134] like Figure 15 As shown, the vibration absorption section 70E on the supply side includes a malleable substrate 23E and a gold thin film 71E. The malleable substrate 23E includes a flexible film. The malleable substrate 23E includes an elastic layer 23e and an insulating layer 23f. The elastic layer 23e is made of, for example, silicon dioxide (SiO2). The insulating layer 23f is made of, for example, zirconium dioxide (ZrO2). The elastic layer 23e is formed on the pressure chamber substrate 25, and the insulating layer 23f is formed on the elastic layer 23e. The elastic layer 23e is continuously formed with the elastic layer 26a of the vibrating plate 26 covering the pressure chamber C. The insulating layer 23f is continuously formed with the insulating layer 26b of the vibrating plate 26.

[0135] Multiple malleable substrates 23E are respectively provided for multiple damper chambers DA arranged in the Y-axis direction. The malleable substrates 23E are deformable under the pressure of ink. The deformation of the malleable substrates 23E by the pressure of ink can absorb the pressure fluctuation of the ink in the damper chambers DA. The multiple malleable substrates 23E change independently corresponding to the multiple damper chambers DA.

[0136] A gold thin film 71E is formed on a malleable substrate 23E. The gold thin film 71E has a predetermined length in the X-axis direction. The length of the gold thin film 71E in the X-axis direction is shorter than the length of the damper chamber DA in the X-axis direction. The gold thin film 71E has a predetermined length in the Y-axis direction. The gold thin film 71E is formed to cover a plurality of malleable substrates 23E arranged in the Y-axis direction. The gold thin film 71E can also be provided separately for each of the plurality of malleable substrates 23E. The gold thin film 71E is formed of gold. To enhance the strength of the malleable substrates 23E, the thickness of the gold thin film 71E is preferably relatively thick, but to efficiently absorb pressure fluctuations of the ink within the damper chamber DA, it is preferably relatively thin. According to experiments, both of these effects can be appropriately obtained when the thickness is 0.7 to 1.3 μm. The vibration absorption section 70E can also replace the gold thin film 71E with a metal thin film formed of a metal different from gold, such as tin, copper, or aluminum.

[0137] like Figure 16 As shown, the vibration absorption section 70F on the discharge side includes a malleable substrate 23F and a gold thin film 71F. The malleable substrate 23F includes a flexible film. The malleable substrate 23F includes an elastic layer 23g and an insulating layer 23h. The elastic layer 23g is made of, for example, silicon dioxide (SiO2). The insulating layer 23h is made of, for example, zirconium dioxide (ZrO2). The elastic layer 2g is formed on the pressure chamber substrate 25, and the insulating layer 23h is formed on the elastic layer 23g. The elastic layer 23g is continuously formed with the elastic layer 26a of the vibrating plate 26 covering the pressure chamber C. The insulating layer 23h is continuously formed with the insulating layer 26b of the vibrating plate 26.

[0138] Multiple malleable substrates 23F are respectively disposed for multiple damper chambers DB arranged in the Y-axis direction. The malleable substrates 23F are deformable under the pressure of ink. The deformation of the malleable substrates 23F by the pressure of the ink allows them to absorb pressure fluctuations of the ink within the damper chambers DB. The multiple malleable substrates 23F change independently corresponding to the multiple damper chambers DB.

[0139] A gold thin film 71F is formed on a malleable substrate 23F. The gold thin film 71F has a predetermined length in the X-axis direction. The length of the gold thin film 71F in the X-axis direction is shorter than the length of the damper chamber DB in the X-axis direction. The gold thin film 71F has a predetermined length in the Y-axis direction. The gold thin film 71F is formed to cover a plurality of malleable substrates 23F arranged in the Y-axis direction. The gold thin film 71F may also be provided separately for the plurality of malleable substrates 23F. The gold thin film 71F is formed of gold. In order to enhance the strength of the malleable substrates 23F, the thickness of the gold thin film 71F is preferably relatively thick, but in order to efficiently absorb the pressure fluctuations of the ink in the damper chamber DB, it is preferably relatively thin. According to experiments, when the thickness is 0.7 to 1.3 μm, the above two effects can be appropriately obtained. The vibration absorption part 70F may also replace the gold thin film 71F with a metal thin film formed of a metal different from gold, such as tin, copper, or aluminum.

[0140] Thus, the liquid ejector head 10C can also include a gold thin film 71E formed on the malleable substrate 23E. The liquid ejector head 10C can also include a gold thin film 71F formed on the malleable substrate 23F. In the liquid ejector head 10C, since the gold thin films 71E and 71F are formed on the malleable substrates 23E and 23F, the strength of the malleable substrates 23E and 23F can be enhanced. This improves the reliability of the malleable substrates 23E and 23F.

[0141] Furthermore, by changing the thickness of the gold thin films 71E and 71F, the ease of deformation of the malleable substrates 23E and 23F can be altered. Additionally, by changing the thickness of the gold thin films 71E and 71F, the vibration absorption efficiency achieved by the vibration absorbing portions 70E and 70F can also be changed. Furthermore, by changing the material of the metal thin film on the malleable substrates 23E and 23F, the ease of deformation of the malleable substrates 23E and 23F can also be altered.

[0142] Example 4

[0143] Next, the liquid nozzle 10 according to Example 4 will be described. Illustrations of the liquid nozzle 10 according to Example 4 have been omitted. The cross-sectional view of the liquid nozzle 10 according to Example 4 is shown below. Figures 14 to 16 The cross-sectional view of the liquid nozzle 10C in Example 3 is substantially the same. The liquid nozzle 10 involved in Example 4 is similar to... Figure 14The liquid ejector head 10C of Embodiment 3 differs in that it has damper chambers DC and DD instead of damper chambers DA and DB, and it has connecting channels 47D and 47E instead of connecting channels 47A and 47B. The damper chambers DC and DD and the connecting channels 47D and 47E are... Figure 11 The damper chambers DC and DD, as well as the connecting channels 47D and 47E, are the same in Embodiment 2 shown.

[0144] In the liquid ejector head 10 of Embodiment 4, a gold film 71E is formed on a malleable substrate 23C that covers the damper chamber DC, which serves as a common supply flow channel. In the liquid ejector head 10 of Embodiment 4, a gold film 71F is formed on a malleable substrate 23D that covers the damper chamber DD, which serves as a common discharge flow channel. The gold films 71E and 71F can be formed in the same manner as the gold films 71E and 71F of Embodiment 3 described above.

[0145] Example 5

[0146] Next, the liquid nozzle 10E according to Example 5 will be described. Illustrations of the liquid nozzle 10E according to Example 5 have been omitted. The cross-sectional view of the liquid nozzle 10E according to Example 5 is shown below. Figure 2 The cross-sectional view of the liquid nozzle 10 in Example 1 is substantially the same. The liquid nozzle 10E involved in Example 5 is similar to... Figure 2 The liquid ejector head 10 of Embodiment 1 differs in that it has a damper chamber DC instead of a damper chamber DA, a connecting flow channel 47D instead of a connecting flow channel 47A, and a vibration absorption section 70C instead of a vibration absorption section 70A. The damper chamber DC, the connecting flow channel 47D, and the vibration absorption section 70C are different from those in Embodiment 1. Figure 11 The damper chamber DC, the connecting channel 47D, and the vibration absorption section 70C of Embodiment 2 shown are the same.

[0147] Figure 17 This is a plan view showing a portion of the connecting plate 24E of the liquid nozzle 10E according to Embodiment 5. The liquid nozzle 10E includes a connecting plate 24E instead of the connecting plate 24 of Embodiment 1. The connecting plate 24E has a connecting channel 47D included in a common supply channel and a connecting channel 47B included in an independent discharge channel.

[0148] Figure 18This is a plan view showing a portion of the pressure chamber substrate 25E of the liquid ejector head 10E according to Embodiment 5. The liquid ejector head 10E includes a pressure chamber substrate 25E instead of the pressure chamber substrate 25 of Embodiment 1. The pressure chamber substrate 25E has a damper chamber DC included in a common supply flow channel and a damper chamber DB included in an independent discharge flow channel formed on it.

[0149] Thus, in the liquid ejector head 10E, the damper chamber DC on the supply side is shared by multiple pressure chambers C, while the damper chamber DB on the discharge side is independently provided for each of the multiple pressure chambers C. In the liquid ejector head 10E, a common malleable substrate 23C is provided for each of the multiple pressure chambers C. In the liquid ejector head 10E, a malleable substrate 23B is provided for each of the multiple pressure chambers C. In the liquid ejector head 10E, an independent malleable substrate 23B is provided for each of the multiple pressure chambers C.

[0150] Example 6

[0151] Next, the liquid nozzle 10 according to Example 6 will be described. The illustrations of the liquid nozzle 10 according to Example 6 have been omitted. The cross-sectional view of the liquid nozzle 10 according to Example 6 is shown below. Figure 14 The cross-sectional view of the liquid nozzle 10C in Example 3 is substantially the same. The liquid nozzle 10 involved in Example 6 is similar to... Figure 14 The liquid ejector head 10C of Embodiment 3 differs in that it has a damper chamber DC instead of a damper chamber DA, and a connecting channel 47D instead of a connecting channel 47A. The damper chamber DC, the connecting channel 47D, and the vibration absorption section 70C are similar to... Figure 11 The damper chamber DC, the connecting channel 47D, and the vibration absorption section 70C of Embodiment 2 shown are the same.

[0152] The connecting plate in Example 6 and Figure 17 The connecting plate 24E in Embodiment 5 is the same. The pressure chamber substrate in Embodiment 6 is the same as... Figure 18 The pressure chamber substrate 25E shown in Embodiment 5 is the same.

[0153] The liquid ejector head 10 of Embodiment 6 includes a vibration-absorbing section 70E on the supply side and a vibration-absorbing section 70F on the discharge side. A cross-sectional view of the vibration-absorbing section 70E on the supply side is shown below. Figure 15The vibration absorption section 70E shown is substantially the same. In embodiment 6, a malleable substrate 23E is provided relative to the damper chamber DC, which serves as a common supply channel. The vibration absorption section 70E on the supply side includes a malleable substrate 23E provided relative to the common damper chamber DC, and a gold thin film 71 provided on the malleable substrate 23E.

[0154] Cross-sectional view of vibration absorption section 70F on the supply side and Figure 16 The vibration absorption section 70F shown is the same. In embodiment 6, a malleable substrate 23F is provided relative to the damper chamber DB, which is an independent discharge channel. The vibration absorption section 70F on the discharge side includes a plurality of malleable substrates 23E respectively provided for a plurality of damper chambers DC, and a gold thin film 71 provided on the malleable substrates 23E.

[0155] In the liquid ejector head 10 of Example 6, gold thin films 71E and 71F are provided on the plastic substrates 23E and 23F.

[0156] Example 7

[0157] Next, the liquid nozzle 10 according to Example 7 will be described. Illustrations of the liquid nozzle 10 according to Example 7 have been omitted. The cross-sectional view of the liquid nozzle 10 according to Example 7 is shown below. Figure 11 The cross-sectional view of the liquid nozzle 10B in Example 2 is substantially the same. The liquid nozzle 10 involved in Example 7 is similar to... Figure 11 The difference in the liquid ejector head 10B of Embodiment 2 is that it has a vibration absorption section 70E instead of a vibration absorption section 70C. In Embodiment 7, the vibration absorption section 70E on the supply side has a gold film 71E, and the vibration absorption section 70D on the discharge side has a piezoelectric element 71D.

[0158] In Embodiment 7, the structure provided on the plastic substrate 23C on the supply side is different from the structure provided on the plastic substrate 23D on the discharge side. Thus, by changing the structure on the plastic substrates 23C and 23D, a difference can be created between the vibration absorption capacity on the supply side and the vibration absorption capacity on the discharge side.

[0159] For example, as a variation of Embodiment 7, the piezoelectric element 71A may be provided relative to the plastic substrate 23C on the supply side, and the gold film 71F may be provided relative to the plastic substrate 23D on the discharge side. Furthermore, in the liquid ejection head 10 of other embodiments, the structure on the plastic substrate may be modified on both the supply and discharge sides.

[0160] Example 8

[0161] Next, the liquid ejector head 10H involved in Example 8 will be described. Figure 19 This is a cross-sectional view showing the liquid ejector head 10H involved in Example 8. Figure 19 The liquid ejector head 10H involved in Example 8 shown is... Figure 2 The difference between the liquid nozzle 10 of Example 1 and the one shown is that the direction of liquid flow is different. In the liquid nozzle 10H of Example 8, the direction of liquid flow is opposite to that in the liquid nozzle 10 of Example 1. Figure 19 In the diagram, arrows indicate the direction of liquid flow. Figure 19 In the middle, it is marked with Figure 1 The symbols are roughly the same, but the direction of liquid flow is opposite to... Figure 1 The opposite direction. In addition, in the description of the liquid nozzle 10H according to Example 8, the same descriptions as those of the liquid nozzles 10 according to Examples 1 to 7 described above are sometimes omitted.

[0162] A flow channel 40H for ink flow is formed in the liquid ejector head 10H. The flow channel 40H includes a supply port 42C, an outlet port 42D, common liquid chambers RA and RB, damper chambers DA and DB, a pressure chamber C, connecting flow channels 47A to 47C, and a nozzle N.

[0163] Flow channel 40H has a supply flow channel 41E and a discharge flow channel 41F. The supply flow channel 41E is an upstream flow channel relative to pressure chamber C, and is a flow channel within the connecting plate 24 and pressure chamber base plate 25. The supply flow channel 41E includes flow channels 45B, 46B, a connecting flow channel 47B, a damper chamber DB, and a connecting flow channel 47C. The discharge flow channel 41F is a downstream flow channel relative to pressure chamber C, and is a flow channel within the connecting plate 24 and pressure chamber base plate 25. The discharge flow channel 41F includes a damper chamber DA, a connecting flow channel 47A, a flow channel 46A, and a flow channel 45A.

[0164] The liquid ejector head 10H includes a damper chamber DB on the supply side and a damper chamber DA on the discharge side. The liquid ejector head 10H also includes a vibration absorption section 70B on the supply side and a vibration absorption section 70A on the discharge side. In this case, the malleable substrate 23B is the malleable substrate on the supply side. The malleable substrate 23A is the malleable substrate on the discharge side.

[0165] In Example 8, the length LX12 of the plastic substrate 23A on the discharge side along the X-axis is longer than the length LX11 of the plastic substrate 23B on the supply side along the X-axis.

[0166] In this way, the length LX12 of the plastic substrate 23A on the discharge side along the X-axis direction can be longer than the length LX11 of the plastic substrate 23B on the supply side along the X-axis direction.

[0167] In Example 8, the plasticity of the discharge-side plastic substrate 23A is greater than that of the supply-side plastic substrate 23B. Plastic substrates 23A and 23B are made of the same material and have the same thickness. Since the length LX12 of plastic substrate 23A along the X-axis is longer than the length LX11 of plastic substrate 23B along the X-axis, the plasticity of plastic substrate 23A is greater than that of plastic substrate 23B.

[0168] In Example 8, the flow resistance of the discharge channel 41F is greater than that of the supply channel 41E. In Example 8, the plasticity of the plastic substrates 23A and 23B is set according to the magnitude of the flow resistance.

[0169] Liquid ejection device

[0170] Next, refer to Figure 20 as well as Figure 21 The liquid ejection device 1, which includes a liquid ejection head 10, will be described. Figure 20 This is a schematic diagram showing a liquid ejection device 1 equipped with a liquid ejection head 10. The liquid ejection device 1 is equipped with the liquid ejection head 10 described in Embodiment 1 above. Figure 21 This is a block diagram illustrating the liquid ejection device 1. Furthermore, the liquid ejection device 1 is not limited to having the structure of the liquid ejection head 10 described in Embodiment 1. The liquid ejection device 1 may also replace the liquid ejection head 10 described in Embodiment 1 with the liquid ejection heads 10B to 10H described in Embodiments 2 to 7.

[0171] Liquid ejection device 1 is an inkjet printing apparatus that ejects ink, an example of a "liquid," in the form of droplets onto a medium PA. Liquid ejection device 1 is a serial printing apparatus. The medium PA is typically printing paper. However, the medium PA is not limited to printing paper; for example, it can be any printing material such as resin film or cloth.

[0172] The liquid ejection device 1 includes a liquid ejection head 10 for ejecting ink, a liquid container 2 for storing ink, a carriage 3 for mounting the liquid ejection head 10, a carriage transport mechanism 4 for transporting the carriage 3, a media transport mechanism 5 for transporting the medium PA, and a control unit 30. The control unit 30 is a control unit for controlling the ejection of the liquid.

[0173] Specific examples of liquid containers 2 include ink cartridges that are detachable from the liquid dispensing device 1, ink pouches formed of flexible films, and ink refill containers. Furthermore, the type of ink stored in the liquid containers 2 can be any type. The liquid dispensing device 1 may have multiple liquid containers 2 corresponding to four colors of ink, for example. The four colors of ink may include, for example, cyan, magenta, yellow, and black. The liquid containers 2 may also be mounted on a carriage 3.

[0174] The liquid ejection device 1 includes a circulation mechanism 8 for circulating ink. The circulation mechanism 8 includes a supply channel 81 for supplying ink to the liquid ejection head 10, a recovery channel 82 for recovering ink discharged from the liquid ejection head 10, and a pump 83 for transferring ink.

[0175] The carriage conveyor mechanism 4 includes a conveyor belt 4a for conveying the carriage 3 and a motor. The media conveying mechanism 5 includes a conveyor roller 5a for conveying the media PA and a motor. The carriage conveyor mechanism 4 and the media conveying mechanism 5 are controlled by the control unit 30. The liquid ejection device 1 conveys the media PA through the media conveying mechanism 5 and conveys the carriage 3 through the carriage conveyor mechanism 4, thereby ejecting ink droplets onto the media PA for printing.

[0176] like Figure 21 As shown, the liquid ejection device 1 includes a linear encoder 6. This linear encoder 6 is positioned at a location capable of detecting the position of the carriage 3. The linear encoder 6 acquires information related to the position of the carriage 3. The linear encoder 6 outputs encoder signals to the control unit 30 as the carriage 3 moves.

[0177] The control unit 30 includes one or more CPUs 31. The control unit 30 may also include an FPGA instead of a CPU 31, or may include an FPGA in addition to a CPU 31. The control unit 30 includes a storage unit 35. The storage unit 35 may include, for example, a ROM 36 and a RAM 37. The storage unit 35 may also include an EEPROM or a PROM. The storage unit 35 is capable of storing printing data Img supplied from the host computer. The storage unit 35 stores the control program for the liquid dispensing device 1.

[0178] CPU is short for Central Processing Unit. FPGA is short for Field-Programmable Gate Array. RAM is short for Random Access Memory. ROM is short for Read Only Memory. EEPROM is short for Electrically Erasable Programmable Read-Only Memory. PROM is short for Programmable ROM.

[0179] The control unit 30 generates signals for controlling the operation of each part of the liquid ejection device 1. The control unit 30 can generate a printed signal SI and a waveform specification signal dCom. The printed signal SI is a digital signal used to specify the type of operation of the liquid ejection head 20. The printed signal SI can specify whether to supply a drive signal Com to the piezoelectric element 50. The waveform specification signal dCom is a digital signal that specifies the waveform of the drive signal Com. The drive signal Com is an analog signal used to drive the piezoelectric element 50.

[0180] The liquid ejection device 1 includes a drive signal generation circuit 32. The drive signal generation circuit 32 is electrically connected to the control unit 30. The drive signal generation circuit 32 includes a DA conversion circuit. The drive signal generation circuit 32 generates a drive signal Com having a waveform defined by the waveform specification signal dCom. When the control unit 30 receives an encoder signal from the linear encoder 6, it outputs a timing signal PTS to the drive signal generation circuit 32. The timing signal PTS specifies the timing for generating the drive signal Com. The drive signal generation circuit 32 outputs the drive signal Com whenever it receives the timing signal PTS.

[0181] The drive circuit 62 is electrically connected to the control unit 30 and the drive signal generation circuit 32. The drive circuit 62 switches whether to supply a drive signal Com to the piezoelectric element 50 based on the printing signal SI. The drive circuit 62 can select the piezoelectric element 50 to which the drive signal Com is supplied based on the printing signal SI, the latch signal LAT, and the exchange signal CH supplied from the control unit 30. The latch signal LAT specifies the latching timing of the printing data Img. The exchange signal CH specifies the selection timing of the drive pulses included in the drive signal Com.

[0182] The control unit 30 controls the ink ejection operation performed by the liquid ejection head 20. As described above, the control unit 30 drives the piezoelectric element 50 to change the pressure of the ink in the pressure chamber C, so that the ink is ejected from the nozzle N. The control unit 30 controls the ejection operation during the printing process.

[0183] In such a liquid ejection device 1, the liquid ejection head 10 described above can be used. In the liquid ejection device 1 equipped with the liquid ejection head 10, the length LX1 of the plastic substrate 23A on the supply side in the X-axis direction is longer than the length LX2 of the plastic substrate 23B on the discharge side in the X-axis direction. By making the length LX2 of the plastic substrate 23B on the discharge side shorter than the length LX1 of the plastic substrate 23A on the supply side, the liquid ejection head 10 can be miniaturized.

[0184] Furthermore, the embodiments described above merely illustrate representative ways of the present invention. The present invention is not limited to the embodiments described above, but various changes and additions can be made without departing from the spirit of the present invention.

[0185] Variation Example 1

[0186] Although in the liquid ejector head 10 of Embodiment 1 described above, the malleable substrates 23A and 23B are positioned at the same location as the vibrating plate 26 in the Z-axis direction, the malleable substrates 23A and 23B may also be positioned at a different location in the Z-axis direction than the vibrating plate 26. For example, the malleable substrate 23A on the supply side may be positioned in the Z1 direction of the connecting channel 47A. The malleable substrate 23B on the discharge side may also be positioned in the Z1 direction of the connecting channel 47B. The malleable substrates 23A and 23B may also be positioned on the nozzle substrate 21.

[0187] Variation Example 2

[0188] Although the liquid ejector head 10 described in Embodiment 1 is equipped with a structure containing plastic substrates 77A and 77B disposed in the common liquid chambers RA and RB, the liquid ejector head 10 may also be configured without the plastic substrates 77A and 77B. Furthermore, the amount of plasticity generated by the plastic substrate 77A on the supply side may differ from the amount of plasticity generated by the plastic substrate 77B on the discharge side. Additionally, the plastic substrates 77A and 77B may have different sizes.

[0189] Variation Example 3

[0190] Although in the liquid ejector head 10 described in Embodiment 1 above, the COF60 is disposed between the piezoelectric element 50 and the malleable substrate 23B on the discharge side in the X-axis direction, the arrangement of the COF60 is not limited to this. For example, the COF60 may also be disposed between the piezoelectric element 50 and the malleable substrate 23A on the supply side in the X-axis direction.

[0191] Variation Example 4

[0192] Although in the liquid ejector head 10 described in Embodiment 1 above, the nozzle N is positioned at a location overlapping the pressure chamber C when viewed in the Z-axis direction, the nozzle N can also be positioned at a location that does not overlap with the pressure chamber C. Furthermore, the liquid ejector head 10 can also be a structure in which multiple pressure chambers C are connected to a single nozzle N.

[0193] Variation Example 5

[0194] Although the liquid ejector head 10 described in Embodiment 1 has a structure in which the vibration absorption section 70A includes an independent electrode layer 71a, a common electrode layer 71b, and a piezoelectric layer 71c disposed on the malleable substrate 23A, the vibration absorption section 70A is not limited to having an independent electrode layer 71a, a common electrode layer 71b, and a piezoelectric layer 71c. For example, the vibration absorption section 70A may also have a structure with a piezoelectric layer 71c and a common electrode layer 71b, but without an independent electrode layer 71a. The material disposed on the malleable substrate 23A may also be other materials. If the material laminated on the malleable substrate 23A has the same structure as the piezoelectric element 50 on the vibrating plate 26, then when the piezoelectric element 50 is laminated, the independent electrode layer 71a, the common electrode layer 71b, and the piezoelectric layer 71c can be laminated simultaneously on the malleable substrate 23A. Therefore, the piezoelectric element 71A can be easily manufactured on the malleable substrate 23A. The same applies to the piezoelectric element 71B on the malleable substrate 77B.

[0195] Variation Example 6

[0196] The rigidity of the supply-side plastic substrate 23A can be lower than that of the discharge-side plastic substrate 23B. For example, the rigidity can be changed by altering the film thickness, material, length in the X-axis direction, and length in the Y-axis direction of the plastic substrates 23A and 23B. Furthermore, the rigidity of the plastic substrates 23A and 23B can also be changed by altering the structure of the laminates on the plastic substrates 23A and 23B. The laminates on the plastic substrates 23A and 23B include, for example, the piezoelectric elements 71A and 71B and the gold thin film 71E described above.

[0197] Although the embodiments described above exemplify a serial liquid ejection device 1 in which the carriage 3 equipped with the liquid ejection head 10 reciprocates in the width direction of the medium PA, the present invention can also be applied to a row-type liquid ejection device having a row head in which the liquid ejection head 10 is arranged in a predetermined direction.

[0198] The liquid ejection device 1 illustrated in the embodiments described above can be used not only in printing equipment but also in various other devices such as fax machines or copiers. Of course, the application of the liquid ejection device of the present invention is not limited to printing. For example, a liquid ejection device that ejects a solution of color material can be used as a manufacturing apparatus for color filters in display devices such as liquid crystal display panels. Furthermore, a liquid ejection device that ejects a solution of conductive material can be used as a manufacturing apparatus for wiring or electrodes in wiring substrates. Additionally, a liquid ejection device that ejects a solution of organic matter related to living organisms can be used, for example, as a manufacturing apparatus for biochips.

[0199] Symbol Explanation

[0200] 1…Liquid ejection device; 10, 10B, 10C, 10E, 10H…Liquid ejection head; 21…Nozzle substrate; 23A…Moldable substrate (supply-side moldable substrate); 23B…Moldable substrate (discharge-side moldable substrate); 24…Connecting plate; 25…Pressure chamber substrate; 30…Control unit; 41A…Supply channel; 41B…Discharge channel; 50…Piezoelectric element; 77A…Moldable substrate (second supply-side moldable substrate); 77B…Moldable… 61… Flexible wiring substrate (second discharge side plastic substrate); C… Pressure chamber; CL… Pressure chamber row; LX1… Length of supply side plastic substrate; LX2… Length of discharge side plastic substrate; N… Nozzle; X… X-axis direction (first direction); X1… X1 direction (one side of the first direction); X2… X2 direction (the other side of the first direction); Y… Y-axis direction (second direction); Z… Z-axis direction (third direction).

Claims

1. A liquid ejector head, characterized in that, have: A nozzle that sprays out liquid; Pressure chamber, used to apply pressure to a liquid; A supply channel is located on one side in a first direction relative to the pressure chamber and supplies liquid to the pressure chamber; A discharge channel is located on the opposite side of the pressure chamber in the first direction, and discharges liquid from the pressure chamber. A supply-side plastic substrate is disposed facing the supply channel and is used to absorb vibrations of the liquid within the supply channel; A malleable substrate on the discharge side, which is disposed facing the discharge channel, is used to absorb vibrations of the liquid within the discharge channel. The length of the discharge-side plastic substrate along the first direction is shorter than the length of the supply-side plastic substrate along the first direction. The liquid ejector head also includes a row of pressure chambers, which is a plurality of pressure chambers arranged in a predetermined direction. The supply-side plastic substrate is shared for the plurality of pressure chambers. The discharge-side plastic substrate is independently provided for the plurality of pressure chambers.

2. The liquid ejector head as described in claim 1, characterized in that, The plasticity of the discharge-side plastic substrate is smaller compared to that of the supply-side plastic substrate.

3. The liquid ejector head as described in claim 1 or 2, characterized in that, The rigidity of the supply-side plastic substrate is lower than that of the discharge-side plastic substrate.

4. The liquid ejector head as described in claim 1, characterized in that, The flow resistance of the discharge channel is greater than that of the supply channel.

5. A liquid ejector head, characterized in that, have: A nozzle that sprays out liquid; Pressure chamber, used to apply pressure to a liquid; A supply channel is located on one side in a first direction relative to the pressure chamber and supplies liquid to the pressure chamber; A discharge channel is located on the opposite side of the pressure chamber in the first direction, and discharges liquid from the pressure chamber. A supply-side plastic substrate is disposed facing the supply channel and is used to absorb vibrations of the liquid within the supply channel; A malleable substrate on the discharge side, which is disposed facing the discharge channel, is used to absorb vibrations of the liquid within the discharge channel. The length of the discharge-side plastic substrate along the first direction is shorter than the length of the supply-side plastic substrate along the first direction. The length of the discharge channel along the first direction is longer than the length of the supply channel along the first direction.

6. The liquid ejector head as described in claim 1 or 5, characterized in that, Upstream of the supply channel, a second supply-side plastic substrate, different from the supply-side plastic substrate, is also provided. A second discharge-side plastic substrate, different from the discharge-side plastic substrate, is also provided downstream of the discharge channel.

7. The liquid ejector head as described in claim 6, characterized in that, The second supply-side plastic substrate and the second discharge-side plastic substrate are disposed along a second direction that intersects the first direction.

8. The liquid ejector head as described in claim 7, characterized in that, The length of the second supply-side plastic substrate along the second direction is equal to the length of the second discharge-side plastic substrate along the second direction.

9. The liquid ejector head as described in claim 1 or 5, characterized in that, In the first direction, the supply-side plastic substrate and the discharge-side plastic substrate are disposed separately from each other.

10. The liquid ejector head as described in claim 9, characterized in that, The pressure chamber is located in the first direction between the supply-side plastic substrate and the discharge-side plastic substrate.

11. The liquid ejector head as described in claim 10, characterized in that, have: A piezoelectric element is disposed relative to the pressure chamber and causes pressure changes in the liquid within the pressure chamber; The wiring board is electrically connected to the piezoelectric element. When viewed from the third upward along the thickness direction of the discharge-side plastic substrate, the wiring board is located between the discharge-side plastic substrate and the pressure chamber.

12. A liquid ejector head, characterized in that, have: A nozzle that sprays out liquid; Pressure chamber, used to apply pressure to a liquid; A supply channel is located on one side in a first direction relative to the pressure chamber and supplies liquid to the pressure chamber; A discharge channel is located on the opposite side of the pressure chamber in the first direction, and discharges liquid from the pressure chamber. A supply-side plastic substrate is disposed facing the supply channel and is used to absorb vibrations of the liquid within the supply channel; A malleable substrate on the discharge side, which is disposed facing the discharge channel, is used to absorb vibrations of the liquid within the discharge channel. The length of the discharge-side plastic substrate along the first direction is longer than the length of the supply-side plastic substrate along the first direction. The length of the discharge channel along the first direction is shorter than the length of the supply channel along the first direction.

13. The liquid ejector head as described in claim 12, characterized in that, The plasticity of the discharge-side plastic substrate is greater than that of the supply-side plastic substrate.

14. The liquid ejector head as described in claim 12 or 13, characterized in that, The flow resistance of the discharge channel is smaller compared to the flow resistance of the supply channel.

15. The liquid ejector head according to any one of claims 1, 5, and 12, characterized in that, It also has: A pressure chamber base plate having the pressure chamber disposed thereon; A nozzle substrate having the nozzle provided thereon; A connecting plate, which has a portion of the supply channel and the discharge channel, is disposed between the pressure chamber base plate and the nozzle base plate. The supply channel is a channel located upstream of the pressure chamber in the channels provided on the connecting plate and the pressure chamber base plate. The discharge channel is a channel located downstream of the pressure chamber in the channels provided on the connecting plate and the pressure chamber base plate.

16. A liquid ejection device, characterized in that, have: The liquid ejector head according to any one of claims 1 to 15; The control unit controls the ejection action that causes the liquid to be ejected from the liquid nozzle.

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