Electronic component dispensing method, apparatus, electronic device, and storage medium

Abstract

The application discloses a kind of electronic component distribution method, device, electronic equipment and storage medium, the method comprises: obtaining the target quantity of electronic component in predetermined position;The predetermined position is the detection position of vacuum suction head;According to the target quantity of the electronic component, the predicted distribution time corresponding to the vacuum suction head is calculated;Based on the preset time set, the similarity set between the predicted distribution time and the preset time set is determined;The preset time set is the time set corresponding to the time set that the vacuum suction head distributes target quantity of the electronic component in historical time;According to the highest similarity of the similarity set is determined target time, to determine the working parameter corresponding to the vacuum suction head according to the target time, and the vacuum suction head is distributed to the electronic component by the working parameter control.The efficiency of electronic component distribution can be dynamically adjusted, the demand for artificial is reduced, and the production efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of electronic component technology, and more specifically to a method, apparatus, electronic device, and storage medium for distributing electronic components. Background Technology

[0002] Circuit products require numerous electronic components. To ensure a high yield rate, each electronic component must be inspected before use to promptly remove any defective ones. Currently, after initial screening by testing equipment, electronic components require further manual screening. However, the randomness of the number of components screened at different workstations makes it difficult to dynamically adjust component allocation efficiency, resulting in high labor demands and hindering production efficiency. Summary of the Invention

[0003] Firstly, the main objective of this invention is to provide a method for distributing electronic components, comprising:

[0004] Obtain the target number of electronic components at a predetermined location; the predetermined location is the detection position of the vacuum nozzle.

[0005] Calculate the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components;

[0006] Based on a preset time set, a similarity set between the predicted allocation time and the preset time set is determined; wherein, the preset time set is the time set corresponding to the allocation of the target number of electronic components by the vacuum suction head within a historical time period;

[0007] The target time with the highest similarity is determined based on the similarity set, and the working parameters corresponding to the vacuum head are determined based on the target time. The working parameters are then used to control the vacuum head to distribute the electronic components.

[0008] Preferably, the step of obtaining the target number of electronic components corresponding to the vacuum nozzle includes:

[0009] When the electronic component to be detected reaches the predetermined position, a target image of the electronic component is acquired;

[0010] The target image is input into the feature extraction model to obtain the target pixels of the target image;

[0011] The target pixel is compared with the reference pixel in the preset image information. If the target image and the preset image information meet the filtering conditions, the target number of the electronic component is calculated based on the target image.

[0012] Preferably, calculating the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components includes:

[0013] Obtain a preset allocation number of the vacuum nozzles; wherein the preset allocation number is related to the number of vacuum nozzles;

[0014] Calculate the ratio between the preset allocation number of the vacuum nozzles and the target number;

[0015] The predicted allocation time for the vacuum suction head is calculated based on the proportional relationship and the movement time of the vacuum suction head.

[0016] Preferably, the moving time is the moving time of the vacuum nozzle for one round trip; the step of calculating the predicted allocation time corresponding to the vacuum nozzle based on the proportional relationship and the moving time of the vacuum nozzle includes:

[0017] The number of times the vacuum suction head moves is determined based on the aforementioned proportional relationship;

[0018] Based on the number of moves and the move time, the predicted allocation time corresponding to the vacuum suction head is calculated.

[0019] Preferably, the step of determining the target time with the highest similarity based on the similarity set, determining the operating parameters corresponding to the vacuum suction head based on the target time, and controlling the vacuum suction head to allocate the electronic components through the operating parameters includes:

[0020] Based on the similarity set, determine the target time with the highest similarity to the predicted allocation time from the predetermined time set;

[0021] The target position and movement path of the vacuum suction head are determined based on the target time;

[0022] The vacuum nozzle is controlled to dispense the electronic components by means of the target location and the movement path.

[0023] Preferably, determining the target position and movement path of the vacuum suction head based on the target time includes:

[0024] Based on the target time and the moving speed of the vacuum nozzle, the moving path corresponding to the target time is calculated;

[0025] Obtain the historical allocation quantity for each location in the movement path; the historical allocation quantity is the quantity of the electronic component allocated within a predetermined time period;

[0026] Based on the historical allocation quantity of each location, the location with the fewest historical allocation quantities is determined as the target location.

[0027] Preferably, the step of controlling the vacuum suction head to dispense the electronic components via the target position and the movement path includes:

[0028] The current allocation quantity for the target location is obtained by accumulating the target quantity and the historical allocation quantity.

[0029] The difference between the current allocation quantities of each pair of positions is calculated to obtain the difference result;

[0030] The electronic components are assigned to various locations based on the difference results.

[0031] Secondly, embodiments of the present invention provide an electronic component dispensing device, comprising:

[0032] The acquisition module is used to acquire the target number of electronic components at a predetermined location; the predetermined location is the detection position of the vacuum nozzle.

[0033] The calculation module is used to calculate the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components;

[0034] The first determining module is used to determine a similarity set between the predicted allocation time and the preset time set based on a preset time set; wherein, the preset time set is the time set corresponding to the allocation of the target number of electronic components by the vacuum suction head within a historical time period;

[0035] The second determining module is used to determine the target time with the highest similarity based on the similarity set, so as to determine the working parameters corresponding to the vacuum suction head based on the target time, and control the vacuum suction head to allocate the electronic components through the working parameters.

[0036] Thirdly, embodiments of the present invention provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the electronic component allocation method described above.

[0037] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the electronic component allocation method described above.

[0038] The above-described solution of the present invention has at least the following beneficial effects:

[0039] The electronic component allocation method provided by this invention first obtains the target number of electronic components in a predetermined location; then, based on the target number of electronic components, calculates the predicted allocation time corresponding to the vacuum suction head; based on a preset time set, determines a similarity set between the predicted allocation time and the preset time set; finally, based on the similarity set, determines the target time with the highest similarity, and determines the working parameters corresponding to the vacuum suction head based on the target time, and controls the vacuum suction head to allocate the electronic components through the working parameters. This allows the efficiency of electronic component allocation to be dynamically adjusted, reduces manual labor requirements, and effectively improves production efficiency. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0041] Figure 1 A schematic diagram of the overall process of the electronic component allocation method provided in the embodiments of the present invention;

[0042] Figure 2 An application scenario diagram of the electronic component allocation method provided in the embodiments of the present invention;

[0043] Figure 3 A structural block diagram of an electronic component distribution device provided in an embodiment of the present invention;

[0044] Figure 4 This is a structural block diagram of an electronic device provided in an embodiment of the present invention.

[0045] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0047] The terms "first," "second," and "third," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects and not to describe a specific order. Furthermore, the term "comprising," and any variations thereof, is intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0048] First, let's take a look at the relevant accompanying drawings to illustrate the solution of the embodiments of this application.

[0049] like Figure 1 As shown, a specific embodiment of the present invention provides a method for distributing electronic components, including:

[0050] S10. Obtain the target number of electronic components in the predetermined position; the predetermined position is the detection position of the vacuum nozzle.

[0051] The target number can represent the number of abnormal electronic components. The vacuum suction head can move together with the camera to a predetermined position and identify the abnormal electronic components through the camera. The target number is calculated by counting the abnormal electronic components. Optionally, when detecting and counting electronic components, the abnormal electronic components and non-abnormal electronic components can be image segmented, and the abnormal electronic components are counted after image segmentation to obtain the corresponding target number.

[0052] Specifically, the process of obtaining the target number of electronic components corresponding to the vacuum suction head includes: acquiring a target image of the electronic component when it reaches a predetermined position; inputting the target image into a feature extraction model to obtain target pixels of the target image; comparing the target pixels with reference pixels in preset image information; and calculating the target number of electronic components based on the target image if the target image and the preset image information meet the screening conditions.

[0053] In this embodiment, the detection device may include a vacuum suction head and a camera. The vacuum suction head and the camera can move together. The predetermined position may be the detection position corresponding to the camera and there may be multiple such positions. Electronic components may be moved to the predetermined position by means of a conveyor belt or the like, and the camera may acquire target images of multiple electronic components. The target images may be in JPG, PNG, TIF, BMP, or other formats, or they may be RGB, YUV, or HSV images. When the electronic component reaches the predetermined position, the electronic component may be in a stopped conveying state. By taking corresponding target images of multiple electronic components, the quality status of each electronic component can be determined through the target images.

[0054] The feature extraction model can be a YOLOv4 feature extraction network model. By inputting the target image into the feature extraction model, the model determines the target pixels in the target image. The target pixels are compared with reference pixels in the preset image information. During the comparison, the position of each pixel in the x-axis and y-axis directions is determined first. Pixels at the same position are then compared to determine if they are identical. If the target pixel is the same as the reference pixel, the target image does not meet the filtering conditions. If the target pixel is different from the reference pixel, the target image meets the filtering conditions. In other words, the filtering is satisfied when the electronic component malfunctions, and not satisfied when the electronic component is normal. In an optional embodiment, the RGB value of the reference pixel can be used as a reference threshold. By comparing the RGB value of the target pixel with the reference threshold, if the RGB values ​​are the same, the filtering conditions are not met; if the RGB values ​​are different, the filtering conditions are met.

[0055] S20. Calculate the predicted allocation time for the vacuum head based on the target number of electronic components.

[0056] In this embodiment, the predicted allocation time can be the time required for the vacuum nozzle to allocate the target number of electronic components. When calculating the predicted allocation time, the single movement time of the vacuum nozzle can be determined based on the average moving distance of the vacuum nozzle. At the same time, the number of movements of the vacuum nozzle can be calculated based on the target number. By determining the number of movements and the single movement time of the vacuum nozzle, the corresponding predicted allocation time can be calculated. Optionally, the average moving distance of the vacuum nozzle can be the average distance of a round trip from a predetermined position to multiple target positions. For example, if the predetermined position is A and the target positions are B, C, and D, the round trip distances of AB, AC, and AD can be calculated respectively, and the average value can be calculated as the average moving distance of the vacuum nozzle.

[0057] Furthermore, the above-mentioned calculation of the predicted allocation time for the vacuum nozzle based on the target number of electronic components includes: obtaining a preset allocation number of vacuum nozzles; wherein the preset allocation number is related to the number of vacuum nozzles; calculating the ratio between the preset allocation number and the target number based on the preset allocation number of vacuum nozzles; and calculating the predicted allocation time for the vacuum nozzle based on the ratio and the movement time of the vacuum nozzle.

[0058] In this embodiment, the preset allocation quantity can be represented as the number of vacuum suction heads, and the movement time is the movement time of one round trip of the vacuum suction head. The above calculation of the predicted allocation time corresponding to the vacuum suction head based on the proportional relationship and the movement time of the vacuum suction head includes: determining the number of times the vacuum suction head moves according to the proportional relationship; and calculating the predicted allocation time corresponding to the vacuum suction head based on the number of moves and the movement time. That is, by calculating the ratio between the preset allocation quantity and the target quantity, the number of times the vacuum suction head moves can be determined from the calculated ratio result. It can be understood that the number of moves can be set as m, and the movement time can be set as t, thereby obtaining the predicted allocation time as T = m × t, where the number of moves can be calculated using the following formula: k′ represents the preset allocation quantity, and k represents the target quantity. Therefore, by determining the number of times the vacuum nozzle moves and the moving time, the predicted allocation time of the vacuum nozzle can be calculated. For example, if the preset allocation quantity is 5, the target quantity is 23, and the moving time is 3 seconds, the number of moves can be calculated to be 5 using the above formula, and thus the predicted allocation time can be calculated to be 15 seconds.

[0059] S30. Based on the preset time set, determine the similarity set between the predicted allocation time and the preset time set; wherein, the preset time set is the time set corresponding to the number of electronic components allocated by the vacuum head in historical time periods.

[0060] In this embodiment, since the vacuum suction head takes a slightly longer time to move, a similarity calculation is performed between a preset time set and the predicted allocation time to determine the actual time when the vacuum suction head allocates the target quantity within a historical time period. Furthermore, a similarity set between the predicted allocation time and the preset time set is calculated. This similarity set identifies the actual time within the preset time set that has a high similarity to the predicted allocation time. The preset time set can be represented as K. a {K1, K2, K3...K a Therefore, the similarity set can be represented as sim Ta {sim T1 , sim T2 , sim T3 …sim Ta}, where 'a' can be represented as the preset time K. a It is understandable that a target time close to the predicted allocation time can be determined through the similarity set, so as to determine the working parameters of the vacuum nozzle based on the target time.

[0061] S40. Determine the target time with the highest similarity based on the similarity set, determine the working parameters corresponding to the vacuum head based on the target time, and control the vacuum head to distribute electronic components through the working parameters.

[0062] In this embodiment, each time in the preset time set corresponds to a different working parameter of the vacuum suction head. The working parameter of the vacuum suction head may include the movement path and movement speed. By determining the target time with the highest similarity, the working parameter corresponding to the target time is used to control the vacuum suction head to work. Optionally, after determining the similarity set, the similarity set can be sorted from largest to smallest. That is, by comparing the predicted allocation time with each time in the preset time set one by one, when the predicted allocation time has the highest similarity with a certain time, that time can be determined as the target time. The working parameter corresponding to the vacuum suction head in the historical time period is determined by the target time. The working parameter is used to control the operation of the vacuum suction head, so that the allocation of electronic components is more balanced and the allocation efficiency can be improved.

[0063] like Figure 2 As shown, the above-mentioned method of determining the target time with the highest similarity based on the similarity set, determining the working parameters of the vacuum nozzle based on the target time, and controlling the vacuum nozzle to allocate electronic components through the working parameters includes: determining the target time with the highest similarity to the predicted allocation time from a predetermined time set based on the similarity set; determining the target position and movement path of the vacuum nozzle based on the target time; and controlling the vacuum nozzle to allocate electronic components through the target position and movement path.

[0064] In this embodiment, there can be multiple target locations, which can be represented as manual workstations. When the vacuum suction head distributes electronic components, it can move any abnormal electronic components from a predetermined location to a target location, allowing the worker at the target location to further screen the abnormal electronic components. It is understood that after determining the target location and movement path that the vacuum suction head needs to reach based on the target time, the electronic components at the predetermined location can be distributed according to the target location and movement path. There can be at least two movement paths, and each movement path can include at least two target locations, so that when the vacuum suction head distributes electronic components, it can move to the corresponding movement path and distribute the electronic components to the corresponding target locations for manual screening. For example, when the target time is 15 seconds, the determined movement paths are predetermined locations to B and C and predetermined locations to F and H. Thus, the target locations can be determined as B, C, F, and H.

[0065] Furthermore, the above-mentioned determination of the target position and movement path of the vacuum nozzle based on the target time includes: calculating the movement path corresponding to the target time based on the target time and the movement speed of the vacuum nozzle; obtaining the historical allocation quantity of each position in the movement path; the historical allocation quantity is the quantity of electronic components allocated within a predetermined time period; and determining the position with the minimum historical allocation quantity as the target position based on the historical allocation quantity of each position.

[0066] The predetermined time period can be before the current time or within a day, such as from 8:00 AM to 10:00 AM. By counting the historical allocation quantities at each location along the movement path in real time, and using the real-time counting results as the historical allocation quantities, the target quantity of electronic components is determined. After determining the target quantity of electronic components, the target location is determined based on the historical allocation quantities. The vacuum suction head is then moved at the movement speed corresponding to the target time, and the target quantity of electronic components is allocated to the target location, thereby improving the allocation efficiency of the vacuum suction head. Optionally, the location with the lowest historical allocation quantity can be determined as the target location, which can ensure that the allocation quantity at each location increases evenly during the allocation process, thereby improving the work efficiency of workers at each location. For example, if there are two locations, A and B, in the movement path, and the historical allocation quantity at location A is 200 and the historical allocation quantity at location B is 230, then the target quantity of electronic components can be allocated to location A.

[0067] In an optional embodiment, after the above-described allocation of electronic components by controlling the vacuum suction head through the target position and movement path includes: accumulating the target quantity and the historical allocation quantity to obtain the current allocation quantity at the target position; calculating the difference between the current allocation quantities of each pair of positions to obtain the difference result; and allocating the electronic components to each position according to the difference result.

[0068] In this embodiment, after the target number of electronic components is allocated, the current allocation quantity for each position can be calculated. By calculating the difference between the current allocation quantities of each pair of positions, the two positions with the largest difference and the two positions with the smallest difference can be obtained. Thus, by determining the two positions with the largest difference, the two positions can be alerted in different ways. For example, a warning light can be output for the position with a larger quantity, while the next batch of selected electronic components can be allocated to the position with a smaller quantity after the target number of electronic components is allocated. Optionally, the two positions with a smaller difference can be evenly allocated in the next round, thereby ensuring that the electronic components allocated to each position are balanced and improving the allocation efficiency.

[0069] The electronic component allocation method provided by this invention first obtains the target number of electronic components in a predetermined location; then, based on the target number of electronic components, calculates the predicted allocation time corresponding to the vacuum suction head; based on a preset time set, determines the similarity set between the predicted allocation time and the preset time set; finally, based on the similarity set, determines the target time with the highest similarity, and determines the working parameters corresponding to the vacuum suction head based on the target time, and controls the vacuum suction head to allocate electronic components through the working parameters. This allows the efficiency of electronic component allocation to be dynamically adjusted, reducing manual labor requirements and effectively improving production efficiency.

[0070] like Figure 3 As shown, an embodiment of the present invention provides an electronic component dispensing device 10, comprising:

[0071] The acquisition module 11 is used to acquire the target number of electronic components in a predetermined position; the predetermined position is the detection position of the vacuum nozzle.

[0072] Calculation module 12 is used to calculate the predicted allocation time corresponding to the vacuum head based on the target number of electronic components;

[0073] The first determining module 13 is used to determine a similarity set between the predicted allocation time and the preset time set based on the preset time set; wherein, the preset time set is the time set corresponding to the number of electronic components allocated by the vacuum suction head in a historical time period;

[0074] The second determining module 14 is used to determine the target time with the highest similarity based on the similarity set, so as to determine the working parameters corresponding to the vacuum head based on the target time, and control the vacuum head to allocate electronic components through the working parameters.

[0075] The electronic component dispensing device 10 provided by this invention first obtains the target number of electronic components in a predetermined position; then, based on the target number of electronic components, calculates the predicted dispensing time corresponding to the vacuum suction head; based on a preset time set, determines the similarity set between the predicted dispensing time and the preset time set; finally, based on the similarity set, determines the target time with the highest similarity, and determines the working parameters corresponding to the vacuum suction head based on the target time, and controls the vacuum suction head to dispense electronic components through the working parameters. This allows the efficiency of electronic component dispensing to be dynamically adjusted, reducing manual labor requirements and effectively improving production efficiency.

[0076] It should be noted that the electronic component distribution device 10 provided in the specific embodiment of the present invention is a device corresponding to the above-described electronic component distribution method. All embodiments of the above-described electronic component distribution method are applicable to the electronic component distribution device 10. Each embodiment of the above-described electronic component distribution device 10 has a corresponding module corresponding to the steps in the above-described electronic component distribution method, which can achieve the same or similar beneficial effects. In order to avoid excessive repetition, each module in the electronic component distribution device 2 will not be described in detail here.

[0077] like Figure 4 As shown, a specific embodiment of the present invention also provides an electronic device 20, including a memory 202, a processor 201, and a computer program stored in the memory 202 and executable on the processor 201. When the processor 201 executes the computer program, it implements the steps of the above-described method for allocating electronic components.

[0078] Specifically, processor 201 calls the computer program stored in memory 202 and performs the following steps:

[0079] Obtain the target number of electronic components at a predetermined location; the predetermined location is the detection position of the vacuum nozzle.

[0080] Calculate the predicted allocation time for the vacuum head based on the target number of electronic components;

[0081] Based on a preset time set, a similarity set between the predicted allocation time and the preset time set is determined; wherein, the preset time set is the time set corresponding to the number of electronic components allocated by the vacuum pick in a historical time period;

[0082] The target time with the highest similarity is determined based on the similarity set. The working parameters of the vacuum nozzle are then determined based on the target time, and the vacuum nozzle is controlled to distribute electronic components through the working parameters.

[0083] Optionally, the processor 201 may perform the following steps before acquiring the target number of electronic components corresponding to the vacuum nozzle:

[0084] When the electronic component to be inspected reaches the predetermined position, acquire a target image of the electronic component;

[0085] The target image is input into the feature extraction model to obtain the target pixels of the target image;

[0086] The target pixel is compared with the reference pixel in the preset image information. If the target image and the preset image information meet the screening conditions, the target number of electronic components is calculated based on the target image.

[0087] Optionally, the processor 201 performs the calculation of the predicted allocation time corresponding to the vacuum head based on the target number of electronic components, including:

[0088] Obtain the preset allocation number of vacuum nozzles; wherein, the preset allocation number is related to the number of vacuum nozzles;

[0089] Calculate the ratio between the preset allocation quantity and the target quantity based on the preset allocation quantity of the vacuum nozzles;

[0090] The predicted allocation time for the vacuum nozzle is calculated based on the proportional relationship and the movement time of the vacuum nozzle.

[0091] Optionally, the movement time is the movement time of one round trip of the vacuum nozzle; the processor 201 calculates the predicted allocation time corresponding to the vacuum nozzle based on the proportional relationship and the movement time of the vacuum nozzle, including:

[0092] The number of times the vacuum nozzle moves is determined based on the proportional relationship;

[0093] Based on the number of moves and the move time, the predicted allocation time corresponding to the vacuum nozzle is calculated.

[0094] Optionally, the processor 201 performs the following steps: determining the target time with the highest similarity based on the similarity set, determining the operating parameters corresponding to the vacuum suction head based on the target time, and controlling the vacuum suction head to allocate electronic components using the operating parameters.

[0095] Based on the similarity set, the target time with the highest similarity to the predicted allocation time is determined from the predetermined time set;

[0096] The target position and movement path of the vacuum nozzle are determined based on the target time.

[0097] The vacuum nozzle is controlled by the target location and movement path to dispense electronic components.

[0098] Optionally, the processor 201 performs the following steps to determine the target position and movement path of the vacuum nozzle based on the target time:

[0099] Calculate the movement path corresponding to the target time based on the target time and the moving speed of the vacuum nozzle;

[0100] Obtain the historical allocation quantity for each location in the movement path; the historical allocation quantity is the quantity of electronic components allocated within a predetermined time period.

[0101] Based on the historical allocation quantity of each location, the location with the fewest historical allocation quantities is determined as the target location.

[0102] Optionally, after the processor 201 controls the vacuum nozzle to dispense electronic components via target position and movement path, the process includes:

[0103] The current allocation quantity for the target location is obtained by accumulating the target quantity and the historical allocation quantity.

[0104] The difference between the current allocation quantities of each pair of positions is calculated to obtain the difference result;

[0105] The electronic components are assigned to their respective locations based on the difference results.

[0106] That is, in a specific embodiment of the present invention, when the processor 201 of the electronic device 20 executes the computer program, it implements the steps of the above-mentioned electronic component allocation method, thereby enabling the efficiency of electronic component allocation to be dynamically adjusted, reducing the need for manual labor, and effectively improving production efficiency.

[0107] It should be noted that since the processor 201 of the electronic device 20 implements the steps of the above-described electronic component allocation method when executing the computer program, all embodiments of the above-described electronic component allocation method are applicable to the electronic device 20 and can achieve the same or similar beneficial effects.

[0108] The computer-readable storage medium provided in this embodiment of the invention stores a computer program. When the computer program is executed by a processor, it implements the various processes of the electronic component allocation method or the application-side electronic component allocation method provided in this embodiment of the invention, and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0109] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or random access memory (RAM), etc.

[0110] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0111] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made under the concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for distributing electronic components, characterized in that, include: Obtain the target number of electronic components at a predetermined location; the predetermined location is the detection position of the vacuum nozzle. Calculate the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components; Based on a preset time set, determine the similarity set between the predicted allocation time and the preset time set; The preset time set is the time set corresponding to the target number of electronic components allocated by the vacuum suction head within a historical time period; The target time with the highest similarity is determined based on the similarity set, and the working parameters corresponding to the vacuum head are determined based on the target time. The working parameters are then used to control the vacuum head to distribute the electronic components. The step of calculating the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components includes: Obtain a preset allocation number of the vacuum nozzles; wherein the preset allocation number is related to the number of vacuum nozzles; Calculate the ratio between the preset allocation number of the vacuum nozzles and the target number; The predicted allocation time for the vacuum nozzle is calculated based on the proportional relationship and the movement time of the vacuum nozzle. The travel time is the travel time of the vacuum nozzle for one round trip; the calculation of the predicted allocation time corresponding to the vacuum nozzle based on the proportional relationship and the travel time of the vacuum nozzle includes: The number of times the vacuum suction head moves is determined based on the aforementioned proportional relationship; Based on the number of moves and the move time, the predicted allocation time corresponding to the vacuum nozzle is calculated; The step of determining the target time with the highest similarity based on the similarity set, determining the operating parameters corresponding to the vacuum suction head based on the target time, and controlling the vacuum suction head to allocate the electronic components through the operating parameters includes: Based on the similarity set, determine the target time with the highest similarity to the predicted allocation time from the predetermined time set; The target position and movement path of the vacuum suction head are determined based on the target time; The vacuum nozzle is controlled to dispense the electronic components by means of the target location and the movement path.

2. The method for distributing electronic components according to claim 1, characterized in that, Before obtaining the target number of electronic components corresponding to the vacuum nozzle, the following should be included: When the electronic component to be detected reaches the predetermined position, a target image of the electronic component is acquired; The target image is input into the feature extraction model to obtain the target pixels of the target image; The target pixel is compared with the reference pixel in the preset image information. If the target image and the preset image information meet the filtering conditions, the target number of the electronic component is calculated based on the target image.

3. The method for distributing electronic components according to claim 1, characterized in that, Determining the target position and movement path of the vacuum head based on the target time includes: Based on the target time and the moving speed of the vacuum nozzle, the movement path corresponding to the target time is calculated; the historical allocation quantity of each position in the movement path is obtained; the historical allocation quantity is the quantity of the electronic component allocated within a predetermined time period; Based on the historical allocation quantity of each location, the location with the fewest historical allocation quantities is determined as the target location.

4. The method for distributing electronic components according to claim 3, characterized in that, After the vacuum nozzle is controlled to dispense the electronic components according to the target position and the movement path, the following steps are included: The current allocation quantity for the target location is obtained by accumulating the target quantity and the historical allocation quantity. The difference between the current allocation quantities of each pair of positions is calculated to obtain the difference result; The electronic components are assigned to various locations based on the difference results.

5. A device for distributing electronic components, characterized in that, include: The acquisition module is used to acquire the target number of electronic components at a predetermined location; The predetermined position is the detection position of the vacuum nozzle; The calculation module is used to calculate the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components; The first determining module is used to determine a similarity set between the predicted allocation time and the preset time set based on a preset time set; wherein, the preset time set is the time set corresponding to the allocation of the target number of electronic components by the vacuum suction head within a historical time period; The second determining module is used to determine the target time with the highest similarity based on the similarity set, so as to determine the working parameters corresponding to the vacuum head based on the target time, and control the vacuum head to allocate the electronic components through the working parameters; The step of calculating the predicted allocation time corresponding to the vacuum head based on the target number of the electronic components includes: Obtain a preset allocation number of the vacuum nozzles; wherein the preset allocation number is related to the number of vacuum nozzles; Calculate the ratio between the preset allocation number of the vacuum nozzles and the target number; The predicted allocation time for the vacuum nozzle is calculated based on the proportional relationship and the movement time of the vacuum nozzle. The travel time is the travel time of the vacuum nozzle for one round trip; the calculation of the predicted allocation time corresponding to the vacuum nozzle based on the proportional relationship and the travel time of the vacuum nozzle includes: The number of times the vacuum suction head moves is determined based on the aforementioned proportional relationship; Based on the number of moves and the move time, the predicted allocation time corresponding to the vacuum nozzle is calculated; The step of determining the target time with the highest similarity based on the similarity set, determining the operating parameters corresponding to the vacuum suction head based on the target time, and controlling the vacuum suction head to allocate the electronic components through the operating parameters includes: Based on the similarity set, determine the target time with the highest similarity to the predicted allocation time from the predetermined time set; The target position and movement path of the vacuum suction head are determined based on the target time; The vacuum nozzle is controlled to dispense the electronic components by means of the target location and the movement path.

6. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method for distributing electronic components as described in any one of claims 1 to 4.

7. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method for distributing electronic components as described in any one of claims 1 to 4.

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