Display panel, display module and its manufacturing method

Abstract

This application discloses a display panel, a display module, and a method for manufacturing the same. The display panel includes a flexible screen, a chip, and a support portion. The flexible screen includes a display portion and a non-display portion. The chip is disposed on a first surface of the non-display portion. The support portion is disposed on the first surface of the non-display portion and surrounds the periphery of the chip, with the height of the support portion being greater than the height of the chip. The support portion is used to prevent the cover plate and the chip from contacting each other when the non-display portion is bonded to the cover plate. By providing a support portion with a height greater than the chip around the chip, the chip is protected, preventing the edge of the cover plate from directly colliding with the chip before chip bonding, thus avoiding chip damage and display panel failure, and effectively improving the display performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display module, and a method for manufacturing the same. Background Technology

[0002] A display module typically includes a display panel and a cover plate. The display panel generally includes a screen body and a chip mounted on the screen body. For curved display modules, such as quad-curved mobile phones, the cover plate is generally a quad-curved cover plate, with the edges of the cover plate curved towards the direction of the display panel in an arc-shaped design.

[0003] In the prior art, before the chip is bonded, the screen body is not bent and is in a flat state. The edge of the cover plate is prone to contact and collision with the chip set on the screen body, which can damage the chip and cause the display panel to fail. Summary of the Invention

[0004] This application provides a display panel, a display module, and a method for manufacturing the same, to solve the problem in the prior art where the edge of the cover plate collides with the chip before the chip is bonded, causing chip damage and display panel failure.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display panel, comprising:

[0006] Flexible screen, including display and non-display components;

[0007] A chip is disposed on the first surface of the non-display portion;

[0008] A support portion is disposed on the first surface of the non-display portion and surrounds the periphery of the chip; the height of the support portion is greater than the height of the chip; the support portion is used to prevent the cover plate and the chip from contacting each other when the non-display portion is attached to the cover plate.

[0009] The support portion has multiple openings for heat dissipation.

[0010] The support portion includes a plurality of adhesive strips arranged around the chip at intervals, the height of which is greater than the height of the chip.

[0011] The adhesive strip includes a plurality of first adhesive strips and a plurality of second adhesive strips; the plurality of first adhesive strips are arranged around the periphery of the chip to form an inner ring, and the plurality of second adhesive strips are arranged around the periphery of the inner ring to form an outer ring;

[0012] Optionally, the outer ring and the inner ring are concentrically arranged and have the same shape.

[0013] In this configuration, multiple first adhesive strips and multiple second adhesive strips are alternately arranged along the periphery of the chip; optionally, the ends of adjacent first adhesive strips and second adhesive strips are flush.

[0014] Wherein, there is a first notch between two adjacent first adhesive strips, and a second notch between two adjacent second adhesive strips; each first adhesive strip corresponds to one second notch, and each second adhesive strip corresponds to one first notch; the chip includes a side surface perpendicular to the first surface;

[0015] Optionally, the projection of the first adhesive strip on the side of the chip covers the projection of the corresponding second notch on the side of the chip; the projection of the second adhesive strip on the side of the chip covers the projection of the corresponding first notch on the side of the chip.

[0016] Optionally, the projection of the first adhesive strip on the side of the chip overlaps with the projection of the corresponding second notch on the side of the chip; the projection of the second adhesive strip on the side of the chip overlaps with the projection of the corresponding first notch on the side of the chip.

[0017] The first adhesive strip and the second adhesive strip have different shapes.

[0018] Wherein, the first adhesive strip is bent toward the chip side, and the second adhesive strip is bent toward the side away from the chip;

[0019] Optionally, the first adhesive strip is arc-shaped with its opening facing the chip; the second adhesive strip is arc-shaped with its opening facing away from the chip.

[0020] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a display module, comprising:

[0021] A cover plate having a mating surface; the edge of the cover plate is curved toward the mating surface.

[0022] And a display panel as described above, wherein the display panel is disposed on the bonding surface side of the cover plate; the non-display portion is bent toward the display portion away from the cover plate; the support portion and the chip are disposed on the non-display portion away from the display portion.

[0023] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a method for manufacturing a display module, comprising:

[0024] A cover plate is provided; the cover plate has a mating surface, and the edge of the cover plate is curved toward the mating surface;

[0025] Any of the display panels described above is disposed on one side of the mating surface of the cover plate; wherein the support portion and the chip are disposed between the non-display portion and the cover plate, and the support portion abuts against the edge of the cover plate, thereby making the chip and the edge of the cover plate spaced apart;

[0026] The non-display portion is bent toward the display portion on the side away from the cover plate; wherein the support portion and the chip are disposed on the side of the non-display portion away from the display portion.

[0027] The beneficial effects of this application are as follows: Unlike existing technologies, this application discloses a display panel, a display module, and a method for manufacturing the same. The display panel includes a flexible screen, a chip, and a support portion. The flexible screen includes a display portion and a non-display portion. The chip is disposed on a first surface of the non-display portion. The support portion is disposed on the first surface of the non-display portion and surrounds the periphery of the chip, with the height of the support portion being greater than the height of the chip. The support portion is used to prevent contact between the cover plate and the chip when the non-display portion is bonded to the cover plate. By surrounding the chip with a support portion that is higher than the chip, the chip is protected, preventing the edge of the cover plate from directly colliding with the chip and causing chip damage or display panel failure when the display panel is in a flat state before chip bonding. This effectively improves the display performance of the display panel. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0029] Figure 1 This is a cross-sectional schematic diagram of the display panel provided in the first embodiment of this application;

[0030] Figure 2 yes Figure 1 A top view of the first embodiment of the provided display panel;

[0031] Figure 3 yes Figure 1 A top view of the second embodiment of the provided display panel;

[0032] Figure 4 yes Figure 1 A top view of the third embodiment of the provided display panel;

[0033] Figure 5 This is a top view of the display panel provided in the second embodiment of this application;

[0034] Figure 6 This is a cross-sectional schematic diagram of the display module provided in the third embodiment of this application;

[0035] Figure 7 This is a schematic flowchart of the method for manufacturing a display module provided in the third embodiment of this application;

[0036] Figure 8 yes Figure 7 A cross-sectional schematic diagram of the display module after step S2 in the provided method for manufacturing the display module. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] See Figures 1 to 4 , Figure 1 This is a cross-sectional schematic diagram of the display panel provided in the first embodiment of this application. Figure 2 yes Figure 1 A top view of the first embodiment of the provided display panel. Figure 3yes Figure 1 A top view of the second embodiment of the provided display panel. Figure 4 yes Figure 1 A top view of the third embodiment of the provided display panel.

[0041] See Figure 1 and Figure 2 This application provides a display panel 100, which includes a flexible screen body 1, a chip 2, and a support portion 3. The flexible screen body 1 includes a display portion 11 and a non-display portion 12. The chip 2 is disposed on a first surface 120 of the non-display portion 12. The support portion 3 is disposed on the first surface 120 of the non-display portion 12 of the flexible screen body 1 and surrounds the periphery of the chip 2. The height of the support portion 3 is greater than the height of the chip 2. The support portion 3 is used to prevent the cover plate 200 and the chip 2 from contacting when the non-display portion 12 is attached to the cover plate 200.

[0042] It is understood that this application provides a chip 2 and a support portion 3 surrounding the chip 2 on the first surface 120 of the non-display portion 12 of the flexible screen 1. The support portion 3, located on the outer periphery of the chip 2, protects the chip 2. Since the height of the support portion 3 is greater than the height of the chip 2, when the flexible screen 1 is in a flat state before the chip 2 is bonded, the support portion 3 supports the edge of the cover plate 200 in the display module 300, preventing the edge of the cover plate 200 from directly contacting and colliding with the chip 2, thus preventing damage to the chip 2. This effectively solves the problem in the prior art where the chip 2 collides with the edge of the cover plate 200 before the chip 2 of the display module 300 is bonded, causing damage to the chip 2 and failure of the display panel 100, thereby improving the performance of the display panel 100.

[0043] Specifically, the flexible screen 1 of the display panel 100 can be an OLED screen. The support portion 3 of the display panel 100 has multiple openings 31, which can be used for heat dissipation. The openings 31 can be small holes provided on the side wall of the support portion 3, such as circular holes provided on the side wall of the support portion 3; or they can be notches formed by dividing the support portion 3.

[0044] The shape of the support portion 3 can be set to any shape. The shape of the support portion 3 can be the same as the outer edge shape of the chip 2. For example, if the chip 2 is rectangular, the shape of the support portion 3 is a rectangular ring surrounding the periphery of the chip 2. The support portion 3 can be a continuous and complete ring structure, or it can be a ring support portion 3 formed by multiple structures surrounding each other. The material of the support portion 3 can be any material such as metal or silicone, and can be designed according to needs.

[0045] In this embodiment, the support portion 3 includes multiple adhesive strips 32, which surround the periphery of the chip 2 and are spaced apart from each other. The height of the adhesive strips 32 is greater than the height of the chip 2. It can be understood that by setting the height of the adhesive strips 32 to be greater than the height of the chip 2, the adhesive strips 32 can protect the chip 2 and prevent direct contact between the cover plate 200 and the chip 2, thus preventing damage to the chip 2. The adhesive strips 32 can be formed by a dispensing process. Compared to the support portion 3 being made of materials such as metal, in this embodiment, the support portion 3 uses adhesive strips 32, which have a certain degree of elasticity, providing stronger cushioning for the cover plate 200. Furthermore, the adhesive strips 32 will not collide with the edge of the cover plate 200, thus preventing damage to the cover plate 200.

[0046] See Figures 2 to 4 Specifically, the adhesive strip 32 includes multiple first adhesive strips 321 and multiple second adhesive strips 322. The multiple first adhesive strips 321 surround the periphery of the chip 2 to form an inner ring C1, and the multiple second adhesive strips 322 surround the periphery of the inner ring C1 formed by the multiple first adhesive strips 321 to form an outer ring C2. That is, the support part 3 includes an inner ring C1 and an outer ring C2 that are spaced apart from each other. The inner ring C1 formed by the multiple first adhesive strips 321 and the outer ring C2 formed by the multiple second adhesive strips 322 can have the same or different shapes, and the inner ring C1 and the outer ring C2 can be concentric or non-concentric. For example, multiple first adhesive strips 321 can surround the periphery of the chip 2 to form a first rectangular ring, and multiple second adhesive strips 322 can surround the periphery of the first rectangular ring to form a second rectangular ring. The second rectangular ring and the first rectangular ring are concentrically arranged, and the centers of the first rectangular ring and the second rectangular ring can coincide with the center of the chip 2; or the support part 3 can also be formed by multiple first adhesive strips 321 surrounding the periphery of the chip 2 to form a first rectangular ring, and multiple second adhesive strips 322 surrounding the periphery of the first rectangular ring to form a circular ring.

[0047] In other embodiments, the support portion 3 may include only a plurality of spaced first adhesive strips 321 or only a plurality of spaced second adhesive strips 322, with the plurality of first adhesive strips 321 or the plurality of second adhesive strips 322 surrounding the periphery of the chip 2 to form a ring, thereby protecting the chip 2 with a ring of first adhesive strips 321 or a ring of second adhesive strips 322; or the support portion 3 may be a continuous and complete annular adhesive strip, with the annular adhesive strip surrounding the periphery of the chip 2, and a plurality of small holes provided on the side wall of the annular adhesive strip for heat dissipation.

[0048] It is understandable that, compared to simply having a strip of adhesive 32 around the chip 2, the support part 3 in this embodiment includes an inner ring C1 and an outer ring C2. The two strips of adhesive 32 provide greater support strength and stronger resistance to deformation, and also provide stronger support and cushioning for the cover plate 200. At the same time, the inner and outer strips of adhesive 32 also allow heat to flow better through the notch, resulting in better heat dissipation.

[0049] The shapes of the first adhesive strip 321 and the second adhesive strip 322 can be the same or different. The cross-sectional shapes of the first adhesive strip 321 and the second adhesive strip 322 can be any shape such as rectangular, square, triangular, or arc. Multiple first adhesive strips 321 and multiple second adhesive strips 322 can be arranged correspondingly along the periphery of the chip 2, that is, the second adhesive strip 322 is arranged on the outer ring C2 of the support part 3 at the position corresponding to the first adhesive strip 321; or multiple first adhesive strips 321 and multiple second adhesive strips 322 can be arranged alternately along the periphery of the chip 2, wherein the ends of adjacent first adhesive strips 321 and second adhesive strips 322 can be arranged flush or staggered. It is understandable that when multiple first adhesive strips 321 and multiple second adhesive strips 322 are alternately arranged and the ends of adjacent first adhesive strips 321 and second adhesive strips 322 are flush, the support part 3 has adhesive strips 32 at each position along the periphery of the chip 2 to support and buffer the cover plate 200. The buffering effect of the support part 3 on the cover plate 200 along the periphery of the chip 2 is continuous, and the support part 3 provides better protection for the chip 2.

[0050] In this embodiment, both the first adhesive strip 321 and the second adhesive strip 322 are linear structures. See [link / reference] Figures 2 to 4 The first adhesive strip 321 and the second adhesive strip 322 have the same shape, both being cuboids, and the chip 2 is also cuboid in shape. Multiple first adhesive strips 321 are spaced apart from each other, with a first notch 311 between adjacent first adhesive strips 321 and a second notch 312 between adjacent second adhesive strips 322. Multiple first adhesive strips 321 and multiple second adhesive strips 322 are alternately arranged along the periphery of the chip 2, with each first adhesive strip 321 corresponding to one second notch 312 and each second adhesive strip 322 corresponding to one first notch 311.

[0051] Chip 2 includes a side surface 21 perpendicular to the first surface 120. For example... Figure 2 As shown, in one embodiment, the first adhesive strip 321 and the second adhesive strip 322 are alternately arranged. The projection of the first notch 311 on the side 21 of the chip 2 covers the projection of the second adhesive strip 322 on the side 21 of the chip 2, that is, the length of the first notch 311 is greater than the length of the second adhesive strip 322; the projection of the second notch 312 on the side 21 of the chip 2 covers the projection of the first adhesive strip 321 on the side 21 of the chip 2, that is, the length of the second notch 312 is greater than the length of the first adhesive strip 321. In other words, the projections of the first adhesive strip 321 and the second adhesive strip 322 on the side 21 of the chip 2 are spaced apart, and the ends of two adjacent first adhesive strips 321 and second adhesive strips 322 are staggered, and the projections of the ends are spaced apart. In this embodiment, the support portion 3 can provide a buffer support for the cover plate 200, but the buffering effect on the cover plate 200 along the periphery of the chip 2 is not continuous.

[0052] like Figure 3 As shown, in another embodiment, the projection of the first adhesive strip 321 onto the side 21 of the chip 2 overlaps the projection of the corresponding second notch 312 onto the side 21 of the chip 2, meaning the length of the first adhesive strip 321 is greater than the length of the second notch 312; the projection of the second adhesive strip 322 onto the side 21 of the chip 2 overlaps the projection of the corresponding first notch 311 onto the side 21 of the chip 2, meaning the length of the second adhesive strip 322 is greater than the length of the first notch 311. In other words, in this embodiment, the first adhesive strip 321 and the second adhesive strip 322 are alternately arranged, but the ends of adjacent first adhesive strips 321 and second adhesive strips 322 are not flush, but staggered, and the projections of adjacent first adhesive strips 321 and second adhesive strips 322 onto the side 21 of the chip 2 partially overlap at their ends. It can be understood that in this embodiment, the buffering effect of the support portion 3 on the cover plate 200 along the periphery of the chip 2 is continuous, and the strength is greater at the overlapping position of the projections of the first adhesive strip 321 and the second adhesive strip 322 of the support portion 3, resulting in a stronger supporting and buffering effect on the cover plate 200.

[0053] like Figure 4 As shown, in another embodiment, the projection of the first adhesive strip 321 onto the side surface 21 of the chip 2 overlaps with the projection of the corresponding second notch 312 onto the side surface 21 of the chip 2, meaning the length of the first adhesive strip 321 is equal to the length of the second notch 312; the projection of the second adhesive strip 322 onto the side surface 21 of the chip 2 overlaps with the projection of the corresponding first notch 311 onto the side surface 21 of the chip 2, meaning the length of the second adhesive strip 322 is equal to the length of the first notch 311. In other words, in this embodiment, the first adhesive strip 321 and the second adhesive strip 322 are alternately arranged, and the ends of adjacent first adhesive strips 321 and second adhesive strips 322 are flush. It can be understood that through the above arrangement, the supporting and buffering effect of the support portion 3 on the cover plate 200 along the periphery of the chip 2 is continuous, and the supporting strength of the support portion 3 on the cover plate 200 at each position along the periphery of the chip 2 is uniform. Compared to the second embodiment where the ends of two adjacent first adhesive strips 321 and second adhesive strips 322 overlap along the periphery of chip 2, in this embodiment, the ends of two adjacent first adhesive strips 321 and second adhesive strips 322 are flush, which can also make the heat dissipation path shorter and facilitate heat dissipation.

[0054] See Figure 5 , Figure 5 This is a top view of the display panel provided in the second embodiment of this application.

[0055] See Figure 5In this embodiment, the cross-sectional shape of the first adhesive strip 321 and the second adhesive strip 322 of the support portion 3 of the display panel 100 is different from that of the display panel 100 in the first embodiment. The rest of the structure is the same as that of the display panel 100 in the first embodiment, and will not be described again.

[0056] In this embodiment, the first adhesive strip 321 and the second adhesive strip 322 of the support portion 3 have different cross-sectional shapes. Specifically, the first adhesive strip 321 is bent towards the chip 2, and the second adhesive strip 322 is bent away from the chip 2. The cross-sectional shapes of the first adhesive strip 321 and the second adhesive strip 322 can be any shape such as V-shaped, arc-shaped, or zigzag-shaped. For example, the first adhesive strip 321 can be configured with a V-shaped cross-section with the opening facing the chip 2, and the second adhesive strip 322 can be configured with a V-shaped cross-section with the opening away from the chip 2; or the first adhesive strip 321 can be configured with an arc-shaped cross-section with the opening facing the chip 2, and the second adhesive strip 322 can be configured with a V-shaped cross-section with the opening away from the chip 2.

[0057] It is understood that in this embodiment, the cross-sectional shapes of the first adhesive strip 321 and the second adhesive strip 322 are different, and the first adhesive strip 321 is bent toward the chip 2, while the second adhesive strip 322 is bent toward the side away from the chip 2. Compared with setting the cross-sectional shapes of the first adhesive strip 321 and the second adhesive strip 322 to be straight, the strength is greater, the resistance to deformation in the horizontal direction is stronger, and the support and buffering effect on the cover plate 200 is also stronger.

[0058] See Figure 5 The first adhesive strip 321 has an arc-shaped cross-section with its arc-shaped opening 31 facing the chip 2, while the second adhesive strip 322 has an arc-shaped cross-section with its arc-shaped opening 31 facing away from the chip 2. The first and second adhesive strips 321 and 322 are alternately arranged, with the ends of adjacent strips flush. This flush arrangement ensures continuous cushioning of the cover plate 200 by the support portion 3 along the periphery of the chip 2, and the arc-shaped structure provides stronger resistance to deformation and greater strength in the horizontal direction. More importantly, the cross-sections of the first and second adhesive strips 321 and 322 are arc-shaped structures facing opposite directions, and the convex surfaces of their arcs are opposite, resulting in a smoother and shorter heat dissipation path, which is more conducive to heat dissipation.

[0059] In other embodiments, the cross-sectional shape of the first adhesive strip 321 and the second adhesive strip 322 can also be V-shaped or other non-linear structures. The first adhesive strip 321 and the second adhesive strip 322 can be arranged correspondingly or alternately. When the first adhesive strip 321 and the second adhesive strip 322 are arranged alternately, the buffering effect on the cover plate 200 is better. The arrangement of the first adhesive strip 321 and the second adhesive strip 322 with the first notch 311 and the second notch 312 can be selected from any one of the three embodiments of the display panel 100 in the first embodiment, which will not be elaborated further and can be designed as needed.

[0060] See Figure 6 , Figure 6 This is a cross-sectional schematic diagram of the display module provided in the third embodiment of this application.

[0061] See Figure 6 This application also provides a display module 300, which includes a cover plate 200 and a display panel 100. The display panel 100 may include any of the display panels 100 provided in the embodiments of this application. Specifically, the display panel 100 is disposed on one side of the cover plate 200, the cover plate 200 has a mating surface 201, and the edge of the cover plate 200 is curved toward the mating surface 201. That is, the display panel 100 is disposed on one side of the mating surface 201 of the cover plate 200, and the edge of the cover plate 200 is curved toward the side closer to the display panel 100. For example, the cross-sectional shape of the cover plate 200 is approximately rectangular, and the edge of the rectangle is curved into an arc surface toward the side closer to the display panel 100.

[0062] like Figure 6 As shown, in this embodiment, the flexible screen 1 of the display panel 100 includes a display portion 11 and a non-display portion 12. The non-display portion 12 is bent toward the display portion 11 on the side away from the cover plate 200. The support portion 3 and the chip 2 are disposed on the side of the non-display portion 12 away from the display portion 11. Specifically, the non-display portion 12 includes a binding portion 122 and a bending portion 121. The binding portion 122 is disposed opposite to the display portion 11, and the bending portion 121 connects the display portion 11 and the binding portion 122. The binding portion 122 is used to bind the chip 2, and the support portion 3 and the chip 2 are disposed on the side of the binding portion 122 away from the display portion 11. The shape of the flexible screen 1 can be arbitrary. For example, the cross-sectional shape of the display portion 11 and the binding portion 122 of the flexible screen 1 is approximately rectangular, and the longitudinal cross-sectional shape of the bending portion 121 is arc-shaped.

[0063] Compared to the display panel 100 provided in the first and second embodiments, in this embodiment, the non-display portion 12 of the flexible screen 1 of the display panel 100 is bent toward the display portion 11 on the side away from the cover plate 200, forming a bent portion 121 and a bonding portion 122. This is to facilitate the chip 2 bonding process, binding the chip 2 to the bonding portion 122 on the side away from the display portion 11, thus preventing the chip 2 bonding process from affecting the display portion 11 of the display panel 100 and causing the display panel 100 to malfunction. Figure 5 As shown, after the non-display part 12 is bent, the support part 3 and the chip 2 are located on the side of the binding part 122 away from the display part 11 as the flexible screen body 1 is bent.

[0064] See Figure 7 and Figure 8 , Figure 7 This is a schematic flowchart of the method for manufacturing a display module according to the third embodiment of this application. Figure 8 yes Figure 7 A cross-sectional schematic diagram of the display module after step S2 in the provided method for manufacturing the display module.

[0065] See Figure 7 This application also provides a method for preparing a display module 300, used to prepare a display module 300 as shown in the figure. Figure 6 The display module 300 shown is manufactured using the following steps:

[0066] S1: Provides a cover plate.

[0067] Specifically, a cover plate 200 is provided, which has a mating surface 201 and the edge of the cover plate 200 is curved toward one side of the mating surface 201. For example, the cover plate 200 is a four-curved cover plate 200, and the edge of the cover plate 200 is curved into an arc shape toward the mating surface 201.

[0068] S2: The display panel is positioned on one side of the mating surface of the cover plate; the support and the chip are positioned between the non-display part and the cover plate, and the support abuts against the edge of the cover plate.

[0069] Specifically, a display panel 100 is provided, which may include any of the display panels 100 provided in the first and second embodiments. The display panel 100 is disposed on one side of the bonding surface 201 of the cover plate 200, and the support portion 3 and the chip 2 of the display panel 100 are disposed between the non-display portion 12 and the cover plate 200. That is, at this time, the chip 2 has not yet undergone the bonding process, the flexible screen body 1 is still in a flat state, and the non-display portion 12 and the display portion 11 are still roughly on the same plane. The support portion 3 abuts against the edge of the cover plate 200. Since the height of the support portion 3 is greater than the height of the chip 2, the support portion 3 can support the edge of the cover plate 200. The support portion 3 has a certain supporting and buffering effect on the cover plate 200, so that the chip 2 and the edge of the cover plate 200 are spaced apart, avoiding direct contact and collision between the chip 2 and the edge of the cover plate 200, which could lead to damage to the chip 2 and consequently failure of the display panel 100, thus effectively improving the display performance of the display panel 100. Specifically, the support portion 3 can be an adhesive strip 32 formed around the chip 2 by a dispensing process. Step S2 can be used to prepare a strip such as... Figure 8 The display module 300 shown is shown.

[0070] S3: Bend the non-display section toward the side of the display section away from the cover plate; the support section and the chip are located on the side of the non-display section away from the display section.

[0071] To facilitate the bonding process of chip 2, the flexible screen 1, which was originally in a flat state, is bent. Specifically, the non-display portion 12 of the flexible screen 1 is bent toward the display portion 11 on the side away from the cover plate 200, so that the non-display portion 12 forms a bonding portion 122 opposite to the display portion 11, and a bent portion 121 connecting the display portion 11 and the bonding portion 122. The bonding portion 122 is used for bonding chip 2, and the bent portion 121 can be arc-shaped. After bending the non-display portion 12 of the flexible screen 1, the support portion 3 and chip 2, originally located between the cover plate 200 and the non-display portion 12, are now located on the side of the bonding portion 122 away from the display portion 11. It can be understood that bonding chip 2 to the side of the bonding portion 122 away from the display portion 11 avoids the bonding process of chip 2 affecting the display portion 11 of the display panel 100, thus preventing the display panel 100 from malfunctioning.

[0072] The method for preparing the display module 300 provided in this application can ultimately produce a display module 300 as shown in the image. Figure 6 The display module 300 shown is shown.

[0073] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, include: Flexible screen, including display and non-display components; A chip is disposed on the first surface of the non-display portion; A support portion is disposed on the first surface of the non-display portion and surrounds the periphery of the chip; the height of the support portion is greater than the height of the chip; the support portion is used to abut against the edge of the four-curved cover plate when the non-display portion is attached to the four-curved cover plate to prevent the four-curved cover plate and the chip from contacting each other. The support portion includes a plurality of adhesive strips that surround the chip and are spaced apart, the height of the adhesive strips being greater than the height of the chip; The adhesive strip includes a plurality of first adhesive strips and a plurality of second adhesive strips; the plurality of first adhesive strips are arranged around the periphery of the chip to form an inner ring, and the plurality of second adhesive strips are arranged around the periphery of the inner ring to form an outer ring; Along the periphery of the chip, a plurality of first adhesive strips and a plurality of second adhesive strips are alternately arranged; there is a first notch between two adjacent first adhesive strips and a second notch between two adjacent second adhesive strips; each first adhesive strip corresponds to one second notch and each second adhesive strip corresponds to one first notch.

2. The display panel according to claim 1, characterized in that, The support has multiple openings for heat dissipation.

3. The display panel according to claim 1, characterized in that, The outer ring and the inner ring are concentrically arranged and have the same shape.

4. The display panel according to claim 1, characterized in that, The ends of the adjacent first and second adhesive strips are flush.

5. The display panel according to claim 1, characterized in that, The chip includes a side surface perpendicular to the first surface; The projection of the first adhesive strip on the side of the chip covers the projection of the corresponding second notch on the side of the chip; the projection of the second adhesive strip on the side of the chip covers the projection of the corresponding first notch on the side of the chip.

6. The display panel according to claim 1, characterized in that, The chip includes a side surface perpendicular to the first surface; the projection of the first adhesive strip on the side surface of the chip overlaps with the projection of the corresponding second notch on the side surface of the chip; the projection of the second adhesive strip on the side surface of the chip overlaps with the projection of the corresponding first notch on the side surface of the chip.

7. The display panel according to claim 1, characterized in that, The first adhesive strip and the second adhesive strip have different shapes.

8. The display panel according to claim 7, characterized in that, The first adhesive strip is bent toward the chip, and the second adhesive strip is bent toward the side away from the chip.

9. The display panel according to claim 8, characterized in that, The first adhesive strip is arc-shaped with its opening facing the chip; the second adhesive strip is arc-shaped with its opening facing away from the chip.

10. The display panel according to any one of claims 1-9, characterized in that, The adhesive strip is prepared by a dispensing process.

11. A display module, characterized in that, include: A cover plate having a mating surface; the edge of the cover plate is curved toward the mating surface. And the display panel as described in any one of claims 1-10, wherein the display panel is disposed on one side of the mating surface of the cover plate; the non-display portion is bent toward the display portion away from the cover plate; the support portion and the chip are disposed on the side of the non-display portion away from the display portion.

12. A method for manufacturing a display module, characterized in that, include: Provide cover plate; The cover plate has a mating surface, and the edge of the cover plate is bent toward the mating surface; The display panel as described in any one of claims 1-10 is disposed on one side of the mating surface of the cover plate; wherein the support portion and the chip are disposed between the non-display portion and the cover plate, and the support portion abuts against the edge of the cover plate, thereby such that the chip and the edge of the cover plate are spaced apart; The non-display portion is bent toward the display portion on the side away from the cover plate; wherein the support portion and the chip are disposed on the side of the non-display portion away from the display portion.

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