Processing system and processing method

Abstract

A processing system and a processing method which appropriately measure the position of at least one of an irradiation device which irradiates a processing light to an object and the object. The processing system which irradiates a processing light to an object to process the object via an irradiation optical system includes: an irradiation device which has at least a terminal optical element in the irradiation optical system; a moving device which moves the irradiation device; a first measuring device which is arranged at the irradiation device and measures the position of the object; a second measuring device which measures the position of the object via the terminal optical element; and a third measuring device which irradiates a measuring light toward the irradiation device from a position apart from the irradiation device, detects the measuring light to measure the position of the irradiation device.

Description

Technical Field

[0001] This invention relates to the technical field of a processing system for processing objects. Background Technology

[0002] Patent Document 1 describes a processing system that processes an object by irradiating its surface with processing light. In this processing system, it is required to appropriately measure the position of at least one of the irradiation device (i.e., the processing device for processing the object) and the object.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2000 / 054925 Summary of the Invention

[0006] According to a first embodiment, a processing system is provided that processes an object by irradiating it with processing light via an irradiation optical system. The processing system includes: an irradiation device having at least an end optical element in the irradiation optical system; a moving device for moving the irradiation device; a first measuring device disposed on the irradiation device and measuring the position of the object; a second measuring device for measuring the position of the object via at least the end optical element in the irradiation optical system; and a third measuring device for irradiating measuring light toward the irradiation device from a position away from the irradiation device and detecting the measuring light to measure the position of the irradiation device.

[0007] According to a second embodiment, a processing system is provided that processes an object by irradiating it with processing light via an irradiation optical system. The processing system includes: an irradiation device having at least an end optical element in the irradiation optical system; a moving device for moving the irradiation device; a first measuring device disposed on the irradiation device and measuring the position of the object; a second measuring device for measuring the position of the object via the irradiation optical system; and a third measuring device for measuring the position of the irradiation device.

[0008] According to a third embodiment, a processing system is provided that processes an object by irradiating processing light onto it via an irradiation optical system. The processing system includes: an irradiation device having at least an end optical element in the irradiation optical system; a moving device for moving the irradiation device; a first measuring device disposed at a fixed position relative to the end optical element and measuring the position of the object; a second measuring device for measuring the position of the object via the end optical element; and a third measuring device for irradiating a measuring light onto a reflective portion disposed at a fixed position relative to the end optical element and detecting the measuring light reflected by the reflective portion to measure the position of the reflective portion.

[0009] According to a fourth embodiment, a processing system is provided for processing an object. The processing system includes: a movable arm; an end effector connected to the movable arm and used for processing the object; a first measuring device fixed relative to the end effector and measuring the position of the object; a second measuring device measuring the position of the object via an illumination optical system; and a third measuring device illuminating measuring light toward the end effector from a position away from the end effector and detecting the measuring light to measure the position of the end effector.

[0010] According to a fifth embodiment, a processing system is provided that processes an object by irradiating it with processing light via an irradiation optical system. The processing system includes: an irradiation device having at least an end optical element in the irradiation optical system; a first measuring device for measuring the position of the object in at least a direction intersecting the irradiation direction of the processing light; a moving device for moving the irradiation device and the first measuring device; a second measuring device for measuring the position of the object in the irradiation direction of the processing light via at least a portion of the irradiation optical system; and a third measuring device for irradiating measuring light toward the irradiation device from a position away from the irradiation device and detecting the measuring light to measure the position of the irradiation device.

[0011] According to a sixth embodiment, a processing system is provided for processing an object. The processing system includes: a first irradiation device having at least a first end optical element in a first irradiation optical system for irradiating the object with a first processing light; a second irradiation device having at least a second end optical element in a second irradiation optical system for irradiating the object with a second processing light; and a measuring device for measuring the positions of the first irradiation device and the second irradiation device, wherein the first irradiation device processes a first region of the object, the second irradiation device processes a second region of the object, and the measuring device is capable of measuring the positions of the first irradiation device and the second irradiation device from a position away from the first irradiation device, the second irradiation device, and the object.

[0012] According to a seventh embodiment, a processing system is provided that processes an object by irradiating it with processing light via an irradiation optical system. The processing system includes: an irradiation device having at least an end optical element in the irradiation optical system; a moving device for moving the irradiation device; a first measuring device disposed on the irradiation device and measuring the position of the object; a second measuring device for measuring the position of the object via at least the end optical element in the irradiation optical system; and a third measuring device for irradiating measuring light toward the irradiation device from a position away from the irradiation device and detecting the measuring light to measure the position of the irradiation device. Attached Figure Description

[0013] Figure 1 This is a schematic diagram illustrating an example of the overall structure of the processing system according to the first embodiment.

[0014] Figure 2 This is a system structure diagram illustrating an example of the system structure of the processing system according to the first embodiment.

[0015] Figure 3 This is a plan view showing an example of a workpiece mark formed on a workpiece.

[0016] Figure 4 This is a block diagram showing the structure of the processing head of the processing system according to the first embodiment.

[0017] Figure 5 It is a three-dimensional diagram showing the measuring light illuminating multiple parts of a workpiece.

[0018] Figure 6 This is a schematic diagram showing the structure of the self-propelled system and the arm-driven system.

[0019] Figure 7 This is a schematic diagram showing the structure of a micro-motion drive system.

[0020] Figure 8 This is a front view showing the appearance of the measuring device.

[0021] Figure 9 It is a block diagram representing the structure of the measuring device.

[0022] Figure 10 This is a block diagram representing another structure of the measuring device.

[0023] Figure 11 This is a schematic diagram illustrating a specific example of a workpiece processed by a processing device.

[0024] Figure 12 This is a flowchart illustrating an example of a processing procedure.

[0025] Figure 13 This is a three-dimensional diagram representing the exposure area SA.

[0026] Figure 14 This is a schematic diagram showing a machining head located in a position where machining light cannot be irradiated onto the area of ​​the workpiece.

[0027] Figure 15 This is a schematic diagram showing a machining head located in a position that can irradiate the area of ​​the workpiece with machining light.

[0028] Figure 16 This is a plan view showing an example of a workpiece mark formed in multiple exposure areas.

[0029] Figure 17 This is a system structure diagram showing the system structure of the processing system in the second embodiment.

[0030] Figure 18 This is a system structure diagram showing the system structure of the processing system in the third embodiment.

[0031] Figure 19 This is a system structure diagram showing the system structure of the processing system in the fourth embodiment.

[0032] Figure 20 This is a system structure diagram showing the system structure of the processing system in the fifth embodiment.

[0033] Figure 21 This is a front view showing the appearance of the processing apparatus of the processing system according to the fifth embodiment.

[0034] Figure 22 This is a system structure diagram showing the system structure of the processing system according to the sixth embodiment.

[0035] Figure 23 This is a plan view showing the arrangement of multiple processing devices in the processing system of the sixth embodiment.

[0036] Figure 24 This is a system structure diagram showing the system structure of the processing system according to the seventh embodiment.

[0037] Figure 25 This is a plan view showing the arrangement of multiple processing devices in the processing system of the seventh embodiment.

[0038] Figure 26 This is a cross-sectional view showing an example of a machining head including an end effector.

[0039] [Explanation of Symbols]

[0040] 1, 1b~1e, 1#1~1#n, 1#1-1~1#1-n1, 1#2-1~1#2-n2: Processing equipment

[0041] 2, 2#1, 2#2: Measuring devices

[0042] 3: Control device

[0043] 11: Processing Light Source

[0044] 12, 12#1, 12'#1, 12#2, 12'#2, 231: Measuring light source

[0045] 13, 13h: Processing head

[0046] 14, 14e: Head drive system

[0047] 15: Filming equipment

[0048] 15b: Distance meter

[0049] 16c: Satellite positioning device

[0050] 16d: Gyroscope sensor

[0051] 111, 121: Optical transmission components

[0052] 131: Processing optical systems

[0053] 132: Measurement Optical System

[0054] 133: Synthetic Optical Systems

[0055] 134: Objective lens optical system

[0056] 135: Head frame

[0057] 136: Reflector

[0058] 136h: End effector

[0059] 141: Self-driving system

[0060] 141e: Flight propulsion system

[0061] 142: Arm Drive System

[0062] 143: Micro-motion drive system

[0063] 144: Power Supply

[0064] 210: Base

[0065] 220: Casing

[0066] 221: Ejection port

[0067] 230, 230': Optical components

[0068] 232: Pointing beam source

[0069] 233, 234, 235, 1321, 1321', 1322, 1322', 1324, 1324', 1331: Beam splitters

[0070] 236, 1320, 1320', 1325, 1325', 1327: Mirror

[0071] 237: Optical Circuit

[0072] 238, 1323, 1323', 1326, 1326': Detectors

[0073] 1311: Position Adjustment Optical System

[0074] 1312: Angle Adjustment Optical System

[0075] 1313: Concentration Position Adjustment Optical System

[0076] 1328, 1328', 1341, 1341': galvanometer mirror

[0077] 1328X, 1328X', 1341X, 1341X': X-ray scanning mirror

[0078] 1328Y, 1328Y', 1341Y, 1341Y': Y-scan mirror

[0079] 1342, 1342': fθ lens

[0080] 1411: Cart

[0081] 1412: Motor

[0082] 1420: Base

[0083] 1421: Robotic Arm

[0084] 1422: Arm Component

[0085] 1423: Joint component

[0086] 1424: Actuator

[0087] 1425: Forearm component

[0088] 1431, 1432: Supporting components

[0089] 1433: Air Spring

[0090] 1434: Damper component

[0091] 1435: Driving component

[0092] 1436: Pressure gauge

[0093] 1437: Position measuring device

[0094] 14361: Gas supply device

[0095] 14362:Piping

[0096] 14363: Valve

[0097] 14371: Testing Department

[0098] 14372: Scale Department

[0099] AX, AX': Optical axis

[0100] B: Directing beam

[0101] EL: Processing light

[0102] ML1、ML2、ML2#1、ML2#1-1、ML2#1-2、ML2#1-3、ML2#2、ML2#2-1、ML2#2-2、ML2#2-3、ML3、ML3#1、ML3#1-1、ML3#1-2、ML3#1-3、ML3#2、ML3#2-1、ML3#2-2、ML3#3-3: Measuring light

[0103] ML4: Return Light

[0104] MSP, MSP#1, MSP#2: Measurement Space

[0105] PSA: Exposure area of ​​the workpiece

[0106] PSP, PSP#1, PSP#1-1, PSP#1-2, PSP#1-n1, PSP#2, PSP#2-1, PSP#2-2, PSP#2-n2, PSP#n: Processing space

[0107] S10~S18: Steps

[0108] SA: Exposure Zone

[0109] SM: Supporting Components

[0110] SS: Support surface

[0111] SYS, SYSa, SYSb, SYSc, SYSd, SYSe, SYSf, SYSg: Machining systems

[0112] W: Workpiece

[0113] W136: Reflector

[0114] WM: Workpiece Marking

[0115] WMG: Marker Group

[0116] WP#1, WP#1-1, WP#1-2, WP#1-n1, WP#1-n2, WP#2, WP#2-1, WP#2-2, WP#n: Area Detailed Implementation

[0117] Hereinafter, embodiments of the machining system will be described with reference to the accompanying drawings. The following describes an embodiment of the machining system using a machining system SYS that uses a machining light EL to machine a workpiece W (i.e., performs machining processing on the workpiece W). However, the present invention is not limited to the embodiments described below.

[0118] Furthermore, in the following explanation, the positional relationships of the various constituent elements constituting the machining system SYS will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. Additionally, for ease of explanation, the X-axis and Y-axis directions will be assumed to be horizontal (i.e., defined directions within the horizontal plane), and the Z-axis direction will be assumed to be vertical (i.e., a direction orthogonal to the horizontal plane, essentially a vertical direction). Hereinafter, the coordinate system with horizontal X-axis and Y-axis directions and vertical Z-axis direction will be referred to as the reference coordinate system used as the reference in the machining system SYSa. In the following explanation, unless otherwise specified, X-axis, Y-axis, and Z-axis may also refer to the X-axis, Y-axis, and Z-axis in the reference coordinate system, respectively. Furthermore, the rotational directions (in other words, tilting directions) about the X-axis, Y-axis, and Z-axis will be referred to as the θX direction, θY direction, and θZ direction, respectively.

[0119] (1) The machining system SYSa in the first embodiment

[0120] First, the machining system SYS of the first embodiment (hereinafter, the machining system SYS of the first embodiment will be referred to as "machining system SYSa") will be described.

[0121] (1-1) Structure of the machining system SYSa

[0122] First, refer to Figure 1 as well as Figure 2 The structure of the processing system SYSa in the first embodiment will be explained. Figure 1 This is a side view schematically showing the appearance of the machining system SYSa according to the first embodiment. Figure 2 This is a system structure diagram showing the system structure of the processing system SYSa in the first embodiment.

[0123] like Figure 1 as well as Figure 2As shown, the machining system SYSa includes a machining device 1, a measuring device 2, and a control device 3.

[0124] The processing device 1 can process the workpiece W under the control of the control device 3. The workpiece W is an object processed by the processing device 1. The workpiece W can be, for example, metal, alloy (e.g., duralumin), semiconductor (e.g., silicon), resin, composite material such as carbon fiber reinforced plastic (CFRP), coating (for example, a coating layer applied to a substrate), glass, or any other material.

[0125] The workpiece W is positioned on the support surface SS. For example... Figure 1 As shown, the workpiece W can also be positioned on the support surface SS via a support member SM that supports the workpiece on the support surface SS. Alternatively, the workpiece W can be directly positioned on the support surface SS. Since the workpiece W can also be positioned on the support surface SS, the support surface SS can also be referred to as the positioning surface.

[0126] The processing apparatus 1 irradiates a processing light EL onto the workpiece W in order to process the workpiece W. The processing light EL can be any type of light as long as it can process the workpiece W by irradiating it. In the first embodiment, an example using a laser as the processing light EL is used for explanation. However, the processing light EL can also be a different type of light than a laser. Furthermore, the wavelength of the processing light EL can be any wavelength as long as it can process the workpiece W by irradiating it. For example, the processing light EL can be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL can also include pulsed light (e.g., pulsed light with a emission time of less than picoseconds). Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL can also be continuous light.

[0127] The processing apparatus 1 can also perform a removal process by irradiating the workpiece W with a processing light EL to remove a portion of the workpiece W. During the removal process, the processing apparatus 1 may also form a rib structure on the workpiece W. The rib structure may also include a structure capable of reducing the surface resistance of the workpiece W to the fluid (especially at least one of frictional resistance and turbulent frictional resistance). The rib structure may also include a structure capable of reducing noise generated when the fluid moves relative to the surface of the workpiece W. The rib structure may also include, for example, a plurality of grooves extending along a first direction (e.g., the Y-axis direction) along the surface of the workpiece W and arranged along a second direction (e.g., the X-axis direction) intersecting the first direction. Furthermore, the fluid referred to herein refers to a medium (e.g., at least one of gas and liquid) that flows relative to the surface of the workpiece W. For example, when the medium itself is stationary and the surface of the workpiece W moves relative to the medium, the medium may also be referred to as a fluid. Additionally, the stationary state of the medium may also refer to a state in which the medium does not move relative to a predetermined reference object (e.g., a support surface SS or a ground surface).

[0128] In the case of removal processing, the machining system SYSa can also form arbitrary structures of arbitrary shapes on the surface of the workpiece W. As an example of an arbitrary structure, a structure that generates vortices in the flow of fluid on the surface of the workpiece W can be listed. As another example of an arbitrary structure, a structure used to impart hydrophobicity to the surface of the workpiece W can be listed. As yet another example of an arbitrary structure, a micro-nanoscale fine texture structure (typically an uneven structure) formed regularly or irregularly can be listed. The fine texture structure may also include at least one of a sharkskin structure and a dimple structure that reduces resistance caused by fluids (gases and / or liquids). The fine texture structure may also include a lotus surface structure that has at least one of hydrophobic and self-cleaning functions (e.g., exhibiting a lotus effect). The fine texture structure may also include at least one of the following: a fine protrusion structure with liquid transport function (refer to U.S. Patent Publication No. 2017 / 0044002); a texture structure with hydrophilic function; a texture structure with anti-fouling function; a moth-eye structure with at least one of reflectivity reduction and hydrophobic functions; a texture structure that enhances light of a specific wavelength through interference to produce structural color; a pillar array structure with adhesive function utilizing van der Waals forces; a texture structure with aerodynamic noise reduction function; a honeycomb structure with droplet trapping function; a texture structure that improves adhesion to layers formed on the surface; and a texture structure for reducing frictional resistance. Here, the fine texture structure may not have a specific function. Furthermore, the machining system SYSa may also smooth the surface of the workpiece W. Here, surface smoothing may also refer to machining the surface to make the machined surface smoother than the unmachined surface. Moreover, the machining system SYSa may also remove burrs present on the surface of the workpiece W.

[0129] The processing apparatus 1 can also perform additive processing, in addition to or replacing removal processing, by irradiating the workpiece W with processing light EL to add new structures to the workpiece W. In this case, the processing apparatus 1 can also form the rib structure on the surface of the workpiece W by performing additive processing. The processing apparatus 1 can also perform marking processing, in addition to or replacing at least one of removal processing and additive processing, by irradiating the workpiece W with processing light EL to form desired marks on the surface of the workpiece W.

[0130] The processing apparatus 1 can then measure the workpiece W under the control of the control device 3. The processing apparatus 1 illuminates the workpiece W with a measuring light ML2 to measure the workpiece W. The measuring light ML2 can be any type of light as long as it can measure the workpiece W by illuminating it. In the first embodiment, an example using a laser as the measuring light ML2 is used for illustration. However, the measuring light ML2 can also be a different type of light than a laser. Furthermore, the wavelength of the measuring light ML2 can be any wavelength as long as it can measure the workpiece W by illuminating it. For example, the measuring light ML2 can be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The measuring light ML2 can also include pulsed light (e.g., pulsed light with a emission time of less than picoseconds). Alternatively, the measuring light ML2 may not include pulsed light. In other words, the measuring light ML2 can also be continuous light.

[0131] The wavelength of the measuring light ML2 can also differ from the wavelength of the processing light EL. For example, the wavelength of the measuring light ML2 can be shorter than that of the processing light EL. As an example, the measuring light ML2 can use a wavelength of 266 nm or 355 nm, while the processing light EL can use a wavelength of 532 nm, 1 μm, or 10 μm. In this case, the spot size of the measuring light ML2 on the workpiece W is smaller than the spot size of the processing light EL on the workpiece W. As a result, the measurement resolution using the measuring light ML2 is higher than the processing resolution using the processing light EL. Furthermore, processing resolution can also refer to the limit of the fineness of the processing performed using the processing light EL (e.g., the smallest machinable size). Measurement resolution can also refer to the limit of the fineness of the measurement performed using the measuring light ML2 (e.g., the smallest measurable size). However, the wavelength of the measuring light ML2 can also be no shorter than the wavelength of the processing light EL. The wavelength of the measuring light ML2 can also be the same as that of the processing light EL.

[0132] Alternatively, the processing apparatus 1 can use the measuring light ML2 to measure the state of the workpiece W. The state of the workpiece W can also include its position. The position of the workpiece W can also include the position of its surface. The position of the workpiece W's surface can also include the position of each facet portion subdivided from the surface of the workpiece W in at least one of the X-axis, Y-axis, and Z-axis directions. The position of the workpiece W's surface can also include the position of each facet portion subdivided from the surface of the workpiece W in at least one of the θX, θY, and θZ directions. That is, the processing apparatus 1 can also use the measuring light ML2 to measure the position of the workpiece W in at least one of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. Here, the position of the workpiece W in at least one of the θX, θY, and θZ directions can also be referred to as the posture of the workpiece W. Furthermore, the position of each surface portion in at least one of the θX, θY, and θZ directions can also be considered equivalent to the orientation of each surface portion (i.e., the direction of each surface portion (e.g., the direction of the normal to each surface portion), which is substantially equivalent to the amount of inclination of each surface portion relative to at least one of the X-axis, Y-axis, and Z-axis). Additionally, the amount of inclination of each surface portion mentioned here can also refer to the angle formed by at least one of the X-axis, Y-axis, and Z-axis with the normal to each surface portion. In this case, the state of the workpiece can also substantially include the shape (e.g., three-dimensional shape) of the workpiece W. Moreover, the state of the workpiece W can also include the size of the workpiece W (e.g., the size in at least one of the X-axis, Y-axis, and Z-axis directions). Furthermore, the processing apparatus 1 can use the measuring light ML2 to measure the characteristics of the workpiece W. The characteristics of the workpiece W can also include the surface roughness of the workpiece W's surface. Surface roughness can also refer to the surface roughness defined in ISO 25178. The characteristics of the workpiece W can also include at least one of the reflectivity of the workpiece W to light of a specified wavelength. Furthermore, the reflectivity of workpiece W to light of a specified wavelength can also refer to the ratio of the luminous flux of light of a specified wavelength reflected by workpiece W to the luminous flux of light of a specified wavelength incident on workpiece W. Here, the reflectivity of workpiece W can also include the reflectivity for each wavelength. That is, the characteristics of workpiece W can also include the color of workpiece W. In addition, the color of workpiece W can also refer to the visual perception (color perception or white stimulus) perceived through the composition of light from the surface of workpiece W (i.e., the wavelength composition of light from the surface of workpiece W).

[0133] In order to process and measure the workpiece W, the processing device 1 includes: a processing light source 11 that generates processing light EL, a measuring light source 12 that generates measuring light ML2, a processing head 13, a head driving system 14, and an imaging device 15.

[0134] The machining head 13 illuminates the workpiece W with machining light EL from machining light source 11 and measurement light ML2 from measurement light source 12. Therefore, the machining head 13 can also be referred to as an illumination device. To illuminate the workpiece W with machining light EL and measurement light ML2, the machining head 13 includes a machining optical system 131, a measurement optical system 132, a combining optical system 133, and an objective lens optical system 134. The machining head 13 illuminates the workpiece W with machining light EL via the machining optical system 131, the combining optical system 133, and the objective lens optical system 134. Therefore, the machining head 13 can also be considered as machining the workpiece W via the machining optical system 131, the combining optical system 133, and the objective lens optical system 134. In this case, the optical system including the machining optical system 131, the combining optical system 133, and the objective lens optical system 134 can also be considered as functioning as an illumination optical system for illuminating the workpiece W with machining light EL. Furthermore, the processing head 13 illuminates the workpiece W with the measuring light ML2 via the measuring optical system 132, the synthesizing optical system 133, and the objective lens optical system 134. Therefore, the processing head 13 can also be considered as measuring the workpiece W via the measuring optical system 132, the synthesizing optical system 133, and the objective lens optical system 134. In this case, the optical system including the measuring optical system 132, the synthesizing optical system 133, and the objective lens optical system 134 can also be considered as an illumination optical system for illuminating the workpiece W with the measuring light ML2. Further details regarding the structure of the processing head 13 will be provided with reference to... Figure 4 This will be explained in detail later.

[0135] The head drive system 14 moves the machining head 13. Specifically, the head drive system 14 moves the machining head 13 relative to the workpiece W. Therefore, the head drive system 14 can also be referred to as a moving device. To move the machining head 13, the head drive system 14 includes a self-driving system 141, an arm drive system 142, and a micro-motion drive system 143. However, the head drive system 14 may not include at least one of the self-driving system 141, the arm drive system 142, and the micro-motion drive system 143. The head drive system 14, referred to as the moving device, moves the machining head 13, thereby moving the end optical element (specifically, the magnification optical element at the very end of a plurality of optical elements arranged in the optical path of the machining light EL, such as the fθ lens 1342 described later) provided on the machining head 13. Furthermore, regarding the structures of the self-driving system 141, the arm drive system 142, and the micro-motion drive system 143 respectively, refer to Figures 6 to 7 The details will be provided later. However, a brief overview of the self-propelled drive system 141, the arm drive system 142, and the micro-motion drive system 143 will be given below.

[0136] The self-propelled drive system 141 is capable of moving independently on the support surface SS that supports or positions the workpiece W. Furthermore, the phrase "the state in which the self-propelled drive system 141 moves independently on the support surface SS" can also refer to the state in which the self-propelled drive system 141 moves relative to the support surface SS using power generated by the self-propelled drive system 141 itself. In the self-propelled drive system 141, the machining head 13 is connected (in other words, coupled or linked) via the arm drive system 142 and the micro-motion drive system 143. Therefore, the self-propelled drive system 141 moves the machining head 13 independently. Therefore, the self-propelled drive system 141 can also be referred to as a moving device or a self-propelled device.

[0137] The arm drive system 142 is a drive system that functions as a robotic arm. A processing head 13 is connected to the arm drive system 142 via a micro-motion drive system 143. The arm drive system 142 moves the processing head 13 by moving like a robotic arm. Therefore, the arm drive system 142 can also be referred to as a moving device.

[0138] The arm drive system 142 can move the machining head 13 with a smaller travel distance than the self-driving system 141. In other words, the self-driving system 141 can also move the machining head 13 with a larger travel distance than the arm drive system 142. Furthermore, travel distance can also refer to the maximum amount of movement in one direction. However, the arm drive system 142 can also move the machining head 13 with the same or larger travel distance as the self-driving system 141. On the other hand, the movement accuracy (in other words, movement resolution) of the arm drive system 142 towards the machining head 13 can be higher than that of the self-driving system 141. In other words, the movement accuracy of the self-driving system 141 towards the machining head 13 can also be lower than that of the arm drive system 142. Furthermore, movement accuracy (movement resolution) can also refer to the limit of the fineness of movement (e.g., the minimum amount of movement). However, the movement accuracy of the arm drive system 142 towards the machining head 13 can be the same as, or lower than, that of the self-driving system 141. Additionally, as... Figure 1 As shown, the processing head 13 is connected to the arm drive system 142, which can function as a robotic arm, and therefore can also be called an end effector.

[0139] The micro-motion drive system 143 moves (in other words, drives) the machining head 13 with a smaller travel distance than the arm drive system 142. Therefore, the micro-motion drive system 143 can also be referred to as a moving device or a driving device. On the other hand, the movement accuracy of the micro-motion drive system 143 towards the machining head 13 is higher than that of the arm drive system 142. Therefore, in the first embodiment, as detailed below, the machining system SYSa can also use the self-driving system 141 and the arm drive system 142 to align the machining head 13 relative to the workpiece W with relatively coarse or low accuracy. Subsequently, the machining system SYSa can also use the micro-motion drive system 143 to align the machining head 13 relative to the workpiece W with relatively fine or high accuracy.

[0140] The head drive system 14 may also include a power supply 144. Additionally, Figure 1 In the example shown, power supply 144 is configured in self-driving system 141, but the configuration location of power supply 144 is not limited to... Figure 1 The location is shown. Power supply 144 can also supply power to self-driving system 141 for moving machining head 13. Power supply 144 can also supply power to arm drive system 142 for moving machining head 13. Power supply 144 can also supply power to micro-motion drive system 143 for moving machining head 13. Power supply 144 can also supply power to at least one of self-driving system 141, arm drive system 142, and micro-motion drive system 143 via power cables. Power supply 144 can also supply power to at least one of self-driving system 141, arm drive system 142, and micro-motion drive system 143 using a contactless power supply method (in other words, a wireless power supply method). Power supply 144 can also be charged by power supplied externally via a charging cable. Power supply 144 can also be charged by power supplied externally via a contactless power supply method (in other words, a wireless power supply method).

[0141] The self-driving system 141, the arm driving system 142, and the micro-motion driving system 143 move the machining head 13 along at least one of the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis, respectively. Furthermore, moving the machining head 13 along at least one of the θX-axis, θY-axis, and θZ-axis can also be considered equivalent to changing the posture of the machining head 13 about at least one of the X-axis, Y-axis, and Z-axis.

[0142] When the processing head 13 moves, the positional relationship between the processing head 13 and the workpiece W changes. Furthermore, when the positional relationship between the workpiece W and the processing head 13 changes, the positional relationship between the workpiece W and at least one of the optical systems included in the processing head 13 (i.e., the processing optical system 131, the measuring optical system 132, the combining optical system 133, and the objective lens optical system 134) changes. Consequently, when the positional relationship between the workpiece W and the processing head 13 changes, the illumination positions of the processing light EL and the measuring light ML2 on the workpiece W change. Therefore, moving the processing head 13 is equivalent to changing the illumination positions of the processing light EL and the measuring light ML2 on the workpiece W. Moving the processing head 13 can also be considered equivalent to changing the focusing positions of the processing light EL and the measuring light ML2 relative to the workpiece W.

[0143] The imaging device 15 is configured (i.e., mounted or fixed) on the processing head 13. Therefore, the imaging device 15 is configured in a fixed position relative to the processing head 13. Since the processing head 13 includes the aforementioned optical systems, the imaging device 15 can also be considered as being configured in a fixed position relative to the optical systems included in the processing head 13. As described above, when the head drive system 14 moves the processing head 13, the imaging device 15 mounted on the processing head 13 also moves. Therefore, the head drive system 14 can also be considered as functioning as a moving device that moves the imaging device 15. Alternatively, the head drive system 14 can also be considered as functioning as a moving device that moves the processing head 13 and the imaging device 15 together. Alternatively, the imaging device 15 can also be configured on a component other than the processing head 13. In this case, the imaging device 15 can also be configured in a fixed position relative to the processing head 13.

[0144] The imaging device 15 can photograph the workpiece W. For example, the imaging device 15 can also illuminate the workpiece W using an illumination light ML1, which is called a measuring light, and photograph the workpiece W illuminated by the illumination light ML1. Alternatively, the imaging device 15 can also photograph the workpiece W illuminated by ambient light (or illumination light emitted by a device other than the imaging device 15) without illuminating the workpiece W using the illumination light ML1.

[0145] The imaging device 15 may also photograph the workpiece W without passing through at least a portion of the optical systems included in the processing head 13. Furthermore, "photographing the workpiece W without passing through at least a portion of the optical systems" can also mean "photographing the workpiece W without receiving light from the workpiece W that has passed through at least a portion of the optical systems." "Photographing the workpiece W without passing through at least a portion of the optical systems" can also mean "photographing the workpiece W by receiving light from the workpiece W that has not passed through at least a portion of the optical systems." For example, the imaging device 15 may also photograph the workpiece W without passing through the processing optical system 131, the measuring optical system 132, the combining optical system 133, and the objective lens optical system 134. For example, the imaging device 15 may also photograph the workpiece W without passing through at least the fθ lens 1342.

[0146] The imaging device 15 measures the position of the workpiece W by photographing it. Therefore, the imaging device 15 can also be referred to as a measuring device. Furthermore, when the imaging device 15 photographs the workpiece W without passing through at least a portion of the optical systems of the processing head 13, as described above, the imaging device 15 can also be considered as a measuring device that measures the position of the workpiece W without passing through at least a portion of the optical systems of the processing head 13. Additionally, "measuring the position of the workpiece W without passing through at least a portion of the optical systems" can also mean "measuring the position of the workpiece W without using light from the workpiece W that has passed through at least a portion of the optical systems." "Measuring the position of the workpiece W without passing through at least a portion of the optical systems" can also mean "measuring the position of the workpiece W using light from the workpiece W that has not passed through at least a portion of the optical systems."

[0147] Specifically, the image of the workpiece W captured by the imaging device 15 (hereinafter referred to as the "workpiece image") is output from the imaging device 15 to the control device 3. The control device 3 calculates the position of the workpiece W by analyzing the workpiece image. For example, the control device 3 calculates the position of the workpiece W in at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction by analyzing the workpiece image. In this case, it can be said that the imaging device 15 uses a different method to measure the position of the workpiece W than the method described above that uses measuring light ML2 to measure the position of the workpiece W. For example, it can be said that the imaging device 15 measures the position of the workpiece W optically without using the optical systems included in the processing head 13.

[0148] Since the imaging device 15 is mounted on the processing head 13, the imaging device 15 can also measure the position of the workpiece W in the head coordinate system defined with reference to the processing head 13. That is, the control device 3 can also calculate the position of the workpiece W in the head coordinate system based on the workpiece image captured by the imaging device 15. In addition, the head coordinate system can also be a coordinate system as described below, that is, the coordinate system along the optical axis of the objective lens optical system 134 included in the processing head 13 (especially the optical axis AX of the fθ lens 1342 described later, refer to...) Figure 4 The Z-axis is defined by the axis of the machining head 13, and the X-axis and Y-axis are defined by two axes orthogonal to the optical axis AX of the fθ lens 1342. That is, the head coordinate system is a coordinate system defined within the reference coordinate system by specifying the three coordinate axes relative to the position and orientation of the machining head 13 within the reference coordinate system, corresponding to the position (including orientation) of the machining head 13. However, since the machining head 13 moves within the reference coordinate system via the head drive system 14, the position of the machining head 13 within the reference coordinate system is known information to the control device 3. Therefore, the control device 3 can convert the coordinates of the reference coordinate system to the coordinates of the head coordinate system based on the position of the machining head 13 within the reference coordinate system, and vice versa. Therefore, the action of measuring the position of the workpiece W (or, any object) within the head coordinate system can also be considered substantially equivalent to the action of measuring the position of the workpiece W (or, any object) within the reference coordinate system.

[0149] Furthermore, as described later, the machining head 13 illuminates the workpiece W with a measuring light ML2 traveling along the optical axis AX of the fθ lens 1342. Therefore, the head coordinate system can also be a coordinate system where the axis along the travel direction (i.e., the illumination direction) of the measuring light ML2 is taken as the Z-axis, and two axes orthogonal to the travel direction of the measuring light ML2 are taken as the X-axis and Y-axis. Moreover, as described later, the machining head 13 illuminates the workpiece W with a machining light EL traveling along the optical axis AX of the fθ lens 1342. Therefore, the head coordinate system is a coordinate system where the axis along the travel direction (i.e., the illumination direction) of the machining light EL is taken as the Z-axis, and two axes orthogonal to the travel direction of the machining light EL are taken as the X-axis and Y-axis.

[0150] To measure the position of workpiece W, the imaging device 15 may also capture images of feature points of workpiece W. These feature points may include portions of workpiece W located at characteristic positions. For example, a characteristic position may correspond to at least one of the following: a corner of workpiece W, an end of workpiece W, the center of workpiece W, and the boundary between an area processed by optical laser (EL) and an area not processed by optical laser (EL). The feature points of workpiece W may also include portions of workpiece W with characteristic shapes. These characteristic shapes may include at least one of a convex shape protruding from the surrounding area and a concave shape recessed from the surrounding area. In this case, the control device 3 can also calculate the position of workpiece W in the head coordinate system by calculating the positions of feature points within the workpiece image. For example, the control device 3 can calculate the position of workpiece W in any one of the X-axis, Y-axis, and θZ directions in the head coordinate system by calculating the position of one feature point within the workpiece image. For example, the control device 3 can also calculate the position of workpiece W in any two of the X-axis, Y-axis, and θZ directions in the head coordinate system by calculating the positions of two feature points within the workpiece image. For example, the control device 3 can also calculate the position of the workpiece W in the X-axis direction, Y-axis direction, and θZ direction in the head coordinate system by calculating the positions of three or more feature points in the workpiece image.

[0151] The imaging device 15 can also capture images of a mark formed on the workpiece W (hereinafter referred to as "workpiece mark WM") for measuring the position of the workpiece W. Furthermore, since the workpiece mark WM is a mark formed on the object of the workpiece W, it can also be called an object mark. An example of the workpiece mark WM is shown below. Figure 3 .like Figure 3 As shown, for workpiece W, a mark group WMG containing at least three workpiece marks WM with a defined positional relationship can also be formed on the surface of workpiece W. At this time, the imaging device 15 can also capture the mark group WMG (i.e., at least three workpiece marks WM). At this time, the control device 3 can also calculate the position of workpiece W in any one of the X-axis, Y-axis, and θZ directions in the head coordinate system by calculating the position of one workpiece mark WM in the workpiece image. The control device 3 can also calculate the position of workpiece W in any two of the X-axis, Y-axis, and θZ directions in the head coordinate system by calculating the positions of two workpiece marks WM in the workpiece image. The control device 3 can also calculate the position of workpiece W in each of the X-axis, Y-axis, and θZ directions in the head coordinate system by calculating the positions of three or more workpiece marks WM in the workpiece image. Furthermore, the control device 3 can also calculate the position of workpiece W in each of the Z-axis, θX, and θY directions in the head coordinate system by calculating at least one of the shapes and sizes of the at least three workpiece marks WM in the workpiece image.

[0152] Again in Figure 1 as well as Figure 2 In this embodiment, the measuring device 2 is capable of measuring the position of the machining head 13. Therefore, the measuring device 2 can also be referred to as a position measuring device. Specifically, the measuring device 2 is capable of measuring the position of the machining head 13 in at least one of the following directions: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis. Here, the position of the machining head 13 in at least one of the θX-axis, θY-axis, and θZ-axis directions can also be referred to as the orientation of the machining head 13. Furthermore, the structure of the measuring device 2 itself will be referred to later. Figure 7 as well as Figure 8 The details will be explained in more detail. However, a brief overview of the operation of measuring device 2 will be provided below.

[0153] To measure the position of the machining head 13, the measuring device 2 may also use a measuring light ML3. Specifically, the measuring device 2 may also illuminate the machining head 13 with the measuring light ML3 and detect the measuring light ML3 from the machining head 13 (i.e., the reflected light from the measuring light ML3 from the machining head 13), thereby measuring the position of the machining head 13. The reflected light from the measuring light ML3 from the machining head 13 may also include at least one of the light reflected from the machining head 13 and the light scattered from the machining head 13.

[0154] To illuminate the machining head 13 with the measuring light ML3, the measuring device 2 can also be positioned away from the machining head 13. Furthermore, "away from the machining head 13" can refer to at least one of the following: a position different from the position of the machining head 13, or a position where there is space between the measuring device 2 and the machining head 13. For example, the measuring device 2 can also be positioned away from the machining head 13 to a degree that allows the distance from the measuring device 2 to the machining head 13 to be longer than the distance from the machining head 13 to the workpiece W. In other words, the measuring device 2 can also be positioned away from the machining head 13 to a degree that allows the distance from the machining head 13 to the workpiece W to be shorter than the distance from the measuring device 2 to the machining head 13. In this case, the measuring device 2 can also illuminate the machining head 13 with the measuring light ML3 from the position away from the machining head 13. The measuring device 2 can also detect the return light of the measuring light ML3 from the machining head 13 at the position away from the machining head 13.

[0155] The measuring device 2 can also illuminate the measuring light ML3 toward any part of the processing head 13 to detect the measuring light ML3 from any part of the processing head 13. Alternatively, the measuring device 2 can also illuminate the measuring light ML3 toward a reflector 136 included in the processing head 13 that reflects (typically recursively reflects) the measuring light ML3, and detect the measuring light ML3 from the reflector 136. The reflector 136 can also be configured in a fixed position relative to the processing head 13. The reflector 136 can also be configured in a position where its positional relationship with the processing head 13 does not change. Typically, the reflector 136 can also be configured on the processing head 13 (e.g., the head frame 135 that constitutes the appearance of the processing head 13). In this case, the measuring device 2 will measure the position of the reflector 136. However, since the reflector 136 is configured in a fixed position relative to the processing head 13, the action of measuring the position of the reflector 136 can also be considered equivalent to the action of measuring the position of the processing head 13. Alternatively, a tooling ball may be used in addition to or in place of the recursive reflector 136.

[0156] The measuring device 2 may measure the position of the workpiece W in addition to or in place of the processing head 13. Specifically, the measuring device 2 may also measure the position of the workpiece W in at least one of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. To measure the position of the workpiece W, the measuring device 2 may also illuminate the workpiece W with a measuring light ML3 and detect the measuring light ML3 from the workpiece W (i.e., the reflected light from the measuring light ML3 from the workpiece W), thereby measuring the position of the workpiece W. The reflected light from the measuring light ML3 from the workpiece W may also include at least one of the reflected light from the workpiece W and the scattered light from the workpiece W.

[0157] To illuminate the workpiece W with the measuring light ML3, the measuring device 2 can also be positioned away from the workpiece W. For example, the measuring device 2 can be positioned such that the distance from the measuring device 2 to the workpiece W is longer than the distance from the machining head 13 to the workpiece W. In other words, the measuring device 2 can also be positioned such that the distance from the machining head 13 to the workpiece W is shorter than the distance from the measuring device 2 to the workpiece W. In this case, the measuring device 2 can also illuminate the workpiece W with the measuring light ML3 from the position away from the workpiece W. The measuring device 2 can also detect the return light of the measuring light ML3 from the workpiece W at the position away from the machining head 13, thereby measuring the position of the workpiece W.

[0158] The measuring device 2 can also illuminate the measuring light ML3 towards any part of the workpiece W and detect the measuring light ML3 from any part of the workpiece W. Alternatively, the measuring device 2 can also illuminate the measuring light ML3 towards a reflector W136 disposed on the workpiece W and capable of reflecting (typically recursively reflecting) the measuring light ML3, and detect the measuring light ML3 from the reflector W136. The reflector W136 can also be disposed in a fixed position relative to the workpiece W. The reflector W136 can also be disposed in a position where its positional relationship with the workpiece W will not change. Typically, the reflector W136 can also be disposed on the workpiece W. In this case, the measuring device 2 will measure the position of the reflector W136. However, since the reflector W136 is disposed in a fixed position relative to the workpiece W, the action of measuring the position of the reflector W136 can also be considered equivalent to the action of measuring the position of the workpiece W. In addition, a tool ball can be used instead of the recursively reflecting reflector W136 or other alternatives.

[0159] As detailed later, the measurement results obtained by the measuring device 2 (i.e., the position measurement results of at least one of the processing head 13 and the workpiece W using the measuring light ML3) can also be mainly used to control the self-driving system 141 and the arm driving system 142, which have relatively low movement accuracy. On the other hand, the measurement results obtained by the imaging device 15 (i.e., the position measurement results of the workpiece W using the imaging device 15) can also be mainly used to control the micro-motion driving system 143, which has relatively high movement accuracy. The measurement results obtained by the processing head 13 (i.e., the position measurement results of the workpiece W using the measuring light ML2) can also be mainly used to control the galvanometer mirror 1341, which can control the irradiation position (e.g., the focusing position) of the processing light EL with high precision. In this case, the measurement resolution of the measuring device 2 (i.e., the resolution of the position measurement results of at least one of the processing head 13 and the workpiece W using the measuring light ML3) may be lower than the measurement resolution of the imaging device 15 (i.e., the resolution of the position measurement results of the workpiece W using the imaging device 15). The measurement resolution of the measuring device 2 may also be lower than that of the processing head 13 (i.e., the resolution of the position measurement result of the workpiece W using the measuring light ML2). In other words, the measurement resolutions of the imaging device 15 and the processing head 13 may also be higher than that of the measuring device 2.

[0160] Control device 3 controls the operation of machining system SYSa. For example, control device 3 can also set machining conditions for workpiece W and control machining device 1 and measuring device 2 to machine workpiece W according to the set machining conditions. That is, control device 3 can also control the machining of workpiece W. For example, control device 3 can also set measurement conditions for workpiece W and control machining device 1 and measuring device 2 to measure workpiece W according to the set measurement conditions.

[0161] In the first embodiment, the control device 3 can also control the machining device 1 to process the workpiece W based on the measurement results obtained by the imaging device 15, the machining head 13, and the measuring device 2. That is, the machining system SYSa can also process the workpiece W based on the measurement results obtained by the imaging device 15, the machining head 13, and the measuring device 2. Furthermore, regarding the operation of processing the workpiece W based on the measurement results obtained by the imaging device 15, the machining head 13, and the measuring device 2, while referring to... Figure 12 And so on, which will be explained in detail later.

[0162] The control device 3 may also include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a central processing unit (CPU) and a graphics processing unit (GPU). The control device 3 executes a computer program via the computing device, thereby functioning as a device for controlling the actions of the machining system SYSa. The computer program is a computer program used to cause the control device 3 (e.g., the computing device) to perform (i.e., execute) the actions described later that the control device 3 should perform. That is, the computer program is a computer program used to cause the control device 3 to function so that the machining system SYSa performs the actions described later. The computer program executed by the computing device may be recorded in a storage device (i.e., a recording medium) included in the control device 3, or it may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or external to the control device 3. Alternatively, the computing device may download the computer program to be executed from a device external to the control device 3 via a network interface.

[0163] The control device 3 may not be located inside the machining system SYSa. For example, the control device 3 may be located outside the machining system SYSa as a server, etc. In this case, the control device 3 and the machining system SYSa may be connected via wired and / or wireless networks (or data buses and / or communication lines). As a wired network, for example, a network with an interface using a serial bus method, such as at least one of the Institute of Electrical and Electronics Engineers (IEEE) 1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) may be used. As a wired network, a network with an interface using a parallel bus method may also be used. As a wired network, a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T, may also be used. As a wireless network, a network utilizing radio waves may also be used. As an example of a network utilizing radio waves, networks conforming to IEEE 802.1x (such as at least one of a Wireless Local Area Network (LAN) and Bluetooth) can be cited. Infrared networks can also be used as wireless networks. Optical communication networks can also be used as wireless networks. In this case, the control device 3 and the machining system SYSa can be configured to send and receive various information via the network. Furthermore, the control device 3 can also send commands or control parameters to the machining system SYSa via the network. The machining system SYSa may also include a receiving device that receives commands or control parameters from the control device 3 via the network. Alternatively, a first control device performing a portion of the processing performed by the control device 3 can be located inside the machining system SYSa, while a second control device performing another portion of the processing performed by the control device 3 can be located outside the machining system SYSa.

[0164] In addition, as a recording medium for recording computer programs executed by a computing device, at least one of the following may be used: Compact Disc Read Only Memory (CD-ROM), Compact Disc-Recordable (CD-R), Compact Disc Rewritable (CD-RW), floppy disk, Magneto-Optical Disc (MO), Digital Versatile Disc Read Only Memory (DVD-ROM), Digital Versatile Disc Random Access Memory (DVD-RAM), Digital Versatile Disc-Recordable (DVD-R), DVD+R, Digital Versatile Disc-Rewritable (DVD-RW), DVD+RW, and Blu-ray (a registered trademark), magnetic media such as magnetic tape, optical disk, semiconductor memory such as USB memory, and any other media capable of storing programs. The recording medium may also include a machine capable of recording computer programs (e.g., a general-purpose or special-purpose machine with a computer program installed in a state that can be executed in at least one form such as software and firmware). Furthermore, the various processes or functions contained in the computer program may be implemented by logic processing blocks implemented within the control device 3 by executing the computer program through the control device 3 (i.e., the computer), or by hardware such as a specified gate array (FPGA, ASIC) included in the control device 3, or by a form in which logic processing blocks and partial hardware modules that implement a portion of the hardware elements coexist.

[0165] (1-2) Structure of machining head 13

[0166] Then, while referring to Figure 4 Here is an example illustrating the structure of the processing head 13. Figure 4 This is a cross-sectional view showing an example of the structure of the processing head 13.

[0167] like Figure 4 As shown, the processing light EL generated by the processing light source 11 is incident on the processing head 13 via an optical transmission member 111 such as an optical fiber. The processing light source 11 may also be disposed outside the processing head 13. For example, as described above... Figure 1As shown, the processing light source 11 can also be configured within the self-driving system 141. In this case, the light transmission member 111 can extend from the processing light source 11 to the processing head 13 via or along the arm drive system 142. However, the configuration position of the processing light source 11 is not limited to... Figure 1 The configuration position is shown. The processing light source 11 can also be configured at any position outside the processing head 13, or it can be configured inside the processing head 13.

[0168] The processing light source 11 is capable of generating processing light EL. When the processing light EL is a laser, the processing light source 11 may, for example, include a laser diode. Furthermore, the processing light source 11 may also be a light source capable of pulse oscillation. In this case, the processing light source 11 can generate pulsed light (e.g., pulsed light with a emission time of less than picoseconds) as the processing light EL. Additionally, the processing light source 11 may also be a CW light source that generates continuous wave (CW).

[0169] As described above, the processing head 13 includes a processing optical system 131, a measuring optical system 132, a combining optical system 133, and an objective lens optical system 134. The processing optical system 131, measuring optical system 132, combining optical system 133, and objective lens optical system 134 are housed within the head frame 135. However, it is also possible that at least one of the processing optical system 131, measuring optical system 132, combining optical system 133, and objective lens optical system 134 is not housed within the head frame 135.

[0170] The machining optical system 131 is an optical system that allows machining light EL from the machining light source 11 to be incident upon it. The machining optical system 131 is also an optical system that directs the machining light EL incident upon it toward the synthesizing optical system 133. The machining light EL emitted by the machining optical system 131 is then directed onto the workpiece W via the synthesizing optical system 133 and the objective lens optical system 134.

[0171] The processing optical system 131 may, for example, include a position adjustment optical system 1311, an angle adjustment optical system 1312, and a focusing position adjustment optical system 1313. The position adjustment optical system 1311 can adjust the emission position of the processing light EL from the processing optical system 131. The position adjustment optical system 1311 may, for example, include a parallel plane plate that can be tilted relative to the travel direction of the processing light EL, and the emission position of the processing light EL is changed by changing the tilt angle of the parallel plane plate. The angle adjustment optical system 1312 can adjust the emission angle (i.e., emission direction) of the processing light EL from the processing optical system 131. The angle adjustment optical system 1312 may, for example, include a mirror that can be tilted relative to the travel direction of the processing light EL, and the emission angle of the processing light EL is changed by changing the tilt angle of the mirror. The focusing position adjustment optical system 1313 is an optical component capable of adjusting the focusing position of the processing light EL in the travel direction of the processing light EL. The focusing position adjustment optical system 1313 may, for example, include a plurality of lenses arranged along the travel direction of the processing light EL. In this case, the focusing position of the processing light EL is adjusted by moving at least one of the plurality of lenses along its optical axis. Alternatively, the focusing position adjustment optical system 1313 may also include, for example, an optical component (typically a galvanometer lens) that can move the focusing position of the processing light EL in a desired direction by deflecting the processing light EL. However, the processing optical system 131 may also not include at least one of the position adjustment optical system 1311, the angle adjustment optical system 1312, and the focusing position adjustment optical system 1313.

[0172] Processing light EL emitted from processing optical system 131 is incident on combining optical system 133. Combining optical system 133 includes a beam splitter (e.g., a polarizing beam splitter) 1331. Beam splitter 1331 directs the processing light EL incident on beam splitter 1331 toward objective optical system 134. Figure 4 In the example shown, the processing light EL incident on beam splitter 1331 passes through the polarization separation surface of beam splitter 1331, and thus exits towards objective lens optical system 134. Therefore, Figure 4 In the example shown, the processing light EL is incident on the polarization separation surface of the beam splitter 1331 in a state having a polarization direction that can pass through the polarization separation surface (e.g., a polarization direction that is p-polarized relative to the polarization separation surface).

[0173] The processing light EL emitted from the composite optical system 133 is incident on the objective optical system 134. The objective optical system 134 directs the processing light EL incident on it toward the workpiece W. The objective optical system 134 includes a galvanometer lens 1341 and an fθ lens 1342.

[0174] The processing light EL incident on the objective lens optical system 134 is incident on the galvanometer lens 1341. The galvanometer lens 1341 deflects the processing light EL (i.e., changes the exit angle of the processing light EL). By deflecting the processing light EL, the galvanometer lens 1341 changes the focusing position of the processing light EL in the plane intersecting the optical axis AX of the fθ lens 1342 (i.e., along the XY plane in the head coordinate system). Therefore, the galvanometer lens 1341 can also be referred to as a focusing position changing device. Typically, such as Figure 4 As shown, the machining head 13 irradiates the workpiece W with the machining light EL when the optical axis AX of the fθ lens 1342 intersects the surface of the workpiece W. Therefore, when the focusing position of the machining light EL in the plane intersecting the optical axis AX is changed, the irradiation position of the machining light EL on the surface of the workpiece W is changed in the direction along the surface of the workpiece W. That is, the irradiation position of the machining light EL is changed along at least one of the X-axis and Y-axis directions in the head coordinate system. Therefore, the galvanometer lens 1341 can function as an irradiation position changing device that can change the irradiation position of the machining light EL on the surface of the workpiece W along the surface of the workpiece W.

[0175] The galvanometer lens 1341 includes an X-scanning lens 1341X and a Y-scanning lens 1341Y. Both the X-scanning lens 1341X and the Y-scanning lens 1341Y are tilt-angle variable mirrors whose angles relative to the optical path of the machining light EL incident on the galvanometer lens 1341 are altered. The X-scanning lens 1341X deflects the machining light EL to change the illumination position of the machining light EL on the workpiece W along the X-axis direction in the head coordinate system. Alternatively, the X-scanning lens 1341X can rotate or oscillate about the Y-axis in the head coordinate system. The Y-scanning lens 1341Y deflects the machining light EL to change the illumination position of the machining light EL on the workpiece W along the Y-axis direction in the head coordinate system. Alternatively, the Y-scanning lens 1341Y can rotate or oscillate about the X-axis in the head coordinate system.

[0176] Alternatively, the processing optical system 131 may include any deflecting optical component that can deflect the processing light EL, in addition to or in place of the galvanometer mirror 1341. As an example of such a deflecting optical component, a multifaceted mirror having multiple reflecting surfaces at different angles can be cited. The multifaceted mirror can rotate to change the incident angle of the processing light EL relative to a reflecting surface while the processing light EL is irradiated by the reflecting surface, and switch the reflecting surface from which the processing light EL is irradiated among the multiple reflecting surfaces. Furthermore, as another example of such a deflecting optical component, at least one of an acoustic optical element, an electro-optical element, a microelectromechanical system (MEMS) mirror, and a two-dimensional mirror capable of rotating (wobbling) in a biaxial direction can be cited.

[0177] Alternatively, the position of the machining light EL on the surface of the workpiece W may also be altered when the head drive system 14 moves the machining head 13 relative to the workpiece W. Therefore, the machining apparatus 1 may also omit the galvanometer mirror 1341.

[0178] The machining light EL from the galvanometer lens 1341 is incident on the fθ lens 1342. The fθ lens 1342 directs the machining light EL from the galvanometer lens 1341 onto the workpiece W. Specifically, the fθ lens 1342 emits the machining light EL in a direction along the optical axis AX of the fθ lens 1342. As a result, the machining light EL emitted by the fθ lens 1342 travels in a direction along the optical axis AX, thus incident on the workpiece W.

[0179] The fθ lens 1342 focuses the processing light EL from the galvanometer lens 1341 onto the workpiece W. At this time, the processing light EL emitted from the fθ lens 1342 can also illuminate the workpiece W without passing through other optical elements with magnification (in other words, optical components, such as lenses). Since the fθ lens 1342 is the last optical element with magnification among the multiple optical elements arranged in the optical path of the processing light EL (i.e., the optical element closest to the workpiece W), it can also be called the terminal optical element.

[0180] Furthermore, in order for the machining head 13 to irradiate the workpiece W with machining light EL, the machining head 13 only needs to include at least an fθ lens 1342. In this case, the machining light EL can also be incident on the machining head 13 via the machining optical system 131, the synthesizing optical system 133, and the galvanometer lens 1341 disposed outside the machining head 13. The machining head 13 can also irradiate the workpiece W with the machining light EL incident on the machining head 13 via the fθ lens 1342.

[0181] Furthermore, the measurement light ML2 generated by the measurement light source 12 is incident on the processing head 13 via an optical transmission member 121 such as an optical fiber. The measurement light source 12 may also be disposed outside the processing head 13. For example, as described above. Figure 1 As shown, the measuring light source 12 can also be configured within the self-driving system 141. In this case, the light transmission member 121 can extend from the measuring light source 12 to the processing head 13 via or along the arm drive system 142. However, the configuration position of the measuring light source 12 is not limited to... Figure 1 The configuration position is shown. The measuring light source 12 can also be configured at any position outside the processing head 13 (e.g., on the support surface SS), or it can be configured inside the processing head 13.

[0182] The measurement light source 12 may also include an optical comb light source. An optical comb light source is a light source capable of generating light containing frequency components arranged at equal intervals along the frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measurement light source 12 emits pulsed light containing frequency components arranged at equal intervals along the frequency axis as measurement light ML2. However, the measurement light source 12 may also include a light source different from the optical comb light source.

[0183] Figure 4 In the example shown, the machining system SYSa includes multiple measurement light sources 12. For example, the machining system SYSa may also include measurement light source 12#1 and measurement light source 12#2. The multiple measurement light sources 12 emit multiple measurement lights ML2 that are phase-synchronized and interfering with each other. For example, the oscillation frequencies of the multiple measurement light sources 12 may also be different. Therefore, the multiple measurement lights ML2 emitted by the multiple measurement light sources 12 are multiple measurement lights ML2 with different pulse frequencies (e.g., the number of pulses per unit time, which is the reciprocal of the emission period of the pulse). As an example, measurement light source 12#1 may emit measurement light ML2#1 with a pulse frequency of 25 GHz, and measurement light source 12#2 may emit measurement light ML2#2 with a pulse frequency of 25 GHz + α (e.g., +100 kHz). However, the machining system SYSa may also include a single measurement light source 12.

[0184] The measurement light ML2 emitted from the measurement light source 12 is incident on the measurement optical system 132. The measurement optical system 132 is an optical system that directs the measurement light ML2 incident on it toward the synthesis optical system 133. The measurement light ML2 emitted from the measurement optical system 132 is then directed onto the workpiece W via the synthesis optical system 133 and the objective lens optical system 134. That is, in order to measure the workpiece W, the measurement optical system 132 directs the measurement light ML2 onto the workpiece W via the synthesis optical system 133 and the objective lens optical system 134.

[0185] The measuring optical system 132 includes, for example, a mirror 1320, a beam splitter 1321, a beam splitter 1322, a detector 1323, a beam splitter 1324, a mirror 1325, a detector 1326, a mirror 1327, and a galvanometer mirror 1328.

[0186] Measurement light ML2 emitted from measurement light source 12 is incident on beam splitter 1321. Specifically, measurement light ML2 emitted from measurement light source 12#1 (hereinafter referred to as "measurement light ML2#1") is incident on beam splitter 1321. Measurement light ML2 emitted from measurement light source 12#2 (hereinafter referred to as "measurement light ML2#2") is incident on beam splitter 1321 via mirror 1320. Beam splitter 1321 directs the measurement light ML2#1 and ML2#2 incident on beam splitter 1321 toward beam splitter 1322.

[0187] Beam splitter 1322 reflects a portion of the measurement light ML2#1 incident on it, namely measurement light ML2#1-1, toward detector 1323. Beam splitter 1322 emits another portion of the measurement light ML2#1 incident on it, namely measurement light ML2#1-2, toward beam splitter 1324. Beam splitter 1322 reflects a portion of the measurement light ML2#2 incident on it, namely measurement light ML2#2-1, toward detector 1323. Beam splitter 1322 emits another portion of the measurement light ML2#2 incident on it, namely measurement light ML2#2-2, toward beam splitter 1324.

[0188] Measurement beams ML2#1-1 and ML2#2-1 emitted from beam splitter 1322 are incident on detector 1323. Detector 1323 detects the interference light generated by the interference between measurement beams ML2#1-1 and ML2#2-1. Specifically, detector 1323 detects the interference light by receiving it. Therefore, detector 1323 may also include a light-receiving element (a light-receiving section, typically a photoelectric conversion element). The detection result of detector 1323 is output to control device 3.

[0189] Measurement beams ML2#1-2 and ML2#2-2 emitted from beam splitter 1322 are incident on beam splitter 1324. Beam splitter 1324 directs at least a portion of the measurement beams ML2#1-2 incident on beam splitter 1324 toward mirror 1325. Beam splitter 1324 directs at least a portion of the measurement beams ML2#2-2 incident on beam splitter 1324 toward mirror 1327.

[0190] The measurement light ML2#1-2 emitted from beam splitter 1324 is incident on mirror 1325. The measurement light ML2#1-2 incident on mirror 1325 is reflected by the reflecting surface of mirror 1325 (which can also be called the reference surface). Specifically, mirror 1325 reflects the measurement light ML2#1-2 incident on mirror 1325 towards beam splitter 1324. That is, mirror 1325 emits the measurement light ML2#1-2 incident on mirror 1325 as the reflected light, i.e., measurement light ML2#1-3, towards beam splitter 1324. At this time, measurement light ML2#1-3 can also be called reference light. The measurement light ML2#1-3 emitted from mirror 1325 is incident on beam splitter 1324. Beam splitter 1324 emits the measurement light ML2#1-3 incident on beam splitter 1324 towards beam splitter 1322. The measurement light ML2#1-3 emitted from beam splitter 1324 is incident on beam splitter 1322. Beam splitter 1322 then directs the measurement light ML2#1-3 incident on beam splitter 1322 toward detector 1326.

[0191] On the other hand, the measurement light ML2#2-2 emitted from the beam splitter 1324 is incident on the mirror 1327. The mirror 1327 reflects the measurement light ML2#2-2 incident on the mirror 1327 toward the galvanometer mirror 1328. That is, the mirror 1327 emits the measurement light ML2#2-2 incident on the mirror 1327 toward the galvanometer mirror 1328.

[0192] The galvanometer lens 1328 deflects the measuring light ML2#2-2 (i.e., changes the emission angle of the measuring light ML2#2-2). By deflecting the measuring light ML2#2-2, the galvanometer lens 1328 changes the focusing position of the measuring light ML2#2-2 within the plane intersecting the optical axis AX of the fθ lens 1342 (i.e., along the XY plane in the head coordinate system). Typically, as... Figure 4 As shown, with the optical axis AX of the fθ lens 1342 intersecting the surface of the workpiece W, the processing head 13 irradiates the workpiece W with a measuring light ML2#2-2. Therefore, when the focusing position of the measuring light ML2#2-2 within the plane intersecting the optical axis AX is changed, the irradiation position of the measuring light ML2#2-2 on the surface of the workpiece W is changed in the direction along the surface of the workpiece W. That is, the irradiation position of the measuring light ML2#2-2 is changed along at least one of the X-axis and Y-axis directions in the head coordinate system. Therefore, the galvanometer lens 1341 can function as an irradiation position changing device that can change the irradiation position of the measuring light ML2#2-2 on the surface of the workpiece W along the surface of the workpiece W.

[0193] The galvanometer lens 1328 includes an X-scanning lens 1328X and a Y-scanning lens 1328Y. Both the X-scanning lens 1328X and the Y-scanning lens 1328Y are tilt-angle variable mirrors whose angles relative to the optical path of the measuring light ML2#2-2 incident on the galvanometer lens 1328 are altered. The X-scanning lens 1328X deflects the measuring light ML2#2-2 to change the illumination position of the measuring light ML2#2-2 on the workpiece W along the X-axis direction in the head coordinate system. Alternatively, the X-scanning lens 1328X can be rotated or oscillated about the Y-axis in the head coordinate system. The Y-scanning lens 1328Y deflects the machining light EL to change the illumination position of the measuring light ML2#2-2 on the workpiece W along the Y-axis direction in the head coordinate system. Alternatively, the Y-scanning lens 1328Y can be rotated or oscillated about the X-axis in the head coordinate system.

[0194] The measurement light ML2#2-2 from the galvanometer lens 1328 is incident on the synthesizing optical system 133. The beam splitter 1331 of the synthesizing optical system 133 directs the measurement light ML2#2-2 incident on the beam splitter 1331 toward the objective lens optical system 134. Figure 4In the example shown, the measurement light ML2#2-2 incident on the synthetic optics system 133 is reflected at the polarization separation plane and thus exits towards the objective optics system 134. Therefore, Figure 4 In the example shown, the measuring light ML2#2-2 is incident on the polarization separation surface of the beam splitter 1331 in a state having a polarization direction that can be reflected by the polarization separation surface (e.g., the polarization direction of s-polarized light relative to the polarization separation surface).

[0195] Here, as described above, in addition to the measurement light ML2#2-2, the processing light EL is also incident on the beam splitter 1331. That is, both the measurement light ML2#2-2 and the processing light EL pass through the beam splitter 1331. The beam splitter 1331 emits the processing light EL and the measurement light ML2#2-2, which are incident on the beam splitter 1331 from different directions, in the same direction (i.e., towards the same objective lens optical system 134). Therefore, the beam splitter 1331 essentially functions as a combining optical component for combining the processing light EL and the measurement light ML2#2-2.

[0196] Furthermore, when the wavelength of the processing light EL is different from the wavelength of the measurement light ML2, the synthesizing optical system 133 can also replace the beam splitter 1331 and include a dichroic mirror as a synthesizing optical component. In this case, the synthesizing optical system 133 can also use the dichroic mirror to synthesize the processing light EL and the measurement light ML2#2-2 (i.e., the optical path for synthesizing the processing light EL and the optical path for synthesizing the measurement light ML2#2-2).

[0197] The measuring light ML2#2-2 emitted from the beam splitter 1331 is incident on the galvanometer lens 1341. The galvanometer lens 1341 deflects the measuring light ML2#2-2 in the same way as it deflects the machining light EL. Therefore, the galvanometer lens 1341 can change the illumination position of the measuring light ML2#2-2 on the surface of the workpiece W in a direction along the surface of the workpiece W.

[0198] As described above, in addition to the measuring light ML2#2-2, the processing light EL is also incident on the galvanometer lens 1341. That is, the processing light EL synthesized by the beam splitter 1331 and the measuring light ML2#2-2 are incident on the galvanometer lens 1341. Therefore, both the measuring light ML2#2-2 and the processing light EL pass through the same galvanometer lens 1341. Thus, the galvanometer lens 1341 can synchronously change the illumination position of the processing light EL on the workpiece W and the illumination position of the measuring light ML2#2-2 on the workpiece W. In other words, the galvanometer lens 1341 can linkageically change the illumination position of the processing light EL on the workpiece W and the illumination position of the measuring light ML2#2-2 on the workpiece W.

[0199] On the other hand, as described above, the measuring light ML2#2-2 illuminates the workpiece W via the galvanometer lens 1328, while the machining light EL does not illuminate the workpiece W via the galvanometer lens 1328. Therefore, the machining system SYSa can use the galvanometer lens 1328 to independently move the illumination position of the measuring light ML2#2-2 on the workpiece W relative to the illumination position of the machining light EL on the workpiece W. The machining system SYSa can independently change the illumination position of the machining light EL on the workpiece W and the illumination position of the measuring light ML2#2-2 on the workpiece W. The machining system SYSa can change the positional relationship between the illumination positions of the machining light EL on the workpiece W and the illumination positions of the measuring light ML2#2-2 on the workpiece W. Alternatively, the machining system SYSa may not include the galvanometer lens 1328 if the positional relationship between the illumination positions of the machining light EL on the workpiece W and the illumination positions of the measuring light ML2#2-2 on the workpiece W is not changed.

[0200] The measuring light ML2#2-2 emitted from the galvanometer lens 1341 is incident on the fθ lens 1342. The fθ lens 1342 directs the measuring light ML2#2-2 from the galvanometer lens 1341 onto the workpiece W. Specifically, the fθ lens 1342 emits the measuring light ML2#2-2 in a direction along the optical axis AX of the fθ lens 1342. As a result, the measuring light ML2#2-2 emitted from the fθ lens 1342 travels in a direction along the optical axis AX, thereby incident on the workpiece W.

[0201] The fθ lens 1342 can also focus the measuring light ML2#2-2 from the galvanometer lens 1341 onto the workpiece W. At this time, the measuring light ML2#2-2 emitted from the fθ lens 1342 can also illuminate the workpiece W without passing through other optical elements with magnification (in other words, optical components, such as lenses).

[0202] When the measuring light ML2#2-2 is irradiated onto the workpiece W, light generated from the workpiece W due to the irradiation of the measuring light ML2#2-2 is emitted. That is, when the measuring light ML2#2-2 is irradiated onto the workpiece W, light generated from the workpiece W due to the irradiation of the measuring light ML2#2-2 is emitted. The light generated by the irradiation of the measuring light ML2#2-2 (in other words, the light emitted from the workpiece W due to the irradiation of the measuring light ML2#2-2) may also include at least one of the following: the measuring light ML2#2-2 reflected by the workpiece W (i.e., reflected light), the measuring light ML2#2-2 scattered by the workpiece W (i.e., scattered light), the measuring light ML2#2-2 diffracted by the workpiece W (i.e., diffracted light), and the measuring light ML2#2-2 transmitted through the workpiece W (i.e., transmitted light).

[0203] At least a portion of the light emitted from the workpiece W due to the illumination of the measuring light ML2#2-2 (hereinafter referred to as "measuring light ML2#2-3") is incident on the objective lens optical system 134. The measuring light ML2#2-3 incident on the objective lens optical system 134 is incident on the combining optical system 133 via the fθ lens 1342 and the galvanometer lens 1341. The beam splitter 1331 of the combining optical system 133 directs the measuring light ML2#2-3 incident on the beam splitter 1331 toward the measuring optical system 132. Figure 4 In the example shown, the measurement light ML2#2-3 incident on beam splitter 1331 is reflected at the polarization separation surface, and thus exits towards measurement optical system 132. Therefore, Figure 4 In the example shown, the measuring light ML2#2-3 is incident on the polarization separation surface of the beam splitter 1331 in a state having a polarization direction that can be reflected by the polarization separation surface.

[0204] The measurement light ML2#2-3 emitted from beam splitter 1331 is incident on the galvanometer mirror 1328 of the measurement optical system 132. The galvanometer mirror 1328 directs the measurement light ML2#2-3 incident on it toward mirror 1327. Mirror 1327 reflects the measurement light ML2#2-3 incident on it toward beam splitter 1324. Beam splitter 1324 directs at least a portion of the measurement light ML2#2-3 incident on it toward beam splitter 1322. Beam splitter 1322 directs at least a portion of the measurement light ML2#2-3 incident on it toward detector 1326.

[0205] As described above, in addition to the measuring light ML2#2-3, another measuring light ML2#1-3 is incident on the detector 1326. That is, the measuring light ML2#2-3 that travels from the workpiece W toward the detector 1326 and the measuring light ML2#1-3 that travels without traveling from the workpiece W toward the detector 1326 are both incident on the detector 1326. The detector 1326 detects the interference light generated by the interference between the measuring light ML2#1-3 and the measuring light ML2#2-3. Specifically, the detector 1326 detects the interference light by receiving it. Therefore, the detector 1326 may also include a light-receiving element (light-receiving section) capable of receiving light. The detection result of the detector 1326 is output to the control device 3.

[0206] The control device 3 calculates the state of the workpiece W (typically, as described above, the position of the workpiece W) based on the detection results of detector 1323 and detector 1326. Specifically, since the pulse frequency of measuring light ML2#1 is different from that of measuring light ML2#2, the pulse frequency of measuring light ML2#1-1 is also different from that of measuring light ML2#2-1. Therefore, the interference light of measuring light ML2#1-1 and measuring light ML2#2-1 becomes interference light with pulses that appear synchronously with the pulses constituting measuring light ML2#1-1 and measuring light ML2#2-1, respectively, when they are simultaneously incident on detector 1323. Similarly, the pulse frequency of measuring light ML2#1-3 is different from that of measuring light ML2#2-3. Therefore, the interference light of measuring light ML2#1-3 and measuring light ML2#2-3 becomes interference light with pulses that appear synchronously with the pulses constituting measuring light ML2#1-3 and measuring light ML2#2-3 when they are simultaneously incident on detector 1326. Here, the position (position on the time axis) of the pulse light that forms the interference light detected by detector 1326 varies based on the positional relationship between processing head 13 and workpiece W. This is because the interference light detected by detector 1326 is the interference light between measuring light ML2#2-3 that travels from workpiece W to detector 1326 and measuring light ML2#1-3 that does not travel from workpiece W to detector 1326. On the other hand, the position (position on the time axis) of the pulse light that forms the interference light detected by detector 1323 does not vary based on the positional relationship between processing head 13 and workpiece W. Therefore, it can be said that the time difference between the pulses of the interference light detected by the forming detector 1326 and the pulses of the interference light detected by the forming detector 1323 indirectly represents the positional relationship between the processing head 13 and the workpiece W (typically, the distance between the processing head 13 and the workpiece W). Therefore, the control device 3 can calculate the state of the workpiece W based on the time difference between the pulses of the interference light detected by the forming detector 1326 and the pulses of the interference light detected by the forming detector 1323. Specifically, the control device 3 can calculate the position of the portion of the workpiece W illuminated by the measuring light ML2#2-2 based on the time difference between the pulses of the interference light detected by the forming detector 1326 and the pulses of the interference light detected by the forming detector 1323. In particular, the control device 3 can calculate the position of the illuminated portion of the workpiece W in the direction of the irradiation of the measuring light ML2 emitted from the fθ lens 1342 (i.e., the Z-axis direction of the head coordinate system). That is, the control device 3 can calculate the position of the workpiece W in the Z-axis direction of the head coordinate system.

[0207] like Figure 5As shown, the processing head 13 can also use at least one of the galvanometer lens 1328 and the galvanometer lens 1341 to deflect the measuring light ML2#2-2, thereby sequentially irradiating multiple parts of the workpiece W with the measuring light ML2#2-2. Alternatively, the processing head 13 can also use at least one of the galvanometer lens 1328 and the galvanometer lens 1341 to deflect the measuring light ML2#2-2, thereby scanning the surface of the workpiece W with the measuring light ML2#2-2. In this case, the control device 3 can calculate the positions of multiple irradiated parts of the workpiece W in the irradiation direction of the measuring light ML2 emitted from the fθ lens 1342 (i.e., the Z-axis direction of the head coordinate system). As a result, the control device 3 can also calculate the shape of the surface of the workpiece W. Furthermore, based on the positions of at least three irradiated parts of the workpiece W in the Z-axis direction of the head coordinate system, the control device 3 can also calculate the position of the workpiece W in at least one of the rotation directions about the X-axis and the Y-axis of the head coordinate system.

[0208] Thus, the processing apparatus 1 can cooperate with the control device 3 to measure the position of the workpiece W using the measuring light ML2, which is irradiated onto the workpiece W via the measuring optical system 132 (and further, the synthesizing optical system 133 and the objective lens optical system 134). In particular, the processing apparatus 1 can cooperate with the control device 3 to measure the position of the workpiece W using the measuring light ML2, which is irradiated onto the workpiece W via at least the fθ lens 1342. For example, the processing apparatus 1 can cooperate with the control device 3 to measure the position of the workpiece W in at least one of the following directions: the Z-axis of the head coordinate system, the rotation direction about the X-axis of the head coordinate system, and the rotation direction about the Y-axis of the head coordinate system. Therefore, the measuring optical system 132, etc., used to irradiate the workpiece W with the measuring light ML2 can also be referred to as a measuring device.

[0209] (1-3) Structure of head drive system 14

[0210] Next, an example of the structure of the head drive system 14 will be described. As described above, the head drive system 14 includes a self-driving system 141, an arm drive system 142, and a micro-motion drive system 143. Therefore, the self-driving system 141, the arm drive system 142, and the micro-motion drive system 143 will be described in sequence below.

[0211] (1-3-1-1) Structure of self-driving system 141

[0212] First, refer to Figure 6 The self-driving system 141 will be explained. Figure 6 This is a cross-sectional view showing the structure of the self-driving system 141.

[0213] like Figure 6As shown, the self-propelled system 141 includes a carriage 1411 and a motor 1412. The carriage 1411 is a platform equipped with wheels. The carriage 1411 is disposed on a support surface SS. The wheels of the carriage 1411 can be rotated using the power of the motor 1412. As a result, the carriage 1411 can move on the support surface SS using the power of the motor 1412 driven under the control of the control device 3. That is, the carriage 1411 can move on its own on the support surface SS using the power of the motor 1412. At this time, the motor 1412 can also be regarded as functioning as a moving mechanism that moves the carriage 1411.

[0214] A boom drive system 142 is connected to the trolley 1411. Therefore, the trolley 1411 can also be referred to as a connecting member connecting the boom drive system 142. Specifically, in the trolley 1411 ( Figure 6 In the example shown, an arm drive system 142 is mounted (i.e., fixed) on the upper surface of the trolley 1411. Therefore, when the trolley 1411 moves, the arm drive system 142 also moves. Furthermore, a micro-motion drive system 143 is connected to the arm drive system 142. Specifically, the micro-motion drive system 143 is mounted (i.e. fixed) on the arm drive system 142. Therefore, when the trolley 1411 moves, the micro-motion drive system 143 also moves. Furthermore, a machining head 13 is connected to the micro-motion drive system 143. Specifically, the machining head 13 is mounted (i.e. fixed) on the micro-motion drive system 143. Therefore, when the trolley 1411 moves, the machining head 13 also moves. Therefore, the self-driving system 141 functions as a moving device that moves the machining head 13 by itself.

[0215] As detailed below, the control device 3 can also control the self-driving system 141 based on the measurement results obtained by the measuring device 2. That is, the control device 3 can also control the self-driving system 141 based on the position of at least one of the machining head 13 and the workpiece W measured by the measuring device 2, so that the machining head 13 moves relative to the workpiece W. For example, as described above, the measuring device 2 can measure the position of at least one of the machining head 13 and the workpiece W in at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Therefore, the control device 3 can also control the self-driving system 141 based on the measurement results obtained by the measuring device 2, so that the machining head 13 moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. However, the control device 3 can also control the self-driving system 141 based on at least one of the measurement results obtained by the machining head 13 and the measurement results obtained by the imaging device 15.

[0216] (1-3-1-2) Structure of arm drive system 142

[0217] Then, while referring to Figure 6 The structure of the arm drive system 142 is explained. Figure 6 This is a cross-sectional view showing the structure of the arm drive system 142.

[0218] like Figure 6 As shown, the arm drive system 142 includes a base 1420. The base 1420 is connected to the self-propelled drive system 141 (specifically, the trolley 1411). That is, the base 1420 is mounted (i.e., fixed) to the trolley 1411. Therefore, the base 1420 can also be referred to as a connecting member connected to the self-propelled drive system 141. One end of the robotic arm 1421 is mounted on the base 1420. The base 1420 supports the robotic arm 1421. The base 1420 serves as a base member for supporting the robotic arm 1421.

[0219] In addition, such as Figure 6 As shown, the processing light source 11 and the measuring light source 12 are positioned near the portion of the trolley 1411 connected to the base 1420. However, the placement of the processing light source 11 and the measuring light source 12 is not limited to... Figure 6 The example shown. For example, at least one of the processing light source 11 and the measuring light source 12 may also be configured in the arm drive system 142. For example, at least one of the processing light source 11 and the measuring light source 12 may also be configured inside the external components constituting at least one of the self-driving system 141 and the arm drive system 142, so that they are not visible from the outside.

[0220] The robotic arm 1421 includes multiple arm components 1422. The multiple arm components 1422 are movably connected via at least one joint component 1423. Therefore, the robotic arm 1421 can also be referred to as a movable arm. Furthermore, the robotic arm 1421 can also be a manipulator with three or more degrees of freedom. Thus, the arm drive system 142 can also function as a robot with a so-called vertical multi-joint structure. However, the arm drive system 142 is not limited to robots with a vertical multi-joint structure; for example, it can also function as a polar coordinate robot, cylindrical coordinate robot, Cartesian coordinate robot, or parallel link robot with a horizontal multi-joint structure. The arm drive system 142 may also include a single joint (i.e., a drive axis defined by the joint component 1423). Alternatively, the arm drive system 142 may also include multiple joints.

[0221] The connector 1423 can also be connected to another arm member 1422 of the connector 1423 in a manner that allows it to rotate relative to one of the arm members 1422 connected to the connector 1423 about a drive axis (e.g., at least one of a rotation axis about the X-axis, a rotation axis about the Y-axis, and a rotation axis about the Z-axis), thereby connecting at least two arm members. The connector 1423 can also be connected to another arm member 1422 of the connector 1423 in a manner that allows it to move relative to one of the arm members 1422 connected to the connector 1423 along a drive axis (e.g., at least one of a movement axis about the X-axis, a movement axis about the Y-axis, and a movement axis about the Z-axis), thereby connecting at least two arm members.

[0222] The two arm members 1422, which are connected by the joint member 1423, move through the actuators 1424 corresponding to each joint. Figure 6 An example is shown where the arm drive system 142 includes four actuators 1424 corresponding to four joint members 1423. As a result, at least one arm member 1422 moves. Therefore, at least one arm member 1422 can move relative to the workpiece W. That is, at least one arm member 1422 can move to change the relative positional relationship between at least one arm member 1422 and the workpiece W.

[0223] A micro-motion drive system 143 is connected to the robotic arm 1421. Specifically, the micro-motion drive system 143 is connected (i.e., mounted or fixed) to one of the multiple arm members 1422 located furthest from the base 1420. Hereinafter, for ease of explanation, the arm member 1422 on which the micro-motion drive system 143 is mounted will be referred to as the front arm member 1425. The micro-motion drive system 143 can be directly mounted to the front arm member 1425 or indirectly mounted to the front arm member 1425 via other members. The front arm member 1425 can also be referred to as the connecting member connecting the micro-motion drive system 143.

[0224] When the front arm member 1425 moves via the actuator 1424, the front arm member 1425 moves relative to the base 1420. That is, when the front arm member 1425 moves, the relative position of the base 1420 and the front arm member 1425 changes. As a result, the micro-motion drive system 143 mounted on the front arm member 1425 also moves. Therefore, the arm drive system 142 can move the micro-motion drive system 143. Specifically, the arm drive system 142 can move the micro-motion drive system 143 relative to the workpiece W. The arm drive system 142 can move the micro-motion drive system 143 to change the relative positional relationship between the micro-motion drive system 143 and the workpiece W. Moreover, when the micro-motion drive system 143 moves, the machining head 13 mounted on the micro-motion drive system 143 also moves. Therefore, the arm drive system 142 can function as a moving device that moves the machining head 13. Alternatively, the micro-drive system 143 may be configured among multiple arm members 1422, in addition to or replacing the micro-drive system 143 mounted on the front arm member 1425. Furthermore, the micro-drive system 143 may be configured between the arm member 1422 and the joint member 1423 and / or between the joint member 1423 and the base 1420.

[0225] As detailed below, the control device 3 can also control the arm drive system 142 based on the measurement results obtained by the measuring device 2. That is, the control device 3 can also control the arm drive system 142 based on the position of at least one of the machining head 13 and the workpiece W measured by the measuring device 2, so as to move the machining head 13. For example, as described above, the measuring device 2 can measure the position of at least one of the machining head 13 and the workpiece W in at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Therefore, the control device 3 can also control the arm drive system 142 based on the measurement results obtained by the measuring device 2, so as to move the machining head 13 along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. However, the control device 3 can also control the arm drive system 142 based on at least one of the measurement results obtained by the machining head 13 and the measurement results obtained by the imaging device 15.

[0226] (1-3-1-2) Structure of the micro-motion drive system 143

[0227] Then, while referring to Figure 7 The structure of the micro-motion drive system 143 is explained. Figure 7 This is a cross-sectional view showing the structure of the micro-motion drive system 143.

[0228] like Figure 7As shown, the micro-motion drive system 143 includes a support member 1431, a support member 1432, an air spring 1433, a damper member 1434, and a drive member 1435.

[0229] Support member 1431 is connected to arm drive system 142. Specifically, support member 1431 is mounted (i.e., fixed) to the front arm member 1425 of arm drive system 142. Therefore, support member 1431 can also be referred to as a connecting member connected to arm drive system 142. Support member 1432 is mounted to processing head 13. Therefore, support member 1432 can also be referred to as a connecting member connected to processing head 13.

[0230] Support member 1431 and support member 1432 are joined (in other words, connected or linked) via air spring 1433, damper member 1434, and drive member 1435. That is, air spring 1433, damper member 1434, and drive member 1435 are mounted on support member 1431 and support member 1432 respectively in a manner that connects them. Since arm drive system 142 is mounted on support member 1431 and processing head 13 is mounted on support member 1432, it can also be considered that air spring 1433, damper member 1434, and drive member 1435 are mounted on support member 1431 and support member 1432 in a manner that substantially connects arm drive system 142 and processing head 13 respectively.

[0231] Under the control of the control device 3, the air spring 1433 applies an elastic force caused by the pressure of a gas (for example, air) to at least one of the support members 1431 and 1432. Under the control of the control device 3, the air spring 1433 applies the elastic force caused by the gas pressure to at least one of the support members 1431 and 1432 via the support members 1431 and 1432. In particular, the air spring 1433 may also apply the elastic force caused by the gas pressure to at least one of the support members 1431 and 1432 along the direction in which the support members 1431 and 1432 are arranged (for example, the Z-axis direction in the arm coordinate system, for example, the direction of gravity). Furthermore, the air spring 1433 may also be referred to as an elastic member.

[0232] To impart elastic force due to gas pressure, gas is supplied to the air spring 1433 from the gas supply device 14361 via piping 14362 and valve 14363. The control device 3 controls at least one of the gas supply device 14361 and valve 14363 based on the measurement results of a pressure gauge 1436 that measures the pressure of the gas within the air spring 1433. Alternatively, the micro-motion drive system 143 may not include the gas supply device 14361, piping 14362, and valve 14363. In this case, the air spring 1433 may impart elastic force due to the internal gas pressure to at least one of the support member 1431 and support member 1432 independently of the control device 3.

[0233] The air spring 1433 can also support the weight of the support member 1432 using its elastic force under the control of the control device 3. Specifically, the air spring 1433 can also support the weight of the support member 1432 using its elastic force along the direction in which the support members 1431 and 1432 are arranged (e.g., the Z-axis direction in the head coordinate system). Since the machining head 13 is mounted on the support member 1432, the air spring 1433 can also support the weight of the machining head 13 mounted on the support member 1432 using its elastic force. Specifically, the air spring 1433 can also support the weight of the machining head 13 using its elastic force along the direction in which the arm drive system 142 (especially the front arm member 1425) and the machining head 13 are arranged. In this case, the air spring 1433 can also function as a weight canceller to counteract the weight of the machining head 13. In addition, the air spring 1433 can also support the weight of the support member 1432 using its elastic force independently of the control device 3.

[0234] The air spring 1433, under the control of the control device 3, can also use its elastic force to reduce vibrations transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. Specifically, the air spring 1433 can also use its elastic force to attenuate vibrations transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. More specifically, the air spring 1433 can also use its elastic force to reduce (attenuate) vibrations transmitted from the arm drive system 142 to (i.e., transmitted to) the processing head 13 via the micro-motion drive system 143. At this time, the control device 3 can also control at least one of the gas supply device 14361 and the valve 14363 based on the measurement results of the pressure gauge 1436 to reduce (i.e., attenuate) vibrations transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. In addition, the air spring 1433 can also reduce the vibration transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143 by using elastic force, independent of the control device 3.

[0235] The damper member 1434 imparts an elastic force, caused by factors different from air pressure, to at least one of the support members 1431 and 1432. The damper member 1434 imparts this elastic force, caused by factors different from air pressure, to at least one of the support members 1431 and 1432 via the support members 1431 and 1432. In particular, the damper member 1434 may also impart the elastic force to at least one of the support members 1431 and 1432 along the direction in which they are arranged (e.g., the Z-axis direction in the head coordinate system, for example, the direction of gravity). That is, the damper member 1434 may also impart the elastic force to at least one of the arm drive system 142 (especially the front arm member 1425) and the processing head 13 along the direction in which they are arranged. In addition, the damper component 1434 can also be referred to as an elastic component.

[0236] The damper component 1434, like the air spring 1433, can also utilize elastic force to support the weight of the support component 1432. The damper component 1434, like the air spring 1433, can also utilize elastic force to reduce vibrations transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. The damper component 1434 can also utilize elastic force to convert the vibrations of the air spring 1433 into damped vibrations. That is, the damper component 1434 can also utilize elastic force to convert vibrations transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143 into damped vibrations.

[0237] The damper component 1434 can be any component as long as it can impart an elastic force. For example, the damper component 1434 may also include a compression spring coil. For example, the damper component 1434 may also include a leaf spring.

[0238] The drive member 1435 is capable of generating a driving force under the control of the control device 3. The drive member 1435 can impart the generated driving force to at least one of the support members 1431 and 1432. The drive member 1435 can impart the generated driving force to at least one of the arm drive system 142 and the processing head 13 via at least one of the support members 1431 and 1432. The drive member 1435 can have any structure as long as it can generate a driving force. For example, the drive member 1435 may also have a structure capable of generating a driving force electrically. For example, the drive member 1435 may also have a structure capable of generating a driving force magnetically. As an example, Figure 7This illustrates an example where the drive member 1435 is a voice coil motor (VCM) capable of generating driving force electrically. Furthermore, since a voice coil motor is a type of linear motor, the drive member 1435 could also be a linear motor different from a voice coil motor. The drive member 1435 could also be a device that generates driving force along a straight axis.

[0239] Alternatively, the drive member 1435 may also have the following structure, in which the component of the drive member 1435 mounted on the support member 1431 and the component of the drive member 1435 mounted on the support member 1432 are not in physical contact. For example, when the drive member 1435 is a voice coil motor, the component of the drive member 1435 mounted on the support member 1431 (e.g., a component including either a coil or a magnetic pole) and the component of the drive member 1435 mounted on the support member 1432 (e.g., a component including the other of a coil and a magnetic pole) will not be in physical contact.

[0240] The drive member 1435, under the control of the control device 3, can also use a driving force to move at least one of the support members 1431 and 1432, thereby moving at least one of the arm drive system 142 and the processing head 13. In this case, the drive member 1435 can also use a driving force to move at least one of the arm drive system 142 and the processing head 13, thereby changing the relative position of the arm drive system 142 and the processing head 13.

[0241] The drive member 1435 can also change the relative position of the arm drive system 142 and the processing head 13 under the control of the control device 3, based on the measurement results of the position measuring device 1437 included in the micro-motion drive system 143. The position measuring device 1437 measures the relative position of the arm drive system 142 and the processing head 13. For example, the position measuring device 1437 may be an encoder including a detection unit 14371 mounted on the support member 1431 and a scaling unit 14372 mounted on the support member 1432. The measurement results of the position measuring device 1437 include information related to the relative position of the support member 1431 and the support member 1432. Since the arm drive system 142 is mounted on the support member 1431 and the processing head 13 is mounted on the support member 1432, the information related to the relative position of the support member 1431 and the support member 1432 includes information related to the relative position of the arm drive system 142 and the processing head 13. Therefore, the control device 3 can appropriately determine the relative position of the arm drive system 142 and the processing head 13. As a result, the control device 3 can appropriately change the relative position of the arm drive system 142 and the processing head 13 based on the measurement results of the position measuring device 1437.

[0242] The drive member 1435 can also change the relative position of the arm drive system 142 and the machining head 13 under the control of the control device 3 (typically, moving the machining head 13 relative to the arm drive system 142), thereby moving (i.e., driving) the machining head 13 relative to the workpiece W. The drive member 1435 can also move (i.e. drive) the machining head 13 to change the relative positional relationship between the machining head 13 and the workpiece W.

[0243] The drive member 1435, under the control of the control device 3, can also use driving force to change the relative position of the arm drive system 142 and the processing head 13, thereby reducing the vibration transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. That is, the drive member 1435 can also use driving force to attenuate the vibration transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143. Specifically, the drive member 1435 can also use driving force to reduce (attenuate) the vibration transmitted from the arm drive system 142 to (i.e., to) the processing head 13 via the micro-motion drive system 143.

[0244] The drive member 1435 can also use the driving force to change the relative position of the arm drive system 142 and the processing head 13, thereby converting the vibration of the air spring 1433 into damped vibration. That is, the drive member 1435 can also use the driving force to convert the vibration transmitted between the arm drive system 142 and the processing head 13 via the micro-motion drive system 143 into damped vibration. In this case, it can be said that the drive member 1435 uses the driving force to reduce the relative displacement between the arm drive system 142 and the processing head 13 caused by the vibration from the arm drive system 142 toward the processing head 13. Specifically, it can be said that the drive member 1435 uses the driving force to reduce the relative displacement between the portion of the arm drive system 142 connected to the micro-motion drive system 143 (i.e., the front arm member 1425) and the portion of the processing head 13 connected to the micro-motion drive system 143 caused by the vibration from the arm drive system 142 toward the processing head 13. Furthermore, if the drive member 1435 can convert the vibration of the air spring 1433 into damped vibration, the micro-motion drive system 143 may not include the damper member 1434. However, even if the drive member 1435 cannot convert the vibration of the air spring 1433 into damped vibration, the micro-motion drive system 143 may not include the damper member 1434. Moreover, the number of air springs 1433, the number of damper members 1434, and the number of drive members 1435 may not be equal to each other.

[0245] The drive member 1435 can also impart a driving force acting in the direction of the directional component of the elastic force imparted by the air spring 1433 and / or the damper member 1434. Figure 6 In the example shown, the air spring 1433 and / or damper member 1434 impart an elastic force along the Z-axis direction of the head coordinate system, so the drive member 1435 can also impart a driving force acting in a direction including the Z-axis component. When the drive member 1435 generates a driving force acting in a direction including the direction component of the elastic force imparted by the air spring 1433 and / or damper member 1434, the drive member 1435 can use the driving force to convert the vibration of the air spring 1433 into a damped vibration. When making the vibration of the air spring 1433 a damped vibration, the drive member 1435 can also use the driving force to change the resonant frequency of the air spring 1433. Typically, the drive member 1435 can also use the driving force to increase the resonant frequency of the air spring 1433.

[0246] A device that actively reduces vibration using elastic components such as air springs 1433 and drive components 1435 can also be called an active vibration damping device. Therefore, the micro-motion drive system 143 can also be called an active vibration damping device. Active vibration damping devices can also be called active vibration isolation systems (AVIS).

[0247] As detailed below, the control device 3 can also control the micro-motion drive system 143 based on the measurement results obtained by the imaging device 15. That is, the control device 3 can also control the micro-motion drive system 143 to move the machining head 13 based on the position of the workpiece W measured by the imaging device 15. For example, as described above, the imaging device 15 can measure the position of the machining head 13 in at least one of the X-axis direction, Y-axis direction, and θZ direction. In this case, the control device 3 can also control the micro-motion drive system 143 based on the measurement results obtained by the imaging device 15 to move the machining head 13 along at least one of the X-axis direction, Y-axis direction, and θZ direction. For example, as described above, the imaging device 15 can measure the position of the machining head 13 in at least one of the Z-axis direction, θX direction, and θY direction. In this case, the control device 3 can also control the micro-motion drive system 143 based on the measurement results obtained by the imaging device 15 to move the machining head 13 along at least one of the Z-axis direction, θX direction, and θY direction. However, the control device 3 may also control the micro-motion drive system 143 based on at least one of the measurement results obtained from the processing head 13 and the measurement results obtained from the measuring device 2.

[0248] (1-4) Structure of measuring device 2

[0249] Next, the structure of measuring device 2 will be described. Measuring device 2 may, for example, be a measuring device comprising a lidar system as described in U.S. Patent Application Publication No. 2012 / 188557 (e.g., a measuring device utilizing frequency-modulated measuring light). Hereinafter, an example of a measuring device 2 comprising a lidar system as described in U.S. Patent Application Publication No. 2012 / 188557 will be described, with reference to... Figure 8 as well as Figure 9 While explaining. Figure 8 This is a front view showing the appearance of the measuring device 2. Figure 9 This is a block diagram showing the structure of measuring device 2.

[0250] like Figure 8As shown, the measuring device 2 includes a base 210 and a housing 220. The base 210 is a platform that supports the housing 220. The base 210 can also be disposed on a support surface SS on which the processing device 1 and the workpiece W are disposed, for example. The base 210 can be disposed on the support surface SS via a support member (not shown) or directly disposed on the support surface SS. The housing 220 is for housing... Figure 9 The components of the optical assembly 230 shown. The housing 220 may also be rotatable about a predetermined axis of rotation. Figure 8 In the example shown, housing 220 is rotatable about a rotation axis along the X-axis and a rotation axis along the Z-axis.

[0251] like Figure 9 As shown, the optical assembly 230 includes a measurement light source 231, a directional beam source 232, a beam splitter 233, a beam splitter 234, a beam splitter 235, a mirror 236, an optical circuit 237, and a detector 238.

[0252] Measurement light source 231 generates measurement light ML3. A portion of the measurement light ML3 generated by measurement light source 231 is emitted from the emission port 221 formed in housing 220 via beam splitter 234 and beam splitter 235 and mirror 236. The measurement light ML3 emitted from emission port 221 is incident on reflector 136 (or reflector W136, hereinafter the same). As described above, when housing 220 rotates about the rotation axis, the emission direction of measurement light ML3 from measurement device 2 changes. Therefore, control device 3 can also rotate housing 220 to cause measurement light ML3 to be incident on reflector 136 arranged at a desired position. Reflector 136 reflects at least a portion of the measurement light ML3 incident on reflector 136. At least a portion of the measurement light ML3 reflected by reflector 136 (hereinafter referred to as "return light ML4") is incident on optical assembly 230 via emission port 221. The return light ML4 incident on the optical component 230 is incident on the detector 238 via the mirror 236 and the beam splitter 235. On the other hand, another part of the measurement light ML3 generated by the measurement light source 231 is incident on the detector 238 via the beam splitter 234 and the optical circuit 237 described in U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4733606, etc.). The control device 3 calculates the position of the processing head 13 based on the detection results of the measurement light ML3 and the return light ML4 by the detector 238. For example, the control device 3 uses the optical heterodyne detection described in U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4733606, etc.) to calculate the position of the processing head 13 based on the detection results of the measurement light ML3 and the return light ML4 by the detector 238.

[0253] A directional beam source 232 generates a directional beam B. The directional beam B is used to identify the position of the measurement light ML3 on the reflector 136. The directional beam B may also contain visible light. The directional beam B generated by the directional beam source 232 is emitted from an outlet 221 formed in the housing 220 via beam splitters 233, 234, and 235 and a mirror 236. The directional beam B emitted from the outlet 221 is incident on the reflector 136. However, the optical assembly 230 may also choose not to direct the directional beam B onto the reflector 136.

[0254] Furthermore, the measuring device 2 is not limited to a measuring device comprising a lidar system as described in U.S. Patent Application Publication No. 2012 / 188557. For example, the measuring device 2 may also be a measuring device comprising a laser coordinate measuring device as described in U.S. Patent No. 7,800,758 (e.g., a measuring device utilizing intensity-modulated measuring light). For example, the measuring device 2 may also be a measuring device comprising an absolute distance meter as described in U.S. Patent No. 6,847,436 (e.g., a measuring device utilizing intensity-modulated measuring light).

[0255] Alternatively, measuring device 2 can also replace Figure 9 The optical component 230 shown includes an optical component 230', which is capable of measuring the position of at least one of the processing head 13 and the workpiece W using the same method as the method described for measuring the position of the workpiece W using measuring light ML2. An example of the optical component 230' is shown in... Figure 10 .like Figure 10As shown, the optical assembly 230' includes a measurement light source 12'#1, a measurement light source 12'#2, a mirror 1320', a beam splitter 1321', a beam splitter 1322', a detector 1323', a beam splitter 1324', a mirror 1325', a detector 1326', a mirror 1327', a galvanometer mirror 1328', a galvanometer mirror 1341', and an fθ lens 1342'. The measuring light source 12'#1, measuring light source 12'#2, mirror 1320', beam splitter 1321', beam splitter 1322', detector 1323', beam splitter 1324', mirror 1325', detector 1326', mirror 1327', galvanometer mirror 1328', galvanometer mirror 1341', and fθ lens 1342' can also be the same as the measuring light source 12#1, measuring light source 12#2, mirror 1320, beam splitter 1321, beam splitter 1322, detector 1323, beam splitter 1324, mirror 1325, detector 1326, mirror 1327, galvanometer mirror 1328, galvanometer mirror 1341, and fθ lens 1342 described above. That is, the optical assembly 230' can also use detectors 1323' and 1326' to detect the interference light between the measuring light ML3#1 from the measuring light source 12'#1 and the measuring light ML3#2 from the measuring light source 12'#2, thereby measuring the position of at least one of the processing head 13 and the workpiece W. Furthermore, as described above, the illumination positions of the measuring light ML3#1 and the measuring light ML3#2 can be changed by rotating the housing 220; therefore, the optical assembly 230' may not include the galvanometer lens 1328 and the galvanometer lens 1341.

[0256] (1-5) Processing Actions

[0257] The following describes the machining actions performed by the machining system SYSa in order to machine workpiece W.

[0258] (1-5-1) Specific example of workpiece W as the object of machining action

[0259] First, refer to Figure 11 One example is given of the workpiece W, which is the object of the processing action.

[0260] like Figure 11 As shown, the processing device 1 can also process workpieces W that are larger than the processing device 1. Figure 11In the example shown, the processing apparatus 1 processes a workpiece W that corresponds to at least a portion of an aircraft. In this case, the processing apparatus 1 can also process at least a portion of the aircraft to form the aforementioned rib structure in that portion. For example, the processing apparatus 1 can also process at least a portion of the aircraft to form the aforementioned rib structure in at least a portion of the aircraft's fuselage, main wing, horizontal tail, and / or vertical tail. However, the processing apparatus 1 can also process workpieces W smaller than itself. The processing apparatus 1 can also process workpieces W of the same size as itself. Furthermore, the processing apparatus 1 can also process workpieces W with dimensions greater than the travel distance of the head drive system 14 included in the processing apparatus 1. The processing apparatus 1 can also process workpieces W with dimensions larger than the area (e.g., the exposure area SA described later) that can be irradiated by the processing light EL without using the head drive system 14 included in the processing apparatus 1 to move the processing head 13.

[0261] As described above, the rib structure is a structure that can reduce the surface resistance of the workpiece W to the fluid (in particular, at least one of frictional resistance and turbulent frictional resistance). Therefore, the processing device 1 can also process workpiece W corresponding to at least a portion of an object whose resistance to the fluid is to be reduced. For example, the processing device 1 can also process workpiece W corresponding to at least a portion of an object (i.e., a moving body) capable of moving in a manner that allows it to enter a fluid (e.g., at least one of a gas and a liquid). As an example of a moving body, at least one of a helicopter and an unmanned aerial vehicle can be listed. In this case, for example, the processing device 1 can also process at least a portion of the fuselage and / or rotor of at least one of the helicopter and the unmanned aerial vehicle. As another example of a moving body, at least one of a rail vehicle, a linear motor car, an automobile, a bicycle, a boat, and a rocket can be listed. In this case, at least a portion of the body of a rail vehicle, the body of a linear motor car, the body of an automobile, the frame of a bicycle, the hull of a boat, and / or the fuselage of a rocket can also be processed. As another example of a moving body, at least one of a turbine, a fan, and a windmill can be listed. At this time, the processing part is not limited to the rotating part (moving part), but can also be a fixed part in contact with the fluid. Alternatively, the processing device 1 can also process a workpiece W that is equivalent to at least a portion of an object in contact with a flowing fluid. As an example of an object that is at least a portion in contact with a flowing fluid, a pipe in which the fluid flows in an internal pipeline can be cited. In this case, the processing device 1 can also process at least a portion of the inner wall of the pipe facing the pipeline.

[0262] (1-5-2) Process flow

[0263] Then, while referring to Figure 12 One example of the processing procedure is explained. Figure 12This is a flowchart illustrating an example of a processing procedure.

[0264] like Figure 12 As shown, control device 3 acquires recipe information (step S10). Recipe information is information used by machining system SYSa for machining workpiece W. Therefore, recipe information may also include various information related to the machining of workpiece W. For example, recipe information may also include workpiece information related to the workpiece W that is the object of machining. Workpiece information may also include at least one of information related to the shape of workpiece W, information related to the size of workpiece W, and information related to the position of workpiece W. Recipe information may also include, in addition to or instead of workpiece information, machining content information related to the machining performed on each part of workpiece W. For example, machining content information may include information related to the characteristics of the rib structure formed on each part of workpiece W (e.g., at least one of the width, depth, extension direction, and spacing of the grooves constituting the rib structure). The characteristics of the rib structure may also be referred to as the morphology of the rib structure.

[0265] The formulation information may also include exposure area information related to the exposure area SA defined for the surface of the workpiece W. For example, a 3D view representing the exposure area SA would be provided. Figure 13 As shown, multiple exposure areas SA can also be set on the workpiece W. In particular, when the processing apparatus 1 processes a workpiece W larger than itself, as described above, it is highly likely that multiple exposure areas SA can be set on the workpiece W. Each exposure area SA can also represent the area (in other words, the range) where processing is performed by the processing apparatus 1 with the positional relationship between the processing head 13 and the workpiece W fixed (i.e., without change). As described above, the workpiece W is processed by the processing light EL, so the area where processing is performed by the processing apparatus 1 is equivalent to the area where the processing head 13 can be irradiated by the processing light EL. Furthermore, with the positional relationship between the processing head 13 and the workpiece W fixed, the irradiation position of the processing light EL on the workpiece W is changed by the galvanometer lens 1341. Therefore, typically, as Figure 13 As shown, the exposure area SA can also be set to be the same as, or narrower than, the scanning range of the processing light EL deflected by the galvanometer lens 1341 when the positional relationship between the processing head 13 and the workpiece W is fixed.

[0266] The exposure zone information may also include information related to the position of each exposure zone SA on the workpiece W. The exposure zone information may also include information related to the size of each exposure zone SA on the workpiece W. Additionally, the control device 3 may set multiple exposure zones SA on the surface of the workpiece W. In this case, the formula information may not include the exposure zone information.

[0267] When multiple exposure zones SA are defined on the surface of workpiece W, the processing apparatus 1 processes the multiple exposure zones SA sequentially. Specifically, the processing apparatus 1 moves the processing head 13 toward a position where it can irradiate a processing light EL onto one exposure zone SA. Then, the processing apparatus 1 irradiates the processing light EL onto one exposure zone SA, thereby processing that exposure zone SA. After processing one exposure zone SA is completed, the processing apparatus 1 moves the processing head 13 toward a position where it can irradiate a processing light EL onto another exposure zone SA, different from the first one. Then, the processing apparatus 1 irradiates the processing light EL onto the other exposure zone SA, thereby processing that other exposure zone SA. The processing apparatus 1 then repeats the same operation until the processing of multiple exposure zones SA is completed.

[0268] Therefore, the control device 3 determines the position (typically, the position in the reference coordinate system) of an exposure area SA to be processed by the processing device 1 on the workpiece W based on the recipe information (step S11). In the following description, for ease of explanation, the exposure area SA determined in step S11 will be referred to as the processing target exposure area PSA. Alternatively, if the control device 3 sets multiple exposure areas SA on the surface of the workpiece W, the control device 3 may also set one of the multiple exposure areas SA set by the control device 3 as the processing target exposure area PSA.

[0269] Subsequently, the control device 3 determines the position of the processing head 13 based on the measurement results obtained from the measuring device 2 (step S12). Furthermore, the control device 3 can also determine the position of the workpiece W as needed. Additionally, the measuring device 2 can also... Figure 2 During the processing operation shown, the position of the processing head 13 is continuously measured. However, the measuring device 2 may also measure the position of the processing head 13 when the measurement result of the measuring device 2 is required. The measuring device 2 may also measure the position of the processing head 13 periodically. The measuring device 2 may also measure the position of the processing head 13 at random times.

[0270] Subsequently, based on the position of the PSA (photosensitive area of ​​the workpiece) determined in step S11 and the position of the processing head 13 determined in step S12, the control device 3 moves the processing head 13 toward a position where it can irradiate the PSA with processing light EL (step S13). Specifically, the control device 3 moves the processing head 13 toward a position where it can irradiate the PSA with processing light EL by controlling at least one of the self-driving system 141 and the arm driving system 142. That is, the control device 3 moves the processing head 13 toward the PSA by controlling at least one of the self-driving system 141 and the arm driving system 142. As a result, the processing head 13 moves from... Figure 14 As shown, the processing head 13 cannot irradiate the processing light EL onto the PSA exposure area of ​​the workpiece at the position shown, and moves to such a position. Figure 15 As shown, the processing head 13 can irradiate the processing light EL onto the PSA exposure area of ​​the workpiece.

[0271] Since the imaging device 15 is installed on the processing head 13, the imaging device 15 moves when the processing head 13 moves. Therefore, the imaging device 15 can capture images of the PSA (partially exposed area of ​​the workpiece) when the processing head 13 is positioned such that it can irradiate the PSA with the processing light EL. Thus, the imaging device 15 can also be aligned with the processing head 13 while the processing head 13 is positioned such that it can irradiate the PSA with the processing light EL, enabling the imaging device 15 to capture images of the PSA.

[0272] As described above, when the movement accuracy of the arm drive system 142 towards the machining head 13 is higher than that of the self-drive system 141, the control device 3 can also use the arm drive system 142 to move the machining head 13 with relatively fine precision after using the self-drive system 141 to move it with relatively coarse precision. That is, the control device 3 can also use the arm drive system 142 to align the machining head 13 with relatively fine precision relative to the PSA of the workpiece after using the self-drive system 141 to align it with the PSA of the workpiece with relatively fine precision.

[0273] The control device 3 can also control at least one of the self-driving system 141 and the arm driving system 142 so that the machining device 1 (especially the machining head 13 and the head driving system 14) does not interfere with the workpiece W while the machining head 13 is moving. That is, the control device 3 can also control at least one of the self-driving system 141 and the arm driving system 142 so that the machining device 1 (especially the machining head 13 and the head driving system 14) does not contact or collide with the workpiece W while the machining head 13 is moving. In this case, the self-driving system 141 can also be regarded as a drive system that can move without interfering with the workpiece W.

[0274] On the other hand, during the period when at least one of the self-driving system 141 and the arm driving system 142 moves the machining head 13, the micro-motion driving system 143 may not move the machining head 13. During the period when at least one of the self-driving system 141 and the arm driving system 142 moves the machining head 13, the machining apparatus 1 may not irradiate the workpiece W with machining light EL. Therefore, during the period when at least one of the self-driving system 141 and the arm driving system 142 moves the machining head 13, the galvanometer lens 1341 that deflects the machining light EL may not be driven. That is, the galvanometer lens 1341 may not change the focusing position of the machining light EL in the plane along the XY plane in the head coordinate system. The galvanometer lens 1341 may not change the irradiation position of the machining light EL on the workpiece W.

[0275] After the processing head 13 moves to a position where it can irradiate the processing light EL onto the PSA area of ​​the workpiece, the control device 3 controls the micro-motion drive system 143 based on the measurement results obtained by the imaging device 15 (step S14). Therefore, the imaging device 15 can also start imaging the workpiece W (especially the PSA area of ​​the workpiece) after the processing head 13 moves to a position where it can irradiate the processing light EL onto the PSA area of ​​the workpiece. That is, the processing device 1 can also use the imaging device 15 to start measuring the position of the workpiece W after the processing head 13 moves to a position where it can irradiate the processing light EL onto the PSA area of ​​the workpiece. However, if the processing device 1 does not include the micro-motion drive system 143, the processing system SYSa may not perform the operation in step S14.

[0276] The control device 3 can also identify the PSA (Pressure Area of ​​the Workpiece) from the measurement results obtained from the imaging device 15, and control the micro-motion drive system 143 based on the measurement results obtained from the imaging device 15, so that the relative positional relationship between the identified PSA and the processing head 13 (especially the fθ lens 1342) is fixed. That is, the control device 3 can also control the micro-motion drive system 143 based on the measurement results obtained from the imaging device 15, so that the processing head 13 (especially the fθ lens 1342) is stationary relative to the identified PSA. At this time, even if the workpiece W moves relative to the processing head 13, the micro-motion drive system 143 will move the processing head 13 in accordance with the movement of the workpiece W. For example, even if the workpiece W moves by a certain amount in one direction relative to the processing head 13, the micro-motion drive system 143 will move the processing head 13 by a certain amount in one direction in accordance with the movement of the workpiece W. As a result, the relative positional relationship between the PSA and the processing head 13 (especially the fθ lens 1342) no longer changes. Therefore, when the control device 3 controls the galvanometer lens 1341 to irradiate the desired position within the PSA of the workpiece, the processing light EL can be applied even without considering the movement of the workpiece W relative to the processing head 13. That is, the control device 3 does not need to consider the movement of the workpiece W relative to the processing head 13 to control the galvanometer lens 1341 to irradiate the desired position within the PSA of the workpiece. Since the relative positional relationship between the PSA of the workpiece and the processing head 13 (especially the fθ lens 1342) does not change, it can also be said that the control device 3 performs control without altering the identified relative positional relationship between the PSA of the workpiece and the processing head 13 (especially the fθ lens 1342).

[0277] As described above, when the imaging device 15 images the workpiece mark WM formed on the workpiece W, the workpiece mark WM can also be formed in each exposure area SA. For example, a workpiece mark WM formed in multiple exposure areas SA could be represented as... Figure 16 As shown, workpiece marks WM can also be formed in each exposure zone SA at the same position as workpiece marks WM formed in other exposure zones SA. When forming a mark group WMG containing multiple workpiece marks WM, the mark group WMG can also be formed in each exposure zone SA at the same position as the mark group WMG formed in other exposure zones SA. In this case, the control device 3 can also calculate the position of the workpiece exposure zone PSA based on the position of the workpiece marks WM formed in the workpiece exposure zone PSA. Alternatively, the control device 3 can also calculate the position of the workpiece exposure zone PSA based on the position of the workpiece marks WM formed in another exposure zone SA that has a predetermined positional relationship with the workpiece exposure zone PSA.

[0278] The workpiece mark WM can also be pre-formed on the workpiece W before the processing device 1 processes it. Alternatively, the workpiece mark WM can be formed by the processing device 1. For example, the processing device 1 can also irradiate the first exposure area SA (or a position having a predetermined positional relationship with the first exposure area SA) with processing light EL before starting to process the first exposure area SA, which is set as the exposure area PSA of the processing object, thereby forming the workpiece mark WM. At this time, the imaging device 15 can also take a picture of the workpiece mark WM formed in the first exposure area SA (or a position having a predetermined positional relationship with the first exposure area SA) during the processing device 1's processing of the first exposure area SA. The control device 3 can also calculate the position of the first exposure area SA based on the position of the workpiece mark WM formed in the first exposure area SA. Alternatively, during at least a portion of the processing of the first exposure area SA, which is designated as the exposure area PSA for the processing object, the processing apparatus 1 may irradiate the second exposure area SA (or, a position having a predetermined positional relationship with respect to the second exposure area SA, such as the first exposure area SA) with processing light EL, thereby forming a workpiece mark WM. In this case, the imaging apparatus 15 may also capture an image of the workpiece mark WM formed on the second exposure area SA (or, a position having a predetermined positional relationship with respect to the second exposure area SA, such as the first exposure area SA) during the processing of the second exposure area SA by the processing apparatus 1. The control device 3 may also calculate the position of the first exposure area SA based on the position of the workpiece mark WM formed on the second exposure area SA (or, a position having a predetermined positional relationship with respect to the second exposure area SA, such as the first exposure area SA).

[0279] During the period when the control device 3 controls the micro-motion drive system 143 based on the measurement results obtained from the imaging device 15, the processing head 13 is aligned with high precision relative to the PSA exposure area of ​​the workpiece by the micro-motion drive system 143. Therefore, during the period when the control device 3 controls the micro-motion drive system 143 based on the measurement results obtained from the imaging device 15, the self-driving system 141 and the arm drive system 142, which have lower movement accuracy than the micro-motion drive system 143, may not move the processing head 13.

[0280] Furthermore, during the period in step S13 when at least one of the self-driving system 141 and the arm-driving system 142 moves the processing head 13, the control device 3 can also control the micro-motion drive system 143 based on the measurement results obtained by the imaging device 15. That is, during the period in step S13 when at least one of the self-driving system 141 and the arm-driving system 142 moves the processing head 13, the imaging device 15 can also begin to photograph the workpiece W (especially the PSA area of ​​the processed object). The processing device 1 can also use the imaging device 15 to begin measuring the position of the workpiece W during the period in step S13 when at least one of the self-driving system 141 and the arm-driving system 142 moves the processing head 13.

[0281] During the period when the micro-motion drive system 143 is controlled based on the measurement results obtained from the imaging device 15, the processing device 1 begins processing the PSA of the object to be exposed. Specifically, the processing device 1 determines the processing content of the PSA of the object to be exposed based on the formula information, and irradiates the PSA of the object to be exposed with processing light EL to perform processing on the PSA of the object to be exposed corresponding to the determined processing content (step S15). For example, the processing device 1 may also use a galvanometer lens 1341 to irradiate the desired position within the PSA of the object to be exposed with processing light EL to form a rib structure based on the formula information in the PSA of the object to be exposed.

[0282] During the processing of the PSA exposure area of ​​the workpiece, the control device 3 controls the galvanometer lens 1341 based on the measurement results obtained from the processing head 13 and the formula information (step S16). That is, the control device 3 controls the micro-motion drive system 143 based on the measurement results obtained from the imaging device 15, and controls the galvanometer lens 1341 based on the measurement results obtained from the processing head 13. Specifically, during or after the movement of the processing head 13 caused by the micro-motion drive system 143 cooperating with the movement of the workpiece W relative to the processing head 13, the control device 3 controls the galvanometer lens 1341 based on the measurement results obtained from the processing head 13. However, if the processing device 1 does not include the galvanometer lens 1341, the processing system SYSa may not perform the operation in step S16.

[0283] Specifically, the control device 3 can also control the galvanometer mirror 1328, which can independently change the irradiation position of the measuring light ML2 on the surface of the workpiece W, thereby irradiating multiple locations on the workpiece exposure area PSA with the measuring light ML2. As a result, the control device 3 can determine the shape of the workpiece exposure area PSA (the shape of the surface portion of the workpiece W on which the workpiece exposure area PSA is set). In addition, the control device 3 can also irradiate multiple locations on the second exposure area SA, which will be set as the workpiece exposure area PSA, before the first exposure area SA is set as the workpiece exposure area PSA (for example, during the period when the second exposure area SA is set as the workpiece exposure area PSA). That is, the control device 3 can also predetermine the shape of the first exposure area SA, which will be set as the workpiece exposure area PSA, before the first exposure area SA is set as the workpiece exposure area PSA.

[0284] Subsequently, the control device 3 can also control the galvanometer mirror 1341 based on the determined shape of the workpiece exposure region PSA to irradiate the desired position within the workpiece exposure region PSA having the determined shape with processing light EL. As an example, if the operation of the galvanometer mirror 1341 is the same when irradiating the workpiece exposure region PSA with a planar surface shape as it is when irradiating the workpiece exposure region PSA with a curved surface shape, the characteristics of the processing light EL irradiated onto the surface of the workpiece exposure region PSA with a planar surface shape may differ from those irradiated onto the surface of the workpiece exposure region PSA with a curved surface shape. For example, the integrated flux of the processing light EL irradiated onto the surface of the workpiece exposure region PSA with a planar surface shape may differ from that irradiated onto the surface of the workpiece exposure region PSA with a curved surface shape. Therefore, the control device 3 can control the irradiation pattern of the processing light EL in the exposed region PSA of the workpiece independently of the difference in surface shape, by controlling the galvanometer lens 1341, so that the exposed region PSA of the workpiece can be processed based on the processing content indicated by the formula information. For example, the control device 3 can also control the galvanometer lens 1341 independently of the difference in surface shape of the exposed region PSA of the workpiece to process the exposed region PSA of the workpiece based on the processing content indicated by the formula information. For example, the control device 3 can also control at least one of the movement direction, movement amount, and movement speed of the focusing position of the processing light EL in at least one of the X-axis and Y-axis directions of the head coordinate system by controlling the galvanometer lens 1341.

[0285] The galvanometer lens 1341 can also be an optical system as described below, that is, in addition to moving the focusing position of the processing light EL along at least one of the X-axis and Y-axis directions of the head coordinate system, it can also move the focusing position of the processing light EL along the Z-axis direction of the head coordinate system (i.e., the travel direction of the processing light EL). The focusing position of the processing light EL along the Z-axis direction of the head coordinate system can also be called the focal position. Therefore, the galvanometer lens 1341 can also be called a focal position changing device. That is, the galvanometer lens 1341 can also be an optical system that can change the relative positional relationship between the focusing position of the processing light EL and the surface of the workpiece W along the Z-axis direction of the head coordinate system. In this case, the control device 3 can also control the galvanometer lens 1341 independently of the surface shape difference of the exposed area PSA of the workpiece to process the exposed area PSA of the workpiece based on the processing content represented by the formula information. For example, the control device 3 can also control at least one of the moving direction, moving amount, and moving speed of the focusing position of the processing light EL in the Z-axis direction of the head coordinate system by controlling the galvanometer lens 1341. The control device 3 can also control the galvanometer lens 1341 independently of the difference in the surface shape of the PSA exposed area of ​​the workpiece, so as to set the focusing position of the processing light EL on or near the surface of the PSA exposed area of ​​the workpiece.

[0286] Furthermore, the aforementioned focusing position adjustment optical system 1313 is an optical system capable of moving the focusing position (focal position) of the processing light EL along the Z-axis direction of the head coordinate system (i.e., the travel direction of the processing light EL). Therefore, the control device 3 can also control the focusing position adjustment optical system 1313 based on the measurement results of the measuring light ML2 used by the processing head 13, except for or replacing the galvanometer mirror 1341.

[0287] After processing of the PSA in the exposed area of ​​the workpiece begins, the control device 3 determines whether the processing of the PSA in the exposed area of ​​the workpiece has been completed (step S17). If the determination result in step S17 is that the processing of the PSA in the exposed area of ​​the workpiece has not been completed (step S17: No), the processing system SYSa repeats the actions from step S14 to step S17. That is, the processing system SYSa continues to process the PSA in the exposed area of ​​the workpiece.

[0288] On the other hand, if the determination result in step S17 is that the processing of the exposure area PSA of the workpiece has been completed (step S17: Yes), then the control device 3 determines whether to process another exposure area SA (step S18). That is, after setting another exposure area SA as the new exposure area PSA of the workpiece, the control device 3 determines whether to start the processing of the new exposure area PSA of the workpiece (step S18). For example, if the processing of at least one of the multiple exposure areas SA set on the workpiece W has not been completed, the control device 3 may also determine to process at least one of the unprocessed exposure areas SA. For example, if the processing of all the multiple exposure areas SA set on the workpiece W has been completed, the control device 3 may also determine that it is not necessary to process another exposure area SA.

[0289] If the determination result in step S18 is that another exposure area SA should be processed (step S18: Yes), then the processing system SYSa repeats the actions from step S11 to step S18. That is, after setting the other exposure area SA as the new processing target exposure area PSA, the processing system SYSa processes the new processing target exposure area PSA. On the other hand, if the determination result in step S18 is that another exposure area SA should not be processed (step S18: No), then the processing system SYSa can also end. Figure 12 The processing actions shown.

[0290] (1-6) Technical effects of the SYSa machining system

[0291] The machining system SYSa described above can appropriately machine workpiece W using machining light EL. Furthermore, the machining system SYSa can measure the position of workpiece W using at least one of the imaging device 15, machining head 13, and measuring device 2. Furthermore, the machining system SYSa can use measuring device 2 to measure the position of machining head 13. Therefore, the machining system SYSa can determine the relative positional relationship between machining head 13 and workpiece W with high precision, thereby enabling high-precision alignment of machining head 13 relative to workpiece W. As a result, the machining system SYSa can machine workpiece W with high precision.

[0292] In addition, the machining system SYSa can use at least one of the imaging device 15, the machining head 13, and the measuring device 2, which function as three measuring devices with different measurement methods, to measure the position of at least one of the workpiece W and the machining head 13. Therefore, the machining system SYSa can measure the position of an object that is difficult to measure using the measuring device with the first measurement method by using a measuring device with a second measurement method different from the first measurement method. Therefore, compared with the machining system of the comparative example that does not include multiple measuring devices with different measurement methods, the machining system SYSa can measure the position of at least one of the workpiece W and the machining head 13 with high accuracy.

[0293] (2) The machining system SYSb of the second embodiment

[0294] Then, while referring to Figure 17 The machining system SYS of the second embodiment (hereinafter, the machining system SYS of the second embodiment will be referred to as "machining system SYSb") will be described. Figure 17 This is a system structure diagram showing the system structure of the processing system SYSb in the second embodiment.

[0295] like Figure 17 As shown, the processing system SYSb of the second embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1b instead of the processing device 1. Other features of the processing system SYSb may also be the same as those of the processing system SYSa. The processing device 1b differs from the processing device 1 in that it includes a distance meter 15b in addition to or instead of the imaging device 15. Other features of the processing device 1b may also be the same as those of the processing device 1.

[0296] Unlike the imaging device 15, which measures the position of workpiece W by photographing it, the distance meter 15b measures the position of workpiece W by irradiating it with a measuring light, such as a laser, and detecting the measuring light from the workpiece W. In this case, the distance meter 15b irradiates the workpiece W with measuring light without passing through the optical systems (especially at least the fθ lens 1342) included in the processing head 13. Furthermore, the distance meter 15b detects the measuring light from the workpiece W without passing through the optical systems (especially at least the fθ lens 1342) included in the processing head 13. Therefore, the distance meter 15b can also function as a measuring device that measures the position of workpiece W without passing through the optical systems (especially at least the fθ lens 1342) included in the processing head 13. Other features of the distance meter 15b are also the same as those of the imaging device 15.

[0297] The distance meter 15b can also function as a measuring device, similar to the processing head 13 that emits the measuring light ML2, to measure the position of the workpiece W (especially the position of the part irradiated by the measuring light) in the direction of the measuring light (e.g., the Z-axis direction of the head coordinate system). Furthermore, the distance meter 15b can also irradiate the measuring light onto multiple parts of the workpiece W. In this case, the distance meter 15b can also function as a measuring device, similar to the processing head 13 that emits the measuring light ML2, to measure the shape of the workpiece W.

[0298] The measurement results obtained from the distance meter 15b can also be used for the same purposes as the measurement results obtained from the imaging device 15. For example, the control device 3 can also control the micro-motion drive system 143 (see reference) based on the measurement results obtained from the distance meter 15b. Figure 12 Step S14).

[0299] The distance meter 15b is configured (i.e., mounted or fixed) on the processing head 13 in the same way as the imaging device 15. That is, the configuration of the distance meter 15b can also be the same as that of the imaging device 15. Therefore, the distance meter 15b moves along with the processing head 13.

[0300] Additionally, as an example of the distance meter 15b, a time-of-flight (TOF) sensor can be cited. Moreover, if the machining system SYSb includes the distance meter 15b in addition to the imaging device 15, the machining system SYSb can also use an RGB-D sensor (i.e., a depth-measuring sensor) to measure the position of the machining head 13.

[0301] The machining system SYSb of this second embodiment can enjoy the same effects as the machining system SYSa of the first embodiment.

[0302] (3) The machining system SYSc of the third embodiment

[0303] Then, while referring to Figure 18 The machining system SYS of the third embodiment (hereinafter, the machining system SYS of the third embodiment will be referred to as "machining system SYSc") will be described. Figure 18 This is a system structure diagram showing the system structure of the machining system SYSc in the third embodiment.

[0304] like Figure 18As shown, the machining system SYSc of the third embodiment differs from the machining system SYSa of the first embodiment in that it includes machining device 1c instead of machining device 1. Furthermore, compared to machining system SYSa, machining system SYSc may not include measuring device 2. However, machining system SYSc may include measuring device 2. Other features of machining system SYSc may be the same as those of machining system SYSa. Compared to machining device 1, machining device 1c differs in that it includes satellite positioning device 16c. Other features of machining device 1c may be the same as those of machining device 1.

[0305] The satellite positioning device 16c is similar to the measuring device 2 in that it can measure the position of at least one of the processing head 13 and the workpiece W. However, the method by which the satellite positioning device 16c measures the position of at least one of the processing head 13 and the workpiece W differs from the method used by the measuring device 2. Specifically, the satellite positioning device 16c uses a satellite positioning system such as the Global Positioning System (GPS) to measure the position of at least one of the processing head 13 and the workpiece W. Therefore, the satellite positioning device 16c may also include a receiving device configured at a fixed position relative to at least one of the processing head 13 and the workpiece W (i.e., a position whose positional relationship with at least one of the processing head 13 and the workpiece W does not change), and can receive signals from artificial satellites constituting the satellite positioning system. The reception result obtained by the receiving device (i.e., the measurement result obtained by the satellite positioning device 16c) is output to the control device 3. The control device 3 calculates the position of at least one of the processing head 13 and the workpiece W, on which the receiving device is configured, based on the reception result obtained by the receiving device. Alternatively, the machining system SYSc may include a regional positioning device in addition to or in place of the satellite positioning device 16c. That is, the machining system SYSc may use a regional positioning device to measure the position of at least one of the machining head 13 and the workpiece W, in addition to or in place of the satellite positioning device 16c.

[0306] The machining system SYSc of this third embodiment can enjoy the same effects as the machining system SYSa of the first embodiment.

[0307] Furthermore, the machining system SYSb of the second embodiment may also include components unique to the machining system SYSc of the third embodiment. The components unique to the machining system SYSc of the third embodiment may also include components related to the satellite positioning device 16c.

[0308] (4) The machining system SYSd in the fourth embodiment

[0309] Then, while referring to Figure 19 The machining system SYS of the fourth embodiment (hereinafter, the machining system SYS of the fourth embodiment will be referred to as "machining system SYSd") will be described. Figure 19 This is a system structure diagram showing the system structure of the processing system SYSd in the fourth embodiment.

[0310] like Figure 19 As shown, the machining system SYSd of the fourth embodiment differs from the machining system SYSa of the first embodiment in that it includes machining device 1d instead of machining device 1. Furthermore, compared to machining system SYSa, machining system SYSd may not include measuring device 2. However, machining system SYSd may include measuring device 2. Other features of machining system SYSd may be the same as those of machining system SYSa. Compared to machining device 1, machining device 1d differs in that it includes gyroscope sensor 16d. Other features of machining device 1d may be the same as those of machining device 1.

[0311] The gyroscope sensor 16d is an angular velocity detection device capable of detecting the angular velocity of the machining head 13. Therefore, the gyroscope sensor 16d can also be configured on the machining head 13. The angular velocity of the machining head 13 detected by the gyroscope sensor 16d is output to the control device 3. The control device 3 can also calculate the position of the machining head 13 based on the angular velocity of the machining head 13. For example, the control device 3 can also calculate the amount of movement of the machining head 13 by integrating the angular velocity of the machining head 13, and calculate the position of the machining head 13 based on the amount of movement of the machining head 13. More specifically, the gyroscope sensor 16d can also be considered as a measuring device capable of measuring the position of the machining head 13.

[0312] The machining system SYSd may include, in addition to or instead of the gyroscope sensor 16d that detects the angular velocity of the machining head 13, a gyroscope sensor 16d that detects the angular velocity of the workpiece W. The gyroscope sensor 16d that detects the angular velocity of the workpiece W may also be disposed on the workpiece W. The angular velocity of the workpiece W detected by the gyroscope sensor 16d is output to the control device 3. The control device 3 may also calculate the position of the workpiece W based on the angular velocity of the workpiece W. For example, the control device 3 may also calculate the amount of movement of the workpiece W by integrating the angular velocity of the workpiece W, and calculate the position of the workpiece W based on the amount of movement. Therefore, the gyroscope sensor 16d can also be considered as a measuring device capable of measuring the position of the workpiece W.

[0313] The machining system SYSd of this fourth embodiment can enjoy the same effects as the machining system SYSa of the first embodiment.

[0314] Furthermore, at least one of the machining systems SYSb of the second embodiment to SYSc of the third embodiment may also include components unique to the machining system SYSd of the fourth embodiment. The components unique to the machining system SYSd of the fourth embodiment may also include components related to the gyroscope sensor 16d.

[0315] (5) The machining system SYSe of the fifth embodiment

[0316] Then, while referring to Figure 20 as well as Figure 21 The machining system SYS of the fifth embodiment (hereinafter, the machining system SYS of the fifth embodiment will be referred to as "machining system SYSe") will be described. Figure 20 This is a system structure diagram showing the system structure of the processing system SYSe in the fifth embodiment. Figure 21 This is a front view showing the appearance of the processing device 1e of the processing system SYSe according to the fifth embodiment.

[0317] like Figure 20 as well as Figure 21 As shown, the processing system SYSe of the fifth embodiment differs from the processing system SYSa of the first embodiment in that it includes a processing device 1e instead of a processing device 1. Other features of the processing system SYSe may also be the same as those of the processing system SYSa. The processing device 1e differs from the processing device 1 in that it includes a head drive system 14e instead of a head drive system 14. Other features of the processing device 1e may also be the same as those of the processing device 1. The head drive system 14e differs from the head drive system 14 in that it includes a flight drive system 141e in addition to or instead of a self-propelled drive system 141. Other features of the head drive system 14e may also be the same as those of the head drive system 14.

[0318] The flight drive system 141e differs from the self-propelled drive system 141, which can move autonomously on the support surface SS, in that it can fly away from the support surface SS. That is, the flight drive system 141e differs from the self-propelled drive system 141, which moves the machining head 13 autonomously on the support surface SS, in that it moves the machining head 13 by flying away from the support surface SS. Furthermore, the position away from the support surface SS can also refer to at least one of a position different from the position of the support surface SS, or a position where there is space between the flight drive system 141e and the support surface SS. Moreover, the flight state of the flight drive system 141e can also refer to the state in which the flight drive system 141e is flying in the air. Other features of the flight drive system 141e may also be the same as other features of the self-propelled drive system 141.

[0319] The machining system SYSe of this fifth embodiment can enjoy the same effects as the machining system SYSa of the first embodiment.

[0320] Furthermore, at least one of the processing systems SYSb of the second embodiment to SYSd of the fourth embodiment may also include components unique to the processing system SYSe of the fifth embodiment. The components unique to the processing system SYSe of the fifth embodiment may also include components related to the flight drive system 141e.

[0321] (6) The machining system SYSf in the sixth embodiment

[0322] Then, while referring to Figure 22 The machining system SYS of the sixth embodiment (hereinafter, the machining system SYS of the sixth embodiment will be referred to as "machining system SYSf") will be described. Figure 22 This is a system structure diagram showing the system structure of the processing system SYSf in the sixth embodiment.

[0323] like Figure 22 As shown, the machining system SYSf of the sixth embodiment differs from the machining system SYSa of the first embodiment in that it includes multiple machining devices 1. Figure 22 In the example shown, the machining system SYSf includes n (where n is an integer greater than 2) machining devices 1 (specifically, machining devices 1#1 to machining devices 1#n). Other characteristics of the machining system SYSf may also be the same as those of the machining system SYSa.

[0324] Multiple processing devices 1 are respectively equivalent to the aforementioned processing device 1. Therefore, each processing device 1#k (where k is a variable representing an integer greater than 1 and less than n) includes a processing light source 11, a measuring light source 12, a processing head 13, a head drive system 14 (i.e., a self-driving system 141, an arm drive system 142, and a micro-motion drive system 143), and an imaging device 15. Furthermore, for ease of explanation, the reference numerals for the constituent elements included in the processing device 1#k and the inherent constituent elements of the processing device 1#k will be appended to the end of their respective reference numerals.

[0325] Multiple processing units 1 are respectively arranged in multiple processing spaces (PSPs). Specifically, a plan view showing the arrangement of the multiple processing units 1 is provided. Figure 23 As shown, machining device 1#1 can also be configured in machining space PSP#1, machining device 1#2 in machining space PSP#2, ..., machining device 1#n in machining space PSP#n. The head drive system 14#k can also move the machining head 13#k within the machining space PSP#k. Alternatively, the head drive system 14#k can move the machining head 13#k in a manner that prevents the machining head 13#k from protruding (and consequently, the machining device 1#k from protruding) outside the machining space PSP#k. The machining device 1#k processes the portion of the workpiece W contained within the machining space PSP#k. That is, the machining device 1#k irradiates the area of ​​the surface of the workpiece W contained within the machining space PSP#k with machining light EL, thereby processing the area. Specifically, as... Figure 23 As shown, machining device 1#1 processes region WP#1 on the surface of workpiece W, which is contained within machining space PSP#1; machining device 1#2 processes region WP#2 on the surface of workpiece W, which is contained within machining space PSP#2; ..., machining device 1#n processes region WP#n on the surface of workpiece W, which is contained within machining space PSP#n.

[0326] The processing space #k may also not repeat with a processing space PSP#m that is different from processing space #k (where m is a variable representing an integer greater than 1 and less than n that is different from variable k). Alternatively, the processing space #k may also at least partially repeat with the processing space PSP#m. Figure 23 In the example shown, machining spaces PSP#1 and PSP#2 partially overlap.

[0327] The measuring device 2 measures the positions of multiple processing heads 13 included in each of the multiple processing devices 1. That is, the measuring device 2 (i) measures the position of processing head 13#1 of processing device 1#1 by irradiating the processing device 1#1 with measuring light ML3, (ii) measures the position of processing head 13#2 of processing device 1#2 by irradiating the processing device 1#2 with measuring light ML3, ..., (n) measures the position of processing head 13#n of processing device 1#n by irradiating the processing device 1#n with measuring light ML3. Therefore, the measuring space MSP of the measuring device 2 may also include multiple processing spaces PSP#1 to PSP#n. In addition, the measuring space MSP may also refer to the space in which the measuring device 2 can measure the position of an object existing inside it.

[0328] Control device 3 controls multiple processing devices 1 respectively. To control processing device 1#k, control device 3 may also use at least the position measurement results of imaging device 15#k on workpiece W, the position measurement results of processing head 13#k on workpiece W, and the position measurement results of measuring device 2 on processing head 13#k. For example, control device 3 may also... Figure 12 In step S13, the self-driving system 141#1 and the arm driving system 142#k are controlled based on the position measurement results of the machining head 13#k by the measuring device 2, so that the machining head 13#k moves toward the PSA (hereinafter referred to as the machining object exposure area PSA#k) to be processed by the machining device 1#k. At this time, the control device 3 can also control the head driving system 14#k (especially the self-driving system 141#k and the arm driving system 142#k) and the head driving system 14#m (especially the self-driving system 141#m and the arm driving system 142#m) so that the machining device 1#k does not collide with other machining devices 1#m. In particular, when the machining space PSP#k and the machining space PSP#m overlap at least partially, the control device 3 can also control the head driving system 14#k and the head driving system 14#m so that the machining device 1#k does not collide with other machining devices 1#m. For example, the control device 3 can also... Figure 12 In step S14, the micro-motion drive system 143#k is controlled based on the measurement results obtained from the imaging device 15#k, so as to fix the relative positional relationship between the exposure area PSA#k of the workpiece and the processing head 13#k (especially the fθ lens 1342#k). For example, the control device 3 can also be used in... Figure 12 In step S16, the galvanometer mirror 1341#k is controlled based on the measurement results obtained from the processing head 13#k.

[0329] The control device 3 can also control multiple processing devices 1 to simultaneously process workpiece W. Alternatively, the control device 3 can control multiple processing devices 1 to simultaneously process workpiece W at least two of them. Or, the control device 3 can control multiple processing devices 1 to process workpiece W at least one of them, while at least another of them does not process workpiece W.

[0330] The machining system SYSf of this sixth embodiment can enjoy the same effects as the machining system SYSa of the first embodiment. In particular, when at least two machining devices 1 process workpiece W simultaneously, the productivity related to the processing of workpiece W is increased.

[0331] Furthermore, at least one of the machining systems SYSb of the second embodiment to SYSe of the fifth embodiment may also include the constituent elements unique to the machining system SYSf of the sixth embodiment. The constituent elements unique to the machining system SYSf of the sixth embodiment may also include constituent elements related to the plurality of machining devices 1.

[0332] (7) The machining system SYSg of the seventh embodiment

[0333] Then, while referring to Figure 24 The machining system SYS of the seventh embodiment (hereinafter, the machining system SYS of the seventh embodiment will be referred to as "machining system SYSg") will be described. Figure 24 This is a system structure diagram showing the system structure of the processing system SYSg in the seventh embodiment.

[0334] like Figure 24 As shown, the machining system SYSg of the seventh embodiment differs from the machining system SYSf of the sixth embodiment in that it includes multiple measuring devices 2. Figure 24 In the example shown, the machining system SYSg includes two measuring devices 2 (specifically, measuring device 2#1 and measuring device 2#2). However, the machining system SYSg may also include more than three measuring devices 2. Other features of the machining system SYSf may also be the same as those of the machining system SYSa.

[0335] Each measuring device 2 measures the position of at least one machining head 13 existing within its measurement space MSP. For example, a plan view showing the arrangement of multiple machining devices 1 is provided. Figure 25 As shown, measuring device 2#1 measures the position of at least one machining head 13 existing within the measuring space MSP#1 of measuring device 2#1. On the other hand, measuring device 2#2 measures the position of at least one machining head 13 existing within the measuring space MSP#2 of measuring device 2#2. Figure 25 In the example shown, within the measurement space MSP#1, there are n1 (where n1 is an integer greater than or equal to 1) processing devices 1 (specifically, processing devices 1#1-1 to 1#1-n1). Therefore, the measuring device 2#1 measures the positions of the processing heads 13#1-1 to 13#1-n1, respectively, included in processing devices 1#1-1 to 1#1-n1. Furthermore, Figure 25 In the example shown, within the measurement space MSP#2, there are n2 (where n2 is an integer greater than or equal to 1) processing devices 1 (specifically, processing devices 1#2-1 to processing devices 1#2-n2). Therefore, the measuring device 2#2 measures the positions of the processing heads 13#2-1 to 13#2-n2 respectively included in processing devices 1#2-1 to 1#2-n2.

[0336] A measurement space MSP may not repeat another measurement space MSP that is different from another measurement space MSP. Alternatively, a measurement space MSP may at least partially repeat another measurement space MSP. Figure 25 In the example shown, measurement space MSP#1 and measurement space MSP#2 partially overlap.

[0337] Machining devices 1#1-1 to 1#1-n1 are respectively arranged within multiple different machining spaces PSPs contained in the measuring space MSP#1. Specifically, they can also be arranged as follows: Figure 25 As shown, machining device 1#1-1 is configured in machining space PSP#1-1, machining device 1#1-2 is configured in machining space PSP#1-2, ..., machining device 1#1-n1 is configured in machining space PSP#1-n1. At this time, machining device 1#1-1 processes the region WP#1-1 on the surface of workpiece W contained within machining space PSP#1-1, machining device 1#1-2 processes the region WP#1-2 on the surface of workpiece W contained within machining space PSP#1-2, ..., machining device 1#1-n1 processes the region WP#1-n1 on the surface of workpiece W contained within machining space PSP#1-n1.

[0338] Similarly, machining devices 1#2-1 to 1#2-n2 are respectively arranged within different machining spaces PSP contained in the measuring space MSP#2. Specifically, it can also be as follows: Figure 25As shown, machining device 1#2-1 is configured in machining space PSP#2-1, machining device 1#2-2 is configured in machining space PSP#2-2, ..., machining device 1#2-n2 is configured in machining space PSP#2-n2. At this time, machining device 1#2-1 processes region WP#2-1 of the surface of workpiece W, which is contained within machining space PSP#2-1; machining device 1#2-2 processes region WP#2-2 of the surface of workpiece W, which is contained within machining space PSP#2-2; ..., machining device 1#2-n2 processes region WP#2-n2 of the surface of workpiece W, which is contained within machining space PSP#2-n2.

[0339] Control device 3 controls multiple processing devices 1 respectively. To control processing devices 1#1-k1 (where k1 is a variable representing an integer greater than 1 and less than n1), control device 3 may also use at least the position measurement results of the imaging device 15#1-k1 of processing devices 1#1-k1 on the workpiece W, the position measurement results of the processing head 13#1-k1 of processing devices 1#1-k1 on the workpiece W, and the position measurement results of the measuring device 2#1 on the processing head 13#1-k1 of processing devices 1#1-k1. On the other hand, to control processing devices 1#2-k2 (where k2 is a variable representing an integer greater than 1 and less than n2), control device 3 may also use at least the position measurement results of the imaging device 15#2-k2 of processing devices 1#2-k2 on the workpiece W, the position measurement results of the processing head 13#2-k2 of processing devices 1#2-k2 on the workpiece W, and the position measurement results of the measuring device 2#2 on the processing head 13#2-k2 of processing devices 1#2-k2. Furthermore, in the seventh embodiment, the method by which the control device 3 controls the multiple processing devices 1 can be the same as that in the sixth embodiment, therefore its detailed description is omitted. However, in the seventh embodiment, the control device 3... Figure 12 In step S13, when the processing head 13 is moved, the head drive system 14#1-k1 of the processing device 1#1-k1 and the head drive system 14#2-k2 of the processing device 1#2-k2 can also be controlled based on the measurement results obtained by the measuring device 2#1 and the measuring device 2#2, so that the processing device 1#1-k1 will not collide with the processing device 1#2-k2.

[0340] The machining system SYSg of this seventh embodiment can enjoy the same effects as the machining system SYSf of the sixth embodiment.

[0341] Furthermore, in the machining system SYSf of the sixth embodiment and the machining system SYSg of the seventh embodiment, the number of measuring devices 2 is less than the number of machining devices 1. However, the number of measuring devices 2 may also be greater than the number of machining devices 1. Moreover, the number of machining devices 1 and the number of measuring devices 2 may also be the same.

[0342] Furthermore, at least one of the machining systems SYSb of the second embodiment to SYSe of the fifth embodiment may also include components unique to the machining system SYSg of the seventh embodiment. The components unique to the machining system SYSg of the seventh embodiment may also include components related to the plurality of measuring devices 2.

[0343] (8) Variations

[0344] In the described description, the machining system SYS uses an imaging device 15 to measure the position of the workpiece W, uses the measuring light ML2 via the measuring optical system 132 to measure the position of the workpiece W, and uses the measuring device 2 to measure the position of at least one of the machining head 13 and the workpiece W. However, the machining system SYS may also not use the imaging device 15 to measure the position of the workpiece W. In this case, the machining system SYS may not include the imaging device 15. The machining system SYSa may also not perform... Figure 12 The action in step S14. Furthermore, the machining system SYS may not use the measuring light ML2 via the measuring optical system 132 to measure the position of the workpiece W. In this case, the machining system SYS may not include the components required to illuminate the workpiece W with the measuring light ML2 (specifically, the measuring light source 12 and the measuring optical system 132). The machining system SYSa may also not perform... Figure 12 The action in step S16. The machining system SYS may also not use measuring device 2 to measure the position of at least one of the machining head 13 and the workpiece W. In this case, the machining system SYS may not include measuring device 2.

[0345] In the description, the machining system SYS includes a machining head 13 capable of emitting machining light EL. However, the machining system SYS may also include a machining head 13h, in addition to or instead of the machining head 13 capable of emitting machining light EL, which includes an arbitrary end effector 136h capable of performing arbitrary actions on the workpiece W. An example of a machining head 13h including an end effector 136h is shown below. Figure 26 . Figure 26In the example shown, the end effector 136h is mounted on the head frame 135. The machining system SYS including this end effector 136h can also be referred to as a robot system. The machining head 13h may differ from the machining head 13 in that it may not include components related to the machining light EL (specifically, the machining optical system 131). Furthermore, if the machining head 13h does not include components related to the machining light EL, it may not combine the machining light EL with the measurement light ML2, and therefore may not include the combining optical system 133. However, the machining head 13h may also include components related to the machining light EL and the combining optical system 133.

[0346] In the description, the processing apparatus 1 processes the workpiece W by irradiating it with processing light EL. However, the processing apparatus 1 may also irradiate the workpiece W with an arbitrary energy beam (which may also be referred to as a "processing beam") that is different from light to process the workpiece W. In this case, the processing apparatus 1 may include a beam source capable of generating arbitrary energy beams, in addition to or in place of the processing light source 11. Examples of arbitrary energy beams include charged particle beams such as electron beams and focused ion beams. Another example of an arbitrary energy beam is an electromagnetic wave.

[0347] Alternatively, the processing apparatus 1 may also use a tool to process the workpiece W. That is, the processing apparatus 1 may also perform machining on the workpiece W. In this case, the processing head 13 may include a tool in addition to or in place of the optical systems. However, even when the processing apparatus 1 performs machining, when the processing head 13 uses the measuring light ML2 to measure the position of the workpiece W, the processing head 13 may include an optical system (specifically, a measuring optical system 132 and an objective lens optical system 134) required to irradiate the workpiece W with the measuring light ML2.

[0348] The processing apparatus 1 may also include an exhaust device. The exhaust device may be able to exhaust gas from the processing space where the workpiece W is disposed. In particular, the exhaust device may be able to extract excess material generated by the irradiation of the processing light EL from the processing space to the outside of the processing space by exhausting the gas within the processing space. Especially when the excess material is present in the optical path of the processing light EL, the excess material may affect the irradiation of the processing light EL onto the workpiece W. Therefore, the exhaust device may also extract excess material along with the gas in the space, particularly the space containing the end optical element of the processing head 13, i.e., the fθ lens 1342, and the workpiece W. Furthermore, as an example of excess material, vapor of the workpiece W (i.e., gas containing fine particles condensed from the vapor of the workpiece W, so-called smog) can be listed.

[0349] The processing apparatus 1 may also include a gas supply device. The gas supply device may also supply gas to the processing space where the workpiece W is disposed. In particular, by supplying gas to the processing space, the gas supply device may also prevent excess material generated by the irradiation of the processing light EL from adhering to the processing head 13 (especially the end optical element of the processing head 13, i.e., the fθ lens 1342) located within the processing space. The gas supply device may also blow away (i.e., remove) excess material adhering to the processing head 13 (especially the end optical element of the processing head 13, i.e., the fθ lens 1342) by supplying gas to the processing space.

[0350] The elements of the various embodiments described can be appropriately combined. Some of the elements of the various embodiments may also be omitted. The elements of the various embodiments can be appropriately substituted for the elements of other embodiments. Furthermore, to the extent permitted by law, all publicly available publications and U.S. patent publications relating to the apparatus, etc., cited in the various embodiments are incorporated herein by reference.

[0351] Furthermore, the present invention may be appropriately modified without departing from the spirit or idea of ​​the invention as can be read from the claims and the specification as a whole, and the processing system accompanying the modifications described above is also included in the technical concept of the present invention.

Claims

1. A processing system that illuminates an object with processing light to process the object, the processing system comprising: An irradiation device that irradiates the object with processing light via at least a terminal optical element in an irradiation optical system; A moving device to move the irradiation device; A first measuring device is disposed in the irradiation device and measures the position of the object; The second measuring device measures the position of the object via at least the end optical element of the illumination optical system; as well as The third measuring device measures the position of the irradiation device. The third measuring device irradiates measuring light toward the irradiation device from a position away from the irradiation device, and detects the measuring light to measure the position of the irradiation device.

2. The processing system according to claim 1, wherein The first measuring device is positioned fixed relative to the end optical element and measures the position of the object. The third measuring device illuminates a measuring light onto a reflective portion fixed at a position relative to the end optical element, and detects the measuring light reflected by the reflective portion to measure the position of the reflective portion.

3. The processing system according to claim 1 or 2, wherein The first measuring device measures at least the position of the object in the direction intersecting with the irradiation direction of the processing light. The second measuring device measures the position of the object in the direction of the irradiation of the processing light via at least a portion of the irradiation optical system.

4. The processing system according to claim 1 or 2, further comprising: The driving device drives the irradiation device with a travel distance smaller than that of the moving device. The driving device drives the irradiation device based on the measurement results obtained from the first measuring device.

5. The processing system according to claim 4, wherein The moving device moves the irradiation device based on the measurement results obtained by the third measuring device. Measurements are initiated using the first measuring device during or after the irradiation device is moved by the moving device.

6. The processing system according to claim 4 further includes: A driving device drives the irradiation device with a travel distance smaller than that of the moving device; as well as A focal position changing device that changes the focal position of the processing light. The moving device moves the irradiation device and the first measuring device based on the measurement results obtained by the third measuring device. During or after the irradiation device moves via the moving device, the driving device drives the irradiation device in at least one direction based on the measurement results obtained by the first measuring device. The focal position changing device changes the focal position of the processing light based on the measurement results obtained by the second measuring device during or after the irradiation device is driven by the driving device.

7. The processing system according to claim 4, wherein The processing system processes the object based on the measurement results obtained by the first measuring device, the second measuring device, and the third measuring device.

8. The processing system according to claim 4, wherein The second measuring device illuminates the measuring light source from the measuring light source via at least a portion of the irradiation optical system and detects the measuring light source from the object via the irradiation optical system, thereby measuring the position of the object.

9. The processing system according to claim 4, wherein The distance from the irradiation device to the object is shorter than the distance between the third measuring device and the irradiation device.

10. The processing system according to claim 4, wherein The measurement resolution of the first measuring device and the measurement resolution of the second measuring device are higher than the measurement resolution of the third measuring device.

11. The processing system according to claim 4, further comprising: Control device, controlling the processing of the object. The control device identifies a designated area of ​​the object based on the measurement results of the first measuring device, and controls the irradiation device to remain stationary relative to the identified designated area.

12. The processing system according to claim 4, further comprising: Control device, controlling the processing of the object. The control device controls the moving device based on the measurement results of the third measuring device, so that the irradiation device moves toward a designated area of ​​the object. Based on the measurement results of the first measuring device, the designated area is identified, and control is performed to keep the irradiation device stationary relative to the identified designated area. The irradiation device is controlled to perform processing based on the measurement results of the second measuring device.

13. The processing system according to claim 1 or 2, further comprising: Control device, controlling the processing of the object. The control device determines the position of the irradiation device based on the measurement results obtained from the third measuring device. The location of the area on the object that can be illuminated by processing light is determined based on information used for processing the object, and Based on the determination of the position of the irradiation device and the position of the range, the moving device is controlled to move the irradiation device.

14. The processing system according to claim 1 or 2, wherein The moving device moves the irradiation device based on the measurement results obtained by the third measuring device. Measurements are initiated using the first measuring device during or after the irradiation device is moved by the moving device.

15. The processing system according to claim 1 or 2, further comprising: A driving device drives the irradiation device with a travel distance smaller than that of the moving device; as well as A focal position changing device that changes the focal position of the processing light. The moving device moves the irradiation device and the first measuring device based on the measurement results obtained by the third measuring device. The driving device drives the irradiation device in at least one direction based on the measurement results obtained by the first measuring device during or after the irradiation device moves via the moving device. The focal position changing device changes the focal position of the processing light based on the measurement results obtained by the second measuring device during or after the irradiation device is driven by the driving device.

16. The processing system according to claim 1 or 2, wherein The second measuring device illuminates the measuring light source from the measuring light source via at least a portion of the irradiation optical system and detects the measuring light source from the object via the irradiation optical system, thereby measuring the position of the object.

17. The processing system according to claim 1 or 2, wherein The distance from the irradiation device to the object is shorter than the distance between the third measuring device and the irradiation device.

18. The processing system according to claim 1 or 2, further comprising: Control device, controlling the processing of the object. The control device identifies a designated area of ​​the object based on the measurement results of the first measuring device, and controls the irradiation device to remain stationary relative to the identified designated area.

19. The processing system according to claim 1 or 2, wherein The first measuring device includes a first optical measuring device that illuminates the object with measuring light without passing through the illumination optical system and detects the measuring light from the object without passing through the illumination optical system, thereby enabling the measurement of the position of the object.

20. The processing system according to claim 1 or 2, wherein The first measuring device measures the position of the object without using at least the end optical element.

21. The processing system according to claim 1 or 2, wherein The second measuring device includes a second optical measuring device, which is capable of illuminating a measuring light source from a measuring light source via the illuminating optical system, and detecting the measuring light source from the object via the illuminating optical system.

22. The processing system according to claim 8, wherein The measuring light source is the first measuring light source. The second measuring device is capable of detecting the interference light between the measuring light source from the object and the reference light from the second measuring light source, which is transmitted through the illumination optical system.

23. The processing system according to claim 22, wherein At least one of the measuring light source and the reference light comprises pulsed light containing frequency components arranged at equal intervals on the frequency axis.

24. The processing system according to claim 1 or 2, wherein The third measuring device includes a third optical measuring device, which is capable of illuminating the measuring light and detecting the measuring light from the illuminating device.

25. The processing system according to claim 1 or 2, wherein The third measuring device includes a position measuring device capable of measuring the position of at least one of the irradiation device and the object from a position away from the irradiation device and the object.

26. The processing system according to claim 1 or 2, wherein The third measuring device includes an angular velocity detection device capable of detecting the angular velocity of the irradiation device.

27. The processing system according to claim 1 or 2, wherein The third measuring device includes a satellite positioning device that can use a satellite positioning system to measure the position of at least one of the illumination optical system and the object.

28. The processing system according to claim 1 or 2, wherein The third measuring device is capable of measuring the position of the irradiation device in at least one of the following directions: along the direction of the first measuring axis, along the direction of the second measuring axis intersecting the first measuring axis, along the direction of the third measuring axis intersecting both the first and second measuring axes, the rotation direction about the first measuring axis, the rotation direction about the second measuring axis, and the rotation direction about the third measuring axis.

29. The processing system according to claim 1 or 2, wherein The mobile device is a first mobile device. The processing system also includes: The driving device drives the irradiation device with a travel distance smaller than that of the first moving device; as well as The second moving device moves the irradiation device by a greater travel distance than the first moving device. The illumination optical system includes a focal position changing device, which changes the illumination position of the processing light on the surface of the object by changing the focal position of the processing light. The driving device includes: A first connecting member is connected to the irradiation device; The second connecting member is connected to the first moving device; A driving component moves the irradiation device relative to the object by changing the relative positional relationship between the first connecting component and the second connecting component; as well as The elastic member combines the first connecting member and the second connecting member. The first mobile device includes: The third connecting component is connected to the driving device; The fourth connecting member is connected to the second moving device; as well as A movable component, capable of moving to change the relative positional relationship between the third connecting component and the fourth connecting component. The second mobile device includes: The fifth connecting member is connected to the first moving device; and The moving mechanism causes the fifth connecting member to move relative to the object.

30. The processing system according to claim 29, wherein The movable component includes multiple arm components and a joint component that can movably connect the multiple arm components.

31. The processing system according to claim 29, wherein The moving mechanism includes at least one of a self-propelled device capable of operating independently without interfering with the object and a flying device capable of flying away from the position of the object.

32. The processing system according to claim 29, wherein The moving accuracy of the driving device is higher than that of the first moving device. The first mobile device has a higher mobility than the second mobile device.

33. The processing system according to claim 29, wherein The first action is to control at least one of the first and second moving devices based on the measurement results of the third measuring device and position information related to the position of the exposure area, so that the irradiation device moves to a position where the irradiation optical system can irradiate the exposure area of ​​the object's surface with the processing light. After the first action is performed, a second action is performed, which is: based on the measurement results of the first measuring device, the driving device is controlled to fix the relative positional relationship between the exposure area and at least the end optical element in the irradiation optical system, and based on the measurement results of the second measuring device and the processing content information representing the processing content of the exposure area, the focal position changing device is controlled to irradiate the processing light at the desired position of the exposure area.

34. The processing system according to claim 33, wherein During the first action, the driving device does not move the irradiation device, and the focus position changing device does not change the focus position. During the second action, the first and second moving devices do not move the irradiation device.

35. The processing system according to claim 33, wherein During the first action, after the second moving device moves the irradiation device, the first moving device moves the irradiation device.

36. A processing system for processing an object, the processing system comprising: Movable boom; An end effector, connected to a movable arm, is used to process the object; A first measuring device is fixed relative to the end effector and measures the position of the object; The second measuring device measures the position of the object via an illumination optical system; as well as A third measuring device illuminates measuring light toward the end effector from a position away from the end effector and detects the measuring light to measure the position of the end effector.

37. The processing system according to any one of claims 1, 2 or 36, wherein The processing system processes the object based on the measurement results obtained by the first measuring device, the second measuring device, and the third measuring device.

38. The processing system according to any one of claims 1, 2 or 36, wherein The measurement resolution of the first measuring device and the measurement resolution of the second measuring device are higher than the measurement resolution of the third measuring device.

39. The processing system according to claim 36, wherein The end effector includes an irradiation device for irradiating processing light for processing the object via at least an end optical element in an irradiation optical system. The processing system also includes: A moving device to move the irradiation device; as well as The driving device drives the irradiation device with a travel distance smaller than that of the moving device. The driving device drives the irradiation device based on the measurement results obtained from the first measuring device.

40. The processing system according to claim 36, wherein The end effector includes an irradiation device for irradiating processing light for processing the object via at least an end optical element in an irradiation optical system. The processing system also includes: A moving device to move the irradiation device; as well as Control device, controlling the processing of the object. The control device determines the position of the irradiation device based on the measurement results obtained from the third measuring device. The location of the area on the object that can be illuminated by processing light is determined based on information used for processing the object, and Based on the determination of the position of the irradiation device and the position of the range, the moving device is controlled to move the irradiation device.

41. The processing system according to claim 36, wherein The processing system processes the object by irradiating it with processing light through an irradiation optical system. The end effector includes an illumination device having at least an end optical element in the illumination optical system. The movable arm is a moving device that allows the irradiation device to move.

42. The processing system according to claim 41, further comprising: The drive mechanism drives the irradiation device with a travel distance smaller than the travel distance of the movable arm. The driving device drives the irradiation device based on the measurement results obtained from the first measuring device.

43. The processing system according to claim 41, wherein The movable arm moves the irradiation device based on the measurement results obtained from the third measuring device. Measurements are initiated using the first measuring device during or after the irradiation device is moved by the movable arm.

44. The processing system according to claim 41, further comprising: The driving device drives the irradiation device with a travel distance smaller than that of the movable arm. as well as A focal position changing device that changes the focal position of the processing light. The movable arm moves the irradiation device and the first measuring device based on the measurement results obtained from the third measuring device. The driving device drives the irradiation device in at least one direction based on the measurement results obtained by the first measuring device during or after the irradiation device moves via the movable arm. The focal position changing device changes the focal position of the processing light based on the measurement results obtained by the second measuring device during or after the irradiation device is driven by the driving device.

45. The processing system according to claim 41, wherein The second measuring device illuminates the measuring light source from the measuring light source via at least a portion of the irradiation optical system and detects the measuring light source from the object via the irradiation optical system, thereby measuring the position of the object.

46. ​​The processing system according to claim 41, wherein The distance from the irradiation device to the object is shorter than the distance between the third measuring device and the irradiation device.

47. The processing system according to claim 41, further comprising: Control device, controlling the processing of the object. The control device identifies a designated area of ​​the object based on the measurement results of the first measuring device, and controls the irradiation device to remain stationary relative to the identified designated area.

48. The processing system according to any one of claims 1, 2 or 36, wherein The first measuring device includes a camera capable of photographing the object.

49. The processing system according to claim 48, wherein The imaging device is capable of capturing object markings formed on the object.

50. The processing system according to any one of claims 1, 2 or 36, wherein The first measuring device is capable of measuring the position of the object in at least one of the following directions: along a first measuring axis, along a second measuring axis intersecting the first measuring axis, and in a rotational direction about a third measuring axis intersecting both the first and second measuring axes.

51. The processing system according to any one of claims 1, 2 or 36, wherein The second measuring device is capable of measuring the position of the object along a third measuring axis, which intersects both the first measuring axis and the second measuring axis that intersects the first measuring axis.

52. The processing system according to claim 51, wherein The second measuring device illuminates the object with measuring light from a measuring light source and detects the measuring light from the object, thereby measuring the position of the object. The direction along the third measuring axis is parallel to the direction along the illumination direction of the measuring light source.

53. The processing system according to any one of claims 1, 2 or 36, wherein The second measuring device illuminates multiple parts of the surface of the object with measuring light from a measuring light source, and detects the measuring light from the multiple parts via the illuminating optical system, thereby enabling the detection of the shape of the surface of the object.

54. The processing system according to any one of claims 1, 2 or 36, wherein The second measuring device is capable of measuring the position of the object in at least one of the following directions: the direction of a third measuring axis that intersects the first measuring axis and the second measuring axis that intersects the first measuring axis; the direction of rotation about the first measuring axis; and the direction of rotation about the second measuring axis.

55. The processing system according to claim 36, wherein The third measuring device includes an angular velocity detection device capable of detecting the angular velocity of the end effector.

56. The processing system according to claim 36, wherein The third measuring device includes a satellite positioning device that can use a satellite positioning system to measure the position of the end effector.

57. The processing system according to claim 36, wherein The third measuring device is capable of measuring the position of the end effector in at least one of the following directions: along the direction of the first measuring axis, along the direction of the second measuring axis intersecting the first measuring axis, along the direction of the third measuring axis intersecting both the first and second measuring axes, the rotation direction about the first measuring axis, the rotation direction about the second measuring axis, and the rotation direction about the third measuring axis.

58. The processing system according to claim 36, wherein The processing system processes the object based on the measurement results obtained by the first measuring device, the second measuring device, and the third measuring device. The processing system processes the object by irradiating it with processing light through an irradiation optical system. The end effector includes an illumination device having at least an end optical element in the illumination optical system. The movable arm is a moving device that allows the irradiation device to move.

59. A processing system for processing an object, the processing system comprising: The first irradiation device has at least a first end optical element in a first irradiation optical system that irradiates the object with a first processing light; The second irradiation device has at least a second end optical element in a second irradiation optical system that irradiates the object with a second processing light; as well as A measuring device is used to measure the positions of the first irradiation device and the second irradiation device. The first irradiation device processes a first region of the object. The second irradiation device processes a second region of the object. The measuring device is capable of measuring the positions of the first irradiation device and the second irradiation device from the position away from the first irradiation device, the second irradiation device, and the object.

60. The processing system according to claim 59, comprising: The first moving device moves the first irradiation device. The second moving device moves the second irradiation device. as well as The control device controls the first moving device and the second moving device. The control device moves the first irradiation device and the second irradiation device based on the results of the measuring device.

61. The processing system according to claim 60, wherein The control device moves the first irradiation device and the second irradiation device based on the measurement results of the measuring device, so that the first irradiation device and the second irradiation device will not collide.

62. The processing system according to any one of claims 59 to 61, wherein The first irradiation device is disposed in the first processing space. The second irradiation device is configured in a second processing space that is different from the first processing space.

63. The processing system according to any one of claims 59 to 61, wherein The measuring device is the first measuring device. The processing system includes: The third irradiation device has at least a third end optical element in a third irradiation optical system that irradiates the object with a third processing light; as well as The second measuring device measures the position of the third irradiation device. The third irradiation device processes the third region of the object. The second measuring device is capable of measuring the position of the third irradiation device from the position away from the third irradiation device and the object.

64. The processing system according to claim 63, comprising: The first moving device moves the first irradiation device. The second moving device moves the second irradiation device. A third moving device is used to move the third irradiation device; as well as The control device controls the first moving device to the third moving device. The control device moves the first irradiation device and the second irradiation device based on the measurement results of the first measuring device. The control device moves the third irradiation device based on the measurement results of the second measuring device.

65. The processing system according to claim 64, wherein The control device moves the first irradiation device to the third irradiation device based on the results of the first measuring device and the second measuring device, so that the first irradiation device, the second irradiation device and the third irradiation device will not collide.

66. The processing system according to claim 63, wherein The first irradiation device is disposed in the first processing space. The second irradiation device is configured in a second processing space, which is different from the first processing space. The third irradiation device is configured in a third processing space that is different from the first processing space and the second processing space.

67. A processing method comprising irradiating an object with processing light via an irradiation optical system to process the object, the processing method comprising: The position of the object is measured using a first measuring device, the first measuring device being disposed in an irradiation device and the irradiation device having at least an end optical element in the irradiation optical system; The position of the object is measured using a second measuring device via the illumination optical system; The position of the irradiation device is measured using a third measuring device, which irradiates measuring light toward the irradiation device from a position away from the irradiation device and detects the measuring light to measure the position of the irradiation device; and The irradiation device is moved using a mobile device.

68. A processing method comprising irradiating an object with processing light via an irradiation optical system to process the object, the processing method comprising: The position of the object is measured using a first measuring device, the first measuring device being disposed in an irradiation device and the irradiation device having at least an end optical element in the irradiation optical system; The position of the object is measured using a second measuring device via at least the end optical element in the illumination optical system; Using a third measuring device, a measuring light is shone toward the irradiation device from a position away from the irradiation device, and the measuring light is detected to measure the position of the irradiation device; and The irradiation device is moved using a mobile device.

69. A processing method for processing an object, the processing method comprising: The position of the object is measured using a first measuring device, which is fixed relative to an end effector connected to a movable arm and used to process the object. The position of the object is measured using a second measuring device via an illumination optical system; A third measuring device is used to illuminate a measuring light toward the end effector from a position away from the end effector, and the measuring light is detected to measure the position of the end effector.

70. A processing method for processing an object, the processing method comprising: A first region of the object is processed using a first irradiation device, the first irradiation device having at least a first end optical element in a first irradiation optical system that irradiates the object with a first processing light. The second region of the object is processed using a second irradiation device, the second irradiation device having at least a second end optical element in a second irradiation optical system that irradiates the object with a second processing light. The positions of the first irradiation device and the second irradiation device are measured using a measuring device capable of measuring the positions of the first irradiation device and the second irradiation device from a position away from the first irradiation device, the second irradiation device, and the object.

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