Circuit board fixing tool and circuit board dicing method

Abstract

The embodiment of the application provides a circuit board fixing tool and a circuit board gluing method. The circuit board fixing tool comprises a bottom plate, a first bearing area and a second bearing area are arranged on the bottom plate, the positions of the two bearing areas distributed on the bottom plate correspond to a first gluing part and a second gluing part of a circuit board placed on the bottom plate respectively, the first gluing part comprises a first sub-area and a second sub-area, a first adsorption area and a second adsorption area are arranged on the first bearing area, the first adsorption area and the second adsorption area correspond to the first sub-area and the second sub-area respectively, when the first sub-area reaches the first adsorption area, the first gluing module glues the first sub-area to divide the first sub-area into 1 to N columns, the circuit board can move to the second bearing area, when the first column on the first sub-area reaches the second bearing area, the first gluing module glues the second sub-area, and the second gluing module glues the second gluing part at the same time.

Description

Technical Field

[0001] This application relates to the field of circuit board processing auxiliary devices, and more specifically, to a circuit board fixing fixture and a method for applying adhesive to a circuit board. Background Technology

[0002] Surface mount technology (SMT), also known as surface mount technology, is a technique for mounting leadless or short-lead surface mount components or devices onto the surface of printed circuit boards or other substrates. Its main process flow is: printing—applying adhesive and mounting—reflow soldering—repair.

[0003] In current gluing processes, circuit boards are typically transported to the gluing position for gluing. During gluing, a pressure plate above the circuit board and a base plate work together to ensure the board is fully attached to the bottom fixture, thus ensuring gluing stability. However, with existing technology, the structural limitations of the vertical optical dual gluing module mean that conventional gluing methods result in excessively long waiting times and low yields. For example, when gluing a circuit board in sections, gluing the left side requires a certain amount of time while gluing the right side. Summary of the Invention

[0004] The purpose of this application is to provide a new technical solution for a circuit board fixing fixture and a method for applying adhesive to a circuit board, which can significantly improve the working efficiency of the adhesive application equipment when the size of the circuit board is smaller than the stroke of the adhesive application module.

[0005] In a first aspect, embodiments of this application provide a circuit board fixing fixture. The circuit board fixing fixture includes a base plate, on which a first bearing area and a second bearing area are provided. The positions of the first bearing area and the second bearing area on the base plate correspond to the first glue-cutting portion and the second glue-cutting portion of the circuit board placed on the base plate, respectively. The first glue-cutting portion includes a first sub-region and a second sub-region.

[0006] A first adsorption region and a second adsorption region are respectively provided in the first bearing region, and the first adsorption region and the second adsorption region correspond to the first sub-region and the second sub-region, respectively.

[0007] When the first sub-region of the circuit board reaches the first adsorption area, the first adsorption area adsorbs the circuit board. The first glue-spreading module spreads glue on the first sub-region to divide the first sub-region into columns 1 to N, where N > 1. The circuit board can move towards the second support area. When the first column on the first sub-region reaches the second support area, the second adsorption area adsorbs the circuit board. The first glue-spreading module spreads glue on the second sub-region, and at the same time, the second glue-spreading module spreads glue on the second glue-spreading area.

[0008] Optionally, a plurality of first suction holes are provided at the positions of the first adsorption area and the second adsorption area, and the circuit board placed on the base plate is adsorbed through the first suction holes.

[0009] Optionally, the first air intake is connected to a vacuum pump, which is located below the base plate.

[0010] Optionally, the circuit board fixing fixture further includes a first pressure plate, which is disposed at the position of the first bearing area and is used to press the circuit board that is adsorbed in the first bearing area.

[0011] Optionally, the first pressure plate includes a pressure strip surrounding the periphery of the first bearing area, and a fixing part integrally connected with the pressure strip, the fixing part being used to fix the first pressure plate.

[0012] Optionally, the circuit board fixing fixture further includes a second pressure plate, which is disposed at the position of the second bearing area;

[0013] Multiple second suction holes are provided in the second bearing area, and the second pressure plate is used to press the circuit board adsorbed by the second suction holes.

[0014] Optionally, the area of ​​the first bearing area is larger than the area of ​​the second bearing area, so that the first bearing area and the second bearing area are asymmetrically spaced on the base plate.

[0015] Optionally, the base plate is provided with a first guide rail connected to the first bearing area, so that the circuit board placed on the base plate can be transported to the position of the first bearing area via the first guide rail; and / or,

[0016] A second guide rail is provided between the first bearing area and the second bearing area, so that the circuit board placed in the first bearing area can be transported to the position of the second bearing area through the second guide rail.

[0017] Optionally, the base plate is made of metal.

[0018] Secondly, this application provides a method for applying adhesive to a circuit board, wherein the method utilizes the circuit board fixing device described in the first aspect, and the method includes:

[0019] The circuit board is pre-divided into sections to form a first adhesive application area and a second adhesive application area on the circuit board, wherein the first adhesive application area is further divided into a first sub-region and a second sub-region.

[0020] The first sub-region of the circuit board is sent to the first adsorption area of ​​the base plate, where the first adsorption area adsorbs the circuit board. The first glue-spreading module is controlled to spread glue on the first sub-region to divide the first sub-region into columns 1 to N, where N > 1.

[0021] The circuit board is driven to move toward the second bearing area of ​​the base plate, and when the first column on the first sub-region reaches the second bearing area, the circuit board is adsorbed by the second adsorption area.

[0022] The first glue-spreading module is controlled to spread glue on the second sub-region, while the second glue-spreading module is controlled to spread glue on the second glue-spreading area.

[0023] According to an embodiment of this application, a circuit board fixing fixture is provided, which changes the original symmetrical base plate and pressure plate structure design. Two asymmetrical bearing areas are formed on the base plate, one of which has two adsorption areas. The first glue-spreading part of the circuit board can be pre-divided into a first sub-region and a second sub-region. The first sub-region is glue-spread in the first adsorption area, and then the second sub-region is glue-spread in the second adsorption area. At the same time, the second glue-spreading part of the circuit board is glue-spread in the second bearing area. This design solves the problem of waiting in the glue-spreading process of different areas on the circuit board, ensures the continuity of the circuit board in the glue-spreading process, and thus can greatly improve the working efficiency of the equipment.

[0024] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0026] Figure 1 This is one of the structural schematic diagrams of the circuit board fixing fixture provided in the embodiments of this application;

[0027] Figure 2 This is a second schematic diagram of the circuit board fixing fixture provided in the embodiments of this application;

[0028] Figure 3This is a top view of the circuit board fixing fixture provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 10. Base plate; 11. First bearing area; 111. First adsorption area; 112. Second adsorption area; 12. Second bearing area; 13. First pressure plate; 131. First pressure strip; 132. Fixing part; 14. Second pressure plate; 141. Second pressure strip; 142. Fixing structure; 01. First glue-spreading module; 02. Second glue-spreading module. Detailed Implementation

[0031] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0032] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0033] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0034] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0036] As mentioned above, in existing glue-applying processes, there is a waiting period when applying glue to different areas of the circuit board, resulting in low equipment efficiency. The solution provided in this application addresses this waiting period during the glue-applying process for different areas of the circuit board, ensuring continuity in the glue-applying process and significantly improving equipment efficiency.

[0037] According to an embodiment of this application, a circuit board fixing fixture is provided, see [link to relevant documentation]. Figures 1 to 3As shown, the circuit board fixing fixture includes a base plate 10, on which a first bearing area 11 and a second bearing area 12 are provided. The positions of the first bearing area 11 and the second bearing area 12 on the base plate 10 correspond to the first glue-scribing part and the second glue-scribing part of the circuit board placed on the base plate 10, respectively. The first glue-scribing part includes a first sub-region and a second sub-region.

[0038] A first adsorption region 111 and a second adsorption region 112 are respectively provided in the first bearing region 11, and the first adsorption region 111 and the second adsorption region 112 correspond to the first sub-region and the second sub-region, respectively.

[0039] When the first sub-region of the circuit board reaches the first adsorption area 111, the first adsorption area 111 adsorbs the circuit board. The first glue-spreading module 01 spreads glue on the first sub-region to divide the first sub-region into columns 1 to N, where N > 1. The circuit board can move toward the second support area 12. When the first column on the first sub-region reaches the second support area 12, the second adsorption area 112 adsorbs the circuit board. The first glue-spreading module 01 spreads glue on the second sub-region, and at the same time, the second glue-spreading module 02 spreads glue on the second glue-spreading area.

[0040] According to the above embodiments of this application, a circuit board fixing fixture is proposed, which changes the original symmetrical base plate and pressure plate structural design. Specifically, two asymmetrical bearing areas are formed on the base plate 10, namely the first bearing area 11 and the second bearing area 12 mentioned above. The first bearing area 11 is provided with a first adsorption area 111 and a second adsorption area 112. The first glue-cutting part of the circuit board can be pre-divided into a first sub-region and a second sub-region. The first sub-region is glue-cut in the first adsorption area 111. Then, while the second sub-region is glue-cut in the second adsorption area 112, the second glue-cutting part of the circuit board is glue-cut in the second bearing area 12. This design solves the problem of waiting during the glue-cutting process in different areas of the circuit board, ensures the continuity of the circuit board in the glue-cutting process, and thus can greatly improve the working efficiency of the equipment.

[0041] In the above embodiments, when the adhesive application is performed on the circuit board in sections, the first adhesive application area is, for example, the left adhesive application side, and the second adhesive application area is, for example, the right adhesive application side. The adhesive application width on the left side is larger, and the adhesive application width on the right side is smaller. The left and right adhesive application operations can be performed simultaneously, and the adhesive application process is continuous without interruption, which can significantly improve the adhesive application efficiency. For example, the adhesive application efficiency of the solution in this application can be improved by 41.7%. This provides greater design flexibility for circuit board (PCB) design.

[0042] Furthermore, in the embodiments of this application, the design size of the circuit board for applying adhesive can be smaller than the stroke of the adhesive application module, which provides a new process solution for adhesive application on the circuit board.

[0043] See some examples in this application. Figure 1 Multiple first suction holes are respectively provided at the positions of the first adsorption area 111 and the second adsorption area 112, and the circuit board placed on the base plate 10 is adsorbed through the first suction holes.

[0044] In the example above, both the first adsorption zone 111 and the second adsorption zone 112 are provided with first air intake holes, and the number and shape of the first air intake holes can be flexibly adjusted as needed.

[0045] The circuit board to be coated can be temporarily fixed to the base plate 10 through the first air suction hole.

[0046] Furthermore, the suction through the first air hole ensures that the circuit board placed on the base plate 10 remains flat, which is beneficial for subsequent glue application and can improve product yield.

[0047] Optionally, in order to improve the adsorption effect of the first suction hole on the circuit board, a row of evenly arranged first suction holes can be set on both sides of each adsorption area. This design can make the adsorption of the circuit board more secure, and at the same time, it can ensure that the circuit board is flattened, thus ensuring the accuracy of the glue application position.

[0048] Optionally, the first air intake is connected to a vacuum pump, which is located below the base plate 10.

[0049] In other words, this application can use vacuum adsorption, which has good stability and the vacuum pump and other related devices are small in size.

[0050] See some examples in this application. Figures 1 to 3 The circuit board fixing fixture also includes a first pressure plate 13, which is disposed at the position of the first bearing area 11 and is used to press the circuit board that is adsorbed on the first bearing area 11.

[0051] In the example above, the first pressure plate 13 can be used to position the circuit board to be glued on the base plate 10, so as to prevent the circuit board from moving during the glue application process, which would affect the accuracy and position of the glue application and lead to a decrease in product yield.

[0052] The first pressure plate 13 includes a first pressure strip 131 surrounding the first bearing area 11, and a fixing part 132 integrally connected with the first pressure strip 131, the fixing part 132 being used to fix the first pressure plate 13.

[0053] The first pressure strip 131 is used to press the first glue-spreading area on the circuit board around the periphery, which will not affect the central area of ​​the first glue-spreading area. At the same time, it can firmly fix the first glue-spreading area and make it easier to flatten the first glue-spreading area. All of these are beneficial for achieving accurate glue-spreading in the subsequent process.

[0054] See some examples in this application. Figure 1 The circuit board fixing fixture also includes a second pressure plate 14, which is disposed at the position of the second bearing area 12; a plurality of second suction holes are provided in the second bearing area 12, and the second pressure plate 14 is used to press the circuit board adsorbed by the second suction holes.

[0055] In other words, when applying adhesive to the second bearing area 12 of the circuit board, a second pressure plate 14 is introduced into the area. The second pressure plate 14 can be used to press the circuit board at the edge of the second bearing area 12, so as not to damage the central area of ​​the second bearing area 12, and at the same time, the second bearing area 12 can be made relatively flat.

[0056] Optionally, see Figure 1 The second pressure plate 14 includes a second pressure strip 141 surrounding the second bearing area 12, and a fixing structure 142 integrally connected with the second pressure strip 141, the fixing structure being used to fix the second pressure plate 14.

[0057] Meanwhile, multiple second suction holes are used to firmly attach the circuit board to the base plate 10 by means of vacuum adsorption.

[0058] Optionally, in order to improve the adsorption effect of the second suction hole on the second bearing area 12, a row of evenly arranged second suction holes can be provided on each side of the second bearing area 12. This design can make the circuit board adsorbed more firmly, and at the same time, it can ensure that the circuit board is flattened, thus ensuring the accuracy of the glue application position.

[0059] Furthermore, in various examples of this application, the air intake holes at different locations can be connected to a vacuum pump. When the air supply to the air intake holes is stopped, the air intake holes lose their adsorption effect on the circuit board, which makes it convenient to remove the circuit board placed on the base plate 10.

[0060] In some examples of this application, the area of ​​the first bearing area 11 is larger than the area of ​​the second bearing area 12, so that the first bearing area 11 and the second bearing area 12 are asymmetrically spaced on the base plate 10.

[0061] The first bearing area 11 includes, for example, two adsorption areas. The first bearing area 11 and the second bearing area 12 are respectively used to apply adhesive to different areas of the circuit board. In this application, the size of the first bearing area 11 is designed to be different from that of the second bearing area 12, that is, the symmetrical base plate 10 is changed to a non-symmetrical one.

[0062] Specifically, see Figure 1 and Figure 3 First, two vacuum adsorption areas (i.e., the first adsorption area 111 and the second adsorption area 112) are added to the left side of the adhesive application position on the base plate 10 (i.e., the first adsorption area 111 and the second adsorption area 112). Then, the first pressure plate 13 and the second pressure plate 14 are designed to support adhesive application in both areas. The specific working principle is as follows: taking the adhesive application of 44 columns as an example, when the circuit board reaches the left side adhesive application position (first adsorption area 11), it first stops in the first vacuum adsorption area (first adsorption area 111) of the left side adhesive application position. At this time, the left adhesive application module (such as the first adhesive application module 01) starts to work. The left adhesive application module only applies adhesive to columns 1 to 28 of the lower half of the circuit board. After completion, The circuit board continues to move. When the first column of adhesive applied to the circuit board reaches the right adhesive application position (second bearing area 12), the left adhesive application module applies adhesive to the remaining 16 columns of the lower half of the circuit board in the second vacuum area (second adsorption area 112). At this time, the left adhesive application for the lower half of the circuit board (columns 29-44) and the right adhesive application for the upper half of the circuit board (columns 1-16) are performed simultaneously. When the left adhesive application has completed 44 columns, it can automatically return to the first vacuum adsorption area on the left to continue applying adhesive to the lower half of the next circuit board (columns 1-28), while the right adhesive application applies adhesive to the remaining 17-44 columns of the upper half of the circuit board. This completes the entire cycle, eliminating the waiting time for adhesive application in different areas.

[0063] In some examples of this application, the base plate 10 is provided with a first guide rail connected to the first bearing area 11, and the circuit board placed on the base plate 10 can be transported to the position of the first bearing area 11 via the first guide rail; and / or,

[0064] A second guide rail is provided between the first carrier area 11 and the second carrier area 12, so that the circuit board placed in the first carrier area 11 can be transported to the position of the second carrier area 12 through the second guide rail.

[0065] In the above example of this application, the movement of the circuit board placed on the base plate 10 can rely on the guide rail, which facilitates easy changes in the position of the circuit board, and the movement of the circuit board can be directly driven by an external drive device, which is conducive to the automation of the entire tooling.

[0066] In some examples of this application, the base plate 10 is made of metal.

[0067] Optionally, the base plate 10 is made of tungsten steel. The base plate 10 has good hardness and rigidity, which can improve durability.

[0068] Of course, the base plate 10 can also be stainless steel or other corrosion-resistant and hard metal materials, and this application embodiment does not limit this.

[0069] This application embodiment also provides a method for applying adhesive to a circuit board, wherein the method applies the circuit board fixing fixture described above, and the method includes:

[0070] Step 1: The circuit board is pre-divided into sections to form a first adhesive application area and a second adhesive application area on the circuit board, wherein the first adhesive application area is further divided into a first sub-region and a second sub-region.

[0071] The first sub-region of the circuit board is sent to the first adsorption area 111 of the base plate 10. The first adsorption area 111 adsorbs the circuit board. The first glue-spreading module 01 is controlled to spread glue on the first sub-region to divide the first sub-region into 1 to N columns, where N>1.

[0072] The circuit board is driven to move toward the second support area 12 of the base plate, and when the first column on the first sub-region reaches the second support area 12, the circuit board is adsorbed by the second adsorption area 112.

[0073] The first glue-spreading module 01 is controlled to spread glue on the second sub-region, while the second glue-spreading module 02 is controlled to spread glue on the second glue-spreading area.

[0074] The specific structure of the circuit board fixing fixture can be found in the above embodiments.

[0075] Since the PCB application method of this application uses the PCB fixing fixture of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0076] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0077] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A circuit board fixing fixture, characterized in that, Includes a base plate (10), on which a first bearing area (11) and a second bearing area (12) are provided, and the positions of the first bearing area (11) and the second bearing area (12) on the base plate (10) correspond to the first glue-scribing part and the second glue-scribing part of the circuit board placed on the base plate (10), and the first glue-scribing part includes a first sub-region and a second sub-region; A first adsorption region (111) and a second adsorption region (112) are respectively provided in the first bearing region (11), and the first adsorption region (111) and the second adsorption region (112) correspond to the first sub-region and the second sub-region respectively; When the first sub-region of the circuit board reaches the first adsorption area (111), the first adsorption area (111) adsorbs the circuit board. The first glue-spreading module (01) spreads glue on the first sub-region to divide the first sub-region into columns 1 to N, where N > 1. The circuit board can move toward the second support area (12). When the first column on the first sub-region reaches the second support area (12), the second adsorption area (112) adsorbs the circuit board. The first glue-spreading module spreads glue on the second sub-region, and at the same time, the second glue-spreading module (02) spreads glue on the second glue-spreading area.

2. The circuit board fixing fixture according to claim 1, characterized in that, Multiple first suction holes are respectively provided at the positions of the first adsorption area (111) and the second adsorption area (112) to adsorb the circuit board placed on the base plate (10) through the first suction holes.

3. The circuit board fixing fixture according to claim 2, characterized in that, The first air intake is connected to a vacuum pump, which is located below the base plate (10).

4. The circuit board fixing fixture according to any one of claims 1-3, characterized in that, The circuit board fixing fixture also includes a first pressure plate (13), which is located in the first bearing area (11) and is used to press the circuit board that is adsorbed in the first bearing area (11).

5. The circuit board fixing fixture according to claim 4, characterized in that, The first pressure plate (13) includes a first pressure strip (131) surrounding the first bearing area (11) and a fixing part (132) integrally connected with the first pressure strip (131), the fixing part (132) being used to fix the first pressure plate (13).

6. The circuit board fixing fixture according to claim 4, characterized in that, The circuit board fixing fixture also includes a second pressure plate (14), which is disposed at the position of the second bearing area (12); A plurality of second suction holes are provided in the second bearing area (12), and the second pressure plate (14) is used to press the circuit board adsorbed by the second suction holes.

7. The circuit board fixing fixture according to claim 1, characterized in that, The area of ​​the first bearing area (11) is larger than the area of ​​the second bearing area (12) so that the first bearing area (11) and the second bearing area (12) are asymmetrically spaced on the base plate (10).

8. The circuit board fixing fixture according to claim 1, characterized in that, The base plate (10) is provided with a first guide rail connected to the first bearing area (11), and the circuit board placed on the base plate (10) can be transported to the position of the first bearing area (11) via the first guide rail; and / or, A second guide rail is provided between the first carrier area (11) and the second carrier area (12), so that the circuit board placed in the first carrier area (11) can be transported to the position of the second carrier area (12) through the second guide rail.

9. The circuit board fixing fixture according to claim 1, characterized in that, The base plate (10) is made of metal.

10. A method for applying adhesive to a circuit board, characterized in that, The adhesive application method utilizes the circuit board fixing fixture as described in any one of claims 1-9, and the adhesive application method includes: The circuit board is pre-divided into sections to form a first adhesive application area and a second adhesive application area on the circuit board, wherein the first adhesive application area is further divided into a first sub-region and a second sub-region. The first sub-region of the circuit board is sent to the first adsorption area of ​​the base plate, where the first adsorption area adsorbs the circuit board. The first glue-spreading module is controlled to spread glue on the first sub-region to divide the first sub-region into columns 1 to N, where N > 1. The circuit board is driven to move toward the second bearing area of ​​the base plate, and when the first column on the first sub-region reaches the second bearing area, the circuit board is adsorbed by the second adsorption area. The first glue-spreading module is controlled to spread glue on the second sub-region, while the second glue-spreading module is controlled to spread glue on the second glue-spreading area.

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