Printed circuit boards and their manufacturing methods, electronic devices

Abstract

This application provides a printed circuit board and its manufacturing method, as well as an electronic device. The printed circuit board includes a first circuit board, an adhesive layer, and a second circuit board stacked along a first direction. The first circuit board has a conductive element, and the second circuit board has a conductive pattern on its surface facing the conductive element. The adhesive layer has a conductive structure with a melting point lower than that of the adhesive layer. In the first direction, a first end of the conductive structure is electrically connected to the conductive element, and a second end of the conductive structure is electrically connected to the conductive pattern, thereby electrically connecting the first circuit board and the second circuit board through the conductive structure. This application can solve the problem that poor soldering and other phenomena easily occur between multiple individual circuit boards of a printed circuit board, thus affecting the stability of the electrical connection between multiple individual circuit boards.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing processes, and more particularly to printed circuit boards and their manufacturing methods, and electronic devices. Background Technology

[0002] Printed circuit boards (PCBs) are important electronic components that can replace complex wiring, reduce the overall size of electronic devices, and improve the quality and reliability of electronic equipment. As the functional requirements of electronic devices continue to increase, PCBs are also developing towards a more modular design.

[0003] Multi-modular printed circuit boards (PCBs) consist of multiple electrically connected individual circuit boards, which connect different components, thus enriching the functionality of the PCB. These individual circuit boards are fixed together by soldering to achieve electrical connections between them. However, issues such as cold solder joints can easily occur between the individual circuit boards, affecting the stability of the electrical connections between them. Summary of the Invention

[0004] This application provides a printed circuit board and its preparation method, as well as an electronic device, to solve the problem that phenomena such as poor soldering are prone to occur between multiple individual circuit boards of a printed circuit board, thereby affecting the stability of the electrical connection between multiple individual circuit boards.

[0005] The printed circuit board provided in this application includes a first circuit board, an adhesive layer, and a second circuit board stacked along a first direction;

[0006] The first circuit board is provided with a conductive element, and the second circuit board is provided with a conductive pattern, the conductive pattern being disposed on the surface of the second circuit board facing the conductive element;

[0007] The adhesive layer is provided with a conductive structure, the melting point of which is lower than that of the adhesive layer; in the first direction, a first end of the conductive structure is electrically connected to the conductive element, and a second end of the conductive structure is electrically connected to the conductive pattern, so that the first circuit board and the second circuit board are electrically connected through the conductive structure.

[0008] By adopting the above technical solution, a conductive structure is provided in the adhesive layer. The first end of the conductive structure is electrically connected to a conductive component, and the second end of the conductive structure is electrically connected to a conductive pattern, so that the first circuit board and the second circuit board are electrically connected through the conductive structure. Therefore, compared with related technologies, the printed circuit board provided in this application does not require soldering to connect the first circuit board and the second circuit board, thus avoiding cold solder joints and ensuring the stability of the electrical connection between multiple individual circuit boards. Furthermore, the melting point of the conductive structure is lower than that of the adhesive layer. Therefore, when the first circuit board and the second circuit board are fixed using the adhesive layer, the conductive structure can melt together with the adhesive layer, thereby reducing the impact of the conductive structure on the adhesive layer and improving the stability of the connection between the first circuit board and the second circuit board.

[0009] In some possible implementations, both the number of conductive elements and the number of conductive structures are multiple, and each conductive element is electrically connected to the conductive pattern through one of the conductive structures.

[0010] In some possible implementations, the first circuit board is provided with at least one conductive hole, and each conductive hole accommodates one of the conductive elements;

[0011] The conductive element is configured such that: the inner wall of the conductive hole is electroplated to form the conductive element on the inner wall of the conductive hole; or, a liquid conductive material is filled into the conductive hole to solidify the liquid conductive material to form the conductive element.

[0012] In some possible implementations, in the first direction, the length of the conductive element is equal to the thickness of the first circuit board;

[0013] The first circuit board includes a plurality of core boards stacked along the first direction, and each core board is electrically connected to the conductive element.

[0014] In some possible implementations, the conductive structure is made of tin or a tin-containing alloy;

[0015] The adhesive layer is configured as a semi-cured adhesive layer, and the semi-cured adhesive layer is provided with a receiving groove, which accommodates the conductive structure.

[0016] This application also provides a method for manufacturing a printed circuit board, comprising the following steps:

[0017] A first circuit board and a second circuit board are provided, wherein the first circuit board is provided with conductive elements and the second circuit board is provided with conductive patterns;

[0018] A solid adhesive layer is formed on the surface of the first circuit board along the first direction;

[0019] A solid conductive structure is formed in the solid adhesive layer, and a first end of the solid conductive structure is electrically connected to the conductive element.

[0020] The solid adhesive layer and the solid conductive structure are heated to melt the solid adhesive layer to form a liquid adhesive layer, and the solid conductive structure is melted to form a liquid conductive structure.

[0021] The second circuit board is fixed by the liquid adhesive layer, so that the first circuit board, the liquid adhesive layer and the second circuit board are stacked along the first direction, and the liquid conductive structure is at least partially electrically connected to the conductive pattern;

[0022] The liquid adhesive layer and the liquid conductive structure are cured to form an adhesive layer and a conductive structure, respectively.

[0023] By adopting the above technical solution, a solid conductive structure is formed in the solid adhesive layer, and the first end of the solid conductive structure is electrically connected to a conductive component. Then, the solid adhesive layer and the solid conductive structure are heated so that the solid adhesive layer melts to form a liquid adhesive layer, and the solid conductive structure melts to form a liquid conductive structure. Thus, when the first circuit board and the second circuit board are fixed using the liquid adhesive layer, the liquid conductive structure can be in a melting state together with the liquid adhesive layer. Therefore, when the second circuit board is fixed using the liquid adhesive layer, the influence of the conductive structure on the liquid adhesive layer is reduced, and the stability of the connection between the first circuit board and the second circuit board is improved.

[0024] In some possible implementations, forming a solid conductive structure in the solid adhesive layer includes the following steps:

[0025] A receiving groove is formed in the solid adhesive layer;

[0026] The receiving tank is filled with a liquid conductive material;

[0027] The liquid conductive material is solidified to form the solid conductive structure.

[0028] In some possible implementations, fixing the second circuit board using the liquid adhesive layer includes the following steps:

[0029] The surface of the second circuit board is connected through the liquid adhesive layer, the conductive pattern faces the first circuit board, and at least a portion of the liquid conductive structure is electrically connected to the conductive pattern;

[0030] The first circuit board, the liquid adhesive layer, and the second circuit board are pressed together to fix the first circuit board and the second circuit board by the liquid adhesive layer.

[0031] In some possible implementations, the conductive structure is made of tin or a tin-containing alloy, the adhesive layer is a semi-cured adhesive layer, and the melting point of the conductive structure is lower than the melting point of the semi-cured adhesive layer.

[0032] When heating the solid adhesive layer and the solid conductive structure, the heating temperature is higher than the melting point of the semi-cured adhesive layer and lower than the curing point of the semi-cured adhesive layer.

[0033] This application also provides an electronic device including the printed circuit board described in any of the above embodiments.

[0034] Since the electronic device includes the printed circuit board described in any of the above claims, the advantages of the electronic device including the printed circuit board described in any of the above claims can be specifically found in the relevant descriptions above, and will not be repeated here. Attached Figure Description

[0035] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0036] Figure 1 This is a schematic diagram of the structure of a printed circuit board provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the structure of the second circuit board provided in an embodiment of this application;

[0038] Figure 3 This is a schematic diagram of the adhesive layer structure provided in the embodiments of this application;

[0039] Figure 4 This is a schematic diagram of the structure of the first circuit board provided in an embodiment of this application;

[0040] Figure 5 A schematic diagram of the fabrication method of the printed circuit board provided in the embodiments of this application;

[0041] Figure 6 This is a schematic diagram of the process for forming a solid conductive structure provided in an embodiment of this application;

[0042] Figure 7 A schematic diagram of the process of fixing the second circuit board with a liquid adhesive layer provided in an embodiment of this application;

[0043] Figure 8 A schematic diagram of the structure of the first circuit board from another perspective provided in an embodiment of this application;

[0044] Figure 9 A schematic diagram of the adhesive layer from another perspective, provided as an embodiment of this application;

[0045] Figure 10 A schematic diagram of the structure of a first circuit board with an adhesive layer connected according to an embodiment of this application;

[0046] Figure 11 This is a schematic diagram of the adhesive layer with a conductive structure provided in an embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100, First circuit board; 110, Core board; 120, Conductive component; 130, Conductive hole; 200, Adhesive layer; 210, Receiving groove; 220, Conductive structure; 300, Second circuit board; 310, Conductive pattern.

[0049] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0050] As described in the background section, a multi-modal printed circuit board (PCB) comprises multiple electrically connected individual circuit boards to connect different components. This allows for electrical connection between components on different individual circuit boards, enriching the functionality of the PCB. During PCB fabrication, soldering is typically used to fix the multiple individual circuit boards together, and metal solder joints are used to establish electrical connections between them. However, when fixing multiple individual circuit boards by soldering, issues such as cold solder joints can easily occur, affecting the stability of the electrical connections between them.

[0051] To address the aforementioned technical problems, this application provides a printed circuit board and its fabrication method, as well as an electronic device. The printed circuit board includes a first circuit board, an adhesive layer, and a second circuit board stacked along a first direction. The adhesive layer has a conductive structure; a first end of the conductive structure is electrically connected to a conductive element, and a second end is electrically connected to a conductive pattern, thereby electrically connecting the first and second circuit boards through the conductive structure. Compared to related technologies, the printed circuit board provided in this application does not require soldering to connect the first and second circuit boards, thus preventing cold solder joints and ensuring the stability of the electrical connection between multiple individual circuit boards. Furthermore, the melting point of the conductive structure is lower than that of the adhesive layer. Therefore, when the first and second circuit boards are fixed using the adhesive layer, the conductive structure and the adhesive layer can melt together, reducing the impact of the conductive structure on the adhesive layer and improving the stability of the connection between the first and second circuit boards.

[0052] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0053] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0054] Reference Figures 1-4 This application provides a printed circuit board, including a first circuit board 100, an adhesive layer 200, and a second circuit board 300 stacked along a first direction, such that the first circuit board 100 and the second circuit board 300 are bonded and fixed by the adhesive layer 200; wherein, the first circuit board 100 is provided with a conductive element 120, and the second circuit board 300 is provided with a conductive pattern 310, the conductive pattern 310 being disposed on the surface of the second circuit board 300 facing the conductive element 120; the adhesive layer 200 is provided with a conductive structure 220, wherein in the first direction, a first end of the conductive structure 220 is electrically connected to the conductive element 120, and a second end of the conductive structure 220 is electrically connected to the conductive pattern 310, so that the first circuit board 100 and the second circuit board 300 are electrically connected by the conductive structure 220.

[0055] It is readily understood that a printed circuit board may include multiple electrically connected individual circuit boards. Among the multiple individual circuit boards, the number of first circuit boards 100 and the number of second circuit boards 300 may both be multiple, and each first circuit board 100 is connected to one second circuit board 300. The multiple individual circuit boards may also be configured in other forms, for example, each first circuit board 100 is connected to multiple second circuit boards 300, or each second circuit board 300 is connected to multiple first circuit boards 100. The embodiments of this application do not impose further limitations on this.

[0056] In some possible implementations, the adhesive layer 200 is configured as a semi-cured adhesive layer, which may be made of resin and reinforcing materials such as fiberglass cloth or paper. When the first circuit board 100 and the second circuit board 300 are bonded and fixed using the semi-cured adhesive layer, the solid semi-cured adhesive layer can be placed on the first circuit board 100 or the second circuit board 300 firstly, and then the solid semi-cured adhesive layer can be heated to form a liquid semi-cured adhesive layer. Then, the first circuit board 100, the semi-cured adhesive layer and the second circuit board 300 are pressed together, thereby bonding the first circuit board 100 and the second circuit board 300 using the liquid semi-cured adhesive layer. Subsequently, the liquid semi-cured adhesive layer is heated to cure, thereby fixing the first circuit board 100 and the second circuit board 300.

[0057] For example, the conductive structure 220 can be made of tin or a tin-containing alloy. The melting point of the conductive structure 220 is lower than that of the semi-cured adhesive layer. When the solid semi-cured adhesive layer is heated to form a liquid semi-cured adhesive layer, the conductive structure 220 is in a liquid state. Therefore, during the pressing process of the first circuit board 100, the semi-cured adhesive layer and the second circuit board 300, the liquid conductive structure 220 will not affect the pressing process, thereby ensuring the stability of the connection between the first circuit board 100 and the second circuit board 300.

[0058] Reference Figures 1-4 In some possible implementations, multiple conductive elements 120 and multiple conductive structures 220 are provided, and each conductive element 120 is electrically connected to the conductive pattern 310 through a conductive structure 220. Furthermore, the first circuit board 100 is provided with multiple conductive holes 130, each of which accommodates one conductive element 120. The conductive element 120 can be configured in various shapes, and can be formed within the conductive hole 130 in various ways. For example, the conductive element 120 can be configured by: electroplating the inner wall of the conductive hole 130 to form the conductive element 120 on the inner wall of the conductive hole 130; or by filling the conductive hole 130 with a liquid conductive material to solidify the liquid conductive material to form the conductive element 120.

[0059] For example, in the first direction, the length of the conductive element 120 is equal to the thickness of the first circuit board 100; the first circuit board 100 includes a plurality of core boards 110 stacked along the first direction, each core board 110 being electrically connected to the conductive element 120, thereby realizing the electrical connection between the core boards 110 of the first circuit board 100 through the conductive element 120.

[0060] The adhesive layer 200 is provided with a plurality of receiving grooves 210, which are correspondingly provided with a plurality of conductive elements 120. Each receiving groove 210 accommodates a conductive structure 220 so that each conductive element 120 can be electrically connected to a conductive structure 220.

[0061] In summary, by providing a conductive structure 220 in the adhesive layer 200, with its first end electrically connected to the conductive element 120 and its second end electrically connected to the conductive pattern 310, the first circuit board 100 and the second circuit board 300 are electrically connected through the conductive structure 220. Therefore, compared to related technologies, the printed circuit board provided in this embodiment does not require soldering to connect the first circuit board 100 and the second circuit board 300, thus preventing cold solder joints and ensuring the stability of the electrical connection between multiple individual circuit boards. Furthermore, the melting point of the conductive structure 220 is lower than that of the adhesive layer 200. Therefore, when the adhesive layer 200 is used to fix the first circuit board 100 and the second circuit board 300, the conductive structure 220 and the adhesive layer 200 are both in a melting state, thereby reducing the impact of the conductive structure 220 on the adhesive layer 200 and improving the stability of the connection between the first circuit board 100 and the second circuit board 300.

[0062] Reference Figures 1-5 This application also provides a method for manufacturing a printed circuit board, comprising the following steps: providing a first circuit board 100 and a second circuit board 300, the first circuit board 100 being provided with a conductive element 120, and the second circuit board 300 being provided with a conductive pattern 310; forming a solid adhesive layer on the surface of the first circuit board 100 along a first direction; forming a solid conductive structure on the solid adhesive layer, the first end of the solid conductive structure being electrically connected to the conductive element 120; heating the solid adhesive layer and the solid conductive structure to melt the solid adhesive layer to form a liquid adhesive layer, and melting the solid conductive structure to form a liquid conductive structure; fixing the second circuit board 300 through the liquid adhesive layer, so that the first circuit board 100, the liquid adhesive layer, and the second circuit board 300 are stacked along the first direction, and the liquid conductive structure is at least partially electrically connected to the conductive pattern 310; and curing the liquid adhesive layer and the liquid conductive structure to form an adhesive layer 200 by the liquid adhesive layer, and a conductive structure 220 by the liquid conductive structure.

[0063] S101. A first circuit board 100 and a second circuit board 300 are provided. The first circuit board 100 is provided with a conductive element 120, and the second circuit board 300 is provided with a conductive pattern 310.

[0064] In the first circuit board 100, the number of conductive elements 120 can be set to multiple, and the conductive elements 120 can be set to various shapes. The conductive elements 120 can be formed in the conductive holes 130 in various ways. For example, the conductive elements 120 are configured to: electroplate the inner wall of the conductive holes 130 to form the conductive elements 120 on the inner wall of the conductive holes 130; or, fill the conductive holes 130 with liquid conductive material to solidify the liquid conductive material to form the conductive elements 120.

[0065] In the first direction, the length of the conductive element 120 is equal to the thickness of the first circuit board 100; the first circuit board 100 includes a plurality of core boards 110 stacked along the first direction, each core board 110 being electrically connected to the conductive element 120, thereby achieving electrical connection between the core boards 110 of the first circuit board 100 through the conductive element 120.

[0066] S102, A solid adhesive layer is formed on the surface of the first circuit board 100 along the first direction;

[0067] Reference Figure 1 , Figure 5 and Figure 10 In some possible implementations, the adhesive layer 200 is configured as a semi-cured adhesive layer, which can be bonded to the surface of the first circuit board 100 along the first direction by means of bonding or other methods. For example, the melting point of the semi-cured adhesive layer is about 80°C. At room temperature, the semi-cured adhesive layer is solid, so the solid adhesive layer can be attached to the surface of the first circuit board 100 at room temperature.

[0068] S103. A solid conductive structure is formed in the solid adhesive layer, and the first end of the solid conductive structure is electrically connected to the conductive component 120.

[0069] For example, the conductive structure 220 is made of tin or a tin-containing alloy, and the melting point of the conductive structure 220 is lower than that of the semi-cured adhesive layer. A solid conductive structure can be formed in the solid adhesive layer in various ways; for example, the solid conductive structure can be embedded in the surface of the solid adhesive layer. Alternatively, forming a solid conductive structure in the solid adhesive layer includes the following steps:

[0070] S1031. A receiving groove 210 is formed in the solid adhesive layer;

[0071] Reference Figure 1 , Figure 5 , Figure 6 and Figures 8-10It is easy to understand that at room temperature, the semi-cured adhesive layer is solid. Therefore, a solid adhesive layer can be formed first, and then multiple receiving grooves 210 can be formed in the solid adhesive layer by cutting or other means, so that the multiple receiving grooves 210 are correspondingly set with multiple conductive elements 120. Then, the solid adhesive layer with multiple receiving grooves 210 is connected to the surface of the first circuit board 100, and each receiving groove 210 is correspondingly set with a conductive element 120.

[0072] Alternatively, a solid adhesive layer can be attached to the surface of the first circuit board 100, and then multiple receiving grooves 210 can be formed on the solid adhesive layer by cutting or other means, so that multiple conductive elements 120 are exposed, and the multiple receiving grooves 210 are set in a one-to-one correspondence with the multiple conductive elements 120, thereby realizing the formation process of the receiving grooves 210.

[0073] S1032. Fill the receiving tank 210 with liquid conductive material;

[0074] For example, if the conductive structure 220 is made of tin or a tin-containing alloy, the liquid conductive material can be set as liquid tin or a liquid tin-containing alloy. Furthermore, the melting point of the liquid conductive material is lower than the melting point of the adhesive layer 200. When the temperature of the liquid conductive material is lower than the melting point of the adhesive layer 200, the adhesive layer 200 is set as a solid adhesive layer, so that the liquid conductive material can be stably filled in the receiving tank 210, thereby ensuring that the liquid conductive material can be filled in the receiving tank 210.

[0075] S1033, Solidify liquid conductive materials to form a solid conductive structure;

[0076] After filling the receiving tank 210 with liquid conductive material, the liquid conductive material can be cured by drying or standing to form a solid conductive structure, thereby forming a solid conductive structure in the solid adhesive layer, and the first end of the solid conductive structure is electrically connected to the conductive component 120.

[0077] S104. Heat the solid adhesive layer and the solid conductive structure to melt the solid adhesive layer to form a liquid adhesive layer and melt the solid conductive structure to form a liquid conductive structure.

[0078] In some possible implementations, when heating the solid adhesive layer and the solid conductive structure, the heating temperature is higher than the melting point of the semi-cured adhesive layer but lower than the curing point of the semi-cured adhesive layer.

[0079] For example, the solid adhesive layer and the solid conductive structure can be heated by a heating device. For example, the heating temperature can be set to be greater than or equal to 100°C and less than or equal to 120°C, so that the solid adhesive layer melts to form a liquid adhesive layer, thereby increasing the bonding area between the adhesive layer 200 and the first circuit board 100 and increasing the stability of the bonding between the adhesive layer 200 and the first circuit board 100.

[0080] S105. The second circuit board 300 is fixed by a liquid adhesive layer so that the first circuit board 100, the liquid adhesive layer and the second circuit board 300 are stacked along the first direction, and the liquid conductive structure is at least partially electrically connected to the conductive pattern 310.

[0081] Reference Figures 1-5 ,as well as Figure 7 In some possible implementations, the second circuit board 300 can be fixed by a liquid adhesive layer in various ways. For example, it may include the following steps:

[0082] S1051. The surface of the second circuit board 300 is connected by a liquid adhesive layer, the conductive pattern 310 faces the first circuit board 100, and at least a portion of the liquid conductive structure is electrically connected to the conductive pattern 310.

[0083] The second circuit board 300 can be placed on the surface of the liquid adhesive layer away from the first circuit board 100, such that the conductive pattern 310 faces the first circuit board 100. At least a portion of the liquid conductive structure is electrically connected to the conductive pattern 310, thereby enabling the second circuit board 300 to make full contact with the liquid adhesive layer, thereby increasing the bonding area between the liquid adhesive layer and the second circuit board 300 and increasing the stability of the bonding between the liquid adhesive layer and the second circuit board 300.

[0084] S1052, Press the first circuit board 100, the liquid adhesive layer, and the second circuit board 300 together so that the first circuit board 100 and the second circuit board 300 are fixed by the liquid adhesive layer;

[0085] For example, the first circuit board 100, the liquid adhesive layer, and the second circuit board 300 are pressed together so that the liquid adhesive layer is in full contact with the first circuit board 100 and the second circuit board 300, so that the first circuit board 100 and the second circuit board 300 can be fixed by the liquid adhesive layer.

[0086] S106. Curing the liquid adhesive layer and the liquid conductive structure to form the adhesive layer 200 and the conductive structure 220.

[0087] The liquid adhesive layer and the liquid conductive structure can be cured by drying or letting it stand, so that the liquid adhesive layer forms the adhesive layer 200 and the liquid conductive structure forms the conductive structure 220, thereby realizing the fabrication process of the printed circuit board.

[0088] In summary, a solid conductive structure is formed in the solid adhesive layer, and the first end of the solid conductive structure is electrically connected to the conductive component 120. Then, the solid adhesive layer and the solid conductive structure are heated so that the solid adhesive layer melts to form a liquid adhesive layer, and the solid conductive structure melts to form a liquid conductive structure. Thus, when the first circuit board 100 and the second circuit board 300 are fixed using the liquid adhesive layer, the liquid conductive structure can be in a melting state together with the liquid adhesive layer. Therefore, when the second circuit board 300 is fixed using the liquid adhesive layer, the influence of the conductive structure 220 on the liquid adhesive layer is reduced, and the stability of the connection between the first circuit board 100 and the second circuit board 300 is improved.

[0089] This application also provides an electronic device including the printed circuit board described in any of the above embodiments. Since the electronic device includes the printed circuit board described in any of the above embodiments, the advantages of this electronic device including the printed circuit board described in any of the above embodiments are specifically described in the relevant above descriptions, and will not be repeated here.

[0090] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0091] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0092] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A printed circuit board, characterized in that, It includes a first circuit board, an adhesive layer, and a second circuit board stacked along a first direction; The first circuit board is provided with a conductive element, and the second circuit board is provided with a conductive pattern, the conductive pattern being disposed on the surface of the second circuit board facing the conductive element; The adhesive layer is configured as a semi-cured adhesive layer, and the semi-cured adhesive layer is provided with a plurality of receiving grooves, the plurality of receiving grooves being correspondingly provided with a plurality of conductive elements, each receiving groove accommodating a conductive structure, the melting point of the conductive structure being lower than the melting point of the semi-cured adhesive layer; in the first direction, the first end of the conductive structure is electrically connected to the conductive element, and the second end of the conductive structure is electrically connected to the conductive pattern, so that the first circuit board and the second circuit board are electrically connected through the conductive structure.

2. The printed circuit board according to claim 1, characterized in that, Each of the conductive elements is electrically connected to the conductive pattern through one of the conductive structures.

3. The printed circuit board according to claim 1, characterized in that, The first circuit board is provided with at least one conductive hole, and each conductive hole accommodates one of the conductive components; The conductive element is configured such that: the inner wall of the conductive hole is electroplated to form the conductive element on the inner wall of the conductive hole; or, a liquid conductive material is filled into the conductive hole to solidify the liquid conductive material to form the conductive element.

4. The printed circuit board according to claim 1, characterized in that, In the first direction, the length of the conductive element is equal to the thickness of the first circuit board; The first circuit board includes a plurality of core boards stacked along the first direction, and each core board is electrically connected to the conductive element.

5. The printed circuit board according to any one of claims 1-4, characterized in that, The conductive structure is made of tin or a tin-containing alloy.

6. A method for manufacturing a printed circuit board, characterized in that, Includes the following steps: A first circuit board and a second circuit board are provided, wherein the first circuit board is provided with conductive elements and the second circuit board is provided with conductive patterns; A solid adhesive layer is formed on the surface of the first circuit board along the first direction; Multiple receiving grooves are formed in the solid adhesive layer; A liquid conductive material is filled into the receiving tank, and the liquid conductive material is solidified to form a solid conductive structure; The first end of the solid conductive structure is electrically connected to the conductive component; The solid adhesive layer and the solid conductive structure are heated to melt the solid adhesive layer to form a liquid adhesive layer and the solid conductive structure to melt to form a liquid conductive structure. The adhesive layer is configured as a semi-cured adhesive layer, and the melting point of the conductive structure is lower than the melting point of the semi-cured adhesive layer. When heating the solid adhesive layer and the solid conductive structure, the heating temperature is higher than the melting point of the semi-cured adhesive layer but lower than the curing point of the semi-cured adhesive layer. The second circuit board is fixed by the liquid adhesive layer, so that the first circuit board, the liquid adhesive layer and the second circuit board are stacked along the first direction, and the liquid conductive structure is at least partially electrically connected to the conductive pattern; The liquid adhesive layer and the liquid conductive structure are cured to form an adhesive layer and a conductive structure, respectively.

7. The method for manufacturing a printed circuit board according to claim 6, characterized in that, Fixing the second circuit board using the liquid adhesive layer includes the following steps: The surface of the second circuit board is connected through the liquid adhesive layer, the conductive pattern faces the first circuit board, and at least a portion of the liquid conductive structure is electrically connected to the conductive pattern; The first circuit board, the liquid adhesive layer, and the second circuit board are pressed together to fix the first circuit board and the second circuit board through the liquid adhesive layer.

8. An electronic device, characterized in that, Including the printed circuit board as described in any one of claims 1-5.

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