Multiple substrate handling system and method
By using the alignment equipment and buffer chamber of the multi-substrate processing system, and utilizing robotic transfer components, multiple substrates can be processed efficiently, solving the problems of low production volume and high cost, and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2021-06-16
- Publication Date
- 2026-06-23
AI Technical Summary
Existing technologies have low production volumes and high costs when processing multiple substrates, especially when processing different types of substrates with different process parameters, where production volumes are limited.
A multi-substrate processing system is adopted, including alignment equipment and buffer chamber. A robotic transfer component is used to transfer substrate carriers between the buffer chamber and the processing chamber, which can process multiple substrates simultaneously and according to the different process parameters of each substrate.
It increased production volume and reduced costs, enabling efficient simultaneous processing of multiple substrates and optimizing production efficiency.
Smart Images
Figure CN116134596B_ABST
Abstract
Description
Technical Field
[0001] Embodiments of this disclosure generally relate to systems and methods for manufacturing semiconductor devices. More specifically, this disclosure relates to apparatus and methods for simultaneously processing multiple substrates. Background Technology
[0002] Electronic devices are typically formed in a controlled processing environment using a transfer system for moving substrates between environments. The effectiveness of device manufacturing is often measured by device yield and cost of ownership (CoO). Device yield and CoO affect the cost of producing electronic devices and thus the competitiveness of device manufacturers in the market. Device yield and CoO are influenced by system and process throughput, which is limited by the number of substrates processed per hour using a process sequence. This sequence involves processing substrates in various chambers and transferring substrates between chambers. Operating parameters and / or conditions at each chamber and methods of transferring substrates are optimized to increase substrate throughput; however, certain limitations in the process often restrict throughput. In particular, for lithography systems, chamber processing times can be optimized for individual substrates; however, processing substrates individually at each chamber and then transferring them from one chamber to another can limit throughput, especially in processes involving different types of substrates using different process parameters (e.g., formulations).
[0003] Therefore, there is a need for a system and method for processing multiple substrates that can meet predetermined device performance and increase total production volume while reducing costs (e.g., CoO). Summary of the Invention
[0004] In one embodiment, a multiple substrate handling system is provided, comprising an alignment device capable of positioning each substrate in a group of substrates in a predetermined orientation for transfer. A buffer chamber is configured to receive and adjust the group of substrates disposed on a substrate carrier. A first transfer assembly is configured to transfer the group of substrates to and from the buffer chamber, and is capable of transferring each substrate in the group of substrates from the alignment device to the carrier in the buffer chamber. The carrier includes multiple modules capable of securing the group of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the group of substrates between the buffer chamber and a processing chamber. The processing chamber is capable of processing the group of substrates using different process parameters for each substrate.
[0005] In another embodiment, a method is provided that includes transferring a first set of substrates from two or more chamber assemblies to a first carrier in a buffer chamber. The first set of substrates includes at least two substrates having different substrate properties relative to each other. The method includes adjusting the first set of substrates disposed on the first carrier in the buffer chamber, and transferring the first carrier having the first set of substrates to a processing chamber. The first set of substrates disposed on the first carrier is processed in the processing chamber. The processing of the first set of substrates uses different process parameters for each substrate.
[0006] In another embodiment, a substrate handling system is provided, including a first transfer assembly configured to transfer a group of substrates to and from a buffer chamber. The buffer chamber is configured to adjust the group of substrates. The buffer chamber includes a carrier that secures the group of substrates for processing. A second transfer assembly is provided, configured to transfer the carrier of the group of substrates between the buffer chamber and a photolithography apparatus. The photolithography apparatus enables each substrate in the group to be processed simultaneously with the others. Attached Figure Description
[0007] To gain a more detailed understanding of the features described above, the present disclosure can be described in more detail with reference to the embodiments, some of which are illustrated in the accompanying drawings.
[0008] Figure 1 A multi-substrate processing system according to an embodiment of the present disclosure is described.
[0009] Figure 2 A flowchart illustrating a method according to an embodiment of this disclosure is provided.
[0010] Figure 3 A lithography apparatus according to an embodiment of the present disclosure is described.
[0011] To facilitate understanding, the same reference numerals are used to denote shared elements in the drawings, where possible. Elements and features of one embodiment are contemplated to be advantageously incorporated into other embodiments without further description.
[0012] However, it should be noted that the accompanying drawings are merely illustrative embodiments of this disclosure and should not be considered as limiting its scope, as this disclosure may allow for other equally effective embodiments. Detailed Implementation
[0013] Before describing embodiments of this disclosure, it should be understood that this disclosure is not limited to the details of the constructions or methods set forth in the following description. This disclosure can have other embodiments and can be practiced or carried out in various ways.
[0014] This disclosure provides a multi-substrate processing system with an alignment device capable of positioning each substrate in a group of substrates in a predetermined orientation for transfer. A buffer chamber is configured to receive and adjust the group of substrates disposed on a substrate carrier. A first transfer assembly is configured to transfer the group of substrates to and from the buffer chamber, and is capable of transferring each substrate in the group of substrates from the alignment device to the carrier in the buffer chamber. The carrier includes multiple modules capable of securing the group of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the group of substrates between the buffer chamber and a processing chamber. The processing chamber is capable of processing the group of substrates using different process parameters for each substrate.
[0015] Figure 1A multi-substrate handling system according to an embodiment of this disclosure is described. The system includes an interface module 102, a buffer module 120, and a processing module 130. The interface module 102 includes pod assemblies 104, alignment devices 108, and a first transfer system 110 configured to transfer substrates between one or more pod assemblies 104 and the alignment devices 108. The first transfer system 110 is also capable of using one or more robots (such as robotic arms 111A, 111B) to transfer substrates from the interface module 102 to the buffer module 120. Each pod assembly 104 is configured to hold both unprocessed and processed substrates. The pod assembly 104 is a front-end opening unified pod (FOUP) and is generally adapted to accept one or more cassettes containing one or more substrates to be adjusted and processed. Each FOUP is capable of holding up to 24 substrates fed into the system described herein at a time. It should be understood that 24 substrates is merely an example and is not intended to be limiting. In conventional processes, a single type of substrate is placed in the interface area and processed sequentially, one substrate at a time in the processing chamber using the same process parameters. Conventional substrate handling processes employ a transfer system that transports one substrate at a time from the FOUP, aligns the substrate, and positions it directly into the processing chamber, where it is adjusted and processed one substrate at a time. After processing, the processed substrate is returned to the FOUP using the same transfer system. Subsequently, the same transfer system retrieves the next substrate for processing. This process has low throughput because it relies on completing one substrate at a time and returning it before processing the next. The system described herein can operate several operations and transfers simultaneously, and process several different types of substrates simultaneously, thereby optimizing throughput. The substrate can be of any shape, such as rectangular, square, triangular, circular, or combinations thereof. Furthermore, the substrate is a silicon substrate, a glass panel, a solar panel, a stacked structure, or a combination thereof. The substrate thickness is from about 0.3 mm to about 5 mm, such as from about 0.5 mm to about 2 mm. The type, thickness, and shape of the substrate are not intended to be limiting.
[0016] Each of the robotic arms 111A and 111B is capable of retrieving a substrate from the cassette. The robotic arms operate simultaneously or sequentially relative to each other. Each module in the control module is controlled using a transfer controller 101. In some embodiments that can be combined with other embodiments described herein, the first transfer system 110 retrieves a substrate from one or more cassette assemblies in cassette assembly 104 and aligns each substrate using an alignment device 108. The alignment device 108 is capable of reading alignment features on each substrate and aligning each substrate before transferring it to the buffer module 120. Alignment features are geometric markings (such as notches) that can be read by a camera and / or a sensor (such as a light sensor disposed on the alignment device 108). The alignment device is capable of positioning each substrate in a predetermined orientation, such as by rotation and translation in all directions. In some embodiments that can be combined with other embodiments described herein, the alignment device 108 is pre-programmed to align various substrates having different types of alignment features according to a predetermined configuration provided for each substrate. In conventional substrate processing, substrates are processed one at a time using the same type of alignment features; therefore, alignment equipment is programmed to perform one alignment procedure at a time. The alignment equipment 108 provided herein is capable of reading different types of alignment features on different types of substrates before transferring the substrates to the buffer module 120.
[0017] The buffer module 120 includes a buffer chamber 122 and a second transport system 125. The alignment device 108 is capable of repositioning the substrate 106 into an orientation to be positioned on the multi-substrate carrier 124 of the buffer module 120. The substrate is positioned and oriented on the carrier 124 in a predetermined configuration. The predetermined configuration is determined based on processing parameters used during processing (e.g., patterning). The substrate 106 is planarized on the carrier 124 using any method known in the industry, such as by vacuum clamping, mechanical clamping, combinations thereof, or other methods known in the industry. Clamping enables various substrates 106 to be planarized in preparation for processing in the processing chamber 132. Clamping in the buffer chamber 122 enables the planarization of substrates deformed up to 20 mm (e.g., as measured from the peak to the valley of the deformation). Substrate deformation is a convex or concave shape extending from the center of the substrate to the radially outer edge of the substrate, or from one edge of the substrate to a second edge. In some embodiments that can be combined with other embodiments described herein, edge-to-edge deformation is in the form of several waves at different intervals. The adaptive adjustment capability of the buffer module 120 enables the preparation of substrates with different manufacturing histories for further processing, such as patterning. The buffer chamber 122 can set and maintain environmental parameters, such as temperature, pressure, humidity, and combinations thereof. In some aspects, the buffer chamber 122 can degas the substrate or remove any particles, chemicals, radiation, and other potential environmental impurities from the substrate. Although in Figure 1 Only a single carrier is depicted herein, but it is conceivable that several carriers 124 can be loaded, unloaded, and adjusted simultaneously. The operation of the buffer chamber 122 is also performed concurrently with substrate transfer and other operations described herein. Each carrier can hold, for example, 1 to 8 substrates. Each carrier holds substrates of the same type and / or each carrier holds substrates of different types. The substrate carriers are held in the buffer chamber 122 until the processing module 130 is available to receive the substrate carriers. This group of substrates disposed on each carrier is referred to herein as a “batch.” The batch is loaded into the processing chamber 132 of the processing module 130 and processed therein. The batch is loaded using a second transfer system 125. The second transfer system 125 is capable of transferring the substrate carriers between the processing chamber 132 and the buffer chamber 122. In some embodiments that can be combined with other embodiments described herein, the second transfer system 125 includes one or more robots, such as robotic arms 123A, 123B. Robotic arms 123A and 123B can simultaneously transfer carriers from unloading / loading processing chamber 132 and buffer chamber 122, for example, by exchanging processed substrate batches with unprocessed substrate batches. Simultaneous exchange of batches between processing chamber 132 and buffer chamber 122 does not affect production volume as is the case with conventional processing systems, which cannot exchange batches simultaneously.
[0018] According to one embodiment, the time for transferring a batch of substrates from one or more compartment assemblies in a compartment assembly to alignment device 108, to buffer chamber 122, and then adjusting the time spent in buffer chamber 122, as well as the scheduling time for transfer to processing module 130 (e.g., compartment-to-buffer time), is approximately 5 seconds to approximately 20 seconds for each substrate on the carrier, such as approximately 20 seconds to approximately 60 seconds for a batch of four, such as approximately 30 seconds to approximately 50 seconds, or approximately 30 seconds to approximately 120 seconds for a batch of six, such as approximately 50 seconds to approximately 70 seconds, or approximately 40 seconds to approximately 120 seconds for a batch of eight, such as approximately 60 seconds to approximately 80 seconds. In some embodiments that can be combined with other embodiments described herein, the scheduling time is added to the total production only once at the start of the process. In particular, the scheduling operation of one batch is performed simultaneously with the processing operations of other batches of substrates, and does not affect the production volume after the first batch is loaded into processing chamber 132.
[0019] According to one embodiment, the processing time in the processing chamber 132 is from about 60 seconds to about 200 seconds, such as from about 100 seconds to about 140 seconds, such as about 120 seconds. After processing, the processed substrate is returned to the buffer chamber 122 using a second transfer system 125. Each substrate is decoupled from the carrier 124 and transferred back to one or more compartment assemblies 104. Specifically, each substrate is returned to the compartment assembly from which it was removed at the start of processing. According to one embodiment, the return time from the processing chamber 132 to the compartment assembly 104 (e.g., the time from processing to the compartment) is from about 2 seconds to about 15 seconds per batch of substrates, such as from about 8 seconds to about 60 seconds for a batch of four, such as from about 20 seconds to about 40 seconds, or from about 12 seconds to about 70 seconds for a batch of six, such as from about 30 seconds to about 50 seconds, or from about 16 seconds to about 100 seconds for a batch of eight, such as from about 40 seconds to about 50 seconds. In some embodiments that can be combined with other embodiments described herein, the scheduling time is added to the total production rate only once at the end of the entire process. Specifically, the return operation of one batch is performed concurrently with the processing operations of other batches of substrates, and does not affect the production rate until the last batch to be processed. According to one embodiment, the production rate for a batch processing 4 substrates is approximately 80 to approximately 130 substrates per hour, or for a batch processing 6 substrates, it is approximately 100 to approximately 170 substrates per hour, or for a batch processing 8 substrates, it is approximately 120 to approximately 220 substrates per hour. In some embodiments that can be combined with other embodiments described herein, for batches of approximately 2 to approximately 8 substrates, the production rate is approximately 80 to approximately 220 substrates per hour. Reference Figure 2 The method described in the text further describes the production volume.
[0020] Figure 2A flowchart illustrating a method 200 using system 100 according to an embodiment of this disclosure is provided. In operation 202, a first set of substrates from two or more chamber assemblies is transferred to a first carrier in a buffer chamber. Before being transferred to the first carrier, each substrate in the set is aligned at an alignment device. In operation 204, the first set of substrates disposed on the first carrier is adjusted in the buffer chamber. The adjustment time for each substrate is different as it is loaded onto the carrier. The adjustment parameters are determined based on a predetermined process to be used in the processing chamber. In operation 206, the first carrier having the first set of substrates is transferred to the processing chamber. The time elapsed from operation 202 to operation 206 is referred to herein as the “scheduling time”. The scheduling time contributes only to the total processing time of the first set of substrates. Since operations 202, 204, and 206 are performed simultaneously with the processing of the first set of substrates in the processing chamber, as described in operation 208 of method 200, all other scheduling times for the second to the last set of substrates are not included in the total processing time for the total production. In operation 210, the first set of substrates in the first carrier is transferred to the buffer chamber, and in operation 212, each substrate in the first set of substrates is returned to two or more chamber assemblies. The time elapsed from operation 210 to 212 is referred to herein as the "return time". The return time of the first set of substrates does not contribute to the total processing time because the return time is completed simultaneously with the scheduling of the second set of substrates and / or the processing operation of 208. In particular, the return time is only added to the total processing of the last set of substrates processed. In some embodiments that can be combined with other embodiments described herein, the processing module 130 is as follows: Figure 3 The photolithography equipment 330 shown is shown.
[0021] The lithography apparatus 330 is configured to simultaneously process a group of substrates disposed on a carrier. In some embodiments that can be combined with other embodiments described herein, each substrate has different characteristics, and / or the lithography apparatus is configured to process each substrate using different processing parameters, such as using different patterning files. The lithography apparatus 330 includes a frame 301, a substrate 302 disposed on the frame 301, a motion platform 304 disposed on a flat substrate surface 305, and a substrate carrier 124 disposed on the motion platform 304, wherein a vibration isolator 303 is inserted between the frame and the substrate. The lithography apparatus 330 also includes a bridge 306 coupled to the substrate 305, and the bridge is separated from the substrate 305 by a sufficient height to allow the motion platform 304 and the substrate carrier 124 on which a group of substrates 106 are disposed to pass between the bridge and the substrate.
[0022] The motion platform 304 is an XY linear translational motion platform, which has a first platform 304A disposed on the base surface 305 and movable relative to the base surface in the X direction (e.g., on the track 308) and a second platform 304B disposed on the first platform 304A and movable relative to the first platform in the Y direction (e.g., on the track 309).
[0023] A bridge 306 supports a plurality of optical modules 307 disposed through an opening 310 in the bridge. The plurality of optical modules 307 are positioned facing a substrate surface 305, and thus facing a set of substrates 106 disposed on a carrier 124 as the motion platform 304 travels between the bridge 306 and the substrate surface 305. An image sensor is used to detect one or more alignment features formed in or patterned on each substrate. A system controller 390 determines pattern offset information and uses this information to pattern the substrates using corresponding design files. Each substrate corresponds to one or more design files. Each design file is used by one or more photolithography exposure sources that direct and / or focus electromagnetic radiation (e.g., one or more UV laser beams) onto or beneath a resist layer deposited on the substrate to form a pattern on that surface. The system controller 390 includes a programmable central processing unit (CPU) 391 that operates in conjunction with a memory 392 (e.g., non-volatile memory) and support circuitry 393. Support circuitry is typically coupled to the CPU 391 and includes caches, clock circuits, input / output subsystems, power supplies, and combinations thereof, which are coupled to various components of the lithography apparatus 330. The CPU 391 is a general-purpose computer processor, such as a programmable logic controller (PLC), used in industrial environments to control various components and subprocessors of the lithography apparatus 330. The memory 392 coupled to the CPU 391 is non-transitory and is typically one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), or any other form of local or remote digital storage device. Typically, the memory 392 is in the form of a computer-readable storage medium containing instructions that, when executed by the CPU 391, facilitate the operation of the lithography apparatus 330.
[0024] Controller 390 is communication coupled to reference Figure 1The described transfer controller 101, in operation, is capable of transferring a carrier with an unprocessed substrate to the lithography apparatus 330 and transferring a carrier with a processed substrate out based on signals from the controller 390. The integrated control scheme of the lithography apparatus and the transfer controller 101 enables simultaneous processing of the substrate and transfer of additional sets of substrates to be processed.
[0025] Example
[0026] Table 1 provides illustrative examples of the productivity benefits provided by the methods and systems of this disclosure. Processing times are provided for batches using four, six, and eight substrates per carrier. Although the system and method allow for substrate retrieval from different FOUPs, for ease of comparison, this embodiment provides the total processing time for processing all substrates from a single FOUP holding 24 substrates. For a batch of four substrates per carrier, a total of six batches are processed. The total processing time for all six batches includes: the scheduling time for the first batch (e.g., 50 seconds), the processing time of 120 seconds per batch multiplied by the number of batches (e.g., 120 × 6 seconds), and the return time for the last batch (e.g., 30 seconds). The total round-trip time for an entire substrate FOUP with six batches is 800 seconds, with a production rate of 108 substrates per hour. Similarly, the total round-trip time for four batches with six substrates per batch is 580 seconds, with a production rate of 148 substrates per hour, and the total round-trip time for three batches with eight substrates per batch is 480 seconds, with a production rate of 480 substrates per hour. As can be seen, the process and system presented in this paper demonstrate an improvement over conventional processes, which has the ability to process multiple substrates at once and save scheduling and return time by operating them simultaneously with the processing.
[0027] Table 1. Examples of production volumes of 4, 6, and 8 batches.
[0028]
[0029] In summary, a multi-substrate processing system is provided, comprising an alignment device capable of positioning each substrate in a group of substrates to a predetermined orientation for transfer. A buffer chamber is configured to receive and adjust the group of substrates disposed on a substrate carrier. A first transfer assembly is configured to transfer the group of substrates to and from the buffer chamber, and is capable of transferring each substrate in the group of substrates from the alignment device to the carrier within the buffer chamber. The carrier includes multiple modules capable of securing the group of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the group of substrates between the buffer chamber and a processing chamber. The processing chamber is capable of processing the group of substrates using different process parameters for each substrate.
Claims
1. A multi-substrate processing system, the system comprising: An alignment device capable of positioning each substrate in a set of substrates in a predetermined orientation for transport; A buffer chamber configured to receive and adjust the assembly substrate; A first transfer assembly is configured to transfer the assembly of substrates to and from the buffer chamber. The first transfer assembly is capable of transferring each substrate in the assembly of substrates from the alignment device to a carrier in the buffer chamber, the carrier including a plurality of modules capable of securing the assembly of substrates. and A second transfer assembly, comprising at least two robots configured to transfer the carrier of the assembled substrates between the buffer chamber and the processing chamber, wherein the processing chamber is capable of processing the assembled substrates using different processing parameters for each substrate. The processing chamber is a photolithography system configured to simultaneously process at least two of the group of substrates using different design files.
2. The system of claim 1, wherein the processing chamber is configured to simultaneously process each of the group of substrates on the carrier.
3. The system of claim 1, wherein the first transmission component and the second transmission component are capable of operating simultaneously with each other.
4. The system of claim 1, wherein the buffer chamber comprises a plurality of carriers, and wherein the buffer chamber and the processing chamber are capable of operating simultaneously with each other.
5. The system of claim 1, further comprising an interface module including two or more compartment assemblies, wherein the first transfer assembly is configured to transfer the substrate between the two or more compartment assemblies and the buffer chamber.
6. The system of claim 1, wherein each group of substrates comprises substrates with different substrate characteristics, said substrate characteristics including geometry, size, composition, transparency, or a combination thereof.
7. The system of claim 1, wherein the first conveying component comprises a first robot and a second robot, each robot being capable of operating simultaneously with the other.
8. The system of claim 7, wherein the second transport component comprises a third robot and a fourth robot, each of the third robot and the fourth robot being capable of operating simultaneously with each other.
9. A method for processing multiple substrates, the method comprising the following steps: The first set of substrates is transferred from two or more chamber assemblies to a first carrier in a buffer chamber, wherein the first set of substrates includes at least two substrates with different substrate properties relative to each other; The first set of substrates disposed on the first carrier are adjusted in the buffer chamber; The first carrier having the first set of substrates is transferred to the processing chamber; and The first group of substrates disposed on the first carrier is processed in the processing chamber, wherein different processing parameters are used for each substrate when processing the first group of substrates. The processing chamber is a photolithography system configured to simultaneously process at least two of the group of substrates using different design files.
10. The method of claim 9, further comprising the following steps: Before being conveyed to the buffer chamber, each substrate conveyed from the two or more chamber assemblies is aligned at the alignment device.
11. The method of claim 9, further comprising the following steps: The second set of substrates is transferred from two or more compartment assemblies to a second carrier in the buffer chamber, wherein the transfer of the second set of substrates occurs simultaneously with the processing of the first set of substrates in the processing chamber.
12. The method of claim 11, further comprising the following steps: The second set of substrates disposed on the second carrier is adjusted in the buffer chamber, wherein the adjustment of the second set of substrates occurs simultaneously with the processing of the first set of substrates in the processing chamber.
13. The method of claim 12, wherein the total round-trip time of the first group of substrates and the second group of substrates processed simultaneously is 15% to 30% less than the cumulative round-trip time of the first group of substrates and the second group of substrates processed sequentially, wherein the round-trip journey refers to transferring the substrates from the two or more compartment assemblies to the buffer chamber, to the processing chamber, to the buffer chamber, and back to the two or more compartment assemblies.
14. The method of claim 9, further comprising the following steps: After processing the first set of substrates, the first set of substrates is transferred from the processing chamber to the buffer chamber; Each substrate is removed from the first carrier in the buffer chamber; and The first set of substrates is transferred from the buffer chamber to each of the two or more compartment assemblies.
15. The method of claim 9, wherein the step of transferring the first set of substrates from two or more compartment assemblies to the first carrier in the buffer chamber further comprises the following steps: The first set of substrates is transported using a first robot and a second robot, wherein each robot transports substrates to the other simultaneously.
16. The method of claim 9, wherein the total round-trip time for processing six groups of four substrates is 600 to 1000 seconds.
17. The method of claim 9, wherein the step of transmitting the first group of substrates includes a transmission time of 1 second to 10 seconds for each substrate.
18. A substrate processing system, the substrate processing system comprising: A first transfer assembly, configured to transfer a set of substrates to and from a buffer chamber, wherein the buffer chamber is configured to adjust the set of substrates, and wherein the buffer chamber includes a carrier configured to secure the set of substrates for processing; and A second transfer assembly is configured to transfer the carrier of the substrate group between the buffer chamber and the photolithography apparatus, wherein the photolithography apparatus enables each substrate in the substrate group to be processed simultaneously with each other.
19. The substrate processing system of claim 18, wherein the substrate group comprises 2 to 8 substrates.