Antenna module and electronic device including the same

Abstract

An electronic device includes a housing including a first plate, a second plate, and a side member including a first conductive member and a second conductive member surrounding a space between the first plate and the second plate and separated from each other by a gap, a support member in the space between the first plate and the second plate, a PCB, a wireless communication circuit disposed on the PCB, a display, a connection part protruding from an area of the second conductive member adjacent to the gap toward an inner portion of the housing, the connection part being electrically connected with the second conductive member, and a bonding member bonded to the connection part. The wireless communication circuit is configured to electrically connect the second conductive member and the connection part with an antenna circuit disposed on the PCB.

Description

Technical Field

[0001] One or more embodiments of this disclosure generally relate to antenna modules and electronic devices including therewith. Background Technology

[0002] With the development of mobile communication technology, electronic devices including at least one antenna have been introduced to the market. Electronic devices can use antennas to transmit and / or receive radio frequency (RF) signals such as voice signals or data (e.g., messages, photos, moving images, music files, or games).

[0003] Electronic devices can transmit or receive signals simultaneously in different frequency bands (i.e., by using multiple frequency bands). Electronic devices can provide services in global communication frequency bands by using different frequency bands. For example, electronic devices can communicate using signals in the low frequency band (LB) (e.g., Global Positioning System (GPS); Legacy; WiFi 1) and / or use signals in the high frequency band (HB) (e.g., WiFi 2).

[0004] Meanwhile, the electronic device can transmit or receive signals by employing not only an antenna module disposed inside the housing but also the housing itself, which includes conductive material, as a radiator. For example, at least a portion of the metal housing included in the electronic device can be electrically connected to a power supply component, and the power supply component can transmit signals in various frequency bands through this portion of the metal housing.

[0005] The above information is presented as background information only to aid in understanding this disclosure. No determination is made, and no assertion is made, regarding whether any of the above is applicable as prior art with respect to this disclosure. Summary of the Invention

[0006] Technical issues

[0007] At least one slit can be formed in a portion of the housing, allowing the housing to function as a radiator. For example, multiple slits can be formed on one side of the housing to separate a portion of the side housing from the rest, allowing that portion of the side housing to function as a radiator. In this way, increasing the number of slits increases the number of radiators. However, increasing the number of radiators by adding more slits to the housing may compromise the aesthetics of the electronic device and reduce its rigidity. Conversely, when the number of slits is limited, the mounting space for the antenna module may also be limited in small mobile devices. In such cases, the electronic device may not be able to provide various services simultaneously in different frequency bands.

[0008] Technical solution

[0009] According to an aspect of this disclosure, an electronic device may include: a housing comprising a first plate, a second plate, and a side member, the first plate facing a first direction, the second plate facing a second direction opposite to the first direction, the side member comprising a first conductive member and a second conductive member, the first conductive member and the second conductive member surrounding a space between the first plate and the second plate and separated from each other by a gap; a support member situated between the first plate and the second plate; a printed circuit board (PCB) disposed on a first surface of the support member; a wireless communication circuit disposed on the PCB; a display disposed on a second surface of the support member facing a direction opposite to the first surface of the support member and exposed through at least a portion of the first plate; a connecting member protruding from a region of the second conductive member adjacent to the gap toward an interior portion of the housing, the connecting member being electrically connected to the second conductive member; and a coupling member coupled to the connecting member while the first surface of the PCB is disposed thereon. The wireless communication circuit may be configured to electrically connect the second conductive member and the connecting member to an antenna circuit included in the PCB.

[0010] According to another aspect of this disclosure, an electronic device may include a side housing, a PCB, and a wireless communication circuit disposed on the PCB. The side housing includes a first conductive member and a second conductive member separated from each other by a gap. The second conductive member may include a connecting member protruding from a region of the second conductive member adjacent to the gap, the connecting member being connected to the PCB. The wireless communication circuit may be configured to electrically connect the second conductive member and the connecting member to antenna circuitry disposed on the PCB.

[0011] Beneficial effects

[0012] As described above, according to certain embodiments, the antenna performance of an electronic device can be improved while maintaining a sufficient number of slits included in the housing.

[0013] At least one connecting component protruding inward from one end of the housing separated by a slit serves as a radiator. In this way, mounting space for the electronic device's antenna can be easily secured. Furthermore, the antenna functioning based on carrier aggregation (CA) technology can be implemented without unnecessary compromises.

[0014] In addition, various effects can be provided, directly or indirectly, through this disclosure. Attached Figure Description

[0015] Figure 1This is a block diagram illustrating an electronic device in a network environment according to various embodiments;

[0016] Figure 2 A front perspective view of an electronic device according to an embodiment is shown;

[0017] Figure 3 A perspective view of the rear of an electronic device according to an embodiment is shown;

[0018] Figure 4 This is an exploded perspective view of an electronic device according to an embodiment;

[0019] Figure 5 The structure of an electronic device including a connecting component according to an embodiment is shown;

[0020] Figure 6 The structure of an electronic device including a connecting component according to an embodiment is shown;

[0021] Figure 7 A stacked structure of an electronic device including connecting components according to an embodiment is shown;

[0022] Figure 8 The structure of an electronic device including a connecting component according to an embodiment is shown;

[0023] Figure 9 The structure of an electronic device including multiple slits according to an embodiment is shown;

[0024] Figure 10 A schematic diagram of the internal portion of an electronic device including a switching circuit according to an embodiment is shown;

[0025] Figure 11 The efficiency variation of the radiation function performed by the electronic device according to the embodiment is shown.

[0026] In the following description with reference to the accompanying drawings, similar components will be given similar reference numerals. Detailed Implementation

[0027] In the following, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, it should be understood that the present disclosure is not limited to the specific embodiments, but includes various modifications, equivalents, and / or substitutions of the embodiments of the present disclosure. Regarding the description of the drawings, similar reference numerals may refer to similar elements.

[0028] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0029] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) coupled to electronic device 101, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or application processor (AP)) and auxiliary processors 123 (e.g., a graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that are operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or it can be implemented as part of the main processor 121.

[0030] The auxiliary processor 123 can control at least some functions or states related to at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) in place of the main processor 121 when the main processor 121 is inactive (e.g., in a sleep state), or perform the aforementioned control together with the main processor 121 when the main processor 121 is active (e.g., executing an application). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware structures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed by the electronic device 101 performing artificial intelligence or via a separate server (e.g., server 108). Learning algorithms can include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. Artificial neural networks can be deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more thereof, but are not limited thereto. Additionally or alternatively, artificial intelligence models may include software structures in addition to hardware structures.

[0031] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0032] The program 140 can be stored as software in the memory 130, and the program 140 includes, for example, an operating system (OS) 142, middleware 144, or application 146.

[0033] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0034] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a corresponding one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0036] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or via headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled to it.

[0037] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0038] Interface 177 may support one or more specified protocols used to directly (e.g., wired) or wirelessly couple electronic device 101 with external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0039] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0042] The power management module 188 can manage the power supply to the electronic device 101. According to one embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0043] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell.

[0044] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0045] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as New Radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0046] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0047] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna). The RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0048] At least some of the aforementioned components can be coupled to each other and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0049] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 coupled to the second network 199. Each of electronic device 102 and electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations to be performed on electronic device 101 can be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service as a substitute for or supplement to performing the function or service. One or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and send the result of the execution to electronic device 101. Electronic device 101 can provide the result as at least part of a response to a request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing can be used. Electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0050] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0051] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase in the phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used only to distinguish the respective component from another component and do not limit the component in other respects (e.g., in terms of importance or order). It will be understood that, in the presence or absence of the terms “operably” or “communically”, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) coupled to another element, wirelessly coupled to another element, or coupled to another element via a third element.

[0052] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor (e.g., processor 120) of the machine (e.g., electronic device 101), the processor can invoke and execute at least one instruction from one or more instructions stored in the storage medium, with or without one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0054] According to embodiments, methods according to various embodiments of this disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or it can be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or it can be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product can be temporarily generated, or at least a portion of the computer program product can be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0055] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0056] Figure 2 An electronic device 200 according to an embodiment is shown (e.g., Figure 1 A front perspective view of the electronic device 101. Figure 3 A perspective view of the rear of an electronic device 200 according to an embodiment is shown.

[0057] refer to Figure 2 and Figure 3 The electronic device 200 according to an embodiment may include a housing 210, the housing 210 including a first surface 210A (or front surface), a second surface 210B (or rear surface), and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. According to another embodiment (not shown), the housing may be referred to as forming Figures 2-3 The structure comprises some of the first surface 210A, second surface 210B, and side surface 210C. According to an embodiment, the first surface 210A may include at least a portion of a substantially transparent front panel 202 (e.g., a glass plate or a polymer plate including various coatings). The second surface 210B may be achieved by a substantially opaque rear panel 211. The rear panel 211 may include, for example, coated glass or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 210C may include a side frame structure (or side member) 218 ​​that is incorporated into the front panel 202 and the rear panel 211 and comprises metal and / or polymer. According to an embodiment, the rear panel 211 and the side frame structure 218 may be integrally formed with each other and may comprise the same material (e.g., a metallic material such as aluminum).

[0058] According to an embodiment, the front panel 202 may include two first regions 210D, which extend seamlessly from the first surface 210A while curving toward the rear panel 211 and forming at opposite long edge ends of the front panel 202. According to the illustrated embodiment (see [reference]...) Figure 3 The rear panel 211 may include two second regions 210E, which extend seamlessly from the second surface 210B while curving toward the front panel 202 and forming at opposite long-side ends of the rear panel 211. According to an embodiment, the front panel 202 (or the rear panel 211) may include only one of the first region 210D (or the second region 210E). According to another embodiment, the first region 210D and / or the second region 210E may be eliminated in certain portions of the housing. According to this embodiment, when viewed from the side surface of the electronic device 200, the side frame structure 218 may have a first thickness (or width) at the side surface without the first region 210D or the second region 210E, and may have a second thickness thinner than the first thickness at the side surface including the first region 210D or the second region 210E.

[0059] According to an embodiment, at least one antenna radiator (e.g., a conductive pattern) may be disposed on a side member of the housing 210 of the electronic device 200 (e.g., Figure 3 The side frame structure 218) extends seamlessly from the first surface 210A of the front plate 202 towards the rear plate 211 in two first regions 210D or extends seamlessly from the second surface 210B of the rear plate 211 towards the front plate 202 in two second regions 210E.

[0060] According to an embodiment, at least one antenna radiator can radiate signals in a specified frequency band. According to an embodiment, at least one antenna radiator can be a sub-radiator. For example, at least one antenna radiator can radiate signals such as “n41”, “n78”, and / or “n79” in a 5G centimeter-wave (Sub-6) frequency band ranging from 3.5 GHz to approximately 6 GHz. In another example, at least one antenna radiator can radiate signals in a WiFi frequency band. The WiFi frequency band can be one or more frequency bands used in IEEE 802.11a and / or 802.11b.

[0061] According to an embodiment, at least one antenna radiator may be a main radiator. According to an embodiment, the frequency band radiated from the main radiator may at least partially overlap with the frequency band radiated from the sub-radiators.

[0062] According to another embodiment, at least one antenna radiator can radiate signals in a millimeter-wave frequency band. For example, the millimeter-wave frequency band may include a band ranging from approximately 24 GHz to 34 GHz and / or from approximately 37 GHz to 44 GHz. In another example, at least one antenna radiator can radiate signals in the IEEE 802.11ay frequency band.

[0063] According to an embodiment, the electronic device 200 includes a display 201 (e.g., Figure 1 Display module 160), audio modules 203, 207 and 214 (e.g., Figure 1 The audio module 170), sensor modules 204, 216 and 219 (e.g., Figure 1 Sensor module 176), camera modules 205, 212 and 213 (e.g., Figure 1 The electronic device 200 may omit at least one of the following components: camera module 180, key input device 217, light-emitting device 206, or connector holes 208 and 209. According to embodiments, the electronic device 200 may omit at least one of the components (e.g., key input device 217 or light-emitting device 206) or may include other components.

[0064] Display 201 may be exposed, for example, through a considerable portion of front panel 202. According to an embodiment, at least a portion of display 201 may be exposed through front panel 202 including a first region 210D comprising a first surface 210A and a side surface 210C. According to an embodiment, the edge of display 201 may be formed to have a shape substantially the same as the shape of the outer portion of front panel 202 (adjacent to the edge). According to another embodiment (not shown), to increase the area exposing display 201, substantially equal distance may be formed between the outer portion of display 201 and the outer portion of front panel 202.

[0065] According to another embodiment (not shown), a notch or opening may be formed in a portion of the screen display area of ​​the display 201. Furthermore, at least one of the audio module 214, sensor module 204, camera module 205, and light-emitting device 206 may be aligned within the notch or opening. According to another embodiment (not shown), at least one of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, or light-emitting device 206 may be included in the rear surface of the screen display area of ​​the display 201. According to yet another embodiment (not shown), the display 201 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor to measure the intensity (pressure) of a touch, and / or may be coupled to or adjacent to a digitizer to detect a stylus based on an electromagnetic scheme. According to embodiments, at least some of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in a first region 210D and / or a second region 210E.

[0066] Audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. The microphone hole 203 allows a microphone to be positioned inside to receive external sound. According to embodiments, multiple microphones may be provided to sense the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for use in a conversation. According to embodiments, speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without speaker holes 207 and 214.

[0067] Sensor modules 204, 216, and 219 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. Sensor modules 204, 216, and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown; e.g., a fingerprint sensor) disposed on a first side surface 210A of housing 210 and / or a third sensor module 219 (e.g., a heart rate monitoring (HRM) sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on a second surface 210B of housing 210. The fingerprint sensor may be disposed on both the second surface 210B and the first surface 210A (e.g., a display 201) of housing 210. Electronic device 200 may also include sensor modules (not shown), such as at least one of a gesture sensor, gyroscope sensor, air pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor 204.

[0068] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, a second camera device 212 disposed on a second side surface 210B of the electronic device 200, and / or a flash 213. Camera devices 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. According to an embodiment, two or more lenses (infrared camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on one side surface of the electronic device 200.

[0069] Key input device 217 may be disposed on side surface 210C of housing 210. According to another embodiment, electronic device 200 may not include some or all of the key input device 217, and the un-included portion of the key input device 217 may be implemented in another form (such as soft keys on display 201). According to another embodiment, key input device 217 may include sensor module 216 disposed on second surface 210B of housing 210.

[0070] The light-emitting device 206 may, for example, be disposed on the first surface 210A of the housing 210. The light-emitting device 206 may provide, for example, status information of the electronic device 200 in an optical form. According to another embodiment, the light-emitting device 206 may provide a light source that operates, for example, in conjunction with the operation of the camera module 205. The light-emitting device 206 may, for example, include LEDs, Ir LEDs, and xenon lamps.

[0071] Connector holes 208 and 209 may include a first connector hole 208 and a second connector hole (e.g., a headphone jack) 209, the first connector hole 208 receiving a connector (e.g., a USB connector) to send or receive power and / or data with an external electronic device, and the second connector hole 209 receiving a connector to send or receive audio signals with an external electronic device.

[0072] Figure 4 It is an electronic device according to an embodiment (e.g., Figure 2 and / or Figure 3 Exploded perspective view 400 of the electronic device 200. (Reference) Figure 4 The electronic device 200 may include a side bezel structure 410 (e.g., Figure 2 The side frame structure 218), the first support member 411 (e.g., bracket), the front panel 420, and the display 430 (e.g., Figure 1 The display 201), printed circuit board (PCB) 440, battery 450, second support member 460 (e.g., rear housing), near-field antenna 470, and rear plate 480 (e.g., Figure 3(The rear plate 211). According to an embodiment, the electronic device 200 may omit at least one of the components (e.g., the first support member 411 or the second support member 460) or may additionally include other components. At least one of the components of the electronic device 200 may be with Figure 2 or Figure 3 At least one of the components of the electronic device 200 is the same or similar, and repeated descriptions thereof will be omitted.

[0073] The side frame structure 410 may include one or more conductive members (e.g., a first conductive member 417a and a second conductive member 417b) surrounding the space between the front panel 420 and the rear panel 480 of the electronic device 200 and separated from each other by a slot 413. The side frame structure 410 may also include a connecting member 415 protruding from the region of the second conductive member 417b adjacent to the slot 413 toward the interior portion of the housing. The connecting member 415 may also be electrically connected to the second conductive member 417b. The connecting member 415 may include a connecting member (e.g., a screw) engaged in the +Z axis direction. Although... Figure 4 Only one slit is shown, but this disclosure is not limited thereto. For example, the side frame structure 410 may also include multiple slits (not shown). The side frame structure 410 may also include conductive members separated from each other by the multiple slits. Thus, connecting members projecting from at least one conductive member toward the interior portion of the housing may be additionally included. Reference will be made later. Figure 9 Details are provided regarding the conductive components that are separated from each other by multiple gaps, as well as the additional connecting components.

[0074] The first support member 411 may be disposed between the front panel 420 and the rear panel 480. The first support member 411 may be disposed inside the electronic device 200 to connect to the side bezel structure 410 or may be integrally formed with the side bezel structure 410. The first support member 411 may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The display 430 may be disposed on a first surface of the first support member 411 (e.g., a surface facing the +Z axis direction), and the PCB 440 may be disposed on a second surface facing a direction opposite to the first surface (e.g., a surface facing the -Z axis direction).

[0075] PCB 440 may have a processor (e.g., Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130), and the interface (e.g., Figure 1 Interface 177) and wireless communication circuits (e.g., Figure 1The wireless communication module 192), antenna circuitry, multiple passive components, and / or switching circuitry are included. The processor 120 may include at least one of, for example, a central processing unit (CPU), application processor (AP), graphics processing unit (GPU), image signal processor (ISP), sensor hub processor (SHP), or communication processor (CP). The memory may include, for example, volatile or non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 200 to an external electronic device (e.g., Figure 1 The electronic devices 102 and 104 may include a USB connector, an SD card / MMC connector, or an audio connector. The wireless communication circuit may be a radio frequency integrated circuit (RFIC). For example, the wireless communication circuit may be configured to electrically connect at least some of the side frame structures 410 (e.g., the second conductive member 417b and the connection member 415) using antenna circuitry disposed on the PCB 440. Multiple passive devices may include at least one of, for example, an inductor or a capacitor. At least some of the multiple passive devices may be electrically connected to the connection member 415 and may correspond to a ground area for the connection member 415. A switching circuit may, for example, be electrically connected to the multiple passive devices and the connection member 415. The switching circuit may perform an operation that changes the electrical connection structure by connecting mutually different passive devices according to the antenna resonant frequency required for the processing performed by the antenna module.

[0076] Battery 450 may include means for supplying power to at least one component of electronic device 200, such as a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. At least a portion of battery 450 may be located on a plane substantially the same as the plane of PCB 440. Battery 450 may be integrally disposed within electronic device 200 and may be configured to be removable from electronic device 200.

[0077] A near-field antenna 470 may be located between the rear panel 480 and the battery 450. The near-field antenna 470 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The near-field antenna 470 may perform short-range communication with external devices or may wirelessly send or receive power necessary for charging. According to another embodiment, the antenna structure may be formed by a portion of the side frame structure 410 and / or the first support member 411, or a combination of the side frame structure 410 and the first support member 411. For example, wireless communication circuitry may be configured to electrically connect at least some of the side frame structure 410 (e.g., the second conductive member 417b) and the connection member 415 to antenna circuitry disposed on the PCB 440. Various antenna structures for electronic devices will be described below.

[0078] Figure 5 The structure 500 of an electronic device including a connecting component according to an embodiment is shown.

[0079] refer to Figure 5 Electronic device 501 (e.g., Figure 1 The electronic device 101 may include a side member 510 (e.g., Figure 4 (Side frame structure 410). Figure 5 It is a view showing one surface of the side member 510 as viewed from a second direction (e.g., the -Z axis direction).

[0080] Reference to the embodiments and Figure 5 The reference numeral 503 corresponds to a region of the side member 510. The electronic device 501 may employ a plurality of conductive members formed in at least one region of the side member 510 and a region protruding from at least one region of the side member 510 as an antenna. For example, the plurality of conductive members formed in at least one region of the side member 510 may refer to regions defined based on gap regions (e.g., slots 513) included in the side member 510. A region protruding from at least one region of the side member 510 may refer to a region protruding from at least some regions defined based on gap regions included in the side member 510. In other words, the conductive members and the region protruding from at least one region of the side member 510 may be components integrally formed with the side member 510, corresponding to a portion of the side member 510.

[0081] According to an embodiment, the side member 510 may include one or more conductive members 517a and 517b (e.g., Figure 4 The first conductive member 417a and the second conductive member 417b), which surround the first plate (e.g., Figure 4 The front panel 420) and the second panel (e.g., Figure 4 The space between the back panel 480) and through the gap 513 (e.g., Figure 4 The gaps 413 are separated from each other. The side member 510 may also include a connecting member 515 projecting from the region of the second conductive member 517b adjacent to the gap 513 toward the interior portion of the housing, and the connecting member 515 is electrically connected to the second conductive member 517b. The connecting member 515 may include a connecting member (e.g., a screw) engaged in the +Z axis direction. Although Figure 5 The illustration shows only one slit (e.g., slit 513), but this disclosure is not limited thereto. For example, the side member 510 may also include at least one slit (e.g., a second slit 523); Figure 9 The second slit 923, the third slit 933, and / or the fourth slit 943). The side member 510 may also include conductive members separated from each other by the plurality of slits. Therefore, the side member 510 may also include a plurality of connecting members (e.g., protruding from at least one of the conductive members toward the interior portion of the housing). Figure 9 (The second connecting part 925, the connecting part 935, and / or the fourth connecting part 945). Refer to later. Figure 9 Details are provided regarding the conductive components that are separated from each other by multiple gaps, as well as the additional connecting components.

[0082] In the following text, reference will be made to Figure 6 An expanded view of the area corresponding to reference numeral 503 in the accompanying drawings is described in more detail.

[0083] Figure 6 The structure 600 of an electronic device including a connecting component according to an embodiment is shown.

[0084] refer to Figure 6 Electronic devices (e.g.) Figure 1 The electronic device 101 may include a side member 610 (e.g., Figure 4 (Side frame structure 410). Figure 6 This illustrates the relationship between the side member 610 and the viewer when viewed from a second direction (e.g., the -Z-axis direction). Figure 5 The area corresponding to the attached figure label 503.

[0085] According to an embodiment, the side member 610 may include a gap 613 (e.g., Figure 4 The gap 413) separates one or more conductive components 617a and 617b from each other (e.g., Figure 4The first conductive member 617a and the second conductive member 617b. According to an embodiment, the first conductive member 617a and the second conductive member 617b may include conductive patterns formed in at least one region of the conductive member 617a and the second conductive member 617b, which are generated via laser directional structuring (LDS). The side member 610 may also include a connecting member 615 projecting from a region of the second conductive member 617b adjacent to the slot 613 toward the interior portion of the housing, and the connecting member 615 may be electrically connected to the second conductive member 617b. The connecting member 615 may be electrically connected to the first conductive member 617a via a power feeding member 623. At least a portion of the connecting member 615 may be formed of a metal such as a copper (Cu) alloy. A coupling member (e.g., a screw) may be coupled to the connecting member 615 while facing the +Z axis direction. The coupling member may be screwed fastened to the connecting member 615 in a first direction (e.g., the +Z axis direction).

[0086] According to an embodiment, the side member 610 may include at least one support member formed therein (e.g., Figure 4 The first support member 411). For example, PCB 640 may be disposed on the first surface of the support member (e.g., the surface of the support member facing the -Z axis direction). As another example, via the front plate (e.g., Figure 4 The front panel 420) exposes at least a portion of the display (e.g., Figure 4 The display 430 can be disposed on a second surface of the support member facing the direction opposite to that of the first surface (e.g., the surface of the support member facing the +Z axis direction).

[0087] According to an embodiment, a wireless communication circuit (not shown), a plurality of passive devices 631a and 631b, a switch (not shown), power supply components 621 and 623 and / or grounding component 650 may be disposed on a PCB 640.

[0088] A wireless communication circuit can supply power to one or more conductive members 617a and / or 617b included in an electronic device. For example, a first power supply member 621 included in the wireless communication circuit can supply power to a first point of the first conductive member 617a. A second power supply member 623 can supply power to a second point of the first conductive member 617a and a connecting member 615. For example, the second point can be arranged adjacent to a first end of the first conductive member 617a adjacent to the gap 613, and the first point can be arranged adjacent to a second end of the first conductive member 617a opposite to the first end. A plurality of passive devices 631a and 631b can be disposed on the path through which the second power supply member 623 supplies power to the connecting member 615. For example, the plurality of passive devices 631a and 631b can be referred to as a matching circuit for the first conductive member 617a and / or the second conductive member 617b. For example, a passive device 631a electrically connected to the first conductive member 617a and the connecting member 615 can be referred to as a first matching circuit. Similarly, the passive device 631b electrically connected to the second conductive member 617b and the connecting member 615 can be referred to as the second matching circuit. The plurality of passive devices 631a and 631b may include, for example, one or more inductors and / or capacitors. At least some of the plurality of passive devices 631a and 631b may be electrically connected to the connecting member 615, thereby grounding the connecting member 615. In another example, the connecting member 615 may be electrically connected to a grounding member 650, which in turn is electrically connected to a point on the second conductive member 617b. Thus, the connecting member 615 can be grounded through the grounding member 650. A switching circuit may, for example, be mounted on a PCB and may be electrically connected to the plurality of passive devices and the connecting member 615. The switching circuit can perform the operation of changing the electrical connection structure by connecting different passive devices according to the antenna resonant frequency required for specific antenna operation. For example, a wireless communication circuit may selectively connect the connecting member 615 to either the first matching circuit 631a or the second matching circuit 631b via the switching circuit. More on this later... Figure 10 Describe the structure of an electronic device that includes switching circuits.

[0089] although Figure 6 Multiple passive devices 631a and 631b are shown, but embodiments of this disclosure are not limited thereto. For example, an electronic device may include at least one active device instead of a passive device. As another example, an electronic device may include only one passive device.

[0090] Figure 7 This is a cross-sectional view 700 of an electronic device including connecting components according to an embodiment.

[0091] Figure 7 Showing from Figure 6The cross-sectional view taken from point A to point A' in the diagram is 700°. (Reference) Figure 7 Electronic devices (e.g.) Figure 1 The electronic device 101 may have a stacked structure in which the various components are included in a housing. In this case, the housing may include a orientation facing a first direction 703a (e.g., Figure 4 The first plate 720 (or) in the +Z axis direction Figure 4 The front plate 420), and the second plate 780 facing the second direction 703b opposite to the first direction 703a (e.g., Figure 4 The rear plate 480), and the side member 710 including conductive members (e.g., Figure 4 The side frame structure 410) has conductive components surrounding the space between the first plate and the second plate and separated from each other by gaps.

[0092] According to an embodiment, the electronic device may include a connection member 715 projecting from a region of a conductive member adjacent to the gap toward an interior portion of the housing, wherein the conductive member passes through the gap (e.g., Figure 6 The gaps 613 are separated from each other. At least a portion of one end of the connecting member 715 facing at least a first direction (e.g., the +z axis direction) and / or at least a portion of the other end of the connecting member 715 facing at least a second direction may be made of a copper (Cu) alloy. In another example, the connecting member 715 may include an anodized film region formed on at least a portion of the surface of the connecting member 715. Reference may be made later. Figure 8 A more detailed description of the components and surfaces of the connecting part 715 is provided.

[0093] According to an embodiment, the electronic device may further include a coupling member 717 formed within the housing. For example, the coupling member 717 may be coupled to the connecting member 715 while facing the first direction 703a. The coupling member 717 may be a screw and may be screw-fastened to the connecting member 715 in the first direction 703a. As the coupling member 717 is fastened, the PCB 740 disposed on the support member 705 can be secured. For example, the support member 705 is physically coupled to a region of the side member 710, and the coupling member 717 is coupled to the connecting member 715, such that the PCB is secured to the support member 705.

[0094] According to an embodiment, the support member 705 may be located in the space between the first plate 720 and the second plate 780. The support member 705 may be disposed inside the electronic device to connect to the side member 710 or may be integrally formed with the side member 710. The support member 705 may be formed of, for example, a non-metallic (e.g., polymer) material. The display 730 may be disposed on a first surface of the support member 705 (e.g., a surface facing a first direction 703a), and the PCB 740 may be disposed on a second surface facing a direction opposite to that of the first surface (e.g., a surface facing a second direction 703b).

[0095] According to an embodiment, pads 743a and 743b with copper (Cu) patterns can be formed on at least a portion of the area of ​​the PCB 740 that contacts the connecting member 715. Antenna circuitry disposed on the PCB 740 can be electrically connected to conductive members via the pads 743a and 743b with copper (Cu) patterns. According to an embodiment, the PCB 740 can be electrically connected to one or more conductive elastic structures 745a and 745b. For example, the PCB 740 can be connected via one or more conductive elastic structures 745a and 745b and / or grounding members (e.g., Figure 6 The grounding component 650) and the power feeding component (e.g., Figure 6 The power supply component 623) is electrically connected. The conductive elastic structures 745a and 745b can be implemented as C-type clips, spring pins, etc.

[0096] Figure 8 The structure of an electronic device including a connecting component according to an embodiment is shown.

[0097] According to an embodiment, the connecting member 815 may include an anodized film region 830 formed on at least a portion of the surface of the connecting member 815. The anodized film region may be coated with an anodized aluminum film. For example, when the anodized film region 830 is included in a region of the connecting member 815 (e.g., a region coupled to a PCB), the connecting member 815 may be AC ​​coupled to a second conductive member (e.g., Figure 6 The second conductive member 617b). As the surface of the connection member 815 is anodized, the connection member 815 can be electrically isolated from the PCB, allowing the connection member 815 to act as a floating ground. The anodized surface of the connection member 815 can protect the component from external influences and can improve the corrosion resistance of the connection member 815. In another example, when the anodized film region 830 is not included in the connection member 815, the connection member 815 can be DC coupled to the second conductive member.

[0098] According to an embodiment, the pads include copper (Cu) patterns (e.g., Figure 7The pads 743a and 743b can be formed on at least a portion 840 of the PCB that contacts the connecting member 815. For example, an antenna circuit disposed on the PCB can be electrically connected to the connecting member 815 via pads with a copper (Cu) pattern formed on the PCB. The connecting member 815 can be electrically connected to a second conductive member. Therefore, the PCB can be electrically connected to the second conductive member using pads with a copper (Cu) pattern.

[0099] Figure 9 The structure of an electronic device including multiple slits according to an embodiment is shown.

[0100] According to an embodiment, electronic devices (e.g., Figure 1 Electronic device 101) may include components formed on side member 910 (e.g., Figure 4 One or more slits 913, 923, 933, and 943 of the side member 410. Each of the regions of the side member 910 that are separated from each other by one or more slits 913, 923, 933, and 943 can be used as a conductive member.

[0101] According to an embodiment, the side member 910 may include a first gap 913 (e.g., Figure 6 The gaps 613, 923, 933, and 943. Although Figure 9 A total of four gaps are shown, but this disclosure is not limited to this. For example, the side member 910 may include only some of the first to fourth gaps 913, 923, 933, and 943. Meanwhile, reference can be made to... Figure 5 and Figure 6 The description is made to understand the description of the conductive components separated from each other by the first gap 913, and its details will be omitted below.

[0102] According to an embodiment, the side member 910 may include a third conductive member 927a and a fourth conductive member 927b separated from each other by a second gap 923. The separation between the third conductive member 927a and the fourth conductive member 927b may be based on the separation between logical regions defined by the third gap 933. According to an embodiment, the side member 910 may also include a second connecting member 925 protruding from a region of the third conductive member 927a or the fourth conductive member 927b toward the interior portion of the housing. For example, the second connecting member 925 may protrude from a region of the fourth conductive member 927b adjacent to the second gap 923 toward the interior portion of the housing and may be electrically connected to the fourth conductive member 927b.

[0103] According to an embodiment, the side member 910 may include a fifth conductive member 937a and a sixth conductive member 937b separated from each other by a third gap 933. The separation between the fifth conductive member 937a and the sixth conductive member 937b may be based on the separation between logical regions defined by the third gap 933. The side member 910 may also include a third connecting member 935 protruding from a region of the fifth conductive member 937a or the sixth conductive member 937b toward the interior portion of the housing. For example, the third connecting member 935 may protrude from a region of the sixth conductive member 937b adjacent to the third gap 933 toward the interior portion of the housing and may be electrically connected to the sixth conductive member 937b.

[0104] According to an embodiment, the side member 910 may include a seventh conductive member 947a and an eighth conductive member 947b, separated from each other by a fourth gap 943. The separation between the seventh conductive member 947a and the eighth conductive member 947b may be based on the separation between logical regions defined by the fourth gap 943. The side member 910 may also include a fourth connecting member 945 protruding from a region of the seventh conductive member 947a or the eighth conductive member 947b toward the interior portion of the housing. For example, the fourth connecting member 945 may protrude from a region of the eighth conductive member 947b adjacent to the fourth gap 943 toward the interior portion of the housing and may be electrically connected to the eighth conductive member 947b.

[0105] Figure 10 A schematic diagram 1000 shows the internal portion of an electronic device including a switch according to an embodiment.

[0106] refer to Figure 10 According to an embodiment, electronic devices (e.g., Figure 1 The electronic device 101 may include a support member 1011, a PCB 1040, a first power supply component 1021, a second power supply component 1023, a first passive device 1031a, a second passive device 1031b, a first switch 1041a, a second switch 1041b, and / or a side member 1010 (e.g., Figure 6 The grounding component 1050 is located inside the side member 610. The first switch 1041a and the second switch 1041b can, for example, perform operations to change the electrical connection structure by connecting different passive devices according to the antenna resonant frequency required for a specific antenna operation. The first passive device 1031a and the second passive device 1031b may include, for example, one or more inductors or capacitors. At least some of the passive devices may correspond to the grounding area of ​​the connection member 1015.

[0107] According to embodiments, the electronic device may include a slit (e.g., Figure 6A first conductive member 1017a and a second conductive member 1017b are separated from each other by a gap 613. This separation between the first conductive member 1017a and the second conductive member 1017b can be based on the separation between logical regions defined by the gap. According to an embodiment, the electronic device may further include a connecting member 1015 projecting from a region of the second conductive member 1017b adjacent to the gap toward an interior portion of the housing, and the connecting member 1015 can be electrically connected to the second conductive member 1017b. According to an embodiment, a wireless communication circuit (e.g., ...) is disposed on a PCB 1040 mounted on one surface of a support member 1011. Figure 1 The wireless communication module 192 can supply power to the first conductive member 1017a and / or the connection member 1015. For example, the first power supply member 1021 can supply power to the first conductive member 1017a. In another example, the second power supply member 1023 can supply power to the first conductive member 1017a and / or the connection member 1015. The connection member 1015 can be electrically connected to the second conductive member 1017b.

[0108] According to an embodiment, the electronic device may further include one or more switches 1041a and 1041b. For example, the first switch 1041a may be electrically connected to the first passive device 1031a and the connection member 1015. For example, the second switch 1041b may be electrically connected to the second passive device 1031b and the connection member 1015.

[0109] Figure 11 This is a graph 1100 showing the efficiency variation of the radiation function performed by the electronic device according to an embodiment.

[0110] According to an embodiment, the curve indicated by reference numeral 1110 can represent the internal structure of the housing (e.g., Figure 4 The connecting component 415) serves as the electronic device of the radiator (e.g., Figure 1 The radiation efficiency measured by the electronic device 101. The curve indicated by reference numeral 1120 can represent the radiation efficiency measured by a conventional electronic device that does not have the structure disclosed herein.

[0111] refer to Figure 11According to embodiments, it can be understood that when an electronic device employs at least one connecting component as a radiator, the radiation efficiency can be increased across the entire frequency band (e.g., a band from 3.0 GHz to 5.6 GHz). For example, it can be understood that in a first frequency band (e.g., a band of 3.0 GHz), the radiation efficiency measured by an electronic device without the structure disclosed herein is -14 dB. Meanwhile, it can be understood that in the first frequency band of 3.0 GHz, the radiation efficiency of an electronic device having the structure disclosed herein is -11 dB, which represents a higher radiation efficiency.

[0112] According to various embodiments of this disclosure, electronic devices (e.g., Figure 1 The electronic device 101 may include: a housing including a first plate facing a first direction (e.g., the +Z axis direction). Figure 4 The front panel 420) faces a second direction opposite to the first direction (e.g., Figure 4 The second plate (e.g., in the -Z axis direction) Figure 4 The rear plate 480) and side members (e.g., Figure 4 The side member 410 includes a first conductive member (e.g., Figure 4 The first conductive member 417a) and the second conductive member (e.g., Figure 4 The second conductive member 417b), the first conductive member and the second conductive member surround the space between the first plate and the second plate and pass through a gap (e.g., Figure 4 The gaps 413) are separated from each other; the supporting members (e.g., Figure 4 Support member 411), located between the first plate and the second plate; printed circuit board (e.g., Figure 4 PCB 440), disposed on the first surface of the support member; wireless communication circuitry, disposed on the PCB; display (e.g., Figure 4 The display 430), is provided on a second surface of the support member facing a direction opposite to the first surface of the support member, and is exposed by at least a portion of the first plate; the connecting component (e.g., Figure 4 The connecting member 415 protrudes from the region of the second conductive member adjacent to the gap toward the interior portion of the housing, and is electrically connected to the second conductive member; and the coupling member is coupled to the connecting member while facing the first surface on which the PCB is disposed.

[0113] According to an embodiment, the wireless communication circuit can be configured to electrically connect the second conductive member to the connecting component using an antenna circuit disposed on a PCB.

[0114] According to an embodiment, pads including copper (Cu) patterns can be formed on at least a portion of the area of ​​the PCB that contacts the connecting components.

[0115] According to an embodiment, the anodized film region may be included on at least a portion of the surface of the connecting component.

[0116] According to an embodiment, the connecting component can act as a floating ground.

[0117] According to an embodiment, the connecting member can be a screw and can be screwed onto the connecting component such that the connecting member faces a first direction.

[0118] According to an embodiment, the electronic device may further include a first matching circuit, which is electrically connected to a first conductive member and a connecting member.

[0119] According to an embodiment, the electronic device may further include a second matching circuit, which is electrically connected to the second conductive member and the ground area of ​​the PCB.

[0120] According to an embodiment, the electronic device may further include a first switching circuit, which is disposed on a PCB and electrically connected to a first matching circuit and a connecting component.

[0121] According to an embodiment, the electronic device may further include a second switching circuit, which is disposed on a PCB and electrically connected to a second matching circuit and a connecting component.

[0122] According to an embodiment, the wireless communication circuit can use a first switching circuit to selectively connect the connection component to a first matching circuit, and use a second switching circuit to selectively connect the connection component to a second matching circuit.

[0123] According to an embodiment, the wireless communication circuit can feed power to a first point at the first end of the first conductive member adjacent to the gap.

[0124] According to an embodiment, the wireless communication circuit can feed power to a second point of the first conductive member adjacent to the second end opposite to the first end.

[0125] According to an embodiment, the support member can be physically attached to at least one area of ​​the side member, and the attachment member can be attached to the connecting member, so that the PCB is fixed to the support member.

[0126] According to various embodiments of this disclosure, an electronic device may include a side housing, a PCB, and a wireless communication circuit disposed on the PCB. The side housing includes a first conductive member and a second conductive member separated from each other by a gap. The second conductive member may include a connecting member protruding from a region of the second conductive member adjacent to the gap, the connecting member being electrically connected to the PCB, and the wireless communication circuit may be configured to electrically connect the second conductive member and the connecting member to an antenna circuit disposed on the PCB.

[0127] According to an embodiment, pads including copper (Cu) patterns can be formed on at least a portion of the area of ​​the PCB that contacts the connecting component, and the connecting component can include an anodized film region formed on at least a portion of the surface of the connecting component, such that the connecting component is electrically isolated from the PCB and can act as a floating ground.

[0128] According to an embodiment, the electronic device may further include a coupling member that is coupled to the connecting member while facing a first surface on which the PCB is disposed, and the coupling member may be a screw and may be screwed fastened to the connecting member.

[0129] According to an embodiment, the electronic device may further include a first matching circuit and a second matching circuit disposed on a PCB.

[0130] According to an embodiment, the first matching circuit can be electrically connected to the first conductive member, and the second matching circuit can be electrically connected to the second conductive member.

[0131] According to an embodiment, the electronic device may further include a first switching circuit and a second switching circuit. The first switching circuit is disposed on a PCB and electrically connected to a first matching circuit and a connecting component. The second switching circuit is disposed on the PCB and electrically connected to a second matching circuit and a connecting component. A wireless communication circuit may use the first and second switching circuits to selectively connect the connecting component to the first and second matching circuits.

[0132] According to an embodiment, the wireless communication circuit can supply power to a first point of the first conductive member adjacent to a first end of the gap and to a second point of the first conductive member adjacent to a second end opposite to the first end.

Claims

1. An electronic device, the electronic device comprising: A housing, the housing comprising a first plate, a second plate, and side members, the first plate facing a first direction, the second plate facing a second direction opposite to the first direction, the side members comprising a first conductive member and a second conductive member, the first conductive member and the second conductive member surrounding the space between the first plate and the second plate and being separated from each other by a gap; A supporting member, wherein the supporting member is located between the first plate and the second plate; A printed circuit board (PCB) is disposed on the first surface of the support member; A wireless communication circuit is disposed on the PCB. The wireless communication circuit includes a first power supply component and a second power supply component. The first power supply component supplies power to a first point of a first end of a first conductive member adjacent to the gap. The second power supply component supplies power to a second point of the first conductive member adjacent to a second end. The second end is opposite to the first end. A display is disposed on a second surface of the support member, the display faces a direction opposite to that of the first surface of the support member, and the display is exposed through at least a portion of the first plate; A connecting component protrudes from a region of the second conductive member adjacent to the gap toward the interior portion of the housing, and the connecting component is electrically connected to the second conductive member; A connecting member is attached to the connecting component while the first surface of the PCB is disposed thereon; as well as A first matching circuit is electrically connected to the first conductive member and the connecting component. Specifically, the region of the connecting component coupled to the PCB includes an anodized film region, such that the connecting component and the PCB are AC-coupled to each other. The wireless communication circuit is configured to electrically connect the second conductive member and the connecting member to an antenna circuit disposed on the PCB, and The first matching circuit is located on the path from which the first power supply component supplies power to the connecting component.

2. The electronic device according to claim 1, wherein, A pad with a copper (Cu) pattern is formed on at least a portion of the area of ​​the PCB that contacts the connecting component.

3. The electronic device according to claim 1, wherein, The connecting component acts as a floating ground.

4. The electronic device according to claim 1, wherein, The connecting member is a screw and is screwed onto the connecting component such that the connecting member faces the first direction.

5. The electronic device according to claim 1, further comprising: The second matching circuit is electrically connected to the second conductive member and the grounding area of ​​the PCB.

6. The electronic device according to claim 5, further comprising: A first switching circuit is disposed on the PCB and electrically connected to the first matching circuit and the connecting component.

7. The electronic device according to claim 6, further comprising: A second switching circuit is disposed on the PCB and electrically connected to the second matching circuit and the connecting component.

8. The electronic device according to claim 7, wherein, The wireless communication circuit uses the first switching circuit to selectively connect the connection component to the first matching circuit.

9. The electronic device according to claim 1, wherein, The support member is physically attached to at least one region of the side member.

10. The electronic device according to claim 7, wherein, The wireless communication circuit uses the second switching circuit to selectively connect the connection component to the second matching circuit.

11. The electronic device according to claim 1, wherein, The connecting member is attached to the connecting component, thereby fixing the PCB to the supporting member.

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