电路板、显示面板、显示装置和制作方法
By designing multiple metal trace layers and connection layers, the problem of copper leakage due to shielding layer damage on the circuit board is solved, improving the circuit board's resistance to ESD and EMI, and ensuring the structural integrity of the circuit board and the stability of signal transmission.
CN116133234BActive Publication Date: 2026-07-17BOE TECHNOLOGY GROUP CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-02-07
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing circuit boards, the shielding layer is prone to damage and copper leakage, which affects the resistance to ESD and EMI.
Method used
The circuit board adopts a multi-layer metal trace structure, combined with the connection layer design of the horizontal and vertical extensions, to avoid forming excessively large stepped surfaces and ensure the integrity of the circuit board structure.
Benefits of technology
This improves the circuit board's resistance to ESD and EMI, prevents damage to the shielding layer, and ensures the structural stability of the circuit board and the reliability of signal transmission.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116133234B_ABST
Abstract
本发明涉及一种电路板、显示面板、显示装置和制作方法。电路板沿厚度方向包括相对设置的第一端部和第二端部；电路板还包括：金属走线层和连接层；金属走线层的数量至少为三层，分别为第一走线层、第二走线层和第三走线层。连接层包括电性连接的横向延伸部和竖向延伸部，横向延伸部的至少部分结构位于第一走线层中，竖向延伸部的一端连接横向延伸部，另一端延伸至靠近第二走线层的第三走线层。在上述结构中，避免第一走线层和连接层形成坡度较大的阶梯面，从而避免坡度较大的阶梯面刺破位于第一走线层和连接层的远离第二走线层的一侧的膜层，进而保证电路板的结构的完整性。
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