Gold point detection method, device and electronic equipment for ic carrier board
By acquiring IC substrate images and performing feature extraction and contour center determination, the problem of long time consumption and complex operation in the existing technology of IC substrate gold spot detection is solved, and efficient gold spot detection is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING LUSTER LIGHTTECH
- Filing Date
- 2022-12-28
- Publication Date
- 2026-06-30
Smart Images
Figure CN116128823B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of image processing technology, and in particular relates to a method, apparatus and electronic device for gold dot detection on IC substrates. Background Technology
[0002] IC substrates serve as the carriers connecting and transmitting signals between bare chips (DIEs) and printed circuit boards (PCBs). Gold dot inspection of IC substrates is a crucial step in the manufacturing process. Currently, related technologies require the use of multiple scripting tools for gold dot inspection, which is not only time-consuming but also inconvenient for users. Summary of the Invention
[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a method, apparatus, and electronic device for gold dot detection on IC substrates to simplify the detection operation.
[0004] In a first aspect, this application provides a method for gold dot detection on an IC substrate, the method comprising:
[0005] Acquire the first image of the IC substrate under test;
[0006] Feature extraction is performed on the first image to obtain a second image, which includes the content of the first image and the outline used to indicate the gold dots;
[0007] Determine the center position of the contour;
[0008] A third image is obtained based on the center position of the contour. The third image includes the content of the second image and labels used to indicate gold points.
[0009] According to the gold spot detection method for IC substrates provided in the embodiments of this application, the gold spots of IC substrates can be accurately and effectively determined by contour extraction and center determination. The entire detection process is simple to operate and can greatly reduce the detection time.
[0010] According to one embodiment of this application, obtaining the third image based on the center position of the contour includes:
[0011] Based on the center position of the outline and the preset gold point sorting type information, the gold points are sorted one by one.
[0012] Based on the sorting information of the gold dots, the labels of the gold dots are determined, and a third image is obtained.
[0013] According to one embodiment of this application, the step of sorting the gold points one by one based on the center position of the contour and preset gold point sorting type information includes:
[0014] Based on the center position of the outline and the preset gold dot arrangement information, determine whether the gold dots are missing.
[0015] If a gold point is found to be missing, the corresponding sorting information of the gold point is added to the missing position.
[0016] According to one embodiment of this application, determining whether gold dots are missing based on the center position of the contour and preset gold dot arrangement information includes:
[0017] Based on the center position of the outline and the preset gold dot arrangement information, the expected position of the next gold dot is determined.
[0018] Based on the deviation between the predicted and actual positions of the next gold point, it is determined whether a gold point is missing.
[0019] According to one embodiment of this application, determining the center position of the contour includes:
[0020] Determine the shape of the outline;
[0021] If the outline is determined to be circular, the center position is obtained by using a circle-finding tool to perform circle-finding processing on the outline.
[0022] If the outline is determined to be rectangular, the rectangular frame of the outline is determined by a line-finding tool, and then the center position is obtained based on the rectangular frame.
[0023] According to one embodiment of this application, the step of extracting features from the first image to obtain the second image includes:
[0024] Blob analysis is performed on the first image to obtain a second image, which includes the content of the first image and the blob outline used to indicate the gold points.
[0025] Secondly, this application provides a gold dot detection device for IC substrates, the device comprising:
[0026] The first acquisition module is used to acquire a first image of the IC carrier board under test;
[0027] The first processing module is used to extract features from the first image to obtain a second image, the second image including the content of the first image and the outline used to indicate the gold points;
[0028] The second processing module is used to determine the center position of the contour;
[0029] The third processing module is used to obtain a third image based on the center position of the contour. The third image includes the content of the second image and labels for indicating gold points.
[0030] According to the IC substrate gold spot detection device of this application, the gold spots of the IC substrate can be accurately and effectively determined by contour extraction and center determination. The entire detection process is simple to operate and can greatly reduce the detection time.
[0031] According to one embodiment of this application, the third processing module is further configured to sort the gold points one by one based on the center position of the contour and the preset gold point sorting type information.
[0032] Based on the sorting information of the gold dots, the labels of the gold dots are determined, and a third image is obtained.
[0033] According to one embodiment of this application, the third processing module is further configured to determine whether gold dots are missing based on the center position of the contour and preset gold dot arrangement information.
[0034] If a gold point is found to be missing, the corresponding sorting information of the gold point is added to the missing position.
[0035] According to one embodiment of this application, the third processing module is further configured to determine the expected position of the next gold dot based on the center position of the contour and the preset gold dot arrangement information.
[0036] Based on the deviation between the predicted and actual positions of the next gold point, it is determined whether a gold point is missing.
[0037] According to one embodiment of this application, the second processing module is further configured to determine the shape of the contour;
[0038] If the outline is determined to be circular, the center position is obtained by using a circle-finding tool to perform circle-finding processing on the outline.
[0039] If the outline is determined to be rectangular, the rectangular frame of the outline is determined by a line-finding tool, and then the center position is obtained based on the rectangular frame.
[0040] According to one embodiment of this application, the first processing module is further configured to perform Blob analysis on the first image to obtain a second image, the second image including the content of the first image and the Blob outline for indicating gold points.
[0041] Thirdly, this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the gold dot detection method for IC substrates as described in the first aspect above.
[0042] Fourthly, this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the gold dot detection method for an IC substrate as described in the first aspect above.
[0043] Fifthly, this application provides a chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the gold dot detection method for IC substrates as described in the first aspect.
[0044] In a sixth aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements the gold dot detection method for an IC substrate as described in the first aspect above.
[0045] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0046] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0047] Figure 1 This is a flowchart illustrating the gold dot detection method for IC substrates provided in this application embodiment;
[0048] Figure 2 This is a schematic diagram of the second image in the gold dot detection method for IC substrates provided in the embodiments of this application;
[0049] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;
[0050] Figure 4 This is a partial schematic diagram of the third image in the gold dot detection method for IC substrates provided in the embodiments of this application;
[0051] Figure 5 This is a schematic diagram of the structure of the gold dot detection device for IC substrate provided in the embodiments of this application;
[0052] Figure 6 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation
[0053] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0054] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0055] The following description, in conjunction with the accompanying drawings, details the method for detecting gold dots on an IC substrate, the device for detecting gold dots on an IC substrate, the electronic device, and the readable storage medium provided in this application, through specific embodiments and application scenarios.
[0056] The gold dot detection method of this IC substrate can be applied to the terminal, and can be executed by the hardware or software in the terminal.
[0057] The gold dot detection method for IC substrates provided in this application embodiment can be executed by an electronic device or a functional module or entity in an electronic device that can implement the gold dot detection method for IC substrates. The electronic devices mentioned in this application embodiment include, but are not limited to, mobile phones, tablets, computers, cameras and wearable devices. The gold dot detection method for IC substrates provided in this application embodiment will be described below using an electronic device as the execution subject.
[0058] like Figure 1 As shown, the gold dot detection method for the IC substrate includes steps 110, 120, 130 and 140.
[0059] Step 110: Obtain the first image of the IC carrier board under test;
[0060] The first image can be an image of the IC substrate under test taken by an industrial camera, which includes the substrate, copper foil lines, and gold dots.
[0061] Step 120: Extract features from the first image to obtain a second image. The second image includes the content of the first image and the outline used to indicate the gold dots.
[0062] The first image includes a foreground and a background. When performing feature extraction on the first image, the foreground can be segmented to obtain the outline of the foreground, which is the outline used to indicate the gold point. This outline is then added to the first image to obtain the second image.
[0063] like Figure 2 and Figure 3 A schematic diagram of the second image is shown. The upper part of the second image includes the outline 310 of 21 groups of gold dots, each group of gold dots corresponds to a column of Unit regions in the lower part, and each group of gold dots includes 9 gold dots, corresponding to 9 Unit regions in the lower column.
[0064] Of course, the number of gold dot groups and the number of gold dots in each group can also take other forms, which are related to the structure of the IC substrate itself.
[0065] In practice, obtaining the second image in this step also includes displaying the second image, which can also serve a certain inspection function.
[0066] Of course, the second image can also be set not to be displayed, that is, after the first image is input, the third image is output directly, and the second image can be manually brought up when the user needs to view it.
[0067] Step 130: Determine the center position of the contour;
[0068] After obtaining the outline of the gold point, the center position of the outline can be calculated, and the center position of the outline can be used as the position coordinates of the gold point.
[0069] Step 140: Based on the center position of the contour, obtain a third image. The third image includes the content of the second image and labels used to indicate the gold points.
[0070] In this step, labels indicating the gold dots are placed on the second image to obtain the third image.
[0071] like Figure 4 As shown, the label used to indicate the gold point may include a crosshair to indicate the center of the gold point and a character identifier, which is used to indicate the serial number of the gold point, etc.
[0072] Of course, labels used to indicate gold points can also take other forms, such as origin and serial number.
[0073] In related technologies, each of steps 120-140 requires at least one script tool to complete, and the parameters of each script tool need to be set independently between adjacent steps, making the operation complex.
[0074] The gold dot detection method for IC substrates described in this application integrates multiple tools and loop structures into a single tool. This eliminates many intermediate tool parameter settings and unnecessary steps within the tool itself. Users simply input the first image of the IC substrate under test, set the parameters in the integrated tool, and then run the test to output the results.
[0075] During the testing process, important intermediate images can also be displayed to facilitate inspection or monitoring of the entire testing process.
[0076] According to the gold spot detection method for IC substrates provided in the embodiments of this application, the gold spots of IC substrates can be accurately and effectively determined by contour extraction and center determination. The entire detection process is simple to operate and can greatly reduce the detection time.
[0077] In some embodiments, step 120, extracting features from the first image to obtain the second image, includes:
[0078] Blob analysis is performed on the first image to obtain a second image, which includes the content of the first image and the blob outline used to indicate the gold points.
[0079] In other words, in this embodiment, the gold point contour is extracted using the Blob analysis method. By extracting and labeling connected components from the binary image after separating the foreground and background, the foreground target is obtained, thereby obtaining the Blob contour used to indicate the gold point.
[0080] In actual computation, pixel scanning or run-length encoding (RLE) based methods can be used.
[0081] The contours extracted using Blob analysis are quite accurate.
[0082] Of course, other methods can be used to obtain the contours for indicating gold points, including the mean method or optical flow method.
[0083] In some embodiments, step 130, determining the center position of the contour, includes:
[0084] Determine the shape of the outline;
[0085] Given that the outline is circular, the center position is obtained by using the circle-finding tool to process the outline into a circle.
[0086] Given that the outline is a rectangle, the rectangular frame of the outline is determined using a line-finding tool, and then the center position is obtained based on the rectangular frame.
[0087] In actual execution, the shape of the outline can be set before step 110, with the options of "circle" and "rectangle". This way, when executing step 130, the circle-finding tool or line-finding tool can be directly called, which is convenient and quick.
[0088] Alternatively, the shape of the contour can be not set before step 110, and the tool type can be determined by analyzing the shape of the contour after the contour is acquired.
[0089] In some embodiments, step 140, obtaining a third image based on the center position of the contour, includes:
[0090] Based on the center position of the contour and the preset gold point sorting type information, determine whether the gold points are missing.
[0091] If a gold dot is found to be missing, the missing gold dot is added to obtain a third image. The labels used to indicate the gold dots in the third image include labels for the detected gold dots and labels for the missing gold dots.
[0092] The position of the crosshair in the missing gold dot label, which indicates the center of the gold dot, is predicted based on the row and column arrangement of the gold dots.
[0093] In some embodiments, step 140, obtaining a third image based on the center position of the contour, includes:
[0094] Based on the center position of the contour and the preset gold point sorting type information, sort the gold points one by one.
[0095] Based on the sorting information of the gold dots, the labels of the gold dots are determined, and a third image is obtained.
[0096] By sorting, each gold point can be given a simple and unique definition, so that when a fault is discovered, the fault point can be identified immediately.
[0097] There are several ways to sort, such as "top and bottom first, then left and right" or "left and right first, then top and bottom".
[0098] like Figure 4 As shown, the order is from top to bottom, then from left to right. In this group of gold dots, the first gold dot in the top left corner is marked as Block_0_0, the second gold dot from the top on the left is marked as Block_0_1, the third gold dot from the top on the left is marked as Block_0_2, the top gold dot in the middle column is marked as Block_0_3, the middle gold dot in the middle column is marked as Block_04, the bottom gold dot in the middle column is marked as Block_05, and so on.
[0099] In some examples, the gold points are sorted one by one based on the center position of the contour and the preset gold point sorting type information, including:
[0100] Based on the center position of the outline and the preset gold dot arrangement information, determine whether the gold dots are missing.
[0101] If a gold point is found to be missing, the corresponding sorting information of the gold point is added to the missing position.
[0102] In other words, if the arrangement information of the gold points is set before the gold point detection, such as setting the row and column information of the gold points, then when the next gold point is not arranged according to the row and column information, it can be determined that the gold point is missing. The row and column information can also be used to supplement the sorting information of the corresponding gold points in order to complete the subsequent detection tasks.
[0103] In some examples, the presence or absence of gold dots is determined based on the center position of the contour and pre-defined gold dot arrangement information, including:
[0104] Based on the center position of the contour and the preset gold dot layout information, determine the expected position of the next gold dot;
[0105] Based on the deviation between the predicted and actual locations of the next gold point, it is determined whether a gold point is missing.
[0106] In other words, this method can first calculate the row spacing, column spacing, and group spacing of gold points. When selecting the next gold point, it will be compared with the expected gold point position. If the next gold point is not within the acceptable threshold of the expected position, it means that there is a missing gold point. The expected gold point position will be added to the image to ensure that even if there is a missing gold point, it will be intelligently added to complete the subsequent detection task.
[0107] The following describes a method for gold spot detection on an IC substrate.
[0108] The gold dot detection method for this IC substrate includes:
[0109] Step 201, parameter settings.
[0110] In this step, you can set the shape type of the gold dots as "circle" or "rectangle", the sorting type of the gold dots as "top and bottom then left and right" or "left and right then top and bottom", the polarity of the blob as "black blob with white background" or "white blob with black background", the number of rows of gold dots, the number of columns of gold dots per group, and the number of groups of gold dots per block, etc.
[0111] Step 202: Obtain the first image of the IC carrier board under test;
[0112] Step 203: Perform Blob analysis on the first image to obtain the second image. The second image includes the content of the first image and the Blob outline used to indicate the gold points.
[0113] Step 204: Determine the center position of the contour;
[0114] Given that the outline is circular, the center position is obtained by using the circle-finding tool to process the outline into a circle.
[0115] Given that the outline is a rectangle, the rectangular frame of the outline is determined using a line-finding tool, and then the center position is obtained based on the rectangular frame.
[0116] Step 205: Output the position of the gold dot on the second image;
[0117] The aforementioned center position is designated as the gold dot and marked with a crosshair on the second image.
[0118] Step 206: Mark the serial number of each gold point next to its location to obtain the third image. The third image includes the content of the second image, the crosshair marker, and the serial number marker used to indicate the gold point.
[0119] When assigning serial numbers to gold points in sequence, the system determines whether a gold point is missing based on the row and column arrangement of the gold points and the distance between adjacent gold points. If a gold point is missing, it is filled in.
[0120] The gold dot detection method for IC substrates provided in this application can be executed by an IC substrate gold dot detection device. This application uses an IC substrate gold dot detection device executing the gold dot detection method as an example to illustrate the IC substrate gold dot detection device provided in this application.
[0121] This application also provides a gold dot detection device for IC substrates.
[0122] like Figure 5 As shown, the gold dot detection device for the IC substrate includes: a first acquisition module 510, a first processing module 520, a second processing module 530, and a third processing module 540.
[0123] The first acquisition module 510 is used to acquire a first image of the IC carrier board under test;
[0124] The first processing module 520 is used to extract features from the first image to obtain a second image, the second image including the content of the first image and the outline used to indicate the gold points;
[0125] The second processing module 530 is used to determine the center position of the contour;
[0126] The third processing module 540 is used to obtain a third image based on the center position of the contour. The third image includes the content of the second image and labels for indicating gold points.
[0127] The first image can be an image of the IC substrate under test taken by an industrial camera, which includes the substrate, copper foil lines, and gold dots.
[0128] The first image includes a foreground and a background. When performing feature extraction on the first image, the foreground can be segmented to obtain the outline of the foreground, which is the outline used to indicate the gold point. This outline is then added to the first image to obtain the second image.
[0129] After obtaining the outline of the gold point, the center position of the outline can be calculated, and the center position of the outline can be used as the position coordinates of the gold point.
[0130] The gold dot detection device for IC substrates provided in the embodiments of this application can accurately and effectively determine the gold dots of IC substrates by contour extraction and center determination. The entire detection process is simple to operate and can greatly reduce the detection time.
[0131] In some embodiments, the third processing module 540 is further configured to sort the gold points one by one based on the center position of the contour and the preset gold point sorting type information.
[0132] Based on the sorting information of the gold dots, the labels of the gold dots are determined, and a third image is obtained.
[0133] In some embodiments, the third processing module 540 is further configured to determine whether gold dots are missing based on the center position of the contour and preset gold dot arrangement information.
[0134] If a gold point is found to be missing, the corresponding sorting information of the gold point is added to the missing position.
[0135] In some embodiments, the third processing module 540 is further configured to determine the expected position of the next gold point based on the center position of the contour and the preset gold point arrangement information.
[0136] Based on the deviation between the predicted and actual locations of the next gold point, it is determined whether a gold point is missing.
[0137] In some embodiments, the second processing module 530 is further configured to determine the shape of the contour; if the contour is determined to be circular, the center position is obtained by performing a circle-finding process on the contour using a circle-finding tool; if the contour is determined to be rectangular, the rectangular frame of the contour is determined by a line-finding tool, and the center position is obtained based on the rectangular frame.
[0138] In some embodiments, the first processing module 520 is further configured to perform Blob analysis on the first image to obtain a second image, the second image including the content of the first image and the Blob outline used to indicate gold points.
[0139] The gold dot detection device for the IC substrate in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the specific type of device.
[0140] The gold dot detection device for the IC substrate in this embodiment can be a device with an operating system. This operating system can be Microsoft Windows, Android, iOS, or other possible operating systems; this embodiment does not specifically limit it.
[0141] The gold dot detection device for IC substrates provided in this application embodiment can achieve... Figures 1 to 4 The various processes implemented in the method implementation examples will not be described again here to avoid repetition.
[0142] In some embodiments, such as Figure 6 As shown, this application embodiment also provides an electronic device 600, including a processor 601, a memory 602, and a computer program stored in the memory 602 and executable on the processor 601. When the program is executed by the processor 601, it implements the various processes of the above-described IC substrate gold dot detection method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0143] It should be noted that the electronic devices in the embodiments of this application include the mobile electronic devices and non-mobile electronic devices described above.
[0144] This application also provides a non-transitory computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described IC substrate gold dot detection method embodiment and achieves the same technical effect. To avoid repetition, it will not be described again here.
[0145] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.
[0146] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method for gold dot detection on an IC substrate.
[0147] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.
[0148] This application embodiment also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above-described IC substrate gold dot detection method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be described again here.
[0149] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.
[0150] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
[0151] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.
[0152] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
[0153] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0154] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A method for detecting gold dots on an IC substrate, characterized in that, include: Acquire the first image of the IC substrate under test; Blob analysis is performed on the first image to obtain a second image, which includes the content of the first image and the blob outline used to indicate the gold points; Determine the center position of the Blob outline; Based on the center position of the Blob outline and the preset gold point sorting type information, the gold points are sorted one by one. Based on the sorting information of the gold dots, the labels of the gold dots are determined, and a third image is obtained; The third image includes the content of the second image and labels used to indicate gold points; Based on the center position of the blob outline and the preset gold dot arrangement information, the gold dots are sorted one by one, including: Based on the center position of the Blob outline and the preset gold dot arrangement information, the expected position of the next gold dot is determined. Based on the deviation between the predicted and actual positions of the next gold point, determine whether a gold point is missing; If a gold point is found to be missing, the corresponding sorting information of the gold point is added to the missing position.
2. The method for detecting gold dots on an IC substrate according to claim 1, characterized in that, Determining the center position of the blob outline includes: Determine the shape of the Blob outline; If the Blob outline is determined to be circular, the center position is obtained by using a circle-finding tool to perform a circle-finding process on the Blob outline. If the Blob outline is determined to be rectangular, the rectangular frame of the Blob outline is determined by a line-finding tool, and then the center position is obtained based on the rectangular frame.
3. A gold dot detection device for an IC substrate used to perform the method as described in any one of claims 1-2, characterized in that, include: The first acquisition module is used to acquire a first image of the IC carrier board under test; The first processing module is used to extract features from the first image to obtain a second image, the second image including the content of the first image and the outline used to indicate the gold points; The second processing module is used to determine the center position of the contour; The third processing module is used to obtain a third image based on the center position of the contour. The third image includes the content of the second image and labels for indicating gold points.
4. An electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the gold dot detection method for the IC substrate as described in any one of claims 1-2.
5. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the computer program implements the gold dot detection method for an IC substrate as described in any one of claims 1-2.
6. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the gold dot detection method for the IC substrate as described in any one of claims 1-2.