Magnet system, sputter device and method

By using dehumidification equipment and a shell design filled with water-poor fluid in the magnet system, the corrosion problem caused by moisture in the magnet system is solved, improving the reliability and service life of the magnet system and ensuring process stability and uniformity.

CN116130328BActive Publication Date: 2025-12-16VON ARDENNE ASSET GMBH & CO KG
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Patent Information

Application Number
CN202211330782.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-11-12
Filing Date
2022-10-27
Publication Date
2025-12-16
Estimated Expiration
2042-10-27

AI Technical Summary

Technical Problem

Magnet systems are susceptible to moisture, which can lead to corrosion and damage, affecting process stability, system reliability, and service life.

Method used

The magnet system's housing is filled with dehumidifying equipment and water-poor fluid, combined with a cooling trap and vacuum sealing design to protect the magnet system from moisture.

Benefits of technology

This improves the reliability and lifespan of the magnet system, reduces susceptibility to interference, and ensures process stability and uniformity.

✦ Generated by Eureka AI based on patent content.

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Abstract

A magnet system, a sputter device and a method are concerned. According to various embodiments, a magnet system (100) for a sputter device (300) can comprise: a housing (406g) having a housing interior space (406h); a magnet carrier (102) arranged in the housing interior space (406h) and supported by means of the housing (406g), preferably in a position-fixed manner with respect to the housing; a dehumidification device adjoining the housing interior space (406h) or arranged in the housing interior space (406h) for drying the housing interior space (406h).
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Citation Information

Patent Citations

  • Sputtering apparatus

    CN106795621A

  • Rotary cathode unit for magnetron sputtering apparatuses

    CN107250427A

  • Magnet system for sputtering equipment and sputtering equipment

    CN218939591U

  • Deposition chamber desiccation systems and methods of use thereof

    US20060272174A1

  • Magnetron sputtering apparatus with an integral cooling and pressure relieving cathode

    US6494999B1