Sound processor

Abstract

A sound processor includes one or more electrical signal outputs configured to generate a plurality of electrical signals. The plurality of electrical signals are generated in response to sound information received at the sound processor in the specific tuned audio band of a respective audio channel. The sound processor further includes a transmitter coupled to the one or more electrical signal outputs for transmitting the plurality of electrical signals. The transmitter is configured to transmit the electrical signals in the respective audio channel over a separate, respective percutaneous communication link.

Description

Technical Field

[0001] This disclosure relates to sound processors such as microphones, and more specifically to in-ear sound processors for cochlear implants and other implantable hearing devices. It further relates to a system, a medical implant, and a method. Background Technology

[0002] Cochlear implants are surgically implanted neuroprosthetic devices that provide hearing to people with severe to profound sensorineural hearing loss. Current cochlear, bone conduction, and hearing implants have both an implantable component and an external component, which includes a microphone, sound processing electronics, and a battery. The implant requires power levels that can be delivered externally via a percutaneous link or from an internal battery. Conventional cochlear implants and other implantable hearing devices transmit data and power across a single RF (inductive) link. This can result in suboptimal power delivery to the implant when data is also transmitted over that link. Cochlear implants break down sound information into discrete frequency bands and then transmit data packets that need to be delivered to multiple sites within the cochlea to recreate speech. This discretization of data can increase latency in data transmission. Furthermore, because sound decoding strategies used with cochlear implants are typically optimized for speech recognition, low-frequency information known as temporal fine structure (TFS), the binaural cues inherently used by the auditory system to obtain sound and noise isolation and directionality, is removed or filtered out. Clinical evidence has shown that TFS is also important for understanding the melody and pitch of a sound.

[0003] The aim is to address or improve one or more of the shortcomings of conventional cochlear implant technology, or at least provide an effective alternative to it.

[0004] Any discussion of documents, actions, materials, devices, objects, etc., contained in this specification shall not be construed as an admission that any or all of such content constitutes part of the prior art or is common general knowledge in the field relating to this disclosure, simply because it existed prior to the priority date of each of the appended claims. Summary of the Invention

[0005] Embodiments of this disclosure provide a sound processor including a communication arrangement configured to transmit multiple audio data signals to a receiver stimulator of a cochlear implant across separate transcutaneous communication links. The arrangement is designed to retain low-frequency data as it is transmitted from the sound signals received at the sound processor to the implant.

[0006] According to a first aspect, a sound processor includes one or more electrical signal outputs configured to generate a plurality of electrical signals, wherein the plurality of electrical signals are generated in a specific tuned audio band in a respective audio channel in response to sound information received at the sound processor in the specific tuned audio band, and the sound processor further includes a transmitter coupled to the one or more electrical signal outputs for transmitting the plurality of electrical signals, wherein the transmitter is configured to transmit the electrical signals in a respective audio channel over a separate respective percutaneous communication link.

[0007] The sound processor generates multiple electrical signals, each corresponding to a specific frequency band, and each signal can be transmitted over a separate transcutaneous communication link, rather than a single signal covering all frequencies being transmitted over a single communication link. This arrangement allows for the transmission of low-frequency electrical signals containing TFS information across separate communication links, in addition to the separate transmission of high-frequency electrical signals, without filtering or discarding audio information. Therefore, the user experience is enriched when attempting to understand speech in noisy environments, and a richer sound is provided by preserving TFS information.

[0008] In some embodiments, the transmitter may include a plurality of interfaces, each coupled to a corresponding electrical signal output of a plurality of electrical signal outputs, each interface being configured to transmit a corresponding electrical signal on a separate, respective percutaneous communication link. The plurality of interfaces may be wireless interfaces, or each may include a wire.

[0009] In some embodiments, the sound processor includes a plurality of additional electrical signal outputs tuned to specific audio bands in respective audio channels and each configured to generate an electrical signal in each respective tuned audio band based on sound information received at the sound processor. The transmitter is configured to transmit each of the electrical signals generated at the plurality of additional electrical signal outputs over a single transcutaneous communication link. The transmitter may include another interface coupled to the plurality of additional electrical signal outputs and configured to transmit the electrical signals generated at the plurality of additional electrical signal outputs over a single transcutaneous communication link.

[0010] In some embodiments, the one or more electrical signal output terminals and the other plurality of electrical signal output terminals may be directly connected to the plurality of interfaces and the other interface.

[0011] The plurality of interfaces and the other interface can be passive, i.e., they do not require any active electronics to perform their functions. Each of the wireless interfaces may include an induction coil, such as a planar induction coil or a solenoid coil. Each respective induction coil can be tuned to its respective electrical signal output such that the inherent oscillation frequency of the electrical signal generated at the sound processor can directly drive the coil and thus transmit its sound information without having to disconnect or break the signal chain. Accordingly, the sound information can be transmitted, for example, without delay, to a hearing device such as a cochlear implant.

[0012] Each of the multiple interfaces is tuned to an audio signal frequency.

[0013] In some embodiments, the sound processor is a small device that can be sized to fit within a patient's ear canal. Therefore, it is necessary to minimize transmission interference between individual percutaneous communication links. In some embodiments, at least a portion of the plurality of interfaces is tuned to the inherent frequency of the electrical signal output via a corresponding electrical signal coupled to its output. At least one of the plurality of interfaces may be tuned to a carrier frequency selected to reduce cross-coupling across the percutaneous communication link. In this arrangement, the electrical signal is carried at the carrier frequency to avoid interference with the transmission of another electrical signal during transmission. The inherent frequency of the electrical signal can be separated from the remainder of the signal transmitted at the carrier frequency once it has been received at the implant.

[0014] In some embodiments, the one or more electrical signal outputs include a plurality of electrodes. The sound processor may include a plurality of resonators, each of which is coupled to a corresponding electrode of the plurality of electrodes, wherein each of the electrical signals generated at the electrode is responsive to incident sound at the corresponding resonator of the plurality of resonators, and at least a portion of the plurality of resonators has a different natural frequency. The plurality of resonators may be piezoelectric resonators, strain gauge resonators, or capacitor cell resonators.

[0015] In some embodiments, the sound processor may further include an earplug for insertion into the ear canal or for mounting on or behind the ear; wherein the plurality of resonators and the transmitter are disposed within the earplug. In some embodiments, the transmitter is disposed outside the earplug enclosing the sound processor and is attached to the sound processor via a cable.

[0016] According to another aspect of this disclosure, a system is provided comprising a sound processor of the first aspect; and an implant comprising: a plurality of implant electrodes, each implant electrode configured to stimulate neurons in the cochlea; and a receiving stimulator configured to: receive each of electrical signals transmitted from a transmitter over a separate transcutaneous communication link, and apply each of the electrical signals to a corresponding implant electrode of the plurality of implant electrodes. In some embodiments, the transmitter is a wireless transmitter, and the receiving stimulator is a wireless receiving stimulator.

[0017] In some embodiments, the electrical signal transmitted from the transmitter includes electrical signals generated at one or more electrical signal output terminals and electrical signals generated at the other plurality of electrical signal output terminals.

[0018] In some embodiments, the receiving stimulator may include a plurality of voltage-controlled current sources or a plurality of charge pumps or voltage multipliers, each voltage-controlled current source, charge pump, or voltage multiplier being configured to apply charge to a corresponding electrical signal generated by the plurality of electrical signal outputs and applied to the plurality of implantable electrodes. Accordingly, the amplitude of each of the electrical signals may be increased to a level sufficient to stimulate a corresponding implantable electrode among the plurality of implantable electrodes.

[0019] In some embodiments, the implant may further include a power source. This power source can be recharged via a wireless receiver (e.g., via a separate inductive link) over a separate percutaneous communication link. In this arrangement, audio data and power are transmitted over a separate percutaneous communication link, allowing optimal power to be provided to the implant while avoiding delays in audio data transmission. Alternatively, the implant may be powered by an external power source via a separate wireless communication link or wire.

[0020] In some embodiments, the sound processor is enclosed in an earplug, and the wireless receiver stimulator is configured to align with the wireless transmitter when the implant is placed near or adjacent to the patient's ear or ear canal and the earplug is inserted into the ear.

[0021] The earpiece may include one or more plug features configured to engage with one or more features of the ear to position the wireless transmitter in a predetermined orientation relative to the ear when the earpiece is inserted into the ear. According to this arrangement, a magnet is not required to position the wireless interface of the in-ear sound processor in place, as is the requirement for some conventional cochlear implants.

[0022] According to another aspect of this disclosure, a medical implant is provided, the medical implant comprising: a plurality of implantable electrodes, each implantable electrode configured to stimulate neurons in the cochlea; a receiving stimulator configured to: receive a plurality of electrical signals transmitted from a transmitter of an in-ear, on-ear, or behind-the-ear sound processor over a separate transcutaneous communication link; and apply each of the electrical signals to a corresponding implantable electrode among the plurality of implantable electrodes.

[0023] The sound processor can be the sound processor of the first aspect of this disclosure.

[0024] Medical implants can be configured to simultaneously apply each of the electrical signals to a corresponding electrode. Medical implants can also be configured to sequentially apply each of the electrical signals to a corresponding electrode.

[0025] According to another aspect of this disclosure, a method is provided comprising: generating an electrical signal in response to sound incident at a piezoelectric resonator of a plurality of piezoelectric resonators; and applying the electrical signal to an electrode near a neuron in the cochlea, wherein the frequency of the electrical signal is within the phase-locked frequency range of the neuron.

[0026] The method may include: generating a plurality of the electrical signals, each electrical signal responding to sound incident at one of the plurality of resonators; and applying each electrical signal to a separate electrode, each separate electrode being near a different neuron in the cochlea; wherein the frequency of each of the electrical signals is within the phase-locked frequency range of the neuron in its neighboring cochlea. The method may apply each of the electrical signals simultaneously or sequentially to a corresponding electrode. Attached Figure Description

[0027] Embodiments of this disclosure will now be described by way of example only with reference to the accompanying drawings, in which:

[0028] Figure 1 This is an anatomical representation of an earplug containing a sound processor and a communication link that is inserted into the ear canal and coupled to a cochlear implant according to embodiments of the present disclosure;

[0029] Figure 2 These are diagrams of an acoustic device according to embodiments of the present disclosure;

[0030] Figure 3 yes Figure 2 A close-up cross-sectional view of a portion of the acoustic device shown in the image;

[0031] Figure 4 yes Figure 2 A partial cross-sectional view of the acoustic device;

[0032] Figure 5This is an exploded perspective view of the earbud and sound processor according to embodiments of the present disclosure;

[0033] Figure 6 yes Figure 5 Partial exploded perspective view of the earbuds and sound processor shown in the image;

[0034] Figure 7 yes Figure 5 The image shows a perspective assembly diagram of the earbuds and sound processor.

[0035] Figure 8 The earpiece that encloses the sound processor and wireless communication link according to embodiments of this disclosure, and Figure 1 A schematic diagram of a cochlear implant shown in the image;

[0036] Figure 9 The earpiece that encloses the sound processor and wired communication link according to embodiments of this disclosure, and Figure 1 A schematic diagram of a cochlear implant shown in the image;

[0037] Figure 10 An earpiece that encloses a sound processor and a wireless communication link according to another embodiment of this disclosure, and Figure 1 A schematic diagram of a cochlear implant shown in the image;

[0038] Figure 11 According to another embodiment of this disclosure, an earpiece encloses a sound processor and a wired communication link, and Figure 1 The diagram shown in the image illustrates a cochlear implant; and

[0039] Figure 12 It includes Figure 8 A schematic representation of the implementation architecture of a sound processor and cochlear implant system. Detailed Implementation

[0040] The embodiments disclosed herein are intended to overcome or at least alleviate the difficulties associated with the preservation and transmission of sound information in hearing systems such as the prior art cochlear hearing system.

[0041] Specifically, embodiments of this disclosure relate to a sound processor capable of converting sound pressure waves into electrical signals with reduced requirements for complex sound processing, and transmitting said electrical signals over a separate audio data percutaneous communication link within an audio frequency range.

[0042] Figure 1 This is an anatomical representation of the human ear and system 10 according to an embodiment of the present invention. System 10 includes a sound processor 100 for converting sound waves into electrical signals, and a medical implant 600 (e.g., a cochlear implant). Figure 1As shown, the sound processor 100 is shown inserted into a user's ear canal. The sound processor 100 has one or more electrical signal outputs, such as a single electrical output or multiple electrical signal outputs, each tuned to a specific audio frequency band. Each electrical signal output is configured to generate an electrical signal in each corresponding tuned audio frequency band based on sound information received at the sound processor.

[0043] Electrical signals are transmitted to a cochlear implant 600 implanted in the user's ear. The cochlear implant 600 includes a stimulator that includes a receiver 602 for receiving electrical signals. Figure 8-11 (as seen in the image) Processor 606 for processing the received electrical signals ( Figure 8-11 As seen in the image), and an electrode array 608 for stimulating the nerves of the cochlea (as seen in the image), Figure 1 , 8 (as seen in -12).

[0044] The sound processor 100 can take various forms. In a preferred embodiment, the sound processor 100 is a mechanical sound processor including an acoustic device 300. The acoustic device 300 includes a plurality of resonators, each configured to generate an electrical signal in response to incident sound, as described herein. Each of the plurality of resonators typically has a different intrinsic frequency and generates an electrical signal at a corresponding electrical signal output. In another embodiment, the sound processor is a conventional digital sound processor in which an electrical signal is output from a multi-channel bandpass filter. In any embodiment of the sound processor 100, an electrical signal is generated at a corresponding electrical signal output based on sound information received at the sound processor. A transmitter is coupled to the one or more electrical signal outputs and is configured to transmit each of the electrical signals over a separate, corresponding percutaneous communication link. The sound processor 100 may include a plurality of additional electrical signal outputs besides the one or more electrical signal outputs. For example, a mechanical sound processor may include another acoustic device 300 providing the plurality of additional electrical signal outputs. The transmitter is configured to transmit each of the additional electrical signals generated at the output terminals over a single transcutaneous communication link.

[0045] Figures 2 to 4 This is a perspective and side view of an acoustic device 300 that can be used in a sound processor 100 to generate electrical signals, according to embodiments of this disclosure. The acoustic device 300 is a mechanical sound processor as fully described in the applicant's published PCT application WO2020 / 142812, the entire contents of which are incorporated herein by reference. Figure 3 Showing only Figure 2 Part of the acoustic device 300 shown in the image is indicated by the dashed circle. Figure 4 yes Figure 7A more detailed side view of a portion of the acoustic device 300 shown in the image. The device 300 includes a support ring 301 that supports a diaphragm 302 having a plurality of resonant cavities 304 formed therein, and a piezoelectric resonator 306 supported above each of the cavities 304.

[0046] In the illustrated embodiment, the plurality of resonators 306 are integrally formed as a portion of a resonator layer 303 disposed above a diaphragm 302. By disposing the resonator layer 303 above the diaphragm 302, the low-frequency sound path difference around the resonator array is significantly reduced. Thus, the diaphragm 302 acts as a baffle, increasing the acoustic shadow at the front and rear surfaces of the device 300. The resonator layer 303 and the diaphragm 302 may be glued, laminated, or otherwise fixed together. The diaphragm 302 may have a thickness between 50 and 150 micrometers. The resonator layer 303 is preferably thinner than the diaphragm 302. In some embodiments, the resonator layer 303 may have a thickness between 10 and 50 micrometers (e.g., 25 micrometers). In some embodiments, the diaphragm layer 302 may have a thickness between 50 and 100 micrometers (e.g., 75 micrometers). The thickness ratio of the diaphragm 302 to the resonator layer 303 may be in the range of 2.5 to 3.5:1. In other embodiments, the diaphragm 302 and the resonator layer 303 may be composed of a single layer, with the plurality of piezoelectric resonators integrated into the diaphragm 302.

[0047] The acoustic device 300 may have an overall radius between 500 micrometers and 20 mm. In some embodiments, the radius of the device may be selected to fit the human ear canal. In the illustrated embodiment, the acoustic device 300 is generally cylindrical. In other embodiments, the acoustic device 300 may be of different shapes, such as elliptical, square, or rectangular.

[0048] Piezoelectric cantilever resonators 306 are supported above each of the resonant cavities 304. In some embodiments, each cantilever resonator 306 is fixed to a support ring 301. Alternatively, each cantilever resonator 306 is fixed to a diaphragm 302, for example, using adhesives. In the illustrated embodiment, the resonator 306 is coupled to the diaphragm 302 through its integration with a resonator layer 303, which is then fixed to the diaphragm 302. By integrating the resonator 306 into the resonator layer 303, the body of the resonator layer 303 (i.e., the portion of the resonator layer 303 excluding the resonator 306) acts as a damper to prevent crosstalk from one positively resonating resonator in the resonators 306 to the other resonators in the resonators 306. Because the body portion of the resonator layer 303 has a much larger mass than each of the resonators 306, its resonant frequency is outside the resonant frequency range of the resonators 306, thus reducing any potential crosstalk between any of the resonators 306.

[0049] Each resonator 306 may have a thickness between 20 and 30 micrometers (e.g., about 25 micrometers). For example, each resonator 306 may have the same thickness as the rest of the resonator layer 303 to which it is integrated. Minimizing the thickness of the resonator 306 reduces the mass of the resonator 306 and thus reduces the amount of sound pressure required to move the resonator 306. Minimizing the thickness of the resonator 306 may also affect its resonant frequency, as discussed above.

[0050] In some embodiments, the resonant cavity 304 has a depth d between 25 and 100 micrometers. The effect of providing a relatively large gap between the diaphragm 302 and the cantilever resonator 306 is that it allows for greater displacement of the beam resonator 306. The thickness of the diaphragm 302 beneath the cavity 304 can be between 20 and 30 micrometers, for example, 25 micrometers.

[0051] Each cantilever resonator 306 includes a free end configured to resonate in response to an incident sound pressure wave. In the illustrated embodiment, the cantilever resonators 306 are arranged radially around the acoustic device 300. In some embodiments, the cantilever resonators 306 may have a length between 1 and 4 mm.

[0052] Each of the piezoelectric cantilever resonators 306 may include a cantilever beam 305. To convert the displacement of the cantilever beam 305 into an electrical signal, each piezoelectric cantilever resonator 306 may further include a piezoelectric layer 308, a ground layer 310, and an electrical signal output terminal in the form of an electrode 314. The ground layer 308 may be formed above the cantilever beam 305. The piezoelectric layer 308 may be formed above the ground layer 310. The electrode 314 may be formed above the piezoelectric layer 308. In the illustrated embodiment, only the cantilever beam 305 is integrated into the resonator layer 303, with the piezoelectric layer 308 and the electrode 314 located on top of the resonator layer 303. In other embodiments, one or more of the piezoelectric layer 308, the ground layer 310, and the electrode 314 may be integrated into the resonator layer 303 without departing from the scope of this disclosure.

[0053] Each of the electrodes 314 may be disposed above the piezoelectric layer 308 to electrically couple each beam resonator 306 to external sensing electronics and / or transmitters. Figures 8 to 11 (As seen in the image). The piezoelectric layer 308, ground layer 310, and electrode 314 can be positioned so as not to substantially overlap with the resonant cavity 304 or the cantilever resonator 306. In practice, the piezoelectric layer 308, ground layer 310, and electrode 314 can be positioned at the edge of the device 300, partially overlapping with the cantilever beam 305. By providing some overlap with the cantilever beam 305 positioned above the acoustic cavity 304, movement of the cantilever beam 305 will cause the piezoelectric layer 308 to generate a charge representing the acoustic signal presented to the beam resonator 306.

[0054] As mentioned above, electrode 314 can be coupled to sensing electronics. The sensing electronics may include a variable gain amplifier or operational amplifier, such as a hybrid junction field-effect transistor (JFET) operational amplifier. The sensing circuitry can be disposed on an application-specific integrated circuit (ASIC), which can be coupled to the diaphragm or provided separately. Signal transmission electronics may also include sensing circuitry, as will be discussed in more detail below.

[0055] The piezoelectric beam resonator 306, cavity 304, membrane 302, and / or electrode 314 can be formed by additive manufacturing (or three-dimensional (3D) printing). Additive manufacturing may include, for example, projection microstereolithography (or stereolithography (SLP) or digital light processing (DLP)). Suitable projection microstereolithography techniques and materials are described in “3D Optical Printing of Piezoelectric Nanoparticle-Polymer Composites” (ACS Nano 8(10), July 2014). In some embodiments, the piezoelectric beam resonator 306, cavity 304, membrane 302, and / or electrode 314 can be formed by laser-cutting sheet (gasket) plastic (e.g., polyethylene terephthalate) or metal (e.g., copper or brass) to form one or more layers of the device 300.

[0056] The diaphragm 302 can be formed from polymer materials such as polyethylene glycol diacrylate (PEGDA). The electrode 314 can be formed from conductive nanostructure-polymer composite materials such as carbon nanotube (CNT)-PEGDA composite materials. The piezoelectric layer 308 of the piezoelectric beam resonator 306 can be formed from piezoelectric nanoparticle-polymer composite materials such as barium titanate (BaTiO3, BTO)-PEGDA composite materials. Other equivalent conductive and piezoelectric polymer composite materials can also be used. Example materials include BaTiO3, PbTiO3, Pb(Zr,Ti)O3, Pb(Mg1 / 3Nb2 / 3)o3-PbTiO3, and (Pb0.8725SM0.085)(Ti0.98Mn0.02)O3.

[0057] During operation, the acoustic pressure wave incident on the beam resonator 306 induces movement in the array of beam resonators 306, thereby causing a change in strain in each of the beam resonators 306. Each beam resonator 306 is configured to resonate at a specific frequency of the incident acoustic pressure wave. When the resonant beam 306 begins to resonate, the displacement of the beam 306 toward the acoustic cavity 304 displaces the air in the cavity 304, thereby increasing the acoustic pressure in the cavity 304 below the beam resonator 306. This increase in acoustic pressure causes the subsequent displacement of the beam resonator 306 away from the diaphragm 302 to be significantly greater than the displacement in the absence of the diaphragm 302 (and therefore the cavity 304). The inventors have found that, in some embodiments, providing a partially enclosed cavity 304 below the beam resonator 306 can result in an increase in the displacement of the beam resonator 306 by up to 90% or more.

[0058] The piezoelectric transition signal generated by the piezoelectric layer 308 is then captured by the electrode 314. The greater the displacement of the resonant beam 305, the greater the voltage generated at the electrode 314.

[0059] Because the amplitude of the piezoelectric transition signal generated at each cantilever resonator 306 is proportional to the total shift of the cantilever resonator 306, multiple mechanically frequency-selective signals can be output from the acoustic device 300 by providing an array of cantilever resonators 306. Thus, compared to a conventional microphone that outputs electrical signals over the entire frequency range of human hearing (e.g., 20 to 10000 Hz), the acoustic device 300 can output multiple electrical signals related to frequency sub-bands of the human hearing frequency range. For example, the sound processor 100 may include two acoustic devices 300a, 300b having a total of ten cantilever resonators manufactured as described above, each cantilever resonator having a different resonant frequency spanning from 200 Hz to 6000 Hz. The frequency range can be tuned by adjusting one or more of the cantilever length, cantilever width, cantilever thickness, cantilever composition, and cantilever compliance to match the frequency topology of the human cochlea.

[0060] The acoustic device 300 described herein can be formed by 3D printing of plastic materials. For configuration as, for example, an in-ear or behind-the-ear sound processor such as a sound processor 100, one or more components of the acoustic device described herein can be formed from a soft, biocompatible plastic material suitable for prolonged contact with human skin.

[0061] The piezoelectric resonators of the various acoustic devices described herein can be formed, for example, from molded, laminated, and / or film forms of piezoelectric polymers, polyvinylidene fluoride (PVDF), and / or piezoelectric ceramics. Other suitable piezoelectric materials include BaTiO3, PbTiO3, Pb(Zr,Ti)O3, Pb(Mg1 / 3Nb2 / 3)o3-PbTiO3, and (Pb0.8725SM0.085)(Ti0.98Mn0.02)O3.

[0062] In an alternative embodiment of the sound processor 100, the acoustic device 300 is Figure 10 and 11 A conventional microphone 700 is schematically shown instead. The conventional microphone 700 converts the received sound information into an electrical signal and outputs the electrical signal at a multi-channel bandpass filter. The multi-channel bandpass filter, as the electrical signal output terminal, can output multiple electrical signals in a specific tuned audio frequency band in a separate audio channel for transmission to the implant 600.

[0063] The sound processor 500 according to embodiments of the present disclosure is in Figures 5 to 7The sound processor 500 is shown in the image. Figure 1 The sound processor 100 in System 10. The sound processor 500 is an in-ear mechanical sound processor. Figure 5 Showing an exploded view of the sound processor 500. Figure 6 The exhibit shows a partially assembled mechanical sound processor 500, with part of the cover removed. Figure 7 The sound processor 500 is shown in an assembled form.

[0064] The sound processor 500 includes a sound shield 502 shaped and configured for insertion into a human ear canal. The sound shield 502 (also referred to herein as an earplug) comprises a cylindrical body having a distal end 507 and a proximal end 508, shaped to conform to the shape of the ear canal. In this embodiment, the sound shield 502 has an elliptical cross-section. The elliptical cross-section conforms well to the shape of the human ear canal, thereby increasing the overall size of the earplug (and thus the internal volume for resonators, processing components, and other hardware) without affecting user comfort or causing injury. The sound shield 502 is configured such that its distal end 507 is inserted into the ear canal during use. The distal and proximal ends 507, 508 of the sound shield 502 therefore preferably each have wavy edges to allow the sound processor 500 to be inserted into and removed from the ear canal without the risk of irritation or injury.

[0065] The sound enclosure 502 may be formed from first and second enclosure portions 502a, 502b configured to enclose all other elements of the mechanical sound processor 500, such as Figures 5 to 7 As shown in the illustration. In these embodiments, the first and second cover portions 502a, 502b may each include a coupling element configured to engage with each other to form the acoustic cover 502. In other embodiments, the first and second cover portions 502a, 502b may be manufactured as a single unit.

[0066] The acoustic shield 502 may include acoustic ports 506a and 506b configured to allow sound pressure waves to be transmitted from a proximal end 508 into the acoustic shield 502, the proximal end being oriented towards the outer side of the ear when the sound processor 500 is inserted into the ear canal. Additionally, the acoustic shield 502 may include an acoustic port 509 at a distal end 507 of the acoustic shield 502, configured to allow air to travel between the proximal end 508 and the distal end 507 through the sound processor 500. Providing the additional port 509 at the proximal end 508 of the sound processor 500 reduces pressure buildup within the acoustic shield 502, thereby improving the flow of sound pressure on the first and second acoustic devices 300a and 300b.

[0067] The sound processor 500 further includes a frame 505 for supporting the first and second acoustic devices 300a, 300b within a sound enclosure 502. The first and second acoustic devices 300a, 300b may be similar to those in the reference styrene. Figures 2 to 4 The described acoustic device 300 may be replaced by the conventional microphone 700 described herein. Acoustic devices 300a and 300b may be axially spaced, with their front flat surfaces facing the axis of rotation of the acoustic shroud 502. In some embodiments, the front flat surfaces of acoustic devices 300a and 300b are positioned to face each other such that the axis of the flat surface of each device 300a and 300b is generally parallel to the axis of the cylindrical body of the acoustic shroud 502. In other embodiments, acoustic devices 300a and 300b may be longitudinally distributed relative to the axis of rotation of the acoustic shroud 502. In other embodiments, acoustic devices 300a and 300b may be angled relative to the axis of rotation of the acoustic shroud 502.

[0068] The first and second acoustic devices 300a and 300b may have corresponding mating portions 513a and 513b, which are configured to cooperate with mating portions 515 on the frame 505 for positioning the first and second acoustic devices 300a and 300b relative to the frame 505. The frame 505 may further include a stabilizing member 517, which is configured to engage with the inner walls of the first and second cover portions 502a and 502b when the first and second cover portions 502a and 502b are in a mating configuration together. In doing so, the stabilizing member 517 prevents the frame from moving relative to the cover portions 502a and 502b when the mechanical sound processor 500 is fully assembled.

[0069] The in-ear cover 502 may be configured to enclose one or more of the following: sensing electronics 511 for sensing and processing electrical signals received from acoustic devices 300a, 300b. Figure 8 The device includes a battery housing 510 for housing one or more batteries, one or more batteries 512 (if provided), and at least one interface in the form of a transmission coil 514 for wirelessly transmitting signals processed by sensing electronics 511 to a device external to the mechanical sound processor 500. In the illustrated embodiment, a plurality of transmission coils 514a-514e are provided for wirelessly transmitting electrical signals output by the electrodes 314a-314e of the plurality of beam resonators 306 across individual percutaneous communication links or channels. In another embodiment, sensing electronics 511 may encode individual electrical signals into a single channel for transmission across combined percutaneous communication links at a single additional transmission coil 514f. The transmission coils 514a-514e, 514f may be positioned adjacent to or integrated with the one or more batteries 512 to enable the transmission coils 514a-514e, 514f to be inductively coupled to an external coil using near-field magnetic induction (NFMI) or similar methods. In some embodiments, the transmission coils 514a-e, 514f of the sound processor 500 are positioned in a linear array near a certain length of the acoustic shield 502, such as... Figure 1and 8 The system diagram is schematically shown to arrange the components closely to the ear canal tissue when inserted into the ear canal. In some embodiments where the in-ear sound processor 500 is to be mounted on or behind the ear, the transmission coils 514a-e and 514f may be located in a separate transmitter cover (not shown) outside the sound cover 502. In this case, the separate transmitter cover housing the transmission coils 514a-e, 514f can be inserted into the ear canal. Wires (not shown) may be connected to sensing electronics 511 located in the sound processor 500to outside the transmission coils 514a-e, 514f.

[0070] In some embodiments, the cover 502 may include one or more latching features configured to engage with one or more features of the ear to position the wireless transmitters 514a-e, 514f in a predetermined orientation relative to the ear when the in-ear mechanical sound processor 500 is inserted into the ear or when a separate cover housing the transmission coils 514a-4, 514f is inserted into the ear. These latching features may be implemented using a patient-specific mantle conforming to the shape of the individual's auricle and ear canal. Other retention features may be employed, such as replaceable clasps that hold the cover 502 in the ear canal to provide positioning and retention of the features. This alignment ensures proper coupling to the implanted receiving coils 604a-e, 604f, 604g to maximize efficiency and achieve robust communication delivery.

[0071] The resonators 306 of the acoustic devices 300a and 300b can be tuned to have different intrinsic frequencies and therefore maximum displacement at different frequencies of the incident sound pressure wave. For example, the first acoustic device 300a can be configured for low-frequency operation, and the second acoustic device 300b can be configured for high-frequency operation. In some embodiments, the first acoustic device 300a may have a frequency response covering frequencies up to 2000 Hz, and the second acoustic device 300b may have a frequency response covering 2000 Hz–8000 Hz, such that the combined frequency response of the acoustic devices 300a and 300b covers a large combined frequency range (e.g., 200 Hz to 8000 Hz), or the frequency range of human speech. By axially spacing the two acoustic devices 300a and 300b and arranging them opposite each other within the acoustic enclosure 502, a large frequency range can be covered with a larger granularity (e.g., 10 channels) while maintaining the small form factor required by the sound processor 500.

[0072] The piezoelectric resonator 306, one or more cavities 304, diaphragm / film 302, and electrode 314 can be formed by additive manufacturing (or three-dimensional (3D) printing). Additive manufacturing may include, for example, projection microstereolithography (or stereolithography (SLP) or digital light processing (DLP)). Suitable projection microstereolithography techniques and materials are described in “3D Optical Printing of Piezoelectric Nanoparticle-Polymer Composites” (ACS Nano 8(10), July 2014).

[0073] In alternative embodiments of the acoustic device, the plurality of resonators may include strain gauge resonators or capacitive resonators instead of piezoelectric resonators.

[0074] As mentioned above, in contrast to Figure 1 As mentioned above, the sound processors 100 and 500 described above can be configured to, for example... Figure 1 The cochlear implant 600 and other cochlear implants are used together. For example, the sound processor 500 can be configured to wirelessly or wiredly transmit electrical signals related to beam displacement, resonance, movement, and oscillation to the cochlear implant 600. By way of example, Figure 1 and 8 A sound processor 500 is shown that is wirelessly coupled to a cochlear implant 600. Figure 9 A variant of the sound processor 500a is shown, which is wired to the cochlear implant 600a.

[0075] refer to Figure 1 Anatomical representation, Figure 8 This is a schematic diagram of the coupling between the sound processor 500 and the cochlear implant 600 when the sound processor 500 is inserted into the ear canal. It shows the electrically active components of the sound processor 500, including first and second acoustic devices 300a, 300b, sensing electronics 511, transmission coils 514a to 514e, 514f, and a battery 512. In the current embodiment, the first acoustic device 300a is configured for low-frequency operation, and the second acoustic device 300b is configured for high-frequency operation. The first acoustic device 300a outputs five low-frequency electrical signals, which are transmitted via transmission coils 514a-514e on five separate transcutaneous communication links. The second acoustic device 300b outputs five high-frequency electrical signals, which are encoded at sensing electronics 511 for transmission via transmission coil 514f on a single channel. Additionally, another separate transmission coil 514g is provided for transmission from... Figure 8 The battery 512 shown in the image or from Figure 12 The external battery 712 seen in the diagram transmits electrical power.

[0076] The cochlear implant 600 includes a receiver 602 comprising multiple radio frequency (RF) coils 604a-g, a stimulator 606, and an electrode array 608 for stimulating cochlear nerves (not shown). The electrode array 608 has multiple electrodes, each configured to stimulate neurons in the cochlea. The receiver 602 is configured to receive multiple electrical signals output from transmission coils 514a-514f and transmission coil 514g of the sound processor 500 over a separate transcutaneous communication link. Figure 8 As shown, receiver 602 is configured for transcutaneous power and data transmission to processor 606 via RF coils 604a-g. Sensing electronics 511 of sound processor 500 are configured to transmit stimulation data concerning acoustic devices 300a, 300b to stimulator 606 via RF coils 514a-514f through receiver 602. Stimulator 606 is configured to apply the stimulation data received by receiver 602 to electrodes of electrode array 608 to stimulate neurons in the cochlea. Implant 600 may be powered by an internal power source 612, such as a rechargeable battery or capacitor, which may be powered from battery 512 of sound processor 500 or from an external battery or power source 712 via transmission coil 514g and a separate wireless induction coil 604g in receiver 602. Figure 12 (As seen in the image) Recharge.

[0077] Figure 9 Show as Figure 8 The sound processor 500a, another variant of the sound processor 500 shown in the image, and as a... Figure 8 The illustration shows an embodiment of a variant of the cochlear implant 600, namely cochlear implant 600a. Identical parts have been given the same reference numerals. In this variant, a sound processor 500a is connected to the cochlear implant 600a via one or more wires 514h, through which data and / or power can be delivered from the sound processor 500a to the cochlear implant 600a. In the illustrated embodiment, the acoustic device 300 outputs five low-frequency electrical signals, which are transmitted on five separate transcutaneous wired links 514h. Five additional high-frequency electrical signals are output from the acoustic device 300b and transmitted on another separate transcutaneous wired link 514i. In some embodiments, the one or more wires 514h, 514i may be interconnected via a transcutaneous plug (not shown) of the cochlear implant 600a.

[0078] Figure 10 Show as Figure 8 The mechanical sound processor 500 and shown in the exhibition Figure 8An embodiment of a sound processor 500b, another variant of the cochlear implant 600, is shown. Identical parts have been given the same designations. In this variant, the sound processor 500b includes a conventional microphone 700, replacing the acoustic devices 300a and 300b. The microphone 700 outputs a broadband frequency response signal, which is bandpass filtered into five low-frequency electrical signals transmitted via transmission coils 514a-514e on five separate transcutaneous communication links, and five high-frequency electrical signals encoded at sensing electronics 511 for transmission via transmission coil 514f on a single channel. Furthermore, another separate transmission coil 514g is provided for [further details regarding the transmission coil and its configuration]. Figure 8 The battery 512 shown in the image or from Figure 12 The external battery 712 seen in the diagram transmits electrical power.

[0079] Figure 11 Display and Figure 10 The sound processor 500b shown in the video and Figure 9 An embodiment of the same sound processor 500c as the cochlear implant 600a shown is illustrated. Identical parts have been given the same numbering. In this variant, the sound processor 500c includes a conventional microphone 700 and is connected to the cochlear implant 600a via one or more wires 514h, through which data and / or power can be delivered from the sound processor 500c to the cochlear implant 600a. In the illustrated embodiment, the microphone 700 outputs a broadband frequency response signal, which is bandpass filtered into five low-frequency electrical signals transmitted on five separate transcutaneous wired links 514h. Five additional high-frequency electrical signals are transmitted on another separate transcutaneous wired link 514i. In some embodiments, the one or more wires 514h, 514i can be interconnected via a transcutaneous plug (not shown) of the cochlear implant 600a.

[0080] Figure 12 A schematic diagram illustrating an embodiment of a sound processor 500 coupled to corresponding receiving coils 602a-g of an implant 600 via induction coils 514a-g, together with processing electronics for processing electrical signals transmitted from resonators 306a-j of the sound processor 500 to provide stimulation current to the electrodes of the electrode array 608.

[0081] like Figure 12As shown in the diagram, the plurality of resonators 306a-306j are divided into, for example, a first resonator group of acoustic device 300a and a second resonator group of acoustic device 300b. Specifically, five low-frequency resonators 306a-306e are stored together in the first resonator group, and their electrical outputs are directed to electrodes 314a-314e. In this embodiment, the resonant natural frequency of each of the five resonators 306a-306e is tuned to a frequency between 100Hz and 1200Hz. Each resonator's electrical signal output has a separate communication link to the implant 600 for transmitting frequency and amplitude data. The electrodes 314a-314e of the first resonator group may be coupled to sensing electronics 511 as needed to filter noise from the low-frequency information in the electrical signal, for example, before transmission at coils 514a-514e. High-frequency resonators 306f-306j are stored together in the second resonator group, and their electrical outputs are directed to electrodes 314f-314j. In this embodiment, the resonant natural frequency of each of the five resonators 306f-306j is tuned to a frequency between 1210Hz and 6500Hz. The frequency and amplitude data outputs of these resonators are transmitted on a single channel via coil 514f. It should be understood that in other embodiments, the low-frequency resonators can be extended to frequencies up to 2000Hz, and the high-frequency resonators will correspondingly start at, for example, 2010Hz and extend to 6500Hz or 8000Hz.

[0082] In some embodiments, the corresponding electrical signals of one or more of the transmission coils 514a-514e, coupled to their respective output terminals, are tuned to the inherent frequency of the electrical signal output terminals. Because these inherent frequencies are adjacent to each other and the physical spacing of the coils 514a-514e is very close, maximizing coupling across the transcutaneous link is problematic for coupling on adjacent channels. Therefore, crosstalk can affect the propagation of electrical signals at their respective inherent frequencies. Thus, at least one of the transmission coils 514a-514e may be tuned to a high-frequency carrier signal, which is selected to shift the inherent frequency out-of-band, typically by a factor of 10, to reduce coupling effects and crosstalk across individual transcutaneous communication links. For example, if the inherent frequencies of two adjacent coils are 800Hz and 1000Hz, the high-frequency carrier signal of the 1000Hz coil may be tuned to a higher factor of 10, such as 10000Hz. This can be implemented as needed on the plurality of communication links to keep all wireless transcutaneous communication links electrically isolated from each other. In this arrangement, electrical signals are transmitted at the carrier frequency to avoid interference with the transmission of another electrical signal during transmission. The inherent frequency of each of the plurality of electrical signals is then filtered from the carrier frequency in the implant receiver 602.

[0083] Accordingly, a separate inductive communication link is used to transmit low-frequency electrical signals from the electrical signal output of the first resonator group. A separate inductive link is used to transmit high-frequency electrical signals from the electrical signal output of the second resonator group of the sound processor 500. Electrical power from the external battery 712 is provided via a transmission coil 514g and a receiver coil 602g on yet another separate inductive link to power electrode stimulation at the electrode array 608 of the implant 600. At the implant 600, the low-frequency electrical signals are individually processed into high-frequency electrical signals to create the desired electrode stimulation current on the plurality of electrodes, as will now be described.

[0084] The electrical signal output from each of the five induction coils 514a-514e is transmitted on a separate induction coil link to a corresponding induction coil among the five induction coils 604a-604e at the receiver 602 of the implant 600.

[0085] Once received at the corresponding induction coil 602, a stimulation current is directly generated from the electrical signal 522a-e without further signal processing. Figure 12The diagram illustrates a stimulation current loop for creating a stimulation current from the output of an acoustic device electrical signal 522a for electrode E1 of electrode array 608. The electrical signal 522a from acoustic device 306a is a sinusoidal voltage output. The circuitry for creating the stimulation current at electrode E1 consists of two main circuits. First, the timing of applying the stimulation current to electrode E1 is driven by the extracted sinusoidal voltage signal, which serves as input to a timing extractor 710. The timing extractor 710 may be composed of a zero-crossing detector circuit. The timing information output from the timing extractor 710 is directly provided to the E1 electrode switch via a switch control circuit 720. The switch control circuit 720 is a switching circuit with a first switch 722 and a second switch 724, with one switch corresponding to each phase of the biphasic pulse of the electrical signal 522a. The timing information determines when to open and close switches 722 and 724 to stimulate electrode E1. The biphasic pulse serves as a means of ensuring charge-balanced stimulation. Next, the envelope of the electrical signal 522a is extracted by the envelope detector 730 to provide the amplitude of the stimulation current based on the loudness of the sound presented to the acoustic device 306a. The extracted amplitude is then processed by the programmable control module 740 to ensure it is within safety limits and within the detectable range of the cochlear implant recipient. The control module 740 can be programmed to increase or decrease the sound level of the stimulation current based on the specific recipient's requirements. For example, each individual recipient has a maximum permissible current amplitude and a minimum detectable current amplitude measured during the initial calibration of the implant for that individual, and the current amplitude must be maintained within the specified frequency band to ensure safe use. Individual mapping information can be programmed into one or more registers and / or lookup tables, which can be queried by the control module 740 to allow amplitude modification based on the loudness growth curve of the individual recipient.

[0086] The modified amplitude information output from control module 740 controls the stimulation current via voltage-controlled current source (VCCS) 750. VCCS 750 takes a small current as input to operate a switch to output a higher current. Accordingly, VCCS 750 can be used to boost an input current, which can be approximately tens of μA, to a sufficient threshold level for stimulating electrode E1, such as at least several hundred μA to 2mA output current. One advantage of using VCCS 750 for this purpose is that it can be controlled or tuned to provide the desired output level based on the input voltage. Other methods for implementing signal boosting include charge pumps or voltage multipliers (not shown). While these topologies can be used instead of VCCS 750, their output is limited and they do not provide the same ability to control the output current to the desired threshold level. VCCS 750 outputs current directly to switch control circuit 720. The switch control circuit 720 includes first and second current sources and an inverter that switches between the positive and negative phases of a biphase pulse train to open and close switches 722, 724 to stimulate electrode E1. A replica of the E1 channel circuit system is used to process each of the electrical signals 522a-e received at coils 602a-602e to create a stimulating current at the corresponding electrodes E1-E5 of the electrode array.

[0087] The stimulating current provided at the low-frequency electrodes E1 to E5 of the electrode array 608 delivers a phase-locked sound signal to the low-frequency cochlear neurons. The system ensures, as far as possible, direct stimulation from the sound signal into the auditory system. This is attributed to the reduced latency in data transmission from the sound processor 500 to the implant 600, minimizing delay and minimizing or eliminating information loss, especially for TFS information, which is crucial for time and location cues. The multi-coil transmitter and receiver system for transmitting the low-frequency electrical signal to the implant 600 and for replicating the stimulating current circuitry for each of the low-frequency electrodes E1 to E5 allows for simultaneous or sequential stimulation of each low-frequency channel. This simultaneous or sequential stimulation of the low-frequency electrodes E1 to E5 can be constant and / or subthreshold (i.e., below what the receiver can perceive or hear) to provide a time-coordinated neural response to high-frequency information and speech recognition.

[0088] At frequencies above approximately 1.2 kHz, the ability to lock onto the auditory nerve weakens. Accordingly, the electrical signal outputs of the high-frequency electrodes 314f-314j are processed separately from the signal outputs of electrodes 314a-314e. Electrodes 314f-314j are also coupled to sensing electronics 511. Figure 8-11In addition to any necessary noise filtering, it includes an encoder 760. The encoder 760 encodes the output from each of the power supplies 314f-314j into a single, separate communication interface at the induction coil 514f. Accordingly, the encoded communication has the benefit of reducing the size and power requirements of the induction link and its associated electronics. The electrical signal transmitted from the induction coil 514f is transmitted to the corresponding induction coil 602f at the receiver 602 of the implant 600.

[0089] The transmitted data is then decoded into timing information at pulse generator 785 based on the electrodes to be stimulated, and the amplitude of the current pulse is extracted at decoder 770. The stimulation rate of these high-frequency channels can be based on the extracted fundamental frequency of the sound source or on any pulse rate required by the receiver's physiological needs. The extracted amplitude is then processed by programmable control module 780 to ensure it is within safety limits and still within an individually detectable range. Control module 780 can be programmed to increase or decrease the sound level of the stimulation current based on the specific requirements of the implanted receiver. Similar to the low-frequency electrical signal, the high-frequency timing and amplitude information is directly output to switch control circuit 790. Switch control circuit 790 is essentially a multiplexer consisting of first and second current sources and an inverter that switches between the positive and negative phases of a biphase pulse train to open and close first switch 792 and second switch 794 to provide output to switch group 795. Switch group 795 stimulates the corresponding electrodes E6 to E10 selected based on the frequency topology position of the receiver's electrode array. Accordingly, electrodes E6 to E10 are stimulated sequentially.

[0090] Power transmission to the implant 600 for electrode stimulation is decoupled from data transmission, allowing a more efficient and dedicated link to keep the implant 600's internal power supply 612 charged. Accordingly, the implant power supply 612 is charged on an inductive link separate from the electrical data signal 522. The internal power supply 612 may be part of a power management block 800 and may include a rechargeable battery or capacitor storage unit. The internal power supply 612 can be recharged from an external battery 712 via an inductive link that includes a transmitter coil 514g at the sound processor 500 and a receiver coil 602g at the implant receiver 602. The external battery 712 may be the same battery as the battery 512 of the mechanical sound processor 500 described above. In this case, the internal power supply 612 can be continuously charged when the sound processor 500 is in wireless (or wired) contact with the receiver coil 602g of the implant 600. Alternatively, the external battery 712 may be a separate battery associated with an external charger (not shown) to enable faster recharging of the internal power supply 612. In this case, the transmitter coil 514g can also be present in the external charger.

[0091] The rectifier 810 converts the AC current output at coil 604g into a DC current output, which is then directly supplied to the internal power supply 612. For example... Figure 12 As seen, electrical power is connected to each of the switching circuits 720, 790 to provide power for electrode stimulation. In the case where the internal power supply 612 is a battery, the power link would be required to operate only while the battery is being recharged, for example, once a day. However, in the case where the internal power supply 612 is a capacitor storage unit, the battery 512 of the mechanical sound processor 500 can continuously power the implant 600 while it is in use and stimulating the electrode array with sound information transmitted across dedicated data interfaces 514a-e, 514f.

[0092] Technicians will find it obvious, although Figure 12 The embodiments relate to a sound processor 500, but the processing electronics at the implant 600 can be used with any of the sound processors 500, 500a, 500b, and 500c described herein after receiving an electrical signal at the receiver 602.

[0093] The sound processor, system, and medical implant disclosed herein achieve direct stimulation of an electrode array using sound waves received at the sound processor. Data transmission from the sound processor to the implant is separated from power transmission. The data transmission itself is further separated according to the tuned audio frequency band, wherein low-frequency audio data signals are transmitted simultaneously or sequentially on multiple communication interfaces and are transmitted separately from the transmission of high-frequency audio data signals. Accordingly, the results are: reduced requirements for signal processing, reduced data transmission latency, improved power transmission, and little or no removal of TFS information. The stimulation rate of the low-frequency audio data is phase-locked with the response of neurons tuned to the corresponding frequency, thus the system provides direct stimulation of the auditory cortex from sound signals containing TFS information as much as possible, thereby recovering timing information crucial for pitch understanding and speech localization (especially in noisy environments).

[0094] Those skilled in the art will understand that many variations and / or modifications can be made to the above embodiments without departing from the broad general scope of this disclosure. Therefore, the embodiments of the present invention should be considered illustrative rather than restrictive in all respects.

Claims

1. A sound processor, comprising: A communication arrangement is configured to transmit each of a plurality of electrical signals to a receiver stimulator of a cochlear implant via multiple separate transcutaneous communication links, wherein the plurality of electrical signals are generated in response to incident sound at the sound processor. A plurality of resonators, wherein each of the plurality of resonators is electrically coupled to a corresponding electrode of a plurality of electrodes, and the plurality of electrodes are respectively configured to generate the plurality of electrical signals.

2. The sound processor of claim 1, further comprising an electrical signal output terminal configured to generate the plurality of electrical signals in response to sound incident at the sound processor in a specific tuned audio band in a respective audio channel, and further comprising a transmitter coupled to the electrical signal output terminal for transmitting the plurality of electrical signals, wherein the transmitter is configured to transmit each of the plurality of electrical signals across the plurality of separate percutaneous communication links.

3. The sound processor of claim 2, wherein the transmitter comprises a plurality of interfaces, each of the plurality of interfaces being coupled to the electrical signal output and configured to transmit a corresponding electrical signal of the plurality of electrical signals on a corresponding individual transcutaneous communication link of the plurality of individual transcutaneous communication links.

4. The sound processor of claim 3, wherein each of the plurality of interfaces includes a wire.

5. The sound processor according to claim 3, wherein the plurality of interfaces are wireless interfaces.

6. The sound processor of claim 5, wherein each wireless interface includes an induction coil.

7. The sound processor according to claim 2, wherein the electrical signal output terminal includes the plurality of electrodes.

8. The sound processor of claim 1, wherein each of the plurality of electrical signals is generated at the electrode in response to sound incident at a respective resonator of the plurality of resonators, and at least some of the plurality of resonators have different inherent frequencies.

9. The sound processor according to claim 8, wherein the plurality of resonators are piezoelectric resonators, strain gauge resonators, or capacitor unit resonators.

10. A system comprising: (a) The sound processor according to any one of claims 1 to 9; as well as (b) Implants, including: (i) Multiple implantable electrodes, each configured to stimulate the cochlea, (ii) A receiving stimulator configured to receive each of the electrical signals transmitted from the transmitter of the sound processor on the plurality of individual percutaneous communication links, and to apply each of the electrical signals to a corresponding implanted electrode among the plurality of implanted electrodes.

11. The system of claim 10, wherein the transmitter is a wireless transmitter and the receiving stimulator is a wireless receiving stimulator.

12. The system of claim 10 or 11, wherein the implant further includes a power source.

13. The system of claim 12, wherein the power source can be recharged via the receiving stimulator over a separate wireless or wired link.

14. The system of claim 10, wherein the implant is powered by an external power source via a separate wireless or wired link.

15. The system of claim 11, wherein the sound processor is enclosed in an earplug, and wherein the wireless receiving stimulator is configured to align with the wireless transmitter when the implant is placed near or adjacent to the patient's ear and the earplug is inserted into the ear.

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