Processing system, tilt adjustment method, and computer storage medium

Abstract

A processing system is a processing system that processes an object, the processing system having: a holding portion that holds the object on an upper surface thereof; a holding base that holds the holding portion on an upper surface thereof; a processing portion that processes the object held by the holding portion; a tilt adjustment portion that adjusts a relative tilt between the holding portion or the holding base and the processing portion; and an information display portion that displays information related to the holding portion, the holding base, the processing portion, and the tilt adjustment portion, wherein the information display portion displays, in the same screen, an input portion for inputting relative distance information between the holding portion or the holding base and the processing portion, and an instruction portion for starting an operation of the tilt adjustment portion.

Description

Technical Field

[0001] This disclosure relates to a processing system, a tilt adjustment method, and a computer storage medium. Background Technology

[0002] Patent Document 1 discloses a grinding apparatus for grinding plate-shaped workpieces. The grinding apparatus includes a height measuring device mounting part for mounting a height measuring device. The height measuring device measures the height position of the holding surface of the holding plate relative to the support surface supporting the grinding wheel. The height measuring device is used to scan on the rotation track of the grinding wheel on the holding surface to measure the height position of the holding surface.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2013-141725 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The technology disclosed herein involves a machining system for grinding a workpiece, in which the relative inclination between the grinding surface of the grinding section used to grind the workpiece and the holding surface of the holding section used to hold the workpiece is appropriately adjusted.

[0008] Solution for solving the problem

[0009] One aspect of this disclosure is a processing system for processing an object, the processing system comprising: a holding part holding a substrate, which serves as the object to be processed, on its upper surface; a holding base holding the holding part on its upper surface; a processing part grinding the object to be processed held in the holding part; a tilt adjustment part adjusting the relative tilt between the upper surface of the holding part or the holding base and the grinding surface of the processing part based on distance information obtained by a measuring device that measures the relative distance between the upper surface of the holding part or the holding base and the grinding surface of the processing part; and an information display part displaying information related to the holding part, the holding base, the processing part, and the tilt adjustment part, wherein the information display part displays, on the same screen, an input part for inputting the relative distance information between the upper surface of the holding part or the holding base and the grinding surface of the processing part measured by the measuring device, and an indication part for initiating the operation of the tilt adjustment part.

[0010] The effects of the invention

[0011] According to this disclosure, in a machining system for grinding a workpiece, the relative inclination between the grinding surface of the grinding section used to grind the workpiece and the holding surface of the holding section used to hold the workpiece can be appropriately adjusted. Attached Figure Description

[0012] Figure 1 This is a top view showing an outline of the structure of the processing apparatus according to this embodiment.

[0013] Figure 2 This is a side view showing an example of the structure of each grinding section and the retaining disc.

[0014] Figure 3 This is an explanatory diagram showing the contact between each grinding section and the holding disc.

[0015] Figure 4 This is an explanatory diagram showing an example of the measurement area where the measuring instrument performs the measurement.

[0016] Figure 5 This is an explanatory diagram showing an example of the display panel according to this embodiment.

[0017] Figure 6 This is a flowchart illustrating the main steps of the tilt adjustment operation involved in this embodiment.

[0018] Figure 7 This is an explanatory diagram showing a summary of the acquisition of distance data by the measuring instrument.

[0019] Figure 8 This is an explanatory diagram showing the self-grinding of the retaining disc. Detailed Implementation

[0020] In recent years, in the manufacturing process of semiconductor devices, the semiconductor substrate (hereinafter referred to as "wafer") on which multiple electronic circuits and other devices are formed on the surface is ground to thin the wafer. The wafer grinding is performed, for example, by rotating the holding unit while holding the wafer on the side opposite to the grinding surface, and bringing the grinding tool of the grinding unit into contact with the grinding surface of the wafer.

[0021] In the wafer grinding process, the holding surface of the holding unit is adjusted to be parallel to the grinding surface of the grinding wheel to ensure uniform in-plane thickness of the wafer as a product. Patent Document 1 discloses a grinding apparatus that performs high-precision adjustment to make the holding surface parallel to the grinding surface. According to the grinding apparatus disclosed in Patent Document 1, a height measuring device mounted on a wheel mount supporting the grinding wheel is used to measure the height position of the holding surface of the holding disc (chuck) relative to the support surface (grinding surface) of the wheel mount, and the relative tilt between the holding surface and the grinding surface is adjusted based on the measurement value of the height measuring device.

[0022] However, in the grinding apparatus disclosed in Patent Document 1, it is necessary to repeatedly perform the same measurement and adjustment manually while confirming the measured value of the height measuring device until the holding surface is parallel to the grinding surface. Therefore, adjusting the inclination between the holding surface and the grinding surface requires a lot of time, and there is a possibility of operational errors and adjustment errors due to manual adjustment.

[0023] The technology disclosed herein was developed in view of the above circumstances. In a machining system that grinds a workpiece, the relative inclination between the grinding surface of the grinding section used to grind the workpiece and the holding surface of the holding section used to hold the workpiece is appropriately adjusted. Hereinafter, the machining apparatus of the machining system according to this embodiment, and the adjustment operation (hereinafter sometimes simply referred to as "inclination adjustment operation") for the relative inclination between the holding surface and the grinding surface will be described with reference to the accompanying drawings. Furthermore, in this specification and the accompanying drawings, elements having substantially the same functional structure are labeled with the same reference numerals, thereby omitting repeated descriptions.

[0024] In the processing apparatus 1 according to this embodiment, a process is performed to uniformly control the in-plane thickness of the wafer W, which is the object to be processed. Specifically, an inclination adjustment operation is performed between the holding surface and the grinding surface. More specifically, for example, when performing the grinding process of the wafer W, the holding surface of the holding disk, which serves as the holding part for holding the wafer W, is adjusted to be parallel to the grinding surface of the grinding part used to process the wafer W. In addition, for example, the relative inclination between the holding surface of the new holding disk and the grinding surface of the grinding part is adjusted, and in this state, the grinding part is used to perform self-grinding of the holding disk, thereby processing the holding disk into a desired shape for properly grinding the wafer W.

[0025] like Figure 1 As shown, the processing apparatus 1 has a structure in which a loading / unloading station 2 and a processing station 3 are connected as one unit. The loading / unloading station 2 is a container C capable of holding multiple wafers W, for example, for loading and unloading from the outside. The processing station 3 is equipped with various processing devices for performing desired processing on the wafers W.

[0026] A cassette loading stage 10 is provided at the loading / unloading station 2. Furthermore, a wafer transport area 20 is provided adjacent to the cassette loading stage 10 on the positive Y-axis side. A wafer transport device 22 is provided in the wafer transport area 20, and this wafer transport device 22 is configured to move freely on a transport path 21 extending along the X-axis direction.

[0027] The wafer transport device 22 includes a transport fork 23 for holding and transporting the wafer W. The transport fork 23 is configured to move freely in the horizontal and vertical directions, and to move freely about the horizontal and vertical axes. Furthermore, the wafer transport device 22 is configured to transport the wafer W to the cassette C of the cassette stage 10, the alignment section 50 (described later), and the first cleaning section 60 (described later).

[0028] In processing station 3, wafer W is subjected to grinding, cleaning, and other processes. Processing station 3 includes a conveying unit 30 for transporting wafer W, a grinding unit 40 for grinding wafer W, an alignment unit 50 for adjusting the horizontal orientation of wafer W before grinding, a first cleaning unit 60 for cleaning the ground wafer W, and a second cleaning unit 70.

[0029] The transport unit 30 is a multi-joint robot with multiple arms 31, for example, three arms 31. Each of the three arms 31 is configured to rotate freely. A transport pad 32 for adsorbing and holding the wafer W is installed on the front arm 31. In addition, the base arm 31 is installed on a lifting mechanism 33 for raising and lowering the arm 31 in the vertical direction. Moreover, the transport unit 30 is configured to transport the wafer W to the junction position A0 of the grinding unit 40, the alignment unit 50, the first cleaning unit 60, and the second cleaning unit 70.

[0030] A rotary table 41 is provided in the grinding section 40. Four holding disks 42 are provided on the rotary table 41 as holding portions for holding the wafer W. The holding disks 42 are, for example, porous holding disks, which hold the surface of the wafer W. The surface of the holding disk 42, i.e., the holding surface of the wafer W, has a convex shape in which the central portion protrudes more than the ends when viewed from the side. Furthermore, this central protrusion is minute, but in the illustrations described below, the central protrusion of the holding disk 42 is sometimes shown in enlarged form for clarity.

[0031] like Figure 2As shown, the retaining disk 42 is held on a retaining disk base 43, which serves as a retaining platform. A tilt adjustment section 44 is provided on the retaining disk base 43, which is used to adjust the relative tilt between each grinding section (rough grinding section 80, intermediate grinding section 90, and fine grinding section 100) and the retaining disk 42. The tilt adjustment section 44 has a fixed shaft 45 provided on the lower surface of the retaining disk base 43 and multiple, for example, two lifting shafts 46. Each lifting shaft 46 is configured to extend and retract freely, allowing the retaining disk base 43 to rise and fall. Through this tilt adjustment section 44, with one end of the outer periphery of the retaining disk base 43 (the position corresponding to the fixed shaft 45) as a base point, the other end can be raised and lowered vertically by the lifting shafts 46, thereby tilting the retaining disk 42 and the retaining disk base 43. Furthermore, this allows adjustment of the relative tilt between each grinding section (grinding surface) at machining positions A1 to A3 and the surface (retaining surface) of the retaining disk 42.

[0032] Furthermore, the structure of the tilt adjustment part 44 is not limited to this. As long as the relative angle (parallelism) of the surface (holding surface) of the holding plate 42 with respect to each grinding part (grinding surface) can be adjusted, it can be selected arbitrarily.

[0033] By rotating the rotary table 41, the four holding discs 42 can be moved to the junction position A0 and the processing positions A1 to A3. In addition, the four holding discs 42 are each configured to be able to rotate about a vertical axis by means of a rotating mechanism (not shown).

[0034] At the transfer position A0, the wafer W is transferred by the transport unit 30. At the processing position A1, the rough grinding unit 80 performs rough grinding on the wafer W. At the processing position A2, the intermediate grinding unit 90 performs intermediate grinding on the wafer W. At the processing position A3, the fine grinding unit 100 performs fine grinding on the wafer W.

[0035] like Figure 2 As shown, the rough grinding unit 80 includes a rough grinding wheel 81 with an annular rough grinding tool on its lower surface, a mounting member 82 supporting the rough grinding wheel 81, a spindle 83 that rotates the rough grinding wheel 81 via the mounting member 82, and a drive unit 84 containing, for example, a motor (not shown). Furthermore, a mounting portion 85 is formed on the outer peripheral surface of the mounting member 82 for mounting a measuring device 110 for measuring the relative distance between the lower surface (grinding surface) of the rough grinding wheel 81 and the surface (holding surface) of the holding disc 42. Additionally, the rough grinding unit 80 is configured to be able to move along... Figure 1 The pillar 86 shown moves in the vertical direction.

[0036] Here, as described above, the holding surface of the holding disk 42 has a convex shape. Therefore, in the rough grinding process of the wafer W performed using the rough grinding section 80, as... Figure 3As shown in the rough section, a portion of the annular coarse grinding tool contacts the wafer W as a processing point. More specifically, the annular coarse grinding tool contacts the portion of the wafer W from the center to the outer periphery in an arc shape, and in this state, the holding disk 42 and the coarse grinding wheel 81 are rotated respectively, thereby grinding the entire surface of the wafer W.

[0037] With the rough grinding wheel 81 removed from the mounting member 82, the measuring device 110 is connected to the mounting portion 85 of the mounting member 82. The measuring point of the measuring device 110 is set to the same height as the grinding surface of the rough grinding wheel 81, and moves along the axis of rotation of the mounting member 82 (spindle 83). Figure 4 The arc-shaped region (hereinafter sometimes referred to as the "measuring region R") corresponding to the outer edge of the rough grinding wheel 81 (the outer edge of the grinding position) is rotated, thereby measuring the relative distance between the upper surface of the holding surface or the holding disc base 43 and the grinding surface along the measuring region R. The relative distance between the upper surface of the holding surface or the holding disc base 43 and the grinding surface measured by the measuring device 110 is displayed, for example, on the display section 110a provided in the measuring device 110. Furthermore, in the following description, the upstream end of the mounting member 82 in the direction of rotation in the arc-shaped measuring region R is sometimes referred to as the "measuring end Ra", the downstream end of the mounting member 82 in the direction of rotation in the measuring region R is sometimes referred to as the "measuring other end Rb", and the midpoint between the measuring end Ra and the measuring other end Rb (the center of the holding disc 42) is sometimes referred to as the "measuring center Rc".

[0038] Furthermore, the type of measuring device 110 installed on the mounting section 85 is not particularly limited, and can be selected arbitrarily. For example, as the measuring device 110, a contact measuring device that measures the relative distance between the device and the grinding surface by contacting the holding surface can be used. Alternatively, for example, a non-contact measuring device that measures the relative distance between the device and the grinding surface by illuminating sensor light onto the holding surface and detecting the reflected light from the holding surface can also be used.

[0039] Furthermore, the mounting position of the measuring device 110 is not limited to the outer peripheral surface of the mounting member 82 as described above. As long as the measuring point can be set to the same height as the grinding surface of the rough grinding wheel 81, it can be configured to be mounted on the lower surface of the mounting member 82.

[0040] The intermediate grinding section 90 has the same structure as the rough grinding section 80. That is, the intermediate grinding section 90 has an intermediate grinding wheel 91 with an annular intermediate grinding wheel, a mounting member 92, a spindle 93, a drive unit 94, a mounting unit 95, and a support column 96. The abrasive grains of the intermediate grinding wheel are smaller than those of the rough grinding wheel.

[0041] The fine grinding section 100 has the same structure as the rough grinding section 80 and the intermediate grinding section 90. That is, the fine grinding section 100 has a fine grinding wheel 101 with an annular fine grinding tool, a mounting member 102, a spindle 103, a drive unit 104, a mounting unit 105, and a support column 106. The abrasive grains of the fine grinding tool are smaller than those of the intermediate grinding tool.

[0042] The processing apparatus 1 described above is provided with a display panel 120 as an information display unit. The display panel 120 may be, for example, a monitor or a touch panel, and may be directly mounted on the processing apparatus 1 or may be mounted in a way that allows for remote confirmation.

[0043] In the display panel 120, for example Figure 5 As shown, the same screen displays a display area 121 for displaying various information related to the tilt adjustment action between the holding surface and the grinding surface, an input area 122 for inputting various information related to the tilt adjustment action, a switching area 123 for switching the various information displayed in the display area 121 and the action mode of the tilt adjustment action, and an instruction area 124 for performing the tilt adjustment action in the machining device 1.

[0044] The display area 121 displays, for example, the holding disc 42, which is the object to be tilted, and the configuration of the holding disc 42 (in...). Figure 5 In the example, information related to the tilt of the holding plate base 43 that holds the holding plate 42 includes processing position A1, such as the height position of the lifting shaft 46 of the tilt adjustment part 44 located below the holding plate base 43.

[0045] In the input area 122, which serves as the input section, the operator inputs information, for example, related to the relative distance between the holding surface and the grinding surface measured by the measuring device 110. Figure 5 In the example, the input is the measurement value at the measurement center Rc of the measurement area R and the measurement value at the other end Rb.

[0046] Regarding the switching area 123, for example, by having the operator select the switching area 123, the action mode of the tilt adjustment action between the holding surface and the grinding surface can be switched between the plane mode (Japanese: フラットモード) Mf described later and the self-grinding mode Mg described later.

[0047] Regarding the indicator area 124, which serves as an indicator, for example, by having the operator select the indicator area 124, the tilt adjustment action between the holding surface and the grinding surface is performed, thus initiating the operation of the tilt adjustment unit 44.

[0048] During the tilt adjustment operation in the machining apparatus 1, when the operator selects the instruction area 124, the movement of the lifting shaft 46 of the tilt adjustment unit 44 is calculated based on the measurement value input to the measuring device 110 in the input area 122. Furthermore, the lifting shaft 46 is automatically moved based on this calculated value to automatically adjust the relative tilt between the holding surface and the grinding surface. At this time, the height position of each of the two lifting shafts 46, i.e., the tilt of the holding surface, is displayed in real time in the display area 121.

[0049] Furthermore, the information output to the display panel 120 is not limited to this embodiment and can be set arbitrarily.

[0050] Furthermore, a control unit 130 is provided in the aforementioned processing apparatus 1. The control unit 130 is, for example, a computer equipped with a CPU, memory, etc., and has a program storage unit (not shown). The program storage unit stores the program for controlling the processing of the wafer W in the processing apparatus 1. Additionally, the program storage unit also stores the program for controlling the tilt adjustment operation between the grinding surface and the holding surface, which will be described later. Furthermore, the above-mentioned program can also be recorded on a computer-readable storage medium H and installed from that storage medium H into the control unit 130.

[0051] The processing apparatus 1 according to this embodiment is configured as described above. Next, the tilt adjustment operation performed in the processing apparatus 1 will be described. Furthermore, as described above, the operation modes of this tilt adjustment operation can include, for example, an operation for adjusting the upper surface of the holding surface or the holding plate base 43 to be parallel to the grinding surface (hereinafter referred to as "planar mode Mf"), and an operation for machining the replaced new holding plate 42 into the desired convex shape (hereinafter referred to as "self-grinding mode Mg").

[0052] In the following description, we will first explain the tilt adjustment operation of the self-grinding mode Mg in the processing apparatus 1. That is, we will take the case where the new holding plate 42 is held by the holding plate base 43 and the relative tilt between the holding surface of the new holding plate 42 and the grinding surface of each grinding section as an example. In addition, the tilt adjustment of each grinding section (rough grinding section 80, intermediate grinding section 90 and fine grinding section 100) can be performed by the same operation, but in the following description, we will take the case of adjusting the relative tilt between the grinding surface of the rough grinding section 80 and the holding surface of the holding plate 42 as an example.

[0053] First, after removing the rough grinding wheel 81 from the rough grinding section 80, the measuring device 110 (a contact type measuring device in this embodiment) is installed on the mounting section 85. Figure 6Step S1). When the measuring device 110 is installed in the mounting part 85, then, before the new retaining plate 42 is held by the retaining plate base 43, the relative inclination between the upper surface of the retaining plate base 43 and the grinding surface is checked. Figure 6 Step S2).

[0054] When confirming the relative tilt between the upper surface of the retaining plate base 43 and the grinding surface, the operator first selects the switching area 123 displayed on the display panel 120 to set the tilt adjustment action mode to planar mode Mf. Figure 6 Step S2-1).

[0055] Next, the measuring device 110 measures the relative distance between the upper surface of the retaining plate base 43 and the grinding surface, and obtains the distance data D1. Figure 6 Step S2-2). Specifically, the rough grinding section 80 is lowered along the support column 86 to bring the contact terminal (probe) of the measuring device 110 into contact with the upper surface of the retaining plate base 43. Then, in this state, while the spindle 83 (measuring device 110) is rotated, the measuring device 110 measures the relative distance between the upper surface of the retaining plate base 43 and the grinding surface at multiple points.

[0056] The measuring device 110 is rotated by the spindle 83 to the upper surface of the holding plate base 43 to... Figure 4 The measurement area R shown is moved in the manner corresponding to the measurement, that is, it moves along the arc connecting one measuring end Ra of the holding plate base 43 to the other measuring end Rb. In step S2-2 above, as Figure 7 As shown in (b), the measuring device 110 follows the tilt of the holding plate base 43 and moves along the measuring area R on the upper surface of the holding plate base 43, as shown in (b). Figure 7 As shown in (a), distance data D1 is acquired at at least three points corresponding to the measurement end Ra, the measurement end Rb, and the measurement center Rc. Furthermore, in the following description, the distance data D acquired at the measurement end Ra, the measurement end Rb, and the measurement center Rc are sometimes referred to as distance data Da, Db, and Dc, respectively.

[0057] The distance data D1 acquired by the measuring device 110 is displayed, for example, on the display unit 110a or display panel 120 of the measuring device 110, and this display is confirmed, for example, by the operator's visual inspection. Here, the distance data D1 displayed on the display unit 110a, etc., is zeroed using the distance data Da1 measured at the measuring end Ra as a reference distance. In other words, the distance data Db1 and Dc1 are displayed as the differences relative to the distance data Da1 obtained after zeroing.

[0058] Here, when the upper surface of the retaining plate base 43 is parallel to the grinding surface, the displayed distance data Db1 and Dc1 are the same as the reference distance data Da1, i.e., Da1 = Db1 = Dc1 = 0. In this case, it is determined that the upper surface of the retaining plate base 43 is parallel to the grinding surface, and the new retaining plate 42 is held on the retaining plate base 43. Figure 6 Step S5).

[0059] On the other hand, if the upper surface of the retaining plate base 43 is not parallel to the grinding surface, the distance data Db1 and Dc1 notified to the operator are different values ​​from the reference distance data Da1, i.e., Da1 = 0, Db1 ≠ 0, and Dc1 ≠ 0. In this case, it is determined that the upper surface of the retaining plate base 43 is not parallel to the grinding surface, and the tilt adjustment of the retaining plate base 43 is performed. Figure 6 Step S3).

[0060] During the tilt adjustment of the base 43, the operator first inputs the distance data Db1 and Dc1 measured by the measuring device 110 into the input area 122 of the display panel 120. Figure 6 Step S3-1), then the operator selects the indicator area 124 of the display panel 120 ( Figure 6 Step S3-2).

[0061] When the operator selects the instruction area 124, based on the distance data Db1 and Dc1 input to the input area 122, the movement (lifting) amount of the two lifting shafts 46 of the tilt adjustment unit 44 is automatically calculated. Figure 6 Step S3-3). Specifically, the movement of the lifting shafts 46 is automatically calculated with the target position being the height position of the two lifting shafts 46 when the upper surface of the holding plate base 43 is parallel to the grinding surface, or more specifically, when Da1 = Db1 = Dc1 = 0. When the movement of the lifting shafts 46 is calculated, the tilt adjustment unit 44 begins to operate. Furthermore, when the lifting shafts 46 are moved to the target position based on the calculated movement, the upper surface of the holding plate base 43 is adjusted to be parallel to the grinding surface. Figure 6 Steps S3-4).

[0062] When the parallelism between the upper surface of the retaining plate base 43 and the grinding surface is adjusted, the relative inclination between the upper surface of the retaining plate base 43 and the grinding surface is then adjusted to an inclination for self-grinding of the retaining plate 42 held in the retaining plate base 43. Figure 6 Step S4).

[0063] When adjusting the tilt between the upper surface of the retaining plate base 43 and the grinding surface, the operator first selects the switching area 123 displayed on the display panel 120 to switch the tilt adjustment action mode from planar mode Mf to self-grinding mode Mg. Figure 6 Step S4-1).

[0064] Next, the measuring device 110 measures the relative distance between the upper surface of the retaining plate base 43 and the grinding surface, and obtains the distance data D2. Figure 6 (Step S4-2). The method for obtaining distance data D2 is the same as the method for obtaining distance data D1 in step S2-2. That is, the contact terminal (probe) of the measuring device 110 is brought into contact with the upper surface of the retaining plate base 43, and then, in this state, the spindle 83 (measuring device 110) is rotated while the measuring device 110 measures the relative distance between the upper surface of the retaining plate base 43 and the grinding surface at multiple points.

[0065] As described above, the measuring device 110 moves along the axis of rotation of the main shaft 83. Figure 4 The arc-shaped measurement area R shown moves on the holding surface of the holding disk 42 or the upper surface of the holding disk base 43. In step S4-2 above, as... Figure 7 As shown, distance data Da2, Db2, and Dc2 are acquired at at least three points, including the measurement area R, the measurement end Ra, the measurement end Rb, and the measurement center Rc.

[0066] The distance data D2 acquired by the measuring device 110 is displayed, for example, on the display section 110a and display panel 120 of the measuring device 110, and this display is confirmed, for example, by the operator's visual inspection. Here, the distance data D2 notified to the operator is zeroed with reference to the distance data Da2 measured at the measuring end Ra. In other words, the distance data Db2 and Dc2 are displayed as the differences relative to the distance data Da2 obtained after zeroing.

[0067] Here, in the self-grinding process of retaining disk 42, such as Figure 8 As shown, in order to machine the retaining disk 42 into a generally conical shape with a convex retaining surface, it is necessary to adjust the relative tilt between the retaining surface and the grinding surface to the desired tilt for machining the retaining disk 42. Therefore, in the tilt adjustment operation as the self-grinding mode Mg according to this embodiment, the tilt adjustment of the retaining disk 42 is performed based on the distance data D2 obtained in step S4-2.

[0068] Specifically, firstly, the operator inputs the distance data Db2 and Dc2 measured by the measuring device 110 into the input area 122 of the display panel 120. Figure 6Step S4-3), then the operator selects the indicator area 124 of the display panel 120 ( Figure 6 Step S4-4).

[0069] When the operator selects the instruction area 124, based on the distance data Db2 and Dc2 input to the input area 122, the movement (lifting) amount of the two lifting shafts 46 of the tilt adjustment unit 44 is automatically calculated. Figure 6 Steps S4-5). Specifically, this is to make the relative inclination between the upper surface of the retaining disc base 43 and the grinding surface become Figure 8 The desired tilt is shown, more specifically, so that the height position of the two lifting shafts 46 when the holding plate base 43 is configured with this desired tilt is taken as the target position, and the amount of movement of the lifting shafts 46 is automatically calculated. When the amount of movement of the lifting shafts 46 is calculated, the tilt adjustment unit 44 starts operating. Moreover, when the lifting shafts 46 are moved to the target position based on the calculated amount of movement, the relative tilt between the upper surface of the holding plate base 43 and the grinding surface is adjusted to the desired tilt for performing self-grinding of the holding plate 42. Figure 6 Steps S4-6).

[0070] Furthermore, when the relative inclination between the upper surface of the retaining plate base 43 and the grinding surface is adjusted as shown, the new retaining plate 42 is held in the retaining plate base 43. Figure 6 Step S5) ends the series of tilt adjustment actions in the processing device 1 as the self-grinding mode Mg.

[0071] Furthermore, during a series of tilting adjustments, the measuring device 110 is removed from the mounting section 85, and then the rough grinding wheel 81 is installed on the rough grinding section 80. Moreover, subsequently, as... Figure 3 and Figure 8 As shown in (a), a portion of the annular coarse grinding wheel is brought into contact with the retaining surface of the retaining disk 42, and in this state, the retaining disk 42 and the coarse grinding wheel 81 are rotated respectively, thereby... Figure 8 (b) and Figure 8 As shown in (c), the retaining disk 42 is machined into the desired approximately conical shape.

[0072] Furthermore, in the above embodiments, the self-grinding tilt between the upper surface of the retaining plate base 43 and the grinding surface is adjusted ( Figure 6 After step S4), the holding plate 42 is held on the holding plate base 43. Figure 6 Step S5), but the holding time of the retaining disk 42 is not limited to this. That is, for example, it could also be adjusted by adjusting the parallelism between the upper surface of the retaining disk base 43 and the grinding surface. Figure 6 Step S3) and hold the holding plate 42 on the holding plate base 43. Figure 6After step S5), the relative tilt between the holding surface of the retaining disc 42 and the grinding surface is adjusted to a self-grinding tilt (equivalent to...). Figure 6 Step S4).

[0073] Furthermore, in the above embodiments, the parallelism between the upper surface of the retaining plate base 43 and the grinding surface was adjusted. Figure 6 After step S3), obtain distance data D2. Figure 6 Step S4-2) is performed to further grind the retaining disk 42, but the acquisition of this distance data D2 can also be appropriately omitted. That is, since the parallelism between the upper surface of the retaining disk base 43 and the grinding surface is adjusted, for example, in the previous process, it can also be done in... Figure 6 In step S4-3, the distance data D2 is input by inputting Db2 = Dc2 = 0.

[0074] Furthermore, in the above embodiments, the case of performing a tilt adjustment operation as a self-grinding mode Mg in the processing apparatus 1 was described as an example. However, as described above, a tilt adjustment operation as a planar mode Mf for adjusting the holding surface of the holding plate 42 to be parallel to the grinding surface can be performed in the processing apparatus 1.

[0075] Regarding the tilt adjustment action of the planar mode Mf used to align the holding surface of the holding disc 42 with the grinding surface, it is achieved through the aforementioned... Figure 6 The tilt adjustment between the upper surface of the retaining plate base 43 and the grinding surface involved in steps S1 to S3 is performed in the same way.

[0076] Specifically, when it is necessary to adjust the parallelism between the holding surface and the grinding surface, firstly, the rough grinding wheel 81 is removed from the rough grinding section 80, and then the measuring device 110 is installed in the mounting section 85. Figure 6 Step S1). Next, confirm the relative inclination between the retaining surface of the retaining plate 42 held in the retaining plate base 43 and the grinding surface ( Figure 6 Step S2).

[0077] When confirming the relative tilt between the holding surface of the holding plate 42 and the grinding surface, after determining the tilt adjustment action mode as plane mode Mf by selecting the switching area 123 ( Figure 6 Step S2-1): The measuring device 110 measures the relative distance between the holding surface and the grinding surface to obtain distance data D3 (distance data Da3, Db3, Dc3). Figure 6(Step S2-2). The distance data D3 acquired by the measuring device 110 is displayed, for example, on the display section 110a or display panel 120 of the measuring device 110, and this display is confirmed, for example, by the operator's visual inspection. Furthermore, the distance data D3 notified to the operator is zeroed with distance data Da3 as the reference distance, and distance data Db3 and Dc3 are displayed as the differences relative to distance data Da3 obtained after zeroing.

[0078] Next, the tilt between the holding surface of the holding plate 42 and the grinding surface is adjusted based on the distance data D3 obtained by the measuring device 110. Figure 6 Step S3).

[0079] When adjusting the relative tilt between the holding surface of the holding disc 42 and the grinding surface, the operator first inputs the distance data Db3 and Dc3 measured by the measuring device 110 into the input area 122. Figure 6 Step S3-1), then select indicator area 124 ( Figure 6 Step S3-2).

[0080] When the operator selects the instruction area 124, the movement of the two lifting shafts 46 of the tilt adjustment unit 44 is automatically calculated based on the distance data Db3 and Dc3 from the input area 122. Figure 6 Step S3-3). Specifically, the target position is the height position of the two lifting shafts 46 when the holding surface is parallel to the grinding surface, or more specifically, when Da3 = Db3 = Dc3 = 0, and the movement of the lifting shafts 46 is automatically calculated. When the movement of the lifting shafts 46 is calculated, the tilt adjustment unit 44 begins to operate. Moreover, when the lifting shafts 46 are moved to the target position based on the calculated movement, the holding surface of the holding plate 42 is adjusted to be parallel to the grinding surface. Figure 6 Steps S3-4). In this way, the series of tilt adjustment actions in the processing device 1 as the planar pattern Mf are completed.

[0081] According to the tilt adjustment operation described in this embodiment, after inputting the distance data D, which is a measured value, into the input area 122, the relative tilt between the holding surface of the holding plate 42 and the grinding surface can be automatically adjusted to the desired tilt simply by selecting the instruction area 124. Therefore, unlike conventional tilt adjustment operations, there is no need to perform manual adjustments multiple times until the desired parallelism (tilt) is obtained, which significantly reduces the time required for tilt adjustment operations. In addition, since the tilt adjustment between the holding surface and the grinding surface can be performed automatically without manual intervention, operational errors and adjustment errors caused by manual operation as in the past can be suppressed.

[0082] Furthermore, according to this embodiment, zeroing is performed using distance data Da from the distance data Da, Db, and Dc measured by the measuring device 110 at three points as a reference distance. This displays distance data Db and Dc as differences relative to distance data Da, and the operator only inputs these distance data Db and Dc into the input area 122. That is, it is not necessary to input all measured values ​​as input values, thereby reducing the amount of information manually input into the input area 122 during tilt adjustments, and thus suppressing input errors caused by manual input.

[0083] Furthermore, in the above embodiments, as described above, the distance data Da obtained at one end Ra of the measurement was used as the reference distance for zeroing, but the reference distance data D can also be the distance data Db or Dc obtained at the other end Rb of the measurement or the measurement center Rc.

[0084] Furthermore, in the above embodiments, the tilt adjustment portion 44, located below the retaining plate base 43, tilts the retaining plate base 43 (retaining plate 42), thereby adjusting the relative angle between the retaining surface and the grinding surface. However, the structure of the tilt adjustment portion is not limited to this. That is, for example, the relative angle between the grinding surface and the retaining surface of the retaining plate 42 can be adjusted by providing tilt adjustment portions on each grinding section side. Additionally, for example, the retaining surface and the grinding surface of the retaining plate 42 can both be tilted.

[0085] Furthermore, in the above embodiments, the grinding process in the grinding unit 40 was described as an example of grinding the wafer W, the holding surface of the holding disk 42, and the upper surface of the holding disk base 43. However, the processing performed in the processing apparatus 1 is not limited to grinding. Specifically, for example, the wafer W, the holding surface of the holding disk 42, and the upper surface of the holding disk base 43 can also be ground in the processing apparatus 1. In this way, the grinding process described in the above embodiments and the grinding process are both included in the "processing" performed in the processing apparatus 1 according to this embodiment.

[0086] It should be understood that all points in the embodiments disclosed herein are illustrative rather than restrictive. The above embodiments may be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0087] Explanation of reference numerals in the attached figures

[0088] 1: Processing device; 42: Holding plate; 43: Holding plate base; 44: Tilt adjustment unit; 80: Rough grinding unit; 120: Display panel; 122: Input area; 124: Indication area; 130: Control unit; W: Wafer.

Claims

1. A processing system for processing an object, the processing system having: A holding section holds a substrate, which is the object to be processed, on its upper surface. A retaining base is used to hold the retaining part on the upper surface of the retaining base; A processing unit that performs grinding processing on the object to be processed held in the holding unit; A tilt adjustment unit adjusts the relative tilt between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part based on distance information measured by a measuring device that measures the relative distance between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part; and The information display unit displays information related to the holding unit, the holding base, the processing unit, and the tilt adjustment unit. in, The information display unit displays, on the same screen, an input unit for the operator to input relative distance information between the upper surface of the holding part or the holding base and the grinding surface of the machining part, as measured by the measuring device, and an indicator unit for initiating the operation of the tilt adjustment unit through the operator's selection.

2. The processing system according to claim 1, characterized in that, It has a control unit that controls the operation of the tilt adjustment unit. When the indicator displayed on the information display unit is selected... The control unit controls the tilt adjustment unit to operate based on the distance information input to the input unit and the difference between the relative distance between the upper surface of the holding unit or the holding base and the grinding surface of the machining unit, which is predetermined.

3. The processing system according to claim 1 or 2, characterized in that, The processing unit includes a mounting section for the measuring device used to acquire the distance information. The measuring device acquires distance information at at least three points within the plane of the retaining part or the retaining base.

4. The processing system according to claim 3, characterized in that, The measuring device is mounted so that it can move along an arc-shaped measuring area passing through the center of the holding part or the holding base. The distance information at the center of the measurement area, i.e. the measurement center, and the distance information at one end of the measurement area are input into the input unit.

5. The processing system according to claim 4, characterized in that, It has a control unit that controls the operation of the tilt adjustment unit. The control unit controls the tilt adjustment unit to operate in the following manner: using the distance information at the other end of the measurement area as a reference height, the relative distance between the measurement center of the measurement area and the holding part or the holding base and the processing part at one end of the measurement area is adjusted.

6. The processing system according to claim 2, characterized in that, The distance information input to the input unit includes the distance information at the center of the measurement area (i.e., the measurement center) and the distance information at one end of the measurement area. The distance information at the measurement center and the distance information at one end are measured along the arc-shaped measurement area passing through the center of the holding part or the holding base. The control unit controls the tilt adjustment unit to operate in the following manner: using the distance information at the other end of the measurement area as a reference height, the relative distance between the measurement center of the measurement area and the holding part or the holding base and the processing part at one end of the measurement area is adjusted.

7. A tilt adjustment method, which is a method for adjusting relative tilt in a machining system, said machining system having: A holding section holds a substrate, which is the object to be processed, on its upper surface. A retaining base is used to hold the retaining part on the upper surface of the retaining base; A processing unit that performs grinding processing on the object to be processed held in the holding unit; A tilt adjustment unit adjusts the relative tilt between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part based on distance information measured by a measuring device that measures the relative distance between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part; and The information display unit displays information related to the holding unit, the holding base, the processing unit, and the tilt adjustment unit. The tilt adjustment method adjusts the relative tilt between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part in the machining system. The tilt adjustment method includes: Obtain the relative distance information between the upper surface of the holding part or the holding base and the grinding surface of the processing part; The distance information is input by the operator in the input section displayed on the information display unit; and The operator selects an indicator displayed on the same screen as the input section to begin the operation of the tilt adjustment section.

8. The tilt adjustment method according to claim 7, characterized in that, In the processing system, the measuring device for acquiring the distance information is mounted to be movable along an arc-shaped measuring area passing through the center of the holding part or the holding base. In acquiring the distance information, distance information is acquired at at least three points along the measurement area.

9. The tilt adjustment method according to claim 8, characterized in that, In the input of the distance information, Input the distance information at the center of the measurement area, i.e. the measurement center, and the distance information at one end of the measurement area.

10. The tilt adjustment method according to any one of claims 7 to 9, characterized in that, Also includes: After the selection of the indicator, the movement of the tilt adjustment part is calculated based on the distance information input to the input part and the difference between the relative distance between the upper surface of the holding part or the holding base and the grinding surface of the processing part, which is predetermined. as well as The tilt adjustment unit is moved based on the calculated value of the movement amount.

11. The tilt adjustment method according to claim 7, characterized in that, Also includes: In the input of the distance information, the distance information at the center of the measurement area, i.e. the measurement center, and the distance information at one end of the measurement area are input. The distance information at the measurement center and the distance information at one end are measured along the arc-shaped measurement area passing through the center of the holding part or the holding base. Using the distance information at the other end of the measurement area as a reference height, the movement of the tilt adjustment part is calculated based on the relative distance between the measurement center of the measurement area and the upper surface of the holding part or the holding base at one end, and the grinding surface of the machining part; and The tilt adjustment unit is moved based on the calculated value of the movement amount.

12. A computer storage medium that stores a readable program, which is actuated on a computer controlling a machining system to cause the machining system to perform a method for adjusting the relative tilt between the upper surface of a holding part or a holding base and the grinding surface of the machining part. The processing system has the following features: The holding part holds the substrate, which is the object to be processed, on its upper surface. The retaining base holds the retaining part on its upper surface; The processing unit processes the object to be processed that is held in the holding unit; A tilt adjustment unit adjusts the relative tilt between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part based on distance information measured by a measuring device that measures the relative distance between the upper surface of the retaining part or the retaining base and the grinding surface of the machining part; and The information display unit displays information related to the holding unit, the holding base, the processing unit, and the tilt adjustment unit. The tilt adjustment method includes: Acquire relative distance information between the upper surface of the holding part or the holding base and the grinding surface of the processing part, which is input by the operator and displayed on the input part of the information display unit; as well as When the operator selects an indicator displayed on the same screen as the input section, the tilt adjustment section begins to operate.

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