Mask plate equalization cooling device

Abstract

This invention relates to a mask uniform cooling device, comprising a heat-conducting metal plate, multiple cooling pads, and a heat insulation pad. The back side of the area of ​​the heat-conducting metal plate used to support the mask is divided into multiple cooling zones arranged in a matrix. Cooling grooves are provided between adjacent rows and columns of cooling zones. Each row or column of cooling zones has a wiring groove, the depth of which is less than the thickness of the heat-conducting metal plate. Each cooling pad is installed in a cooling zone, with its cold side attached to the heat-conducting metal plate. The lead wire of a temperature sensor located in the middle area of ​​the cold side of each cooling pad is led out from the corresponding wiring groove. The heat insulation pad is disposed on the back side of the heat-conducting metal plate and has a perforated grid facing each cooling zone. This invention employs individual control of each cooling zone, precisely controlling the temperature of each cooling zone, thereby achieving uniform cooling of all parts of the mask.

Description

Technical Field

[0001] This invention relates to the field of photomask production, and more specifically to a photomask equalization cooling device. Background Technology

[0002] During the photolithography process, the photomask expands due to the absorption of radiation light, which in turn causes it to deform and affects the photolithography magnification. Changes in the photomask magnification will affect the photolithography accuracy. In actual mass production, it is impossible to calibrate the photomask magnification at any time. Therefore, cooling the photomask is the fundamental solution.

[0003] Most existing mask cooling devices use water cooling or air cooling to reduce temperature. These methods have problems such as difficulty in controlling and inaccuracy of temperature, uneven cooling of different parts of the mask, and large local temperature differences. These problems will affect the mask magnification and thus the lithography accuracy. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide a mask plate equalization cooling device, which adopts a method of individual control of each cooling zone to accurately control the temperature of each cooling zone, so as to achieve equal cooling of each position of the mask plate.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is: a mask plate equalization cooling device, comprising:

[0006] A cooling metal plate, wherein the back side of the area of ​​the cooling metal plate used to support the mask is divided into multiple cooling zones arranged in a matrix, and a cooling insulation groove is provided between adjacent rows and adjacent columns of cooling zones, and a wiring groove is provided in each row or column of cooling zones, wherein the depth of the cooling insulation groove and the wiring groove is less than the thickness of the cooling metal plate.

[0007] Multiple cooling chips are installed in a cooling zone, and the cold side is attached to the heat-conducting metal plate. The lead wire of the temperature sensor located in the middle area of ​​the cold side of each cooling chip is led out from the corresponding wiring groove.

[0008] A heat insulation pad is disposed on the back of the heat-conducting metal plate and has a perforated grid pattern facing each cooling zone.

[0009] Furthermore, the cooling zones located in the edge rows or edge columns employ edge wiring channels, which include main wiring channels and multiple branch wiring channels. The main wiring channels are located on the side of the heat insulation pad, and the branch wiring channels extend from the middle area of ​​the corresponding edge cooling zone to the main wiring channels and are perpendicular to the main wiring channels.

[0010] Furthermore, the cooling zones located in non-edge rows or columns employ intermediate wiring channels, which are straight channels passing through the middle position of the corresponding row or column of the cooling zone.

[0011] Furthermore, to prevent the lead wires from detaching from the intermediate wiring groove, a spacer for pressing the lead wires is installed inside the intermediate wiring groove.

[0012] Furthermore, the partition is cross-shaped and is fitted into the position where the intermediate wiring groove and the corresponding cold insulation groove intersect.

[0013] Furthermore, to better avoid mutual interference between the cooling zones, the surface of the heat insulation pad near the heat-conducting metal plate has embedded ribs corresponding to the heat insulation grooves. The embedded ribs are embedded in the corresponding heat insulation grooves, and a notch is provided at the position of the embedded ribs opposite the wiring groove.

[0014] Furthermore, in order to ensure that the cooling chips can continue to work normally, the mask plate equalization cooling device also includes a heat dissipation device, which is disposed on the hot side of the multiple cooling chips.

[0015] Furthermore, the heat dissipation device is a water-cooled structure, and the water-cooled structure has a meandering water-cooling channel inside.

[0016] Furthermore, side heat insulation plates are fixedly installed around the cold-conducting metal plate, and the side heat insulation plates protrude from the cold-conducting metal plate in both the direction facing the front of the cold-conducting metal plate and the direction facing the back of the cold-conducting metal plate.

[0017] By adopting the above technical solution, the present invention enables individual temperature control of each cooling zone. At the same time, it uses a cold insulation groove and heat insulation pad to isolate adjacent cooling chips, ensuring that multiple cooling chips are independent of each other and do not affect each other. It also provides a wiring groove, which, while ensuring aesthetics, allows the cold side of the cooling chip to be tightly and flatly attached to the back of the heat-conducting metal plate, thus achieving uniform cooling of the cooling zone. The present invention can precisely control the temperature of each cooling zone, avoiding excessive temperature differences in different areas of the heat-conducting metal plate, thereby ensuring uniform cooling of all parts of the mask. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the mask plate equalization cooling device of the present invention;

[0019] Figure 2 for Figure 1 Exploded view;

[0020] Figure 3 This is a schematic diagram of the back structure of the heat-conducting metal plate of the present invention;

[0021] Figure 4 This is a schematic diagram of the mask plate equalization cooling device of the present invention after the water cooling structure has been removed;

[0022] Figure 5 This is a schematic diagram of the structure of the heat insulation pad of the present invention. Detailed Implementation

[0023] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0024] like Figure 1 , 2 As shown in Figures 3, 4, and 5, a mask plate equalization cooling device includes:

[0025] The back side of the area of ​​the cooling metal plate 1 used to support the mask 10 is divided into multiple cooling zones arranged in a matrix. Cooling grooves 2 are provided between adjacent rows and adjacent columns of cooling zones. Each row or column of cooling zones is provided with a wiring groove. The depth of the cooling grooves 2 and the wiring grooves is less than the thickness of the cooling metal plate 1.

[0026] Multiple cooling elements 3 are installed in a cooling zone, and the cold side is attached to the heat-conducting metal plate 1. The lead wire of the temperature sensor configured in the middle area of ​​the cold side of each cooling element 3 is led out from the corresponding wiring groove.

[0027] The heat insulation pad 4 is disposed on the back of the heat-conducting metal plate 1, and has a perforated grid 41 at the position opposite each cooling zone.

[0028] This embodiment features multiple identical cooling zones, each equipped with a cooling chip 3. Each cooling zone is individually controlled. Adjacent cooling chips 3 are isolated using a cold-insulating groove 2 and a heat-insulating pad 4, ensuring that the multiple cooling chips 3 are independent and do not interfere with each other. Each temperature sensor collects the temperature of the middle area of ​​the cold side of the corresponding cooling chip 3, free from external interference. Based on the temperature feedback from the temperature sensors, a PID control method is used for precise temperature control of each cooling zone, preventing excessive temperature differences between different areas of the heat-conducting metal plate 1. This ensures even cooling of all parts of the mask 10. This embodiment also includes wiring channels. Temperature sensors are installed in the middle of each cooling zone, and their leads are led out from these channels. The wiring channels prevent messy leads and avoid gaps between the cooling chips 3 and the heat-conducting metal plate 1 caused by placing the leads between them. The wiring channels also ensure that the cold side of the cooling chip 3 is tightly attached to the back of the heat-conducting metal plate 1, guaranteeing even and better cooling of the cooling zones.

[0029] In this embodiment, the heat insulation pad 4 is configured as a grid structure, which can block adjacent cooling elements 3 on the one hand, and position, fix and constrain each cooling element 3 on the other hand.

[0030] In this embodiment, the heat-conducting metal plate 1 can be made of stainless steel, but is not limited to this. The cooling plate 3 is a semiconductor cooling plate.

[0031] In this embodiment, the PLC is connected to each temperature sensor and each cooling chip 3 respectively. Based on the temperature feedback from each temperature sensor, the PLC uses the PID method to control the operation of the corresponding cooling chip 3 to control the temperature, so that all parts of the mask plate 10 are cooled evenly to the required temperature.

[0032] like Figure 3 As shown, the cooling zones located in the edge rows or columns employ edge wiring channels 5. The edge wiring channels 5 include a main channel 51 and multiple branch channels 52. The main channel 51 is located on the side of the heat insulation pad 4. The branch channels 52 extend from the middle area of ​​the corresponding edge cooling zone to the main channel 51 and are perpendicular to the main channel 51. Each branch channel 52 only needs to lead out one temperature sensor lead, therefore, it can be set relatively narrow to minimize interference with the temperature uniformity of various positions on the heat-conducting metal plate 1. The temperature sensor lead enters the main channel 51 along the branch channel 52 and then exits from the main channel 51. The lead is bent once when entering the main channel 51 from the branch channel 52, so the lead will not be pulled up during wiring or debugging. To ensure the lead's firmness within the edge wiring channels 5, it can also be glued to the edge wiring channels 5.

[0033] like Figure 3 As shown, the cooling zones located in non-edge rows or columns utilize a central wiring trough 6, which is a straight trough passing through the middle of the corresponding row or column of cooling zone. This arrangement results in a more aesthetically pleasing and orderly appearance, while also minimizing the length of the wiring troughs in the non-edge rows or columns of cooling zone.

[0034] like Figure 3 As shown, a spacer 7 for clamping the leads is installed inside the intermediate wiring groove 6. Because the leads in the intermediate wiring groove 6 are led out along a straight path without the corner constraints of the edge wiring groove 5, there is a risk of the leads coming loose during wiring or debugging. The spacer 7 is provided to keep the leads clamped inside the intermediate wiring groove 6. The leads can also be glued to the intermediate wiring groove 6 to ensure a secure fit.

[0035] like Figure 3 As shown, the spacer 7 is cross-shaped and is fitted into the intersection of the central wiring groove 6 and the corresponding cold insulation groove 2. This arrangement allows the spacer 7 to be firmly fitted into the central wiring groove while keeping its length as short as possible. The shorter length of the spacer 7 also minimizes interference with the temperature uniformity of various positions on the cold-conducting metal plate 1.

[0036] In this embodiment, there are nine cooling zones and nine cooling chips arranged in a 3×3 matrix, and each column of cooling zones is provided with the wiring groove 6. The cooling zones in the edge columns use the edge wiring groove 5, and the cooling zones in the non-edge columns use the middle wiring groove 6.

[0037] In this embodiment, the surface of the heat insulation pad 4 near the cold-conducting metal plate 1 has embedded ribs corresponding to the cold-insulating grooves 2. The embedded ribs are embedded in the corresponding cold-insulating grooves 2, and a notch is provided at the position of the embedded ribs opposite the wiring groove. This arrangement can better reduce interference between adjacent cooling elements 3.

[0038] like Figure 1 , 2 As shown, the mask plate equalization cooling device also includes a heat dissipation device, which is disposed on the hot side of multiple cooling chips 3. The heat dissipation device can be a water-cooled structure 8, which has a meandering water-cooling channel. The water-cooled structure 8 includes an aluminum plate 81 and a cover plate 82, with the cover plate 82 covering the aluminum plate 81. The water-cooling channel is located between the cover plate 82 and the aluminum plate 81, and has an inlet and an outlet. It adopts a cooling water circulation cooling mode to ensure that the cooling chips 3 can continuously operate normally.

[0039] like Figure 1 , 2 As shown in Figure 4, side heat insulation plates 9 are fixedly installed around the cold-conducting metal plate 1. The side heat insulation plates 9 protrude from the cold-conducting metal plate 1 in both the direction facing the front and the back of the cold-conducting metal plate 1. The four side heat insulation plates 9 form a circle, providing installation space for the cooling chip 3, the heat insulation pad 4, and the water-cooling structure 8, and also serving as heat insulation.

[0040] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A mask plate equalization cooling device, characterized in that, include: A cooling metal plate (1) is provided. The back side of the area of ​​the cooling metal plate (1) used to support the mask plate (10) is divided into multiple cooling zones arranged in a matrix. Cooling grooves (2) are provided between adjacent rows and adjacent columns of cooling zones. Each row or column of cooling zone is provided with a wiring groove. The depth of the cooling groove (2) and the wiring groove is less than the thickness of the cooling metal plate (1). Multiple cooling chips (3), each cooling chip (3) is installed in a cooling zone and the cold side is attached to the heat-conducting metal plate (1). The lead wire of the temperature sensor configured in the middle area of ​​the cold side of each cooling chip (3) is led out from the corresponding wiring groove. Heat insulation pad (4), the heat insulation pad (4) is disposed on the back of the heat-conducting metal plate (1), and a perforated grid (41) is provided in the position facing each cooling zone; The cooling zone located in the edge row or edge column adopts the edge wiring channel (5), the edge wiring channel (5) includes the main channel (51) and multiple branch channels (52), the main channel (51) is located on the side of the heat insulation pad (4), and the branch channels (52) extend from the middle area of ​​the corresponding edge cooling zone to the main channel (51) and are perpendicular to the main channel (51); The refrigeration zone located in a non-edge row or non-edge column adopts a central wiring groove (6), which is a straight groove that passes through the middle position of the refrigeration zone in the corresponding row or column. The intermediate wiring groove (6) is fitted with a spacer (7) for pressing the lead wire; The surface of the heat insulation pad (4) near the cold-conducting metal plate (1) has an embedded rib corresponding to the cold insulation groove (2). The embedded rib is embedded in the corresponding cold insulation groove (2), and a notch is provided at the position of the embedded rib opposite the wiring groove.

2. The mask plate equalization cooling device according to claim 1, characterized in that, The partition (7) is cross-shaped and is fitted at the intersection of the intermediate wiring groove (6) and the corresponding cold insulation groove (2).

3. The mask plate equalization cooling device according to claim 1, characterized in that, It also includes a heat dissipation device, which is disposed on the hot side of a plurality of cooling plates (3).

4. The mask plate equalization cooling device according to claim 3, characterized in that, The heat dissipation device is a water-cooled structure (8), and the water-cooled structure (8) has a meandering water-cooling channel inside.

5. The mask plate equalization cooling device according to claim 1, characterized in that, Side heat insulation plates (9) are fixedly installed around the cold-conducting metal plate (1). The side heat insulation plates (9) protrude from the cold-conducting metal plate (1) in both the direction facing the front and the back of the cold-conducting metal plate (1).

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